Texas Instruments DV2004S1, DV2004L1, BQ2004SNTR, BQ2004SN, BQ2004PN Datasheet

Features
Fast charge and conditioning of nickel cadmium or nickel-metal hydride batteries
Hysteretic PWM switch-mode current regulation or gated con
-
Easily integrated into systems or used as a stand-alone charger
Pre-charge qualification of tem
-
perature and voltage
Configurable, direct LED outputs display battery and charge status
Fast-charge termination by tem
-
perature/time, peak volume de
­tection, -V, maximum voltage, maximum temperature, and maxi­mum time
Optional top-off charge and
pulsed current maintenance charging
Logic-level controlled low-power
mode (< 5µA standby current)
General Description
The bq2004 Fast Charge IC provides comprehensive fast charge control functions together with high-speed switching power control circuitry on a monolithic CMOS device.
Integration of closed-loop current control circuitry allows the bq2004 to be the basis of a cost-effective so
­lution for stand-alone and system­integrated chargers for batteries of one or more cells.
Switch-activated discharge-before­charge allows bq2004-based chargers to support battery conditioning and capacity determination.
High-efficiency power conversion is accomplished using the bq2004 as a hysteretic PWM controller for switch-mode regulation of the charg­ing current. The bq2004 may alterna­tively be used to gate an externally regulated charging current.
Fast charge may begin on application of the charging supply, replacement
of the battery, or switch depression. For safety, fast charge is inhibited unless/until the battery tempera
-
ture and voltage are within config
-
ured limits.
Temperature, voltage, and time are monitored throughout fast charge. Fast charge is terminated by any of the following:
n
Rate of temperature time (∆T/∆t)
n
Peak voltage detection (PVD)
n
Negative delta voltage (-∆V)
n
Maximum voltage
n
Maximum temperature
n
Maximum time
After fast charge, optional top-off and pulsed current maintenance phases are available.
1
Fast-Charge IC
bq2004
DCMD Discharge command
DSEL Display select
VSEL Voltage termination
select
TM
1
Timer mode select 1
TM
2
Timer mode select 2
TCO Temperature cutoff
TS Temperature sense
BAT Battery voltage
1
PN2004E01.eps
16-Pin Narrow DIP
or Narrow SOIC
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
INH
DIS
MOD
VCC
V
SS
LED
2
LED
1
SNS
DCMD
DSEL
VSEL
TM
1
TM
2
TCO
TS
BAT
SNS Sense resistor input
LED
1
Charge status output 1
LED
2
Charge status output 2
V
SS
System ground
V
CC
5.0V±10% power
MOD Charge current control
DIS Discharge control
output
INH
Charge inhibit input
Pin Connections
SLUS063–JUNE 1999 F
Pin Names
Pin Descriptions
DCMD
Discharge-before-charge control input
The DCMD
input controls the conditions that enable discharge-before-charge. DCMD is pulled up internally. A negative-going pulse on DCMD
initiates a discharge to end­of-discharge voltage (EDV) on the BAT pin, followed by a new charge cycle start. Tying DCMD
to ground enables automatic discharge-before-charge on every new charge cycle start.
DSEL
Display select input
This three-state input configures the charge status display mode of the LED
1
and LED
2
outputs. See Table 2.
VSEL
Voltage termination select input
This three-state input controls the voltage­termination technique used by the bq2004. When high, PVD is active. When floating,
-V is used. When pulled low, both PVD and
-V are disabled.
TM
1
TM
2
Timer mode inputs
TM
1
and TM2are three-state inputs that configure the fast charge safety timer, voltage termination hold-off time, “top-off ”, and trickle charge control. See Table 1.
TCO
Temperature cut-off threshold input
Input to set maximum allowable battery temperature. If the potential between TS and SNS is less than the voltage at the TCO input, then fast charge or top-off charge is ter
-
minated.
TS
Temperature sense input
Input, referenced to SNS, for an external thermister monitoring battery temperature.
BAT
Battery voltage input
BAT is the battery voltage sense input, refer
­enced to SNS. This is created by a high­impedance resistor-divider network con
­nected between the positive and the negative terminals of the battery.
SNS
Charging current sense input
SNS controls the switching of MOD based on an external sense resistor in the current path of the battery. SNS is the reference po
­tential for both the TS and BAT pins. If SNS is connected to V
SS
, then MOD switches high at the beginning of charge and low at the end of charge.
LED
1
LED
2
Charge status outputs
Push-pull outputs indicating charging status. See Table 2.
V
SS
Ground
V
CC
VCCsupply input
5.0V, ±10% power input.
MOD
Charge current control output
MOD is a push-pull output that is used to control the charging current to the battery. MOD switches high to enable charging cur­rent to flow and low to inhibit charging current flow.
DIS
Discharge control output
Push-pull output used to control an external transistor to discharge the battery before charging.
INH
Charge inhibit input
When low, the bq2004 suspends all charge actions, drives all outputs to high imped
­ance, and assumes a low-power operational state. When transitioning from low to high, a new charge cycle is started.
2
bq2004
Functional Description
Figure 3 shows a block diagram and Figure 4 shows a state diagram of the bq2004.
Battery Voltage and Temperature Measurements
Battery voltage and temperature are monitored for maximum allowable values. The voltage presented on the battery sense input, BAT, should represent a two-cell potential for the battery under charge. A resistor-divider ratio of:
RB1 RB2
=
N
2
- 1
is recommended to maintain the battery voltage within the valid range, where N is the number of cells, RB1 is the resistor connected to the positive battery terminal, and RB2 is the resistor connected to the negative bat
-
tery terminal. See Figure 1.
Note: This resistor-divider network input impedance to end-to-end should be at least 200kand less than 1MΩ.
A ground-referenced negative temperature coefficient ther­mistor placed in proximity to the battery may be used as a low-cost temperature-to-voltage transducer. The tempera­ture sense voltage input at TS is developed using a resistor-thermistor network between V
CC
and VSS. See Figure 1. Both the BAT and TS inputs are referenced to SNS, so the signals used inside the IC are:
V
BAT-VSNS=VCELL
and
V
TS-VSNS=VTEMP
Discharge-Before-Charge
The DCMD input is used to command discharge-before­charge via the DIS output. Once activated, DIS becomes active (high) until V
CELL
falls below V
EDV,
at which time
DIS goes low and a new fast charge cycle begins.
The DCMD
input is internally pulled up to VCC(its inac
­tive state). Leaving the input unconnected, therefore, results in disabling discharge-before-charge. A negative going pulse on DCMD
initiates discharge-before-charge at any time regardless of the current state of the bq2004. If DCMD
is tied to VSS, discharge-before-charge
will be the first step in all newly started charge cycles.
Starting a Charge Cycle
A new charge cycle (see Figure 2) is started by:
1. V
CC
rising above 4.5V
2. V
CELL
falling through the maximum cell voltage,
V
MCV
where:
V
MCV
= 0.8 VCC± 30mV
3. A transition on the INH
input from low to high.
If DCMD
is tied low, a discharge-before-charge is exe­cuted as the first step of the new charge cycle. Other­wise, pre-charge qualification testing is the first step.
The battery must be within the configured temperature and voltage limits before fast charging begins.
The valid battery voltage range is V
EDV<VBAT<VMCV
where:
V
EDV
= 0.4 VCC± 30mV
The valid temperature range is V
HTF<VTEMP<VLTF
,
where:
3
bq2004
Fg2004a.eps
N T C
bq2004
V
CC
PACK +
PACK -
T
S
SNS
RT1
RT2
RB2
RB1
bq2004
Negative Temperature Coefficient Thermister
PACK+
PACK-
BAT
SNS
Figure 1. Voltage and Temperature Monitoring
4
Fast Charging
Top-Off
(Optional)
TD200401a.eps
Dis-
charge
(Optional)
Charge
Pending*
(Pulse-Trickle)
DIS
MOD
MOD
Mode 1, LED2 Status Output
Discharge-Before-Charge started
or
Battery discharged to 0.4 * V
CC.
Battery outside
temperature/voltage limits.
Battery within temperature/voltage limits.
Pulse-Trickle
Switch-mode Configuration
External Regulation
(
SNS Grounded)
Mode 1, LED1 Status Output
Mode 2, LED2 Status Output
Mode 2, LED1 Status Output
Mode 3, LED2 Status Output
Mode 3, LED1 Status Output
260 s
2080 s
260 s
2080 s
260 s
Note*
260 s
Note*
*See Table 3 for pulse-trickle period.
Figure 2. Charge Cycle Phases
bq2004
V
LTF
= 0.4 VCC± 30mV
V
HTF
= [(1/4 V
LTF
) + (3/4 V
TCO
)] ± 30mV
Note: The low temperature fault (LTF) threshold is not enforced if the IC is configured for PVD termination (VSEL = high).
V
TCO
is the voltage presented at the TCO input pin, and is
configured by the user with a resistor divider between V
CC
and ground. The allowed range is 0.2 to 0.4 ∗ VCC.
If the temperature of the battery is out of range, or the voltage is too low, the chip enters the charge pending state and waits for both conditions to fall within their al
­lowed limits. The MOD output is modulated to provide the configured trickle charge rate in the charge pending state. There is no time limit on the charge pending state; the charger remains in this state as long as the voltage or temperature conditons are outside of the al
­lowed limits. If the voltage is too high, the chip goes to the battery absent state and waits until a new charge cycle is started.
Fast charge continues until termination by one or more of the six possible termination conditions:
n
Delta temperature/delta time (T/t)
n
Peak voltage detection (PVD)
n
Negative delta voltage (-∆V)
n
Maximum voltage
n
Maximum temperature
n
Maximum time
PVD and -V Termination
The bq2004 samples the voltage at the BAT pin once every 34s. When -V termination is selected, if V
CELL
is lower than any previously measured value by 12mV ±4mV (6mV/cell), fast charge is terminated. When PVD termination is selected, if V
CELL
is lower than any previ
­ously measured value by 6mV ±2mV (3mV/cell), fast charge is terminated. The PVD and -V tests are valid in the range 0.4 V
CC<VCELL
< 0.8 VCC.
Voltage Sampling
Each sample is an average of voltage measurements taken 57µs apart. The IC takes 32 measurements in PVD mode and 16 measurements in -V mode. The re
-
sulting sample periods (9.17ms and 18.18ms, respec
­tively) filter out harmonics centered around 55Hz and 109Hz. This technique minimizes the effect of any AC line ripple that may feed through the power supply from either 50Hz or 60Hz AC sources. Tolerance on all tim
­ing is ±16%.
Voltage Termination Hold-off
A hold-off period occurs at the start of fast charging. During the hold-off period, -V termination is disabled. This avoids premature termination on the voltage spikes sometimes produced by older batteries when fast-charge current is first applied. T/t, maximum voltage and maximum temperature terminations are not affected by the hold-off period.
T/t Termination
The bq2004 samples at the voltage at the TS pin every 34s, and compares it to the value measured two samples earlier. If V
TEMP
has fallen 16mV ±4mV or more, fast
charge is terminated. If VSEL = high, the T/t termi
­nation test is valid only when V
TCO<VTEMP<VTCO
+
0.2 V
CC
. Otherwise the T/t termination test is valid
only when V
TCO<VTEMP<VLTF
.
Temperature Sampling
Each sample is an average of 16 voltage measurements taken 57µ s apart. The resulting sample period (18.18ms) filters out harmonics around 55Hz. This tech­nique minimizes the effect of any AC line ripple that may feed through the power supply from either 50Hz or 60Hz AC sources. Tolerance on all timing is ±16%.
Maximum Voltage,Temperature, and Time
Anytime V
CELL
rises above V
MCV,
the LEDs go off and
charging ceases immediately. If V
CELL
then falls back be
­low V
MCV
before t
MCV
= 1.5s ±0.5s, the chip transitions to
the Charge Complete state (maximum voltage termina
­tion). If V
CELL
remains above V
MCV
at the expiration of
t
MCV,
the bq2004 transitions to the Battery Absent state
(battery removal). See Figure 4.
Maximum temperature termination occurs anytime V
TEMP
falls below the temperature cutoff threshold
V
TCO
. Unless PVD termination is enabled (VSEL =
high), charge will also be terminated if V
TEMP
rises
above the low temperature fault threshold, V
LTF
, after
fast charge begins. The V
LTF
threshold is not enforced
when the IC is configured for PVD termination.
Maximum charge time is configured using the TM pin. Time settings are available for corresponding charge rates of C/4, C/2, 1C, and 2C. Maximum time-out termi
­nation is enforced on the fast-charge phase, then reset, and enforced again on the top-off phase, if selected. There is no time limit on the trickle-charge phase.
5
bq2004
VSEL Input Voltage Termination
Low Disabled
Float
-V
High PVD
Top-off Charge
An optional top-off charge phase may be selected to follow fast charge termination for the C/2 through 4C rates. This phase may be necessary on NiMH or other battery chemistries that have a tendency to terminate charge prior to reaching full capacity. With top-off en
­abled, charging continues at a reduced rate after fast-charge termination for a period of time equal to the fast-charge safety time (See Table 1.) During top­off, the MOD pin is enabled at a duty cycle of 260µsac
­tive for every 1820µs inactive. This modulation results in an average rate 1/8th that of the fast charge rate. Maximum voltage, time, and temperature are the only termination methods enabled during top-off.
Pulse-Trickle Charge
Pulse-trickle charging follows the fast charge and op
­tional top-off charge phases to compensate for self­discharge of the battery while it is idle in the charger. The configured pulse-trickle rate is also applied in the charge pending state to raise the voltage of an over­discharged battery up to the minimum required before fast charge can begin.
In the pulse-trickle mode, MOD is active for 260µsofa period specified by the settings of TM1 and TM2. See Table 1. The resulting trickle-charge rate is C/64 when top-off is enabled and C/32 when top-off is disabled. Both pulse trickle and top-off may be disabled by tying TM1 and TM2 to V
SS
.
Charge Status Indication
Charge status is indicated by the LED1and LED2out
-
puts. The state of these outputs in the various charge cy
-
cle phases is given in Table 2 and illustrated in Figure 2.
In all cases, if V
CELL
exceeds the voltage at the MCV
pin, both LED
1
and LED2outputs are held low regard
­less of other conditions. Both can be used to directly drive an LED.
Charge Current Control
The bq2004 controls charge current through the MOD output pin. The current control circuitry is designed to support implementation of a constant-current switching regulator or to gate an externally regulated current source.
When used in switch mode configuration, the nominal regulated current is:
I
REG
= 0.225V/R
SNS
Charge current is monitored at the SNS input by the voltage drop across a sense resistor, R
SNS
, between the
low side of the battery pack and ground. R
SNS
is sized to
provide the desired fast charge current.
If the voltage at the SNS pin is less than V
SNSLO
, the MOD output is switched high to pass charge current to the battery.
6
Corresponding
Fast-Charge
Rate TM1 TM2
Typical
Fast-Charge Safety
Time (minutes)
Typical
PVD, -∆V Hold-Off
Time (seconds)
Top-Off
Rate
Pulse-
Trickle
Rate
Pulse-
Trickle
Period (Hz)
C/4 Low Low 360 137 Disabled Disabled Disabled
C/2 Float Low 180 820 Disabled C/32 240
1C High Low 90 410 Disabled C/32 120
2C Low Float 45 200 Disabled C/32 60
4C Float Float 23 100 Disabled C/32 30
C/2 High Float 180 820 C/16 C/64 120
1C Low High 90 410 C/8 C/64 60
2C Float High 45 200 C/4 C/64 30
4C High High 23 100 C/2 C/64 15
Note: Typical conditions = 25°C, VCC= 5.0V.
Table 1. Fast-Charge Safety Time/Hold-Off/Top-Off Table
bq2004
When the SNS voltage is greater than V
SNSHI
, the MOD output is switched low—shutting off charging current to the battery.
V
SNSLO
= 0.04 VCC± 25mV
V
SNSHI
= 0.05 VCC± 25mV
When used to gate an externally regulated current source, the SNS pin is connected to V
SS
, and no sense re
-
sisitor is required.
7
BD200401.eps
Timing
Control
OSC
Display
Control
Charge Control
State Machine
Discharge
Control
MOD
Control
TCO
Check
LTF
Check
A/D
EDV
Check
MCV
Check
DIS MOD INH VCCV
SS
BAT
SNS
TS
TCOTM2TM1
LED1
DCMD
DVEN
VTS - V
SNS
V
BAT
- V SNS
LED2
DSEL
PWR
Control
Figure 3. Block Diagram
Mode 1 Charge Status LED
1
LED
2
DSEL = V
SS
Battery absent Low Low Fast charge pending or discharge-before-charge in progress High High Fast charge in progress Low High Charge complete, top-off, and/or trickle High Low
Mode 2 Charge Status LED
1
LED
2
DSEL = Floating
Battery absent, fast charge in progress or complete Low Low Fast charge pending High Low Discharge in progress Low High Top-off in progress High High
Mode 3 Charge Status LED
1
LED
2
DSEL = V
CC
Battery absent Low Low
Fast charge pending or discharge-before-charge in progress Low
1/8s high
1/8s low Fast charge in progress Low High Fast charge complete, top-off, and/or trickle High Low
Table 2. bq2004 LED Status Display Options
bq2004
8
Charge Pending
DCMD Tied to Ground?
Rising Edge
on DCMD
Discharge-
Before-Charge
Pulse
Trickle
Charge
Pulse
Trickle
Charge
Pulse
Trickle
Charge
Pulse
Trickle
Charge
Top-Off
Charge
Fast
Charge
Battery Voltage?
Battery Temperature?
Top-Off
Selected?
New Charge Cycle Started by
Any One of:
V
CC
Rising to Valid Level
Battery Replacement
(V
CELL
Falling through V
MCV
)
Inhibit (INH) Released
V
EDV
< V
CELL
< V
MCV
and
V
HTF
< V
TEMP
< V
LTF
*
V
HTF
< V
TEMP
< V
LTF
*
V
EDV
< V
CELL
< V
MCV
V
TEMP
> V
LTF
or
V
TEMP
< V
HTF
V
CELL
< V
EDV
V
CELL
< V
EDV
Yes
Yes
No
*VSEL = High disables LTF threshold enforcement
No
t >
t
MCV
> V
MCV
V
CELL
> V
MCV
V
CELL
>
V
CELL
V
MCV
>
V
CELL
V
MCV
>
V
CELL
V
MCV
V
CELL
<
V
MCV
Charge Complete
Battery Absent
or Maximum Time Out
V
TEMP
< V
TCO
SD2004.eps
>
V
CELL
V
MCV
- V or
T/ t or
V
TEMP
<
V
TCO
or Maximum
Time Out
Figure 4. State Diagram
bq2004
9
Absolute Maximum Ratings
Symbol Parameter Minimum Maximum Unit Notes
V
CC
VCCrelative to V
SS
-0.3 +7.0 V
V
T
DC voltage applied on any pin ex
-
cluding V
CC
relative to V
SS
-0.3 +7.0 V
T
OPR
Operating ambient temperature -20 +70 °C Commercial
T
STG
Storage temperature -55 +125 °C
T
SOLDER
Soldering temperature - +260 °C 10 sec max.
T
BIAS
Temperature under bias -40 +85 °C
Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional opera
-
tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Expo
-
sure to conditions beyond the operational limits for extended periods of time may affect device reliability.
DC Thresholds (T
A=TOPR;VCC
±
10%)
Symbol Parameter Rating Tolerance Unit Notes
V
SNSHI
High threshold at SNS result­ing in MOD = Low
0.05*V
CC
±
0.025
V
V
SNSLO
Low threshold at SNS result­ing in MOD = High
0.04 * V
CC
±
0.010
V
V
LTF
Low-temperature fault
0.4*V
CC
±
0.030
V
V
TEMP
V
LTF
inhib
-
its/terminates charge
V
HTF
High-temperature fault
(1/4*V
LTF
) + (2/3*V
TCO
)
±
0.030
V
V
TEMP
V
HTF
inhibits
charge
V
EDV
End-of-discharge voltage
0.4*V
CC
±
0.030
V
V
CELL<VEDV
inhibits
fast charge
V
MCV
Maximum cell voltage
0.8*V
CC
±
0.030
V
V
CELL>VMCV
inhibits/
terminates charge
V
THERM
TS input change forT/t detection
-16
±4
mV
V
CC
= 5V, TA= 25°C
-V
BAT input change for -V detection
-12
±4
mV
V
CC
= 5V, TA= 25°C
PVD
BAT input change for PVD detection
-6
±2
mV
V
CC
= 5V, TA= 25°C
bq2004
10
Recommended DC Operating Conditions (T
A
= T
OPR)
Symbol Condition Minimum Typical Maximum Unit Notes
V
CC
Supply voltage 4.5 5.0 5.5 V
V
BAT
Battery input 0 - V
CC
V
V
CELL
BAT voltage potential 0 - V
CC
VV
BAT
- V
SNS
V
TS
Thermistor input 0 - V
CC
V
V
TEMP
TS voltage potential 0 - V
CC
VVTS- V
SNS
V
TCO
Temperature cutoff 0.2*V
CC
- 0.4*V
CC
V Valid∆T/∆t range
V
IH
Logic input high 2.0 - - V DCMD, INH
Logic input high VCC- 0.3 - - V TM1,TM2, DSEL, VSEL
V
IL
Logic input low - - 0.8 V DCMD, INH
Logic input low - - 0.3 V TM1,TM2, DSEL, VSEL
V
OH
Logic output high
V
CC
- 0.8
--V
DIS, MOD, LED
1
, LED2,
I
OH
-10mA
V
OL
Logic output low - - 0.8 V
DIS, MOD, LED
1
, LED2,
I
OL
10mA
I
CC
Supply current - 1 3 mA Outputs unloaded
I
SB
Standby current - - 1
µ
A INH = V
IL
I
OH
DIS, LED1, LED2, MOD source -10 - - mA @VOH= VCC- 0.8V
I
OL
DIS, LED1, LED2, MOD sink 10 - - mA @VOL= VSS+ 0.8V
I
L
Input leakage - -
±
1
µ
A INH, BAT, V = VSSto V
CC
Input leakage 50 - 400
µ
A DCMD, V = VSSto V
CC
I
IL
Logic input low source - - 70
µ
A
TM
1
,TM2, DSEL, VSEL,
V = V
SS
to VSS+ 0.3V
I
IH
Logic input high source -70 - -
µ
A
TM
1
,TM2, DSEL, VSEL,
V = V
CC
- 0.3V to V
CC
I
IZ
Tri-state -2 - 2
µ
A
TM
1
,TM2, DSEL, and VSEL should be left disconnected (floating) for Z logic input state
Note: All voltages relative to VSSexcept as noted.
bq2004
11
Impedance
Symbol Parameter Minimum Typical Maximum Unit
R
BAT
Battery input impedance 50 - - M
R
TS
TS input impedance 50 - - M
R
TCO
TCO input impedance 50 - - M
R
SNS
SNS input impedance 50 - - M
Timing (T
A
= 0 to +70°C; V
CC
±
10%)
Symbol Parameter Minimum Typical Maximum Unit Notes
t
PW
Pulse width for DCMD and INH pulse command
1- -
µ
s
Pulse start for charge or discharge before charge
d
FCV
Time base variation -16 - 16 % VCC= 4.75V to 5.25V
f
REG
MOD output regulation frequency
- - 300 kHz
t
MCV
Maximum voltage termi­nation time limit
1- 2s
Time limit to distinguish battery re­moved from charge complete.
Note: Typical is at TA= 25°C, VCC= 5.0V.
bq2004
12
bq2004
16-Pin DIP Narrow (PN)
16-Pin PN(0.300" DIP
)
Dimension
Inches Millimeters
Min. Max. Min. Max.
A 0.160 0.180 4.06 4.57
A1 0.015 0.040 0.38 1.02
B 0.015 0.022 0.38 0.56
B1 0.055 0.065 1.40 1.65
C 0.008 0.013 0.20 0.33
D 0.740 0.770 18.80 19.56
E 0.300 0.325 7.62 8.26
E1 0.230 0.280 5.84 7.11
e 0.300 0.370 7.62 9.40
G 0.090 0.110 2.29 2.79
L 0.115 0.150 2.92 3.81
S 0.020 0.040 0.51 1.02
13
bq2004
16-Pin SOIC Narrow (SN)
A
A1
.004
C
B
e
D
E
H
L
16-Pin SN(0.150" SOIC
)
Dimension
Inches Millimeters
Min. Max. Min. Max.
A 0.060 0.070 1.52 1.78
A1 0.004 0.010 0.10 0.25
B 0.013 0.020 0.33 0.51
C 0.007 0.010 0.18 0.25
D 0.385 0.400 9.78 10.16
E 0.150 0.160 3.81 4.06
e 0.045 0.055 1.14 1.40
H 0.225 0.245 5.72 6.22
L 0.015 0.035 0.38 0.89
14
bq2004
Data Sheet Revision History
Change No. Page No. Description Nature of Change
1 10 Standby current ISB
Was 5 µA max; is 1 µA max
29V
BSNSLO
Rating Was: V
SNSHI
- (0.01 * VCC)
Is: 0.04 * V
CC
2 7 Correction in Peak Voltage Detect Termination section Was VCELL; is VBAT
2 3 Added block diagram Diagram insertion
2 7 Added VSEL/termination table Table insertion
2 8 Added values to Table 3 Top-off rate values
3 7 VSEL/Termination Low, High changed
4 All Revised and expanded format of this data sheet Clarification
5 9 Corrected V
HTF
rating
Was: (1/3 V
LTF
) + (2/3
V
TCO
)
Is: (1/4 V
LTF
) + (3/4 V
TCO
)
69T
OPR
Deleted industrial tempera­ture range
Notes: Change 1 = Apr. 1994 B “Final” changes from Dec. 1993 A “Preliminary.”
Change 2 = Sept. 1996 C changes from Apr. 1994 B. Change 3 = April 1997 C changes from Sept. 1996 C. Change 4 = Oct. 1997 D changes from April 1997 C. Change 5 = Jan. 1998 E changes from Oct. 1997 D. Change 6 = June 1999 F changes from Jan. 1998 E.
15
bq2004
Ordering Information
bq2004
Package Option:
PN = 16-pin narrow plastic DIP SN = 16-pin narrow SOIC
Device:
bq2004 Fast-Charge IC
16
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