Quectel Wireless Solutions 201905SC66MW User Manual

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SC66 Hardware Design

Smart LTE Module Series

Rev: SC66_Hardware_Design_V1.0

Date: 2019-03-08

Status: Preliminary

www.quectel.com

Smart LTE Module Series

SC66 Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 5108 6236

Email: info@quectel.com

Or our local office. For more information, please visit:

http://www.quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/technical.htm

Or email to: support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.

COPYRIGHT

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

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About the Document

History

 

Revision

 

Date

 

Author

 

Description

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

2019-03-08

 

Jian WU

Initial

 

 

 

 

 

 

 

 

 

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Contents

About the Document...................................................................................................................................

2

Contents

.......................................................................................................................................................

 

3

Table Index...................................................................................................................................................

 

6

Figure Index .................................................................................................................................................

 

8

1

Introduction ........................................................................................................................................

 

10

 

1.1. .....................................................................................................................

Safety Information

14

2

Product ................................................................................................................................Concept

15

 

2.1. ..................................................................................................................

General Description

15

 

2.2. .............................................................................................................................

Key Features

19

 

2.3. ...................................................................................................................

Functional Diagram

22

 

2.4. .......................................................................................................................

Evaluation Board

24

3

Application .......................................................................................................................Interfaces

25

 

3.1. ..................................................................................................................

General Description

25

 

3.2. .........................................................................................................................

Pin Assignment

26

 

3.3. ..........................................................................................................................

Pin Description

27

 

3.4. ............................................................................................................................

Power Supply

42

 

3.4.1. .........................................................................................................

Power Supply Pins

42

 

3.4.2. ..................................................................................................

Decrease Voltage Drop

42

 

3.4.3. ..............................................................................Reference Design for Power Supply

43

 

3.5. .........................................................................................................

Turn on and off Scenarios

45

 

3.5.1. .............................................................................Turn on Module Using the PWRKEY

45

 

3.5.2. .........................................................................................................

Restart the Module

46

 

3.6. .........................................................................................................................

VRTC Interface

47

 

3.7. ............................................................................................................................

Power Output

48

 

3.8. .............................................................................................

Battery Charge and Management

48

 

3.9. ............................................................................................................................

USB Interface

51

 

3.9.1. .........................................................................................................

TYPE-C Interfaces

51

 

3.9.2. ..................................................................................................................

DP Interfaces

54

 

3.9.3. ................................................................................................................................

Host

56

 

3.10. ........................................................................................................................

UART Interfaces

56

 

3.11. ......................................................................................................................

(U)SIM Interfaces

58

 

3.12. .....................................................................................................................

SD Card Interface

61

 

3.13. ........................................................................................................................

GPIO Interfaces

63

 

3.14. ............................................................................................................................

I2C Interfaces

64

 

3.15. ..............................................................................................................................

I2S Interface

65

 

3.16. ............................................................................................................................

SPI Interfaces

66

 

3.17. ..........................................................................................................................

ADC Interfaces

66

 

3.18. ..........................................................................................................................

LCM Interfaces

67

 

 

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3.19.

Touch Panel Interfaces .............................................................................................................

71

 

3.20.

Camera Interfaces.....................................................................................................................

73

 

3.20.1.

Design Considerations ...................................................................................................

79

 

3.21.

Sensor Interfaces ......................................................................................................................

81

 

3.22.

Audio Interfaces ........................................................................................................................

82

 

3.22.1. Reference Circuit Design for Microphone Interfaces.....................................................

83

 

3.22.2. Reference Circuit Design for Earpiece Interface ...........................................................

84

 

3.22.3. Reference Circuit Design for Headphone Interface.......................................................

85

 

3.22.4. Reference Circuit Design for Loudspeaker Interface.....................................................

85

 

3.22.5. Audio Interfaces Design Considerations........................................................................

85

 

3.23.

Emergency Download Interface................................................................................................

86

4

Wi-Fi and BT .......................................................................................................................................

87

 

4.1.

Wi-Fi Overview..........................................................................................................................

87

 

4.1.1.

Wi-Fi Performance .........................................................................................................

87

 

4.2.

BT Overview..............................................................................................................................

89

 

4.2.1.

BT Performance .............................................................................................................

90

5

GNSS

...................................................................................................................................................

 

91

 

5.1.

GNSS Performance ..................................................................................................................

91

 

5.2.

GNSS RF Design Guidelines....................................................................................................

92

6

Antenna Interfaces.............................................................................................................................

93

 

6.1.

Main/Rx-diversity Antenna Interfaces .......................................................................................

93

 

6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design .......................................

97

 

6.1.2. Reference Design of RF Layout.....................................................................................

97

 

6.2.

Wi-Fi/BT Antenna Interface.......................................................................................................

99

 

6.3.

GNSS Antenna Interface.........................................................................................................

100

 

6.3.1. Recommended Circuit for Passive Antenna ................................................................

101

 

6.3.2.

Recommended Circuit for Active Antenna ...................................................................

102

 

6.4.

Antenna Installation.................................................................................................................

102

 

6.4.1.

Antenna Requirements ................................................................................................

102

 

6.4.2. Recommended RF Connector for Antenna Installation ...............................................

103

7 Electrical, Reliability and Radio Characteristics ..........................................................................

105

 

7.1.

Absolute Maximum Ratings ....................................................................................................

105

 

7.2.

Power Supply Ratings.............................................................................................................

105

 

7.3.

Operation and Storage Temperatures.....................................................................................

106

 

7.4.

Current Consumption..............................................................................................................

107

 

7.5.

RF Output Power ....................................................................................................................

116

 

7.6.

RF Receiving Sensitivity .........................................................................................................

119

 

7.7.

Electrostatic Discharge ...........................................................................................................

123

8

Mechanical Dimensions ..................................................................................................................

124

 

8.1.

Mechanical Dimensions of the Module ...................................................................................

124

 

8.2.

Recommended Footprint ........................................................................................................

126

 

8.3.

Top and Bottom View of the Module .......................................................................................

127

 

 

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9

Storage, Manufacturing and Packaging ........................................................................................

128

 

9.1.

Storage ....................................................................................................................................

128

 

9.2.

Manufacturing and Soldering ..................................................................................................

129

 

9.3.

Packaging ...............................................................................................................................

130

10

Appendix A References...................................................................................................................

132

11

Appendix B GPRS Coding Schemes .............................................................................................

135

12

Appendix C GPRS Multi-slot Classes............................................................................................

136

13

Appendix D EDGE Modulation and Coding Schemes .................................................................

138

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Table Index

 

TABLE 1: SC66-CE* FREQUENCY BANDS.....................................................................................................

15

TABLE 2: SC66-A* FREQUENCY BANDS .......................................................................................................

16

TABLE 3: SC66-J* FREQUENCY BANDS ........................................................................................................

16

TABLE 4: SC66-E* FREQUENCY BANDS .......................................................................................................

17

TABLE 5: SC66-W* FREQUENCY BANDS ......................................................................................................

17

TABLE 6: SC66-MW*(2*2 MIMO WIFI) FREQUENCY BANDS ........................................................................

18

TABLE 7: SC66 KEY FEATURES .....................................................................................................................

19

TABLE 8: I/O PARAMETERS DEFINITION.......................................................................................................

27

TABLE 9: PIN DESCRIPTION ...........................................................................................................................

27

TABLE 10: POWER DESCRIPTION .................................................................................................................

48

TABLE 11: PIN DEFINITION OF CHARGING INTERFACE .............................................................................

49

TABLE 12: PIN DEFINITION OF USB INTERFACE .........................................................................................

51

TABLE 13: USB TRACE LENGTH INSIDE THE MODULE...............................................................................

54

TABLE 14: THE DIFFERENCES BETWEEN USB MODE AND DISPLAYPORT MODE .................................

55

TABLE 15: USB2 CONFIGURATION ................................................................................................................

56

TABLE 16: PIN DEFINITION OF UART INTERFACES.....................................................................................

57

TABLE 17: PIN DEFINITION OF (U)SIM INTERFACES...................................................................................

59

TABLE 18: PIN DEFINITION OF SD CARD INTERFACE ................................................................................

61

TABLE 19: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE .......................................................

62

TABLE 20: PIN DEFINITION OF GPIO INTERFACES .....................................................................................

63

TABLE 21: PIN DEFINITION OF I2C INTERFACES.........................................................................................

65

TABLE 22: PIN DEFINITION OF I2S INTERFACE ...........................................................................................

65

TABLE 23: PIN DEFINITION OF SPI INTERFACES ........................................................................................

66

TABLE 24: PIN DEFINITION OF ADC INTERFACES .......................................................................................

66

TABLE 25: PIN DEFINITION OF LCM INTERFACES.......................................................................................

67

TABLE 26: PIN DEFINITION OF TOUCH PANEL INTERFACES .....................................................................

72

TABLE 27: PIN DEFINITION OF CAMERA INTERFACES ...............................................................................

74

TABLE 28: MIPI TRACE LENGTH INSIDE THE MODULE...............................................................................

79

TABLE 29: PIN DEFINITION OF SENSOR INTERFACES ...............................................................................

81

TABLE 30: PIN DEFINITION OF AUDIO INTERFACES ...................................................................................

82

TABLE 31: WI-FI TRANSMITTING PERFORMANCE.......................................................................................

87

TABLE 32: WI-FI RECEIVING PERFORMANCE..............................................................................................

88

TABLE 33: BT DATA RATE AND VERSIONS....................................................................................................

90

TABLE 34: BT TRANSMITTING AND RECEIVING PERFORMANCE .............................................................

90

TABLE 35: GNSS PERFORMANCE .................................................................................................................

91

TABLE 36: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES .........................................

93

TABLE 37: SC66-CE* MODULE OPERATING FREQUENCIES ......................................................................

93

TABLE 38: SC66-A* MODULE OPERATING FREQUENCIES.........................................................................

94

TABLE 39: SC66-J* MODULE OPERATING FREQUENCIES .........................................................................

95

TABLE 40: SC66-E* MODULE OPERATING FREQUENCIES.........................................................................

96

TABLE 41: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE ................................................................

99

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TABLE 42: WI-FI/BT FREQUENCY.................................................................................................................

100

TABLE 43: PIN DEFINITION OF GNSS ANTENNA........................................................................................

100

TABLE 44: GNSS FREQUENCY.....................................................................................................................

101

TABLE 45: ANTENNA REQUIREMENTS........................................................................................................

102

TABLE 46: ABSOLUTE MAXIMUM RATINGS ................................................................................................

105

TABLE 47: SC66 MODULE POWER SUPPLY RATINGS...............................................................................

105

TABLE 48: OPERATION AND STORAGE TEMPERATURES ........................................................................

106

TABLE 49: SC66-CE* CURRENT CONSUMPTION .......................................................................................

107

TABLE 50: SC66-A* CURRENT CONSUMPTION..........................................................................................

109

TABLE 51: SC66-J* CURRENT CONSUMPTION ...........................................................................................

110

TABLE 52: SC66-E* CURRENT CONSUMPTION...........................................................................................

112

TABLE 53: SC66-CE* RF OUTPUT POWER...................................................................................................

116

TABLE 54: SC66-A* RF OUTPUT POWER .....................................................................................................

116

TABLE 55: SC66-J* RF OUTPUT POWER......................................................................................................

117

TABLE 56: SC66-E* RF OUTPUT POWER .....................................................................................................

118

TABLE 57: SC66-CE* RF RECEIVING SENSITIVITY .....................................................................................

119

TABLE 58: SC66-A* RF RECEIVING SENSITIVITY.......................................................................................

120

TABLE 59: SC66-J* RF RECEIVING SENSITIVITY .......................................................................................

121

TABLE 60: SC66-E* RF RECEIVING SENSITIVITY.......................................................................................

122

TABLE 61: ESD CHARACTERISTICS (TEMPERATURE: 25°C, HUMIDITY: 45%).......................................

123

TABLE 50: RECOMMENDED THERMAL PROFILE PARAMETERS .............................................................

129

TABLE 63: REEL PACKAGING .......................................................................................................................

131

TABLE 64: RELATED DOCUMENTS ..............................................................................................................

132

TABLE 65: TERMS AND ABBREVIATIONS ....................................................................................................

132

TABLE 66: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................

135

TABLE 67: GPRS MULTI-SLOT CLASSES ....................................................................................................

136

TABLE 68: EDGE MODULATION AND CODING SCHEMES.........................................................................

138

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ...............................................................................................................

24

FIGURE 2: PIN ASSIGNMENT (TOP VIEW).....................................................................................................

26

FIGURE 3: VOLTAGE DROP SAMPLE.............................................................................................................

42

FIGURE 4: STRUCTURE OF POWER SUPPLY ..............................................................................................

43

FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY ..............................................................................

44

FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT...................................................................

45

FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ...........................................................................

45

FIGURE 8: AUTOMATIC BOOT REFERENCE CIRCUIT .................................................................................

46

FIGURE 9: TIMING OF RESTARTING MODULE .............................................................................................

46

FIGURE 10: RTC POWERED BY RECHARGEABLE BUTTON CELL.............................................................

47

FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT ...................................................

50

FIGURE 12: USB TYPE-C INTERFACE REFERENCE DESIGN .....................................................................

53

FIGURE 13: DISPLAY PORT INTERFACES....................................................................................................

56

FIGURE 14: USB2 HOST .................................................................................................................................

56

FIGURE 15: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART6)..............................

58

FIGURE 16: RS232 LEVEL MATCH CIRCUIT (FOR UART5) ..........................................................................

58

FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR

...................................................................................................................................................................

60

FIGURE 18: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR

...................................................................................................................................................................

60

FIGURE 19: REFERENCE CIRCUIT FOR SD CARD INTERFACE .................................................................

62

FIGURE 20: LCM0 EXTERNAL BACKLIGHT DRIVE REFERENCE CIRCUIT ................................................

69

FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE.........................................................

69

FIGURE 22: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE.........................................................

70

FIGURE 23: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE.........................................................

71

FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES.......................................

73

FIGURE 25: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS ..................................

76

FIGURE 26: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS ....................................

77

FIGURE 27: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERA APPLICATIONS ................................

78

FIGURE 28: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE ...........................

83

FIGURE 29: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE ........................................

84

FIGURE 30: REFERENCE CIRCUIT DESIGN FOR EARPIECE IINTERFACE ...............................................

84

FIGURE 31: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ...........................................

85

FIGURE 30: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE .......................................

85

FIGURE 33: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE.....................

86

FIGURE 34: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES ..

97

FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB......................................................................

98

FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB..................................................

98

FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE

 

GROUND) ..................................................................................................................................................

98

FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

 

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GROUND) ..................................................................................................................................................

99

FIGURE 37: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE ................................

100

FIGURE 38: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA .........................................

101

FIGURE 39: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ...........................................

102

FIGURE 40: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)..............................................

103

FIGURE 41: MECHANICALS OF U.FL-LP CONNECTORS ...........................................................................

104

FIGURE 42: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .........................................................

104

FIGURE 43: MODULE TOP AND SIDE DIMENSIONS...................................................................................

124

FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW) .......................................................................

125

FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................

126

FIGURE 46: TOP VIEW OF THE MODULE ....................................................................................................

127

FIGURE 47: BOTTOM VIEW OF THE MODULE............................................................................................

127

FIGURE 48: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE..............................................

129

FIGURE 49: TAPE DIMENSIONS ...................................................................................................................

130

FIGURE 50: REEL DIMENSIONS ...................................................................................................................

131

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1 Introduction

This document defines the SC66 module and describes its air interface and hardware interface which are connected with customers’ applications.

This document can help customers quickly understand module interface specifications, electrical and mechanical details as well as other related information of SC66 module. Associated with application note and user guide, customers can use SC66 module to design and set up mobile applications easily.

Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [SC66-MW] is in compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm

The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.

 

AT

BE

BG

HR

CY

CZ

DK

 

EE

FI

FR

DE

EL

HU

IE

 

IT

LV

LT

LU

MT

NL

PL

 

PT

RO

SK

SI

ES

SE

UK

The device could be used with a separation distance of 20cm to the human body.

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OEM/Integrators Installation Manual

Important Notice to OEM integrators

1.This module is limited to OEM installation ONLY.

2.This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).

3.The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations

4.For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part

15Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).

The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

End Product Labeling

When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: “Contains FCC ID: XMR201905SC66MW”

“Contains IC: 10224A-20195SC66MW “

The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

Antenna Installation

(1)The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2)The transmitter module may not be co-located with any other transmitter or antenna.

(3)Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation.

Antenna

2.4GHz

5.2GHz

5.3GHz

5.5GHz

5.8GHz

type

band

band

band

band

band

 

Peak Gain

Peak Gain

Peak Gain

Peak Gain

Peak Gain

 

(dBi)

(dBi)

(dBi)

(dBi)

(dBi)

 

 

 

 

 

 

External

5.38

4.48

4.48

5.05

4.54

antenna

 

 

 

 

 

 

 

 

 

 

 

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

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with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Industry Canada Statement

This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions:

(1)This device may not cause interference; and

(2)This device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

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(1)l'appareil ne doit pas produire de brouillage, et

(2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement."

The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure. Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where required by the technology.

The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems;

The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall comply with the e.i.r.p. limit; and

The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.

L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par la technologie.

Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;

Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725 MHz doit être conforme à la norme e.r.p. limite; et

Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à la norme e.i.r.p. les limites spécifiées pour un fonctionnement point à point et non point à point, selon le cas.

CAN ICES-3(B)/ NMB-3(B)

Radiation Exposure Statement

This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body.

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1.1. Safety Information

The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating SC66 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description

SC66 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and provides industrial grade performance. Its general features are listed below:

Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA, WCDMA, TD-SCDMA, EVDO/CDMA, EDGE and GPRS coverage

Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT5.0 LE standards

Integrate GPS/GLONASS/BeiDou satellite positioning systems

Support multiple audio and video codecs

Built-in high performance AdrenoTM 512 graphics processing unit

Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces

SC66 are available in six variants: SC66-MW*, SC66-CE*, SC66-A*, SC66-J*, SC66-E*, SC66-W*.

The following table shows the supported frequency bands of SC66.

Table 1: SC66-CE* Frequency Bands

Type

Frequency Bands

 

 

LTE-FDD

B1/B3/B5/B8

 

 

LTE-TDD

B34/B38/B39/B40/B41

 

 

WCDMA

B1/B8

 

 

TD-SCDMA

B34/B39

 

 

EVDO/CDMA

BC0

 

 

GSM

900/1800MHz

 

 

Wi-Fi 802.11a/b/g/n/ac

2402MHz~2482MHz; 5180MHz~5825MHz

 

 

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BT5.0

2402MHz~2480MHz

GPS: 1575.42MHz±1.023MHz GNSS GLONASS: 1597.5MHz~1605.8MHz

BeiDou: 1561.098MHz±2.046MHz

Table 2: SC66-A* Frequency Bands

Type

Frequency Bands

 

 

LTE-FDD

B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71

 

 

LTE-TDD

B41(200M)

 

 

WCDMA

B2/B4/B5

 

 

Wi-Fi 802.11a/b/g/n/ac

2402MHz~2482MHz; 5180MHz~5825MHz

 

 

BT 5.0

2402MHz~2480MHz

 

 

 

GPS: 1575.42MHz±1.023MHz

GNSS

GLONASS: 1597.5MHz~1605.8MHz

 

BeiDou: 1561.098MHz±2.046MHz

 

 

Table 3: SC66-J* Frequency Bands

 

 

 

Type

Frequency Bands

 

 

LTE-FDD

B1/B3/B5/B8/B11/B18/B19/B21/B26/B28(A+B)

 

 

LTE-TDD

B41(120M)

 

 

WCDMA

B1/B6/B8/B19

 

 

Wi-Fi 802.11a/b/g/n/ac

2402MHz~2482MHz; 5180MHz~5825MHz

 

 

BT 5.0

2402MHz~2480MHz

 

 

 

GPS: 1575.42MHz±1.023MHz

GNSS

GLONASS: 1597.5MHz~1605.8MHz

 

BeiDou: 1561.098MHz±2.046MHz

 

 

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Table 4: SC66-E* Frequency Bands

 

 

 

 

 

 

 

Type

Frequency Bands

 

 

 

 

 

 

LTE-FDD

B1/B2/B3/B4/B5/B7/B8/B20/B28(A+B)

 

 

 

 

 

LTE-TDD

B38/B39/B40/B41(200M)

 

 

 

 

 

WCDMA

B1/B2/B4/B5/B8

 

 

 

 

 

GSM

B2/B3/B5/B8

 

 

 

 

 

Wi-Fi 802.11a/b/g/n/ac

2402MHz~2482MHz; 5180MHz~5825MHz

 

 

 

 

 

BT 5.0

2402MHz~2480MHz

 

 

 

 

 

 

GPS: 1575.42MHz±1.023MHz

 

GNSS

GLONASS: 1597.5MHz~1605.8MHz

 

 

BeiDou: 1561.098MHz±2.046MHz

 

 

 

 

Table 5: SC66-W* Frequency Bands

Type

Frequency Bands

 

 

LTE-FDD

/

 

 

LTE-TDD

/

 

 

WCDMA

/

 

 

TD-SCDMA

/

 

 

CDMA

/

 

 

GSM

/

 

 

Wi-Fi 802.11a/b/g/n/ac

2402MHz~2482MHz; 5180MHz~5825MHz

 

 

BT 5.0

2402MHz~2480MHz

 

 

GNSS

/

 

 

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Table 6: SC66-MW*(2*2 MIMO WIFI) Frequency Bands

Type

Frequency Bands

 

 

LTE-FDD

/

 

 

LTE-TDD

/

 

 

WCDMA

/

 

 

TD-SCDMA

/

 

 

CDMA

/

 

 

GSM

/

 

 

Wi-Fi 802.11a/b/g/n/ac

2402MHz~2482MHz; 5180MHz~5825MHz

 

 

BT 5.0

2402MHz~2480MHz

 

 

GNSS

/

 

 

NOTE

“*” means under development. SC66-A SC66-J SC66-E SC66-MW support WIFI_MIMO

SC66 is an SMD type module which can be embedded into applications through its 324 pins (including 152 LCC pads and 172 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC66 can meet almost all requirements for M2M applications such as smart metering, smart home, security, routers, wireless POS, mobile computing devices, PDA phone, tablet PC, etc.

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2.2. Key Features

The following table describes the detailed features of SC66 module.

Table 7: SC66 Key Features

Features

 

Details

 

 

 

 

 

Customized 64-bit ARM v8-compliant applications processorCustomized

 

 

64-bit ARM v8-compliant applications processor

Application Processor

 

Kryo Gold: quad high-performance cores targeting 2.2 GHz

 

 

Kryo Silver: quad low-power cores targeting 1.843 GHz

 

 

two quad-core processors with 1MB L2 cache

Modem system

 

LTE Cat 6(FDD and TDD), 2*20 CA(40MHz)

 

 

 

GPU

 

Adreno 512 up to 650 MHzAdreno 512 up to 650 MHz

 

 

 

Memory

 

32GB eMMC + 3GB LPDDR4x(default)

 

64GB eMMC + 4GB LPDDR4x (optional)

 

 

 

 

 

Operating System

 

Android 9

 

 

 

Power Supply

 

VBAT Supply Voltage: 3.55V~4.4V

 

Typical 4.0V

 

 

 

 

 

 

 

Class 4 (33dBm±2dB) for EGSM900

 

 

Class 1 (30dBm±2dB) for DCS1800

 

 

Class E2 (27dBm±3dB) for EGSM900 8-PSK

 

 

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Transmitting Power

 

Class 3 (24dBm+1/-3dB) for WCDMA bands

 

 

Class 3 (24dBm+3/-1dB) for EVDO/CDMA BC0

 

 

Class 2 (24dBm+1/-3dB) for TD-SCDMA bands

 

 

Class 3 (23dBm±2dB) for LTE-FDD bands

 

 

Class 3 (23dBm±2dB) for LTE-TDD bands

 

 

 

 

 

Support 3GPP R12 Cat 6* and Cat 4

 

 

Support 1.4 MHz to 20MHz RF bandwidth

 

 

Support Multiuser MIMO in DL direction

LTE Features

 

Cat 6* FDD: Max 300Mbps (DL)/Max 50Mbps (UL)

 

 

Cat 6* TDD: Max 265Mbps (DL)/Max 30Mbps (UL)

 

 

Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)

 

 

Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL)

 

 

Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA

UMTS Features

 

Support QPSK, 16-QAM and 64-QAM modulation

 

DC-HSDPA: Max 42Mbps (DL)

 

 

 

 

DC-HSUPA: Max 11.2Mbps (UL)

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WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)

 

 

 

 

 

TD-SCDMA Features

Support CCSA Release 3 TD-SCDMA

 

Max 4.2Mbps (DL)/Max 2.2Mbps (UL)

 

 

 

 

 

Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A

 

CDMA2000 Features

EVDO: Max 3.1Mbps (DL)/Max 1.8 Mbps (UL)

 

 

1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL)

 

 

 

R99

 

 

CSD: 9.6kbps, 14.4kbps

 

 

GPRS

 

 

Support GPRS multi-slot class 33 (33 by default)

 

 

Coding scheme: CS-1, CS-2, CS-3 and CS-4

 

 

Max 107Kbps (DL), 85.6Kbps (UL)

 

GSM Features

EDGE

 

 

Support EDGE multi-slot class 33 (33 by default)

 

 

Support GMSK and 8-PSK for different MCS (Modulation and Coding

 

 

Scheme)

 

 

Downlink coding schemes: CS 1-4 and MCS 1-9

 

 

Uplink coding schemes: CS 1-4 and MCS 1-9

 

 

Max 296Kbps (DL), 236.8Kbps (UL)

 

 

 

 

 

WLAN Features

2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps

 

Support AP and STA mode

 

 

 

 

 

 

 

Bluetooth Features

BT5.0 LE

 

 

 

 

 

GNSS Features

GPS/GLONASS/BeiDou

 

 

 

 

 

 

Text and PDU mode

 

SMS

Point-to-point MO and MT

 

 

SMS cell broadcast

 

 

 

 

 

 

Support for MIPI_DSI and DP overTYPE-C for dual screen display

 

LCM Interfaces

MIPI_DSI Supports up to 2560x1600@60fps

 

 

DP supports 4K@30fps

 

 

 

 

 

 

Support three groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane

 

Camera Interfaces

Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane +

 

2-lane + 1-lane)

 

 

 

 

up to 24MP with dual ISP

 

 

 

 

 

Video Codec

Video encoding and decoding: up to 4K @30fps

 

Concurrency: encoding up to 1080P @30fps; decoding up to 1080P @60fps

 

 

 

 

 

 

 

 

Audio Input

 

 

Three analog microphone inputs, integrating internal bias voltage

 

Audio Interfaces

Audio Output

 

Class AB stereo headphone output

 

 

 

 

Class AB earpiece differential output

 

 

Class D speaker differential amplifier output

 

 

 

 

 

 

 

 

 

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Audio Codec

EVRC, EVRC-B, EVRC-WB; G.711, G.729A/AB; GSM-FR, GSM-EFR,

 

GSM-HR; AMR-NB, AMR-WB, AMR-eAMR, AMR-BeAMR

 

 

 

 

 

 

 

 

Compliant with USB 3.1 and 2.0 specifications, with transmission rates up to

 

 

10Gbps on USB 3.1 and 480Mbps on USB 2.0.

 

USB Interface

Support USB OTG

 

 

Used for AT command communication, data transmission, software

 

 

debugging and firmware upgrade

 

 

 

 

 

 

4 UART Interfaces: DEBUG UART UART6 UART1 and LPI_UART_2

 

 

UART6: 4-wire UART interface with RTS/CTS hardware flow control,

 

UART Interfaces

max rate up to 4Mbps

 

UART1: terface

 

 

 

 

DEBUG: 2-wire UART interface used for debugging

 

 

LPI_UART_2:low power uart, use is not recommended for the time being

 

 

SD Card Interface

Support SD 3.0

 

Support SD card hot-plug

 

 

 

 

 

 

 

 

2 (U)SIM interfaces

 

(U)SIM Interfaces

Support USIM/SIM card: 1.8V/2.95V

 

 

Support Dual SIM Dual Standby (supported by default)

 

 

 

 

 

I2C Interfaces

It supports up to five I2C interfaces, used for peripherals such as TP, camera,

 

sensor, etc.

 

 

 

 

 

 

 

I2S Interface

Supports two I2S, one of which is low power I2S

 

 

 

 

 

ADC Interfaces

2 general purpose ADC interfaces

 

 

 

 

 

SPI Interfaces

One SPI interfaces, only support master mode

 

 

 

 

 

Real Time Clock

Supported

 

 

 

 

 

Antenna Interfaces

Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna

 

interfaces

 

 

 

 

 

 

 

 

Size: (43.0±0.15)mm × (44.0±0.15)mm × (2.85±0.2)mm

 

Physical Characteristics

Package: LCC + LGA

 

 

Weight: approx. 13.0g

 

 

 

 

 

 

Operating temperature range: -35°C ~ +65°C 1)

 

Temperature Range

Extended temperature range: -40°C ~ +75°C 2)

 

 

Storage temperature range: -40°C ~ +90°C

 

 

 

 

 

Firmware Upgrade

Over USB interface

 

 

 

 

 

RoHS

All hardware components are fully compliant with EU RoHS directive

 

 

 

 

NOTES

1. 1) Within operation temperature range, the module is 3GPP compliant.

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2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to

the normal operating temperature levels, the module will meet 3GPP specifications again. 3. “*” means under development.

2.3. Functional Diagram

The following figure shows a block diagram of SC66 and illustrates the major functional parts.

Power management

Radio frequency

Baseband

LPDDR4X+eMMC flash

Peripheral interfaces

--USB interface

--(U)SIM interfaces

--UART interfaces

--SD card interface

--I2C interfaces

- I2S interfaces

--SPI interfaces --ADC interfaces

--LCM (MIPI) interfaces

--TP (touch panel) interfaces

--Camera (MIPI) interfaces

--Audio interfaces

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Power

Power

 

 

 

 

 

 

ANT_WIFI/BT

ANT_WIFI/BT

 

 

 

 

 

 

 

 

 

Signal

Function

 

 

 

 

 

 

 

 

 

 

 

V DD_ RF

 

 

 

 

 

 

 

 

VOL_UP

 

 

 

 

 

 

 

 

 

 

MICs

 

 

 

 

 

 

 

 

 

 

SPK

 

 

 

 

 

 

 

FEM

 

FEM

 

Codec

 

 

 

 

 

 

 

EAR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Headset

 

 

 

 

 

 

 

 

 

 

SD_VDD

PM660L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SD_PU_VDD

 

 

 

 

 

 

 

 

 

 

LDO3B_2P8

 

 

 

 

 

 

 

 

 

 

LDO7B_3P125

 

 

 

 

 

 

38.4MHZ

 

 

 

 

 

 

 

 

 

XO

 

 

 

PWM

 

 

 

 

 

 

 

WCN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VPH_PWR

 

 

 

 

 

 

 

 

 

 

 

 

BBCLK

 

 

 

 

 

 

 

 

VRTC

 

RFCLK

 

 

 

PM-3003A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USIM1_VDD

 

 

 

 

 

 

 

 

LPDDR

USIM2_VDD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

eMMC

LDO11A_1P8

PM660

 

 

 

 

 

 

 

LDO13A_1P8

 

38.4 M

 

 

 

 

 

 

 

 

LDO14A_1P8

 

XO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADCs

HK ADC

Porcessors

 

Air Interface

 

MEM

 

 

 

 

 

 

 

 

 

 

&MPPs

 

 

 

 

 

Baseband

 

 

 

PWRKEY

 

 

 

 

 

 

 

 

 

VOL DOWN

 

 

 

 

 

 

Connectivity

 

 

VBUS

 

Multimedia

 

 

 

 

 

BATTERY

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

13.2

 

 

 

 

 

 

 

 

 

 

769

 

 

SPI

LCM

TP

CAM

USB

2×(U)SIM UART

SD 3.0

I2S

I2C GPIOs

 

 

2.0&3.1

 

 

 

 

 

 

 

 

 

 

This diagram just used for SC66-MW

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Power

Power

 

Signal

Function

C1

 

 

 

 

V DD_ RF

VOL_UP

 

 

MICs

 

 

SPK

 

 

EAR

Codec

 

 

 

Headset

 

 

SD_VDD

PM660L

 

SD_PU_VDD

 

 

LDO3B_2P8

 

 

LDO7B_3P125

 

 

PWM

 

 

VPH_PWR

 

 

 

 

BBCLK

VRTC

 

RFCLK

 

 

USIM1_VDD

 

 

USIM2_VDD

 

 

LDO11A_1P8

PM660

LDO13A_1P8

 

 

LDO14A_1P8

 

 

ADCs

HK ADC

 

 

&MPPs

 

PWRKEY

 

 

VOL DOWN

 

 

VBUS

 

 

BATTERY

 

 

-

ANT_ MAIN

ANT_ GNSS

ANT_DRX

ANT_WIFI/BT

ANT_WIFI/BT

 

 

 

 

SAW

Switch

 

 

 

Switch

 

 

 

 

 

APT

 

 

 

LNA

 

 

 

 

 

 

 

 

 

 

 

SAW

Duplexs

 

SAW

FEM

FEM

 

 

 

 

SAW

 

 

 

0

PA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Tranceiver

38.4MHZ

 

 

 

 

 

 

 

XO

 

WCN

 

 

 

 

 

 

 

 

 

 

 

PM-3003A

 

LPDDR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

eMMC

38.4 M

 

 

 

 

 

 

 

XO

 

 

 

 

 

 

 

Porcessors

 

Air Interface

 

MEM

 

 

 

 

 

Baseband

 

 

Multimedia

 

 

 

Connectivity

 

 

 

 

 

 

 

 

13.2

 

 

 

 

 

 

 

769

SPI

LCM

TP

CAM

USB

2×(U)SIM UART

SD 3.0

I2S I2C GPIOs

2.0&3.1

 

 

 

 

 

 

 

Figure 1: Functional Diagram

NOTE

The red dotted frame is WIFI_MIMO path, which is not supported by SC66-CE and SC66-W.

2.4. Evaluation Board

In order to help customers develop applications with SC66 conveniently, Quectel supplies the evaluation board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone, antenna and other peripherals to control or test the module.

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3 Application Interfaces

3.1. General Description

SC66 is equipped with 324-pin 1.0mm pitch SMT pads that can be embedded into cellular application platform. The following chapters provide the detailed description of pins/interfaces listed below.

Power supply

Turn on and off function

VRTC interface

Power Output

Charging interface

USB interface

UART interfaces

(U)SIM interfaces

SD card interface

GPIO interfaces

I2C interfaces

I2S interfaces

SPI interfaces

ADC interfaces

LCM interfaces

TP (touch panel) interfaces

Camera interfaces

Sensor interfaces

Audio interfaces

Emergency download interface

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3.2. Pin Assignment

The following figure shows the pin assignment of SC66 module.

320

1

 

2

 

3

 

4

 

5

 

6

153

 

7

 

8

154

 

9

 

10

155

11

 

12

156

13

 

14

157

 

15

 

16

158

 

17

 

18

159

 

19

 

20

160

 

21

 

22

161

 

23

 

24

162

 

25

 

26

163

 

27

 

28

164

 

29

 

30

165

 

31

 

32

166

 

33

 

34

 

35

 

36

 

37

 

38

 

 

321

152

151

150

149

148

147

146

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

126

125

124

211

212

257

264

271

278

285

292

299

306

213

 

 

 

 

 

 

 

 

 

258

265

272

279

286

293

300

307

214

 

 

 

 

 

 

 

 

 

259

266

273

280

287

294

301

308

215

 

 

 

 

 

 

 

 

216

260

267

274

281

288

295

302

309

 

217

 

 

 

 

 

 

 

 

 

261

268

275

282

289

296

303

310

218

 

 

 

 

 

 

 

 

 

262

269

276

283

290

297

304

311

219

 

 

 

 

 

 

 

 

220

263

270

277

284

291

298

305

312

 

221

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

GND

POWER

AUDIO

USB

(U)SIM

SD

TP

LCM

CAMERA

ANT

UART

123

122

121

120

119

118

117

116

115

324

323

 

195

 

194

 

244

 

193

313

243

192

242

314

191

 

 

241

 

190

315

 

 

240

 

189

316

239

 

 

188

 

238

317

187

 

 

237

 

186

318

236

 

 

185

 

235

319

 

 

184

 

234

 

183

 

182

322

68

69

70

71

72

73

74

75

76

GPIO RESERVED OTHERS

114

113

112

111

110

109

108

107

106

105

104

103

102

101

100

99

98

97

96

95

94

93

92

91

90

89

88

87

86

85

84

83

82

81

80

79

78

77

Figure 2: Pin Assignment (Top View)

SC66_Hardware_Design

26 / 118

Smart LTE Module Series

SC66 Hardware Design

3.3. Pin Description

Table 8: I/O Parameters Definition

Type

Description

 

 

IO

Bidirectional

 

 

DI

Digital input

 

 

DO

Digital output

 

 

PI

Power input

 

 

PO

Power output

 

 

AI

Analog input

 

 

AO

Analog output

 

 

OD

Open drain

 

 

The following tables show the SC66’s pin definition and electrical characteristics.

Table 9: Pin Description

Power Supply

 

Pin Name

Pin No.

I/O

Description

DC Characteristics

Comment

 

 

 

 

 

 

 

 

 

 

 

 

 

 

It must be able to

 

 

 

 

 

 

provide sufficient

 

 

 

 

 

Vmax=4.4V

current up to 3.0A.

 

 

 

PI/P

Power supply for the

It is suggested to

 

VBAT

36,37, 38

Vmin=3.55V

 

O

module

use a TVS to

 

 

 

Vnorm=4.0V

 

 

 

 

 

increase voltage

 

 

 

 

 

 

 

 

 

 

 

 

surge withstand

 

 

 

 

 

 

capability.

 

 

 

 

 

 

 

 

 

 

 

 

Connect to external

 

 

 

 

 

 

 

bypass capacitors to

Vmax=4.4V

Do not load

 

VDD_RF

1, 2

PO

eliminate voltage

Vmin=3.55V

 

externally.

 

 

 

 

fluctuation of RF

Vnorm=4.0V

 

 

 

 

 

 

 

 

 

 

part.

 

 

 

 

 

 

 

 

 

 

 

 

VRTC

16

PI/P

Power supply for

VOmax=3.2V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

 

 

 

27 / 118

 

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

O

internal RTC circuit

When VBAT is not

 

 

 

 

 

connected

 

 

 

 

 

 

 

:

 

 

 

 

 

 

 

VI=2.1V~3.25V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power supply for

 

LDO13A_1

9

PO

1.8V output power

Vnorm=1.8V

external GPIO’s

 

P8

supply

IOmax=20mA

pull up circuits and

 

 

 

 

 

 

 

 

 

level shift circuit.

 

 

 

 

 

 

 

 

 

LDO7B_3P

157

PO

3.125V output power

Vnorm=3.125V

Power supply only

125

supply

IOmax=150mA

for DP switch

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power supply for

 

LDO11A_1P

10

PO

1.8V output power

Vnorm=1.8V

I/O VDD of

8

supply

IOmax=150mA

cameras, LCDs

 

 

 

 

 

 

 

 

and TP etc.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power supply for

 

 

 

 

 

 

Sensors. Add a

 

LDO14A_1

 

 

1.8V output power

Vnorm=1.8V

1.0uF~4.7uF

 

158

PO

bypass capacitor if

 

P8

supply

IOmax=150mA

 

 

 

used.

 

 

 

 

 

 

 

 

 

 

 

 

If unused, keep

 

 

 

 

 

 

this pin open.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power supply for

 

 

 

 

 

 

sensor and LCM.

 

LDO3B_2P

 

 

2.8V output power

Vnorm=2.8V

Add a 1.0uF~2.2uF

 

12

PO

bypass capacitor if

8

supply

IOmax=600mA

 

 

used.

 

 

 

 

 

 

 

 

 

 

 

 

If unused, keep

 

 

 

 

 

 

this pin open.

 

 

 

 

 

 

 

 

 

VPH_PWR 30

PO

VBAT output power

Vnorm=VBAT

Power supply for

 

supply

IOmax=1000mA

other ICs.ICs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3 4 18

 

 

 

 

 

 

 

20 24

 

 

 

 

 

 

GND

 

 

Ground

 

 

 

 

 

31 34

 

 

 

 

 

 

 

35 40

 

 

 

 

 

SC66_Hardware_Design

28 / 118

Smart LTE Module Series

SC66 Hardware Design

43 47

56 62

87 98

101 112

125 128

130 133

135 148

150 159

160 163

166 170

173 176

182 193

195 219

225 243 257~323

Audio Interfaces

 

Pin Name

Pin No.

I/O

Description

 

DC Characteristics

Comment

 

 

 

 

 

 

 

 

 

MIC_BIAS

167

AO

Microphone bias

VO=1.6V~2.9V

 

 

 

voltage

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MIC1_P

44

AI

Microphone positive

 

 

 

 

input for channel 1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Microphone

 

 

 

 

 

MIC1_M

45

AI

negative input

for

 

 

 

 

 

 

 

channel 1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Microphone

 

 

If unused, it should

 

MIC_GND

168

 

 

 

be connected to

 

 

reference ground

 

 

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MIC2_P

46

AI

Microphone

 

 

Headset mic input

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

 

 

 

 

29 / 118

 

 

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

positive input

for

 

 

 

 

 

 

headset

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Microphone

 

 

 

 

 

MIC3_P

169

AI

positive input for

Second mic input

 

 

 

 

second mic

 

 

 

 

 

 

 

 

 

 

 

 

 

EAR_P

53

AO

Earpiece positive

 

 

 

output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EAR_M

52

AO

Earpiece negative

 

 

 

output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SPK_P

55

AO

Speaker positive

 

 

 

output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SPK_M

54

AO

Speaker negative

 

 

 

output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

HPH_R

51

AO

Headphone right

 

 

 

channel output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Headphone

 

 

It should be

 

HPH_REF

50

AI

 

 

connected to main

 

reference ground

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

HPH_L

49

AO

Headphone left

 

 

 

 

 

channel output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

HS_DET

48

AI

Headset insertion

Default high level

 

detection

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB Interface

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin No.

I/O

Description

 

DC Characteristics

Comment

 

 

 

 

 

 

 

 

 

 

 

 

Charging power

 

 

 

 

 

 

input.

 

 

 

 

 

 

 

 

Power supply

 

Vmax=10V

 

 

 

 

 

PI/P

output for OTG

 

 

 

 

USB_VBUS

41, 42

 

Vmin=3.6V

 

 

 

O

device.

 

 

 

 

 

 

 

Vnorm=5.0V

 

 

 

 

 

 

USB/charger

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

insertion

 

 

 

 

 

 

 

 

detection.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB2_HS_

 

 

USB 2.0

 

 

 

 

 

25

IO

differential data

 

 

 

 

 

DM

 

 

 

 

 

 

 

bus (minus)

 

USB 2.0 standard

90Ω differential

 

 

 

 

 

 

 

 

 

 

 

compliant

impedance.

 

USB2_HS_

 

 

USB 2.0

 

 

26

IO

differential data

 

 

 

 

 

DP

 

 

 

 

 

 

 

bus (plus)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB1_HS_

 

 

USB 2.0

 

USB 2.0 standard

90Ω differential

 

33

IO

differential data

 

impedance;

 

DM

 

compliant

 

 

 

bus (minus)

 

One part of the

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

30 / 118

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB1_HS_

 

 

USB 2.0

 

 

TYPE-C.

 

32

IO

differential data

 

 

 

 

 

DP

 

 

 

 

 

 

 

bus (plus)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB_SS2_T

 

 

USB 3.1

 

 

 

 

 

165

IO

differential

 

 

 

 

 

X_P

 

 

 

 

 

 

 

transmit (plus)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB_SS2_T

 

 

USB 3.1

 

 

 

 

 

164

IO

differential

 

 

 

 

 

X_M

 

 

 

 

 

 

 

transmit (minus)

USB 3.1 channel2

 

90Ω differential

 

 

 

 

 

 

 

 

 

 

standard compliant

 

impedance.

 

USB_SS2_

 

 

USB 3.1

 

 

162

IO

differential receive

 

 

 

 

 

RX_P

 

 

 

 

 

 

 

(plus)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB_SS2_

 

 

USB 3.1

 

 

 

 

 

161

IO

differential receive

 

 

 

 

 

RX_M

 

 

 

 

 

 

 

(minus)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB_SS1_

 

 

USB 3.1

 

 

 

 

 

171

IO

differential receive

 

 

 

 

 

RX_P

 

 

 

 

 

 

 

(plus)

 

 

90Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

USB_SS1_

 

 

USB 3.1

 

 

 

172

IO

differential receive

 

 

 

 

 

RX_M

 

 

 

 

 

 

 

(minus)

USB 3.1 channel1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

standard compliant

 

 

 

 

USB_SS1_T

 

 

USB 3.1

 

 

 

 

174

IO

differential

 

 

 

 

 

X _P

 

 

 

 

 

 

 

transmit (plus)

 

 

90Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

USB_SS1_T

 

 

USB 3.1

 

 

 

175

IO

differential

 

 

 

 

 

X _M

 

 

 

 

 

 

 

transmit (minus)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

USB Type-C

 

 

When micro usb is

 

USB_CC1

224

AI

detection channel

 

 

used ,it can be

 

 

 

 

1

 

 

used as ID pin

 

 

 

 

 

 

 

 

 

 

 

 

 

USB Type-C

 

 

 

 

 

USB_CC2

223

AI

detection channel

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

When USB

 

 

 

 

 

 

 

TYPE-C is used, it

 

 

 

 

 

 

 

should be

 

 

 

 

TYPE-C&uUSB

 

 

connected to

 

UUSB_TYP

 

 

 

 

VPH_PWR

 

23

DI

configuration

 

 

 

EC

 

 

through 10K

 

 

 

control pin

 

 

 

 

 

 

 

 

resistor. When

 

 

 

 

 

 

 

 

 

 

 

 

 

 

uUSB is used, it

 

 

 

 

 

 

 

should be

 

 

 

 

 

 

 

connected to GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

 

 

 

31 / 118

 

Smart LTE Module Series

SC66 Hardware Design

 

 

 

 

 

through 10K

 

 

 

 

 

resistor.

 

 

 

 

 

 

 

 

 

 

 

When USB

 

 

 

 

 

TYPE-C is used, it

 

 

 

 

 

should be

SS_DIR_IN 21

DI

CC status

 

connected to

detection pin

 

SS_DIR_OUT.

 

 

 

 

 

 

 

 

 

When uUSB is

 

 

 

 

 

used, it should be

 

 

 

 

 

connected to GND.

 

 

 

 

 

 

 

 

 

 

 

When USB

 

 

 

 

 

TYPE-C is used, it

 

 

 

 

 

should be

SS_DIR_OU

226

DO

CC status output

 

connected to

T

pin

 

SS_DIR_IN. When

 

 

 

 

 

 

 

 

uUSB is used, it

 

 

 

 

 

should be kept

 

 

 

 

 

open.

 

 

 

 

 

(U)SIM Interfaces

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O Description

DC Characteristics

Comment

No.

 

 

 

 

 

USIM1_DET

145

DI

(U)SIM1 card

VILmax=0.63V

hot-plug detection

VIHmin=1.17V

 

 

 

Active Low. Require external pull-up to 1.8V. If unused, keep this pin open.

USIM1_RST

144

DO

(U)SIM1 card

VOLmax=0.4V

 

reset signal

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

 

(U)SIM1 card

 

USIM1_CLK

143

DO

0.8 × USIM1_VDD

 

clock signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VILmax=

 

 

 

 

 

0.2 × USIM1_VDD

 

 

 

 

(U)SIM1 card data

VIHmin=

 

USIM1_DATA

142

IO

0.7 × USIM1_VDD

 

signal

 

 

 

 

VOLmax=0.4V

 

 

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

0.8 × USIM1_VDD

 

 

 

 

 

 

 

 

 

 

(U)SIM1 card

 

Either 1.8V or

USIM1_VDD

141

PO

 

2.95V (U)SIM card

power supply

 

 

 

 

 

is supported.

 

 

 

 

 

 

 

 

 

 

 

USIM2_DET

256

DI

(U)SIM2 card

VILmax=0.63V

Active Low.

detection

VIHmin=1.17V

Need external

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

32 / 118

Smart LTE Module Series

SC66 Hardware Design

pull-up to 1.8V. If unused, keep this pin open.

 

 

 

(U)SIM2 card

VOLmax=0.4V

USIM2_RST

207

DO

VOHmin=

reset signal

 

 

 

0.8 × USIM2_VDD

 

 

 

 

 

 

 

 

 

 

 

 

(U)SIM2 card

VOLmax=0.4V

USIM2_CLK

208

DO

VOHmin=

clock signal

 

 

 

0.8 × USIM2_VDD

 

 

 

 

 

 

 

 

 

 

 

 

 

VILmax=

 

 

 

 

0.2 × USIM2_VDD

 

 

 

(U)SIM2 card data

VIHmin=

USIM2_DATA

209

IO

0.7 × USIM2_VDD

signal

 

 

 

VOLmax=0.4V

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

0.8 × USIM2_VDD

 

 

 

(U)SIM2 card

Either 1.8V or

USIM2_VDD

210

PO

2.95V (U)SIM card

power supply

 

 

 

is supported.

 

 

 

 

 

 

 

 

 

UART Interfaces

 

Pin Name

Pin

I/O Description

DC Characteristics

Comment

 

.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DEBUG transmit

 

 

 

 

DEBUG_TXD

5

DO

data.

VOLmax=0.45V

 

 

 

Debug port by

VOHmin=1.35V

 

 

 

 

 

 

 

 

 

 

 

 

default.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DEBUG receive

 

 

 

 

DEBUG_RXD

6

DI

data.

VILmax=0.63V

 

 

 

Debug port by

VIHmin=1.17V

 

 

 

 

 

 

 

 

 

 

 

 

default.

 

 

 

 

 

 

 

 

 

 

 

UART1_TXD

7

DO

UART1 transmit

VOLmax=0.45V

1.8V power

 

data

VOHmin=1.35V

 

 

 

 

 

 

domain.

 

UART1_RXD

8

DI

UART1 receive

VILmax=0.63V

If unused, keep

 

data

VIHmin=1.17V

these pins open.

 

 

 

 

 

 

 

 

 

 

 

 

 

UART6_RXD

198

DI

UART6 receive

VILmax=0.63V

 

 

 

data

VIHmin=1.17V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UART6_TXD

199

DO

UART6 transmit

VOLmax=0.45V

 

 

 

data

VOHmin=1.35V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UART6_RTS

245

DO

UART6 request to

VOLmax=0.45V

 

 

 

send

VOHmin=1.35V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UART6_CTS

246

DI

UART6 clear to

VILmax=0.63V

 

 

 

send

VIHmin=1.17V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

 

 

 

33 / 118

 

Smart LTE Module Series

SC66 Hardware Design

LPI_UART_2_T

 

60

DO

UART2 transmit

VOLmax=0.45V

 

XD

 

data

VOHmin=1.35V

 

 

 

 

 

 

 

 

 

 

 

 

LPI_UART_2_R

 

61

DI

UART2 receive

VILmax=0.63V

 

XD

 

data

VIHmin=1.17V

 

 

 

 

 

 

 

 

 

 

 

SD Card Interface

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

 

Pin

I/O

Description

DC Characteristics

Comment

.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.8V SD card:

 

 

 

 

 

 

VOLmax=0.45V

 

 

 

 

 

High speed digital

VOHmin=1.4V

 

SD_CLK

 

70

DO

clock signal of SD

 

 

 

 

 

 

card

2.95V SD card:

 

 

 

 

 

 

VOLmax=0.368V

 

 

 

 

 

 

VOHmin=2.125V

 

 

 

 

 

 

 

 

SD_CMD

 

69

IO

Command signal

 

 

 

of SD card

 

 

 

 

 

 

 

 

 

 

 

 

 

1.8V SD card:

 

 

 

 

 

 

 

SD_DATA0

 

68

IO

 

VILmax=0.58V

 

 

 

VIHmin=1.27V

 

 

 

 

 

 

 

 

 

 

 

 

VOLmax=0.45V

 

 

 

 

 

High speed

VOHmin=1.4V

 

SD_DATA1

 

67

IO

 

 

 

bidirectional digital

 

 

 

 

 

 

2.95V SD card:

 

 

 

 

 

signal lines of SD

 

 

 

 

 

VILmax=0.737V

 

 

 

 

 

card

 

 

 

 

 

VIHmin=1.843V

 

SD_DATA2

 

66

IO

 

 

 

 

VOLmax=0.368V

 

 

 

 

 

 

 

 

 

 

 

 

VOHmin=2.125V

 

SD_DATA3

 

65

IO

 

 

 

 

 

 

 

 

 

 

 

 

 

SD_DET

 

64

DI

SD card insertion

VILmax=0.63V

Active low.

 

detection

VIHmin=1.17V

 

 

 

 

 

 

 

 

 

 

 

 

SD_VDD

 

63

PO

Power supply for

Vnorm=2.95V

 

 

SD card

IOmax=600mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Vnorm=1.8V/2.95V

Power supply for

SD_PU_VDD

 

179

PO

2.95V output

SD card’s pull-up

 

IOmax=50mA

 

 

 

 

 

circuit.

 

 

 

 

 

 

 

 

 

 

TP (Touch Panel) Interfaces

 

 

 

 

 

 

 

 

 

 

Pin Name

 

Pin N

I/O

Description

DC Characteristics

Comment

 

 

 

 

 

 

 

SC66_Hardware_Design

34 / 118

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TP0_RST

138

DO

Reset signal of

VOLmax=0.45V

1.8V power

 

touch panel (TP0)

VOHmin=1.35V

domain. Active low.

 

 

 

 

 

 

 

 

 

 

 

 

 

TP0_INT

139

DI

Interrupt signal of

VILmax=0.63V

1.8V power

 

touch panel (TP0)

VIHmin=1.17V

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

TP0_I2C_SCL

140

OD

I2C clock signal of

 

1.8V power

 

touch panel (TP0)

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TP0_I2C_SDA

206

OD

I2C data signal of

 

1.8V power

 

touch panel (TP0)

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LCM Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC Characteristics

Comment

 

No.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PWM

152

DO

PWM Output

 

 

 

LCD0_RST

127

DO LCD0 reset signal

VOLmax=0.45V

VOHmin=1.35V

 

 

 

1.8V power domain It should not be pulled up.

LCD0_TE

126

DI

LCD0 tearing

VILmax=0.63V

1.8V power

effect signal

VIHmin=1.17V

domain.

 

 

 

 

 

 

 

 

 

DSI0_CLK_N

116

AO

LCD0 MIPI clock

 

 

signal (negative)

 

85Ω differential

 

 

 

 

 

 

 

 

impedance.

DSI0_CLK_P

115

AO

LCD0 MIPI clock signal

(positive)

 

 

 

 

 

 

 

 

 

 

 

 

DSI0_LN0_N

118

AO

LCD0 MIPI lane 0 data

 

signal (negative)

 

85Ω differential

 

 

 

 

 

 

 

 

impedance.

DSI0_LN0_P

117

AO

LCD0 MIPI lane 0 data

signal (positive)

 

 

 

 

 

 

 

 

 

 

 

 

DSI0_LN1_N

120

AO

LCD0 MIPI lane 1 data

 

signal (negative)

 

85Ω differential

 

 

 

 

 

 

 

 

impedance.

DSI0_LN1_P

119

AO

LCD0 MIPI lane 1 data

signal (positive)

 

 

 

 

 

 

 

 

 

 

 

 

DSI0_LN2_N

122

AO

LCD0 MIPI lane 2 data

 

signal (negative)

 

85Ω differential

 

 

 

 

 

 

 

 

impedance.

DSI0_LN2_P

121

AO

LCD0 MIPI lane 2 data

signal (positive)

 

 

 

 

 

 

 

 

 

 

 

 

DSI0_LN3_N

124

AO

LCD0 MIPI lane 3 data

 

signal (negative)

 

85Ω differential

 

 

 

 

 

 

 

 

impedance.

DSI0_LN3_P

123

AO

LCD0 MIPI lane 3 data

signal (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

Camera Interfaces

SC66_Hardware_Design

35 / 118

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O Description

DC

 

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI1_CLK_N

89

AI

MIPI clock signal of rear

 

 

 

 

 

camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI1_CLK_P

88

AI

MIPI clock signal of rear

 

 

 

camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI1_LN0_N

91

AI

MIPI lane 0 data signal of

 

 

 

 

 

rear camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI1_LN0_P

90

AI

MIPI lane 0 data signal of

 

 

 

rear camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI1_LN1_N

93

AI

MIPI lane 1 data signal of

 

 

 

 

 

rear camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI1_LN1_P

92

AI

MIPI lane 1 data signal of

 

 

 

rear camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI1_LN2_N

95

AI

MIPI lane 2 data signal of

 

 

 

 

 

rear camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI1_LN2_P

94

AI

MIPI lane 2 data signal of

 

 

 

rear camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI1_LN3_N

97

AI

MIPI lane 3 data signal of

 

 

 

 

 

rear camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI1_LN3_P

96

AI

MIPI lane 3 data signal of

 

 

 

rear camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI2_CLK_N

184

AI

MIPI clock signal of depth

 

 

 

 

 

camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI2_CLK_P

183

AI

MIPI clock signal of depth

 

 

 

camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI2_LN0_N

186

AI

MIPI lane 0 data signal of

 

 

 

 

 

depth camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI2_LN0_P

185

AI

MIPI lane 0 data signal of

 

 

 

depth camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI2_LN1_N

188

AI

MIPI lane 1 data signal of

 

 

 

 

 

depth camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI2_LN1_P

187

AI

MIPI lane 1 data signal of

 

 

 

depth camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI2_LN2_N

190

AI

MIPI lane 2 data signal of

 

 

85Ω differential

 

depth camera (negative)

 

 

 

 

 

 

 

 

impedance.

 

 

 

 

 

 

 

 

CSI2_LN2_P

189

AI

MIPI lane 2 data signal of

 

 

 

 

 

 

 

 

depth camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI2_LN3_N

192

AI

MIPI lane 3 data signal of

 

 

85Ω differential

 

depth camera (negative)

 

 

 

 

 

 

 

 

impedance.

 

 

 

 

 

 

 

 

CSI2_LN3_P

191

AI

MIPI lane 3 data signal of

 

 

 

 

 

 

 

 

depth camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

 

 

 

 

36 / 118

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI0_CLK_N

78

AI

MIPI clock signal of front

 

 

 

 

 

camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI0_CLK_P

77

AI

MIPI clock signal of front

 

 

 

camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI0_LN0_N

80

AI

MIPI lane 0 data signal of

 

 

 

 

 

front camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI0_LN0_P

79

AI

MIPI lane 0 data signal of

 

 

 

front camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI0_LN1_N

82

AI

MIPI lane 1 data signal of

 

 

 

 

 

front camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI0_LN1_P

81

AI

MIPI lane 1 data signal of

 

 

 

front camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI0_LN2_N

84

AI

MIPI lane 2 data signal of

 

 

 

 

 

front camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI0_LN2_P

83

AI

MIPI lane 2 data signal of

 

 

 

front camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CSI0_LN3_N

86

AI

MIPI lane 3 data signal of

 

 

 

 

 

front camera (negative)

 

 

85Ω differential

 

 

 

 

 

 

 

 

 

 

 

 

 

impedance.

 

CSI0_LN3_P

85

AI

MIPI lane 3 data signal of

 

 

 

front camera (positive)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MCAM_MCLK

99

DO

Master clock signal of rear

 

 

1.8V power

 

camera

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCAM_MCLK

100

DO

Master clock signal of front

 

 

1.8V power

 

camera

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MCAM_RST

74

DO

Reset signal of rear

 

 

1.8V power

 

camera

 

 

domain.

 

 

 

 

VOLmax=0.45V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOHmin=1.35V

 

 

 

 

 

 

 

Power down signal of rear

 

1.8V power

 

MCAM_PWDN

73

DO

 

 

 

camera

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCAM_RST

72

DO

Reset signal of front

 

 

1.8V power

 

camera

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SCAM_PWDN

71

DO

Power down signal of front

 

 

1.8V power

 

camera

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAM_I2C_SCL0

75

OD

I2C clock signal of camera

 

 

1.8V power

 

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAM_I2C_SDA

76

OD

I2C data signal of camera

 

 

1.8V power

0

 

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DCAM_MCLK

194

DO

Master clock signal of

VOLmax=0.45V

 

1.8V power domain

 

depth camera

VOHmin=1.35V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

 

 

 

37 / 118

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DCAM_RST

180

DO

Reset signal of depth

 

1.8V power domain

 

camera

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DCAM_PWDN

181

DO

Power down signal of

 

1.8V power domain

 

depth camera

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAM_I2C_SDA

197

OD

I2C data signal of depth

 

1.8V power domain

1

camera

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAM_I2C_SCL1

196

OD

I2C data signal of depth

 

1.8V power

 

camera

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

Keypad Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PWRKEY

39

DI

Turn on/off the module

 

1.8V power domain

 

 

 

 

 

 

 

 

 

VOL_UP

146

DI

Volume up

 

The voltage follows

 

 

VBAT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOL_DWN

147

DI

Volume down

 

1.8V power domain

 

 

 

 

 

 

 

 

SENSOR_I2C Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SENSOR_I2C_

131

OD

I2C clock signal of

 

1.8V power

 

SCL

external sensors

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

SENSOR_I2C_

132

OD

I2C data signal of external

 

1.8V power

 

SDA

sensors

 

domain.

 

 

 

 

 

 

 

 

 

 

 

 

 

ADC Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADC0

151

AI

 

 

Max input

 

 

 

voltage:1.8V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADC1

153

AI

 

 

Max input

 

 

 

voltage:1.8V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Antenna Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ANT_MAIN

19

IO

Main antenna interface

 

50Ω impedance

 

 

 

 

 

 

 

 

SC66_Hardware_Design

38 / 118

Smart LTE Module Series

SC66 Hardware Design

ANT_DRX

149

AI

Diversity antenna interface

 

 

 

 

 

 

 

 

 

 

 

 

ANT_GNSS

134

AI

GNSS antenna interface

 

 

 

 

 

 

 

 

 

 

 

 

ANT_WIFI/BT

129

IO

Wi-Fi/BT antenna

 

 

 

 

interface

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ANT_WIFI_MIM

324

IO

Wi-Fi_MIMO antenna

 

SC66-CE SC66-W

O

interface

 

is not supported

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_20

113

 

IO

GPIO

 

Can be

used

as

 

 

LCD1_RST

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_21

231

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_34

236

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_40

238

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_41

237

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_42

137

 

IO

GPIO

 

Can be

used

as

 

 

TP1_INT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_43

136

 

IO

GPIO

 

Can be

used

as

 

 

TP1_RST

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_55

178

 

IO

GPIO

VILmax=0.63V

 

 

 

 

 

 

 

 

VIHmin=1.17V

 

 

 

GPIO_56

177

 

IO

GPIO

 

 

 

 

VOLmax=0.45V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOLmin=1.35V

 

 

 

GPIO_72

239

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_73

59

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_74

58

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_76

232

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_77

240

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

ACCL_INT

252

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

GYRO_INT

255

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

MAG_INT

254

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

ALPS_INT

253

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

39 / 118

Smart LTE Module Series

SC66 Hardware Design

HALL_INT

218

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_22

204

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_23

205

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_12

228

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_13

227

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_14

230

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_15

229

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_61

234

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_03B

11

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_08B

13

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_04B

14

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_05B

15

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_11A

211

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GPIO_13A

233

 

 

IO

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

GRFC Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin No.

 

I/O

Description

DC

Comment

 

 

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GRFC_19

242

 

 

IO

GPIO

 

Only for RF debug.

 

 

 

 

 

 

 

It should

not be

GRFC_18

241

 

 

IO

GPIO

 

 

 

 

pulled up.

 

 

 

 

 

 

 

 

 

 

SPI Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SPI_CS

201

 

DO

Chip selection signal

 

 

 

 

 

 

 

 

 

 

 

SPI_CLK

200

 

DO

Clock signal

 

Only

support

 

 

 

 

 

 

 

 

 

 

 

 

 

 

master mode

SPI_MOSI

248

 

DO

Data output signal

 

 

 

 

 

 

 

 

 

 

 

 

 

SPI_MISO

247

 

DI

Data input signal

 

 

 

 

 

 

 

 

 

 

 

 

I2S Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SC66_Hardware_Design

40 / 118

 

 

 

 

 

 

Smart LTE Module Series

 

 

 

 

 

 

SC66 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MI2S_2_WS

203

DO

I2S Word selection signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MI2S_2_DATA0

249

IO

I2S DATA0 signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MI2S_2_SCK

250

DO

I2S Serial clock signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MI2S_2_DATA1

251

IO

I2S DATA1 signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MI2S_2_MCLK

114

DO

I2S Main clock signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LPI_MI2S_SCLK

212

DO

LPI_I2S serial clock signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LPI_MI2S_WS

156

DO

LPI_I2S word selection

 

 

 

 

 

signal

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LPI_MI2S_DATA

154

IO

LPI_I2S DATA0 signal

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LPI_MI2S_DATA

155

IO

LPI_I2S DATA1 signal

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Emergency Download Interface

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pulled up to

 

 

 

 

 

 

 

LDO13A_1P8

 

 

 

 

 

Force the module to enter

 

during power-up

 

 

USB_BOOT

57

DI

into emergency download

 

will force the

 

 

 

 

 

mode

 

module to enter

 

 

 

 

 

 

 

into emergency

 

 

 

 

 

 

 

download mode.

 

 

 

 

 

 

 

 

 

 

 

Other Interfaces

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Name

Pin

I/O

Description

DC

Comment

 

 

No.

Characteristics

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GNSS_PPS_OU

202

DO

LNA enable control

 

LNA enable control

 

 

T

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

If customers

 

 

 

 

 

 

 

require automatic

 

 

CBL_PWR_N

22

DI

Used for configuring auto

 

power-on, this pin

 

 

power-on

 

should be

 

 

 

 

 

 

shorted-to-ground

.

Reserved Interface

SC66_Hardware_Design

41 / 118

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