Quectel Wireless Solutions 201901EM12G User Manual

EM12-G Hardware Design

LTE-A Module Series

Rev. EM12_Hardware_Design_

Date: 2018-09-28

Status: Preliminary

www.quectel.com

LTE-A Module Series

EM12-G Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: [phone]

Email: [e-mail]

Or our local office. For more information, please visit:

http://quectel.com/support/sales.htm

For technical support, or to report documentation errors, please visit: http://quectel.com/support/technical.htm

Or email to: [e-mail]

GENERAL NOTES

QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.

COPYRIGHT

THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.

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About the Document

History

	Revision			Date		Author			Description
	Draft		2018-09-28			Oscar LIU/			Initial
						Reed Wang

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Contents

About the Document...................................................................................................................................			2
Contents .......................................................................................................................................................			3
Table Index...................................................................................................................................................			5
Figure Index .................................................................................................................................................			6
1	Introduction ..........................................................................................................................................		7
	1.1.	Safety Information .....................................................................................................................	10
2	Product Concept ................................................................................................................................		11
	2.1.	General Description ..................................................................................................................	11
	2.2.	Key Features.............................................................................................................................	13
	2.3.	Functional Diagram ...................................................................................................................	15
	2.4.	Evaluation Board.......................................................................................................................	15
3	Application Interfaces .......................................................................................................................		16
	3.1.	Pin Assignment .........................................................................................................................	17
	3.2.	Pin Description ..........................................................................................................................	18
	3.3.	Power Supply ............................................................................................................................	22
		3.3.1. Decrease Voltage Drop ..................................................................................................	22
		3.3.2. Reference Design for Power Supply..............................................................................	23
	3.4. Turn on and off Scenarios.........................................................................................................		24
		3.4.1. Turn on the Module ........................................................................................................	24

3.4.1.1.Turn on the Module Through GPIO Controlled FULL_CARD_POWER_OFF# . 25

	3.4.1.2. Turn on the Module Automatically.......................................................................		25
3.4.2. Turn off the Module ........................................................................................................			26
	3.4.2.1. Turn off the Module Through FULL_CARD_POWER_OFF# .............................		26
	3.4.2.2. Turn off the Module via AT Command.................................................................		27
3.5.	Reset the Module ......................................................................................................................		27
3.6.	(U)SIM Interfaces ......................................................................................................................		28
3.7.	USB Interface............................................................................................................................		32
3.8.	PCIE Interface...........................................................................................................................		34
3.9.	PCM and I2C Interfaces............................................................................................................		34
3.10.	Control and Indicator Signals....................................................................................................		36
3.10.1.		W_DISABLE1# Signal....................................................................................................	37
3.10.2.		WWAN_LED# Signal .....................................................................................................	38
3.10.3.		WAKE_ON_WAN# Signal ..............................................................................................	38
3.10.4.		DPR Signal.....................................................................................................................	39
3.11.	Tunable Antenna Control Interface*..........................................................................................		40
3.12.	Configuration Pins.....................................................................................................................		40
4 GNSS Receiver...................................................................................................................................			42
4.1.	General Description ..................................................................................................................		42
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5	Antenna Interfaces.............................................................................................................................			43
	5.1.	Main/Rx-diversity Antenna Interfaces .......................................................................................		43
		5.1.1.	Operating Frequency .....................................................................................................	44
	5.2.	GNSS Antenna Interface...........................................................................................................		45
	5.3.	Antenna Installation ..................................................................................................................		46
		5.3.1.	Antenna Requirements ..................................................................................................	46
		5.3.2. Recommended RF Connector for Antenna Installation .................................................		46
6 Electrical, Reliability and Radio Characteristics ............................................................................				50
	6.1.	Absolute Maximum Ratings ......................................................................................................		50
	6.2.	Power Supply Requirements ....................................................................................................		50
	6.3.	I/O Requirements ......................................................................................................................		51
	6.4. Operation and Storage Temperatures ......................................................................................			51
	6.5.	Current Consumption(TBD) ......................................................................................................		52
	6.6.	RF Output Power ......................................................................................................................		52
	6.7.	RF Receiving Sensitivity ...........................................................................................................		52
	6.8.	ESD Characteristics..................................................................................................................		54
	6.9.	Thermal Dissipation ..................................................................................................................		54
7 Mechanical Dimensions and Packaging .........................................................................................				56
	7.1. Mechanical Dimensions of the Module .....................................................................................			56
	7.2. Standard Dimensions of M.2 PCI Express ...............................................................................			57
	7.3. Design Effect Drawings of the Module......................................................................................			58
	7.4.	M.2 Connector...........................................................................................................................		58
	7.5.	Barcode Rule ............................................................................................................................		58
	7.6.	Packaging .................................................................................................................................		59
8	Appendix References ........................................................................................................................			61
1

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Table Index
TABLE 1: FREQUENCY BANDS AND GNSS TYPE OF EM12 MODULE ........................................................	11
TABLE 2: KEY FEATURES OF EM12 ...............................................................................................................	13
TABLE 3: DEFINITION OF I/O PARAMETERS.................................................................................................	18
TABLE 4: PIN DESCRIPTION ...........................................................................................................................	18
TABLE 5: DEFINITION OF VCC AND GND PINS.............................................................................................	22
TABLE 6: DEFINITION OF FULL_CARD_POWER_OFF# PIN ........................................................................	24
TABLE 7: RESET# PIN DEFINITION ................................................................................................................	27
TABLE 8: PIN DEFINITION OF (U)SIM INTERFACES .....................................................................................	29
TABLE 9: PIN DEFINITION OF USB INTERFACE ...........................................................................................	32
TABLE 10: PIN DEFINITION OF PCM AND I2C INTERFACES .......................................................................	35
TABLE 11: LIST OF CONTROL AND INDICATOR SIGNALS ...........................................................................	37
TABLE 12: RF FUNCTION STATUS .................................................................................................................	37
TABLE 13: NETWORK STATUS INDICATIONS OF WWAN_LED# SIGNAL ...................................................	38
TABLE 14: STATE OF THE WAKE_ON_WAN# SIGNAL..................................................................................	38
TABLE 15: FUNCTION OF THE DPR SIGNAL.................................................................................................	39
TABLE 16: PIN DEFINITION OF TUNABLE ANTENNA CONTROL INTERFACE* ..........................................	40
TABLE 17: PIN DEFINITION OF CONFIGURATION PINS ..............................................................................	40
TABLE 18: LIST OF CONFIGURATION PINS ..................................................................................................	41
TABLE 19: EM12 OPERATING FREQUENCIES ..............................................................................................	44
TABLE 20: GNSS FREQUENCY.......................................................................................................................	45
TABLE 21: ANTENNA REQUIREMENTS..........................................................................................................	46
TABLE 22: MAJOR SPECIFICATIONS OF THE RF CONNECTOR.................................................................	47
TABLE 23: ABSOLUTE MAXIMUM RATINGS ..................................................................................................	50
TABLE 24: POWER SUPPLY REQUIREMENTS..............................................................................................	50
TABLE 25: I/O REQUIREMENTS......................................................................................................................	51
TABLE 26: OPERATION AND STORAGE TEMPERATURES ..........................................................................	51
TABLE 27: RF OUTPUT POWER .....................................................................................................................	52
TABLE 28: EM12 CONDUCTED RF RECEIVING SENSITIVITY .....................................................................	52
TABLE 29: ELECTROSTATIC DISCHARGE CHARACTERISTICS (TEMPERATURE: 25ºC, HUMIDITY: 40%)
...................................................................................................................................................................	54
TABLE 30: RELATED DOCUMENTS ................................................................................................................	61
TABLE 31: TERMS AND ABBREVIATIONS ......................................................................................................	61

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ...............................................................................................................	15
FIGURE 2: PIN ASSIGNMENT .........................................................................................................................	17
FIGURE 3: POWER SUPPLY LIMITS DURING RADIO TRANSMISSION.......................................................	23
FIGURE 4: REFERENCE CIRCUIT OF VCC....................................................................................................	23
FIGURE 5: REFERENCE DESIGN OF POWER SUPPLY ...............................................................................	24
FIGURE 6: TURN ON THE MODULE THROUGH GPIO CONTROLLED FULL_CARD_POWER_OFF# .......	25
FIGURE 7: TURN ON THE MODULE AUTOMATICALLY.................................................................................	25
FIGURE 8: TIMING OF TURNING ON MODULE .............................................................................................	26
FIGURE 9: TIMING OF TURNING OFF THE MODULE THROUGH FULL_CARD_POWER_OFF#...............	26
FIGURE 10: REFERENCE CIRCUIT OF RESET# BY USING DRIVING CIRCUIT .........................................	27
FIGURE 11: REFERENCE CIRCUIT OF RESET# BY USING BUTTON .........................................................	28
FIGURE 12: TIMING OF RESETTING MODULE .............................................................................................	28
FIGURE 13: REFERENCE CIRCUIT OF NORMALLY SHORT-CIRCUITED (U)SIM CARD CONNECTOR ...	30
FIGURE 14: REFERENCE CIRCUIT OF NORMALLY OPEN (U)SIM CARD CONNECTOR ..........................	30
FIGURE 15: REFERENCE CIRCUIT OF A 6-PIN (U)SIM CARD CONNECTOR .............................................	31
FIGURE 16: REFERENCE CIRCUIT OF USB 2.0 & 3.0 INTERFACE .............................................................	33
FIGURE 17: PRIMARY MODE TIMING ............................................................................................................	35
FIGURE 18: AUXILIARY MODE TIMING ..........................................................................................................	35
FIGURE 19: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ....................................	36
FIGURE 20: WWAN_LED# SIGNAL REFERENCE CIRCUIT DIAGRAM ........................................................	38
FIGURE 21: WAKE_ON_WAN# BEHAVIOR ....................................................................................................	39
FIGURE 22: WAKE_ON_WAN# SIGNAL REFERENCE CIRCUIT DESIGN ....................................................	39
FIGURE 23: ANTENNA INTERFACES ON THE MODULE ..............................................................................	43
FIGURE 24: EM12 RF CONNECTOR DIMENSIONS (UNIT: MM) ...................................................................	47
FIGURE 25: SPECIFICATIONS OF MATING PLUGS USING Ø0.81MM COAXIAL CABLES .........................	48
FIGURE 26: CONNECTION BETWEEN RF CONNECTOR AND MATING PLUG USING Ø0.81MM COAXIAL
CABLE .......................................................................................................................................................	48
FIGURE 27: CONNECTION BETWEEN RF CONNECTOR AND MATING PLUG USING Ø1.13MM COAXIAL
CABLE .......................................................................................................................................................	49
FIGURE 28: THERMAL DISSIPATION AREA ON BOTTOM SIDE OF MODULE (TOP VIEW) .......................	55
FIGURE 29: MECHANICAL DIMENSIONS OF EM12 (UNIT: MM)...................................................................	56
FIGURE 30: STANDARD DIMENSIONS OF M.2 TYPE 3042-S3 (UNIT: MM) .................................................	57
FIGURE 31: M.2 NOMENCLATURE .................................................................................................................	57
FIGURE 32: TOP VIEW OF THE MODULE ......................................................................................................	58
FIGURE 33: TRAY SIZE ....................................................................................................................................	59
FIGURE 34: TRAY PACKAGING PROCEDURE ..............................................................................................	60

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1 Introduction

This document defines EM12 module and describes its air interface and hardware interfaces which are connected with customers’ applications.

This document can help customers to quickly understand the interface specifications, electrical and mechanical details, as well as other related information of EM12 module. To facilitate its application in different fields, reference design is also provided for customers’ reference. Associated with application note and user guide, customers can use the module to design and set up mobile applications easily.

.

The device could be used with a separation distance of 20cm to the human body.

Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [EM12-G] is in compliance with Directive 2014/53/EU.

The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com

FCC Regulations:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.

This device has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiated radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is

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encouraged to try to correct the interference by one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

Caution: Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment.

RF Exposure Information

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation.

ISED Notice

This device complies with Innovation, Science and Economic Development Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

(1)this device may not cause interference, and

(2)this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:

(1)l'appareil ne doit pas produire de brouillage, et

(2)l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en

This device complies with the Canadian ICES-003 Class B specifications.

CAN ICES-3(B)/ NMB-3(B)

ISED Radiation Exposure Statement

This device complies with RSS-102 radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the ISED radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation.

Cet appareil est conforme aux limites d'exposition aux rayonnements de la CNR-102 définies pour un environnement non contrôlé. Afin d'éviter la possibilité de dépasser les limites d'exposition aux

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fréquences radio de la CNR-102, la proximité humaine à l'antenne ne doit pas être inférieure à20 cm (8 pouces) pendant le fonctionnement normal.

IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied.

Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment.

USERS MANUAL OF THE END PRODUCT:

In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following " Contains Transmitter Module FCC ID: XMR201901EM12G ". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules.

Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the words “Contains transmitter module IC: 10224A-201901EM12G”

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1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EM12-G module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. Please comply with laws and regulations restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. If the device offers an Airplane Mode, then it should be enabled prior to boarding an aircraft. Please consult the airline staff for more restrictions on the use of wireless devices on boarding the aircraft.

Wireless devices may cause interference on sensitive medical equipment, so please be aware of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare facilities.

Cellular terminals or mobiles operating over radio signals and cellular network cannot be guaranteed to connect in all possible conditions (for example, with unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such conditions, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on in a service area with adequate cellular signal strength.

The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency signals. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description

EM12-G is a LTE/UMTS/HSPA+ wireless communication module with receive diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks with standard PCI Express M.2 interface.

EM12-G supports embedded operating systems such as Windows CE, Linux and Android, and also provides GNSS1) and voice functionality2) to meet customers’ specific application demands.

The following table shows the frequency bands and GNSS type of EM12-G module.

Table 1: Frequency Bands and GNSS Type of EM12-G Module

Mode		EM12-G
LTE-FDD		B1/B2/B3/B4/B5/B7/B8/B9/B12/B13/B14/B17/B18/B19/B20/B21		3)
				/B25/B26/
(with Rx-diversity)		B28/B29/B30/B32/B66;
LTE-TDD		B38/39/B40/B41
(with Rx-diversity)
		B1+3,5,18,19,20,26;
		B2+2,4,5,12,13,17,29,30,66;
		B3+3,5,7,8,19,20,28;
		B4+4(CA_4C only),5,12,13,17,29,30;
		B5+7,25,30,66;
		B7+7,20,28;
		B12+25,30;
DL 2×CA		B13+66;
		B19+21	3)
			;
		B20+B32;
		B25+25,26,41
		B29+30;

B38+38;

B39+39 (CA_39C only);

B39+39; B39+41

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B40+40 (CA_40C only); B41+41;

B66+66 (CA_66C only);12,29,30,5; B2+B14;B14+B30;B14+B66;

(Note: B29, B32 is only for secondary component carrier)

		DL inter-band 3CA:
		1+3+7, 1+3+19, 1+3+20, 1+3+5, 1+3+8, 1+3+28,1+7+20,1+3+5,
		2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30 ,
		3+7+20, 3+7+28 , 3+7+8,
		4+5+30, 4+12+30, 4+29+30 ,
		5+66+2, 13+66+2,
		66+12+30,66+29+30,66+5+30;
		B2+B14+B66;
		DL 2 intra-band plus inter-band 3CA:
	DL 3×CA	2+2+5, 2+2+13 ,
		3+3+7, 3+7+7, 3+3+20 , 3+3+28,3+3+1,
		4+4+5, 4+4+13,
		7+7+28,
		5+66+66, 13+66+66, 66+66+2,
		B39+B39+B41; B39+B41+B41;
		B14+B66+B66
		B25+B25+B26, B25+B41+B41
		DL 3 intra-band 3CA:
		40+40+40, 41+41+41, 66+66+66
	UL CA	B3C;B7C;B38C;B40C;B41C;
	WCDMA	B1/B2/B3/B4/B5/B8/B9/B19
	(with Rx-diversity)
	GNSS 1)	GPS, GLONASS, BeiDou, Galileo

NOTES

1. 1) GNSS function is optional.

2. 2) EM12-G contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function.

3. 3)B21 band follow up will be developed

EM12-G can be applied in the following fields:

Rugged Tablet PC and Laptop Computer

Remote Monitor System

Vehicle System

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Wireless POS System

Smart Metering System

Wireless Router and Switch

Other Wireless Terminal Devices

2.2. Key Features

The following table describes the detailed features of EM12-G.

Table 2: Key Features of EM12-G

Feature		Details
Function Interface		PCI Express M.2 Interface
Power Supply		Supply voltage: 3.135V~4.4V
		Typical supply voltage: 3.7V
		Class 3 (23dBm±2dB) for LTE-FDD bands
Transmitting Power		Class 3 (23dBm±2dB) for LTE-TDD bands
		Class 3 (24dBm+1/-3dB) for WCDMA
		Support up to LTE Cat 12
		Support 1.4MHz to 20MHz RF bandwidth
LTE Features		Support MIMO in DL direction
		 FDD: Max 600Mbps (DL)/150Mbps (UL)
		 TDD: Max 408Mbps (DL)/90Mbps (UL)
		Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
		Support QPSK, 16-QAM and 64-QAM modulation
UMTS Features		 DC-HSDPA: Max 42Mbps (DL)
		 HSUPA: Max 5.76Mbps (UL)
		 WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
		Support PPP/QMI/NTP*/TCP*/UDP*/FTP*/HTTP*/PING*/HTTPS*/SMTP*
		/MMS*/FTPS*/SMTPS*/SSL* protocols
Internet Protocol Features		Support the protocols PAP (Password Authentication Protocol) and CHAP
		(Challenge Handshake Authentication Protocol) usually used for PPP
		connections
		Text and PDU mode
SMS		Point to point MO and MT
		SMS cell broadcast
		SMS storage: ME by default
		Support (U)SIM card: 1.8V, 3.0V
(U)SIM Interfaces		Include USIM1 and USIM2 interfaces
		Support Dual SIM Single Standby*

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		Support one digital audio interface: PCM interface
	Audio Feature	WCDMA: AMR/AMR-WB
		LTE: AMR/AMR-WB
		Support echo cancellation and noise suppression
		Used for audio function with external codec
		Support 16-bit linear data format
	PCM Interface	Support long frame synchronization and short frame synchronization
		Support master and slave modes, but must be the master in long frame
		synchronization
		Compliant with USB 3.0 and 2.0 specifications, with maximum transmission
		rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0.
		Used for AT command communication, data transmission, firmware
	USB Interface	upgrade, software debugging, GNSS NMEA sentence output and voice
		over USB*
		Support USB serial drivers for: Windows 7/8/8.1/10, Windows CE
		5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x
	PCIE Interface*	Support PCIE interface, under development
	Antenna Interface	Include main antenna, diversity antenna and GNSS antenna interfaces
	Rx-diversity	Support LTE/WCDMA Rx-diversity
	GNSS Features	Gen 9HT Lite of Qualcomm
		Protocol: NMEA 0183
	AT Commands	Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
		commands
	Physical Characteristics	Size: (42.0±0.15)mm × (30.0±0.15)mm × (2.3±0.1)mm
		Weight: TBD
		Operation temperature range: -30°C~ +70°C 1)
	Temperature Range	Extended temperature range: -40°C~ +85°C 2)
		Storage temperature range: -40°C ~ +90°C
	Firmware Upgrade	USB 2.0 interface and DFOTA*
	RoHS	All hardware components are fully compliant with EU RoHS directive

NOTES

1. 1) Within operation temperature range, the module is 3GPP compliant.

2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature

returns to normal operating temperature levels, the module will meet 3GPP specifications again.

3.“*” means under development.

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2.3. Functional Diagram

The following figure shows a block diagram of EM12-G.

	VCC
FULL_CARD_POWER_OFF#
	RESET#	PMIC			ET
Interface
	USB2.0&USB3.0	38.4MHz	Control		Tx
		XO
M.2ExpressKey-B	(U)SIM1&(U)SIM2				PRx
	W_DISABLE1#		QLINK	Transceiver	BlocksTx/Rx
	WWAN_LED#
	WAKE_ON_WAN#	Baseband
	PCM
	GPIOs		Control
	W_DISABLE2#
PCI	PCIE*				DRx
		NAND +
		DDR2 SDRAM

Figure 1: Functional Diagram

ANT_MAIN

ANT_GNSS

ANT_DIV

2.4. Evaluation Board

In order to help customers develop applications conveniently with EM12-G, Quectel supplies the evaluation board (M.2 EVB), USB to RS-232 converter cable, USB type-C cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [1].

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3 Application Interfaces

The physical connections and signal levels of EM12-G comply with PCI Express M.2 specifications. This chapter mainly describes the definition and application of the following interfaces/signals/pins of EM12-G:

Power supply

(U)SIM interfaces

USB interface

PCIE interface*

PCM and I2C interfaces

Control and indicator signals

Tunable antenna control interface*

Configuration pins

NOTE

“*” means under development.

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3.1. Pin Assignment

The following figure shows the pin assignment of EM12-G. The top side contains EM12-G module and antenna connectors.

N o .	P in N a m e
7 4	V C C
7 2	V C C
7 0	V C C
6 8	N C
6 6	U S IM 1 _ D E T
6 4	R E S E R V E D
6 2	R E S E R V E D
6 0	R E S E R V E D
5 8	I2 C _ S C L
5 6	I2 C _ S D A
5 4	N C
5 2	N C
5 0	N C
4 8	U S IM 2 _ V D D
4 6	U S IM 2 _ R E S E T
4 4	U S IM 2 _ C L K
4 2	U S IM 2 _ D A T A
4 0	U S IM 2 _ D E T
3 8	N C
3 6	U S IM 1 _ V D D
3 4	U S IM 1 _ D A T A
3 2	U S IM 1 _ C L K
3 0	U S IM 1 _ R E S E T
2 8	P C M _ S Y N C
2 6	W _ D IS A B L E 2 #
2 4	P C M _ O U T
2 2	P C M _ IN
2 0	P C M _ C L K
	N o tc h
	N o tc h
	N o tc h
	N o tc h
1 0	W W A N _ L E D #
8	W _ D IS A B L E 1 #
6	F U L L _ C A R D _ P O W E R _ O F F #
4	V C C
2	V C C

PIN75

PIN74

BOT

TOP

PIN11

PIN10

PIN2	PIN1

P in N a m e	N o .
C O N F IG _ 2	7 5
G N D	7 3
G N D	7 1
C O N F IG _ 1	6 9
R E S E T #	6 7
A N T C T L 3	6 5
A N T C T L 2	6 3
A N T C T L 1	6 1
A N T C T L 0	5 9
G N D	5 7
P C IE _ R E F C L K +	5 5
P C IE _ R E F C L K -	5 3
G N D	5 1
P C IE _ R X +	4 9
P C IE _ R X -	4 7
G N D	4 5
P C IE _ T X +	4 3
P C IE _ T X -	4 1
G N D	3 9
U S B 3 .0 _ R X +	3 7
U S B 3 .0 _ R X -	3 5
G N D	3 3
U S B 3 .0 _ T X +	3 1
U S B 3 .0 _ T X -	2 9
G N D	2 7
D P R	2 5
W A K E _ O N _ W A N #	2 3
C O N F IG _ 0	2 1
N o tc h
N o tc h
N o tc h
N o tc h
G N D	1 1
U S B _ D M	9
U S B _ D P	7
G N D	5
G N D	3
C O N F IG _ 3	1

Figure 2: Pin Assignment

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3.2. Pin Description

The following tables show the pin definition and description of EM12-G on the 75-pin application.

Table 3: Definition of I/O Parameters

Type	Description
IO	Bidirectional
DI	Digital input
DO	Digital output
OD	Open drain
PI	Power input
PO	Power output

Table 4: Pin Description

Pin

M.2 Socket 2

EM12-G

WWAN Module

I/O

Description

Comment

No.

Pin Name

Pinout

Not connected internally.

1

CONFIG_3

CONFIG_3

EM12-G is configured as

WWAN-USB 3.0.

Vmin=3.135V

2

3.3V

VCC

PI

Power supply

Vnorm=3.7V

Vmax=4.4V

3

GND

GND

Ground

Vmin=3.135V

4

3.3V

VCC

PI

Power supply

Vnorm=3.7V

Vmax=4.4V

5

GND

GND

Ground

A signal to control power-on/-off

FULL_CARD_

FULL_CARD_

of the module. When it is at low

Pulled down

6

DI

level, the module powers off.

POWER_OFF#

POWER_OFF#

internally

When it is at high level,

the

module powers on.

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