M50
Quectel Cellular Engine
Hardware Design
M50_HD_V2.0
M50Hardware Design
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Document Title |
M50 Hardware Design |
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Revision |
2.0 |
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Date |
2012-06-26 |
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Status |
Released |
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Document Control ID |
M50_HD_V2.0 |
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General Notes |
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Quectel offers this information as a |
service to i s cus om rs, o support app ication |
and |
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engineering efforts that use the products designed by Qu c l. The information provided is |
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based upon requirements specifically provided for |
us om rs of Qu ct . Quectel has not |
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undertaken any independent sear h for additional informa ion, r l vant to any information |
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that may be in the customer’s possession. Furthermore, sys em validation of th s product |
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designed by Quect l within a larg r |
l tronic system remains the respons b l y of |
he |
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customer or the custom r’s syst m int |
grator. All spe |
ifi ations supplied herein are subject to |
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change. |
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Quecctel
ConfidentialCopyright
This doc ment contains proprietary technical information of Qu ct l Co., Ltd. Copying this document, distribution to others, and commun cat on of the co t ts th reof, are forbidden without permission. Offenders are liable to the paym nt of amag s. All rights are reserved in the event of a pate t gra t or registrat on of a utility mo el or design. All specifications supplied herein are subject to cha ge w thout not ce at any time.
Copyright © Shanghai Quectel Wireless Solutions Ltd. 2012.
M50_HD_V2.0 |
- 2 - |
M50Hardware Design |
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Contents |
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Contents ................................................................................................................................................... |
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3 |
Table Index .............................................................................................................................................. |
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5 |
Figure Index ............................................................................................................................................ |
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6 |
0. Revision history .................................................................................................................................. |
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8 |
1. Introduction ....................................................................................................................................... |
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1.1. Related documents.................................................................................................................... |
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1.2. Terms and abbreviations......................................................................................................... |
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1.3. Safety cautions........................................................................................................................ |
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2. Product concept ............................................................................................................................. |
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2.1. Key features ............................................................................................................................ |
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15 |
Quecctel |
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2.2. Functional diagram................................................................................................................. |
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2.3. Evaluation board..................................................................................................................... |
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3. Application interface...................................................................................................................... |
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3.1. Pin of module.......................................................................................................................... |
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3.1.1. Pin assignm nt.............................................................................................................. |
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Confidential3.9.1. UART Port....................................................................................................................42 |
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3.1.2. Pin description.............................................................................................................. |
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3.2. Operating mod s..................................................................................................................... |
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3.3. Power s pply........................................................................................................................... |
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3.3.1. Power f at |
r s of module ............................................................................................ |
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3.3.2. Decrease s |
pply voltage drop...................................................................................... |
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3.3.3. Reference design for power supply............................................................................. |
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3.3.4. Monitor power s |
pply.................................................................................................. |
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3.4. Power on and down scenarios................................................................................................ |
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3.4.1. Power on ....................................................................................................................... |
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3.4.2. Power down .................................................................................................................. |
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3.4.3. Restart ........................................................................................................................... |
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3.5. Charge interface...................................................................................................................... |
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3.6. P wer saving........................................................................................................................... |
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3.6.1. Minimum fu cti |
ality mode...................................................................................... |
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3.6.2. SLEEP m de................................................................................................................. |
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3.6.3. Wake up m dule from SLEEP mode .......................................................................... |
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3.7. Summary of state transition ................................................................................................... |
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3.8. RTC backup............................................................................................................................. |
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3.9. Serial interfaces ...................................................................................................................... |
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3.9.2. Debug Port .................................................................................................................... |
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3.9.3. Auxiliary UART Port................................................................................................... |
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3.9.4. UART application ........................................................................................................ |
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3.10. Audio interfaces.................................................................................................................... |
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3.10.1. Decrease TDD noise and other noise........................................................................ |
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3.10.2. Microphone interfaces design.................................................................................... |
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M50_HD_V2.0 |
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- 3 - |
M50Hardware Design |
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3.10.3. Receiver and speaker interface design...................................................................... |
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3.10.4. Earphone interface design.......................................................................................... |
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3.10.5. Loud speaker interface design................................................................................... |
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3.10.6. Audio characteristics.................................................................................................. |
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3.11. SIM card interface ................................................................................................................ |
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3.11.1. SIM card application.................................................................................................. |
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3.11.2. 6 Pin SIM cassette ...................................................................................................... |
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3.11.3. 8 Pin SIM cassette ...................................................................................................... |
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3.12. SD card interface .................................................................................................................. |
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3.13. PCM interface....................................................................................................................... |
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3.13.1. Configuration.............................................................................................................. |
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3.13.2. Timing |
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3.13.3. Reference design ........................................................................................................ |
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3.13.4. AT command.............................................................................................................. |
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Quecctel |
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3.14. ADC....................................................................................................................................... |
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3.15. Behaviors of the ...............................................................................................................RI |
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3.16. Network status .....................................................................................................indication |
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3.17. Operating status ..................................................................................................indication |
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Confidential |
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4. Antenna interface........................................................................................................................... |
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4.1. RF reference d ................................................................................................................sign |
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4.2. RF o tp t pow .....................................................................................................................r |
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4.3. RF receiving s .......................................................................................................... |
nsitivity |
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4.4. Operating fr q ............................................................................................................. |
nci s |
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4.5. RF cable soldering.................................................................................................................. |
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5. Electrical, reliability .........................................................................and radio character st cs |
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5.1. Absolute maximum ....................................................................................................ratings |
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5.2. Operating temperature............................................................................................................ |
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5.3. Power supply rati .............................................................................................................. |
gs |
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5.4. Current consumption .............................................................................................................. |
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5.5. Electro-static discharge .......................................................................................................... |
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6. Mechanical dime si ................................................................................................................ |
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6.1. Mechanical dime ........................................................................................ |
si s of module |
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6.2. Rec mmended ..........................................................f |
tpri t without bottom centre pads |
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6.4. T p view f the .........................................................................................................m |
dule |
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6.5. Bottom view of ....................................................................................................the module |
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7. Storage and manufacturing......................................................................................................... |
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7.1. Storage..................................................................................................................................... |
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7.2. Soldering ................................................................................................................................. |
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7.3. Packaging ................................................................................................................................ |
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Appendix A: GPRS coding .............................................................................................schemes |
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Appendix B: GPRS multi ............................................................................................-slot classes |
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M50_HD_V2.0 |
- 4 - |
M50Hardware Design |
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Table Index |
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TABLE 1: RELATED DOCUMENTS ..................................................................................................... |
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TABLE 2: TERMS AND ABBREVIATIONS........................................................................................ |
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TABLE 3: MODULE KEY FEATURES................................................................................................ |
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TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE..17 |
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TABLE 5: M50 PIN ASSIGNMENT ..................................................................................................... |
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TABLE 6: PIN DESCRIPTION ............................................................................................................. |
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TABLE 7: OVERVIEW OF OPERATING MODES.............................................................................. |
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TABLE 8: PIN DEFINITION OF THE CHARGING............................................................................ |
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TABLE 9: SUMMARY OF STATE TRANSITION............................................................................... |
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TABLE 10: LOGIC LEVELS OF THE UART INTERFACES.............................................................. |
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Quecctel |
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TABLE 11: PIN DEFINITION OF THE UART INTERFACES............................................................ |
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TABLE 12: PIN DEFINITION OF AUDIO INTERFACES .................................................................. |
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TABLE 13: AOUT3 OUTPUT CHARACTERISTICS.......................................................................... |
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TABLE 14: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS....................................... |
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TABLE 15: TYPICAL SPEAKER CHARACTERISTICS.................................................................... |
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ConfidentialTABLE 35: OPERATING TEMPERATURE.........................................................................................74 |
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TABLE 16: PIN DEFINITION OF THE SIM INTERFACE ................................................................. |
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TABLE 17: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER ......................................... |
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TABLE 18: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER................................................. |
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TABLE 19: PIN DEFINITION OF THE SD CARD INTERFACE ....................................................... |
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TABLE 20: PIN NAME OF THE SD CARD AND MICRO SD CARD............................................... |
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TABLE 21: PIN DEFINITION OF PCM INTERFACE......................................................................... |
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TABLE 22: CONFIGURATION ............................................................................................................ |
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TABLE 23: PCMON COMMAND DESCRIPTION .......................................................................... |
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TABLE 24: PCMVOL COMMAND DESCRIPTION ........................................................................ |
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TABLE 25: PIN DEFINITION OF THE ADC....................................................................................... |
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TABLE 26: CHARACTERISTICS OF THE ADC ................................................................................ |
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TABLE 27: BEHAVIORS OF THE RI .................................................................................................. |
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TABLE 28: WORKING STATE OF THE NETLIGHT ......................................................................... |
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TABLE 29: PIN DEFINITION OF THE STATUS................................................................................. |
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TABLE 30: PIN DEFINITION OF THE RF ANT................................................................................ |
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TABLE 31: THE MODULE CONDUCTED RF OUTPUT POWER .................................................... |
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TABLE 32: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY.................................... |
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TABLE 33: THE MODULE OPERATING FREQUENCIES................................................................ |
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TABLE 34: ABSOLUTE MAXIMUM RATINGS................................................................................. |
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TABLE 36: THE MODULE POWER SUPPLY RATINGS ................................................................... |
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TABLE 37: THE MODULE CURRENT CONSUMPTION.................................................................. |
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TABLE 38: THE ESD ENDURANCE (TEMPERATURE:25 ,HUMIDITY:45 %)............................ |
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TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................. |
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TABLE 40: GPRS MULTI-SLOT CLASSES ........................................................................................ |
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M50_HD_V2.0 |
- 5 - |
M50Hardware Design |
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Figure Index |
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FIGURE 1: MODULE FUNCTIONAL DIAGRAM ............................................................................. |
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FIGURE 2: PIN ASSIGNMENT............................................................................................................ |
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FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING ............................................................. |
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FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT............................................................ |
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FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY.............................................................. |
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FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................. |
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FIGURE 7: TURN ON THE MODULE USING KEYSTROKE........................................................... |
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FIGURE 8: TIMING OF TURNING ON SYSTEM .............................................................................. |
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FIGURE 9: TIMING OF TURNING OFF THE MODULE................................................................... |
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FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT............ |
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Quecctel |
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FIGURE 11: REFERENCE CIRCUIT FOR EMERG OFF BY USING BUTTON.............................. |
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FIGURE 12: TIMING OF RESTARTING SYSTEM ............................................................................ |
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FIGURE 13: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN.............. |
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FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ............................................... |
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FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY .................................................... |
40 |
ConfidentialFIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER..............................................58 |
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FIGURE 16: RTC SUPPLY FROM CAPACITOR ................................................................................ |
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FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTICS............................................. |
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FIGURE 18: REFERENCE DESIGN FOR FULL-FUNCTION UART................................................ |
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FIGURE 19: REFERENCE DESIGN FOR UART PORT ..................................................................... |
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FIGURE 20: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL... |
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FIGURE 21: REFERENCE DESIGN FOR FIRMWARE UPGRADE.................................................. |
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FIGURE 22: REFERENCE DESIGN FOR DEBUG PORT.................................................................. |
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FIGURE 23: REFERENCE DESIGN FOR AUXILIARY UART PORT............................................... |
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FIGURE 24: LEVEL MATCH DESIGN FOR 3.3V SYSTEM.............................................................. |
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FIGURE 25: LEVEL MATCH DESIGN FOR 5V SYSTEM................................................................. |
48 |
FIGURE 26: LEVEL MATCH DESIGN FOR RS-232.......................................................................... |
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FIGURE 27: REFERENCE DESIGN FOR AIN1&AIN2...................................................................... |
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FIGURE 28: REFERENCE DESIGN FOR AOUT1.............................................................................. |
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FIGURE 29: HANDSET INTERFACE DESIGN FOR AOUT2 ........................................................... |
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FIGURE 30: SPEAKER INTERFACE DESIGN WITH AN AMPLIFIER FOR AOUT2..................... |
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FIGURE 31: EARPHONE INTERFACE DESIGN ............................................................................... |
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FIGURE 32: LOUD SPEAKER INTERFACE DESIGN....................................................................... |
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FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD.................................................... |
56 |
FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD.................................................... |
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FIGURE 36: MOLEX 91228 SIM CARD HOLDER ............................................................................ |
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FIGURE 37: REFERENCE CIRCUIT OF SD CARD........................................................................... |
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FIGURE 38: LONG SYNCHRONIZATION & SIGN EXTENSION DIAGRAM ............................... |
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FIGURE 39: LONG SYNCHRONIZATION & ZERO PADDING DIAGRAM ................................... |
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FIGURE 40: SHORT SYNCHRONIZATION & SIGN EXTENSION DIAGRAM.............................. |
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FIGURE 41: SHORT SYNCHRONIZATION & ZERO PADDING DIAGRAM ................................. |
64 |
M50_HD_V2.0 |
- 6 - |
M50Hardware Design |
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FIGURE 42: REFERENCE DESIGN FOR PCM.................................................................................. |
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FIGURE 43: RI BEHAVIOR OF VOICE CALLING AS A RECEIVER .............................................. |
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FIGURE 44: RI BEHAVIOR OF DATA CALLING AS A RECEIVER ................................................ |
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FIGURE 45: RI BEHAVIOR AS ACALLER........................................................................................ |
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FIGURE 46: RI BEHAVIOR OF URC OR SMS RECEIVED .............................................................. |
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FIGURE 47: REFERENCE DESIGN FOR NETLIGHT....................................................................... |
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FIGURE 48: REFERENCE DESIGN FOR STATUS ............................................................................ |
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FIGURE 49: REFERENCE DESIGN FOR RF...................................................................................... |
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FIGURE 50: RF SOLDERING SAMPLE.............................................................................................. |
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FIGURE 51: M50 TOP AND SIDE DIMENSIONS .............................................................................. |
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FIGURE 52: M50 BOTTOM DIMENSIONS........................................................................................ |
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FIGURE 53: RECOMMENDED FOOTPRINT WITHOUT BOTTOM CENTRE PADS .................... |
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FIGURE 55: TOP VIEW OF THE MODULE ....................................................................................... |
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FIGURE 56: BOTTOM VIEW OF THE MODULE.............................................................................. |
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Quecctel |
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FIGURE 57: PASTE APPLICATION .................................................................................................... |
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FIGURE 58: RAMP-SOAK-SPIKE REFLOW PROFILE .................................................................... |
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FIGURE 59: MODULE TRAY .............................................................................................................. |
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FIGURE 60: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ........................................... |
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Confidential |
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FIGURE 61: RADIO BLOCK STRUCTURE OF CS-4........................................................................ |
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M50_HD_V2.0 |
- 7 - |
M50Hardware Design
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Revision |
Date |
Author |
Description of change |
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1.0 |
2011-12-20 |
Ray XU |
Initial |
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1.1 |
2012-02-03 |
Ray XU |
1. |
Updated PCM interface |
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2. |
Updated SD interface |
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3. |
Updated charging interface |
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4. |
Updated timing of turning on the module |
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1.2 |
2012-07-20 |
Baly BAO |
1. |
Deleted the USB interface |
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2. |
Deleted the camera interface |
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1.3 |
2012-10-22 |
Mountain ZHOU |
1. |
Updated functional diagram |
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Quecctel |
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2. |
Upda ed r f r nce d sign circuit |
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3. |
Upda ed audio charact ristics |
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4. |
Upda ed VRTC DC charact ristics |
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5. |
Upda ed SLEEP curr nt consumption |
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6. |
Upda ed in ernet service protocols |
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7. |
Updated SIM pins’ name |
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Confidential |
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8. |
Modified PCM function |
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9. |
Deleted FAX fu ction |
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2.0 |
2012-06-16 |
Ray XU |
1. |
Update the module size |
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2. |
Update the pin layout |
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M50_HD_V2.0 |
- 8 - |
M50 Hardware Design
This document defines the M50 module and describes the hardware interface of M50 which are connected with the customer application and the air interface.
This document can help customers quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, customers can use M50module to design and set up mobile applications easily.
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Table 1: Related documents |
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QuecctelSpec cat on of the SIM Application Toolkit for the |
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Document name |
Remark |
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[1] |
M50 ATC |
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AT |
ommands set |
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[2] |
ITU-T |
Draft |
new Serial asyn hronous au oma ic dialing and control |
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Confidential |
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recommendation V.25t r |
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[3] |
GSM 07.07 |
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Digital |
ellular tele ommunications (Phase |
2+); |
AT |
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ommand set for GSM Mobile Equipme |
(ME) |
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[4] |
GSM 07.10 |
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Support GSM 07.10 multipl xi |
g pro ocol |
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[5] |
GSM 07.05 |
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Digital cellular t l commu icatio s (Phase 2+); Use |
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of |
Data T rminal Equipm |
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– |
Data |
Circuit |
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term nat ng Equipm nt (DTE |
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DCE) |
i terface |
for |
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Short Message S rvice (SMS) and Cell Broadcast |
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Serv ce (CBS) |
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[6] |
GSM 11.14 |
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D g tal |
cellular telecommunications |
(Phase |
2+); |
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Subscriber Identity module – Mobile Equipment (SIM |
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– ME) interface |
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[7] |
GSM 11.11 |
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Digital cellular telecommunications (Phase 2+); |
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Specification of the Subscriber Identity module – |
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Mobile Equipment (SIM – ME) interface |
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[8] |
GSM 03.38 |
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Digital cellular telecommunications (Phase 2+); |
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Alphabets and language-specific information |
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[9] |
GSM 11.10 |
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Digital cellular telecommunications (Phase 2); Mobile |
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Station (MS) conformance specification; Part 1: |
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Conformance specification |
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[10] |
GSM_UART_AN |
UART port application note |
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[11]GSM_FW_Upgrade_AN01 GSM Firmware upgrade application note
[12] M10_EVB_UGD |
M10 EVB user guide |
M50_HD_V2.0 |
- 9 - |
M50 Hardware Design
Table 2: Terms and abbreviations
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Abbreviation |
Description |
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ADC |
Analog-to-Digital Converter |
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AMR |
Adaptive Multi-Rate |
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ARP |
Antenna Reference Point |
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ASIC |
Application Specific Integrated Circuit |
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BER |
Bit Error Rate |
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BOM |
Bill Of Material |
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BTS |
Base Transceiver Station |
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Quecctel |
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CHAP |
Challenge Handshake Authentication Pro ocol |
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CS |
Coding Scheme |
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CSD |
Circuit Switched Data |
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CTS |
Clear To Send |
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DAC |
Digital-to-Analog Converter |
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Confidential |
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DRX |
Discontinuous R |
ption |
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DSP |
Digital Signal Pro |
ssor |
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DCE |
Data Comm ni ations Equipment (typically module) |
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DTE |
Data T rminal Equipm nt (typically comput r, xt r al co roller) |
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DTR |
Data T rminal R ady |
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DTX |
Discontin o s Transmission |
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EFR |
Enhanced F ll Rate |
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EGSM |
Enhanced GSM |
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EMC |
Electromagnetic Compat b l ty |
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ESD |
Electrostatic Discharge |
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ETS |
Eur pean Telecommu cat on Standard |
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FCC |
Federal C mmu icatio s Commission (U.S.) |
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FDMA |
Freque cy Division Multiple Access |
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FR |
Full Rate |
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GMSK |
Gaussian Minimum Shift Keying |
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GPRS |
General Packet Radio Service |
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GSM |
Global System for Mobile Communications |
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HR |
Half Rate |
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I/O |
Input/Output |
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IC |
Integrated Circuit |
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IMEI |
International Mobile Equipment Identity |
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Imax |
Maximum Load Current |
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Inorm |
Normal Current |
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kbps |
Kilo Bits Per Second |
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LED |
Light Emitting Diode |
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M50_HD_V2.0 |
|
- 10 - |
|
M50 Hardware Design
|
Li-Ion |
Lithium-Ion |
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MO |
Mobile Originated |
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MS |
Mobile Station (GSM engine) |
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MT |
Mobile Terminated |
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PAP |
Password Authentication Protocol |
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PBCCH |
Packet Switched Broadcast Control Channel |
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PCB |
Printed Circuit Board |
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PDU |
Protocol Data Unit |
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PPP |
Point-to-Point Protocol |
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RF |
Radio Frequency |
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RMS |
Root Mean Square (value) |
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RTC |
Real Time Clock |
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RX |
Receive Direction |
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VILmax |
QuecctelMaximum I put Low Level Voltage Value |
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SIM |
Subscriber Identification Module |
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SMS |
Short Message Service |
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TDMA |
Time Division Multiple A ess |
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TE |
Terminal Equipment |
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TX |
Confidential |
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Transmitting Dir tion |
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UART |
Univ rsal Asyn hronous Re eiver & Transmitter |
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URC |
Unsolicit d R sult Code |
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USSD |
Unstr ct r d Suppl m ntary Service Data |
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VSWR |
Voltage Standing Wave Ratio |
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Vmax |
Maxim m Voltage Value |
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Vnorm |
Normal Voltage Value |
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Vmin |
Minimum Voltage Value |
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VIHmax |
Maximum Input H gh Level Voltage Value |
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VIHmin |
Mi imum I put High Level Voltage Value |
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VILmin |
Mi imum I put Low Level Voltage Value |
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VImax |
Abs lute Maximum I put Voltage Value |
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VImin |
Abs lute Mi imum I put Voltage Value |
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VOHmax |
Maximum Output High Level Voltage Value |
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VOHmin |
Minimum Output High Level Voltage Value |
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VOLmax |
Maximum Output Low Level Voltage Value |
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VOLmin |
Minimum Output Low Level Voltage Value |
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Phonebook abbreviations |
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LD |
SIM Last Dialing phonebook (list of numbers most recently dialed) |
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MC |
Mobile Equipment list of unanswered MT Calls (missed calls) |
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ON |
SIM (or ME) Own Numbers (MSISDNs) list |
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RC |
Mobile Equipment list of Received Calls |
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SM |
SIM phonebook |
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M50_HD_V2.0 |
- 11 - |
M50 Hardware Design
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating M50module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for customer failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions about the |
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use of mobile. Switch the cellular terminal or mobile off. Medical equipment may |
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Quecctel |
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be sensitive to not operate normally for RF |
n rgy int rf r nce. |
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Switch off the cellular terminal or mobile b |
fore boarding an aircraft. Make sure |
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it switched off. The operation of wireless applianc s in an aircraft is forbidden to |
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prevent interferen e with |
ommuni a ion sys |
ms. Forg t to think much of these |
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Confidential |
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instructions may l ad to the flight safe y or offend against local legal |
c on, or |
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both. |
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Do not op rate the c llular terminal or mobile in the pr s |
ce of flammable gas |
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or f me. Switch off the c llular terminal wh |
n you are |
ar pe rol s a ion, fuel |
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depot, chemical plant or where blasting op |
ratio s are in progress. Operation of |
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any electrical equipment |
n potent ally xplosive atmosph re can co |
stitute a |
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safety hazard. |
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Y |
ur cellular termi al or mob le receives and transmits radio frequency energy |
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while switched on. RF i ter erence can occur if it is used close to TV set, radio, |
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c |
mputer r |
ther electric equipment. |
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R |
ad safety c |
mes first! Do not use a hand-held cellular terminal or mobile while |
driving a vehicle, unless it is securely mounted in a holder for hands-free operation. Before making a call with a hand-held terminal or mobile, park the vehicle.
M50_HD_V2.0 |
- 12 - |
M50 Hardware Design
GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, Please Remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call.
QuecctelAlso, some networks require that a valid SIM card be prop r y inserted in cellular terminal or mobile.
According to the R&TTE Dire tive 1999/95/CE, all wir l ss quipment and
Confidentialtelecommunications terminals sold in EU must m t all the stipulated he lth, safety RF, EMC requirements that provide for CE mark. Quectel Module M50
is fully in accordan with all the dire tives of EU.
The M50 mod le is designed to comply with the FCC stat m nts. FCC ID: XMR201211M50. The Host system sing M50, should have label n cated contains FCC ID: XMR201211M50.
1.4.1. FCC Stateme t
1. This device c mplies with Part 15 of the FCC rules. Operation is subject to the following conditi ns:
a) This device may t cause harmful interference.
b)This device must accept any interference received, including interference that may cause undesired perati n.
2.hanges or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage.
M50_HD_V2.0 |
- 13 - |
M50 Hardware Design
The manual of the host system, which uses M50, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of M50 module depending on the Mobile status.
The following list of antenna is indicating the maximum permissible antenna gain.
|
Type |
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Maximum Gain |
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Maximum Gain |
Impedance |
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(850Hz/900Hz) |
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(1800Hz/1900Hz) |
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External |
Monopole |
0.5dBi |
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2dBi |
50Ω |
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Antenna |
Vehicular antenna |
0.5dBi |
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2dBi |
50Ω |
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Internal |
Monopole |
0.5dBi |
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2dBi |
50Ω |
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Antenna |
PIFA |
0.5dBi |
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2dBi |
50Ω |
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FPC |
0.5dBi |
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2dBi |
50Ω |
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Quecctel |
50Ω |
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PCB |
0.5dBi |
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2dBi |
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This radio module must not be installed |
o o-locate and operate simu |
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ltaneously with oth r radios in host sys em; |
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Confidential |
additional testing and quipm nt authorization may be requ red o op erating sim ltan o sly with oth r radios.
M50_HD_V2.0 |
- 14 - |
M50 Hardware Design
M50 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M50 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix A and Appendix B.
With a tiny profile of 24.5mm×25.3mm×2.6mm, the module can meet almost all the requirements for M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA, Smart Metering, and Remote Maintenance & Control etc.
|
M50 is an SMD type |
module with LCC package, which |
can be |
mb dd d in customer’s |
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QuecctelTable 3: Module key features |
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applications. It provides abundant hardware interfaces be w |
n he modu |
and customer’s host |
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board. |
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Designed with power saving technique, the urrent onsump ion of M50 is as low as 1.3 mA in |
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SLEEP mode when DRX is 5. |
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Confidential |
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M50 is integrated with Int rn t s rvi |
proto ols, su h as TCP, UDP, FTP a d PPP. Ex ended AT |
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commands have been d v lop d for |
ustom r to use these Internet service protocols eas ly. |
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The mod le f lly compli s with the RoHS directive of the Europ an U |
ion. |
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2.1. Key features |
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Feature |
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Description |
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Power supply |
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Si gle supply voltage 3.3V~ 4.6V |
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Typical supply voltage 4.0V |
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Power saving |
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Typical power consumption in SLEEP mode: |
1.3 mA@ DRX=5 |
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1.2 mA@ DRX=9 |
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Frequency bands |
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Quad-band: GSM850, GSM900, DCS1800, PCS1900. |
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The module can search these frequency bands automatically |
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The frequency bands can be set by AT command. |
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Compliant with GSM Phase 2/2+ |
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GSM class |
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Small MS |
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Transmitting power |
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Class 4 (2W) at GSM850 and GSM900 |
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Class 1 (1W) at DCS1800 and PCS1900 |
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GPRS connectivity |
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GPRS multi-slot class 12 |
(default) |
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GPRS multi-slot class 1~12 |
(configurable) |
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GPRS mobile station class B |
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M50_HD_V2.0 |
|
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|
- 15 - |
|
M50 Hardware Design
|
Temperature range |
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Normal operation: -35°C ~ +80°C |
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Restricted operation: -40°C ~ -35°C and +80°C ~ +85°C 1) |
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Storage temperature: -45°C ~ +90°C |
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DATA GPRS: |
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GPRS data downlink transfer: max. 85.6 kbps |
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GPRS data uplink transfer: max. 85.6 kbps |
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Coding scheme: CS-1, CS-2, CS-3 and CS-4 |
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Support the protocols PAP (Password Authentication Protocol) |
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usually used for PPP connections |
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Internet service protocols |
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TCP/UDP/FTP/PPP/HTTP/NTP/PING |
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Quecctel |
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Support Packet Broadcast Control Channel (PBCCH) |
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CSD: |
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CSD transmission rates: 2.4, 4.8, 9.6, 14.4 kbps non-transparent |
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Support Unstructured Suppl m n ary S rvice Data (USSD) |
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SMS |
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Text and PDU mode |
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SMS storage: SIM ard |
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SIM interface |
Support SIM card: 1.8V, 3V |
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Audio features |
Spee h odec modes: |
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Half Rate (ETS 06.20) |
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ConfidentialSIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99 |
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Full Rate (ETS 06.10) |
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Enhan d Full Rate (ETS 06.50 / 06.60 / 06.80) |
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Adaptive Multi-Rate (AMR) |
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Echo Suppression |
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Echo Canc llation |
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Noise Re uction |
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Embedded one ampl fi r of class AB with maximum driving |
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power up to 800mW |
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UART interfaces |
UART Port: |
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Seven l es on UART port interface |
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Used or AT comman , GPRS ata and CSD data |
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Multiplexing unction |
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Support autobauding from 4800 bps to 115200 bps |
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Debug Port: |
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Two lines on debug port interface DBG TXD and DBG RXD |
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Debug Port only used for firmware debugging |
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Auxiliary Port: |
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Used for AT command |
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Phonebook management |
Support phonebook types: SM, ME, ON, MC, RC, DC, LD, LA |
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Real time clock |
Supported |
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Physical characteristics |
Size: |
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24.5 (±0.15) × 25.3 (±0.15) × 2.6 (±0.2) mm |
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Weight: 3.3g |
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Firmware upgrade |
Firmware upgrade via UART Port |
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M50_HD_V2.0 |
|
- 16 - |
|
M50 Hardware Design
Antenna interface |
Connected to antenna pad with 50 Ohm impedance control |
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1 When the module works in this temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased.
Table 4: Coding schemes and maximum net data rates over air interface
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Coding scheme |
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1 Timeslot |
2 Timeslot |
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4 Timeslot |
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CS-1 |
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9.05kbps |
18.1kbps |
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36.2kbps |
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CS-2 |
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13.4kbps |
26.8kbps |
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53.6kbps |
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CS-3 |
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15.6kbps |
31.2kbps |
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62.4kbps |
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CS-4 |
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21.4kbps |
42.8kbps |
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85.6kbps |
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Quecctel |
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|
2.2. Functional diagram |
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|||
Confidential |
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The following figure shows a blo k diagram of the M50 module |
and illus ra es he m jor |
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functional parts: |
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Power manag m nt |
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Baseband |
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Serial Flash |
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The radio freq ency part |
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The peripheral interface |
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—Charge interface |
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—PCM interface |
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—SD interface |
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—SIM interface |
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—Audio i |
terface |
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—Serial i |
terface |
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—P wer supply
—RF interface
—ADC
—Turn on/off interface (PWRKEY & EMERG OFF)
M50_HD_V2.0 |
- 17 - |
M50 Hardware Design
RF_ANT |
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ESD |
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RF |
PAM |
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SAW |
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VBAT |
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Charge |
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RF Transceiver |
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26MHz |
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Interface |
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PWRKEY |
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EMERG_OFF |
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Reset |
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SD |
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SD |
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2.3. Evaluation |
Quecctelboard |
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Interface |
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NETLIGHT |
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Int rface |
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Figure 1: Mo ule unct onal |
iagram |
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||||||||||||||
In order to help cust |
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mer to develop appl cat ons w th M50 , Quectel supplies an evaluation board |
||||||||||||||||||||||||||||||||||||
(EVB), RS-232 to USB cable, power adapter, earphone, antenna and other peripherals to control |
||||||||||||||||||||||||||||||||||||||
or test the m dule. F |
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r details, please refer to the document [12]. |
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M50_HD_V2.0 |
- 18 - |
M50 Hardware Design
The module is equipped with 83-pin SMT pads and it adopts LCC package. Detailed descriptions on Sub-interfaces included in these pads are given in the following chapters:
Power supply Power on/down Charge interface RTC
Serial interfaces Audio interfaces SIM interface
Quecctel SD interface PCM interface
ADC
Confidential
M50_HD_V2.0 |
- 19 - |
M50 Hardware Design
|
|
|
RESERVED |
RESERVED |
RESERVED |
RESERVED |
VBAT |
VBAT |
VBAT |
VBAT |
GND |
GND |
GND |
RF ANT |
GND |
GND |
VDD EXT |
VRTC |
RESERVED |
SIM PRESENCE |
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||||||||||||
|
74 |
73 |
72 |
71 |
70 |
69 |
68 |
67 |
66 |
65 |
64 |
63 |
62 |
61 |
60 |
59 |
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58 |
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57 |
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ADC1 |
1 |
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SIM1_VDD |
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56 |
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55 |
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ADC0 |
2 |
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Top view |
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SIM1_DATA |
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RESERVED |
3 |
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54 |
SIM1_CLK |
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NETLIGHT |
4 |
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53 |
SIM1_RST |
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SPK2P |
5 |
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52 |
SIM1_GND |
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AGND |
6 |
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51 |
TXD |
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Confidential |
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MIC2P |
7 |
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GND |
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50 |
RXD |
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MIC2N |
8 |
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82 |
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49 |
RTS |
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MIC1P |
9 |
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RESERVED 75 |
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81 GND |
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48 |
CTS |
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MIC1N 10 |
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RESERVED 76 |
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83 |
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80 GND |
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47 |
DTR |
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SPK1N 11 |
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RESERVED 77 |
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79 GND |
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46 |
RI |
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SPK1P 12 |
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78 |
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45 |
DCD |
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LOUDSPKN 13 |
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RESERVED |
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44 |
RESERVED |
|||||||
LOUDSPKP 14 |
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43 |
DBG RXD |
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STATUS 15 |
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42 |
DBG TXD |
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PWRKEY 16 |
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41 |
RXD AUX |
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EMERG OFF 17 |
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40 |
TXD AUX |
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PCM IN 18 |
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39 |
RESERVED |
|||||
PCM CLK |
19 |
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38 |
RESERVED |
||||
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20 |
21 |
22 |
23 |
24 |
25 |
26 |
27 |
28 |
29 |
30 |
31 |
32 |
33 |
34 |
35 |
36 |
37 |
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|||||||||
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|
PCM OUT |
PCM SYNC |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
RESERVED |
SD CMD |
SD CLK |
SD DATA0 |
GND |
|
||||||||||||
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VBAT |
Other |
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GND |
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RF |
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PCM |
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UART |
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ADC |
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||||||||||||||||
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Power |
SIM |
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Reserved |
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SD |
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Audio |
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Figure 2: Pin assignment
M50_HD_V2.0 |
- 20 - |
M50 Hardware Design
Table 5: M50 pin assignment
|
|
|
/ |
|
|
|
/ |
|
|
1 |
ADC1 |
I |
|
2 |
ADC0 |
I |
|
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|
|
|
|
|
|
|
3 |
RESERVED |
|
|
4 |
NETLIGHT |
O |
|
|
5 |
SPK2P |
O |
|
6 |
AGND |
|
|
|
7 |
MIC2P |
I |
|
8 |
MIC2N |
I |
|
|
9 |
MIC1P |
I |
|
10 |
MIC1N |
I |
|
|
11 |
SPK1N |
O |
|
12 |
SPK1P |
O |
|
|
|
|
|
|
|
|
|
|
|
13 |
LOUDSPKN |
O |
|
14 |
LOUDSPKP |
O |
|
|
15 |
STATUS |
O |
|
16 |
PWRKEY |
I |
|
|
17 |
EMERG_OFF |
I |
|
18 |
PCM_IN |
I |
|
|
45 |
QuecctelDCD O 46 RI |
O |
|
||||
|
19 |
PCM CLK |
O |
20 |
PCM OUT |
O |
|
|
|
21 |
PCM SYNC |
O |
22 |
RESERVED |
|
|
|
|
23 |
RESERVED |
|
24 |
RESERVED |
|
|
|
|
25 |
RESERVED |
|
26 |
RESERVED |
|
|
|
|
27 |
RESERVED |
|
28 |
RESERVED |
|
|
|
|
61 |
ConfidentialGND 62 GND |
|
|||||
|
29 |
RESERVED |
|
30 |
RESERVED |
|
|
|
|
31 |
RESERVED |
|
32 |
RESERVED |
|
|
|
|
33 |
RESERVED |
|
34 |
SD CMD |
O |
|
|
|
35 |
SD CLK |
O |
36 |
SD DATA0 |
I/O |
|
|
|
37 |
GND |
|
38 |
RESERVED |
|
|
|
|
39 |
RESERVED |
|
40 |
TXD AUX |
O |
|
|
|
41 |
RXD AUX |
I |
42 |
DBG TXD |
O |
|
|
|
43 |
DBG RXD |
I |
44 |
RESERVED |
|
|
|
|
47 |
DTR |
I |
|
48 |
CTS |
O |
|
|
49 |
RTS |
I |
50 |
RXD |
I |
|
|
|
|
|
|
|
|
|
|
|
|
51 |
TXD |
O |
|
52 |
SIM GND |
|
|
|
53 |
SIM RST |
O |
|
54 |
SIM CLK |
O |
|
|
55 |
SIM DATA |
I/O |
|
56 |
SIM VDD |
O |
|
|
57 |
SIM PRESENCE |
I |
|
58 |
RESERVED |
|
|
|
59 |
VRTC |
I/O |
|
60 |
VDD EXT |
O |
|
|
|
|
|
|
|
|
|
|
|
63 |
RF_ANT |
I/O |
|
64 |
GND |
|
|
|
65 |
GND |
|
|
66 |
GND |
|
|
|
67 |
VBAT |
I |
|
68 |
VBAT |
I |
|
|
69 |
VBAT |
I |
|
70 |
VBAT |
I |
|
|
71 |
RESERVED |
|
72 |
RESERVED |
|
|
|
|
M50_HD_V2.0 |
|
|
|
|
- 21 - |
|
M50 Hardware Design
73 |
RESERVED |
|
|
74 |
RESERVED |
|
75 |
RESERVED |
|
|
76 |
RESERVED |
|
77 |
RESERVED |
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78 |
RESERVED |
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79 |
GND |
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80 |
GND |
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81 |
GND |
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82 |
GND |
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83 |
GND |
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Note: Keep all reserved pins open.
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Table 6: Pin description |
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Quecctel |
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Power supply |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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VBAT |
Confidential |
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|||||
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67, |
I |
Main pow r supply |
Vmax= 4.6V |
Make sure th t |
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68, |
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of modul : |
Vmin=3.3V |
supply suff c ent |
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69 |
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VBAT=3.3V~4.6V |
Vnorm=4.0V |
curre |
n |
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70 |
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ra sm |
ng |
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burst wh ch |
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ypically rises to |
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1.6A. |
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VRTC |
59 |
I/O |
Power supply for |
VImax=3.3V |
If u used, keep |
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RTC when VBAT s |
VImin=1.5V |
this pin open. |
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not suppl ed or the |
VInorm=2.8V |
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system. |
VOmax=2.85V |
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Charg g or backup |
VOmin=2.6V |
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battery or golden |
VOnorm=2.8V |
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capacitor when the |
Iout(max)= 1mA |
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VBAT is supplied. |
Iin=2.6~5 uA |
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VDD EXT |
60 |
O |
Supply 2.8V voltage |
Vmax=2.9V |
1. If unused, |
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for external circuit. |
Vmin=2.7V |
keep this pin |
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Vnorm=2.8V |
open. |
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Imax=20mA |
2. Recommended |
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to add a |
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2.2~4.7uF |
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bypass capacitor |
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when supplying |
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power for |
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external circuit. |
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GND |
37, |
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Ground |
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61, |
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M50_HD_V2.0 |
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- 22 - |
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M50 Hardware Design |
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62, |
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64, |
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65, |
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66, |
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Turn on/off |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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PWRKEY |
15 |
I |
Turn on/off control. |
VILmax= |
Pulled up to |
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PWRKEY should be |
0.1×VBAT |
VBAT internally. |
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pulled down for a |
VIHmin= |
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moment to turn on |
0.6×VBAT |
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or off the system. |
VImax=VBAT |
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Emergency shutdown |
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Quecctel |
COMMENT |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
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NO. |
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CHARACTERISTICS |
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EMERG OFF |
17 |
I |
Emergency off. |
VILmax=0.4V |
Open |
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Pulled down for at |
VIHmin=2.2V |
drain/collector |
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Confidential |
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l ast 20ms, whi h |
Vopenmax=2.8V |
dr ver requ red n |
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will turn off the |
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cellular dev ce |
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module in ase of |
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appl ca |
on. |
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m rg n y. Use it |
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If u used, keep |
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only wh n normal |
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h s p |
open. |
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shutdown through |
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PWRKEY or AT |
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command cannot |
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per orm well. |
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Module indicator |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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STATUS |
16 |
O |
I dicate module |
VOHmin= |
If unused, keep |
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operati g status. |
0.85×VDD EXT |
this pin open. |
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High level indicates |
VOLmax= |
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module is power-on |
0.15×VDD EXT |
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and low level |
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indicates |
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power-down. |
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Audio interface |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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MIC1P |
9, 10 |
I |
Channel one for |
|
If unused, keep |
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MIC1N |
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positive and |
|
these pins open. |
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negative voice-band |
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input |
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M50_HD_V2.0 |
|
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|
- 23 - |
|
|
M50 Hardware Design
|
MIC2P |
7, 8 |
I |
Channel two for |
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MIC2N |
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positive and |
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negative voice-band |
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input |
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SPK1P |
12, 11 |
O |
Channel one for |
|
1. If unused, |
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SPK1N |
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positive and |
|
keep these pins |
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negative voice-band |
|
open. |
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output |
|
2. Support both |
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SPK2P |
5 |
O |
Channel two for |
|
voice and |
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voice-band output |
|
ringtone output. |
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AGND |
6 |
|
Analog ground. |
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Constitute a pseudo |
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differential channel |
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Quecctel |
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with SPK2P. |
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LOUDSPKN |
13, |
O |
Channel three of |
|
1. If unused, |
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LOUDSPKP |
14 |
|
positive and |
|
keep these pins |
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negative voi e-band |
|
open. |
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output |
|
2. Embedded |
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ConfidentialVIHmin= recommend |
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ampl f er of cl ss |
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AB n ern lly. |
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3. Support bo h |
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vo ce a |
d |
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ri g o |
e ou put. |
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Net status indicator |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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NETLIGHT |
4 |
O |
Network status |
VOHmin= |
If unused, keep |
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i dicat on |
0.85×VDD EXT |
this pin open. |
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VOLmax= |
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0.15×VDD EXT |
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UART P rt |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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|
NO. |
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CHARACTERISTICS |
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DTR |
47 |
I |
Data terminal ready |
VILmin=0V |
If only use TXD, |
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VILmax= |
RXD and GND |
|
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RXD |
50 |
I |
Receive data |
|
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TXD |
49 |
O |
Transmit data |
0.25×VDD EXT |
to communicate, |
|
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||||
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RTS |
51 |
I |
Request to send |
0.75×VDD_EXT |
pulling down |
|
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CTS |
48 |
O |
Clear to send |
|
|||
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VIHmax= |
RTS and keeping |
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RI |
46 |
O |
Ring indicator |
|
|||
|
VDD_EXT+0.3 |
other pins open. |
|
|||||
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|||
|
DCD |
45 |
O |
Data carrier |
|
|||
|
VOHmin= |
|
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|
||||
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|
detection |
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0.85×VDD_EXT |
|
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VOLmax= |
|
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|
M50_HD_V2.0 |
|
|
|
|
|
- 24 - |
|
M50 Hardware Design
|
|
|
|
|
0.15×VDD_EXT |
|
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Debug Port |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
|
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|
NO. |
|
|
CHARACTERISTICS |
|
|
|
DBG_TXD |
42 |
O |
UART interface for |
VILmin=0V |
If unused, keep |
|
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|
|
debugging only. |
VILmax= |
these pins open. |
|
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0.25×VDD_EXT |
|
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VIHmin= |
|
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0.75×VDD_EXT |
|
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DBG_RXD |
43 |
I |
|
VIHmax= |
|
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VDD_EXT+0.3 |
|
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VOHmin= |
|
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|
Quecctel |
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|||
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0.85×VDD EXT |
|
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VOLmax= |
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0.15×VDD EXT |
|
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Auxiliary UART Port |
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|
PIN NAME |
PIN |
Confidential1.8V or 3V. protected against |
|
|||
|
I/O |
DESCRIPTION |
DC |
COMMENT |
|
||
|
|
NO. |
|
|
CHARACTERISTICS |
|
|
|
TXD AUX |
40 |
O |
Transmit data |
VILmin=0V |
If u used, keep |
|
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|
|
VILmax= |
hese p ns open. |
|
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|
|
0.25×VDD EXT |
|
|
|
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|
|
VIHmin= |
|
|
|
RXD AUX |
41 |
I |
Rece ve data |
0.75×VDD EXT |
|
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VIHmax= |
|
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VDD EXT+0.3 |
|
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VOHmin= |
|
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|
0.85×VDD EXT |
|
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VOLmax= |
|
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|
0.15×VDD EXT |
|
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|
SIM interface |
|
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|
PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
|
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|
NO. |
|
|
CHARACTERISTICS |
|
|
|
SIM VDD |
56 |
O |
Power supply for |
The voltage can be |
All signals of |
|
|
|
|
|
SIM card |
selected by firmware |
SIM interface |
|
|
|
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|
|
automatically. Either |
should be |
|
|
|
|
|
|
|
ESD with a TVS |
|
|
SIM_DATA |
54 |
I/O |
SIM data |
3V |
|
|
|
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|
|
|
VOLmax=0.4 |
diode array. |
|
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|
|
VOHmin= |
Maximum cable |
|
|
|
|
|
|
SIM_VDD-0.4 |
length is 200mm |
|
|
|
|
|
|
1.8V: |
from the module |
|
|
|
|
|
|
VOLmax= |
pad to SIM card |
|
|
M50_HD_V2.0 |
|
|
|
|
- 25 - |
|
M50 Hardware Design
|
|
|
|
|
|
0.15×SIM_VDD |
holder. |
|
|
|
|
|
|
|
VOHmin= |
|
|
|
|
|
|
|
|
SIM_VDD-0.4 |
|
|
|
SIM_CLK |
55 |
O |
SIM clock |
3V |
|
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|
|
VOLmax=0.4 |
|
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|
|
VOHmin= |
|
|
|
|
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|
|
0.9×SIM_VDD |
|
|
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|
|
1.8V: |
|
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|
|
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|
|
VOLmax= |
|
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|
|
0.12×SIM_VDD |
|
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|
|
VOHmin= |
|
|
|
|
|
|
|
|
0.9×SIM_VDD |
|
|
|
SIM_RST |
53 |
O |
SIM reset |
3V |
|
|
|
|
|
QuecctelVDD EXT+0.3 |
|
|
||||
|
|
|
|
|
|
VOLmax=0.36 |
|
|
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|
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|
|
|
VOHmin= |
|
|
|
|
|
|
|
|
0.9×SIM VDD |
|
|
|
|
|
|
|
|
1.8V: |
|
|
|
|
|
|
|
|
VOLmax= |
|
|
|
|
Confidential |
|
|||||
|
|
|
|
|
|
0.2×SIM VDD |
|
|
|
|
|
|
|
|
VOHmin= |
|
|
|
|
|
|
|
|
0.9×SIM VDD |
|
|
|
SIM GND |
52 |
|
SIM ground |
|
|
|
|
|
SIM PRESEN |
57 |
I |
SIM card detection |
VILmin=0V |
If u used, keep |
|
|
|
CE |
|
|
|
|
VILmax= |
this pin open. |
|
|
|
|
|
|
|
0.25×VDD EXT |
|
|
|
|
|
|
|
|
VIHmin= |
|
|
|
|
|
|
|
|
0.75×VDD EXT |
|
|
|
|
|
|
|
|
VIHmax= |
|
|
|
ADC |
|
|
|
|
|
|
|
|
PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
|
|
|
|
|
NO. |
|
|
CHARACTERISTICS |
|
|
|
AD |
0 |
2 |
I |
General purpose |
Voltage range: 0V to |
Please give |
|
|
|
|
|
|
analog to digital |
2.8V |
priority to the |
|
|
|
|
|
|
converter. |
|
use of ADC0. |
|
|
AD |
1 |
1 |
I |
General purpose |
Voltage range: 0V to |
If unused, keep |
|
|
|
|
|
|
analog to digital |
2.8V |
these pins open. |
|
|
|
|
|
|
converter. |
|
|
|
|
|
|
|
|
|
|
|
|
|
PCM |
|
|
|
|
|
|
|
|
PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
|
|
|
|
|
NO. |
|
|
CHARACTERISTICS |
|
|
|
PCM_CLK |
19 |
O |
PCM clock |
VILmin=0V |
|
|
|
|
PCM_IN |
18 |
I |
PCM data input |
VILmax= |
|
|
|
|
M50_HD_V2.0 |
|
|
|
|
- 26 - |
|
M50 Hardware Design
|
PCM_OUT |
20 |
O |
PCM data output |
0.25×VDD_EXT |
|
|
|
|
PCM_SYNC |
21 |
O |
PCM frame |
VIHmin= |
|
|
|
|
|
|
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synchronization |
0.75×VDD_EXT |
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VIHmax= |
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VDD_EXT+0.3 |
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VOHmin= |
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0.85×VDD_EXT |
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VOLmax= |
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0.15×VDD_EXT |
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SD card |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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SD_CMD |
34 |
O |
SD command |
VILmin=0V |
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Quecctel |
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SD CLK |
35 |
O |
SD clock |
VILmax= |
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SD DATA0 |
36 |
I/O |
SD data |
0.25×VDD EXT |
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VIHmin= |
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0.75×VDD EXT |
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VIHmax= |
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Confidential |
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VDD EXT+0.3 |
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VOHmin= |
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0.85×VDD EXT |
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VOLmax= |
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0.15×VDD EXT |
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RF interface |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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RF ANT |
63 |
I/O |
RF antenna pad |
Imp ance of 50Ω |
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Other interface |
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PIN NAME |
PIN |
I/O |
DESCRIPTION |
DC |
COMMENT |
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NO. |
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CHARACTERISTICS |
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DOWNLOAD |
3 |
I |
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VILmin=0V |
Keep this |
pin |
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VILmax= |
open. |
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0.25×VDD EXT |
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VIHmin= |
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0.75×VDD EXT |
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VIHmax= |
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VDD EXT+0.3 |
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RESERVED |
22~ |
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Keep these |
pins |
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33 |
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open. |
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38~ |
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39, |
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44, |
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58, |
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M50_HD_V2.0 |
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- 27 - |
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