Quectel Wireless Solutions 201905AG35LA User Manual
AG35 Hardware Design
Automotive Module Series
Rev. AG35_Hardware_Design_V1.3
Date: 2019-05-20
Status: Released
www.quectel.com
Automotive Module Series
AG35 Hardware Design
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AG35 Hardware Design
Revision
Date
Author
Description
1.0
2018-03-19
Eden LIU/
Dominic GONG
Initial
1.1
2018-12-12
Eden LIU/
Dominic GONG/
Ethan SHAN
1. Updated the variants and/or frequency bands of
AG35 (Table 1).
2. Updated the functional diagram (Figure 1).
3. Updated the pin assignment of AG35 (Figure 2).
4. Updated the drive current of STATUS pin (Table 4).
5. Enabled SHDN_N (pin 176), and added the
description of the interface in Chapter 3.7.2.3.
6. Enabled an optional audio interface (pins 132~141)
for AG35 (Chapter 3.12).
7. Updated the pin definition of PCM and I2C
interfaces in Chapter 3.13.
8. Updated the power domain of SGMII interface
(Chapter 3.15).
9. Added the description of RTC function (Chapter
3.22).
10. Added GNSS performance values of AG35-NA and
AG35-J (Chapter 4.2).
11. Completed the operating frequency of the module
(Chapter 5.1.2),
12. Updated the frequency of Galileo and QZSS (Table
34).
13. Updated current consumption values of the module
(Chapter 6.4).
14. Completed the RF output power values of the
module (Chapter 6.5).
15. Added the RF receiving sensitivity of AG35-E,
AG35-NA and AG35-J (Chapter 6.6).
About the Document
History
Automotive Module Series
AG35_Hardware_Design 2 / 129
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16. Updated the recommended reflow soldering
thermal profile and involved parameters (Chapter
8.2).
1.2
2019-04-30
Eden LIU/
Dominic GONG
1. Removed the optional LTE-FDD B28 from
AG35-NA.
2. Enabled HSIC interface (pin 194/195) and added
related information thereof (Chapter 2.2, Chapter
2.3, Chapter 3.2, Chapter 3.3 and Chapter 3.23).
3. Added audio interface characteristics (Table 17).
4. Updated the reference circuit for connection with
AF20 module (Figure 29).
5. Added AG35-E and AG35-LA GNSS performance
parameters (Table 33 and Table 35).
6. Updated AG35-J GNSS performance parameters
(Table 36).
7. Updated GNSS frequency (Table 44).
8. Updated current consumption values of the module
(Chapter 6.4).
9. Updated RF receiving sensitivity (Chapter 6.6).
10. Updated electrostatic discharge characteristics
(Table 69).
11. Updated the recommended stencil thickness and
the peak reflow temperature (Chapter 8.2).
1.3
2019-05-20
Eden LIU
Corrected some pin names in the pin assignment
figure (Figure 2).
AG35 Hardware Design
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 4
Table Index ................................................................................................................................................... 7
Figure Index ................................................................................................................................................. 9
1 Introduction ........................................................................................................................................ 11
1.1. Safety Information ..................................................................................................................... 15
2 Product Concept ................................................................................................................................ 16
2.1. General Description .................................................................................................................. 16
2.2. Key Features ............................................................................................................................. 17
2.3. Functional Diagram ................................................................................................................... 20
2.4. Evaluation Board ....................................................................................................................... 21
3 Application Interfaces ....................................................................................................................... 22
3.1. General Description .................................................................................................................. 22
3.2. Pin Assignment ......................................................................................................................... 23
3.3. Pin Description .......................................................................................................................... 24
3.4. Operating Modes ....................................................................................................................... 35
3.5. Power Saving ............................................................................................................................ 36
3.5.1. Sleep Mode .................................................................................................................... 36
3.5.1.1. UART Application ................................................................................................ 37
3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 37
3.5.1.3. USB Application with USB Suspend/Resume and RI Functions ........................ 38
3.5.1.4. USB Application without USB Suspend Function ............................................... 39
3.5.2. Airplane Mode ................................................................................................................ 39
3.6. Power Supply ............................................................................................................................ 40
3.6.1. Power Supply Pins ......................................................................................................... 40
3.6.2. Decrease Voltage Drop .................................................................................................. 41
3.6.3. Reference Design for Power Supply .............................................................................. 42
3.6.4. Monitor the Power Supply .............................................................................................. 42
3.7. Turn on and off Scenarios ......................................................................................................... 42
3.7.1. Turn on Module Using the PWRKEY ............................................................................. 42
3.7.2. Turn off Module .............................................................................................................. 44
3.7.2.1. Turn off Module Using the PWRKEY Pin ............................................................ 44
3.7.2.2. Turn off Module Using AT Command .................................................................. 45
3.7.2.3. Turn off Module Using SHDN_N ......................................................................... 45
3.8. Reset the Module ...................................................................................................................... 47
3.9. (U)SIM Interface ........................................................................................................................ 48
3.10. USB Interface ............................................................................................................................ 50
3.11. UART Interfaces ........................................................................................................................ 52
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3.12. Audio Interface (Optional) ......................................................................................................... 54
3.13. PCM and I2C Interfaces ............................................................................................................ 56
3.14. SDIO Interfaces ......................................................................................................................... 59
3.14.1. SDIO1 Interface ............................................................................................................. 59
3.14.2. SDIO2 Interface ............................................................................................................. 59
3.15. SGMII Interface (Optional) ........................................................................................................ 61
3.16. Wireless Connectivity Interfaces ............................................................................................... 63
3.16.1. WLAN Interface .............................................................................................................. 65
3.16.2. BT Interface* .................................................................................................................. 66
3.17. ADC Interfaces .......................................................................................................................... 66
3.18. Network Status Indication ......................................................................................................... 67
3.19. STATUS ..................................................................................................................................... 68
3.20. Behaviors of RI .......................................................................................................................... 69
3.21. USB_BOOT Interface................................................................................................................ 70
3.22. RTC ........................................................................................................................................... 71
3.23. HSIC Interface* ......................................................................................................................... 71
4 GNSS Receiver ................................................................................................................................... 73
4.1. General Description .................................................................................................................. 73
4.2. GNSS Performance .................................................................................................................. 73
4.3. Layout Guidelines ..................................................................................................................... 76
5 Antenna Interfaces ............................................................................................................................. 77
5.1. Main/Rx-diversity Antenna Interface ......................................................................................... 77
5.1.1. Pin Definition .................................................................................................................. 77
5.1.2. Operating Frequency ..................................................................................................... 77
5.1.3. Reference Design of RF Antenna Interfaces ................................................................. 81
5.1.4. Reference Design of RF Layout..................................................................................... 82
5.2. GNSS Antenna Interface ........................................................................................................... 84
5.3. Antenna Installation .................................................................................................................. 85
5.3.1. Antenna Requirements .................................................................................................. 85
5.3.2. Recommended RF Connector for Antenna Installation ................................................. 86
6 Electrical, Reliability and Radio Characteristics ............................................................................ 88
6.1. Absolute Maximum Ratings ...................................................................................................... 88
6.2. Power Supply Ratings ............................................................................................................... 89
6.3. Operation and Storage Temperatures ...................................................................................... 89
6.4. Current Consumption ................................................................................................................ 90
6.5. RF Output Power .................................................................................................................... 106
6.6. RF Receiving Sensitivity ......................................................................................................... 110
6.7. Electrostatic Discharge ........................................................................................................... 114
6.8. Thermal Consideration ............................................................................................................ 114
7 Mechanical Dimensions .................................................................................................................. 117
7.1. Mechanical Dimensions of the Module ................................................................................... 117
7.2. Recommended Footprint ........................................................................................................ 119
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7.3. Design Effect Drawings of the Module .................................................................................... 120
8 Storage, Manufacturing and Packaging ........................................................................................ 121
8.1. Storage .................................................................................................................................... 121
8.2. Manufacturing and Soldering .................................................................................................. 122
8.3. Packaging ............................................................................................................................... 123
9 Appendix A References ................................................................................................................... 125
10 Appendix B GPRS Coding Schemes ............................................................................................. 129
11 Appendix C GPRS Multi-slot Classes ............................................................................................ 130
12 Appendix D EDGE Modulation and Coding Schemes ................................................................. 132
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Table Index
TABLE 1: FREQUENCY BANDS OF AG35 SERIES MODULES ..................................................................... 16
TABLE 2: AG35 KEY FEATURES ..................................................................................................................... 17
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 24
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 24
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 35
TABLE 6: VBAT AND GND PINS ....................................................................................................................... 40
TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 43
TABLE 8: PIN DEFINITION OF SHDN_N ......................................................................................................... 45
TABLE 9: RESET_N PIN DESCRIPTION ......................................................................................................... 47
TABLE 10: PIN DEFINITION OF (U)SIM INTERFACE ..................................................................................... 48
TABLE 11: PIN DEFINITION OF USB INTERFACE .......................................................................................... 50
TABLE 12: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................. 52
TABLE 13: PIN DEFINITION OF UART2 INTERFACE (FOR BT FUNCTION*) ............................................... 52
TABLE 14: PIN DEFINITION OF DEBUG UART INTERFACE ......................................................................... 53
TABLE 15: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 53
TABLE 16: PIN DEFINITION OF ANALOG AUDIO INTERFACE ...................................................................... 54
TABLE 17: AUDIO INTERFACE CHARACTERISTICS ..................................................................................... 55
TABLE 18: PIN DEFINITION OF PCM INTERFACE ......................................................................................... 57
TABLE 19: PIN DEFINITION OF I2C INTERFACES ......................................................................................... 57
TABLE 20: PIN DEFINITION OF SDIO2 INTERFACE ...................................................................................... 59
TABLE 21: PIN DEFINITION OF SGMII INTERFACE ...................................................................................... 61
TABLE 22: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 63
TABLE 23: PIN DEFINITION OF ADC INTERFACES ....................................................................................... 66
TABLE 24: CHARACTERISTICS OF ADC INTERFACES ................................................................................ 67
TABLE 25: PIN DEFINITION OF NETWORK CONNECTION STATUS /ACTIVITY INDICATOR ..................... 67
TABLE 26: WORKING STATE OF THE NETWORK CONNECTION STATUS /ACTIVITY INDICATOR .......... 68
TABLE 27: PIN DEFINITION OF STATUS ........................................................................................................ 69
TABLE 28: DEFAULT BEHAVIORS OF RI ........................................................................................................ 70
TABLE 29: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 70
TABLE 30: PIN DEFINITION OF HSIC INTERFACE ........................................................................................ 71
TABLE 31: DESIGN GUIDELINES FOR HSIC.................................................................................................. 71
TABLE 32: AG35-CE GNSS PERFORMANCE ................................................................................................. 73
TABLE 33: AG35-E GNSS PERFORMANCE .................................................................................................... 74
TABLE 34: AG35-NA GNSS PERFORMANCE ................................................................................................. 74
TABLE 35: AG35-LA GNSS PERFORMANCE .................................................................................................. 75
TABLE 36: AG35-J GNSS PERFORMANCE .................................................................................................... 75
TABLE 37: PIN DEFINITION OF RF ANTENNA INTERFACES ........................................................................ 77
TABLE 38: AG35-CE OPERATING FREQUENCIES ........................................................................................ 77
TABLE 39: AG35-E OPERATING FREQUENCIES ........................................................................................... 78
TABLE 40: AG35-NA OPERATING FREQUENCIES ........................................................................................ 79
TABLE 41: AG35-LA OPERATING FREQUENCIES ......................................................................................... 79
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TABLE 42: AG35-J OPERATING FREQUENCIES ........................................................................................... 80
TABLE 43: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 84
TABLE 44: GNSS FREQUENCY ....................................................................................................................... 84
TABLE 45: ANTENNA REQUIREMENTS .......................................................................................................... 85
TABLE 46: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 88
TABLE 47: POWER SUPPLY RATINGS ........................................................................................................... 89
TABLE 48: OPERATION AND STORAGE TEMPERATURES .......................................................................... 89
TABLE 49: AG35-CE CURRENT CONSUMPTION (25°C, 3.8V POWER SUPPLY) ........................................ 90
TABLE 50: AG35-E CURRENT CONSUMPTION ............................................................................................. 93
TABLE 51: AG35-NA CURRENT CONSUMPTION ........................................................................................... 96
TABLE 52: AG35-LA CURRENT CONSUMPTION ........................................................................................... 99
TABLE 53: AG35-J CURRENT CONSUMPTION ............................................................................................ 103
TABLE 54: AG35-CE GNSS CURRENT CONSUMPTION ............................................................................. 105
TABLE 55: AG35-E GNSS CURRENT CONSUMPTION ................................................................................ 105
TABLE 56: AG35-NA GNSS CURRENT CONSUMPTION ............................................................................. 105
TABLE 57: AG35-LA GNSS CURRENT CONSUMPTION .............................................................................. 106
TABLE 58: AG35-J GNSS CURRENT CONSUMPTION................................................................................. 106
TABLE 59: AG35-CE RF OUTPUT POWER ................................................................................................... 106
TABLE 60: AG35-E RF OUTPUT POWER ...................................................................................................... 107
TABLE 61: AG35-NA RF OUTPUT POWER ................................................................................................... 108
TABLE 62: AG35-LA RF OUTPUT POWER .................................................................................................... 108
TABLE 63: AG35-J RF OUTPUT POWER ...................................................................................................... 109
TABLE 64: AG35-CE RF RECEIVING SENSITIVITY ...................................................................................... 110
TABLE 65: AG35-E RF RECEIVING SENSITIVITY ......................................................................................... 111
TABLE 66: AG35-NA RF RECEIVING SENSITIVITY ....................................................................................... 112
TABLE 67: AG35-LA RF RECEIVING SENSITIVITY ....................................................................................... 112
TABLE 68: AG35-J RF RECEIVING SENSITIVITY .......................................................................................... 113
TABLE 69: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................ 114
TABLE 70: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................. 122
TABLE 71: RELATED DOCUMENTS .............................................................................................................. 125
TABLE 72: TERMS AND ABBREVIATIONS .................................................................................................... 125
TABLE 73: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 129
TABLE 74: GPRS MULTI-SLOT CLASSES .................................................................................................... 130
TABLE 75: EDGE MODULATION AND CODING SCHEMES ......................................................................... 132
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 21
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 23
FIGURE 3: SLEEP MODE CURRENT CONSUMPTION DIAGRAM ................................................................ 36
FIGURE 4: SLEEP MODE APPLICATION VIA UART ....................................................................................... 37
FIGURE 5: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 38
FIGURE 6: SLEEP MODE APPLICATION WITH RI ......................................................................................... 38
FIGURE 7: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 39
FIGURE 8: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 41
FIGURE 9: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 41
FIGURE 10: REFERENCE CIRCUIT OF POWER SUPPLY ............................................................................ 42
FIGURE 11: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 43
FIGURE 12: TURN ON THE MODULE USING KEYSTROKE ......................................................................... 43
FIGURE 13: TIMING OF TURNING ON MODULE ........................................................................................... 44
FIGURE 14: TIMING OF TURNING OFF MODULE ......................................................................................... 45
FIGURE 15: SHUT DOWN THE MODULE USING DRIVING CIRCUIT ........................................................... 46
FIGURE 16: TIMING OF TURNING OFF MODULE VIA SHDN_N ................................................................... 46
FIGURE 17: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 47
FIGURE 18: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 47
FIGURE 19: TIMING OF RESETTING MODULE ............................................................................................. 48
FIGURE 20: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 49
FIGURE 21: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR . 49
FIGURE 22: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 51
FIGURE 23: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 53
FIGURE 24: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 54
FIGURE 25: PRIMARY MODE TIMING ............................................................................................................ 56
FIGURE 26: AUXILIARY MODE TIMING .......................................................................................................... 57
FIGURE 27: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 58
FIGURE 28: REFERENCE CIRCUIT OF SD CARD APPLICATION ................................................................ 60
FIGURE 29: REFERENCE CIRCUIT FOR CONNECTION WITH AF20 MODULE .......................................... 65
FIGURE 30: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 68
FIGURE 31: REFERENCE CIRCUIT OF THE STATUS ................................................................................... 69
FIGURE 32: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 70
FIGURE 33: REFERENCE CIRCUIT OF RF ANTENNA INTERFACES ........................................................... 81
FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB ............................................................................... 82
FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB ........................................................... 82
FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 83
FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 83
FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 84
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FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 86
FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 86
FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 87
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................. 115
FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
.................................................................................................................................................................. 116
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................... 117
FIGURE 45: MODULE BOTTOM DIMENSIONS (TOP VIEW) ........................................................................ 118
FIGURE 46: MODULE BOTTOM DIMENSIONS (TOP VIEW) ........................................................................ 119
FIGURE 47: TOP VIEW OF THE MODULE .................................................................................................... 120
FIGURE 48: BOTTOM VIEW OF THE MODULE ............................................................................................ 120
FIGURE 49: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE .............................................. 122
FIGURE 50: TAPE SPECIFICATIONS ............................................................................................................ 123
FIGURE 51: REEL SPECIFICATIONS ............................................................................................................ 124
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1 Introduction
This document defines the AG35 module and describes its air interface and hardware interfaces which
are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. Associated with application notes
and user guides, customers can use AG35 to design and set up automotive industry mobile applications
easily.
Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [AG35-LA] is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com
The device could be used with a separation distance of 20cm to the human body.
AG35_Hardware_Design 11 / 129
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OEM/Integrators Installation Manual
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the
instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.
that they wish to change
the antenna trace design. In this case, a Class II permissive change application is required to be filed
by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new
application) procedure followed by a Class II permissive change application.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on
the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains
FCC ID: XMR201905AG35LA”
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
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Antenna type
GSM850
Gain (dBi)
GSM1900
Gain (dBi)
WCDMA
Band II Gain
(dBi)
WCDMA
Band IV Gain
(dBi)
WCDMA
Band V Gain
(dBi)
Fixed
External
Antenna
4.50
2.00
2.00
5.00
4.50
Antenna type
LTE Band 2
Gain (dBi)
LTE Band 4
Gain (dBi)
LTE Band 5
Gain (dBi)
LTE Band 7
Gain (dBi)
Fixed
External
Antenna
2.00
5.00
4.50
7.00
AG35 Hardware Design
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
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conjunction with any other antenna or transmitter.
List of applicable FCC rules
This module has been tested and found to comply with part 22, part 24, part 27 requirements for Modular
Approval.
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter
rules) listed on the grant, and that the host product manufacturer is responsible for compliance to
any other FCC rules that apply to the host not covered by the modular transmitter grant of
certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also
contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that
the final host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
This device is intended only for OEM integrators under the following
conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.
AG35_Hardware_Design 14 / 129
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Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
AG35 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating AG35 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
AG35_Hardware_Design 15 / 129
Automotive Module Series
Network
Type
AG35-CE
AG35-E
AG35-NA
AG35-LA
AG35-J
LTE-FDD
(with
Rx-diversity)
B1/B3/
B5/B8
B1/B3/B5/
B7/B8/B20/
B28
B2/B4/B5/
B7/B12/B13/
B17
B1/B2/B3/
B4/B5/B7/
B8/B28
B1/B3/B5/B8/
B9/B19/B21/
B28
LTE-TDD
(with
Rx-diversity)
B34/B38/
B39/B40/
B41
B38/B40
N/A
N/A
B41
WCDMA
(with
Rx-diversity)
B1/B8
B1/B5/B8
B2/B4/B5
B1/B2/B3/
B4/B5/B8
B1/B3/B5/
B6/B8/B19
TD-SCDMA
B34/B39
N/A
N/A
N/A
N/A
EVDO/CDMA
BC0 1)
N/A
N/A
N/A
N/A
GSM
900/1800MHz
900/1800MHz
850/1900MHz
850/900/
1800/1900MHz
N/A
AG35 Hardware Design
2 Product Concept
2.1. General Description
AG35 is a series of automotive-grade LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/EVDO/CDMA/GSM
wireless communication module with LTE/WCDMA receive diversity. Engineered to meet the demanding
requirements in automotive applications and other harsh operating conditions, it offers a premium solution
for high performance automotive and intelligent transportation system (ITS) applications, such as fleet
management, onboard vehicle telematics, in-car entertainment systems, emergency calling, and roadside
assistance. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,
WCDMA, TD-SCDMA, EVDO, CDMA, EDGE and GPRS networks. Also it can provide GNSS and voice
functionality to meet customers’ specific application demands.
AG35 contains five variants: AG35-CE, AG35-E, AG35-NA, AG35-LA and AG35-J. Customers can
choose a dedicated type based on the region or operator. The following table shows the frequency bands
of AG35 series modules.
Table 1: Frequency Bands of AG35 Series Modules
AG35_Hardware_Design 16 / 129
Automotive Module Series
GNSS
GPS,
GLONASS,
BeiDou/
Compass,
Galileo, QZSS
GPS,
GLONASS,
BeiDou/
Compass,
Galileo, QZSS
GPS,
GLONASS,
BeiDou/
Compass,
Galileo, QZSS
GPS,
GLONASS,
BeiDou/
Compass,
Galileo,
QZSS,SBAS
GPS,
GLONASS,
BeiDou/
Compass,
Galileo, QZSS
1. 1) EVDO/CDMA BC0 for AG35-CE is optional.
2. “*” means under development.
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Transmitting Power
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+2/-1dB) for EVDO/CDMA BC0
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 2 (24dBm+1/-3dB) for TD-SCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support up to non-CA Cat 4 FDD and TDD
Support 1.4 to 20MHz RF bandwidth
NOTES
AG35 Hardware Design
AG35 is an SMD type module which can be embedded in applications through its 299-pin LGA pads. This,
coupled with its compact profile of 33.0mm × 37.5mm × 3.0mm, makes AG35 a ruggedized module for
the most demanding applications and environments.
2.2. Key Features
The following table describes the detailed features of AG35 module.
Table 2: AG35 Key Features
AG35_Hardware_Design 17 / 129
Automotive Module Series
Support Multiuser MIMO in DL direction
FDD: Max 150Mbps (DL)/50Mbps (UL)
TDD: Max 130Mbps (DL)/30Mbps (UL)
WCDMA Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL)/384Kbps (UL)
TD-SCDMA Features
Support CCSA Release 3 TD-SCDMA
Max 4.2Mbps (DL)/2.2Mbps (UL)
CDMA2000 Features
Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A
EVDO: Max 3.1Mbps (DL)/1.8Mbps (UL)
1X Advanced: Max 307.2Kbps (DL)/307.2Kbps (UL)
GSM Features
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL)/85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/236.8Kbps (UL)
Internet Protocol Features
Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS/SMTP/MMS/
FTPS/SMTPS/SSL protocols
Support the protocols PAP (Password Authentication Protocol) and CHAP
(Challenge Handshake Authentication Protocol) usually used for PPP
connections
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support USIM/SIM card: 1.8V, 3.0V
Audio Features
(Optional)
Built-in audio codec with two microphone inputs and one stereo output or
two mono outputs
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
AG35 Hardware Design
AG35_Hardware_Design 18 / 129
Automotive Module Series
Support master and slave modes, but must be the master in long frame
synchronization
SGMII Interface (Optional)
Support 10/100/1000Mbps
WLAN Interface
Compliant with 802.11, 4-bit, 1.8V WLAN interface
SDIO Interfaces
SDIO1:
Compliant with SD 3.0 protocol
Used for WLAN function
SDIO2:
Compliant with SD 3.0 protocol
USB Interface
Compliant with USB 2.0 specification (slave only), and the data transfer
rate can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging and firmware upgrade
Support USB serial driver under Windows 7/8/8.1/10, Windows CE
5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x/8.x/9.x
HSIC Interface*
High-speed inter-chip USB electrical specification compliant
UART Interfaces
Main UART:
Used for AT command communication and data transmission
Baud rate reach up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
UART2:
Used for BT function*
Baud rate reach up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
Rx-diversity
Support LTE/WCDMA Rx-diversity
GNSS Features
Gen8C-Lite of Qualcomm
Protocol: NMEA 0183
Data update rate: 1Hz by default and maximally up to 10Hz
AT Commands
3GPP TS 27.007/3GPP TS 27.005 AT commands and Quectel enhanced
AT commands
Network Indication
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Antenna Interface
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Physical Characteristics
Size: (33.0±0.15)mm × (37.5±0.15)mm × (3.0±0.2)mm
Weight: Approx. 8.1g
Temperature Range
Operation temperature range: -35°C ~ +75°C 1)
AG35 Hardware Design
AG35_Hardware_Design 19 / 129
Automotive Module Series
Extended temperature range: -40°C ~ +85°C
2)
eCall temperature range: -40°C ~ +90°C 3)
Storage temperature range: -40°C ~ +95°C
Firmware Upgrade
USB interface
DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
1. 1) Within operation temperature range, the module is 3GPP compliant, and emergency call can be
dialed out with a maximum power and data rate.
2. 2) Within extended temperature range, the module remains fully functional and retains the ability to
establish and maintain a voice, SMS, data transmission, emergency call, etc. There is no
unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio
network. Only one or more parameters like P
out
might reduce in their value and exceed the specified
tolerances. When the temperature returns to normal operation temperature levels, the module will
meet 3GPP specifications again.
3. 3) Within eCall temperature range, the emergency call function must be functional until the module is
broken. When the ambient temperature is between 75°C and 90°C and the module temperature has
reached the threshold value, the module will trigger protective measures (such as reduce power,
decrease throughput, unregister the device, etc.) to ensure the full function of emergency call.
4. “*” means under development.
NOTES
AG35 Hardware Design
2.3. Functional Diagram
The following figure shows a block diagram of AG35 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interface
AG35_Hardware_Design 20 / 129
Automotive Module Series
Baseband
PMIC
Transceiver
NAND
DDR2
SDRAM
PA
PAM
LNA
Switch
ANT_MAIN ANT_DIVANT_GNSS
VBAT_BB
VBAT_RF
APT
PWRKEY
ADCs
VDD_EXT
RESET_N
19.2M
XO
STATUS
SAW
Control
IQ Control
Duplex
SAW
Tx
PRx DRx
PCM SGMII WLAN SDIOs USB (U)SIM I2CS UARTs HSIC*
PM_ENABLENET_STATUS
STATUS
BT_EN*
Audio
SPKS MICS
SHDN_N
RTC
SAW
“*” means under development.
NOTE
AG35 Hardware Design
Figure 1: Functional Diagram
2.4. Evaluation Board
In order to help customers develop applications with AG35 conveniently, Quectel supplies the evaluation
board (EVB), USB data cable, earphone, antenna and other peripherals to control or test the module. For
more details, please refer to document [3].
AG35_Hardware_Design 21 / 129
Automotive Module Series
“*” means under development.
NOTE
AG35 Hardware Design
3 Application Interfaces
3.1. General Description
AG35 is equipped with 299-pin LGA pads that can be connected to cellular application platform.
Sub-interfaces included in these pads are described in detail in the following sub-chapters:
Power supply
(U)SIM interface
USB interface
UART interfaces
Audio interface (optional)
PCM and I2C interfaces
SDIO interfaces
SGMII interface (optional)
Wireless connectivity interfaces
ADC interfaces
Status indication interfaces
USB_BOOT interface
HSIC interface*
AG35_Hardware_Design 22 / 129
AG35 Hardware Design
299
176
298
174
172
170
168
166
164
162
160
158
156
154
152
150
148
146
144
142
140
138
136
134
132
130
175
173
171
169
167
165
163
161
159
157
155
153
151
149
147
145
143
141
139
137
135
133
131
129
127
125
123
121
119
117
115
111
109
107
105
103
101
99
97
95
128
113
126
124
122
120
118
116
114
112
110
108
106
104
102
100
98
96
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
93
91
89
94
92
90
197
196
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
41
39
37
35
33
31
29
27
23
21
19
17
15
13
11
9
7
402538
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
5
3
1
6
4
2
178
177
297
296
216 217 218215 219 220 221 222 223
224
233
242
251
260
269
278
287
225
234
243
252
261
270
279
288
226
235
244
253
262
271
280
289
227
236
272
281
290
228
237
273
282
291
229
238
274
283
292
230
239
248
257
266
275
284
293
231
240
249
258
267
276
285
294
232
241
250
259
268
277
286
295
RESET_N
PWRKEY
BT_EN*
PM_ENABLE
USIM_PRESENCE
USIM_CLK
USIM_DATA
USIM_VDD
USIM_RST
USB_VBUS
USB_DM
USB_DP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
I2C1_SDA
I2C1_SCL
VDD_SDIO
SDC2_DATA2
SDC2_DATA3
SDC2_DATA0
SDC2_DATA1
SDC2_CMD
SD_INS_DET
SDC2_CLK
UART1_CTS
UART1_RTS
UART1_RXD
UART1_DCD
UART1_TXD
UART1_RI
UART1_DTR
PCM_SYNC
PCM_CLK
PCM_IN
PCM_OUT
RESERVED
RESERVED
RESERVED
RESERVED
VBAT_RF
VBAT_RF
VBAT_RF
VBAT_RF
ANT_MAIN
ANT_GNSS
ANT_DIV
SPK1_P
MICBIAS
MIC2_P
MIC_P
SPK1_N
MIC2_N
MIC1_N
RESERVED
COEX_UART_TX
NET_MODE
WLAN_EN
W_DISABLE#
SLEEP_IND
COEX_UART_RX
WAKEUP_IN
MCLK
VBAT_BB
VBAT_BB
WLAN_WAKE
UART2_TXD
UART2_RXD
UART2_CTS
UART2_RTS
VDD_EXT
WLAN_SLP_CLK
GND
NET_STATUS
STATUS
ADC0
ADC1
GND
GND
GND
GND
GND
GND
GND
AGND
SPK2_P
GND
GND
SPK2_N
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
USIM_GND
245 246 247
254 255 256
263 264 265
RESERVED
RESERVED
RESERVED
ADC2
SHDN_N
VDD_MDIO
EPHY_RST_N
SGMII_MCLK
SGMII_MDATA
EPHY_INT_N
GND
SGMII_RX_M
GND
SGMII_RX_P
SGMII_TX_P
GND
SDC1_CMD
SDC1_DATA0
SDC1_DATA2
GND
GND
GND
GND
SDC1_DATA3
SDC1_DATA1
SDC1_CLK
GND
SGMII_TX_M
GND
GND
GND
GND
GND
GND
RESERVED
RESERVED
HSIC_STROBE*
HSIC_DATA*
RESERVED
RESERVED
RESERVED
RESERVED
I2C2_SCL
I2C2_SDA
DBG_RXD
DBG_TXD
Power Pins GND Pins Signal Pins RESVRVED Pins
MDIO Pins
SDIO Pins
(U)SIM Pins
USB Pins
IIC Pins
SD Pins
ADC Pins
UART2 Pins
UART1 Pins
Debug UART Pins
GPIO Pins
COEX_UART Pins SGMII Pins
SPI Pins
Audio Pins
PCM Pins
HSIC Pins
/USB_BOOT
3.2. Pin Assignment
The following figure shows the pin assignment of AG35 module.
Automotive Module Series
Figure 2: Pin Assignment (Top View)
AG35_Hardware_Design 23 / 129
AG35 Hardware Design
1. Pins 59, 65, 67, 144~147 and 149 cannot be pulled up before power-up.
2. PWRKEY (pin 2) output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
3. GND pins 215~299 should be connected to ground in the design.
4. Keep all RESERVED pins and unused pins unconnected.
5. “*” means under development.
Type
Description
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
IO
Bidirectional
PI
Power input
PO
Power output
Power Supply
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
VBAT_BB
155, 156
PI
Power supply for
module’s baseband
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
VBAT_RF
85, 86, 87, 88
PI
Power supply for
module’s RF part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 1.8A in a
NOTES
3.3. Pin Description
The following tables show the pin definition and description of AG35.
Automotive Module Series
Table 3: I/O Parameters Definition
Table 4: Pin Description
AG35_Hardware_Design 24 / 129
Automotive Module Series
transmitting burst.
VDD_EXT
168
PO
Provide 1.8V for
external circuit
Vnorm=1.8V
IOmax=50mA
Power supply for
external GPIO’s pull up
circuits.
GND
10, 13, 16,
17, 30, 31,
35, 39, 44,
45, 54, 55,
63, 64, 69,
70, 75, 76,
81~84,
89~94,
96~100,
102~106,
108~112,
114,
116~118,
120~126,
128~131,
142, 148,
153, 154,
157, 158,
167, 174,
177, 178,
181, 184,
187, 191,
196~299
Ground
Turn on/off
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
PWRKEY
2
DI
Turn on/off the
module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
The output voltage is
0.8V because of the
diode drop in the
Qualcomm chipset.
RESET_N
1
DI
Reset the module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Internally pulled up to
1.8V. Active low.
SHDN_N
176
DI
Emergency
shutdown for the
module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
Status Indication
AG35 Hardware Design
AG35_Hardware_Design 25 / 129
Automotive Module Series
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
STATUS
171
OD
Indicate the
module’s operation
status
The drive current
should be less than
0.15mA.
Require external
pull-up. If unused,
keep it open.
NET_MODE
147
DO
Indicate the
module’s network
registration status
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep it
open.
NET_
STATUS
170
DO
Indicate the
module’s network
activity status
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep it
open.
USB Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USB_VBUS
32
PI
USB connection
detection
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
Maximum Current:
1mA
USB_DM
33
IO
USB differential
data bus (-)
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90Ω.
USB_DP
34
IO
USB differential
data bus (+)
Compliant with USB
2.0 standard
specification.
Require differential
impedance of 90Ω.
HSIC Interface*
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
HSIC_
STROBE*
194
IO
High speed inter
chip interface strobe
VILmax=0.4V
VIHmin=0.8V
VOLmax=0.3V
VOHmin=0.9V
1.2V power domain.
If unused, keep them
open.
HSIC_DATA*
195
IO
High speed inter
chip interface - data
(U)SIM Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USIM_GND
24
Specified ground for
(U)SIM card
Connect to ground of
(U)SIM card
connector.
USIM_
PRESENCE
25
DI
(U)SIM card
insertion detection
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
AG35 Hardware Design
AG35_Hardware_Design 26 / 129
Automotive Module Series
USIM_VDD
26
PO
Power supply for
(U)SIM card
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=3.05V
Vmin=2.7V
IOmax=50mA
Either 1.8V or 3V is
supported by the
module automatically.
USIM_CLK
27
DO
Clock signal of
(U)SIM card
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
USIM_RST
28
DO
Reset signal of
(U)SIM card
For 1.8V USIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VOLmax=0.45V
VOHmin=2.55V
USIM_DATA
29
IO
Data signal of
(U)SIM card
For 1.8V USIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V USIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
Main UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
UART1_CTS
56
DO
DTE clear to send
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART1_RTS
57
DI
DTE request to
send
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
AG35 Hardware Design
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Automotive Module Series
UART1_RXD
58
DI
Receive data
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
UART1_DCD
59
DO
Data carrier
detection
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART1_TXD
60
DO
Transmit data
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART1_RI
61
DO
Ring indicator
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART1_DTR
62
DI
Data terminal ready.
Sleep mode control
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
Pulled up by default.
Low level wakes up
the module.
If unused, keep it
open.
UART2 Interface (for BT Function*)
UART2_TXD
163
DO
Transmit data
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART2_CTS
164
DO
DTE clear to send
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
UART2_RXD
165
DI
Receive data
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
UART2_RTS
166
DI
DTE request to
send
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep it
open.
Debug UART Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
DBG_TXD
71
DO
Transmit data
VOLmax=0.45V
VOHmin=1.35V
1.8V power domain.
If unused, keep it
open.
DBG_RXD
72
DI
Receive data
VILmin=-0.3V
VILmax=0.6V
1.8V power domain.
If unused, keep it
AG35 Hardware Design
AG35_Hardware_Design 28 / 129
Automotive Module Series
VIHmin=1.2V
VIHmax=2.0V
open.
ADC Interfaces
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ADC2
172
AI
General purpose
analog to digital
converter interface
Voltage Range:
0.1V to 1.7V
If unused, keep it
open.
ADC0
173
AI
General purpose
analog to digital
converter interface
Voltage Range:
0.3V to VBAT_BB
If unused, keep it
open.
ADC1
175
AI
General purpose
analog to digital
converter interface
Voltage Range:
0.3V to VBAT_BB
If unused, keep it
open.
Audio Interface (Optional)
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
SPK2_P
132
AO
Earphone analog
output 2 (+)
If unused, keep it
open.
SPK2_N
133
AO
Earphone analog
output 2 (-)
If unused, keep it
open.
SPK1_P
134
AO
Earphone analog
output 1 (+)
If unused, keep it
open.
SPK1_N
135
AO
Earphone analog
output 1 (-)
If unused, keep it
open.
MICBIAS
136
AO
Bias voltage output
for microphone
Vmax=1.55V
Vmin=1.5V
Vnorm=1.525V
If unused, keep it
open.
MIC2_N
137
AI
Microphone analog
input 2 (-)
If unused, keep it
open.
MIC2_P
138
AI
Microphone analog
input 2 (+)
If unused, keep it
open.
MIC1_N
139
AI
Microphone analog
input 1 (-)
If unused, keep it
open.
MIC1_P
140
AI
Microphone analog
input 1 (+)
If unused, keep it
open.
AGND
141
Analog ground
If unused, keep it
open.
PCM Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
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AG35_Hardware_Design 29 / 129
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