Sony HCD-RG550, HCD-RG660 Schematic

HCD-RG550/RG660

SERVICE MANUAL

Ver 1.0 2003. 06

• HCD-RG550/RG660 is the tuner, deck, CD and amplifier section in MHC-RG550/RG660.

(Photo: HCD-RG550)

CD CD Mechanism Type CDM74F-K6BD71B Section Base Unit Name BU-K6BD71B

Tape Deck Model Name Using Similar Machanism CX-JT8 Section Tape Transport Mechanism Type CWM43RR-23

AEP Model

UK Model

E Model

Model Name Using Similar Mechanism NEW

Optical Pick-up Name KSS-213DCP

Amplifier section

European model: HCD-RG660:

Front speaker DIN power output (rated):

160 + 160 watts (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

200 + 200 watts (6 ohms at 1 kHz, 10% THD)

Music power output (reference):

400 + 400 watts (6 ohms at 1 kHz, 10% THD)

Other models: HCD-RG660:

The following measured at AC 120, 127, 220, 240 V, 50/60 Hz DIN power output (rated):

160 + 160 watts (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

200 + 200 watts (6 ohms at 1 kHz, 10% THD)

HCD-RG550:

The following measured at AC 120, 127, 220, 240 V, 50/60 Hz DIN power output (rated):

115 + 115 watts (6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

140 + 140 watts (6 ohms at 1 kHz, 10% THD)

SPECIFICATIONS

Inputs MD (VIDEO) IN L/R (phono jacks):

voltage 450/250 mV, impedance 47 kilohms

GAME INPUT AUDIO L/R (phono jacks):

voltage 250 mV, impedance 47 kilohms

GAME INPUT VIDEO (phono jack):

1 Vp-p, 75 ohms

MIC (phone jack) (except for European model):

sensitivity 1 mV,

impedance 10 kilohms Outputs PHONES (stereo mini jack):

accepts headphones of

8 ohms or more VIDEO OUT (phono jack):

max. output level

1 Vp-p, unbalanced, Sync

negative, load impedance

75 ohms SPEAKER: accepts impedance of 6 to

16 ohms SURROUND SPEAKER (HCD-RG660 only):

accepts impedance of 24

ohms

– Continued on next page –

COMPACT DISC DECK RECEIVER

9-961-000-01

Sony Corporation

Home Audio Company Published by Sony Engineering Corporation

HCD-RG550/RG660

CD player section

System Compact disc and digital

audio system

Laser Semiconductor laser

(λ=780 nm) Emission duration:

continuous Frequency response 2 Hz – 20 kHz (±0.5 dB) Wavelength 780 – 790 nm Signal-to-noise ratio More than 90 dB Dynamic range More than 90 dB CD OPTICAL DIGITAL OUT (square optical connector jack, rear panel) Wavelength 660 nm Output –18 dBm

Tape deck section

Recording system 4-track 2-channel stereo Frequency response 50 – 13,000 Hz (±3 dB),

using Sony TYPE I

cassettes Wow and flutter ±0.15% W.Peak (IEC)

0.1% W.RMS (NAB)

±0.2% W.Peak (DIN)

Tuner section

FM stereo, FM/AM superheterodyne tuner

FM tuner section

Tuning range 87.5 – 108.0 MHz Antenna FM lead antenna Antenna terminals 75 ohms unbalanced Intermediate frequency 10.7 MHz

AM tuner section

Tuning range Latin American model: 530 – 1,710 kHz (with the tuning

interval set at 10 kHz)

531 – 1,710 kHz (with the tuning

interval set at 10 kHz) European, Middle Eastern and Philippine models:

531 – 1,602 kHz (with the tuning

interval set at 9 kHz) Other models: 530 – 1,710 kHz (with the tuning

interval set at 10 kHz)

531 – 1,602 kHz (with the tuning

interval set at 9 kHz) Antenna AM loop antenna Antenna terminals External antenna terminal Intermediate frequency 450 kHz

General

Power requirements European model: 230 V AC, 50/60 Hz Argentine model: 220 V AC, 50/60 Hz Mexican model: 127 V AC, 60 Hz Saudi Arabian model: 120 – 127 V/220 V or

230 – 240 V AC, 50/60 Hz Adjustable with voltage selector

Other models: 120 V, 220 V or 230 –

240 V AC, 50/60 Hz Adjustable with voltage selector

Power consumption European model: HCD-RG660: 190 watts

0.35 watts (at the Power

Saving Mode) Other models: HCD-RG660: 190 watts HCD-RG550: 135 watts

Dimensions (w/h/d) Approx. 280 × 325 × 407 mm

Mass European model: HCD-RG660: Approx. 10.0 kg Other models: HCD-RG660: Approx. 11.0 kg HCD-RG550: Approx. 9.0 kg

Supplied accessories: AM loop antenna (1)

Remote Commander (1)

Batteries (2)

FM lead antenna (1)

Speaker pads

HCD-RG660 (16)

HCD-RG550 (8)

Design and specifications are subject to change without notice.

Speaker

Front speaker SS-RG665 for HCD-RG660/RG550:

Speaker system 3-way, 3-unit, bass-reflex

type Speaker units Sub Woofer: 15 cm, cone type Woofer: 15 cm, cone type Tweeter: 5 cm, cone type Nominal impedance 6 ohms Dimensions (w/h/d) Approx. 240 × 363 × 290 mm Mass Approx. 4.7 kg net per

speaker

Surround speaker SS-RS660 for HCD-RG660:

Speaker system 3-way, 3-unit, bass-reflex

type Speaker units Woofer: 13 cm, cone type Tweeter: 5 cm, cone type Super tweeter: 2 cm, dome type Nominal impedance 24 ohms Dimensions (w/h/d) Approx. 195 × 325 × 225 mm Mass Approx. 2.3 kg net per

speaker

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY P ARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

HCD-RG550/RG660

CAUTION

Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing

• Keep the temperature of soldering iron around 270°C during repairing.

• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering or unsoldering.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic breakdown because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.

MODEL IDENTIFICATION

– BACK PANEL –

PARTS No.

MODEL PARTS No.

RG550: E2, E3, E51 4-247-996-01 RG550: MX 4-247-996-11 RG660: E3 4-247-996-21 RG660: AEP , UK 4-247-996-31

• Abbreviation E2 : 120 V AC area in E model E3 : 240 V AC area in E model E51 : 220 V AC area in E model MX : Mexican model

LASER DIODE AND FOCUS SEARCH OPERATION CHECK

Carry out the “S curve check” in “CD section adjustment” and check that the S curve waveforms is output three times.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead free mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

SETTING AND RELEASING THE CD DISC TRAY LOCK FUNCTION

This set has a disc tray lock function to prevent discs for demonstration at shops from theft. While this lock function is set, the tray will not be delivered out even when the OPEN/CLOSE button is pressed.

Setting method:

Press the OPEN/CLOSE button while pressing the STOP button. After a few seconds, the message “LOCKED” will appear on the fluorescent indicator tube with the tray locked.

Releasing method:

Just as the lock is set, press the OPEN/CLOSE button while pressing the STOP button. After a few seconds, the message “UNLOCKED” will appear with the lock released.

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C. Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity Unleaded solder is more viscou-s (sticky , less prone to flo w) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

HCD-RG550/RG660

1. GENERAL

Main Unit ................................................................................ 5

Remote Control ....................................................................... 5

2. DISASSEMBLY

2-1. Case (Top) ........................................................................... 7

2-2. CD Door .............................................................................. 7

2-3. CD Mechanism Block ......................................................... 8

2-4. Front Panel Section ............................................................. 9

2-5. Tape Mechanism Deck ...................................................... 10

2-6. Panel Board, 6 Stream Led Board, Remote Board............ 10

2-7. Jack Board .........................................................................11

2-8. Back Panel Section............................................................ 11

2-9. Main Board ....................................................................... 12

2-10. Power Amp Board ............................................................. 12

2-11. SW Board, Driver Board...................................................13

2-12. CD Block Assy.................................................................. 13

2-13. Sensor Board ..................................................................... 14

2-14. Motor (TB) Board ............................................................. 14

2-15. Motor (LD) Board ............................................................. 15

2-16. BD Board .......................................................................... 15

2-17. Optical Pick-up ................................................................. 16

3. TEST MODE ..................................................................... 17

4. ELECTRICAL ADJUSTMENTS................................. 20

6. EXPLODED VIEWS

6-1. Main Section .....................................................................52

6-2. Front Panel Section (1)...................................................... 53

6-3. Front Panel Section (2)...................................................... 54

6-4. Front Panel Section (3)...................................................... 55

6-5. Main Board Section .......................................................... 56

6-6. CD Mechanism Deck Section (1) ..................................... 57

6-7. CD Mechanism Deck Section (2) ..................................... 58

6-8. Base Unit Section ..............................................................59

7. ELECTRICAL PARTS LIST ........................................ 60

5. DIAGRAMS

5-1. IC Pin Descriptions ........................................................... 21

5-2. Block Diagram –CD Section–........................................... 25

5-3. Block Diagram –Tuner/Tape/Panel Section– ....................26

5-4. Block Diagram –Amp/Power Supply Section–................. 27

5-5. Circuit Boards Location .................................................... 28

5-6. Note for Printed Wiring Boards

and Schematic Diagrams .................................................. 29

5-7. Waveforms......................................................................... 29

5-8. Printed Wiring Board –CD Mechanism Section (1/2)– .... 30

5-9. Schematic Diagram –CD Mechanism Section (1/2)– ....... 31

5-10. Printed Wiring Boards –CD Mechanism Section (2/2)– ...32

5-11. Schematic Diagram –CD Mechanism Section (2/2)– ....... 33

5-12. Schematic Diagram –Main Section (1/4)– ........................34

5-13. Schematic Diagram –Main Section (2/4)– ........................35

5-14. Schematic Diagram –Main Section (3/4)– ........................36

5-15. Schematic Diagram –Main Section (4/4)– ........................37

5-16. Printed Wiring Board –Main Section– .............................. 38

5-17. Printed Wiring Boards –Panel Section– ............................ 39

5-18. Schematic Diagram –Panel Section– ................................ 40

5-19. Printed Wiring Boards –Jack Section–..............................41

5-20. Schematic Diagram –Jack Section– .................................. 42

5-21. Printed Wiring Board –Power Amp Section– ................... 43

5-22. Schematic Diagram –Power Amp Section (1/2)– ............. 44

5-23. Schematic Diagram –Power Amp Section (2/2)– ............. 45

5-24. Printed Wiring Board

–Transformer Section (HCD-RG550)– ............................. 46

5-25. Printed Wiring Board

–Transformer Section (HCD-RG660)– ............................. 47

5-26. Schematic Diagram –Transformer Section– ..................... 48

5-27. IC Block Diagrams............................................................ 49

SECTION 1

GENERAL

HCD-RG550/RG660

This section is extracted from instruction manual.

HCD-RG550/RG660

Note : Disassemble the unit in the order as shown below.

SET

2-1. CASE (TOP)

(Page 7)

2-2. CD DOOR

(Page 7)

2-3. CD MECHANISM BLOCK

(Page 8)

2-11. SW BOARD,

DRIVER BOARD (Page 13)

2-13. SENSOR BOARD

2-14. MOTOR (TB) BOARD

2-15. MOTOR (LD) BOARD

SECTION 2

DISASSEMBLY

(Page 14)

(Page 15)

2-12. CD BLOCK ASSY

(Page 13)

2-16. BD BOARD

(Page 15)

2-17. OPTICAL PICK-UP

(Page 16)

2-4. FRONT PANEL SECTION

(Page 9)

2-6. PANEL BOARD,

6 STREAM LED BOARD, REMOTE BOARD (Page 10)

2-5. TAPE MECHANISM DECK

2-7. JACK BOARD

2-8. BACK PANEL SECTION

(Page 11)

2-9. MAIN BOARD

(Page 12)

2-10. POWER AMP BOARD

(Page 12)

(Page 10)

(Page 11)

Note : Follow the disassembly procedure in the numerical order given.

)

2-1. CASE (TOP)

HCD-RG550/RG660

two screws (case 3 TP2)

screw (case 3 TP2)

(+BVTP 3

case (side-L)

screw

case (top)

10)

screw

(+BVTP 3

10)

two screws (+BVTP 3

case (side-R)

10)

screw

(+BVTP 3

two screws

(case 3 TP2)

2-2. CD DOOR

CD mechanism deck (CDM74F-K6BD71B)

Turn the pulley to the direction of arrow.

pulley

Front panel side

Pull-out the disc tray.

CD door

(+BVTP 3

screw (case 3 TP2)

screw

10)

HCD-RG550/RG660

)

2-3. CD MECHANISM BLOCK

screw

(+BVTP 3

CD mechanism block

CN701

10)

three

(+BVTP 3

screws

10)

MAIN board

CN312 (flat type)

screw

(+BVTP 3

2-4. FRONT PANEL SECTION

)

screw

(+BVTP 3

TRANS board

CN311 (flat type)

CN003

HCD-RG550/RG660

CN305

front panel section

connector

three screws (+BVTP 3

CN304 (flat type)

CN310

× 8

screw

(+BVTP 3

)

HCD-RG550/RG660

)

2-5. TAPE MECHANISM DECK

connector

(+BVTP 2.6

tape mechanism deck

two

screws

(+BVTP 2.6

three

screws

(+BVTP 2.6

two

screws

2-6. PANEL BOARD, 6 STREAM LED BOARD, REMOTE BOARD

three

(+BVTP 2.6

CN607

REMOTE board

screws

two

(+BVTP 2.6

6 STREAM LED board

screws

two

(+BVTP 2.6

two

(+BVTP 2.6

three

(+BVTP 2.6

PANEL board

screws

two

screws

(+BVTP 2.6

screws

volume knob

2-7. JACK BOARD

HCD-RG550/RG660

two

screws

(+BVTP 2.6

shield plate

JACK board

2-8. BACK PANEL SECTION

back panel section

screw

(+BVTP 3

screw

(+BVTP 3

two mic knobs

screw

(+BVTP 3

three

(+BVTP 3

screws

10)

CN303

chassis section

CN101 (flat type)

two

screws

(+BVTT 3

HCD-RG550/RG660

2-9. MAIN BOARD

MAIN board

MAIN boar

2-10. POWER AMP BOARD

CN902

(+BVTP 3

screw

(+BVTP 3

screw

(+BVTT 3

10)

(+BVTP 3

two claws

screw

(+BVTT 3

POWER AMP boar

two

screws

10)

2-11. SW BOARD, DRIVER BOARD

SW board

CN702 (flat type)

CN703

DRIVER boar

HCD-RG550/RG660

2-12. CD BLOCK ASSY

screw

(+BTTP (M2.6))

holder (213) assy

CD block assy

two

insulators

CN704

two

screws

(+BTTP (M2.6))

floating

(+PTPWH M2.6)

two

insulators

coil springs

(insulator)

screw

two

coil springs

(insulator)

two stoppers (BU)

(+BTTB M2.6)

two screws

stopper (BU)

screw

(+BTTB M2.6)

floating

(+PTPWH M2.6)

screw

HCD-RG550/RG660

2-13. SENSOR BOARD

tray

floating

(+PTPWH M2.6)

floating

(+PTPWH M2.6)

gear (geneva)

screw

(+BTTP (M2.6))

screw

SENSOR board

CN731

belt (table)

floating

(+PTPWH M2.6)

screw

pulley (table)

2-14. MOTOR (TB) BOARD

claw

table motor assy (M741)

MOTOR (TB) board

Remove the two solderings of motor.

two

screws

(+BTTP (M2.6))

)

2-15. MOTOR (LD) BOARD

Remove the two solderings of motor.

loading motor assy (M751)

two

screws

(+BTTP (M2.6))

MOTOR (LD) board

HCD-RG550/RG660

2-16. BD BOARD

BD board

Remove the two solderings of motor.

belt (loading)

screw

(+BVTP 3

CN708 (flat type

Remove the two solderings of motor.

HCD-RG550/RG660

2-17. OPTICAL PICK-UP

Remove the optical pick-up (KSS-213D) in the direction of arrow

gear (A)

sled shaft

Slide the lever in the direction of arrow

SECTION 3

TEST MODE

HCD-RG550/RG660

[COLD RESET]

• The cold reset clears all data including preset data stored in the RAM to initial conditions. Execute this mode when returning the set to the customer.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press three keys of x , [GROOVE] and [POWER] simultaneously.

3. The message “COLD RESET” is displayed on the fluorescent

indicator tube momentarily, then becomes standby states.

[TUNER STEP CHANGE-OVER]

(Except AEP and UK models)

•A step of AM channels can be changed over between 9 kHz and 10 kHz.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [TUNER BAND] key to select “AM”.

3. Press the [POWER] key to turn the power OFF.

4. Press two keys of [ENTER] and [POWER] simultaneously.

5. The message “9K STEP” or “10K STEP” is displayed on the

fluorescent indicator tube, and thus the channel step is changed over.

[CD SHIP MODE]

•This mode moves the optical pick-up to the position durable to vibration. Use this mode when returning the set to the customer after repair.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [CD] key to select “CD”.

3. Press two keys of [CD] and [POWER] simultaneously.

4. The message “LOCK” is displayed on the fluorescent indicator

tube, and the CD ship mode is set.

[CHANGE-OVER FUNCTION OF MD/VIDEO]

•This mode is used to enable function of external input to change over between MD and VIDEO.

Procedure:

1. Set to standby state.

2. Press two keys of [MD VIDEO ] and [POWER] simultaneously.

3. The message “MD” or “VIDEO” is displayed on the fluorescent

indicator tube, and the function of external input is changed over.

(

)

[CD TRAY LOCK MODE]

•This mode is used to unable to take sample disc out of tray in the shop.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [CD] key to select “CD”.

3. Set disc on the tray.

4. While pressing the x key, press the Z key for 5 seconds.

5. The message “LOCKED” is displayed on the fluorescent

indicator tube and the tray is locked. (Even if pressing the Z key, the message “LOCKED” is displayed on the fluorescent indicator tube and the tray is locked)

6. To release from this mode, while pressing the x key, press

the Z key for 5 seconds.

7. The message “UNLOCKED” is displayed on the fluorescent

indicator tube and the tray is unlocked.

[AMP TEST MODE]

•This mode is used to set the parameter of AMP IC for adjustment of tone quality and VACS level and display VACS status.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press three keys of x , [GAME EQ] and [EFFECT ON/OFF]

simultaneously.

3. When the AMP test mode is activated, the message “AMP

TEST” is displayed on the fluorescent indicator tube momentarily.

4. Press two keys of [GAME EQ] and [DISC 2] simultaneously, mode

is changed over to parameter setting of AMP IC and display of VACS status.

5. When the VACS status, the message VACS level, VACS signal

level, and VACS signal hold le vel is displayed on the fluorescent indicator tube.

6. Press the [GROOVE] key, DBFB ON/OFF is changed over.

7. Press the [GAME MIXING] key, surround ON/OFF is changed

over.

8. Press the cursol B and b key, EQ band is changed over to

LOW, MID or HIGH.

9. Press the cursol V and v key, EQ curve adjustment value is

changed over between –8dB to +8dB.

10. To release from this mode, press two keys of [GAME EQ] and

[MOVIE EQ] simultaneously.

HCD-RG550/RG660

[AGING MODE]

• This mode can be used for operation check of CD section and tape deck section. CD section and tape deck section work in parallel.

If an error occurred:

The aging operation stops only an error occurred sections and display then status.

If no error occurs:

The aging operation continues repeatedly.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [CD] key to select “CD”.

3. Set disc on the tray and set tape into the deck.

4. Set the “ALL DISCS” mode and “REV OFF” mode.

5. Press three keys of x , [GAME EQ] and [DISC SKIP/EX-CHANGE]

simultaneously.

6. The message “AGING” is displayed on the fluorescent

indicator tube momentarily, then aging operations of CD and tape are started at the same time.

7. To release from this mode, operate the “COLD RESET”.

1. Display at the Aging Mode

Display operating state of CD section and tape deck section alternately. If an error occurred, stop display which that section.

2. CD Section

The sequence during the aging mode is following as below. Display at the aging mode is the same as the normal operation.

Aging mode sequence (CD section) :

3. Tape Deck Section

The sequence during the aging mode is following as below. If an error occurred, stop display that step.

Aging mode sequence (tape deck section) :

Rewind the tape A and B

“AAG-1 or 2”

Shut off

FWD play the tape A

“AAG-3”

2 minutes

Fast forward the tape A

“AAG-4”

Shut off or 20 seconds

REV play the tape A

“AAG-5”

2 minutes

Rewind the tape A

“AAG-6”

Shut off

FWD play the tape B

“BAG-3”

Start (from disc 1)

Disc chucking

TOC read

Play first track for 2 seconds

Play last track for 2 seconds

EX-change open/close

Open the disc tray

Disc skip

Close the tray

Change the next disc.

2 minutes

Fast forward the tape B

“BAG-4”

Shut off or 20 seconds

REV play the tape B

“BAG-5”

2 minutes

Rewind the tape B

“BAG-6”

Shut off

Note: “*AG-*” is display of each step.

HCD-RG550/RG660

[GC TEST MODE]

• This mode is used to check the fluorescent indicator tube, LED and key.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press three keys of x , [GAME EQ] and [DISC 2] simultaneously.

3. Fluorescent indicator tube and LEDs are all turned ON.

4. Press two keys of [GAME EQ] and [DISC 2] simultaneously, mode

is changed over.

5. In the key check mode, press each key, the defined key number

of every each key list is displayed on the fluorescent indicator tube.

6. In the key count check mode, “KEYCNT 0” is displayed on the

fluorescent indicator tube. Each time a key is pressed, “KEYCNT” value increases. Howev er , once a key is pressed , it is no longer taken into account.

7. In the headphone input check mode, connect the headphone,

the message “H_P ON” is displayed on the fluorescent indicator tube, and disconnect the headphone, the message “H_P OFF” is displayed on the fluorescent indicator tube.

8. In the volume check mode, turn the [VOLUME] knob, the

display on the fluorescent indicator tube is changed over to “VOLUME UP”, “VOLUME FLAT” or “VOLUME DOWN”

[MC TEST MODE]

•This mode is used to check operations of Amplifier.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press three keys of x , [GAME EQ] and [DISC 3] simultaneously.

3. When the MC test mode is activated, the message “TEST

MODE” is displayed on the fluorescent indicator tube momentarily, then VACS level is displayed on the fluorescent indicator tube.

4. Press the [MUSIC EQ] key, the display on the fluorescent

indicator tube is changed over to “GEQ MAX”, press the [EFFECT ON/OFF] key, the display on the fluorescent indicator tube is changed over to “GEQ 16”, press the [MOVIE EQ] key, the display on the fluorescent indicator tube is changed over to “GEQ MIN”,

5. Turn the [VOLUME] knob, the display on the fluorescent

indicator tube is changed over to “VOLUME MAX”, “V OLUME MID” or “VOLUME MIN”

6. Press the [GROOVE] key, VACS ON/OFF is changed over.

7. When the [REC PAUSE/START] ke y is pressed with a ta pe set in

the deck-B, the function is switched “MD” or “VIDEO” and recording starts. When the m or M key is pressed during recording, the tape is rewound back to the beginning of recording, the function is switched to “T APE B”, then playback starts.

8. When the [CD SYNC] key is pressed with the test tape (AMS-

100, AMS-110A) in the deck, number of space between tunes is counted, then if AMS-110A is set, “OK” is displayed on the fluorescent indicator tube and if AMS-100 is set, “NG” is displayed on the fluorescent indicator tube.

9. To release from this mode, press the [POWER] key.

[MODEL, DESTINATION AND VERSION DISPLAY]

•This mode is used to check the model, destination and software version.

Procedure:

1. Set to the standby state.

2. Press three keys of x , [GAME EQ] and [MOVIE EQ]

simultaneously.

3. When the model, destination and version display mode is

activated, the model an destination is displayed on the fluorescent indicator tube.

4. Press two keys of [GAME EQ] and [DISC 2] simultaneously, mode

is changed over to model and destination display mode and version display mode.

5. To release from this mode, press the two keys of [GAME EQ]

and [MOVIE EQ] simultaneously.

[CD ERROR CODE DISPLAY]

• This mode can be used for error display of CD section.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [CD] key to select “CD”.

3. Press three keys of x , [GAME EQ] and [DISC 1] simultaneously.

Note: Error code is not displayed on the fluorescent indicator tube.

[CD SERVICE MODE]

•This mode can run the CD sled motor freely. Use this mode, for instance, when cleaning the optical pick-up.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [CD] key to select “CD”.

3. Press three keys of x , [GAME EQ] and Z simultaneously.

4. When the CD service mode is activated, the message

“TRA VERS ON” is displa yed on the fluorescent indicator tube.

5. Press the M key, optical pick-up move to outside track and

the message “SLED OUT” is displayed on the fluorescent indicator tube.

6. Press the m key, optical pick-up move to inside track and

the message “SLED IN” is displayed on the fluorescent indicator tube..

7. Press the [MOVIE EQ] key, traverse ON/OFF is changed over.

[5 REPEAT LIMIT CANCEL]

• Number of repeat for CD playback is 5 times when the repeat mode is “REPEAT”. This mode is used to enables CD to repeat playback for limitless times.

Procedure:

1. Press the [POWER] key to turn the power ON.

2. Press the [CD] key to select “CD”.

3. Press three keys of x , [GAME EQ] and gG simultaneously.

HCD-RG550/RG660

SECTION 4

ELECTRICAL ADJUSTMENTS

CD SECTION

Note:

1. CD Block is basically designed to operate without adjustment. Therefore, check each item in order given.

2. Use YEDS-18 (3-702-101-01) unless otherwise indicated.

3. Use an oscilloscope with more than 10MW impedance.

4. Clean the object lens by an applicator with neutral detergent when the signal level is low than specified value with the following checks.

S-CURVE CHECK

Oscilloscope

BD board

TP(FE) TP(VC)

Procedure :

1. Connect an oscilloscope to TP (FE) and TP (VC).

2. Turn the power on.

3. Load a disc (YEDS-18) and actuate the focus search. (In consequence of open and close the disc tray, actuate the focus search)

4. Confirm that the oscilloscope waveform (S-curve) is symmetrical between A and B. And confirm peak to peak level within 3 ± 0.5 Vp-p.

Note: Clear RF signal wav eform means that the shape “ ◊ ” can be

clearly distinguished at the center of the waveform.

RF signal waveform

VOLT/DIV : 200mV TIME/DIV : 500ns

level : 1.3

0.3Vp-

Connecting Location: BD board

– BD Board (Conductor side) –

S-curve waveform

symmetry

within 3

0.5Vp-

Note: •Try to measure several times to make sure than the ratio

of A : B or B : A is more than 10 : 7.

•Take sweep time as long as possible and light up the brightness to obtain best waveform.

RF LEVEL CHECK

BD board

TP(RF) TP(VC)

Procedure :

1. Connect an oscilloscope to TP (RF) and TP (VC).

2. Turn the power on.

3. Load a disc (YEDS-18) and playback.

4. Confirm that oscilloscope waveform is clear and check if RF signal level is correct or not.

oscilloscope

TP (RF)

TP (VC)

TP (FE)

IC721

TP (TE)

HCD-RG550/RG660

SECTION 5

DIAGRAMS

5-1. IC PIN DESCRIPTIONS

• IC309 BU2099FV (MULTI CONTROLLER) (MAIN BOARD)

Pin No. Pin Name I/O Pin Description

1 VSS — Ground pin 2NC—Not used. (Open) 3DATAISerial data input from the tape mechanism controller 4 CLOCK I Serial data transfer clock signal input from the system controller 5 LCK I Serial data latch pulse clock signal input from the system controller 6 REC O Recording on/off control signal output “L”: recording 7BIAS O Recording bias on/off control signal output “L”: bias on

8A/BO

9 PB MUTE O

10 REC MUTE O

11 TUNER MUTE O Tuner muting on/off control signal output to the tuner unit “H”: muting on 12 LM-R (CD) O Loading motor drive signal output 13 LM-L (CD) O Loading motor drive signal output 14 TM-R (CD) O Table motor drive signal output 15 TM-L (CD) O Table motor drive signal output 16 SP RERAY O Front speaker on/off relay drive control signal output “L”: front speaker on 17 LINK/MATRIX O Surround speaker on/off relay drive control signal output “H”: surround speaker on 18 SO O Serial data output to the bass boost controller 19 OE — Not used. (Connect to ground.) 20 VDD — Power supply pin (+3.3 V)

Deck-A/B selection signal output to the deck-A/B select switch “L”: deck-B, “H”: deck-A Playback muting on/off control signal output to the recording/playback equalizer amplifier “H”: muting on Recording muting on/off control signal output to the recording/playback equalizer amplifier “L”: muting on

HCD-RG550/RG660

• IC310 BU2099FV (BASS BOOST CONTROLLER) (MAIN BOARD)

Pin No. Pin Name I/O Pin Description

1 VSS — Ground pin 2NC—Not used. (Open) 3DATAISerial data input from the multi controller 4 CLOCK I Serial data transfer clock signal input from the system controller 5 LCK I Serial data latch pulse clock signal input from the system controller

6 to 8 NC — Not used. (Open)

9MOTOR VCC O Motor power control signal output “L”: motor power on 10 SOL A O SOL-A control signal output 11 SOL B O SOL-B control signal output 12 LINE OUT MUTE O Line out mute signal output terminal “H”: mute on 13 CD MUTE O CD mute signal output terminal “H”: mute on

14 to 16 CONT 1 to 3 O Bass boost control signal output “H”: bass boost

17 NC — Not used. (Open) 18 SO O Serial data output Not used. (Open) 19 OE — Not used. (Connect to ground.) 20 VDD — Power supply pin (+3.3 V)

• IC601 LC876696B-51Y1-E (SYSTEM CONTROL, FLD CONTROL) (PANEL BOARD)

Pin No. Pin Name I/O Pin Description

1 SYS MUTE O System mute signal output 2BU1924 DATA I Not used in this set. (Connected to ground.) 3 PWR DOWN I Power down signal input 4 LC78646 RESET O CD reset signal output 5 LC78646 CE O CD CE signal output 6 LC78684 CE (MP3) O CD CE (MP3) signal output 7 M61519 CLK O Clock signal output 8BU2099FV LCK O LCK signal output

9 LC72121 CE O CE signal output 10 LC78684 SYNC I SYNC signal input 11 RESET I Reset signal input from the IC603 12 XT1 I Oscillater connect pin (32.768 kHz) 13 XT2 O Oscillater connect pin (32.768 kHz) 14 VSS1 — Ground pin 15 CF1 I Ceramic vibrator connect pin (8.64 MHz) 16 CF2 O Ceramic vibrator connect pin (8.64 MHz) 17 VDD1 — Power supply pin (+3.3 V) 18 TAPE A STAT I Tape A start signal input 19 TAPE B STAT I Tape B start signal input 20 CD ENCODER I CD encoder switch signal input 21 SW ON/OFF SENSOR I Switch control on/off signal input 22 STREAM IN I Stream in signal input 23 VACS I VACS signal input 24 KEY2 I Key signal input 2 25 KEY1 I Key signal input 1 26 KEY0 I Key signal input 0 27 PROTECTOR (HOLD) I Protector (Hold) signal input 28 REMOCON IN I Remote control signal input from the RM601 29 BU1924 CLK I Not used in this set. (Connected to ground.)

30 – 41 G12 – G1 O FLD control signal output 42 – 45 P1 – P4 O FLD control signal output

46 VDD3 — Power supply pin (+3.3 V)

47 – 50 P5 – P8 O FLD control signal output

51 VPP — Ground pin

52 – 55 P9 – P12 O FLD control signal output

56 SW1 (a) P13 O FLD control signal output 57 SW2 (b) P14 O FLD control signal output 58 SW3 (c) P15 O FLD control signal output 59 SW4 (d) P16 O FLD control signal output 60 SW5 P17 O FLD control signal output 61 SW6 P18 O FLD control signal output 62 SW7 P19 O FLD control signal output 63 SW8 P20 O FLD control signal output

64, 65 P21, P22 O FLD control signal output

66 ENTER LED O Not used in this set. (Open) 67 MD/VIDEO LED O GAME LED (LED610) drive signal output 68 GAME LED O MD/VIDEO LED (LED612) drive signal output 69 TAPE LED O TAPE A/B LED (LED609) drive signal output 70 TUNER LED O TUNER/BAND LED (LED608) drive signal output 71 CD LED O CD LED (LED607) drive signal output 72 VDD4 — Power supply pin (+3.3 V) 73 CD VDD O CD power control signal output

HCD-RG550/RG660

+ 53 hidden pages

Sony HCD-RG550, HCD-RG660 Schematic

TABLE OF CONTENTS

GENERAL

DISASSEMBLY

case (top)

CD door

CD mechanism block

front panel section

tape mechanism deck

JACK board

back panel section

MAIN board

CD block assy

SENSOR board

MOTOR (TB) board

MOTOR (LD) board

BD board

TEST MODE

ELECTRICAL ADJUSTMENTS

DIAGRAMS