MT25QL128ABA8ESF-0SIT as a possible part for U7. In Table 1-24, the I2C addresses
were updated for the FMC HPC and FMC LPC device rows.
07/08/20161.7Updated VRP/VRN resistor connection information in DDR3 Memory Module.
Moved the Additional Resources and Legal Notices appendix to the end of the
book.
08/26/20151.6.2In Table 1-9, the I/O standard for SYSCLK_N and SYSCLK_P were updated to LVDS.
In Table 1-27, under Directional Pushbutton Switches, the I/O standard for
GPIO_SW_C was updated to LVCMOS25. Updated the #USB UART section of
Appendix C, Master Constraints File Listing.
04/13/20151.6.1In HPC Connector J22, page 63, the GTX clock count changed from 1 to 2. Updated
links.
12/08/20141.6Added a note about jumper header locations below Table 1-1. Changed Table 1-5
heading J1 DDR3 Memory to U58 BPI Flash Memory. Parts PC28F00AP30TF and
N25Q128A13BSF40F changed from Numonyx to Micron. Described J11 and J12
connections in User SMA Clock Input, page 30. Made these updates in
Programmable User Clock Source, page 29: XTP186 became XTP204, RDF0175
became RDF0194, XTP187 became XTP203, and RDF0176 became RDF0193.
Corrected the device in the heading of Table 1-20 from CP2013 to CP2103. Updated
I2C Bus Switch, page 52. Updated Table 1-24 I2C devices. In Table 1-28, J22 pin G7
connects to FPGA U1 pin C27. Replaced Table A-3, KC705 Default Jumper Settings
and added
Appendix C, Master Constraints File Listing. Added information about ordering the
custom ATX cable to Appendix F, Regulatory Compliance and Information, [Ref 20].
07/11/20141.5Corrected MGT Quad connection information in GTX Transceivers, page 33 and a
connection in Table 1-10. Added MGTREFCLK1 - PCIE_CLK from P1 to Quad 115 in
GTX Transceivers, page 33. Updated Table 1-4, Table 1-5, Table 1-6, Table 1-7,
Table 1-9, Table 1-18, Table 1-21, Table 1-23, Table 1-27, Table 1-28, and
Table 1-29. Added table footnotes regarding I/O standard and pins prior to board
revision 1.1 to Table 1-14. Clarified default jumper positions in Table 1-15.
Corrected the J2 C19 pin number in Table 1-29. In Figure 1-40, changed pin names
VBATT to VCCBATT and POUC_B to PUDC_B. Removed three pins from KC705 Board
XDC Listing, page 88 (PACKAGE _PIN R8, R7, and W8). The Appendix C title changed
to Master Constraints File Listing and the constraints file in Appendix C was
replaced. The Declaration of Conformity link in Appendix F was updated.
07/18/20131.4Revised the format of Table 1-20 and added the I/O standard column. Revised the
FPGA U1 pin for FMC_HPC_CLK0_M2C_N in Table 1-28 to C27 on page 59. Revised
the descriptions of the functions for SW13 position 3 and position 5 in Table A-2.
In Appendix C, Master Constraints File Listing, changed appendix title from Master
UCF Listing to Master Board Constraints, replaced references to the term UCF with
the term XDC and replaced the KC705 Board UCF Listing with the KC705 Board XDC
Listing.
Figure A-3 to show jumper locations. Replaced the constraints file in
KC705 Evaluation Board2
UG810 (v1.8) March 20, 2018www.xilinx.com
DateVersionRevision
SendFeedback
05/10/20131.3Updated Figure 1-1 to show v 1.1 board. Updated Table 1-1, page 10: callout 1 to
identify Fansink, callouts 25and 26 pointing to User I/O. Added Table 1-9 Clock
Source to FPGA U1 Connections. Updated Programmable User Clock Source,
page 29 to include I2C address. Updated Table 1-17, page 43 for naming pins 18
and 19. Added Note to Table 1-14, page 42. Updated I2C Bus Switch, page 52 to
show TI device instead of NXP Semiconductor, deleted; updated [Ref 19]. Added
Figure 1-28, page 57 Rotary Switch, and Figure 1-29, page 58 GPIO SMAs J13 and
Additional Resources to include CE PC Test reference.
12/10/20121.2Replaced direct, inline links to external references in the body text with indirect
references to the links in a numbered list in Appendix G, Additional Resources and
Legal Notices. Revised the value for frequency jitter for the System Clock Source,
page 29. Reset conditions are added to Jitter Attenuated Clock, page 32 Revised
jumper information for SFP_RS1, page 42 in Table 1-15. Revised contents and
organization of Appendix F, Additional Resources.
04/05/20121.1Updated links from Table 1-1, page 10. Revised the JTAG configuration mode USB
cable description under FPGA Configuration, page 12. Added Encryption Key
Backup Circuit, page 13 and Table 1-4, page 15. Added links to User SMA Clock
Input in Table 1-8, page 28. Added link to Si570 device vendor on page 30. Added
Ethernet PHY Status LEDs, page 54 and Figure 1-24, page 54. Updated Power
On/Off Slide Switch SW15, page 60 and added Figure 1-32, page 61. Revised FPGA
Mezzanine Card Interface, page 63 and Table 1-28, page 64 and Table 1-29,
page 69. Added description of power module cooling requirement to Power
Management, page 71. Added Cooling Fan Control, page 74. Updated Table 1-35,
page 80. Added references to Documents, page 85. Added Appendix E, Compliance
with European Union Directives and Standards, Appendix D, Board Setup, and
Appendix E, Board Specifications.
The KC705 evaluation board for the Kintex®-7 FPGA provides a hardware environment for
developing and evaluating designs targeting the Kintex-7 XC7K325T-2FFG900C FPGA. The
KC705 board provides features common to many embedded processing systems, including
a DDR3 SODIMM memory, an 8-lane PCI Express® interface, a tri-mode Ethernet PHY,
general purpose I/O, and a UART interface. Other features can be added by using FPGA
Mezzanine Cards (FMCs) attached to either of two VITA-57 FPGA mezzanine connectors
provided on the board. High pin count (HPC) and low pin count (LPC) FMCs are provided.
See KC705 Board Features for a complete list of features. The details for each feature are
described in Feature Descriptions, page 9.
Chapter 1
Additional Information
See Appendix G, Additional Resources and Legal Notices for references to documents, files,
and resources relevant to the KC705 board.
KC705 Board Features
•Kintex-7 XC7K325T-2FFG900C FPGA
•1 GB DDR3 memory SODIMM
•128 MB Linear Byte Peripheral Interface (BPI) flash memory
•128 Mb Quad Serial Peripheral Interface (SPI) flash memory
PMBus voltage and current monitoring via TI power controller
°
Chapter 1: KC705 Evaluation Board Features
•XADC header
•Configuration options
Linear BPI flash memory
°
Quad SPI flash memory
°
USB JTAG configuration port
°
Platform cable header JTAG configuration port
°
The KC705 board block diagram is shown in Figure 1-1. The KC705 board schematics are
available for download from the Kintex-7 FPGA KC705 Evaluation Kit website.
CAUTION! The KC705 board can be damaged by electrostatic discharge (ESD). Follow standard ESD
prevention measures when handling the board.
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X-Ref Target - Figure 1-1
UG810_c1_01_011812
Kintex-7 FPGA
XC7K325T-2FFG900C
128 MB Linear BPI
Flash memory
128 Mb Quad-SPI
Flash Memory
8-lane PCI Express
Edge Connector
LCD Display
(2 line x 16 characters)
1 KB EEPROM (I2C)
I2C Bus Switch
XADC Header
User Switches,
Buttons, and LEDs
HDMI Video
Interface
Differential Clock
GTX SMA Clock
1 GB DDR3 Memory
(SODIMM)
FMC Connectors
(HPC/LPC)
10/100/1000 Ethernet
Interface
DIP Switch SW13
Config and Flash Addr
USB-to-UART Bridge
JTAG Interface
mini-B USB Connector
SFP+ Single Cage
SendFeedback
Chapter 1: KC705 Evaluation Board Features
Figure 1-1: KC705 Board Block Diagram
Feature Descriptions
Figure 1-2 shows the KC705 board. Each numbered feature that is referenced in Figure 1-2
is described in the sections that follow.
Note:
board.
The image in Figure 1-2 is for reference only and might not reflect the current revision of the
KC705 Evaluation Board9
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X-Ref Target - Figure 1-2
SendFeedback
Round callout references a component
00
on the front side of the board
Chapter 1: KC705 Evaluation Board Features
Square callout references a component
00
on the back side of the board
35
17
21
18
33
14
20
6
34
4
15
11
13
30
9
26
8
3
29
10
7
1
12
16
Figure 1-2: KC705 Board Components
Table 1-1:KC705 Board Component Descriptions
2
19
User rotary switch
25
located under LCD
31
37
22
27
5
36
24
28
23
UG841_c1_02_042313
Callout
1U1Kintex-7 FPGA (Located under
2J1DDR3 Memory Module, under EMI
Reference
Designator
Component DescriptionNotes
XC7K325T-2FFG900C, Radian
fansink)
INC3001-7_1.5BU_LI98
Micron MT8JTF12864HZ-1G6G115
Page Number
shield
3U58Linear BPI Flash MemoryMicron PC28F00AP30TF26
4U7Quad SPI Flash MemoryMicron N25Q128A13BSF40F or
Micron MT25QL128ABA8ESF-0SIT
5U9SD Card InterfaceMolex 67840-800128
6USB JTAG ModuleDigilent USB JTAG Module (with
micro-B receptacle)
7U6System Clock Source (back side of
SiTime SIT9102-243N25E200.000023
board)
8U45Programmable User Clock Source
Silicon Labs SI570BAB0000544DG23
(back side of board)
9J11, J12User SMA Clock InputRosenberger 32K10K-400L523
10J15, J16GTX SMA Clock InputRosenberger 32K10K-400L523
35J392 x 5 shrouded PMBus connectorAssman HW10G-020235
36J4912V power input 2 x 3 connectorMolex 39-30-106035
37SW7CPU Reset PushbuttonE-Switch TL3301EP100QG35
Reference
Designator
Component DescriptionNotes
Page Number
Molex 87832-142016
connector
Note: Jumper header locations are identified in Appendix A, Default Switch and Jumper Settings.
Kintex-7 FPGA
[Figure 1-2, callout 1]
The KC705 board is populated with the Kintex-7 XC7K325T-2FFG900C FPGA.
For further information on Kintex-7 FPGAs, see
FPGA Configuration
7 Series FPGAs Overview (DS180) [Ref 1].
Schematic
0381397
The KC705 board supports three of the five 7 series FPGA configuration modes:
•Master SPI flash memory using the onboard Quad SPI flash memory
•Master BPI flash memory using the onboard Linear BPI flash memory
•JTAG using a standard-A to micro-B USB cable for connecting the host PC to the KC705
board configuration port
Each configuration interface corresponds to one or more configuration modes and bus
widths as listed in Table 1-2. The mode switches M2, M1, and M0 are on SW13 positions 3,
4, and 5 respectively as shown in Figure 1-3.
X-Ref Target - Figure 1-3
Figure 1-3: SW13 Default Settings
The default mode setting is M[2:0] = 010, which selects Master BPI at board power-on.
Refer to the Configuration Options, page 80 for detailed information about the mode
switch SW13.
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Table 1-2:KC705 Board FPGA Configuration Modes
SendFeedback
Chapter 1: KC705 Evaluation Board Features
Configuration Mode
SW13 DIP Switch
Settings (M[2:0])
Bus WidthCCLK Direction
Master SPI001x1, x2, x4Output
Master BPI010x8, x16Output
JTAG101x1Not applicable
For full details on configuring the FPGA, see 7 Series FPGAs Configuration User Guide
(UG470) [Ref 2].
Encryption Key Backup Circuit
FPGA U1 implements bitstream encryption key technology. The KC705 board provides the
encryption key backup battery circuit shown in Figure 1-4. The rechargeable 1.5V lithium
button-type battery B1 is soldered to the board with the positive output connected to FPGA
U1 VCCBATT pin C10. The battery supply current I
board power is off. B1 is charged from the VCCAUX_IO 2.0V rail through a series diode with
a typical forward voltage drop of 0.38V. and 4.7 KΩ current limit resistor. The nominal
charging voltage is 1.62V.
X-Ref Target - Figure 1-4
D11
40V
200 mW
specification is 150 nA max when
BATT
NC
1
VCCAUX_IO (2.0V)
3
BAS40-04
2
R406
4.70K 1%
To FPGA U1 Pin C10
(VCCBATT)
FPGA_VBATT
B1
1/16W
1
+
Lithium Battery
Seiko
TS518SE_FL35E
2
GND
UG810_c1_04_031214
Figure 1-4: Encryption Key Backup Circuit
I/O Voltage Rails
There are 10 I/O banks available on the Kintex-7 device. The voltages applied to the FPGA
I/O banks used by the KC705 board are listed in Table 1-3.
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Chapter 1: KC705 Evaluation Board Features
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Table 1-3:I/O Voltage Rails
U1 FPGA BankPower Supply Rail Net NameVoltage
Bank 0VCC2V5_FPGA2.5V
Bank 12
Bank 13
Bank 14VCC2V5_FPGA2.5V
Bank 15VCC2V5_FPGA2.5V
Bank 16
Bank 17
Bank 18
Bank 32VCC1V5_FPGA1.5V
Bank 33VCC1V5_FPGA1.5V
Bank 34VCC1V5_FPGA1.5V
Notes:
1. The VADJ_FPGA rail can support 1.8V, 2.5V, or 3.3V. For more information on VADJ_FPGA see Power Management,
page 71.
(1)
(1)
(1)
(1)
(1)
VADJ_FPGA2.5V (default)
VADJ_FPGA2.5V (default)
VADJ_FPGA2.5V (default)
VADJ_FPGA2.5V (default)
VADJ_FPGA2.5V (default)
DDR3 Memory Module
[Figure 1-2, callout 2]
The memory module at J1 is a 1 GB DDR3 small outline dual-inline memory module
(SODIMM). It provides volatile synchronous dynamic random access memory (SDRAM) for
storing user code and data.
The DDR3 interface is implemented across I/O banks 32, 33, and 34. Each bank is a 1.5V
high-performance (HP) bank. The VRP/VRN DCI resistor connection to bank 33 is cascaded
to the data interface banks 32 and 34 by adding the DCI cascade constraint to the XDC:
# Set DCI_CASCADE
set_property slave_banks {32 34} [get_iobanks 33]
An external 0.75V reference VTTREF is provided for data interface banks 32 and 34. Any
interface connected to these banks that requires a reference voltage must use this FPGA
voltage reference. The connections between the DDR 3 memory and the FPGA are listed in
Table 1-4.
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Chapter 1: KC705 Evaluation Board Features
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Table 1-4:DDR3 Memory Connections to the FPGA
J1 DDR3 Memory
U1 FPGA
Pin
Net NameI/O Standard
Pin
Number
AH12DDR3_A0SSTL1598A0
AG13DDR3_A1SSTL1597A1
AG12DDR3_A2SSTL1596A2
AF12DDR3_A3SSTL1595A3
AJ12DDR3_A4SSTL1592A4
AJ13DDR3_A5SSTL1591A5
AJ14DDR3_A6SSTL1590A6
AH14DDR3_A7SSTL1586A7
AK13DDR3_A8SSTL1589A8
AK14DDR3_A9SSTL1585A9
Pin Name
AF13DDR3_A10SSTL15107A10/AP
AE13DDR3_A11SSTL1584A11
AJ11DDR3_A12SSTL1583A12_BC_N
AH11DDR3_A13SSTL15119A13
AK10DDR3_A14SSTL1580A14
AK11DDR3_A15SSTL1578A15
AH9DDR3_BA0SSTL15109BA0
AG9DDR3_BA1SSTL15108BA1
AK9DDR3_BA2SSTL1579BA2
AA15DDR3_D0SSTL155DQ0
AA16DDR3_D1SSTL157DQ1
AC14DDR3_D2SSTL1515DQ2
AD14DDR3_D3SSTL1517DQ3
AA17DDR3_D4SSTL154DQ4
AB15DDR3_D5SSTL156DQ5
AE15DDR3_D6SSTL1516DQ6
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Y15DDR3_D7SSTL1518DQ7
AB19DDR3_D8SSTL1521DQ8
AD16DDR3_D9SSTL1523DQ9
AC19DDR3_D10SSTL1533DQ10
AD17DDR3_D11SSTL1535DQ11
Chapter 1: KC705 Evaluation Board Features
SendFeedback
Table 1-4:DDR3 Memory Connections to the FPGA (Cont’d)
U1 FPGA
Pin
AA18DDR3_D12SSTL1522DQ12
AB18DDR3_D13SSTL1524DQ13
AE18DDR3_D14SSTL1534DQ14
AD18DDR3_D15SSTL1536DQ15
AG19DDR3_D16SSTL1539DQ16
AK19DDR3_D17SSTL1541DQ17
AG18DDR3_D18SSTL1551DQ18
AF18DDR3_D19SSTL1553DQ19
AH19DDR3_D20SSTL1540DQ20
AJ19DDR3_D21SSTL1542DQ21
AE19DDR3_D22SSTL1550DQ22
AD19DDR3_D23SSTL1552DQ23
AK16DDR3_D24SSTL1557DQ24
Net NameI/O Standard
Pin
Number
Pin Name
J1 DDR3 Memory
AJ17DDR3_D25SSTL1559DQ25
AG15DDR3_D26SSTL1567DQ26
AF15DDR3_D27SSTL1569DQ27
AH17DDR3_D28SSTL1556DQ28
AG14DDR3_D29SSTL1558DQ29
AH15DDR3_D30SSTL1568DQ30
AK15DDR3_D31SSTL1570DQ31
AK8DDR3_D32SSTL15129DQ32
AK6DDR3_D33SSTL15131DQ33
AG7DDR3_D34SSTL15141DQ34
AF7DDR3_D35SSTL15143DQ35
AF8DDR3_D36SSTL15130DQ36
AK4DDR3_D37SSTL15132DQ37
AJ8DDR3_D38SSTL15140DQ38
AJ6DDR3_D39SSTL15142DQ39
AH5DDR3_D40SSTL15147DQ40
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AH6DDR3_D41SSTL15149DQ41
AJ2DDR3_D42SSTL15157DQ42
Chapter 1: KC705 Evaluation Board Features
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Table 1-4:DDR3 Memory Connections to the FPGA (Cont’d)
U1 FPGA
Pin
AH2DDR3_D43SSTL15159DQ43
AH4DDR3_D44SSTL15146DQ44
AJ4DDR3_D45SSTL15148DQ45
AK1DDR3_D46SSTL15158DQ46
AJ1DDR3_D47SSTL15160DQ47
AF1DDR3_D48SSTL15163DQ48
AF2DDR3_D49SSTL15165DQ49
AE4DDR3_D50SSTL15175DQ50
AE3DDR3_D51SSTL15177DQ51
AF3DDR3_D52SSTL15164DQ52
AF5DDR3_D53SSTL15166DQ53
AE1DDR3_D54SSTL15174DQ54
AE5DDR3_D55SSTL15176DQ55
Net NameI/O Standard
Pin
Number
Pin Name
J1 DDR3 Memory
AC1DDR3_D56SSTL15181DQ56
AD3DDR3_D57SSTL15183DQ57
AC4DDR3_D58SSTL15191DQ58
AC5DDR3_D59SSTL15193DQ59
AE6DDR3_D60SSTL15180DQ60
AD6DDR3_D61SSTL15182DQ61
AC2DDR3_D62SSTL15192DQ62
AD4DDR3_D63SSTL15194DQ63
Y16DDR3_DM0SSTL1511DM0
AB17DDR3_DM1SSTL1528DM1
AF17DDR3_DM2SSTL1546DM2
AE16DDR3_DM3SSTL1563DM3
AK5DDR3_DM4SSTL15136DM4
AJ3DDR3_DM5SSTL15153DM5
AF6DDR3_DM6SSTL15170DM6
AC7DDR3_DM7SSTL15187DM7
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AC15DDR3_DQS0_NDIFF_SSTL1510DQS0_N
AC16DDR3_DQS0_PDIFF_SSTL1512DQS0_P
Chapter 1: KC705 Evaluation Board Features
SendFeedback
Table 1-4:DDR3 Memory Connections to the FPGA (Cont’d)
U1 FPGA
Pin
Y18DDR3_DQS1_NDIFF_SSTL1527DQS1_N
Y19DDR3_DQS1_PDIFF_SSTL1529DQS1_P
AK18DDR3_DQS2_NDIFF_SSTL1545DQS2_N
AJ18DDR3_DQS2_PDIFF_SSTL1547DQS2_P
AJ16DDR3_DQS3_NDIFF_SSTL1562DQS3_N
AH16DDR3_DQS3_PDIFF_SSTL1564DQS3_P
AJ7DDR3_DQS4_NDIFF_SSTL15135DQS4_N
AH7DDR3_DQS4_PDIFF_SSTL15137DQS4_P
AH1DDR3_DQS5_NDIFF_SSTL15152DQS5_N
AG2DDR3_DQS5_PDIFF_SSTL15154DQS5_P
AG3DDR3_DQS6_NDIFF_SSTL15169DQS6_N
AG4DDR3_DQS6_PDIFF_SSTL15171DQS6_P
AD1DDR3_DQS7_NDIFF_SSTL15186DQS7_N
Net NameI/O Standard
Pin
Number
Pin Name
J1 DDR3 Memory
AD2DDR3_DQS7_PDIFF_SSTL15188DQS7_P
AD8DDR3_ODT0SSTL15116ODT0
AC10DDR3_ODT1SSTL15120ODT1
AK3DDR3_RESET_BLVCMOS1530RESET_B
AC12DDR3_S0_BSSTL15114S0_B
AE8DDR3_S1_BSSTL15121S1_B
AJ9DDR3_TEMP_EVENTSSTL15198EVENT_B
AE9DDR3_WE_BSSTL15113WE_B
AC11DDR3_CAS_BSSTL15115CAS_B
AD9DDR3_RAS_BSSTL15110RAS_B
AF10DDR3_CKE0SSTL1573CKE0
AE10DDR3_CKE1SSTL1574CKE1
AH10DDR3_CLK0_NDIFF_SSTL15103CK0_N
AG10DDR3_CLK0_PDIFF_SSTL15101CK0_P
AF11DDR3_CLK1_NDIFF_SSTL15104CK1_N
AE11DDR3_CLK1_PDIFF_SSTL15102CK1_P
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The KC705 DDR3 SODIMM interface adheres to the constraints guidelines documented in
the DDR3 Design Guidelines section of 7 Series FPGAs Memory Interface Solutions
Chapter 1: KC705 Evaluation Board Features
SendFeedback
User Guide (UG586) [Ref 3]. The KC705 DDR3 SODIMM interface is a 40Ω impedance
implementation. Other memory interface details are available in UG586 and 7SeriesFPGAs Memory Resources User Guide (UG473) [Ref 4] . For more information about the Micron
MT8JTF12864HZ-1G6G1 part, see [Ref 5].
Linear BPI Flash Memory
[Figure 1-2, callout 3]
The Linear BPI flash memory located at U58 provides 128 MB of nonvolatile storage that
can be used for configuration or software storage. The data, address, and control signals
are connected to the FPGA. The BPI flash memory device is packaged in a 64-pin BGA.
•Part number: PC28F00AP30TF (Micron)
•Supply voltage: 2.5V
•Datapath width: 16 bits (26 address lines and 7 control signals)
•Data rate: Up to 33 MHz
The Linear BPI flash memory can synchronously configure the FPGA in Master BPI mode at
the 33 MHz data rate supported by the PC28F00AP30TF flash memory by using a
configuration bitstream generated with BitGen options for synchronous configuration and
for configuration clock division. The fastest configuration method uses the external 66 MHz
oscillator connected to the FPGA EMCCLK pin with a bitstream that has been built to divide
the configuration clock by two. The division is necessary to remain within the synchronous
read timing specifications of the flash memory.
Multiple bitstreams can be stored in the Linear BPI flash memory. The two most significant
address bits (A25, A24) of the flash memory are connected to DIP switch SW13 positions 1
and 2 respectively, and to the RS1 and RS0 pins of the FPGA. By placing valid XC7K325T
bitstreams at four different offset addresses in the flash memory, 1 of the 4 bitstreams can
be selected to configure the FPGA by appropriately setting the DIP switch SW13. The
connections between the BPI flash memory and the FPGA are listed in Table 1-5.
Table 1-5:BPI Flash Memory Connections to the FPGA
U58 BPI Flash Memory
U1 FPGA PinNet NameI/O Standard
Pin NumberPin Name
W22FLASH_A0LVCMOS25A1A1
W21FLASH_A1LVCMOS25B1A2
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V24FLASH_A2LVCMOS25C1A3
U24FLASH_A3LVCMOS25D1A4
V22FLASH_A4LVCMOS25D2A5
V21FLASH_A5LVCMOS25A2A6
Chapter 1: KC705 Evaluation Board Features
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Table 1-5:BPI Flash Memory Connections to the FPGA (Cont’d)
U1 FPGA PinNet NameI/O Standard
U58 BPI Flash Memory
Pin NumberPin Name
U23FLASH_A6LVCMOS25C2A7
W24FLASH_A7LVCMOS25A3A8
W23FLASH_A8LVCMOS25B3A9
V20FLASH_A9LVCMOS25C3A10
V19FLASH_A10LVCMOS25D3A11
W26FLASH_A11LVCMOS25C4A12
V25FLASH_A12LVCMOS25A5A13
V30FLASH_A13LVCMOS25B5A14
V29FLASH_A14LVCMOS25C5A15
V27FLASH_A15LVCMOS25D7A16
P22FLASH_A16LVCMOS25D8A17
P21FLASH_A17LVCMOS25A7A18
N24FLASH_A18LVCMOS25B7A19
N22FLASH_A19LVCMOS25C7A20
N21FLASH_A20LVCMOS25C8A21
N20FLASH_A21LVCMOS25A8A22
N19FLASH_A22LVCMOS25G1A23
N26FLASH_A23LVCMOS25H8A24
M23FLASH_A24LVCMOS25B6A25
M22FLASH_A25LVCMOS25B8A26
P24FLASH_D0LVCMOS25F2DQ0
R25FLASH_D1LVCMOS25E2DQ1
R20FLASH_D2LVCMOS25G3DQ2
R21FLASH_D3LVCMOS25E4DQ3
T20FLASH_D4LVCMOS25E5DQ4
T21FLASH_D5LVCMOS25G5DQ5
T22FLASH_D6LVCMOS25G6DQ6
T23FLASH_D7LVCMOS25H7DQ7
U20FLASH_D8LVCMOS25E1DQ8
P29FLASH_D9LVCMOS25E3DQ9
KC705 Evaluation Board20
UG810 (v1.8) March 20, 2018www.xilinx.com
R29FLASH_D10LVCMOS25F3DQ10
P27FLASH_D11LVCMOS25F4DQ11
Chapter 1: KC705 Evaluation Board Features
SendFeedback
Table 1-5:BPI Flash Memory Connections to the FPGA (Cont’d)
U1 FPGA PinNet NameI/O Standard
U58 BPI Flash Memory
Pin NumberPin Name
P28FLASH_D12LVCMOS25F5DQ12
T30FLASH_D13LVCMOS25H5DQ13
P26FLASH_D14LVCMOS25G7DQ14
R26FLASH_D15LVCMOS25E7DQ15
U29FLASH_WAITLVCMOS25F7WAIT
M25FPGA_FWE_BLVCMOS25G8WE_B
M24FLASH_OE_BLVCMOS25F8OE_B
B10FPGA_CCLKLVCMOS25E6CLK
U63.6FLASH_CE_BLVCMOS25B4CE_B
M30FLASH_ADV_BLVCMOS25F6ADV_B
A10FPGA_INIT_BLVCMOS25D4RST_B
Additional FPGA bitstreams can be stored and used for configuration by setting the Warm
Boot Start Address (WBSTAR) register contained in 7 series FPGAs. More information is
available in the reconfiguration and multiboot section in 7 Series FPGAs Configuration User Guide (UG470) [Ref 2]. The configuration section in this document provides details on
the Master BPI configuration mode.
KC705 Evaluation Board21
UG810 (v1.8) March 20, 2018www.xilinx.com
Chapter 1: KC705 Evaluation Board Features
PC28F00AP30TF
64-Pin BGA (8 x 10 mm)
U58
FLASH_A0
A1
FLASH_A1
A2
FLASH_A2
A3
FLASH_A3
A4
FLASH_A4
A5
FLASH_A5
A6
FLASH_A6
A7
FLASH_A7
A8
FLASH_A8
A9
FLASH_A9
A10
FLASH_A10
A11
FLASH_A11
A12
FLASH_A12
A13
FLASH_A13
A14
FLASH_A14
A15
FLASH_A15
A16
FLASH_A16
A17
FLASH_A17
A18
FLASH_A18
A19
FLASH_A19
A20
FLASH_A20
A21
FLASH_A21
A22
FLASH_A22
A23
FLASH_A23
A24
FLASH_A24
A25
FLASH_A25
A26
NC
A27
VCC2
VCCQ1
VCCQ2
VCCQ3
VPP
VCC1
FLASH_D0_R
DQ0
FLASH_D1_R
DQ1
FLASH_D2_R
DQ2
FLASH_D3_R
DQ3
FLASH_D4_R
DQ4
FLASH_D5_R
DQ5
FLASH_D6_R
DQ6
FLASH_D7_R
DQ7
FLASH_D8_R
DQ8
FLASH_D9_R
DQ9
FLASH_D10_R
DQ10
FLASH_D11_R
DQ11
FLASH_D12_R
DQ12
FLASH_D13_R
DQ13
FLASH_D14_R
DQ14
FLASH_D15_R
DQ15
WE_B
FLASH_WP_B
WP_B
ADV_B
RST_B
OE_B
CE_B
FLASH_WAIT_R
WAIT
GND
VSS0
VSS1
VSS2
VSS3
NC
RFU1
NC
RFU2
NC
RFU3
2.5V
1.8V
CLK
UG810_c1_05_031214
A1
B1
C1
D1
D2
A2
C2
A3
B3
C3
D3
C4
A5
B5
C5
H1
D7
D8
A7
B7
C7
C8
A8
G1
H8
B6
B8
D5
D6
G4
A4
A6
H3
F2
E2
G3
E4
E5
G5
G6
H7
E1
E3
F3
F4
F5
H5
G7
E7
G8
C6
F6
D4
F8
B4
F7
E6
H6
E8
F1
G2
B2
H2
H4
FLASH_ADV_B
FPGA_INIT_B
FLASH_OE_B
FLASH_CE_B
FLASH_PWE_B
FPGA_CCLK
SendFeedback
Figure 1-5 shows the connections of the linear BPI flash memory on the KC705 board.
For more information about the Micron PC28F00AP30TF part, see [Ref 5].
X-Ref Target - Figure 1-5
Figure 1-5: 128 MB Linear Flash Memory (U58)
KC705 Evaluation Board22
UG810 (v1.8) March 20, 2018www.xilinx.com
Chapter 1: KC705 Evaluation Board Features
SendFeedback
Quad SPI Flash Memory
[Figure 1-2, callout 4]
The Quad SPI flash memory located at U7 on the back side of the board provides 128 Mb of
nonvolatile storage that can be used for configuration and data storage.
•Part number: Micron N25Q128A13BSF40F or MT25QL128ABA8ESF-0SIT
•Supply voltage: 2.8V
•Datapath width: 4 bits
•Data rate: Various depending on Single/Dual/Quad mode and CCLK rate
Four data lines and the FPGA CCLK pin are wired to the Quad SPI flash memory. A common
chip select (FPGA_FCS) shared between the Linear BPI flash memory and the Quad SPI flash
memory is controlled by the configuration mode settings on DIP switch SW13 position 5
(M0) and a one-of-two demultiplexer device U64. If mode pin M0 = 1, the SPI flash memory
device is selected. If mode pin M0 = 0, the Linear BPI flash memory device is selected. The
connections between the SPI flash memory and the FPGA are listed in Table 1-6.
Table 1-6:Quad SPI Flash Memory Connections to the FPGA
J1 DDR3 Memory
U1 FPGA PinNet NameI/O Standard
Pin NumberPin Name
P24FLASH_D0 LVCMOS2515DQ0
R25FLASH_D1 LVCMOS258DQ1
R20FLASH_D2 LVCMOS259DQ2
R21FLASH_D3 LVCMOS251DQ3
B10FPGA_CCLK N/A16C
U19QSPI_IC_CS_B
Notes:
1. FPGA_FCS connected to FPGA U1 pin U19 becomes QSPI_IC_CS_B through U64 and J3.
(1)
LVCMOS257S_B
KC705 Evaluation Board23
UG810 (v1.8) March 20, 2018www.xilinx.com
X-Ref Target - Figure 1-6
UG810_c1_06_031214
VCC2V5
N25Q128
128 Mb Serial
Flash Memory
GND
1
2
3
5
7
6
U7
4
8
VCC_SPI
C18
0.1μF 25V
X5R
FLASH_D2
DQ1
16
15
14
12
10
11
13
9
SB
NC3
NC2
NC1
NC0
VCC
HOLD_B/DQ3
WB/VPP/DQ2
VSS
NC4
NC5
NC6
NC7
DQ0
C
R17
DNP
R18
4.7kΩ 5%
R431
15Ω 1%
R432
15Ω 1%
FLASH_D0
FPGA_CCLK
FLASH_D2_R
FLASH_D0_R
GND
VCC2V5
R20
DNP
R19
4.7kΩ 5%
R21
4.7kΩ 5%
R430
15Ω 1%
R429
15Ω 1%
FLASH_D2_R
FLASH_D3_R
FLASH_D3
FLASH_D1
QSPI_IC_CS_B
SendFeedback
Chapter 1: KC705 Evaluation Board Features
The configuration section of7 Series FPGAs Configuration User Guide (UG470) [Ref 2]
provides details on using the Quad SPI flash memory. Figure 1-6 shows the connections of
the Quad SPI flash memory on the KC705 board.
For more information about the Micron N25Q128A13BSF40F or MT25QL128ABA8ESF-0SIT
parts, see [Ref 5].
KC705 Evaluation Board24
UG810 (v1.8) March 20, 2018www.xilinx.com
Figure 1-6: 128 Mb Quad SPI Flash Memory
SD Card Interface
[Figure 1-2, callout 5]
The KC705 board includes a secure digital input/output (SDIO) interface to provide
user-logic access to general purpose nonvolatile SDIO memory cards and peripherals. The
SD card slot is designed to support 50 MHz high speed SD cards.
The SDIO signals are connected to I/O bank 12 which has its VCCO set to VADJ. A Texas
Instruments I TXB0108 8-bit bidirectional voltage-level translator is used between the FPGA
X-Ref Target - Figure 1-7
SendFeedback
To
Chapter 1: KC705 Evaluation Board Features
and the SD card connector (U9). Figure 1-7 shows the connections of the SD card interface
on the KC705 board.
VCC3V3
SDIO_DAT0 7
SDIO_DAT1
SDIO_DAT2
SDIO_CMD
SDIO_CLK
SDIO_SDWP
NC 12
U9
4
8
9
1SDIO_CD_DAT3
2
5
10
11
3
6
GND
C22
0.1μF 25V
X5R
GND
SDIO Card
Connector
VDD
DAT0
DAT1
DAT2
CD_DAT3
CMD
CLK
DETECT
PROTECT
D_P
VSS2
IOGND2
IOGND1
GNDTAB4
GNDTAB3
GNDTAB2VSS1
GNDTAB1
FPGA
Bank 12
(U1)
51.1K 1% Six Places
SDIO_DAT0_LS
SDIO_DAT1_LS
SDIO_DAT2_LS
SDIO_CD_DAT3_LS
SDIO_CMD_LS
SDIO_CLK_LS
R447
R449
R448
0.1μF 25V
R450
C543
R451
X5R
GND
VADJ
R452
NC
NC
C22
0.1μF 25V
X5R
U57
GND
TXB0108
Voltage-Level
Translator
VCCB
VCCA
A1
A2
A3
A4
A5
A6
A7
A8B8
OE
GND
B1
B2
B3
B4
B5
B6
B7
GND
VCC3V3
51.1K 1% Six Places
To
FPGA
Bank 12
(U1)
R453
R454
VADJ
R455
VCC3V3
R457
R456
4.7K
R35
R458
SDIO_SDDET
R34
4.7K
18
17
16
15
14
13
GND
UG810_c1_07_031214
Figure 1-7: SD Card Interface
Table 1-7 lists the SD card interface connections to the FPGA.
Table 1-7:SDIO Connections to the FPGA
U57 Level ShifterU9 SDIO Connector
U1 FPGA Pin Schematic Net Name I/O Standard
Pin Name (A) Pin Name (B) Pin Number Pin Name
Y21SDIO_SDWPLVCMOS25N/AN/A11SDWP
AA21SDIO_SDDETLVCMOS25N/AN/A10SDDET
AB22SDIO_CMD_LSLVCMOS25A5B62CMD
AB23SDIO_CLK_LSLVCMOS25A6B75CLK
AA22SDIO_DAT2_LSLVCMOS25A3B49DAT2
AA23SDIO_DAT1_LSLVCMOS25A2B38DAT1
AC20SDIO_DAT0_LSLVCMOS25A1B17DAT0
AC21SDIO_CD_DAT3_LSLVCMOS25A4B51CD_DAT3
KC705 Evaluation Board25
UG810 (v1.8) March 20, 2018www.xilinx.com
X-Ref Target - Figure 1-8
UG810_c1_08_031214
2.5V3.3V
FMC HPC
Connector
TDI
TDO
J22
USB
Module
or
JTAG
Connector
(J60)
TDO
TDI
U1
Kintex-7
FPGA
TDI
TDO
SN74AVC1T45
Voltage
Translator
TDITDO
U102
FMC LPC
Connector
TDI
TDO
J2
SPST Bus Switch
U76
N.C.N.C.
SPST Bus Switch
U77
SendFeedback
Chapter 1: KC705 Evaluation Board Features
USB JTAG Module
[Figure 1-2, callout 6]
JTAG configuration is provided through a Digilent onboard USB-to-JTAG configuration
logic module (U59) where a host computer accesses the KC705 board JTAG chain through a
standard-A plug (host side) to micro-B plug (KC705 board side) USB cable.
A 2-mm JTAG header (J60) is also provided in parallel for access by Xilinx® download cables
such as the Platform Cable USB II and the Parallel Cable IV.
The JTAG chain of the KC705 board is illustrated in Figure 1-8. JTAG configuration is allowed
at any time regardless of FPGA mode pin settings. JTAG initiated configuration takes
priority over the configuration method selected through the FPGA mode pin settings at
SW13.
KC705 Evaluation Board26
UG810 (v1.8) March 20, 2018www.xilinx.com
Figure 1-8: JTAG Chain Block Diagram
When an FMC card is attached to the KC705 board, it is automatically added to the JTAG
chain through electronically controlled single-pole single-throw (SPST) switches U76 and
U77. The SPST switches are in a normally closed state and transition to an open state when
an FMC mezzanine card is attached. Switch U76 adds an attached FMC HPC mezzanine card
to the FPGAs JTAG chain as determined by the FMC_HPC_PRSNT_M2C_B signal. Switch U77
adds an attached FMC HPC mezzanine card to the FPGAs JTAG chain as determined by the
FMC_LPC_PRSNT_M2C_B signal. The attached FMC card must implement a TDI-to-TDO
connection via a device or bypass jumper for the JTAG chain to be completed to the FPGA
U1.
The JTAG connectivity on the KC705 board allows a host computer to download bitstreams
to the FPGA using the Xilinx software. In addition, the JTAG connector allows debug tools or
a software debugger to access the FPGA. The Xilinx software tool can also indirectly
program the Linear BPI or the Quad SPI flash memory. To accomplish this, the software
X-Ref Target - Figure 1-9
UG810_c1_09_031214
JTAG_TDI
FMC_TDI_BUF
FPGA_TMS_BUF
FPGA_TDO
FPGA_TCK_BUF
FMC_LPC_TCK_BUF
FMC_HPC_TDO
FMC_LPC_TDO
FMC_TMS_BUF
LPC_PRSNT_M2C_B
HPC_PRSNT_M2C_B
JTAG_TMS
JTAG_TCK
JTAG_TDO
FMC_LPC_TMS_BUF
FMC_HPC_TCK_BUF
FMC_HPC_PRSNT_M2C_B
FMC_LPC_PRSNT_M2C_B
FMC HPC
Connector
TDI
TDO
J22
TMS
TCK
PRSNT_L
VCC3V3
FMC LPC
Connector
TDI
TDO
J2
TMS
TCK
PRSNT_L
Kintex-7
FPGA
TDI
TDO
U1
TMS
TCK
Digilent
USB-JTAG
Module
TMS
TDI
SN74AVC1T45
Voltage
Translator
U102
SN74AVC2T45
Voltage
Translator
U69
SN74LV541A
Voltage
Translator
U5
R381 15Ω
U59
R382 15Ω
R380 15Ω
TCK
TDO
TMS
TDI
J60
TCK
TDO
JTAG
Header
VCC2V5
VCC2V5
VCC3V3
VCC3V3
VCC3V3
VCC3V3
VCC3V3
U76
U77
SendFeedback
Chapter 1: KC705 Evaluation Board Features
configures the FPGA with a temporary design to access and program the BPI or Quad SPI
flash memory device. The JTAG circuit is shown in Figure 1-9.
Figure 1-9: JTAG Circuit
KC705 Evaluation Board27
UG810 (v1.8) March 20, 2018www.xilinx.com
Chapter 1: KC705 Evaluation Board Features
SendFeedback
Clock Generation
There are five clock sources available for the FPGA fabric on the KC705 board (refer to
Table 1-8).
Table 1-8:KC705 Board Clock Sources
Clock NameReferenceDescription
System Clock
User Clock
User SMA Clock
(differential pair)
GTX SMA REF Clock
(differential pair)
Jitter Attenuated
Clock
U6
U45
J11
J12
J16
J15
U70
SiT9102 2.5V LVDS 200 MHz Fixed Frequency Oscillator (Si Time). See
System Clock Source, page 29.
Si570 3.3V LVDS I2C Programmable Oscillator
(Silicon Labs). Default power-on frequency 156.250 MHz. See
Table 1-9 lists the pin-to-pin connections from each clock source to the FPGA.
KC705 Evaluation Board28
UG810 (v1.8) March 20, 2018www.xilinx.com
Table 1-9:Clock Source to FPGA U1 Connections
Clock Source PinSchematic Net NameI/O StandardU1 FPGA Pin
U6.5 SYSCLK_N LVDSAD11
U6.4 SYSCLK_P LVDSAD12
U45.5 USER_CLOCK_N LVDS_25K29
U45.4 USER_CLOCK_P LVDS_25K28
J12.1 USER_SMA_CLOCK_NLVDS_25K25
J11.1 USER_SMA_CLOCK_PLVDS_25L25
J15.1 SMA_MGT_REFCLK_NN/A (MGT REFCLK INPUT)J7
J16.1 SMA_MGT_REFCLK_PN/A (MGT REFCLK INPUT)J8
U70.29Si5326_OUT_N N/A (MGT REFCLK INPUT)L7
U70.28Si5326_OUT_P N/A (MGT REFCLK INPUT)L8
Chapter 1: KC705 Evaluation Board Features
SendFeedback
System Clock Source
[Figure 1-2, callout 7]
The KC705 board has a 2.5V LVDS differential 200 MHz oscillator (U6) soldered onto the
back side of the board and wired to an FPGA MRCC clock input on bank 33. This 200 MHz
signal pair is named SYSCLK_P and SYSCLK_N, which are connected to FPGA U1 pins AD12
and AD11 respectively.
•Oscillator: Si Time SiT9102AI-243N25E200.00000 (200 MHz)
•PPM frequency jitter: 50 ppm
•Differential Output
The system clock circuit is shown in Figure 1-10.
X-Ref Target - Figure 1-10
VCC2V5
U6
SIT9102
200 MHz
1
2
3
Oscillator
OE
NC
GND
VCC
OUT_B
OUT
6
5
4
R459
100Ω 1%
SYSCLK_N
SYSCLK_P
C550
0.1 μF 10V
X5R
GND
UG810_c1_10_031214
Figure 1-10: System Clock Source
For more about the Si Time SiT9102 see [Ref 6].
Programmable User Clock Source
[Figure 1-2, callout 8]
The KC705 board has a programmable low-jitter 3.3V differential oscillator (U45) the FPGA
MRCC inputs of bank 15. This USER_CLOCK_P and USER_CLOCK_N clock signal pair are
connected to FPGA U1 pins K28 and K29 respectively. On power-up the user clock defaults
to an output frequency of 156.250 MHz. User applications can change the output frequency
within the range of 10 MHz to 810 MHz through an I2C interface. Power cycling the KC705
board reverts the user clock to its default frequency of 156.250 MHz.
An external high-precision clock signal can be provided to the FPGA bank 15 by connecting
differential clock signals through the onboard 50Ω SMA connectors J11 (P) and J12 (N). The
differential clock has signal names are USER_SMA_CLOCK_P and USER_SMA_CLOCK_N,
which are connected to FPGA U1 pins L25 and K25, respectively. J11 (P) and J12 (N) are
connected directly to the noted FPGA pins (no series capacitors and no external parallel
KC705 Evaluation Board30
UG810 (v1.8) March 20, 2018www.xilinx.com
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