Quectel Wireless Solutions 201905SC66MW User Manual
SC66 Hardware Design
Smart LTE Module Series
Rev: SC66_Hardware_Design_V1.0
Date: 2019-03-08
Status: Preliminary
www.quectel.com
Smart LTE Module Series
SC66 Hardware Design
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assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: +86 21 5108 6236
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Or our local office. For more information, please visit:
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GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
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RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
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COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL
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MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
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Revision
Date
Author
Description
1.0
2019-03-08
Jian WU
Initial
SC66 Hardware Design
About the Document
History
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 6
Figure Index ................................................................................................................................................. 8
1 Introduction ........................................................................................................................................ 10
1.1. Safety Information ..................................................................................................................... 14
2 Product Concept ................................................................................................................................ 15
2.1. General Description .................................................................................................................. 15
2.2. Key Features ............................................................................................................................. 19
2.3. Functional Diagram ................................................................................................................... 22
2.4. Evaluation Board ....................................................................................................................... 24
3 Application Interfaces ....................................................................................................................... 25
3.1. General Description .................................................................................................................. 25
3.2. Pin Assignment ......................................................................................................................... 26
3.3. Pin Description .......................................................................................................................... 27
3.4. Power Supply ............................................................................................................................ 42
3.4.1. Power Supply Pins ......................................................................................................... 42
3.4.2. Decrease Voltage Drop .................................................................................................. 42
3.4.3. Reference Design for Power Supply .............................................................................. 43
3.5. Turn on and off Scenarios ......................................................................................................... 45
3.5.1. Turn on Module Using the PWRKEY ............................................................................. 45
3.5.2. Restart the Module ......................................................................................................... 46
3.6. VRTC Interface ......................................................................................................................... 47
3.7. Power Output ............................................................................................................................ 48
3.8. Battery Charge and Management ............................................................................................. 48
3.9. USB Interface ............................................................................................................................ 51
3.9.1. TYPE-C Interfaces ......................................................................................................... 51
3.9.2. DP Interfaces .................................................................................................................. 54
3.9.3. Host ................................................................................................................................ 56
3.10. UART Interfaces ........................................................................................................................ 56
3.11. (U)SIM Interfaces ...................................................................................................................... 58
3.12. SD Card Interface ..................................................................................................................... 61
3.13. GPIO Interfaces ........................................................................................................................ 63
3.14. I2C Interfaces ............................................................................................................................ 64
3.15. I2S Interface .............................................................................................................................. 65
3.16. SPI Interfaces ............................................................................................................................ 66
3.17. ADC Interfaces .......................................................................................................................... 66
3.18. LCM Interfaces .......................................................................................................................... 67
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3.19. Touch Panel Interfaces ............................................................................................................. 71
3.20. Camera Interfaces..................................................................................................................... 73
3.20.1. Design Considerations ................................................................................................... 79
3.21. Sensor Interfaces ...................................................................................................................... 81
3.22. Audio Interfaces ........................................................................................................................ 82
3.22.1. Reference Circuit Design for Microphone Interfaces ..................................................... 83
3.22.2. Reference Circuit Design for Earpiece Interface ........................................................... 84
3.22.3. Reference Circuit Design for Headphone Interface ....................................................... 85
3.22.4. Reference Circuit Design for Loudspeaker Interface..................................................... 85
3.22.5. Audio Interfaces Design Considerations........................................................................ 85
3.23. Emergency Download Interface ................................................................................................ 86
4 Wi-Fi and BT ....................................................................................................................................... 87
4.1. Wi-Fi Overview .......................................................................................................................... 87
4.1.1. Wi-Fi Performance ......................................................................................................... 87
4.2. BT Overview .............................................................................................................................. 89
4.2.1. BT Performance ............................................................................................................. 90
5 GNSS ................................................................................................................................................... 91
5.1. GNSS Performance .................................................................................................................. 91
5.2. GNSS RF Design Guidelines .................................................................................................... 92
6 Antenna Interfaces ............................................................................................................................. 93
6.1. Main/Rx-diversity Antenna Interfaces ....................................................................................... 93
6.1.1. Main and Rx-diversity Antenna Interfaces Reference Design ....................................... 97
6.1.2. Reference Design of RF Layout..................................................................................... 97
6.2. Wi-Fi/BT Antenna Interface ....................................................................................................... 99
6.3. GNSS Antenna Interface ......................................................................................................... 100
6.3.1. Recommended Circuit for Passive Antenna ................................................................ 101
6.3.2. Recommended Circuit for Active Antenna ................................................................... 102
6.4. Antenna Installation ................................................................................................................. 102
6.4.1. Antenna Requirements ................................................................................................ 102
6.4.2. Recommended RF Connector for Antenna Installation ............................................... 103
7 Electrical, Reliability and Radio Characteristics .......................................................................... 105
7.1. Absolute Maximum Ratings .................................................................................................... 105
7.2. Power Supply Ratings ............................................................................................................. 105
7.3. Operation and Storage Temperatures ..................................................................................... 106
7.4. Current Consumption .............................................................................................................. 107
7.5. RF Output Power .................................................................................................................... 116
7.6. RF Receiving Sensitivity ......................................................................................................... 119
7.7. Electrostatic Discharge ........................................................................................................... 123
8 Mechanical Dimensions .................................................................................................................. 124
8.1. Mechanical Dimensions of the Module ................................................................................... 124
8.2. Recommended Footprint ........................................................................................................ 126
8.3. Top and Bottom View of the Module ....................................................................................... 127
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9 Storage, Manufacturing and Packaging ........................................................................................ 128
9.1. Storage .................................................................................................................................... 128
9.2. Manufacturing and Soldering .................................................................................................. 129
9.3. Packaging ............................................................................................................................... 130
10 Appendix A References ................................................................................................................... 132
11 Appendix B GPRS Coding Schemes ............................................................................................. 135
12 Appendix C GPRS Multi-slot Classes ............................................................................................ 136
13 Appendix D EDGE Modulation and Coding Schemes ................................................................. 138
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Table Index
TABLE 1: SC66-CE* FREQUENCY BANDS ..................................................................................................... 15
TABLE 2: SC66-A* FREQUENCY BANDS ....................................................................................................... 16
TABLE 3: SC66-J* FREQUENCY BANDS ........................................................................................................ 16
TABLE 4: SC66-E* FREQUENCY BANDS ....................................................................................................... 17
TABLE 5: SC66-W* FREQUENCY BANDS ...................................................................................................... 17
TABLE 6: SC66-MW*(2*2 MIMO WIFI) FREQUENCY BANDS ........................................................................ 18
TABLE 7: SC66 KEY FEATURES ..................................................................................................................... 19
TABLE 8: I/O PARAMETERS DEFINITION ....................................................................................................... 27
TABLE 9: PIN DESCRIPTION ........................................................................................................................... 27
TABLE 10: POWER DESCRIPTION ................................................................................................................. 48
TABLE 11: PIN DEFINITION OF CHARGING INTERFACE ............................................................................. 49
TABLE 12: PIN DEFINITION OF USB INTERFACE ......................................................................................... 51
TABLE 13: USB TRACE LENGTH INSIDE THE MODULE............................................................................... 54
TABLE 14: THE DIFFERENCES BETWEEN USB MODE AND DISPLAYPORT MODE ................................. 55
TABLE 15: USB2 CONFIGURATION ................................................................................................................ 56
TABLE 16: PIN DEFINITION OF UART INTERFACES ..................................................................................... 57
TABLE 17: PIN DEFINITION OF (U)SIM INTERFACES ................................................................................... 59
TABLE 18: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 61
TABLE 19: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE ....................................................... 62
TABLE 20: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... 63
TABLE 21: PIN DEFINITION OF I2C INTERFACES ......................................................................................... 65
TABLE 22: PIN DEFINITION OF I2S INTERFACE ........................................................................................... 65
TABLE 23: PIN DEFINITION OF SPI INTERFACES ........................................................................................ 66
TABLE 24: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 66
TABLE 25: PIN DEFINITION OF LCM INTERFACES ....................................................................................... 67
TABLE 26: PIN DEFINITION OF TOUCH PANEL INTERFACES ..................................................................... 72
TABLE 27: PIN DEFINITION OF CAMERA INTERFACES ............................................................................... 74
TABLE 28: MIPI TRACE LENGTH INSIDE THE MODULE............................................................................... 79
TABLE 29: PIN DEFINITION OF SENSOR INTERFACES ............................................................................... 81
TABLE 30: PIN DEFINITION OF AUDIO INTERFACES ................................................................................... 82
TABLE 31: WI-FI TRANSMITTING PERFORMANCE ....................................................................................... 87
TABLE 32: WI-FI RECEIVING PERFORMANCE .............................................................................................. 88
TABLE 33: BT DATA RATE AND VERSIONS .................................................................................................... 90
TABLE 34: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 90
TABLE 35: GNSS PERFORMANCE ................................................................................................................. 91
TABLE 36: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES ......................................... 93
TABLE 37: SC66-CE* MODULE OPERATING FREQUENCIES ...................................................................... 93
TABLE 38: SC66-A* MODULE OPERATING FREQUENCIES ......................................................................... 94
TABLE 39: SC66-J* MODULE OPERATING FREQUENCIES ......................................................................... 95
TABLE 40: SC66-E* MODULE OPERATING FREQUENCIES ......................................................................... 96
TABLE 41: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE ................................................................ 99
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TABLE 42: WI-FI/BT FREQUENCY................................................................................................................. 100
TABLE 43: PIN DEFINITION OF GNSS ANTENNA ........................................................................................ 100
TABLE 44: GNSS FREQUENCY ..................................................................................................................... 101
TABLE 45: ANTENNA REQUIREMENTS ........................................................................................................ 102
TABLE 46: ABSOLUTE MAXIMUM RATINGS ................................................................................................ 105
TABLE 47: SC66 MODULE POWER SUPPLY RATINGS ............................................................................... 105
TABLE 48: OPERATION AND STORAGE TEMPERATURES ........................................................................ 106
TABLE 49: SC66-CE* CURRENT CONSUMPTION ....................................................................................... 107
TABLE 50: SC66-A* CURRENT CONSUMPTION .......................................................................................... 109
TABLE 51: SC66-J* CURRENT CONSUMPTION ........................................................................................... 110
TABLE 52: SC66-E* CURRENT CONSUMPTION ........................................................................................... 112
TABLE 53: SC66-CE* RF OUTPUT POWER ................................................................................................... 116
TABLE 54: SC66-A* RF OUTPUT POWER ..................................................................................................... 116
TABLE 55: SC66-J* RF OUTPUT POWER ...................................................................................................... 117
TABLE 56: SC66-E* RF OUTPUT POWER ..................................................................................................... 118
TABLE 57: SC66-CE* RF RECEIVING SENSITIVITY ..................................................................................... 119
TABLE 58: SC66-A* RF RECEIVING SENSITIVITY ....................................................................................... 120
TABLE 59: SC66-J* RF RECEIVING SENSITIVITY ....................................................................................... 121
TABLE 60: SC66-E* RF RECEIVING SENSITIVITY ....................................................................................... 122
TABLE 61: ESD CHARACTERISTICS (TEMPERATURE: 25°C , HUMIDITY: 45%) ....................................... 123
TABLE 50: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................. 129
TABLE 63: REEL PACKAGING ....................................................................................................................... 131
TABLE 64: RELATED DOCUMENTS .............................................................................................................. 132
TABLE 65: TERMS AND ABBREVIATIONS .................................................................................................... 132
TABLE 66: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 135
TABLE 67: GPRS MULTI-SLOT CLASSES .................................................................................................... 136
TABLE 68: EDGE MODULATION AND CODING SCHEMES ......................................................................... 138
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 24
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 26
FIGURE 3: VOLTAGE DROP SAMPLE ............................................................................................................. 42
FIGURE 4: STRUCTURE OF POWER SUPPLY .............................................................................................. 43
FIGURE 5: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 44
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 45
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 45
FIGURE 8: AUTOMATIC BOOT REFERENCE CIRCUIT ................................................................................. 46
FIGURE 9: TIMING OF RESTARTING MODULE ............................................................................................. 46
FIGURE 10: RTC POWERED BY RECHARGEABLE BUTTON CELL ............................................................. 47
FIGURE 11: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT ................................................... 50
FIGURE 12: USB TYPE-C INTERFACE REFERENCE DESIGN ..................................................................... 53
FIGURE 13: DISPLAY PORT INTERFACES .................................................................................................... 56
FIGURE 14: USB2 HOST ................................................................................................................................. 56
FIGURE 15: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART6) .............................. 58
FIGURE 16: RS232 LEVEL MATCH CIRCUIT (FOR UART5) .......................................................................... 58
FIGURE 17: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 60
FIGURE 18: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 60
FIGURE 19: REFERENCE CIRCUIT FOR SD CARD INTERFACE ................................................................. 62
FIGURE 20: LCM0 EXTERNAL BACKLIGHT DRIVE REFERENCE CIRCUIT ................................................ 69
FIGURE 21: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE ......................................................... 69
FIGURE 22: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE ......................................................... 70
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE ......................................................... 71
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR TOUCH PANEL INTERFACES ....................................... 73
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS .................................. 76
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERA APPLICATIONS .................................... 77
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERA APPLICATIONS ................................ 78
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE ........................... 83
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE ........................................ 84
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR EARPIECE IINTERFACE ............................................... 84
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 85
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE ....................................... 85
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE ..................... 86
FIGURE 34: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES .. 97
FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 98
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 98
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 98
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
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GROUND) .................................................................................................................................................. 99
FIGURE 37: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE ................................ 100
FIGURE 38: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA ......................................... 101
FIGURE 39: REFERENCE CIRCUIT DESIGN FOR GNSS ACTIVE ANTENNA ........................................... 102
FIGURE 40: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) .............................................. 103
FIGURE 41: MECHANICALS OF U.FL-LP CONNECTORS ........................................................................... 104
FIGURE 42: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ......................................................... 104
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS ................................................................................... 124
FIGURE 44: MODULE BOTTOM DIMENSIONS (TOP VIEW) ....................................................................... 125
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 126
FIGURE 46: TOP VIEW OF THE MODULE .................................................................................................... 127
FIGURE 47: BOTTOM VIEW OF THE MODULE ............................................................................................ 127
FIGURE 48: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE .............................................. 129
FIGURE 49: TAPE DIMENSIONS ................................................................................................................... 130
FIGURE 50: REEL DIMENSIONS ................................................................................................................... 131
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AT
BE
BG
HR
CY
CZ
DK
EE
FI
FR
DE
EL
HU
IE
IT
LV
LT
LU
MT
NL
PL
PT
RO
SK
SI
ES
SE
UK
SC66 Hardware Design
1 Introduction
This document defines the SC66 module and describes its air interface and hardware interface which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details as well as other related information of SC66 module. Associated with application note
and user guide, customers can use SC66 module to design and set up mobile applications easily.
Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [SC66-MW] is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com/support/technical.htm
The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.
The device could be used with a separation distance of 20cm to the human body.
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5.38
4.48
4.48
5.05
4.54
SC66 Hardware Design
OEM/Integrators Installation Manual
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on
the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains
FCC ID: XMR201905SC66MW”
“Contains IC: 10224A-20195SC66MW “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
Antenna
type
External
antenna
2.4GHz
band
Peak Gain
(dBi)
5.2GHz
band
Peak Gain
(dBi)
5.3GHz
band
Peak Gain
(dBi)
5.5GHz
band
Peak Gain
(dBi)
5.8GHz
band
Peak Gain
(dBi)
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with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes:
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(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement."
The device could automatically discontinue transmission in case of absence of information to transmit, or
operational failure. Note that this is not intended to prohibit transmission of control or signaling information
or the use of repetitive codes where required by the technology.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co-channel mobile satellite systems;
The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz
shall comply with the e.i.r.p. limit; and
The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the
e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à
transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission
d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par
la technologie.
Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire
le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;
Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725
MHz doit être conforme à la norme e.r.p. limite; et
Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à
la norme e.i.r.p. les limites spécifiées pour un fonctionnement point à point et non point à point, selon le
cas.
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.
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Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
SC66 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC66 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
SC66_Hardware_Design 14 / 118
Smart LTE Module Series
Type
Frequency Bands
LTE-FDD
B1/B3/B5/B8
LTE-TDD
B34/B38/B39/B40/B41
WCDMA
B1/B8
TD-SCDMA
B34/B39
EVDO/CDMA
BC0
GSM
900/1800MHz
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
SC66 Hardware Design
2 Product Concept
2.1. General Description
SC66 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and
provides industrial grade performance. Its general features are listed below:
Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA,
WCDMA, TD-SCDMA, EVDO/CDMA, EDGE and GPRS coverage
Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT5.0 LE standards
Integrate GPS/GLONASS/BeiDou satellite positioning systems
Support multiple audio and video codecs
Built-in high performance AdrenoTM 512 graphics processing unit
Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces
SC66 are available in six variants: SC66-MW*, SC66-CE*, SC66-A*, SC66-J*, SC66-E*, SC66-W*.
The following table shows the supported frequency bands of SC66.
Table 1: SC66-CE* Frequency Bands
SC66_Hardware_Design 15 / 118
SC66 Hardware Design
BT5.0
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz
GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Type
Frequency Bands
LTE-FDD
B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71
LTE-TDD
B41(200M)
WCDMA
B2/B4/B5
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz
GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Type
Frequency Bands
LTE-FDD
B1/B3/B5/B8/B11/B18/B19/B21/B26/B28(A+B)
LTE-TDD
B41(120M)
WCDMA
B1/B6/B8/B19
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz
GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Table 2: SC66-A* Frequency Bands
Smart LTE Module Series
Table 3: SC66-J* Frequency Bands
SC66_Hardware_Design 16 / 118
SC66 Hardware Design
Type
Frequency Bands
LTE-FDD
B1/B2/B3/B4/B5/B7/B8/B20/B28(A+B)
LTE-TDD
B38/B39/B40/B41(200M)
WCDMA
B1/B2/B4/B5/B8
GSM
B2/B3/B5/B8
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0
2402MHz~2480MHz
GNSS
GPS: 1575.42MHz±1.023MHz
GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Type
Frequency Bands
LTE-FDD
/
LTE-TDD
/
WCDMA
/
TD-SCDMA
/
CDMA
/
GSM
/
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0
2402MHz~2480MHz
GNSS
/
Table 4: SC66-E* Frequency Bands
Smart LTE Module Series
Table 5: SC66-W* Frequency Bands
SC66_Hardware_Design 17 / 118
Smart LTE Module Series
“*” means under development. SC66-A、SC66-J、SC66-E、SC66-MW support WIFI_MIMO
Type
Frequency Bands
LTE-FDD
/
LTE-TDD
/
WCDMA
/
TD-SCDMA
/
CDMA
/
GSM
/
Wi-Fi 802.11a/b/g/n/ac
2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0
2402MHz~2480MHz
GNSS
/
NOTE
SC66 Hardware Design
Table 6: SC66-MW*(2*2 MIMO WIFI) Frequency Bands
SC66 is an SMD type module which can be embedded into applications through its 324 pins (including
152 LCC pads and 172 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC66 can
meet almost all requirements for M2M applications such as smart metering, smart home, security, routers,
wireless POS, mobile computing devices, PDA phone, tablet PC, etc.
SC66_Hardware_Design 18 / 118
Smart LTE Module Series
Features
Details
Application Processor
Customized 64-bit ARM v8-compliant applications processorCustomized
64-bit ARM v8-compliant applications processor
Kryo Gold: quad high-performance cores targeting 2.2 GHz
Kryo Silver: quad low-power cores targeting 1.843 GHz
two quad-core processors with 1MB L2 cache
Modem system
LTE Cat 6(FDD and TDD), 2*20 CA(40MHz)
GPU
Adreno 512 up to 650 MHzAdreno 512 up to 650 MHz
Memory
32GB eMMC + 3GB LPDDR4x(default)
64GB eMMC + 4GB LPDDR4x (optional)
Operating System
Android 9
Power Supply
VBAT Supply Voltage: 3.55V~4.4V
Typical 4.0V
Transmitting Power
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (24dBm+3/-1dB) for EVDO/CDMA BC0
Class 2 (24dBm+1/-3dB) for TD-SCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support 3GPP R12 Cat 6* and Cat 4
Support 1.4 MHz to 20MHz RF bandwidth
Support Multiuser MIMO in DL direction
Cat 6* FDD: Max 300Mbps (DL)/Max 50Mbps (UL)
Cat 6* TDD: Max 265Mbps (DL)/Max 30Mbps (UL)
Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
UMTS Features
Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/HSUPA/WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
DC-HSUPA: Max 11.2Mbps (UL)
SC66 Hardware Design
2.2. Key Features
The following table describes the detailed features of SC66 module.
Table 7: SC66 Key Features
SC66_Hardware_Design 19 / 118
Smart LTE Module Series
WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
TD-SCDMA Features
Support CCSA Release 3 TD-SCDMA
Max 4.2Mbps (DL)/Max 2.2Mbps (UL)
CDMA2000 Features
Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A
EVDO: Max 3.1Mbps (DL)/Max 1.8 Mbps (UL)
1X Advanced: Max 307.2Kbps (DL)/Max 307.2Kbps (UL)
GSM Features
R99
CSD: 9.6kbps, 14.4kbps
GPRS
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL), 85.6Kbps (UL)
EDGE
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL), 236.8Kbps (UL)
WLAN Features
2.4GHz/5GHz, support 802.11a/b/g/n/ac, maximally up to 433Mbps
Support AP and STA mode
Bluetooth Features
BT5.0 LE
GNSS Features
GPS/GLONASS/BeiDou
SMS
Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
LCM Interfaces
Support for MIPI_DSI and DP overTYPE-C for dual screen display
MIPI_DSI Supports up to 2560x1600@60fps
DP supports 4K@30fps
Camera Interfaces
Support three groups of 4-lane MIPI_CSI, up to 2.1Gbps per lane
Support 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-lane + 4-lane +
2-lane + 1-lane)
up to 24MP with dual ISP
Video Codec
Video encoding and decoding: up to 4K @30fps
Concurrency: encoding up to 1080P @30fps; decoding up to 1080P @60fps
Audio Interfaces
Audio Input
Three analog microphone inputs, integrating internal bias voltage
Audio Output
Class AB stereo headphone output
Class AB earpiece differential output
Class D speaker differential amplifier output
SC66 Hardware Design
SC66_Hardware_Design 20 / 118
Smart LTE Module Series
1. 1) Within operation temperature range, the module is 3GPP compliant.
Audio Codec
EVRC, EVRC-B, EVRC-WB; G.711, G.729A/AB; GSM-FR, GSM-EFR,
GSM-HR; AMR-NB, AMR-WB, AMR-eAMR, AMR-BeAMR
USB Interface
Compliant with USB 3.1 and 2.0 specifications, with transmission rates up to
10Gbps on USB 3.1 and 480Mbps on USB 2.0.
Support USB OTG
Used for AT command communication, data transmission, software
debugging and firmware upgrade
UART Interfaces
4 UART Interfaces: DEBUG UART、UART6、UART1 and LPI_UART_2
UART6: 4-wire UART interface with RTS/CTS hardware flow control,
max rate up to 4Mbps
UART1: terface
DEBUG: 2-wire UART interface used for debugging
LPI_UART_2:low power uart, use is not recommended for the time being
SD Card Interface
Support SD 3.0
Support SD card hot-plug
(U)SIM Interfaces
2 (U)SIM interfaces
Support USIM/SIM card: 1.8V/2.95V
Support Dual SIM Dual Standby (supported by default)
I2C Interfaces
It supports up to five I2C interfaces, used for peripherals such as TP, camera,
sensor, etc.
I2S Interface
Supports two I2S, one of which is low power I2S
ADC Interfaces
2 general purpose ADC interfaces
SPI Interfaces
One SPI interfaces, only support master mode
Real Time Clock
Supported
Antenna Interfaces
Main antenna, Rx-diversity antenna, GNSS antenna and Wi-Fi/BT antenna
interfaces
Physical Characteristics
Size: (43.0±0.15)mm × (44.0±0.15)mm × (2.85±0.2)mm
Package: LCC + LGA
Weight: approx. 13.0g
Temperature Range
Operating temperature range: -35°C ~ +65°C
1)
Extended temperature range: -40°C ~ +75°C
2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
Over USB interface
RoHS
All hardware components are fully compliant with EU RoHS directive
NOTES
SC66 Hardware Design
SC66_Hardware_Design 21 / 118
Smart LTE Module Series
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
out
might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
SC66 Hardware Design
2.3. Functional Diagram
The following figure shows a block diagram of SC66 and illustrates the major functional parts.
Power management
Radio frequency
Baseband
LPDDR4X+eMMC flash
Peripheral interfaces
-- USB interface
-- (U)SIM interfaces
-- UART interfaces
-- SD card interface
-- I2C interfaces
- I2S interfaces
-- SPI interfaces
--ADC interfaces
-- LCM (MIPI) interfaces
-- TP (touch panel) interfaces
-- Camera (MIPI) interfaces
-- Audio interfaces
SC66_Hardware_Design 22 / 118
Smart LTE Module Series
Baseband
WCN
LPDDR
eMMC
FEM
XO
ANT_WIFI/BT
SD 3.0
UART
2×(U)SIM
USB
2.0&3.1
CAM
TPLCMSPI
EAR
SPK
MICs
RFCLK
BBCLK
MEM
Multimedia
Connectivity
Air Interface
Porcessors
Codec
Power
Signal
Power
Function
38.4MHZ
38.4
M
XO
Headset
VDD_RF
VOL_UP
VRTC
USIM1_VDD
USIM2_VDD
LDO13A_1P8
LDO11A_1P8
LDO14A_1P8
BATTERY
VPH_PWR
VBUS
GPIOs
13.2
769
I2C
I2S
PWRKEY
VOL DOWN
PM660L
SD_PU_VDD
SD_VDD
ADCs
LDO7B_3P125
LDO3B_2P8
HK ADC
&MPPs
PM660
PWM
PM-3003A
FEM
ANT_WIFI/BT
SC66 Hardware Design
This diagram just used for SC66-MW
SC66_Hardware_Design 23 / 118
Smart LTE Module Series
Baseband
Tranceiver
WCN
LPDDR
eMMC
FEM
XO
ANT_ GNSS
ANT_WIFI/BT
SD 3.0
UART
2×(U)SIM
USB
2.0&3.1
CAM
TPLCMSPI
EAR
SPK
MICs
RFCLK
BBCLK
MEM
Multimedia
Connectivity
Air Interface
Porcessors
Codec
Power
Signal
Power
Function
38.4MHZ
Duplexs
PA
Switch
SAW
LNA
SAW
SAW
Switch
SAW
ANT_DRX
ANT_ MAIN
38.4
M
XO
Headset
APT
VDD_RF
VOL_UP
C
1
VRTC
USIM1_VDD
USIM2_VDD
LDO13A_1P8
LDO11A_1P8
LDO14A_1P8
BATTERY
VPH_PWR
VBUS
GPIOs
13.2
769
I2C
I2S
PWRKEY
VOL DOWN
PM660L
SD_PU_VDD
SD_VDD
ADCs
LDO7B_3P125
LDO3B_2P8
HK ADC
&MPPs
PM660
PWM
PM-3003A
0欧姆跳贴
FEM
ANT_WIFI/BT
The red dotted frame is WIFI_MIMO path, which is not supported by SC66-CE and SC66-W.
NOTE
SC66 Hardware Design
-
2.4. Evaluation Board
Figure 1: Functional Diagram
In order to help customers develop applications with SC66 conveniently, Quectel supplies the evaluation
board, USB to RS232 converter cable, USB Type-C data cable, power adapter, earphone, antenna and
other peripherals to control or test the module.
SC66_Hardware_Design 24 / 118
Smart LTE Module Series
SC66 Hardware Design
3 Application Interfaces
3.1. General Description
SC66 is equipped with 324-pin 1.0mm pitch SMT pads that can be embedded into cellular application
platform. The following chapters provide the detailed description of pins/interfaces listed below.
Power supply
Turn on and off function
VRTC interface
Power Output
Charging interface
USB interface
UART interfaces
(U)SIM interfaces
SD card interface
GPIO interfaces
I2C interfaces
I2S interfaces
SPI interfaces
ADC interfaces
LCM interfaces
TP (touch panel) interfaces
Camera interfaces
Sensor interfaces
Audio interfaces
Emergency download interface
SC66_Hardware_Design 25 / 118
Smart LTE Module Series
313
314
315
316
317
318
319
306
307
308
309
310
311
312
299
300
301
302
303
304
305
292
293
294
295
296
297
298
285
286
287
288
289
290
291
278
279
280
281
282
283
284
271
272
273
274
275
276
277
264
265
266
268
269
270
267
257
258
259
261
262
263
260
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
39
41
42
43
44
45
46
47
48
49
51
52
53
54
40
50
55
56
57
585960
616263
64
323
321
322
2
4
25
26
27
29
28
30
31
32
33
34
35
36
37
38
656667
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
109
111
112
113
114
115
116
117
118
120
121
122
123
124
125
126
128
129
130
131
132
133
134
135
136
137
138
139
141
142
143
144
145
146
147
148
149
150
151
152
127
140
153
154
155
156
157
158
159
160
161
162
163
164
165
166
119
GND POWER AUDIO USB
(U)SIM SD TP LCM
CAMERA ANT UART GPIO
RESERVED
OTHERS
108
110
182
183
184
185
186
187
188
189
190
191
192
193
194
195
211
212
213
214
215
216
217
218
219
220
221
244
243
242
241
240
239
238
237
236
235
234
320
324
SC66 Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of SC66 module.
Figure 2: Pin Assignment (Top View)
SC66_Hardware_Design 26 / 118
SC66 Hardware Design
Type
Description
IO
Bidirectional
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
Power Supply
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
VBAT
36,37, 38
PI/PO Power supply for the
module
Vmax=4.4V
Vmin=3.55V
Vnorm=4.0V
It must be able to
provide sufficient
current up to 3.0A.
It is suggested to
use a TVS to
increase voltage
surge withstand
capability.
VDD_RF
1, 2
PO
Connect to external
bypass capacitors to
eliminate voltage
fluctuation of RF
part.
Vmax=4.4V
Vmin=3.55V
Vnorm=4.0V
Do not load
externally.
VRTC
16
PI/P
Power supply for
VOmax=3.2V；
3.3. Pin Description
Table 8: I/O Parameters Definition
Smart LTE Module Series
The following tables show the SC66’s pin definition and electrical characteristics.
Table 9: Pin Description
SC66_Hardware_Design 27 / 118
Smart LTE Module Series
O
internal RTC circuit
When VBAT is not
connected
:
VI=2.1V~3.25V
LDO13A_1
P8
9
PO
1.8V output power
supply
Vnorm=1.8V
IOmax=20mA
Power supply for
external GPIO’s
pull up circuits and
level shift circuit.
LDO7B_3P
125
157
PO
3.125V output power
supply
Vnorm=3.125V
IOmax=150mA
Power supply only
for DP switch
LDO11A_1P
8
10
PO
1.8V output power
supply
Vnorm=1.8V
IOmax=150mA
Power supply for
I/O VDD of
cameras, LCDs
and TP etc.
LDO14A_1
P8
158
PO
1.8V output power
supply
Vnorm=1.8V
IOmax=150mA
Power supply for
Sensors. Add a
1.0uF~4.7uF
bypass capacitor if
used.
If unused, keep
this pin open.
LDO3B_2P
8
12
PO
2.8V output power
supply
Vnorm=2.8V
IOmax=600mA
Power supply for
sensor and LCM.
Add a 1.0uF~2.2uF
bypass capacitor if
used.
If unused, keep
this pin open.
VPH_PWR
30
PO
VBAT output power
supply
Vnorm=VBAT
IOmax=1000mA
Power supply for
other ICs.ICs
GND
3，4，18 ，
20，24，
31，34，
35，40，
Ground
SC66 Hardware Design
SC66_Hardware_Design 28 / 118
Smart LTE Module Series
43，47，
56，62，
87，98，
101，112，
125，128，
130，133，
135，148，
150，159，
160，163，
166，170，
173，176，
182，193，
195，219，
225，243，
257~323
Audio Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
MIC_BIAS
167
AO
Microphone bias
voltage
VO=1.6V~2.9V
MIC1_P
44
AI
Microphone positive
input for channel 1
MIC1_M
45
AI
Microphone
negative input for
channel 1
MIC_GND
168
Microphone
reference ground
If unused, it should
be connected to
GND
MIC2_P
46
AI
Microphone
Headset mic input
SC66 Hardware Design
SC66_Hardware_Design 29 / 118
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