TEXAS INSTRUMENTS TMS320F28335, TMS320F28334, TMS320F28332, TMS320F28235, TMS320F28234 Technical data

...
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
Data Manual
June 2007 – Revised February 2008
Literature Number: SPRS439C
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Revision History .......................................................................................................................... 11
1 TMS320F2833x, TMS320F2823x DSCs ................................................................................... 13
1.1 Features ..................................................................................................................... 13
1.2 Getting Started .............................................................................................................. 14
2 Introduction ....................................................................................................................... 15
2.1 Pin Assignments ............................................................................................................ 17
2.2 Signal Descriptions ......................................................................................................... 26
3 Functional Overview ........................................................................................................... 35
3.1 Memory Maps .............................................................................................................. 36
3.2 Brief Descriptions ........................................................................................................... 42
3.2.1 C28x CPU ....................................................................................................... 42
3.2.2 Memory Bus (Harvard Bus Architecture) .................................................................... 43
3.2.3 Peripheral Bus .................................................................................................. 43
3.2.4 Real-Time JTAG and Analysis ................................................................................ 43
3.2.5 External Interface (XINTF) ..................................................................................... 43
3.2.6 Flash .............................................................................................................. 44
3.2.7 M0, M1 SARAMs ............................................................................................... 44
3.2.8 L0, L1, L2, L3, L4, L5, L6, L7 SARAMs ..................................................................... 44
3.2.9 Boot ROM ........................................................................................................ 44
3.2.10 Security .......................................................................................................... 45
3.2.11 Peripheral Interrupt Expansion (PIE) Block .................................................................. 46
3.2.12 External Interrupts (XINT1-XINT7, XNMI) .................................................................... 47
3.2.13 Oscillator and PLL .............................................................................................. 47
3.2.14 Watchdog ........................................................................................................ 47
3.2.15 Peripheral Clocking ............................................................................................. 47
3.2.16 Low-Power Modes .............................................................................................. 47
3.2.17 Peripheral Frames 0, 1, 2, 3 (PFn) ........................................................................... 47
3.2.18 General-Purpose Input/Output (GPIO) Multiplexer ......................................................... 48
3.2.19 32-Bit CPU-Timers (0, 1, 2) ................................................................................... 48
3.2.20 Control Peripherals ............................................................................................. 48
3.2.21 Serial Port Peripherals ......................................................................................... 48
3.3 Register Map ................................................................................................................ 49
3.4 Device Emulation Registers ............................................................................................... 50
3.5 Interrupts .................................................................................................................... 52
3.5.1 External Interrupts .............................................................................................. 56
3.6 System Control ............................................................................................................. 56
3.6.1 OSC and PLL Block ............................................................................................ 58
3.6.1.1 External Reference Oscillator Clock Option ....................................................... 59
3.6.1.2 PLL-Based Clock Module ............................................................................ 59
3.6.1.3 Loss of Input Clock ................................................................................... 61
3.6.2 Watchdog Block ................................................................................................. 61
3.7 Low-Power Modes Block .................................................................................................. 62
4 Peripherals ........................................................................................................................ 63
4.1 DMA Overview .............................................................................................................. 64
4.2 32-Bit CPU-Timers 0/1/2 .................................................................................................. 65
4.3 Enhanced PWM Modules (ePWM1/2/3/4/5/6) .......................................................................... 67
4.4 High-Resolution PWM (HRPWM) ........................................................................................ 69
4.5 Enhanced CAP Modules (eCAP1/2/3/4/5/6) ............................................................................ 70
4.6 Enhanced QEP Modules (eQEP1/2) ..................................................................................... 72
4.7 Analog-to-Digital Converter (ADC) Module ............................................................................. 74
Contents 2 Submit Documentation Feedback
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
4.7.1 ADC Connections if the ADC Is Not Used ................................................................... 77
4.7.2 ADC Registers ................................................................................................... 77
4.7.3 ADC Calibration .................................................................................................. 78
4.8 Multichannel Buffered Serial Port (McBSP) Module ................................................................... 79
4.9 Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B) ..................................... 82
4.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C) ........................................... 87
4.11 Serial Peripheral Interface (SPI) Module (SPI-A) ...................................................................... 91
4.12 Inter-Integrated Circuit (I2C) .............................................................................................. 94
4.13 GPIO MUX .................................................................................................................. 96
4.14 External Interface (XINTF) ............................................................................................... 101
5 Device Support ................................................................................................................. 104
5.1 Device and Development Support Tool Nomenclature .............................................................. 104
5.2 Documentation Support .................................................................................................. 106
6 Electrical Specifications .................................................................................................... 109
6.1 Absolute Maximum Ratings ............................................................................................. 109
6.2 Recommended Operating Conditions .................................................................................. 110
6.3 Electrical Characteristics ................................................................................................ 110
6.4 Current Consumption ..................................................................................................... 111
6.4.1 Reducing Current Consumption ............................................................................. 113
6.4.2 Current Consumption Graphs ................................................................................ 114
6.4.2.1 Thermal Design Considerations .............................................................................. 115
6.5 Emulator Connection Without Signal Buffering for the DSP ........................................................ 115
6.6 Timing Parameter Symbology ........................................................................................... 116
6.6.1 General Notes on Timing Parameters ....................................................................... 116
6.6.2 Test Load Circuit .............................................................................................. 116
6.6.3 Device Clock Table ........................................................................................... 116
6.7 Clock Requirements and Characteristics ............................................................................. 118
6.8 Power Sequencing ........................................................................................................ 119
6.8.1 Power Management and Supervisory Circuit Solutions ................................................... 119
6.9 General-Purpose Input/Output (GPIO) ................................................................................. 122
6.9.1 GPIO - Output Timing ......................................................................................... 122
6.9.2 GPIO - Input Timing ........................................................................................... 123
6.9.3 Sampling Window Width for Input Signals .................................................................. 124
6.9.4 Low-Power Mode Wakeup Timing ........................................................................... 125
6.10 Enhanced Control Peripherals .......................................................................................... 128
6.10.1 Enhanced Pulse Width Modulator (ePWM) Timing ........................................................ 128
6.10.2 Trip-Zone Input Timing ........................................................................................ 128
6.10.3 External Interrupt Timing ...................................................................................... 130
6.10.4 I2C Electrical Specification and Timing ..................................................................... 131
6.10.5 Serial Peripheral Interface (SPI) Master Mode Timing .................................................... 131
6.10.6 SPI Slave Mode Timing ....................................................................................... 135
6.10.7 External Interface (XINTF) Timing ........................................................................... 137
6.10.7.1 USEREADY = 0 .................................................................................... 138
6.10.7.2 Synchronous Mode (USEREADY = 1, READYMODE = 0) .................................. 138
6.10.7.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1) ................................. 139
6.10.7.4 XINTF Signal Alignment to XCLKOUT .......................................................... 140
6.10.7.5 External Interface Read Timing .................................................................. 141
6.10.7.6 External Interface Write Timing .................................................................. 142
6.10.7.7 External Interface Ready-on-Read Timing With One External Wait State ................. 143
6.10.7.8 External Interface Ready-on-Write Timing With One External Wait State ................. 147
6.10.8 XHOLD and XHOLDA Timing ................................................................................ 149
6.10.9 On-Chip Analog-to-Digital Converter ........................................................................ 152
Contents 3
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
6.10.9.1 ADC Power-Up Control Bit Timing .............................................................. 153
6.10.9.2 Definitions ........................................................................................... 154
6.10.9.3 Sequential Sampling Mode (Single-Channel) (SMODE = 0) ................................. 155
6.10.9.4 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1) ............................... 156
6.10.10 Detailed Descriptions ........................................................................................ 157
6.10.11 Multichannel Buffered Serial Port (McBSP) Timing ....................................................... 158
6.10.11.0.1 McBSP Transmit and Receive Timing ...................................................... 158
6.10.11.0.2 McBSP as SPI Master or Slave Timing ..................................................... 160
6.11 Migrating From F2833x Devices to F2823x Devices ................................................................. 163
7 Thermal/Mechanical Data ................................................................................................... 164
Contents 4 Submit Documentation Feedback
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
List of Figures
2-1 F2833x, F2823x 176-Pin PGF LQFP (Top View) ............................................................................. 17
2-2 F2833x, F2823x 179-Ball ZHH MicroStar BGA™ (Upper Left Quadrant) (Bottom View) ............................... 18
2-3 F2833x, F2823x 179-Ball ZHH MicroStar BGA™ (Upper Right Quadrant) (Bottom View) .............................. 19
2-4 F2833x, F2823x 179-Ball ZHH MicroStar BGA™ (Lower Left Quadrant) (Bottom View) ............................... 20
2-5 F2833x, F2823x 179-Ball ZHH MicroStar BGA ™(Lower Right Quadrant) (Bottom View) .............................. 21
2-6 F2833x, F2823x 176-Ball ZJZ Plastic BGA (Upper Left Quadrant) (Bottom View) ...................................... 22
2-7 F2833x, F2823x 176-Ball ZJZ Plastic BGA (Upper Right Quadrant) (Bottom View) ..................................... 23
2-8 F2833x, F2823x 176-Ball ZJZ Plastic BGA (Lower Left Quadrant) (Bottom View) ...................................... 24
2-9 F2833x, F2823x 176-Ball ZJZ Plastic BGA (Lower Right Quadrant) (Bottom View) ..................................... 25
3-1 Functional Block Diagram ....................................................................................................... 35
3-2 F28335/F28235 Memory Map ................................................................................................... 37
3-3 F28334/F28234 Memory Map ................................................................................................... 38
3-4 F28332/F28232 Memory Map ................................................................................................... 39
3-5 External and PIE Interrupt Sources ............................................................................................. 52
3-6 External Interrupts ................................................................................................................ 53
3-7 Multiplexing of Interrupts Using the PIE Block ................................................................................ 54
3-8 Clock and Reset Domains ....................................................................................................... 57
3-9 OSC and PLL Block Diagram ................................................................................................... 58
3-10 Using a 3.3-V External Oscillator ............................................................................................... 59
3-11 Using a 1.9-V External Oscillator ............................................................................................... 59
3-12 Using the Internal Oscillator ..................................................................................................... 59
3-13 Watchdog Module ................................................................................................................. 61
4-1 DMA Functional Block Diagram ................................................................................................. 64
4-2 CPU-Timers ........................................................................................................................ 65
4-3 CPU-Timer Interrupt Signals and Output Signal .............................................................................. 65
4-4 Multiple PWM Modules in a F2833x/F2823x System ........................................................................ 67
4-5 ePWM Sub-Modules Showing Critical Internal Signal Interconnections ................................................... 69
4-6 eCAP Functional Block Diagram ................................................................................................ 70
4-7 eQEP Functional Block Diagram ................................................................................................ 72
4-8 Block Diagram of the ADC Module ............................................................................................. 75
4-9 ADC Pin Connections With Internal Reference ............................................................................... 76
4-10 ADC Pin Connections With External Reference .............................................................................. 76
4-11 McBSP Module ................................................................................................................... 80
4-12 eCAN Block Diagram and Interface Circuit .................................................................................... 83
4-13 eCAN-A Memory Map ............................................................................................................ 84
4-14 eCAN-B Memory Map ............................................................................................................ 85
4-15 Serial Communications Interface (SCI) Module Block Diagram ............................................................ 90
4-16 SPI Module Block Diagram (Slave Mode) ..................................................................................... 93
4-17 I2C Peripheral Module Interfaces ............................................................................................... 95
List of Figures 5
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
4-18 GPIO MUX Block Diagram ....................................................................................................... 96
4-19 Qualification Using Sampling Window ........................................................................................ 101
4-20 External Interface Block Diagram ............................................................................................. 102
4-21 Typical 16-bit Data Bus XINTF Connections ................................................................................. 102
4-22 Typical 32-bit Data Bus XINTF Connections ................................................................................. 103
5-1 Example of F2833x, F2823x Device Nomenclature ......................................................................... 105
6-1 Typical Operational Current Versus Frequency (F28335/F28235/F28334/F28234) .................................... 114
6-2 Typical Operational Power Versus Frequency (F28335/F28235/F28334/F28234) ..................................... 114
6-3 Emulator Connection Without Signal Buffering for the DSP ............................................................... 115
6-4 3.3-V Test Load Circuit ......................................................................................................... 116
6-5 Clock Timing ..................................................................................................................... 119
6-6 Power-on Reset .................................................................................................................. 120
6-7 Warm Reset ...................................................................................................................... 121
6-8 Example of Effect of Writing Into PLLCR Register .......................................................................... 122
6-9 General-Purpose Output Timing ............................................................................................... 122
6-10 Sampling Mode .................................................................................................................. 123
6-11 General-Purpose Input Timing ................................................................................................. 124
6-12 IDLE Entry and Exit Timing .................................................................................................... 125
6-13 STANDBY Entry and Exit Timing Diagram ................................................................................... 126
6-14 HALT Wake-Up Using GPIOn ................................................................................................. 127
6-15 PWM Hi-Z Characteristics ...................................................................................................... 128
6-16 ADCSOCAO or ADCSOCBO Timing ......................................................................................... 130
6-17 External Interrupt Timing ....................................................................................................... 130
6-18 SPI Master Mode External Timing (Clock Phase = 0) ...................................................................... 133
6-19 SPI Master Mode External Timing (Clock Phase = 1) ...................................................................... 135
6-20 SPI Slave Mode External Timing (Clock Phase = 0) ........................................................................ 136
6-21 SPI Slave Mode External Timing (Clock Phase = 1) ........................................................................ 137
6-22 Relationship Between XTIMCLK and SYSCLKOUT ........................................................................ 140
6-23 Example Read Access .......................................................................................................... 142
6-24 Example Write Access .......................................................................................................... 143
6-25 Example Read With Synchronous XREADY Access ....................................................................... 145
6-26 Example Read With Asynchronous XREADY Access ...................................................................... 146
6-27 Write With Synchronous XREADY Access ................................................................................... 148
6-28 Write With Asynchronous XREADY Access ................................................................................. 149
6-29 External Interface Hold Waveform ............................................................................................ 150
6-30 XHOLD/ XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) ................................................... 151
6-31 ADC Power-Up Control Bit Timing ............................................................................................ 153
6-32 ADC Analog Input Impedance Model ......................................................................................... 154
6-33 Sequential Sampling Mode (Single-Channel) Timing ....................................................................... 155
6-34 Simultaneous Sampling Mode Timing ........................................................................................ 156
6-35 McBSP Receive Timing ......................................................................................................... 159
List of Figures6 Submit Documentation Feedback
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
6-36 McBSP Transmit Timing ........................................................................................................ 160
6-37 McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 .................................................... 161
6-38 McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 .................................................... 161
6-39 McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 .................................................... 162
6-40 McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 .................................................... 163
List of Figures 7
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
List of Tables
2-1 F2833x Hardware Features ..................................................................................................... 15
2-2 F2823x Hardware Features ..................................................................................................... 16
2-3 Signal Descriptions ............................................................................................................... 26
3-1 Addresses of Flash Sectors in F28335/F28235 .............................................................................. 40
3-2 Addresses of Flash Sectors in F28334/F28234 ............................................................................... 40
3-3 Addresses of Flash Sectors in F28332/F28232 ............................................................................... 40
3-4 Handling Security Code Locations .............................................................................................. 41
3-5 Wait-states ......................................................................................................................... 42
3-6 Boot Mode Selection .............................................................................................................. 45
3-7 Peripheral Frame 0 Registers .................................................................................................. 49
3-8 Peripheral Frame 1 Registers ................................................................................................... 50
3-9 Peripheral Frame 2 Registers ................................................................................................... 50
3-10 Peripheral Frame 3 Registers ................................................................................................... 50
3-11 Device Emulation Registers ..................................................................................................... 51
3-12 PIE Peripheral Interrupts ........................................................................................................ 54
3-13 PIE Configuration and Control Registers ...................................................................................... 55
3-14 External Interrupt Registers ...................................................................................................... 56
3-15 PLL, Clocking, Watchdog, and Low-Power Mode Registers ................................................................ 58
3-16 PLLCR Bit Descriptions .......................................................................................................... 60
3-17 CLKIN Divide Options ............................................................................................................ 60
3-18 Possible PLL Configuration Modes ............................................................................................. 60
3-19 Low-Power Modes ................................................................................................................ 62
4-1 CPU-Timers 0, 1, 2 Configuration and Control Registers ................................................................... 66
4-2 ePWM Control and Status Registers ........................................................................................... 68
4-3 eCAP Control and Status Registers ............................................................................................ 71
4-4 eQEP Control and Status Registers ............................................................................................ 73
4-5 ADC Registers ..................................................................................................................... 77
4-6 McBSP Register Summary ...................................................................................................... 81
4-7 3.3-V eCAN Transceivers ....................................................................................................... 83
4-8 CAN Register Map ............................................................................................................... 86
4-9 SCI-A Registers .................................................................................................................. 88
4-10 SCI-B Registers .................................................................................................................. 88
4-11 SCI-C Registers .................................................................................................................. 89
4-12 SPI-A Registers ................................................................................................................... 92
4-13 I2C-A Registers .................................................................................................................... 95
4-14 GPIO Registers ................................................................................................................... 97
4-15 GPIO-A Mux Peripheral Selection Matrix ..................................................................................... 98
4-16 GPIO-B Mux Peripheral Selection Matrix ..................................................................................... 99
4-17 GPIO-C Mux Peripheral Selection Matrix .................................................................................... 100
List of Tables8 Submit Documentation Feedback
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
4-18 XINTF Configuration and Control Register Mapping ........................................................................ 103
6-1 TMS320F28335/F28235 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT .................. 111
6-2 TMS320F28334/F28234 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT .................. 112
6-3 Typical Current Consumption by Various Peripherals (at 150 MHz) ..................................................... 113
6-4 Clocking and Nomenclature (150-MHz devices) ............................................................................ 117
6-5 Clocking and Nomenclature (100-MHz devices) ............................................................................ 117
6-6 Input Clock Frequency .......................................................................................................... 118
6-7 XCLKIN Timing Requirements - PLL Enabled ............................................................................... 118
6-8 XCLKIN Timing Requirements - PLL Disabled .............................................................................. 118
6-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) ....................................................... 118
6-10 Power Management and Supervisory Circuit Solutions .................................................................... 119
6-11 Reset ( XRS) Timing Requirements ........................................................................................... 121
6-12 General-Purpose Output Switching Characteristics ......................................................................... 122
6-13 General-Purpose Input Timing Requirements ............................................................................... 123
6-14 IDLE Mode Timing Requirements ............................................................................................. 125
6-15 IDLE Mode Switching Characteristics ......................................................................................... 125
6-16 STANDBY Mode Timing Requirements ...................................................................................... 125
6-17 STANDBY Mode Switching Characteristics ................................................................................. 126
6-18 HALT Mode Timing Requirements ............................................................................................ 126
6-19 HALT Mode Switching Characteristics ....................................................................................... 127
6-20 ePWM Timing Requirements................................................................................................... 128
6-21 ePWM Switching Characteristics .............................................................................................. 128
6-22 Trip-Zone input Timing Requirements ........................................................................................ 128
6-23 High Resolution PWM Characteristics at SYSCLKOUT = (60 - 150 MHz) .............................................. 129
6-24 Enhanced Capture (eCAP) Timing Requirement ............................................................................ 129
6-25 eCAP Switching Characteristics ............................................................................................... 129
6-26 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements .................................................... 129
6-27 eQEP Switching Characteristics ............................................................................................... 129
6-28 External ADC Start-of-Conversion Switching Characteristics .............................................................. 129
6-29 External Interrupt Timing Requirements ...................................................................................... 130
6-30 External Interrupt Switching Characteristics ................................................................................. 130
6-31 I2C Timing ....................................................................................................................... 131
6-32 SPI Master Mode External Timing (Clock Phase = 0) ...................................................................... 132
6-33 SPI Master Mode External Timing (Clock Phase = 1) ...................................................................... 134
6-34 SPI Slave Mode External Timing (Clock Phase = 0)........................................................................ 135
6-35 SPI Slave Mode External Timing (Clock Phase = 1)........................................................................ 136
6-36 Relationship Between Parameters Configured in XTIMING and Duration of Pulse .................................... 137
6-37 XINTF Clock Configurations .................................................................................................... 139
6-38 External Interface Read Timing Requirements .............................................................................. 141
6-39 External Interface Read Switching Characteristics .......................................................................... 141
6-40 External Interface Write Switching Characteristics .......................................................................... 142
List of Tables 9
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
6-41 External Interface Read Switching Characteristics (Ready-on-Read, 1 Wait State) .................................... 143
6-42 External Interface Read Timing Requirements (Ready-on-Read, 1 Wait State) ........................................ 143
6-43 Synchronous XREADY Timing Requirements (Ready-on-Read, 1 Wait State) ......................................... 144
6-44 Asynchronous XREADY Timing Requirements (Ready-on-Read, 1 Wait State) ........................................ 144
6-45 External Interface Write Switching Characteristics (Ready-on-Write, 1 Wait State) .................................... 147
6-46 Synchronous XREADY Timing Requirements (Ready-on-Write, 1 Wait State) ......................................... 147
6-47 Asynchronous XREADY Timing Requirements (Ready-on-Write, 1 Wait State) ........................................ 147
6-48 XHOLD/ XHOLDA Timing Requirements (XCLKOUT = XTIMCLK) ....................................................... 150
6-49 XHOLD/ XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK) ................................................... 151
6-50 ADC Electrical Characteristics (over recommended operating conditions) .............................................. 152
6-51 ADC Power-Up Delays .......................................................................................................... 153
6-52 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK) ......................................... 153
6-53 Sequential Sampling Mode Timing ............................................................................................ 155
6-54 Simultaneous Sampling Mode Timing ........................................................................................ 156
6-55 McBSP Timing Requirements .................................................................................................. 158
6-56 McBSP Switching Characteristics ............................................................................................. 158
6-57 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) ................................. 160
6-58 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0) ............................. 160
6-59 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) ................................. 161
6-60 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0) ............................. 161
6-61 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) ................................. 162
6-62 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1) ............................. 162
6-63 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) ................................. 162
6-64 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) ............................. 163
7-1 Thermal Model 176-pin PGF Results ......................................................................................... 164
7-2 Thermal Model 179-pin ZHH Results ......................................................................................... 164
7-3 Thermal Model 176-pin ZJZ Results ......................................................................................... 164
List of Tables10 Submit Documentation Feedback
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232

Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
The table lists the technical changes made for this revision.
Changes Made in Revision C
Location Additions, Deletions, Modifications
Global Added TMS320F28235, TMS320F28234, and TMS320F28232 devices.
Table 2-2 Added F2823x hardware features table.
Figure 3-1 Modified the functional block diagram.
Section 3.1 Changed the fifth bullet under memory maps section.
Figure 3-2 Figure 3-4 Modified all three memory maps.
Section 3.2.19 Deleted a sentence in section on 32-Bit CPU Timers (0, 1, 2).
Section 3.6.1.2 Added a sentence to the section on PLL-Based Clock Module.
Figure 3-8 Modified the Clock and Reset Diagram.
Figure 4-9 and
Figure 4-10 Figure 4-11 Modified the McBSP block diagram.
Figure 5-1 Modified the Device Nomenclature figure to include new devices.
Table 6-1 and Table 6-2 Modified current consumption tables by adding a seventh note.
Table 6-3 Modified Typical Current Consumption table by adding a fourth note.
Table 6-50 Modified ADC Electrical Characteristics table by deleting a row.
Section 6.11 Added section on migrating from F2833x to F2823x devices
Modified the ADC Pin Connection Figures.
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Revision History 11
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Revision History12 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232

1 TMS320F2833x, TMS320F2823x DSCs

1.1 Features

High-Performance Static CMOS Technology
Up to 150 MHz (6.67-ns Cycle Time) – 1.9-V Core, 3.3-V I/O Design
High-Performance 32-Bit CPU (TMS320C28x)
IEEE-754 Single-Precision Floating-Point
Unit (FPU) (2833x only) – 16 x 16 and 32 x 32 MAC Operations – 16 x 16 Dual MAC – Harvard Bus Architecture – Fast Interrupt Response and Processing – Unified Memory Programming Model – Code-Efficient (in C/C++ and Assembly)
Six Channel DMA Controller (for ADC, McBSP,
XINTF, and SARAM) 2 x 8 Channel Input Multiplexer
16-bit or 32-bit External Interface (XINTF)
Over 2M x 16 Address Reach
On-Chip Memory
F28335/F28235: 256K x 16 Flash, 34K x 16
SARAM – F28334/F28234: 128K x 16 Flash, 34K x 16
SARAM – F28332/F28232: 64K x 16 Flash, 26K x 16
SARAM – 1K x 16 OTP ROM
Boot ROM (8K x 16)
With Software Boot Modes (via SCI, SPI,
CAN, I2C, McBSP, XINTF, and Parallel I/O) – Standard Math Tables
Clock and System Control
Dynamic PLL Ratio Changes Supported – On-Chip Oscillator – Watchdog Timer Module
GPIO0 to GPIO63 Pins Can Be Connected to
One of the Eight External Core Interrupts
Peripheral Interrupt Expansion (PIE) Block
That Supports All 58 Peripheral Interrupts
128-Bit Security Key/Lock
Protects Flash/OTP/RAM Blocks – Prevents Firmware Reverse Engineering
Enhanced Control Peripherals
Up to 18 PWM Outputs – Up to 6 HRPWM Outputs With 150 ps MEP
Resolution
Up to 6 Event Capture Inputs – Up to 2 Quadrature Encoder Interfaces – Up to 8 32-bit/Six 16-bit Timers
Three 32-Bit CPU Timers
Serial Port Peripherals
Up to 2 CAN Modules – Up to 3 SCI (UART) Modules – Up to 2 McBSP Modules (Configurable as
SPI) – One SPI Module – One Inter-Integrated-Circuit (I2C) Bus
12-Bit ADC, 16 Channels
80-ns Conversion Rate
Two Sample-and-Hold – Single/Simultaneous Conversions – Internal or External Reference
Up to 88 Individually Programmable,
Multiplexed GPIO Pins With Input Filtering
JTAG Boundary Scan Support
Advanced Emulation Features
Analysis and Breakpoint Functions – Real-Time Debug via Hardware
Development Support Includes
ANSI C/C++ Compiler/Assembler/Linker – Code Composer Studio™ IDE – DSP/BIOS™ – Digital Motor Control and Digital Power
Software Libraries
Low-Power Modes and Power Savings
IDLE, STANDBY, HALT Modes Supported – Disable Individual Peripheral Clocks
Package Options
Lead-free Green Packaging – Thin Quad Flatpack (PGF) – MicroStar BGA™ (ZHH) – Plastic BGA (ZJZ)
Temperature Options: A: –40 ° C to 85 ° C (PGF, ZHH, ZJZ)
S: –40 ° C to 125 ° C (ZJZ)
(1) IEEE Standard 1149.1-1990 Standard Test Access Port and
Boundary Scan Architecture
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
(1)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this document.
Code Composer Studio, DSP/BIOS, MicroStar BGA, TMS320C28x, TMS320C54x, TMS320C55x, C28x are trademarks of Texas
Instruments.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.
Copyright © 2007–2008, Texas Instruments Incorporated
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008

1.2 Getting Started

This section gives a brief overview of the steps to take when first developing for a C28x device. For more detail on each of these steps, see the following:
Getting Started With TMS320C28x™ Digital Signal Controllers (literature number SPRAAM0 ).
C2000 Getting Started Website (http://www.ti.com/c2000getstarted)
14 TMS320F2833x, TMS320F2823x DSCs Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008

2 Introduction

The TMS320F28335, TMS320F28334, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices, members of the TMS320C28x™ DSC generation, are highly integrated, high-performance solutions for demanding control applications.
Throughout this document, the devices are abbreviated as F28335, F28334, F28332, F28235, F28234, and F28232, respectively. Table 2-1 and Table 2-2 provide a summary of features for each device.
Table 2-1. F2833x Hardware Features
FEATURE F28335 (150 MHz) F28334 (150 MHz) F28332 (100 MHz)
Instruction cycle 6.67 ns 6.67 ns 10 ns Floating-point Unit Yes Yes Yes
3.3-V on-chip flash (16-bit word) 256K 128K 64K Single-access RAM (SARAM) (16-bit word) 34K 34K 26K One-time programmable (OTP) ROM
(16-bit word) Code security for on-chip flash/SARAM/OTP
blocks Boot ROM (8K X16) Yes Yes Yes 16/32-bit External Interface (XINTF) Yes Yes Yes 6-channel Direct Memory Access (DMA) Yes Yes Yes PWM outputs ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 HRPWM channels ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A 32-bit Capture inputs or auxiliary PWM outputs 6 6 4 32-bit QEP channels (four inputs/channel) 2 2 2 Watchdog timer Yes Yes Yes
No. of channels 16 16 16
12-Bit ADC MSPS 12.5 12.5 12.5
Conversion time 80 ns 80 ns 80 ns 32-Bit CPU timers 3 3 3 Multichannel Buffered Serial Port (McBSP)/SPI 2 2 1 Serial Peripheral Interface (SPI) 1 1 1 Serial Communications Interface (SCI) 3 3 2 Enhanced Controller Area Network (eCAN) 2 2 2 Inter-Integrated Circuit (I2C) 1 1 1 General Purpose I/O pins (shared) 88 88 88 External interrupts 8 8 8
176-Pin PGF Yes Yes Yes Packaging 179-Ball ZHH Yes Yes Yes
176-Ball ZJZ Yes Yes Yes
Temperature options
Product status TMX TMX TMX
A: –40 ° C to 85 ° C (PGF, ZHH, ZJZ) (PGF, ZHH, ZJZ) (PGF, ZHH, ZJZ)
S: –40 ° C to 125 ° C (ZJZ) (ZJZ) (ZJZ)
1K 1K 1K
Yes Yes Yes
Submit Documentation Feedback Introduction 15
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Table 2-2. F2823x Hardware Features
FEATURE F28235 (150 MHz) F28234 (150 MHz) F28232 (100 MHz)
Instruction cycle 6.67 ns 6.67 ns 10 ns Floating-point Unit No No No
3.3-V on-chip flash (16-bit word) 256K 128K 64K Single-access RAM (SARAM) (16-bit word) 34K 34K 26K One-time programmable (OTP) ROM
(16-bit word) Code security for on-chip flash/SARAM/OTP
blocks Boot ROM (8K X16) Yes Yes Yes 16/32-bit External Interface (XINTF) Yes Yes Yes 6-channel Direct Memory Access (DMA) Yes Yes Yes PWM outputs ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 HRPWM channels ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A 32-bit Capture inputs or auxiliary PWM outputs 6 6 4 32-bit QEP channels (four inputs/channel) 2 2 2 Watchdog timer Yes Yes Yes
No. of channels 16 16 16 12-Bit ADC MSPS 12.5 12.5 12.5
Conversion time 80 ns 80 ns 80 ns 32-Bit CPU timers 3 3 3 Multichannel Buffered Serial Port (McBSP)/SPI 2 2 1 Serial Peripheral Interface (SPI) 1 1 1 Serial Communications Interface (SCI) 3 3 2 Enhanced Controller Area Network (eCAN) 2 2 2 Inter-Integrated Circuit (I2C) 1 1 1 General Purpose I/O pins (shared) 88 88 88 External interrupts 8 8 8
176-Pin PGF Yes Yes Yes Packaging 179-Ball ZHH Yes Yes Yes
176-Ball ZJZ Yes Yes Yes
Temperature options
Product status
(1) See Section 5.1, Device and Development Support Nomenclature for descriptions of device stages.
(1)
A: –40 ° C to 85 ° C (PGF, ZHH, ZJZ) (PGF, ZHH, ZJZ) (PGF, ZHH, ZJZ)
S: –40 ° C to 125 ° C (ZJZ) (ZJZ) (ZJZ)
1K 1K 1K
Yes Yes Yes
TMX TMX TMX
Introduction 16 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45
133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
1
15
114
113
112
11
1
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
GPIO48/ECAP5/XD31 TCK EMU1 EMU0 V
DD3VFL
V
SS
TEST2 TEST1 XRS TMS TRST TDO TDI GPIO33/SCLA/EPWMSYNCO/ADCSOCBO GPIO32/SDAA/EPWMSYNCI/ADCSOCAO GPIO27/ECAP4/EQEP2S/MFSXB GPIO26/ECAP3/EQEP2I/MCLKXB V
DDIO
V
SS
GPIO25/ECAP2/EQEP2B/MDRB GPIO24/ECAP1/EQEP2A/MDXB GPIO23/EQEP1I/MFSXA/SCIRXDB GPIO22/EQEP1S/MCLKXA/SCITXDB GPIO21/EQEP1B/MDRA/CANRXB GPIO20/EQEP1A/MDXA/CANTXB GPIO19/ /SCIRXDB/CANTXASPISTEA GPIO18/SPICLKA/SCITXDB/CANRXA V
DD
V
SS
V
DD2A18
V
SS2AGND
ADCRESEXT ADCREFP ADCREFM ADCREFIN ADCINB7 ADCINB6 ADCINB5 ADCINB4 ADCINB3 ADCINB2 ADCINB1 ADCINB0 V
DDAIO
GPIO75/XD4
GPIO74/XD5
GPIO73/XD6
GPIO72/XD7
GPIO71/XD8
GPIO70/XD9
V
DDVSS
GPIO69/XD10
GPIO68/XD11
GPIO67/XD12
V
DDIOVSS
GPIO66/XD13
V
SSVDD
GPIO65/XD14
GPIO64/XD15
GPIO63/SCITXDC/XD16
GPIO62/SCIRXDC/XD17
GPIO61/MFSRB/XD18
GPIO60/MCLKRB/XD19
GPIO59/MFSRA/XD20
V
DDVSSVDDIOVSS
XCLKIN
X1
V
SS
X2
V
DD
GPIO58/MCLKRA/XD21
GPIO57/ /XD22SPISTEA
GPIO56/SPICLKA/XD23
GPIO55/SPISOMIA/XD24
GPIO54/SPISIMOA/XD25
GPIO53/EQEP1I/XD26
GPIO52/EQEP1S/XD27
V
DDIOVSS
GPIO51/EQEP1B/XD28
GPIO50/EQEP1A/XD29
GPIO49/ECAP6/XD30
GPIO30/CANRXA/XA18
GPIO29/SCITXDA/XA19
V
SS
V
DD
GPIO0/EPWM1A
GPIO1/EPWM1B/ECAP6/MFSRB
GPIO2/EPWM2A
V
SS
V
DDIO
GPIO3/EPWM2B/ECAP5/MCLKRB
GPIO4/EPWM3A
GPIO5/EPWM3B/MFSRA/ECAP1
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO
V
SS
V
DD
GPIO7/EPWM4B/MCLKRA/ECAP2
GPIO8/EPWM5A/CANTXB/
ADCSOCAO
GPIO9/EPWM5B/SCITXDB/ECAP3
GPIO10/EPWM6A/CANRXB/
ADCSOCBO
GPIO1
1/EPWM6B/SCIRXDB/ECAP4
GPIO12 /CANTXB/MDXB/TZ1
V
SS
V
DD
GPIO13/ /CANRXB/MDRBTZ2
GPIO14/ /XHOLD/ /
TZ3 SCITXDBMCLKXB
GPIO15/ /XHOLDATZ4 /SCIRXDB/MFSXB
GPIO16/SPISIMOA/CANTXB/TZ5
GPIO17/SPISOMIA/CANRXB/TZ6
V
D
D
V
SS
V
DD1A18
V
SS1AGND
V
SSA2
V
DDA2
ADCINA7
ADCINA6
ADCINA5
ADCINA4
ADCINA3
ADCINA2
ADCINA1
ADCINA0
ADCLO
V
SSAIO
GPIO76/XD3
GPIO77/XD2
GPIO78/XD1
GPIO79/XD0
GPIO38/XWE0
XCLKOUT
V
DD
V
SS
GPIO28/SCIRXDA/XZCS6
GPIO34/ECAP1/XREADY
V
DDIO
V
SS
GPIO36/SCIRXDA/XZCS0
V
DD
V
SS
GPIO35/SCITXDA/XR/W
XRD
GPIO37/ECAP2/XZCS7
GPIO40/XA0/XWE1
GPIO41/XA1 GPIO42/XA2
V
DD
V
SS
GPIO43/XA3 GPIO44/XA4 GPIO45/XA5
V
DDIO
V
SS
GPIO46/XA6 GPIO47/XA7 GPIO80/XA8 GPIO81/XA9
GPIO82/XA10
V
SS
V
DD
GPIO83/XA11
GPIO84/XA12
V
DDIO
V
SS
GPIO85/XA13 GPIO86/XA14 GPIO87/XA15 GPIO39/XA16
GPIO31/CANTXA/XA17
GPIO28/SCIRXDA/XZCS6
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008

2.1 Pin Assignments

The 176-pin PZ low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2-1 . The 179-ball ZHH ball grid array (BGA) terminal assignments are shown in Figure 2-2 through Figure 2-5 . The 176-ball ZJZ plastic ball grid array (PBGA) terminal assignments are shown in Figure 2-6 through
Figure 2-9 .Table 2-3 describes the function(s) of each pin.
Submit Documentation Feedback Introduction 17
Figure 2-1. F2833x, F2823x 176-Pin PGF LQFP (Top View)
www.ti.com
ADVANCE INFORMATION
ADCINB0 ADCINB2 ADCINB6 ADCREFP
ADCINA1
ADCRESEXTADCINA2
ADCLO
ADCINA0 ADCINB4
V
SS1AGND
ADCINA4
ADCINA3 ADCINB3
ADCREFIN
P P
N N
M M
L LADCINA5
GPIO18/ SPICLKA/ SCITXDB/
CANRXA
V
SSA2
ADCINA7 ADCINB7
GPIO17/
SPISOMIA/
CANRXB/
TZ6
V
DD1A18
V
DD
GPIO14/
/
SCITXDB/
MCLKXB
TZ3XHOLD/
GPIO13/
CANRXB/
MDRB
TZ2/
V
DDAIO
K K
J J
H H
1 2 3 4 5
6 7
GPIO20/
EQEP1A/
MDXA/
CANTXB
V
SS2AGND
GPIO21/
EQEP1B/
MDRA/
CANRXB
GPIO22/ EQEP1S/ MCLKXA/ SCITXDB
V
SS
1 2
3
4
5 6
7
V
SSAIO
V
SS
V
DD
V
DD
GPIO23/ EQEP1I/
MFSXA/
SCIRXDB
GPIO19/
SCIRXDB/
CANTXA
SPISTEA/
ADCINA6
GPIO16/
SPISIMOA/
CANTXB/
TZ5
GPIO15/
/
SCIRXDB/
MFSXB
TZ4XHOLDA/
V
DDA2
V
DD2A18
ADCREFMADCINB5ADCINB1
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-2. F2833x, F2823x 179-Ball ZHH MicroStar BGA™ (Upper Left Quadrant) (Bottom View)
Introduction 18 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
GPIO50/
EQEP1A/
XD29
TMS TEST2
EMU1
GPIO51/
EQEP1B/
XD28
GPIO48/
ECAP5/
XD31
TCK
GPIO52/
EQEP1S/
XD27
V
SS
GPIO27/
ECAP4/
EQEP2S/
MFSXB
XRS
EMU0
GPIO53/ EQEP1I/
XD26
V
DD
GPIO55/
SPISOMIA/
XD24
V
SS
GPIO56/
SPICLKA/
XD23
GPIO58/
MCLKRA/
XD21
GPIO33/
SCLA/
EPWMSYNCO/
ADCSOCBO
TRST
GPIO32/
SDAA/
EPWMSYNCI/
ADCSOCAO
V
DDIO
8 9
10 11 12 13 14
PP
NN
MM
LL
KK
J
J
HH
GPIO57/
/
XD22
SPISTEA
X1
XCLKIN
GPIO59/ MFSRA/
XD20
V
SS
GPIO25/
ECAP2/
EQEP2B/
MDRB
V
SS
V
DD
V
SS
8 9 10
11 12
13
14
V
SS
V
SS
TEST1
V
DD3VFL
GPIO24/
ECAP1/
EQEP2A/
MDXB
GPIO26/
ECAP3/ EQEP2I/ MCLKXB
TDO
V
DDIO
V
SS
X2
GPIO54/
SPISIMOA/
XD25
TDI
V
DDIO
GPIO49/
ECAP6/
XD30
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-3. F2833x, F2823x 179-Ball ZHH MicroStar BGA™ (Upper Right Quadrant) (Bottom View)
Submit Documentation Feedback Introduction 19
www.ti.com
ADVANCE INFORMATION
GPIO11
EPWM6B
SCIRXDB
ECAP4
/
/
/
GPIO12
CANTXB
MDXB
TZ1//
/
GPIO10 EPWM6A CANRXB
ADCSOCBO
/
/ /
GPIO9/ EPWM5B/ SCITXDB/
ECAP3
GPIO81/
XA9
GPIO8/
EPWM5A/
CANTXB/
ADCSOCAO
GPIO7/
EPWM4B/
MCLKRA/
ECAP2
GPIO84/
XA12
GPIO6/
EPWM4A/
EPWMSYNCI/
EPWMSYNCO
GPIO4/
EPWM3A
GPIO5/
EPWM3B/
MFSRA/
ECAP1
GPIO3/
EPWM2B/
ECAP5/
MCLKRB
V
DDIO
V
DDIO
V
SS
GPIO2/
EPWM2A
GPIO1/
EPWM1B/
ECAP6/ MFSRB
GPIO86/
XA14
GPIO83/
XA11
G
F
E
D
GPIO0/
EPWM1A
GPIO29/
SCITXDA/
XA19
V
SS
GPIO85/
XA13
GPIO82/
XA10
V
DD
GPIO30/
CANRXA/
XA18
GPIO39/
XA16
V
SS
V
DD
GPIO31/
CANTXA/
XA17
GPIO87/
XA15
V
DDIO
C
B
A
1 2 3 4 5 6 7
G
F
E
D
C
B
A
V
SS
GPIO45/
XA5
V
SS
GPIO80/
XA8
GPIO46/
XA6
GPIO43/
XA3
GPIO44/
XA4
GPIO47/
XA7
V
SS
1 2 3 4 5
6 7
V
SS
V
DD
V
SS
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-4. F2833x, F2823x 179-Ball ZHH MicroStar BGA™ (Lower Left Quadrant) (Bottom View)
Introduction 20 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
GPIO60/
MCLKRB/
XD19
GPIO64/
XD15
GPIO63/
SCITXDC/
XD16
GPIO61/ MFSRB/
XD18
GPIO67/
XD12
GPIO65/
XD14
GPIO62/
SCIRXDC
XD17
GPIO78/
XD1
GPIO79/
XD0
GPIO66/
XD13
GPIO68/
XD11
V
SS
GPIO37/
ECAP2/
XZCS7
GPIO34/
ECAP1/
XREADY
GPIO38/
XWE0
GPIO70/
XD9
G
F
E
D
V
DD
GPIO40/
XA0/
XWE1
V
SS
XCLKOUT
GPIO73/
XD6
GPIO42/
XA2
XRD
GPIO28/
SCIRXDA/
XZCS6
V
DD
GPIO35/
SCITXDA/
XR/W
GPIO69/
XD10
V
DDIO
C
B
A
8 9 10 11 12 13 14
G
F
E
D
C
B
A
GPIO74/
XD5
GPIO76/
XD3
GPIO72/
XD7
GPIO75/
XD4
GPIO77/
XD2
V
SS
GPIO41/
XA1
V
SS
V
DD
V
SS
8 9
10 11 12 13 14
V
SS
V
DD
V
SS
V
DDIO
GPIO36/
SCIRXDA/
XZCS0
V
DD
GPIO71/
XD8
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-5. F2833x, F2823x 179-Ball ZHH MicroStar BGA ™(Lower Right Quadrant) (Bottom View)
Submit Documentation Feedback Introduction 21
www.ti.com
ADVANCE INFORMATION
V
SSA2
ADCINB0 ADCREFM ADCREFP ADCRESEXT ADCREFIN
V
SSAIO
ADCLO
ADCINB1
ADCINB3
ADCINB5 ADCINB7
EMU0
ADCINA2 ADCINA1 ADCINA0 ADCINB2 ADCINB4 ADCINB6 TEST1
ADCINA5 ADCINA4
ADCINA3
V
SS1AGND
V
DDAIO
V
DD2A18
TEST2
ADCINA7 ADCINA6
V
DD1A18
V
DDA2
GPIO15/
/ /
SCIRXDB/
MFSXB
TZ4XHOLDA
GPIO16/
SPISIMOA/
CANTXB/
TZ5
GPIO17/
SPISOMIA/
CANRXB/
TZ6
V
DD
V
SS
V
SS
GPIO14/
/TZ3XHOLD/
SCITXDB/
MCLKXB
V
DD
V
SS
V
SS
P
N
M
L
K
J
H
1 2 3 4 5 6 7
V
SS2AGND
GPIO12/
TZ1/
CANTXB/
MDXB
GPIO13/
TZ2/
CANRXB/
MDRB
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-6. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Upper Left Quadrant) (Bottom View)
Introduction 22 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
V
SS
V
SS
V
SS
V
SS
P
N
M
L
K
J
H
8 9 10 11 12 13 14
EMU1
GPIO20/
EQEP1A/
MDXA/
CANTXB
GPIO23/ EQEP1I/
MFSXA/
SCIRXDB
GPIO26/
ECAP3/ EQEP2I/ MCLKXB
GPIO33/
SCLA/
EPWMSYNCO/
ADCSOCBO
V
SS
V
SS
GPIO18/ SPICLKA/ SCITXDB/
CANRXA
GPIO21/
EQEP1B/
MDRA/
CANRXB
GPIO24/
ECAP1/
EQEP2A/
MDXB
GPIO27/
ECAP4/
EQEP2S/
MFSXB
TDI
TDO
V
DDIO
GPIO19/
/
SCIRXDB/
CANTXA
SPISTEA
GPIO22/ EQEP1S/ MCLKXA/ SCITXDB
GPIO25/
ECAP2/
EQEP2B/
MDRB
GPIO32/
SDAA/
EPWMSYNCI/
ADSOCAO
TMS
XRS
TCK
V
DD
V
DD3VFL
V
DDIO
TRST
GPIO50/
EQEP1A/
XD29
GPIO49/
ECAP6/
XD30
GPIO48/
ECAP5/
XD31
V
DD
GPIO53
EQEP1I/
XD26
GPIO52/
EQEP1S/
XD27
GPIO51/
EQEP1B/
XD28
V
DD
GPIO56/
SPICLKA/
XD23
GPIO55/
SPISOMIA/
XD24
GPIO54/
SPISIMOA/
XD25
GPIO59/
MFSRA/
XD20
GPIO58/
MCLKRA/
XD21
GPIO57/
/
XD22
SPISTEA
X2
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-7. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Upper Right Quadrant) (Bottom View)
Submit Documentation Feedback Introduction 23
www.ti.com
ADVANCE INFORMATION
G
F
E
D
C
B
A
1 2 3 4 5 6 7
GPIO9/ EPWM5B/ SCITXDB/
ECAP3
GPIO10/ EPWM6A/ CANRXB/
ADCSOCBO
GPIO11/
EPWM6B/
SCIRXDB/
ECAP4
V
DDIO
V
SS
V
SS
V
SS
V
SS
GPIO6/
EPWM4A/
EPWMSYNCI/
EPWMSYNCO
GPIO7/ EPWM4B/ MCLKRA/
ECAP2
GPIO8/
EPWM5A/
CANTXB/
ADCSOCAO
V
DD
GPIO3/
EPWM2B/
ECAP5/
MCLKRB
GPIO4/
EPWM3A
GPIO5/
EPWM3B/
MFSRA/
ECAP1
V
DDIO
GPIO0/
EPWM1A
GPIO1/
EPWM1B/
ECAP6/
MFSRB
GPIO2/
EPWM2A
V
DD
V
DD
GPIO47/
XA7
V
DDIO
GPIO29/
SCITXDA/
XA19
GPIO30/
CANRXA/
XA18
GPIO39/
XA16
GPIO85/
XA13
GPIO82/
XA10
GPIO46/
XA6
GPIO43/
XA3
V
DDIO
GPIO31/
CANTXA/
XA17
GPIO87/
XA15
GPIO84/
XA12
GPIO81/
XA9
GPIO45/
XA5
GPIO42/
XA2
V
SS
V
SS
GPIO86/
XA14
GPIO83/
XA11
GPIO80/
XA8
GPIO44/
XA4
GPIO41/
XA1
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-8. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Lower Left Quadrant) (Bottom View)
Introduction 24 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
G
F
E
D
C
B
A
8 9 10 11 12 13 14
X1
V
SS
V
SS
V
SS
V
SS
V
DDIO
GPIO60/
MCLKRB/
XD19
XCLKIN
V
DD
GPIO63/
SCITXDC/
XD16
GPIO62/
SCIRXDC/
XD17
GPIO61/
MFSRB/
XD18
V
DD
GPIO66/
XD13
GPIO65/
XD14
GPIO64/
XD15
V
DD
V
DD
GPIO28/
SCIRXDA/
XZCS6
V
DDIO
GPIO69/
XD10
GPIO68/
XD11
GPIO67/
XD12
GPIO40/
XA0/XWE1
GPIO36/
SCIRXDA/
XZCS0
GPIO38/
XWE0
GPIO78/
XD1
GPIO75/
XD4
GPIO71/
XD8
GPIO70/
XD9
GPIO37/
ECAP2/
XZCS7
GPIO35/
SCITXDA/
XR/W
GPIO79/
XD0
GPIO77/
XD2
GPIO74/
XD5
GPIO72
XD7
V
SS
V
SS
XRD
GPIO34/
ECAP1/
XREADY
XCLKOUT
GPIO76/
XD3
GPIO73/
XD6
V
DDIO
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Figure 2-9. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Lower Right Quadrant) (Bottom View)
Submit Documentation Feedback Introduction 25
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008

2.2 Signal Descriptions

Table 2-3 describes the signals. The GPIO function (shown in Italics) is the default at reset. The peripheral
signals that are listed under them are alternate functions. Some peripheral functions may not be available in all devices. See Table 2-1 for details. Inputs are not 5-V tolerant. All XINTF pins have a drive strength of 8 mA (typical), with the exception of XREADY, which is 4 mA (typical). All GPIO pins are I/O/Z, 4-mA drive typical (unless otherwise indicated), and have an internal pullup, which can be selectively enabled/disabled on a per-pin basis. This feature only applies to the GPIO pins. The pullups on GPIO0-GPIO11 pins are not enabled at reset. The pullups on GPIO12-GPIO34 are enabled upon reset.
Table 2-3. Signal Descriptions
PIN NO.
NAME DESCRIPTION
TRST 78 M10 L11
TCK 87 N12 M14 JTAG test clock with internal pullup (I, ) TMS 79 P10 M12
TDI 76 M9 N12
TDO 77 K9 N13
EMU0 85 L11 N7 (I/O/Z, 8 mA drive )
EMU1 86 P12 P8 (I/O/Z, 8 mA drive )
V
DD3VFL
TEST1 81 K10 M7 Test Pin. Reserved for TI. Must be left unconnected. (I/O) TEST2 82 P11 L7 Test Pin. Reserved for TI. Must be left unconnected. (I/O)
XCLKOUT 138 C11 A10 and bit 2 (CLKMODE) in the XINTCNF2 register. At reset, XCLKOUT = SYSCLKOUT/4. The
PGF ZHH ZJZ
PIN BAL BAL
# L # L #
JTAG
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of the operations of the device. If this signal is not connected or driven low, the device operates in its functional mode, and the test reset signals are ignored. NOTE: TRST is an active high test pin and must be maintained low at all times during normal device operation. An external pulldown resistor is recommended on this pin. The value of this resistor should be based on drive strength of the debugger pods applicable to the design. A 2.2-k resistor generally offers adequate protection. Since this is application-specific, it is recommended that each target board be validated for proper operation of the debugger and the application. (I, )
JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP controller on the rising edge of TCK. (I, )
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK. (I, )
JTAG scan out, test data output (TDO). The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. (O/Z 8 mA drive)
Emulator pin 0. When TRST is driven high, this pin is used as an interrupt to or from the emulator system and is defined as input/output through the JTAG scan. This pin is also used to put the device into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low state, a rising edge on the TRST pin would latch the device into boundary-scan mode.
NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be based on the drive strength of the debugger pods applicable to the design. A 2.2-k to 4.7-k resistor is generally adequate. Since this is application-specific, it is recommended that each target board be validated for proper operation of the debugger and the application.
Emulator pin 1. When TRST is driven high, this pin is used as an interrupt to or from the emulator system and is defined as input/output through the JTAG scan. This pin is also used to put the device into boundary-scan mode. With the EMU0 pin at a logic-high state and the EMU1 pin at a logic-low state, a rising edge on the TRST pin would latch the device into boundary-scan mode.
NOTE: An external pullup resistor is recommended on this pin. The value of this resistor should be based on the drive strength of the debugger pods applicable to the design. A 2.2-k to 4.7-k resistor is generally adequate. Since this is application-specific, it is recommended that each target board be validated for proper operation of the debugger and the application.
FLASH
84 M11 L9 3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.
CLOCK
Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by bits 18:16 (XTIMCLK)
XCLKOUT signal can be turned off by setting XINTCNF2[CLKOFF] to 1. Unlike other GPIO pins, the XCLKOUT pin is not placed in high-impedance state during a reset. (O/Z, 8 mA drive).
(1)
(1) I = Input, O = Output, Z = High impedance, OD = Open drain, = Pullup, = Pulldown
Introduction 26 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Table 2-3. Signal Descriptions (continued)
PIN NO.
NAME DESCRIPTION
XCLKIN 105 J14 G13 the X1 pin must be tied to GND. If a crystal/resonator is used (or if an external 1.9-V oscillator is
X1 104 J13 G14 power supply. A 1.9-V external oscillator may be connected to the X1 pin. In this case, the XCLKIN
X2 102 J11 H14
XRS 80 L10 M13
ADCINA7 35 K4 K1 ADC Group A, Channel 7 input (I) ADCINA6 36 J5 K2 ADC Group A, Channel 6 input (I) ADCINA5 37 L1 L1 ADC Group A, Channel 5 input (I) ADCINA4 38 L2 L2 ADC Group A, Channel 4 input (I) ADCINA3 39 L3 L3 ADC Group A, Channel 3 input (I) ADCINA2 40 M1 M1 ADC Group A, Channel 2 input (I) ADCINA1 41 N1 M2 ADC Group A, Channel 1 input (I) ADCINA0 42 M3 M3 ADC Group A, Channel 0 input (I) ADCINB7 53 K5 N6 ADC Group B, Channel 7 input (I) ADCINB6 52 P4 M6 ADC Group B, Channel 6 input (I) ADCINB5 51 N4 N5 ADC Group B, Channel 5 input (I) ADCINB4 50 M4 M5 ADC Group B, Channel 4 input (I) ADCINB3 49 L4 N4 ADC Group B, Channel 3 input (I) ADCINB2 48 P3 M4 ADC Group B, Channel 2 input (I) ADCINB1 47 N3 N3 ADC Group B, Channel 1 input (I) ADCINB0 46 P2 P3 ADC Group B, Channel 0 input (I) ADCLO 43 M2 N2 Low Reference (connect to analog ground) (I) ADCRESEXT 57 M5 P6 ADC External Current Bias Resistor. Connect a 22-k resistor to analog ground. ADCREFIN 54 L5 P7 External reference input (I)
ADCREFP 56 P5 P5
ADCREFM 55 N5 P4
V
DDA2
V
SSA2
V
DDAIO
V
SSAIO
V
DD1A18
V
SS1AGND
PGF ZHH ZJZ
PIN BAL BAL
# L # L #
External Oscillator Input. This pin is to feed a clock from an external 3.3-V oscillator. In this case, used to feed clock to X1 pin), this pin must be tied to GND. (I)
Internal/External Oscillator Input. To use the internal oscillator, a quartz crystal or a ceramic resonator may be connected across X1 and X2. The X1 pin is referenced to the 1.9-V core digital
pin must be connected to ground. If a 3.3-V external oscillator is used with the XCLKIN pin, X1 must be tied to GND. (I)
Internal Oscillator Output. A quartz crystal or a ceramic resonator may be connected across X1 and X2. If X2 is not used it must be left unconnected. (O)
RESET
Device Reset (in) and Watchdog Reset (out). Device reset. XRS causes the device to terminate execution. The PC will point to the address contained at the location 0x3FFFC0. When XRS is brought to a high level, execution begins at the location pointed to by the PC. This pin is driven low by the DSC when a watchdog reset occurs. During watchdog reset, the XRS pin is driven low for the watchdog reset duration of 512 OSCCLK cycles. (I/OD, ) The output buffer of this pin is an open-drain with an internal pullup. It is recommended that this pin be driven by an open-drain device.
ADC SIGNALS
Internal Reference Positive Output. Requires a low ESR (50 m - 1.5 ) ceramic bypass capacitor of 2.2 µ F to analog ground. (O)
Internal Reference Medium Output. Requires a low ESR (50 m - 1.5 ) ceramic bypass capacitor of 2.2 µ F to analog ground. (O)
CPU AND I/O POWER PINS
34 K2 K4 ADC Analog Power Pin 33 K3 P1 ADC Analog Ground Pin 45 N2 L5 ADC Analog I/O Power Pin 44 P1 N1 ADC Analog I/O Ground Pin 31 J4 K3 ADC Analog Power Pin 32 K1 L4 ADC Analog Ground Pin
(1)
Submit Documentation Feedback Introduction 27
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Table 2-3. Signal Descriptions (continued)
PIN NO.
NAME DESCRIPTION
V
DD2A18
V
SS2AGND
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DD
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
DDIO
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
PGF ZHH ZJZ
PIN BAL BAL
# L # L #
59 M6 L6 ADC Analog Power Pin 58 K6 P2 ADC Analog Ground Pin
4 B1 D4 15 B5 D5 23 B11 D8 29 C8 D9 61 D13 E11
101 E9 F4 109 F3 F11 CPU and Logic Digital Power Pins 117 F13 H4 126 H1 J4 139 H12 J11 146 J2 K11 154 K14 L8 167 N6
9 A4 A13 71 B10 B1 93 E7 D7
107 E12 D11 121 F5 E4 Digital I/O Power Pin 143 L8 G4 159 H11 G11 170 N14 L10
N14 3 A5 A1 8 A10 A2
14 A11 A14 22 B4 B14 30 C3 F6 60 C7 F7 70 C9 F8 83 D1 F9 92 D6 G6
103 D14 G7
Digital Ground Pins
106 E8 G8 108 E14 G9 118 F4 H6 120 F12 H7 125 G1 H8 140 H10 H9 144 H13 J6 147 J3 J7 155 J10 J8 160 J12 J9
(1)
Introduction 28 Submit Documentation Feedback
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232
Table 2-3. Signal Descriptions (continued)
PIN NO.
NAME DESCRIPTION
V
SS
V
SS
V
SS
V
SS
V
SS
GPIO0 General purpose input/output 0 (I/O/Z) EPWM1A Enhanced PWM1 Output A and HRPWM channel (O)
- -
- ­GPIO1 General purpose input/output 1 (I/O/Z)
EPWM1B Enhanced PWM1 Output B (O) ECAP6 Enhanced Capture 6 input/output (I/O) MFSRB McBSP-B receive frame synch (I/O)
GPIO2 General purpose input/output 2 (I/O/Z) EPWM2A Enhanced PWM2 Output A and HRPWM channel (O)
- -
- ­GPIO3 General purpose input/output 3 (I/O/Z)
EPWM2B Enhanced PWM2 Output B (O) ECAP5 Enhanced Capture 5 input/output (I/O) MCLKRB McBSP-B receive clock (I/O)
GPIO4 General purpose input/output 4 (I/O/Z) EPWM3A Enhanced PWM3 output A and HRPWM channel (O)
- -
- ­GPIO5 General purpose input/output 5 (I/O/Z)
EPWM3B Enhanced PWM3 output B (O) MFSRA McBSP-A receive frame synch (I/O) ECAP1 Enhanced Capture input/output 1 (I/O)
GPIO6 General purpose input/output 6 (I/O/Z) EPWM4A Enhanced PWM4 output A and HRPWM channel (O) EPWMSYNCI External ePWM sync pulse input (I) EPWMSYNCO External ePWM sync pulse output (O)
GPIO7 General purpose input/output 7 (I/O/Z) EPWM4B Enhanced PWM4 output B (O) MCLKRA McBSP-A receive clock (I/O) ECAP2 Enhanced capture input/output 2 (I/O)
GPIO8 General Purpose Input/Output 8 (I/O/Z) EPWM5A Enhanced PWM5 output A and HRPWM channel (O) CANTXB Enhanced CAN-B transmit (O) ADCSOCAO ADC start-of-conversion A (O)
GPIO9 General purpose input/output 9 (I/O/Z) EPWM5B Enhanced PWM5 output B (O) SCITXDB SCI-B transmit data(O) ECAP3 Enhanced capture input/output 3 (I/O)
GPIO10 General purpose input/output 10 (I/O/Z) EPWM6A Enhanced PWM6 output A and HRPWM channel (O) CANRXB Enhanced CAN-B receive (I) ADCSOCBO ADC start-of-conversion B (O)
GPIO11 General purpose input/output 11 (I/O/Z) EPWM6B Enhanced PWM6 output B (O) SCIRXDB SCI-B receive data (I) ECAP4 Enhanced CAP Input/Output 4 (I/O)
PGF ZHH ZJZ
PIN BAL BAL
# L # L #
166 M12 P13 171 N10 P14
N11
P6 P8
5 C1 D1
6 D3 D2
7 D2 D3
10 E4 E1
11 E2 E2
12 E3 E3
13 E1 F1
16 F2 F2
17 F1 F3
18 G5 G1
19 G4 G2
20 G2 G3
Digital Ground Pins
GPIOA AND PERIPHERAL SIGNALS
Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
(1)
Submit Documentation Feedback Introduction 29
www.ti.com
ADVANCE INFORMATION
TMS320F28335, TMS320F28334, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 Digital Signal Controllers (DSCs)
SPRS439C – JUNE 2007 – REVISED FEBRUARY 2008
Table 2-3. Signal Descriptions (continued)
PIN NO.
NAME DESCRIPTION
GPIO12 General purpose input/output 12 (I/O/Z) TZ1 Trip Zone input 1 (I) CANTXB Enhanced CAN-B transmit (O) MDXB McBSP-B transmit serial data (O)
GPIO13 General purpose input/output 13 (I/O/Z) TZ2 Trip Zone input 2 (I) CANRXB Enhanced CAN-B receive (I) MDRB McBSP-B receive serial data (I)
GPIO14 General purpose input/output 14 (I/O/Z)
TZ3/ XHOLD XINTCNF2[HOLD] = 1. If this is not done, the XINTF bus will go into high impedance anytime TZ3
SCITXDB SCI-B Transmit (I) MCLKXB McBSP-B transmit clock (I/O)
GPIO15 General purpose input/output 15 (I/O/Z)
TZ4/ XHOLDA
SCIRXDB SCI-B receive (I) MFSXB McBSP-B transmit frame synch (I/O)
GPIO16 General purpose input/output 16 (I/O/Z) SPISIMOA SPI slave in, master out (I/O) CANTXB Enhanced CAN-B transmit (O) TZ5 Trip Zone input 5 (I)
GPIO17 General purpose input/output 17 (I/O/Z) SPISOMIA SPI-A slave out, master in (I/O) CANRXB Enhanced CAN-B receive (I) TZ6 Trip zone input 6 (I)
GPIO18 General purpose input/output 18 (I/O/Z) SPICLKA SPI-A clock input/output (I/O) SCITXDB SCI-B transmit (O) CANRXA Enhanced CAN-A receive (I)
GPIO19 General purpose input/output 19 (I/O/Z) SPISTEA SPI-A slave transmit enable input/output (I/O) SCIRXDB SCI-B receive (I) CANTXA Enhanced CAN-A transmit (O)
GPIO20 General purpose input/output 20 (I/O/Z) EQEP1A Enhanced QEP1 input A (I) MDXA McBSP-A transmit serial data (O) CANTXB Enhanced CAN-B transmit (O)
GPIO21 General purpose input/output 21 (I/O/Z) EQEP1B Enhanced QEP1 input B (I) MDRA McBSP-A receive serial data (I) CANRXB Enhanced CAN-B receive (I)
GPIO22 General purpose input/output 22 (I/O/Z) EQEP1S Enhanced QEP1 strobe (I/O) MCLKXA McBSP-A transmit clock (I/O) SCITXDB SCI-B transmit (O)
PGF ZHH ZJZ
PIN BAL BAL
# L # L #
21 G3 H1
24 H3 H2
Trip Zone input 3/External Hold Request. XHOLD, when active (low), requests the external interface (XINTF) to release the external bus and place all buses and strobes into a high-impedance state. To prevent this from happening when TZ3 signal goes active, disable this function by writing
25 H2 H3
26 H4 J1 active (low) when the XINTF has granted an XHOLD request. All XINTF buses and strobe signals
27 H5 J2
28 J1 J3
62 L6 N8
63 K7 M8
64 L7 P9
65 P7 N9
66 N7 M9
goes low. On the ePWM side, TZn signals are ignored by default, unless they are enabled by the code. The XINTF will release the bus when any current access is complete and there are no pending accesses on the XINTF. (I)
Trip Zone input 4/External Hold Acknowledge. The pin function for this option is based on the direction chosen in the GPADIR register. If the pin is configured as an input, then TZ4 function is chosen. If the pin is configured as an output, then XHOLDA function is chosen. XHOLDA is driven
will be in a high-impedance state. XHOLDA is released when the XHOLD signal is released. External devices should only drive the external bus when XHOLDA is active (low). (I/0)
(1)
Introduction 30 Submit Documentation Feedback
Loading...
+ 140 hidden pages