Quectel Wireless Solutions 201202M10 Users Manual

M10

Quectel Cellular Engine

Hardware Design

M10_HD_V3.0

M10 Hardware Design

		Document Title
				M10 Hardware Design
		Revision		3.0
		Date		2012-03-02
		Status		Released
		Document Control ID		M10_HD_V3.0

General Notes

Quectel offers this information as a service to its customers, to support application and engineering efforts that use the products designed by Quectel. The information provided is based upon requirements specifically provided for customers of Quectel. Quectel has not undertaken any independent search for additional information, relevant to any information that may be in the customer’s possession. Furthermore, system validation of this product designed by Quectel within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change.

Copyright

This document contains proprietary technical information of Quectel Co., Ltd. Copying of this document, distribution to others, and communication of the contents thereof, are forbidden without permission. Offenders are liable to the payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design. All specification supplied herein are subject to change without notice at any time.

Copyright © Quectel Wireless Solutions Co., Ltd. 2012

M10_HD_V3.0

- 1 -

M10 Hardware Design

Contents
Contents ............................................................................................................................................	2
Table Index........................................................................................................................................	4
Figure Index ......................................................................................................................................	5
0. Revision history ............................................................................................................................	7
1. Introduction...................................................................................................................................	9
1.1. Related documents ..............................................................................................................	9
1.2. Terms and abbreviations....................................................................................................	10
1.3. Directives and standards....................................................................................................	12
1.3.1. FCC Statement ........................................................................................................	12
1.3.2. FCC Radiation exposure statement .........................................................................	12
1.3.3. Industry Canada licence ..........................................................................................	12
1.4. Safety cautions ..................................................................................................................	13
2. Product concept...........................................................................................................................	15
2.1. Key features ......................................................................................................................	15
2.2. Functional diagram............................................................................................................	17
2.3. Evaluation board ...............................................................................................................	18
3. Application interface...................................................................................................................	19
3.1. Pin of module ....................................................................................................................	19
3.1.1. Pin assignment.........................................................................................................	19
3.1.2. Pin description.........................................................................................................	20
3.2. Operating modes ...............................................................................................................	25
3.3. Power supply.....................................................................................................................	26
3.3.1. Power supply pins....................................................................................................	27
3.3.2. Minimizing supply voltage drop..............................................................................	27
3.3.3. Monitor power supply .............................................................................................	28
3.4. Power up and down scenarios ...........................................................................................	28
3.4.1. Power on..................................................................................................................	28
3.4.2. Power down.............................................................................................................	31
3.4.3. Restart module using the PWRKEY pin..................................................................	35
3.5. Power saving .....................................................................................................................	36
3.5.1. Minimum functionality mode..................................................................................	36
3.5.2. SLEEP mode (slow clock mode).............................................................................	36
3.5.3. Wake up module from SLEEP mode ......................................................................	37
3.6. Summary of state transitions (except SLEEP mode).........................................................	37
3.7. RTC backup ......................................................................................................................	37
3.8. Serial interfaces.................................................................................................................	39
3.8.1. UART Port ..............................................................................................................	40
3.8.2. Debug Port...............................................................................................................	43
3.8.3. UART Port 3 ...........................................................................................................	44
3.8.4. UART Application ..................................................................................................	45
3.9. Audio interfaces.................................................................................................................	46
M10_HD_V3.0	- 2 -

M10 Hardware Design

3.9.1. Decrease TDD noise and other noise ......................................................................	47
3.9.2. Microphone interfaces configuration.......................................................................	48
3.9.3. Receiver and speaker interface configuration..........................................................	49
3.9.4. Earphone interface configuration ............................................................................	51
3.10. SIM card interface...........................................................................................................	52
3.10.1. SIM card application .............................................................................................	52
3.10.2. Design considerations for SIM card holder...........................................................	54
3.11. Keypad interface..............................................................................................................	56
3.12. ADC.................................................................................................................................	57
3.13. Behaviors of the RI .........................................................................................................	58
3.14. Network status indication................................................................................................	60
3.15. Operating status indication..............................................................................................	61
3.16. General purpose input & output (GPIO) .........................................................................	61
3.17. Open drain output (LIGHT_MOS)..................................................................................	62
3.18. SD card interface.............................................................................................................	63
4. Antenna interface ........................................................................................................................	65
4.1. Antenna installation...........................................................................................................	65
4.2. RF output power................................................................................................................	66
4.3. RF receiving sensitivity.....................................................................................................	66
4.4. Operating frequencies .......................................................................................................	66
4.5. Recommendation of RF pad welding................................................................................	66
5. Electrical, reliability and radio characteristics ............................................................................	68
5.1. Absolute maximum ratings................................................................................................	68
5.2. Operating temperature.......................................................................................................	68
5.3. Power supply ratings .........................................................................................................	69
5.4. Current consumption .........................................................................................................	70
5.5. Electro-static discharge .....................................................................................................	72
6. Mechanical dimensions...............................................................................................................	73
6.1. Mechanical dimensions of module....................................................................................	73
6.2. Footprint of recommendation............................................................................................	75
6.3. Top view of the module ....................................................................................................	77
6.4. Bottom view of the module...............................................................................................	77
Appendix A: GPRS coding schemes...............................................................................................	78
Appendix B: GPRS multi-slot classes.............................................................................................	79

M10_HD_V3.0

- 3 -

M10 Hardware Design

Table Index
TABLE 1: RELATED DOCUMENTS .............................................................................................	9
TABLE 2: TERMS AND ABBREVIATIONS................................................................................	10
TABLE 3: MODULE KEY FEATURES ........................................................................................	15
TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR
INTERFACE..................................................................................................................	17
TABLE 5: PIN DESCRIPTION......................................................................................................	20
TABLE 6: OVERVIEW OF OPERATING MODES......................................................................	25
TABLE 7: AT COMMANDS USED IN ALARM MODE .............................................................	31
TABLE 8: SUMMARY OF STATE TRANSITION .......................................................................	37
TABLE 9: LOGIC LEVELS OF THE SERIAL INTERFACE.......................................................	40
TABLE 10: PIN DEFINITION OF THE SERIAL INTERFACES.................................................	40
TABLE 11: PIN DEFINITION OF AUDIO INTERFACE.............................................................	47
TABLE 12: TYPICAL ELECTRET MICROPHONE CHARACTERISTIC .................................	51
TABLE 13: TYPICAL SPEAKER CHARACTERISTIC...............................................................	51
TABLE 14: PIN DEFINITION OF THE SIM INTERFACE..........................................................	52
TABLE 15: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER..................................	55
TABLE 16: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER .........................................	55
TABLE 17: PIN DEFINITION OF THE KEYPAD INTERFACE.................................................	56
TABLE 18: PIN DEFINITION OF THE ADC ...............................................................................	57
TABLE 19: CHARACTERISTIC OF THE ADC...........................................................................	58
TABLE 20: BEHAVIORS OF THE RI...........................................................................................	58
TABLE 21: WORKING STATE OF THE NETLIGHT..................................................................	60
TABLE 22: PIN DEFINITION OF THE STATUS.........................................................................	61
TABLE 23: PIN DEFINITION OF THE GPIO INTERFACE .......................................................	62
TABLE 24: PIN DEFINITION OF THE LIGHT_MOS.................................................................	62
TABLE 25: PIN DEFINITION OF THE SD CARD INTERFACE ...............................................	63
TABLE 26: PIN NAME OF THE SD CARD AND T-FLASH(MICRO SD) CARD.....................	64
TABLE 27: PIN DEFINITION OF THE RF_ANT ........................................................................	65
TABLE 28: THE MODULE CONDUCTED RF OUTPUT POWER ............................................	66
TABLE 29: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY ............................	66
TABLE 30: THE MODULE OPERATING FREQUENCIES ........................................................	66
TABLE 31: ABSOLUTE MAXIMUM RATINGS .........................................................................	68
TABLE 32: OPERATING TEMPERATURE .................................................................................	68
TABLE 33: THE MODULE POWER SUPPLY RATINGS ...........................................................	69
TABLE 34: THE MODULE CURRENT CONSUMPTION ..........................................................	70
TABLE 35: THE ESD ENDURANCE (TEMPERATURE:25 ,HUMIDITY:45 %)....................	72
TABLE 36: DESCRIPTION OF DIFFERENT CODING SCHEMES...........................................	78
TABLE 37: GPRS MULTI-SLOT CLASSES ................................................................................	79

M10_HD_V3.0

- 4 -

M10 Hardware Design

Figure Index
FIGURE 1: MODULE FUNCTIONAL DIAGRAM......................................................................	18
FIGURE 2: TOP VIEW OF MODULE PIN ASSIGNMENT.........................................................	19
FIGURE 3: REFERENCE CIRCUIT OF THE SOURCE POWER SUPPLY INPUT ...................	26
FIGURE 4: RIPPLE IN SUPPLY VOLTAGE DURING TRANSMITTING BURST ...................	27
FIGURE 5: REFERENCE CIRCUIT OF THE VBAT INPUT.......................................................	28
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT.........................................	29
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ...................................................	29
FIGURE 8: TIMING OF TURN ON SYSTEM .............................................................................	30
FIGURE 9: TIMING OF TURN OFF THE MODULE..................................................................	32
FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT ....	34
FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON ......................	34
FIGURE 12: TIMING OF RESTART SYSTEM............................................................................	35
FIGURE 13: TIMING OF RESTART SYSTEM AFTER EMERGENCY SHUTDOWN .............	35
FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY........................................	38
FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ............................................	38
FIGURE 16: RTC SUPPLY FROM CAPACITOR.........................................................................	38
FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTIC .......................................	39
FIGURE 18: CONNECTION OF ALL FUNCTIONAL UART PORT ..........................................	42
FIGURE 19: CONNECTION OF THREE LINES UART PORT...................................................	42
FIGURE 20: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL..........	43
FIGURE 21: CONNECTION OF SOFTWARE UPGRADE .........................................................	43
FIGURE 22: CONNECTION OF SOFTWARE DEBUG ..............................................................	44
FIGURE 23: CONNECTION OF AUXILIARY UART PORT ......................................................	44
FIGURE 24: 3.3V LEVEL MATCH CIRCUIT ..............................................................................	45
FIGURE 25: 5V LEVEL MATCH CIRCUIT.................................................................................	45
FIGURE 26: RS232 LEVEL MATCH CIRCUIT...........................................................................	46
FIGURE 27: MICROPHONE INTERFACE CONFIGURATION OF AIN1&AIN2.....................	48
FIGURE 28: SPEAKER INTERFACE CONFIGURATION OF AOUT1......................................	49
FIGURE 29: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1.....	49
FIGURE 30: SPEAKER INTERFACE CONFIGURATION OF AOUT2......................................	50
FIGURE 31: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2.....	50
FIGURE 32: EARPHONE INTERFACE CONFIGURATION......................................................	51
FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD ............................................	53
FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD ............................................	53
FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER ......................................	54
FIGURE 36: MOLEX 91228 SIM CARD HOLDER.....................................................................	55
FIGURE 37: REFERENCE CIRCUIT OF THE KEYPAD INTERFACE .....................................	57
FIGURE 38: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER....................................	59
FIGURE 39: RI BEHAVIOUR OF DATA CALLING AS A RECEIVER......................................	59
FIGURE 40: RI BEHAVIOUR AS A CALLER .............................................................................	59
FIGURE 41: RI BEHAVIOUR OF URC OR SMS RECEIVED....................................................	60
M10_HD_V3.0	- 5 -

M10 Hardware Design

FIGURE 42: REFERENCE CIRCUIT OF THE NETLIGHT ........................................................	60
FIGURE 43: REFERENCE CIRCUIT OF THE STATUS .............................................................	61
FIGURE 44: REFERENCE CIRCUIT OF THE LIGHT_MOS .....................................................	62
FIGURE 45: REFERENCE CIRCUIT OF SD CARD ...................................................................	63
FIGURE 46: REFERENCE CIRCUIT OF RF INTERFACE.........................................................	65
FIGURE 47: RECOMMENDATION OF RF PAD WELDING .....................................................	67
FIGURE 48: M10 TOP AND SIDE DIMENSIONS UNIT: MM ............................................	73
FIGURE 49: M10 BOTTOM DIMENSIONS UNIT: MM ......................................................	74
FIGURE 50: PAD BOTTOM DIMENSIONS UNIT: MM ......................................................	74
FIGURE 51: FOOTPRINT OF RECOMMENDATION UNIT: MM ......................................	76
FIGURE 52: TOP VIEW OF THE MODULE................................................................................	77
FIGURE 53: BOTTOM VIEW OF THE MODULE ......................................................................	77
FIGURE 54: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3....................................	78
FIGURE 55: RADIO BLOCK STRUCTURE OF CS-4 ................................................................	78

M10_HD_V3.0

- 6 -

M10 Hardware Design

0. Revision history

Revision	Date	Author	Description of change
1.00	2009-06-27	Tracy ZHANG	Initial
1.01	2009-09-18	Yong AN	1.	Modified VRTC voltage inputting range.
			2.	Modified Figure 1.
			3.	Added Table 7 and Figure 4 with remark.
			4.	Modified ordering information content in
				Chapter 6.
			5.	Added VCHG pin description.
			6.	Modified current consumption data in Table 36.
			7.	Added appendix A and B.
1.02	2009-11-12	Yong AN	1.	Baud rate of the main UART port is set to
				autobauding mode from former fixed baud rate
				of 115200 in default configuration.
			2.	Modified contents about autobauding in
				Chapter 3.8
			3.	Modified the SIM card detection function
				through “AT+QSIMDET”.
1.03	2010-06-09	Yong AN	1.	Added charging interface description.
			2.	Added Serial Port 3 interface description.
			3.	Added STATUS pin and its function description.
			4.	Added GPIO control by AT+QGPIO command.
			5.	Modified timing of powering on, powering
				down and restarting the module.
			6.	Added ESD level of SIM card interface.
			7.	Modified function description of audio AOUT2
				channel.
			8.	Disabled VDD_EXT pin as the indication of
				power-on and power-down.
			9.	Both STATUS and AT+QGPIO functions are
				supported at R05A05 release version and later,
				while Serial Port 3 function will be supported at
				R06AXX and later.
2.0	2010-07-30	DavidWEI	1.	Added recommendation of RF pad welding.
3.0	2012-02-28	LayneYE	1.	Modified the power supply range
			2.	Modified buzzer interface as RESERVED
			3.	Modified the display interface as SD interface
			4.	Modified the peak current in a transmitting burst
			5.	Modified the current consumption in GSM talk
				mode and GPRS communication mode
			6.	Modified the RF receiving sensitivity
M10_HD_V3.0				- 7 -

M10 Hardware Design

7. Deleted the content of charging function.

M10_HD_V3.0

- 8 -

M10 Hardware Design

1. Introduction

This document defines the M10 module and describes the hardware interface of M10 module which are connected with the customer application and the air interface.

This document can help customer quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customer can use M10 module to design and set up mobile applications easily.

1.1. Related documents

Table 1: Related documents

SN	Document name			Remark
[1]	M10_ATC			AT commands set
[2]	ITU-T	Draft	new	Serial asynchronous automatic dialing and control
	recommendation V.25ter
[3]	GSM 07.07			Digital cellular telecommunications (Phase 2+); AT
				command set for GSM Mobile Equipment (ME)
[4]	GSM 07.10			Support GSM 07.10 multiplexing protocol
[5]	GSM 07.05			Digital cellular telecommunications (Phase 2+); Use of
				Data Terminal Equipment – Data Circuit terminating
				Equipment (DTE – DCE) interface for Short Message
				Service (SMS) and Cell Broadcast Service (CBS)
[6]	GSM 11.14			Digital cellular telecommunications (Phase 2+);
				Specification of the SIM Application Toolkit for the
				Subscriber Identity module – Mobile Equipment (SIM –
				ME) interface
[7]	GSM 11.11			Digital cellular telecommunications (Phase 2+);
				Specification of the Subscriber Identity module – Mobile
				Equipment (SIM – ME) interface
[8]	GSM 03.38			Digital cellular telecommunications (Phase 2+);
				Alphabets and language-specific information
[9]	GSM 11.10			Digital cellular telecommunications (Phase 2); Mobile
				Station (MS) conformance specification; Part 1:
				Conformance specification
[10]	GSM_UART_AN			UART port application notes
[11]	M10_HD_AN01			M10 hardware design application notes
[12]	GSM_FW_Upgrade_AN01			GSM Firmware upgrade application note
[13]	M10_EVB_UGD			M10 EVB user guide application notes

M10_HD_V3.0

- 9 -

M10 Hardware Design

1.2. Terms and abbreviations

Table 2: Terms and abbreviations

Abbreviation	Description
ADC	Analog-to-Digital Converter
AMR	Adaptive Multi-Rate
ARP	Antenna Reference Point
ASIC	Application Specific Integrated Circuit
BER	Bit Error Rate
BOM	Bill Of Material
BTS	Base Transceiver Station
CHAP	Challenge Handshake Authentication Protocol
CS	Coding Scheme
CSD	Circuit Switched Data
CTS	Clear To Send
DAC	Digital-to-Analog Converter
DRX	Discontinuous Reception
DSP	Digital Signal Processor
DCE	Data Communications Equipment (typically module)
DTE	Data Terminal Equipment (typically computer, external controller)
DTR	Data Terminal Ready
DTX	Discontinuous Transmission
EFR	Enhanced Full Rate
EGSM	Enhanced GSM
EMC	Electromagnetic Compatibility
ESD	Electrostatic Discharge
ETS	European Telecommunication Standard
FCC	Federal Communications Commission (U.S.)
FDMA	Frequency Division Multiple Access
FR	Full Rate
GMSK	Gaussian Minimum Shift Keying
GPRS	General Packet Radio Service
GSM	Global System for Mobile Communications
HR	Half Rate
I/O	Input/Output
IC	Integrated Circuit
IMEI	International Mobile Equipment Identity
Imax	Maximum Load Current
Inorm	Normal Current
kbps	Kilo Bits Per Second
LED	Light Emitting Diode
M10_HD_V3.0	- 10 -

M10 Hardware Design

Abbreviation	Description
Li-Ion	Lithium-Ion
MO	Mobile Originated
MS	Mobile Station (GSM engine)
MT	Mobile Terminated
PAP	Password Authentication Protocol
PBCCH	Packet Switched Broadcast Control Channel
PCB	Printed Circuit Board
PDU	Protocol Data Unit
PPP	Point-to-Point Protocol
RF	Radio Frequency
RMS	Root Mean Square (value)
RTC	Real Time Clock
RX	Receive Direction
SIM	Subscriber Identification Module
SMS	Short Message Service
TDMA	Time Division Multiple Access
TE	Terminal Equipment
TX	Transmitting Direction
UART	Universal Asynchronous Receiver & Transmitter
URC	Unsolicited Result Code
USSD	Unstructured Supplementary Service Data
VSWR	Voltage Standing Wave Ratio
Vmax	Maximum Voltage Value
Vnorm	Normal Voltage Value
Vmin	Minimum Voltage Value
VIHmax	Maximum Input High Level Voltage Value
VIHmin	Minimum Input High Level Voltage Value
VILmax	Maximum Input Low Level Voltage Value
VILmin	Minimum Input Low Level Voltage Value
VImax	Absolute Maximum Input Voltage Value
VImin	Absolute Minimum Input Voltage Value
VOHmax	Maximum Output High Level Voltage Value
VOHmin	Minimum Output High Level Voltage Value
VOLmax	Maximum Output Low Level Voltage Value
VOLmin	Minimum Output Low Level Voltage Value
Phonebook abbreviations
FD	SIM Fix Dialing phonebook
LD	SIM Last Dialing phonebook (list of numbers most recently dialed)
MC	Mobile Equipment list of unanswered MT Calls (missed calls)
ON	SIM (or ME) Own Numbers (MSISDNs) list
RC	Mobile Equipment list of Received Calls
M10_HD_V3.0	- 11 -

M10 Hardware Design

Abbreviation	Description
SM	SIM phonebook

1.3. Directives and standards

The M10 module is designed to comply with the FCC statements. FCC ID is XMR201202M10. The Host system using M10, should have label indicating FCC ID: XMR201202M10.

1.3.1. FCC Statement

Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

1.3.2. FCC Radiation exposure statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

The manual of the host system, which uses M10, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M10 module depending on portable or Mobile status.

Note: If a portable device (such as PDA) uses M10 module, the device needs to do permissive change and SAR testing.

1.3.3. Industry Canada license

English version

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:

a)This device may not cause harmful interference.

b)This device must accept any interference, including interference that may cause undesired operation of the device.

The Host system using M10, should have label indicating “transmitter module IC: 10064-201202M10.

French version

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

M10_HD_V3.0

- 12 -

M10 Hardware Design

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :

a)l'appareil ne doit pas produire de brouillage, et

b)L’utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

1.4. Safety cautions

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M10 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions about the use of mobile. Switch the cellular terminal or mobile off. Medical equipment may be sensitive to not operate normally for RF energy interference.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gas or fume. Switch off the cellular terminal when you are near petrol station, fuel depot, chemical plant or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmosphere can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

Road safety comes first! Do not use a hand-held cellular terminal or mobile while driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

M10_HD_V3.0

- 13 -

M10 Hardware Design

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call.

Also, some networks require that a valid SIM card be properly inserted in cellular terminal or mobile.

M10_HD_V3.0

- 14 -

M10 Hardware Design

2. Product concept

The M10 is a Quad-band GSM/GPRS engine that works at frequencies GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M10 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to Appendix A and Appendix B.

With a tiny profile of 29mm×29mm ×3.6 mm, the module can meet almost all the requirements for M2M applications, including Tracking and Tracing, Intelligent Instrument, Wireless POS, Security, Telematics, Remote Controlling, etc.

M10 is an SMD type module, which can be embedded in customer application through its 64-pin pads. It provides all hardware interfaces between the module and customer’s host board.

Designed with power saving technique, current consumption of M10 is as low as 1.1 mA in SLEEP mode when DRX is 5.

M10 is integrated with Internet service protocols, which are TCP/IP, PPP. Extended AT commands have been developed for customer to use these Internet service protocols easily.

The modules are fully RoHS compliant to EU regulation.

2.1. Key features

Table 3: Module key features

	Feature	Implementation
	Power supply	Single supply voltage: 3.3V~4.6V
		Typical supply voltage: 4V
	Power saving	Typical power consumption in SLEEP mode to 1.1 mA@ DRX=5
			0.95mA@ DRX=9
	Frequency bands	 Daud-band: GSM850, GSM900, DCS1800, PCS1900.
		 The module can search these frequency bands automatically
		 The frequency bands can be set by AT command.
		 Compliant to GSM Phase 2/2+
	GSM class	Small MS
	Transmitting power	 Class 4 (2W) at GSM850 and GSM900
		 Class 1 (1W) at DCS1800 and PCS1900
	GPRS connectivity		GPRS multi-slot class 12 (default)
			GPRS multi-slot class 1~12 (configurable)
		 GPRS mobile station class B
	Temperature range	 Normal operation: -35°C ~ +80°C
	M10_HD_V3.0		- 15 -

M10 Hardware Design

	 Restricted operation: -45°C ~ -35°C and +80°C ~ +85°C 1)
	 Storage temperature: -45°C ~ +90°C
DATA GPRS:	 GPRS data downlink transfer: max. 85.6 kbps
	 GPRS data uplink transfer: max. 85.6 kbps
	 Coding scheme: CS-1, CS-2, CS-3 and CS-4
	 Support the protocols PAP (Password Authentication Protocol)
		usually used for PPP connections
	 Internet service protocols TCP/UDP/FTP/HTTP/MMS/SMTP
	 Support Packet Switched Broadcast Control Channel (PBCCH)
CSD:	 CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent
	 Support Unstructured Supplementary Services Data (USSD)
SMS	 MT, MO, CB, Text and PDU mode
	 SMS storage: SIM card
FAX	Group 3 Class 1 and Class 2
SIM interface	Support SIM card: 1.8V, 3V
Antenna interface	Connected via 50 Ohm antenna pad
Audio features	Speech codec modes:
	 Half Rate (ETS 06.20)
	 Full Rate (ETS 06.10)
	 Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
	 Adaptive Multi-Rate (AMR)
		Echo Cancellation
		Echo Suppression
		Noise Reduction
Serial interface	Serial Port:
	 Seven lines on serial port interface
	 Use for AT command, GPRS data and CSD data
		Multiplexing function
	 Support autobauding from 4800 bps to 115200 bps
	Debug Port:
	 Two lines on second serial port interface DBG_TXD and
		DBG_RXD
		Debug Port used for software debugging and log output
	UART3:
	 Use for AT command
Phonebook management	Support phonebook types: SM, FD, LD, RC, ON, MC
SIM Application Toolkit	Support SAT class 3, GSM 11.14 Release 99
Real time clock	Implemented
Alarm function	Programmable via AT command
Physical characteristics	Size:
	29±0.15×29±0.15×3.6±0.3mm
	Weight: 6g
Firmware upgrade	Firmware upgrade over Serial Port
M10_HD_V3.0		- 16 -

M10 Hardware Design

1)When the module works in this temperature range, the deviation from the GSM specification might occur. For example, the frequency error or the phase error could increase.

Table 4: Coding schemes and maximum net data rates over air interface

	Coding scheme	1 Timeslot	2 Timeslot	4 Timeslot
	CS-1:	9.05kbps	18.1kbps	36.2kbps
	CS-2:	13.4kbps	26.8kbps	53.6kbps
	CS-3:	15.6kbps	31.2kbps	62.4kbps
	CS-4:	21.4kbps	42.8kbps	85.6kbps

2.2. Functional diagram

The following figure shows a block diagram of M10 and illustrates the major functional parts.

Power management

Baseband

Serial Flash

The GSM radio frequency part

The Peripheral interface

—Power supply

—Turn on/off interface

—UART interface

—Audio interface

—SIM interface

—Keypad interface

—ADC

—SD card interface

—RF interface

M10_HD_V3.0

- 17 -

M10 Hardware Design

Figure 1: Module functional diagram

2.3. Evaluation board

In order to help customer on the application of M12, Quectel supplies an Evaluation Board (EVB) that hosts the module directly with appropriate power supply, SIM card holder, RS-232 serial interface, handset RJ11 port, earphone port, antenna and other peripherals to control or test the module. For details, please refer to the document [13].

M10_HD_V3.0

- 18 -

M10 Hardware Design

3. Application interface

The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular application platform. Sub-interfaces included in these pads are described in detail in following chapters:

Power supply (refer to Chapter 3.3)

Serial interfaces (refer to Chapter 3.8)

Two analog audio interfaces (refer to Chapter 3.9)

SIM interface (refer to Chapter 3.10)

SD card interface(refer to Chapter 3.18)

Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6.

3.1. Pin of module

3.1.1. Pin assignment

The following figure shows pin name and assignment of M10.

Figure 2: Top view of module pin assignment

M10_HD_V3.0

- 19 -

M10 Hardware Design

3.1.2. Pin description

Table 5: Pin description

Power supply

	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	VBAT	50,51	I	Module main	Vmax= 4.6V	It must be able to
		52		power supply.	Vmin=3.3V	provide sufficient
				VBAT=3.3V~4.6V	Vnorm=4.0V	current in a
				.		transmitting burst
						which typically
						rises to 1.6A.
	VRTC	16	I/O	Power supply for	VImax=VBAT	Recommended to
				RTC when VBAT	VImin=2.6V	connect to a
				is not supplied.	VInorm=2.75V	backup battery or a
				Charging for	VOmax=2.85V	golden capacitor.
				backup battery or	VOmin=2.6V
				golden capacitor	VOnorm=2.75V
				when the VBAT is	Iout(max)= 730uA
				supplied.	Iin=2.6~5 uA
	VDD_EXT	7	O	Supply 2.8V	Vmax=2.9V	1. If unused, keep
				voltage for	Vmin=2.7V	this pin open.
				external circuit.	Vnorm=2.8V	2. Recommended
					Imax=20mA	to add a 2.2~4.7uF
						bypass capacitor,
						when used for
						power supply.
	GND	8,42,		Digital ground
		44~
		49
	Turn on /off
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	PWRKEY	18	I	Power on/off key	VILmax=0.1*VBAT	Pull up to VBAT
				PWRKEY should	VIHmin=0.6*VBAT	internally.
				be pulled down for	VImax=VBAT
				a moment to turn
				on or off the
				system.
	Emergency shutdown
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	M10_HD_V3.0					- 20 -

M10 Hardware Design

	EMERG_	17	I		Emergency off.	VILmax=0.4V	Open
	OFF				Pulling down for	VIHmin=2.2V	drain/collector
					at least 20ms will	Vopenmax=2.8V	driver required in
					turn off the module		cellular device
					in case of		application.
					emergency. Use it		If unused, keep
					only when normal		this pin open.
					shutdown through
					PWRKEY or AT
					command cannot
					perform well.
	Module status indication
	PIN NAME	PIN	I/O		DESCRIPTION	DC	COMMENT
		NO.				CHARACTERISTICS
	STATUS	54	O		Used to indicate	VOLmax=	If unused, keep
					module’s operating	0.15*VDD_EXT	this pin open.
					status. High level	VOHmax=
					indicates module	0.85*VDD_EXT
					power-on and low
					level indicates
					power-down.
	Audio interfaces
	PIN NAME	PIN	I/O		DESCRIPTION	DC	COMMENT
		NO.				CHARACTERISTICS
	MIC1P	23	I		Positive and	For Audio DC	If unused, keep
	MIC1N	24			negative	characteristics refer to	these pins open.
					voice-band input.	Chapter 3.10.
	MIC2P	25	I		Auxiliary positive
	MIC2N	26			and negative
					voice-band input.
	SPK1P	22	O		Positive and
	SPK1N	21			negative
					voice-band output.
	SPK2P	20	O		Auxiliary positive
					voice-band output.
	AGND	19			AGND is separate
					ground connection
					for external audio
					circuits.
	General purpose input/output
	PIN NAME	PIN	I/O		DESCRIPTION	DC	COMMENT
		NO.				CHARACTERISTICS
	M10_HD_V3.0						- 21 -

M10 Hardware Design

	KBC0~	33~37	I	Keypad interface	VILmin=-0.3V	If unused, keep
	KBC4				VILmax=	these pins open.
					0.25*VDD_EXT
	KBR0~	28~32	O			Pull up to
					VIHmin=
	KBR4					VDD_EXT, if
					0.75*VDD_EXT
						unused, keep these
					VIHmax=
						pins open.
					VDD_EXT+0.3
	GPIO1_	38	I/O	Normal		If unused, keep
					VOLmax=
	KBC5			input/output		these pins open.
					0.15*VDD_EXT
				port/Keypad
					VOHmin=
				interface
					0.85*VDD_EXT
	GPIO0	64	I/O	Normal
				input/output port
	NETLIGHT	6	O	Network status
				indication
	LIGHT_	27	O	Open drain output	Imax=60mA	If unused, keep
	MOS			port		this pin open.
	Main Serial port
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	DTR	59	I	Data terminal	VILmin=-0.3V	If only use TXD,
				ready	VILmax=	RXD and GND to
	RXD	61	I	Receive data	0.25*VDD_EXT	communicate,
					VIHmin=	recommend
	TXD	60	O	Transmit data
					0.75*VDD_EXT	connecting RTS to
	RTS	58	I	Request to send	VIHmax=	GND via 0R
					VDD_EXT+0.3	resistor and
	CTS	57	O	Clear to send
					VOLmax=	keeping other pins
	RI	55	O	Ring indicator
					0.15*VDD_EXT	open.
	DCD	56	O	Data carrier	VOHmin=
				detection	0.85*VDD_EXT
	Debug port
	DBG_TXD	10	O	Serial interface for	Same as above	If unused, keep
				debugging only		these pins open.
	DBG_RXD	9	I
	UART3
	TXD3	62	O	Transmit data	Same as above	If unused, keep
						these pins open.
	RXD3	63	I	Receive data
	SD card interface
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	SD_DATA	1	I/O	SD serial data	VILmin=-0.3V	If unused, keep

M10_HD_V3.0

- 22 -

M10 Hardware Design

SD_CLK		2	O	SD serial clock	VILmax=	these pins open.
					0.25*VDD_EXT	If used,
SD_CMD		3	O	SD command	VIHmin=	SD_DATA is
					0.75*VDD_EXT	connected to SD
					VIHmax=	card DATA0 pin.
					VDD_EXT+0.3
					VOLmax=
					0.15*VDD_EXT
					VOHmin=
					0.85*VDD_EXT
SIM interface
PIN NAME		PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
SIM_VDD		12	O	Voltage supply for	The voltage can be	All signals of SIM
				SIM card	selected by software	interface should be
					automatically. Either	protected against
					1.8V or 3V.	ESD with a TVS
SIM_DATA		13	I/O	SIM data	When SIM_VDD=3V	diode array.
					VILmax=0.4V	Maximum cable
					VIHmin=	length is 200mm
					SIM_VDD-0.4	from the module
					VOLmax=0.4V	pad to SIM card
					VOHmin=	holder.
					SIM_VDD-0.4
					When SIM_VDD=1.8V
					VILmax=
					0.15*SIM_VDD
					VIHmin=
					SIM_VDD-0.4
					VOLmax=
					0.15*SIM_VDD
					VOHmin=
					SIM_VDD-0.4
SIM_CLK		14	O	SIM clock	When SIM_VDD=3V
					VILmax=0.4V
					VIHmin=
					0.9*SIM_VDD
					VOLmax=0.4V
					VOHmin=
					0.9*SIM_VDD
					When SIM_VDD=1.8V
					VILmax=
					0.12*SIM_VDD
					VIHmin=
M10_HD_V3.0						- 23 -

M10 Hardware Design

				0.9*SIM_VDD
				VOLmax=
				0.12*SIM_VDD
				VOHmin=
				0.9*SIM_VDD
SIM_RST	15	O	SIM reset	When SIM_VDD=3V
				VILmax=0.36V
				VIHmin=
				0.9*SIM_VDD
				VOLmax=0.4V
				VOHmin=
				0.9*SIM_VDD
				When SIM_VDD=1.8V
				VILmax=
				0.12*SIM_VDD
				VIHmin=
				0.9*SIM_VDD
				VOLmax=
				0.12*SIM_VDD
				VOHmin=
				0.9*SIM_VDD
SIM_	11	I	SIM card detection	VILmax=0.67V	If unused, keep
PRESENCE				VIHmin=1.7V	this pin open.
AUX ADC
PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
	NO.			CHARACTERISTICS
ADC0	41	I	General purpose	Voltage range:	If unused, keep
ADC1	40	I	analog to digital	0V ~ 2.8V	this pin open.
			converter
RF interface
PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
	NO.			CHARACTERISTICS
RF_ANT	43	I/O	RF antenna pad	Impedance of 50Ω	Refer to Chapter
					4.
Other interfaces
PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
	NO.			CHARACTERISTICS
RESERVED	4,5,				Keep these pins
	39,53				open

M10_HD_V3.0

- 24 -