Quectel Wireless Solutions 201211M50 User Manual

Loading...
Quectel Wireless Solutions 201211M50 User Manual

M50

Quectel Cellular Engine

Hardware Design

M50_HD_V2.0

M50Hardware Design

 

Document Title

M50 Hardware Design

 

 

 

 

Revision

2.0

 

 

 

 

Date

2012-06-26

 

 

 

 

Status

Released

 

 

 

 

Document Control ID

M50_HD_V2.0

 

 

 

 

 

 

General Notes

 

 

 

Quectel offers this information as a

service to i s cus om rs, o support app ication

and

engineering efforts that use the products designed by Qu c l. The information provided is

based upon requirements specifically provided for

us om rs of Qu ct . Quectel has not

undertaken any independent sear h for additional informa ion, r l vant to any information

that may be in the customer’s possession. Furthermore, sys em validation of th s product

designed by Quect l within a larg r

l tronic system remains the respons b l y of

he

customer or the custom r’s syst m int

grator. All spe

ifi ations supplied herein are subject to

change.

 

 

 

Quecctel

ConfidentialCopyright

This doc ment contains proprietary technical information of Qu ct l Co., Ltd. Copying this document, distribution to others, and commun cat on of the co t ts th reof, are forbidden without permission. Offenders are liable to the paym nt of amag s. All rights are reserved in the event of a pate t gra t or registrat on of a utility mo el or design. All specifications supplied herein are subject to cha ge w thout not ce at any time.

Copyright © Shanghai Quectel Wireless Solutions Ltd. 2012.

M50_HD_V2.0

- 2 -

M50Hardware Design

 

 

 

 

 

Contents

 

Contents ...................................................................................................................................................

 

 

3

Table Index ..............................................................................................................................................

 

 

5

Figure Index ............................................................................................................................................

 

 

6

0. Revision history ..................................................................................................................................

 

 

8

1. Introduction .......................................................................................................................................

 

 

9

1.1. Related documents....................................................................................................................

 

9

1.2. Terms and abbreviations.........................................................................................................

10

1.3. Safety cautions........................................................................................................................

 

 

12

2. Product concept .............................................................................................................................

 

 

15

2.1. Key features ............................................................................................................................

 

 

15

Quecctel

 

2.2. Functional diagram.................................................................................................................

 

17

2.3. Evaluation board.....................................................................................................................

 

 

18

3. Application interface......................................................................................................................

 

 

19

3.1. Pin of module..........................................................................................................................

 

 

20

3.1.1. Pin assignm nt..............................................................................................................

 

20

Confidential3.9.1. UART Port....................................................................................................................42

3.1.2. Pin description..............................................................................................................

 

22

3.2. Operating mod s.....................................................................................................................

 

 

29

3.3. Power s pply...........................................................................................................................

 

 

30

3.3.1. Power f at

r s of module ............................................................................................

30

3.3.2. Decrease s

pply voltage drop......................................................................................

30

3.3.3. Reference design for power supply.............................................................................

31

3.3.4. Monitor power s

pply..................................................................................................

32

3.4. Power on and down scenarios................................................................................................

32

3.4.1. Power on .......................................................................................................................

 

 

32

3.4.2. Power down ..................................................................................................................

 

34

3.4.3. Restart ...........................................................................................................................

 

 

36

3.5. Charge interface......................................................................................................................

 

 

38

3.6. P wer saving...........................................................................................................................

 

 

38

3.6.1. Minimum fu cti

ality mode......................................................................................

38

3.6.2. SLEEP m de.................................................................................................................

 

39

3.6.3. Wake up m dule from SLEEP mode ..........................................................................

39

3.7. Summary of state transition ...................................................................................................

39

3.8. RTC backup.............................................................................................................................

 

 

40

3.9. Serial interfaces ......................................................................................................................

 

 

41

3.9.2. Debug Port ....................................................................................................................

 

 

46

3.9.3. Auxiliary UART Port...................................................................................................

46

3.9.4. UART application ........................................................................................................

47

3.10. Audio interfaces....................................................................................................................

 

 

50

3.10.1. Decrease TDD noise and other noise........................................................................

51

3.10.2. Microphone interfaces design....................................................................................

51

M50_HD_V2.0

 

 

- 3 -

M50Hardware Design

 

 

 

3.10.3. Receiver and speaker interface design......................................................................

52

3.10.4. Earphone interface design..........................................................................................

54

3.10.5. Loud speaker interface design...................................................................................

54

3.10.6. Audio characteristics..................................................................................................

55

3.11. SIM card interface ................................................................................................................

55

3.11.1. SIM card application..................................................................................................

55

3.11.2. 6 Pin SIM cassette ......................................................................................................

57

3.11.3. 8 Pin SIM cassette ......................................................................................................

58

3.12. SD card interface ..................................................................................................................

60

3.13. PCM interface.......................................................................................................................

 

62

3.13.1. Configuration..............................................................................................................

62

3.13.2. Timing

.........................................................................................................................

 

63

3.13.3. Reference design ........................................................................................................

64

3.13.4. AT command..............................................................................................................

64

Quecctel

 

3.14. ADC.......................................................................................................................................

 

 

66

3.15. Behaviors of the ...............................................................................................................RI

66

3.16. Network status .....................................................................................................indication

69

3.17. Operating status ..................................................................................................indication

69

Confidential

4. Antenna interface...........................................................................................................................

 

 

71

4.1. RF reference d ................................................................................................................sign

71

4.2. RF o tp t pow .....................................................................................................................r

 

72

4.3. RF receiving s ..........................................................................................................

nsitivity

72

4.4. Operating fr q .............................................................................................................

nci s

72

4.5. RF cable soldering..................................................................................................................

73

5. Electrical, reliability .........................................................................and radio character st cs

74

5.1. Absolute maximum ....................................................................................................ratings

74

5.2. Operating temperature............................................................................................................

74

5.3. Power supply rati ..............................................................................................................

gs

75

5.4. Current consumption ..............................................................................................................

76

5.5. Electro-static discharge ..........................................................................................................

78

6. Mechanical dime si ................................................................................................................

s

79

6.1. Mechanical dime ........................................................................................

si s of module

79

6.2. Rec mmended ..........................................................f

tpri t without bottom centre pads

81

6.4. T p view f the .........................................................................................................m

dule

82

6.5. Bottom view of ....................................................................................................the module

83

7. Storage and manufacturing.........................................................................................................

84

7.1. Storage.....................................................................................................................................

 

 

84

7.2. Soldering .................................................................................................................................

 

 

85

7.3. Packaging ................................................................................................................................

 

 

86

Appendix A: GPRS coding .............................................................................................schemes

87

Appendix B: GPRS multi ............................................................................................-slot classes

88

M50_HD_V2.0

- 4 -

M50Hardware Design

 

Table Index

 

TABLE 1: RELATED DOCUMENTS .....................................................................................................

9

TABLE 2: TERMS AND ABBREVIATIONS........................................................................................

10

TABLE 3: MODULE KEY FEATURES................................................................................................

15

TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE..17

TABLE 5: M50 PIN ASSIGNMENT .....................................................................................................

21

TABLE 6: PIN DESCRIPTION .............................................................................................................

22

TABLE 7: OVERVIEW OF OPERATING MODES..............................................................................

29

TABLE 8: PIN DEFINITION OF THE CHARGING............................................................................

38

TABLE 9: SUMMARY OF STATE TRANSITION...............................................................................

39

TABLE 10: LOGIC LEVELS OF THE UART INTERFACES..............................................................

42

Quecctel

 

TABLE 11: PIN DEFINITION OF THE UART INTERFACES............................................................

42

TABLE 12: PIN DEFINITION OF AUDIO INTERFACES ..................................................................

50

TABLE 13: AOUT3 OUTPUT CHARACTERISTICS..........................................................................

51

TABLE 14: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS.......................................

55

TABLE 15: TYPICAL SPEAKER CHARACTERISTICS....................................................................

55

ConfidentialTABLE 35: OPERATING TEMPERATURE.........................................................................................74

TABLE 16: PIN DEFINITION OF THE SIM INTERFACE .................................................................

56

TABLE 17: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER .........................................

58

TABLE 18: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER.................................................

59

TABLE 19: PIN DEFINITION OF THE SD CARD INTERFACE .......................................................

60

TABLE 20: PIN NAME OF THE SD CARD AND MICRO SD CARD...............................................

61

TABLE 21: PIN DEFINITION OF PCM INTERFACE.........................................................................

62

TABLE 22: CONFIGURATION ............................................................................................................

62

TABLE 23: PCMON COMMAND DESCRIPTION ..........................................................................

65

TABLE 24: PCMVOL COMMAND DESCRIPTION ........................................................................

65

TABLE 25: PIN DEFINITION OF THE ADC.......................................................................................

66

TABLE 26: CHARACTERISTICS OF THE ADC ................................................................................

66

TABLE 27: BEHAVIORS OF THE RI ..................................................................................................

66

TABLE 28: WORKING STATE OF THE NETLIGHT .........................................................................

69

TABLE 29: PIN DEFINITION OF THE STATUS.................................................................................

69

TABLE 30: PIN DEFINITION OF THE RF ANT................................................................................

71

TABLE 31: THE MODULE CONDUCTED RF OUTPUT POWER ....................................................

72

TABLE 32: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY....................................

72

TABLE 33: THE MODULE OPERATING FREQUENCIES................................................................

72

TABLE 34: ABSOLUTE MAXIMUM RATINGS.................................................................................

74

TABLE 36: THE MODULE POWER SUPPLY RATINGS ...................................................................

75

TABLE 37: THE MODULE CURRENT CONSUMPTION..................................................................

76

TABLE 38: THE ESD ENDURANCE (TEMPERATURE:25 ,HUMIDITY:45 %)............................

78

TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES ..................................................

87

TABLE 40: GPRS MULTI-SLOT CLASSES ........................................................................................

88

M50_HD_V2.0

- 5 -

M50Hardware Design

 

Figure Index

 

FIGURE 1: MODULE FUNCTIONAL DIAGRAM .............................................................................

18

FIGURE 2: PIN ASSIGNMENT............................................................................................................

20

FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING .............................................................

30

FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT............................................................

31

FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY..............................................................

31

FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT.................................................

32

FIGURE 7: TURN ON THE MODULE USING KEYSTROKE...........................................................

33

FIGURE 8: TIMING OF TURNING ON SYSTEM ..............................................................................

33

FIGURE 9: TIMING OF TURNING OFF THE MODULE...................................................................

34

FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT............

36

Quecctel

 

FIGURE 11: REFERENCE CIRCUIT FOR EMERG OFF BY USING BUTTON..............................

36

FIGURE 12: TIMING OF RESTARTING SYSTEM ............................................................................

37

FIGURE 13: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN..............

37

FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ...............................................

40

FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ....................................................

40

ConfidentialFIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER..............................................58

FIGURE 16: RTC SUPPLY FROM CAPACITOR ................................................................................

40

FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTICS.............................................

41

FIGURE 18: REFERENCE DESIGN FOR FULL-FUNCTION UART................................................

44

FIGURE 19: REFERENCE DESIGN FOR UART PORT .....................................................................

44

FIGURE 20: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL...

45

FIGURE 21: REFERENCE DESIGN FOR FIRMWARE UPGRADE..................................................

45

FIGURE 22: REFERENCE DESIGN FOR DEBUG PORT..................................................................

46

FIGURE 23: REFERENCE DESIGN FOR AUXILIARY UART PORT...............................................

47

FIGURE 24: LEVEL MATCH DESIGN FOR 3.3V SYSTEM..............................................................

47

FIGURE 25: LEVEL MATCH DESIGN FOR 5V SYSTEM.................................................................

48

FIGURE 26: LEVEL MATCH DESIGN FOR RS-232..........................................................................

49

FIGURE 27: REFERENCE DESIGN FOR AIN1&AIN2......................................................................

52

FIGURE 28: REFERENCE DESIGN FOR AOUT1..............................................................................

52

FIGURE 29: HANDSET INTERFACE DESIGN FOR AOUT2 ...........................................................

53

FIGURE 30: SPEAKER INTERFACE DESIGN WITH AN AMPLIFIER FOR AOUT2.....................

53

FIGURE 31: EARPHONE INTERFACE DESIGN ...............................................................................

54

FIGURE 32: LOUD SPEAKER INTERFACE DESIGN.......................................................................

54

FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD....................................................

56

FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD....................................................

57

FIGURE 36: MOLEX 91228 SIM CARD HOLDER ............................................................................

59

FIGURE 37: REFERENCE CIRCUIT OF SD CARD...........................................................................

60

FIGURE 38: LONG SYNCHRONIZATION & SIGN EXTENSION DIAGRAM ...............................

63

FIGURE 39: LONG SYNCHRONIZATION & ZERO PADDING DIAGRAM ...................................

63

FIGURE 40: SHORT SYNCHRONIZATION & SIGN EXTENSION DIAGRAM..............................

63

FIGURE 41: SHORT SYNCHRONIZATION & ZERO PADDING DIAGRAM .................................

64

M50_HD_V2.0

- 6 -

M50Hardware Design

 

FIGURE 42: REFERENCE DESIGN FOR PCM..................................................................................

64

FIGURE 43: RI BEHAVIOR OF VOICE CALLING AS A RECEIVER ..............................................

67

FIGURE 44: RI BEHAVIOR OF DATA CALLING AS A RECEIVER ................................................

67

FIGURE 45: RI BEHAVIOR AS ACALLER........................................................................................

67

FIGURE 46: RI BEHAVIOR OF URC OR SMS RECEIVED ..............................................................

68

FIGURE 47: REFERENCE DESIGN FOR NETLIGHT.......................................................................

69

FIGURE 48: REFERENCE DESIGN FOR STATUS ............................................................................

70

FIGURE 49: REFERENCE DESIGN FOR RF......................................................................................

71

FIGURE 50: RF SOLDERING SAMPLE..............................................................................................

73

FIGURE 51: M50 TOP AND SIDE DIMENSIONS ..............................................................................

79

FIGURE 52: M50 BOTTOM DIMENSIONS........................................................................................

80

FIGURE 53: RECOMMENDED FOOTPRINT WITHOUT BOTTOM CENTRE PADS ....................

81

FIGURE 55: TOP VIEW OF THE MODULE .......................................................................................

82

FIGURE 56: BOTTOM VIEW OF THE MODULE..............................................................................

83

Quecctel

 

FIGURE 57: PASTE APPLICATION ....................................................................................................

85

FIGURE 58: RAMP-SOAK-SPIKE REFLOW PROFILE ....................................................................

86

FIGURE 59: MODULE TRAY ..............................................................................................................

86

FIGURE 60: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ...........................................

87

Confidential

FIGURE 61: RADIO BLOCK STRUCTURE OF CS-4........................................................................

87

M50_HD_V2.0

- 7 -

M50Hardware Design

0. Revision history

 

Revision

Date

Author

Description of change

 

 

1.0

2011-12-20

Ray XU

Initial

 

 

 

 

 

 

 

 

 

1.1

2012-02-03

Ray XU

1.

Updated PCM interface

 

 

 

 

 

2.

Updated SD interface

 

 

 

 

 

3.

Updated charging interface

 

 

 

 

 

4.

Updated timing of turning on the module

 

 

1.2

2012-07-20

Baly BAO

1.

Deleted the USB interface

 

 

 

 

 

2.

Deleted the camera interface

 

 

 

 

 

 

 

 

 

1.3

2012-10-22

Mountain ZHOU

1.

Updated functional diagram

 

 

 

Quecctel

 

 

 

 

 

2.

Upda ed r f r nce d sign circuit

 

 

 

 

 

3.

Upda ed audio charact ristics

 

 

 

 

 

4.

Upda ed VRTC DC charact ristics

 

 

 

 

 

5.

Upda ed SLEEP curr nt consumption

 

 

 

 

 

6.

Upda ed in ernet service protocols

 

 

 

 

 

7.

Updated SIM pins’ name

 

 

 

Confidential

 

 

 

 

 

8.

Modified PCM function

 

 

 

 

 

9.

Deleted FAX fu ction

 

 

2.0

2012-06-16

Ray XU

1.

Update the module size

 

 

 

 

 

2.

Update the pin layout

 

M50_HD_V2.0

- 8 -

M50 Hardware Design

1. Introduction

This document defines the M50 module and describes the hardware interface of M50 which are connected with the customer application and the air interface.

This document can help customers quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customers can use M50module to design and set up mobile applications easily.

1.1. Related documents

 

 

Table 1: Related documents

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SN

QuecctelSpec cat on of the SIM Application Toolkit for the

 

 

 

 

Document name

Remark

 

 

 

 

 

 

 

 

[1]

M50 ATC

 

AT

ommands set

 

 

 

 

 

 

 

[2]

ITU-T

Draft

new Serial asyn hronous au oma ic dialing and control

 

 

 

Confidential

 

 

 

recommendation V.25t r

 

 

 

 

 

 

 

 

 

 

[3]

GSM 07.07

 

Digital

ellular tele ommunications (Phase

2+);

AT

 

 

 

 

 

ommand set for GSM Mobile Equipme

(ME)

 

 

 

[4]

GSM 07.10

 

Support GSM 07.10 multipl xi

g pro ocol

 

 

 

 

[5]

GSM 07.05

 

Digital cellular t l commu icatio s (Phase 2+); Use

 

 

 

 

 

of

Data T rminal Equipm

t

Data

Circuit

 

 

 

 

 

term nat ng Equipm nt (DTE

DCE)

i terface

for

 

 

 

 

 

Short Message S rvice (SMS) and Cell Broadcast

 

 

 

 

 

Serv ce (CBS)

 

 

 

 

 

 

 

[6]

GSM 11.14

 

D g tal

cellular telecommunications

(Phase

2+);

 

 

 

 

 

 

 

Subscriber Identity module – Mobile Equipment (SIM

 

 

 

 

 

– ME) interface

 

 

 

 

 

 

 

[7]

GSM 11.11

 

Digital cellular telecommunications (Phase 2+);

 

 

 

 

 

Specification of the Subscriber Identity module –

 

 

 

 

 

Mobile Equipment (SIM – ME) interface

 

 

 

 

[8]

GSM 03.38

 

Digital cellular telecommunications (Phase 2+);

 

 

 

 

 

Alphabets and language-specific information

 

 

 

 

[9]

GSM 11.10

 

Digital cellular telecommunications (Phase 2); Mobile

 

 

 

 

 

Station (MS) conformance specification; Part 1:

 

 

 

 

 

Conformance specification

 

 

 

 

 

 

 

[10]

GSM_UART_AN

UART port application note

 

 

 

 

 

 

 

[11]GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note

[12] M10_EVB_UGD

M10 EVB user guide

M50_HD_V2.0

- 9 -

M50 Hardware Design

1.2. Terms and abbreviations

Table 2: Terms and abbreviations

 

Abbreviation

Description

 

 

 

ADC

Analog-to-Digital Converter

 

 

AMR

Adaptive Multi-Rate

 

 

ARP

Antenna Reference Point

 

 

 

 

 

 

ASIC

Application Specific Integrated Circuit

 

 

BER

Bit Error Rate

 

 

 

BOM

Bill Of Material

 

 

 

BTS

Base Transceiver Station

 

 

Quecctel

 

 

CHAP

Challenge Handshake Authentication Pro ocol

 

 

CS

Coding Scheme

 

 

 

CSD

Circuit Switched Data

 

 

CTS

Clear To Send

 

 

 

DAC

Digital-to-Analog Converter

 

 

Confidential

 

 

DRX

Discontinuous R

ption

 

 

DSP

Digital Signal Pro

ssor

 

 

DCE

Data Comm ni ations Equipment (typically module)

 

 

DTE

Data T rminal Equipm nt (typically comput r, xt r al co roller)

 

 

DTR

Data T rminal R ady

 

 

DTX

Discontin o s Transmission

 

 

EFR

Enhanced F ll Rate

 

 

 

EGSM

Enhanced GSM

 

 

 

EMC

Electromagnetic Compat b l ty

 

 

ESD

Electrostatic Discharge

 

 

ETS

Eur pean Telecommu cat on Standard

 

 

FCC

Federal C mmu icatio s Commission (U.S.)

 

 

FDMA

Freque cy Division Multiple Access

 

 

FR

Full Rate

 

 

 

GMSK

Gaussian Minimum Shift Keying

 

 

GPRS

General Packet Radio Service

 

 

GSM

Global System for Mobile Communications

 

 

 

 

 

 

 

HR

Half Rate

 

 

 

I/O

Input/Output

 

 

 

IC

Integrated Circuit

 

 

 

 

 

 

 

IMEI

International Mobile Equipment Identity

 

 

Imax

Maximum Load Current

 

 

 

 

 

 

 

Inorm

Normal Current

 

 

 

kbps

Kilo Bits Per Second

 

 

LED

Light Emitting Diode

 

 

M50_HD_V2.0

 

- 10 -

 

M50 Hardware Design

 

Li-Ion

Lithium-Ion

 

 

MO

Mobile Originated

 

 

MS

Mobile Station (GSM engine)

 

 

MT

Mobile Terminated

 

 

 

 

 

 

PAP

Password Authentication Protocol

 

 

PBCCH

Packet Switched Broadcast Control Channel

 

 

PCB

Printed Circuit Board

 

 

PDU

Protocol Data Unit

 

 

PPP

Point-to-Point Protocol

 

 

RF

Radio Frequency

 

 

RMS

Root Mean Square (value)

 

 

RTC

Real Time Clock

 

 

RX

Receive Direction

 

 

 

 

 

 

VILmax

QuecctelMaximum I put Low Level Voltage Value

 

 

SIM

Subscriber Identification Module

 

 

SMS

Short Message Service

 

 

TDMA

Time Division Multiple A ess

 

 

TE

Terminal Equipment

 

 

TX

Confidential

 

 

Transmitting Dir tion

 

 

UART

Univ rsal Asyn hronous Re eiver & Transmitter

 

 

URC

Unsolicit d R sult Code

 

 

USSD

Unstr ct r d Suppl m ntary Service Data

 

 

VSWR

Voltage Standing Wave Ratio

 

 

Vmax

Maxim m Voltage Value

 

 

Vnorm

Normal Voltage Value

 

 

Vmin

Minimum Voltage Value

 

 

VIHmax

Maximum Input H gh Level Voltage Value

 

 

VIHmin

Mi imum I put High Level Voltage Value

 

 

 

 

 

 

VILmin

Mi imum I put Low Level Voltage Value

 

 

VImax

Abs lute Maximum I put Voltage Value

 

 

VImin

Abs lute Mi imum I put Voltage Value

 

 

VOHmax

Maximum Output High Level Voltage Value

 

 

VOHmin

Minimum Output High Level Voltage Value

 

 

VOLmax

Maximum Output Low Level Voltage Value

 

 

VOLmin

Minimum Output Low Level Voltage Value

 

 

Phonebook abbreviations

 

 

LD

SIM Last Dialing phonebook (list of numbers most recently dialed)

 

 

MC

Mobile Equipment list of unanswered MT Calls (missed calls)

 

 

ON

SIM (or ME) Own Numbers (MSISDNs) list

 

 

RC

Mobile Equipment list of Received Calls

 

 

SM

SIM phonebook

 

 

 

 

 

M50_HD_V2.0

- 11 -

M50 Hardware Design

1.3. Safety cautions

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M50module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions about the

use of mobile. Switch the cellular terminal or mobile off. Medical equipment may

Quecctel

 

be sensitive to not operate normally for RF

n rgy int rf r nce.

 

Switch off the cellular terminal or mobile b

fore boarding an aircraft. Make sure

it switched off. The operation of wireless applianc s in an aircraft is forbidden to

prevent interferen e with

ommuni a ion sys

ms. Forg t to think much of these

Confidential

instructions may l ad to the flight safe y or offend against local legal

c on, or

both.

 

 

 

 

 

 

Do not op rate the c llular terminal or mobile in the pr s

ce of flammable gas

or f me. Switch off the c llular terminal wh

n you are

ar pe rol s a ion, fuel

depot, chemical plant or where blasting op

ratio s are in progress. Operation of

any electrical equipment

n potent ally xplosive atmosph re can co

stitute a

safety hazard.

 

 

 

 

 

Y

ur cellular termi al or mob le receives and transmits radio frequency energy

while switched on. RF i ter erence can occur if it is used close to TV set, radio,

c

mputer r

ther electric equipment.

 

 

 

 

R

ad safety c

mes first! Do not use a hand-held cellular terminal or mobile while

driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

M50_HD_V2.0

- 12 -

M50 Hardware Design

GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call.

QuecctelAlso, some networks require that a valid SIM card be prop r y inserted in cellular terminal or mobile.

According to the R&TTE Dire tive 1999/95/CE, all wir l ss quipment and

Confidentialtelecommunications terminals sold in EU must m t all the stipulated he lth, safety RF, EMC requirements that provide for CE mark. Quectel Module M50

is fully in accordan with all the dire tives of EU.

1.4. Directives and standards

The M50 mod le is designed to comply with the FCC stat m nts. FCC ID: XMR201211M50. The Host system sing M50, should have label n cated contains FCC ID: XMR201211M50.

1.4.1. FCC Stateme t

1. This device c mplies with Part 15 of the FCC rules. Operation is subject to the following conditi ns:

a) This device may t cause harmful interference.

b)This device must accept any interference received, including interference that may cause undesired perati n.

2.hanges or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

1.4.2. FCC Radiation exposure statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage.

M50_HD_V2.0

- 13 -

M50 Hardware Design

The manual of the host system, which uses M50, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M50 module depending on the Mobile status.

The following list of antenna is indicating the maximum permissible antenna gain.

 

Type

 

Maximum Gain

 

Maximum Gain

Impedance

 

 

 

 

(850Hz/900Hz)

 

(1800Hz/1900Hz)

 

 

 

External

Monopole

0.5dBi

 

2dBi

50Ω

 

 

Antenna

Vehicular antenna

0.5dBi

 

2dBi

50Ω

 

 

Internal

Monopole

0.5dBi

 

2dBi

50Ω

 

 

Antenna

PIFA

0.5dBi

 

2dBi

50Ω

 

 

 

FPC

0.5dBi

 

2dBi

50Ω

 

 

 

Quecctel

50Ω

 

 

 

PCB

0.5dBi

 

2dBi

 

 

This radio module must not be installed

o o-locate and operate simu

 

ltaneously with oth r radios in host sys em;

 

 

Confidential

additional testing and quipm nt authorization may be requ red o op erating sim ltan o sly with oth r radios.

M50_HD_V2.0

- 14 -

M50 Hardware Design

2. Product concept

M50 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M50 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix A and Appendix B.

With a tiny profile of 24.5mm×25.3mm×2.6mm, the module can meet almost all the requirements for M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA, Smart Metering, and Remote Maintenance & Control etc.

 

M50 is an SMD type

module with LCC package, which

can be

mb dd d in customer’s

QuecctelTable 3: Module key features

 

applications. It provides abundant hardware interfaces be w

n he modu

and customer’s host

 

board.

 

 

 

 

 

 

 

 

Designed with power saving technique, the urrent onsump ion of M50 is as low as 1.3 mA in

 

SLEEP mode when DRX is 5.

 

 

 

 

 

Confidential

 

M50 is integrated with Int rn t s rvi

proto ols, su h as TCP, UDP, FTP a d PPP. Ex ended AT

 

commands have been d v lop d for

ustom r to use these Internet service protocols eas ly.

 

The mod le f lly compli s with the RoHS directive of the Europ an U

ion.

 

 

 

2.1. Key features

 

 

 

 

 

 

 

 

Feature

 

Description

 

 

 

 

 

Power supply

 

Si gle supply voltage 3.3V~ 4.6V

 

 

 

 

 

 

 

Typical supply voltage 4.0V

 

 

 

 

 

Power saving

 

Typical power consumption in SLEEP mode:

1.3 mA@ DRX=5

 

 

 

 

 

 

 

 

1.2 mA@ DRX=9

 

 

Frequency bands

 

Quad-band: GSM850, GSM900, DCS1800, PCS1900.

 

 

 

 

The module can search these frequency bands automatically

 

 

 

 

The frequency bands can be set by AT command.

 

 

 

 

Compliant with GSM Phase 2/2+

 

 

 

 

GSM class

 

Small MS

 

 

 

 

 

Transmitting power

 

Class 4 (2W) at GSM850 and GSM900

 

 

 

 

 

Class 1 (1W) at DCS1800 and PCS1900

 

 

 

 

 

 

 

 

 

 

GPRS connectivity

 

GPRS multi-slot class 12

(default)

 

 

 

 

 

GPRS multi-slot class 1~12

(configurable)

 

 

 

 

GPRS mobile station class B

 

 

 

 

 

M50_HD_V2.0

 

 

 

 

 

- 15 -

 

M50 Hardware Design

 

Temperature range

Normal operation: -35°C ~ +80°C

 

 

 

Restricted operation: -40°C ~ -35°C and +80°C ~ +85°C 1)

 

 

 

Storage temperature: -45°C ~ +90°C

 

 

DATA GPRS:

GPRS data downlink transfer: max. 85.6 kbps

 

 

 

GPRS data uplink transfer: max. 85.6 kbps

 

 

 

Coding scheme: CS-1, CS-2, CS-3 and CS-4

 

 

 

Support the protocols PAP (Password Authentication Protocol)

 

 

 

 

usually used for PPP connections

 

 

 

Internet service protocols

 

 

 

 

TCP/UDP/FTP/PPP/HTTP/NTP/PING

 

 

Quecctel

 

 

 

Support Packet Broadcast Control Channel (PBCCH)

 

 

CSD:

CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent

 

 

 

Support Unstructured Suppl m n ary S rvice Data (USSD)

 

 

SMS

Text and PDU mode

 

 

 

SMS storage: SIM ard

 

 

SIM interface

Support SIM card: 1.8V, 3V

 

 

Audio features

Spee h odec modes:

 

 

 

Half Rate (ETS 06.20)

 

 

ConfidentialSIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99

 

 

 

Full Rate (ETS 06.10)

 

 

 

Enhan d Full Rate (ETS 06.50 / 06.60 / 06.80)

 

 

 

Adaptive Multi-Rate (AMR)

 

 

 

Echo Suppression

 

 

 

Echo Canc llation

 

 

 

Noise Re uction

 

 

 

Embedded one ampl fi r of class AB with maximum driving

 

 

 

 

power up to 800mW

 

 

UART interfaces

UART Port:

 

 

 

Seven l es on UART port interface

 

 

 

Used or AT comman , GPRS ata and CSD data

 

 

 

Multiplexing unction

 

 

 

Support autobauding from 4800 bps to 115200 bps

 

 

 

Debug Port:

 

 

 

Two lines on debug port interface DBG TXD and DBG RXD

 

 

 

Debug Port only used for firmware debugging

 

 

 

Auxiliary Port:

 

 

 

Used for AT command

 

 

Phonebook management

Support phonebook types: SM, ME, ON, MC, RC, DC, LD, LA

 

 

 

 

 

 

Real time clock

Supported

 

 

Physical characteristics

Size:

 

 

 

 

24.5 (±0.15) × 25.3 (±0.15) × 2.6 (±0.2) mm

 

 

 

Weight: 3.3g

 

 

Firmware upgrade

Firmware upgrade via UART Port

 

 

M50_HD_V2.0

 

- 16 -

 

M50 Hardware Design

Antenna interface

Connected to antenna pad with 50 Ohm impedance control

 

 

1 When the module works in this temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased.

Table 4: Coding schemes and maximum net data rates over air interface

 

Coding scheme

 

1 Timeslot

2 Timeslot

 

4 Timeslot

 

 

CS-1

 

 

9.05kbps

18.1kbps

 

36.2kbps

 

 

CS-2

 

 

13.4kbps

26.8kbps

 

53.6kbps

 

 

 

 

 

 

 

 

 

 

 

CS-3

 

 

15.6kbps

31.2kbps

 

62.4kbps

 

 

CS-4

 

 

21.4kbps

42.8kbps

 

85.6kbps

 

 

Quecctel

 

 

2.2. Functional diagram

 

 

 

 

Confidential

 

The following figure shows a blo k diagram of the M50 module

and illus ra es he m jor

 

functional parts:

 

 

 

 

 

 

 

Power manag m nt

 

 

 

 

 

Baseband

 

 

 

 

 

 

 

Serial Flash

 

 

 

 

 

The radio freq ency part

 

 

 

 

 

The peripheral interface

 

 

 

 

 

 

—Charge interface

 

 

 

 

 

 

—PCM interface

 

 

 

 

 

 

—SD interface

 

 

 

 

 

 

—SIM interface

 

 

 

 

 

 

—Audio i

terface

 

 

 

 

 

 

—Serial i

terface

 

 

 

 

—P wer supply

—RF interface

—ADC

—Turn on/off interface (PWRKEY & EMERG OFF)

M50_HD_V2.0

- 17 -

M50 Hardware Design

RF_ANT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ESD

 

 

 

 

RF

PAM

 

 

 

SAW

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Filter

 

 

 

 

 

 

 

VBAT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Charge

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Charge

 

 

 

 

 

 

 

RF Transceiver

 

 

26MHz

 

 

 

 

Interface

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PWRKEY

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EMERG_OFF

 

 

 

 

 

 

 

 

 

 

 

 

 

Reset

 

 

 

 

 

 

 

 

 

 

 

 

 

SD

 

 

 

 

 

 

SD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VRTC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Interface

 

 

 

 

 

 

Interface

 

 

 

 

 

 

 

 

 

 

 

RTC

PMU

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

32KHz

 

 

 

 

 

 

 

 

BB&RF

 

 

 

 

 

 

 

 

 

 

SIM

 

 

 

 

 

 

 

 

 

 

 

SIM

 

 

 

 

 

 

PCM

 

 

 

 

 

 

PCM

2.3. Evaluation

Quecctelboard

 

 

 

 

 

 

Inteface

Interface

 

 

 

 

 

 

 

 

Interface

 

 

 

 

 

 

 

 

 

 

 

 

 

In rface

 

 

 

 

 

 

STATUS&

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GPIO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NETLIGHT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADC

 

 

 

 

 

 

ADC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

UART

 

 

 

 

 

 

 

 

 

 

S rial

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Confidential

 

 

 

 

 

 

 

 

 

Int rface

 

 

 

 

 

 

 

Memory

 

 

 

 

 

Audio

 

 

 

 

 

 

Aud o

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Interfa e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Serial

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Flash

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 1: Mo ule unct onal

iagram

 

 

 

 

 

 

 

In order to help cust

 

mer to develop appl cat ons w th M50 , Quectel supplies an evaluation board

(EVB), RS-232 to USB cable, power adapter, earphone, antenna and other peripherals to control

or test the m dule. F

 

r details, please refer to the document [12].

 

 

 

 

 

 

 

M50_HD_V2.0

- 18 -

M50 Hardware Design

3. Application interface

The module is equipped with 83-pin SMT pads and it adopts LCC package. Detailed descriptions on Sub-interfaces included in these pads are given in the following chapters:

Power supply Power on/down Charge interface RTC

Serial interfaces Audio interfaces SIM interface

QuecctelSD interface PCM interface

ADC

Confidential

M50_HD_V2.0

- 19 -

M50 Hardware Design

3.1. Pin of module

3.1.1. Pin assignment

 

 

 

RESERVED

RESERVED

RESERVED

RESERVED

VBAT

VBAT

VBAT

VBAT

GND

GND

GND

RF ANT

GND

GND

VDD EXT

VRTC

RESERVED

SIM PRESENCE

 

 

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

 

58

 

57

 

 

 

 

 

ADC1

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SIM1_VDD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

56

Quecctel

 

 

 

55

 

ADC0

2

 

 

 

 

 

 

 

 

 

 

 

 

Top view

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SIM1_DATA

RESERVED

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

54

SIM1_CLK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NETLIGHT

4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

53

SIM1_RST

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SPK2P

5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

52

SIM1_GND

AGND

6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

51

TXD

 

Confidential

MIC2P

7

 

 

 

 

 

 

 

 

 

 

 

 

GND

 

 

 

 

 

 

 

 

 

 

 

 

50

RXD

MIC2N

8

 

 

 

 

 

 

 

 

 

 

 

 

82

 

 

 

 

 

 

 

 

 

 

 

 

49

RTS

MIC1P

9

 

 

 

 

 

RESERVED 75

 

 

 

 

81 GND

 

 

 

 

 

 

 

 

 

 

 

48

CTS

MIC1N 10

 

 

 

 

 

RESERVED 76

 

83

 

80 GND

 

 

 

 

 

 

 

 

47

DTR

SPK1N 11

 

 

 

 

 

RESERVED 77

 

 

 

 

79 GND

 

 

 

 

 

 

 

 

46

RI

SPK1P 12

 

 

 

 

 

 

 

 

 

 

 

 

78

 

 

 

 

 

 

 

 

 

 

 

 

45

DCD

LOUDSPKN 13

 

 

 

 

 

 

 

 

 

 

 

 

RESERVED

 

 

 

 

 

 

 

 

 

 

 

44

RESERVED

LOUDSPKP 14

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

43

DBG RXD

STATUS 15

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

42

DBG TXD

PWRKEY 16

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

41

RXD AUX

EMERG OFF 17

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

40

TXD AUX

PCM IN 18

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

39

RESERVED

PCM CLK

19

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

38

RESERVED

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

 

 

 

 

 

 

 

 

PCM OUT

PCM SYNC

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

SD CMD

SD CLK

SD DATA0

GND

 

 

 

VBAT

Other

 

GND

 

RF

 

PCM

 

 

UART

 

 

 

ADC

 

 

 

Power

SIM

 

Reserved

 

SD

 

Audio

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 2: Pin assignment

M50_HD_V2.0

- 20 -

M50 Hardware Design

Table 5: M50 pin assignment

 

 

 

/

 

 

 

/

 

 

1

ADC1

I

 

2

ADC0

I

 

 

 

 

 

 

 

 

 

 

 

3

RESERVED

 

 

4

NETLIGHT

O

 

 

5

SPK2P

O

 

6

AGND

 

 

 

7

MIC2P

I

 

8

MIC2N

I

 

 

9

MIC1P

I

 

10

MIC1N

I

 

 

11

SPK1N

O

 

12

SPK1P

O

 

 

 

 

 

 

 

 

 

 

 

13

LOUDSPKN

O

 

14

LOUDSPKP

O

 

 

15

STATUS

O

 

16

PWRKEY

I

 

 

17

EMERG_OFF

I

 

18

PCM_IN

I

 

 

45

QuecctelDCD O 46 RI

O

 

 

19

PCM CLK

O

20

PCM OUT

O

 

 

21

PCM SYNC

O

22

RESERVED

 

 

 

23

RESERVED

 

24

RESERVED

 

 

 

25

RESERVED

 

26

RESERVED

 

 

 

27

RESERVED

 

28

RESERVED

 

 

 

61

ConfidentialGND 62 GND

 

 

29

RESERVED

 

30

RESERVED

 

 

 

31

RESERVED

 

32

RESERVED

 

 

 

33

RESERVED

 

34

SD CMD

O

 

 

35

SD CLK

O

36

SD DATA0

I/O

 

 

37

GND

 

38

RESERVED

 

 

 

39

RESERVED

 

40

TXD AUX

O

 

 

41

RXD AUX

I

42

DBG TXD

O

 

 

43

DBG RXD

I

44

RESERVED

 

 

 

47

DTR

I

 

48

CTS

O

 

 

49

RTS

I

50

RXD

I

 

 

 

 

 

 

 

 

 

 

 

51

TXD

O

 

52

SIM GND

 

 

 

53

SIM RST

O

 

54

SIM CLK

O

 

 

55

SIM DATA

I/O

 

56

SIM VDD

O

 

 

57

SIM PRESENCE

I

 

58

RESERVED

 

 

 

59

VRTC

I/O

 

60

VDD EXT

O

 

 

 

 

 

 

 

 

 

 

 

63

RF_ANT

I/O

 

64

GND

 

 

 

65

GND

 

 

66

GND

 

 

 

67

VBAT

I

 

68

VBAT

I

 

 

69

VBAT

I

 

70

VBAT

I

 

 

71

RESERVED

 

72

RESERVED

 

 

 

M50_HD_V2.0

 

 

 

 

- 21 -

 

M50 Hardware Design

73

RESERVED

 

 

74

RESERVED

 

75

RESERVED

 

 

76

RESERVED

 

77

RESERVED

 

 

78

RESERVED

 

 

 

 

 

 

 

 

79

GND

 

 

80

GND

 

81

GND

 

 

82

GND

 

83

GND

 

 

 

 

 

 

 

 

 

 

 

 

Note: Keep all reserved pins open.

3.1.2. Pin description

 

Table 6: Pin description

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quecctel

 

 

 

Power supply

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

VBAT

Confidential

 

 

67,

I

Main pow r supply

Vmax= 4.6V

Make sure th t

 

 

 

68,

 

of modul :

Vmin=3.3V

supply suff c ent

 

 

 

69

 

VBAT=3.3V~4.6V

Vnorm=4.0V

curre

n

 

 

 

70

 

 

 

ra sm

ng

 

 

 

 

 

 

 

burst wh ch

 

 

 

 

 

 

 

ypically rises to

 

 

 

 

 

 

 

1.6A.

 

 

 

VRTC

59

I/O

Power supply for

VImax=3.3V

If u used, keep

 

 

 

 

 

RTC when VBAT s

VImin=1.5V

this pin open.

 

 

 

 

 

not suppl ed or the

VInorm=2.8V

 

 

 

 

 

 

 

system.

VOmax=2.85V

 

 

 

 

 

 

 

Charg g or backup

VOmin=2.6V

 

 

 

 

 

 

 

battery or golden

VOnorm=2.8V

 

 

 

 

 

 

 

capacitor when the

Iout(max)= 1mA

 

 

 

 

 

 

 

VBAT is supplied.

Iin=2.6~5 uA

 

 

 

 

VDD EXT

60

O

Supply 2.8V voltage

Vmax=2.9V

1. If unused,

 

 

 

 

 

for external circuit.

Vmin=2.7V

keep this pin

 

 

 

 

 

 

Vnorm=2.8V

open.

 

 

 

 

 

 

 

Imax=20mA

2. Recommended

 

 

 

 

 

 

 

to add a

 

 

 

 

 

 

 

 

2.2~4.7uF

 

 

 

 

 

 

 

bypass capacitor

 

 

 

 

 

 

 

when supplying

 

 

 

 

 

 

 

power for

 

 

 

 

 

 

 

external circuit.

 

 

GND

37,

 

Ground

 

 

 

 

 

 

61,

 

 

 

 

 

 

 

M50_HD_V2.0

 

 

 

 

 

- 22 -

 

 

M50 Hardware Design

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

62,

 

 

 

 

 

 

 

 

 

64,

 

 

 

 

 

 

 

 

 

65,

 

 

 

 

 

 

 

 

 

66,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Turn on/off

 

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

 

PWRKEY

15

I

Turn on/off control.

VILmax=

Pulled up to

 

 

 

 

 

PWRKEY should be

0.1×VBAT

VBAT internally.

 

 

 

 

 

pulled down for a

VIHmin=

 

 

 

 

 

 

 

 

moment to turn on

0.6×VBAT

 

 

 

 

 

 

 

 

or off the system.

VImax=VBAT

 

 

 

 

 

Emergency shutdown

 

 

 

 

 

 

 

 

 

Quecctel

COMMENT

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

 

EMERG OFF

17

I

Emergency off.

VILmax=0.4V

Open

 

 

 

 

 

 

 

Pulled down for at

VIHmin=2.2V

drain/collector

 

 

 

Confidential

 

 

 

 

 

l ast 20ms, whi h

Vopenmax=2.8V

dr ver requ red n

 

 

 

 

 

will turn off the

 

cellular dev ce

 

 

 

 

 

module in ase of

 

appl ca

on.

 

 

 

 

 

m rg n y. Use it

 

If u used, keep

 

 

 

 

 

only wh n normal

 

h s p

open.

 

 

 

 

 

shutdown through

 

 

 

 

 

 

 

 

 

PWRKEY or AT

 

 

 

 

 

 

 

 

 

command cannot

 

 

 

 

 

 

 

 

 

per orm well.

 

 

 

 

 

 

Module indicator

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

 

STATUS

16

O

I dicate module

VOHmin=

If unused, keep

 

 

 

 

 

operati g status.

0.85×VDD EXT

this pin open.

 

 

 

 

 

High level indicates

VOLmax=

 

 

 

 

 

 

 

 

module is power-on

0.15×VDD EXT

 

 

 

 

 

 

 

 

and low level

 

 

 

 

 

 

 

 

 

indicates

 

 

 

 

 

 

 

 

 

power-down.

 

 

 

 

 

 

Audio interface

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

 

MIC1P

9, 10

I

Channel one for

 

If unused, keep

 

 

MIC1N

 

 

positive and

 

these pins open.

 

 

 

 

 

negative voice-band

 

 

 

 

 

 

 

 

 

input

 

 

 

 

 

 

M50_HD_V2.0

 

 

 

 

 

- 23 -

 

 

M50 Hardware Design

 

MIC2P

7, 8

I

Channel two for

 

 

 

 

 

MIC2N

 

 

positive and

 

 

 

 

 

 

 

 

negative voice-band

 

 

 

 

 

 

 

 

input

 

 

 

 

 

 

 

 

 

 

 

 

 

SPK1P

12, 11

O

Channel one for

 

1. If unused,

 

 

SPK1N

 

 

positive and

 

keep these pins

 

 

 

 

 

negative voice-band

 

open.

 

 

 

 

 

 

output

 

2. Support both

 

 

SPK2P

5

O

Channel two for

 

voice and

 

 

 

 

 

voice-band output

 

ringtone output.

 

 

AGND

6

 

Analog ground.

 

 

 

 

 

 

 

 

Constitute a pseudo

 

 

 

 

 

 

 

 

differential channel

 

 

 

 

 

 

Quecctel

 

 

 

 

 

 

 

with SPK2P.

 

 

 

 

 

LOUDSPKN

13,

O

Channel three of

 

1. If unused,

 

 

LOUDSPKP

14

 

positive and

 

keep these pins

 

 

 

 

 

negative voi e-band

 

open.

 

 

 

 

 

 

output

 

2. Embedded

 

 

 

ConfidentialVIHmin= recommend

 

 

 

 

 

 

 

ampl f er of cl ss

 

 

 

 

 

 

 

AB n ern lly.

 

 

 

 

 

 

 

3. Support bo h

 

 

 

 

 

 

 

vo ce a

d

 

 

 

 

 

 

 

ri g o

e ou put.

 

 

Net status indicator

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

NETLIGHT

4

O

Network status

VOHmin=

If unused, keep

 

 

 

 

 

i dicat on

0.85×VDD EXT

this pin open.

 

 

 

 

 

 

VOLmax=

 

 

 

 

 

 

 

 

0.15×VDD EXT

 

 

 

 

UART P rt

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

DTR

47

I

Data terminal ready

VILmin=0V

If only use TXD,

 

 

 

 

 

 

VILmax=

RXD and GND

 

 

RXD

50

I

Receive data

 

 

TXD

49

O

Transmit data

0.25×VDD EXT

to communicate,

 

 

 

 

 

 

 

RTS

51

I

Request to send

0.75×VDD_EXT

pulling down

 

 

 

 

 

 

 

 

CTS

48

O

Clear to send

 

 

 

 

 

 

VIHmax=

RTS and keeping

 

 

RI

46

O

Ring indicator

 

 

VDD_EXT+0.3

other pins open.

 

 

 

 

 

 

 

 

DCD

45

O

Data carrier

 

 

VOHmin=

 

 

 

 

 

 

 

detection

 

 

 

 

 

 

 

0.85×VDD_EXT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

M50_HD_V2.0

 

 

 

 

 

- 24 -

 

M50 Hardware Design

 

 

 

 

 

0.15×VDD_EXT

 

 

 

 

 

 

 

 

 

 

 

Debug Port

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

DBG_TXD

42

O

UART interface for

VILmin=0V

If unused, keep

 

 

 

 

 

debugging only.

VILmax=

these pins open.

 

 

 

 

 

 

0.25×VDD_EXT

 

 

 

 

 

 

 

VIHmin=

 

 

 

 

 

 

 

0.75×VDD_EXT

 

 

 

DBG_RXD

43

I

 

VIHmax=

 

 

 

 

 

 

 

VDD_EXT+0.3

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

Quecctel

 

 

 

 

 

 

 

0.85×VDD EXT

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

 

 

 

0.15×VDD EXT

 

 

 

Auxiliary UART Port

 

 

 

 

 

 

PIN NAME

PIN

Confidential1.8V or 3V. protected against

 

 

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

TXD AUX

40

O

Transmit data

VILmin=0V

If u used, keep

 

 

 

 

 

 

VILmax=

hese p ns open.

 

 

 

 

 

 

0.25×VDD EXT

 

 

 

 

 

 

 

VIHmin=

 

 

 

RXD AUX

41

I

Rece ve data

0.75×VDD EXT

 

 

 

 

 

 

 

VIHmax=

 

 

 

 

 

 

 

VDD EXT+0.3

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

0.85×VDD EXT

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

 

 

 

0.15×VDD EXT

 

 

 

SIM interface

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

SIM VDD

56

O

Power supply for

The voltage can be

All signals of

 

 

 

 

 

SIM card

selected by firmware

SIM interface

 

 

 

 

 

 

automatically. Either

should be

 

 

 

 

 

 

 

ESD with a TVS

 

 

SIM_DATA

54

I/O

SIM data

3V

 

 

 

 

 

 

VOLmax=0.4

diode array.

 

 

 

 

 

 

VOHmin=

Maximum cable

 

 

 

 

 

 

SIM_VDD-0.4

length is 200mm

 

 

 

 

 

 

1.8V:

from the module

 

 

 

 

 

 

VOLmax=

pad to SIM card

 

 

M50_HD_V2.0

 

 

 

 

- 25 -

 

M50 Hardware Design

 

 

 

 

 

 

0.15×SIM_VDD

holder.

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

SIM_VDD-0.4

 

 

 

SIM_CLK

55

O

SIM clock

3V

 

 

 

 

 

 

 

 

VOLmax=0.4

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

0.9×SIM_VDD

 

 

 

 

 

 

 

 

1.8V:

 

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

 

 

 

 

0.12×SIM_VDD

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

0.9×SIM_VDD

 

 

 

SIM_RST

53

O

SIM reset

3V

 

 

 

 

QuecctelVDD EXT+0.3

 

 

 

 

 

 

 

 

VOLmax=0.36

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

0.9×SIM VDD

 

 

 

 

 

 

 

 

1.8V:

 

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

Confidential

 

 

 

 

 

 

 

0.2×SIM VDD

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

0.9×SIM VDD

 

 

 

SIM GND

52

 

SIM ground

 

 

 

 

SIM PRESEN

57

I

SIM card detection

VILmin=0V

If u used, keep

 

 

CE

 

 

 

 

VILmax=

this pin open.

 

 

 

 

 

 

 

0.25×VDD EXT

 

 

 

 

 

 

 

 

VIHmin=

 

 

 

 

 

 

 

 

0.75×VDD EXT

 

 

 

 

 

 

 

 

VIHmax=

 

 

 

ADC

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

AD

0

2

I

General purpose

Voltage range: 0V to

Please give

 

 

 

 

 

 

analog to digital

2.8V

priority to the

 

 

 

 

 

 

converter.

 

use of ADC0.

 

 

AD

1

1

I

General purpose

Voltage range: 0V to

If unused, keep

 

 

 

 

 

 

analog to digital

2.8V

these pins open.

 

 

 

 

 

 

converter.

 

 

 

 

 

 

 

 

 

 

 

 

PCM

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

PCM_CLK

19

O

PCM clock

VILmin=0V

 

 

 

PCM_IN

18

I

PCM data input

VILmax=

 

 

 

M50_HD_V2.0

 

 

 

 

- 26 -

 

M50 Hardware Design

 

PCM_OUT

20

O

PCM data output

0.25×VDD_EXT

 

 

 

 

PCM_SYNC

21

O

PCM frame

VIHmin=

 

 

 

 

 

 

 

synchronization

0.75×VDD_EXT

 

 

 

 

 

 

 

 

VIHmax=

 

 

 

 

 

 

 

 

VDD_EXT+0.3

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

0.85×VDD_EXT

 

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

 

 

 

 

0.15×VDD_EXT

 

 

 

 

SD card

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

SD_CMD

34

O

SD command

VILmin=0V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Quecctel

 

 

 

 

SD CLK

35

O

SD clock

VILmax=

 

 

 

 

SD DATA0

36

I/O

SD data

0.25×VDD EXT

 

 

 

 

 

 

 

 

VIHmin=

 

 

 

 

 

 

 

 

0.75×VDD EXT

 

 

 

 

 

 

 

 

VIHmax=

 

 

 

 

 

Confidential

 

 

 

 

 

 

VDD EXT+0.3

 

 

 

 

 

 

 

 

VOHmin=

 

 

 

 

 

 

 

 

0.85×VDD EXT

 

 

 

 

 

 

 

 

VOLmax=

 

 

 

 

 

 

 

 

0.15×VDD EXT

 

 

 

 

RF interface

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

RF ANT

63

I/O

RF antenna pad

Imp ance of 50Ω

 

 

 

 

Other interface

 

 

 

 

 

 

 

 

PIN NAME

PIN

I/O

DESCRIPTION

DC

COMMENT

 

 

 

 

NO.

 

 

CHARACTERISTICS

 

 

 

 

DOWNLOAD

3

I

 

VILmin=0V

Keep this

pin

 

 

 

 

 

 

VILmax=

open.

 

 

 

 

 

 

 

0.25×VDD EXT

 

 

 

 

 

 

 

 

VIHmin=

 

 

 

 

 

 

 

 

0.75×VDD EXT

 

 

 

 

 

 

 

 

VIHmax=

 

 

 

 

 

 

 

 

VDD EXT+0.3

 

 

 

 

RESERVED

22~

 

 

 

Keep these

pins

 

 

 

33

 

 

 

open.

 

 

 

 

38~

 

 

 

 

 

 

 

 

39,

 

 

 

 

 

 

 

 

44,

 

 

 

 

 

 

 

 

58,

 

 

 

 

 

 

 

M50_HD_V2.0

 

 

 

 

- 27 -

 

+ 62 hidden pages