Texas Instruments TMS320F28069, TMS320F28068, TMS320F28065, TMS320F28064, TMS320F28067 User Manual

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TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

TMS320F2806x Piccolo™ Microcontrollers

1 Device Overview

1.1 Features

• High-Efficiency 32-Bit CPU (TMS320C28x) – 90 MHz (11.11-ns Cycle Time) – 16 × 16 and 32 × 32 Multiply and Accumulate

(MAC) Operations – 16 × 16 Dual MAC – Harvard Bus Architecture – Atomic Operations – Fast Interrupt Response and Processing – Unified Memory Programming Model – Code-Efficient (in C/C++ and Assembly)

• Floating-Point Unit (FPU) – Native Single-Precision Floating-Point

Operations

• Programmable Control Law Accelerator (CLA) – 32-Bit Floating-Point Math Accelerator – Executes Code Independently of the Main CPU

• Viterbi, Complex Math, CRC Unit (VCU) – Extends C28x Instruction Set to Support

Complex Multiply, Viterbi Operations, and Cyclic Redundency Check (CRC)

• Embedded Memory – Up to 256KB of Flash – Up to 100KB of RAM – 2KB of One-Time Programmable (OTP) ROM

• 6-Channel Direct Memory Access (DMA)

• Low Device and System Cost – Single 3.3-V Supply – No Power Sequencing Requirement – Integrated Power-on Reset and Brown-out

Reset – Low-Power Operating Modes – No Analog Support Pin

• Endianness: Little Endian

• JTAG Boundary Scan Support – IEEE Standard 1149.1-1990 Standard Test

Access Port and Boundary Scan Architecture

• Clocking – Two Internal Zero-Pin Oscillators – On-Chip Crystal Oscillator/External Clock Input – Watchdog Timer Module – Missing Clock Detection Circuitry

• Peripheral Interrupt Expansion (PIE) Block That Supports All Peripheral Interrupts

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

• Three 32-Bit CPU Timers

• Advanced Control Peripherals

• Up to 8 Enhanced Pulse-Width Modulator (ePWM) Modules

– 16 PWM Channels Total (8 HRPWM-Capable) – Independent 16-Bit Timer in Each Module

• Three Input Enhanced Capture (eCAP) Modules

• Up to 4 High-Resolution Capture (HRCAP) Modules

• Up to 2 Enhanced Quadrature Encoder Pulse (eQEP) Modules

• 12-Bit Analog-to-Digital Converter (ADC), Dual Sample-and-Hold (S/H)

– Up to 3.46 MSPS – Up to 16 Channels

• On-Chip Temperature Sensor

• 128-Bit Security Key and Lock – Protects Secure Memory Blocks – Prevents Reverse-Engineering of Firmware

• Serial Port Peripherals – Two Serial Communications Interface (SCI)

[UART] Modules – Two Serial Peripheral Interface (SPI) Modules – One Inter-Integrated-Circuit (I2C) Bus – One Multichannel Buffered Serial Port (McBSP)

Bus – One Enhanced Controller Area Network (eCAN) – Universal Serial Bus (USB) 2.0

(see Device Comparison Table for Availability)

• Full-Speed Device Mode

• Full-Speed or Low-Speed Host Mode

• Up to 54 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering

• Advanced Emulation Features – Analysis and Breakpoint Functions – Real-Time Debug Through Hardware

• 2806x Packages – 80-Pin PFP and 100-Pin PZP PowerPAD™

Thermally Enhanced Thin Quad Flatpacks (HTQFPs)

– 80-Pin PN and 100-Pin PZ Low-Profile Quad

Flatpacks (LQFPs)

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

1.2 Applications

• Switch Mode Power Supplies (SMPSs)

• Solar Micro Inverters and Converters

• Power Factor Correction (PFC)

• Smart Grid and Power Line Communications

• AC/DC Inverters

1.3 Description

The F2806x Piccolo™ family of microcontrollers (MCUs) provides the power of the C28x core and CLA coupled with highly integrated control peripherals in low pin-count devices. This family is code-compatible with previous C28x-based code, and also provides a high level of analog integration.

An internal voltage regulator allows for single-rail operation. Enhancements have been made to the HighResolution Pulse Width Modulator (HRPWM) module to allow for dual-edge control (frequency modulation). Analog comparators with internal 10-bit references have been added and can be routed directly to control the ePWM outputs. The ADC converts from 0 to 3.3-V fixed full-scale range and supports ratio-metric V and latency.

REFHI/VREFLO

references. The ADC interface has been optimized for low overhead

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Device Information

PART NUMBER PACKAGE BODY SIZE

TMS320F28069PZP HTQFP (100) 14.0 mm × 14.0 mm TMS320F28069PFP HTQFP (80) 12.0 mm × 12.0 mm TMS320F28069PZ LQFP (100) 14.0 mm × 14.0 mm TMS320F28069PN LQFP (80) 12.0 mm × 12.0 mm

(1) For more information on these devices, see Section 9, Mechanical Packaging and Orderable

Information.

(1)

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CLA Bus

DMA Bus

16-bit Peripheral Bus

32-bit Peripheral

Bus

Memory Bus

A7:0

B7:0

Memory Bus

DMA Bus

CLA Bus

DMA Bus

GPIO Mux

AIO Mux

32-bit Peripheral Bus

ADC

0-wait

Result

Regs

ADC

COMP

DAC

COMP1OUT

COMP2OUT

COMP3OUT

COMP1A

COMP2A

COMP3A

COMP1B

COMP2B

COMP3B

Boot-ROM

(32K 16)

(0-wait,

Non-Secure)

GPIO

Mux

GPIO

Mux

TRST

TCK, TDI, TMS

TDO

XCLKIN

LPM Wakeup

3 Ext. Interrupts

X1 X2

XRS

M0 SARAM (1K 16)

(0-wait, Non-Secure)

M1 SARAM (1K 16)

(0-wait, Non-Secure)

L5 DPSARAM (8K 16)

(0-wait, Non-Secure)

DMA RAM0

L6 DPSARAM (8K 16)

(0-wait, Non-Secure)

DMA RAM1

L7 DPSARAM (8K 16)

(0-wait, Non-Secure)

DMA RAM2

L8 DPSARAM (8K 16)

(0-wait, Non-Secure)

DMA RAM3

L0 DPSARAM (2K 16)

(0-wait, Secure) CLA Data RAM2

L1 DPSARAM (1K 16)

(0-wait, Secure) CLA Data RAM0

L2 DPSARAM (1K 16)

(0-wait, Secure) CLA Data RAM1

L3 DPSARAM (4K 16)

(0-wait, Secure)

CLA Program RAM

L4 SARAM (8K 16)

(0-wait, Secure)

Code

Security

Module

(CSM)

PSWD

OTP 1K 16

Secure

FLASH

128K 16

8 equal sectors

Secure

64K 16´

PUMP

OTP/Flash

Wrapper

32-bit Peripheral

Bus

USB-0

GPIO Mux

SCITXDx

SCIRXDx

SPISIMOx

SPISOMIx

SPICLKx

SPISTEx

SDAx

SCLx

MFSRA

MDRA

MCLKRA

MFSXA

MDXA

MCLKXA

ECAPx

EQEPxA

EQEPxB

EQEPxI

EQEPxS

HRCAPx

CANRXx

CANTXx

USB0DP

USB0DM

TZx

EPWMxA

EPWMxB

EPWMSYNCI

EPWMSYNCO

SCI-A SCI-B

(4L FIFO)

SPI-A SPI-B

(4L FIFO)

I2C-A

(4L FIFO)

32-bit Peripheral Bus

(CLA accessible)

ePWM1 to ePWM8

HRPWM (8ch)

McBSP-A

32-bit

Peripheral Bus

(CLA accessible)

eCAP1 eCAP2 eCAP3

eQEP1 eQEP2

32-bit Peripheral

Bus

HRCAP1 HRCAP2 HRCAP3 HRCAP4

eCAN-A

(32-mbox)

CLA +

Message

RAMs

DMA

6-ch

C28x 32-bit CPU

FPU VCU

OSC1, OSC2,

Ext, PLLs,

LPM, WD, CPU Timer 0, CPU Timer 1, CPU Timer 2,

PIE

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1.4 Functional Block Diagram

Figure 1-1 shows a functional block diagram of the device.

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TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

A. Not all peripheral pins are available at the same time due to multiplexing.

Figure 1-1. Functional Block Diagram

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10-bit

DAC

Analog

Comparators

CMP1-Out

CMP2-Out

CMP3-Out

Trip Zone

Temp

Sensor

ADC

(DMA-

accessible)

12-bit

3.46-MSPS Dual

Sample-

andHold

SOC-based

REF

CLA Core

90-MHz Floating-Point

(Accelerator)

(DMA-accessible)

10-bit

DAC

10-bit

DAC

A2 A3 A4 A5 A6 A7

B1 B2 B3 B4 B5 B6 B7

eQEP 2´

HRCAP 4´

eCAP 3´

System

Vreg

Int-Osc-1

POR/BOR

Int-Osc-2

On-chip Osc

PLL

CLKSEL

Timers 32-bit

Timer-0

Timer-1

Timer-2

GPIO

Control

COMMS

X1 X2

REFLO

REFHI

C28x Core

(90-MHz)

FPU

VCU

Flash Memory

RAM

(Dual-Access)

eQEP

HRCAP

eCAP

PWM-1A PWM-1B

PWM-2A PWM-2B

PWM-3A PWM-3B

PWM-4A PWM-4B

PWM-5A PWM-5B

PWM-6A PWM-6B

PWM-7A PWM-7B

PWM-8A PWM-8B

TZ1 TZ2 TZ3

CMP1-out CMP2-out CMP3-out

PWM1

(DMA-accessible)

PWM5

(DMA-accessible)

PWM8

(DMA-accessible)

PWM7

(DMA-accessible)

PWM6

(DMA-accessible)

PWM4

(DMA-accessible)

PWM3

(DMA-accessible)

PWM2

(DMA-accessible)

UART 2´

SPI 2´

I C

CAN

McBSP

(DMA-accessible)

USB

(DMA-accessible)

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

1.5 System Device Diagram

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Figure 1-2. Peripheral Blocks

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TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Table of Contents

1 Device Overview ......................................... 1

1.1 Features .............................................. 1

1.2 Applications........................................... 2

1.3 Description............................................ 2

1.4 Functional Block Diagram ............................ 3

1.5 System Device Diagram.............................. 4

2 Revision History ......................................... 6

3 Device Comparison ..................................... 7

4 Terminal Configuration and Functions.............. 9

4.1 Pin Diagrams ......................................... 9

4.2 Signal Descriptions.................................. 11

5 Specifications........................................... 19

5.1 Absolute Maximum Ratings ........................ 19

5.2 ESD Ratings for TMS320F2806xU ................. 19

5.3 ESD Ratings for TMS320F2806x,

TMS320F2806xM, and TMS320F2806xF .......... 19

5.4 Recommended Operating Conditions............... 20

5.5 Electrical Characteristics............................ 20

5.6 Power Consumption Summary...................... 21

5.7 Thermal Resistance Characteristics ................ 25

5.8 Thermal Design Considerations .................... 27

5.9 Emulator Connection Without Signal Buffering for

the MCU............................................. 27

5.10 Parameter Information .............................. 28

5.11 Test Load Circuit .................................... 28

5.12 Power Sequencing.................................. 29

5.13 Clock Specifications................................. 32

5.14 Flash Timing ........................................ 35

6 Detailed Description................................... 37

6.1 Overview ............................................ 37

6.2 Memory Maps....................................... 47

6.3 Register Maps....................................... 58

6.4 Device Emulation Registers......................... 60

6.5 VREG, BOR, POR .................................. 62

6.6 System Control ...................................... 64

6.7 Low-power Modes Block ............................ 73

6.8 Interrupts ............................................ 74

6.9 Peripherals .......................................... 79

7 Applications, Implementation, and Layout ...... 156

7.1 TI Design or Reference Design.................... 156

7.2 Development Tools ................................ 157

7.3 Software Tools ..................................... 157

7.4 Training ............................................ 158

8 Device and Documentation Support.............. 159

8.1 Device Support..................................... 159

8.2 Documentation Support............................ 161

8.3 Related Links ...................................... 162

8.4 Community Resources............................. 162

8.5 Trademarks ........................................ 162

8.6 Electrostatic Discharge Caution ................... 162

8.7 Glossary............................................ 162

9 Mechanical Packaging and Orderable

Information............................................. 163

9.1 Packaging Information ............................. 163

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

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2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from July 2, 2014 to March 22, 2016 (from E Revision (July 2014) to F Revision) Page

• Global: Changed "CAN 2.0B" to "ISO11898-1 (CAN 2.0B)". .................................................................. 1

• Table 3-1 (Device Comparison): Changed the number of High-resolution ePWM Channels on the 80-Pin

PN/PFP packages from 6 to 8. ..................................................................................................... 7

• Table 3-1: Removed "Product status" row and associated footnote. ......................................................... 7

• Figure 4-1 (80-Pin PN and PFP Packages (Top View)): Added footnote about PowerPAD. .............................. 9

• Figure 4-2 (100-Pin PZ and PZP Packages (Top View)): Added footnote about PowerPAD. ........................... 10

• Section 4.2 (Signal Descriptions): Added "GPIO26–27" to NOTE. .......................................................... 11

• Table 4-1 (Signal Descriptions): Updated DESCRIPTION of X1, V

• Section 5.1 (Absolute Maximum Ratings): Added Input voltage, V

• Section 5.1: Added T

. ........................................................................................................... 19

stg

• Section 5.2 (ESD Ratings for TMS320F2806xU): Added section. ........................................................... 19

• Section 5.3 (ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF): Changed title from

"Handling Ratings" to "ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF". ................. 19

• Section 5.3: Updated footnotes. .................................................................................................. 19

• Section 5.4 (Recommended Operating Conditions): Removed footnote that read "V

maintained within approximately 0.3 V of each other". ........................................................................ 20

• Section 5.6 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power

Consumption Summary". .......................................................................................................... 21

• Section 5.12 (Power Sequencing): Updated paragraph that reads "There is no power sequencing requirement

needed ...". .......................................................................................................................... 29

• Table 5-10 (XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)): Added MAX value for t

• Table 5-10: Added MAX value for t

......................................................................................... 34

r(XCO)

• Table 5-15 (Flash/OTP Access Timing): Removed footnote. ................................................................. 36

• Figure 6-1 (28069 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM. ........ 48

• Figure 6-2 (28068 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM. ....... 49

• Figure 6-3 (28067 Memory Map): Added figure. ............................................................................... 50

• Figure 6-8 (28062 Memory Map): Added "FAST and SpinTAC Libraries" block. Changed size of Boot ROM. ........ 55

• Section 6.6.2 (Crystal Oscillator Option): Added paragraph that begins "The on-chip crystal oscillator X1 and X2

pins are 1.8-V level signals ...". ................................................................................................... 67

• Section 6.9.6.1.2 (McBSP as SPI Master or Slave Timing): Replaced "For all SPI slave modes ..." paragraphs

with "For all SPI slave modes ..." table footnotes. ............................................................................ 115

• Table 6-44 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)): Added "For all

SPI slave modes ..." footnote. ................................................................................................... 115

• Table 6-46 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)): Added "For all

SPI slave modes ..." footnote. ................................................................................................... 116

• Table 6-48 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)): Added "For all

SPI slave modes ..." footnote. ................................................................................................... 117

• Table 6-50 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)): Added "For all

SPI slave modes ..." footnote. ................................................................................................... 118

• Table 6-65 (HRCAP Registers): Added reference to footnote for HCICLR and HCIFRC. .............................. 137

• Section 7 (Applications, Implementation, and Layout): Added section. .................................................... 156

• Section 8.1.1.1 (Getting Started): Updated links. ............................................................................. 159

• Figure 8-1 (Device Nomenclature): Updated list of devices. ................................................................ 160

• Section 8.2 (Documentation Support): Added the Calculating Useful Lifetimes of Embedded Processors

Application Report (SPRABX4) to list of application reports. ............................................................... 161

• Section 8.2.1 (Receiving Notification of Document Updates): Added section. ............................................ 162

, V

REFHI

(X1). ................................................. 19

REFLO

, and V

DDIO

. ............................. 11

DDIO

and V

DDA

should be

f(XCO)

........ 34

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SPRS698F – NOVEMBER 2010–REVISED MARCH 2016

3 Device Comparison

(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the

basic functionality of the module. These device-specific differences are listed in the TMS320x28xx, 28xxx DSP Peripheral Reference Guide (SPRU566) and in the peripheral reference

guides. (2) USB is present on TMS320F2806xU, TMS320F2806xM, and TMS320F2806xF devices. (3) The "Q" temperature option is not available on the TMS320F2806xU devices. (4) TMS320F2806xM devices are InstaSPIN-MOTION-enabled MCUs. TMS320F2806xF devices are InstaSPIN-FOC-enabled MCUs. For more information, see Section 8.2 for a list of

InstaSPIN Technical Reference Manuals.

Table 3-1. Device Comparison

FEATURE TYPE

(1)

28069

28069U

(2) (3)

28069M

(2) (4)

28069F

(2) (4)

(90 MHz)

28068

28068U

(2) (3)

28068M

(2) (4)

28068F

(2) (4)

(90 MHz)

28067

28067U

(2) (3)

(90 MHz)

28066

28066U

(2) (3)

(90 MHz)

28065

28065U

(2) (3)

(90 MHz)

28064

28064U

(2) (3)

(90 MHz)

28063

28063U

(2) (3)

(90 MHz)

28062

28062U

(2) (3)

28062F

(2) (4)

(90 MHz)

Package Type (PFP andPZP are PowerPAD HTQFPs. PN andPZ are LQFPs.)

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

Instruction cycle – 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns 11.11 ns Floating-Point Unit(FPU) Yes Yes Yes Yes Yes Yes Yes Yes VCU Yes Yes No No Yes Yes No No CLA 0 Yes No No No Yes No No No 6-Channel DMA 0 Yes Yes Yes Yes Yes Yes Yes Yes On-chip Flash(16-bit word) – 128K 128K 128K 128K 64K 64K 64K 64K On-chip SARAM(16-bit word) – 50K 50K 50K 34K 50K 50K 34K 26K Code securityfor on-chip Flash, SARAM,

and OTPblocks

– Yes Yes Yes Yes Yes Yes Yes Yes

Boot ROM(32K × 16) – Yes Yes Yes Yes Yes Yes Yes Yes One-time programmable(OTP) ROM

(16-bit word)

– 1K 1K 1K 1K 1K 1K 1K 1K

ePWM channels 1 16 14 16 14 16 14 16 14 16 14 16 14 16 14 16 14 High-resolution ePWMChannels 1 8 8 8 8 8 8 8 8 eCAP inputs 0 3 3 3 3 3 3 3 3 HRCAP 0 4 1 4 1 4 1 4 1 4 1 4 1 4 1 4 1 eQEP modules 0 2 1 2 1 2 1 2 1 2 1 2 1 2 1 2 1 Watchdog timer – Yes Yes Yes Yes Yes Yes Yes Yes

12-Bit ADC

MSPS

3.46 3.46 3.46 3.46 3.46 3.46 3.46 3.46 Conversion Time 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns 289 ns Channels 16 12 16 12 16 12 16 12 16 12 16 12 16 12 16 12 Temperature Sensor Yes Yes Yes Yes Yes Yes Yes Yes Dual Sample-and-Hold Yes Yes Yes Yes Yes Yes Yes Yes

32-Bit CPUtimers – 3 3 3 3 3 3 3 3 Comparators withIntegrated DACs 0 3 3 3 3 3 3 3 3

I2C

0 1 1 1 1 1 1 1 1

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SPRS698F – NOVEMBER 2010–REVISED MARCH 2016

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Table 3-1. Device Comparison (continued)

FEATURE TYPE

(1)

28069

28069U

(2) (3)

28069M

(2) (4)

28069F

(2) (4)

(90 MHz)

28068

28068U

(2) (3)

28068M

(2) (4)

28068F

(2) (4)

(90 MHz)

28067

28067U

(2) (3)

(90 MHz)

28066

28066U

(2) (3)

(90 MHz)

28065

28065U

(2) (3)

(90 MHz)

28064

28064U

(2) (3)

(90 MHz)

28063

28063U

(2) (3)

(90 MHz)

28062

28062U

(2) (3)

28062F

(2) (4)

(90 MHz)

Package Type (PFP andPZP are PowerPAD HTQFPs. PN andPZ are LQFPs.)

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

100-Pin

PZP

80-Pin

PFP

(5) "Q" refers to Q100 qualification for automotive applications.

McBSP 1 1 1 1 1 1 1 1 1 eCAN 0 1 1 1 1 1 1 1 1 SPI 1 2 2 2 2 2 2 2 2 SCI 0 2 2 2 2 2 2 2 2 USB 0 1

(2)

2-pin Oscillator 1 1 1 1 1 1 1 1 0-pin Oscillator 2 2 2 2 2 2 2 2

I/O pins (shared)

GPIO – 54 40 54 40 54 40 54 40 54 40 54 40 54 40 54 40 AIO – 6 6 6 6 6 6 6 6

External interrupts – 3 3 3 3 3 3 3 3 Supply voltage(nominal) – 3.3 V 3.3 V 3.3 V 3.3V 3.3 V 3.3V 3.3 V 3.3V

Temperature options

T: –40°Cto 105°C – PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN PZ PN S: –40°C to 125°C – PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP Q: –40°Cto 125°C

(3)(5)

– PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP PZP PFP

101112

GPIO23/EQEP1I/MFSXA/SCIRXDB

DDIO

GPIO20/EQEP1A/MDXA/COMP1OUT

GPIO21/EQEP1B/MDRA/COMP2OUT

GPIO4/EPWM3A

GPIO5/EPWM3B/SPISIMOA/ECAP1

XRS

TRST

DDIO

ADCINA6/COMP3A/AIO6

ADCINA5

ADCINA4/COMP2A/AIO4

ADCINA2/COMP1A/AIO2

ADCINA1

ADCINA0, V

REFHI

DDA

GPIO10/EPWM6A/ADCSOCBO

GPIO11/EPWM6B/SCIRXDB/ECAP1

GPIO36/TMS

GPIO35/TDI

GPIO37/TDO

GPIO34/COMP2OUT/COMP3OUT

GPIO38/XCLKIN/TCK

GPIO39

GPIO19/XCLKIN/ /SCIRXDB/ECAP1SPISTEA

VDDVSSV

DDIO

GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO

GPIO7/EPWM4B/SCIRXDA/ECAP2

GPIO16/SPISIMOA/TZ2

GPIO8/EPWM5A/ADCSOCAO

GPIO17/SPISOMIA/TZ3

GPIO18/SPICLKA/SCITXDB/XCLKOUT

GPIO26/ECAP3/SPICLKB/USB0DP

GPIO27/HRCAP2/SPISTEB/USB0DM

DDIO

GPIO3/EPWM2B/SPISOMIA/COMP2OUT

GPIO2/EPWM2A

GPIO1/EPWM1B/COMP1OUT

GPIO0/EPWM1A

GPIO15/ECAP2/SCIRXDB/SPISTEB

VREGENZ

DDIO

GPIO13/ /SPISOMIBTZ2

GPIO14/ /SCITXDB/SPICLKBTZ3

GPIO24/ECAP1/SPISIMOB

GPIO22/EQEP1S/MCLKXA/SCITXDB

GPIO32/SDAA/EPWMSYNCI/ADCSOCAO

GPIO33/SCLA/EPWMSYNCO/ADCSOCBO

GPIO29/SCITXDA/SCLA/TZ3

GPIO12/ /SCITXDA/SPISIMOBTZ1

TEST2

DD3VFL

GPIO9/EPWM5B/SCITXDB/ECAP3

GPIO28/SCIRXDA/SDAA/TZ2

GPIO30/CANRXA/EPWM7A

GPIO31/CANTXA/EPWM8A

GPIO25/ECAP2/SPISOMIB

DDIO

ADCINB6/COMP3B/AIO14

ADCINB5

ADCINB4/COMP2B/AIO12

ADCINB2/COMP1B/AIO10

ADCINB1

ADCINB0 V , V

REFLO SSA

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4 Terminal Configuration and Functions

4.1 Pin Diagrams

Figure 4-1 shows the pin assignments on the 80-pin PN and PFP packages. Figure 4-2 shows the pin

assignments on the 100-pin PZ and PZP packages.

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

A. Pin 19: V

exclusive to one another. Pin 21: V

REFHI

is always connected to V

REFLO

and ADCINA0 share the same pin on the 80-pin PN and PFP devices and their use is mutually

B. The PowerPAD is not connected to the ground on the die. To facilitate effective heat dissipation, the PowerPAD must

be connected to the ground plane of the PCB. It should not be left unconnected. For more details, see the PowerPAD™ Thermally Enhanced Package Application Report (SLMA002).

Figure 4-1. 80-Pin PN and PFP Packages (Top View)

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100

DDIO

REFHI

DDIO

DD3VFL

SSA

TEST2

ADCINB7

ADCINB3

VREGENZ

REFLO

ADCINB6/COMP3B/AIO14

ADCINB5

ADCINB4/COMP2B/AIO12

ADCINB2/COMP1B/AIO10

ADCINB1

ADCINB0

GPIO0/EPWM1A

GPIO1/EPWM1B/COMP1OUT

GPIO2/EPWM2A

GPIO56/SPICLKA/EQEP2I/HRCAP3

GPIO57/ /EQEP2S/HRCAP4SPISTEA

GPIO58/MCLKRA/SCITXDB/EPWM7A

GPIO40/EPWM7A/SCITXDB

GPIO41/EPWM7B/SCIRXDB

GPIO3/EPWM2B/SPISOMIA/COMP2OUT

GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO

GPIO44/MFSRA/SCIRXDB/EPWM7B

GPIO7/EPWM4B/SCIRXDA/ECAP2

GPIO8/EPWM5A/ADCSOCAO

GPIO9/EPWM5B/SCITXDB/ECAP3

GPIO10/EPWM6A/ADCSOCBO

GPIO11/EPWM6B/SCIRXDB/ECAP1

GPIO12/ /SCITXDA/SPISIMOBTZ1

GPIO13/ /SPISOMIBTZ2

GPIO14/ /SCITXDB/SPICLKBTZ3

GPIO15/ECAP2/SCIRXDB/SPISTEB

GPIO16/SPISIMOA/TZ2

GPIO17/SPISOMIA/TZ3

GPIO42/EPWM8A/ /COMP1OUTTZ1

GPIO43/EPWM8B/ /COMP2OUTTZ2

GPIO18/SPICLKA/SCITXDB/XCLKOUT

GPIO19/XCLKIN/ /SCIRXDB/ECAP1SPISTEA

GPIO22/EQEP1S/MCLKXA/SCITXDB

GPIO24/ECAP1/EQEP2A/SPISIMOB

GPIO25/ECAP2/EQEP2B/SPISOMIB

GPIO26/ECAP3/EQEP2I/SPICLKB/USB0DP

GPIO27/HRCAP2/EQEP2S/SPISTEB/USB0DM

GPIO28/SCIRXDA/SDAA/TZ2

GPIO29/SCITXDA/SCLA/TZ3

GPIO30/CANRXA/EQEP2I/EPWM7A

GPIO50/EQEP1A/MDXA/TZ1

GPIO51/EQEP1B/MDRA/TZ2

GPIO52/EQEP1S/MCLKXA/TZ3

GPIO53/EQEP1I/MFSXA

GPIO54/SPISIMOA/EQEP2A/HRCAP1

GPIO55/SPISOMIA/EQEP2B/HRCAP2

GPIO31/CANTXA/EQEP2S/EPWM8A

GPIO32/SDAA/EPWMSYNCI/ADCSOCAO

GPIO33/SCLA/EPWMSYNCO/ADCSOCBO

GPIO34/COMP2OUT/COMP3OUT

GPIO35/TDI

GPIO36/TMS

GPIO37/TDO

GPIO38/XCLKIN/TCK

GPIO39

GPIO23/EQEP1I/MFSXA/SCIRXDB

GPIO20/EQEP1A/MDXA/COMP1OUT

GPIO21/EQEP1B/MDRA/COMP2OUT

GPIO4/EPWM3A

GPIO5/EPWM3B/SPISIMOA/ECAP1

ADCINA7

ADCINA3

XRS

TRST

ADCINA6/COMP3A/AIO6

ADCINA5

ADCINA4/COMP2A/AIO4

ADCINA2/COMP1A/AIO2

ADCINA1

ADCINA0

DDA

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A. The PowerPAD is not connected to the ground on the die. To facilitate effective heat dissipation, the PowerPAD must

be connected to the ground plane of the PCB. It should not be left unconnected. For more details, see the PowerPAD™ Thermally Enhanced Package Application Report (SLMA002).

Figure 4-2. 100-Pin PZ and PZP Packages (Top View)

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4.2 Signal Descriptions

Table 4-1 describes the signals. With the exception of the JTAG pins, the GPIO function is the default at

reset, unless otherwise mentioned. The peripheral signals that are listed under them are alternate functions. Some peripheral functions may not be available in all devices. See Table 3-1 for details. Inputs are not 5-V tolerant. All GPIO pins are I/O/Z and have an internal pullup (PU), which can be selectively enabled or disabled on a per-pin basis. This feature only applies to the GPIO pins. The pullups on the PWM pins are not enabled at reset. The pullups on other GPIO pins are enabled upon reset. The AIO pins do not have an internal pullup.

When the on-chip voltage regulator (VREG) is used, the GPIO19, GPIO26–27, and GPIO34–38 pins could glitch during power up. If this is unacceptable in an application, 1.8 V could be supplied externally. There is no power-sequencing requirement when using an external 1.8-V supply. However, if the 3.3-V transistors in the level-shifting output buffers of the I/O pins are powered before the 1.9-V transistors, it is possible for the output buffers to turn on, causing a glitch to occur on the pin during power up. To avoid this behavior, power the VDDpins before or simultaneously with the V reached 0.7 V before the V

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NOTE

pins, ensuring that the VDDpins have

pins reach 0.7 V.

DDIO

Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

TRST 12 10 I

TCK See GPIO38 I See GPIO38. JTAG test clock with internal pullup. (↑) TMS See GPIO36 I

TDI See GPIO35 I

TDO See GPIO37 O/Z

DD3VFL

TEST2 45 36 I/O Test Pin. Reserved for TI. Must be left unconnected.

PZP

46 37 3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.

PFP

I/O/Z DESCRIPTION

JTAG

JTAG test reset with internal pulldown (PD). TRST, when driven high, gives the scan system control of the operations of the device. If this signal is not connected or driven low, the device operates in its functional mode, and the test reset signals are ignored. NOTE: TRST is an active-high test pin and must be maintained low at all times during normal device operation. An external pulldown resistor is required on this pin. The value of this resistor should be based on drive strength of the debugger pods applicable to the design. A 2.2-kΩ resistor generally offers adequate protection. Because this is application-specific, TI recommends validating each target board for proper operation of the debugger and the application. (↓)

See GPIO36. JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into the TAP controller on the rising edge of TCK. (↑)

See GPIO35. JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK. (↑)

See GPIO37. JTAG scan out, test data output (TDO). The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. (8-mA drive)

FLASH

(1)

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Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

XCLKOUT See GPIO18 O/Z

XCLKIN

X1 60 48 I

X2 59 47 O

XRS 11 9 I/OD

ADCINA7 16 – I ADC Group A, Channel 7 input ADCINA6 COMP3A I Comparator Input 3A AIO6 I/O Digital AIO 6 ADCINA5 18 15 I ADC Group A, Channel 5 input ADCINA4 COMP2A I Comparator Input 2A AIO4 I/O Digital AIO 4 ADCINA3 20 – I ADC Group A, Channel 3 input ADCINA2 COMP1A I Comparator Input 1A AIO2 I/O Digital AIO 2 ADCINA1 22 18 I ADC Group A, Channel 1 input

ADCINA0 23 19 I

PZP

See GPIO19 and

17 14

19 16

21 17

PFP

GPIO38

I/O/Z DESCRIPTION

CLOCK

See GPIO18. Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3. The mux control for GPIO18 must also be set to XCLKOUT for this signal to propogate to the pin.

See GPIO19 and GPIO38. External oscillator input. Pin source for the clock is controlled by the XCLKINSEL bit in the XCLK register, GPIO38 is the default selection. This pin feeds a clock from an external 3.3-V oscillator. In this case, the X1 pin, if available, must be tied to GND and the on-chip crystal oscillator must be disabled through bit 14 in the CLKCTL register. If a crystal or resonator is used, the XCLKIN

path must be disabled by bit 13 in the CLKCTL register. NOTE: Designs that use the GPIO38/XCLKIN/TCK pin to supply an external clock for normal device operation may need to incorporate some hooks to disable this path during debug using the JTAG connector. This is to prevent contention with the TCK signal, which is active during JTAG debug sessions. The zero-pin internal oscillators may be used during this time to clock the device.

On-chip 1.8-V crystal-oscillator input. To use this oscillator, a quartz crystal or a ceramic resonator must be connected across X1 and X2. In this case, the XCLKIN path must be disabled by bit 13 in the CLKCTL register. If this pin is not used, it must be tied to GND.

On-chip crystal-oscillator output. A quartz crystal or a ceramic resonator must be connected across X1 and X2. If X2 is not used, it must be left unconnected.

RESET

Device Reset (in) and Watchdog Reset (out). Piccolo devices have a built-in power-on reset (POR) and brown-out reset (BOR) circuitry. During a power-on or brown-out condition, this pin is driven low by the device. An external circuit may also drive this pin to assert a device reset. This pin is also driven low by the MCU when a watchdog reset occurs. During watchdog reset, the XRS pin is driven low for the watchdog reset duration of 512 OSCCLK cycles. A resistor between 2.2 kΩ and 10 kΩ should be placed between XRS and V noise filtering, it should be 100 nF or smaller. These values will allow the watchdog to properly drive the XRS pin to VOLwithin 512 OSCCLK cycles when the watchdog reset is asserted. Regardless of the source, a device reset causes the device to terminate execution. The program counter points to the address contained at the location 0x3F FFC0. When reset is deactivated, execution begins at the location designated by the program counter. The output buffer of this pin is an open-drain with an internal pullup. (↑)

ADC, COMPARATOR, ANALOG I/O

I ADC Group A, Channel 6 input

I ADC Group A, Channel 4 input

I ADC Group A, Channel 2 input

ADC Group A, Channel 0 input. NOTE: V and their use is mutually exclusive to one another.

and ADCINA0 share the same pin on the 80-pin PN and PFP devices

REFHI

(1)

DDIO

(continued)

. If a capacitor is placed between XRS and VSSfor

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Table 4-1. Signal Descriptions

(1)

PIN NO.

PIN NAME

PZP

PFP

I/O/Z DESCRIPTION

ADC External Reference High – only used when in ADC external reference mode. See

REFHI

24 19

Section 6.9.2.1.

NOTE: V and their use is mutually exclusive to one another.

and ADCINA0 share the same pin on the 80-pin PN and PFP devices

REFHI

ADCINB7 35 – I ADC Group B, Channel 7 input ADCINB6 COMP3B I Comparator Input 3B

34 27

I ADC Group B, Channel 6 input

AIO14 I/O Digital AIO 14 ADCINB5 33 26 I ADC Group B, Channel 5 input ADCINB4 COMP2B I Comparator Input 2B

32 25

I ADC Group B, Channel 4 input

AIO12 I/O Digital AIO12 ADCINB3 31 – I ADC Group B, Channel 3 input ADCINB2 COMP1B I Comparator Input 1B

30 24

I ADC Group B, Channel 2 input

AIO10 I/O Digital AIO 10 ADCINB1 29 23 I ADC Group B, Channel 1 input ADCINB0 28 22 I ADC Group B, Channel 0 input

REFLO

27 21

ADC External Reference Low. NOTE: V

is always connected to V

REFLO

CPU AND I/O POWER

DDA

SSA

25 20 Analog Power Pin. Tie with a 2.2-μF capacitor (typical) close to the pin. 26 21

Analog Ground Pin. NOTE: V

is always connected to V

REFLO

3 2

14 12

37 29 63 51

CPU and Logic Digital Power Pins. When using internal VREG, place one 1.2-µF capacitor between each VDDpin and ground. Higher value capacitors may be used.

81 65 91 72

5 4

13 11

DDIO

38 30 61 49

Digital I/O and Flash Power Pin. Single supply source when VREG is enabled. Place a

2.2-uF decoupling capacitor on each pin. The exact value of the total decoupling capacitance should be determined by the system voltage regulation solution.

79 63 93 74

4 3 15 13 36 28

47 38

Digital Ground Pins 62 50 80 64 92 73

(continued)

on the 80-pin PN and PFP devices.

SSA

on the 80-pin PN and PFP devices.

SSA

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Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

VREGENZ 90 71 I Internal VREG Enable/Disable. Pull low to enable VREG, pull high to disable VREG.

GPIO0

EPWM1A O Enhanced PWM1 Output A and HRPWM channel

GPIO1

EPWM1B O Enhanced PWM1 Output B COMP1OUT O Direct output of Comparator 1

GPIO2

EPWM2A O Enhanced PWM2 Output A and HRPWM channel

GPIO3

EPWM2B O Enhanced PWM2 Output B SPISOMIA I/O SPI-A slave out, master in COMP2OUT O Direct output of Comparator 2

GPIO4

EPWM3A O Enhanced PWM3 output A and HRPWM channel

GPIO5

EPWM3B O Enhanced PWM3 output B SPISIMOA I/O SPI-A slave in, master out ECAP1 I/O Enhanced Capture input/output 1

GPIO6

EPWM4A O Enhanced PWM4 output A and HRPWM channel EPWMSYNCI I External ePWM sync pulse input EPWMSYNCO O External ePWM sync pulse output

GPIO7

EPWM4B O Enhanced PWM4 output B SCIRXDA I SCI-A receive data ECAP2 I/O Enhanced Capture input/output 2

GPIO8

EPWM5A O Enhanced PWM5 output A and HRPWM channel Reserved – Reserved ADCSOCAO O ADC start-of-conversion A

GPIO9

EPWM5B O Enhanced PWM5 output B SCITXDB O SCI-B transmit data ECAP3 I/O Enhanced Capture input/output 3

GPIO10

EPWM6A O Enhanced PWM6 output A and HRPWM channel Reserved – Reserved ADCSOCBO O ADC start-of-conversion B

GPIO11

EPWM6B O Enhanced PWM6 output B SCIRXDB I SCI-B receive data ECAP1 I/O Enhanced Capture input/output 1

PZP

87 69

86 68

84 67

83 66

9 7

10 8

58 46

57 45

54 43

49 39

74 60

73 59

PFP

I/O/Z DESCRIPTION

VOLTAGE REGULATOR CONTROL SIGNAL

GPIO AND PERIPHERAL SIGNALS

I/O/Z General-purpose input/output 0

I/O/Z General-purpose input/output 1

I/O/Z General-purpose input/output 2

I/O/Z General-purpose input/output 3

I/O/Z General-purpose input/output 4

I/O/Z General-purpose input/output 5

I/O/Z General-purpose input/output 6

I/O/Z General-purpose input/output 7

I/O/Z General-purpose input/output 8

I/O/Z General-purpose input/output 9

I/O/Z General-purpose input/output 10

I/O/Z General-purpose input/output 11

(1)

(continued)

(2)

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Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

GPIO12

TZ1 I Trip Zone input 1 SCITXDA O SCI-A transmit data SPISIMOB I/O SPI-B slave in, master out

GPIO13

TZ2 I Trip Zone input 2 Reserved – Reserved SPISOMIB I/O SPI-B slave out, master in

GPIO14

TZ3 I Trip zone input 3 SCITXDB O SCI-B transmit data SPICLKB I/O SPI-B clock input/output

GPIO15

ECAP2 I/O Enhanced Capture input/output 2 SCIRXDB I SCI-B receive data SPISTEB I/O SPI-B slave transmit enable input/output

GPIO16

SPISIMOA I/O SPI-A slave in, master out Reserved – Reserved TZ2 I Trip Zone input 2

GPIO17

SPISOMIA I/O SPI-A slave out, master in Reserved – Reserved TZ3 I Trip zone input 3

GPIO18

SPICLKA I/O SPI-A clock input/output SCITXDB O SCI-B transmit data XCLKOUT

GPIO19

XCLKIN

SPISTEA I/O SPI-A slave transmit enable input/output SCIRXDB I SCI-B receive data ECAP1 I/O Enhanced Capture input/output 1

GPIO20

EQEP1A I Enhanced QEP1 input A MDXA O McBSP transmit serial data COMP1OUT O Direct output of Comparator 1

GPIO21

EQEP1B I Enhanced QEP1 input B MDRA I McBSP receive serial data COMP2OUT O Direct output of Comparator 2

PZP

44 35

95 75

96 76

88 70

55 44

52 42

51 41

64 52

6 5

7 6

PFP

I/O/Z DESCRIPTION

I/O/Z General-purpose input/output 12

I/O/Z General-purpose input/output 13

I/O/Z General-purpose input/output 14

I/O/Z General-purpose input/output 15

I/O/Z General-purpose input/output 16

I/O/Z General-purpose input/output 17

I/O/Z General-purpose input/output 18

Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-

half the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by

O/Z

bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT = SYSCLKOUT/4.

The XCLKOUT signal can be turned off by setting XCLKOUTDIV to 3. The mux control

for GPIO18 must also be set to XCLKOUT for this signal to propogate to the pin.

I/O/Z General-purpose input/output 19

External Oscillator Input. The path from this pin to the clock block is not gated by the

mux function of this pin. Care must be taken not to enable this path for clocking if it is

being used for the other peripheral functions.

I/O/Z General-purpose input/output 20

I/O/Z General-purpose input/output 21

(1)

(continued)

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Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

GPIO22

EQEP1S I/O Enhanced QEP1 strobe MCLKXA I/O McBSP transmit clock SCITXDB O SCI-B transmit data

GPIO23

EQEP1I I/O Enhanced QEP1 index MFSXA I/O McBSP transmit frame synch SCIRXDB I SCI-B receive data

GPIO24

ECAP1 I/O Enhanced Capture input/output 1 EQEP2A

SPISIMOB I/O SPI-B slave in, master out

GPIO25

ECAP2 I/O Enhanced Capture input/output 2 EQEP2B I SPISOMIB I/O SPI-B slave out, master in

GPIO26

ECAP3 I/O Enhanced Capture input/output 3 EQEP2I I/O SPICLKB I/O SPI-B clock input/output USB0DP

GPIO27

HRCAP2 I High-Resolution Input Capture 2 EQEP2S I/O SPISTEB I/O SPI-B slave transmit enable input/output USB0DM

GPIO28

SCIRXDA I SCI-A receive data SDAA I/OD I2C data open-drain bidirectional port TZ2 I Trip zone input 2

GPIO29

SCITXDA O SCI-A transmit data SCLA I/OD I2C clock open-drain bidirectional port TZ3 I Trip zone input 3

GPIO30

CANRXA I CAN receive EQEP2I I/O EPWM7A O Enhanced PWM7 Output A and HRPWM channel

(3)

PZP

98 78

2 1

97 77

39 31

78 62

77 61

50 40

43 34

41 33

PFP

I/O/Z DESCRIPTION

I/O/Z General-purpose input/output 22

I/O/Z General-purpose input/output 23

I/O/Z General-purpose input/output 24

Enhanced QEP2 input A.

NOTE: eQEP2 is only available in the PZ and PZP packages.

I/O/Z General-purpose input/output 25

Enhanced QEP2 input B.

NOTE: eQEP2 is only available in the PZ and PZP packages.

I/O/Z General-purpose input/output 26

Enhanced QEP2 index.

NOTE: eQEP2 is only available in the PZ and PZP packages.

Positive Differential half of USB signal. To enable USB functionality on this pin, set the

I/O

USBIOEN bit in the GPACTRL2 register.

I/O/Z General-purpose input/output 27

Enhanced QEP2 strobe.

NOTE: eQEP2 is only available in the PZ and PZP packages.

Negative Differential half of USB signal. To enable USB functionality on this pin, set the

I/O

USBIOEN bit in the GPACTRL2 register.

I/O/Z General-purpose input/output 28

I/O/Z General-purpose input/output 29

I/O/Z General-purpose input/output 30

Enhanced QEP2 index.

NOTE: eQEP2 is only available in the PZ and PZP packages.

(1)

(continued)

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Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

GPIO31

CANTXA O CAN transmit EQEP2S I/O EPWM8A O Enhanced PWM8 Output A and HRPWM channel

GPIO32

SDAA I/OD I2C data open-drain bidirectional port EPWMSYNCI I Enhanced PWM external sync pulse input ADCSOCAO O ADC start-of-conversion A

GPIO33

SCLA I/OD I2C clock open-drain bidirectional port EPWMSYNCO O Enhanced PWM external synch pulse output ADCSOCBO O ADC start-of-conversion B

GPIO34

COMP2OUT O Direct output of Comparator 2 COMP3OUT O Direct output of Comparator 3 GPIO35 TDI

GPIO36 TMS

GPIO37 TDO

GPIO38 XCLKIN

TCK I JTAG test clock with internal pullup GPIO39 66 53 I/O/Z General-purpose input/output 39

GPIO40

EPWM7A O Enhanced PWM7 output A and HRPWM channel SCITXDB O SCI-B transmit data

GPIO41

EPWM7B O Enhanced PWM7 output B SCIRXDB I SCI-B receive data

GPIO42

EPWM8A O Enhanced PWM8 output A and HRPWM channel TZ1 I Trip zone input 1 COMP1OUT O Direct output of Comparator 1

GPIO43

EPWM8B O Enhanced PWM8 output B TZ2 I Trip zone input 2 COMP2OUT O Direct output of Comparator 2

PZP

40 32

99 79

100 80

68 55

71 57

72 58

70 56

67 54

82 –

76 –

1 –

8 –

PFP

I/O/Z DESCRIPTION

I/O/Z General-purpose input/output 31

Enhanced QEP2 strobe.

NOTE: eQEP2 is only available in the PZ and PZP packages.

I/O/Z General-purpose input/output 32

I/O/Z General-purpose input/output 33

I/O/Z General-purpose input/output 34

I/O/Z General-purpose input/output 35

JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register

(instruction or data) on a rising edge of TCK.

I/O/Z General-purpose input/output 36

JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked

into the TAP controller on the rising edge of TCK.

I/O/Z General-purpose input/output 37

JTAG scan out, test data output (TDO). The contents of the selected register

O/Z

(instruction or data) are shifted out of TDO on the falling edge of TCK (8 mA drive).

I/O/Z General-purpose input/output 38

External Oscillator Input. The path from this pin to the clock block is not gated by the

mux function of this pin. Care must be taken to not enable this path for clocking if it is

being used for the other functions.

I/O/Z General-purpose input/output 40

I/O/Z General-purpose input/output 41

I/O/Z General-purpose input/output 42

I/O/Z General-purpose input/output 43

(1)

(continued)

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Table 4-1. Signal Descriptions

PIN NO.

PIN NAME

GPIO44

MFSRA I/O McBSP receive frame synch SCIRXDB I SCI-B receive data EPWM7B O Enhanced PWM7 output B

GPIO50

EQEP1A I Enhanced QEP1 input A MDXA O McBSP transmit serial data TZ1 I Trip zone input 1

GPIO51

EQEP1B I Enhanced QEP1 input B MDRA I McBSP receive serial data TZ2 I Trip zone input 2

GPIO52

EQEP1S I/O Enhanced QEP1 strobe MCLKXA I/O McBSP transmit clock TZ3 I Trip zone input 3

GPIO53

EQEP1I I/O Enhanced QEP1 index MFSXA I/O McBSP transmit frame synch

GPIO54

SPISIMOA I/O SPI-A slave in, master out EQEP2A I Enhanced QEP2 input A HRCAP1 I High-Resolution Input Capture 1

GPIO55

SPISOMIA I/O SPI-A slave out, master in EQEP2B I Enhanced QEP2 input B HRCAP2 I High-Resolution Input Capture 2

GPIO56

SPICLKA I/O SPI-A clock input/output EQEP2I I/O Enhanced QEP2 index HRCAP3 I High-Resolution Input Capture 3

GPIO57

SPISTEA I/O SPI-A slave transmit enable input/output EQEP2S I/O Enhanced QEP2 strobe HRCAP4 I High-Resolution Input Capture 4

GPIO58

MCLKRA I/O McBSP receive clock SCITXDB O SCI-B transmit data EPWM7A O Enhanced PWM7 output A and HRPWM channel (1) I = Input, O = Output, Z = High Impedance, OD = Open Drain, ↑ = Pullup, ↓ = Pulldown (2) The GPIO function (shown in bold italics) is the default at reset. The peripheral signals that are listed under them are alternate functions.

For JTAG pins that have the GPIO functionality multiplexed, the input path to the GPIO block is always valid. The output path from the GPIO block and the path to the JTAG block from a pin is enabled or disabled based on the condition of the TRST signal. See the Systems Control and Interrupts chapter of the TMS320x2806x Piccolo Technical Reference Manual (SPRUH18).

(3) Depending on your USB application, additional pins may be required to maintain compliance with the USB 2.0 Specification. For more

information, see the Universal Serial Bus (USB) Controller chapter of the TMS320x2806x Piccolo Technical Reference Manual (SPRUH18).

PZP

56 –

42 –

48 –

53 –

65 –

69 –

75 –

85 –

89 –

94 –

PFP

I/O/Z DESCRIPTION

I/O/Z General-purpose input/output 44

I/O/Z General-purpose input/output 50

I/O/Z General-purpose input/output 51

I/O/Z General-purpose input/output 52

I/O/Z General-purpose input/output 53

I/O/Z General-purpose input/output 54

I/O/Z General-purpose input/output 55

I/O/Z General-purpose input/output 56

I/O/Z General-purpose input/output 57

I/O/Z General-purpose input/output 58

(1)

(continued)

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5 Specifications

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

5.1 Absolute Maximum Ratings

(1)(2)

over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

(I/O and Flash) with respect to V

Supply voltage

Analog voltage V

Input voltage

Output voltage V

DDIO

VDDwith respect to V

with respect to V

DDA

VIN(3.3 V) –0.3 4.6 VIN(X1) –0.3 2.5

Input clamp current IIK(VIN< 0 or VIN> V Output clamp current IOK(VO< 0 or VO> V Junction temperature Storage temperature

(4)

stg

SSA

(3)

)

DDIO

) –20 20 mA

DDIO

–0.3 4.6 –0.3 2.5 –0.3 4.6 V

–0.3 4.6 V

–20 20 mA

–40 150 °C –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.4 is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to VSS, unless otherwise noted. (3) Continuous clamp current per pin is ±2 mA. (4) Long-term high-temperature storage or extended use at maximum temperature conditions may result in a reduction of overall device life.

For additional information, see the IC Package Thermal Metrics Application Report (SPRA953).

5.2 ESD Ratings for TMS320F2806xU

VALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(ESD)

Electrostatic discharge (ESD)

Charged-device model (CDM), per JEDEC specification JESD22-

(2)

C101

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(1)

±2000

±500

5.3 ESD Ratings for TMS320F2806x, TMS320F2806xM, and TMS320F2806xF

TMS320F2806x, TMS320F2806xM, and TMS320F2806xF in 100-pin PZ and PZP packages

(ESD)

TMS320F2806x, TMS320F2806xM, and TMS320F2806xF in 80-pin PN and PFP packages

(ESD)

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Electrostatic discharge

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Human body model (HBM), per AEC Q100-002

(1)

Charged device model (CDM), per AEC Q100-011

All pins ±2000

All pins ±500 Corner pins on 100-pin PZ and

PZP: 1, 25, 26, 50, 51, 75, 76, 100

Human body model (HBM), per AEC Q100-002

(1)

Charged device model (CDM), per AEC Q100-011

All pins ±2000

All pins ±500 Corner pins on 80-pin PN and

PFP: 1, 20, 21, 40, 41, 60, 61, 80

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VALUE UNIT

±750

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5.4 Recommended Operating Conditions

MIN NOM MAX UNIT

Device supply voltage, I/O, V

DDIO

Device supply voltage CPU, VDD(When internal VREG is disabled and 1.8 V is supplied externally)

Supply ground, V Analog supply voltage, V Analog ground, V

DDA

SSA

Device clock frequency (system clock) 2 90 MHz High-level input voltage, VIH(3.3 V) 2 V Low-level input voltage, VIL(3.3 V) VSS– 0.3 0.8 V High-level output source current, VOH= V

Low-level output sink current, VOL= V

Junction temperature, T

OL(MAX)

OH(MIN)

, I

All GPIO/AIO pins –4 Group 2

(1)

All GPIO/AIO pins 4 Group 2

(1)

T version –40 105 S version –40 125

Ambient temperature, T

Q version (Q100 qualification)

(2)

(1) Group 2 pins are as follows: GPIO16, GPIO17, GPIO18, GPIO19, GPIO28, GPIO29, GPIO36, GPIO37. (2) The "Q" temperature option is not available on the 2806xU devices.

2.97 3.3 3.63 V

1.71 1.8 1.995

0 V

2.97 3.3 3.63 V 0 V

+ 0.3 V

DDIO

–8

–40 125

°C

5.5 Electrical Characteristics

(1)

over recommended operating conditions (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

High-level output voltage

Low-level output voltage IOL= IOLMAX 0.4 V

Pin with pullup

Input current (low level)

enabled Pin with pulldown

enabled Pin with pullup

Input current (high level)

enabled Pin with pulldown

enabled

Output current, pullup or pulldown disabled

Input capacitance 2 pF V

BOR trip point Falling V

DDIO

BOR hysteresis 35 mV

DDIO

Supervisor reset release delay time

VREG VDDoutput Internal VREG on 1.9 V

(1) When the on-chip VREG is used, its output is monitored by the POR/BOR circuit, which will reset the device should the core voltage

(VDD) go out of range.

IOH= IOHMAX 2.4 IOH= 50 μA V

= 3.3 V, VIN= 0 V

DDIO

= 3.3 V, VIN= 0 V ±2

DDIO

= 3.3 V, VIN= V

DDIO

= 3.3 V, VIN= V

DDIO

VO= V

DDIO

or 0 V ±2 μA

DDIO

All GPIO –80 –140 –205 XRS pin –230 –300 –375

Time after BOR/POR/OVR event is removed to XRS release

– 0.2

DDIO

28 50 80

2.50 2.78 2.96 V

400 800 μs

±2

μA

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5.6 Power Consumption Summary

Table 5-1. TMS320F2806x Current Consumption at 90-MHz SYSCLKOUT

VREG ENABLED VREG DISABLED

MODE TEST CONDITIONS

The following peripheral clocks are enabled:

• ePWM1, ePWM2, ePWM3, ePWM4, ePWM5, ePWM6, ePWM7, ePWM8

• eCAP1, eCAP2, eCAP3

• eQEP1, eQEP2

• eCAN

• CLA

• HRPWM

• SCI-A, SCI-B

Operational (Flash)

IDLE

STANDBY

HALT

(1) I (2) In order to realize the I

• SPI-A, SPI-B

• ADC

• I2C

• COMP1, COMP2, COMP3

• CPU-TIMER0, CPU-TIMER1, CPU-TIMER2

• McBSP

• USB

All PWM pins are toggled at 90 kHz. All I/O pins are left unconnected. Code is running out of flash with 3 wait-states. XCLKOUT is turned off.

Flash is powered down. XCLKOUT is turned off. All peripheral clocks are turned off.

Flash is powered down. Peripheral clocks are off.

Flash is powered down. Peripheral clocks are off. Input clock is disabled.

current is dependent on the electrical loading on the I/O pins.

DDIO

(4) (5)

writing to the PCLKCR0 register.

185 mA

(7)

currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by

DDA

(1)

DDIO

(3)

TYP

22 mA 27 mA 15 µA 25 µA 5 µA 10 µA 21 mA 26 mA 120 µA 400 µA 15 µA 25 µA 5 µA 10 µA

9 mA 11 mA 15 µA 25 µA 5 µA 10 µA 8 mA 10 mA 120 µA 400 µA 15 µA 25 µA 5 µA 10 µA

75 µA 15 µA 25 µA 5 µA 10 µA 25 µA

MAX TYP

(6)

245 mA

(6)

(3) The TYP numbers are applicable over room temperature and nominal voltage. (4) The following is done in a loop:

• Data is continuously transmitted out of SPI-A, SPI-B, SCI-A, eCAN-A, McBSP-A, and I2C ports.

• The hardware multiplier is exercised.

• Watchdog is reset.

• ADC is performing continuous conversion.

• COMP1 and COMP2 are continuously switching voltages.

• GPIO17 is toggled. (5) CLA is continuously performing polynomial calculations. (6) For F2806x devices that do not have CLA, subtract the IDDcurrent number for CLA (see Table 5-2) from the IDD(VREG disabled)/I

(VREG enabled) current numbers shown in Table 5-1 for operational mode. (7) If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the on-chip crystal oscillator. (8) To realize the IDDnumber shown for HALT mode, the following must be done:

• PLL2 must be shut down by clearing bit 2 of the PLLCTL register.

• A value of 0x00FF must be written to address 0x6822.

(2)

DDA (3)

MAX TYP

16 mA 22 mA 35 mA 40 mA 165 mA

DD3VFL

(3)

MAX TYP

(3)

MAX TYP

(6)

(8)

220 mA

(6)

(1)

DDIO

(3)

MAX TYP

15 mA 20 mA 16 mA 22 mA 35 mA 40 mA

40 µA 15 µA 25 µA 5 µA 10 µA

DDA (3)

(2)

MAX TYP

DD3VFL

(3)

MAX

DDIO

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NOTE

The peripheral - I/O multiplexing implemented in the device prevents all available peripherals from being used at the same time. This is because more than one peripheral function may share an I/O pin. It is, however, possible to turn on the clocks to all the peripherals at the same time, although such a configuration is not useful. If this is done, the current drawn by the device will be more than the numbers specified in the current consumption tables.

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5.6.1 Reducing Current Consumption

The 2806x devices incorporate a method to reduce the device current consumption. Since each peripheral unit has an individual clock-enable bit, significant reduction in current consumption can be achieved by turning off the clock to any peripheral module that is not used in a given application. Furthermore, any one of the three low-power modes could be taken advantage of to reduce the current consumption even further. Table 5-2 indicates the typical reduction in current consumption achieved by turning off the clocks.

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Table 5-2. Typical Current Consumption by Various

Peripherals (at 90 MHz)

PERIPHERAL

MODULE

COMP/DAC 1

CPU-TIMER 1

Internal zero-pin oscillator 0.5

(1) All peripheral clocks (except CPU Timer clock) are disabled upon

reset. Writing to or reading from peripheral registers is possible only after the peripheral clocks are turned on.

(2) For peripherals with multiple instances, the current quoted is per

module. For example, the 2 mA value quoted for ePWM is for one ePWM module.

(3) This number represents the current drawn by the digital portion of

the ADC module. Turning off the clock to the ADC module results in the elimination of the current drawn by the analog portion of the ADC (I

) as well.

DDA

(2)

ADC 2

I2C 3

ePWM 2

eCAP 2 eQEP 2

SCI 2

SPI 2

HRPWM 3

HRCAP 3

USB 12

CAN 2.5

CLA 20

McBSP 6

(1)

IDDCURRENT

REDUCTION (mA)

(3)

current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off.

DDIO

The baseline IDDcurrent (current when the core is executing a dummy loop with no peripherals enabled) is 40 mA, typical. To arrive at the IDDcurrent for a given application, the current-drawn by the peripherals (enabled by that application) must be added to the baseline IDDcurrent.

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100

200

300

400

500

600

700

800

900

10 20 30 40 50 60 70 80 90

Operational Power (mW)

SYSCLKOUT (MHz)

Operational Power vs Frequency (Internal VREG)

100

150

200

250

10 20 30 40 50 60 70 80 90

Operational Current (mA)

SYSCLKOUT (MHz)

Operational Current (Flash) vs Frequency (Internal VREG)

IDDIO

IDDA

IDD3VFL

Total

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Following are other methods to reduce power consumption further:

• The flash module may be powered down if code is run off SARAM. This results in a current reduction of 18 mA (typical) in the VDDrail and 13 mA (typical) in the V

• Savings in I

may be realized by disabling the pullups on pins that assume an output function.

DDIO

5.6.2 Current Consumption Graphs (VREG Enabled)

DDIO

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rail.

Figure 5-1. Typical Operational Current Versus Frequency

Figure 5-2. Typical Operational Power Versus Frequency

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

5.7 Thermal Resistance Characteristics

5.7.1 PFP PowerPAD Package

(1)

°C/W

RΘ RΘ

JC JB

Junction-to-case thermal resistance 9.4 0 Junction-to-board thermal resistance 4.6 0

25.8 0

RΘ

(High k PCB)

Junction-to-free air thermal resistance

16.3 150

15.2 250

13.6 500

0.3 0

Psi

Junction-to-package top

0.4 150

0.4 250

0.5 500

4.6 0

Psi

Junction-to-board

4.4 150

4.3 250

4.3 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

AIR FLOW (lfm)

(2)

5.7.2 PZP PowerPAD Package

(1)

°C/W

RΘ RΘ

JC JB

Junction-to-case thermal resistance 9.4 0 Junction-to-board thermal resistance 4.4 0

24.4 0

RΘ

(High k PCB)

Junction-to-free air thermal resistance

15.1 150

13.9 250

12.4 500

0.3 0

Psi

Junction-to-package top

0.4 150

0.4 250

0.5 500

4.5 0

Psi

Junction-to-board

4.2 150

4.2 250

4.2 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

AIR FLOW (lfm)

(2)

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5.7.3 PN Package

(1)

°C/W

RΘ RΘ

JC JB

Junction-to-case thermal resistance 7.9 0 Junction-to-board thermal resistance 15.6 0

41.1 0

RΘ

(High k PCB)

Junction-to-free air thermal resistance

31.2 150

29.7 250

27.5 500

0.4 0

Psi

Junction-to-package top

0.6 150

0.7 250

0.9 500

15.3 0

Psi

Junction-to-board

14.6 150

14.4 250

14.1 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

AIR FLOW (lfm)

(2)

5.7.4 PZ Package

(1)

°C/W

RΘ RΘ

JC JB

Junction-to-case thermal resistance 7.2 0 Junction-to-board thermal resistance 19.6 0

42.2 0

RΘ

(High k PCB)

Junction-to-free air thermal resistance

32.4 150

30.9 250

28.7 500

0.4 0

Psi

Junction-to-package top

0.6 150

0.7 250

0.9 500

19.1 0

Psi

Junction-to-board

18.2 150

17.9 250

14.1 500

(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2) lfm = linear feet per minute

AIR FLOW (lfm)

(2)

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TRST

TMS

TDI

TDO

TCK

DDIO

MCU

EMU0

EMU1

TRST

TMS

TDI

TDO

TCK

TCK_RET

6 inches or less

GND

JTAG Header

DDIO

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5.8 Thermal Design Considerations

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Based on the end application design and operational profile, the IDDand I Systems that exceed the recommended maximum power dissipation in the end product may require additional thermal enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care should be taken to keep TJwithin the specified limits. T measured to estimate the operating junction temperature TJ. T

is normally measured at the center of

case

the package top-side surface. The thermal application report IC Package Thermal Metrics (SPRA953) helps to understand the thermal metrics and definitions.

5.9 Emulator Connection Without Signal Buffering for the MCU

Figure 5-3 shows the connection between the MCU and JTAG header for a single-processor configuration.

If the distance between the JTAG header and the MCU is greater than 6 inches, the emulation signals must be buffered. If the distance is less than 6 inches, buffering is typically not needed. Figure 5-3 shows the simpler, no-buffering situation. For the pullup and pulldown resistor values, see Section 4.2.

currents could vary.

DDIO

case

should be

A. See Figure 6-54 for JTAG/GPIO multiplexing.

Figure 5-3. Emulator Connection Without Signal Buffering for the MCU

The 2806x devices do not have EMU0/EMU1 pins. For designs that have a JTAG Header onboard, the EMU0/EMU1 pins on the header must be tied to V (typical) resistor.

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through a 4.7-kΩ

DDIO

Transmission Line

4.0 pF 1.85 pF

Z0 = 50

(A)

Tester Pin Electronics

Data Sheet Timing Reference Point

Output Under Test

3.5 nH

Device Pin

(B)

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5.10 Parameter Information

5.10.1 Timing Parameter Symbology

Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows:

LOWERCASE SUBSCRIPTS AND THEIR MEANINGS: LETTERS AND SYMBOLS AND THEIR MEANINGS:

a access time H High c cycle time (period) L Low d delay time V Valid f fall time X Unknown, changing, or don't care level h hold time Z High impedance r rise time su setup time t transition time v valid time w pulse duration (width)

5.10.2 General Notes on Timing Parameters

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All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that all output transitions for a given half-cycle occur with a minimum of skewing relative to each other.

The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles. For actual cycle examples, see the appropriate cycle description section of this document.

5.11 Test Load Circuit

This test load circuit is used to measure all switching characteristics provided in this document.

A. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the

device pin.

B. The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its

transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from the data sheet timing.

Figure 5-4. 3.3-V Test Load Circuit

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w(RSL1)

h(boot-mode)

(C)

V V

(3.3 V)

DDIO DDA

INTOSC1

X1/X2

XRS

(D)

Boot-Mode

Pins

V (1.8 V)

XCLKOUT

User-code dependent

Boot-ROM execution starts

Peripheral/GPIO function Based on boot code

GPIO pins as input

OSCST

Address/Data/

Control

(Internal)

Address/data valid, internal boot-ROM code execution phase

User-code execution phase

d(EX)

INTOSCST

(A)

(B)

I/O Pins

GPIO pins as input [state depends on internal pullup/pulldown (PU/PD)]

User-code dependent

(E)

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5.12 Power Sequencing

There is no power sequencing requirement needed to ensure the device is in the proper state after reset or to prevent the I/Os from glitching during power up or power down (GPIO19, GPIO26–27, GPIO34–38 do not have glitch-free I/Os). No voltage larger than a diode drop (0.7 V) above V any digital pin before powering up the device. Voltages applied to pins on an unpowered device can bias internal p-n junctions in unintended ways and produce unpredictable results.

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should be applied to

DDIO

A. Upon power up, SYSCLKOUT is OSCCLK/4. Since the XCLKOUTDIV bits in the XCLK register come up with a reset

state of 0, SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. XCLKOUT = OSCCLK/16 during this phase.

B. Boot ROM configures the DIVSEL bits for /1 operation. XCLKOUT = OSCCLK/4 during this phase. Note that

XCLKOUT will not be visible at the pin until explicitly configured by user code.

C. After reset, the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode pin, the boot code

branches to destination memory or boot code function. If boot ROM code executes after power-on conditions (in debugger environment), the boot code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT

will be based on user environment and could be with or without PLL enabled. D. Using the XRS pin is optional due to the on-chip POR circuitry. E. The internal pullup or pulldown will take effect when BOR is driven high.

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Figure 5-5. Power-on Reset

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h(boot-mode)

(A)

w(RSL2)

INTOSC1

X1/X2

XRS

Boot-Mode

Pins

XCLKOUT

I/O Pins

Address/Data/

Control

(Internal)

Boot-ROM Execution Starts

User-Code Execution Starts

User-Code Dependent

User-Code Execution Phase

User-Code Dependent

User-Code Execution

Peripheral/GPIO Function

User-Code Dependent

GPIO Pins as Input (State Depends on Internal PU/PD)

GPIO Pins as Input

Peripheral/GPIO Function

d(EX)

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Table 5-3. Reset (XRS) Timing Requirements

h(boot-mode)

w(RSL2)

Hold time for boot-mode pins 1000t Pulse duration, XRS low on warm reset 32t

Table 5-4. Reset (XRS) Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

w(RSL1)

w(WDRS)

d(EX)

INTOSCST

(1)

OSCST

(1) Dependent on crystal/resonator and board design.

Pulse duration, XRS driven by device 600 μs Pulse duration, reset pulse generated by watchdog 512t Delay time, address/data valid after XRS high 32t Start up time, internal zero-pin oscillator 3 μs On-chip crystal-oscillator start-up time 1 10 ms

c(OSCCLK)

c(OSCCLK) c(OSCCLK)

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MIN MAX UNIT

c(SCO)

cycles cycles

A. After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code

branches to destination memory or boot code function. If Boot ROM code executes after power-on conditions (in

debugger environment), the Boot code execution time is based on the current SYSCLKOUT speed. The

SYSCLKOUT will be based on user environment and could be with or without PLL enabled.

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Figure 5-6. Warm Reset

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OSCCLK

SYSCLKOUT

Write to PLLCR

OSCCLK * 2

(Current CPU

Frequency)

OSCCLK/2

(CPU frequency while PLL is stabilizing

with the desired frequency. This period

(PLL lock-up time t ) is 1 ms long.)

OSCCLK * 4

(Changed CPU frequency)

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Figure 5-7 shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR =

0x0004 and SYSCLKOUT = OSCCLK × 2. The PLLCR is then written with 0x0008. Right after the PLLCR register is written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the PLL lock-up is complete, SYSCLKOUT reflects the new operating frequency, OSCCLK × 4.

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Figure 5-7. Example of Effect of Writing Into PLLCR Register

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5.13 Clock Specifications

5.13.1 Device Clock Table

This section provides the timing requirements and switching characteristics for the various clock options available on the 2806x MCUs. Table 5-5 lists the cycle times of various clocks.

Table 5-5. 2806x Clock Table and Nomenclature (90-MHz Devices)

MIN NOM MAX UNIT

, Cycle time 11.11 500 ns

SYSCLKOUT

LSPCLK

(1)

ADC clock

(1) Lower LSPCLK will reduce device power consumption. (2) This is the default reset value if SYSCLKOUT = 90 MHz.

Table 5-6. Device Clocking Requirements/Characteristics

On-chip oscillator (X1/X2 pins) (Crystal/Resonator)

External oscillator/clock source (XCLKIN pin) — PLL Enabled

External oscillator/clock source (XCLKIN pin) — PLL Disabled

Limp mode SYSCLKOUT (with /2 enabled)

XCLKOUT

PLL lock time

(1) The PLLLOCKPRD register must be updated based on the number of OSCCLK cycles. If the zero-pin internal oscillators (10 MHz) are

used as the clock source, then the PLLLOCKPRD register must be written with a value of 10,000 (minimum).

(1)

c(SCO)

Frequency 2 90 MHz t

, Cycle time 11.11 44.4

c(LCO)

Frequency 22.5 t

c(ADCCLK)

, Cycle time 22.22 ns

(2) (2)

90 MHz

Frequency 45 MHz

MIN NOM MAX UNIT

, Cycle time 50 200 ns

c(OSC)

Frequency 5 20 MHz t

, Cycle time (C8) 33.3 200 ns

c(CI)

Frequency 5 30 MHz t

, Cycle time (C8) 11.11 250 ns

c(CI)

Frequency 4 90 MHz Frequency range 1 to 5 MHz t

, Cycle time (C1) 44.44 2000 ns

c(XCO)

Frequency 0.5 22.5 MHz t

1 ms

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Zero-Pin Oscillator Frequency Movement With Temperature

9.6

9.7

9.8

9.9

10.1

10.2

10.3

10.4

10.5

10.6

–40

–30

–20 –10 0 10 20

40 50 60 70 80 90 100 110 120

Temperature (°C)

Output Frequency (MHz)

Typical

Max

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Table 5-7. Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics

PARAMETER MIN TYP MAX UNIT

Internal zero-pin oscillator 1 (INTOSC1) at 30°C Internal zero-pin oscillator 2 (INTOSC2) at 30°C Step size (coarse trim) 55 kHz Step size (fine trim) 14 kHz Temperature drift Voltage (VDD) drift

(1) In order to achieve better oscillator accuracy (10 MHz ± 1% or better) than shown, refer to the Oscillator Compensation Guide

Application Report (SPRAB84). (2) Frequency range ensured only when VREG is enabled, VREGENZ = VSS. (3) Output frequency of the internal oscillators follows the direction of both the temperature gradient and voltage (VDD) gradient. For

example:

• Increase in temperature will cause the output frequency to increase per the temperature coefficient.

• Decrease in voltage (VDD) will cause the output frequency to decrease per the voltage coefficient.

(3)

(1)(2) (1)(2)

Frequency 10.000 MHz Frequency 10.000 MHz

3.03 4.85 kHz/°C 175 Hz/mV

Figure 5-8. Zero-Pin Oscillator Frequency Movement With Temperature

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XCLKOUT

(B)

XCLKIN

(A)

C10

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5.13.2 Clock Requirements and Characteristics

Table 5-8. XCLKIN Timing Requirements - PLL Enabled

NO. MIN MAX UNIT

C9 t

f(CI)

C10 t

r(CI)

C11 t

w(CIL)

C12 t

w(CIH)

NO. MIN MAX UNIT

C9 t

f(CI)

C10 t

r(CI)

C11 t

w(CIL)

C12 t

w(CIH)

The possible configuration modes are shown in Table 6-15.

Fall time, XCLKIN 6 ns Rise time, XCLKIN 6 ns Pulse duration, XCLKIN low as a percentage of t Pulse duration, XCLKIN high as a percentage of t

c(OSCCLK)

45% 55% 45% 55%

Table 5-9. XCLKIN Timing Requirements - PLL Disabled

Fall time, XCLKIN

Rise time, XCLKIN

Pulse duration, XCLKIN low as a percentage of t Pulse duration, XCLKIN high as a percentage of t

c(OSCCLK)

Up to 20 MHz 6 20 MHz to 90 MHz 2 Up to 20 MHz 6 20 MHz to 90 MHz 2

45% 55% 45% 55%

Table 5-10. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)

(1)(2)

over recommended operating conditions (unless otherwise noted)

NO. PARAMETER MIN MAX UNIT

C3 t C4 t C5 t C6 t

f(XCO) r(XCO) w(XCOL) w(XCOH)

Fall time, XCLKOUT 5 ns Rise time, XCLKOUT 5 ns Pulse duration, XCLKOUT low H – 2 H + 2 ns Pulse duration, XCLKOUT high H – 2 H + 2 ns

(1) A load of 40 pF is assumed for these parameters. (2) H = 0.5t

c(XCO)

A. The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is

intended to illustrate the timing parameters only and may differ based on actual configuration.

B. XCLKOUT configured to reflect SYSCLKOUT.

Figure 5-9. Clock Timing

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5.14 Flash Timing

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Table 5-11. Flash/OTP Endurance for T Temperature Material

ERASE/PROGRAM

TEMPERATURE

N N

Flash endurance for the array (write/erase cycles) 0°C to 105°C (ambient) 20000 50000 cycles

OTP endurance for the array (write cycles) 0°C to 30°C (ambient) 1 write

OTP

MIN TYP MAX UNIT

(1)

(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.

Table 5-12. Flash/OTP Endurance for S Temperature Material

ERASE/PROGRAM

TEMPERATURE

N N

Flash endurance for the array (write/erase cycles) 0°C to 125°C (ambient) 20000 50000 cycles

OTP endurance for the array (write cycles) 0°C to 30°C (ambient) 1 write

OTP

MIN TYP MAX UNIT

(1)

(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.

Table 5-13. Flash/OTP Endurance for Q Temperature Material

ERASE/PROGRAM

TEMPERATURE

N N

Flash endurance for the array (write/erase cycles) –40°C to 125°C (ambient) 20000 50000 cycles

OTP endurance for the array (write cycles) –40°C to 30°C (ambient) 1 write

OTP

(1)(2)

MIN TYP MAX UNIT

(1) Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers. (2) The "Q" temperature option is not available on the 2806xU devices.

Table 5-14. Flash Parameters at 90-MHz SYSCLKOUT

PARAMETER

TEST

CONDITIONS

MIN TYP MAX UNIT

16-Bit Word 50 μs

Program Time

16K Sector 500 ms 8K Sector 250 ms 4K Sector 125 ms 16K Sector 2

Erase Time

(1)

s8K Sector 2

4K Sector 2

(2)

DDP

DDIOP

(2) (2)

VDDcurrent consumption during Erase/Program cycle V

current consumption during Erase/Program cycle 60

DDIO

current consumption during Erase/Program cycle VREG enabled 120 mA

DDIO

VREG disabled

(1) The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required

before programming, when programming the device for the first time. However, the erase operation is needed on all subsequent programming operations.

(2) Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain a

stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash programming could be higher than normal operating conditions. The power supply used should ensure V times, as specified in the Recommended Operating Conditions of the data sheet. Any brown-out or interruption to power during

on the supply rails at all

MIN

erasing/programming could potentially corrupt the password locations and lock the device permanently. Powering a target board (during flash programming) through the USB port is not recommended, as the port may be unable to respond to the power demands placed during the programming process.

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largeriswhichever1,orinteger,highestnextthetoupround1StateWaitOTP

ú û

ê ë

÷ ø

ç è

c(SCO)

a(OTP)

largeriswhichever1,orinteger,highestnextthetoupround1StateWaitRandomFlash

ú û

ê ë

÷ ø

ç è

c(SCO)

r)a(f

largeriswhichever1,orinteger,highestnextthetoupround1StateWaitPageFlash

ú û

ê ë

÷ ø

ç è

c(SCO)

p)a(f

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Table 5-15. Flash/OTP Access Timing

PARAMETER MIN MAX UNIT

a(fp)

a(fr)

a(OTP)

Paged Flash access time 36 ns Random Flash access time 36 ns OTP access time 60 ns

Table 5-16. Flash Data Retention Duration

PARAMETER TEST CONDITIONS MIN MAX UNIT

retention

Data retention duration TJ= 55°C 15 years

Table 5-17. Minimum Required Flash/OTP Wait-States at Different Frequencies

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SYSCLKOUT

(MHz)

90 11.11 3 3 5 80 12.5 2 2 4 70 14.29 2 2 4 60 16.67 2 2 3 55 18.18 1 1 3 50 20 1 1 2 45 22.22 1 1 2 40 25 1 1 2 35 28.57 1 1 2 30 33.33 1 1 1

(1) Page and random wait-state must be ≥ 1.

SYSCLKOUT

(ns)

The equations to compute the Flash page wait-state and random wait-state in Table 5-17 are as follows:

The equation to compute the OTP wait-state in Table 5-17 is as follows:

PAGE

WAIT-STATE

(1)

RANDOM

WAIT-STATE

(1)

OTP

WAIT-STATE

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6 Detailed Description

6.1 Overview

6.1.1 CPU

The 2806x (C28x) family is a member of the TMS320C2000™ microcontroller (MCU) platform. The C28xbased controllers have the same 32-bit fixed-point architecture as existing C28x MCUs. Each C28x-based controller, including the 2806x device, is a very efficient C/C++ engine, enabling users to develop not only their system control software in a high-level language, but also enabling development of math algorithms using C/C++. The device is as efficient at MCU math tasks as it is at system control tasks that typically are handled by microcontroller devices. This efficiency removes the need for a second processor in many systems. The 32 × 32-bit MAC 64-bit processing capabilities enable the controller to handle higher numerical resolution problems efficiently. Add to this the fast interrupt response with automatic context save of critical registers, resulting in a device that is capable of servicing many asynchronous events with minimal latency. The device has an 8-level-deep protected pipeline with pipelined memory accesses. This pipelining enables it to execute at high speeds without resorting to expensive high-speed memories. Special branch-look-ahead hardware minimizes the latency for conditional discontinuities. Special store conditional operations further improve performance.

6.1.2 Control Law Accelerator (CLA)

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The C28x control law accelerator is a single-precision (32-bit) floating-point unit that extends the capabilities of the C28x CPU by adding parallel processing. The CLA is an independent processor with its own bus structure, fetch mechanism, and pipeline. Eight individual CLA tasks, or routines, can be specified. Each task is started by software or a peripheral such as the ADC, ePWM, eCAP, eQEP, or CPU Timer 0. The CLA executes one task at a time to completion. When a task completes the main CPU is notified by an interrupt to the PIE and the CLA automatically begins the next highest-priority pending task. The CLA can directly access the ADC Result registers, ePWM+HRPWM, eCAP, and eQEP registers. Dedicated message RAMs provide a method to pass additional data between the main CPU and the CLA.

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6.1.3 Viterbi, Complex Math, CRC Unit (VCU)

The C28x VCU enhances the processing power of C2000™ devices by adding additional assembly instructions to target complex math, Viterbi decode, and CRC calculations. The VCU instructions accelerate many applications, including the following:

• Orthogonal frequency-division multiplex (OFDM) used in the PRIME and G3 standards for power line communications

• Short-range radar complex math calculations

• Power calculations

• Memory and data communication packet checks (CRC)

The VCU features include:

• Instructions to support Cyclic Redundancy Checks (CRCs), which is a polynomial code checksum. – CRC8 – CRC16 – CRC32

• Instructions to support a flexible software implementation of a Viterbi decoder – Branch metric calculations for a code rate of 1/2 or 1/3 – Add-Compare Select or Viterbi Butterfly in 5 cycles per butterfly – Traceback in 3 cycles per stage – Easily supports a constraint length of K = 7 used in PRIME and G3 standards

• Complex math arithmetic unit – Single-cycle Add or Subtract – 2-cycle multiply – 2-cycle multiply and accumulate (MAC) – Single-cycle repeat MAC

• Independent register space

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6.1.4 Memory Bus (Harvard Bus Architecture)

As with many MCU-type devices, multiple busses are used to move data between the memories and peripherals and the CPU. The memory bus architecture contains a program read bus, data read bus, and data write bus. The program read bus consists of 22 address lines and 32 data lines. The data read and write busses consist of 32 address lines and 32 data lines each. The 32-bit-wide data busses enable single cycle 32-bit operations. The multiple bus architecture, commonly termed Harvard Bus, enables the C28x to fetch an instruction, read a data value and write a data value in a single cycle. All peripherals and memories attached to the memory bus prioritize memory accesses. Generally, the priority of memory bus accesses can be summarized as follows:

Highest: Data Writes (Simultaneous data and program writes cannot occur on the

memory bus.)

Program Writes (Simultaneous data and program writes cannot occur on the

memory bus.) Data Reads Program Reads (Simultaneous program reads and fetches cannot occur on the

memory bus.)

Lowest: Fetches (Simultaneous program reads and fetches cannot occur on the

memory bus.)

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6.1.5 Peripheral Bus

To enable migration of peripherals between various Texas Instruments (TI) MCU family of devices, the devices adopt a peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes the various busses that make up the processor Memory Bus into a single bus consisting of 16 address lines and 16 or 32 data lines and associated control signals. Three versions of the peripheral bus are supported. One version supports only 16-bit accesses (called peripheral frame 2). Another version supports both 16- and 32-bit accesses (called peripheral frame 1).

6.1.6 Real-Time JTAG and Analysis

The devices implement the standard IEEE 1149.1 JTAG Additionally, the devices support real-time mode of operation allowing modification of the contents of memory, peripheral, and register locations while the processor is running and executing code and servicing interrupts. The user can also single step through non-time-critical code while enabling timecritical interrupts to be serviced without interference. The device implements the real-time mode in hardware within the CPU. This is a feature unique to the 28x family of devices, requiring no software monitor. Additionally, special analysis hardware is provided that allows setting of hardware breakpoint or data/address watch-points and generating various user-selectable break events when a match occurs.

6.1.7 Flash

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(1)

interface for in-circuit based debug.

The F28069, F28068, F28067, and F28066 devices contain 128K × 16 of embedded flash memory, segregated into eight 16K × 16 sectors. The F28065, F28064, F28063, and F28062 devices contain 64K × 16 of embedded flash memory, segregated into eight 8K × 16 sectors. All devices also contain a single 1K × 16 of OTP memory at address range 0x3D 7800 – 0x3D 7BF9. The user can individually erase, program, and validate a flash sector while leaving other sectors untouched. However, it is not possible to use one sector of the flash or the OTP to execute flash algorithms that erase or program other sectors. Special memory pipelining is provided to enable the flash module to achieve higher performance. The flash/OTP is mapped to both program and data space; therefore, it can be used to execute code or store data information. Addresses 0x3F 7FF0 – 0x3F 7FF5 are reserved for data variables and should not contain program code.

NOTE

The Flash and OTP wait-states can be configured by the application. This allows applications running at slower frequencies to configure the flash to use fewer wait-states.

Flash effective performance can be improved by enabling the flash pipeline mode in the Flash options register. With this mode enabled, effective performance of linear code execution will be much faster than the raw performance indicated by the wait-state configuration alone. The exact performance gain when using the Flash pipeline mode is application-dependent.

For more information on the Flash options, Flash wait-state, and OTP wait-state registers, see the Systems Control and Interrupts chapter of the TMS320x2806x Piccolo Technical Reference Manual (SPRUH18).

(1) IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

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6.1.8 M0, M1 SARAMs

All devices contain these two blocks of single-access memory, each 1K × 16 in size. The stack pointer points to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks on C28x devices, are mapped to both program and data space. Hence, the user can use M0 and M1 to execute code or for data variables. The partitioning is performed within the linker. The C28x device presents a unified memory map to the programmer. This makes for easier programming in high-level languages.

6.1.9 L4 SARAM, and L0, L1, L2, L3, L5, L6, L7, and L8 DPSARAMs

The device contains up to 48K × 16 of single-access RAM. To ascertain the exact size for a given device, see the device-specific memory map figures in Section 6.2. This block is mapped to both program and data space. L0 is 2K in size. L1 and L2 are each 1K in size. L3 is 4K in size. L4, L5, L6, L7, and L8 are each 8K in size. L0, L1, and L2 are shared with the CLA, which can use these blocks for its data space. L3 is shared with the CLA, which can use this block for its program space. L5, L6, L7, and L8 are shared with the DMA, which can use these blocks for its data space. DPSARAM refers to the dual-port configuration of these blocks.

6.1.10 Boot ROM

The Boot ROM is factory-programmed with boot-loading software. Boot-mode signals are provided to tell the bootloader software what boot mode to use on power up. The user can select to boot normally or to download new software from an external connection or to select boot software that is programmed in the internal Flash/ROM. The Boot ROM also contains standard tables, such as SIN/COS waveforms, for use in math-related algorithms.

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Table 6-1. Boot Mode Selection

MODE GPIO37/TDO

3 1 1 0 GetMode 2 1 0 0 Wait (see Section 6.1.11 for description) 1 0 1 0 SCI 0 0 0 0 Parallel IO

EMU x x 1 Emulation Boot

GPIO34/COMP2OUT/

COMP3OUT

TRST MODE

6.1.10.1 Emulation Boot

When the emulator is connected, the GPIO37/TDO pin cannot be used for boot mode selection. In this case, the boot ROM detects that an emulator is connected and uses the contents of two reserved SARAM locations in the PIE vector table to determine the boot mode. If the content of either location is invalid, then the Wait boot option is used. All boot mode options can be accessed in emulation boot.

6.1.10.2 GetMode

The default behavior of the GetMode option is to boot to flash. This behavior can be changed to another boot option by programming two locations in the OTP. If the content of either OTP location is invalid, then boot to flash is used. One of the following loaders can be specified: SCI, SPI, I2C, CAN, or OTP.

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6.1.10.3 Peripheral Pins Used by the Bootloader

Table 6-2 shows which GPIO pins are used by each peripheral bootloader. Refer to the GPIO mux table

to see if these conflict with any of the peripherals you would like to use in your application.

Table 6-2. Peripheral Bootload Pins

BOOTLOADER PERIPHERAL LOADER PINS

SCI SCIRXDA (GPIO28)

SCITXDA (GPIO29)

Parallel Boot Data (GPIO31,30,5:0)

28x Control (AIO6) Host Control (AIO12)

SPI SPISIMOA (GPIO16)

SPISOMIA (GPIO17) SPICLKA (GPIO18) SPISTEA (GPIO19)

I2C SDAA (GPIO32)

SCLA (GPIO33)

CAN CANRXA (GPIO30)

CANTXA (GPIO31)

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6.1.11 Security

The devices support high levels of security to protect the user firmware from being reverse-engineered. The security features a 128-bit password (hardcoded for 16 wait-states), which the user programs into the flash. One code security module (CSM) is used to protect the flash/OTP and the L0/L1 SARAM blocks. The security feature prevents unauthorized users from examining the memory contents through the JTAG port, executing code from external memory or trying to boot-load some undesirable software that would export the secure memory contents. To enable access to the secure blocks, the user must write the correct 128-bit KEY value that matches the value stored in the password locations within the Flash.

In addition to the CSM, the emulation code security logic (ECSL) has been implemented to prevent unauthorized users from stepping through secure code. Any code or data access to CSM secure memory while the emulator is connected will trip the ECSL and break the emulation connection. To allow emulation of secure code, while maintaining the CSM protection against secure memory reads, the user must write the correct value into the lower 64 bits of the KEY register, which matches the value stored in the lower 64 bits of the password locations within the flash. Note that dummy reads of all 128 bits of the password in the flash must still be performed. If the lower 64 bits of the password locations are all ones (unprogrammed), then the KEY value does not need to match.

When initially debugging a device with the password locations in flash programmed (that is, secured), the CPU will start running and may execute an instruction that performs an access to a protected ECSL area. If this happens, the ECSL will trip and cause the emulator connection to be cut.

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The solution is to use the Wait boot option. This will sit in a loop around a software breakpoint to allow an emulator to be connected without tripping security. Piccolo devices do not support a hardware wait-inreset mode.

NOTE

• When the code-security passwords are programmed, all addresses between 0x3F 7F80 and 0x3F 7FF5 cannot be used as program code or data. These locations must be programmed to 0x0000.

• If the code security feature is not used, addresses 0x3F 7F80 through 0x3F 7FEF may be used for code or data. Addresses 0x3F 7FF0 – 0x3F 7FF5 are reserved for data and should not contain program code.

• The 128-bit password (at 0x3F 7FF8 – 0x3F 7FFF) must not be programmed to zeros. Doing so would permanently lock the device.

Disclaimer

Code Security Module Disclaimer

THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY (EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN ACCORDANCE WITH ITS STANDARD TERMS AND CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY PERIOD APPLICABLE FOR THIS DEVICE.

TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT AS SET FORTH ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS CONCERNING THE CSM OR OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.

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IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT, INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR OTHER ECONOMIC LOSS.

6.1.12 Peripheral Interrupt Expansion (PIE) Block

The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The PIE block can support up to 96 peripheral interrupts. On the F2806x, 72 of the possible 96 interrupts are used by peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of 12 CPU interrupt lines (INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a dedicated RAM block that can be overwritten by the user. The vector is automatically fetched by the CPU on servicing the interrupt. Eight CPU clock cycles are needed to fetch the vector and save critical CPU registers. Hence the CPU can quickly respond to interrupt events. Prioritization of interrupts is controlled in hardware and software. Each individual interrupt can be enabled or disabled within the PIE block.

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6.1.13 External Interrupts (XINT1–XINT3)

The devices support three masked external interrupts (XINT1–XINT3). Each of the interrupts can be selected for negative, positive, or both negative and positive edge triggering and can also be enabled or disabled. These interrupts also contain a 16-bit free-running up counter, which is reset to zero when a valid interrupt edge is detected. This counter can be used to accurately time-stamp the interrupt. There are no dedicated pins for the external interrupts. XINT1, XINT2, and XINT3 interrupts can accept inputs from GPIO0–GPIO31 pins.

6.1.14 Internal Zero Pin Oscillators, Oscillator, and PLL

The device can be clocked by either of the two internal zero-pin oscillators, an external oscillator, or by a crystal attached to the on-chip oscillator circuit. A PLL is provided supporting up to 16 input-clock-scaling ratios. The PLL ratios can be changed on-the-fly in software, enabling the user to scale back on operating frequency if lower power operation is desired. Refer to Section 5, Specifications, for timing details. The PLL block can be set in bypass mode. A second PLL (PLL2) feeds the HRCAP module.

6.1.15 Watchdog

Each device contains two watchdogs: CPU-watchdog that monitors the core and NMI-watchdog that is a missing clock-detect circuit. The user software must regularly reset the CPU-watchdog counter within a certain time frame; otherwise, the CPU-watchdog generates a reset to the processor. The CPU-watchdog can be disabled if necessary. The NMI-watchdog engages only in case of a clock failure and can either generate an interrupt or a device reset.

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6.1.16 Peripheral Clocking

The clocks to each individual peripheral can be enabled or disabled to reduce power consumption when a peripheral is not in use. Additionally, the system clock to the serial ports (except I2C) can be scaled relative to the CPU clock.

6.1.17 Low-power Modes

The devices are full static CMOS devices. Three low-power modes are provided:

IDLE: Places CPU in low-power mode. Peripheral clocks may be turned off selectively and

only those peripherals that need to function during IDLE are left operating. An enabled interrupt from an active peripheral or the watchdog timer will wake the processor from IDLE mode.

STANDBY: Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL

functional. An external interrupt event will wake the processor and the peripherals. Execution begins on the next valid cycle after detection of the interrupt event

HALT: This mode basically shuts down the device and places it in the lowest possible power-

consumption mode. If the internal zero-pin oscillators are used as the clock source, the HALT mode turns them off, by default. To keep these oscillators from shutting down, the INTOSCnHALTI bits in CLKCTL register may be used. The zero-pin oscillators may thus be used to clock the CPU-watchdog in this mode. If the on-chip crystal oscillator is used as the clock source, it is shut down in this mode. A reset or an external signal (through a GPIO pin) or the CPU-watchdog can wake the device from this mode.

The CPU clock (OSCCLK) and WDCLK should be from the same clock source before attempting to put the device into HALT or STANDBY.

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6.1.18 Peripheral Frames 0, 1, 2, 3 (PFn)

The device segregates peripherals into four sections. The mapping of peripherals is as follows:

PF0: PIE: PIE Interrupt Enable and Control Registers Plus PIE Vector Table

Flash: Flash Waitstate Registers Timers: CPU-Timers 0, 1, 2 Registers CSM: Code Security Module KEY Registers ADC: ADC Result Registers CLA: Control Law Accelrator Registers and Message RAMs

PF1: GPIO: GPIO MUX Configuration and Control Registers

eCAN: Enhanced Control Area Network Configuration and Control Registers

PF2: SYS: System Control Registers

SCI: Serial Communications Interface (SCI) Control and RX/TX Registers SPI: Serial Port Interface (SPI) Control and RX/TX Registers ADC: ADC Status, Control, and Configuration Registers I2C: Inter-Integrated Circuit Module and Registers XINT: External Interrupt Registers

PF3: McBSP: Multichannel Buffered Serial Port Registers

ePWM: Enhanced Pulse Width Modulator Module and Registers eCAP: Enhanced Capture Module and Registers eQEP: Enhanced Quadrature Encoder Pulse Module and Registers Comparators: Comparator Modules USB: Universal Serial Bus Module and Registers

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6.1.19 General-Purpose Input/Output (GPIO) Multiplexer

Most of the peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. This enables the user to use a pin as GPIO if the peripheral signal or function is not used. On reset, GPIO pins are configured as inputs. The user can individually program each pin for GPIO mode or peripheral signal mode. For specific inputs, the user can also select the number of input qualification cycles. This is to filter unwanted noise glitches. The GPIO signals can also be used to bring the device out of specific low-power modes.

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6.1.20 32-Bit CPU-Timers (0, 1, 2)

CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock prescaling. The timers have a 32-bit count-down register, which generates an interrupt when the counter reaches zero. The counter is decremented at the CPU clock speed divided by the prescale value setting. When the counter reaches zero, it is automatically reloaded with a 32-bit period value.

CPU-Timer 0 is for general use and is connected to the PIE block. CPU-Timer 1 is also for general use and can be connected to INT13 of the CPU. CPU-Timer 2 is reserved for SYS/BIOS. CPU-Timer 2 is connected to INT14 of the CPU. If SYS/BIOS is not being used, CPU-Timer 2 is available for general use.

CPU-Timer 2 can be clocked by any one of the following:

• SYSCLKOUT (default)

• Internal zero-pin oscillator 1 (INTOSC1)

• Internal zero-pin oscillator 2 (INTSOC2)

• External clock source

6.1.21 Control Peripherals

The devices support the following peripherals that are used for embedded control and communication:

ePWM: The enhanced PWM peripheral supports independent/complementary PWM

generation, adjustable dead-band generation for leading/trailing edges, latched/cycle-by-cycle trip mechanism. Some of the PWM pins support the HRPWM high-resolution duty and period features. The type 1 module found on 2806x devices also supports increased dead-band resolution, enhanced SOC and interrupt generation, and advanced triggering including trip functions based on comparator outputs.

eCAP: The enhanced capture peripheral uses a 32-bit time base and registers up to four

programmable events in continuous/one-shot capture modes. This peripheral can also be configured to generate an auxiliary PWM signal.

eQEP: The enhanced QEP peripheral uses a 32-bit position counter, supports low-speed

measurement using capture unit and high-speed measurement using a 32-bit unit timer. This peripheral has a watchdog timer to detect motor stall and input error detection logic to identify simultaneous edge transition in QEP signals.

ADC: The ADC block is a 12-bit converter. The ADC has up to 16 single-ended channels

pinned out, depending on the device. The ADC also contains two sample-and-hold units for simultaneous sampling.

Comparator: Each comparator block consists of one analog comparator along with an internal

10-bit reference for supplying one input of the comparator.

HRCAP: The high-resolution capture peripheral operates in normal capture mode through a

16-bit counter clocked off of the HCCAPCLK or in high-resolution capture mode by using built-in calibration logic in conjunction with a TI-supplied calibration library.

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6.1.22 Serial Port Peripherals

The devices support the following serial communication peripherals:

SPI: The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream

of programmed length (1 to 16 bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications between the MCU and external peripherals or another processor. Typical applications include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multi-device communications are supported by the master/slave operation of the SPI. The SPI contains a 4-level receive and transmit FIFO for reducing interrupt servicing overhead.

SCI: The serial communications interface is a 2-wire asynchronous serial port,

commonly known as UART. The SCI contains a 4-level receive and transmit FIFO for reducing interrupt servicing overhead.

I2C: The inter-integrated circuit (I2C) module provides an interface between a MCU and

other devices compliant with Philips Semiconductors Inter-IC bus ( I2C-bus®) specification version 2.1 and connected by way of an I2C-bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to or from the MCU through the I2C module. The I2C contains a 4-level receiveand-transmit FIFO for reducing interrupt servicing overhead.

eCAN: This is the enhanced version of the CAN peripheral. The eCAN supports

32 mailboxes, time stamping of messages, and is compliant with ISO11898-1 (CAN 2.0B).

McBSP: The multichannel buffered serial port (McBSP) connects to E1/T1 lines, phone-

quality codecs for modem applications or high-quality stereo audio DAC devices. The McBSP receive and transmit registers are supported by the DMA to significantly reduce the overhead for servicing this peripheral. Each McBSP module can be configured as an SPI as required.

USB: The USB peripheral, which conforms to the USB 2.0 specification, may be used as

either a full-speed (12-Mbps) device controller, or a full-speed (12-Mbps) or lowspeed (1.5-Mbps) host controller. The controller supports a total of six userconfigurable endpoints—all of which can be accessed through DMA, in addition to a dedicated control endpoint for endpoint zero. All packets transmitted or received are buffered in 4KB of dedicated endpoint memory. The USB peripheral supports all four transfer types: Control, Interrupt, Bulk, and Isochronous. Because of the complexity of the USB peripheral and the associated protocol overhead, a full software library with application examples is provided within controlSUITE™.

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6.2 Memory Maps

In Figure 6-1 through Figure 6-8, the following apply:

• Memory blocks are not to scale.

• Peripheral Frame 0, Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 memory maps are restricted to data memory only. A user program cannot access these memory maps in program space.

• Protected means the order of Write-followed-by-Read operations is preserved rather than the pipeline order.

• Certain memory ranges are EALLOW protected against spurious writes after configuration.

• Locations 0x3D 7C80–0x3D 7CC0 contain the internal oscillator and ADC calibration routines. These locations are not programmable by the user.

• All devices with USB have the USB control registers mapped from 0x4000 to 0x4FFF and 2K ×16 RAM from 0x40000 to 0x40800. When the clock to the USB module is enabled, this RAM is connected to the USB controller and acts as the FIFO RAM. When the clock to the USB module is disabled, this RAM is remapped to the CPU-accessible address space and can be used as general-purpose RAM.

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M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

0x00 2000

Reserved

Peripheral Frame 0

0x00 0800

0x00 1580

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1, ENPIE = 1)

0x00 1400

0x00 0E00

0x00 1500

0x00 1480

CPU-to-CLA Message RAM

CLA-to-CPU Message RAM

CLA Registers

Peripheral Frame 0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM2)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 0)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 1)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL, CLA Program RAM)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x01 4000

Reserved

0x3D 7BFA

Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

FAST and SpinTAC Libraries

(16K 16, 0-Wait)

(B)

128-Bit Password

0x3D 8000

0x3F 7FF8

0x3F 8000

0x3F C000

Boot ROM (16K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

0x3D 7E80

PARTID

Reserved

0x3D 7EB0

Reserved

Calibration Data

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A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved. B. On 2806xM and 2806xF devices only.

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Figure 6-1. 28069 Memory Map

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M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00

Peripheral Frame 0

0x00 1400

Reserved

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

FAST and SpinTAC Libraries

(16K 16, 0-Wait)

(B)

128-Bit Password

0x3D 8000

0x3F 7FF8

0x3F 8000

0x3F C000

Boot ROM (16K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

www.ti.com

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved. B. On 2806xM and 2806xF devices only.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Figure 6-2. 28068 Memory Map

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TMS320F28064 TMS320F28063 TMS320F28062

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00

Peripheral Frame 0

0x00 1400

Reserved

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3D 8000

0x3F 7FF8

Boot ROM (32K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F 8000

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

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Figure 6-3. 28067 Memory Map

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M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00

Peripheral Frame 0

0x00 1400

Reserved

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

Reserved

0x01 0000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(128K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3D 8000

0x3F 7FF8

Boot ROM (32K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F 8000

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

www.ti.com

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Figure 6-4. 28066 Memory Map

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TMS320F28064 TMS320F28063 TMS320F28062

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

0x00 2000

Reserved

Peripheral Frame 0

0x00 0800

0x00 1580

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 1400

0x00 0E00

0x00 1500

0x00 1480

CPU-to-CLA Message RAM

CLA-to-CPU Message RAM

CLA Registers

Peripheral Frame 0

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM2)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 0)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL, CLA Data RAM 1)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL, CLA Program RAM)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

Boot ROM (32K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F 8000

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

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Figure 6-5. 28065 Memory Map

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TMS320F28064 TMS320F28063 TMS320F28062

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00

Peripheral Frame 0

0x00 1400

Reserved

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L8 DPSARAM (8K 16)

(0-Wait, DMA RAM 3)

L7 DPSARAM (8K 16)

(0-Wait, DMA RAM 2)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

0x01 0000

0x01 2000

Reserved

0x01 4000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

Boot ROM (32K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F 8000

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

www.ti.com

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Figure 6-6. 28064 Memory Map

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TMS320F28064 TMS320F28063 TMS320F28062

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00

Peripheral Frame 0

0x00 1400

Reserved

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

L6 DPSARAM (8K 16)

(0-Wait, DMA RAM 1)

0x00 E000

Reserved

0x01 0000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

128-Bit Password

0x3E 8000

0x3F 7FF8

Boot ROM (32K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F 8000

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

www.ti.com

Figure 6-7. 28063 Memory Map

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TMS320F28064 TMS320F28063 TMS320F28062

M0 Vector RAM (Enabled if VMAP = 0)

M0 SARAM (1K 16, 0-Wait)´

0x00 0000

0x00 0040

M1 SARAM (1K 16, 0-Wait)´

0x00 0400

Data Space Prog Space

Reserved

Peripheral Frame 0

0x00 0800

0x00 0D00

PIE Vector - RAM

(256 16)

(Enabled if

VMAP = 1,

ENPIE = 1)

0x00 0E00

Peripheral Frame 0

0x00 1400

Reserved

0x00 8000

L0 DPSARAM (2K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8800

L1 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 8C00

L2 DPSARAM (1K 16)

(0-Wait, Secure Zone + ECSL)

0x00 9000

L3 DPSARAM (4K 16)

(0-Wait, Secure Zone + ECSL)

0x00 A000

L4 SARAM (8K 16)

(0-Wait, Secure Zone + ECSL)

0x00 C000

L5 DPSARAM (8K 16)

(0-Wait, DMA RAM 0)

Reserved

0x00 E000

Reserved

0x3D 7800

User OTP (1K 16, Secure Zone + ECSL)´

0x3D 7C80

Calibration Data

0x3D 7BFA

Reserved

FLASH

(64K 16, 8 Sectors, Secure Zone + ECSL)´

FAST and SpinTAC Libraries

(16K 16, 0-Wait)

(B)

128-Bit Password

0x3E 8000

0x3F 7FF8

0x3F 8000

0x3F C000

Boot ROM (16K 16, 0-Wait)´

Vector (32 Vectors, Enabled if VMAP = 1)

0x3F FFC0

0x3D 7CC0

Get_mode function

0x3D 7CD0

Reserved

0x3D 7E80

PARTID

Calibration Data

Reserved

0x3D 7EB0

Peripheral Frame 3 (4K 16, Protected)

DMA-Accessible

0x00 5000

0x00 4000

Peripheral Frame 2

(4K 16, Protected)´

0x00 7000

Peripheral Frame 1 (4K 16, Protected)´

USB Control Registers

(A)

0x00 6000

www.ti.com

A. On non-USB devices, 0x00 4000–0x00 4FFF is Reserved. B. On 2806xM and 2806xF devices only.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Figure 6-8. 28062 Memory Map

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TMS320F28064 TMS320F28063 TMS320F28062

TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Table 6-3. Addresses of Flash Sectors in F28069, F28068, F28067, F28066

ADDRESS RANGE PROGRAM AND DATA SPACE

0x3D 8000 – 0x3D BFFF Sector H (16K × 16)

0x3D C000 – 0x3D FFFF Sector G (16K × 16)

0x3E 0000 – 0x3E 3FFF Sector F (16K × 16) 0x3E 4000 – 0x3E 7FFF Sector E (16K × 16) 0x3E 8000 – 0x3E BFFF Sector D (16K × 16)

0x3E C000 – 0x3E FFFF Sector C (16K × 16)

0x3F 0000 – 0x3F 3FFF Sector B (16K × 16) 0x3F 4000 – 0x3F 7FF5 Sector A (16K × 16)

0x3F 7FF6 – 0x3F 7FF7

0x3F 7FF8 – 0x3F 7FFF

(program branch instruction here)

Table 6-4. Addresses of Flash Sectors in F28065, F28064, F28063, F28062

ADDRESS RANGE PROGRAM AND DATA SPACE

0x3E 8000 – 0x3E 9FFF Sector H (8K × 16) 0x3E A000 – 0x3E BFFF Sector G (8K × 16) 0x3E C000 – 0x3E DFFF Sector F (8K × 16)

0x3E E000 – 0x3E FFFF Sector E (8K × 16)

0x3F 0000 – 0x3F 1FFF Sector D (8K × 16) 0x3F 2000 – 0x3F 3FFF Sector C (8K × 16) 0x3F 4000 – 0x3F 5FFF Sector B (8K × 16) 0x3F 6000 – 0x3F 7FF5 Sector A (8K × 16)

0x3F 7FF6 – 0x3F 7FF7

0x3F 7FF8 – 0x3F 7FFF

(program branch instruction here)

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Boot-to-Flash Entry Point

Security Password (128-Bit)

(Do not program to all zeros)

Boot-to-Flash Entry Point

Security Password (128-Bit)

(Do not program to all zeros)

Addresses 0x3F 7FF0 – 0x3F 7FF5 are reserved for data and should not contain program code.

Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065

NOTE

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TMS320F28069,TMS320F28068,TMS320F28067,TMS320F28066

TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Peripheral Frame 1 and Peripheral Frame 2 are grouped together to enable these blocks to be write/read peripheral block protected. The protected mode makes sure that all accesses to these blocks happen as written. Because of the pipeline, a write immediately followed by a read to different memory locations, will appear in reverse order on the memory bus of the CPU. This can cause problems in certain peripheral applications where the user expected the write to occur first (as written). The CPU supports a block protection mode where a region of memory can be protected so that operations occur as written (the penalty is extra cycles are added to align the operations). This mode is programmable and by default, it protects the selected zones.

The wait-states for the various spaces in the memory map area are listed in Table 6-5.

Table 6-5. Wait-States

AREA WAIT-STATES (CPU) COMMENTS

M0 and M1 SARAMs 0-wait Fixed

Peripheral Frame 0 0-wait Peripheral Frame 1 0-wait (writes) Cycles can be extended by peripheral-generated ready.

2-wait (reads) Back-to-back write operations to Peripheral Frame 1 registers will incur

Peripheral Frame 2 0-wait (writes) Fixed. Cycles cannot be extended by the peripheral.

2-wait (reads)

Peripheral Frame 3 0-wait (writes) Assumes no conflict between CPU and CLA/DMA cycles. The wait

2-wait (reads)

L0–L8 SARAM 0-wait data and program Assumes no CPU conflicts

OTP Programmable Programmed through the Flash registers.

1-wait minimum 1-wait is minimum number of wait states allowed.

FLASH Programmable Programmed through the Flash registers.

0-wait Paged min

1-wait Random min

Random ≥ Paged

FLASH Password 16-wait fixed Wait states of password locations are fixed.

Boot-ROM 0-wait

a 1-cycle stall (1-cycle delay).

states can be extended by peripheral-generated ready.

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

6.3 Register Maps

The devices contain four peripheral register spaces. The spaces are categorized as follows:

Peripheral Frame 0: These are peripherals that are mapped directly to the CPU memory bus.

See Table 6-6.

Peripheral Frame 1: These are peripherals that are mapped to the 32-bit peripheral bus. See

Table 6-7.

Peripheral Frame 2: These are peripherals that are mapped to the 16-bit peripheral bus. See

Table 6-8.

Peripheral Frame 3: McBSP registers are mapped to this. See Table 6-9.

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Table 6-6. Peripheral Frame 0 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

Device Emulation registers 0x00 0880 – 0x00 0984 261 Yes System Power Control registers 0x00 0985 – 0x00 0987 3 Yes FLASH registers Code Security Module registers 0x00 0AE0 – 0x00 0AEF 16 Yes ADC registers (0 wait read only) 0x00 0B00 – 0x00 0B0F 16 No CPU-TIMER0, CPU-TIMER1, CPU-TIMER2

registers PIE registers 0x00 0CE0 – 0x00 0CFF 32 No PIE Vector Table 0x00 0D00 – 0x00 0DFF 256 Yes DMA registers 0x00 1000 – 0x00 11FF 512 Yes CLA registers 0x00 1400 – 0x00 147F 128 Yes CLA to CPU Message RAM (CPU writes ignored) 0x00 1480 – 0x00 14FF 128 NA CPU to CLA Message RAM (CLA writes ignored) 0x00 1500 – 0x00 157F 128 NA

(1) Registers in Frame 0 support 16-bit and 32-bit accesses. (2) If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction

disables writes to prevent stray code or pointers from corrupting register contents.

(3) The Flash Registers are also protected by the Code Security Module (CSM).

(3)

0x00 0A80 – 0x00 0ADF 96 Yes

0x00 0C00 – 0x00 0C3F 64 No

(1)

(2)

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Table 6-7. Peripheral Frame 1 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

eCAN-A registers 0x00 6000 – 0x00 61FF 512 HRCAP1 registers 0x00 6AC0 – 0x00 6ADF 32 HRCAP2 registers 0x00 6AE0 – 0x00 6AFF 32 HRCAP3 registers 0x00 6C80 – 0x00 6C9F 32 HRCAP4 registers 0x00 6CA0 – 0x00 6CBF 32 GPIO registers 0x00 6F80 – 0x00 6FFF 128

(1) Some registers are EALLOW protected. See the module reference guide for more information.

Table 6-8. Peripheral Frame 2 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

System Control registers 0x00 7010 – 0x00 702F 32 Yes SPI-A registers 0x00 7040 – 0x00 704F 16 No SCI-A registers 0x00 7050 – 0x00 705F 16 No NMI Watchdog Interrupt registers 0x00 7060 – 0x00 706F 16 Yes External Interrupt registers 0x00 7070 – 0x00 707F 16 Yes ADC registers 0x00 7100 – 0x00 717F 128 SPI-B registers 0x00 7740 – 0x00 774F 16 No SCI-B registers 0x00 7750 – 0x00 775F 16 No I2C-A registers 0x00 7900 – 0x00 793F 64

(1) Some registers are EALLOW protected. See the module reference guide for more information.

(1) (1) (1) (1) (1) (1)

(1)

Table 6-9. Peripheral Frame 3 Registers

NAME ADDRESS RANGE SIZE (×16) EALLOW PROTECTED

USB0 registers 0x00 4000 – 0x00 4FFF 4096 No McBSP-A registers 0x00 5000 – 0x00 503F 64 No Comparator 1 registers 0x00 6400 – 0x00 641F 32 Comparator 2 registers 0x00 6420 – 0x00 643F 32 Comparator 3 registers 0x00 6440 – 0x00 645F 32 ePWM1 + HRPWM1 registers 0x00 6800 – 0x00 683F 64 ePWM2 + HRPWM2 registers 0x00 6840 – 0x00 687F 64 ePWM3 + HRPWM3 registers 0x00 6880 – 0x00 68BF 64 ePWM4 + HRPWM4 registers 0x00 68C0 – 0x00 68FF 64 ePWM5 + HRPWM5 registers 0x00 6900 – 0x00 693F 64 ePWM6 + HRPWM6 registers 0x00 6940 – 0x00 697F 64 ePWM7 + HRPWM7 registers 0x00 6980 – 0x00 69BF 64 ePWM8 + HRPWM8 registers 0x00 69C0 – 0x00 69FF 64 eCAP1 registers 0x00 6A00 – 0x00 6A1F 32 No eCAP2 registers 0x00 6A20 – 0x00 6A3F 32 No eCAP3 registers 0x00 6A40 – 0x00 6A57 32 No eQEP1 registers 0x00 6B00 – 0x00 6B3F 64 eQEP2 registers 0x00 6B40 – 0x00 6B7F 64

(1) Some registers are EALLOW protected. See the module reference guide for more information.

(1) (1) (1) (1) (1) (1) (1) (1) (1)

(1)

(1) (1)

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6.4 Device Emulation Registers

These registers are used to control the protection mode of the C28x CPU and to monitor some critical device signals. The registers are defined in Table 6-10.

Table 6-10. Device Emulation Registers

NAME ADDRESS RANGE SIZE (×16) DESCRIPTION

DEVICECNF PARTID 0x3D 7E80 1 Part ID Register TMS320F28069PZP/PZ 0x009E

0x0880–

0x0881

2 Device Configuration Register Yes

TMS320F28069UPZP/PZ 0x009F TMS320F28069MPZP/PZ 0x009E TMS320F28069FPZP/PZ 0x009E TMS320F28069PFP/PN 0x009C TMS320F28069UPFP/PN 0x009D TMS320F28069MPFP/PN 0x009C TMS320F28069FPFP/PN 0x009C TMS320F28068PZP/PZ 0x008E TMS320F28068UPZP/PZ 0x008F TMS320F28068MPZP/PZ 0x008E TMS320F28068FPZP/PZ 0x008E TMS320F28068PFP/PN 0x008C TMS320F28068UPFP/PN 0x008D TMS320F28068MPFP/PN 0x008C TMS320F28068FPFP/PN 0x008C TMS320F28067PZP/PZ 0x008A TMS320F28067UPZP/PZ 0x008B TMS320F28067PFP/PN 0x0088 TMS320F28067UPFP/PN 0x0089 TMS320F28066PZP/PZ 0x0086 TMS320F28066UPZP/PZ 0x0087 TMS320F28066PFP/PN 0x0084 TMS320F28066UPFP/PN 0x0085 TMS320F28065PZP/PZ 0x007E TMS320F28065UPZP/PZ 0x007F TMS320F28065PFP/PN 0x007C TMS320F28065UPFP/PN 0x007D TMS320F28064PZP/PZ 0x006E TMS320F28064UPZP/PZ 0x006F TMS320F28064PFP/PN 0x006C TMS320F28064UPFP/PN 0x006D TMS320F28063PZP/PZ 0x006A TMS320F28063UPZP/PZ 0x006B TMS320F28063PFP/PN 0x0068 TMS320F28063UPFP/PN 0x0069 TMS320F28062PZP/PZ 0x0066 TMS320F28062UPZP/PZ 0x0067 TMS320F28062FPZP/PZ 0x0066 TMS320F28062PFP/PN 0x0064 TMS320F28062UPFP/PN 0x0065 TMS320F28062FPFP/PN 0x0064

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EALLOW

PROTECTED

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Table 6-10. Device Emulation Registers (continued)

NAME ADDRESS RANGE SIZE (×16) DESCRIPTION

CLASSID 0x0882 1 Class ID Register TMS320F28069 0x009F

TMS320F28069U 0x009F TMS320F28069M 0x009F TMS320F28069F 0x009F TMS320F28068 0x008F TMS320F28068U 0x008F TMS320F28068M 0x008F TMS320F28068F 0x008F TMS320F28067 0x008F TMS320F28067U 0x008F TMS320F28066 0x008F TMS320F28066U 0x008F TMS320F28065 0x007F TMS320F28065U 0x007F TMS320F28064 0x006F TMS320F28064U 0x006F TMS320F28063 0x006F TMS320F28063U 0x006F TMS320F28062 0x006F TMS320F28062U 0x006F TMS320F28062F 0x006F

REVID 0x0883 1 Revision ID Register 0x0000 - Silicon Rev. 0 - TMX

0x0002 - Silicon Rev. B - TMS

EALLOW

PROTECTED

No0x0001 - Silicon Rev. A - TMS

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6.5 VREG, BOR, POR

Although the core and I/O circuitry operate on two different voltages, these devices have an on-chip VREG to generate the VDDvoltage from the V

supply. This eliminates the cost and space of a second

DDIO

external regulator on an application board. Additionally, internal power-on reset (POR) and brown-out reset (BOR) circuits monitor both the VDDand V

rails during power-up and run mode.

DDIO

6.5.1 On-chip VREG

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A linear regulator generates the core voltage (VDD) from the V

supply. Therefore, although capacitors

DDIO

are required on each VDDpin to stabilize the generated voltage, power need not be supplied to these pins to operate the device. Conversely, the VREG can be disabled, should power or redundancy be the primary concern of the application.

6.5.1.1 Using the On-chip VREG

To use the on-chip VREG, the VREGENZ pin should be tied low and the appropriate recommended operating voltage should be supplied to the V

DDIO

and V

pins. In this case, the VDDvoltage needed by

DDA

the core logic will be generated by the VREG. Each VDDpin requires on the order of 1.2 μF (minimum) capacitance for proper regulation of the VREG. These capacitors should be located as close as possible to the VDDpins.

6.5.1.2 Disabling the On-chip VREG

To conserve power, it is also possible to disable the on-chip VREG and supply the core logic voltage to the VDDpins with a more efficient external regulator. To enable this option, the VREGENZ pin must be tied high.

6.5.2 On-chip Power-On Reset (POR) and Brown-Out Reset (BOR) Circuit

Two on-chip supervisory circuits, the power-on reset (POR) and the brown-out reset (BOR) remove the burden of monitoring the VDDand V to create a clean reset throughout the device during the entire power-up procedure. The trip point is a looser, lower trip point than the BOR, which watches for dips in the VDDor V operation. The POR function is present on both VDDand V up, the BOR function is present on V (VREGENZ pin is tied low). Both functions tie the XRS pin low when one of the voltages is below their respective trip point. Additionally, when the internal voltage regulator is enabled, an over-voltage protection circuit will tie XRS low if the VDDrail rises above its trip point. See Section 5 for the various trip points as well as the delay time for the device to release the XRS pin after the under-voltage or overvoltage condition is removed. Figure 6-9 shows the VREG, POR, and BOR. To disable both the VDDand V

BOR functions, a bit is provided in the BORCFG register. See the Systems Control and Interrupts

DDIO

chapter of the TMS320x2806x Piccolo Technical Reference Manual (SPRUH18) for details.

supply rails from the application board. The purpose of the POR is

DDIO

rails at all times. After initial device power-

DDIO

at all times, and on VDDwhen the internal VREG is enabled

DDIO

rail during device

DDIO

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I/O Pin

Out

DIR (0 = Input, 1 = Output)

(Force Hi-Z When High)

SYSRS

C28

Core

Sync

PLL

Clocking

Logic

MCLKRS

VREGHALT

Deglitch

Filter

On-Chip

Voltage

Regulator

(VREG)

VREGENZ

POR/BOR

Generating

Module

XRS

WDRST

SYSCLKOUT

WDRST

(A)

JTAG

TCK

Detect

Logic

PBRS

(B)

Internal Weak PU

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A. WDRST is the reset signal from the CPU-watchdog. B. PBRS is the reset signal from the POR/BOR module.

Figure 6-9. VREG + POR + BOR + Reset Signal Connectivity

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6.6 System Control

This section describes the oscillator and clocking mechanisms, the watchdog function and the low power modes.

Table 6-11. PLL, Clocking, Watchdog, and Low-Power Mode Registers

NAME ADDRESS SIZE (×16) DESCRIPTION

BORCFG 0x00 0985 1 BOR Configuration Register XCLK 0x00 7010 1 XCLKOUT Control PLLSTS 0x00 7011 1 PLL Status Register CLKCTL 0x00 7012 1 Clock Control Register PLLLOCKPRD 0x00 7013 1 PLL Lock Period INTOSC1TRIM 0x00 7014 1 Internal Oscillator 1 Trim Register INTOSC2TRIM 0x00 7016 1 Internal Oscillator 2 Trim Register PCLKCR2 0x00 7019 1 Peripheral Clock Control Register 2 LOSPCP 0x00 701B 1 Low-Speed Peripheral Clock Prescaler Register PCLKCR0 0x00 701C 1 Peripheral Clock Control Register 0 PCLKCR1 0x00 701D 1 Peripheral Clock Control Register 1 LPMCR0 0x00 701E 1 Low Power Mode Control Register 0 PCLKCR3 0x00 7020 1 Peripheral Clock Control Register 3 PLLCR 0x00 7021 1 PLL Control Register SCSR 0x00 7022 1 System Control and Status Register WDCNTR 0x00 7023 1 Watchdog Counter Register WDKEY 0x00 7025 1 Watchdog Reset Key Register WDCR 0x00 7029 1 Watchdog Control Register JTAGDEBUG 0x00 702A 1 JTAG Port Debug Register PLL2CTL 0x00 7030 1 PLL2 Configuration Register PLL2MULT 0x00 7032 1 PLL2 Multiplier Register PLL2STS 0x00 7034 1 PLL2 Lock Status Register SYSCLK2CNTR 0x00 7036 1 SYSCLK2 Clock Counter Register EPWMCFG 0x00 703A 1 ePWM DMA/CLA Configuration Register

(1) All registers in this table are EALLOW protected.

(1)

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LOSPCP

(System Ctrl Regs)

Peripheral

Registers

SPI-A, SPI-B, SCI-A, SCI-B

PF2

LSPCLK

SYSCLKOUT

C28x Core

CLKIN

Peripheral

Registers

USB

PF3

GPIO

Mux

LOSPCP

(System Ctrl Regs)

Peripheral

Registers

McBSP

PF3

LSPCLK

Peripheral

Registers

eCAN-A

PF1

Peripheral

Registers

eCAP1, eCAP2, eCAP3

eQEP1, eQEP2

PF3

Peripheral

Registers

ePWM1, ePWM2,

ePWM3, ePWM4, ePWM5,

ePWM6, ePWM7, ePWM8

PF3

Peripheral

Registers

I2C-A

PF2

Peripheral

Registers

HRCAP1, HRCAP2,

HRCAP3, HRCAP4

PF1

ADC

Registers

12-Bit ADC16 Ch

PF2

PF0

COMP

Registers

COMP1, COMP2, COMP3

PF3

Analog

GPIO

Mux

PCLKCR0/1/2/3

(System Ctrl Regs)

Clock Enables

PLL2

I/O

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Figure 6-10 shows the various clock domains that are discussed. Figure 6-11 shows the various clock

sources (both internal and external) that can provide a clock for device operation.

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A. CLKIN is the clock into the CPU. CLKIN is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same

frequency as SYSCLKOUT).

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Figure 6-10. Clock and Reset Domains

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INTOSC1TRIM Reg

(A)

Internal

OSC 1

(10 MHz)

OSCE

CLKCTL[INTOSC1OFF]

WAKEOSC

CLKCTL[INTOSC1HALT]

INTOSC2TRIM Reg

(A)

Internal

OSC 2

(10 MHz)

OSCE

CLKCTL[INTOSC2OFF]

CLKCTL[INTOSC2HALT]

1 = Turn OSC Off

1 = Ignore HALT

1 = Turn OSC Off

1 = Ignore HALT

XCLK[XCLKINSEL]

0 = GPIO38 1 = GPIO19

GPIO19

GPIO38

CLKCTL[XCLKINOFF]

(Crystal)

OSC

XCLKIN

CLKCTL[XTALOSCOFF]

0 = OSC on (default on reset) 1 = Turn OSC off

OSC1CLK

OSCCLKSRC1

WDCLK

OSC2CLK

CLKCTL[WDCLKSRCSEL]

(OSC1CLK on reset)XRS

CLKCTL[OSCCLKSRCSEL]

CLKCTL[TRM2CLKPRESCALE]

CLKCTL[TMR2CLKSRCSEL]

OSCCLKSRC2

Prescale

/1, /2, /4,

/8, /16

01, 10, 11 CPUTMR2CLK

SYNC

Edge

Detect

CLKCTL[OSCCLKSRC2SEL]

SYSCLKOUT

WAKEOSC

(Oscillators enabled when this signal is high)

EXTCLK

XTAL

XCLKIN

(OSC1CLK on reset)XRS

OSCCLK

PLL

Missing-Clock-Detect Circuit

(B)

CPU-Watchdog

PLL2CTL.PLL2CLKSRCSEL

PLL2CTL.PLL2EN

SYSCLK2 to

USB and

HRCAP Blocks

PLL2

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A. Register loaded from TI OTP-based calibration function. B. See Section 6.6.5 for details on missing clock detection.

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Figure 6-11. Clock Tree

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X2X1

Crystal

XCLKIN/GPIO19/38

Turn off

XCLKIN path

in CLKCTL

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6.6.1 Internal Zero Pin Oscillators

The F2806x devices contain two independent internal zero pin oscillators. By default both oscillators are turned on at power up, and internal oscillator 1 is the default clock source at this time. For power savings, unused oscillators may be powered down by the user. The center frequency of these oscillators is determined by their respective oscillator trim registers, written to in the calibration routine as part of the boot ROM execution. See Section 6.9 for more information on these oscillators.

6.6.2 Crystal Oscillator Option

The on-chip crystal oscillator X1 and X2 pins are 1.8-V level signals and must never have 3.3-V level signals applied to them. If a system 3.3-V external oscillator is to be used as a clock source, it should be connected to the XCLKIN pin only. The X1 pin is not intended to be used as a single-ended clock input, it should be used with X2 and a crystal.

The typical specifications for the external quartz crystal (fundamental mode, parallel resonant) are listed in

Table 6-12. Furthermore, ESR range = 30 to 150 Ω.

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Table 6-12. Typical Specifications for External Quartz Crystal

FREQUENCY (MHz) Rd(Ω) CL1(pF) CL2(pF)

5 2200 18 18 10 470 15 15 15 0 15 15 20 0 12 12

(1) C

should be less than or equal to 5 pF.

shunt

(1)

Figure 6-12. Using the On-chip Crystal Oscillator

NOTE

1. CL1and CL2are the total capacitance of the circuit board and components excluding the IC and crystal. The value is usually approximately twice the value of the load capacitance of the crystal.

2. The load capacitance of the crystal is described in the crystal specifications of the manufacturers.

3. TI recommends that customers have the resonator/crystal vendor characterize the operation of their device with the MCU chip. The resonator/crystal vendor has the equipment and expertise to tune the tank circuit. The vendor can also advise the customer regarding the proper tank component values that will produce proper start up and stability over the entire operating range.

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External Clock Signal

(Toggling 0−V

DDIO

)

XCLKIN/GPIO19/38

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Figure 6-13. Using a 3.3-V External Oscillator

6.6.3 PLL-Based Clock Module

The devices have an on-chip, PLL-based clock module. This module provides all the necessary clocking signals for the device, as well as control for low-power mode entry. The PLL has a 5-bit ratio control PLLCR[DIV] to select different CPU clock rates. The watchdog module should be disabled before writing to the PLLCR register. The watchdog module can be re-enabled (if need be) after the PLL module has stabilized, which takes 1 ms. The input clock and PLLCR[DIV] bits should be chosen in such a way that the output frequency of the PLL (VCOCLK) is at least 50 MHz.

Table 6-13. PLL Settings

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PLLCR[DIV] VALUE

00000 (PLL bypass) OSCCLK/4 (Default)

00001 (OSCCLK * 1)/4 (OSCCLK * 1)/2 (OSCCLK * 1)/1 00010 (OSCCLK * 2)/4 (OSCCLK * 2)/2 (OSCCLK * 2)/1 00011 (OSCCLK * 3)/4 (OSCCLK * 3)/2 (OSCCLK * 3)/1 00100 (OSCCLK * 4)/4 (OSCCLK * 4)/2 (OSCCLK * 4)/1 00101 (OSCCLK * 5)/4 (OSCCLK * 5)/2 (OSCCLK * 5)/1 00110 (OSCCLK * 6)/4 (OSCCLK * 6)/2 (OSCCLK * 6)/1 00111 (OSCCLK * 7)/4 (OSCCLK * 7)/2 (OSCCLK * 7)/1 01000 (OSCCLK * 8)/4 (OSCCLK * 8)/2 (OSCCLK * 8)/1 01001 (OSCCLK * 9)/4 (OSCCLK * 9)/2 (OSCCLK * 9)/1 01010 (OSCCLK * 10)/4 (OSCCLK * 10)/2 (OSCCLK * 10)/1 01011 (OSCCLK * 11)/4 (OSCCLK * 11)/2 (OSCCLK * 11)/1 01100 (OSCCLK * 12)/4 (OSCCLK * 12)/2 (OSCCLK * 12)/1 01101 (OSCCLK * 13)/4 (OSCCLK * 13)/2 (OSCCLK * 13)/1 01110 (OSCCLK * 14)/4 (OSCCLK * 14)/2 (OSCCLK * 14)/1 01111 (OSCCLK * 15)/4 (OSCCLK * 15)/2 (OSCCLK * 15)/1 10000 (OSCCLK * 16)/4 (OSCCLK * 16)/2 (OSCCLK * 16)/1 10001 (OSCCLK * 17)/4 (OSCCLK * 17)/2 (OSCCLK * 17)/1 10010 (OSCCLK * 18)/4 (OSCCLK * 18)/2 (OSCCLK * 18)/1

(1) The PLL control register (PLLCR) and PLL Status Register (PLLSTS) are reset to their default state by the XRS signal or a watchdog

reset only. A reset issued by the debugger or the missing clock detect logic has no effect.

(2) This register is EALLOW protected. See the Systems Control and Interrupts chapter of the TMS320x2806x Piccolo Technical Reference

Manual (SPRUH18) for more information.

(3) By default, PLLSTS[DIVSEL] is configured for /4. (The boot ROM changes this to /1.) PLLSTS[DIVSEL] must be 0 before writing to the

PLLCR and should be changed only after PLLSTS[PLLLOCKS] = 1.

(1) (2)

PLLSTS[DIVSEL] = 0 or 1

(1)

(3)

SYSCLKOUT (CLKIN)

PLLSTS[DIVSEL] = 2 PLLSTS[DIVSEL] = 3

OSCCLK/2 OSCCLK

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Table 6-14. CLKIN Divide Options

PLLSTS [DIVSEL] CLKIN DIVIDE

0 /4 1 /4 2 /2 3 /1

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The PLL-based clock module provides four modes of operation:

• INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1. This can provide

• INTOSC2 (Internal Zero-pin Oscillator 2): This is the on-chip internal oscillator 2. This can provide

• Crystal/Resonator Operation: The on-chip (crystal) oscillator enables the use of an external

• External Clock Source Operation: If the on-chip (crystal) oscillator is not used, this mode allows it to

Before changing clock sources, ensure that the target clock is present. If a clock is not present, then that clock source must be disabled (using the CLKCTL register) before switching clocks.

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the clock for the Watchdog block, core and CPU-Timer 2

the clock for the Watchdog block, core and CPU-Timer 2. Both INTOSC1 and INTOSC2 can be independently chosen for the Watchdog block, core and CPU-Timer 2.

crystal/resonator attached to the device to provide the time base. The crystal/resonator is connected to the X1/X2 pins. Some devices may not have the X1/X2 pins. See Table 4-1 for details.

be bypassed. The device clocks are generated from an external clock source input on the XCLKIN pin. Note that the XCLKIN is multiplexed with GPIO19 or GPIO38 pin. The XCLKIN input can be selected as GPIO19 or GPIO38 through the XCLKINSEL bit in XCLK register. The CLKCTL[XCLKINOFF] bit disables this clock input (forced low). If the clock source is not used or the respective pins are used as GPIOs, the user should disable at boot time.

Table 6-15. Possible PLL Configuration Modes

PLL MODE REMARKS PLLSTS[DIVSEL] CLKIN AND SYSCLKOUT

PLL Off Invoked by the user setting the PLLOFF bit in the PLLSTS register. The

PLL block is disabled in this mode. This can be useful to reduce system noise and for low power operation. The PLLCR register must first be set to 0x0000 (PLL Bypass) before entering this mode. The CPU clock (CLKIN) is derived directly from the input clock on either X1/X2, X1 or XCLKIN.

PLL Bypass PLL Bypass is the default PLL configuration upon power-up or after an

external reset (XRS). This mode is selected when the PLLCR register is set to 0x0000 or while the PLL locks to a new frequency after the PLLCR register has been modified. In this mode, the PLL itself is bypassed but the PLL is not turned off.

PLL Enable Achieved by writing a non-zero value n into the PLLCR register. Upon

writing to the PLLCR the device will switch to PLL Bypass mode until the PLL locks.

0, 1 OSCCLK/4

2 OSCCLK/2 3 OSCCLK/1

0, 1 OSCCLK/4

2 OSCCLK/2 3 OSCCLK/1

0, 1 OSCCLK * n/4

2 OSCCLK * n/2 3 OSCCLK * n/1

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6.6.4 USB and HRCAP PLL Module (PLL2)

In addition to the main system PLL, these devices also contain a second PLL (PLL2) which can be used to clock the USB and HRCAP peripherals. The PLL supports multipliers of 1 to 15 and has a fixed divide-bytwo on its output.

PLL2 may be clocked from the following three sources by modifying the PLL2CLKSRCSEL bits appropriately in the PLL2CTL register:

• INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1 and provides a 10MHz clock. If used as a clock source for HRCAP, the oscillator compensation routine should be called frequently. Because of accuracy requirements, INTOSC1 cannot be used as a clock source for the USB.

• Crystal/Resonator Operation: The (crystal) oscillator enables the use of an external crystal or resonator attached to the device to provide the time base. The crystal or resonator is connected to the X1/X2 pins.

• External Clock Source Operation: This mode allows the reference clock to be derived from an external single-ended clock source connected to either GPIO19 or GPIO38. The XCLKINSEL bit in the XCLK register should be set appropriately to enable the selected GPIO to drive XCLKIN.

NOTE

For proper operation of the USB module, PLL2 should be configured to generate a 120-MHz clock. This will be divided by two to yield the desired 60 MHz for the USB peripheral.

HRCAP supports a maximum clock input frequency of 120 MHz.

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NMIFLG[NMINT]

Generate

Interrupt

Pulse When

Input = 1

NMINT

Latch

Clear

Set

Clear

NMIFLGCLR[NMINT]

XRS

NMICFG[CLOCKFAIL]

Latch

Clear

Set

Clear

XRS

NMIFLG[CLOCKFAIL]

NMI Watchdog

SYSCLKOUT

SYSRS

NMIRS

NMIWDPRD[15:0] NMIWDCNT[15:0]

NMIFLGCLR[CLOCKFAIL]

SYNC?

NMIFLGFRC[CLOCKFAIL]

SYSCLKOUT

See System

Control Section

CLOCKFAIL

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6.6.5 Loss of Input Clock (NMI Watchdog Function)

The 2806x devices may be clocked from either one of the internal zero-pin oscillators (INTOSC1/INTOSC2), the on-chip crystal oscillator, or from an external clock input. Regardless of the clock source, in PLL-enabled and PLL-bypass mode, if the input clock to the PLL vanishes, the PLL will issue a limp-mode clock at its output. This limp-mode clock continues to clock the CPU and peripherals at a typical frequency of 1–5 MHz.

When the limp mode is activated, a CLOCKFAIL signal is generated that is latched as an NMI interrupt. Depending on how the NMIRESETSEL bit has been configured, a reset to the device can be fired immediately or the NMI watchdog counter can issue a reset when it overflows. In addition to this, the Missing Clock Status (MCLKSTS) bit is set. The NMI interrupt could be used by the application to detect the input clock failure and initiate necessary corrective action such as switching over to an alternative clock source (if available) or initiate a shut-down procedure for the system.

If the software does not respond to the clock-fail condition, the NMI watchdog triggers a reset after a preprogrammed time interval. Figure 6-14 shows the interrupt mechanisms involved.

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6.6.6 CPU-Watchdog Module

The CPU-watchdog module on the 2806x device is similar to the one used on the 281x/280x/283xx devices. This module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit watchdog up counter has reached its maximum value. To prevent this, the user must disable the counter or the software must periodically write a 0x55 + 0xAA sequence into the watchdog key register that resets the watchdog counter. Figure 6-15 shows the various functional blocks within the watchdog module.

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Figure 6-14. NMI-Watchdog

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/512

WDCLK

WDCR (WDPS[2:0])

WDCLK

WDCNTR(7:0)

WDKEY(7:0)

Good Key

1 0 1

WDCR (WDCHK[2:0])

Bad WDCHK Key

WDCR (WDDIS)

Clear Counter

SCSR (WDENINT)

Watchdog Prescaler

Generate

Output Pulse

(512 OSCCLKs)

8-Bit

Watchdog

Counter

CLR

WDRST

WDINT

Watchdog

55 + AA

Key Detector

XRS

Core-reset

WDRST

(A)

Internal

Pullup

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Normally, when the input clocks are present, the CPU-watchdog counter decrements to initiate a CPUwatchdog reset or WDINT interrupt. However, when the external input clock fails, the CPU-watchdog counter stops decrementing (that is, the watchdog counter does not change with the limp-mode clock).

NOTE

The CPU-watchdog is different from the NMI watchdog. The CPU-watchdog is the legacy watchdog that is present in all 28x devices.

NOTE

Applications in which the correct CPU operating frequency is absolutely critical should implement a mechanism by which the MCU will be held in reset, should the input clocks ever fail. For example, an R-C circuit may be used to trigger the XRS pin of the MCU, should the capacitor ever get fully charged. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from getting fully charged. Such a circuit would also help in detecting failure of the flash memory.

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A. The WDRST signal is driven low for 512 OSCCLK cycles.

The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode. In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains

functional is the CPU-watchdog. This module will run off OSCCLK. The WDINT signal is fed to the LPM block so that it can wake the device from STANDBY (if enabled). See Section 6.7 for more details.

In IDLE mode, the WDINT signal can generate an interrupt to the CPU, through the PIE, to take the CPU

out of IDLE mode. In HALT mode, the CPU-watchdog can be used to wake up the device through a device reset.

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Figure 6-15. CPU-Watchdog Module

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6.7 Low-power Modes Block

Table 6-16 summarizes the various modes.

Table 6-16. Low-power Modes

MODE LPMCR0(1:0) OSCCLK CLKIN SYSCLKOUT EXIT

IDLE 00 On On On

STANDBY 01

(3)

HALT

(1) The Exit column lists which signals or under what conditions the low power mode is exited. A low signal, on any of the signals, exits the

low power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise, the low-power

mode will not be exited and the device will go back into the indicated low power mode. (2) The JTAG port can still function even if the CPU clock (CLKIN) is turned off. (3) The WDCLK must be active for the device to go into HALT mode.

(CPU-watchdog still running)

(on-chip crystal oscillator and

PLL turned off, zero-pin oscillator

and CPU-watchdog state

dependent on user code.)

Off

Off Off

XRS, CPU-watchdog interrupt, any enabled interrupt

XRS, CPU-watchdog interrupt, GPIO Port A signal, debugger

XRS, GPIO Port A signal, debugger CPU-watchdog

The various low-power modes operate as follows:

(1)

(2)

IDLE Mode: This mode is exited by any enabled interrupt that is recognized by the

processor. The LPM block performs no tasks during this mode as long as the LPMCR0(LPM) bits are set to 0,0.

STANDBY Mode: Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY

mode. The user must select which signals will wake the device in the GPIOLPMSEL register. The selected signals are also qualified by the OSCCLK before waking the device. The number of OSCCLKs is specified in the LPMCR0 register.

HALT Mode: CPU-watchdog, XRS, and any GPIO port A signal (GPIO[31:0]) can wake

the device from HALT mode. The user selects the signal in the GPIOLPMSEL register.

NOTE

The low-power modes do not affect the state of the output pins (PWM pins included). They will be in whatever state the code left them in when the IDLE instruction was executed. See the Systems Control and Interrupts chapter of the TMS320x2806x Piccolo Technical Reference Manual (SPRUH18) for more details.

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Watchdog

XINT1

XINT2

GPIO

MUX

WDINT

INT1

INT12

NMI

Low-Power Modes

LPMINT

WAKEINT

Sync

SYSCLKOUT

M U X

XINT2

M U X

XINT3

ADC

XINT2SOC

GPIOXINT1SEL[4:0]

GPIOXINT2SEL[4:0]

M U X

XINT3

System Control

(See the System Control section.)

INT14

INT13

GPIO0.int

GPIO31.int

DMA

clear

DMA

PIE

Up to 96 Interrupts

DMA

TOUT1

TINT0

TINT2

TINT1

Flash Wrapper

GPIOXINT3SEL[4:0]

M U X

NMI Interrupt With Watchdog Function

(See the NMI Watchdog section.)

NMIRS

GPIO0.int

GPIO31.int

CLOCKFAIL

CPUTMR2CLK

DMA

C28x Core

Peripherals

(USB, McBSP, ePWM, ADC)

Peripherals

(SPI, SCI, I C, eCAN, eCAP, eQEP,

HRCAP, CLA)

Interrupt Control

XINT1CR[15:0]

XINT1CTR[15:0]

XINT2CTR[15:0]

Interrupt Control

XINT2CR[15:0]

Interrupt Control

XINT3CR[15:0]

XINT3CTR[15:0]

CPU TIMER 0

CPU TIMER 1

CPU TIMER 2

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6.8 Interrupts

Figure 6-16 shows how the various interrupt sources are multiplexed.

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Figure 6-16. External and PIE Interrupt Sources

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INT12

MUX

INT11

INT2

INT1

CPU

(Enable)(Flag)

INTx

INTx.8

PIEIERx[8:1] PIEIFRx[8:1]

MUX

INTx.7

INTx.6

INTx.5

INTx.4

INTx.3

INTx.2

INTx.1

From

Peripherals

External

Interrupts

(Enable) (Flag)

IER[12:1]IFR[12:1]

Global

Enable

INTM

PIEACKx

(Enable/Flag)

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Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with 8 interrupts per group equals 96 possible interrupts. Table 6-17 shows the interrupts used by 2806x devices.

The TRAP #VectorNumber instruction transfers program control to the interrupt service routine corresponding to the vector specified. TRAP #0 attempts to transfer program control to the address pointed to by the reset vector. The PIE vector table does not, however, include a reset vector. Therefore, TRAP #0 should not be used when the PIE is enabled. Doing so will result in undefined behavior.

When the PIE is enabled, TRAP #1 through TRAP #12 will transfer program control to the interrupt service routine corresponding to the first vector within the PIE group. For example: TRAP #1 fetches the vector from INT1.1, TRAP #2 fetches the vector from INT2.1, and so forth.

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Figure 6-17. Multiplexing of Interrupts Using the PIE Block

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Table 6-17. PIE MUXed Peripheral Interrupt Vector Table

INTx.8 INTx.7 INTx.6 INTx.5 INTx.4 INTx.3 INTx.2 INTx.1

INT1.y WAKEINT TINT0 ADCINT9 XINT2 XINT1 Reserved ADCINT2 ADCINT1

(LPM/WD) (TIMER 0) (ADC) Ext. int. 2 Ext. int. 1 – (ADC) (ADC)

0xD4E 0xD4C 0xD4A 0xD48 0xD46 0xD44 0xD42 0xD40

INT2.y EPWM8_TZINT EPWM7_TZINT EPWM6_TZINT EPWM5_TZINT EPWM4_TZINT EPWM3_TZINT EPWM2_TZINT EPWM1_TZINT

(ePWM8) (ePWM7) (ePWM6) (ePWM5) (ePWM4) (ePWM3) (ePWM2) (ePWM1)

0xD5E 0xD5C 0xD5A 0xD58 0xD56 0xD54 0xD52 0xD50

INT3.y EPWM8_INT EPWM7_INT EPWM6_INT EPWM5_INT EPWM4_INT EPWM3_INT EPWM2_INT EPWM1_INT

(ePWM8) (ePWM7) (ePWM6) (ePWM5) (ePWM4) (ePWM3) (ePWM2) (ePWM1)

0xD6E 0xD6C 0xD6A 0xD68 0xD66 0xD64 0xD62 0xD60

INT4.y HRCAP2_INT HRCAP1_INT Reserved Reserved Reserved ECAP3_INT ECAP2_INT ECAP1_INT

(HRCAP2) (HRCAP1) – – – (eCAP3) (eCAP2) (eCAP1)

0xD7E 0xD7C 0xD7A 0xD78 0xD76 0xD74 0xD72 0xD70

INT5.y USB0_INT Reserved Reserved HRCAP4_INT HRCAP3_INT Reserved EQEP2_INT EQEP1_INT

(USB0) – – (HRCAP4) (HRCAP3) – (eQEP2) (eQEP1) 0xD8E 0xD8C 0xD8A 0xD88 0xD86 0xD84 0xD82 0xD80

INT6.y Reserved Reserved MXINTA MRINTA SPITXINTB SPIRXINTB SPITXINTA SPIRXINTA

– – (McBSP-A) (McBSP-A) (SPI-B) (SPI-B) (SPI-A) (SPI-A)

0xD9E 0xD9C 0xD9A 0xD98 0xD96 0xD94 0xD92 0xD90

INT7.y Reserved Reserved DINTCH6 DINTCH5 DINTCH4 DINTCH3 DINTCH2 DINTCH1

– – (DMA) (DMA) (DMA) (DMA) (DMA) (DMA)

0xDAE 0xDAC 0xDAA 0xDA8 0xDA6 0xDA4 0xDA2 0xDA0

INT8.y Reserved Reserved Reserved Reserved Reserved Reserved I2CINT2A I2CINT1A

– – – – – – (I2C-A) (I2C-A)

0xDBE 0xDBC 0xDBA 0xDB8 0xDB6 0xDB4 0xDB2 0xDB0

INT9.y Reserved Reserved ECAN1_INTA ECAN0_INTA SCITXINTB SCIRXINTB SCITXINTA SCIRXINTA

– – (CAN-A) (CAN-A) (SCI-B) (SCI-B) (SCI-A) (SCI-A)

0xDCE 0xDCC 0xDCA 0xDC8 0xDC6 0xDC4 0xDC2 0xDC0

INT10.y ADCINT8 ADCINT7 ADCINT6 ADCINT5 ADCINT4 ADCINT3 ADCINT2 ADCINT1

(ADC) (ADC) (ADC) (ADC) (ADC) (ADC) (ADC) (ADC)

0xDDE 0xDDC 0xDDA 0xDD8 0xDD6 0xDD4 0xDD2 0xDD0

INT11.y CLA1_INT8 CLA1_INT7 CLA1_INT6 CLA1_INT5 CLA1_INT4 CLA1_INT3 CLA1_INT2 CLA1_INT1

(CLA) (CLA) (CLA) (CLA) (CLA) (CLA) (CLA) (CLA)

0xDEE 0xDEC 0xDEA 0xDE8 0xDE6 0xDE4 0xDE2 0xDE0

INT12.y LUF LVF Reserved Reserved Reserved Reserved Reserved XINT3

(CLA) (CLA) – – – – – Ext. Int. 3

0xDFE 0xDFC 0xDFA 0xDF8 0xDF6 0xDF4 0xDF2 0xDF0

(1)

(1) Out of 96 possible interrupts, some interrupts are not used. These interrupts are reserved for future devices. These interrupts can be

used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group is being used by a

peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while modifying the PIEIFR.

To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts:

• No peripheral within the group is asserting interrupts.

• No peripheral interrupts are assigned to the group (for example, PIE group 7).

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Table 6-18. PIE Configuration and Control Registers

NAME ADDRESS SIZE (×16) DESCRIPTION

PIECTRL 0x0CE0 1 PIE, Control Register PIEACK 0x0CE1 1 PIE, Acknowledge Register PIEIER1 0x0CE2 1 PIE, INT1 Group Enable Register PIEIFR1 0x0CE3 1 PIE, INT1 Group Flag Register PIEIER2 0x0CE4 1 PIE, INT2 Group Enable Register PIEIFR2 0x0CE5 1 PIE, INT2 Group Flag Register PIEIER3 0x0CE6 1 PIE, INT3 Group Enable Register PIEIFR3 0x0CE7 1 PIE, INT3 Group Flag Register PIEIER4 0x0CE8 1 PIE, INT4 Group Enable Register PIEIFR4 0x0CE9 1 PIE, INT4 Group Flag Register PIEIER5 0x0CEA 1 PIE, INT5 Group Enable Register PIEIFR5 0x0CEB 1 PIE, INT5 Group Flag Register PIEIER6 0x0CEC 1 PIE, INT6 Group Enable Register PIEIFR6 0x0CED 1 PIE, INT6 Group Flag Register PIEIER7 0x0CEE 1 PIE, INT7 Group Enable Register PIEIFR7 0x0CEF 1 PIE, INT7 Group Flag Register PIEIER8 0x0CF0 1 PIE, INT8 Group Enable Register PIEIFR8 0x0CF1 1 PIE, INT8 Group Flag Register PIEIER9 0x0CF2 1 PIE, INT9 Group Enable Register PIEIFR9 0x0CF3 1 PIE, INT9 Group Flag Register PIEIER10 0x0CF4 1 PIE, INT10 Group Enable Register PIEIFR10 0x0CF5 1 PIE, INT10 Group Flag Register PIEIER11 0x0CF6 1 PIE, INT11 Group Enable Register PIEIFR11 0x0CF7 1 PIE, INT11 Group Flag Register PIEIER12 0x0CF8 1 PIE, INT12 Group Enable Register PIEIFR12 0x0CF9 1 PIE, INT12 Group Flag Register Reserved 0x0CFA –

0x0CFF

(1) The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector table

is protected.

6 Reserved

(1)

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XINT1, XINT2, XINT3

w(INT)

Interrupt Vector

d(INT)

Address bus

(internal)

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6.8.1 External Interrupts

Table 6-19. External Interrupt Registers

NAME ADDRESS SIZE (×16) DESCRIPTION

XINT1CR 0x00 7070 1 XINT1 configuration register XINT2CR 0x00 7071 1 XINT2 configuration register XINT3CR 0x00 7072 1 XINT3 configuration register XINT1CTR 0x00 7078 1 XINT1 counter register XINT2CTR 0x00 7079 1 XINT2 counter register XINT3CTR 0x00 707A 1 XINT3 counter register

Each external interrupt can be enabled or disabled or qualified using positive, negative, or both positive and negative edge. For more information, see the Systems Control and Interrupts chapter of the TMS320x2806x Piccolo Technical Reference Manual (SPRUH18).

6.8.1.1 External Interrupt Electrical Data/Timing

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Table 6-20. External Interrupt Timing Requirements

(2)

w(INT)

(1) For an explanation of the input qualifier parameters, see Table 6-76. (2) This timing is applicable to any GPIO pin configured for ADCSOC functionality.

Pulse duration, INT input low/high

Synchronous 1t With qualifier 1t

Table 6-21. External Interrupt Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

d(INT)

(1) For an explanation of the input qualifier parameters, see Table 6-76.

Delay time, INT low/high to interrupt-vector fetch t

Figure 6-18. External Interrupt Timing

(1)

c(SCO)

MIN MAX UNIT

c(SCO)

+ t

w(IQSW)

(1)

+ 12t

w(IQSW)

c(SCO)

cycles cycles

cycles

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6.9 Peripherals

6.9.1 Control Law Accelerator (CLA) Overview

The control law accelerator extends the capabilities of the C28x CPU by adding parallel processing. Timecritical control loops serviced by the CLA can achieve low ADC sample to output delay. Thus, the CLA enables faster system response and higher frequency control loops. Using the CLA for time-critical tasks frees up the main CPU to perform other system and communication functions concurently. The following is a list of major features of the CLA.

• Clocked at the same rate as the main CPU (SYSCLKOUT).

• An independent architecture allowing CLA algorithm execution independent of the main C28x CPU. – Complete bus architecture:

• Program address bus and program data bus

• Data address bus, data read bus, and data write bus – Independent eight-stage pipeline. – 12-bit program counter (MPC) – Four 32-bit result registers (MR0–MR3) – Two 16-bit auxillary registers (MAR0, MAR1) – Status register (MSTF)

• Instruction set includes: – IEEE single-precision (32-bit) floating-point math operations – Floating-point math with parallel load or store – Floating-point multiply with parallel add or subtract – 1/X and 1/sqrt(X) estimations – Data type conversions. – Conditional branch and call – Data load and store operations

• The CLA program code can consist of up to eight tasks or interrupt service routines. – The start address of each task is specified by the MVECT registers. – No limit on task size as long as the tasks fit within the CLA program memory space. – One task is serviced at a time through to completion. There is no nesting of tasks. – Upon task completion, a task-specific interrupt is flagged within the PIE. – When a task finishes, the next highest-priority pending task is automatically started.

• Task trigger mechanisms: – C28x CPU through the IACK instruction – Task1 to Task7: the corresponding ADC, ePWM, eQEP, or eCAP module interrupt. For example:

• Task1: ADCINT1 or EPWM1_INT

• Task2: ADCINT2 or EPWM2_INT

• Task4: ADCINT4 or EPWM4_INT or EQEPx_INT or ECAPx_INT

• Task7: ADCINT7 or EPWM7_INT or EQEPx_INT or ECAPx_INT

– Task8: ADCINT8 or by CPU Timer 0 or EQEPx_INT or ECAPx_INT.

• Memory and Shared Peripherals: – Two dedicated message RAMs for communication between the CLA and the main CPU. – The C28x CPU can map CLA program and data memory to the main CPU space or CLA space. – The CLA has direct access to the ADC Result registers, comparator registers, and the eCAP, eQEP, and

ePWM+HRPWM registers.

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CLA_INT1 to CLA_INT8

MVECT1 MVECT2

MPERINT1

MPERINT8

PIE

Main

28x

CPU

CLA

Program

Memory

MMEMCFG

MCTL

MIFR

MIER

MIFRC

MIRUN

MIOVF MICLR

MICLROVF

MPISRCSEL1

MVECT3 MVECT4 MVECT5 MVECT6 MVECT7 MVECT8

ain CP U B US

INT11 INT12

Peripheral Interrupts

ADCINT1 to ADCINT8

ECAP1_INT to ECAP3_INT

EQEP1_INT and EQEP2_INT

EPWM1_INT to EPWM8_INT

CPU Timer 0

Map to CLA or

CPU Space

CLA

Data

Memory

Comparator

Registers

eCAP

Registers

eQEP

Registers

ePWM

and

HRPWM

Registers

ADC

Result

Registers

CLA

Shared

Message

RAMs

Main CPU Read/Write Data Bus

CLA Program Address Bus

CLA Program Data Bus

Map to CLA or

CPU Space

CLA Data Bus

Main CPU Bus

MR0(32)

MPC(12)

MR1(32)

MR3(32)

MAR0(32)

MSTF(32)

MR2(32)

MAR1(32)

CLA Data Read Address Bus

CLA Data Write Data Bus

CLA Data Write Address Bus

CLA Data Read Data Bus

MEALLOW

Main CPU Read Data Bus

CLA Execution

Registers

CLA Control

Registers

SYSCLKOUT

CLAENCLK

SYSRS

LVF

LUF

IACK

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Figure 6-19. CLA Block Diagram

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Table 6-22. CLA Control Registers

CLA1

ADDRESS

SIZE (×16)

EALLOW

PROTECTED

DESCRIPTION

(1)

MVECT1 0x1400 1 Yes CLA Interrupt/Task 1 Start Address MVECT2 0x1401 1 Yes CLA Interrupt/Task 2 Start Address MVECT3 0x1402 1 Yes CLA Interrupt/Task 3 Start Address MVECT4 0x1403 1 Yes CLA Interrupt/Task 4 Start Address MVECT5 0x1404 1 Yes CLA Interrupt/Task 5 Start Address MVECT6 0x1405 1 Yes CLA Interrupt/Task 6 Start Address MVECT7 0x1406 1 Yes CLA Interrupt/Task 7 Start Address MVECT8 0x1407 1 Yes CLA Interrupt/Task 8 Start Address MCTL 0x1410 1 Yes CLA Control Register MMEMCFG 0x1411 1 Yes CLA Memory Configure Register MPISRCSEL1 0x1414 2 Yes Peripheral Interrupt Source Select Register 1 MIFR 0x1420 1 Yes Interrupt Flag Register MIOVF 0x1421 1 Yes Interrupt Overflow Register MIFRC 0x1422 1 Yes Interrupt Force Register MICLR 0x1423 1 Yes Interrupt Clear Register MICLROVF 0x1424 1 Yes Interrupt Overflow Clear Register MIER 0x1425 1 Yes Interrupt Enable Register MIRUN 0x1426 1 Yes Interrupt RUN Register MIPCTL 0x1427 1 Yes Interrupt Priority Control Register

(2)

MPC MAR0 MAR1 MSTF MR0 MR1 MR2 MR3

(2) (2)

(2) (2) (2) (2) (2)

0x1428 1 – CLA Program Counter 0x142A 1 – CLA Aux Register 0 0x142B 1 – CLA Aux Register 1 0x142E 2 – CLA STF Register 0x1430 2 – CLA R0H Register 0x1434 2 – CLA R1H Register 0x1438 2 – CLA R2H Register 0x143C 2 – CLA R3H Register

(1) All registers in this table are CSM protected (2) The main C28x CPU has read only access to this register for debug purposes. The main CPU cannot perform CPU or debugger writes

to this register.

ADDRESS RANGE SIZE (×16) DESCRIPTION

0x1480 – 0x14FF 128 CLA to CPU Message RAM 0x1500 – 0x157F 128 CPU to CLA Message RAM

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Table 6-23. CLA Message RAM

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100-Pin

80-Pin

VDDA

VREFLO

Tied To

VSSA

VREFLO

VREFHI

VREFHI Tied To

(3.3 V) VDDA (Agnd) VSSA

VREFLO

Diff

Interface Reference

Comp1

VREFHI

A0 B0

AIO2

AIO10

A1 B1

10-Bit

DAC

COMP1OUT

A3 B3

AIO4

AIO12

Comp2

10-Bit

DAC

COMP2OUT

Comp3

10-Bit

DAC

COMP3OUT

ADC

AIO6

AIO14

A7 B7

Simultaneous Sampling Channels

Signal Pinout

Temperature Sensor

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6.9.2 Analog Block

A 12-bit ADC core is implemented that has different timings than the 12-bit ADC used on the F280x and F2833x devices. The ADC wrapper is modified to incorporate the new timings and also other enhancements to improve the timing control of start of conversions. Figure 6-20 shows the interaction of the analog module with the rest of the F2806x system.

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Figure 6-20. Analog Pin Configurations

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0,ValueDigital =

V0inputwhen £

VoltageAnalogInput

4096ValueDigital

REFLOREFHI

REFLO

´=

inputV0when

REFHI

4095,ValueDigital =

inputwhen

REFHI

0,ValueDigital =

V0inputwhen £

3.3

VoltageAnalogInput

4096ValueDigital

REFLO

´=

V3.3inputV0when <<

4095,ValueDigital =

V3.3inputwhen ³

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6.9.2.1 Analog-to-Digital Converter (ADC)

6.9.2.1.1 Features

The core of the ADC contains a single 12-bit converter fed by two sample-and-hold circuits. The sampleand-hold circuits can be sampled simultaneously or sequentially. These, in turn, are fed by a total of up to 16 analog input channels. The converter can be configured to run with an internal bandgap reference to create true-voltage based conversions or with a pair of external voltage references (V create ratiometric-based conversions.

Contrary to previous ADC types, this ADC is not sequencer-based. The user can easily create a series of conversions from a single trigger. However, the basic principle of operation is centered around the configurations of individual conversions, called SOCs, or Start-Of-Conversions.

Functions of the ADC module include:

• 12-bit ADC core with built-in dual sample-and-hold (S/H)

• Simultaneous sampling or sequential sampling modes

• Full range analog input: 0 V to 3.3 V fixed, or V analog voltage is derived by:

– Internal Reference (V

REFLO

= V

external reference modes.)

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

) to

SSA

. V

REFHI/VREFLO

must not exceed V

REFHI

REFHI/VREFLO

ratiometric. The digital value of the input

when using either internal or

DDA

– External Reference (V

REFHI/VREFLO

connected to external references. V

when using either internal or external reference modes.)

• Up to 16-channel, multiplexed inputs

• 16 SOCs, configurable for trigger, sample window, and channel

• 16 result registers (individually addressable) to store conversion values

• Multiple trigger sources – S/W – software immediate start – ePWM 1–8 – GPIO XINT2 – CPU Timer 0, CPU Timer 1, CPU Timer 2 – ADCINT1, ADCINT2

• 9 flexible PIE interrupts, can configure interrupt request after any conversion

must not exceed V

REFHI

DDA

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Table 6-24. ADC Configuration and Control Registers

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ADCCTL1 0x7100 1 Yes Control 1 Register ADCCTL2 0x7101 1 Yes Control 2 Register ADCINTFLG 0x7104 1 No Interrupt Flag Register ADCINTFLGCLR 0x7105 1 No Interrupt Flag Clear Register ADCINTOVF 0x7106 1 No Interrupt Overflow Register ADCINTOVFCLR 0x7107 1 No Interrupt Overflow Clear Register INTSEL1N2 0x7108 1 Yes Interrupt 1 and 2 Selection Register INTSEL3N4 0x7109 1 Yes Interrupt 3 and 4 Selection Register INTSEL5N6 0x710A 1 Yes Interrupt 5 and 6 Selection Register INTSEL7N8 0x710B 1 Yes Interrupt 7 and 8 Selection Register INTSEL9N10 0x710C 1 Yes Interrupt 9 Selection Register (reserved Interrupt 10 Selection) SOCPRICTL 0x7110 1 Yes SOC Priority Control Register ADCSAMPLEMODE 0x7112 1 Yes Sampling Mode Register ADCINTSOCSEL1 0x7114 1 Yes Interrupt SOC Selection 1 Register (for 8 channels) ADCINTSOCSEL2 0x7115 1 Yes Interrupt SOC Selection 2 Register (for 8 channels) ADCSOCFLG1 0x7118 1 No SOC Flag 1 Register (for 16 channels) ADCSOCFRC1 0x711A 1 No SOC Force 1 Register (for 16 channels) ADCSOCOVF1 0x711C 1 No SOC Overflow 1 Register (for 16 channels) ADCSOCOVFCLR1 0x711E 1 No SOC Overflow Clear 1 Register (for 16 channels) ADCSOC0CTL to

ADCSOC15CTL ADCREFTRIM 0x7140 1 Yes Reference Trim Register ADCOFFTRIM 0x7141 1 Yes Offset Trim Register COMPHYSTCTL 0x714C 1 Yes Comparator Hysteresis Control Register ADCREV 0x714F 1 No Revision Register

0x7120 –

0x712F

SIZE

(×16)

1 Yes

EALLOW

PROTECTED

DESCRIPTION

SOC0 Control Register to SOC15 Control Register

Table 6-25. ADC Result Registers (Mapped to PF0)

ADCRESULT0 to ADCRESULT15

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0xB00 –

0xB0F

SIZE

(×16)

1 No ADC Result 0 Register to ADC Result 15 Register

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EALLOW

PROTECTED

DESCRIPTION

PF0 (CPU)

PF2 (CPU)

SYSCLKOUT

ADCENCLK

AIO

MUX

ADC

Channels

ADC Core

12-Bit

0-Wait Result

Registers

ADCINT 1

ADCINT 9

ADCTRIG 1

TINT 0

PIE

CPUTIMER 0

ADCTRIG 2

TINT 1

CPUTIMER 1

ADCTRIG 3

TINT 2

CPUTIMER 2

ADCTRIG 4

XINT 2SOC

XINT 2

ADCTRIG 5

SOCA 1

EPWM 1

ADCTRIG 6

SOCB 1

ADCTRIG 7

SOCA 2

EPWM 2

ADCTRIG 8

SOCB 2

ADCTRIG 9

SOCA 3

EPWM 3

ADCTRIG 10

SOCB 3

ADCTRIG 11

SOCA 4

EPWM 4

ADCTRIG 12

SOCB 4

ADCTRIG 13

SOCA 5

EPWM 5

ADCTRIG 14

SOCB 5

ADCTRIG 15

SOCA 6

EPWM 6

ADCTRIG 16

SOCB 6

ADCTRIG 17

SOCA 7

EPWM 7

ADCTRIG 18

SOCB 7

ADCTRIG 19

SOCA 8

EPWM 8

ADCTRIG 20

SOCB 8

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ADC Connections if the ADC is Not Used

It is recommended that the connections for the analog power pins be kept, even if the ADC is not used. Following is a summary of how the ADC pins should be connected, if the ADC is not used in an application:

• V

• ADCINAn, ADCINBn, V

When the ADC module is used in an application, unused ADC input pins should be connected to analog ground (V

NOTE: Unused ADCIN pins that are multiplexed with AIO function should not be directly connected to analog ground. They should be grounded through a 1-kΩ resistor. This is to prevent an errant code from configuring these pins as AIO outputs and driving grounded pins to a logic-high state.

When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power savings.

– Connect to V

DDA SSA REFLO

– Connect to V

SSA

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DDIO

REFHI

Figure 6-21. ADC Connections

– Connect to V

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SSA

ADCSOCAO

ADCSOCBO

w(ADCSOCL)

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6.9.2.1.2 ADC Start-of-Conversion Electrical Data/Timing

Table 6-26. External ADC Start-of-Conversion Switching Characteristics

over recommended operating conditions (unless otherwise noted)

PARAMETER MIN MAX UNIT

w(ADCSOCL)

Pulse duration, ADCSOCxO low 32t

c(HCO)

cycles

Figure 6-22. ADCSOCAO or ADCSOCBO Timing

6.9.2.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing

Table 6-27. ADC Electrical Characteristics

PARAMETER MIN TYP MAX UNIT

DC SPECIFICATIONS

Resolution 12 Bits ADC clock 90-MHz device 0.001 45 MHz

Sample Window 7 64

ACCURACY

INL (Integral nonlinearity)

(1)

–4 4 LSB

DNL (Differential nonlinearity), no missing codes –1 1.5 LSB

Offset error

Executing a single self-

(2)

recalibration Executing periodic self-

recalibration

(3)

(4)

–20 20

–4 4

Overall gain error with internal reference –60 60 LSB Overall gain error with external reference –40 40 LSB Channel-to-channel offset variation –4 4 LSB Channel-to-channel gain variation –4 4 LSB ADC temperature coefficient with internal reference –50 ppm/°C ADC temperature coefficient with external reference –20 ppm/°C V

REFLO

REFHI

–100 µA

100 µA

ANALOG INPUT

Analog input voltage with internal reference 0 3.3 V Analog input voltage with external reference V V

REFLO

REFHI

input voltage

(5)

(6)

with V

REFLO

= V

SSA

REFLO

SSA

2.64 V

1.98 V

REFHI

0.66 V

DDA DDA

Input capacitance 5 pF Input leakage current ±2 μA

(1) INL will degrade when the ADC input voltage goes above V (2) 1 LSB has the weighted value of full-scale range (FSR)/4096. FSR is 3.3 V with internal reference and V

reference.

DDA

REFHI

- V

REFLO

for external

(3) For more details, see the TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064,

TMS320F28063, TMS320F28062 Piccolo MCUs Silicon Errata (SPRZ342). (4) Periodic self-recalibration will remove system-level and temperature dependencies on the ADC zero offset error. (5) V (6) V

is always connected to V

REFLO

must not exceed V

REFHI

and PFP devices, the input signal on ADCINA0 must not exceed V

DDA

on the 80-pin PN and PFP devices.

SSA

when using either internal or external reference modes. Since V

DDA

is tied to ADCINA0 on the 80-pin PN

REFHI

ADC

Clocks

LSB

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ADCPWDN/

ADCBGPWD/

ADCREFPWD/

ADCENABLE

Request for ADC

Conversion

d(PWD)

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SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Table 6-28. ADC Power Modes

ADC OPERATING MODE CONDITIONS I

DDA

UNIT

ADC Clock Enabled

Mode A – Operating Mode

Bandgap On (ADCBGPWD = 1) Reference On (ADCREFPWD = 1)

16 mA ADC Powered Up (ADCPWDN = 1) ADC Clock Enabled

Mode B – Quick Wake Mode

Bandgap On (ADCBGPWD = 1) Reference On (ADCREFPWD = 1)

4 mA ADC Powered Up (ADCPWDN = 0) ADC Clock Enabled

Mode C – Comparator-Only Mode

Bandgap On (ADCBGPWD = 1) Reference On (ADCREFPWD = 0)

1.5 mA ADC Powered Up (ADCPWDN = 0) ADC Clock Enabled

Mode D – Off Mode

Bandgap On (ADCBGPWD = 0) Reference On (ADCREFPWD = 0)

0.075 mA

ADC Powered Up (ADCPWDN = 0)

6.9.2.1.3.1 Internal Temperature Sensor

Table 6-29. Temperature Sensor Coefficient

PARAMETER

SLOPE

OFFSET

Degrees C of temperature movement per measured ADC LSB change of the temperature sensor

ADC output at 0°C of the temperature sensor 1750 LSB

(1) The temperature sensor slope and offset are given in terms of ADC LSBs using the internal reference of the ADC. Values must be

adjusted accordingly in external reference mode to the external reference voltage. (2) ADC temperature coeffieicient is accounted for in this specification (3) Output of the temperature sensor (in terms of LSBs) is sign-consistent with the direction of the temperature movement. Increasing

temperatures will give increasing ADC values relative to an initial value; decreasing temperatures will give decreasing ADC values

relative to an initial value.

(1)

MIN TYP MAX UNIT

(2)(3)

0.18

°C/LSB

6.9.2.1.3.2 ADC Power-Up Control Bit Timing

Table 6-30. ADC Power-Up Delays

PARAMETER

d(PWD)

Delay time for the ADC to be stable after power up 1 ms

(1) Timings maintain compatibility to the ADC module. The 2806x ADC supports driving all 3 bits at the same time t

conversion.

(1)

MIN MAX UNIT

Figure 6-23. ADC Conversion Timing

d(PWD)

ms before first

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ADCIN

5 pF

1.6 pF

Switch

Typical Values of the Input Circuit Components:

Switch Resistance (R ): 3.4 k

Sampling Capacitor (C ): 1.6 pF

Parasitic Capacitance (C ): 5 pF

Source Resistance (R ): 50

28x DSP

Source

Signal

3.4 k

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Figure 6-24. ADC Input Impedance Model

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SOC0

ADCCLK

ADCRESULT 0

S/H Window Pulse to Core

ADCCTL 1.INTPULSEPOS

ADCSOCFLG 1.SOC 0

ADCINTFLG.ADCINTx

SOC1 SOC2

9 15 22 24 3720

Result 0 Latched

ADCSOCFLG 1.SOC 1

ADCSOCFLG 1.SOC 2

ADCRESULT 1

EOC0 Pulse

EOC1 Pulse

Conversion 0

13 ADC Clocks

Minimum

7 ADCCLKs

ADCCLKs

Conversion 1

13 ADC Clocks

Minimum

7 ADCCLKs

2 ADCCLKs

1 ADCCLK

Analog Input

SOC1 Sample

Window

SOC0 Sample

Window

SOC2 Sample

Window

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6.9.2.1.3.3 ADC Sequential and Simultaneous Timings

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

Figure 6-25. Timing Example for Sequential Mode / Late Interrupt Pulse

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Conversion 0

13 ADC Clocks

Minimum

7 ADCCLKs

SOC0

ADCCLK

ADCRESULT 0

S/H Window Pulse to Core

ADCCTL1.INTPULSEPOS

ADCSOCFLG 1.SOC 0

ADCINTFLG.ADCINTx

SOC1 SOC2

9 15 22 24 37

ADCCLKs

Result 0 Latched

Conversion 1

13 ADC Clocks

Minimum

7 ADCCLKs

ADCSOCFLG 1.SOC 1

ADCSOCFLG 1.SOC 2

ADCRESULT 1

EOC0 Pulse

EOC1 Pulse

EOC2 Pulse

2 ADCCLKs

Analog Input

SOC1 Sample

Window

SOC0 Sample

Window

SOC2 Sample

Window

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Figure 6-26. Timing Example for Sequential Mode / Early Interrupt Pulse

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Conversion 0 (A)

13 ADC Clocks

Minimum

7 ADCCLKs

SOC0 (A/B)

ADCCLK

ADCRESULT 0

S/H Window Pulse to Core

ADCCTL1 .INTPULSEPOS

ADCSOCFLG 1 .SOC0

ADCINTFLG .ADCINTx

SOC2 (A/B)

9 22 24 37

ADCCLKs

Result 0 (A) Latched

Conversion 0 (B)

13 ADC Clocks

Minimum

7 ADCCLKs

ADCSOCFLG 1 .SOC1

ADCSOCFLG 1 .SOC2

ADCRESULT 1

Result 0 (B) Latched

Conversion 1 (A)

13 ADC Clocks

ADCRESULT 2

EOC0 Pulse

EOC1 Pulse

EOC2 Pulse

1 ADCCLK

2 ADCCLKs

Analog Input B

SOC0 Sample

B Window

SOC2 Sample

B Window

Analog Input A

SOC0 Sample

A Window

SOC2 Sample

A Window

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Figure 6-27. Timing Example for Simultaneous Mode / Late Interrupt Pulse

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ADCCLK

0 9

SOC0 Sample

B Window

Analog Input B

Analog Input A

SOC0 Sample

A Window

SOC2 Sample

B Window

SOC2 Sample

A Window

2422

ADCCTL1.INTPULSEPOS

ADCSOCFLG1.SOC0

ADCSOCFLG1.SOC1

ADCSOCFLG1.SOC2

S/H Window Pulse to Core

SOC0 (A/B)

SOC2 (A/B)

ADCRESULT 0

Result 0 (A) Latched

2 ADCCLKs

Result 0 (B) Latched

ADCRESULT 1

ADCRESULT 2

EOC0 Pulse

EOC1 Pulse

EOC2 Pulse

Minimum

7 ADCCLKs

Conversion 0 (A)

13 ADC Clocks

2 ADCCLKs

Minimum

7 ADCCLKs

Conversion 1 (A)

13 ADC Clocks

Conversion 0 (B)

13 ADC Clocks

ADCINTFLG.ADCINTx

ADCCLKs

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Figure 6-28. Timing Example for Simultaneous Mode / Early Interrupt Pulse

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To COMPy A or B input

To ADC Channel X

AIOx Pin

AIOxIN

AIOxINE

SYNC

SYSCLK

Logic implemented in GPIO MUX block

AIODAT Reg

(Read)

AIODAT Reg

(Latch)

AIOSET,

AIOCLEAR,

AIOTOGGLE

Regs

AIOMUX 1 Reg

AIOxDIR

(1 = Input,

0 = Output)

(0 = Input, 1 = Output)

AIODIR Reg

(Latch)

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6.9.2.2 ADC MUX

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Figure 6-29. AIOx Pin Multiplexing

The ADC channel and Comparator functions are always available. The digital I/O function is available only when the respective bit in the AIOMUX1 register is 0. In this mode, reading the AIODAT register reflects the actual pin state.

The digital I/O function is disabled when the respective bit in the AIOMUX1 register is 1. In this mode, reading the AIODAT register reflects the output latch of the AIODAT register and the input digital I/O buffer is disabled to prevent analog signals from generating noise.

On reset, the digital function is disabled. If the pin is used as an analog input, users should keep the AIO function disabled for that pin.

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AIO

MUX

COMP x A

COMP x B

COMP x

DAC x

Wrapper

DAC

Core

10-Bit

COMP

COMPxOUT

GPIO

MUX

TZ1/2/3

ePWM

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6.9.2.3 Comparator Block

Figure 6-30 shows the interaction of the Comparator modules with the rest of the system.

Figure 6-30. Comparator Block Diagram

Table 6-31. Comparator Control Registers

NAME

COMPCTL 0x6400 0x6420 0x6440 1 Yes Comparator Control Register COMPSTS 0x6402 0x6422 0x6442 1 No Comparator Status Register DACCTL 0x6404 0x6424 0x6444 1 Yes DAC Control Register DACVAL 0x6406 0x6426 0x6446 1 No DAC Value Register RAMPMAXREF_

ACTIVE RAMPMAXREF_

SHDW RAMPDECVAL_

ACTIVE RAMPDECVAL_

SHDW RAMPSTS 0x6410 0x6430 0x6450 1 No Ramp Generator Status Register

COMP1

ADDRESS

0x6408 0x6428 0x6448 1 No

0x640A 0x642A 0x644A 1 No

0x640C 0x642C 0x644C 1 No

0x640E 0x642E 0x644E 1 No

COMP2

ADDRESS

COMP3

ADDRESS

SIZE (×16)

EALLOW

PROTECTED

DESCRIPTION

Ramp Generator Maximum Reference (Active) Register

Ramp Generator Maximum Reference (Shadow) Register

Ramp Generator Decrement Value (Active) Register

Ramp Generator Decrement Value (Shadow) Register

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Settling Time (ns)

100

200

300

400

500

600

700

800

900

1000

1100

0 50 100 150 200 250 300 350 400 450 500

DAC Step Size (Codes)

15 Codes 7 Codes 3 Codes 1 Code

DAC Accuracy

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6.9.2.3.1 On-Chip Comparator/DAC Electrical Data/Timing

Table 6-32. Electrical Characteristics of the Comparator/DAC

CHARACTERISTIC MIN TYP MAX UNIT

Comparator

Comparator Input Range V Comparator response time to PWM Trip Zone (Async) 30 ns Input Offset ±5 mV Input Hysteresis

(1)

DAC

DAC Output Range V DAC resolution 10 bits DAC settling time See Figure 6-31 DAC Gain –1.5% DAC Offset 10 mV Monotonic Yes INL ±3 LSB

(1) Hysteresis on the comparator inputs is achieved with a Schmidt trigger configuration. This results in an effective 100-kΩ feedback

resistance between the output of the comparator and the non-inverting input of the comparator.

SSA

– V

DDA

35 mV

– V

DDA

Figure 6-31. DAC Settling Time

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6.02

1.76)(SINADN-

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6.9.3 Detailed Descriptions

Integral Nonlinearity

Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale. The point used as zero occurs one-half LSB before the first code transition. The full-scale point is defined as level one-half LSB beyond the last code transition. The deviation is measured from the center of each particular code to the true straight line between these two points.

Differential Nonlinearity

An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A differential nonlinearity error of less than ±1 LSB ensures no missing codes.

Zero Offset

The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the deviation of the actual transition from that point.

Gain Error

The first code transition should occur at an analog value one-half LSB above negative full scale. The last transition should occur at an analog value one and one-half LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions.

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Signal-to-Noise Ratio + Distortion (SINAD)

SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding DC. The value for SINAD is expressed in decibels.

Effective Number of Bits (ENOB)

For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following

formula, it is possible to get a measure of performance expressed as N, the effective number of bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD.

Total Harmonic Distortion (THD)

THD is the ratio of the rms sum of the first nine harmonic components to the rms value of the measured input signal and is expressed as a percentage or in decibels.

Spurious Free Dynamic Range (SFDR)

SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.

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1)(SPIBRR

LSPCLK

rateBaud

127to3SPIBRRwhen =

LSPCLK

rateBaud =

21,0,SPIBRRwhen =

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6.9.4 Serial Peripheral Interface (SPI) Module

The device includes the four-pin serial peripheral interface (SPI) module. Up to two SPI modules are available. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length (1 to 16 bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for communications between the MCU and external peripherals or another processor. Typical applications include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs. Multidevice communications are supported by the master/slave operation of the SPI.

The SPI module features include:

• Four external pins: – SPISOMI: SPI slave-output/master-input pin – SPISIMO: SPI slave-input/master-output pin – SPISTE: SPI slave transmit-enable pin – SPICLK: SPI serial-clock pin

NOTE: All four pins can be used as GPIO if the SPI module is not used.

• Two operational modes: master and slave Baud rate: 125 different programmable rates.

SPRS698F –NOVEMBER 2010–REVISED MARCH 2016

• Data word length: 1 to 16 data bits

• Four clocking schemes (controlled by clock polarity and clock phase bits) include: – Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the SPICLK

signal and receives data on the rising edge of the SPICLK signal.

– Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the falling edge

of the SPICLK signal and receives data on the falling edge of the SPICLK signal.

– Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the SPICLK

signal and receives data on the falling edge of the SPICLK signal.

– Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the falling

edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.

• Simultaneous receive and transmit operation (transmit function can be disabled in software)

• Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.

• Nine SPI module control registers: Located in control register frame beginning at address 7040h.

NOTE

All registers in this module are 16-bit registers that are connected to Peripheral Frame 2. When a register is accessed, the register data is in the lower byte (7–0), and the upper byte (15–8) is read as zeros. Writing to the upper byte has no effect.

Enhanced feature:

• 4-level transmit/receive FIFO

• Delayed transmit control

• Bi-directional 3 wire SPI mode support

• Audio data receive support through SPISTE inversion

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The SPI port operation is configured and controlled by the registers listed in Table 6-33 and Table 6-34.

Table 6-33. SPI-A Registers

NAME ADDRESS SIZE (×16) EALLOW PROTECTED DESCRIPTION

SPICCR 0x7040 1 No SPI-A Configuration Control Register SPICTL 0x7041 1 No SPI-A Operation Control Register SPISTS 0x7042 1 No SPI-A Status Register SPIBRR 0x7044 1 No SPI-A Baud Rate Register SPIRXEMU 0x7046 1 No SPI-A Receive Emulation Buffer Register SPIRXBUF 0x7047 1 No SPI-A Serial Input Buffer Register SPITXBUF 0x7048 1 No SPI-A Serial Output Buffer Register SPIDAT 0x7049 1 No SPI-A Serial Data Register SPIFFTX 0x704A 1 No SPI-A FIFO Transmit Register SPIFFRX 0x704B 1 No SPI-A FIFO Receive Register SPIFFCT 0x704C 1 No SPI-A FIFO Control Register SPIPRI 0x704F 1 No SPI-A Priority Control Register

(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined

results.

(1)

Table 6-34. SPI-B Registers

NAME ADDRESS SIZE (×16) EALLOW PROTECTED DESCRIPTION

SPICCR 0x7740 1 No SPI-B Configuration Control Register SPICTL 0x7741 1 No SPI-B Operation Control Register SPISTS 0x7742 1 No SPI-B Status Register SPIBRR 0x7744 1 No SPI-B Baud Rate Register SPIRXEMU 0x7746 1 No SPI-B Receive Emulation Buffer Register SPIRXBUF 0x7747 1 No SPI-B Serial Input Buffer Register SPITXBUF 0x7748 1 No SPI-B Serial Output Buffer Register SPIDAT 0x7749 1 No SPI-B Serial Data Register SPIFFTX 0x774A 1 No SPI-B FIFO Transmit Register SPIFFRX 0x774B 1 No SPI-B FIFO Receive Register SPIFFCT 0x774C 1 No SPI-B FIFO Control Register SPIPRI 0x774F 1 No SPI-B Priority Control Register

(1) Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined

results.

(1)

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SPICTL.0

SPI INT FLAG

SPI INT

ENA

SPISTS.6

Clock

Polarity

Talk

LSPCLK

SPI Bit Rate

State Control

Clock Phase

Receiver

Overrun Flag

SPICTL.4

Overrun INT ENA

SPICCR.3 - 0

SPIBRR.6 - 0

SPICCR.6

SPICTL.3

SPIDAT.15 - 0

SPICTL.1

Master/Slave

SPISTS.7

SPIDAT

Data Register

SPICTL.2

SPI Char

SPISIMO

SPISOMI

SPICLK

SW2

SW3

To CPU

SW1

RX FIFO _0 RX FIFO _1

-----

RX FIFO _3

TX FIFO Registers

TX FIFO _0

TX FIFO _1

-----

TX FIFO _3

RX FIFO Registers

TX Interrupt

Logic

RX Interrupt

Logic

SPIINT

SPITX

SPIFFOVF

FLAG

SPIFFRX.15

TX FIFO Interrupt

RX FIFO Interrupt

SPIRXBUF

SPITXBUF

SPIFFTX.14

SPIFFENA

SPISTE

SPIPRI.0

TRIWIRE

SPIPRI.1

STEINV

SPIRXBUF

Buffer Register

SPITXBUF

Buffer Register

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Figure 6-32 is a block diagram of the SPI in slave mode.

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A. SPISTE is driven low by the master for a slave device.

Figure 6-32. SPI Module Block Diagram (Slave Mode)

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100

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6.9.4.1 SPI Master Mode Electrical Data/Timing

Table 6-35 lists the master mode timing (clock phase = 0) and Table 6-36 lists the master mode timing (clock phase = 1). Figure 6-33 and Figure 6-34 show the timing waveforms.

(1) The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared. (2) t

c(SPC)

= SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR +1)

(3) t

c(LCO)

= LSPCLK cycle time

(4) Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:

Master mode transmit 20-MHz MAX, master mode receive 10-MHz MAX Slave mode transmit 10-MHz MAX, slave mode receive 10-MHz MAX.

(5) The active edge of the SPICLK signal referenced is controlled by the clock polarity bit (SPICCR.6).

Table 6-35. SPI Master Mode External Timing (Clock Phase = 0)

(1)(2) (3) (4)(5)

NO.

SPI WHEN (SPIBRR + 1) IS EVEN

OR SPIBRR = 0 OR 2

SPI WHEN (SPIBRR + 1) IS ODD

AND SPIBRR > 3

UNIT

MIN MAX MIN MAX

1 t

c(SPC)M

Cycle time, SPICLK 4t

c(LCO)

128t

c(LCO)

127t

c(LCO)

w(SPCH)M

Pulse duration, SPICLK high (clock polarity = 0)

0.5t

c(SPC)M

– 10 0.5t

c(SPC)M

0.5t

c(SPC)M

– 0.5t

c(LCO)

– 10 0.5t

c(SPC)M

– 0.5t

c(LCO)

w(SPCL)M

Pulse duration, SPICLK low (clock polarity = 1)

0.5t

c(SPC)M

– 10 0.5t

c(SPC)M

0.5t

c(SPC)M

– 0.5t

c(LCO)

– 10 0.5t

c(SPC)M

– 0.5t

c(LCO)

w(SPCL)M

Pulse duration, SPICLK low (clock polarity = 0)

0.5t

c(SPC)M

– 10 0.5

tc(SPC)M

0.5t

c(SPC)M

+ 0.5t

c(LCO)

– 10 0.5t

c(SPC)M

+ 0.5t

c(LCO)

w(SPCH)M

Pulse duration, SPICLK high (clock polarity = 1)

0.5

tc(SPC)M

– 10 0.5t

c(SPC)M

0.5t

c(SPC)M

+ 0.5t

c(LCO)

– 10 0.5t

c(SPC)M

+ 0.5t

c(LCO)

d(SPCH-SIMO)M

Delay time, SPICLK high to SPISIMO valid (clock polarity = 0)

10 10

d(SPCL-SIMO)M

Delay time, SPICLK low to SPISIMO valid (clock polarity = 1)

10 10

v(SPCL-SIMO)M

Valid time, SPISIMO data valid after SPICLK low (clock polarity = 0)

0.5t

c(SPC)M

– 10 0.5t

c(SPC)M

+ 0.5t

c(LCO)

– 10

v(SPCH-SIMO)M

Valid time, SPISIMO data valid after SPICLK high (clock polarity = 1)

0.5t

c(SPC)M

– 10 0.5t

c(SPC)M

+ 0.5t

c(LCO)

– 10

su(SOMI-SPCL)M

Setup time, SPISOMI before SPICLK low (clock polarity = 0)

26 26

su(SOMI-SPCH)M

Setup time, SPISOMI before SPICLK high (clock polarity = 1)

26 26

v(SPCL-SOMI)M

Valid time, SPISOMI data valid after SPICLK low (clock polarity = 0)

0.25t

c(SPC)M

– 10 0.5t

c(SPC)M

– 0.5t

c(LCO)

– 10

v(SPCH-SOMI)M

Valid time, SPISOMI data valid after SPICLK high (clock polarity = 1)

0.25t

c(SPC)M

– 10 0.5t

c(SPC)M

– 0.5t

c(LCO)

– 10

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