Quectel Wireless Solutions 201905SC66MW User Manual

SC66 Hardware Design

Smart LTE Module Series

Rev: SC66_Hardware_Design_V1.0

Date: 2019-03-08

Status: Preliminary

www.quectel.com

Smart LTE Module Series

SC66 Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: [phone]

Email: [e-mail]

Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm

Or email to: [e-mail]

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.

COPYRIGHT

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

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About the Document

History

	Revision		Date		Author		Description
1.0		2019-03-08			Jian WU		Initial

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Contents

About the Document...................................................................................................................................				2
Contents		.......................................................................................................................................................		3
Table Index...................................................................................................................................................				6
Figure Index .................................................................................................................................................				8
1	Introduction ........................................................................................................................................			10
	1.1. .....................................................................................................................	Safety Information		14
2	Product ................................................................................................................................Concept			15
	2.1. ..................................................................................................................	General Description		15
	2.2. .............................................................................................................................	Key Features		19
	2.3. ...................................................................................................................	Functional Diagram		22
	2.4. .......................................................................................................................	Evaluation Board		24
3	Application .......................................................................................................................Interfaces			25
	3.1. ..................................................................................................................	General Description		25
	3.2. .........................................................................................................................	Pin Assignment		26
	3.3. ..........................................................................................................................	Pin Description		27
	3.4. ............................................................................................................................	Power Supply		42
	3.4.1. .........................................................................................................		Power Supply Pins	42
	3.4.2. ..................................................................................................		Decrease Voltage Drop	42
	3.4.3. ..............................................................................Reference Design for Power Supply			43
	3.5. .........................................................................................................	Turn on and off Scenarios		45
	3.5.1. .............................................................................Turn on Module Using the PWRKEY			45
	3.5.2. .........................................................................................................		Restart the Module	46
	3.6. .........................................................................................................................	VRTC Interface		47
	3.7. ............................................................................................................................	Power Output		48
	3.8. .............................................................................................	Battery Charge and Management		48
	3.9. ............................................................................................................................	USB Interface		51
	3.9.1. .........................................................................................................		TYPE-C Interfaces	51
	3.9.2. ..................................................................................................................		DP Interfaces	54
	3.9.3. ................................................................................................................................		Host	56
	3.10. ........................................................................................................................	UART Interfaces		56
	3.11. ......................................................................................................................	(U)SIM Interfaces		58
	3.12. .....................................................................................................................	SD Card Interface		61
	3.13. ........................................................................................................................	GPIO Interfaces		63
	3.14. ............................................................................................................................	I2C Interfaces		64
	3.15. ..............................................................................................................................	I2S Interface		65
	3.16. ............................................................................................................................	SPI Interfaces		66
	3.17. ..........................................................................................................................	ADC Interfaces		66
	3.18. ..........................................................................................................................	LCM Interfaces		67
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	3.19.	Touch Panel Interfaces .............................................................................................................		71
	3.20.	Camera Interfaces.....................................................................................................................		73
	3.20.1.		Design Considerations ...................................................................................................	79
	3.21.	Sensor Interfaces ......................................................................................................................		81
	3.22.	Audio Interfaces ........................................................................................................................		82
	3.22.1. Reference Circuit Design for Microphone Interfaces.....................................................			83
	3.22.2. Reference Circuit Design for Earpiece Interface ...........................................................			84
	3.22.3. Reference Circuit Design for Headphone Interface.......................................................			85
	3.22.4. Reference Circuit Design for Loudspeaker Interface.....................................................			85
	3.22.5. Audio Interfaces Design Considerations........................................................................			85
	3.23.	Emergency Download Interface................................................................................................		86
4	Wi-Fi and BT .......................................................................................................................................			87
	4.1.	Wi-Fi Overview..........................................................................................................................		87
	4.1.1.		Wi-Fi Performance .........................................................................................................	87
	4.2.	BT Overview..............................................................................................................................		89
	4.2.1.		BT Performance .............................................................................................................	90
5	GNSS	...................................................................................................................................................		91
	5.1.	GNSS Performance ..................................................................................................................		91
	5.2.	GNSS RF Design Guidelines....................................................................................................		92
6	Antenna Interfaces.............................................................................................................................			93
	6.1.	Main/Rx-diversity Antenna Interfaces .......................................................................................		93
	6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design .......................................			97
	6.1.2. Reference Design of RF Layout.....................................................................................			97
	6.2.	Wi-Fi/BT Antenna Interface.......................................................................................................		99
	6.3.	GNSS Antenna Interface.........................................................................................................		100
	6.3.1. Recommended Circuit for Passive Antenna ................................................................			101
	6.3.2.		Recommended Circuit for Active Antenna ...................................................................	102
	6.4.	Antenna Installation.................................................................................................................		102
	6.4.1.		Antenna Requirements ................................................................................................	102
	6.4.2. Recommended RF Connector for Antenna Installation ...............................................			103
7 Electrical, Reliability and Radio Characteristics ..........................................................................				105
	7.1.	Absolute Maximum Ratings ....................................................................................................		105
	7.2.	Power Supply Ratings.............................................................................................................		105
	7.3.	Operation and Storage Temperatures.....................................................................................		106
	7.4.	Current Consumption..............................................................................................................		107
	7.5.	RF Output Power ....................................................................................................................		116
	7.6.	RF Receiving Sensitivity .........................................................................................................		119
	7.7.	Electrostatic Discharge ...........................................................................................................		123
8	Mechanical Dimensions ..................................................................................................................			124
	8.1.	Mechanical Dimensions of the Module ...................................................................................		124
	8.2.	Recommended Footprint ........................................................................................................		126
	8.3.	Top and Bottom View of the Module .......................................................................................		127
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9	Storage, Manufacturing and Packaging ........................................................................................		128
	9.1.	Storage ....................................................................................................................................	128
	9.2.	Manufacturing and Soldering ..................................................................................................	129
	9.3.	Packaging ...............................................................................................................................	130
10	Appendix A References...................................................................................................................		132
11	Appendix B GPRS Coding Schemes .............................................................................................		135
12	Appendix C GPRS Multi-slot Classes............................................................................................		136
13	Appendix D EDGE Modulation and Coding Schemes .................................................................		138

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Table Index
TABLE 1: SC66-CE* FREQUENCY BANDS.....................................................................................................	15
TABLE 2: SC66-A* FREQUENCY BANDS .......................................................................................................	16
TABLE 3: SC66-J* FREQUENCY BANDS ........................................................................................................	16
TABLE 4: SC66-E* FREQUENCY BANDS .......................................................................................................	17
TABLE 5: SC66-W* FREQUENCY BANDS ......................................................................................................	17
TABLE 6: SC66-MW*(2*2 MIMO WIFI) FREQUENCY BANDS ........................................................................	18
TABLE 7: SC66 KEY FEATURES .....................................................................................................................	19
TABLE 8: I/O PARAMETERS DEFINITION.......................................................................................................	27
TABLE 9: PIN DESCRIPTION ...........................................................................................................................	27
TABLE 10: POWER DESCRIPTION .................................................................................................................	48
TABLE 11: PIN DEFINITION OF CHARGING INTERFACE .............................................................................	49
TABLE 12: PIN DEFINITION OF USB INTERFACE .........................................................................................	51
TABLE 13: USB TRACE LENGTH INSIDE THE MODULE...............................................................................	54
TABLE 14: THE DIFFERENCES BETWEEN USB MODE AND DISPLAYPORT MODE .................................	55
TABLE 15: USB2 CONFIGURATION ................................................................................................................	56
TABLE 16: PIN DEFINITION OF UART INTERFACES.....................................................................................	57
TABLE 17: PIN DEFINITION OF (U)SIM INTERFACES...................................................................................	59
TABLE 18: PIN DEFINITION OF SD CARD INTERFACE ................................................................................	61
TABLE 19: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE .......................................................	62
TABLE 20: PIN DEFINITION OF GPIO INTERFACES .....................................................................................	63
TABLE 21: PIN DEFINITION OF I2C INTERFACES.........................................................................................	65
TABLE 22: PIN DEFINITION OF I2S INTERFACE ...........................................................................................	65
TABLE 23: PIN DEFINITION OF SPI INTERFACES ........................................................................................	66
TABLE 24: PIN DEFINITION OF ADC INTERFACES .......................................................................................	66
TABLE 25: PIN DEFINITION OF LCM INTERFACES.......................................................................................	67
TABLE 26: PIN DEFINITION OF TOUCH PANEL INTERFACES .....................................................................	72
TABLE 27: PIN DEFINITION OF CAMERA INTERFACES ...............................................................................	74
TABLE 28: MIPI TRACE LENGTH INSIDE THE MODULE...............................................................................	79
TABLE 29: PIN DEFINITION OF SENSOR INTERFACES ...............................................................................	81
TABLE 30: PIN DEFINITION OF AUDIO INTERFACES ...................................................................................	82
TABLE 31: WI-FI TRANSMITTING PERFORMANCE.......................................................................................	87
TABLE 32: WI-FI RECEIVING PERFORMANCE..............................................................................................	88
TABLE 33: BT DATA RATE AND VERSIONS....................................................................................................	90
TABLE 34: BT TRANSMITTING AND RECEIVING PERFORMANCE .............................................................	90
TABLE 35: GNSS PERFORMANCE .................................................................................................................	91
TABLE 36: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES .........................................	93
TABLE 37: SC66-CE* MODULE OPERATING FREQUENCIES ......................................................................	93
TABLE 38: SC66-A* MODULE OPERATING FREQUENCIES.........................................................................	94
TABLE 39: SC66-J* MODULE OPERATING FREQUENCIES .........................................................................	95
TABLE 40: SC66-E* MODULE OPERATING FREQUENCIES.........................................................................	96
TABLE 41: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE ................................................................	99
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TABLE 42: WI-FI/BT FREQUENCY.................................................................................................................	100
TABLE 43: PIN DEFINITION OF GNSS ANTENNA........................................................................................	100
TABLE 44: GNSS FREQUENCY.....................................................................................................................	101
TABLE 45: ANTENNA REQUIREMENTS........................................................................................................	102
TABLE 46: ABSOLUTE MAXIMUM RATINGS ................................................................................................	105
TABLE 47: SC66 MODULE POWER SUPPLY RATINGS...............................................................................	105
TABLE 48: OPERATION AND STORAGE TEMPERATURES ........................................................................	106
TABLE 49: SC66-CE* CURRENT CONSUMPTION .......................................................................................	107
TABLE 50: SC66-A* CURRENT CONSUMPTION..........................................................................................	109
TABLE 51: SC66-J* CURRENT CONSUMPTION ...........................................................................................	110
TABLE 52: SC66-E* CURRENT CONSUMPTION...........................................................................................	112
TABLE 53: SC66-CE* RF OUTPUT POWER...................................................................................................	116
TABLE 54: SC66-A* RF OUTPUT POWER .....................................................................................................	116
TABLE 55: SC66-J* RF OUTPUT POWER......................................................................................................	117
TABLE 56: SC66-E* RF OUTPUT POWER .....................................................................................................	118
TABLE 57: SC66-CE* RF RECEIVING SENSITIVITY .....................................................................................	119
TABLE 58: SC66-A* RF RECEIVING SENSITIVITY.......................................................................................	120
TABLE 59: SC66-J* RF RECEIVING SENSITIVITY .......................................................................................	121
TABLE 60: SC66-E* RF RECEIVING SENSITIVITY.......................................................................................	122
TABLE 61: ESD CHARACTERISTICS (TEMPERATURE: 25°C, HUMIDITY: 45%).......................................	123
TABLE 50: RECOMMENDED THERMAL PROFILE PARAMETERS .............................................................	129
TABLE 63: REEL PACKAGING .......................................................................................................................	131
TABLE 64: RELATED DOCUMENTS ..............................................................................................................	132
TABLE 65: TERMS AND ABBREVIATIONS ....................................................................................................	132
TABLE 66: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................	135
TABLE 67: GPRS MULTI-SLOT CLASSES ....................................................................................................	136
TABLE 68: EDGE MODULATION AND CODING SCHEMES.........................................................................	138

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ...............................................................................................................	24
FIGURE 2: PIN ASSIGNMENT (TOP VIEW).....................................................................................................	26
FIGURE 3: VOLTAGE DROP SAMPLE.............................................................................................................	42
FIGURE 4: STRUCTURE OF POWER SUPPLY ..............................................................................................	43
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY ..............................................................................	44
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT...................................................................	45
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ...........................................................................	45
FIGURE 8: AUTOMATIC BOOT REFERENCE CIRCUIT .................................................................................	46
FIGURE 9: TIMING OF RESTARTING MODULE .............................................................................................	46
FIGURE 10: RTC POWERED BY RECHARGEABLE BUTTON CELL.............................................................	47
FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT ...................................................	50
FIGURE 12: USB TYPE-C INTERFACE REFERENCE DESIGN .....................................................................	53
FIGURE 13: DISPLAY PORT INTERFACES....................................................................................................	56
FIGURE 14: USB2 HOST .................................................................................................................................	56
FIGURE 15: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART6)..............................	58
FIGURE 16: RS232 LEVEL MATCH CIRCUIT (FOR UART5) ..........................................................................	58
FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
...................................................................................................................................................................	60
FIGURE 18: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
...................................................................................................................................................................	60
FIGURE 19: REFERENCE CIRCUIT FOR SD CARD INTERFACE .................................................................	62
FIGURE 20: LCM0 EXTERNAL BACKLIGHT DRIVE REFERENCE CIRCUIT ................................................	69
FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE.........................................................	69
FIGURE 22: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE.........................................................	70
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE.........................................................	71
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES.......................................	73
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS ..................................	76
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS ....................................	77
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERA APPLICATIONS ................................	78
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE ...........................	83
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE ........................................	84
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR EARPIECE IINTERFACE ...............................................	84
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ...........................................	85
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE .......................................	85
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE.....................	86
FIGURE 34: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES ..	97
FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB......................................................................	98
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB..................................................	98
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) ..................................................................................................................................................	98
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

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GROUND) ..................................................................................................................................................	99
FIGURE 37: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE ................................	100
FIGURE 38: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA .........................................	101
FIGURE 39: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ...........................................	102
FIGURE 40: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)..............................................	103
FIGURE 41: MECHANICALS OF U.FL-LP CONNECTORS ...........................................................................	104
FIGURE 42: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .........................................................	104
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS...................................................................................	124
FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW) .......................................................................	125
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................	126
FIGURE 46: TOP VIEW OF THE MODULE ....................................................................................................	127
FIGURE 47: BOTTOM VIEW OF THE MODULE............................................................................................	127
FIGURE 48: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE..............................................	129
FIGURE 49: TAPE DIMENSIONS ...................................................................................................................	130
FIGURE 50: REEL DIMENSIONS ...................................................................................................................	131

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1 Introduction

This document defines the SC66 module and describes its air interface and hardware interface which are connected with customers’ applications.

This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of SC66 module. Associated with application note and user guide, customers can use SC66 module to design and set up mobile applications easily.

Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [SC66-MW] is in compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm

The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.

	AT	BE	BG	HR	CY	CZ	DK
	EE	FI	FR	DE	EL	HU	IE
	IT	LV	LT	LU	MT	NL	PL
	PT	RO	SK	SI	ES	SE	UK

The device could be used with a separation distance of 20cm to the human body.

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OEM/Integrators Installation Manual

Important Notice to OEM integrators

1.This module is limited to OEM installation ONLY.

2.This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).

3.The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations

4.For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part

15Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).

The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

End Product Labeling

When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR201905SC66MW”

“Contains IC: 10224A-20195SC66MW “

The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

Antenna Installation

(1)The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2)The transmitter module may not be co-located with any other transmitter or antenna.

(3)Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna	2.4GHz	5.2GHz	5.3GHz	5.5GHz	5.8GHz
type	band	band	band	band	band
	Peak Gain	Peak Gain	Peak Gain	Peak Gain	Peak Gain
	(dBi)	(dBi)	(dBi)	(dBi)	(dBi)
External	5.38	4.48	4.48	5.05	4.54
antenna

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

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with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Industry Canada Statement

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

(1)This device may not cause interference; and

(2)This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

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(1)l'appareil ne doit pas produire de brouillage, et

(2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."

The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.

The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and

The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.

L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par la technologie.

Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;

Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit être conforme à la norme e.r.p. limite; et

Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à la norme e.i.r.p. les limites spécifiées pour un fonctionnement point à point et non point à point, selon le cas.

CAN ICES-3(B)/ NMB-3(B)

Radiation Exposure Statement

This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

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1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating SC66 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description

SC66 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and provides industrial grade performance. Its general features are listed below:

Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO/CDMA, EDGE and GPRS coverage

Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT5.0 LE standards

Integrate GPS/GLONASS/BeiDou satellite positioning systems

Support multiple audio and video codecs

Built-in high performance AdrenoTM 512 graphics processing unit

Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces

SC66 are available in six variants: SC66-MW*, SC66-CE*, SC66-A*, SC66-J*, SC66-E*, SC66-W*.

The following table shows the supported frequency bands of SC66.

Table 1: SC66-CE* Frequency Bands

Type	Frequency Bands
LTE-FDD	B1/B3/B5/B8
LTE-TDD	B34/B38/B39/B40/B41
WCDMA	B1/B8
TD-SCDMA	B34/B39
EVDO/CDMA	BC0
GSM	900/1800MHz
Wi-Fi 802.11a/b/g/n/ac	2402MHz~2482MHz; 5180MHz~5825MHz

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BT5.0

2402MHz~2480MHz

GPS: 1575.42MHz±1.023MHz GNSS GLONASS: 1597.5MHz~1605.8MHz

BeiDou: 1561.098MHz±2.046MHz

Table 2: SC66-A* Frequency Bands

Type	Frequency Bands
LTE-FDD	B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71
LTE-TDD	B41(200M)
WCDMA	B2/B4/B5
Wi-Fi 802.11a/b/g/n/ac	2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0	2402MHz~2480MHz
	GPS: 1575.42MHz±1.023MHz
GNSS	GLONASS: 1597.5MHz~1605.8MHz
	BeiDou: 1561.098MHz±2.046MHz
Table 3: SC66-J* Frequency Bands
Type	Frequency Bands
LTE-FDD	B1/B3/B5/B8/B11/B18/B19/B21/B26/B28(A+B)
LTE-TDD	B41(120M)
WCDMA	B1/B6/B8/B19
Wi-Fi 802.11a/b/g/n/ac	2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0	2402MHz~2480MHz
	GPS: 1575.42MHz±1.023MHz
GNSS	GLONASS: 1597.5MHz~1605.8MHz
	BeiDou: 1561.098MHz±2.046MHz

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	Table 4: SC66-E* Frequency Bands
	Type	Frequency Bands
	LTE-FDD	B1/B2/B3/B4/B5/B7/B8/B20/B28(A+B)
	LTE-TDD	B38/B39/B40/B41(200M)
	WCDMA	B1/B2/B4/B5/B8
	GSM	B2/B3/B5/B8
	Wi-Fi 802.11a/b/g/n/ac	2402MHz~2482MHz; 5180MHz~5825MHz
	BT 5.0	2402MHz~2480MHz
		GPS: 1575.42MHz±1.023MHz
	GNSS	GLONASS: 1597.5MHz~1605.8MHz
		BeiDou: 1561.098MHz±2.046MHz

Table 5: SC66-W* Frequency Bands

Type	Frequency Bands
LTE-FDD	/
LTE-TDD	/
WCDMA	/
TD-SCDMA	/
CDMA	/
GSM	/
Wi-Fi 802.11a/b/g/n/ac	2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0	2402MHz~2480MHz
GNSS	/

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Table 6: SC66-MW*(2*2 MIMO WIFI) Frequency Bands

Type	Frequency Bands
LTE-FDD	/
LTE-TDD	/
WCDMA	/
TD-SCDMA	/
CDMA	/
GSM	/
Wi-Fi 802.11a/b/g/n/ac	2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0	2402MHz~2480MHz
GNSS	/

NOTE

“*” means under development. SC66-A SC66-J SC66-E SC66-MW support WIFI_MIMO

SC66 is an SMD type module which can be embedded into applications through its 324 pins (including 152 LCC pads and 172 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC66 can meet almost all requirements for M2M applications such as smart metering, smart home, security, routers, wireless POS, mobile computing devices, PDA phone, tablet PC, etc.

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2.2. Key Features

The following table describes the detailed features of SC66 module.

Table 7: SC66 Key Features

Features		Details
		Customized 64-bit ARM v8-compliant applications processorCustomized
		64-bit ARM v8-compliant applications processor
Application Processor		 Kryo Gold: quad high-performance cores targeting 2.2 GHz
		 Kryo Silver: quad low-power cores targeting 1.843 GHz
		 two quad-core processors with 1MB L2 cache
Modem system		LTE Cat 6(FDD and TDD), 2*20 CA(40MHz)
GPU		Adreno 512 up to 650 MHzAdreno 512 up to 650 MHz
Memory		32GB eMMC + 3GB LPDDR4x(default)
		64GB eMMC + 4GB LPDDR4x (optional)
Operating System		Android 9
Power Supply		VBAT Supply Voltage: 3.55V~4.4V
		Typical 4.0V
		Class 4 (33dBm±2dB) for EGSM900
		Class 1 (30dBm±2dB) for DCS1800
		Class E2 (27dBm±3dB) for EGSM900 8-PSK
		Class E2 (26dBm±3dB) for DCS1800 8-PSK
Transmitting Power		Class 3 (24dBm+1/-3dB) for WCDMA bands
		Class 3 (24dBm+3/-1dB) for EVDO/CDMA BC0
		Class 2 (24dBm+1/-3dB) for TD-SCDMA bands
		Class 3 (23dBm±2dB) for LTE-FDD bands
		Class 3 (23dBm±2dB) for LTE-TDD bands
		Support 3GPP R12 Cat 6* and Cat 4
		Support 1.4 MHz to 20MHz RF bandwidth
		Support Multiuser MIMO in DL direction
LTE Features		 Cat 6* FDD: Max 300Mbps (DL)/Max 50Mbps (UL)
		 Cat 6* TDD: Max 265Mbps (DL)/Max 30Mbps (UL)
		 Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
		 Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
		Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA
UMTS Features		Support QPSK, 16-QAM and 64-QAM modulation
		 DC-HSDPA: Max 42Mbps (DL)
		 DC-HSUPA: Max 11.2Mbps (UL)

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		 WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
	TD-SCDMA Features	Support CCSA Release 3 TD-SCDMA
		 Max 4.2Mbps (DL)/Max 2.2Mbps (UL)
		Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A
	CDMA2000 Features	 EVDO: Max 3.1Mbps (DL)/Max 1.8 Mbps (UL)
		 1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL)
		R99
		CSD: 9.6kbps, 14.4kbps
		GPRS
		Support GPRS multi-slot class 33 (33 by default)
		Coding scheme: CS-1, CS-2, CS-3 and CS-4
		Max 107Kbps (DL), 85.6Kbps (UL)
	GSM Features	EDGE
		Support EDGE multi-slot class 33 (33 by default)
		Support GMSK and 8-PSK for different MCS (Modulation and Coding
		Scheme)
		Downlink coding schemes: CS 1-4 and MCS 1-9
		Uplink coding schemes: CS 1-4 and MCS 1-9
		Max 296Kbps (DL), 236.8Kbps (UL)
	WLAN Features	2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps
		Support AP and STA mode
	Bluetooth Features	BT5.0 LE
	GNSS Features	GPS/GLONASS/BeiDou
		Text and PDU mode
	SMS	Point-to-point MO and MT
		SMS cell broadcast
		Support for MIPI_DSI and DP overTYPE-C for dual screen display
	LCM Interfaces	MIPI_DSI Supports up to 2560x1600@60fps
		DP supports 4K@30fps
		Support three groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane
	Camera Interfaces	Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane +
		2-lane + 1-lane)
		up to 24MP with dual ISP
	Video Codec	Video encoding and decoding: up to 4K @30fps
		Concurrency: encoding up to 1080P @30fps; decoding up to 1080P @60fps
		Audio Input
		Three analog microphone inputs, integrating internal bias voltage
	Audio Interfaces	Audio Output
		Class AB stereo headphone output
		Class AB earpiece differential output
		Class D speaker differential amplifier output
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	Audio Codec	EVRC, EVRC-B, EVRC-WB; G.711, G.729A/AB; GSM-FR, GSM-EFR,
		GSM-HR; AMR-NB, AMR-WB, AMR-eAMR, AMR-BeAMR
		Compliant with USB 3.1 and 2.0 specifications, with transmission rates up to
		10Gbps on USB 3.1 and 480Mbps on USB 2.0.
	USB Interface	Support USB OTG
		Used for AT command communication, data transmission, software
		debugging and firmware upgrade
		4 UART Interfaces: DEBUG UART UART6 UART1 and LPI_UART_2
		 UART6: 4-wire UART interface with RTS/CTS hardware flow control,
	UART Interfaces	max rate up to 4Mbps
		 UART1: terface
		 DEBUG: 2-wire UART interface used for debugging
		 LPI_UART_2:low power uart, use is not recommended for the time being
	SD Card Interface	Support SD 3.0
		Support SD card hot-plug
		2 (U)SIM interfaces
	(U)SIM Interfaces	Support USIM/SIM card: 1.8V/2.95V
		Support Dual SIM Dual Standby (supported by default)
	I2C Interfaces	It supports up to five I2C interfaces, used for peripherals such as TP, camera,
		sensor, etc.
	I2S Interface	Supports two I2S, one of which is low power I2S
	ADC Interfaces	2 general purpose ADC interfaces
	SPI Interfaces	One SPI interfaces, only support master mode
	Real Time Clock	Supported
	Antenna Interfaces	Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna
		interfaces
		Size: (43.0±0.15)mm × (44.0±0.15)mm × (2.85±0.2)mm
	Physical Characteristics	Package: LCC + LGA
		Weight: approx. 13.0g
		Operating temperature range: -35°C ~ +65°C 1)
	Temperature Range	Extended temperature range: -40°C ~ +75°C 2)
		Storage temperature range: -40°C ~ +90°C
	Firmware Upgrade	Over USB interface
	RoHS	All hardware components are fully compliant with EU RoHS directive

NOTES

1. 1) Within operation temperature range, the module is 3GPP compliant.

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2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to

the normal operating temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development.

2.3. Functional Diagram

The following figure shows a block diagram of SC66 and illustrates the major functional parts.

Power management

Radio frequency

Baseband

LPDDR4X+eMMC flash

Peripheral interfaces

--USB interface

--(U)SIM interfaces

--UART interfaces

--SD card interface

--I2C interfaces

- I2S interfaces

--SPI interfaces --ADC interfaces

--LCM (MIPI) interfaces

--TP (touch panel) interfaces

--Camera (MIPI) interfaces

--Audio interfaces

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Power	Power							ANT_WIFI/BT		ANT_WIFI/BT
Signal	Function
		V DD_ RF
VOL_UP
MICs
SPK								FEM		FEM
	Codec
EAR
Headset
SD_VDD	PM660L
SD_PU_VDD
LDO3B_2P8
LDO7B_3P125							38.4MHZ
							XO
PWM									WCN
VPH_PWR
		BBCLK
VRTC		RFCLK				PM-3003A
USIM1_VDD									LPDDR
USIM2_VDD
									eMMC
LDO11A_1P8	PM660
LDO13A_1P8		38.4 M
LDO14A_1P8		XO
ADCs	HK ADC	Porcessors				Air Interface			MEM
	&MPPs						Baseband
PWRKEY
VOL DOWN							Connectivity
VBUS		Multimedia
BATTERY
										13.2
										769
		SPI	LCM	TP	CAM	USB	2×(U)SIM UART	SD 3.0	I2S	I2C GPIOs
						2.0&3.1

This diagram just used for SC66-MW

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Power	Power
Signal	Function	C1
		V DD_ RF
VOL_UP
MICs
SPK
EAR	Codec
Headset
SD_VDD	PM660L
SD_PU_VDD
LDO3B_2P8
LDO7B_3P125
PWM
VPH_PWR
		BBCLK
VRTC		RFCLK
USIM1_VDD
USIM2_VDD
LDO11A_1P8	PM660
LDO13A_1P8
LDO14A_1P8
ADCs	HK ADC
	&MPPs
PWRKEY
VOL DOWN
VBUS
BATTERY

-

ANT_ MAIN

ANT_ GNSS

ANT_DRX

ANT_WIFI/BT

ANT_WIFI/BT

					SAW	Switch
		Switch
	APT				LNA
		SAW	Duplexs			SAW	FEM	FEM
					SAW
	0	PA
				Tranceiver		38.4MHZ
						XO		WCN
					PM-3003A			LPDDR
								eMMC
	38.4 M
	XO
	Porcessors				Air Interface			MEM
						Baseband
	Multimedia					Connectivity
								13.2
								769
	SPI	LCM	TP	CAM	USB	2×(U)SIM UART	SD 3.0	I2S I2C GPIOs
					2.0&3.1

Figure 1: Functional Diagram

NOTE

The red dotted frame is WIFI_MIMO path, which is not supported by SC66-CE and SC66-W.

2.4. Evaluation Board

In order to help customers develop applications with SC66 conveniently, Quectel supplies the evaluation board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone, antenna and other peripherals to control or test the module.

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3 Application Interfaces

3.1. General Description

SC66 is equipped with 324-pin 1.0mm pitch SMT pads that can be embedded into cellular application platform. The following chapters provide the detailed description of pins/interfaces listed below.

Power supply

Turn on and off function

VRTC interface

Power Output

Charging interface

USB interface

UART interfaces

(U)SIM interfaces

SD card interface

GPIO interfaces

I2C interfaces

I2S interfaces

SPI interfaces

ADC interfaces

LCM interfaces

TP (touch panel) interfaces

Camera interfaces

Sensor interfaces

Audio interfaces

Emergency download interface

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3.2. Pin Assignment

The following figure shows the pin assignment of SC66 module.

320

1
2
3
4
5
6	153
7
8	154
9
10	155
11
12	156

13
14	157
15
16	158
17
18	159
19
20	160
21
22	161
23
24	162
25
26	163
27
28	164
29
30	165
31
32	166
33
34
35
36
37
38
	321

152

151

150

149

148

147

146

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

126

125

124

211

212	257	264	271	278	285	292	299	306
213
	258	265	272	279	286	293	300	307
214
	259	266	273	280	287	294	301	308
215
216	260	267	274	281	288	295	302	309
217
	261	268	275	282	289	296	303	310
218
	262	269	276	283	290	297	304	311
219
220	263	270	277	284	291	298	305	312

221

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

GND

POWER

AUDIO

USB

(U)SIM

SD

TP

LCM

CAMERA

ANT

UART

123

122

121

120

119

118

117

116

115

324

323

	195
	194
	244
	193
313	243

192

242

314	191
	241
	190
315
	240
	189
316	239
	188
	238
317	187
	237
	186
318	236
	185
	235
319
	184
	234
	183
	182

322

68

69

70

71

72

73

74

75

76

GPIO RESERVED OTHERS

114

113

112

111

110

109

108

107

106

105

104

103

102

101

100

99

98

97

96

95

94

93

92

91

90

89

88

87

86

85

84

83

82

81

80

79

78

77

Figure 2: Pin Assignment (Top View)

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3.3. Pin Description

Table 8: I/O Parameters Definition

Type	Description
IO	Bidirectional
DI	Digital input
DO	Digital output
PI	Power input
PO	Power output
AI	Analog input
AO	Analog output
OD	Open drain

The following tables show the SC66’s pin definition and electrical characteristics.

Table 9: Pin Description

Power Supply

	Pin Name	Pin No.	I/O	Description	DC Characteristics	Comment
						It must be able to
						provide sufficient
					Vmax=4.4V	current up to 3.0A.
			PI/P	Power supply for the		It is suggested to
	VBAT	36,37, 38			Vmin=3.55V
			O	module		use a TVS to
					Vnorm=4.0V
						increase voltage
						surge withstand
						capability.
				Connect to external
				bypass capacitors to	Vmax=4.4V	Do not load
	VDD_RF	1, 2	PO	eliminate voltage	Vmin=3.55V
						externally.
				fluctuation of RF	Vnorm=4.0V
				part.
	VRTC	16	PI/P	Power supply for	VOmax=3.2V
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				O	internal RTC circuit	When VBAT is not
						connected
						:
						VI=2.1V~3.25V
							Power supply for
		LDO13A_1	9	PO	1.8V output power	Vnorm=1.8V	external GPIO’s
		P8			supply	IOmax=20mA	pull up circuits and
							level shift circuit.
		LDO7B_3P	157	PO	3.125V output power	Vnorm=3.125V	Power supply only
	125				supply	IOmax=150mA	for DP switch
							Power supply for
		LDO11A_1P	10	PO	1.8V output power	Vnorm=1.8V	I/O VDD of
	8				supply	IOmax=150mA	cameras, LCDs
							and TP etc.
							Power supply for
							Sensors. Add a
		LDO14A_1			1.8V output power	Vnorm=1.8V	1.0uF~4.7uF
			158	PO			bypass capacitor if
		P8			supply	IOmax=150mA
							used.
							If unused, keep
							this pin open.
							Power supply for
							sensor and LCM.
		LDO3B_2P			2.8V output power	Vnorm=2.8V	Add a 1.0uF~2.2uF
			12	PO			bypass capacitor if
	8				supply	IOmax=600mA
							used.
							If unused, keep
							this pin open.
		VPH_PWR 30		PO	VBAT output power	Vnorm=VBAT	Power supply for
					supply	IOmax=1000mA	other ICs.ICs
			3 4 18
			20 24
		GND			Ground
			31 34
			35 40

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43 47

56 62

87 98

101 112

125 128

130 133

135 148

150 159

160 163

166 170

173 176

182 193

195 219

225 243 257~323

Audio Interfaces

	Pin Name	Pin No.	I/O	Description		DC Characteristics	Comment
	MIC_BIAS	167	AO	Microphone bias		VO=1.6V~2.9V
				voltage
	MIC1_P	44	AI	Microphone positive
				input for channel 1
				Microphone
	MIC1_M	45	AI	negative input	for
				channel 1
				Microphone			If unused, it should
	MIC_GND	168					be connected to
				reference ground
							GND
	MIC2_P	46	AI	Microphone			Headset mic input
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				positive input	for
				headset
				Microphone
	MIC3_P	169	AI	positive input for			Second mic input
				second mic
	EAR_P	53	AO	Earpiece positive
				output
	EAR_M	52	AO	Earpiece negative
				output
	SPK_P	55	AO	Speaker positive
				output
	SPK_M	54	AO	Speaker negative
				output
	HPH_R	51	AO	Headphone right
				channel output
				Headphone			It should be
	HPH_REF	50	AI				connected to main
				reference ground
							GND
	HPH_L	49	AO	Headphone left
				channel output
	HS_DET	48	AI	Headset insertion			Default high level
				detection
	USB Interface
	Pin Name	Pin No.	I/O	Description		DC Characteristics	Comment
				Charging power
				input.
				Power supply		Vmax=10V
			PI/P	output for OTG
	USB_VBUS	41, 42				Vmin=3.6V
			O	device.
						Vnorm=5.0V
				USB/charger
				insertion
				detection.
	USB2_HS_			USB 2.0
		25	IO	differential data
	DM
				bus (minus)		USB 2.0 standard	90Ω differential
						compliant	impedance.
	USB2_HS_			USB 2.0
		26	IO	differential data
	DP
				bus (plus)
	USB1_HS_			USB 2.0		USB 2.0 standard	90Ω differential
		33	IO	differential data			impedance;
	DM					compliant
				bus (minus)			One part of the

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	USB1_HS_			USB 2.0			TYPE-C.
		32	IO	differential data
	DP
				bus (plus)
	USB_SS2_T			USB 3.1
		165	IO	differential
	X_P
				transmit (plus)
	USB_SS2_T			USB 3.1
		164	IO	differential
	X_M
				transmit (minus)	USB 3.1 channel2		90Ω differential
					standard compliant		impedance.
	USB_SS2_			USB 3.1
		162	IO	differential receive
	RX_P
				(plus)
	USB_SS2_			USB 3.1
		161	IO	differential receive
	RX_M
				(minus)
	USB_SS1_			USB 3.1
		171	IO	differential receive
	RX_P
				(plus)			90Ω differential
							impedance.
	USB_SS1_			USB 3.1
		172	IO	differential receive
	RX_M
				(minus)	USB 3.1 channel1
					standard compliant
	USB_SS1_T			USB 3.1
		174	IO	differential
	X _P
				transmit (plus)			90Ω differential
							impedance.
	USB_SS1_T			USB 3.1
		175	IO	differential
	X _M
				transmit (minus)
				USB Type-C			When micro usb is
	USB_CC1	224	AI	detection channel			used ,it can be
				1			used as ID pin
				USB Type-C
	USB_CC2	223	AI	detection channel
				2
							When USB
							TYPE-C is used, it
							should be
				TYPE-C&uUSB			connected to
	UUSB_TYP						VPH_PWR
		23	DI	configuration
	EC						through 10K
				control pin
							resistor. When
							uUSB is used, it
							should be
							connected to GND
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						through 10K
						resistor.
						When USB
						TYPE-C is used, it
						should be
	SS_DIR_IN 21		DI	CC status		connected to
				detection pin		SS_DIR_OUT.
						When uUSB is
						used, it should be
						connected to GND.
						When USB
						TYPE-C is used, it
						should be
	SS_DIR_OU	226	DO	CC status output		connected to
	T			pin		SS_DIR_IN. When
						uUSB is used, it
						should be kept
						open.
	(U)SIM Interfaces
	Pin Name	Pin	I/O Description		DC Characteristics	Comment
		No.

	USIM1_DET	145	DI	(U)SIM1 card	VILmax=0.63V
				hot-plug detection	VIHmin=1.17V

Active Low. Require external pull-up to 1.8V. If unused, keep this pin open.

	USIM1_RST	144	DO	(U)SIM1 card	VOLmax=0.4V
				reset signal
					VOHmin=
				(U)SIM1 card
	USIM1_CLK	143	DO		0.8 × USIM1_VDD
				clock signal
					VILmax=
					0.2 × USIM1_VDD
				(U)SIM1 card data	VIHmin=
	USIM1_DATA	142	IO		0.7 × USIM1_VDD
				signal
					VOLmax=0.4V
					VOHmin=
					0.8 × USIM1_VDD
				(U)SIM1 card		Either 1.8V or
	USIM1_VDD	141	PO			2.95V (U)SIM card
				power supply
						is supported.
	USIM2_DET	256	DI	(U)SIM2 card	VILmax=0.63V	Active Low.
				detection	VIHmin=1.17V	Need external

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pull-up to 1.8V. If unused, keep this pin open.

				(U)SIM2 card	VOLmax=0.4V
	USIM2_RST	207	DO		VOHmin=
				reset signal
					0.8 × USIM2_VDD
				(U)SIM2 card	VOLmax=0.4V
	USIM2_CLK	208	DO		VOHmin=
				clock signal
					0.8 × USIM2_VDD
					VILmax=
					0.2 × USIM2_VDD
				(U)SIM2 card data	VIHmin=
	USIM2_DATA	209	IO		0.7 × USIM2_VDD
				signal
					VOLmax=0.4V
					VOHmin=
					0.8 × USIM2_VDD

				(U)SIM2 card	Either 1.8V or
	USIM2_VDD	210	PO		2.95V (U)SIM card
				power supply
					is supported.

UART Interfaces

	Pin Name	Pin	I/O Description		DC Characteristics	Comment
		.
				DEBUG transmit
	DEBUG_TXD	5	DO	data.	VOLmax=0.45V
				Debug port by	VOHmin=1.35V
				default.
				DEBUG receive
	DEBUG_RXD	6	DI	data.	VILmax=0.63V
				Debug port by	VIHmin=1.17V
				default.
	UART1_TXD	7	DO	UART1 transmit	VOLmax=0.45V	1.8V power
				data	VOHmin=1.35V
						domain.
	UART1_RXD	8	DI	UART1 receive	VILmax=0.63V	If unused, keep
				data	VIHmin=1.17V	these pins open.
	UART6_RXD	198	DI	UART6 receive	VILmax=0.63V
				data	VIHmin=1.17V
	UART6_TXD	199	DO	UART6 transmit	VOLmax=0.45V
				data	VOHmin=1.35V
	UART6_RTS	245	DO	UART6 request to	VOLmax=0.45V
				send	VOHmin=1.35V
	UART6_CTS	246	DI	UART6 clear to	VILmax=0.63V
				send	VIHmin=1.17V
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LPI_UART_2_T		60	DO	UART2 transmit	VOLmax=0.45V
XD				data	VOHmin=1.35V
LPI_UART_2_R		61	DI	UART2 receive	VILmax=0.63V
XD				data	VIHmin=1.17V
SD Card Interface
Pin Name		Pin	I/O	Description	DC Characteristics	Comment
	.
					1.8V SD card:
					VOLmax=0.45V
				High speed digital	VOHmin=1.4V
SD_CLK		70	DO	clock signal of SD
				card	2.95V SD card:
					VOLmax=0.368V
					VOHmin=2.125V
SD_CMD		69	IO	Command signal
				of SD card
					1.8V SD card:
SD_DATA0		68	IO		VILmax=0.58V
					VIHmin=1.27V
					VOLmax=0.45V
				High speed	VOHmin=1.4V
SD_DATA1		67	IO
				bidirectional digital
					2.95V SD card:
				signal lines of SD
					VILmax=0.737V
				card
					VIHmin=1.843V
SD_DATA2		66	IO
					VOLmax=0.368V
					VOHmin=2.125V
SD_DATA3		65	IO
SD_DET		64	DI	SD card insertion	VILmax=0.63V	Active low.
				detection	VIHmin=1.17V
SD_VDD		63	PO	Power supply for	Vnorm=2.95V
				SD card	IOmax=600mA
					Vnorm=1.8V/2.95V	Power supply for
SD_PU_VDD		179	PO	2.95V output		SD card’s pull-up
					IOmax=50mA
						circuit.
TP (Touch Panel) Interfaces
Pin Name		Pin N	I/O	Description	DC Characteristics	Comment

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						Smart LTE Module Series
						SC66 Hardware Design
	TP0_RST	138	DO	Reset signal of	VOLmax=0.45V	1.8V power
				touch panel (TP0)	VOHmin=1.35V	domain. Active low.
	TP0_INT	139	DI	Interrupt signal of	VILmax=0.63V	1.8V power
				touch panel (TP0)	VIHmin=1.17V	domain.
	TP0_I2C_SCL	140	OD	I2C clock signal of		1.8V power
				touch panel (TP0)		domain.
	TP0_I2C_SDA	206	OD	I2C data signal of		1.8V power
				touch panel (TP0)		domain.
	LCM Interfaces
	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		No.
	PWM	152	DO	PWM Output

	LCD0_RST	127	DO LCD0 reset signal	VOLmax=0.45V
				VOHmin=1.35V

1.8V power domain It should not be pulled up.

	LCD0_TE	126	DI	LCD0 tearing	VILmax=0.63V	1.8V power
				effect signal	VIHmin=1.17V	domain.
	DSI0_CLK_N	116	AO	LCD0 MIPI clock
				signal (negative)		85Ω differential
						impedance.
	DSI0_CLK_P	115	AO	LCD0 MIPI clock signal
				(positive)
	DSI0_LN0_N	118	AO	LCD0 MIPI lane 0 data
				signal (negative)		85Ω differential
						impedance.
	DSI0_LN0_P	117	AO	LCD0 MIPI lane 0 data
				signal (positive)
	DSI0_LN1_N	120	AO	LCD0 MIPI lane 1 data
				signal (negative)		85Ω differential
						impedance.
	DSI0_LN1_P	119	AO	LCD0 MIPI lane 1 data
				signal (positive)
	DSI0_LN2_N	122	AO	LCD0 MIPI lane 2 data
				signal (negative)		85Ω differential
						impedance.
	DSI0_LN2_P	121	AO	LCD0 MIPI lane 2 data
				signal (positive)
	DSI0_LN3_N	124	AO	LCD0 MIPI lane 3 data
				signal (negative)		85Ω differential
						impedance.
	DSI0_LN3_P	123	AO	LCD0 MIPI lane 3 data
				signal (positive)

Camera Interfaces

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						SC66 Hardware Design
	Pin Name	Pin	I/O Description		DC		Comment
		No.			Characteristics
	CSI1_CLK_N	89	AI	MIPI clock signal of rear
				camera (negative)			85Ω differential
							impedance.
	CSI1_CLK_P	88	AI	MIPI clock signal of rear
				camera (positive)
	CSI1_LN0_N	91	AI	MIPI lane 0 data signal of
				rear camera (negative)			85Ω differential
							impedance.
	CSI1_LN0_P	90	AI	MIPI lane 0 data signal of
				rear camera (positive)
	CSI1_LN1_N	93	AI	MIPI lane 1 data signal of
				rear camera (negative)			85Ω differential
							impedance.
	CSI1_LN1_P	92	AI	MIPI lane 1 data signal of
				rear camera (positive)
	CSI1_LN2_N	95	AI	MIPI lane 2 data signal of
				rear camera (negative)			85Ω differential
							impedance.
	CSI1_LN2_P	94	AI	MIPI lane 2 data signal of
				rear camera (positive)
	CSI1_LN3_N	97	AI	MIPI lane 3 data signal of
				rear camera (negative)			85Ω differential
							impedance.
	CSI1_LN3_P	96	AI	MIPI lane 3 data signal of
				rear camera (positive)
	CSI2_CLK_N	184	AI	MIPI clock signal of depth
				camera (negative)			85Ω differential
							impedance.
	CSI2_CLK_P	183	AI	MIPI clock signal of depth
				camera (positive)
	CSI2_LN0_N	186	AI	MIPI lane 0 data signal of
				depth camera (negative)			85Ω differential
							impedance.
	CSI2_LN0_P	185	AI	MIPI lane 0 data signal of
				depth camera (positive)
	CSI2_LN1_N	188	AI	MIPI lane 1 data signal of
				depth camera (negative)			85Ω differential
							impedance.
	CSI2_LN1_P	187	AI	MIPI lane 1 data signal of
				depth camera (positive)
	CSI2_LN2_N	190	AI	MIPI lane 2 data signal of			85Ω differential
				depth camera (negative)
							impedance.
	CSI2_LN2_P	189	AI	MIPI lane 2 data signal of
				depth camera (positive)
	CSI2_LN3_N	192	AI	MIPI lane 3 data signal of			85Ω differential
				depth camera (negative)
							impedance.
	CSI2_LN3_P	191	AI	MIPI lane 3 data signal of
				depth camera (positive)
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	CSI0_CLK_N	78	AI	MIPI clock signal of front
				camera (negative)			85Ω differential
							impedance.
	CSI0_CLK_P	77	AI	MIPI clock signal of front
				camera (positive)
	CSI0_LN0_N	80	AI	MIPI lane 0 data signal of
				front camera (negative)			85Ω differential
							impedance.
	CSI0_LN0_P	79	AI	MIPI lane 0 data signal of
				front camera (positive)
	CSI0_LN1_N	82	AI	MIPI lane 1 data signal of
				front camera (negative)			85Ω differential
							impedance.
	CSI0_LN1_P	81	AI	MIPI lane 1 data signal of
				front camera (positive)
	CSI0_LN2_N	84	AI	MIPI lane 2 data signal of
				front camera (negative)			85Ω differential
							impedance.
	CSI0_LN2_P	83	AI	MIPI lane 2 data signal of
				front camera (positive)
	CSI0_LN3_N	86	AI	MIPI lane 3 data signal of
				front camera (negative)			85Ω differential
							impedance.
	CSI0_LN3_P	85	AI	MIPI lane 3 data signal of
				front camera (positive)
	MCAM_MCLK	99	DO	Master clock signal of rear			1.8V power
				camera			domain.
	SCAM_MCLK	100	DO	Master clock signal of front			1.8V power
				camera			domain.
	MCAM_RST	74	DO	Reset signal of rear			1.8V power
				camera			domain.
					VOLmax=0.45V
					VOHmin=1.35V
				Power down signal of rear			1.8V power
	MCAM_PWDN	73	DO
				camera			domain.
	SCAM_RST	72	DO	Reset signal of front			1.8V power
				camera			domain.
	SCAM_PWDN	71	DO	Power down signal of front			1.8V power
				camera			domain.
	CAM_I2C_SCL0	75	OD	I2C clock signal of camera			1.8V power
							domain.
	CAM_I2C_SDA	76	OD	I2C data signal of camera			1.8V power
0							domain.
	DCAM_MCLK	194	DO	Master clock signal of	VOLmax=0.45V		1.8V power domain
				depth camera	VOHmin=1.35V
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	DCAM_RST	180	DO	Reset signal of depth		1.8V power domain
				camera
	DCAM_PWDN	181	DO	Power down signal of		1.8V power domain
				depth camera
	CAM_I2C_SDA	197	OD	I2C data signal of depth		1.8V power domain
1				camera
	CAM_I2C_SCL1	196	OD	I2C data signal of depth		1.8V power
				camera		domain.
	Keypad Interfaces
	Pin Name	Pin	I/O	Description	DC	Comment
		No.			Characteristics
	PWRKEY	39	DI	Turn on/off the module		1.8V power domain
	VOL_UP	146	DI	Volume up		The voltage follows
						VBAT
	VOL_DWN	147	DI	Volume down		1.8V power domain
	SENSOR_I2C Interfaces
	Pin Name	Pin	I/O	Description	DC	Comment
		No.			Characteristics
	SENSOR_I2C_	131	OD	I2C clock signal of		1.8V power
	SCL			external sensors		domain.
	SENSOR_I2C_	132	OD	I2C data signal of external		1.8V power
	SDA			sensors		domain.
	ADC Interfaces
	Pin Name	Pin	I/O	Description	DC	Comment
		No.			Characteristics
	ADC0	151	AI			Max input
						voltage:1.8V
	ADC1	153	AI			Max input
						voltage:1.8V
	Antenna Interfaces
	Pin Name	Pin	I/O	Description	DC	Comment
		No.			Characteristics
	ANT_MAIN	19	IO	Main antenna interface		50Ω impedance

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ANT_DRX	149	AI	Diversity antenna interface
ANT_GNSS	134	AI	GNSS antenna interface
ANT_WIFI/BT	129	IO	Wi-Fi/BT antenna
			interface
ANT_WIFI_MIM	324	IO	Wi-Fi_MIMO antenna			SC66-CE SC66-W
O			interface			is not supported
GPIO Interfaces
Pin Name	Pin	I/O	Description		DC	Comment
	No.				Characteristics
GPIO_20	113		IO	GPIO		Can be	used	as
						LCD1_RST
GPIO_21	231		IO	GPIO
GPIO_34	236		IO	GPIO
GPIO_40	238		IO	GPIO
GPIO_41	237		IO	GPIO
GPIO_42	137		IO	GPIO		Can be	used	as
						TP1_INT
GPIO_43	136		IO	GPIO		Can be	used	as
						TP1_RST
GPIO_55	178		IO	GPIO	VILmax=0.63V
					VIHmin=1.17V
GPIO_56	177		IO	GPIO
					VOLmax=0.45V
					VOLmin=1.35V
GPIO_72	239		IO	GPIO
GPIO_73	59		IO	GPIO
GPIO_74	58		IO	GPIO
GPIO_76	232		IO	GPIO
GPIO_77	240		IO	GPIO
ACCL_INT	252		IO	GPIO
GYRO_INT	255		IO	GPIO
MAG_INT	254		IO	GPIO
ALPS_INT	253		IO	GPIO

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HALL_INT	218			IO	GPIO
GPIO_22	204			IO	GPIO
GPIO_23	205			IO	GPIO
GPIO_12	228			IO	GPIO
GPIO_13	227			IO	GPIO
GPIO_14	230			IO	GPIO
GPIO_15	229			IO	GPIO
GPIO_61	234			IO	GPIO
GPIO_03B	11			IO	GPIO
GPIO_08B	13			IO	GPIO
GPIO_04B	14			IO	GPIO
GPIO_05B	15			IO	GPIO
GPIO_11A	211			IO	GPIO
GPIO_13A	233			IO	GPIO
GRFC Interfaces
Pin Name	Pin No.			I/O	Description	DC	Comment
						Characteristics
GRFC_19	242			IO	GPIO		Only for RF debug.
							It should	not be
GRFC_18	241			IO	GPIO
							pulled up.
SPI Interfaces
Pin Name	Pin		I/O	Description		DC	Comment
	No.					Characteristics
SPI_CS	201		DO	Chip selection signal
SPI_CLK	200		DO	Clock signal			Only	support
							master mode
SPI_MOSI	248		DO	Data output signal
SPI_MISO	247		DI	Data input signal
I2S Interfaces

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		Pin Name	Pin	I/O	Description	DC	Comment
			No.			Characteristics
		MI2S_2_WS	203	DO	I2S Word selection signal
		MI2S_2_DATA0	249	IO	I2S DATA0 signal
		MI2S_2_SCK	250	DO	I2S Serial clock signal
		MI2S_2_DATA1	251	IO	I2S DATA1 signal
		MI2S_2_MCLK	114	DO	I2S Main clock signal
		LPI_MI2S_SCLK	212	DO	LPI_I2S serial clock signal
		LPI_MI2S_WS	156	DO	LPI_I2S word selection
					signal
		LPI_MI2S_DATA	154	IO	LPI_I2S DATA0 signal
0
		LPI_MI2S_DATA	155	IO	LPI_I2S DATA1 signal
1
		Emergency Download Interface
		Pin Name	Pin	I/O	Description	DC	Comment
			No.			Characteristics
							Pulled up to
							LDO13A_1P8
					Force the module to enter		during power-up
		USB_BOOT	57	DI	into emergency download		will force the
					mode		module to enter
							into emergency
							download mode.
		Other Interfaces
		Pin Name	Pin	I/O	Description	DC	Comment
			No.			Characteristics
		GNSS_PPS_OU	202	DO	LNA enable control		LNA enable control
		T
							If customers
							require automatic
		CBL_PWR_N	22	DI	Used for configuring auto		power-on, this pin
					power-on		should be

shorted-to-ground

.

Reserved Interface

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