SC66 Hardware Design
Smart LTE Module Series
Rev: SC66_Hardware_Design_V1.0
Date: 2019-03-08
Status: Preliminary
www.quectel.com
Smart LTE Module Series
SC66 Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
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Or email to: support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
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About the Document
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1.0 |
2019-03-08 |
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Smart LTE Module Series
SC66 Hardware Design
Contents
About the Document................................................................................................................................... |
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Contents |
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Table Index................................................................................................................................................... |
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Figure Index ................................................................................................................................................. |
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1 |
Introduction ........................................................................................................................................ |
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10 |
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1.1. ..................................................................................................................... |
Safety Information |
14 |
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2 |
Product ................................................................................................................................Concept |
15 |
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2.1. .................................................................................................................. |
General Description |
15 |
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2.2. ............................................................................................................................. |
Key Features |
19 |
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2.3. ................................................................................................................... |
Functional Diagram |
22 |
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2.4. ....................................................................................................................... |
Evaluation Board |
24 |
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3 |
Application .......................................................................................................................Interfaces |
25 |
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3.1. .................................................................................................................. |
General Description |
25 |
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3.2. ......................................................................................................................... |
Pin Assignment |
26 |
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3.3. .......................................................................................................................... |
Pin Description |
27 |
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3.4. ............................................................................................................................ |
Power Supply |
42 |
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3.4.1. ......................................................................................................... |
Power Supply Pins |
42 |
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3.4.2. .................................................................................................. |
Decrease Voltage Drop |
42 |
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3.4.3. ..............................................................................Reference Design for Power Supply |
43 |
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3.5. ......................................................................................................... |
Turn on and off Scenarios |
45 |
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3.5.1. .............................................................................Turn on Module Using the PWRKEY |
45 |
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3.5.2. ......................................................................................................... |
Restart the Module |
46 |
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3.6. ......................................................................................................................... |
VRTC Interface |
47 |
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3.7. ............................................................................................................................ |
Power Output |
48 |
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3.8. ............................................................................................. |
Battery Charge and Management |
48 |
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3.9. ............................................................................................................................ |
USB Interface |
51 |
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3.9.1. ......................................................................................................... |
TYPE-C Interfaces |
51 |
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3.9.2. .................................................................................................................. |
DP Interfaces |
54 |
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3.9.3. ................................................................................................................................ |
Host |
56 |
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3.10. ........................................................................................................................ |
UART Interfaces |
56 |
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3.11. ...................................................................................................................... |
(U)SIM Interfaces |
58 |
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3.12. ..................................................................................................................... |
SD Card Interface |
61 |
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3.13. ........................................................................................................................ |
GPIO Interfaces |
63 |
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3.14. ............................................................................................................................ |
I2C Interfaces |
64 |
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3.15. .............................................................................................................................. |
I2S Interface |
65 |
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3.16. ............................................................................................................................ |
SPI Interfaces |
66 |
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3.17. .......................................................................................................................... |
ADC Interfaces |
66 |
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3.18. .......................................................................................................................... |
LCM Interfaces |
67 |
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3.19. |
Touch Panel Interfaces ............................................................................................................. |
71 |
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3.20. |
Camera Interfaces..................................................................................................................... |
73 |
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3.20.1. |
Design Considerations ................................................................................................... |
79 |
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3.21. |
Sensor Interfaces ...................................................................................................................... |
81 |
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3.22. |
Audio Interfaces ........................................................................................................................ |
82 |
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3.22.1. Reference Circuit Design for Microphone Interfaces..................................................... |
83 |
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3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... |
84 |
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3.22.3. Reference Circuit Design for Headphone Interface....................................................... |
85 |
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3.22.4. Reference Circuit Design for Loudspeaker Interface..................................................... |
85 |
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3.22.5. Audio Interfaces Design Considerations........................................................................ |
85 |
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3.23. |
Emergency Download Interface................................................................................................ |
86 |
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4 |
Wi-Fi and BT ....................................................................................................................................... |
87 |
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4.1. |
Wi-Fi Overview.......................................................................................................................... |
87 |
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4.1.1. |
Wi-Fi Performance ......................................................................................................... |
87 |
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4.2. |
BT Overview.............................................................................................................................. |
89 |
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4.2.1. |
BT Performance ............................................................................................................. |
90 |
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5 |
GNSS |
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91 |
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5.1. |
GNSS Performance .................................................................................................................. |
91 |
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5.2. |
GNSS RF Design Guidelines.................................................................................................... |
92 |
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6 |
Antenna Interfaces............................................................................................................................. |
93 |
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6.1. |
Main/Rx-diversity Antenna Interfaces ....................................................................................... |
93 |
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6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design ....................................... |
97 |
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6.1.2. Reference Design of RF Layout..................................................................................... |
97 |
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6.2. |
Wi-Fi/BT Antenna Interface....................................................................................................... |
99 |
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6.3. |
GNSS Antenna Interface......................................................................................................... |
100 |
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6.3.1. Recommended Circuit for Passive Antenna ................................................................ |
101 |
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6.3.2. |
Recommended Circuit for Active Antenna ................................................................... |
102 |
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6.4. |
Antenna Installation................................................................................................................. |
102 |
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6.4.1. |
Antenna Requirements ................................................................................................ |
102 |
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6.4.2. Recommended RF Connector for Antenna Installation ............................................... |
103 |
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7 Electrical, Reliability and Radio Characteristics .......................................................................... |
105 |
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7.1. |
Absolute Maximum Ratings .................................................................................................... |
105 |
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7.2. |
Power Supply Ratings............................................................................................................. |
105 |
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7.3. |
Operation and Storage Temperatures..................................................................................... |
106 |
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7.4. |
Current Consumption.............................................................................................................. |
107 |
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7.5. |
RF Output Power .................................................................................................................... |
116 |
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7.6. |
RF Receiving Sensitivity ......................................................................................................... |
119 |
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7.7. |
Electrostatic Discharge ........................................................................................................... |
123 |
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8 |
Mechanical Dimensions .................................................................................................................. |
124 |
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8.1. |
Mechanical Dimensions of the Module ................................................................................... |
124 |
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8.2. |
Recommended Footprint ........................................................................................................ |
126 |
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8.3. |
Top and Bottom View of the Module ....................................................................................... |
127 |
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9 |
Storage, Manufacturing and Packaging ........................................................................................ |
128 |
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9.1. |
Storage .................................................................................................................................... |
128 |
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9.2. |
Manufacturing and Soldering .................................................................................................. |
129 |
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9.3. |
Packaging ............................................................................................................................... |
130 |
10 |
Appendix A References................................................................................................................... |
132 |
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11 |
Appendix B GPRS Coding Schemes ............................................................................................. |
135 |
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12 |
Appendix C GPRS Multi-slot Classes............................................................................................ |
136 |
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13 |
Appendix D EDGE Modulation and Coding Schemes ................................................................. |
138 |
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Smart LTE Module Series
SC66 Hardware Design
Table Index |
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TABLE 1: SC66-CE* FREQUENCY BANDS..................................................................................................... |
15 |
TABLE 2: SC66-A* FREQUENCY BANDS ....................................................................................................... |
16 |
TABLE 3: SC66-J* FREQUENCY BANDS ........................................................................................................ |
16 |
TABLE 4: SC66-E* FREQUENCY BANDS ....................................................................................................... |
17 |
TABLE 5: SC66-W* FREQUENCY BANDS ...................................................................................................... |
17 |
TABLE 6: SC66-MW*(2*2 MIMO WIFI) FREQUENCY BANDS ........................................................................ |
18 |
TABLE 7: SC66 KEY FEATURES ..................................................................................................................... |
19 |
TABLE 8: I/O PARAMETERS DEFINITION....................................................................................................... |
27 |
TABLE 9: PIN DESCRIPTION ........................................................................................................................... |
27 |
TABLE 10: POWER DESCRIPTION ................................................................................................................. |
48 |
TABLE 11: PIN DEFINITION OF CHARGING INTERFACE ............................................................................. |
49 |
TABLE 12: PIN DEFINITION OF USB INTERFACE ......................................................................................... |
51 |
TABLE 13: USB TRACE LENGTH INSIDE THE MODULE............................................................................... |
54 |
TABLE 14: THE DIFFERENCES BETWEEN USB MODE AND DISPLAYPORT MODE ................................. |
55 |
TABLE 15: USB2 CONFIGURATION ................................................................................................................ |
56 |
TABLE 16: PIN DEFINITION OF UART INTERFACES..................................................................................... |
57 |
TABLE 17: PIN DEFINITION OF (U)SIM INTERFACES................................................................................... |
59 |
TABLE 18: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ |
61 |
TABLE 19: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE ....................................................... |
62 |
TABLE 20: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... |
63 |
TABLE 21: PIN DEFINITION OF I2C INTERFACES......................................................................................... |
65 |
TABLE 22: PIN DEFINITION OF I2S INTERFACE ........................................................................................... |
65 |
TABLE 23: PIN DEFINITION OF SPI INTERFACES ........................................................................................ |
66 |
TABLE 24: PIN DEFINITION OF ADC INTERFACES ....................................................................................... |
66 |
TABLE 25: PIN DEFINITION OF LCM INTERFACES....................................................................................... |
67 |
TABLE 26: PIN DEFINITION OF TOUCH PANEL INTERFACES ..................................................................... |
72 |
TABLE 27: PIN DEFINITION OF CAMERA INTERFACES ............................................................................... |
74 |
TABLE 28: MIPI TRACE LENGTH INSIDE THE MODULE............................................................................... |
79 |
TABLE 29: PIN DEFINITION OF SENSOR INTERFACES ............................................................................... |
81 |
TABLE 30: PIN DEFINITION OF AUDIO INTERFACES ................................................................................... |
82 |
TABLE 31: WI-FI TRANSMITTING PERFORMANCE....................................................................................... |
87 |
TABLE 32: WI-FI RECEIVING PERFORMANCE.............................................................................................. |
88 |
TABLE 33: BT DATA RATE AND VERSIONS.................................................................................................... |
90 |
TABLE 34: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. |
90 |
TABLE 35: GNSS PERFORMANCE ................................................................................................................. |
91 |
TABLE 36: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES ......................................... |
93 |
TABLE 37: SC66-CE* MODULE OPERATING FREQUENCIES ...................................................................... |
93 |
TABLE 38: SC66-A* MODULE OPERATING FREQUENCIES......................................................................... |
94 |
TABLE 39: SC66-J* MODULE OPERATING FREQUENCIES ......................................................................... |
95 |
TABLE 40: SC66-E* MODULE OPERATING FREQUENCIES......................................................................... |
96 |
TABLE 41: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE ................................................................ |
99 |
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TABLE 42: WI-FI/BT FREQUENCY................................................................................................................. |
100 |
TABLE 43: PIN DEFINITION OF GNSS ANTENNA........................................................................................ |
100 |
TABLE 44: GNSS FREQUENCY..................................................................................................................... |
101 |
TABLE 45: ANTENNA REQUIREMENTS........................................................................................................ |
102 |
TABLE 46: ABSOLUTE MAXIMUM RATINGS ................................................................................................ |
105 |
TABLE 47: SC66 MODULE POWER SUPPLY RATINGS............................................................................... |
105 |
TABLE 48: OPERATION AND STORAGE TEMPERATURES ........................................................................ |
106 |
TABLE 49: SC66-CE* CURRENT CONSUMPTION ....................................................................................... |
107 |
TABLE 50: SC66-A* CURRENT CONSUMPTION.......................................................................................... |
109 |
TABLE 51: SC66-J* CURRENT CONSUMPTION ........................................................................................... |
110 |
TABLE 52: SC66-E* CURRENT CONSUMPTION........................................................................................... |
112 |
TABLE 53: SC66-CE* RF OUTPUT POWER................................................................................................... |
116 |
TABLE 54: SC66-A* RF OUTPUT POWER ..................................................................................................... |
116 |
TABLE 55: SC66-J* RF OUTPUT POWER...................................................................................................... |
117 |
TABLE 56: SC66-E* RF OUTPUT POWER ..................................................................................................... |
118 |
TABLE 57: SC66-CE* RF RECEIVING SENSITIVITY ..................................................................................... |
119 |
TABLE 58: SC66-A* RF RECEIVING SENSITIVITY....................................................................................... |
120 |
TABLE 59: SC66-J* RF RECEIVING SENSITIVITY ....................................................................................... |
121 |
TABLE 60: SC66-E* RF RECEIVING SENSITIVITY....................................................................................... |
122 |
TABLE 61: ESD CHARACTERISTICS (TEMPERATURE: 25°C, HUMIDITY: 45%)....................................... |
123 |
TABLE 50: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................. |
129 |
TABLE 63: REEL PACKAGING ....................................................................................................................... |
131 |
TABLE 64: RELATED DOCUMENTS .............................................................................................................. |
132 |
TABLE 65: TERMS AND ABBREVIATIONS .................................................................................................... |
132 |
TABLE 66: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ |
135 |
TABLE 67: GPRS MULTI-SLOT CLASSES .................................................................................................... |
136 |
TABLE 68: EDGE MODULATION AND CODING SCHEMES......................................................................... |
138 |
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... |
24 |
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... |
26 |
FIGURE 3: VOLTAGE DROP SAMPLE............................................................................................................. |
42 |
FIGURE 4: STRUCTURE OF POWER SUPPLY .............................................................................................. |
43 |
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. |
44 |
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................... |
45 |
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... |
45 |
FIGURE 8: AUTOMATIC BOOT REFERENCE CIRCUIT ................................................................................. |
46 |
FIGURE 9: TIMING OF RESTARTING MODULE ............................................................................................. |
46 |
FIGURE 10: RTC POWERED BY RECHARGEABLE BUTTON CELL............................................................. |
47 |
FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT ................................................... |
50 |
FIGURE 12: USB TYPE-C INTERFACE REFERENCE DESIGN ..................................................................... |
53 |
FIGURE 13: DISPLAY PORT INTERFACES.................................................................................................... |
56 |
FIGURE 14: USB2 HOST ................................................................................................................................. |
56 |
FIGURE 15: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART6).............................. |
58 |
FIGURE 16: RS232 LEVEL MATCH CIRCUIT (FOR UART5) .......................................................................... |
58 |
FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR |
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60 |
FIGURE 18: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR |
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60 |
FIGURE 19: REFERENCE CIRCUIT FOR SD CARD INTERFACE ................................................................. |
62 |
FIGURE 20: LCM0 EXTERNAL BACKLIGHT DRIVE REFERENCE CIRCUIT ................................................ |
69 |
FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... |
69 |
FIGURE 22: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE......................................................... |
70 |
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... |
71 |
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES....................................... |
73 |
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS .................................. |
76 |
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS .................................... |
77 |
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERA APPLICATIONS ................................ |
78 |
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE ........................... |
83 |
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE ........................................ |
84 |
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR EARPIECE IINTERFACE ............................................... |
84 |
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... |
85 |
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE ....................................... |
85 |
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE..................... |
86 |
FIGURE 34: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES .. |
97 |
FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB...................................................................... |
98 |
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB.................................................. |
98 |
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE |
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GROUND) .................................................................................................................................................. |
98 |
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE |
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GROUND) .................................................................................................................................................. |
99 |
FIGURE 37: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE ................................ |
100 |
FIGURE 38: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA ......................................... |
101 |
FIGURE 39: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ........................................... |
102 |
FIGURE 40: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM).............................................. |
103 |
FIGURE 41: MECHANICALS OF U.FL-LP CONNECTORS ........................................................................... |
104 |
FIGURE 42: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ......................................................... |
104 |
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS................................................................................... |
124 |
FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW) ....................................................................... |
125 |
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ |
126 |
FIGURE 46: TOP VIEW OF THE MODULE .................................................................................................... |
127 |
FIGURE 47: BOTTOM VIEW OF THE MODULE............................................................................................ |
127 |
FIGURE 48: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE.............................................. |
129 |
FIGURE 49: TAPE DIMENSIONS ................................................................................................................... |
130 |
FIGURE 50: REEL DIMENSIONS ................................................................................................................... |
131 |
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Smart LTE Module Series
SC66 Hardware Design
1 Introduction
This document defines the SC66 module and describes its air interface and hardware interface which are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of SC66 module. Associated with application note and user guide, customers can use SC66 module to design and set up mobile applications easily.
Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [SC66-MW] is in compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm
The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.
|
AT |
BE |
BG |
HR |
CY |
CZ |
DK |
|
EE |
FI |
FR |
DE |
EL |
HU |
IE |
|
IT |
LV |
LT |
LU |
MT |
NL |
PL |
|
PT |
RO |
SK |
SI |
ES |
SE |
UK |
The device could be used with a separation distance of 20cm to the human body.
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OEM/Integrators Installation Manual
Important Notice to OEM integrators
1.This module is limited to OEM installation ONLY.
2.This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3.The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations
4.For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part
15Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR201905SC66MW”
“Contains IC: 10224A-20195SC66MW “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1)The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2)The transmitter module may not be co-located with any other transmitter or antenna.
(3)Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.
Antenna |
2.4GHz |
5.2GHz |
5.3GHz |
5.5GHz |
5.8GHz |
type |
band |
band |
band |
band |
band |
|
Peak Gain |
Peak Gain |
Peak Gain |
Peak Gain |
Peak Gain |
|
(dBi) |
(dBi) |
(dBi) |
(dBi) |
(dBi) |
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External |
5.38 |
4.48 |
4.48 |
5.05 |
4.54 |
antenna |
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In the event that these conditions cannot be met (for example certain laptop configurations or co-location
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with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:
(1)This device may not cause interference; and
(2)This device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
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SC66 Hardware Design
(1)l'appareil ne doit pas produire de brouillage, et
(2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."
The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;
The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and
The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par la technologie.
Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;
Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit être conforme à la norme e.r.p. limite; et
Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à la norme e.i.r.p. les limites spécifiées pour un fonctionnement point à point et non point à point, selon le cas.
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.
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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating SC66 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
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SC66 Hardware Design
2 Product Concept
2.1. General Description
SC66 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and provides industrial grade performance. Its general features are listed below:
Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO/CDMA, EDGE and GPRS coverage
Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT5.0 LE standards
Integrate GPS/GLONASS/BeiDou satellite positioning systems
Support multiple audio and video codecs
Built-in high performance AdrenoTM 512 graphics processing unit
Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces
SC66 are available in six variants: SC66-MW*, SC66-CE*, SC66-A*, SC66-J*, SC66-E*, SC66-W*.
The following table shows the supported frequency bands of SC66.
Table 1: SC66-CE* Frequency Bands
Type |
Frequency Bands |
|
|
LTE-FDD |
B1/B3/B5/B8 |
|
|
LTE-TDD |
B34/B38/B39/B40/B41 |
|
|
WCDMA |
B1/B8 |
|
|
TD-SCDMA |
B34/B39 |
|
|
EVDO/CDMA |
BC0 |
|
|
GSM |
900/1800MHz |
|
|
Wi-Fi 802.11a/b/g/n/ac |
2402MHz~2482MHz; 5180MHz~5825MHz |
|
|
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BT5.0 |
2402MHz~2480MHz |
GPS: 1575.42MHz±1.023MHz GNSS GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Table 2: SC66-A* Frequency Bands
Type |
Frequency Bands |
|
|
LTE-FDD |
B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71 |
|
|
LTE-TDD |
B41(200M) |
|
|
WCDMA |
B2/B4/B5 |
|
|
Wi-Fi 802.11a/b/g/n/ac |
2402MHz~2482MHz; 5180MHz~5825MHz |
|
|
BT 5.0 |
2402MHz~2480MHz |
|
|
|
GPS: 1575.42MHz±1.023MHz |
GNSS |
GLONASS: 1597.5MHz~1605.8MHz |
|
BeiDou: 1561.098MHz±2.046MHz |
|
|
Table 3: SC66-J* Frequency Bands |
|
|
|
Type |
Frequency Bands |
|
|
LTE-FDD |
B1/B3/B5/B8/B11/B18/B19/B21/B26/B28(A+B) |
|
|
LTE-TDD |
B41(120M) |
|
|
WCDMA |
B1/B6/B8/B19 |
|
|
Wi-Fi 802.11a/b/g/n/ac |
2402MHz~2482MHz; 5180MHz~5825MHz |
|
|
BT 5.0 |
2402MHz~2480MHz |
|
|
|
GPS: 1575.42MHz±1.023MHz |
GNSS |
GLONASS: 1597.5MHz~1605.8MHz |
|
BeiDou: 1561.098MHz±2.046MHz |
|
|
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SC66 Hardware Design |
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Table 4: SC66-E* Frequency Bands |
|
|
|
|
|
|
|
Type |
Frequency Bands |
|
|
|
|
|
|
LTE-FDD |
B1/B2/B3/B4/B5/B7/B8/B20/B28(A+B) |
|
|
|
|
|
|
LTE-TDD |
B38/B39/B40/B41(200M) |
|
|
|
|
|
|
WCDMA |
B1/B2/B4/B5/B8 |
|
|
|
|
|
|
GSM |
B2/B3/B5/B8 |
|
|
|
|
|
|
Wi-Fi 802.11a/b/g/n/ac |
2402MHz~2482MHz; 5180MHz~5825MHz |
|
|
|
|
|
|
BT 5.0 |
2402MHz~2480MHz |
|
|
|
|
|
|
|
GPS: 1575.42MHz±1.023MHz |
|
|
GNSS |
GLONASS: 1597.5MHz~1605.8MHz |
|
|
|
BeiDou: 1561.098MHz±2.046MHz |
|
|
|
|
|
Table 5: SC66-W* Frequency Bands
Type |
Frequency Bands |
|
|
LTE-FDD |
/ |
|
|
LTE-TDD |
/ |
|
|
WCDMA |
/ |
|
|
TD-SCDMA |
/ |
|
|
CDMA |
/ |
|
|
GSM |
/ |
|
|
Wi-Fi 802.11a/b/g/n/ac |
2402MHz~2482MHz; 5180MHz~5825MHz |
|
|
BT 5.0 |
2402MHz~2480MHz |
|
|
GNSS |
/ |
|
|
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Table 6: SC66-MW*(2*2 MIMO WIFI) Frequency Bands
Type |
Frequency Bands |
|
|
LTE-FDD |
/ |
|
|
LTE-TDD |
/ |
|
|
WCDMA |
/ |
|
|
TD-SCDMA |
/ |
|
|
CDMA |
/ |
|
|
GSM |
/ |
|
|
Wi-Fi 802.11a/b/g/n/ac |
2402MHz~2482MHz; 5180MHz~5825MHz |
|
|
BT 5.0 |
2402MHz~2480MHz |
|
|
GNSS |
/ |
|
|
NOTE
“*” means under development. SC66-A SC66-J SC66-E SC66-MW support WIFI_MIMO
SC66 is an SMD type module which can be embedded into applications through its 324 pins (including 152 LCC pads and 172 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC66 can meet almost all requirements for M2M applications such as smart metering, smart home, security, routers, wireless POS, mobile computing devices, PDA phone, tablet PC, etc.
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SC66 Hardware Design
2.2. Key Features
The following table describes the detailed features of SC66 module.
Table 7: SC66 Key Features
Features |
|
Details |
|
|
|
|
|
Customized 64-bit ARM v8-compliant applications processorCustomized |
|
|
64-bit ARM v8-compliant applications processor |
Application Processor |
|
Kryo Gold: quad high-performance cores targeting 2.2 GHz |
|
|
Kryo Silver: quad low-power cores targeting 1.843 GHz |
|
|
two quad-core processors with 1MB L2 cache |
Modem system |
|
LTE Cat 6(FDD and TDD), 2*20 CA(40MHz) |
|
|
|
GPU |
|
Adreno 512 up to 650 MHzAdreno 512 up to 650 MHz |
|
|
|
Memory |
|
32GB eMMC + 3GB LPDDR4x(default) |
|
64GB eMMC + 4GB LPDDR4x (optional) |
|
|
|
|
|
|
|
Operating System |
|
Android 9 |
|
|
|
Power Supply |
|
VBAT Supply Voltage: 3.55V~4.4V |
|
Typical 4.0V |
|
|
|
|
|
|
|
|
|
Class 4 (33dBm±2dB) for EGSM900 |
|
|
Class 1 (30dBm±2dB) for DCS1800 |
|
|
Class E2 (27dBm±3dB) for EGSM900 8-PSK |
|
|
Class E2 (26dBm±3dB) for DCS1800 8-PSK |
Transmitting Power |
|
Class 3 (24dBm+1/-3dB) for WCDMA bands |
|
|
Class 3 (24dBm+3/-1dB) for EVDO/CDMA BC0 |
|
|
Class 2 (24dBm+1/-3dB) for TD-SCDMA bands |
|
|
Class 3 (23dBm±2dB) for LTE-FDD bands |
|
|
Class 3 (23dBm±2dB) for LTE-TDD bands |
|
|
|
|
|
Support 3GPP R12 Cat 6* and Cat 4 |
|
|
Support 1.4 MHz to 20MHz RF bandwidth |
|
|
Support Multiuser MIMO in DL direction |
LTE Features |
|
Cat 6* FDD: Max 300Mbps (DL)/Max 50Mbps (UL) |
|
|
Cat 6* TDD: Max 265Mbps (DL)/Max 30Mbps (UL) |
|
|
Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL) |
|
|
Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL) |
|
|
Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA |
UMTS Features |
|
Support QPSK, 16-QAM and 64-QAM modulation |
|
DC-HSDPA: Max 42Mbps (DL) |
|
|
|
|
|
|
DC-HSUPA: Max 11.2Mbps (UL) |
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Smart LTE Module Series
SC66 Hardware Design
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WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL) |
|
|
|
|
|
|
TD-SCDMA Features |
Support CCSA Release 3 TD-SCDMA |
|
|
Max 4.2Mbps (DL)/Max 2.2Mbps (UL) |
|
|
|
|
||
|
|
Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A |
|
|
CDMA2000 Features |
EVDO: Max 3.1Mbps (DL)/Max 1.8 Mbps (UL) |
|
|
|
1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL) |
|
|
|
R99 |
|
|
|
CSD: 9.6kbps, 14.4kbps |
|
|
|
GPRS |
|
|
|
Support GPRS multi-slot class 33 (33 by default) |
|
|
|
Coding scheme: CS-1, CS-2, CS-3 and CS-4 |
|
|
|
Max 107Kbps (DL), 85.6Kbps (UL) |
|
|
GSM Features |
EDGE |
|
|
|
Support EDGE multi-slot class 33 (33 by default) |
|
|
|
Support GMSK and 8-PSK for different MCS (Modulation and Coding |
|
|
|
Scheme) |
|
|
|
Downlink coding schemes: CS 1-4 and MCS 1-9 |
|
|
|
Uplink coding schemes: CS 1-4 and MCS 1-9 |
|
|
|
Max 296Kbps (DL), 236.8Kbps (UL) |
|
|
|
|
|
|
WLAN Features |
2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps |
|
|
Support AP and STA mode |
||
|
|
||
|
|
|
|
|
Bluetooth Features |
BT5.0 LE |
|
|
|
|
|
|
GNSS Features |
GPS/GLONASS/BeiDou |
|
|
|
|
|
|
|
Text and PDU mode |
|
|
SMS |
Point-to-point MO and MT |
|
|
|
SMS cell broadcast |
|
|
|
|
|
|
|
Support for MIPI_DSI and DP overTYPE-C for dual screen display |
|
|
LCM Interfaces |
MIPI_DSI Supports up to 2560x1600@60fps |
|
|
|
DP supports 4K@30fps |
|
|
|
|
|
|
|
Support three groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane |
|
|
Camera Interfaces |
Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane + |
|
|
2-lane + 1-lane) |
||
|
|
||
|
|
up to 24MP with dual ISP |
|
|
|
|
|
|
Video Codec |
Video encoding and decoding: up to 4K @30fps |
|
|
Concurrency: encoding up to 1080P @30fps; decoding up to 1080P @60fps |
||
|
|
||
|
|
|
|
|
|
Audio Input |
|
|
|
Three analog microphone inputs, integrating internal bias voltage |
|
|
Audio Interfaces |
Audio Output |
|
|
Class AB stereo headphone output |
||
|
|
||
|
|
Class AB earpiece differential output |
|
|
|
Class D speaker differential amplifier output |
|
|
|
|
|
|
|
|
|
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SC66 Hardware Design |
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Audio Codec |
EVRC, EVRC-B, EVRC-WB; G.711, G.729A/AB; GSM-FR, GSM-EFR, |
|
|
GSM-HR; AMR-NB, AMR-WB, AMR-eAMR, AMR-BeAMR |
||
|
|
||
|
|
|
|
|
|
Compliant with USB 3.1 and 2.0 specifications, with transmission rates up to |
|
|
|
10Gbps on USB 3.1 and 480Mbps on USB 2.0. |
|
|
USB Interface |
Support USB OTG |
|
|
|
Used for AT command communication, data transmission, software |
|
|
|
debugging and firmware upgrade |
|
|
|
|
|
|
|
4 UART Interfaces: DEBUG UART UART6 UART1 and LPI_UART_2 |
|
|
|
UART6: 4-wire UART interface with RTS/CTS hardware flow control, |
|
|
UART Interfaces |
max rate up to 4Mbps |
|
|
UART1: terface |
||
|
|
||
|
|
DEBUG: 2-wire UART interface used for debugging |
|
|
|
LPI_UART_2:low power uart, use is not recommended for the time being |
|
|
SD Card Interface |
Support SD 3.0 |
|
|
Support SD card hot-plug |
||
|
|
||
|
|
|
|
|
|
2 (U)SIM interfaces |
|
|
(U)SIM Interfaces |
Support USIM/SIM card: 1.8V/2.95V |
|
|
|
Support Dual SIM Dual Standby (supported by default) |
|
|
|
|
|
|
I2C Interfaces |
It supports up to five I2C interfaces, used for peripherals such as TP, camera, |
|
|
sensor, etc. |
||
|
|
||
|
|
|
|
|
I2S Interface |
Supports two I2S, one of which is low power I2S |
|
|
|
|
|
|
ADC Interfaces |
2 general purpose ADC interfaces |
|
|
|
|
|
|
SPI Interfaces |
One SPI interfaces, only support master mode |
|
|
|
|
|
|
Real Time Clock |
Supported |
|
|
|
|
|
|
Antenna Interfaces |
Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna |
|
|
interfaces |
||
|
|
||
|
|
|
|
|
|
Size: (43.0±0.15)mm × (44.0±0.15)mm × (2.85±0.2)mm |
|
|
Physical Characteristics |
Package: LCC + LGA |
|
|
|
Weight: approx. 13.0g |
|
|
|
|
|
|
|
Operating temperature range: -35°C ~ +65°C 1) |
|
|
Temperature Range |
Extended temperature range: -40°C ~ +75°C 2) |
|
|
|
Storage temperature range: -40°C ~ +90°C |
|
|
|
|
|
|
Firmware Upgrade |
Over USB interface |
|
|
|
|
|
|
RoHS |
All hardware components are fully compliant with EU RoHS directive |
|
|
|
|
|
NOTES
1. 1) Within operation temperature range, the module is 3GPP compliant.
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SC66 Hardware Design
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of SC66 and illustrates the major functional parts.
Power management
Radio frequency
Baseband
LPDDR4X+eMMC flash
Peripheral interfaces
--USB interface
--(U)SIM interfaces
--UART interfaces
--SD card interface
--I2C interfaces
- I2S interfaces
--SPI interfaces --ADC interfaces
--LCM (MIPI) interfaces
--TP (touch panel) interfaces
--Camera (MIPI) interfaces
--Audio interfaces
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SC66 Hardware Design
Power |
Power |
|
|
|
|
|
|
ANT_WIFI/BT |
ANT_WIFI/BT |
|
|
|
|
|
|
|
|
|
|
||
Signal |
Function |
|
|
|
|
|
|
|
|
|
|
|
V DD_ RF |
|
|
|
|
|
|
|
|
VOL_UP |
|
|
|
|
|
|
|
|
|
|
MICs |
|
|
|
|
|
|
|
|
|
|
SPK |
|
|
|
|
|
|
|
FEM |
|
FEM |
|
Codec |
|
|
|
|
|
|
|
||
EAR |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Headset |
|
|
|
|
|
|
|
|
|
|
SD_VDD |
PM660L |
|
|
|
|
|
|
|
|
|
|
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|
|
|
|
|
|
|
|
SD_PU_VDD |
|
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|
|
LDO3B_2P8 |
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|
|
LDO7B_3P125 |
|
|
|
|
|
|
38.4MHZ |
|
|
|
|
|
|
|
|
|
XO |
|
|
|
|
PWM |
|
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WCN |
||
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VPH_PWR |
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BBCLK |
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VRTC |
|
RFCLK |
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PM-3003A |
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|||
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USIM1_VDD |
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LPDDR |
|
USIM2_VDD |
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||
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eMMC |
||
LDO11A_1P8 |
PM660 |
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||
LDO13A_1P8 |
|
38.4 M |
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LDO14A_1P8 |
|
XO |
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ADCs |
HK ADC |
Porcessors |
|
Air Interface |
|
MEM |
||||
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||
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&MPPs |
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Baseband |
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PWRKEY |
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VOL DOWN |
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Connectivity |
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VBUS |
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Multimedia |
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BATTERY |
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13.2 |
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769 |
|
|
SPI |
LCM |
TP |
CAM |
USB |
2×(U)SIM UART |
SD 3.0 |
I2S |
I2C GPIOs |
|
|
2.0&3.1 |
||||||||
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This diagram just used for SC66-MW
SC66_Hardware_Design |
23 / 118 |
Smart LTE Module Series
SC66 Hardware Design
Power |
Power |
|
Signal |
Function |
C1 |
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V DD_ RF |
VOL_UP |
|
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MICs |
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SPK |
|
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EAR |
Codec |
|
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|
|
Headset |
|
|
SD_VDD |
PM660L |
|
|
||
SD_PU_VDD |
|
|
LDO3B_2P8 |
|
|
LDO7B_3P125 |
|
|
PWM |
|
|
VPH_PWR |
|
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|
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BBCLK |
VRTC |
|
RFCLK |
|
|
|
USIM1_VDD |
|
|
USIM2_VDD |
|
|
LDO11A_1P8 |
PM660 |
|
LDO13A_1P8 |
|
|
LDO14A_1P8 |
|
|
ADCs |
HK ADC |
|
|
&MPPs |
|
PWRKEY |
|
|
VOL DOWN |
|
|
VBUS |
|
|
BATTERY |
|
|
-
ANT_ MAIN |
ANT_ GNSS |
ANT_DRX |
ANT_WIFI/BT |
ANT_WIFI/BT |
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SAW |
Switch |
|
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Switch |
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||
APT |
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LNA |
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||
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SAW |
Duplexs |
|
SAW |
FEM |
FEM |
||
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SAW |
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0 |
PA |
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||
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Tranceiver |
38.4MHZ |
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||
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XO |
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WCN |
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PM-3003A |
|
LPDDR |
||
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eMMC |
|
38.4 M |
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XO |
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Porcessors |
|
Air Interface |
|
MEM |
||||
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Baseband |
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Multimedia |
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Connectivity |
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|||
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13.2 |
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|
769 |
|
SPI |
LCM |
TP |
CAM |
USB |
2×(U)SIM UART |
SD 3.0 |
I2S I2C GPIOs |
|
2.0&3.1 |
||||||||
|
|
|
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|
|
|
Figure 1: Functional Diagram
NOTE
The red dotted frame is WIFI_MIMO path, which is not supported by SC66-CE and SC66-W.
2.4. Evaluation Board
In order to help customers develop applications with SC66 conveniently, Quectel supplies the evaluation board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone, antenna and other peripherals to control or test the module.
SC66_Hardware_Design |
24 / 118 |
Smart LTE Module Series
SC66 Hardware Design
3 Application Interfaces
3.1. General Description
SC66 is equipped with 324-pin 1.0mm pitch SMT pads that can be embedded into cellular application platform. The following chapters provide the detailed description of pins/interfaces listed below.
Power supply
Turn on and off function
VRTC interface
Power Output
Charging interface
USB interface
UART interfaces
(U)SIM interfaces
SD card interface
GPIO interfaces
I2C interfaces
I2S interfaces
SPI interfaces
ADC interfaces
LCM interfaces
TP (touch panel) interfaces
Camera interfaces
Sensor interfaces
Audio interfaces
Emergency download interface
SC66_Hardware_Design |
25 / 118 |
Smart LTE Module Series
SC66 Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of SC66 module.
320
1 |
|
2 |
|
3 |
|
4 |
|
5 |
|
6 |
153 |
|
|
7 |
|
8 |
154 |
|
|
9 |
|
10 |
155 |
11 |
|
12 |
156 |
13 |
|
14 |
157 |
|
|
15 |
|
16 |
158 |
|
|
17 |
|
18 |
159 |
|
|
19 |
|
20 |
160 |
|
|
21 |
|
22 |
161 |
|
|
23 |
|
24 |
162 |
|
|
25 |
|
26 |
163 |
|
|
27 |
|
28 |
164 |
|
|
29 |
|
30 |
165 |
|
|
31 |
|
32 |
166 |
|
|
33 |
|
34 |
|
35 |
|
36 |
|
37 |
|
38 |
|
|
321 |
152 |
151 |
150 |
149 |
148 |
147 |
146 |
145 |
144 |
143 |
142 |
141 |
140 |
139 |
138 |
137 |
136 |
135 |
134 |
133 |
132 |
131 |
130 |
129 |
128 |
127 |
126 |
125 |
124 |
211
212 |
257 |
264 |
271 |
278 |
285 |
292 |
299 |
306 |
213 |
|
|
|
|
|
|
|
|
|
258 |
265 |
272 |
279 |
286 |
293 |
300 |
307 |
214 |
|
|
|
|
|
|
|
|
|
259 |
266 |
273 |
280 |
287 |
294 |
301 |
308 |
215 |
|
|
|
|
|
|
|
|
216 |
260 |
267 |
274 |
281 |
288 |
295 |
302 |
309 |
|
||||||||
217 |
|
|
|
|
|
|
|
|
|
261 |
268 |
275 |
282 |
289 |
296 |
303 |
310 |
218 |
|
|
|
|
|
|
|
|
|
262 |
269 |
276 |
283 |
290 |
297 |
304 |
311 |
219 |
|
|
|
|
|
|
|
|
220 |
263 |
270 |
277 |
284 |
291 |
298 |
305 |
312 |
|
221
39 |
40 |
41 |
42 |
43 |
44 |
45 |
46 |
47 |
48 |
49 |
50 |
51 |
52 |
53 |
54 |
55 |
56 |
57 |
58 |
59 |
60 |
61 |
62 |
63 |
64 |
65 |
66 |
67 |
GND |
POWER |
AUDIO |
USB |
(U)SIM |
SD |
TP |
LCM |
CAMERA |
ANT |
UART |
123 |
122 |
121 |
120 |
119 |
118 |
117 |
116 |
115 |
324 |
323
|
195 |
|
194 |
|
244 |
|
193 |
313 |
243 |
192
242
314 |
191 |
|
|
|
241 |
|
190 |
315 |
|
|
240 |
|
189 |
316 |
239 |
|
|
|
188 |
|
238 |
317 |
187 |
|
|
|
237 |
|
186 |
318 |
236 |
|
|
|
185 |
|
235 |
319 |
|
|
184 |
|
234 |
|
183 |
|
182 |
322
68 |
69 |
70 |
71 |
72 |
73 |
74 |
75 |
76 |
GPIO RESERVED OTHERS
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
Figure 2: Pin Assignment (Top View)
SC66_Hardware_Design |
26 / 118 |
Smart LTE Module Series
SC66 Hardware Design
3.3. Pin Description
Table 8: I/O Parameters Definition
Type |
Description |
|
|
IO |
Bidirectional |
|
|
DI |
Digital input |
|
|
DO |
Digital output |
|
|
PI |
Power input |
|
|
PO |
Power output |
|
|
AI |
Analog input |
|
|
AO |
Analog output |
|
|
OD |
Open drain |
|
|
The following tables show the SC66’s pin definition and electrical characteristics.
Table 9: Pin Description
Power Supply
|
Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
It must be able to |
|
|
|
|
|
|
|
provide sufficient |
|
|
|
|
|
|
Vmax=4.4V |
current up to 3.0A. |
|
|
|
|
PI/P |
Power supply for the |
It is suggested to |
||
|
VBAT |
36,37, 38 |
Vmin=3.55V |
||||
|
O |
module |
use a TVS to |
||||
|
|
|
Vnorm=4.0V |
||||
|
|
|
|
|
increase voltage |
||
|
|
|
|
|
|
||
|
|
|
|
|
|
surge withstand |
|
|
|
|
|
|
|
capability. |
|
|
|
|
|
|
|
|
|
|
|
|
|
Connect to external |
|
|
|
|
|
|
|
bypass capacitors to |
Vmax=4.4V |
Do not load |
|
|
VDD_RF |
1, 2 |
PO |
eliminate voltage |
Vmin=3.55V |
||
|
externally. |
||||||
|
|
|
|
fluctuation of RF |
Vnorm=4.0V |
||
|
|
|
|
|
|
||
|
|
|
|
part. |
|
|
|
|
|
|
|
|
|
|
|
|
VRTC |
16 |
PI/P |
Power supply for |
VOmax=3.2V |
|
|
|
|
|
|
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|
|
|
|
|
|
|
|
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|
|
SC66_Hardware_Design |
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27 / 118 |
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Smart LTE Module Series |
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SC66 Hardware Design |
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||
|
|
|
O |
internal RTC circuit |
When VBAT is not |
|||
|
|
|
|
|
connected |
|
|
|
|
|
|
|
|
: |
|
|
|
|
|
|
|
|
VI=2.1V~3.25V |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Power supply for |
||
|
LDO13A_1 |
9 |
PO |
1.8V output power |
Vnorm=1.8V |
external GPIO’s |
||
|
P8 |
supply |
IOmax=20mA |
pull up circuits and |
||||
|
|
|
||||||
|
|
|
|
|
|
level shift circuit. |
||
|
|
|
|
|
|
|
|
|
|
LDO7B_3P |
157 |
PO |
3.125V output power |
Vnorm=3.125V |
Power supply only |
||
125 |
supply |
IOmax=150mA |
for DP switch |
|||||
|
|
|||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Power supply for |
||
|
LDO11A_1P |
10 |
PO |
1.8V output power |
Vnorm=1.8V |
I/O VDD of |
||
8 |
supply |
IOmax=150mA |
cameras, LCDs |
|||||
|
|
|||||||
|
|
|
|
|
|
and TP etc. |
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Power supply for |
||
|
|
|
|
|
|
Sensors. Add a |
||
|
LDO14A_1 |
|
|
1.8V output power |
Vnorm=1.8V |
1.0uF~4.7uF |
||
|
158 |
PO |
bypass capacitor if |
|||||
|
P8 |
supply |
IOmax=150mA |
|||||
|
|
|
used. |
|||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
If unused, keep |
||
|
|
|
|
|
|
this pin open. |
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Power supply for |
||
|
|
|
|
|
|
sensor and LCM. |
||
|
LDO3B_2P |
|
|
2.8V output power |
Vnorm=2.8V |
Add a 1.0uF~2.2uF |
||
|
12 |
PO |
bypass capacitor if |
|||||
8 |
supply |
IOmax=600mA |
||||||
|
|
used. |
||||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
If unused, keep |
||
|
|
|
|
|
|
this pin open. |
||
|
|
|
|
|
|
|
|
|
|
VPH_PWR 30 |
PO |
VBAT output power |
Vnorm=VBAT |
Power supply for |
|||
|
supply |
IOmax=1000mA |
other ICs.ICs |
|||||
|
|
|
|
|||||
|
|
|
|
|
|
|
|
|
|
|
3 4 18 |
|
|
|
|
|
|
|
|
20 24 |
|
|
|
|
|
|
|
GND |
|
|
Ground |
|
|
|
|
|
|
31 34 |
|
|
|
|
|
|
|
|
35 40 |
|
|
|
|
|
SC66_Hardware_Design |
28 / 118 |
Smart LTE Module Series
SC66 Hardware Design
43 47
56 62
87 98
101 112
125 128
130 133
135 148
150 159
160 163
166 170
173 176
182 193
195 219
225 243 257~323
Audio Interfaces
|
Pin Name |
Pin No. |
I/O |
Description |
|
DC Characteristics |
Comment |
|
|
|
|
|
|
|
|
|
|
|
MIC_BIAS |
167 |
AO |
Microphone bias |
VO=1.6V~2.9V |
|
|
|
|
voltage |
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
MIC1_P |
44 |
AI |
Microphone positive |
|
|
|
|
|
input for channel 1 |
|
|
|
||||
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
Microphone |
|
|
|
|
|
MIC1_M |
45 |
AI |
negative input |
for |
|
|
|
|
|
|
|
channel 1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Microphone |
|
|
If unused, it should |
|
|
MIC_GND |
168 |
|
|
|
be connected to |
||
|
|
reference ground |
|
|||||
|
|
|
|
|
GND |
|||
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
MIC2_P |
46 |
AI |
Microphone |
|
|
Headset mic input |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SC66_Hardware_Design |
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29 / 118 |
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Smart LTE Module Series |
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SC66 Hardware Design |
|
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|
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|
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|
|
|
|
|
|
|
|
|
|
|
|
positive input |
for |
|
|
|
|
|
|
|
headset |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Microphone |
|
|
|
|
|
MIC3_P |
169 |
AI |
positive input for |
Second mic input |
|||
|
|
|
|
second mic |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EAR_P |
53 |
AO |
Earpiece positive |
|
|
||
|
output |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EAR_M |
52 |
AO |
Earpiece negative |
|
|
||
|
output |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SPK_P |
55 |
AO |
Speaker positive |
|
|
||
|
output |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SPK_M |
54 |
AO |
Speaker negative |
|
|
||
|
output |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
HPH_R |
51 |
AO |
Headphone right |
|
|
||
|
channel output |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Headphone |
|
|
It should be |
|
|
HPH_REF |
50 |
AI |
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connected to main |
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reference ground |
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GND |
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HPH_L |
49 |
AO |
Headphone left |
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channel output |
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HS_DET |
48 |
AI |
Headset insertion |
Default high level |
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detection |
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USB Interface |
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Pin Name |
Pin No. |
I/O |
Description |
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DC Characteristics |
Comment |
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Charging power |
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input. |
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Power supply |
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Vmax=10V |
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PI/P |
output for OTG |
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USB_VBUS |
41, 42 |
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Vmin=3.6V |
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O |
device. |
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Vnorm=5.0V |
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USB/charger |
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insertion |
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detection. |
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USB2_HS_ |
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USB 2.0 |
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25 |
IO |
differential data |
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DM |
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bus (minus) |
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USB 2.0 standard |
90Ω differential |
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compliant |
impedance. |
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USB2_HS_ |
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USB 2.0 |
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26 |
IO |
differential data |
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DP |
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bus (plus) |
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USB1_HS_ |
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USB 2.0 |
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USB 2.0 standard |
90Ω differential |
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33 |
IO |
differential data |
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impedance; |
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DM |
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compliant |
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bus (minus) |
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One part of the |
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SC66_Hardware_Design |
30 / 118 |
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Smart LTE Module Series |
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SC66 Hardware Design |
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USB1_HS_ |
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USB 2.0 |
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TYPE-C. |
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32 |
IO |
differential data |
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DP |
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bus (plus) |
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USB_SS2_T |
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USB 3.1 |
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165 |
IO |
differential |
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X_P |
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transmit (plus) |
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USB_SS2_T |
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USB 3.1 |
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164 |
IO |
differential |
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X_M |
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transmit (minus) |
USB 3.1 channel2 |
|
90Ω differential |
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standard compliant |
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impedance. |
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USB_SS2_ |
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USB 3.1 |
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162 |
IO |
differential receive |
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RX_P |
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(plus) |
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USB_SS2_ |
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USB 3.1 |
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161 |
IO |
differential receive |
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RX_M |
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(minus) |
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USB_SS1_ |
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USB 3.1 |
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171 |
IO |
differential receive |
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RX_P |
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(plus) |
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90Ω differential |
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impedance. |
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USB_SS1_ |
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USB 3.1 |
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172 |
IO |
differential receive |
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RX_M |
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(minus) |
USB 3.1 channel1 |
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standard compliant |
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USB_SS1_T |
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USB 3.1 |
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174 |
IO |
differential |
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X _P |
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transmit (plus) |
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90Ω differential |
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impedance. |
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USB_SS1_T |
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USB 3.1 |
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|
175 |
IO |
differential |
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X _M |
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transmit (minus) |
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USB Type-C |
|
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When micro usb is |
|
|
USB_CC1 |
224 |
AI |
detection channel |
|
|
used ,it can be |
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1 |
|
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used as ID pin |
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USB Type-C |
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USB_CC2 |
223 |
AI |
detection channel |
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2 |
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When USB |
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TYPE-C is used, it |
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should be |
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|
|
|
TYPE-C&uUSB |
|
|
connected to |
|
|
UUSB_TYP |
|
|
|
|
VPH_PWR |
||
|
23 |
DI |
configuration |
|
|
|||
|
EC |
|
|
through 10K |
||||
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|
|
control pin |
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|||
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|
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resistor. When |
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||
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uUSB is used, it |
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should be |
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connected to GND |
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|
SC66_Hardware_Design |
|
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|
31 / 118 |
|
Smart LTE Module Series
SC66 Hardware Design
|
|
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|
|
through 10K |
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|
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resistor. |
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When USB |
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|
|
TYPE-C is used, it |
|
|
|
|
|
|
should be |
|
SS_DIR_IN 21 |
DI |
CC status |
|
connected to |
||
detection pin |
|
SS_DIR_OUT. |
||||
|
|
|
|
|||
|
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|
|
|
When uUSB is |
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|
|
used, it should be |
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connected to GND. |
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When USB |
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|
|
TYPE-C is used, it |
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|
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|
|
|
should be |
|
SS_DIR_OU |
226 |
DO |
CC status output |
|
connected to |
|
T |
pin |
|
SS_DIR_IN. When |
|||
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|
||||
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|
|
uUSB is used, it |
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|
|
should be kept |
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|
|
open. |
|
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||
(U)SIM Interfaces |
|
|
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||
|
|
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|
|
Pin Name |
Pin |
I/O Description |
DC Characteristics |
Comment |
||
No. |
||||||
|
|
|
|
|
USIM1_DET |
145 |
DI |
(U)SIM1 card |
VILmax=0.63V |
|
hot-plug detection |
VIHmin=1.17V |
||||
|
|
|
Active Low. Require external pull-up to 1.8V. If unused, keep this pin open.
USIM1_RST |
144 |
DO |
(U)SIM1 card |
VOLmax=0.4V |
|
|
reset signal |
|
|||||
|
|
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VOHmin= |
|
||
|
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||
|
|
|
(U)SIM1 card |
|
||
USIM1_CLK |
143 |
DO |
0.8 × USIM1_VDD |
|
||
clock signal |
|
|||||
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VILmax= |
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0.2 × USIM1_VDD |
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(U)SIM1 card data |
VIHmin= |
|
|
USIM1_DATA |
142 |
IO |
0.7 × USIM1_VDD |
|
||
signal |
|
|||||
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VOLmax=0.4V |
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VOHmin= |
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0.8 × USIM1_VDD |
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|
(U)SIM1 card |
|
Either 1.8V or |
|
USIM1_VDD |
141 |
PO |
|
2.95V (U)SIM card |
||
power supply |
|
|||||
|
|
|
|
is supported. |
||
|
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||
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|
USIM2_DET |
256 |
DI |
(U)SIM2 card |
VILmax=0.63V |
Active Low. |
|
detection |
VIHmin=1.17V |
Need external |
||||
|
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||||
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|
SC66_Hardware_Design |
32 / 118 |
Smart LTE Module Series
SC66 Hardware Design
pull-up to 1.8V. If unused, keep this pin open.
|
|
|
(U)SIM2 card |
VOLmax=0.4V |
|
USIM2_RST |
207 |
DO |
VOHmin= |
||
reset signal |
|||||
|
|
|
0.8 × USIM2_VDD |
||
|
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||
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|
(U)SIM2 card |
VOLmax=0.4V |
|
USIM2_CLK |
208 |
DO |
VOHmin= |
||
clock signal |
|||||
|
|
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0.8 × USIM2_VDD |
||
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||
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VILmax= |
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0.2 × USIM2_VDD |
|
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|
|
(U)SIM2 card data |
VIHmin= |
|
USIM2_DATA |
209 |
IO |
0.7 × USIM2_VDD |
||
signal |
|||||
|
|
|
VOLmax=0.4V |
||
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||
|
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|
|
VOHmin= |
|
|
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|
|
0.8 × USIM2_VDD |
|
|
|
(U)SIM2 card |
Either 1.8V or |
|
USIM2_VDD |
210 |
PO |
2.95V (U)SIM card |
||
power supply |
|||||
|
|
|
is supported. |
||
|
|
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|
||
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|
|
UART Interfaces
|
Pin Name |
Pin |
I/O Description |
DC Characteristics |
Comment |
||
|
. |
||||||
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DEBUG transmit |
|
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|
|
DEBUG_TXD |
5 |
DO |
data. |
VOLmax=0.45V |
|
|
|
Debug port by |
VOHmin=1.35V |
|
|
|||
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||
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default. |
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DEBUG receive |
|
|
|
|
DEBUG_RXD |
6 |
DI |
data. |
VILmax=0.63V |
|
|
|
Debug port by |
VIHmin=1.17V |
|
|
|||
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||
|
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|
|
default. |
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|
|
UART1_TXD |
7 |
DO |
UART1 transmit |
VOLmax=0.45V |
1.8V power |
|
|
data |
VOHmin=1.35V |
|
|
|||
|
|
|
|
domain. |
|||
|
UART1_RXD |
8 |
DI |
UART1 receive |
VILmax=0.63V |
If unused, keep |
|
|
data |
VIHmin=1.17V |
these pins open. |
||||
|
|
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|
||||
|
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|
|
UART6_RXD |
198 |
DI |
UART6 receive |
VILmax=0.63V |
|
|
|
data |
VIHmin=1.17V |
|
|
|||
|
|
|
|
|
|
||
|
|
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|
|
|
|
|
|
UART6_TXD |
199 |
DO |
UART6 transmit |
VOLmax=0.45V |
|
|
|
data |
VOHmin=1.35V |
|
|
|||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
UART6_RTS |
245 |
DO |
UART6 request to |
VOLmax=0.45V |
|
|
|
send |
VOHmin=1.35V |
|
|
|||
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
UART6_CTS |
246 |
DI |
UART6 clear to |
VILmax=0.63V |
|
|
|
send |
VIHmin=1.17V |
|
|
|||
|
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|
||
|
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|
|
|
|
|
SC66_Hardware_Design |
|
|
|
33 / 118 |
|
Smart LTE Module Series
SC66 Hardware Design
LPI_UART_2_T |
|
60 |
DO |
UART2 transmit |
VOLmax=0.45V |
|
XD |
|
data |
VOHmin=1.35V |
|
||
|
|
|
|
|||
|
|
|
|
|
|
|
LPI_UART_2_R |
|
61 |
DI |
UART2 receive |
VILmax=0.63V |
|
XD |
|
data |
VIHmin=1.17V |
|
||
|
|
|
|
|||
|
|
|
|
|
|
|
SD Card Interface |
|
|
|
|
|
|
|
|
|
|
|
|
|
Pin Name |
|
Pin |
I/O |
Description |
DC Characteristics |
Comment |
. |
|
|||||
|
|
|
|
|
|
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|
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|
|
|
|
|
|
1.8V SD card: |
|
|
|
|
|
|
VOLmax=0.45V |
|
|
|
|
|
High speed digital |
VOHmin=1.4V |
|
SD_CLK |
|
70 |
DO |
clock signal of SD |
|
|
|
|
|
|
card |
2.95V SD card: |
|
|
|
|
|
|
VOLmax=0.368V |
|
|
|
|
|
|
VOHmin=2.125V |
|
|
|
|
|
|
|
|
SD_CMD |
|
69 |
IO |
Command signal |
|
|
|
of SD card |
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
1.8V SD card: |
|
|
|
|
|
|
|
|
SD_DATA0 |
|
68 |
IO |
|
VILmax=0.58V |
|
|
|
VIHmin=1.27V |
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
VOLmax=0.45V |
|
|
|
|
|
High speed |
VOHmin=1.4V |
|
SD_DATA1 |
|
67 |
IO |
|
|
|
|
bidirectional digital |
|
|
|||
|
|
|
|
2.95V SD card: |
|
|
|
|
|
|
signal lines of SD |
|
|
|
|
|
|
VILmax=0.737V |
|
|
|
|
|
|
card |
|
|
|
|
|
|
VIHmin=1.843V |
|
|
SD_DATA2 |
|
66 |
IO |
|
|
|
|
|
VOLmax=0.368V |
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
VOHmin=2.125V |
|
SD_DATA3 |
|
65 |
IO |
|
|
|
|
|
|
|
|||
|
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SD_DET |
|
64 |
DI |
SD card insertion |
VILmax=0.63V |
Active low. |
|
detection |
VIHmin=1.17V |
||||
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SD_VDD |
|
63 |
PO |
Power supply for |
Vnorm=2.95V |
|
|
SD card |
IOmax=600mA |
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Vnorm=1.8V/2.95V |
Power supply for |
SD_PU_VDD |
|
179 |
PO |
2.95V output |
SD card’s pull-up |
|
|
IOmax=50mA |
|||||
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circuit. |
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|||
TP (Touch Panel) Interfaces |
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Pin Name |
|
Pin N |
I/O |
Description |
DC Characteristics |
Comment |
|
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|
|
SC66_Hardware_Design |
34 / 118 |
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|
Smart LTE Module Series |
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|
|
SC66 Hardware Design |
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|
TP0_RST |
138 |
DO |
Reset signal of |
VOLmax=0.45V |
1.8V power |
|
|
touch panel (TP0) |
VOHmin=1.35V |
domain. Active low. |
||||
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TP0_INT |
139 |
DI |
Interrupt signal of |
VILmax=0.63V |
1.8V power |
|
|
touch panel (TP0) |
VIHmin=1.17V |
domain. |
||||
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TP0_I2C_SCL |
140 |
OD |
I2C clock signal of |
|
1.8V power |
|
|
touch panel (TP0) |
|
domain. |
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TP0_I2C_SDA |
206 |
OD |
I2C data signal of |
|
1.8V power |
|
|
touch panel (TP0) |
|
domain. |
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LCM Interfaces |
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|
Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
|
|
No. |
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PWM |
152 |
DO |
PWM Output |
|
|
|
LCD0_RST |
127 |
DO LCD0 reset signal |
VOLmax=0.45V |
|
VOHmin=1.35V |
||||
|
|
|
1.8V power domain It should not be pulled up.
LCD0_TE |
126 |
DI |
LCD0 tearing |
VILmax=0.63V |
1.8V power |
|
effect signal |
VIHmin=1.17V |
domain. |
||||
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||||
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|
DSI0_CLK_N |
116 |
AO |
LCD0 MIPI clock |
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|
signal (negative) |
|
85Ω differential |
||||
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|
impedance. |
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DSI0_CLK_P |
115 |
AO |
LCD0 MIPI clock signal |
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(positive) |
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DSI0_LN0_N |
118 |
AO |
LCD0 MIPI lane 0 data |
|
||
signal (negative) |
|
85Ω differential |
||||
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|
|||
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|
|
impedance. |
||
DSI0_LN0_P |
117 |
AO |
LCD0 MIPI lane 0 data |
|||
signal (positive) |
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||||
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DSI0_LN1_N |
120 |
AO |
LCD0 MIPI lane 1 data |
|
||
signal (negative) |
|
85Ω differential |
||||
|
|
|
|
|||
|
|
|
|
impedance. |
||
DSI0_LN1_P |
119 |
AO |
LCD0 MIPI lane 1 data |
|||
signal (positive) |
|
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||||
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||
DSI0_LN2_N |
122 |
AO |
LCD0 MIPI lane 2 data |
|
||
signal (negative) |
|
85Ω differential |
||||
|
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|
|||
|
|
|
|
impedance. |
||
DSI0_LN2_P |
121 |
AO |
LCD0 MIPI lane 2 data |
|||
signal (positive) |
|
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||||
|
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||
|
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|
||
DSI0_LN3_N |
124 |
AO |
LCD0 MIPI lane 3 data |
|
||
signal (negative) |
|
85Ω differential |
||||
|
|
|
|
|||
|
|
|
|
impedance. |
||
DSI0_LN3_P |
123 |
AO |
LCD0 MIPI lane 3 data |
|||
signal (positive) |
|
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||||
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|
|
Camera Interfaces
SC66_Hardware_Design |
35 / 118 |
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|
|
Smart LTE Module Series |
||
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|
|
SC66 Hardware Design |
||
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|
|
Pin Name |
Pin |
I/O Description |
DC |
|
Comment |
||
|
No. |
Characteristics |
||||||
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|||
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|
|
CSI1_CLK_N |
89 |
AI |
MIPI clock signal of rear |
|
|
|
|
|
camera (negative) |
|
|
85Ω differential |
||||
|
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|
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|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI1_CLK_P |
88 |
AI |
MIPI clock signal of rear |
|
|
||
|
camera (positive) |
|
|
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|
|||
|
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|
|
CSI1_LN0_N |
91 |
AI |
MIPI lane 0 data signal of |
|
|
|
|
|
rear camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI1_LN0_P |
90 |
AI |
MIPI lane 0 data signal of |
|
|
||
|
rear camera (positive) |
|
|
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|
|||
|
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|
|
CSI1_LN1_N |
93 |
AI |
MIPI lane 1 data signal of |
|
|
|
|
|
rear camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI1_LN1_P |
92 |
AI |
MIPI lane 1 data signal of |
|
|
||
|
rear camera (positive) |
|
|
|
|
|||
|
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|
|
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|
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|
|
|
|
|
CSI1_LN2_N |
95 |
AI |
MIPI lane 2 data signal of |
|
|
|
|
|
rear camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI1_LN2_P |
94 |
AI |
MIPI lane 2 data signal of |
|
|
||
|
rear camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI1_LN3_N |
97 |
AI |
MIPI lane 3 data signal of |
|
|
|
|
|
rear camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI1_LN3_P |
96 |
AI |
MIPI lane 3 data signal of |
|
|
||
|
rear camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI2_CLK_N |
184 |
AI |
MIPI clock signal of depth |
|
|
|
|
|
camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI2_CLK_P |
183 |
AI |
MIPI clock signal of depth |
|
|
||
|
camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI2_LN0_N |
186 |
AI |
MIPI lane 0 data signal of |
|
|
|
|
|
depth camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI2_LN0_P |
185 |
AI |
MIPI lane 0 data signal of |
|
|
||
|
depth camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI2_LN1_N |
188 |
AI |
MIPI lane 1 data signal of |
|
|
|
|
|
depth camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI2_LN1_P |
187 |
AI |
MIPI lane 1 data signal of |
|
|
||
|
depth camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI2_LN2_N |
190 |
AI |
MIPI lane 2 data signal of |
|
|
85Ω differential |
|
|
depth camera (negative) |
|
|
|||||
|
|
|
|
|
|
impedance. |
||
|
|
|
|
|
|
|
||
|
CSI2_LN2_P |
189 |
AI |
MIPI lane 2 data signal of |
|
|
||
|
|
|
|
|
||||
|
depth camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI2_LN3_N |
192 |
AI |
MIPI lane 3 data signal of |
|
|
85Ω differential |
|
|
depth camera (negative) |
|
|
|||||
|
|
|
|
|
|
impedance. |
||
|
|
|
|
|
|
|
||
|
CSI2_LN3_P |
191 |
AI |
MIPI lane 3 data signal of |
|
|
||
|
|
|
|
|
||||
|
depth camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SC66_Hardware_Design |
|
|
|
|
36 / 118 |
|
|
|
|
|
|
Smart LTE Module Series |
|||
|
|
|
|
|
|
SC66 Hardware Design |
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI0_CLK_N |
78 |
AI |
MIPI clock signal of front |
|
|
|
|
|
camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI0_CLK_P |
77 |
AI |
MIPI clock signal of front |
|
|
||
|
camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI0_LN0_N |
80 |
AI |
MIPI lane 0 data signal of |
|
|
|
|
|
front camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI0_LN0_P |
79 |
AI |
MIPI lane 0 data signal of |
|
|
||
|
front camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI0_LN1_N |
82 |
AI |
MIPI lane 1 data signal of |
|
|
|
|
|
front camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI0_LN1_P |
81 |
AI |
MIPI lane 1 data signal of |
|
|
||
|
front camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI0_LN2_N |
84 |
AI |
MIPI lane 2 data signal of |
|
|
|
|
|
front camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI0_LN2_P |
83 |
AI |
MIPI lane 2 data signal of |
|
|
||
|
front camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CSI0_LN3_N |
86 |
AI |
MIPI lane 3 data signal of |
|
|
|
|
|
front camera (negative) |
|
|
85Ω differential |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
impedance. |
|
|
CSI0_LN3_P |
85 |
AI |
MIPI lane 3 data signal of |
|
|
||
|
front camera (positive) |
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
MCAM_MCLK |
99 |
DO |
Master clock signal of rear |
|
|
1.8V power |
|
|
camera |
|
|
domain. |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
SCAM_MCLK |
100 |
DO |
Master clock signal of front |
|
|
1.8V power |
|
|
camera |
|
|
domain. |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
MCAM_RST |
74 |
DO |
Reset signal of rear |
|
|
1.8V power |
|
|
camera |
|
|
domain. |
||||
|
|
|
|
VOLmax=0.45V |
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
VOHmin=1.35V |
|
|
|
|
|
|
|
Power down signal of rear |
|
1.8V power |
||
|
MCAM_PWDN |
73 |
DO |
|
|
|||
|
camera |
|
|
domain. |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
SCAM_RST |
72 |
DO |
Reset signal of front |
|
|
1.8V power |
|
|
camera |
|
|
domain. |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
SCAM_PWDN |
71 |
DO |
Power down signal of front |
|
|
1.8V power |
|
|
camera |
|
|
domain. |
||||
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
CAM_I2C_SCL0 |
75 |
OD |
I2C clock signal of camera |
|
|
1.8V power |
|
|
|
|
domain. |
|||||
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
CAM_I2C_SDA |
76 |
OD |
I2C data signal of camera |
|
|
1.8V power |
|
0 |
|
|
domain. |
|||||
|
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
DCAM_MCLK |
194 |
DO |
Master clock signal of |
VOLmax=0.45V |
|
1.8V power domain |
|
|
depth camera |
VOHmin=1.35V |
|
|||||
|
|
|
|
|
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
SC66_Hardware_Design |
|
|
|
37 / 118 |
|
|
|
|
|
|
Smart LTE Module Series |
||
|
|
|
|
|
SC66 Hardware Design |
||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DCAM_RST |
180 |
DO |
Reset signal of depth |
|
1.8V power domain |
|
|
camera |
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DCAM_PWDN |
181 |
DO |
Power down signal of |
|
1.8V power domain |
|
|
depth camera |
|
|||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CAM_I2C_SDA |
197 |
OD |
I2C data signal of depth |
|
1.8V power domain |
|
1 |
camera |
|
|||||
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
CAM_I2C_SCL1 |
196 |
OD |
I2C data signal of depth |
|
1.8V power |
|
|
camera |
|
domain. |
||||
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
Keypad Interfaces |
|
|
|
|
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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PWRKEY |
39 |
DI |
Turn on/off the module |
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1.8V power domain |
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VOL_UP |
146 |
DI |
Volume up |
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The voltage follows |
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VBAT |
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VOL_DWN |
147 |
DI |
Volume down |
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1.8V power domain |
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SENSOR_I2C Interfaces |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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SENSOR_I2C_ |
131 |
OD |
I2C clock signal of |
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1.8V power |
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SCL |
external sensors |
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domain. |
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SENSOR_I2C_ |
132 |
OD |
I2C data signal of external |
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1.8V power |
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SDA |
sensors |
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domain. |
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ADC Interfaces |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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ADC0 |
151 |
AI |
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Max input |
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voltage:1.8V |
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ADC1 |
153 |
AI |
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Max input |
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voltage:1.8V |
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Antenna Interfaces |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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ANT_MAIN |
19 |
IO |
Main antenna interface |
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50Ω impedance |
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SC66_Hardware_Design |
38 / 118 |
Smart LTE Module Series
SC66 Hardware Design
ANT_DRX |
149 |
AI |
Diversity antenna interface |
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ANT_GNSS |
134 |
AI |
GNSS antenna interface |
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ANT_WIFI/BT |
129 |
IO |
Wi-Fi/BT antenna |
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interface |
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ANT_WIFI_MIM |
324 |
IO |
Wi-Fi_MIMO antenna |
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SC66-CE SC66-W |
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O |
interface |
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is not supported |
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GPIO Interfaces |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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GPIO_20 |
113 |
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IO |
GPIO |
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Can be |
used |
as |
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LCD1_RST |
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GPIO_21 |
231 |
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IO |
GPIO |
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GPIO_34 |
236 |
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IO |
GPIO |
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GPIO_40 |
238 |
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IO |
GPIO |
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GPIO_41 |
237 |
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IO |
GPIO |
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GPIO_42 |
137 |
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IO |
GPIO |
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Can be |
used |
as |
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TP1_INT |
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GPIO_43 |
136 |
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IO |
GPIO |
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Can be |
used |
as |
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TP1_RST |
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GPIO_55 |
178 |
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IO |
GPIO |
VILmax=0.63V |
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VIHmin=1.17V |
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GPIO_56 |
177 |
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IO |
GPIO |
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VOLmax=0.45V |
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VOLmin=1.35V |
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GPIO_72 |
239 |
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IO |
GPIO |
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GPIO_73 |
59 |
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IO |
GPIO |
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GPIO_74 |
58 |
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IO |
GPIO |
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GPIO_76 |
232 |
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IO |
GPIO |
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GPIO_77 |
240 |
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IO |
GPIO |
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ACCL_INT |
252 |
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IO |
GPIO |
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GYRO_INT |
255 |
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IO |
GPIO |
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MAG_INT |
254 |
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IO |
GPIO |
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ALPS_INT |
253 |
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IO |
GPIO |
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SC66_Hardware_Design |
39 / 118 |
Smart LTE Module Series
SC66 Hardware Design
HALL_INT |
218 |
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IO |
GPIO |
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GPIO_22 |
204 |
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IO |
GPIO |
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GPIO_23 |
205 |
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IO |
GPIO |
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GPIO_12 |
228 |
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IO |
GPIO |
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GPIO_13 |
227 |
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IO |
GPIO |
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GPIO_14 |
230 |
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IO |
GPIO |
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GPIO_15 |
229 |
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IO |
GPIO |
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GPIO_61 |
234 |
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IO |
GPIO |
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GPIO_03B |
11 |
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IO |
GPIO |
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GPIO_08B |
13 |
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IO |
GPIO |
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GPIO_04B |
14 |
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IO |
GPIO |
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GPIO_05B |
15 |
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IO |
GPIO |
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GPIO_11A |
211 |
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IO |
GPIO |
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GPIO_13A |
233 |
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IO |
GPIO |
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GRFC Interfaces |
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Pin Name |
Pin No. |
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I/O |
Description |
DC |
Comment |
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Characteristics |
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GRFC_19 |
242 |
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IO |
GPIO |
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Only for RF debug. |
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It should |
not be |
GRFC_18 |
241 |
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IO |
GPIO |
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pulled up. |
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SPI Interfaces |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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SPI_CS |
201 |
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DO |
Chip selection signal |
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SPI_CLK |
200 |
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DO |
Clock signal |
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Only |
support |
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master mode |
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SPI_MOSI |
248 |
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DO |
Data output signal |
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SPI_MISO |
247 |
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DI |
Data input signal |
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I2S Interfaces |
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SC66_Hardware_Design |
40 / 118 |
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Smart LTE Module Series |
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SC66 Hardware Design |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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MI2S_2_WS |
203 |
DO |
I2S Word selection signal |
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MI2S_2_DATA0 |
249 |
IO |
I2S DATA0 signal |
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MI2S_2_SCK |
250 |
DO |
I2S Serial clock signal |
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MI2S_2_DATA1 |
251 |
IO |
I2S DATA1 signal |
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MI2S_2_MCLK |
114 |
DO |
I2S Main clock signal |
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LPI_MI2S_SCLK |
212 |
DO |
LPI_I2S serial clock signal |
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LPI_MI2S_WS |
156 |
DO |
LPI_I2S word selection |
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signal |
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LPI_MI2S_DATA |
154 |
IO |
LPI_I2S DATA0 signal |
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0 |
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LPI_MI2S_DATA |
155 |
IO |
LPI_I2S DATA1 signal |
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1 |
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Emergency Download Interface |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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Pulled up to |
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LDO13A_1P8 |
|
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|
|
Force the module to enter |
|
during power-up |
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USB_BOOT |
57 |
DI |
into emergency download |
|
will force the |
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mode |
|
module to enter |
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into emergency |
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download mode. |
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Other Interfaces |
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Pin Name |
Pin |
I/O |
Description |
DC |
Comment |
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No. |
Characteristics |
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GNSS_PPS_OU |
202 |
DO |
LNA enable control |
|
LNA enable control |
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|
T |
|
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If customers |
|
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|
|
|
require automatic |
|
|
|
CBL_PWR_N |
22 |
DI |
Used for configuring auto |
|
power-on, this pin |
|
|
|
power-on |
|
should be |
||||
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|
|
shorted-to-ground
.
Reserved Interface
SC66_Hardware_Design |
41 / 118 |