Quectel Wireless Solutions 201808BC66 Users Manual

BC66 Hardware Design
NB-IoT Module Series
Rev. BC66_Hardware_Design_V1.1
Date: 2018-11-14
Status: Released
www.quectel.com
BC66 Hardware Design
Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm
Or email to: support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL
WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND
EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN
WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL
RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY
MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.
BC66_Hardware_Design 1 / 57
BC66 Hardware Design
About the Document
History
Revision Date Author Description
1.0 2018-08-24
1.1 2018-11-14 Newgate HUA
Speed SUN/
Newgate HUA
Initial
Updated supported bands and involved RF parameters of
BC66.
BC66_Hardware_Design 2 / 57
BC66 Hardware Design
Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 3
Table Index ............................................................................................................................................... 5
Figure Index .............................................................................................................................................. 6
1 Introduction ....................................................................................................................................... 7
1.1. Safety Information .................................................................................................................... 8
2 Product Concept ............................................................................................................................... 9
2.1. General Description .................................................................................................................. 9
2.2. Key Features .......................................................................................................................... 10
2.3. Functional Diagram .................................................................................................................11
2.4. Development Board ................................................................................................................ 12
3 Application Interfaces ..................................................................................................................... 13
3.1. General Description ................................................................................................................ 13
3.2. Pin Assignment ....................................................................................................................... 14
3.3. Pin Description ....................................................................................................................... 15
3.4. Operating Modes .................................................................................................................... 18
3.5. Power Saving Mode (PSM) .................................................................................................... 19
3.6. Power Supply ......................................................................................................................... 20
3.6.1. Power Supply Pins ....................................................................................................... 20
3.6.2. Reference Design for Power Supply ............................................................................ 21
3.7. Power up/Power down Scenarios ........................................................................................... 21
3.7.1. Turn on ........................................................................................................................ 21
3.7.2. Turn off ........................................................................................................................ 23
3.7.3. Reset the Module ......................................................................................................... 24
3.8. UART Interfaces ..................................................................................................................... 25
3.8.1. Main UART Port ........................................................................................................... 26
3.8.2. Debug UART Port ........................................................................................................ 26
3.8.3. Auxiliary UART Port ..................................................................................................... 27
3.8.4. UART Application ......................................................................................................... 27
3.9. SPI Interface ........................................................................................................................... 29
3.10. USIM Interface ....................................................................................................................... 30
3.11. ADC Interface ......................................................................................................................... 32
3.12. RI Behaviors* ......................................................................................................................... 32
3.13. Network Status Indication* ...................................................................................................... 32
4
Antenna Interface ............................................................................................................................ 34
4.1. Pin Definition .......................................................................................................................... 34
4.2. Operating Frequencies ........................................................................................................... 34
4.3. RF Antenna Reference Design ............................................................................................... 35
4.4. Reference Design of RF Layout ............................................................................................. 36
BC66_Hardware_Design 3 / 57
BC66 Hardware Design
4.5. Antenna Requirements ........................................................................................................... 38
4.6. RF Output Power .................................................................................................................... 39
4.7. RF Receiving Sensitivity ......................................................................................................... 40
4.8. Recommended RF Connector for Antenna Installation ........................................................... 41
5 Electrical and Reliability Characteristics ...................................................................................... 43
5.1. Operation and Storage Temperatures ..................................................................................... 43
5.2. Current Consumption ............................................................................................................. 43
5.3. Electrostatic Discharge ........................................................................................................... 45
6 Mechanical Dimensions.................................................................................................................. 47
6.1. Mechanical Dimensions of the Module ................................................................................... 47
6.2. Recommended Footprint ........................................................................................................ 49
6.3. Top and Bottom Views of the Module ..................................................................................... 50
7 Storage, Manufacturing and Packaging ........................................................................................ 51
7.1. Storage ................................................................................................................................... 51
7.2. Manufacturing and Soldering .................................................................................................. 52
7.3. Packaging ............................................................................................................................... 53
7.3.1. Tape and Reel Packaging ............................................................................................ 53
8 Appendix A References .................................................................................................................. 55
BC66_Hardware_Design 4 / 57
BC66 Hardware Design
Table Index
TABLE 1: FREQUENCY BANDS OF BC66 MODULE ........................................................................................ 9
TABLE 2: BC66 KEY FEATURES ..................................................................................................................... 10
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 18
TABLE 6: POWER SUPPLY PINS ..................................................................................................................... 20
TABLE 7: PWRKEY PIN .................................................................................................................................... 21
TABLE 8: RESET PIN ........................................................................................................................................ 24
TABLE 9: PIN DEFINITION OF UART INTERFACES ....................................................................................... 25
TABLE 10: PIN DEFINITION OF SPI INTERFACE ........................................................................................... 30
TABLE 11: PIN DEFINITION OF USIM INTERFACE ........................................................................................ 31
TABLE 12: PIN DEFINITION OF ADC INTERFACE ......................................................................................... 32
TABLE 13: PIN DEFINITION OF NB-IOT ANTENNA INTERFACE ................................................................... 34
TABLE 14: MODULE OPERATING FREQUENCIES ........................................................................................ 34
TABLE 15: ANTENNA CABLE INSERTION LOSS REQUIREMENTS ............................................................. 38
TABLE 16: REQUIRED ANTENNA PARAMETERS .......................................................................................... 38
TABLE 17: RF CONDUCTED OUTPUT POWER ............................................................................................. 39
TABLE 18: RECEIVING SENSITIVITY (WITH RF RETRANSMISSIONS) ....................................................... 40
TABLE 19: OPERATION AND STORAGE TEMPERATURES .......................................................................... 43
TABLE 20: MODULE CURRENT CONSUMPTION .......................................................................................... 44
TABLE 21: ELECTROSTATIC DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ........ 46
TABLE 22: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................... 52
TABLE 23: RELATED DOCUMENTS ................................................................................................................ 55
TABLE 24: TERMS AND ABBREVIATIONS ...................................................................................................... 55
BC66_Hardware_Design 5 / 57
BC66 Hardware Design
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 12
FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 14
FIGURE 3: MODULE POWER CONSUMPTION IN DIFFERENT MODES ...................................................... 19
FIGURE 4: TIMING OF WAKING UP MODULE FROM PSM ........................................................................... 20
FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY ............................................................................ 21
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................... 22
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 22
FIGURE 8: POWER UP TIMING ....................................................................................................................... 22
FIGURE 9: POWER DOWN TIMING (POWER OFF BY AT COMMAND) ........................................................ 23
FIGURE 10: POWER DOWN TIMING (POWER OFF BY DISCONNECTING VBAT) ...................................... 23
FIGURE 11: REFERENCE CIRCUIT OF RESET BY USING DRIVING CIRCUIT ........................................... 24
FIGURE 12: REFERENCE CIRCUIT OF RESET BY USING BUTTON ........................................................... 24
FIGURE 13: RESET TIMING ............................................................................................................................. 25
FIGURE 14: REFERENCE DESIGN FOR MAIN UART PORT ........................................................................ 26
FIGURE 15: REFERENCE DESIGN OF DEBUG UART PORT ....................................................................... 27
FIGURE 16: REFERENCE DESIGN OF AUXILIARY UART PORT .................................................................. 27
FIGURE 17: REFERENCE CIRCUIT WITH VOLTAGE LEVEL TRANSLATOR CHIP ...................................... 28
FIGURE 18: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 28
FIGURE 19: SKETCH MAP FOR RS-232 INTERFACE MATCH ...................................................................... 29
FIGURE 20: SPI INTERFACE REFERENCE CIRCUIT WITH TRANSLATOR CHIP ....................................... 30
FIGURE 21: REFERENCE CIRCUIT FOR USIM INTERFACE WITH A 6-PIN USIM CARD CONNECTOR ... 31
FIGURE 22: REFERENCE DESIGN FOR NETLIGHT ..................................................................................... 33
FIGURE 23: REFERENCE DESIGN OF NB-IOT ANTENNA INTERFACE ...................................................... 36
FIGURE 24: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 36
FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 37
FIGURE 26: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 37
FIGURE 27: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .................................................................................................................................................. 37
FIGURE 28: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ................................................ 41
FIGURE 29: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 41
FIGURE 30: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 42
FIGURE 31: TOP VIEW OF THE MODULE ...................................................................................................... 50
FIGURE 32: BOTTOM VIEW OF THE MODULE .............................................................................................. 50
FIGURE 33: TAPE DIMENSIONS (UNIT: MM) .................................................................................................. 54
FIGURE 34: REEL DIMENSIONS (UNIT: MM) ................................................................................................. 54
BC66_Hardware_Design 6 / 57
BC66 Hardware Design
1 Introduction
This document defines the BC66 module and describes its air interface and hardware interface which are
connected with the customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. Associated with application notes
and user guides, customers can use BC66 to design and set up mobile applications easily.
BC66_Hardware_Design 7 / 57
BC66 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating BC66 module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
BC66_Hardware_Design 8 / 57
BC66 Hardware Design
2 Product Concept
2.1. General Description
BC66 is a high-performance NB-IoT module with extremely low power consumption. It is designed to
communicate with infrastructures of mobile network operators through NB-IoT radio protocols (3GPP
Rel.13 and 3GPP Rel.14*). BC66 supports a broad range of frequency bands as listed below.
Table 1: Frequency Bands of BC66 Module
Mode BC66
H-FDD B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26*/B28/B66
BC66 is an SMD type module with LCC package, and has an ultra-compact profile of 17.7mm × 15.8mm ×
2.0mm. These make it can be easily embedded into size-constrained applications and provide reliable
connectivity with the applications.
BC66 provides abundant external interfaces (UART, SPI*, ADC*, NETLIGHT*, etc.) and protocol stacks
(UDP/TCP, LwM2M, MQTT, etc.), which provide great convenience for customers' applications.
Due to compact form factor, ultra-low power consumption and extended temperature range, BC66 is a
best choice for a wide range of IoT applications, such as smart metering, bike sharing, smart wearables,
smart parking, smart city, home appliances, security and asset tracking, agricultural and environmental
monitoring, etc. It is able to provide a complete range of SMS* and data transmission services to meet
customers’ demands.
The module fully complies with the RoHS directive of the European Union.
NOTE
“*” means under development.
BC66_Hardware_Design 9 / 57
BC66 Hardware Design
2.2. Key Features
The following table describes the detailed features of BC66 module.
Table 2: BC66 Key Features
Feature Details
Power Supply
Power Saving
Frequency bands
Supply voltage: 2.1V ~ 3.63V
Typical supply voltage: 3.3V
Maximum power consumption: 5μA
Typical power consumption: 3.5μA
LTE Cat NB1:
B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26*/B28/B66
Transmitting Power 23dBm±2dB
USIM Interface Support 1.8V USIM card
Main UART Port:
Used for AT command communication and data transmission.
By default, the module is in auto-baud mode, and it supports automatic
baud rates not exceeding 115200bps. When powering on the module, the
MCU has to send AT command consecutively to synchronize baud rate with the module. When OK is returned, it indicates the baud rate has been
synchronized successfully. When the module is woken up from PSM or
UART Interfaces
idle mode, the baud rate synchronized during start-up will be used directly.
Also can be used for firmware upgrade, and in such case, the baud rate is
921600bps by default.
Debug UART Port:
Used for firmware debugging
Default baud rate: 115200bps
Auxiliary UART Port:
Used for firmware debugging
Default baud rate: 115200bps
Network Protocols UDP/TCP/LwM2M/MQTT/CoAP*/PPP*/TLS*/DTLS*/HTTP*/HTTPS*
SMS* Text/PDU Mode
Data Transmission
Features
AT Commands
Single-tone: 25.5kbps (DL)/16.7kbps (UL)
Multi-tone: 25.5kbps (DL )/62.5kbps (UL)
3GPP TS 27.005/3GPP TS 27.007 AT commands (3GPP Rel. 13/Rel.14*)
and Quectel Enhanced AT commands
Firmware Update Upgrade firmware via main UART port or DFOTA
BC66_Hardware_Design 10 / 57
BC66 Hardware Design
Real Time Clock Supported
Physical
Characteristics
Temperature Range
Size: (17.7±0.15)mm × (15.8±0.15)mm × (2.0±0.2)mm
Weight: 1.2g±0.2g
1)
Operation temperature range: -35°C ~ +75°C
Extended temperature range: -40°C ~ +85°C
2)
Storage temperature range: -40°C ~ +90°C
Antenna Interface 50 impedance control
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1)
1.
Within operation temperature range, the module is 3GPP compliant.
2)
2.
Within extended temperature range, the module remains the ability to establish and maintain an
SMS*, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on
radio spectrum and no harm to radio network. Only one or more parameters like P
might reduce in
out
their value and exceed the specified tolerances. When the temperature returns to normal operation
temperature levels, the module will meet 3GPP specifications again.
3. "*" means under development.
2.3. Functional Diagram
The following figure shows a block diagram of BC66 and illustrates the major functional parts.
Radio frequency
Baseband
Power management
Peripheral interfaces
BC66_Hardware_Design 11 / 57
BC66 Hardware Design
Figure 1: Functional Diagram
NOTE
“*” means under development.
2.4. Development Board
Quectel provides a complete set of development tools to facilitate the use and testing of BC66 module.
The development tool kit includes the TE-B board, USB cable, antenna and other peripherals. For more
details, please refer to document [1].
BC66_Hardware_Design 12 / 57
BC66 Hardware Design
3 Application Interfaces
3.1. General Description
BC66 is equipped with a total of 58 pins, including 44 LCC pins and 14 LGA pins. The subsequent
chapters will provide detailed descriptions of the following functions/pins/interfaces:
PSM
Power Supply
RESET
PWRKEY
UART Interfaces
SPI Interface
USIM Interface
ADC Interface
Network Status Indication*
Antenna Interface
NOTE
“*” means under development.
BC66_Hardware_Design 13 / 57
BC66 Hardware Design
3.2. Pin Assignment
Figure 2: Pin Assignment
NOTES
1. Keep all reserved pins unconnected.
2. “*” means under development.
BC66_Hardware_Design 14 / 57
BC66 Hardware Design
3.3. Pin Description
Table 3: I/O Parameters Definition
Type Description
IO Bidirectional
DI Digital input
DO Digital output
PI Power input
PO Power output
AI Analog input
AO Analog output
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
VBAT_BB 42 PI
VBAT_RF 43 PI
Power supply for
the module’s
baseband part
Power supply for
the module’s RF
part
Vmax=3.63V
Vmin=2.1V
Vnorm=3.3V
Vmax=3.63V
Vmin=2.1V
Vnorm=3.3V
No voltage output in
PSM mode.
It is intended to supply
VDD_
EXT
24 PO
1.8V output
power supply
Vnorm=1.8V
power for the module’s
pull-up circuits, and is
thus not recommended
to be used as the
power supply for
external circuits.
1, 27, 34,
GND
36, 37, 40,
GND
41
BC66_Hardware_Design 15 / 57
BC66 Hardware Design
Power Key Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
PWRKEY 7 DI
Pull down
PWRKEY to turn
on the module
V
max=0.3*VBAT
IL
V
min=0.7*VBAT
IH
Reset Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
RESET 15 DI Reset the module Active low.
PSM_EINT Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
Dedicated
external interrupt
PSM_EINT 19 DI
pin.
Used to wake up
the module from
PSM.
Network Status Indication
Pin Name Pin No. I/O Description DC Characteristics Comment
NETLIGHT* 16 DO
Network status
indication
ADC Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
General purpose
ADC0* 9 AI
analog to digital
converter
Voltage range:
0V~1.4V
interface
Main UART Port
Pin Name Pin No. I/O Description DC Characteristics Comment
RXD 18 DI Receive data
1.8V power domain.
TXD 17 DO Transmit data
Auxiliary UART Port
BC66_Hardware_Design 16 / 57
BC66 Hardware Design
Pin Name Pin No. I/O Description DC Characteristics Comment
RXD_AUX 28 DI Receive data
1.8V power domain.
TXD_AUX 29 DO Transmit data
Debug UART Port
Pin Name Pin No. I/O Description DC Characteristics Comment
RXD_DBG 38 DI Receive data
1.8V power domain.
TXD_DBG 39 DO Transmit data
Ringing Signal
Pin Name Pin No. I/O Description DC Characteristics Comment
RI* 20 DO Ring indicator 1.8V power domain.
USIM Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
SIM_VDD 14 DO
SIM_RST 12 DO
SIM_DATA 11 IO
SIM_CLK 13 DO
USIM card
power supply
USIM card reset
signal
USIM card data
signal
USIM card clock
signal
Vnorm=1.8V
V
max=0.15×SIM_VDD
OL
V
min=0.85×SIM_VDD
OH
V
max=0.25×SIM_VDD
IL
VIHmin=0.75×SIM_VDD
max=0.15×SIM_VDD
V
OL
min=0.85×SIM_VDD
V
OH
V
max=0.15×SIM_VDD
OL
V
min=0.85×SIM_VDD
OH
Specified
SIM_GND 10 GND
ground for USIM
card
Antenna Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
RF_ANT 35 IO
RF antenna
interface
50 characteristic
impedance
SPI Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
BC66_Hardware_Design 17 / 57
BC66 Hardware Design
Master input
SPI_MISO* 3 DI
slave output of
SPI interface
Master output
SPI_MOSI* 4 DO
slave input of SPI
interface
1.8V power domain.
Serial clock
SPI_SCLK* 5 DO
signal of SPI
interface
SPI_CS* 6 DO
Chip select of
SPI interface
Reserved Pins
Pin Name Pin No. I/O Description DC Characteristics Comment
2, 8,
RESERVED
21~23,
25~26,
30~33,
Keep these pins
unconnected.
44~58
NOTES
1. Keep all unused pins unconnected.
2. “*” means under development.
3.4. Operating Modes
The following table briefly describes the three operating modes of the module.
Table 5: Overview of Operating Modes
Mode Function
In active mode, all functions of the module are available and all
Active
Normal Operation
Idle
BC66_Hardware_Design 18 / 57
processors are active; radio transmission and reception can be
performed. Transitions to idle mode or PSM can be initiated in active
mode.
In idle mode, the module is in light sleep and network connection is
maintained in DRX/eDRX state; paging messages can be received.
Transitions to active mode or PSM can be initiated in idle mode.
Loading...
+ 44 hidden pages