Quectel Wireless Solutions 201708EC25E User Manual

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EC25Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233

Tel: +86 21 5108 6236

Email:info@quectel.com

Or our local office.For more information, please visit:

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Or email to: Support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THEINFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT

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OR DESIGN.

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EC25Hardware Design

About the Document

History

Revision Date Author Description

1.0 2016-04-01 Woody WU Initial

LTE Module Series

1.1 2016-09-22

1.2 2016-11-04

Lyndon LIU/

Frank WANG

Lyndon LIU/

Michael ZHANG

1. Updated EC25 series frequency bands in Table 1.

2. Updated transmitting power, supported maximum

baud rate of main UART/internal protocols/USB

drivers of USB interface, firmware upgrade and

temperature range in Table 2.

3. Updated timing of turning on module in Figure 12.

4. Updated timing of turning off module in Figure 13.

5. Updated timing of resetting module in Figure 16.

6. Updated supported baud rates of main UART in

Chapter 3.11.

7. Added notes for ADC interface in Chapter 3.13.

8. Updated GNSS performance in Table 21.

9. Updated operating frequencies of module in Table 23.

10. Added current consumption in Chapter 6.4.

11. Updated RF output power in Chapter 6.5.

12. Added RF receiving sensitivity in Chapter 6.6.

1. Added SGMII and WLAN interfaces in Table 2.

2. Updated function diagram in Figure 1.

3. Updated pin assignment (Top View) in Figure 2.

4. Added description of SGMII and WLAN interfaces in

Table 4.

5. Added SGMII interface in Chapter 3.17.

6. Added WLAN interface in Chapter 3.18.

7. Added USB_BOOT interface in Chapter 3.19.

8. Added reference design of RF layout in Chapter 5.1.4.

9. Added note about SIMO in Chapter 6.6.

1.3 2017-01-24

EC25_Hardware_DesignConfidential / Released 2 / 90

Lyndon LIU/

Frank WANG

1. Updated function diagram in Figure 1.

2. Updated pin assignment (top view) in Figure 2.

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EC25Hardware Design

3. Added BT interface in Chapter 3.18.2.

4. Updated GNSS performance in Table 24.

5. Updated reference circuit of wireless connectivity

interfaces with FC20 module in Figure 29.

6. Updated current consumption of EC25-E module in

Table 33.

7. Updated EC25-A conducted RF receiving sensitivity

in Table 38.

8. AddedEC25-J conducted RF receiving sensitivity in

Table 40.

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Contents

About the Document ................................................................................................................................ 2

Contents .................................................................................................................................................... 4

Table Index ............................................................................................................................................... 6

Figure Index .............................................................................................................................................. 8

1 Introduction ..................................................................................................................................... 10

1.1. Safety Information ..................................................................................................................11

2 Product Concept ............................................................................................................................. 12

2.1. General Description .............................................................................................................. 12

2.2. Key Features ......................................................................................................................... 13

2.3. Functional Diagram ............................................................................................................... 15

2.4. Evaluation Board ................................................................................................................... 16

3 Application Interface ....................................................................................................................... 17

3.1. General Description .............................................................................................................. 17

3.2. Pin Assignment ..................................................................................................................... 18

3.3. Pin Description ...................................................................................................................... 19

3.4. Operating Modes .................................................................................................................. 28

3.5. Power Saving ........................................................................................................................ 28

3.5.1.

Sleep Mode.................................................................................................................. 28

3.5.1.1. UART Application ............................................................................................... 28

3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 29

3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 30

3.5.1.4. USB Application without USB Suspend Function ............................................... 31

3.5.2. Airplane Mode .............................................................................................................. 31

3.6. Power Supply ........................................................................................................................ 32

3.6.1. Power Supply Pins ....................................................................................................... 32

3.6.2. Decrease Voltage Drop ................................................................................................ 33

3.6.3. Reference Design for Power Supply ............................................................................ 34

3.6.4. Monitor the Power Supply ............................................................................................ 34

3.7. Turn on and off Scenarios ..................................................................................................... 34

3.7.1. Turn on Module Using the PWRKEY ........................................................................... 34

3.7.2. Turn off Module ............................................................................................................ 36

3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 36

3.7.2.2. Turn off Module Using AT Command ................................................................. 37

3.8. Reset the Module .................................................................................................................. 37

3.9. USIM Card Interface ............................................................................................................. 39

3.10. USB Interface ........................................................................................................................ 41

3.11. UART Interfaces .................................................................................................................... 43

3.12. PCM and I2C Interfaces ........................................................................................................ 45

3.13. ADC Function ........................................................................................................................ 47

3.14. Network Status Indication ..................................................................................................... 48

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3.15. STATUS ................................................................................................................................ 49

3.16. Behavior of the RI ................................................................................................................. 50

3.17. SGMII Interface ..................................................................................................................... 51

3.18. Wireless Connectivity Interfaces ........................................................................................... 53

3.18.1. WLAN Interface ........................................................................................................... 55

3.18.2. BT Interface* ................................................................................................................ 56

3.19. USB_BOOT Interface ............................................................................................................ 56

4 GNSS Receiver ................................................................................................................................ 58

4.1. General Description .............................................................................................................. 58

4.2. GNSS Performance .............................................................................................................. 58

4.3. Layout Guidelines ................................................................................................................. 59

5 Antenna Interfaces .......................................................................................................................... 60

5.1. Main/Rx-diversity Antenna Interface ..................................................................................... 60

5.1.1. Pin Definition ................................................................................................................ 60

5.1.2. Operating Frequency ................................................................................................... 60

5.1.3. Reference Design of RF Antenna Interface ................................................................. 61

5.1.4. Reference Design of RF Layout ................................................................................... 62

5.2. GNSS Antenna Interface ....................................................................................................... 64

5.3. Antenna Installation .............................................................................................................. 65

5.3.1. Antenna Requirement .................................................................................................. 65

5.3.2. Recommended RF Connector for Antenna Installation ................................................ 66

6 Electrical, Reliability and Radio Characteristics .......................................................................... 68

6.1. Absolute Maximum Ratings .................................................................................................. 68

6.2. Power Supply Ratings ........................................................................................................... 69

6.3. Operating Temperature ......................................................................................................... 69

6.4. Current Consumption ............................................................................................................ 70

6.5. RF Output Power .................................................................................................................. 73

6.6. RF Receiving Sensitivity ....................................................................................................... 74

6.7. Electrostatic Discharge ......................................................................................................... 76

7 Mechanical Dimensions.................................................................................................................. 77

7.1. Mechanical Dimensions of the Module.................................................................................. 77

7.2. Recommended Footprint ....................................................................................................... 79

7.3. Design Effect Drawings of the Module .................................................................................. 80

8 Storage, Manufacturing and Packaging ........................................................................................ 81

8.1. Storage ................................................................................................................................. 81

8.2. Manufacturing and Soldering ................................................................................................ 82

8.3. Packaging ............................................................................................................................. 83

9 Appendix A References .................................................................................................................. 84

10 Appendix B GPRS Coding Schemes ............................................................................................. 88

11 Appendix C GPRS Multi-slot Classes ............................................................................................ 89

12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 90

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Table Index

TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ........................................................................ 12

TABLE 2: KEY FEATURES OF EC25 MODULE ............................................................................................... 13

TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 19

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19

TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 28

TABLE 6: VBAT AND GND PINS ....................................................................................................................... 32

TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 35

TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 37

TABLE 9: PIN DEFINITION OF THE USIM CARD INTERFACE ...................................................................... 39

TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 41

TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE ..................................................................... 43

TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ................................................................. 43

TABLE 13:LOGIC LEVELS OF DIGITAL I/O ..................................................................................................... 44

TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 46

TABLE 15: PIN DEFINITION OF THE ADC ...................................................................................................... 48

TABLE 16: CHARACTERISTIC OF THE ADC .................................................................................................. 48

TABLE 17: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ...................... 48

TABLE 18: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ........... 49

TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ 50

TABLE 20: BEHAVIOR OF THE RI ................................................................................................................... 50

TABLE 21: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 51

TABLE 22: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 53

TABLE 23: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 56

TABLE 24: GNSS PERFORMANCE ................................................................................................................. 58

TABLE 25: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 60

TABLE 26: MODULE OPERATING FREQUENCIES ........................................................................................ 60

TABLE 27: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 64

TABLE 28: GNSS FREQUENCY ....................................................................................................................... 64

TABLE 29: ANTENNA REQUIREMENTS .......................................................................................................... 65

TABLE 30: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 68

TABLE 31: THE MODULE POWER SUPPLY RATINGS .................................................................................. 69

TABLE 32: OPERATING TEMPERATURE ........................................................................................................ 69

TABLE 33: EC25-E CURRENT CONSUMPTION ............................................................................................. 70

TABLE 34: EC25-A CURRENT CONSUMPTION ............................................................................................. 72

TABLE 35: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE ................................................. 73

TABLE 36: RF OUTPUT POWER ..................................................................................................................... 73

TABLE 37: EC25-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 74

TABLE 38: EC25-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 74

TABLE 39: EC25-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 75

TABLE 40: EC25-J CONDUCTED RF RECEIVING SENSITIVITY................................................................... 75

TABLE 41: ELECTROSTATICS DISCHARGE CHARACTERISTICS ............................................................... 76

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TABLE 42: RELATED DOCUMENTS ................................................................................................................ 84

TABLE 43: TERMS AND ABBREVIATIONS ...................................................................................................... 84

TABLE 44: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 88

TABLE 45: GPRS MULTI-SLOT CLASSES ...................................................................................................... 89

TABLE 46: EDGE MODULATION AND CODING SCHEMES ........................................................................... 90

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16

FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18

FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 29

FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 30

FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 30

FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 31

FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 33

FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 33

FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 34

FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 35

FIGURE 11: TURN ON THE MODULE USING KEYSTROKE .......................................................................... 35

FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 36

FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 37

FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 38

FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 38

FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 38

FIGURE 17: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH AN 8-PIN USIM CARD

CONNECTOR .................................................................................................................................................... 40

FIGURE 18: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH A 6-PIN USIM CARD CONNECTOR

........................................................................................................................................................................... 40

FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 42

FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 44

FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 45

FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 46

FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 46

FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 47

FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 49

FIGURE 26: REFERENCE CIRCUITS OF STATUS ......................................................................................... 50

FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 52

FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................. 52

FIGURE 29: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE

........................................................................................................................................................................... 55

FIGURE 30: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 57

FIGURE 31: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61

FIGURE 32: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62

FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 62

FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE

GROUND) .......................................................................................................................................................... 63

FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

GROUND) .......................................................................................................................................................... 63

FIGURE 36: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64



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FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 66

FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 66

FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 67

FIGURE 40: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 77

FIGURE 41: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 78

FIGURE 42: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 79

FIGURE 43: TOP VIEW OF THE MODULE ...................................................................................................... 80

FIGURE 44: BOTTOM VIEW OF THE MODULE .............................................................................................. 80

FIGURE 45: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 82

FIGURE 46: TAPE AND REEL SPECIFICATIONS ........................................................................................... 83

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1 Introduction

This document defines the EC25module and describes its air interface and hardware interface which are

connected with your application.

This document can help you quickly understand module interface specifications, electrical and

mechanical details, as well as other related information of EC25 module. Associated with application note

and user guide, you can use EC25 module to design and set up mobile applications easily.

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1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,

service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular

terminal should send the following safety information to users and operating personnel, and incorporate

these guidelines into all manuals supplied with the product. If not so, Quectelassumes no liability for the

customer’s failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. You must comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden, so as

to prevent interference with communication systems. Consult the airline staff about

the use of wireless devices on boarding the aircraft, if your device offers an

Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment.

Cellular terminals or mobiles operatingover radio frequency signal and cellular

network cannot be guaranteed to connect in all conditions, for example no mobile

fee or with an invalid USIM/SIM card. While you are in this condition and need

emergent help, please remember using emergency call. In order to make or

receive a call, the cellular terminal or mobile must be switched on and in a service

area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,

it receives and transmits radio frequency energy. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as your phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders, etc.

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EC25Hardware Design

2 Product Concept

2.1. General Description

EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive

diversity, which provides data connectivity on LTE-FDD,LTE-TDD,DC-HSPA+, HSPA+, HSDPA, HSUPA,

WCDMA,EDGE andGPRSnetworks. It also provides GNSS

application.EC25 contains fivevariants:EC25-E, EC25-A, EC25-V, EC25-Jand EC25-AU. You can choose

a dedicated type based on the region or operator. The following table shows the frequency bands of EC25

series module.

and voice functionality2) for your specific

Table 1: Frequency Bands of EC25 Series Module

Modules2) LTE Bands 3G Bands GSM

EC25-E

EC25-A

EC25-V

EC25-J

EC25-AU3)

NOTES

FDD:B1/B3/B5/B7/B8/

B20

TDD: B38/B40/B41

FDD: B2/B4/B12

FDD: B4/B13 Not supported Not supported Supported

FDD: B1/B3/B8/B18/B19/

B26

TDD: B41

FDD: B1/B2/B3/B4/B5/B7/

B8/B28

TDD: B40

WCDMA:

B1/B5/B8

WCDMA:

B2/B4/B5

WCDMA:

B1/B6/B8/

B19

WCDMA:

B1/B2/B5/B8

900/1800 Supported

Not supported Supported

850/900/

1800/1900

Rxdiversity

Supported

GNSS1)

GPS,

GLONASS,

BeiDou/

Compass,

Galileo,

QZSS

GNSS function is optional.

EC25_Hardware_DesignConfidential / Released 12 / 90

EC25 series module (EC25-E/EC25-A/EC25-V/EC25-J/EC25-AU) includes Data-only and

Telematics versions. Data-only version does not support voice function, while Telematics version

supports it.

B2 band on EC25-AU module does not support Rx-diversity.

LTE Module Series

EC25Hardware Design

With a tiny profile of 32.0mm ×29.0mm ×2.4mm, EC25 can meet almost all requirements for M2M

applications such as automotive, metering, tracking system, security, router, wireless POS, mobile

computing device, PDA phone, tablet PC, etc.

EC25 is an SMD type module which can be embedded in applications through its 144-pin pads, including

80 LCC signal pads and 64 other pads.

2.2. Key Features

The following table describes the detailed features of EC25 module.

Table 2: Key Features of EC25 Module

Feature Details

Power Supply Supply voltage: 3.3V~4.3VTypical supply voltage: 3.8V

Class 4 (33dBm±2dB) for GSM900

Class 1 (30dBm±2dB) for DCS1800

Class E2 (27dBm±3dB) for GSM900 8-PSK

Transmitting Power

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Class 3 (23dBm+1/-3dB) for WCDMA bands

Class 3 (23dBm+1/-3dB) for LTE-FDD band5

Class 3 (22.5dBm+1/-3dB) for LTE-FDD band7

Class 3 (23dBm+1/-3dB) for LTE-TDD bands

Support up to non-CA CAT4

Support 1.4 to 20MHz RF bandwidth

LTE Features

Support MIMO in DL direction

FDD: Max 50Mbps (UL), 150Mbps (DL)

TDD: Max 35Mbps (UL), 130Mbps (DL)

Support 3GPP R8 DC-HSPA+

WCDMA Features

Support 16-QAM, 64-QAM and QPSKmodulation

3GPP R6 CAT6 HSUPA: Max 5.76Mbps (UL)

3GPP R8 CAT24 DC-HSPA+: Max 42Mbps (DL)

R99:

CSD: 9.6kbps, 14.4kbps

GPRS:

GSMFeatures

Support GPRS multi-slot class 12 (12 by default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Maximum of four Rx time slots per frame

EDGE:

Support EDGE multi-slot class 12 (12 by default)

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EC25Hardware Design

Support GMSK and 8-PSK for different MCS (Modulation and Coding

Scheme)

Downlink coding schemes: CS 1-4 and MCS 1-9

Uplink coding schemes: CS 1-4 and MCS 1-9

SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/MMS*

/FTPS*/SMTPS*/SSL*protocols

Internet Protocol Features

Support the protocols PAP (Password Authentication Protocol) and CHAP

(Challenge Handshake Authentication Protocol) usually used for PPP

connections

Text and PDU mode

SMS

Point to point MO and MT

SMS cell broadcast

SMS storage: ME by default

USIM Interface Support USIM/SIM card: 1.8V, 3.0V

Support one digital audio interface: PCM interface

GSM: HR/FR/EFR/AMR/AMR-WB

Audio Features

WCDMA: AMR/AMR-WB

LTE: AMR/AMR-WB

Support echo cancellation and noise suppression

LTE Module Series

PCM Interface

USB Interface

UART Interface

Used for audio function with external codec

Support 8-bit A-law*, μ-law*and 16-bit linear data formats

Support long frame synchronization and short frame synchronization

Support master and slave modes, but must be the master in long frame

synchronization

Compliant with USB 2.0 specification (slave only);the data transfer rate can

reach up to 480Mbps

Used for AT command communication, data transmission, GNSS NMEA

output, software debugging, firmware upgrade and voiceover USB*

Support USB drivers for: Windows XP, Windows Vista, Windows 7,

Windows 8/8.1, Windows 10, Linux 2.6 or later, Android

4.0/4.2/4.4/5.0/5.1/6.0

Main UART:

Used for AT command communication and data transmission

Baud rate reach up to 3000000bps, 115200bps by default

Support RTS and CTS hardware flow control

Debug UART:

Used for Linux console, log output

115200bps baud rate

SGMII Interface Support 10/100/1000Mbps Ethernet connectivity

Wireless Connectivity

Interfaces

Support a low-power SDIO 3.0 interface for WLAN and UART/PCM

interface for Bluetooth*

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EC25Hardware Design

Rx-diversity Support LTE/WCDMA Rx-diversity

LTE Module Series

GNSS Features

AT Commands

Network Indication

Antenna Interface

Physical Characteristics

Temperature Range

Gen8CLite of Qualcomm

Protocol: NMEA 0183

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT

commands

Two pins including NET_MODE and NET_STATUS to indicate network

connectivity status

Including main antenna interface (ANT_MAIN), Rx-diversityantenna

interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)

Size: 32.0±0.15×29.0±0.15×2.4±0.2mm

Weight: approx. 4.9g

Operation temperature range: -35°C ~ +75°C

Extended temperature range: -40°C ~ +85°C

Firmware Upgrade USB interface and DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive

NOTES

Within operation temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like

might reduce in their value and exceed the specified tolerances. When the temperature returns to

out

the normal operating temperature levels, the module will meet 3GPP compliant again.

3. “*” means under development.

2.3. Functional Diagram

The following figure shows a block diagram of EC25 and illustrates the major functional parts.

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EC25Hardware Design

 Power management

 Baseband

 DDR+NAND flash

 Radio frequency

 Peripheral interfaces

LTE Module Series

ANT_MAIN ANT_DIVANT_GNSS

VBAT_RF

VBAT_BB

PWRKEY

RESET_N

ADCs

STATUS

APT

PMIC

Control

19.2M

Switch

Duplex

PRx DRx

SAW

LNA

Transceiver

IQ Control

Baseband

Switch

SAW

NAND DDR2

SDRAM

VDD_EXT

USB

USIM

PCM

SGMII

WLAN

I2C

UART

GPIOs

Figure 1: Functional Diagram

2.4. Evaluation Board

In order to help youto develop applications with EC25, Quectel supplies an evaluation board (EVB), USB

data cable, earphone, antenna and other peripherals to control or test the module.

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EC25Hardware Design

3 Application Interface

3.1. General Description

EC25 is equipped with 80-pin SMT pads plus 64-pin ground pads and reserved pads that can

beconnected to cellular application platform. Sub-interfaces included in these pads are described in detail

in the following chapters:

 Power supply

 USIM interface

 USB interface

 UART interfaces

 PCM interface

 ADC interface

 Status indication

 SGMII interface

 Wireless connectivityinterfaces

 USB_BOOT interface

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EC25Hardware Design

3.2. Pin Assignment

The following figure shows the pin assignment of EC25 module.

LTE Module Series

WAKEUP_IN

AP_READY

RESERVED

W_DISABLE#

NET_MODE

NET_STATUS

VDD_EXT

RESERVED

GND

USIM_GND

DBG_RXD

DBG_TXD

USIM_PRESENCE

USIM_VDD

USIM_DATA

USIM_CLK

USIM_RST

RESERVED

141

142

129

130

131

132

133

134

135

136

137

138

117

118

119

120

121

122

123

124

125

126

108

109

110

111

103

104

105

106

100

101

139

140

127

128

112

107

102

144

143

GND

ANT_MAIN

GND

RESERVED

ANT_GNSS

GND

ADC0

ADC1

RESERVED

I2C_SDA

I2C_SCL

BT_CTS

BT_RXD

BT_TXD

BT_RTS

GND Pins

WLAN Pins Bluetooth Pins

Signal Pins RESERVED Pins

Power Pins

SGMII Pins

Figure 2: Pin Assignment (Top View)

NOTES

1. 1)meansthat these pins cannot be pulled up before startup.

PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.

3. Pads 119~126 are SGMII function pins.

4. Pads 37~40, 118, 127 and 129~139 are wireless connectivity interfaces, among which pads 127 and

129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT function is under

development.

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EC25Hardware Design

5. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20

module.

6. Keep all RESERVEDpins and unused pins unconnected.

7. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should

not be designed in schematic and PCB decal.

※

8. “

”means these interface functions are only supported on Telematics version.

3.3. Pin Description

The following tables show the pin definition of EC25 modules.

Table 3: I/O Parameters Definition

Type Description

IO Bidirectional

DI Digital input

DO Digital output

PI Power input

PO Power output

AI Analog input

AO Analog output

OD Open drain

Table 4: Pin Description

Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment

VBAT_BB 59,60 PI

VBAT_RF 57,58 PI

Power supply for

module baseband

part

Power supply for

module RF part

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

It must be able to

provide sufficient

current up to 0.8A.

It must be able to

provide sufficient

current up to 1.8A in a

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EC25Hardware Design

bursttransmission.

Power supply for

external GPIO’s pull up

circuits.

VDD_EXT 7 PO

Provide 1.8V for

external circuit

Vnorm=1.8V

max=50mA

8,9,19,22,3

GND

6,46,48,50

~54,56,72,

Ground

85~112

Turn on/off

Pin Name Pin No. I/O Description DC Characteristics Comment

The output voltage is

0.8V because of the

diode drop in the

Qualcomm chipset.

PWRKEY 21 DI

Turnon/off the

module

RESET_N 20 DI Reset the module

max=2.1V

min=1.3V

max=0.5V

max=2.1V

min=1.3V

max=0.5V

Status Indication

Pin Name Pin No. I/O Description DC Characteristics Comment

STATUS 61 OD

Indicate the module

operating status

The drive current

should be less than

0.9mA.

Require external

pull-up. If unused,

keep it open.

1.8V power domain.

Cannot be pulled up

before startup.

If unused, keep it

NET_MODE 5 DO

Indicate the module

network registration

mode

min=1.35V

max=0.45V

open.

NET_

STATUS

Indicate the module

6 DO

network activity

status

min=1.35V

max=0.45V

1.8V power domain.

If unused, keep it

open.

USB Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

Vmax=5.25V

USB_VBUS 71 PI USB detection

Vmin=3.0V

Vnorm=5.0V

USB_DP 69 IO

USB differential data

bus

Compliant with USB

2.0 standard

specification.

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Require differential

impedance of 90ohm.

LTE Module Series

EC25Hardware Design

USB_DM 70 IO

USB differential data

bus

Compliant with USB

2.0 standard

specification.

Require differential

impedance of 90ohm.

USIM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

USIM_GND 10

Specified ground for

USIM card

For 1.8V USIM:

Vmax=1.9V

USIM_VDD 14 PO

Power supply for

USIM card

Vmin=1.7V

For 3.0V USIM:

Vmax=3.05V

Either 1.8V or 3.0V is

supported by the

module automatically.

Vmin=2.7V

max=50mA

For 1.8V USIM:

max=0.6V

min=1.2V

max=0.45V

min=1.35V

For 3.0V USIM:

max=1.0V

min=1.95V

max=0.45V

min=2.55V

USIM_DATA 15 IO

Data signal of USIM

card

For 1.8V USIM:

max=0.45V

min=1.35V

For 3.0V USIM:

max=0.45V

min=2.55V

USIM_CLK 16 DO

Clock signal of USIM

card

For 1.8V USIM:

max=0.45V

min=1.35V

For 3.0V USIM:

max=0.45V

min=2.55V

min=-0.3V

max=0.6V

1.8V power domain.

If unused, keep it

USIM_RST 17 DO

USIM_

PRESENCE

13 DI

Reset signal of

USIM card

USIM card insertion

detection

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EC25Hardware Design

VIHmin=1.2V

open.

VIHmax=2.0V

UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

RI 62 DO Ring indicator

DCD 63 DO

Data carrier

detection

CTS 64 DO Clear to send

RTS 65 DI Request to send

max=0.45V

min=1.35V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Data terminal

DTR 66 DI

ready,sleep mode

control

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

Pull-up by default.

Low level wakes up

the module.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

TXD 67 DO Transmit data

RXD 68 DI Receive data

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

Debug UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

DBG_TXD 12 DO Transmit data

DBG_RXD 11 DI Receive data

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

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ADC Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

General purpose

ADC0 45 AI

analog to digital

converter

General purpose

ADC1 44 AI

analog to digital

converter

Voltage range:

0.3V to VBAT_BB

Voltage range:

0.3V to VBAT_BB

If unused, keep it

open.

If unused, keep it

open.

PCM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

min=-0.3V

PCM_IN 24 DI PCM data input

PCM_OUT 25 DO PCM data output

PCM data frame

PCM_SYNC 26 IO

synchronization signal

PCM_CLK 27 IO PCM clock

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

VOLmax=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open.

1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal.

If unused, keep it

open.

I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment

I2C serial clock

I2C_SCL 41 OD

Used for external

codec.

External pull-up

resistor is required.

1.8V only. If unused,

keep it open.

External pull-up

I2C_SDA 42 OD

I2C serial dataUsed

for external codec.

resistor is required.

1.8V only. If unused,

keep it open.

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EC25Hardware Design

SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment

For 1.8V:

max=0.45V

EPHY_RST_

119 DO Ethernet PHY reset

EPHY_INT_N 120 DI

Ethernet PHY

interrupt

VOHmin=1.4V

For 2.85V:

max=0.35V

min=2.14V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V/2.85V power

domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

For 1.8V:

max=0.45V

min=1.4V

max=0.58V

SGMII_

MDATA

SGMII MDIO

121 IO

(Management Data

Input/Output) data

min=1.27V

For 2.85V:

max=0.35V

min=2.14V

max=0.71V

min=1.78V

1.8V/2.85V power

domain.

If unused, keep it

open.

For 1.8V:

max=0.45V

SGMII_

MCLK

SGMII MDIO

122 DO

(Management Data

Input/Output) clock

min=1.4V

For2.85V:

max=0.35V

min=2.14V

1.8V/2.85V power

domain.

If unused, keep it

open.

Configurable power

source.

1.8V/2.85V power

USIM2_VDD 128 PO

SGMII MDIO pull-up

power source

domain.

External pull-up for

SGMII MDIO pins.

If unused, keep it

open.

SGMII_TX_M 123 AO

SGMII transmission

- minus

If unused, keep it

open.

SGMII_TX_P 124 AO SGMII transmission If unused, keep it

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EC25Hardware Design

- plus open.

SGMII_RX_P 125 AI

SGMII_RX_M 126 AI

SGMII receiving

- plus

SGMII receiving

-minus

If unused, keep it

open.

If unused, keep it

open.

Wireless Connectivity Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment

max=0.45V

min=1.35V

SDC1_

DATA3

SDC1_

DATA2

SDC1_

DATA1

SDC1_

DATA0

129 IO SDIO data bus D3

130 IO SDIO data bus D2

131 IO SDIO data bus D1

132 IO SDIO data bus D0

SDC1_CLK 133 DO SDIO clock

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

max=0.45V

SDC1_CMD 134 DO SDIO command

PM_ENABLE 127 DO

WAKE_ON_

WIRELESS

135 DI

External power

control

Wake up the host

(EC25 module) by

max=0.45V

min=-0.3V

max=0.6V

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min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Active low.

LTE Module Series

EC25Hardware Design

FC20 module. VIHmin=1.2V

WLAN function

WLAN_EN 136 DO

control via FC20

module

COEX_UART

_RX

COEX_UART

_TX

WLAN_SLP_

CLK

137 DI

138 DO

118 DO WLAN sleep clock

BT_RTS* 37 DI

BT_TXD* 38 DO

LTE/WLAN&BT

coexistence signal

LTE/WLAN&BT

coexistence signal

BT UART request to

send

BT UART transmit

data

VIHmax=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

If unused, keep it

open.

1.8V power domain.

Active high.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

min=-0.3V

BT_RXD* 39 DI

BT_CTS* 40 DO

BT_EN* 139 DO

BT UART receive

data

BT UART clear to

send

BT function control

via FC20 module

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment

ANT_DIV 35 AI Diversity antenna 50ohm impedance

If unused, keep it

open.

ANT_MAIN 49 IO Main antenna 50ohm impedance

ANT_GNSS 47 AI GNSS antenna 50 ohm impedance

If unused, keep it

open.

GPIO Pins

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EC25Hardware Design

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

Cannot be pulled up

before startup.

Low level wakes up

the module.

If unused, keep it

WAKEUP_IN 1 DI Sleep mode control

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

open.

1.8V power domain.

Pull-up by default.

In low voltage level,

module can enter into

airplane mode.

If unused, keep it

open.

W_DISABLE# 4 DI

Airplane mode

control

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

min=-0.3V

AP_READY 2 DI

Application

processor sleep

state detection

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

USB_BOOT Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

min=-0.3V

USB_BOOT 115 DI

Force the module to

boot from USB port

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

RESERVED Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

3, 18, 23,

28~34, 43,

RESERVED

55, 73~84,

113, 114,

Reserved

Keep these pins

unconnected.

116, 117,

140~144

NOTES

1. “*” means under development.

2. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20

module.

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EC25Hardware Design

3.4. Operating Modes

The table below briefly summarizes the various operating modes referred in the following chapters.

Table 5: Overview of Operating Modes

Mode Details

Normal

Idle

Operation

Talk/Data

Minimum

Functionality

Mode

Airplane Mode

AT+CFUN command can set the module to a minimum functionality mode without

removing the power supply. In this case, both RF function and USIM card will be

invalid.

AT+CFUN command or W_DISABLE# pin can set the module to airplane mode. In

this case, RF function will be invalid.

In this mode, the current consumption of the module will be reduced to the minimal

Sleep Mode

level. During this mode, the module can still receive paging message, SMS, voice call

and TCP/UDP data from the network normally.

Power Down

Mode

In this mode, the power management unit shuts down the power supply. Software is

not active. The serial interface is not accessible. Operating voltage (connected to

VBAT_RF and VBAT_BB) remains applied.

3.5. Power Saving

Software is active. The module hasregistered onthe network, and it is

ready to send and receive data.

Network connection is ongoing. In this mode, the power consumption is

decided by network settingand data transfer rate.

3.5.1. Sleep Mode

EC25 is able to reduce its current consumption to a minimum value during the sleep mode. The following

section describes power saving procedure of EC25 module.

3.5.1.1. UART Application

If the host communicates with module via UART interface, the following preconditions can let the module

enter into sleep mode.

 Execute AT+QSCLK=1command to enable sleep mode.

 Drive DTR to high level.

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EC25Hardware Design

The following figure shows the connection between the module and the host.

Figure 3: Sleep Mode Application via UART

 Driving the host DTR to low level will wake up the module.

 When EC25 has URC to report, RI signal will wake up the host. Refer to Chapter 3.16 for details

about RI behavior.

 AP_READY will detect the sleep state of the host (can be configured to high level or low level

detection). Please refer to AT+QCFG=“apready”command for details.

NOTE

AT+QCFG=“apready”commandis under development.

3.5.1.2. USB Application with USB Remote Wakeup Function

If the host supports USB suspend/resume and remote wakeup function, the followingthreepreconditions

must be met tolet the module enter into the sleep mode.

 Execute AT+QSCLK=1command to enable the sleep mode.

 Ensure the DTR is held in high level or keep it open.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended

state.

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EC25Hardware Design

The following figure shows the connection between the module and the host.

Figure 4: Sleep ModeApplication with USB Remote Wakeup

 Sending data to EC25through USB will wake up the module.

 When EC25has URC to report, the module will send remote wake-up signals viaUSB bus so as to

wake up the host.

3.5.1.3. USB Application with USB Suspend/Resume and RI Function

If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is

needed to wake up the host.

There are threepreconditions to let the module enter into the sleep mode.

 Execute AT+QSCLK=1command to enable the sleep mode.

 Ensure the DTR is held in high level or keep it open.

 The host’s USB bus, which is connected with the module’s USB interface, enters into suspended

state.

The following figure shows the connection between the module and the host.

Figure 5: Sleep Mode Application with RI

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 Sending data to EC25through USB will wake up the module.

 When EC25has URC to report, RI signal will wake up the host.

3.5.1.4. USB Application without USB Suspend Function

If the host does not support USB suspend function, you should disconnect USB_VBUS with additional

control circuit to let the module enter into sleep mode.

 Execute AT+QSCLK=1commandto enable the sleep mode.

 Ensure the DTR is held in high level or keep it open.

 Disconnect USB_VBUS.

The following figure shows the connection between the module and the host.

Module Host

GPIO

USB_VBUS

USB_DP

USB_DM

AP_READY

GND

Power

Switch

Figure 6: Sleep Mode Application without Suspend Function

Switching on the power switch to supply power to USB_VBUS will wake up the module.

NOTE

Please pay attention to the level match shown in dotted line between the module and the host.Refer to

document [1] for more details about EC25 power management application.

VDD

USB_DP

USB_DM

EINT

GPIO

GND

3.5.2. Airplane Mode

When the module enters into airplane mode, the RF function does not work, and all AT commands

correlative with RF function will be inaccessible. This mode can be set via the following ways.

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Hardware:

The W_DISABLE# pin is pulled up by default; driving it to low level will let the module enter into airplane

mode.

Software: AT+CFUNcommand provides the choice of the functionality level.

 AT+CFUN=0: Minimum functionality mode; both USIM and RF functions are disabled.  AT+CFUN=1: Full functionality mode (by default).  AT+CFUN=4: Airplane mode. RF function is disabled.

NOTES

1. The W_DISABLE# control function is disabled in firmware by default. It can be enabled

byAT+QCFG=“airplanecontrol”command. This commandis under development.

2. The execution of AT+CFUN command will not affect GNSS function.

3.6. Power Supply

3.6.1. Power Supply Pins

EC25 provides four VBAT pins dedicated to connect with the external power supply. There are two

separate voltage domains for VBAT.

 Two VBAT_RF pins for module RF part

 Two VBAT_BB pins for module baseband part

The following table shows the details of VBAT pins and ground pins.

Table 6: VBAT and GND Pins

Pin Name Pin No. Description Min. Typ. Max. Unit

VBAT_RF 57,58

VBAT_BB 59,60

8,9,19,22,

GND

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36,46,

48,50~54,56,

Power supply for module RF

part

Power supply for module

baseband part

Ground - 0 - V

3.3 3.8 4.3 V

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EC25Hardware Design

72, 85~112

3.6.2. Decrease Voltage Drop

The power supply range of the module is from 3.3Vto4.3V. Please make sure that the input voltage will

never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G

network. The voltage drop will be less in 3G and 4G networks.

Burst

Transmission

VBAT

Drop

Min.3.3V

Burst

Transmission

Ripple

Figure 7: Power Supply Limits during Burst Transmission

To decrease voltage drop, a bypass capacitor of about 100µF with low ESR should be used, and a

multi-layer ceramic chip (MLCC) capacitor array should also be used toprovide the low ESR. The main

power supply from an external application has to be a single voltage source and can be expanded to two

sub paths with star structure. The width of VBAT_BB trace should be no less than 1mm; andthe width of

VBAT_RF trace should be no less than 2mm.In principle, the longer the VBAT trace is, the wider it will be.

Three ceramic capacitors (100nF, 33pF, 10pF) are recommended to be applied to the VBAT pins. These

capacitors should be placed close to the VBAT pins. In addition, in order to get a stable power source, it is

suggested that you should use a zener diode of which reverse zener voltage is 5.1V and dissipation

power is more than 0.5W. The following figure shows the star structure of the power supply.

Figure 8: Star Structure of the Power Supply

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3.6.3. Reference Design for Power Supply

Power design for the module is very important, asthe performance of the module largely depends on the

power source. The power supply is capable of providing sufficient current up to 2A at least. If the voltage

drop between the input and output is not too high, it is suggested that you shoulduse an LDO to supply

power for the module. If there is a big voltage difference between the input source and the desired output

(VBAT), a buck converter is preferred to be used as thepower supply.

The following figure shows a reference design for +5V input power source. The typical output of the power

supplyis about 3.8V and the maximum load current is 3A.

Figure 9: Reference Circuit of Power Supply

NOTE

In order to avoid damaging internal flash, please do not switch off the power supply when the module

works normally. Only after the module is shutdown by PWRKEY or AT command, the power supply can be

cut off.

3.6.4. Monitor the Power Supply

AT+CBC command can be used to monitor the VBAT_BB voltage value. For more details, please refer to

document [2].

3.7. Turn on and off Scenarios

3.7.1. Turn on Module Using the PWRKEY

The following table shows the pin definition of PWRKEY.

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Table 7: PWRKEY Pin Description

Pin Name Pin No. Description DC Characteristics Comment

max=2.1V

PWRKEY 21 Turn on/off the module

min=1.3V

max=0.5V

The output voltage is 0.8V

because of the diode drop in

the Qualcomm chipset.

When EC25 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a

low level for at least 100ms. It is recommended to use an open drain/collector driver to control the

PWRKEY.After STATUS pin (require external pull-up) outputting a low level, PWRKEY pin can be

released. A simple reference circuit is illustrated in the following figure.

Figure 10: Turn on the Module Using Driving Circuit

The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic

strike may generate from finger. Therefore, aTVS component is indispensable to be placed nearby the

button for ESD protection. A reference circuit is shownin the following figure.

Figure 11: Turn on the Module Using Keystroke

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The turn on scenario is illustrated in the following figure.

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Figure 12: Timing of Turning on Module

NOTE

Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no

less than 30ms.

3.7.2. Turn off Module

The following procedures can be used to turn off the module:

 Normal power down procedure: Turn off the module using the PWRKEY pin.

 Normal power down procedure: Turn off the module using AT+QPOWDcommand.

3.7.2.1. Turn off Module Using the PWRKEY Pin

Driving the PWRKEY pin to a low level voltage for at least 650ms, the module will execute power-down

procedure after the PWRKEY is released. The power-down scenario is illustrated inthe following figure.

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Figure 13: Timing of Turning off Module

3.7.2.2. Turn off Module Using AT Command

It is also a safe way to use AT+QPOWDcommand to turn off the module, which is similar to turning off the

module via PWRKEY pin.

Please refer todocument [2] for details about AT+QPOWD command.

NOTE

Inorder to avoid damaging internal flash, please do not switch off the power supply when the module

works normally. Only after the module is shutdown by PWRKEY or AT command, the power supply can be

cut off.

3.8. Reset the Module

The RESET_N pin can be used to reset the module.The module can be reset by driving RESET_N to a

low level voltage for time between 150ms and 460ms.

Table 8: RESET_N Pin Description

Pin Name Pin No. Description DC Characteristics Comment

max=2.1V

RESET_N 20 Reset the module

min=1.3V

max=0.5V

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The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button

can be used to control the RESET_N.

Figure 14: Reference Circuit of RESET_N by Using Driving Circuit

Figure 15: Reference Circuit of RESET_N by Using Button

The reset scenario is illustrated inthe following figure.

Figure 16: Timing of Resetting Module

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NOTES

1. Use RESET_N only when turning off the module by AT+QPOWDcommand and PWRKEY pin failed.

2. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.

3.9. USIM Card Interface

The USIM card interface circuitrymeets ETSI and IMT-2000 SIM interface requirements. Both 1.8V and

3.0V USIM cards are supported.

Table 9: Pin Definition of the USIM Card Interface

Pin Name Pin No. I/O Description Comment

USIM_VDD 14 PO Power supply for USIM card

Either 1.8V or 3.0V is supported

by the module automatically.

USIM_DATA 15 IO Data signal of USIM card

USIM_CLK 16 DO Clock signal of USIM card

USIM_RST 17 DO Reset signal of USIM card

USIM_

PRESENCE

13 DI USIM card insertion detection

USIM_GND 10 Specified ground for USIM card

EC25 supports USIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and

high level detections, and isdisabled by default. Please refer to document [2] about AT+QSIMDET

command for details.

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The following figure shows a reference design for USIM card interface with an 8-pin USIM card connector.

Figure 17: Reference Circuit of USIM Card Interface with an 8-Pin USIM Card Connector

If USIM card detection function is not needed, please keep USIM_PRESENCE unconnected. Areference

circuit for USIM card interface witha 6-pin USIM card connector is illustrated inthe following figure.

Figure 18: Reference Circuit of USIM Card Interface with a 6-Pin USIM Card Connector

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In order to enhance the reliability and availability of the USIM card in your application, please follow the

criteria below in USIM circuit design:

 Keep layout of USIM card as close to the module as possible. Keep the trace length as less than

200mm as possible.

 Keep USIM card signals away from RF and VBAT traces.

 Assure the ground between the module and the USIM card connector short and wide. Keep thetrace

width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential.

 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away fromeach other and

shield them with surrounded ground.

 In order to offer good ESD protection, it is recommended to add a TVS diode array whose parasitic

capacitance should not be more than 50pF. The 22ohmresistors should be added in series between

the module and the USIM card so as to suppress EMI spurious transmission and enhance ESD

protection. The 33pFcapacitors are used for filtering interference of GSM900.Please note that the

USIM peripheral circuit should be close to the USIM card connector.

 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace

and sensitive occasion areapplied, and should be placed close to the USIM card connector.

3.10. USB Interface

EC25 contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0

specification and supports high-speed (480Mbps) and full-speed (12Mbps)modes. The USB interface is

used for AT command communication, data transmission, GNSS NMEA sentences output, software

debugging, firmware upgrade and voice over USB*. The following table shows the pin definition of USB

interface.

Table 10: Pin Description of USB Interface

Pin Name Pin No. I/O Description Comment

USB Signal Part

USB_DP 69 IO USB differential data bus (positive)

USB_DM 70 IO USB differential data bus (minus)

Require differential

impedance of 90Ω

Require differential

impedance of 90Ω

USB_VBUS 71 PI Used for detecting the USB connection Typical 5.0V

GND 72 Ground

For more details about the USB 2.0 specifications, please visithttp://www.usb.org/home

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The USB interface is recommended to be reserved for firmware upgrade in your design. The following

figure shows areference circuit of USB interface.

Figure 19: Reference Circuit of USB Application

In order to ensurethe integrity of USB data line signal, components R1, R2, R3 and R4 must be placed

close to the module, and also these resistors should be placed close to each other. The extra stubs of

trace must be as short as possible.

In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply

with the following principles:

 It is important to route the USB signal traces as differential pairs with total grounding. The impedance

of USB differential trace is 90ohm.

 Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is

important to route the USB differential traces in inner-layer with ground shielding onnot only upper

and lower layers but also right and left sides.

 Pay attention to the influence of junction capacitance of ESD protection components on USB data

lines. Typically, the capacitance value should be less than 2pF.

 Keep the ESD protection components to the USB connector as close as possible.

NOTES

1. EC25 module can only be used as a slave device.

2. “*” means under development.

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3.11. UART Interfaces

The module provides two UART interfaces: the main UART interface and the debug UART interface. The

following shows their features.

 The main UART interface supports4800, 9600, 19200,38400,57600,115200,230400,460800,921600

and3000000bps baud rates, and the default is 115200bps. This interface is used for data

transmission and AT command communication.

 The debug UART interface supports 115200bps baud rate. It is used forLinux console and log output.

The following tables show the pin definition.

Table 11: Pin Definition of the Main UART Interface

Pin Name Pin No. I/O Description Comment

RI 62 DO Ring indicator 1.8V power domain

DCD 63 DO Data carrier detection 1.8V power domain

CTS 64 DO Clear to send 1.8V power domain

RTS 65 DI Request to send 1.8V power domain

DTR 66 DI Sleep mode control 1.8V power domain

TXD 67 DO Transmit data 1.8V power domain

RXD 68 DI Receive data 1.8V power domain

Table 12: Pin Definition of the Debug UART Interface

Pin Name Pin No. I/O Description Comment

DBG_TXD 12 DO Transmit data 1.8V power domain

DBG_RXD 11 DI Receive data 1.8V power domain

The logic levels are described in the following table.

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Table 13:Logic Levels of Digital I/O

Parameter Min. Max. Unit

VIL -0.3 0.6 V

VIH 1.2 2.0 V

VOL 0 0.45 V

VOH 1.35 1.8 V

The module provides 1.8V UART interface. A level translator should be used if your application is

equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instrument is

recommended. The following figure shows a reference design.

Figure 20: Reference Circuit with Translator Chip

Please visit http://www.ti.com

for more information.

Another example with transistor translation circuit is shown as below. Thecircuit design of dotted line

section can refer to the design of solid line section, in terms of both module input and output circuit

designs, but please pay attention to the direction of connection.

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Figure 21: Reference Circuit with Transistor Circuit

NOTE

Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.

3.12. PCM and I2C Interfaces

EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the

following modes:

 Primary mode (short frame synchronization, works as both master and slave)

 Auxiliary mode (long frame synchronization, works as master only)

In primary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge. The PCM_SYNC falling edge represents the MSB. In this mode, PCM_CLK supports

128,256,512,1024 and2048kHz for different speech codecs.

In auxiliary mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising

edge.The PCM_SYNC rising edge represents the MSB. In this mode, PCM interface operates with a

128kHz PCM_CLK and an 8kHz, 50% duty cycle PCM_SYNC only.

EC25 supports 8-bit A-law* andμ-law*, and also 16-bit linear data formats. The following figures show

theprimary mode’s timing relationship with 8kHz PCM_SYNC and 2048kHz PCM_CLK, as well asthe

auxiliary mode’s timing relationship with 8kHz PCM_SYNC and 128kHz PCM_CLK.

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Figure 22: Primary Mode Timing

Figure 23: Auxiliary Mode Timing

The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio

codec design.

Table 14: Pin Definition of PCM and I2C Interfaces

Pin Name Pin No. I/O Description Comment

PCM_IN 24 DI PCM data input 1.8V power domain

PCM_OUT 25 DO PCM data output 1.8V power domain

PCM_SYNC 26 IO PCM data frame sync signal 1.8V power domain

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PCM_CLK 27 IO PCM data bit clock 1.8V power domain

I2C_SCL 41 OD I2C serial clock Require external pull-up to 1.8V

I2C_SDA 42 OD I2C serial data Require external pull-up to 1.8V

Clock and mode can be configured by AT command, and the default configuration is master mode using

short frame synchronization format with 2048kHzPCM_CLK and 8kHz PCM_SYNC.Please refer to

document [2] about AT+QDAIcommand for details.

The following figure shows areference design of PCM interface with external codec IC.

Figure 24: Reference Circuit of PCM Application with Audio Codec

NOTES

1. “*” means under development.

2. It is recommended to reserve RC (R=22ohm, C=22pF) circuit on the PCM lines, especially for

PCM_CLK.

3. EC25 works as a master device pertaining to I2C interface.

3.13. ADC Function

The module provides two analog-to-digital converters (ADC).AT+QADC=0command can be used toread the voltage value on ADC0 pin. AT+QADC=1command can be used to read the voltage value on ADC1 pin. For more details about these AT commands, please refer todocument [2].

In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.

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Table 15: Pin Definition of the ADC

Pin Name Pin No. Description

ADC0 45 General purpose analog to digital converter

ADC1 44 General purpose analog to digital converter

The following table describes the characteristic of the ADC function.

Table 16: Characteristic of the ADC

Parameter Min. Typ. Max. Unit

ADC0 Voltage Range 0.3 VBAT_BB V

ADC1 Voltage Range 0.3 VBAT_BB V

ADC Resolution 15 bits

NOTES

1. ADC input voltage must not exceed VBAT_BB.

2. It is prohibited to supply any voltage to ADC pinswhen VBAT is removed.

3. It is recommended to use resistor divider circuit for ADC application.

3.14. Network Status Indication

The network indication pins can be used to drive network status indication LEDs. The module provides

two pins which are NET_MODE and NET_STATUS. The following tables describe pin definition and logic

level changes in different network status.

Table 17: Pin Definition of Network Connection Status/Activity Indicator

Pin Name Pin No. I/O Description Comment

NET_MODE1) 5 DO

NET_STATUS 6 DO

Indicate the module network

registration mode.

Indicate the module network activity

status.

1.8V power domain

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meansthat this pin cannot be pulled up before startup.

Table 18: Working State of the Network Connection Status/Activity Indicator

Pin Name Logic Level Changes Network Status

Always High Registered on LTE network

NET_MODE

Always Low Others

Flicker slowly (200ms High/1800ms Low) Network searching

Flicker slowly (1800ms High/200ms Low) Idle

NET_STATUS

Flicker quickly (125ms High/125ms Low) Data transfer is ongoing

Always High Voice calling

A reference circuit is shown in the following figure.

Figure 25: Reference Circuit of the Network Indicator

3.15. STATUS

The STATUS pin is an open drain output for indicating the module’s operation status. You can connect it

to a GPIO of DTE with a pulled up resistor, or as LED indication circuit as below. When the module is

turned on normally, the STATUS will present the low state. Otherwise, the STATUS will present

high-impedance state.

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Table 19: Pin Definition of STATUS

Pin Name Pin No. I/O Description Comment

STATUS 61 OD Indicate the module operation status Require external pull-up

The following figure shows different circuitdesigns of STATUS, and you can choose either one according

to your application demands.

Figure 26: Reference Circuits of STATUS

3.16. Behavior of the RI

AT+QCFG=“risignaltype”,“physical”command can be used to configure RI behavior.

No matter on which port URC is presented, URC will trigger the behavior of RI pin.

NOTE

URC can be output from UART port, USB AT port and USB modem port by AT+QURCCFG command.

The default port is USB AT port.

In addition, RI behavior can be configured flexibly. The default behavior of the RI is shown as below.

Table 20: Behavior of the RI

State Response

Idle RI keeps in high level

URC RI outputs 120ms low pulse when new URC returns

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The RI behavior can be changed by AT+QCFG=“urc/ri/ring” command. Please refer to document [2]

for details.

3.17. SGMII Interface

EC25 includes an integrated Ethernet MAC with an SGMII interface and twomanagement interfaces,key

features of the SGMII interface are shown below:

 IEEE802.3 compliance

 Full duplex at 1000Mbps

 Half/full duplex for 10/100Mbps

 Support VLAN tagging

 Support IEEE1588 and Precision Time Protocol(PTP)

 Can be used to connect toexternal Ethernet PHY like AR8033, or to an external switch

 Management interfaces support dual voltage 1.8V/2.85V

The following table shows the pin definition of SGMII interface.

Table 21: Pin Definition of the SGMII Interface

Pin Name Pin No. I/O Description Comment

Control Signal Part

EPHY_RST_N 119 DO Ethernet PHY reset 1.8V/2.85V power domain

EPHY_INT_N 120 DI Ethernet PHY interrupt 1.8V power domain

SGMII_MDATA 121 IO

SGMII_MCLK 122 DO

SGMII MDIO(Management Data

Input/Output) data

SGMII MDIO (Management Data

Input/Output) clock

1.8V/2.85V power domain

Configurable power source.

USIM2_VDD 128 PO

SGMII MDIO pull-up power

source

1.8V/2.85V power domain.

External pull-up power source for

SGMII MDIO pins.

SGMII Signal Part

SGMII_TX_M 123 AO SGMII transmission-minus

Connect with a 0.1uF capacitor,

close to the PHY side.

SGMII_TX_P 124 AO SGMII transmission-plus

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Connect with a 0.1uF capacitor,

close to the PHY side.

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SGMII_RX_P 125 AI SGMII receiving-plus

SGMII_RX_M 126 AI SGMII receiving-minus

Connect with a 0.1uF capacitor,

close to EC25 module.

Connect with a 0.1uF capacitor,

close to EC25 module.

The following figure shows the simplified block diagram for Ethernet application.

Figure 27: Simplified Block Diagram for Ethernet Application

The following figure shows a reference design ofSGMII interface with PHY AR8033 application.

10K

1.5K

Close to Module

VDD_EXT

USIM2_VDD

AR8033

INT

RSTN

MDIO

MDC

SOP

SON

Control

Module

EPHY_RST_N

SGMII_MDATA

EPHY_INT_N

SGMII_MCLK

USIM2_VDD

SGMII_RX_P

SGMII_RX_M

USIM2_VDD

0.1uF

SGMII Data

SGMII_TX_P

SGMII_TX_M

0.1uF

SIP

SIN

Close to AR8033

Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application

In order to enhance the reliability and availability in your application, please follow the criteria below in the

Ethernet PHY circuit design:

 Keep SGMII data and control signals away from RF and VBAT trace.

 Keep the maximum trace length less than 10inch and keep skew on the differential pairs less than

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20mil.

 The differential impedance of SGMII data trace is 100ohm±10%.

 To minimize crosstalk, the distance between separate adjacent pairs that are on the same layer must

be equal to or larger than 40mil.

NOTE

For more information about SGMII application, please refer to document [5]and document [7].

3.18. Wireless Connectivity Interfaces

EC25supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.

The following table shows the pin definition of wireless connectivity interfaces.

Table 22: Pin Definition of Wireless Connectivity Interfaces

Pin Name Pin No. I/O Description Comment

WLAN Part

SDC1_DATA3 129 IO SDIO data bus D3 1.8V power domain

SDC1_DATA2 130 IO SDIO data bus D2 1.8V power domain

SDC1_DATA1 131 IO SDIO data bus D1 1.8V power domain

SDC1_DATA0 132 IO SDIO data bus D0 1.8V power domain

SDC1_CLK 133 DO SDIO clock 1.8V power domain

SDC1_CMD 134 IO SDIO command 1.8V power domain

WLAN_EN 136 DO

Coexistence and Control Part

WLAN function control via FC20

module. Active high.

1.8V power domain

PM_ENABLE 127 DO External power control 1.8V power domain

WAKE_ON_

WIRELESS

COEX_UART_RX 137 DI LTE/WLAN&BT coexistence signal 1.8V power domain

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135 DI

Wake up the host (EC25 module)

by FC20 module.

1.8V power domain

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COEX_UART_TX 138 DO LTE/WLAN&BT coexistence signal 1.8V power domain

WLAN_SLP_CLK 118 DO WLAN sleep clock

BT Part*

BT_RTS* 37 DI BT UART request to send 1.8V power domain

BT_TXD* 38 DO BT UART transmit data 1.8V power domain

BT_RXD* 39 DI BT UART receive data 1.8V power domain

BT_CTS* 40 DO BT UART clear to send 1.8V power domain

PCM_IN1) 24 DI PCM data input 1.8V power domain

PCM_OUT1) 25 DO PCM data output 1.8V power domain

PCM_SYNC1) 26 IO PCM data frame sync signal 1.8V power domain

PCM_CLK1) 27 IO PCM data bit clock 1.8V power domain

BT_EN* 139 DO

BT function control via FC20

module. Active high.

1.8V power domain

NOTES

1. “*” means under development.

Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20

module.

The following figure shows a reference design of Wireless Connectivity interfaces with QuectelFC20

module.

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Module

WLAN

COEX & Control

SDC1_DATA3

SDC1_DATA2

SDC1_DATA1

SDC1_DATA0

SDC1_CLK

SDC1_CMD

WLAN_EN

WLAN_SLP_CLK

WAKE_ON_WIRELESS

COEX_UART_RX

COEX_UART_TX

PM_ENABLE

BT_EN

BT_RTS

BT_CTS

BT_TXD

BT_RXD

PCM_IN

PCM_OUT

PCM_CLK

PCM_SYNC

DCDC/LDO

FC20 Module

SDIO_D3

SDIO_D2

SDIO_D1

SDIO_D0

SDIO_CLK

SDIO_CMD

WLAN_EN

32KHz_IN

WAKE_ON_WIRELESS

LTE_UART_TXD

LTE_UART_RXD

VDD_3V3

BT_EN

BT_UART_RTS

BT_UART_CTS

BT_UART_RXD

BT_UART_TXD

PCM_OUT

PCM_IN

PCM_CLK

PCM_SYNC

Figure 29: Reference Circuit of Wireless Connectivity Interfaces with FC20 Module

NOTES

1. FC20 module can only be used as a slave device,

2. When BT function is enabled on EC25 module, PCM_SYNC and PCM_CLK pins are only used to output signals.

3. For more information about wireless connectivity interfaces application, please refer to document [5].

3.18.1. WLAN Interface

EC25 provides a low power SDIO 3.0 interface and control interface for WLAN design.

SDIO interface supports the following modes:

 Single data rate(SDR) mode (up to 200MHz)

 Double data rate(DDR) mode (up to 52MHz)

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As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the

SDIO 3.0 specification, please comply with the following principles:

 It is important to route the SDIO signal traces with total grounding. The impedance of SDIOsignal

trace is 50ohm(±10%).

 Protect other sensitive signals/circuits(RF, analog signals, etc.) from SDIO corruption and protect

SDIO signals from noisy signals (clocks, DCDCs, etc.).

 It is recommended to keep matching lengthbetween CLK andDATA/CMD less than 1mm and total

routing length less than 50mm.

 Keep termination resistorswithin 15~24ohm on clock lines near the module and keep the route

distance from the module clock pins to termination resistorsless than 5mm.

 Make sure the adjacent trace spacing is 2x line width and bus capacitance is less than 15pF.

3.18.2. BT Interface*

EC25 supportsa dedicated UART interface and a PCM interface for BT application.

Further information about BT interface will be added in future version of this document.

NOTE

“*” means under development.

3.19. USB_BOOT Interface

EC25 provides a USB_BOOT pin. During development or factory production, USB_BOOT pin can force

the module to boot from USB port for firmware upgrade.

Table 23: Pin Definition of USB_BOOT Interface

Pin Name Pin No. I/O Description Comment

USB_BOOT 115 DI

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Force the module to boot from USB

port

1.8V power domain.

Active high.

If unused, keep it open.

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The following figure shows a reference circuit of USB_BOOT interface.

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Figure 30: Reference Circuit of USB_BOOT Interface

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4 GNSS Receiver

4.1. General Description

EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of

Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS).

EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via

USB interface by default.

By default, EC25 GNSS engine is switched off. It has to be switched on via AT command. For more

details about GNSS engine technology and configurations, please refer to document [3].

4.2. GNSS Performance

The following table shows GNSS performance of EC25.

Table 24: GNSS Performance

Parameter Description Conditions Typ. Unit

Cold start Autonomous -146 dBm

Sensitivity

(GNSS)

TTFF

(GNSS)

Reacquisition Autonomous -157 dBm

Tracking Autonomous -157 dBm

Cold start

@open sky

Warm start

@open sky

Autonomous 35 s

XTRA enabled 18 s

Autonomous 26 s

XTRA enabled 2.2 s

Hot start Autonomous 2.5 s

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Accuracy

(GNSS)

@open sky

CEP-50

XTRA enabled 1.8 s

Autonomous

@open sky

<1.5 m

NOTES

1. Tracking sensitivity: the lowest GNSSsignal value at the antenna port on which the module can keep

on positioning for 3 minutes.

2. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can

fix position again within 3 minutes after loss of lock.

3. Cold start sensitivity: the lowest GNSS signal value at the antenna port on which the module fixes

position within 3 minutes after executing cold start command.

4.3. Layout Guidelines

The following layout guidelines should be taken into account in your design.

 Maximize the distance among GNSS antenna, main antenna and Rx-diversity antenna.

 Digital circuits such as USIM card, USB interface, camera module, display connector and SD card

should be kept away from the antennas.

 Use ground vias around the GNSS trace and sensitive analog signal traces to provide coplanar

isolation and protection.

 Keep 50ohm characteristic impedance for the ANT_GNSS trace.

Please refer to Chapter 5 for GNSS antenna reference design and antenna installation information.

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5 Antenna Interfaces

EC25 antenna interfaces include a main antenna interface,anRx-diversity antennainterface which is used

toresist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna

interface. The antenna interfaces have an impedance of 50ohm.

5.1. Main/Rx-diversityAntenna Interface

5.1.1. Pin Definition

The pin definition of main antenna and Rx-diversityantenna interfaces are shown below.

Table 25: Pin Definition of the RF Antenna

Pin Name Pin No. I/O Description Comment

ANT_MAIN 49 IO Main antenna pad 50ohmimpedance

ANT_DIV 35 AI Receive diversityantenna pad 50ohm impedance

5.1.2. Operating Frequency

Table 26: Module Operating Frequencies

3GPP Band Transmit Receive Unit

B1 1920~1980 2110~2170 MHz

B2 (1900) 1850~1910 1930~1990 MHz

B3 (1800) 1710~1785 1805~1880 MHz

B4 1710~1755 2110~2155 MHz

B5 (850) 824~849 869~894 MHz

B6 830~840 875~885 MHz

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B7 2500~2570 2620~2690 MHz

B8 (900) 880~915 925~960 MHz

B12 699~716 729~746 MHz

B13 777~787 746~756 MHz

B18 815~830 860~875 MHz

B19 830~845 875~890 MHz

B20 832~862 791~821 MHz

B26 814~849 859~894 MHz

B28 703~748 758~803 MHz

B38 2570~2620 2570~2620 MHz

B40 2300~2400 2300~2400 MHz

B41 2555~2655 2555~2655 MHz

5.1.3. Reference Design of RF Antenna Interface

Areference design of ANT_MAIN and ANT_DIVantenna pads is shown as below. It should reserve a

π-type matching circuit for better RF performance. The capacitors are not mounted by default.

Figure 31: Reference Circuit of RF Antenna Interface

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NOTES

1. Keep a proper distance between the main antenna and theRx-diversityantenna to improve the

receiving sensitivity.

2. ANT_DIV function is enabledby default.

3. Place theπ-type matching components (R1, C1, C2, R2, C3, C4) as close to the antenna as possible.

5.1.4. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 ohm. The

impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,

the distance between signal layer and reference ground (H), and the clearance between RF trace and

ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic

impedance control. The following are reference designs of microstrip line or coplanar waveguide line with

different PCB structures

Figure 32: Microstrip Line Design on a 2-layer PCB

Figure 33: Coplanar Waveguide Line Design on a 2-layer PCB

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Figure 34: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)

Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)

In order to ensure RF performance and reliability, the following principles should be complied with in RF

layout design:

 Use impedance simulation tool to control the characteristic impedanceof RF tracesas 50ohm.

 The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to

ground.

 The distance between the RF pinsand the RFconnector should be as short as possible, and all the

right angle traces should be changed to curved ones.

 There should be clearance area under the signal pin of the antenna connector or solder joint.

 The reference ground of RF traces should be complete. Meanwhile, adding some ground viasaround

RF traces and the reference ground could help to improve RF performance. The distance between

the ground viasand RF traces should be no less than two times the width of RF signal traces (2*W).

For more details about RF layout, please refer to document [6].

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5.2. GNSS Antenna Interface

The following tables show pin definition and frequency specification of GNSS antenna interface.

Table 27: Pin Definition of GNSS Antenna Interface

Pin Name Pin No. I/O Description Comment

ANT_GNSS 47 AI GNSS antenna 50ohmimpedance

Table 28: GNSS Frequency

Type Frequency Unit

GPS/Galileo/QZSS 1575.42±1.023 MHz

GLONASS 1597.5~1605.8 MHz

BeiDou 1561.098±2.046 MHz

A reference design of GNSS antenna is shown as below.

Figure 36: Reference Circuit of GNSS Antenna

NOTES

1. An external LDO can be selected to supply power according to the active antenna requirement.

2. If the module is designed with a passive antenna, then the VDD circuit is not needed.

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5.3. Antenna Installation

5.3.1. Antenna Requirement

The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna.

Table 29: Antenna Requirements

Type Requirements

Frequency range: 1561~1615MHz

Polarization: RHCP or linear

VSWR: <2 (Typ.)

GNSS

Passive antenna gain: >0dBi

Active antenna noise figure: <1.5dB

Active antenna gain: >-2dBi

Active antenna embedded LNA gain: 20dB (Typ.)

Active antenna total gain: >18dBi (Typ.)

GSM/WCDMA/LTE

VSWR:≤2

Gain (dBi): 1

Max input power (W): 50

Input impedance (ohm): 50

Polarization type: Vertical

Cable insertion loss: <1dB

( GSM900, WCDMA B5/B6/B8/B19,

LTE B5/B8/B12/B13/B18/B20/B26/B28)

Cable insertion loss: <1.5dB

(GSM1800, WCDMA B1/B2/B4,LTE B1/B2/B3/B4)

Cable insertion loss <2dB

(LTE B7/B38/B40/B41)

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5.3.2. Recommended RF Connector for Antenna Installation

If RF connector is used for antenna connection, it is recommended to use UF.L-R-SMT connector

provided by HIROSE.

Figure 37: Dimensions of the UF.L-R-SMT Connector (Unit: mm)

U.FL-LP serial connectors listed in the following figure can be used to match the UF.L-R-SMT.

Figure 38:Mechanicals of UF.L-LP Connectors

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The following figure describes the space factor of mated connector.

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Figure 39:Space Factor of Mated Connector (Unit: mm)

For more details, please visithttp://hirose.com

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6 Electrical, Reliability and

RadioCharacteristics

6.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are

listed in the following table.

Table 30: Absolute Maximum Ratings

Parameter Min. Max. Unit

VBAT_RF/VBAT_BB -0.3 4.7 V

USB_VBUS -0.3 5.5 V

Peak Current of VBAT_BB 0 0.8 A

Peak Current of VBAT_RF 0 1.8 A

Voltage at Digital Pins -0.3 2.3 V

Voltage at ADC0 0 VBAT_BB V

Voltage at ADC1 0 VBAT_BB V

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6.2. Power Supply Ratings

Table 31: The Module Power Supply Ratings

Parameter Description Conditions Min. Typ. Max. Unit

Voltage must stay within the

VBAT_BB and

VBAT_RF

VBAT

min/max values, including

voltage drop, ripple and

spikes.

3.3 3.8 4.3 V

VBAT

Voltage drop during

burst transmission

Peak supply current

(during

transmissionslot)

Maximum power control

level on GSM900.

Maximum power control

level on GSM900.

400 mV

1.8 2.0 A

USB_VBUS USB detection 3.0 5.0 5.25 V

6.3. Operating Temperature

The operating temperature is listed in the following table.

Table 32: Operating Temperature

Parameter Min. Typ. Max. Unit

OperationTemperature Range1) -35 +25 +75 ºC

Extended Operation Range2) -40 +85 ºC

NOTES

1. 1)Within operation temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters

like P

might reduce in their value and exceed the specified tolerances. When the temperature

out

returns to the normal operating temperature levels, the module will meet 3GPP compliant again.

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6.4. Current Consumption

Table 33: EC25-E Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 20 uA

VBAT

Sleep state

AT+CFUN=0 (USB disconnected)

1.4 mA

GSM DRX=2 (USB disconnected) 2.74 mA

GSM DRX=9 (USB disconnected) 2.0 mA

WCDMA PF=64 (USB disconnected) 2.7 mA

WCDMA PF=128 (USB disconnected) 2.3 mA

LTE-FDD PF=64 (USB disconnected) 2.0 mA

LTE-FDD PF=128 (USB disconnected) 1.9 mA

LTE-TDD PF=64 (USB disconnected) 4.2 mA

LTE-TDD PF=128 (USB disconnected) 4.2 mA

GSM DRX=5 (USB disconnected) 22.0 mA

GSM DRX=5 (USB connected) 31.0 mA

WCDMA PF=64 (USB disconnected) 31.0 mA

WCDMA PF=64 (USB connected) 36.0 mA

Idle state

LTE-FDDPF=64 (USB disconnected) 22.0 mA

LTE-FDDPF=64 (USB connected) 32.0 mA

LTE-TDDPF=64 (USB disconnected) 22.0 mA

LTE-TDDPF=64 (USB connected) 32.0 mA

GSM900 4DL/1UL @32.18dBm 236.0 mA

GPRS data

GSM900 3DL/2UL @32dBm 392.9 mA

transfer (GNSS

OFF)

GSM900 2DL/3UL @30.2dBm 466.1 mA

GSM900 1DL/4UL @29.3dBm 554.2 mA

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DCS1800 4DL/1UL @28.9dBm 181.3 mA

DCS1800 3DL/2UL @28.9dBm 305.3 mA

DCS1800 2DL/3UL @28.8dBm 420.1 mA

DCS1800 1DL/4UL @28.6dBm 531.6 mA

GSM900 4DL/1UL PCL=8 @26.5dBm 156.4 mA

GSM900 3DL/2UL PCL=8 @26.5dBm 248.1 mA

GSM900 2DL/3UL PCL=8 @26.4dBm 340.1 mA

EDGE data

transfer (GNSS

OFF)

WCDMA

datatransfer(GNSS

OFF)

GSM900 1DL/4UL PCL=8 @26.3dBm 438.8 mA

DCS1800 4DL/1UL PCL=2 @24.9dBm 158.1 mA

DCS1800 3DL/2UL PCL=2 @24.8dBm 251.4 mA

DCS1800 2DL/3UL PCL=2 @24.7dBm 340.4 mA

DCS1800 1DL/4UL PCL=2 @24.5dBm 432.8 mA

WCDMA B1 HSDPA@22.1dBm 663.7 mA

WCDMA B1 HSUPA@23.85dBm 662.6 mA

WCDMA B5 HSDPA@22.5dBm 708.6 mA

WCDMA B5 HSUPA@22.3dBm 696.6 mA

WCDMA B8 HSDPA@21.95dBm 595.5 mA

WCDMA B8 HSUPA@21.92dBm 593.5 mA

LTE-FDD B1 @23.25dBm 783.6 mA

LTE-FDD B3 @23.35dBm 845.8 mA

LTE-FDD B5 @23.04dBm 795.3 mA

LTE-FDD B7 @23.37dBm 843 mA

LTE

datatransfer(GNSS

LTE-FDD B8 @23.45dBm 759.9 mA

OFF)

LTE-FDD B20 @23.35dBm 755.8 mA

LTE-TDD B38 @23.41dBm 449.5 mA

LTE-TDD B40 @23.17dBm 431.8 mA

LTE-TDD B41 @23.37dBm 447.2 mA

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GSM

voice call

GSM900 PCL=5 @32.2dBm 231.7 mA

DCS1800PCL=0 @23.35dBm 188.8 mA

WCDMA B1 @22.89dBm 724.7 mA

WCDMA voice call

WCDMA B5 @22.92dBm 698.2 mA

WCDMA B8 @22.82dBm 628.2 mA

Table 34: EC25-A Current Consumption

Parameter Description Conditions Typ. Unit

OFF state Power down 20 uA

AT+CFUN=0 (USB disconnected)

0.99 mA

WCDMA PF=64 (USB disconnected) 2.0 mA

Sleep state

WCDMA PF=128 (USB disconnected) 1.6 mA

VBAT

LTE-FDD PF=64 (USB disconnected) 2.4 mA

LTE-FDD PF=128 (USB disconnected) 1.9 mA

WCDMA PF=64 (USB disconnected) 22.0 mA

WCDMA PF=64 (USB connected) 32.0 mA

Idle state

LTE-FDDPF=64 (USB disconnected) 22.0 mA

LTE-FDDPF=64 (USB connected) 33.0 mA

WCDMA B2 HSDPA@22.86dBm 600.0 mA

WCDMA B2 HSUPA@22.51dBm 584.6 mA

WCDMA

WCDMA B4 HSDPA@22.46dBm 578.7 mA

datatransfer(GNSS

OFF)

WCDMA B4 HSUPA@22.27dBm 576.4 mA

WCDMA B5 HSDPA@22.38dBm 492.0 mA

WCDMA B5 HSUPA@21.07dBm 483.2 mA

LTE-FDD B2 @23.17dBm 781.0 mA

LTE

datatransfer(GNSS

LTE-FDD B4 @23.05dBm 785.7 mA

OFF)

LTE-FDD B12 @23.3dBm 667.3 mA

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WCDMA B2 @23.61dBm 670.2 mA

WCDMA voice call

WCDMA B4 @23.21dBm 630.3 mA

WCDMA B5 @23.34dBm 536.7 mA

Table 35: GNSS Current Consumption of EC25 Series Module

Parameter Description Conditions Typ. Unit

Cold start @Passive Antenna 54.0 mA

Lost state @Passive Antenna 53.9 mA

Instrument Environment 30.5 mA

Open Sky @Passive Antenna 33.2 mA

VBAT

(GNSS)

Searching

(AT+CFUN=0)

Tracking

(AT+CFUN=0)

Open Sky @Active Antenna 40.8 mA

6.5. RF Output Power

The following table shows the RF output power of EC25 module.

Table 36: RF Output Power

Frequency Max. Min.

GSM900 33dBm±2dB 5dBm±5dB

DCS1800 30dBm±2dB 0dBm±5dB

GSM900(8-PSK) 27dBm±3dB 5dBm±5dB

DCS1800 26dBm±3dB 0dBm±5dB

WCDMA bands 23dBm+1/-3dB <-50dBm

LTE-FDD band5 23dBm+1/-3dB <-44dBm

LTE-FDD band7 22.5dBm+1/-3dB <-44dBm

LTE-TDD bands 23dBm+1/-3dB <-44dBm

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NOTE

In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the

GSM specification as described in Chapter 13.16of 3GPP TS 51.010-1.

6.6. RF Receiving Sensitivity

The following tables show conducted RF receiving sensitivity of EC25 series module.

Table 37: EC25-E Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO1) 3GPP (SIMO)

GSM900 -109.0dBm / / -102.0dBm

DCS1800 -109.0dBm / / -102.0dbm

WCDMA B1 -110.5dBm / / -106.7dBm

WCDMA B5 -110.5dBm / / -104.7dBm

WCDMA B8 -110.5dBm / / -103.7dBm

LTE-FDD B1(10M) -98.0dBm -98.0dBm -101.5dBm -96.3dBm

LTE-FDD B3(10M) -96.5dBm -98.5dBm -101.5dBm -93.3dBm

LTE-FDD B5(10M) -98.0dBm -98.5dBm -101.0dBm -94.3dBm

LTE-FDD B7(10M) -97.0dBm -94.5dBm -99.5dBm -94.3dBm

LTE-FDD B8(10M) -97.0dBm -97.0dBm -101.0dBm -93.3dBm

LTE-FDD B20(10M) -97.5dBm -99.0dBm -102.5dBm -93.3dBm

LTE-TDD B38 (10M) -96.7dBm -97.0dBm -100.0dBm -96.3dBm

LTE-TDD B40 (10M) -96.3dBm -98.0dBm -101.0dBm -96.3dBm

LTE-TDD B41 (10M) -95.2dBm -95.7dBm -99.0dBm -94.3dBm

Table 38: EC25-A Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP (SIMO)

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WCDMA B2 -110.0dBm / / -104.7dBm

WCDMA B4 -110.0dBm / / -106.7dBm

WCDMA B5 -110.5dBm / / -104.7dBm

LTE-FDD B2 (10M) -98.0dBm -98.0dBm -101.0dBm -94.3dBm

LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm

LTE-FDD B12 (10M) -96.5dBm -98.0dBm -101.0dBm -93.3dBm

Table 39: EC25-V Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP (SIMO)

LTE-FDD B4 (10M) -97.5dBm -99.0dBm -101.0dBm -96.3dBm

LTE-FDD B13 (10M) -95.0dBm -97.0dBm -100.0dBm -93.3dBm

Table 40: EC25-J Conducted RF Receiving Sensitivity

Frequency Primary Diversity SIMO 3GPP (SIMO)

WCDMA B1 -110.0dBm / / -106.7dBm

WCDMA B6 -110.5dBm / / -106.7dBm

WCDMA B8 -110.5dBm / / -106.7dBm

WCDMA B19 -110.5dBm / / -106.7dBm

LTE-FDD B1 (10M) -97.5dBm -98.7dBm -100.2dBm -96.3dBm

LTE-FDD B3 (10M) -96.5dBm -97.1dBm -100.5dBm -93.3dBm

LTE-FDD B8 (10M) -98.4dBm -99.0dBm -101.2dBm -93.3dBm

LTE-FDD B18 (10M) -99.5dBm -99.0dBm -101.7dBm -96.3dBm

LTE-FDD B19 (10M) -99.2dBm -99.0dBm -101.4dBm -96.3dBm

LTE-FDD B26 (10M) -99.5dBm -99.0dBm -101.5dBm -93.8dBm

LTE-TDD B41 (10M) -95.0dBm -95.7dBm -99.0dBm -94.3dBm

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NOTE

SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas

at the receiver side, which can improve RX performance.

6.7. Electrostatic Discharge

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject

to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be applied throughout the processing, handling and operation of any

application that incorporates the module.

The following table shows the module electrostatics discharge characteristics.

Table 41: Electrostatics Discharge Characteristics

Tested Points Contact Discharge Air Discharge Unit

VBAT, GND ±5 ±10 kV

All Antenna Interfaces ±4 ±8 kV

Other Interfaces ±0.5 ±1 kV

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7 Mechanical Dimensions

This chapter describes the mechanical dimensions of the module.All dimensions are measured in mm.

7.1. Mechanical Dimensions of the Module

(32+/-0.15)

2.4+/-0.2

(29+/-0.15)

0.8

Figure 40: Module Top and Side Dimensions

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32.0

1.30

3.85

2.49

1.8

2.15

5.96

1.6

1.7

6.75

0.82

4.88

4.4

3.2

1.05

1.15

3.4

3.35

3.5

1.30

2.0

3.0

2.8

1.10

4.8

3.23.43.2

1.8

29.0

0.8

3.5

1.9

2.4

3.45

1.5

Figure 41: Module Bottom Dimensions (Bottom View)

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7.2. Recommended Footprint

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1.90

7.80

1.80

15.60

3.85

3.00

24.70

1.10

2.00

3.00

3.45

3.40

4.80

1.80

2.80

0.50

Keepout area

0.50

4.80

3.20 3.40 3.20

3.40

0.80

2.50

1.00

1.90

3.20 3.40

3.50

1.30

32.0

Figure 42: Recommended Footprint (Top View)

NOTES

1. The keepout area should not be designed.

2. For easy maintenance of the module, please keep about 3mm between the module and other

components in thehost PCB.

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7.3. Design Effect Drawings of the Module

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Figure 43: Top View of the Module

Figure 44: Bottom View of the Module

NOTE

These are design effect drawings of EC25 module. For more accurate pictures, please refer to the

module that you get from Quectel.

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8 Storage, Manufacturing and

Packaging

8.1. Storage

EC25 is stored in a vacuum-sealed bag. The storage restrictionsare shown as below.

1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH.

2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other

high temperature processes must be:

 Mounted within 72 hours at the factory environment of ≤30ºC/60%RH.

 Stored at <10% RH.

3. Devices require bake before mounting, if any circumstances below occurs:

 When the ambient temperature is 23ºC±5ºC and the humidity indicator card shows the humidity

is >10% before opening the vacuum-sealed bag.

 Device mounting cannot be finished within 72 hours at factory conditions of ≤30ºC/60%RH.

4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.

NOTE

As the plastic packagecannot be subjected to high temperature, it should be removed from devices before

high temperature (125ºC) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033

for baking procedure.

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8.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the

stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted

properlyso as to produce a clean stencil surface on a single pass. To ensure the module soldering quality,

thethickness of stencil for the module is recommended to be 0.18mm. For more details, please refer

todocument [4].

It is suggested that the peak reflow temperature is 235 ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute

max reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is

suggested that the module should be mounted after reflow soldering for the other side of PCB has been

completed. Recommended reflow soldering thermal profile is shown below:

Figure 45: Reflow Soldering Thermal Profile

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8.3. Packaging

EC25 is packaged in tap andreel carriers. One reel is 11.53m long and contains 250pcs modules. The

figure below shows the package details, measured in mm.

±0.3

44.00

±0.15

20.20

±0.1

1.75

32.5

33.5

±0.15 ±0.15

48.5

2.00

±0.1

44.00

±0.1

4.00

±0.1

32.5± 0.15

33.5± 0.15

±0.15

29.3

±0.15

30.3

0.35± 0.05

4.2

3.1

±0.15

30.3

±0.15

Cover tap

Direction of feed

100

+0.20

44.5

-0.00

Figure 46: Tape and Reel Specifications

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EC25Hardware Design

9 Appendix A References

Table 42: Related Documents

SN Document Name Remark

LTE Module Series

[1]

[2] Quectel_EC25&EC21_AT_Commands_Manual EC25 and EC21 AT Commands Manual

[3]

[4] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide

[5] Quectel_EC25_Reference_Design EC25 Reference Design

[6] Quectel_RF_Layout_Application_Note RF Layout Application Note

[7] Quectel_SGMII_Design_Application_Note SGMII Desgin Application Note

Table 43: Terms and Abbreviations

Abbreviation Description

AMR Adaptive Multi-rate

Quectel_EC25_Power_Management_Application_

Note

Quectel_EC25&EC21_GNSS_AT_Commands_

Manual

EC25 Power Management Application

Note

EC25 and EC21 GNSS AT Commands

Manual

bps Bits Per Second

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear To Send

DC-HSPA+ Dual-carrier High Speed Packet Access

DFOTA Delta Firmware Upgrade Over The Air

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EC25Hardware Design

DL Downlink

DTR Data Terminal Ready

DTX Discontinuous Transmission

EFR Enhanced Full Rate

ESD Electrostatic Discharge

FDD Frequency Division Duplex

FR Full Rate

LTE Module Series

GLONASS

GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global

Navigation Satellite System

GMSK Gaussian Minimum Shift Keying

GNSS Global Navigation Satellite System

GPS Global Positioning System

GSM Global System for Mobile Communications

HR Half Rate

HSPA High Speed Packet Access

HSDPA High Speed Downlink Packet Access

HSUPA High Speed Uplink Packet Access

I/O Input/Output

Inorm Normal Current

LED Light Emitting Diode

LNA Low Noise Amplifier

LTE Long Term Evolution

MIMO Multiple Input Multiple Output

MO Mobile Originated

MS Mobile Station (GSM engine)

MT Mobile Terminated

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PAP Password Authentication Protocol

PCB Printed Circuit Board

PDU Protocol Data Unit

PPP Point-to-Point Protocol

QAM Quadrature Amplitude Modulation

QPSK Quadrature Phase Shift Keying

RF Radio Frequency

RHCP Right Hand Circularly Polarized

Rx Receive

LTE Module Series

SGMII Serial Gigabit Media IndependentInterface

SIM Subscriber Identification Module

SIMO Single Input Multiple Output

SMS Short Message Service

TDD Time Division Duplexing

TDMA Time Division Multiple Access

TD-SCDMA Time Division-Synchronous Code Division Multiple Access

TX Transmitting Direction

UL Uplink

UMTS Universal Mobile Telecommunications System

URC Unsolicited Result Code

USIM Universal Subscriber Identity Module

Vmax Maximum Voltage Value

Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VIHmax Maximum Input High Level Voltage Value

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EC25Hardware Design

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

LTE Module Series

VSWR Voltage Standing Wave Ratio

WCDMA Wideband Code Division Multiple Access

WLAN Wireless Local Area Network

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LTE Module Series

EC25Hardware Design

10 Appendix B GPRS Coding Schemes

Table 44: Description of Different Coding Schemes

Scheme

Code Rate

USF

Pre-coded USF

Radio Block excl.USF and BCS

BCS

Tail

Coded Bits

Punctured Bits

Data Rate Kb/s

CS-1 CS-2 CS-3 CS-4

1/2 2/3 3/4 1

3 3 3 3

3 6 6 12

181 268 312 428

40 16 16 16

4 4 4 -

456 588 676 456

0 132 220 -

9.05 13.4 15.6 21.4

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EC25Hardware Design

11 Appendix C GPRS Multi-slot Classes

Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot

classes are product dependent, and determine the maximum achievable data rates in both the uplink and

downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,

while the second number indicates the amount of uplink timeslots. The active slots determine the total

number of slots the GPRS device can use simultaneously for both uplink and downlink communications.

The description of different multi-slot classes is shown in the following table.

Table 45: GPRS Multi-slot Classes

Multislot Class Downlink Slots Uplink Slots Active Slots

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5

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9282245

LTE M

C25Hard

dule Sire

are Desig

Table 46:

Coding Sc

CS-1:

CS-2:

CS-3:

CS-4:

MCS-1

MCS-2

Ap Co

DGE Mod

eme Mo

endi ing

lation and

ulation

che

Coding Sc

Coding

emes

Family

Timeslot

.05kbps

13.4kbps

15.6kbps

1.4kbps

.80kbps

11.2kbps

ulati

2 Ti

18.1

26.8

31.2

42.8

17.6

22.4

ona

eslot

bps

kbps

bps

4 Timeslot

36.2kbps

53.6kbps

62.4kbps

85.6kbps

35.20kbps

44.8kbps

MCS-3

MCS-4

MCS-5

MCS-6

MCS-7

MCS-8

MCS-9

8-P

14.8kbps

17.6kbps

2.4kbps

9.6kbps

4.8kbps

4.4kbps

9.2kbps

29.6

35.2

44.8

59.2

89.6

108.

118.

bps

kbps

59.2kbps

70.4kbps

89.6kbps

118.4kbps

179.2kbps

217.6kbps

236.8kbps

EC25_Har

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Quectel Wireless Solutions 201708EC25E User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual