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201805EC25AU
User Manual
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Quectel Wireless Solutions 201805EC25AU Users Manual

EC25 Hardware Design
LTE Module Series
Rev. EC25_Hardware_Design_V1.5
Date: 2018-04-20
Status: Released
www.quectel.com
EC25 Hardware Design
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Email: info@quectel.com
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GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
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THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
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REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2018. All rights reserved.
EC25_Hardware_Design 1 / 112
EC25 Hardware Design
About the Document
History
Revision Date Author Description
1.0 2016-04-01 Woody WU Initial
1.1 2016-09-22
1.2 2016-11-04
Lyndon LIU/
Frank WANG
Lyndon LIU/
Michael ZHANG
1. Updated EC25 series frequency bands in Table 1.
2. Updated transmitting power, supported maximum
baud rate of main UART/internal protocols/USB
drivers of USB interface, firmware upgrade and
temperature range in Table 2.
3. Updated timing of turning on module in Figure 12.
4. Updated timing of turning off module in Figure 13.
5. Updated timing of resetting module in Figure 16.
6. Updated supported baud rates of main UART in
Chapter 3.11.
7. Added notes for ADC interface in Chapter 3.13.
8. Updated GNSS performance in Table 21.
9. Updated operating frequencies of module in Table 23.
10. Added current consumption in Chapter 6.4.
11. Updated RF output power in Chapter 6.5.
12. Added RF receiving sensitivity in Chapter 6.6.
1. Added SGMII and WLAN interfaces in Table 2.
2. Updated function diagram in Figure 1.
3. Updated pin assignment (Top View) in Figure 2.
4. Added description of SGMII and WLAN interfaces in
Table 4.
5. Added SGMII interface in Chapter 3.17.
6. Added WLAN interface in Chapter 3.18.
7. Added USB_BOOT interface in Chapter 3.19.
8. Added reference design of RF layout in Chapter 5.1.4.
9. Added note about SIMO in Chapter 6.6.
1.3 2017-01-24
EC25_Hardware_Design 2 / 112
Lyndon LIU/
Frank WANG
1. Updated function diagram in Figure 1.
2. Updated pin assignment (top view) in Figure 2.
EC25 Hardware Design
AnniceZHANG/
1.4 2018-03-05
Lyndon LIU/
Frank WANG
3. Added BT interface in Chapter 3.18.2.
4. Updated GNSS performance in Table 24.
5. Updated reference circuit of wireless connectivity
interfaces with FC20 module in Figure 29.
6. Updated current consumption of EC25-E module in
Table 33.
7. Updated EC25-A conducted RF receiving sensitivity
in Table 38.
8. AddedEC25-J conducted RF receiving sensitivity in
Table 40.
1. Updated functional diagram in Figure 1.
2. Updated frequency bands in Table 1.
3. Updated LTE, UMTS and GSM features in Table 2.
4. Updated description of pin 40/136/137/138.
5. Updated PWRKEY pulled down time to 500ms in
Chapter 3.7.1 and reference circuit in Figure 10.
6. Updated reference circuit of (U)SIM interface in
Figure 17&18.
7. Updated reference circuit of USB interface in Figure
19.
8. Updated PCM mode in Chapter 3.12.
9. Added SD card interface in Chapter 3.13.
10. Updated USB_BOOT reference circuit in Chapter
3.20.
11. Updated module operating frequencies in Table 26.
12. Updated antenna requirements in Table 30.
13. Updated EC25 series module current consumption in
Chapter 6.4.
14. Updated EC25 series module conducted RF receiving
sensitivity in Chapter 6.6.
15. Added thermal consideration description in Chapter
6.8.
16. Added dimension tolerance information in Chapter 7.
17. Added storage temperature range in Table 2 and
Chapter 6.3.
18. Updated RF output power in Table 41.
19. Updated GPRS multi-slot classes in Table 53.
20. Updated storage information in Chapter 8.1.
1. Added information of EC25-AF in Table 1.
2. Updated module operating frequencies in Table 27.
1.5 2018-04-20 Kinsey ZHANG
3. Added current consumption of EC25-AF module in
Table 40.
4. Changed GNSS current consumption of EC25 series
module into Table 41.
EC25_Hardware_Design 3 / 112
EC25 Hardware Design
5. Added EC25-AF conducted RF receiving sensitivity in
Table 50.
EC25_Hardware_Design 4 / 112
EC25 Hardware Design
Contents
About the Document ................................................................................................................................ 2
Contents .................................................................................................................................................... 5
Table Index ............................................................................................................................................... 8
Figure Index ............................................................................................................................................ 10
1 Introduction ..................................................................................................................................... 12
1.1. Safety Information ................................................................................................................. 13
1.2. FCC Statement ..................................................................................................................... 14
2 Product Concept ............................................................................................................................. 16
2.1. General Description .............................................................................................................. 16
2.2. Key Features ......................................................................................................................... 17
2.3. Functional Diagram ............................................................................................................... 20
2.4. Evaluation Board ................................................................................................................... 21
3 Application Interfaces ..................................................................................................................... 22
3.1. General Description .............................................................................................................. 22
3.2. Pin Assignment ..................................................................................................................... 23
3.3. Pin Description ...................................................................................................................... 24
3.4. Operating Modes .................................................................................................................. 36
3.5.
Power Saving ........................................................................................................................ 36
3.5.1. Sleep Mode.................................................................................................................. 36
3.5.1.1. UART Application .............................................................................................. 36
3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 37
3.5.1.3. USB Application with USB Suspend/Resume and RI Function.......................... 38
3.5.1.4. USB Application without USB Suspend Function .............................................. 39
3.5.2. Airplane Mode .............................................................................................................. 39
3.6. Power Supply ........................................................................................................................ 40
3.6.1. Power Supply Pins ....................................................................................................... 40
3.6.2. Decrease Voltage Drop ............................................................................................... 41
3.6.3. Reference Design for Power Supply ............................................................................ 42
3.6.4. Monitor the Power Supply ............................................................................................ 42
3.7. Turn on and off Scenarios ..................................................................................................... 42
3.7.1. Turn on Module Using the PWRKEY ........................................................................... 42
3.7.2. Turn off Module ............................................................................................................ 44
3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 44
3.7.2.2. Turn off Module Using AT Command ................................................................ 45
3.8.
Reset the Module .................................................................................................................. 45
3.9. (U)SIM Interface .................................................................................................................... 47
3.10.USB Interface ........................................................................................................................ 49
3.11.UART Interfaces ................................................................................................................... 51
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EC25 Hardware Design
3.12.PCM and I2C Interfaces ........................................................................................................ 53
3.13.SD Card Interface ................................................................................................................. 56
3.14.ADC Interfaces ...................................................................................................................... 58
3.15.Network Status Indication ..................................................................................................... 59
3.16.STATUS ................................................................................................................................ 60
3.17.Behaviors of RI ..................................................................................................................... 61
3.18.SGMII Interface ..................................................................................................................... 62
3.19.Wireless Connectivity Interfaces ........................................................................................... 64
3.19.1.WLAN Interface ........................................................................................................... 66
3.19.2.BT Interface* ................................................................................................................ 66
3.20.USB_BOOT Interface............................................................................................................ 66
4 GNSS Receiver ................................................................................................................................ 68
4.1. General Description .............................................................................................................. 68
4.2. GNSS Performance .............................................................................................................. 68
4.3. Layout Guidelines ................................................................................................................. 69
5 Antenna Interfaces .......................................................................................................................... 70
5.1.
Main/Rx-diversity Antenna Interfaces.................................................................................... 70
5.1.1. Pin Definition ................................................................................................................ 70
5.1.2. Operating Frequency ................................................................................................... 70
5.1.3. Reference Design of RF Antenna Interface ................................................................. 72
5.1.4. Reference Design of RF Layout ................................................................................... 72
5.2. GNSS Antenna Interface ....................................................................................................... 74
5.3. Antenna Installation .............................................................................................................. 76
5.3.1. Antenna Requirement .................................................................................................. 76
5.3.2. Recommended RF Connector for Antenna Installation ................................................ 77
6 Electrical, Reliability and Radio Characteristics .......................................................................... 79
6.1. Absolute Maximum Ratings .................................................................................................. 79
6.2. Power Supply Ratings ........................................................................................................... 80
6.3. Operation and Storage Temperatures .................................................................................. 80
6.4. Current Consumption ............................................................................................................ 81
6.5. RF Output Power .................................................................................................................. 92
6.6. RF Receiving Sensitivity ....................................................................................................... 93
6.7. Electrostatic Discharge ......................................................................................................... 97
6.8. Thermal Consideration .........................................................................................................
. 97
7 Mechanical Dimensions................................................................................................................ 100
7.1. Mechanical Dimensions of the the Module .......................................................................... 100
7.2. Recommended Footprint ..................................................................................................... 102
7.3. Design Effect Drawings of the Module ................................................................................ 103
8 Storage, Manufacturing and Packaging ...................................................................................... 104
8.1. Storage ............................................................................................................................... 104
8.2. Manufacturing and Soldering .............................................................................................. 105
8.3. Packaging ........................................................................................................................... 106
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EC25 Hardware Design
9 Appendix A References ................................................................................................................ 107
10Appendix B GPRS Coding Schemes ........................................................................................... 111
11Appendix C GPRS Multi-slot Classes .......................................................................................... 112
12Appendix D EDGE Modulationand Coding Schemes ................................................................. 114
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Table Index
TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 16
TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 17
TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 24
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 24
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 36
TABLE 6: VBAT AND GND PINS ...................................................................................................................... 40
TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 43
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 45
TABLE 9: PIN DEFINITION OF THE (U)SIM INTERFACE ............................................................................... 47
TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 49
TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 51
TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 51
TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 52
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ...................................................................... 54
TABLE 15: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 56
TABLE 16: PIN DEFINITION OF ADC INTERFACES ...................................................................................... 58
TABLE 17: CHARACTERISTIC OF ADC .......................................................................................................... 58
TABLE 18: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 59
TABLE 19: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ......... 59
TABLE 20: PIN DEFINITION OF STATUS ....................................................................................................... 60
TABLE 21: BEHAVIOR OF RI ........................................................................................................................... 61
TABLE 22: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 62
TABLE 23: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ............................................... 64
TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 67
TABLE 25: GNSS PERFORMANCE ................................................................................................................. 68
TABLE 26: PIN DEFINITION OF RF ANTENNA ............................................................................................... 70
TABLE 27: MODULE OPERATING FREQUENCIES ....................................................................................... 70
TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE .................................................................... 74
TABLE 29: GNSS FREQUENCY ...................................................................................................................... 75
TABLE 30: ANTENNA REQUIREMENTS ......................................................................................................... 76
TABLE 31: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 79
TABLE 32: THE MODULE POWER SUPPLY RATINGS .................................................................................. 80
TABLE 33: OPERATION AND STORAGE TEMPERATURES ......................................................................... 80
TABLE 34: EC25-E CURRENT CONSUMPTION ............................................................................................. 81
TABLE 35: EC25-A CURRENT CONSUMPTION ............................................................................................. 83
TABLE 36: EC25-V CURRENT CONSUMPTION ............................................................................................. 84
TABLE 37: EC25-J CURRENT CONSUMPTION ............................................................................................. 85
TABLE 38: EC25-AU CURRENT CONSUMPTION .......................................................................................... 86
TABLE 39: EC25-AUT CURRENT CONSUMPTION ........................................................................................ 89
TABLE 40: EC25-AF CURRENT CONSUMPTION ........................................................................................... 90
TABLE 41: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE ................................................ 92
EC25_Hardware_Design 8 / 112
EC25 Hardware Design
TABLE 42: RF OUTPUT POWER ..................................................................................................................... 92
TABLE 43: EC25-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 93
TABLE 44: EC25-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 93
TABLE 45: EC25-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 94
TABLE 46: EC25-J CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 94
TABLE 47: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 95
TABLE 48: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 95
TABLE 49: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 96
TABLE 50: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY ............................................................... 96
TABLE 51: ELECTROSTATICS DISCHARGE CHARACTERISTICS .............................................................. 97
TABLE 52: RELATED DOCUMENTS ............................................................................................................. 107
TABLE 53: TERMS AND ABBREVIATIONS ................................................................................................... 107
TABLE 54: DESCRIPTION OF DIFFERENT CODING SCHEMES ................................................................ 111
TABLE 55: GPRS MULTI-SLOT CLASSES .................................................................................................... 112
TABLE 56: EDGE MODULATION AND CODING SCHEMES ........................................................................ 114
EC25_Hardware_Design 9 / 112
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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 20
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 23
FIGURE 3: SLEEP MODE APPLICATION VIA UART ...................................................................................... 37
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 38
FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 38
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 39
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ..................................................... 41
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ........................................................................... 41
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 42
FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT ........................................................... 43
FIGURE 11: TURN ON THE MODULE BY USING BUTTON ........................................................................... 43
FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 44
FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 45
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 46
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 46
FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 46
FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 48
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 48
FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 50
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 52
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 53
FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 54
FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 54
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 55
FIGURE 25: REFERENCE CIRCUIT OF SD CARD ......................................................................................... 57
FIGURE 26: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 60
FIGURE 27: REFERENCE CIRCUITS OF STATUS ........................................................................................ 61
FIGURE 28: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 63
FIGURE 29: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................ 63
FIGURE 30: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE
................................................................................................................................................................... 65
FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 67
FIGURE 32: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 72
FIGURE 33: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ..................................................................... 73
FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB ................................................. 73
FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .................................................................................................................................................. 73
FIGURE 36: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND) .................................................................................................................................................. 74
FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 75
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EC25 Hardware Design
FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 77
FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ............................................................................. 77
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 78
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ................. 98
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................... 98
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 100
FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 101
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 102
FIGURE 46: TOP VIEW OF THE MODULE .................................................................................................... 103
FIGURE 47: BOTTOM VIEW OF THE MODULE ............................................................................................ 103
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE ............................................................................ 105
FIGURE 49: TAPE AND REEL SPECIFICATIONS ........................................................................................ 106
EC25_Hardware_Design 11 / 112
EC25 Hardware Design
1 Introduction
This document defines the EC25 module and describes its air interface and hardware interface which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EC25 module. Associated with application note
and user guide, customers can use EC25 module to design and set up mobile applications easily.
EC25_Hardware_Design 12 / 112
EC25 Hardware Design
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a hands free kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals,clinics or other health care
facilities. These requests are designed to prevent possible interference with
sensitive medical equipment.
Cellular terminals or mobiles operating over radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid (U)SIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.
EC25_Hardware_Design 13 / 112
EC25 Hardware Design
1.2. FCC Statement
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile
device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based time-
averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements
of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body
and must not transmit simultaneously with any other antenna or transmitter.
3.A label with the following statements must be attached to the host end product: This device contains FCC
ID: XMR201805EC25AU.
4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed 4dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products. Please
refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labelled withan FCC ID - Section 2.926 (see 2.2 Certification
(labelling requirements) above). The OEM manual must provide clear instructions explaining to the OEM
the labelling requirements,options and OEM user manual instructions that are required (see next
paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is notvisible when
installed in the host, or (2) if the host is marketed so that end users do not havestraightforward commonly
used methods for access to remove the module so that the FCC ID ofthe module is visible; then an
additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC
ID:XMR201805EC25AU” or “Contains FCC ID: XMR201805EC25AU” mustbe used. The host OEM user
manual must also contain clear instructions on how end users can find and/or access the module and the
FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may be
EC25_Hardware_Design 14 / 112
EC25 Hardware Design
included in the manual in that alternative form, provided the user can reasonably be expected to have the
capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Declaration of Conformity procedure without a transmitter
certified module and a module is added, the host manufacturer is responsible for ensuring that the after the
module is installed and operational the host continues to be compliant with the Part 15B unintentional
radiator requirements.
EC25_Hardware_Design 15 / 112
EC25 Hardware Design
2 Product Concept
2.1. General Description
EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive
diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,
WCDMA, EDGE and GPRS networks. It also provides GNSS
specific application. EC25 contains seven variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU,
EC25-AUT, EC25-AF and EC25-AUTL. Customers can choose a dedicated type based on the region or
operator. The following table shows the frequency bands of EC25 series module.
1)
and voice functionality2) for customers’
Table 1: Frequency Bands of EC25 Series Module
Modules2) LTE Bands
EC25-E
EC25-A
EC25-V
EC25-J
EC25-AU3)
EC25-AUT
EC25-AF
FDD: B1/B3/B5/B7/B8/B20
TDD: B38/B40/B41
FDD: B2/B4/B12 B2/B4/B5 N Y
FDD: B4/B13 N N Y
FDD: B1/B3/B8/B18/B19/
B26
TDD: B41
FDD: B1/B2/B3/B4/B5/B7/
B8/B28
TDD: B40
FDD: B1/B3//B5/B7/B28 B1/B5 N Y
FDD: B2/B4//B5/B12/B13/
B14/B66/B71
WCDMA Bands
B1/B5/B8 900/1800MHz Y
B1/B6/B8/B19 N Y
B1/B2/B5/B8
B2/B4/B5 N Y
GSM Bands
850/900/
1800/1900MHz
Rx­diversity
Y
GNSS1)
GPS,
GLONASS,
BeiDou/
Compass,
Galileo,
QZSS
EC25-AUTL
EC25_Hardware_Design 16 / 112
FDD: B3/B7/B28 N N Y N
EC25 Hardware Design
NOTES
1)
1.
GNSS function is optional.
2)
2.
EC25 series module (EC25-E/EC25-A/EC25-V/EC25-J/EC25-AU/EC25-AUT/EC25-AF/
EC25-AUTL) contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function.
3)
3.
B2 band on EC25-AU module does not support Rx-diversity.
4. Y = Supported. N = Not supported.
With a compact profile of 29.0mm × 32.0mm × 2.4mm, EC25 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EC25 is an SMD type module which can be embedded into applications through its 144-pin pads,
including 80 LCC signal pads and 64 LGA pads.
2.2. Key Features
The following table describes the detailed features of EC25 module.
Table 2: Key Features of EC25 Module
Feature Details
Power Supply
Transmitting Power
Supply voltage: 3.3V~4.3V Typical supply voltage: 3.8V
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
Support up to non-CA Cat 4 FDD and TDD
LTE Features
Support 1.4MHz~20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 150Mbps (DL)/50Mbps (UL)
EC25_Hardware_Design 17 / 112
UMTS Features
GSM Features
EC25 Hardware Design
LTE-TDD: Max 130Mbps (DL)/30Mbps (UL)
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL)/384Kbps (UL)
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL)/85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/236.8Kbps (UL)
Support
TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/CMUX*/HTTPS*/SMTP*/
Internet Protocol Features
MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
Text and PDU mode
SMS
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
Audio Features
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
Used for audio function with external codec
Support 16-bit linear data format
PCM Interface
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
Compliant with USB 2.0 specification (slave only); the data transfer rate can
USB Interface
reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging, firmware upgrade and voice over USB*
EC25_Hardware_Design 18 / 112
EC25 Hardware Design
Support USB serial drivers for: Windows 7/8/8.1/10,
Windows CE 5.0/6.0/7.0*, Linux 2.6/3.x/4.1~4.14, Android 4.x/5.x/6.x/7.x
Main UART:
Used for AT command communication and data transmission
Baud rates reach up to 921600bps, 115200bps by default
UART Interface
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
SD Card Interface Support SD 3.0 protocol
SGMII Interface
Wireless Connectivity
Interfaces
Support 10M/100M/1000M Ethernet work mode
Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network
Support a low-power SDIO 3.0 interface for WLAN and UART/PCM
interface for Bluetooth*
Rx-diversity Support LTE/WCDMA Rx-diversity
GNSS Features
AT Commands
Network Indication
Antenna Interfaces
Physical Characteristics
Gen8C Lite of Qualcomm
Protocol: NMEA 0183
Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Size: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mm
Weight: approx. 4.9g
Operation temperature range: -35°C ~ +75°C
Temperature Range
Extended temperature range: -40°C ~ +85°C
Storage temperature range: -40°C~ +90°C
1)
2)
Firmware Upgrade USB interface and DFOTA*
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1)
1.
Within operation temperature range, the module is 3GPP compliant.
2)
2.
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
P
might reduce in their value and exceed the specified tolerances. When the temperature returns to
out
the normal operating temperature levels, the module will meet 3GPP specifications again.
3. “*” means under development.
EC25_Hardware_Design 19 / 112
EC25 Hardware Design
2.3. Functional Diagram
The following figure shows a block diagram of EC25 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
Figure 1: Functional Diagram
NOTE
“*” means under development.
EC25_Hardware_Design 20 / 112
EC25 Hardware Design
2.4. Evaluation Board
In order to help customers develop applications with EC25, Quectel supplies an evaluation board (EVB),
USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module.
EC25_Hardware_Design 21 / 112
EC25 Hardware Design
3 Application Interfaces
3.1. General Description
EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application
platform. Sub-interfaces included in these pads are described in detail in the following chapters:
Power supply
(U)SIM interface
USB interface
UART interfaces
PCM and I2C interfaces
SD card interface
ADC interfaces
Status indication
SGMII interface
Wireless connectivity interfaces
USB_BOOT interface
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EC25 Hardware Design
3.2. Pin Assignment
The following figure shows the pin assignment of EC25 module.
Figure 2: Pin Assignment (Top View)
NOTES
1)
1.
means that these pins cannot be pulled up before startup.
2)
2.
PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
3)
3.
means these interface functions are only supported on Telematics version.
4. Pads 37~40, 118, 127 and 129~139 are used for wireless connectivity interfaces, among which pads
118, 127 and 129~138 are WLAN function pins, and the rest are Bluetooth (BT) function pins. BT
function is under development.
5. Pads 119~126 and 128 are used for SGMII interface.
EC25_Hardware_Design 23 / 112
EC25 Hardware Design
6. Pads 24~27 are multiplexing pins used for audio design on the EC25 module and BT function on the
BT module.
7. Keep all RESERVED pins and unused pins unconnected.
8. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84
should not be designed in schematic and PCB decal, and these pins should be served as a keep out
area.
9. “*” means under development.
3.3. Pin Description
The following tables show the pin definition of EC25 modules.
Table 3: I/O Parameters Definition
Type Description
IO Bidirectional
DI Digital input
DO Digital output
PI Power input
PO Power output
AI Analog input
AO Analog output
OD Open drain
Table 4: Pin Description
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
VBAT_BB 59, 60 PI
Power supply for
module’s baseband
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
It must be able to
provide sufficient
current up to 0.8A.
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EC25 Hardware Design
It must be able to
provide sufficient
current up to 1.8A in a
burst transmission.
Power supply for
external GPIO’s pull-up
circuits.
VBAT_RF 57, 58 PI
VDD_EXT 7 PO
Power supply for
module’s RF part
Provide 1.8V for
external circuit
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
Vnorm=1.8V
I
max=50mA
O
8, 9, 19,
22, 36, 46,
GND
48, 50~54,
Ground
56, 72,
85~112
Turn on/off
Pin Name Pin No. I/O Description DC Chara ct eristics Comment
The output voltage is
0.8V because of the
diode drop in the
Qualcomm chipset.
PWRKEY 21 DI
Turn on/off the
module
V
max=2.1V
IH
V
min=1.3V
IH
V
max=0.5V
IL
max=2.1V
V
RESET_N 20 DI Reset the module
IH
V
min=1.3V
IH
V
max=0.5V
IL
If unused, keep it
open.
Status Indication
Pin Name Pin No. I/O Description DC Chara ct eristics Comment
STATUS 61 OD
Indicate the module
operating status
The drive current
should be less than
0.9mA.
An external pull-up
resistor is required. If
unused, keep it open.
1.8V power domain.
Cannot be pulled up
before startup.
If unused, keep it
NET_MODE 5 DO
Indicate the module
network registration
mode
V
min=1.35V
OH
V
max=0.45V
OL
open.
NET_
STATUS
Indicate the module
6 DO
network activity
status
V
min=1.35V
OH
V
max=0.45V
OL
1.8V power domain.
If unused, keep it
open.
USB Interface
Pin Name Pin No. I/O Description DC Chara ct eristics Comment
USB_VBUS 71 PI USB detection
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
Typical: 5.0V
If unused, keep it
open.
EC25_Hardware_Design 25 / 112
EC25 Hardware Design
Require differential
impedance of 90Ω.
If unused, keep it
open.
Require differential
impedance of 90Ω.
If unused, keep it
open.
USB_DP 69 IO
USB_DM 70 IO
USB differential data
bus (+)
USB differential data
bus (-)
Compliant with USB
2.0 standard
specification.
Compliant with USB
2.0 standard
specification.
(U)SIM Interface Pin Name Pin No. I/O Description DC Chara ct eristics Comment
USIM_GND 10
USIM_
PRESENCE
13 DI
Specified ground for
(U)SIM card
(U)SIM card
insertion detection
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
1.8V power domain.
If unused, keep it
open.
For 1.8V(U)SIM:
Vmax=1.9V
Vmin=1.7V
USIM_VDD 14 PO
Power supply for
(U)SIM card
For 3.0V(U)SIM:
Vmax=3.05V
Either 1.8V or 3.0V is
supported by the
module automatically.
Vmin=2.7V
I
max=50mA
O
For 1.8V (U)SIM:
V
max=0.6V
IL
V
min=1.2V
IH
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
V
max=1.0V
IL
V
min=1.95V
IH
V
max=0.45V
OL
V
min=2.55V
OH
USIM_DATA 15 IO
Data signal of
(U)SIM card
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
V
max=0.45V
OL
V
min=2.55V
OH
USIM_CLK 16 DO
Clock signal of
(U)SIM card
EC25_Hardware_Design 26 / 112
EC25 Hardware Design
For 1.8V (U)SIM:
V
max=0.45V
OL
V
min=1.35V
OH
For 3.0V (U)SIM:
V
max=0.45V
OL
V
min=2.55V
OH
USIM_RST 17 DO
Reset signal of
(U)SIM card
Main UART Interface Pin Name Pin No. I/O Description DC Chara ct eristics Comment
V
RI 62 DO Ring indicator
DCD 63 DO
Data carrier
detection
CTS 64 DO Clear to send
RTS 65 DI Request to send
DTR 66 DI
Data terminal ready,
sleep mode control
OL
V
OH
V
OL
V
OH
V
OL
V
OH
V
IL
V
IL
V
IH
V
IH
V
IL
V
IL
V
IH
V
IH
max=0.45V
min=1.35V
max=0.45V
min=1.35V
max=0.45V
min=1.35V
min=-0.3V
max=0.6V
min=1.2V
max=2.0V
min=-0.3V
max=0.6V
min=1.2V
max=2.0V
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
Pulled up by default.
Low level wakes up
the module.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
TXD 67 DO Transmit data
RXD 68 DI Receive data
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
Debug UART Interface Pin Name Pin No. I/O Description DC Chara ct eristics Comment
1.8V power domain.
If unused, keep it
open.
DBG_TXD 12 DO Transmit data
V
max=0.45V
OL
V
min=1.35V
OH
DBG_RXD 11 DI Receive data VILmin=-0.3V 1.8V power domain.
EC25_Hardware_Design 27 / 112
EC25 Hardware Design
VILmax=0.6V
VIHmin=1.2V
V
max=2.0V
IH
If unused, keep it
open.
ADC Interface Pin Name Pin No. I/O Description DC Chara ct eristics Comment
General purpose
ADC0 45 AI
analog to digital
converter
General purpose
ADC1 44 AI
analog to digital
converter
Voltage range:
0.3V to VBAT_BB
Voltage range:
0.3V to VBAT_BB
If unused, keep it
open.
If unused, keep it
open.
PCM Interface Pin Name Pin No. I/O Description DC Chara ct eristics Comment
V
min=-0.3V
PCM_IN 24 DI PCM data input
PCM_OUT 25 DO PCM data output
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
1.8V power domain.
In master mode, it is
an output signal. In
slave mode, it is an
input signal.
If unused, keep it
open.
PCM data frame
PCM_SYNC 26 IO
synchronization
signal
PCM_CLK 27 IO PCM clock
VOLmax=0.45V
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
V
max=0.45V
OL
V
min=1.35V
OH
V
min=-0.3V
IL
V
max=0.6V
IL
V
min=1.2V
IH
V
max=2.0V
IH
I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment
External pull-up
I2C_SCL 41 OD
I2C serial clock Used
for external codec.
resistor is required.
1.8V only. If unused,
keep it open.
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EC25 Hardware Design
External pull-up
I2C_SDA 42 OD
I2C serial dataUsed
for external codec.
resistor is required.
1.8V only. If unused,
keep it open.
SD Card Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
1.8V signaling:
V
max=0.45V
OL
V
min=1.4V
OH
V
min=-0.3V
SDC2_
DATA3
28 IO
SD card SDIO bus
DATA3
IL
V
max=0.58V
IL
V
min=1.27V
IH
V
max=2.0V
IH
3.0V signaling:
max=0.38V
V
OL
V
min=2.01V
OH
V
min=-0.3V
IL
V
max=0.76V
IL
V
min=1.72V
IH
V
max=3.34V
IH
SDIO signal level can
be selected according
to SD card supported
level, please refer to
SD 3.0 protocol for
more details.
If unused, keep it
open.
1.8V signaling:
V
max=0.45V
OL
V
min=1.4V
OH
V
min=-0.3V
SDC2_
DATA2
SDC2_
DATA1
29 IO
30 IO
SD card SDIO bus
DATA2
SD card SDIO bus
DATA1
IL
V
max=0.58V
IL
V
min=1.27V
IH
V
max=2.0V
IH
3.0V signaling:
max=0.38V
V
OL
V
min=2.01V
OH
V
min=-0.3V
IL
V
max=0.76V
IL
V
min=1.72V
IH
V
max=3.34V
IH
1.8V signaling:
V
max=0.45V
OL
V
min=1.4V
OH
V
min=-0.3V
IL
V
max=0.58V
IL
V
min=1.27V
IH
SDIO signal level can
be selected according
to SD card supported
level, please refer to
SD 3.0 protocol for
more details.
If unused, keep it
open.
SDIO signal level can
be selected according
to SD card supported
EC25_Hardware_Design 29 / 112
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