EC25Hard ware es ig n
LTE Module Series
Rev. EC25_H ardware_ Design_V1.3
Date: 2017-01-24
www.quectel.com
LTE Module Series
EC25Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Email:info@quectel.com
Or our local office.For more information, please visit:
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GENERAL NOTES
QUECTEL OFFERS THEINFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. THE INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.
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About the Document
History
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Description |
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1.0 |
2016-04-01 |
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Woody WU |
Initial |
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1. |
Updated EC25 series frequency bands in Table 1. |
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2. |
Updated transmitting power, supported maximum |
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baud rate of main UART/internal protocols/USB |
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drivers of USB interface, firmware upgrade and |
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temperature range in Table 2. |
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3. |
Updated timing of turning on module in Figure 12. |
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4. |
Updated timing of turning off module in Figure 13. |
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1.1 |
2016-09-22 |
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Lyndon LIU/ |
5. |
Updated timing of resetting module in Figure 16. |
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Frank WANG |
6. |
Updated supported baud rates of main UART in |
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Chapter 3.11. |
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7. |
Added notes for ADC interface in Chapter 3.13. |
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8. |
Updated GNSS performance in Table 21. |
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9. |
Updated operating frequencies of module in Table 23. |
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10. |
Added current consumption in Chapter 6.4. |
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11. |
Updated RF output power in Chapter 6.5. |
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12. |
Added RF receiving sensitivity in Chapter 6.6. |
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1. |
Added SGMII and WLAN interfaces in Table 2. |
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2. |
Updated function diagram in Figure 1. |
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3. |
Updated pin assignment (Top View) in Figure 2. |
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4. |
Added description of SGMII and WLAN interfaces in |
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1.2 |
2016-11-04 |
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Lyndon LIU/ |
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Table 4. |
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Michael ZHANG |
5. |
Added SGMII interface in Chapter 3.17. |
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6. |
Added WLAN interface in Chapter 3.18. |
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7. |
Added USB_BOOT interface in Chapter 3.19. |
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8. |
Added reference design of RF layout in Chapter 5.1.4. |
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9. |
Added note about SIMO in Chapter 6.6. |
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1.3 |
2017-01-24 |
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Lyndon LIU/ |
1. |
Updated function diagram in Figure 1. |
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Frank WANG |
2. |
Updated pin assignment (top view) in Figure 2. |
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3.Added BT interface in Chapter 3.18.2.
4.Updated GNSS performance in Table 24.
5.Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29.
6.Updated current consumption of EC25-E module in Table 33.
7.Updated EC25-A conducted RF receiving sensitivity in Table 38.
8.AddedEC25-J conducted RF receiving sensitivity in Table 40.
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Contents
About the Document ................................................................................................................................ |
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2 |
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Contents |
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4 |
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Table Index ............................................................................................................................................... |
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6 |
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Figure Index.............................................................................................................................................. |
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1 |
Introduction ..................................................................................................................................... |
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10 |
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1.1. .................................................................................................................. |
Safety Information |
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11 |
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2 |
Product .............................................................................................................................Concept |
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12 |
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2.1. .............................................................................................................. |
General Description |
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12 |
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2.2. ......................................................................................................................... |
Key Features |
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13 |
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2.3. ............................................................................................................... |
Functional Diagram |
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15 |
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2.4. ................................................................................................................... |
Evaluation Board |
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16 |
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3 |
Application .......................................................................................................................Interface |
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17 |
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3.1. .............................................................................................................. |
General Description |
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17 |
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3.2. ..................................................................................................................... |
Pin Assignment |
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18 |
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3.3. ...................................................................................................................... |
Pin Description |
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19 |
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3.4. .................................................................................................................. |
Operating Modes |
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28 |
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3.5. ........................................................................................................................ |
Power Saving |
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28 |
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3.5.1. .................................................................................................................. |
Sleep Mode |
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28 |
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3.5.1.1. UART Application |
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28 |
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3.5.1.2. USB Application with USB Remote Wakeup Function |
29 |
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3.5.1.3. USB Application with USB Suspend/Resume and RI Function |
30 |
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3.5.1.4. USB Application without USB Suspend Function |
31 |
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3.5.2. .............................................................................................................. |
Airplane Mode |
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31 |
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3.6. ........................................................................................................................ |
Power Supply |
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32 |
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3.6.1. ....................................................................................................... |
Power Supply Pins |
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32 |
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3.6.2. ................................................................................................ |
Decrease Voltage Drop |
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33 |
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3.6.3. ............................................................................Reference Design for Power Supply |
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34 |
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3.6.4. ............................................................................................Monitor the Power Supply |
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34 |
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3.7. ..................................................................................................... |
Turn on and off Scenarios |
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34 |
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3.7.1. ...........................................................................Turn on Module Using the PWRKEY |
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34 |
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3.7.2. ............................................................................................................ |
Turn off Module |
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36 |
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3.7.2.1. Turn off Module Using the PWRKEY Pin |
36 |
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3.7.2.2. Turn off Module Using AT Command |
37 |
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3.8. .................................................................................................................. |
Reset the Module |
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37 |
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3.9. ............................................................................................................. |
USIM Card Interface |
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39 |
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3.10. ........................................................................................................................ |
USB Interface |
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41 |
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3.11. .................................................................................................................... |
UART Interfaces |
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43 |
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3.12. ........................................................................................................ |
PCM and I2C Interfaces |
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45 |
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3.13. ........................................................................................................................ |
ADC Function |
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47 |
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3.14. ..................................................................................................... |
Network Status Indication |
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48 |
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3.15. |
STATUS ................................................................................................................................ |
49 |
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3.16. |
Behavior of the RI ................................................................................................................. |
50 |
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3.17. |
SGMII Interface..................................................................................................................... |
51 |
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3.18. |
Wireless Connectivity Interfaces ........................................................................................... |
53 |
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3.18.1. |
WLAN Interface ........................................................................................................... |
55 |
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3.18.2. |
BT Interface*................................................................................................................ |
56 |
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3.19. |
USB_BOOT Interface............................................................................................................ |
56 |
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4 |
GNSS Receiver ................................................................................................................................ |
58 |
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4.1. |
General Description .............................................................................................................. |
58 |
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4.2. |
GNSS Performance .............................................................................................................. |
58 |
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4.3. |
Layout Guidelines ................................................................................................................. |
59 |
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5 |
Antenna Interfaces.......................................................................................................................... |
60 |
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5.1. |
Main/Rx-diversity Antenna Interface ..................................................................................... |
60 |
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5.1.1. |
Pin Definition................................................................................................................ |
60 |
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5.1.2. |
Operating Frequency ................................................................................................... |
60 |
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5.1.3. Reference Design of RF Antenna Interface ................................................................. |
61 |
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5.1.4. Reference Design of RF Layout................................................................................... |
62 |
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5.2. |
GNSS Antenna Interface....................................................................................................... |
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5.3. |
Antenna Installation .............................................................................................................. |
65 |
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5.3.1. |
Antenna Requirement.................................................................................................. |
65 |
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5.3.2. Recommended RF Connector for Antenna Installation................................................ |
66 |
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6 |
Electrical, Reliability and Radio Characteristics .......................................................................... |
68 |
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6.1. |
Absolute Maximum Ratings .................................................................................................. |
68 |
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6.2. |
Power Supply Ratings........................................................................................................... |
69 |
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6.3. |
Operating Temperature ......................................................................................................... |
69 |
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6.4. |
Current Consumption............................................................................................................ |
70 |
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6.5. |
RF Output Power .................................................................................................................. |
73 |
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6.6. |
RF Receiving Sensitivity ....................................................................................................... |
74 |
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6.7. |
Electrostatic Discharge ......................................................................................................... |
76 |
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7 |
Mechanical Dimensions.................................................................................................................. |
77 |
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7.1. |
Mechanical Dimensions of the Module.................................................................................. |
77 |
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7.2. |
Recommended Footprint....................................................................................................... |
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7.3. |
Design Effect Drawings of the Module .................................................................................. |
80 |
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8 |
Storage, Manufacturing and Packaging........................................................................................ |
81 |
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8.1. |
Storage ................................................................................................................................. |
81 |
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8.2. |
Manufacturing and Soldering ................................................................................................ |
82 |
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8.3. |
Packaging ............................................................................................................................. |
83 |
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9 |
Appendix A References.................................................................................................................. |
84 |
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Appendix B GPRS Coding Schemes ............................................................................................. |
88 |
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Appendix C GPRS Multi-slot Classes............................................................................................ |
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12 |
Appendix D EDGE Modulation and Coding Schemes.................................................................. |
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Table Index |
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TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE........................................................................ |
12 |
TABLE 2: KEY FEATURES OF EC25 MODULE............................................................................................... |
13 |
TABLE 3: I/O PARAMETERS DEFINITION....................................................................................................... |
19 |
TABLE 4: PIN DESCRIPTION........................................................................................................................... |
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TABLE 5: OVERVIEW OF OPERATING MODES............................................................................................. |
28 |
TABLE 6: VBAT AND GND PINS....................................................................................................................... |
32 |
TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... |
35 |
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... |
37 |
TABLE 9: PIN DEFINITION OF THE USIM CARD INTERFACE ...................................................................... |
39 |
TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... |
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TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE ..................................................................... |
43 |
TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE................................................................. |
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TABLE 13:LOGIC LEVELS OF DIGITAL I/O ..................................................................................................... |
44 |
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... |
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TABLE 15: PIN DEFINITION OF THE ADC ...................................................................................................... |
48 |
TABLE 16: CHARACTERISTIC OF THE ADC .................................................................................................. |
48 |
TABLE 17: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR...................... |
48 |
TABLE 18: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ........... |
49 |
TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ |
50 |
TABLE 20: BEHAVIOR OF THE RI ................................................................................................................... |
50 |
TABLE 21: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. |
51 |
TABLE 22: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES................................................ |
53 |
TABLE 23: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. |
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TABLE 24: GNSS PERFORMANCE ................................................................................................................. |
58 |
TABLE 25: PIN DEFINITION OF THE RF ANTENNA....................................................................................... |
60 |
TABLE 26: MODULE OPERATING FREQUENCIES........................................................................................ |
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TABLE 27: PIN DEFINITION OF GNSS ANTENNA INTERFACE..................................................................... |
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TABLE 28: GNSS FREQUENCY....................................................................................................................... |
64 |
TABLE 29: ANTENNA REQUIREMENTS.......................................................................................................... |
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TABLE 30: ABSOLUTE MAXIMUM RATINGS .................................................................................................. |
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TABLE 31: THE MODULE POWER SUPPLY RATINGS .................................................................................. |
69 |
TABLE 32: OPERATING TEMPERATURE........................................................................................................ |
69 |
TABLE 33: EC25-E CURRENT CONSUMPTION ............................................................................................. |
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TABLE 34: EC25-A CURRENT CONSUMPTION ............................................................................................. |
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TABLE 35: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE................................................. |
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TABLE 36: RF OUTPUT POWER ..................................................................................................................... |
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TABLE 37: EC25-E CONDUCTED RF RECEIVING SENSITIVITY.................................................................. |
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TABLE 38: EC25-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. |
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TABLE 39: EC25-V CONDUCTED RF RECEIVING SENSITIVITY.................................................................. |
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TABLE 40: EC25-J CONDUCTED RF RECEIVING SENSITIVITY................................................................... |
75 |
TABLE 41: ELECTROSTATICS DISCHARGE CHARACTERISTICS ............................................................... |
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TABLE 42: RELATED DOCUMENTS................................................................................................................ |
84 |
TABLE 43: TERMS AND ABBREVIATIONS...................................................................................................... |
84 |
TABLE 44: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. |
88 |
TABLE 45: GPRS MULTI-SLOT CLASSES ...................................................................................................... |
89 |
TABLE 46: EDGE MODULATION AND CODING SCHEMES........................................................................... |
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Figure Index |
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FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... |
16 |
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... |
18 |
FIGURE 3: SLEEP MODE APPLICATION VIA UART....................................................................................... |
29 |
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... |
30 |
FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... |
30 |
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ |
31 |
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION...................................................... |
33 |
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ |
33 |
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. |
34 |
FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................. |
35 |
FIGURE 11: TURN ON THE MODULE USING KEYSTROKE.......................................................................... |
35 |
FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... |
36 |
FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... |
37 |
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... |
38 |
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... |
38 |
FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. |
38 |
FIGURE 17: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH AN 8-PIN USIM CARD |
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CONNECTOR.................................................................................................................................................... |
40 |
FIGURE 18: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH A 6-PIN USIM CARD CONNECTOR |
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40 |
FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... |
42 |
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... |
44 |
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. |
45 |
FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ |
46 |
FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... |
46 |
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... |
47 |
FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR.......................................................... |
49 |
FIGURE 26: REFERENCE CIRCUITS OF STATUS......................................................................................... |
50 |
FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. |
52 |
FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION................. |
52 |
FIGURE 29: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE |
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55 |
FIGURE 30: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ |
57 |
FIGURE 31: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. |
61 |
FIGURE 32: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB...................................................................... |
62 |
FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB.................................................. |
62 |
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE |
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GROUND).......................................................................................................................................................... |
63 |
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE |
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GROUND).......................................................................................................................................................... |
63 |
FIGURE 36: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. |
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FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) |
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FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. |
66 |
FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... |
67 |
FIGURE 40: MODULE TOP AND SIDE DIMENSIONS..................................................................................... |
77 |
FIGURE 41: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. |
78 |
FIGURE 42: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. |
79 |
FIGURE 43: TOP VIEW OF THE MODULE...................................................................................................... |
80 |
FIGURE 44: BOTTOM VIEW OF THE MODULE.............................................................................................. |
80 |
FIGURE 45: REFLOW SOLDERING THERMAL PROFILE.............................................................................. |
82 |
FIGURE 46: TAPE AND REEL SPECIFICATIONS ........................................................................................... |
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LTE Module Series
EC25Hardware Design
1 Introduction
This document defines the EC25module and describes its air interface and hardware interface which are connected with your application.
This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC25 module. Associated with application note and user guide, you can use EC25 module to design and set up mobile applications easily.
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1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectelassumes no liability for the customer’s failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment.
Cellular terminals or mobiles operatingover radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid USIM/SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
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LTE Module Series
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2 Product Concept
2.1. General Description
EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive diversity, which provides data connectivity on LTE-FDD,LTE-TDD,DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA,EDGE andGPRSnetworks. It also provides GNSS1) and voice functionality2) for your specific application.EC25 contains fivevariants:EC25-E, EC25-A, EC25-V, EC25-Jand EC25-AU. You can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC25 series module.
Table 1: Frequency Bands of EC25 Series Module
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Modules2) |
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LTE Bands |
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3G Bands |
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GSM |
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Rx- |
GNSS1) |
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diversity |
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FDD:B1/B3/B5/B7/B8/ |
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WCDMA: |
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EC25-E |
B20 |
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900/1800 |
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B1/B5/B8 |
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TDD: B38/B40/B41 |
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EC25-A |
FDD: B2/B4/B12 |
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WCDMA: |
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Not supported |
Supported |
GPS, |
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B2/B4/B5 |
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GLONASS, |
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EC25-V |
FDD: B4/B13 |
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Not supported |
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Not supported |
Supported |
BeiDou/ |
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Compass, |
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FDD: B1/B3/B8/B18/B19/ |
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Galileo, |
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EC25-J |
B26 |
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B1/B6/B8/ |
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Not supported |
Supported |
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QZSS |
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TDD: B41 |
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B19 |
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FDD: B1/B2/B3/B4/B5/B7/ |
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WCDMA: |
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850/900/ |
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EC25-AU3) |
B8/B28 |
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B1/B2/B5/B8 |
1800/1900 |
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TDD: B40 |
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NOTES |
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1. |
1) GNSS function is optional. |
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2. |
2) EC25 |
series module (EC25-E/EC25-A/EC25-V/EC25-J/EC25-AU) |
includes Data-only and |
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Telematics versions. Data-only version does not support voice function, while Telematics version |
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supports it. |
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3. |
3) B2 band on EC25-AU module does not support Rx-diversity. |
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EC25_Hardware_DesignConfidential / Released |
12 / 90 |
|
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LTE Module Series
EC25Hardware Design
With a tiny profile of 32.0mm ×29.0mm ×2.4mm, EC25 can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.
EC25 is an SMD type module which can be embedded in applications through its 144-pin pads, including 80 LCC signal pads and 64 other pads.
2.2. Key Features
The following table describes the detailed features of EC25 module.
Table 2: Key Features of EC25 Module
Feature
Power Supply
Transmitting Power
LTE Features
WCDMA Features
GSMFeatures
Details
Supply voltage: 3.3V~4.3VTypical supply voltage: 3.8V
Class 4 (33dBm±2dB) for GSM900 Class 1 (30dBm±2dB) for DCS1800
Class E2 (27dBm±3dB) for GSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class 3 (23dBm+1/-3dB) for WCDMA bands Class 3 (23dBm+1/-3dB) for LTE-FDD band5 Class 3 (22.5dBm+1/-3dB) for LTE-FDD band7 Class 3 (23dBm+1/-3dB) for LTE-TDD bands Support up to non-CA CAT4
Support 1.4 to 20MHz RF bandwidth Support MIMO in DL direction
FDD: Max 50Mbps (UL), 150Mbps (DL) TDD: Max 35Mbps (UL), 130Mbps (DL) Support 3GPP R8 DC-HSPA+
Support 16-QAM, 64-QAM and QPSKmodulation 3GPP R6 CAT6 HSUPA: Max 5.76Mbps (UL) 3GPP R8 CAT24 DC-HSPA+: Max 42Mbps (DL)
R99:
CSD: 9.6kbps, 14.4kbps
GPRS:
Support GPRS multi-slot class 12 (12 by default) Coding scheme: CS-1, CS-2, CS-3 and CS-4 Maximum of four Rx time slots per frame
EDGE:
Support EDGE multi-slot class 12 (12 by default)
EC25_Hardware_DesignConfidential / Released |
13 / 90 |
LTE Module Series
EC25Hardware Design
Internet Protocol Features
SMS
Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9
SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/MMS*
/FTPS*/SMTPS*/SSL*protocols
Support the protocols PAP (Password Authentication Protocol) and CHAP (Challenge Handshake Authentication Protocol) usually used for PPP connections
Text and PDU mode Point to point MO and MT SMS cell broadcast
SMS storage: ME by default
USIM Interface |
Support USIM/SIM card: 1.8V, 3.0V |
|
Support one digital audio interface: PCM interface |
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GSM: HR/FR/EFR/AMR/AMR-WB |
Audio Features |
WCDMA: AMR/AMR-WB |
|
LTE: AMR/AMR-WB |
|
Support echo cancellation and noise suppression |
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Used for audio function with external codec |
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Support 8-bit A-law*, μ-law*and 16-bit linear data formats |
PCM Interface |
Support long frame synchronization and short frame synchronization |
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Support master and slave modes, but must be the master in long frame |
|
synchronization |
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Compliant with USB 2.0 specification (slave only);the data transfer rate can |
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reach up to 480Mbps |
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Used for AT command communication, data transmission, GNSS NMEA |
USB Interface |
output, software debugging, firmware upgrade and voiceover USB* |
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Support USB drivers for: Windows XP, Windows Vista, Windows 7, |
|
Windows 8/8.1, Windows 10, Linux 2.6 or later, Android |
|
4.0/4.2/4.4/5.0/5.1/6.0 |
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Main UART: |
|
Used for AT command communication and data transmission |
|
Baud rate reach up to 3000000bps, 115200bps by default |
UART Interface |
Support RTS and CTS hardware flow control |
|
Debug UART: |
|
Used for Linux console, log output |
|
115200bps baud rate |
SGMII Interface |
Support 10/100/1000Mbps Ethernet connectivity |
|
|
Wireless Connectivity |
Support a low-power SDIO 3.0 interface for WLAN and UART/PCM |
Interfaces |
interface for Bluetooth* |
EC25_Hardware_DesignConfidential / Released |
14 / 90 |
LTE Module Series
EC25Hardware Design
Rx-diversity
GNSS Features
AT Commands
Network Indication
Antenna Interface
Physical Characteristics
Temperature Range
Firmware Upgrade
RoHS
NOTES
Support LTE/WCDMA Rx-diversity
Gen8CLite of Qualcomm Protocol: NMEA 0183
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT commands
Two pins including NET_MODE and NET_STATUS to indicate network connectivity status
Including main antenna interface (ANT_MAIN), Rx-diversityantenna interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Size: 32.0±0.15×29.0±0.15×2.4±0.2mm Weight: approx. 4.9g
Operation temperature range: -35°C ~ +75°C1) Extended temperature range: -40°C ~ +85°C2)
USB interface and DFOTA*
All hardware components are fully compliant with EU RoHS directive
1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet 3GPP compliant again.
3.“*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EC25 and illustrates the major functional parts.
EC25_Hardware_DesignConfidential / Released |
15 / 90 |
LTE Module Series
EC25Hardware Design
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
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ANT_MAIN |
ANT_GNSS ANT_DIV |
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Switch |
SAW |
Switch |
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Duplex |
LNA |
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VBAT_RF |
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SAW |
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PA |
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APT |
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PRx |
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DRx |
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Tx |
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Transceiver |
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NAND |
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DDR2 |
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SDRAM |
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IQ |
Control |
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VBAT_BB |
PMIC |
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Control |
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PWRKEY |
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RESET_N |
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ADCs |
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STATUS |
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19.2M |
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XO |
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VDD_EXT |
USB USIM |
PCM SGMII WLAN |
I2C |
UART GPIOs |
BT |
Figure 1: Functional Diagram
2.4. Evaluation Board
In order to help youto develop applications with EC25, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module.
EC25_Hardware_DesignConfidential / Released |
16 / 90 |
LTE Module Series
EC25Hardware Design
3 Application Interface
3.1. General Description
EC25 is equipped with 80-pin SMT pads plus 64-pin ground pads and reserved pads that can beconnected to cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply
USIM interface
USB interface
UART interfaces
PCM interface
ADC interface
Status indication
SGMII interface
Wireless connectivityinterfaces
USB_BOOT interface
EC25_Hardware_DesignConfidential / Released |
17 / 90 |
LTE Module Series
EC25Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of EC25 module.
WAKEUP_IN1) |
1 |
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AP_READY |
2 |
129 |
117 |
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RESERVED |
3 |
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130 |
118 |
108 |
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W_DISABLE# |
4 |
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NET_MODE1) |
5 |
131 |
119 |
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NET_STATUS |
6 |
132 |
120 |
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VDD_EXT |
7 |
109 |
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RESERVED |
141 |
133 |
121 |
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RESERVED |
142 |
134 |
122 |
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GND |
8 |
110 |
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GND |
9 |
135 |
123 |
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USIM_GND |
10 |
136 |
124 |
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DBG_RXD |
11 |
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111 |
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DBG_TXD |
12 |
137 |
125 |
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USIM_PRESENCE |
13 |
138 |
126 |
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USIM_VDD |
14 |
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USIM_DATA |
15 |
139 |
127 |
112 |
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USIM_CLK |
16 |
140 |
128 |
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USIM_RST |
17 |
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RESERVED |
18 |
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GND |
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GND |
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GND |
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103 |
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99 |
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95 |
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90 |
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85 |
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GND |
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ANT_MAIN |
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96 |
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49 |
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RESERVED |
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RESERVED |
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82 |
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79 |
76 |
73 |
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143 |
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ANT_GNSS |
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77 |
74 |
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92 |
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47 |
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GND |
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81 |
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75 |
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46 |
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ADC0 |
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106 |
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97 |
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93 |
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88 |
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44 |
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43 |
RESERVED |
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I2C_SDA |
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I2C_SCL |
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107 |
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102 |
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98 |
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94 |
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89 |
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41 |
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BT_CTS |
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40 |
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BT_RXD |
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BT_TXD |
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BT_RTS |
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37 |
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GND Pins |
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Signal Pins |
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RESERVED Pins |
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SGMII Pins |
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WLAN Pins |
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Power Pins |
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Bluetooth Pins |
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Figure 2: Pin Assignment (Top View)
NOTES
1. 1)meansthat these pins cannot be pulled up before startup.
2. 2) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
3.Pads 119~126 are SGMII function pins.
4.Pads 37~40, 118, 127 and 129~139 are wireless connectivity interfaces, among which pads 127 and 129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT function is under development.
EC25_Hardware_DesignConfidential / Released |
18 / 90 |
LTE Module Series
EC25Hardware Design
5.Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20 module.
6.Keep all RESERVEDpins and unused pins unconnected.
7.GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should not be designed in schematic and PCB decal.
8.“ ”means these interface functions are only supported on Telematics version.
3.3. Pin Description
The following tables show the pin definition of EC25 modules.
Table 3: I/O Parameters Definition
Type |
Description |
|
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IO |
Bidirectional |
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DI |
Digital input |
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DO |
Digital output |
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PI |
Power input |
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PO |
Power output |
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AI |
Analog input |
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AO |
Analog output |
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OD |
Open drain |
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Table 4: Pin Description
Power Supply
Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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Power supply for |
Vmax=4.3V |
It must be able to |
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VBAT_BB |
59,60 |
PI |
module baseband |
Vmin=3.3V |
provide sufficient |
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part |
Vnorm=3.8V |
current up to 0.8A. |
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Power supply for |
Vmax=4.3V |
It must be able to |
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VBAT_RF |
57,58 |
PI |
Vmin=3.3V |
provide sufficient |
||
module RF part |
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Vnorm=3.8V |
current up to 1.8A in a |
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EC25_Hardware_DesignConfidential / Released |
19 / 90 |
|
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LTE Module Series |
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EC25Hardware Design |
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bursttransmission. |
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Provide 1.8V for |
Vnorm=1.8V |
Power supply for |
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VDD_EXT |
7 |
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PO |
external GPIO’s pull up |
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external circuit |
IOmax=50mA |
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circuits. |
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8,9,19,22,3 |
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GND |
6,46,48,50 |
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Ground |
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~54,56,72, |
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85~112 |
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Turn on/off |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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VIHmax=2.1V |
The output voltage is |
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Turnon/off the |
0.8V because of the |
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PWRKEY |
21 |
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DI |
VIHmin=1.3V |
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module |
diode drop in the |
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VILmax=0.5V |
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Qualcomm chipset. |
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VIHmax=2.1V |
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RESET_N |
20 |
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DI |
Reset the module |
VIHmin=1.3V |
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VILmax=0.5V |
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Status Indication |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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Indicate the module |
The drive current |
Require external |
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STATUS |
61 |
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OD |
should be less than |
pull-up. If unused, |
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operating status |
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0.9mA. |
keep it open. |
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1.8V power domain. |
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Indicate the module |
VOHmin=1.35V |
Cannot be pulled up |
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NET_MODE |
5 |
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DO |
network registration |
before startup. |
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VOLmax=0.45V |
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mode |
If unused, keep it |
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open. |
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NET_ |
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Indicate the module |
VOHmin=1.35V |
1.8V power domain. |
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6 |
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DO |
network activity |
If unused, keep it |
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STATUS |
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VOLmax=0.45V |
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status |
open. |
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USB Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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Vmax=5.25V |
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USB_VBUS |
71 |
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PI |
USB detection |
Vmin=3.0V |
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Vnorm=5.0V |
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USB differential data |
Compliant with USB |
Require differential |
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USB_DP |
69 |
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IO |
2.0 standard |
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bus |
impedance of 90ohm. |
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specification. |
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EC25_Hardware_DesignConfidential / Released |
20 / 90 |
|
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LTE Module Series |
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|
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EC25Hardware Design |
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USB differential data |
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Compliant with USB |
Require differential |
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USB_DM |
70 |
IO |
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2.0 standard |
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bus |
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impedance of 90ohm. |
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specification. |
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USIM Interface |
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Pin Name |
Pin No. |
I/O Description |
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DC Characteristics |
Comment |
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USIM_GND |
10 |
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Specified ground for |
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USIM card |
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For 1.8V USIM: |
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Vmax=1.9V |
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Vmin=1.7V |
Either 1.8V or 3.0V is |
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Power supply for |
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USIM_VDD |
14 |
PO |
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supported by the |
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USIM card |
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For 3.0V USIM: |
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module automatically. |
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Vmax=3.05V |
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Vmin=2.7V |
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IOmax=50mA |
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For 1.8V USIM: |
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VILmax=0.6V |
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VIHmin=1.2V |
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VOLmax=0.45V |
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Data signal of USIM |
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VOHmin=1.35V |
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USIM_DATA |
15 |
IO |
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card |
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For 3.0V USIM: |
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VILmax=1.0V |
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VIHmin=1.95V |
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VOLmax=0.45V |
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VOHmin=2.55V |
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For 1.8V USIM: |
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VOLmax=0.45V |
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USIM_CLK |
16 |
DO |
Clock signal of USIM |
VOHmin=1.35V |
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card |
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For 3.0V USIM: |
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VOLmax=0.45V |
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VOHmin=2.55V |
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For 1.8V USIM: |
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VOLmax=0.45V |
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Reset signal of |
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VOHmin=1.35V |
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USIM_RST |
17 |
DO |
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||
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USIM card |
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For 3.0V USIM: |
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VOLmax=0.45V |
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VOHmin=2.55V |
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USIM_ |
13 |
DI |
USIM card insertion |
|
VILmin=-0.3V |
1.8V power domain. |
||
|
|
PRESENCE |
detection |
|
VILmax=0.6V |
If unused, keep it |
||||
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||||||
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|
EC25_Hardware_DesignConfidential / Released |
21 / 90 |
|
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|
|
LTE Module Series |
|
|
|
|
|
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|
EC25Hardware Design |
|
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VIHmin=1.2V |
open. |
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VIHmax=2.0V |
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UART Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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VOLmax=0.45V |
1.8V power domain. |
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RI |
62 |
DO |
Ring indicator |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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Data carrier |
VOLmax=0.45V |
1.8V power domain. |
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DCD |
63 |
DO |
If unused, keep it |
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detection |
VOHmin=1.35V |
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open. |
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VOLmax=0.45V |
1.8V power domain. |
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CTS |
64 |
DO |
Clear to send |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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VILmin=-0.3V |
1.8V power domain. |
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VILmax=0.6V |
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RTS |
65 |
DI |
Request to send |
If unused, keep it |
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VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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1.8V power domain. |
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Data terminal |
VILmin=-0.3V |
Pull-up by default. |
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VILmax=0.6V |
Low level wakes up |
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DTR |
66 |
DI |
ready,sleep mode |
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VIHmin=1.2V |
the module. |
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control |
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VIHmax=2.0V |
If unused, keep it |
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open. |
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VOLmax=0.45V |
1.8V power domain. |
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TXD |
67 |
DO |
Transmit data |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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VILmin=-0.3V |
1.8V power domain. |
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VILmax=0.6V |
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RXD |
68 |
DI |
Receive data |
If unused, keep it |
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VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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Debug UART Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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VOLmax=0.45V |
1.8V power domain. |
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DBG_TXD |
12 |
DO |
Transmit data |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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VILmin=-0.3V |
1.8V power domain. |
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VILmax=0.6V |
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DBG_RXD |
11 |
DI |
Receive data |
If unused, keep it |
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VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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EC25_Hardware_DesignConfidential / Released |
22 / 90 |
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LTE Module Series |
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EC25Hardware Design |
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ADC Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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General purpose |
Voltage range: |
If unused, keep it |
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ADC0 |
45 |
AI |
analog to digital |
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0.3V to VBAT_BB |
open. |
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converter |
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General purpose |
Voltage range: |
If unused, keep it |
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ADC1 |
44 |
AI |
analog to digital |
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0.3V to VBAT_BB |
open. |
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converter |
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PCM Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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VILmin=-0.3V |
1.8V power domain. |
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VILmax=0.6V |
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PCM_IN |
24 |
DI |
PCM data input |
If unused, keep it |
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VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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VOLmax=0.45V |
1.8V power domain. |
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PCM_OUT |
25 |
DO |
PCM data output |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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VOLmax=0.45V |
1.8V power domain. |
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PCM data frame |
VOHmin=1.35V |
In master mode, it is |
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VILmin=-0.3V |
an output signal. In |
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PCM_SYNC |
26 |
IO |
synchronization |
slave mode, it is an |
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VILmax=0.6V |
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signal |
input signal. |
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VIHmin=1.2V |
If unused, keep it |
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VIHmax=2.0V |
open. |
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VOLmax=0.45V |
1.8V power domain. |
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VOHmin=1.35V |
In master mode, it is |
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an output signal. In |
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VILmin=-0.3V |
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PCM_CLK |
27 |
IO |
PCM clock |
slave mode, it is an |
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VILmax=0.6V |
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input signal. |
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VIHmin=1.2V |
If unused, keep it |
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VIHmax=2.0V |
open. |
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I2C Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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I2C serial clock |
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External pull-up |
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resistor is required. |
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I2C_SCL |
41 |
OD |
Used for external |
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1.8V only. If unused, |
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codec. |
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keep it open. |
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External pull-up |
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I2C_SDA |
42 |
OD |
I2C serial dataUsed |
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resistor is required. |
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for external codec. |
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1.8V only. If unused, |
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keep it open.
EC25_Hardware_DesignConfidential / Released |
23 / 90 |
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LTE Module Series |
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EC25Hardware Design |
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SGMII Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics Comment |
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For 1.8V: |
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VOLmax=0.45V |
1.8V/2.85V power |
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VOHmin=1.4V |
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EPHY_RST_ |
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domain. |
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119 |
DO |
Ethernet PHY reset |
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N |
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For 2.85V: |
If unused, keep it |
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open. |
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VOLmax=0.35V |
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VOHmin=2.14V |
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VILmin=-0.3V |
1.8V power domain. |
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Ethernet PHY |
VILmax=0.6V |
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EPHY_INT_N 120 |
DI |
If unused, keep it |
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interrupt |
VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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For 1.8V: |
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VOLmax=0.45V |
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VOHmin=1.4V |
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VILmax=0.58V |
1.8V/2.85V power |
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SGMII MDIO |
VIHmin=1.27V |
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SGMII_ |
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domain. |
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121 |
IO |
(Management Data |
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MDATA |
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If unused, keep it |
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Input/Output) data |
For 2.85V: |
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open. |
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VOLmax=0.35V |
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VOHmin=2.14V |
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VILmax=0.71V |
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VIHmin=1.78V |
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For 1.8V: |
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VOLmax=0.45V |
1.8V/2.85V power |
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SGMII MDIO |
VOHmin=1.4V |
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SGMII_ |
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domain. |
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122 |
DO |
(Management Data |
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MCLK |
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If unused, keep it |
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Input/Output) clock |
For2.85V: |
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open. |
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VOLmax=0.35V |
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VOHmin=2.14V |
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Configurable power |
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source. |
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1.8V/2.85V power |
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USIM2_VDD |
128 |
PO |
SGMII MDIO pull-up |
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domain. |
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power source |
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External pull-up for |
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SGMII MDIO pins. |
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If unused, keep it |
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open. |
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SGMII_TX_M |
123 |
AO |
SGMII transmission |
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If unused, keep it |
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- minus |
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open. |
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SGMII_TX_P |
124 |
AO |
SGMII transmission |
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If unused, keep it |
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EC25_Hardware_DesignConfidential / Released |
24 / 90 |
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LTE Module Series |
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EC25Hardware Design |
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- plus |
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open. |
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SGMII_RX_P |
125 |
AI |
SGMII receiving |
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If unused, keep it |
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- plus |
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open. |
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SGMII_RX_M 126 |
AI |
SGMII receiving |
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If unused, keep it |
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-minus |
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open. |
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Wireless Connectivity Interfaces |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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VOLmax=0.45V |
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VOHmin=1.35V |
1.8V power domain. |
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SDC1_ |
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VILmin=-0.3V |
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129 |
IO |
SDIO data bus D3 |
If unused, keep it |
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DATA3 |
VILmax=0.6V |
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open. |
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VIHmin=1.2V |
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VIHmax=2.0V |
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VOLmax=0.45V |
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VOHmin=1.35V |
1.8V power domain. |
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SDC1_ |
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VILmin=-0.3V |
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130 |
IO |
SDIO data bus D2 |
If unused, keep it |
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DATA2 |
VILmax=0.6V |
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open. |
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VIHmin=1.2V |
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VIHmax=2.0V |
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VOLmax=0.45V |
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VOHmin=1.35V |
1.8V power domain. |
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SDC1_ |
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VILmin=-0.3V |
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131 |
IO |
SDIO data bus D1 |
If unused, keep it |
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DATA1 |
VILmax=0.6V |
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open. |
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VIHmin=1.2V |
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VIHmax=2.0V |
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VOLmax=0.45V |
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VOHmin=1.35V |
1.8V power domain. |
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SDC1_ |
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VILmin=-0.3V |
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132 |
IO |
SDIO data bus D0 |
If unused, keep it |
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DATA0 |
VILmax=0.6V |
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open. |
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VIHmin=1.2V |
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VIHmax=2.0V |
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VOLmax=0.45V |
1.8V power domain. |
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SDC1_CLK |
133 |
DO |
SDIO clock |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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VOLmax=0.45V |
1.8V power domain. |
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SDC1_CMD |
134 |
DO |
SDIO command |
If unused, keep it |
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VOHmin=1.35V |
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open. |
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External power |
VOLmax=0.45V |
1.8V power domain. |
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PM_ENABLE |
127 |
DO |
If unused, keep it |
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control |
VOHmin=1.35V |
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open. |
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WAKE_ON_ |
135 |
DI |
Wake up the host |
VILmin=-0.3V |
1.8V power domain. |
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WIRELESS |
(EC25 module) by |
VILmax=0.6V |
Active low. |
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EC25_Hardware_DesignConfidential / Released |
25 / 90 |
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LTE Module Series |
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EC25Hardware Design |
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FC20 module. |
VIHmin=1.2V |
If unused, keep it |
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VIHmax=2.0V |
open. |
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WLAN function |
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1.8V power domain. |
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VOLmax=0.45V |
Active high. |
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WLAN_EN |
136 |
DO |
control via FC20 |
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VOHmin=1.35V |
If unused, keep it |
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module |
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open. |
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VILmin=-0.3V |
1.8V power domain. |
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COEX_UART |
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LTE/WLAN&BT |
VILmax=0.6V |
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137 |
DI |
If unused, keep it |
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_RX |
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coexistence signal |
VIHmin=1.2V |
open. |
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VIHmax=2.0V |
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COEX_UART |
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LTE/WLAN&BT |
VOLmax=0.45V |
1.8V power domain. |
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138 |
DO |
If unused, keep it |
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_TX |
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coexistence signal |
VOHmin=1.35V |
open. |
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WLAN_SLP_ |
118 |
DO |
WLAN sleep clock |
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If unused, keep it |
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CLK |
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open. |
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VILmin=-0.3V |
1.8V power domain. |
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BT UART request to |
VILmax=0.6V |
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BT_RTS* |
37 |
DI |
If unused, keep it |
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send |
VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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BT UART transmit |
VOLmax=0.45V |
1.8V power domain. |
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BT_TXD* |
38 |
DO |
If unused, keep it |
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data |
VOHmin=1.35V |
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open. |
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VILmin=-0.3V |
1.8V power domain. |
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BT UART receive |
VILmax=0.6V |
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BT_RXD* |
39 |
DI |
If unused, keep it |
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data |
VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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BT UART clear to |
VOLmax=0.45V |
1.8V power domain. |
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BT_CTS* |
40 |
DO |
If unused, keep it |
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send |
VOHmin=1.35V |
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open. |
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BT function control |
VOLmax=0.45V |
1.8V power domain. |
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BT_EN* |
139 |
DO |
If unused, keep it |
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via FC20 module |
VOHmin=1.35V |
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open. |
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RF Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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ANT_DIV |
35 |
AI |
Diversity antenna |
50ohm impedance |
If unused, keep it |
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open. |
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ANT_MAIN |
49 |
IO |
Main antenna |
50ohm impedance |
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ANT_GNSS |
47 |
AI |
GNSS antenna |
50 ohm impedance |
If unused, keep it |
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open. |
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GPIO Pins
EC25_Hardware_DesignConfidential / Released |
26 / 90 |
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LTE Module Series |
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EC25Hardware Design |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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1.8V power domain. |
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VILmin=-0.3V |
Cannot be pulled up |
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before startup. |
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VILmax=0.6V |
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WAKEUP_IN |
1 |
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DI |
Sleep mode control |
Low level wakes up |
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VIHmin=1.2V |
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the module. |
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VIHmax=2.0V |
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If unused, keep it |
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open. |
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1.8V power domain. |
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VILmin=-0.3V |
Pull-up by default. |
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In low voltage level, |
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Airplane mode |
VILmax=0.6V |
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W_DISABLE# |
4 |
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DI |
module can enter into |
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control |
VIHmin=1.2V |
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airplane mode. |
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VIHmax=2.0V |
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If unused, keep it |
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open. |
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Application |
VILmin=-0.3V |
1.8V power domain. |
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VILmax=0.6V |
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AP_READY |
2 |
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DI |
processor sleep |
If unused, keep it |
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VIHmin=1.2V |
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state detection |
open. |
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VIHmax=2.0V |
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USB_BOOT Interface |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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VILmin=-0.3V |
1.8V power domain. |
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Force the module to |
VILmax=0.6V |
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USB_BOOT |
115 |
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DI |
If unused, keep it |
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boot from USB port |
VIHmin=1.2V |
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open. |
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VIHmax=2.0V |
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RESERVED Pins |
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Pin Name |
Pin No. |
I/O |
Description |
DC Characteristics |
Comment |
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3, 18, 23, |
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28~34, 43, |
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RESERVED |
55, 73~84, |
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Reserved |
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Keep these pins |
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113, 114, |
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unconnected. |
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116, 117, |
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140~144 |
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NOTES
1.“*” means under development.
2.Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20 module.
EC25_Hardware_DesignConfidential / Released |
27 / 90 |