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201807EG06A
Users Manual
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Quectel Wireless Solutions 201807EG06A Users Manual

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EG06 Manual
LTE-A Module Series
Rev. EG06_Hardware_Design_V1.0
Date: 2018-05-16
Status: Released
LTE-A Module Series
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Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7
th
Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
http://quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://quectel.com/support/technical.htm
Or Email to: support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF
DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR
REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved
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About the Document
History
Revision
Date
Author
Description
1.0
2018-04-11
King MA/
Wison HE
Initial
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 6
Figure Index ................................................................................................................................................. 8
1 Introduction ........................................................................................................................................ 10
1.1. Safety Information.................................................................................................................... 11
2 Product Concept ................................................................................................................................ 13
2.1. General Description ................................................................................................................. 13
2.2. Key Features ........................................................................................................................... 14
2.3. Functional Diagram ................................................................................................................. 16
2.4. Evaluation Board ..................................................................................................................... 17
3 Application Interface ......................................................................................................................... 18
3.1. General Description ................................................................................................................. 18
3.2. Pin Assignment ........................................................................................................................ 19
3.3. Pin Description ......................................................................................................................... 20
3.4. Operating Modes ..................................................................................................................... 30
3.5. Power Saving ........................................................................................................................... 31
3.5.1. Sleep Mode .................................................................................................................... 31
3.5.1.1. UART Application ................................................................................................. 31
3.5.1.2. USB Application with USB Remote Wakeup Function ........................................ 32
3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 33
3.5.1.4. USB Application without USB Suspend Function ................................................ 33
3.5.2. Airplane Mode ................................................................................................................ 34
3.6. Power Supply ........................................................................................................................... 35
3.6.1. Power Supply Pins ......................................................................................................... 35
3.6.2. Decrease Voltage Drop .................................................................................................. 36
3.6.3. Reference Design for Power Supply .............................................................................. 37
3.6.4. Monitor the Power Supply .............................................................................................. 37
3.7. Turn on and off Scenarios ....................................................................................................... 37
3.7.1. Turn on Module Using the PWRKEY ............................................................................. 37
3.7.2. Turn off Module .............................................................................................................. 39
3.7.2.1. Turn off Module Using the PWRKEY Pin ............................................................ 39
3.7.2.2. Turn off Module Using AT Command .................................................................. 40
3.8. Reset the Module..................................................................................................................... 40
3.9. (U)SIM Interface ...................................................................................................................... 42
3.10. USB Interface .......................................................................................................................... 44
3.11. UART Interfaces ...................................................................................................................... 46
3.12. PCM and I2C Interfaces .......................................................................................................... 49
3.13. ADC Interfaces ........................................................................................................................ 51
3.14. Network Status Indication ........................................................................................................ 52
3.15. STATUS ................................................................................................................................... 53
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3.16. Behavior of the RI .................................................................................................................... 54
3.17. PCIe Interface* ........................................................................................................................ 55
3.18. WLAN Control Interface* ......................................................................................................... 56
3.19. SD Card Interface .................................................................................................................... 57
3.20. SPI Interface ............................................................................................................................ 59
3.21. USB_BOOT Interface .............................................................................................................. 60
4 GNSS Receiver ................................................................................................................................... 62
4.1. General Description ................................................................................................................. 62
4.2. GNSS Performance ................................................................................................................. 62
4.3. Layout Guidelines .................................................................................................................... 63
5 Antenna Interfaces ............................................................................................................................. 64
5.1. Main/Rx-diversity Antenna Interface ....................................................................................... 64
5.1.1. Pin Definition .................................................................................................................. 64
5.1.2. Operating Frequency ..................................................................................................... 64
5.1.3. Reference Design of RF Antenna Interface ................................................................... 66
5.1.4. Reference Design of RF Layout..................................................................................... 66
5.2. GNSS Antenna Interface ......................................................................................................... 68
5.3. Antenna Installation ................................................................................................................. 69
5.3.1. Antenna Requirement .................................................................................................... 69
5.3.2. Recommended RF Connector for Antenna Installation ................................................. 71
6 Electrical, Reliability and Radio Characteristics ............................................................................ 74
6.1. Absolute Maximum Ratings ..................................................................................................... 74
6.2. Power Supply Ratings ............................................................................................................. 75
6.3. Operation and Storage Temperatures .................................................................................... 75
6.4. Current Consumption .............................................................................................................. 76
6.5. RF Output Power ..................................................................................................................... 78
6.6. RF Receiving Sensitivity .......................................................................................................... 78
6.7. Electrostatic Discharge ............................................................................................................ 79
6.8. Thermal Consideration ............................................................................................................ 80
7 Mechanical Dimensions .................................................................................................................... 82
7.1. Mechanical Dimensions of the Module.................................................................................... 82
7.2. Recommended Footprint ......................................................................................................... 84
7.3. Design Effect Drawings of the Module .................................................................................... 85
8 Storage, Manufacturing and Packaging .......................................................................................... 86
8.1. Storage .................................................................................................................................... 86
8.2. Manufacturing and Soldering .................................................................................................. 87
8.3. Packaging ................................................................................................................................ 87
9 Appendix A References ..................................................................................................................... 89
10 IC & FCC Requirement ...................................................................................................................... 93
10.1. FCC Regulations: .................................................................................................................... 93
10.2. RF Exposure Information ......................................................................................................... 93
10.3. ISED Notice ............................................................................................................................. 93
10.4. ISED Radiation Exposure Statement ...................................................................................... 94
10.5. IMPORTANT NOTE: ............................................................................................................... 94
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10.6. USERS MANUAL OF THE END PRODUCT: ......................................................................... 94
10.7. LABEL OF THE END PRODUCT: ........................................................................................... 95
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Table Index
TABLE 1: FREQUENCY BANDS OF EG06 SERIES MODULE ....................................................................... 13
TABLE 2: KEY FEATURES OF EG06 MODULE .............................................................................................. 14
TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 20
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 20
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 30
TABLE 6: VBAT AND GND PINS ...................................................................................................................... 35
TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 38
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 41
TABLE 9: PIN DEFINITION OF THE (U)SIM INTERFACE ............................................................................... 42
TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 44
TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE .................................................................... 46
TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ................................................................ 47
TABLE 13: PIN DEFINITION OF THE BT UART INTERFACE......................................................................... 47
TABLE 14: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 47
TABLE 15: PIN DEFINITION OF PCM AND I2C INTERFACES....................................................................... 50
TABLE 16: PIN DEFINITION OF THE ADC INTERFACES .............................................................................. 51
TABLE 17: CHARACTERISTICS OF ADC INTERFACES ................................................................................ 52
TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 52
TABLE 19: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ......... 52
TABLE 20: PIN DEFINITION OF STATUS........................................................................................................ 53
TABLE 21: BEHAVIOR OF THE RI ................................................................................................................... 54
TABLE 22: PIN DEFINITION OF THE PCIE INTERFACE ................................................................................ 55
TABLE 23: PIN DEFINITION OF WLAN CONTROL INTERFACE ................................................................... 56
TABLE 24: PIN DEFINITION OF THE SD CARDINTERFACE ......................................................................... 57
TABLE 25: PIN DEFINITION OF THE SPI INTERFACE .................................................................................. 59
TABLE 26: PARAMETERS OF SPI INTERFACE TIMING ............................................................................... 60
TABLE 27: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 61
TABLE 28: GNSS PERFORMANCE ................................................................................................................. 62
TABLE 29: PIN DEFINITION OF THE RF ANTENNA ...................................................................................... 64
TABLE 30: MODULE OPERATING FREQUENCIES ....................................................................................... 64
TABLE 31: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 68
TABLE 32: GNSS FREQUENCY ...................................................................................................................... 69
TABLE 33: ANTENNA REQUIREMENTS ......................................................................................................... 70
TABLE 34: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 74
TABLE 35: THE MODULE POWER SUPPLY RATINGS.................................................................................. 75
TABLE 36: OPERATION AND STORAGE TEMPERATURES ......................................................................... 75
TABLE 37: EG06-E CURRENT CONSUMPTION ............................................................................................. 76
TABLE 38: RF OUTPUT POWER ..................................................................................................................... 78
TABLE 39: EG06-E CONDUCTED RF RECEIVING SENSITIVITY ................................................................. 79
TABLE 40: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 80
TABLE 41: RELATED DOCUMENTS ............................................................................................................... 89
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TABLE 42: TERMS AND ABBREVIATIONS ..................................................................................................... 89
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 17
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 19
FIGURE 3: DRX RUN TIME AND CURRENT CONSUMPTION IN SLEEP MODE ......................................... 31
FIGURE 4: SLEEP MODE APPLICATION VIA UART ...................................................................................... 32
FIGURE 5: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 32
FIGURE 6: SLEEP MODE APPLICATION WITH RI ......................................................................................... 33
FIGURE 7: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION................................................ 34
FIGURE 8: POWER SUPPLY LIMITS DURING TX POWER ........................................................................... 36
FIGURE 9: STAR STRUCTURE OF THE POWER SUPPLY ........................................................................... 36
FIGURE 10: REFERENCE CIRCUIT OF POWER SUPPLY ............................................................................ 37
FIGURE 11: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 38
FIGURE 12: TURN ON THE MODULE USING KEYSTROKE ......................................................................... 38
FIGURE 13: TIMING OF TURNING ON MODULE ........................................................................................... 39
FIGURE 14: TIMING OF TURNING OFF MODULE ......................................................................................... 40
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 41
FIGURE 16: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 41
FIGURE 17: TIMING OF RESETTING MODULE ............................................................................................. 42
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 43
FIGURE 19: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 43
FIGURE 20: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 45
FIGURE 21: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 48
FIGURE 22: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 48
FIGURE 23: PRIMARY MODE TIMING ............................................................................................................ 49
FIGURE 24: AUXILIARY MODE TIMING .......................................................................................................... 50
FIGURE 25: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 51
FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 53
FIGURE 27: REFERENCE CIRCUITS OF STATUS ........................................................................................ 54
FIGURE 28: REFERENCE CIRCUIT OF SD CARD APPLICATION ................................................................ 58
FIGURE 29: SPI INTERFACE TIMING ............................................................................................................. 59
FIGURE 30: SPI INTERFACE REFERENCE CIRCUIT WITH A LEVEL TRANSLATOR ................................ 60
FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 61
FIGURE 32: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 66
FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ..................................................................... 67
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB ................................................. 67
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 67
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .................................................................................................................................................. 68
FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. 69
FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 71
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FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 72
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 73
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................. 81
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 81
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 82
FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW) ......................................................................... 83
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 84
FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 85
FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 85
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 87
FIGURE 49: TAPE SPECIFICATIONS.............................................................................................................. 88
FIGURE 50: REEL SPECIFICATIONS.............................................................................................................. 88
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1 Introduction
This document defines the EG06 module and describes its air interface and hardware interface which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EG06 module. Associated with application note
and user guide, customers can use EG06 module to design and set up mobile applications easily.
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1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EG06 module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for the customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals,clinics or other health care
facilities. These requests are designed to prevent possible interference with
sensitive medical equipment.
Cellular terminals or mobiles operatingover radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid (U)SIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
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Please do not discard. Maybe wireless devices have an impact on the environment
so please do not arbitrarily discarded.
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2 Product Concept
2.1. General Description
EG06 is a series of LTE-FDD/LTE-TDD/WCDMA wireless communication module with receive diversity,
which provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, and
WCDMA networks. It also provides GNSS
1)
and voice functionality
2)
to meet customers’ specific
application demands. EG06 contains five variants: EG06-E, EG06-A, EG06-LA, EG06-APAC and
EG06-AUTL. Customers can choose a dedicated type based on the region or operator. The following
table shows the frequency bands of EG06 series module.
Table 1: Frequency Bands of EG06 Series Module
Mode
EG06-E
EG06-A
EG06-LA
EG06-APAC
EG06-AUTL
LTE-FDD
(with
Rx-diversity)
B1/B3/B5/B7/
B8/B20/B28/
B32
3)
B2/B4/B5/B7/
B12/B13/B25/
B26/B29
3)
/B30/
B66
B2/B3/B4/B5/
B7/B8/B20/B28
B1/B3/B5/B7/
B8/B18/B19/
B21/B26
B3/B7/B28
LTE-TDD
(with
Rx-diversity)
B38/B40/B41
Not supported
Not supported
B38/B39/B40/
B41
Not supported
2×CA
B1+B1/B5/B8/
B20/B28;
B3+B3/B5/B7/
B8/B20/B28;
B7+B5/B7/B8/
B20/B28;
B20+B32
3)
;
B38+B38;
B40+B40;
B41+B41
B2+B2/B5/B12/
B13/B26/B29
3)
;
B4+B4/B5/B12/
B13/B26/B29
3)
;
B7+B5/B7/B12/
B13/B26/B29
3)
;
B25+B5/B12/
B13/B25/B26/
B29
3)
;
B30+B5/B12/
B13/B26/B29
3)
;
B66+B5/B12/
B13/B26/B29
3)
/
B66
B2+B2/B5/B8/
B20/B28;
B3+B3/B5/B7/
B8/B20/B28;
B4+B4/B5/B8/
B20/B28;
B7+B5/B7/B8/
B20/B28
B1+B3/B8/B18/
B19;
B3+B5/B19;
B7+B5/B7;
B21+B19;
B38+B38;
B39+B39;
B39+B41;
B40+B40;
B41+B41
B3+B3/B7/B28;
B7+B7/B28
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1.
1)
GNSS function is optional.
2.
2)
EG06 series module (EG06-E/EG06-A/EG06-LA/EG06-APAC/EG06-AUTL) contains Telematics
version and Data-only version. Telematics version supports voice and data functions, while
Data-only version only supports data function.
3.
3)
B32 and B29 support Rx only, and in 2×CA they are only for secondary component carrier.
With a compact profile of 37.0mm × 39.5mm × 2.8mm, EG06 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EG06 is an SMD type module which can be embedded in applications through its 299-pin LGA pads.
2.2. Key Features
The following table describes the detailed features of EG06 module.
Table 2: Key Features of EG06 Module
WCDMA
(with
Rx-diversity)
B1/B3/B5/B8
B2/B4/B5
B2/B3/B4/B5/
B8
B1/B5/B6/B8/
B9/B19
Not supported
GNSS
GPS,
GLONASS,
BeiDou/
Galileo,
QZSS
GPS,
GLONASS,
BeiDou/
Galileo,
QZSS
GPS,
GLONASS,
BeiDou/
Galileo,
QZSS
GPS,
GLONASS,
BeiDou/Galileo,
QZSS
GPS,
GLONASS,
BeiDou/Galileo,
QZSS
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Transmitting Power
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support up to CA Cat 6 FDD and TDD
Support uplink QPSK and 16-QAM modulation
Support downlink QPSK, 16-QAM and 64-QAM modulation
Support 1.4MHz to 20MHz (2×CA) RF bandwidth
Support MIMO in DL direction
NOTES
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FDD: Max 300Mbps (DL)/50Mbps (UL)
TDD: Max 226Mbps (DL)/28Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL)/384Kbps (UL)
Internet Protocol Features
Support PPP/QMI/TCP*/UDP*/FTP*/HTTP*/NTP*/PING*/HTTPS*/SMTP*/
MMS*/FTPS*/SMTPS*/SSL* protocols
Support the protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) usually used for PPP
connections
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support (U)SIM card: 1.8V/3.0V
Audio Features
Support one digital audio interface: PCM interface
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
USB Interface
Compliant with USB 3.0 and 2.0 specifications, with maximum transmission
rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0.
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output and voice
over USB*
Support USB serial drivers for: Windows XP/Vista 7/8/8.1/10;
WinCE 5.0/6.0/7.0*; Linux 2.6/3.x/4.1~4.14; Android 4.x/5.x/6.x/7.x
UART Interface
Main UART:
Used for AT command communication and data transmission
Baud rate reaches up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
BT UART:
Used for Bluetooth communication
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1.
1)
Within operation temperature range, the module is 3GPP compliant.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
out
might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of EG06 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
PCIe Interface*
Comply with PCI Express Specification Revision 2.1
Used for Ethernet or WLAN communication
Rx-diversity
Support LTE/WCDMA Rx-diversity
GNSS Features
Gen8C-Lite of Qualcomm
Protocol: NMEA 0183
AT Commands
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Network Indication
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Antenna Interface
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Physical Characteristics
Size: (37.0±0.15)mm × (39.5±0.15)mm × (2.8±0.2)mm
Weight: approx. 6.7g
Temperature Range
Operation temperature range: -35°C ~ +75°C
1)
Extended temperature range: -40°C ~ +85°C
2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
USB2.0 interface and DFOTA*
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES
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Baseband
PMIC
Transceiver
NAND
DDR2
SDRAM
Tx/Rx Blocks
ANT_MAIN ANT_DIVANT_GNSS
VBAT_BB
VBAT_RF
APT
PWRKEY
ADCs
VDD_EXT
USB2.0/3.0 USIM PCM
UART
I2C
RESET_N
19.2M
XO
STATUS
GPIOs
Control
IQ Control
Tx
PRx DRx
PCIe*
CLK_OUT
SD
SPI
Figure 1: Functional Diagram
“*” means under development.
2.4. Evaluation Board
In order to help customers develop applications with EG06, Quectel supplies an evaluation board (EVB),
USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.
NOTE
LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 18 / 89
3 Application Interface
3.1. General Description
EG06 is equipped with 299-pin LGA pads that can be connected to cellular application platform.
Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply
(U)SIM interface
USB interface
UART interfaces
PCM and I2C interfaces
ADC interfaces
Network status indication
PCIe interface*
WLAN control interface*
SD card interface
USB_BOOT interface
“*” means under development.
NOTE
LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 19 / 89
3.2. Pin Assignment
The following figure shows the pin assignment of EG06 module.
299
176
298
174
172
170
168
166
164
162
160
158
156
154
152
150
148
146
144
142
140
138
136
134
132
130
175
173
171
169
167
165
163
161
159
157
155
153
151
149
147
145
143
141
139
137
135
133
131
129
127
125
123
121
119
117
115
111
109
107
105
103
101
99
97
95
128
113
126
124
122
120
118
116
114
112
110
108
106
104
102
100
98
96
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
93
91
89
94
92
90
197
196
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
41
39
37
35
33
31
29
27
23
21
19
17
15
13
11
9
7
40
25
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
5
3
1
6
4
2
178
177
Power Pins GND Pins
GPIO and Other Pins
RESVRVED Pins
297
296
216 217 218215 219 220 221 222 223
224
233
242
251
260
269
278
287
225
234
243
252
261
270
279
288
226
235
244
253
262
271
280
289
227
236
272
281
290
228
237
273
282
291
229
238
274
283
292
230
239
248
257
266
275
284
293
231
240
249
258
267
276
285
294
232
241
250
259
268
277
286
295
PCIe Pins
PCM Pins
USIM Pins USB Pins
IIC Pins
SD Pins
ADC Pins
UART Pins
SPI Pins
ANT Pins
CLK Pins
RESET_N
PWRKEY
BT_EN
PM_ENABLE
USIM_PRESENCE
USIM_CLK
USIM_DATA
USIM_VDD
USIM_RST
USB_VBUS
USB_DM
USB_DP
USB_ID
USB_SS_TX_M
USB_SS_TX_P
USB_SS_RX_P
USB_SS_RX_M
I2C_SDA
I2C_SCL
SD_VDD
SD_DATA2
SD_DATA3
SD_DATA0
SD_DATA1
SD_CMD
SD_DETECT
SD_CLK
CTS
RTS
RXD
DCD
TXD
RI
DTR
PCM_SYNC
PCM_CLK
PCM_IN
PCM_OUT
SPI_MOSI
SPI_CS
SPI_MISO
SPI_CLK
VBAT_RF
VBAT_RF
VBAT_RF
VBAT_RF
ANT_MAIN
ANT_GNSS
ANT_DIV
RESERVED
DBG_RXD
GPIO1
USB_BOOT
VDD_P2
DBG_TXD
GPIO2
OTG_PWR_EN
COEX_UART_TX
NET_MODE
WLAN_EN
W_DISABLE#
SLEEP_IND
COEX_UART_RX
WAKEUP_IN
RESERVED
VBAT_BB
VBAT_BB
WAKE_ON_WIRELESS
BT_TXD
BT_RXD
BT_CTS
BT_RTS
VDD_EXT
WLAN_SLP_CLK
GND
NET_STATUS
STATUS
ADC0
ADC1
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
PCIE_REFCLK_P
PCIE_REFCLK_M
PCIE_TX_M
PCIE_TX_P
PCIE_RX_M
PCIE_RX_P
PCIE_CLK_REQ_N
PCIE_RST_N
PCIE_WAKE_N
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
USIM_GND
245 246 247
254 255 256
263 264 265
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
RESERVED
GND
RESERVED
RESERVED
GND
RESERVED
RESERVED
RESERVED
GND
GND
GND
GND
RESERVED
RESERVED
RESERVED
GND
RESERVED
GND
GND
GND
GND
GND
GND
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
Figure 2: Pin Assignment (Top View)
LTE-A Module Series
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EG06_Hardware_Design 20 / 89
1. Keep all RESERVED pins and unused pins unconnected.
2. GND pads 215~299 should be connected to ground in the design.
3.3. Pin Description
The following tables show the pin definition and description of EG06 module.
Table 3: I/O Parameters Definition
Type
Description
IO
Bidirectional
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
Table 4: Pin Description
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT_BB
155,156
PI
Power supply for
the module’s
baseband part.
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
VBAT_RF
85, 86,
87, 88
PI
Power supply for
the module’s RF
part.
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 1.8A in a
transmitting burst.
NOTES
LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 21 / 89
VDD_EXT
168
PO
Provide 1.8V for
external circuit.
Vnorm=1.8V
I
O
max=50mA
Power supply for
external GPIO’s pull up
circuits.
VDD_P2
135
PI
It is determined by
external circuit.
If an SD card is used,
connect VDD_P2 to
SD_VDD.
If an eMMC* is used,
connect VDD_P2 to
VDD_EXT.
GND
10, 13, 16,
17, 24, 30,
31, 35, 39,
44, 45, 54,
55, 63, 64,
69, 70, 75,
76, 81~84,
89~94,
96~100,
102~106,
108~112,
114, 116,
117, 118,
120~126,
128~133,
141, 142,
148, 153,
154, 157,
158, 167,
174, 177,
178, 181,
184, 187,
191,
196~299
Ground
Turn on/off
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PWRKEY
2
DI
Turn on/off the
module.
V
IH
max=2.1V
V
IH
min=1.3V
V
IL
max=0.5V
The output voltage is
0.8V because it is
pulled up to an
internal voltage
(800mV).
RESET_N
1
DI
Reset the module
V
IH
max=2.1V
V
IH
min=1.3V
V
IL
max=0.5V
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Status Indication
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
STATUS
171
DO
Indicate the
module’s operation
status.
V
OH
min=1.35V
V
OL
max=0.45V
1.8V power domain.
If unused, keep it
open.
NET_MODE
147
DO
Indicate the
module’s network
registration mode
V
OH
min=1.35V
V
OL
max=0.45V
1.8V power domain.
If unused, keep it
open.
NET_
STATUS
170
DO
Indicate the
module’s network
activity status
V
OH
min=1.35V
V
OL
max=0.45V
1.8V power domain.
If unused, keep it
open.
USB Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USB_VBUS
32
PI
USB connection
detection
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
USB_DP
34
IO
USB 2.0 differential
data bus - plus
Compliant with USB
2.0 standard
specifications.
Require differential
impedance of 90Ω.
USB_DM
33
IO
USB 2.0 differential
data bus - minus
Compliant with USB
2.0 standard
specifications.
USB_ID
36
DI
OTG identification
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
USB_SS_
TX_P
38
AO
USB 3.0 super
speed
transmission- plus
Compliant with USB
3.0 standard
specifications.
Require differential
impedance of 90Ω.
USB_SS_
TX_M
37
AO
USB 3.0 super
speed
transmission-
minus
USB_SS_
RX_P
40
AI
USB 3.0 super
speed receiving-
plus
Require differential
impedance of 90Ω.
USB_SS_
RX_M
41
AI
USB 3.0
super-speed
receiving- minus
LTE-A Module Series
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EG06_Hardware_Design 23 / 89
OTG_PWR_
EN
143
DO
OTG power control
V
OL
max=0.45V
V
OH
min=1.35V
(U)SIM Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USIM_GND
24
Specified ground
for (U)SIM card
USIM_VDD
26
PO
Power supply for
(U)SIM card
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=3.05V
Vmin=2.75V
I
O
max=50mA
Either 1.8V or 3.0V is
supported by the
module
automatically.
USIM_
DATA
29
IO
Data signal of
(U)SIM card
For 1.8V (U)SIM:
V
IL
max=0.36V
V
IH
min=1.26V
V
OL
max=0.4V
V
OH
min=1.45V
For 3.0V (U)SIM:
V
IL
max=0.57V
V
IH
min=2.0V
V
OL
max=0.4V
V
OH
min=2.3V
USIM_CLK
27
DO
Clock signal of
(U)SIM card
For 1.8V (U)SIM:
V
OL
max=0.4V
V
OH
min=1.45V
For 3.0V (U)SIM:
V
OL
max=0.4V
V
OH
min=2.3V
USIM_RST
28
DO
Reset signal of
(U)SIM card
For 1.8V (U)SIM:
V
OL
max=0.4V
V
OH
min=1.45V
For 3.0V (U)SIM:
V
OL
max=0.4V
V
OH
min=2.3V
USIM_
PRESENCE
25
DI
(U)SIM card
insertion detection
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
LTE-A Module Series
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EG06_Hardware_Design 24 / 89
UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
RI
61
DO
Ring indicator
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
DCD
59
DO
Data carrier
detection
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
CTS
56
DO
Clear to send
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
RTS
57
DI
Request to send
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
DTR
62
DI
Data terminal
ready, sleep mode
control
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
Pull-up by default.
Pulling down to low
level will wake up the
module.
If unused, keep it
open.
TXD
60
DO
Transmit data
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
RXD
58
DI
Receive data
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
BT Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
BT_TXD
163
DO
Transmit data
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
BT_RXD
165
DI
Receive data
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
BT_RTS
166
DI
Request to send
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
1.8V power domain.
If unused, keep it
open.
LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 25 / 89
V
IH
max=2.0V
BT_CTS
164
DO
Clear to send
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
BT_EN*
3
DO
BT function
enabled
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
Keep it open.
This function is under
development
Debug UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
DBG_RXD
136
DI
Receive data
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
DBG_TXD
137
DO
Transmit data
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
ADC Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ADC0
173
AI
General purpose
analog to digital
converter interface
Voltage range:
0.15V to VBAT_BB
If unused, keep it
open.
ADC1
175
AI
General purpose
analog to digital
converter interface
Voltage range:
0.15V to VBAT_BB
If unused, keep it
open.
PCM and I2C Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PCM_IN
66
DI
PCM data input
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
PCM_OUT
68
DO
PCM data output
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
PCM_SYNC
65
IO
PCM data frame
synchronization
signal
V
OL
max=0.45V
V
OH
min=1.35V
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 26 / 89
V
IH
max=2.0V
PCM_CLK
67
IO
PCM clock
V
OL
max=0.45V
V
OH
min=1.35V
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
I2C_SCL
43
OD
I2C serial clock
Used for external
codec.
1.8V power domain.
An external pull-up
resistor is required.
1.8V only. If unused,
keep it open.
I2C_SDA
42
OD
I2C serial data
Used for external
codec.
1.8V power domain.
An external pull-up
resistor is required.
1.8V only. If unused,
keep it open.
SPI Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
SPI_CS
79
DO
Chip select of SPI
interface
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
SPI_CLK
80
DO
Clock signal of SPI
interface
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
SPI_MOSI
77
DO
Master output
slave input of SPI
interface
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
SPI_MISO
78
DI
Master input
slave output of SPI
interface
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
PCIe Interface*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PCIE_REF
CLK_P
179
AO
Output PCIe
reference clock -
plus
If unused, keep it
open.
PCIE_REF
CLK_M
180
AO
Output PCIe
reference clock -
minus
If unused, keep it
open.
PCIE_TX_M
182
AO
PCIe transmission
- minus
If unused, keep it
open.
LTE-A Module Series
EG06 Hardware Design
EG06_Hardware_Design 27 / 89
PCIE_TX_P
183
AO
PCIe transmission
- plus
If unused, keep it
open.
PCIE_RX_M
185
AI
PCIe receiving-
minus
If unused, keep it
open.
PCIE_RX_P
186
AI
PCIe receiving -
plus
If unused, keep it
open.
PCIE_CLK_
REQ_N
188
IO
PCIe clock request
V
OL
max=0.45V
V
OH
min=1.35V
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
In master mode, it is
an input signal.
In slave mode, it is an
output signal.
If unused, keep it
open.
PCIE_RST_N
189
IO
PCIe reset
V
OL
max=0.45V
V
OH
min=1.35V
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
In master mode, it is
an output signal.
In slave mode, it is an
input signal.
If unused, keep it
open.
PCIE_WAKE_
N
190
IO
PCIe wake
V
OL
max=0.45V
V
OH
min=1.35V
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
V
IH
max=2.0V
In master mode, it is
an input signal.
In slave mode, it is an
output signal.
If unused, keep it
open.
WLAN Control Interface*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PM_ENABLE
5
DO
Enable WLAN
power
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
WAKE_ON_
WIRELESS
160
DI
Wake up the host
(EG06 module) by
Wi-Fi module.
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
Active low.
If unused, keep it
open.
WLAN_EN
149
DO
WLAN function
enable control
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
Active high.
If unused, keep it
open.
COEX_UART_
RX
146
DI
LTE/WLAN
coexistence signal
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
LTE-A Module Series
EG06 Hardware Design
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COEX_UART_
TX
145
DO
LTE/WLAN
coexistence signal
V
OL
max=0.45V
V
OH
min=1.35V
1.8V power domain.
If unused, keep it
open.
WLAN_SLP_
CLK
169
DO
WLAN sleep clock
V
OL
max=0.45V
V
OH
min=1.35V
If unused, keep it
open.
SD Card Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
SD_VDD
46
PO
Power supply for
pull up voltage of
SD card bus
For 1.8V SD:
Vmax=1.9V
Vmin=1.75V
For 3.0V SD:
Vmax=3.05V
Vmin=2.75V
I
O
max=50mA
Either 1.8V or 3.0V is
supported by the
module
automatically.
Power supply of SD
card must be
provided by an
external power
supply.
SD_DATA0
49
IO
Secure digital
controller data bit 0
For1.8V SD:
V
OL
max=0.45V
V
OH
min=1.4V
V
IL
min=-0.3V
V
IL
max=0.58V
V
IH
min=1.3V
V
IH
max=2.0V
For 3.0V SD:
V
OL
max=0.35V
V
OH
min=2.15V
V
IL
min=-0.3V
V
IL
max=0.7V
V
IH
min=1.8V
V
IH
max=3.15V
If unused, keep it
open.
SD_DATA1
50
IO
Secure digital
controller data bit 1
If unused, keep it
open.
SD_DATA2
47
IO
Secure digital
controller data bit 2
If unused, keep it
open.
SD_DATA3
48
IO
Secure digital
controller data bit 3
If unused, keep it
open.
SD_CMD
51
DO
Command signal
for SD card
If unused, keep it
open.
SD_CLK
53
DO
Serial clock signal
for SD card
If unused, keep it
open.
SD_ DETECT
52
DI
SD card insertion
detection
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
If unused, keep it
open.
RF Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_DIV
127
AI
Diversity antenna
interface
50Ω impedance.
If unused, keep it
open.
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