Quectel Wireless Solutions 201211M50 User Manual

M50

Quectel Cellular Engine

Hardware Design

M50_HD_V2.0

M50Hardware Design

	Document Title	M50 Hardware Design
	Revision	2.0
	Date	2012-06-26
	Status	Released
	Document Control ID	M50_HD_V2.0

General Notes
Quectel offers this information as a	service to i s cus om rs, o support app ication		and
engineering efforts that use the products designed by Qu c l. The information provided is
based upon requirements specifically provided for		us om rs of Qu ct . Quectel has not
undertaken any independent sear h for additional informa ion, r l vant to any information
that may be in the customer’s possession. Furthermore, sys em validation of th s product
designed by Quect l within a larg r	l tronic system remains the respons b l y of		he
customer or the custom r’s syst m int	grator. All spe	ifi ations supplied herein are subject to
change.

Quecctel

ConfidentialCopyright

This doc ment contains proprietary technical information of Qu ct l Co., Ltd. Copying this document, distribution to others, and commun cat on of the co t ts th reof, are forbidden without permission. Offenders are liable to the paym nt of amag s. All rights are reserved in the event of a pate t gra t or registrat on of a utility mo el or design. All specifications supplied herein are subject to cha ge w thout not ce at any time.

Copyright © Shanghai Quectel Wireless Solutions Ltd. 2012.

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		Contents
Contents ...................................................................................................................................................			3
Table Index ..............................................................................................................................................			5
Figure Index ............................................................................................................................................			6
0. Revision history ..................................................................................................................................			8
1. Introduction .......................................................................................................................................			9
1.1. Related documents....................................................................................................................			9
1.2. Terms and abbreviations.........................................................................................................			10
1.3. Safety cautions........................................................................................................................			12
2. Product concept .............................................................................................................................			15
2.1. Key features ............................................................................................................................			15
Quecctel
2.2. Functional diagram.................................................................................................................			17
2.3. Evaluation board.....................................................................................................................			18
3. Application interface......................................................................................................................			19
3.1. Pin of module..........................................................................................................................			20
3.1.1. Pin assignm nt..............................................................................................................			20
Confidential3.9.1. UART Port....................................................................................................................42
3.1.2. Pin description..............................................................................................................			22
3.2. Operating mod s.....................................................................................................................			29
3.3. Power s pply...........................................................................................................................			30
3.3.1. Power f at	r s of module ............................................................................................		30
3.3.2. Decrease s	pply voltage drop......................................................................................		30
3.3.3. Reference design for power supply.............................................................................			31
3.3.4. Monitor power s		pply..................................................................................................	32
3.4. Power on and down scenarios................................................................................................			32
3.4.1. Power on .......................................................................................................................			32
3.4.2. Power down ..................................................................................................................			34
3.4.3. Restart ...........................................................................................................................			36
3.5. Charge interface......................................................................................................................			38
3.6. P wer saving...........................................................................................................................			38
3.6.1. Minimum fu cti		ality mode......................................................................................	38
3.6.2. SLEEP m de.................................................................................................................			39
3.6.3. Wake up m dule from SLEEP mode ..........................................................................			39
3.7. Summary of state transition ...................................................................................................			39
3.8. RTC backup.............................................................................................................................			40
3.9. Serial interfaces ......................................................................................................................			41
3.9.2. Debug Port ....................................................................................................................			46
3.9.3. Auxiliary UART Port...................................................................................................			46
3.9.4. UART application ........................................................................................................			47
3.10. Audio interfaces....................................................................................................................			50
3.10.1. Decrease TDD noise and other noise........................................................................			51
3.10.2. Microphone interfaces design....................................................................................			51
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M50Hardware Design
3.10.3. Receiver and speaker interface design......................................................................			52
3.10.4. Earphone interface design..........................................................................................			54
3.10.5. Loud speaker interface design...................................................................................			54
3.10.6. Audio characteristics..................................................................................................			55
3.11. SIM card interface ................................................................................................................			55
3.11.1. SIM card application..................................................................................................			55
3.11.2. 6 Pin SIM cassette ......................................................................................................			57
3.11.3. 8 Pin SIM cassette ......................................................................................................			58
3.12. SD card interface ..................................................................................................................			60
3.13. PCM interface.......................................................................................................................			62
3.13.1. Configuration..............................................................................................................			62
3.13.2. Timing	.........................................................................................................................		63
3.13.3. Reference design ........................................................................................................			64
3.13.4. AT command..............................................................................................................			64
Quecctel
3.14. ADC.......................................................................................................................................			66
3.15. Behaviors of the ...............................................................................................................RI			66
3.16. Network status .....................................................................................................indication			69
3.17. Operating status ..................................................................................................indication			69
Confidential
4. Antenna interface...........................................................................................................................			71
4.1. RF reference d ................................................................................................................sign			71
4.2. RF o tp t pow .....................................................................................................................r			72
4.3. RF receiving s ..........................................................................................................	nsitivity		72
4.4. Operating fr q .............................................................................................................	nci s		72
4.5. RF cable soldering..................................................................................................................			73
5. Electrical, reliability .........................................................................and radio character st cs			74
5.1. Absolute maximum ....................................................................................................ratings			74
5.2. Operating temperature............................................................................................................			74
5.3. Power supply rati ..............................................................................................................		gs	75
5.4. Current consumption ..............................................................................................................			76
5.5. Electro-static discharge ..........................................................................................................			78
6. Mechanical dime si ................................................................................................................		s	79
6.1. Mechanical dime ........................................................................................		si s of module	79
6.2. Rec mmended ..........................................................f		tpri t without bottom centre pads	81
6.4. T p view f the .........................................................................................................m		dule	82
6.5. Bottom view of ....................................................................................................the module			83
7. Storage and manufacturing.........................................................................................................			84
7.1. Storage.....................................................................................................................................			84
7.2. Soldering .................................................................................................................................			85
7.3. Packaging ................................................................................................................................			86
Appendix A: GPRS coding .............................................................................................schemes			87
Appendix B: GPRS multi ............................................................................................-slot classes			88

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Table Index
TABLE 1: RELATED DOCUMENTS .....................................................................................................	9
TABLE 2: TERMS AND ABBREVIATIONS........................................................................................	10
TABLE 3: MODULE KEY FEATURES................................................................................................	15
TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE..17
TABLE 5: M50 PIN ASSIGNMENT .....................................................................................................	21
TABLE 6: PIN DESCRIPTION .............................................................................................................	22
TABLE 7: OVERVIEW OF OPERATING MODES..............................................................................	29
TABLE 8: PIN DEFINITION OF THE CHARGING............................................................................	38
TABLE 9: SUMMARY OF STATE TRANSITION...............................................................................	39
TABLE 10: LOGIC LEVELS OF THE UART INTERFACES..............................................................	42
Quecctel
TABLE 11: PIN DEFINITION OF THE UART INTERFACES............................................................	42
TABLE 12: PIN DEFINITION OF AUDIO INTERFACES ..................................................................	50
TABLE 13: AOUT3 OUTPUT CHARACTERISTICS..........................................................................	51
TABLE 14: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS.......................................	55
TABLE 15: TYPICAL SPEAKER CHARACTERISTICS....................................................................	55
ConfidentialTABLE 35: OPERATING TEMPERATURE.........................................................................................74
TABLE 16: PIN DEFINITION OF THE SIM INTERFACE .................................................................	56
TABLE 17: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER .........................................	58
TABLE 18: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER.................................................	59
TABLE 19: PIN DEFINITION OF THE SD CARD INTERFACE .......................................................	60
TABLE 20: PIN NAME OF THE SD CARD AND MICRO SD CARD...............................................	61
TABLE 21: PIN DEFINITION OF PCM INTERFACE.........................................................................	62
TABLE 22: CONFIGURATION ............................................................................................................	62
TABLE 23: PCMON COMMAND DESCRIPTION ..........................................................................	65
TABLE 24: PCMVOL COMMAND DESCRIPTION ........................................................................	65
TABLE 25: PIN DEFINITION OF THE ADC.......................................................................................	66
TABLE 26: CHARACTERISTICS OF THE ADC ................................................................................	66
TABLE 27: BEHAVIORS OF THE RI ..................................................................................................	66
TABLE 28: WORKING STATE OF THE NETLIGHT .........................................................................	69
TABLE 29: PIN DEFINITION OF THE STATUS.................................................................................	69
TABLE 30: PIN DEFINITION OF THE RF ANT................................................................................	71
TABLE 31: THE MODULE CONDUCTED RF OUTPUT POWER ....................................................	72
TABLE 32: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY....................................	72
TABLE 33: THE MODULE OPERATING FREQUENCIES................................................................	72
TABLE 34: ABSOLUTE MAXIMUM RATINGS.................................................................................	74
TABLE 36: THE MODULE POWER SUPPLY RATINGS ...................................................................	75
TABLE 37: THE MODULE CURRENT CONSUMPTION..................................................................	76
TABLE 38: THE ESD ENDURANCE (TEMPERATURE:25 ,HUMIDITY:45 %)............................	78
TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES ..................................................	87
TABLE 40: GPRS MULTI-SLOT CLASSES ........................................................................................	88
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Figure Index
FIGURE 1: MODULE FUNCTIONAL DIAGRAM .............................................................................	18
FIGURE 2: PIN ASSIGNMENT............................................................................................................	20
FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING .............................................................	30
FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT............................................................	31
FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY..............................................................	31
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT.................................................	32
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE...........................................................	33
FIGURE 8: TIMING OF TURNING ON SYSTEM ..............................................................................	33
FIGURE 9: TIMING OF TURNING OFF THE MODULE...................................................................	34
FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT............	36
Quecctel
FIGURE 11: REFERENCE CIRCUIT FOR EMERG OFF BY USING BUTTON..............................	36
FIGURE 12: TIMING OF RESTARTING SYSTEM ............................................................................	37
FIGURE 13: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN..............	37
FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ...............................................	40
FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY ....................................................	40
ConfidentialFIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER..............................................58
FIGURE 16: RTC SUPPLY FROM CAPACITOR ................................................................................	40
FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTICS.............................................	41
FIGURE 18: REFERENCE DESIGN FOR FULL-FUNCTION UART................................................	44
FIGURE 19: REFERENCE DESIGN FOR UART PORT .....................................................................	44
FIGURE 20: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL...	45
FIGURE 21: REFERENCE DESIGN FOR FIRMWARE UPGRADE..................................................	45
FIGURE 22: REFERENCE DESIGN FOR DEBUG PORT..................................................................	46
FIGURE 23: REFERENCE DESIGN FOR AUXILIARY UART PORT...............................................	47
FIGURE 24: LEVEL MATCH DESIGN FOR 3.3V SYSTEM..............................................................	47
FIGURE 25: LEVEL MATCH DESIGN FOR 5V SYSTEM.................................................................	48
FIGURE 26: LEVEL MATCH DESIGN FOR RS-232..........................................................................	49
FIGURE 27: REFERENCE DESIGN FOR AIN1&AIN2......................................................................	52
FIGURE 28: REFERENCE DESIGN FOR AOUT1..............................................................................	52
FIGURE 29: HANDSET INTERFACE DESIGN FOR AOUT2 ...........................................................	53
FIGURE 30: SPEAKER INTERFACE DESIGN WITH AN AMPLIFIER FOR AOUT2.....................	53
FIGURE 31: EARPHONE INTERFACE DESIGN ...............................................................................	54
FIGURE 32: LOUD SPEAKER INTERFACE DESIGN.......................................................................	54
FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD....................................................	56
FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD....................................................	57
FIGURE 36: MOLEX 91228 SIM CARD HOLDER ............................................................................	59
FIGURE 37: REFERENCE CIRCUIT OF SD CARD...........................................................................	60
FIGURE 38: LONG SYNCHRONIZATION & SIGN EXTENSION DIAGRAM ...............................	63
FIGURE 39: LONG SYNCHRONIZATION & ZERO PADDING DIAGRAM ...................................	63
FIGURE 40: SHORT SYNCHRONIZATION & SIGN EXTENSION DIAGRAM..............................	63
FIGURE 41: SHORT SYNCHRONIZATION & ZERO PADDING DIAGRAM .................................	64
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M50Hardware Design
FIGURE 42: REFERENCE DESIGN FOR PCM..................................................................................	64
FIGURE 43: RI BEHAVIOR OF VOICE CALLING AS A RECEIVER ..............................................	67
FIGURE 44: RI BEHAVIOR OF DATA CALLING AS A RECEIVER ................................................	67
FIGURE 45: RI BEHAVIOR AS ACALLER........................................................................................	67
FIGURE 46: RI BEHAVIOR OF URC OR SMS RECEIVED ..............................................................	68
FIGURE 47: REFERENCE DESIGN FOR NETLIGHT.......................................................................	69
FIGURE 48: REFERENCE DESIGN FOR STATUS ............................................................................	70
FIGURE 49: REFERENCE DESIGN FOR RF......................................................................................	71
FIGURE 50: RF SOLDERING SAMPLE..............................................................................................	73
FIGURE 51: M50 TOP AND SIDE DIMENSIONS ..............................................................................	79
FIGURE 52: M50 BOTTOM DIMENSIONS........................................................................................	80
FIGURE 53: RECOMMENDED FOOTPRINT WITHOUT BOTTOM CENTRE PADS ....................	81
FIGURE 55: TOP VIEW OF THE MODULE .......................................................................................	82
FIGURE 56: BOTTOM VIEW OF THE MODULE..............................................................................	83
Quecctel
FIGURE 57: PASTE APPLICATION ....................................................................................................	85
FIGURE 58: RAMP-SOAK-SPIKE REFLOW PROFILE ....................................................................	86
FIGURE 59: MODULE TRAY ..............................................................................................................	86
FIGURE 60: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ...........................................	87
Confidential
FIGURE 61: RADIO BLOCK STRUCTURE OF CS-4........................................................................	87

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0. Revision history

	Revision	Date	Author	Description of change
	1.0	2011-12-20	Ray XU	Initial
	1.1	2012-02-03	Ray XU	1.	Updated PCM interface
				2.	Updated SD interface
				3.	Updated charging interface
				4.	Updated timing of turning on the module
	1.2	2012-07-20	Baly BAO	1.	Deleted the USB interface
				2.	Deleted the camera interface
	1.3	2012-10-22	Mountain ZHOU	1.	Updated functional diagram
		Quecctel
				2.	Upda ed r f r nce d sign circuit
				3.	Upda ed audio charact ristics
				4.	Upda ed VRTC DC charact ristics
				5.	Upda ed SLEEP curr nt consumption
				6.	Upda ed in ernet service protocols
				7.	Updated SIM pins’ name
		Confidential
				8.	Modified PCM function
				9.	Deleted FAX fu ction
	2.0	2012-06-16	Ray XU	1.	Update the module size
				2.	Update the pin layout

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1. Introduction

This document defines the M50 module and describes the hardware interface of M50 which are connected with the customer application and the air interface.

This document can help customers quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customers can use M50module to design and set up mobile applications easily.

1.1. Related documents

Table 1: Related documents

SN

QuecctelSpec cat on of the SIM Application Toolkit for the

Document name

Remark

[1]

M50 ATC

AT

ommands set

[2]

ITU-T

Draft

new Serial asyn hronous au oma ic dialing and control

Confidential

recommendation V.25t r

[3]

GSM 07.07

Digital

ellular tele ommunications (Phase

2+);

AT

ommand set for GSM Mobile Equipme

(ME)

[4]

GSM 07.10

Support GSM 07.10 multipl xi

g pro ocol

[5]

GSM 07.05

Digital cellular t l commu icatio s (Phase 2+); Use

of

Data T rminal Equipm

t

–

Data

Circuit

term nat ng Equipm nt (DTE

–

DCE)

i terface

for

Short Message S rvice (SMS) and Cell Broadcast

Serv ce (CBS)

[6]

GSM 11.14

D g tal

cellular telecommunications

(Phase

2+);

Subscriber Identity module – Mobile Equipment (SIM

– ME) interface

[7]

GSM 11.11

Digital cellular telecommunications (Phase 2+);

Specification of the Subscriber Identity module –

Mobile Equipment (SIM – ME) interface

[8]

GSM 03.38

Digital cellular telecommunications (Phase 2+);

Alphabets and language-specific information

[9]

GSM 11.10

Digital cellular telecommunications (Phase 2); Mobile

Station (MS) conformance specification; Part 1:

Conformance specification

[10]

GSM_UART_AN

UART port application note

[11]GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note

[12] M10_EVB_UGD

M10 EVB user guide

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1.2. Terms and abbreviations

Table 2: Terms and abbreviations

	Abbreviation	Description
	ADC	Analog-to-Digital Converter
	AMR	Adaptive Multi-Rate
	ARP	Antenna Reference Point
	ASIC	Application Specific Integrated Circuit
	BER	Bit Error Rate
	BOM	Bill Of Material
	BTS	Base Transceiver Station
	Quecctel
	CHAP	Challenge Handshake Authentication Pro ocol
	CS	Coding Scheme
	CSD	Circuit Switched Data
	CTS	Clear To Send
	DAC	Digital-to-Analog Converter
	Confidential
	DRX	Discontinuous R	ption
	DSP	Digital Signal Pro	ssor
	DCE	Data Comm ni ations Equipment (typically module)
	DTE	Data T rminal Equipm nt (typically comput r, xt r al co roller)
	DTR	Data T rminal R ady
	DTX	Discontin o s Transmission
	EFR	Enhanced F ll Rate
	EGSM	Enhanced GSM
	EMC	Electromagnetic Compat b l ty
	ESD	Electrostatic Discharge
	ETS	Eur pean Telecommu cat on Standard
	FCC	Federal C mmu icatio s Commission (U.S.)
	FDMA	Freque cy Division Multiple Access
	FR	Full Rate
	GMSK	Gaussian Minimum Shift Keying
	GPRS	General Packet Radio Service
	GSM	Global System for Mobile Communications
	HR	Half Rate
	I/O	Input/Output
	IC	Integrated Circuit
	IMEI	International Mobile Equipment Identity
	Imax	Maximum Load Current
	Inorm	Normal Current
	kbps	Kilo Bits Per Second
	LED	Light Emitting Diode
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M50 Hardware Design

	Li-Ion	Lithium-Ion
	MO	Mobile Originated
	MS	Mobile Station (GSM engine)
	MT	Mobile Terminated
	PAP	Password Authentication Protocol
	PBCCH	Packet Switched Broadcast Control Channel
	PCB	Printed Circuit Board
	PDU	Protocol Data Unit
	PPP	Point-to-Point Protocol
	RF	Radio Frequency
	RMS	Root Mean Square (value)
	RTC	Real Time Clock
	RX	Receive Direction
	VILmax	QuecctelMaximum I put Low Level Voltage Value
	SIM	Subscriber Identification Module
	SMS	Short Message Service
	TDMA	Time Division Multiple A ess
	TE	Terminal Equipment
	TX	Confidential
		Transmitting Dir tion
	UART	Univ rsal Asyn hronous Re eiver & Transmitter
	URC	Unsolicit d R sult Code
	USSD	Unstr ct r d Suppl m ntary Service Data
	VSWR	Voltage Standing Wave Ratio
	Vmax	Maxim m Voltage Value
	Vnorm	Normal Voltage Value
	Vmin	Minimum Voltage Value
	VIHmax	Maximum Input H gh Level Voltage Value
	VIHmin	Mi imum I put High Level Voltage Value
	VILmin	Mi imum I put Low Level Voltage Value
	VImax	Abs lute Maximum I put Voltage Value
	VImin	Abs lute Mi imum I put Voltage Value
	VOHmax	Maximum Output High Level Voltage Value
	VOHmin	Minimum Output High Level Voltage Value
	VOLmax	Maximum Output Low Level Voltage Value
	VOLmin	Minimum Output Low Level Voltage Value
	Phonebook abbreviations
	LD	SIM Last Dialing phonebook (list of numbers most recently dialed)
	MC	Mobile Equipment list of unanswered MT Calls (missed calls)
	ON	SIM (or ME) Own Numbers (MSISDNs) list
	RC	Mobile Equipment list of Received Calls
	SM	SIM phonebook

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1.3. Safety cautions

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M50module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions.

When in a hospital or other health care facility, observe the restrictions about the
use of mobile. Switch the cellular terminal or mobile off. Medical equipment may
Quecctel
be sensitive to not operate normally for RF				n rgy int rf r nce.
Switch off the cellular terminal or mobile b				fore boarding an aircraft. Make sure
it switched off. The operation of wireless applianc s in an aircraft is forbidden to
prevent interferen e with			ommuni a ion sys		ms. Forg t to think much of these
Confidential
instructions may l ad to the flight safe y or offend against local legal							c on, or
both.
Do not op rate the c llular terminal or mobile in the pr s						ce of flammable gas
or f me. Switch off the c llular terminal wh					n you are	ar pe rol s a ion, fuel
depot, chemical plant or where blasting op				ratio s are in progress. Operation of
any electrical equipment			n potent ally xplosive atmosph re can co				stitute a
safety hazard.
Y	ur cellular termi al or mob le receives and transmits radio frequency energy
while switched on. RF i ter erence can occur if it is used close to TV set, radio,
c	mputer r	ther electric equipment.
R	ad safety c	mes first! Do not use a hand-held cellular terminal or mobile while

driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.

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GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call.

QuecctelAlso, some networks require that a valid SIM card be prop r y inserted in cellular terminal or mobile.

According to the R&TTE Dire tive 1999/95/CE, all wir l ss quipment and

Confidentialtelecommunications terminals sold in EU must m t all the stipulated he lth, safety RF, EMC requirements that provide for CE mark. Quectel Module M50

is fully in accordan with all the dire tives of EU.

1.4. Directives and standards

The M50 mod le is designed to comply with the FCC stat m nts. FCC ID: XMR201211M50. The Host system sing M50, should have label n cated contains FCC ID: XMR201211M50.

1.4.1. FCC Stateme t

1. This device c mplies with Part 15 of the FCC rules. Operation is subject to the following conditi ns:

a) This device may t cause harmful interference.

b)This device must accept any interference received, including interference that may cause undesired perati n.

2.hanges or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

1.4.2. FCC Radiation exposure statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage.

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The manual of the host system, which uses M50, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M50 module depending on the Mobile status.

The following list of antenna is indicating the maximum permissible antenna gain.

	Type		Maximum Gain		Maximum Gain	Impedance
			(850Hz/900Hz)		(1800Hz/1900Hz)
	External	Monopole	0.5dBi		2dBi	50Ω
	Antenna	Vehicular antenna	0.5dBi		2dBi	50Ω
	Internal	Monopole	0.5dBi		2dBi	50Ω
	Antenna	PIFA	0.5dBi		2dBi	50Ω
		FPC	0.5dBi		2dBi	50Ω
		Quecctel				50Ω
		PCB	0.5dBi		2dBi
	This radio module must not be installed			o o-locate and operate simu
	ltaneously with oth r radios in host sys em;
Confidential

additional testing and quipm nt authorization may be requ red o op erating sim ltan o sly with oth r radios.

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2. Product concept

M50 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M50 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix A and Appendix B.

With a tiny profile of 24.5mm×25.3mm×2.6mm, the module can meet almost all the requirements for M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA, Smart Metering, and Remote Maintenance & Control etc.

	M50 is an SMD type	module with LCC package, which			can be	mb dd d in customer’s
QuecctelTable 3: Module key features
	applications. It provides abundant hardware interfaces be w				n he modu		and customer’s host
	board.
	Designed with power saving technique, the urrent onsump ion of M50 is as low as 1.3 mA in
	SLEEP mode when DRX is 5.
Confidential
	M50 is integrated with Int rn t s rvi			proto ols, su h as TCP, UDP, FTP a d PPP. Ex ended AT
	commands have been d v lop d for			ustom r to use these Internet service protocols eas ly.
	The mod le f lly compli s with the RoHS directive of the Europ an U					ion.
	2.1. Key features
	Feature		Description
	Power supply		Si gle supply voltage 3.3V~ 4.6V
			Typical supply voltage 4.0V
	Power saving		Typical power consumption in SLEEP mode:				1.3 mA@ DRX=5
							1.2 mA@ DRX=9
	Frequency bands		 Quad-band: GSM850, GSM900, DCS1800, PCS1900.
			 The module can search these frequency bands automatically
			 The frequency bands can be set by AT command.
			 Compliant with GSM Phase 2/2+
	GSM class		Small MS
	Transmitting power		 Class 4 (2W) at GSM850 and GSM900
			 Class 1 (1W) at DCS1800 and PCS1900
	GPRS connectivity		 GPRS multi-slot class 12		(default)
			 GPRS multi-slot class 1~12		(configurable)
			 GPRS mobile station class B
	M50_HD_V2.0						- 15 -

M50 Hardware Design

	Temperature range		Normal operation: -35°C ~ +80°C
		 Restricted operation: -40°C ~ -35°C and +80°C ~ +85°C 1)
			Storage temperature: -45°C ~ +90°C
	DATA GPRS:		GPRS data downlink transfer: max. 85.6 kbps
		 GPRS data uplink transfer: max. 85.6 kbps
		 Coding scheme: CS-1, CS-2, CS-3 and CS-4
		 Support the protocols PAP (Password Authentication Protocol)
			usually used for PPP connections
			Internet service protocols
			TCP/UDP/FTP/PPP/HTTP/NTP/PING
	Quecctel
			Support Packet Broadcast Control Channel (PBCCH)
	CSD:		CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent
			Support Unstructured Suppl m n ary S rvice Data (USSD)
	SMS		Text and PDU mode
			SMS storage: SIM ard
	SIM interface	Support SIM card: 1.8V, 3V
	Audio features	Spee h odec modes:
		 Half Rate (ETS 06.20)
	ConfidentialSIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99
			Full Rate (ETS 06.10)
			Enhan d Full Rate (ETS 06.50 / 06.60 / 06.80)
		 Adaptive Multi-Rate (AMR)
			Echo Suppression
			Echo Canc llation
			Noise Re uction
			Embedded one ampl fi r of class AB with maximum driving
			power up to 800mW
	UART interfaces	UART Port:
			Seven l es on UART port interface
			Used or AT comman , GPRS ata and CSD data
			Multiplexing unction
		 Support autobauding from 4800 bps to 115200 bps
		Debug Port:
			Two lines on debug port interface DBG TXD and DBG RXD
		 Debug Port only used for firmware debugging
		Auxiliary Port:
		 Used for AT command
	Phonebook management	Support phonebook types: SM, ME, ON, MC, RC, DC, LD, LA
	Real time clock	Supported
	Physical characteristics	Size:
		24.5 (±0.15) × 25.3 (±0.15) × 2.6 (±0.2) mm
		Weight: 3.3g
	Firmware upgrade	Firmware upgrade via UART Port
	M50_HD_V2.0		- 16 -

M50 Hardware Design

Antenna interface	Connected to antenna pad with 50 Ohm impedance control

1 When the module works in this temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased.

Table 4: Coding schemes and maximum net data rates over air interface

	Coding scheme			1 Timeslot	2 Timeslot		4 Timeslot
	CS-1			9.05kbps	18.1kbps		36.2kbps
	CS-2			13.4kbps	26.8kbps		53.6kbps
	CS-3			15.6kbps	31.2kbps		62.4kbps
	CS-4			21.4kbps	42.8kbps		85.6kbps
	Quecctel
	2.2. Functional diagram
Confidential
	The following figure shows a blo k diagram of the M50 module					and illus ra es he m jor
	functional parts:
		Power manag m nt
		Baseband
		Serial Flash
		The radio freq ency part
		The peripheral interface
		—Charge interface
		—PCM interface
		—SD interface
		—SIM interface
		—Audio i	terface
		—Serial i	terface

—P wer supply

—RF interface

—ADC

—Turn on/off interface (PWRKEY & EMERG OFF)

M50_HD_V2.0

- 17 -

M50 Hardware Design

RF_ANT

ESD

RF

PAM

SAW

Filter

VBAT

Charge

Charge

RF Transceiver

26MHz

Interface

PWRKEY

EMERG_OFF

Reset

SD

SD

VRTC

Interface

Interface

RTC

PMU

32KHz

BB&RF

SIM

SIM

PCM

PCM

2.3. Evaluation

Quecctelboard

Inteface

Interface

Interface

In rface

STATUS&

GPIO

NETLIGHT

ADC

ADC

UART

S rial

Confidential

Int rface

Memory

Audio

Aud o

Interfa e

Serial

Flash

Figure 1: Mo ule unct onal

iagram

In order to help cust

mer to develop appl cat ons w th M50 , Quectel supplies an evaluation board

(EVB), RS-232 to USB cable, power adapter, earphone, antenna and other peripherals to control

or test the m dule. F

r details, please refer to the document [12].

M50_HD_V2.0

- 18 -

M50 Hardware Design

3. Application interface

The module is equipped with 83-pin SMT pads and it adopts LCC package. Detailed descriptions on Sub-interfaces included in these pads are given in the following chapters:

 Power supply  Power on/down  Charge interface  RTC

 Serial interfaces  Audio interfaces  SIM interface

Quecctel SD interface  PCM interface

 ADC

Confidential

M50_HD_V2.0

- 19 -

M50 Hardware Design

3.1. Pin of module

3.1.1. Pin assignment

			RESERVED	RESERVED		RESERVED	RESERVED	VBAT	VBAT			VBAT	VBAT	GND	GND	GND	RF ANT	GND		GND	VDD EXT	VRTC			RESERVED			SIM PRESENCE
	74			73		72	71	70	69			68	67	66	65	64	63	62		61	60	59			58			57
ADC1	1																																SIM1_VDD
																															56
		Quecctel
																															55
ADC0	2													Top view																			SIM1_DATA
RESERVED	3																														54		SIM1_CLK
NETLIGHT	4																															53	SIM1_RST
SPK2P	5																														52		SIM1_GND
AGND	6																														51		TXD
		Confidential
MIC2P	7													GND														50					RXD
MIC2N	8													82														49					RTS
MIC1P	9						RESERVED 75										81 GND														48		CTS
MIC1N 10							RESERVED 76							83			80 GND											47					DTR
SPK1N 11							RESERVED 77										79 GND											46					RI
SPK1P 12														78														45					DCD
LOUDSPKN 13														RESERVED														44					RESERVED
LOUDSPKP 14																												43					DBG RXD
STATUS 15																												42					DBG TXD
PWRKEY 16																												41					RXD AUX
EMERG OFF 17																												40					TXD AUX
PCM IN 18																												39					RESERVED
PCM CLK	19																											38					RESERVED
		20		21		22	23	24	25			26	27	28	29	30	31	32		33	34	35			36			37
			PCM OUT	PCM SYNC		RESERVED	RESERVED	RESERVED	RESERVED			RESERVED	RESERVED	RESERVED	RESERVED	RESERVED	RESERVED	RESERVED		RESERVED	SD CMD	SD CLK			SD DATA0			GND
		VBAT				Other			GND					RF		PCM				UART					ADC
		Power				SIM			Reserved					SD		Audio

Figure 2: Pin assignment

M50_HD_V2.0

- 20 -

M50 Hardware Design

Table 5: M50 pin assignment

			/				/
	1	ADC1	I		2	ADC0	I
	3	RESERVED			4	NETLIGHT	O
	5	SPK2P	O		6	AGND
	7	MIC2P	I		8	MIC2N	I
	9	MIC1P	I		10	MIC1N	I
	11	SPK1N	O		12	SPK1P	O
	13	LOUDSPKN	O		14	LOUDSPKP	O
	15	STATUS	O		16	PWRKEY	I
	17	EMERG_OFF	I		18	PCM_IN	I
	45	QuecctelDCD O 46 RI					O
	19	PCM CLK	O	20		PCM OUT	O
	21	PCM SYNC	O	22		RESERVED
	23	RESERVED		24		RESERVED
	25	RESERVED		26		RESERVED
	27	RESERVED		28		RESERVED
	61	ConfidentialGND 62 GND
	29	RESERVED		30		RESERVED
	31	RESERVED		32		RESERVED
	33	RESERVED		34		SD CMD	O
	35	SD CLK	O	36		SD DATA0	I/O
	37	GND		38		RESERVED
	39	RESERVED		40		TXD AUX	O
	41	RXD AUX	I	42		DBG TXD	O
	43	DBG RXD	I	44		RESERVED
	47	DTR	I		48	CTS	O
	49	RTS	I	50		RXD	I
	51	TXD	O		52	SIM GND
	53	SIM RST	O		54	SIM CLK	O
	55	SIM DATA	I/O		56	SIM VDD	O
	57	SIM PRESENCE	I		58	RESERVED
	59	VRTC	I/O		60	VDD EXT	O
	63	RF_ANT	I/O		64	GND
	65	GND			66	GND
	67	VBAT	I		68	VBAT	I
	69	VBAT	I		70	VBAT	I
	71	RESERVED		72		RESERVED
	M50_HD_V2.0						- 21 -

M50 Hardware Design

73	RESERVED			74	RESERVED
75	RESERVED			76	RESERVED
77	RESERVED			78	RESERVED
79	GND			80	GND
81	GND			82	GND
83	GND

Note: Keep all reserved pins open.

3.1.2. Pin description

	Table 6: Pin description
	Quecctel
	Power supply
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	VBAT	Confidential
		67,	I	Main pow r supply	Vmax= 4.6V	Make sure th t
		68,		of modul :	Vmin=3.3V	supply suff c ent
		69		VBAT=3.3V~4.6V	Vnorm=4.0V	curre	n
		70				ra sm	ng
						burst wh ch
						ypically rises to
						1.6A.
	VRTC	59	I/O	Power supply for	VImax=3.3V	If u used, keep
				RTC when VBAT s	VImin=1.5V	this pin open.
				not suppl ed or the	VInorm=2.8V
				system.	VOmax=2.85V
				Charg g or backup	VOmin=2.6V
				battery or golden	VOnorm=2.8V
				capacitor when the	Iout(max)= 1mA
				VBAT is supplied.	Iin=2.6~5 uA
	VDD EXT	60	O	Supply 2.8V voltage	Vmax=2.9V	1. If unused,
				for external circuit.	Vmin=2.7V	keep this pin
					Vnorm=2.8V	open.
					Imax=20mA	2. Recommended
						to add a
						2.2~4.7uF
						bypass capacitor
						when supplying
						power for
						external circuit.
	GND	37,		Ground
		61,
	M50_HD_V2.0						- 22 -

	M50 Hardware Design
		62,
		64,
		65,
		66,
	Turn on/off
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	PWRKEY	15	I	Turn on/off control.	VILmax=	Pulled up to
				PWRKEY should be	0.1×VBAT	VBAT internally.
				pulled down for a	VIHmin=
				moment to turn on	0.6×VBAT
				or off the system.	VImax=VBAT
	Emergency shutdown
		Quecctel				COMMENT
	PIN NAME	PIN	I/O	DESCRIPTION	DC
		NO.			CHARACTERISTICS
	EMERG OFF	17	I	Emergency off.	VILmax=0.4V	Open
				Pulled down for at	VIHmin=2.2V	drain/collector
		Confidential
				l ast 20ms, whi h	Vopenmax=2.8V	dr ver requ red n
				will turn off the		cellular dev ce
				module in ase of		appl ca	on.
				m rg n y. Use it		If u used, keep
				only wh n normal		h s p	open.
				shutdown through
				PWRKEY or AT
				command cannot
				per orm well.
	Module indicator
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	STATUS	16	O	I dicate module	VOHmin=	If unused, keep
				operati g status.	0.85×VDD EXT	this pin open.
				High level indicates	VOLmax=
				module is power-on	0.15×VDD EXT
				and low level
				indicates
				power-down.
	Audio interface
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	MIC1P	9, 10	I	Channel one for		If unused, keep
	MIC1N			positive and		these pins open.
				negative voice-band
				input
	M50_HD_V2.0						- 23 -

M50 Hardware Design

	MIC2P	7, 8	I	Channel two for
	MIC2N			positive and
				negative voice-band
				input
	SPK1P	12, 11	O	Channel one for		1. If unused,
	SPK1N			positive and		keep these pins
				negative voice-band		open.
				output		2. Support both
	SPK2P	5	O	Channel two for		voice and
				voice-band output		ringtone output.
	AGND	6		Analog ground.
				Constitute a pseudo
				differential channel
		Quecctel
				with SPK2P.
	LOUDSPKN	13,	O	Channel three of		1. If unused,
	LOUDSPKP	14		positive and		keep these pins
				negative voi e-band		open.
				output		2. Embedded
		ConfidentialVIHmin= recommend
						ampl f er of cl ss
						AB n ern lly.
						3. Support bo h
						vo ce a	d
						ri g o	e ou put.
	Net status indicator
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	NETLIGHT	4	O	Network status	VOHmin=	If unused, keep
				i dicat on	0.85×VDD EXT	this pin open.
					VOLmax=
					0.15×VDD EXT
	UART P rt
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	DTR	47	I	Data terminal ready	VILmin=0V	If only use TXD,
					VILmax=	RXD and GND
	RXD	50	I	Receive data
	TXD	49	O	Transmit data	0.25×VDD EXT	to communicate,
	RTS	51	I	Request to send	0.75×VDD_EXT	pulling down
	CTS	48	O	Clear to send
					VIHmax=	RTS and keeping
	RI	46	O	Ring indicator
					VDD_EXT+0.3	other pins open.
	DCD	45	O	Data carrier
					VOHmin=
				detection
					0.85×VDD_EXT
					VOLmax=
	M50_HD_V2.0						- 24 -

M50 Hardware Design

					0.15×VDD_EXT
	Debug Port
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	DBG_TXD	42	O	UART interface for	VILmin=0V	If unused, keep
				debugging only.	VILmax=	these pins open.
					0.25×VDD_EXT
					VIHmin=
					0.75×VDD_EXT
	DBG_RXD	43	I		VIHmax=
					VDD_EXT+0.3
					VOHmin=
		Quecctel
					0.85×VDD EXT
					VOLmax=
					0.15×VDD EXT
	Auxiliary UART Port
	PIN NAME	PIN	Confidential1.8V or 3V. protected against
			I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	TXD AUX	40	O	Transmit data	VILmin=0V	If u used, keep
					VILmax=	hese p ns open.
					0.25×VDD EXT
					VIHmin=
	RXD AUX	41	I	Rece ve data	0.75×VDD EXT
					VIHmax=
					VDD EXT+0.3
					VOHmin=
					0.85×VDD EXT
					VOLmax=
					0.15×VDD EXT
	SIM interface
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	SIM VDD	56	O	Power supply for	The voltage can be	All signals of
				SIM card	selected by firmware	SIM interface
					automatically. Either	should be
						ESD with a TVS
	SIM_DATA	54	I/O	SIM data	3V
					VOLmax=0.4	diode array.
					VOHmin=	Maximum cable
					SIM_VDD-0.4	length is 200mm
					1.8V:	from the module
					VOLmax=	pad to SIM card
	M50_HD_V2.0					- 25 -

M50 Hardware Design

						0.15×SIM_VDD	holder.
						VOHmin=
						SIM_VDD-0.4
	SIM_CLK		55	O	SIM clock	3V
						VOLmax=0.4
						VOHmin=
						0.9×SIM_VDD
						1.8V:
						VOLmax=
						0.12×SIM_VDD
						VOHmin=
						0.9×SIM_VDD
	SIM_RST		53	O	SIM reset	3V
			QuecctelVDD EXT+0.3
						VOLmax=0.36
						VOHmin=
						0.9×SIM VDD
						1.8V:
						VOLmax=
			Confidential
						0.2×SIM VDD
						VOHmin=
						0.9×SIM VDD
	SIM GND		52		SIM ground
	SIM PRESEN		57	I	SIM card detection	VILmin=0V	If u used, keep
	CE					VILmax=	this pin open.
						0.25×VDD EXT
						VIHmin=
						0.75×VDD EXT
						VIHmax=
	ADC
	PIN NAME		PIN	I/O	DESCRIPTION	DC	COMMENT
			NO.			CHARACTERISTICS
	AD	0	2	I	General purpose	Voltage range: 0V to	Please give
					analog to digital	2.8V	priority to the
					converter.		use of ADC0.
	AD	1	1	I	General purpose	Voltage range: 0V to	If unused, keep
					analog to digital	2.8V	these pins open.
					converter.
	PCM
	PIN NAME		PIN	I/O	DESCRIPTION	DC	COMMENT
			NO.			CHARACTERISTICS
	PCM_CLK		19	O	PCM clock	VILmin=0V
	PCM_IN		18	I	PCM data input	VILmax=
	M50_HD_V2.0						- 26 -

M50 Hardware Design

	PCM_OUT	20	O	PCM data output	0.25×VDD_EXT
	PCM_SYNC	21	O	PCM frame	VIHmin=
				synchronization	0.75×VDD_EXT
					VIHmax=
					VDD_EXT+0.3
					VOHmin=
					0.85×VDD_EXT
					VOLmax=
					0.15×VDD_EXT
	SD card
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	SD_CMD	34	O	SD command	VILmin=0V
		Quecctel
	SD CLK	35	O	SD clock	VILmax=
	SD DATA0	36	I/O	SD data	0.25×VDD EXT
					VIHmin=
					0.75×VDD EXT
					VIHmax=
		Confidential
					VDD EXT+0.3
					VOHmin=
					0.85×VDD EXT
					VOLmax=
					0.15×VDD EXT
	RF interface
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	RF ANT	63	I/O	RF antenna pad	Imp ance of 50Ω
	Other interface
	PIN NAME	PIN	I/O	DESCRIPTION	DC	COMMENT
		NO.			CHARACTERISTICS
	DOWNLOAD	3	I		VILmin=0V	Keep this	pin
					VILmax=	open.
					0.25×VDD EXT
					VIHmin=
					0.75×VDD EXT
					VIHmax=
					VDD EXT+0.3
	RESERVED	22~				Keep these	pins
		33				open.
		38~
		39,
		44,
		58,
	M50_HD_V2.0					- 27 -