Quectel Wireless Solutions 201708EC25E User Manual

LTE

Rev.

Date:

EC25_H

2017-01

odule

eries

rdware

-24

Design

V1.3

w.quectel.

LTE Module Series

EC25Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233

Tel: +86 21 5108 6236

Email:info@quectel.com

Or our local office.For more information, please visit:

http://www.quectel.com/support/salesupport.aspx

For technical support, or to report documentation errors, please visit:

http://www.quectel.com/support/techsupport.aspx

Or email to: Support@quectel.com

GENERAL NOTES

QUECTEL OFFERS THEINFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT

TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT

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ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL

OR DESIGN.

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EC25Hardware Design

About the Document

History

Revision Date Author Description

1.0 2016-04-01 Woody WU Initial

LTE Module Series

1.1 2016-09-22

1.2 2016-11-04

Lyndon LIU/

Frank WANG

Lyndon LIU/

Michael ZHANG

1. Updated EC25 series frequency bands in Table 1.

2. Updated transmitting power, supported maximum

baud rate of main UART/internal protocols/USB

drivers of USB interface, firmware upgrade and

temperature range in Table 2.

3. Updated timing of turning on module in Figure 12.

4. Updated timing of turning off module in Figure 13.

5. Updated timing of resetting module in Figure 16.

6. Updated supported baud rates of main UART in

Chapter 3.11.

7. Added notes for ADC interface in Chapter 3.13.

8. Updated GNSS performance in Table 21.

9. Updated operating frequencies of module in Table 23.

10. Added current consumption in Chapter 6.4.

11. Updated RF output power in Chapter 6.5.

12. Added RF receiving sensitivity in Chapter 6.6.

1. Added SGMII and WLAN interfaces in Table 2.

2. Updated function diagram in Figure 1.

3. Updated pin assignment (Top View) in Figure 2.

4. Added description of SGMII and WLAN interfaces in

Table 4.

5. Added SGMII interface in Chapter 3.17.

6. Added WLAN interface in Chapter 3.18.

7. Added USB_BOOT interface in Chapter 3.19.

8. Added reference design of RF layout in Chapter 5.1.4.

9. Added note about SIMO in Chapter 6.6.

1.3 2017-01-24

EC25_Hardware_DesignConfidential / Released 2 / 90

Lyndon LIU/

Frank WANG

1. Updated function diagram in Figure 1.

2. Updated pin assignment (top view) in Figure 2.

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EC25Hardware Design

3. Added BT interface in Chapter 3.18.2.

4. Updated GNSS performance in Table 24.

5. Updated reference circuit of wireless connectivity

interfaces with FC20 module in Figure 29.

6. Updated current consumption of EC25-E module in

Table 33.

7. Updated EC25-A conducted RF receiving sensitivity

in Table 38.

8. AddedEC25-J conducted RF receiving sensitivity in

Table 40.

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Contents

About the Document ................................................................................................................................ 2

Contents .................................................................................................................................................... 4

Table Index ............................................................................................................................................... 6

Figure Index .............................................................................................................................................. 8

1 Introduction ..................................................................................................................................... 10

1.1. Safety Information ..................................................................................................................11

2 Product Concept ............................................................................................................................. 12

2.1. General Description .............................................................................................................. 12

2.2. Key Features ......................................................................................................................... 13

2.3. Functional Diagram ............................................................................................................... 15

2.4. Evaluation Board ................................................................................................................... 16

3 Application Interface ....................................................................................................................... 17

3.1. General Description .............................................................................................................. 17

3.2. Pin Assignment ..................................................................................................................... 18

3.3. Pin Description ...................................................................................................................... 19

3.4. Operating Modes .................................................................................................................. 28

3.5. Power Saving ........................................................................................................................ 28

3.5.1.

Sleep Mode.................................................................................................................. 28

3.5.1.1. UART Application ............................................................................................... 28

3.5.1.2. USB Application with USB Remote Wakeup Function ....................................... 29

3.5.1.3. USB Application with USB Suspend/Resume and RI Function .......................... 30

3.5.1.4. USB Application without USB Suspend Function ............................................... 31

3.5.2. Airplane Mode .............................................................................................................. 31

3.6. Power Supply ........................................................................................................................ 32

3.6.1. Power Supply Pins ....................................................................................................... 32

3.6.2. Decrease Voltage Drop ................................................................................................ 33

3.6.3. Reference Design for Power Supply ............................................................................ 34

3.6.4. Monitor the Power Supply ............................................................................................ 34

3.7. Turn on and off Scenarios ..................................................................................................... 34

3.7.1. Turn on Module Using the PWRKEY ........................................................................... 34

3.7.2. Turn off Module ............................................................................................................ 36

3.7.2.1. Turn off Module Using the PWRKEY Pin ........................................................... 36

3.7.2.2. Turn off Module Using AT Command ................................................................. 37

3.8. Reset the Module .................................................................................................................. 37

3.9. USIM Card Interface ............................................................................................................. 39

3.10. USB Interface ........................................................................................................................ 41

3.11. UART Interfaces .................................................................................................................... 43

3.12. PCM and I2C Interfaces ........................................................................................................ 45

3.13. ADC Function ........................................................................................................................ 47

3.14. Network Status Indication ..................................................................................................... 48

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3.15. STATUS ................................................................................................................................ 49

3.16. Behavior of the RI ................................................................................................................. 50

3.17. SGMII Interface ..................................................................................................................... 51

3.18. Wireless Connectivity Interfaces ........................................................................................... 53

3.18.1. WLAN Interface ........................................................................................................... 55

3.18.2. BT Interface* ................................................................................................................ 56

3.19. USB_BOOT Interface ............................................................................................................ 56

4 GNSS Receiver ................................................................................................................................ 58

4.1. General Description .............................................................................................................. 58

4.2. GNSS Performance .............................................................................................................. 58

4.3. Layout Guidelines ................................................................................................................. 59

5 Antenna Interfaces .......................................................................................................................... 60

5.1. Main/Rx-diversity Antenna Interface ..................................................................................... 60

5.1.1. Pin Definition ................................................................................................................ 60

5.1.2. Operating Frequency ................................................................................................... 60

5.1.3. Reference Design of RF Antenna Interface ................................................................. 61

5.1.4. Reference Design of RF Layout ................................................................................... 62

5.2. GNSS Antenna Interface ....................................................................................................... 64

5.3. Antenna Installation .............................................................................................................. 65

5.3.1. Antenna Requirement .................................................................................................. 65

5.3.2. Recommended RF Connector for Antenna Installation ................................................ 66

6 Electrical, Reliability and Radio Characteristics .......................................................................... 68

6.1. Absolute Maximum Ratings .................................................................................................. 68

6.2. Power Supply Ratings ........................................................................................................... 69

6.3. Operating Temperature ......................................................................................................... 69

6.4. Current Consumption ............................................................................................................ 70

6.5. RF Output Power .................................................................................................................. 73

6.6. RF Receiving Sensitivity ....................................................................................................... 74

6.7. Electrostatic Discharge ......................................................................................................... 76

7 Mechanical Dimensions.................................................................................................................. 77

7.1. Mechanical Dimensions of the Module.................................................................................. 77

7.2. Recommended Footprint ....................................................................................................... 79

7.3. Design Effect Drawings of the Module .................................................................................. 80

8 Storage, Manufacturing and Packaging ........................................................................................ 81

8.1. Storage ................................................................................................................................. 81

8.2. Manufacturing and Soldering ................................................................................................ 82

8.3. Packaging ............................................................................................................................. 83

9 Appendix A References .................................................................................................................. 84

10 Appendix B GPRS Coding Schemes ............................................................................................. 88

11 Appendix C GPRS Multi-slot Classes ............................................................................................ 89

12 Appendix D EDGE Modulation and Coding Schemes .................................................................. 90

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Table Index

TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ........................................................................ 12

TABLE 2: KEY FEATURES OF EC25 MODULE ............................................................................................... 13

TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 19

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19

TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 28

TABLE 6: VBAT AND GND PINS ....................................................................................................................... 32

TABLE 7: PWRKEY PIN DESCRIPTION .......................................................................................................... 35

TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 37

TABLE 9: PIN DEFINITION OF THE USIM CARD INTERFACE ...................................................................... 39

TABLE 10: PIN DESCRIPTION OF USB INTERFACE ..................................................................................... 41

TABLE 11: PIN DEFINITION OF THE MAIN UART INTERFACE ..................................................................... 43

TABLE 12: PIN DEFINITION OF THE DEBUG UART INTERFACE ................................................................. 43

TABLE 13:LOGIC LEVELS OF DIGITAL I/O ..................................................................................................... 44

TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ....................................................................... 46

TABLE 15: PIN DEFINITION OF THE ADC ...................................................................................................... 48

TABLE 16: CHARACTERISTIC OF THE ADC .................................................................................................. 48

TABLE 17: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ...................... 48

TABLE 18: WORKING STATE OF THE NETWORK CONNECTION STATUS/ACTIVITY INDICATOR ........... 49

TABLE 19: PIN DEFINITION OF STATUS ........................................................................................................ 50

TABLE 20: BEHAVIOR OF THE RI ................................................................................................................... 50

TABLE 21: PIN DEFINITION OF THE SGMII INTERFACE .............................................................................. 51

TABLE 22: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ................................................ 53

TABLE 23: PIN DEFINITION OF USB_BOOT INTERFACE ............................................................................. 56

TABLE 24: GNSS PERFORMANCE ................................................................................................................. 58

TABLE 25: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 60

TABLE 26: MODULE OPERATING FREQUENCIES ........................................................................................ 60

TABLE 27: PIN DEFINITION OF GNSS ANTENNA INTERFACE ..................................................................... 64

TABLE 28: GNSS FREQUENCY ....................................................................................................................... 64

TABLE 29: ANTENNA REQUIREMENTS .......................................................................................................... 65

TABLE 30: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 68

TABLE 31: THE MODULE POWER SUPPLY RATINGS .................................................................................. 69

TABLE 32: OPERATING TEMPERATURE ........................................................................................................ 69

TABLE 33: EC25-E CURRENT CONSUMPTION ............................................................................................. 70

TABLE 34: EC25-A CURRENT CONSUMPTION ............................................................................................. 72

TABLE 35: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE ................................................. 73

TABLE 36: RF OUTPUT POWER ..................................................................................................................... 73

TABLE 37: EC25-E CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 74

TABLE 38: EC25-A CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 74

TABLE 39: EC25-V CONDUCTED RF RECEIVING SENSITIVITY .................................................................. 75

TABLE 40: EC25-J CONDUCTED RF RECEIVING SENSITIVITY................................................................... 75

TABLE 41: ELECTROSTATICS DISCHARGE CHARACTERISTICS ............................................................... 76

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TABLE 42: RELATED DOCUMENTS ................................................................................................................ 84

TABLE 43: TERMS AND ABBREVIATIONS ...................................................................................................... 84

TABLE 44: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 88

TABLE 45: GPRS MULTI-SLOT CLASSES ...................................................................................................... 89

TABLE 46: EDGE MODULATION AND CODING SCHEMES ........................................................................... 90

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16

FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18

FIGURE 3: SLEEP MODE APPLICATION VIA UART ....................................................................................... 29

FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP .................................................... 30

FIGURE 5: SLEEP MODE APPLICATION WITH RI ......................................................................................... 30

FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION ................................................ 31

FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ...................................................... 33

FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 33

FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 34

FIGURE 10: TURN ON THE MODULE USING DRIVING CIRCUIT ................................................................. 35

FIGURE 11: TURN ON THE MODULE USING KEYSTROKE .......................................................................... 35

FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 36

FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 37

FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 38

FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 38

FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 38

FIGURE 17: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH AN 8-PIN USIM CARD

CONNECTOR .................................................................................................................................................... 40

FIGURE 18: REFERENCE CIRCUIT OF USIM CARD INTERFACE WITH A 6-PIN USIM CARD CONNECTOR

........................................................................................................................................................................... 40

FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 42

FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 44

FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT .............................................................. 45

FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 46

FIGURE 23: AUXILIARY MODE TIMING .......................................................................................................... 46

FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 47

FIGURE 25: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 49

FIGURE 26: REFERENCE CIRCUITS OF STATUS ......................................................................................... 50

FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION ............................................. 52

FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION ................. 52

FIGURE 29: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE

........................................................................................................................................................................... 55

FIGURE 30: REFERENCE CIRCUIT OF USB_BOOT INTERFACE ................................................................ 57

FIGURE 31: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................. 61

FIGURE 32: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 62

FIGURE 33: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 62

FIGURE 34: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE

GROUND) .......................................................................................................................................................... 63

FIGURE 35: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

GROUND) .......................................................................................................................................................... 63

FIGURE 36: REFERENCE CIRCUIT OF GNSS ANTENNA ............................................................................. 64



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FIGURE 37: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 66

FIGURE 38: MECHANICALS OF UF.L-LP CONNECTORS ............................................................................. 66

FIGURE 39: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 67

FIGURE 40: MODULE TOP AND SIDE DIMENSIONS ..................................................................................... 77

FIGURE 41: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ................................................................. 78

FIGURE 42: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 79

FIGURE 43: TOP VIEW OF THE MODULE ...................................................................................................... 80

FIGURE 44: BOTTOM VIEW OF THE MODULE .............................................................................................. 80

FIGURE 45: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 82

FIGURE 46: TAPE AND REEL SPECIFICATIONS ........................................................................................... 83

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1 Introduction

This document defines the EC25module and describes its air interface and hardware interface which are

connected with your application.

This document can help you quickly understand module interface specifications, electrical and

mechanical details, as well as other related information of EC25 module. Associated with application note

and user guide, you can use EC25 module to design and set up mobile applications easily.

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1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,

service or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular

terminal should send the following safety information to users and operating personnel, and incorporate

these guidelines into all manuals supplied with the product. If not so, Quectelassumes no liability for the

customer’s failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) causes

distraction and can lead to an accident. You must comply with laws and regulations

restricting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

switched off. The operation of wireless appliances in an aircraft is forbidden, so as

to prevent interference with communication systems. Consult the airline staff about

the use of wireless devices on boarding the aircraft, if your device offers an

Airplane Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals,clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment.

Cellular terminals or mobiles operatingover radio frequency signal and cellular

network cannot be guaranteed to connect in all conditions, for example no mobile

fee or with an invalid USIM/SIM card. While you are in this condition and need

emergent help, please remember using emergency call. In order to make or

receive a call, the cellular terminal or mobile must be switched on and in a service

area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,

it receives and transmits radio frequency energy. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn

off wireless devices such as your phone or other cellular terminals. Areas with

potentially explosive atmospheres include fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders, etc.

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EC25Hardware Design

2 Product Concept

2.1. General Description

EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive

diversity, which provides data connectivity on LTE-FDD,LTE-TDD,DC-HSPA+, HSPA+, HSDPA, HSUPA,

WCDMA,EDGE andGPRSnetworks. It also provides GNSS

application.EC25 contains fivevariants:EC25-E, EC25-A, EC25-V, EC25-Jand EC25-AU. You can choose

a dedicated type based on the region or operator. The following table shows the frequency bands of EC25

series module.

and voice functionality2) for your specific

Table 1: Frequency Bands of EC25 Series Module

Modules2) LTE Bands 3G Bands GSM

EC25-E

EC25-A

EC25-V

EC25-J

EC25-AU3)

NOTES

FDD:B1/B3/B5/B7/B8/

B20

TDD: B38/B40/B41

FDD: B2/B4/B12

FDD: B4/B13 Not supported Not supported Supported

FDD: B1/B3/B8/B18/B19/

B26

TDD: B41

FDD: B1/B2/B3/B4/B5/B7/

B8/B28

TDD: B40

WCDMA:

B1/B5/B8

WCDMA:

B2/B4/B5

WCDMA:

B1/B6/B8/

B19

WCDMA:

B1/B2/B5/B8

900/1800 Supported

Not supported Supported

850/900/

1800/1900

Rxdiversity

Supported

GNSS1)

GPS,

GLONASS,

BeiDou/

Compass,

Galileo,

QZSS

GNSS function is optional.

EC25_Hardware_DesignConfidential / Released 12 / 90

EC25 series module (EC25-E/EC25-A/EC25-V/EC25-J/EC25-AU) includes Data-only and

Telematics versions. Data-only version does not support voice function, while Telematics version

supports it.

B2 band on EC25-AU module does not support Rx-diversity.

LTE Module Series

EC25Hardware Design

With a tiny profile of 32.0mm ×29.0mm ×2.4mm, EC25 can meet almost all requirements for M2M

applications such as automotive, metering, tracking system, security, router, wireless POS, mobile

computing device, PDA phone, tablet PC, etc.

EC25 is an SMD type module which can be embedded in applications through its 144-pin pads, including

80 LCC signal pads and 64 other pads.

2.2. Key Features

The following table describes the detailed features of EC25 module.

Table 2: Key Features of EC25 Module

Feature Details

Power Supply Supply voltage: 3.3V~4.3VTypical supply voltage: 3.8V

Class 4 (33dBm±2dB) for GSM900

Class 1 (30dBm±2dB) for DCS1800

Class E2 (27dBm±3dB) for GSM900 8-PSK

Transmitting Power

Class E2 (26dBm±3dB) for DCS1800 8-PSK

Class 3 (23dBm+1/-3dB) for WCDMA bands

Class 3 (23dBm+1/-3dB) for LTE-FDD band5

Class 3 (22.5dBm+1/-3dB) for LTE-FDD band7

Class 3 (23dBm+1/-3dB) for LTE-TDD bands

Support up to non-CA CAT4

Support 1.4 to 20MHz RF bandwidth

LTE Features

Support MIMO in DL direction

FDD: Max 50Mbps (UL), 150Mbps (DL)

TDD: Max 35Mbps (UL), 130Mbps (DL)

Support 3GPP R8 DC-HSPA+

WCDMA Features

Support 16-QAM, 64-QAM and QPSKmodulation

3GPP R6 CAT6 HSUPA: Max 5.76Mbps (UL)

3GPP R8 CAT24 DC-HSPA+: Max 42Mbps (DL)

R99:

CSD: 9.6kbps, 14.4kbps

GPRS:

GSMFeatures

Support GPRS multi-slot class 12 (12 by default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Maximum of four Rx time slots per frame

EDGE:

Support EDGE multi-slot class 12 (12 by default)

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EC25Hardware Design

Support GMSK and 8-PSK for different MCS (Modulation and Coding

Scheme)

Downlink coding schemes: CS 1-4 and MCS 1-9

Uplink coding schemes: CS 1-4 and MCS 1-9

SupportTCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS*/SMTP*/MMS*

/FTPS*/SMTPS*/SSL*protocols

Internet Protocol Features

Support the protocols PAP (Password Authentication Protocol) and CHAP

(Challenge Handshake Authentication Protocol) usually used for PPP

connections

Text and PDU mode

SMS

Point to point MO and MT

SMS cell broadcast

SMS storage: ME by default

USIM Interface Support USIM/SIM card: 1.8V, 3.0V

Support one digital audio interface: PCM interface

GSM: HR/FR/EFR/AMR/AMR-WB

Audio Features

WCDMA: AMR/AMR-WB

LTE: AMR/AMR-WB

Support echo cancellation and noise suppression

LTE Module Series

PCM Interface

USB Interface

UART Interface

Used for audio function with external codec

Support 8-bit A-law*, μ-law*and 16-bit linear data formats

Support long frame synchronization and short frame synchronization

Support master and slave modes, but must be the master in long frame

synchronization

Compliant with USB 2.0 specification (slave only);the data transfer rate can

reach up to 480Mbps

Used for AT command communication, data transmission, GNSS NMEA

output, software debugging, firmware upgrade and voiceover USB*

Support USB drivers for: Windows XP, Windows Vista, Windows 7,

Windows 8/8.1, Windows 10, Linux 2.6 or later, Android

4.0/4.2/4.4/5.0/5.1/6.0

Main UART:

Used for AT command communication and data transmission

Baud rate reach up to 3000000bps, 115200bps by default

Support RTS and CTS hardware flow control

Debug UART:

Used for Linux console, log output

115200bps baud rate

SGMII Interface Support 10/100/1000Mbps Ethernet connectivity

Wireless Connectivity

Interfaces

Support a low-power SDIO 3.0 interface for WLAN and UART/PCM

interface for Bluetooth*

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EC25Hardware Design

Rx-diversity Support LTE/WCDMA Rx-diversity

LTE Module Series

GNSS Features

AT Commands

Network Indication

Antenna Interface

Physical Characteristics

Temperature Range

Gen8CLite of Qualcomm

Protocol: NMEA 0183

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT

commands

Two pins including NET_MODE and NET_STATUS to indicate network

connectivity status

Including main antenna interface (ANT_MAIN), Rx-diversityantenna

interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)

Size: 32.0±0.15×29.0±0.15×2.4±0.2mm

Weight: approx. 4.9g

Operation temperature range: -35°C ~ +75°C

Extended temperature range: -40°C ~ +85°C

Firmware Upgrade USB interface and DFOTA*

RoHS All hardware components are fully compliant with EU RoHS directive

NOTES

Within operation temperature range, the module is 3GPP compliant.

Within extended temperature range, the module remains the ability to establish and maintain a

voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There

are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like

might reduce in their value and exceed the specified tolerances. When the temperature returns to

out

the normal operating temperature levels, the module will meet 3GPP compliant again.

3. “*” means under development.

2.3. Functional Diagram

The following figure shows a block diagram of EC25 and illustrates the major functional parts.

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EC25Hardware Design

 Power management

 Baseband

 DDR+NAND flash

 Radio frequency

 Peripheral interfaces

LTE Module Series

ANT_MAIN ANT_DIVANT_GNSS

VBAT_RF

VBAT_BB

PWRKEY

RESET_N

ADCs

STATUS

APT

PMIC

Control

19.2M

Switch

Duplex

PRx DRx

SAW

LNA

Transceiver

IQ Control

Baseband

Switch

SAW

NAND DDR2

SDRAM

VDD_EXT

USB

USIM

PCM

SGMII

WLAN

I2C

UART

GPIOs

Figure 1: Functional Diagram

2.4. Evaluation Board

In order to help youto develop applications with EC25, Quectel supplies an evaluation board (EVB), USB

data cable, earphone, antenna and other peripherals to control or test the module.

EC25_Hardware_DesignConfidential / Released 16 / 90

LTE Module Series

EC25Hardware Design

3 Application Interface

3.1. General Description

EC25 is equipped with 80-pin SMT pads plus 64-pin ground pads and reserved pads that can

beconnected to cellular application platform. Sub-interfaces included in these pads are described in detail

in the following chapters:

 Power supply

 USIM interface

 USB interface

 UART interfaces

 PCM interface

 ADC interface

 Status indication

 SGMII interface

 Wireless connectivityinterfaces

 USB_BOOT interface

EC25_Hardware_DesignConfidential / Released 17 / 90

EC25Hardware Design

3.2. Pin Assignment

The following figure shows the pin assignment of EC25 module.

LTE Module Series

WAKEUP_IN

AP_READY

RESERVED

W_DISABLE#

NET_MODE

NET_STATUS

VDD_EXT

RESERVED

GND

USIM_GND

DBG_RXD

DBG_TXD

USIM_PRESENCE

USIM_VDD

USIM_DATA

USIM_CLK

USIM_RST

RESERVED

141

142

129

130

131

132

133

134

135

136

137

138

117

118

119

120

121

122

123

124

125

126

108

109

110

111

103

104

105

106

100

101

139

140

127

128

112

107

102

144

143

GND

ANT_MAIN

GND

RESERVED

ANT_GNSS

GND

ADC0

ADC1

RESERVED

I2C_SDA

I2C_SCL

BT_CTS

BT_RXD

BT_TXD

BT_RTS

GND Pins

WLAN Pins Bluetooth Pins

Signal Pins RESERVED Pins

Power Pins

SGMII Pins

Figure 2: Pin Assignment (Top View)

NOTES

1. 1)meansthat these pins cannot be pulled up before startup.

PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.

3. Pads 119~126 are SGMII function pins.

4. Pads 37~40, 118, 127 and 129~139 are wireless connectivity interfaces, among which pads 127 and

129~138 are WLAN function pins, and others are Bluetooth (BT) function pins. BT function is under

development.

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LTE Module Series

EC25Hardware Design

5. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20

module.

6. Keep all RESERVEDpins and unused pins unconnected.

7. GND pads 85~112 should be connected to ground in the design, and RESERVED pads 73~84should

not be designed in schematic and PCB decal.

※

8. “

”means these interface functions are only supported on Telematics version.

3.3. Pin Description

The following tables show the pin definition of EC25 modules.

Table 3: I/O Parameters Definition

Type Description

IO Bidirectional

DI Digital input

DO Digital output

PI Power input

PO Power output

AI Analog input

AO Analog output

OD Open drain

Table 4: Pin Description

Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment

VBAT_BB 59,60 PI

VBAT_RF 57,58 PI

Power supply for

module baseband

part

Power supply for

module RF part

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

It must be able to

provide sufficient

current up to 0.8A.

It must be able to

provide sufficient

current up to 1.8A in a

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LTE Module Series

EC25Hardware Design

bursttransmission.

Power supply for

external GPIO’s pull up

circuits.

VDD_EXT 7 PO

Provide 1.8V for

external circuit

Vnorm=1.8V

max=50mA

8,9,19,22,3

GND

6,46,48,50

~54,56,72,

Ground

85~112

Turn on/off

Pin Name Pin No. I/O Description DC Characteristics Comment

The output voltage is

0.8V because of the

diode drop in the

Qualcomm chipset.

PWRKEY 21 DI

Turnon/off the

module

RESET_N 20 DI Reset the module

max=2.1V

min=1.3V

max=0.5V

max=2.1V

min=1.3V

max=0.5V

Status Indication

Pin Name Pin No. I/O Description DC Characteristics Comment

STATUS 61 OD

Indicate the module

operating status

The drive current

should be less than

0.9mA.

Require external

pull-up. If unused,

keep it open.

1.8V power domain.

Cannot be pulled up

before startup.

If unused, keep it

NET_MODE 5 DO

Indicate the module

network registration

mode

min=1.35V

max=0.45V

open.

NET_

STATUS

Indicate the module

6 DO

network activity

status

min=1.35V

max=0.45V

1.8V power domain.

If unused, keep it

open.

USB Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

Vmax=5.25V

USB_VBUS 71 PI USB detection

Vmin=3.0V

Vnorm=5.0V

USB_DP 69 IO

USB differential data

bus

Compliant with USB

2.0 standard

specification.

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Require differential

impedance of 90ohm.

LTE Module Series

EC25Hardware Design

USB_DM 70 IO

USB differential data

bus

Compliant with USB

2.0 standard

specification.

Require differential

impedance of 90ohm.

USIM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

USIM_GND 10

Specified ground for

USIM card

For 1.8V USIM:

Vmax=1.9V

USIM_VDD 14 PO

Power supply for

USIM card

Vmin=1.7V

For 3.0V USIM:

Vmax=3.05V

Either 1.8V or 3.0V is

supported by the

module automatically.

Vmin=2.7V

max=50mA

For 1.8V USIM:

max=0.6V

min=1.2V

max=0.45V

min=1.35V

For 3.0V USIM:

max=1.0V

min=1.95V

max=0.45V

min=2.55V

USIM_DATA 15 IO

Data signal of USIM

card

For 1.8V USIM:

max=0.45V

min=1.35V

For 3.0V USIM:

max=0.45V

min=2.55V

USIM_CLK 16 DO

Clock signal of USIM

card

For 1.8V USIM:

max=0.45V

min=1.35V

For 3.0V USIM:

max=0.45V

min=2.55V

min=-0.3V

max=0.6V

1.8V power domain.

If unused, keep it

USIM_RST 17 DO

USIM_

PRESENCE

13 DI

Reset signal of

USIM card

USIM card insertion

detection

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LTE Module Series

EC25Hardware Design

VIHmin=1.2V

open.

VIHmax=2.0V

UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

RI 62 DO Ring indicator

DCD 63 DO

Data carrier

detection

CTS 64 DO Clear to send

RTS 65 DI Request to send

max=0.45V

min=1.35V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Data terminal

DTR 66 DI

ready,sleep mode

control

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

Pull-up by default.

Low level wakes up

the module.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

TXD 67 DO Transmit data

RXD 68 DI Receive data

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

Debug UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

DBG_TXD 12 DO Transmit data

DBG_RXD 11 DI Receive data

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

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LTE Module Series

EC25Hardware Design

ADC Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

General purpose

ADC0 45 AI

analog to digital

converter

General purpose

ADC1 44 AI

analog to digital

converter

Voltage range:

0.3V to VBAT_BB

Voltage range:

0.3V to VBAT_BB

If unused, keep it

open.

If unused, keep it

open.

PCM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

min=-0.3V

PCM_IN 24 DI PCM data input

PCM_OUT 25 DO PCM data output

PCM data frame

PCM_SYNC 26 IO

synchronization signal

PCM_CLK 27 IO PCM clock

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

VOLmax=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal. If unused, keep it open.

1.8V power domain. In master mode, it is an output signal. In slave mode, it is an input signal.

If unused, keep it

open.

I2C Interface Pin Name Pin No. I/O Description DC Characteristics Comment

I2C serial clock

I2C_SCL 41 OD

Used for external

codec.

External pull-up

resistor is required.

1.8V only. If unused,

keep it open.

External pull-up

I2C_SDA 42 OD

I2C serial dataUsed

for external codec.

resistor is required.

1.8V only. If unused,

keep it open.

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LTE Module Series

EC25Hardware Design

SGMII Interface Pin Name Pin No. I/O Description DC Characteristics Comment

For 1.8V:

max=0.45V

EPHY_RST_

119 DO Ethernet PHY reset

EPHY_INT_N 120 DI

Ethernet PHY

interrupt

VOHmin=1.4V

For 2.85V:

max=0.35V

min=2.14V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

1.8V/2.85V power

domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

For 1.8V:

max=0.45V

min=1.4V

max=0.58V

SGMII_

MDATA

SGMII MDIO

121 IO

(Management Data

Input/Output) data

min=1.27V

For 2.85V:

max=0.35V

min=2.14V

max=0.71V

min=1.78V

1.8V/2.85V power

domain.

If unused, keep it

open.

For 1.8V:

max=0.45V

SGMII_

MCLK

SGMII MDIO

122 DO

(Management Data

Input/Output) clock

min=1.4V

For2.85V:

max=0.35V

min=2.14V

1.8V/2.85V power

domain.

If unused, keep it

open.

Configurable power

source.

1.8V/2.85V power

USIM2_VDD 128 PO

SGMII MDIO pull-up

power source

domain.

External pull-up for

SGMII MDIO pins.

If unused, keep it

open.

SGMII_TX_M 123 AO

SGMII transmission

- minus

If unused, keep it

open.

SGMII_TX_P 124 AO SGMII transmission If unused, keep it

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LTE Module Series

EC25Hardware Design

- plus open.

SGMII_RX_P 125 AI

SGMII_RX_M 126 AI

SGMII receiving

- plus

SGMII receiving

-minus

If unused, keep it

open.

If unused, keep it

open.

Wireless Connectivity Interfaces Pin Name Pin No. I/O Description DC Characteristics Comment

max=0.45V

min=1.35V

SDC1_

DATA3

SDC1_

DATA2

SDC1_

DATA1

SDC1_

DATA0

129 IO SDIO data bus D3

130 IO SDIO data bus D2

131 IO SDIO data bus D1

132 IO SDIO data bus D0

SDC1_CLK 133 DO SDIO clock

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

max=0.45V

SDC1_CMD 134 DO SDIO command

PM_ENABLE 127 DO

WAKE_ON_

WIRELESS

135 DI

External power

control

Wake up the host

(EC25 module) by

max=0.45V

min=-0.3V

max=0.6V

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min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

Active low.

LTE Module Series

EC25Hardware Design

FC20 module. VIHmin=1.2V

WLAN function

WLAN_EN 136 DO

control via FC20

module

COEX_UART

_RX

COEX_UART

_TX

WLAN_SLP_

CLK

137 DI

138 DO

118 DO WLAN sleep clock

BT_RTS* 37 DI

BT_TXD* 38 DO

LTE/WLAN&BT

coexistence signal

LTE/WLAN&BT

coexistence signal

BT UART request to

send

BT UART transmit

data

VIHmax=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

If unused, keep it

open.

1.8V power domain.

Active high.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

min=-0.3V

BT_RXD* 39 DI

BT_CTS* 40 DO

BT_EN* 139 DO

BT UART receive

data

BT UART clear to

send

BT function control

via FC20 module

max=0.6V

min=1.2V

max=2.0V

max=0.45V

min=1.35V

max=0.45V

min=1.35V

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

1.8V power domain.

If unused, keep it

open.

RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment

ANT_DIV 35 AI Diversity antenna 50ohm impedance

If unused, keep it

open.

ANT_MAIN 49 IO Main antenna 50ohm impedance

ANT_GNSS 47 AI GNSS antenna 50 ohm impedance

If unused, keep it

open.

GPIO Pins

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LTE Module Series

EC25Hardware Design

Pin Name Pin No. I/O Description DC Characteristics Comment

1.8V power domain.

Cannot be pulled up

before startup.

Low level wakes up

the module.

If unused, keep it

WAKEUP_IN 1 DI Sleep mode control

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

open.

1.8V power domain.

Pull-up by default.

In low voltage level,

module can enter into

airplane mode.

If unused, keep it

open.

W_DISABLE# 4 DI

Airplane mode

control

min=-0.3V

max=0.6V

min=1.2V

max=2.0V

min=-0.3V

AP_READY 2 DI

Application

processor sleep

state detection

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

USB_BOOT Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

min=-0.3V

USB_BOOT 115 DI

Force the module to

boot from USB port

max=0.6V

min=1.2V

max=2.0V

1.8V power domain.

If unused, keep it

open.

RESERVED Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

3, 18, 23,

28~34, 43,

RESERVED

55, 73~84,

113, 114,

Reserved

Keep these pins

unconnected.

116, 117,

140~144

NOTES

1. “*” means under development.

2. Pads 24~27 are multiplexing pins used for audio design on EC25 module and BT function on FC20

module.

EC25_Hardware_DesignConfidential / Released 27 / 90

+ 63 hidden pages

Quectel Wireless Solutions 201708EC25E User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual