Quectel Wireless Solutions 201404UC15 Users Manual

UC15 Hardware Design

UMTS/HSDPA Module Series

Rev. UC15_Hardware_Design_V1.3

Date: 2014-04-21

www.quectel.com

UMTS/HSDPA Module Series

UC15 Hardware Design

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About the Document

History

Revision Date Author Description

1.0 2013-11-26 Mountain ZHOU Initial

1． Modified packaging information of UC15 in the

Chapter 7.3.

1.1 2014-01-15 Huik LI

1.2 2014-02-14 Huik LI Modified the frequency bands of UC15-A.

1.3 2014-04-21 Huik LI

2． Modified Figure 4 and Figure 11.

3． Modified the description of command AT+CFUN

in the Chapter 3.5.2.

1. Modified current consumption in Chapter 5.4.

2. Added PCM feature in Chapter 3.12.

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Contents

About the Document ................................................................................................................................ 2

Contents .................................................................................................................................................... 3

Table Index ............................................................................................................................................... 6

Figure Index .............................................................................................................................................. 7

1 Introduction ....................................................................................................................................... 9

1.1. Safety Information ................................................................................................................... 9

2 Product Concept ............................................................................................................................. 11

2.1. General Description ...............................................................................................................11

2.2. Directives and Standards ...................................................................................................... 12

2.2.1. FCC Statement ............................................................................................................ 12

2.2.2. FCC Radiation Exposure Statement ............................................................................ 12

2.3. Key Features ......................................................................................................................... 13

2.4. Functional Diagram ............................................................................................................... 15

2.5. Evaluation Board ................................................................................................................... 16

3 Application Interface ....................................................................................................................... 17

3.1. General Description .............................................................................................................. 17

3.2. Pin Assignment ..................................................................................................................... 18

3.3. Pin Description ...................................................................................................................... 19

3.4. Operating Modes .................................................................................................................. 24

3.5. Power Saving ........................................................................................................................ 25

3.5.1. Sleep Mode.................................................................................................................. 25

3.5.1.1. UART Application ............................................................................................... 25

3.5.1.2. USB Application with Suspend Function ............................................................ 26

3.5.1.3. USB Application without Suspend Function ....................................................... 27

3.5.2. Minimum Functionality Mode ....................................................................................... 27

3.6. Power Supply ........................................................................................................................ 28

3.6.1. Power Supply Pins ....................................................................................................... 28

3.6.2. Decrease Voltage Drop ................................................................................................ 28

3.6.3. Reference Design for Power Supply ............................................................................ 29

3.6.4. Monitor the Power Supply ............................................................................................ 30

3.6.5. VDD_EXT .................................................................................................................... 30

3.7. Turn on and off Scenarios ..................................................................................................... 30

3.7.1. Turn on Module by PWRKEY Pin ................................................................................ 30

3.7.2. Turn off Module ............................................................................................................ 32

3.7.2.1. Turn off Module by PWRKEY Pin ...................................................................... 32

3.7.2.2. Turn off Module by AT Command ...................................................................... 33

3.7.2.3. Automatic Shutdown .......................................................................................... 33

3.8. Reset the Module .................................................................................................................. 34

3.9. UART Interface ..................................................................................................................... 35

3.9.1. The Connection of UART ............................................................................................. 36

3.9.2. UART Application ......................................................................................................... 38

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3.10. Behavior of the RI ................................................................................................................. 39

3.11. Analog Audio Interface .......................................................................................................... 40

3.11.1. Decrease TDD Noise and Other Noise ........................................................................ 41

3.11.2. Microphone Interfaces Application ............................................................................... 42

3.11.3. Receiver and Speaker Interface Application ................................................................ 43

3.11.4. Earphone Interface Application .................................................................................... 45

3.12. PCM and I2C Interface .......................................................................................................... 46

3.13. USIM Card Interface ............................................................................................................. 48

3.13.1. USIM Card Application ................................................................................................. 48

3.13.2. Design Considerations for USIM Card Holder ............................................................. 50

3.14. USB Interface ........................................................................................................................ 53

3.15. ADC Function ........................................................................................................................ 54

3.16. Network Status Indication ...................................................................................................... 55

3.17. Operating Status Indication ................................................................................................... 56

4 Antenna Interface ............................................................................................................................ 58

4.1. Antenna Interface .................................................................................................................. 58

4.1.1. Pin Definition ................................................................................................................ 58

4.1.2. Operating Frequency ................................................................................................... 58

4.1.3. Reference Design ........................................................................................................ 58

4.2. Antenna Installation ............................................................................................................... 59

4.2.1. Antenna Requirement .................................................................................................. 59

4.2.2. Install the Antenna with RF Connector ......................................................................... 59

5 Electrical, Reliability and Radio Characteristics .......................................................................... 62

5.1. Absolute Maximum Ratings .................................................................................................. 62

5.2. Power Supply Ratings ........................................................................................................... 63

5.3. Operating Temperature ......................................................................................................... 63

5.4. Current Consumption ............................................................................................................ 64

5.5. RF Output Power .................................................................................................................. 65

5.6. RF Receiving Sensitivity ....................................................................................................... 65

5.7. Electrostatic Discharge ......................................................................................................... 66

6 Mechanical Dimensions.................................................................................................................. 67

6.1. Mechanical Dimensions of the Module.................................................................................. 67

6.2. Footprint of Recommendation ............................................................................................... 69

6.3. Top View of the Module ......................................................................................................... 70

6.4. Bottom View of the Module ................................................................................................... 70

7 Storage and Manufacturing ............................................................................................................ 71

7.1. Storage.................................................................................................................................. 71

7.2. Manufacturing and Welding .................................................................................................. 71

7.3. Packaging ............................................................................................................................. 72

8 Appendix A Reference .................................................................................................................... 74

9 Appendix B GPRS Coding Scheme ............................................................................................... 77

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10 Appendix C GPRS Multi-slot Class ................................................................................................ 78

11 Appendix D EDGE Modulation and Coding Scheme .................................................................... 79

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Table Index

TABLE 1: FREQUENCY BANDS OF UC15 SERIES ......................................................................................... 11

TABLE 2: UC15 KEY FEATURES ..................................................................................................................... 13

TABLE 3: IO PARAMETERS DEFINITION ........................................................................................................ 19

TABLE 4: PIN DESCRIPTION ........................................................................................................................... 19

TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 24

TABLE 6: VBAT AND GND PIN ......................................................................................................................... 28

TABLE 7: ELECTRICAL CHARACTERISTICS OF VDD_EXT ......................................................................... 30

TABLE 8: PWRKEY PIN DESCRIPTION .......................................................................................................... 30

TABLE 9: RESET_N PIN DESCRIPTION ......................................................................................................... 34

TABLE 10: PIN DEFINITION OF THE UART INTERFACE ............................................................................... 35

TABLE 11: LOGIC LEVELS OF DIGITAL I/O .................................................................................................... 36

TABLE 12: BEHAVIOR OF THE RI ................................................................................................................... 40

TABLE 13: PIN DEFINITION OF THE AUDIO INTERFACE ............................................................................. 40

TABLE 14: MICROPHONE CHARACTERISTICS............................................................................................. 45

TABLE 15: SPEAKER CHARACTERISTICS .................................................................................................... 45

TABLE 16: PIN DEFINITION OF PCM AND I2C INTERFACE .......................................................................... 47

TABLE 17: PIN DEFINITION OF THE USIM INTERFACES ............................................................................. 48

TABLE 18: PIN DESCRIPTION OF MOLEX USIM CARD HOLDER ................................................................ 51

TABLE 19: PIN DESCRIPTION OF AMPHENOL USIM CARD HOLDER ........................................................ 52

TABLE 20: USB PIN DESCRIPTION ................................................................................................................ 53

TABLE 21: PIN DEFINITION OF THE ADC ...................................................................................................... 55

TABLE 22: CHARACTERISTICS OF THE ADC ................................................................................................ 55

TABLE 23: PIN DEFINITION OF NETWORK INDICATOR ............................................................................... 55

TABLE 24: WORKING STATE OF THE NETWORK INDICATOR .................................................................... 55

TABLE 25: PIN DEFINITION OF STATUS ........................................................................................................ 56

TABLE 26: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 58

TABLE 27: MODULE OPERATING FREQUENCIES ........................................................................................ 58

TABLE 28: ANTENNA REQUIREMENTS .......................................................................................................... 59

TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 62

TABLE 30: THE MODULE POWER SUPPLY RATINGS .................................................................................. 63

TABLE 31: OPERATING TEMPERATURE ........................................................................................................ 63

TABLE 32: MODULE CURRENT CONSUMPTION .......................................................................................... 64

TABLE 33: MODULE CONDUCTED RF OUTPUT POWER ............................................................................. 65

TABLE 34: MODULE CONDUCTED RECEIVING SENSITIVITY ..................................................................... 65

TABLE 35: ELECTROSTATICS DISCHARGE CHARACTERISTICS ............................................................... 66

TABLE 36: RELATED DOCUMENTS ................................................................................................................ 74

TABLE 37: TERMS AND ABBREVIATIONS ...................................................................................................... 74

TABLE 38: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 77

TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. 78

TABLE 40: EDGE MODULATION AND CODING SCHEME ............................................................................. 79

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 16

FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 18

FIGURE 3: UART SLEEP APPLICATION ......................................................................................................... 26

FIGURE 4: USB APPLICATION WITH SUSPEND FUNCTION ........................................................................ 26

FIGURE 5: USB SLEEP APPLICATION WITHOUT SUSPEND FUNCTION .................................................... 27

FIGURE 6: STAR STRUCTURE OF THE POWER SUPPLY ............................................................................ 29

FIGURE 7: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 29

FIGURE 8: TURN ON THE MODULE BY DRIVING CIRCUIT.......................................................................... 31

FIGURE 9: TURN ON THE MODULE BY KEYSTROKE .................................................................................. 31

FIGURE 10: TIMING OF TURNING ON MODULE ........................................................................................... 32

FIGURE 11: TIMING OF TURNING OFF MODULE .......................................................................................... 33

FIGURE 12: REFERENCE CIRCUIT OF RESET_N ........................................................................................ 34

FIGURE 13: TIMING OF RESETTING MODULE ............................................................................................. 35

FIGURE 14: CONNECTION OF FULL FUNCTIONAL UART PORT ................................................................ 36

FIGURE 15: CONNECTION OF THREE LINES UART PORT ......................................................................... 37

FIGURE 16: CONNECTION OF UART PORT WITH HARDWARE FLOW CONTROL .................................... 37

FIGURE 17: 3.3V LEVEL MATCH CIRCUIT ..................................................................................................... 38

FIGURE 18: 5V LEVEL MATCH CIRCUIT ........................................................................................................ 38

FIGURE 19: RS232 LEVEL SHIFT CIRCUIT .................................................................................................... 39

FIGURE 20: RI BEHAVIOR ............................................................................................................................... 40

FIGURE 21: MICROPHONE REFERENCE DESIGN FOR AIN1&AIN2 ........................................................... 42

FIGURE 22: REFERENCE DESIGN FOR AOUT1 ........................................................................................... 43

FIGURE 23: REFERENCE DESIGN WITH AN AMPLIFIER FOR AOUT1 ....................................................... 43

FIGURE 24: REFERENCE DESIGN FOR AOUT2 ........................................................................................... 44

FIGURE 25: REFERENCE DESIGN WITH AN AMPLIFIER FOR AOUT2 ....................................................... 44

FIGURE 26: REFERENCE DESIGN FOR AN EARPHONE ............................................................................. 45

FIGURE 27: PRIMARY MODE TIMING ............................................................................................................ 46

FIGURE 28: AUXILIARY MODE TIMING .......................................................................................................... 47

FIGURE 29: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC .................................... 48

FIGURE 30: REFERENCE CIRCUIT OF THE 8-PIN USIM CARD .................................................................. 49

FIGURE 31: REFERENCE CIRCUIT OF THE 6-PIN USIM CARD .................................................................. 50

FIGURE 32: MOLEX 91228 USIM CARD HOLDER ......................................................................................... 51

FIGURE 33: AMPHENOL C707 10M006 512 2 USIM CARD HOLDER ........................................................... 52

FIGURE 34: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 53

FIGURE 35: TEST POINTS OF FIRMWARE UPGRADE ................................................................................. 54

FIGURE 36: REFERENCE CIRCUIT OF THE NETWORK INDICATOR .......................................................... 56

FIGURE 37: REFERENCE CIRCUIT OF THE STATUS ................................................................................... 57

FIGURE 38: REFERENCE CIRCUIT OF ANTENNA INTERFACE ................................................................... 59

FIGURE 39: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) ................................................ 60

FIGURE 40: MECHANICALS OF UF.L-LP CONNECTORS (UNIT: MM) .......................................................... 60

FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 61

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FIGURE 42: UC15 TOP AND SIDE DIMENSIONS ........................................................................................... 67

FIGURE 43: UC15 BOTTOM DIMENSIONS (BOTTOM VIEW) ....................................................................... 68

FIGURE 44: BOTTOM PADS DIMENSIONS (BOTTOM VIEW) ....................................................................... 68

FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW) .............................................................................. 69

FIGURE 46: TOP VIEW OF THE MODULE ...................................................................................................... 70

FIGURE 47: BOTTOM VIEW OF THE MODULE .............................................................................................. 70

FIGURE 48: REFLOW SOLDERING PROFILE ................................................................................................ 72

FIGURE 49: CARRIER TAPE ............................................................................................................................ 73

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1 Introduction

This document defines the UC15 module and describes its hardware interface which are connected with

your application and the air interface.

This document can help you quickly understand module interface specifications, electrical and

mechanical details. Associated with application notes and user guide, you can use UC15 module to

design and set up mobile applications easily.

1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,

service or repair of any cellular terminal or mobile incorporating UC15 module. Manufacturers of the cellular

terminal should send the following safety information to users and operating personnel and to incorporate

these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability

for customer failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

accident. Using a mobile while driving (even with a handsfree kit) cause distraction

and can lead to an accident. You must comply with laws and regulations restricting

the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it

switched off. The operation of wireless appliances in an aircraft is forbidden to

prevent interference with communication systems. Consult the airline staff about

the use of wireless devices on boarding the aircraft, if your device offers a Airplane

Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are desinged to prevent possible interference with sentitive medical equipment.

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GSM cellular terminals or mobiles operate over radio frequency signal and cellular

network and cannot be guaranteed to connect in all conditions, for example no

mobile fee or an invalid USIM card. While you are in this condition and need

emergent help, please remember using emergency call. In order to make or

receive call, the cellular terminal or mobile must be switched on and in a service

area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON ,

it receives and transmits radio frequency energy. RF interference can occur if it is

used close to TV set, radio, computer or other electric equipment.

In locations with potencially explosive atmospheres, obey all posted signs to turn

off wireless devices such as your phone or other cellular terminals. Areas with

potencially exposive atmospheres including fuelling areas, below decks on boats,

fuel or chemical transfer or storage facilities, areas where the air contains

chemicals or particles such as grain, dust or metal powders.

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2 Product Concept

2.1. General Description

UC15 is an embedded UMTS/HSDPA module. Its UMTS-based modem provides data connectivity on

HSDPA, WCDMA, EDGE and GPRS networks. UC15 offers a maximum data rate of 3.6Mbps on

downlink and also supports GPRS/EDGE multi-slot class 12 as well. GPRS supports the coding schemes

CS-1, CS-2, CS-3 and CS-4. EDGE supports CS-1 to CS-4 and MCS-1 to MCS-9 coding schemes. UC15

includes two variants, UC15-A and UC15-E. And both of them are divided into Telematics version and

Data Only version. Telematics version supports voice and data, while Data Only version only supports

data. This is convenient for you to choose the dedicated type based on the wireless network configuration.

The following table shows the entire radio band configuration of UC15 series.

Table 1: Frequency Bands of UC15 Series

Module

UC15      

More details about GPRS/EDGE multi-slot configuration and coding schemes, please refer to Appendix B,

C and D.

With a tiny profile of 29.0mm × 29.0mm × 2.5mm, UC15 can meet almost all requirements for M2M

application such as automotive, metering, tracking system, security solutions, routers, wireless POS,

mobile computing devices, PDA phone and tablet PC, etc.

UC15 is an SMD type module, which can be embedded in your application through its 108-pin pads

including 68 LCC signal pads and 40 other pads.

UC15 is integrated with internet service protocols such as TCP/UDP and PPP. Extended AT commands

have been developed for you to use these internet service protocols easily.

GSM 850

EGSM 900

DCS 1800

PCS 1900

UMTS 850

UMTS 900

UMTS 1900

UMTS 2100

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2.2. Directives and Standards

The UC15 module is designed to comply with the FCC statements. FCC ID: XMR201404UC15

If the FCC ID of the module cannot be seen by the user in the final installation, the host device must show the statement: “Contains FCC ID: XMR201404UC15” in a visible and permanent location”

2.2.1. FCC Statement

1. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions:

a) This device may not cause harmful interference.

b) This device must accept any interference received, including interference that may cause undesired

operation.

2. Changes or modifications not expressly approved by the party responsible for compliance could avoid

the user’s authority to operate the equipment.

2.2.2. FCC Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20cm between the radiator and

your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this

module usage.

This module should NOT be installed and operating simultaneously with other radio.

The manual of the host system, which uses UC15, must include RF exposure warning statement to

advice user should keep minimum 20cm from the radio antenna of UC15 module depending on the

Mobile status.

Note: If a portable device (such as PDA) uses UC15 module, the device needs to do permissive change

and SAR testing.

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2.3. Key Features

The following table describes the detailed features of UC15 module.

Table 2: UC15 Key Features

Feature Details

Power Supply

Supply voltage: 3.3V~4.3V

Typical supply voltage: 3.8V

Frequency Bands UC15-A: GSM850/900/1800/1900, UMTS850/1900

HSDPA R5: Max 3.6Mbps (DL)

WCDMA R99: Max 384kbps (DL)/Max 384kbps (UL)

Transmission Data

EDGE: Max 236.8kbps (DL only)

GPRS: Max 85.6kbps (DL)/Max 85.6kbps (UL)

CSD: 64kbps

Class 4 (33dBm±2dB) for GSM850

Class 1 (30dBm±2dB) for PCS1900

Transmitting Power

Class E2 (27dBm±3dB) for GSM850 and EGSM900 8-PSK

Class E2 (26dBm+3/-4dB) for DCS1800 and PCS1900 8-PSK

Class 3 (24dBm+1/-3dB) for UMTS850/1900

HSDPA data rate is corresponded with 3GPP R5. 3.6Mbps on

HSDPA and WCDMA

Features

downlink.

WCDMA data rate is corresponded with 3GPP R99/R4. 384kbps on

downlink and 384kbps on uplink.

Support both 16-QAM and QPSK modulation.

GPRS:

Support GPRS multi-slot class 12 (10 by default)

Coding scheme: CS-1, CS-2, CS-3 and CS-4

Maximum of four Rx time slots per frame

EDGE:

GSM/GPRS/EDGE

Data Features

Support EDGE multi-slot class 12 (12 by default).

Support GMSK and 8-PSK for different MCS (Modulation and Coding

scheme).

Downlink coding schemes: CS 1-4 and MCS 1-9.

CSD:

CSD transmission rates: 64kbps non-transparent.

Support Unstructured Supplementary Services Data (USSD).

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Support TCP/PPP/UDP protocols.

Internet Protocol Features

Support the protocols PAP (Password Authentication Protocol) and

CHAP (Challenge Handshake Authentication Protocol) usually used

for PPP connections.

Text and PDU mode

SMS

Point to point MO and MT

SMS cell broadcast

SMS storage: ME by default

USIM Interface Support USIM/SIM card: 1.8V, 3.0V

Support two analog input channels and two analog output channels.

Audio Features

GSM: HR/FR/EFR/AMR/AMR-WB

WCDMA: AMR/AMR-WB

Echo cancellation and noise suppression.

Used for audio function with external codec.

Support 16-bit linear data formats.

PCM Interface*

Support long frame sync and short frame sync.

Support master and slave mode, but must be the master in long frame

sync.

Seven lines on UART interface.

UART Interface

Support RTS and CTS hardware flow control.

Baud rate can reach up to 921600bps, 115200bps by default.

Used for AT command, data transmission and firmware upgrade.

Compliant with USB 2.0 specification (slave only), the data transfer

rate can reach up to 480 Mbps at high speed mode.

Used for AT command communication, data transmission, software

USB Interface

debug and firmware upgrade.

USB driver: support Windows XP, Windows Vista, Windows 7,

Windows 8, Windows CE5.0/6.0, Windows Mobile 6.1/6.5, Linux 2.6 or

later, Android 2.3 or later.

AT Commands

Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT

commands.

Network Indication Indicate network activity status.

Antenna Interface Connected via 50ohm antenna pad.

Physical Characteristics

Size: 29.0±0.15 × 29.0±0.15 × 2.5±0.2 mm

Weight: Approx. 4.3g

Normal operation: -35°C ~ +75°C

Temperature Range

Restricted operation: -40°C ~ -35°C and +75°C ~ +85°C 1)

Storage temperature: -45°C ~ +90°C

Firmware Upgrade USB interface (by default) and UART interface.

RoHS All hardware components are fully compliant with EU RoHS directive.

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NOTES

1. “1)” means when the module works within this temperature range, RF performance might degrade.

For example, the frequency error or the phase error would increase.

2. “*” means this feature is under development.

2.4. Functional Diagram

The following figure shows a block diagram of UC15 and illustrates the major functional parts.

 Power management unit

 Baseband

 DDR+NAND flash

 Radio frequency

 Peripheral interface

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Figure 1: Functional Diagram

2.5. Evaluation Board

In order to help you to develop applications with UC15, Quectel supplies an evaluation board (EVB),

RS-232 to USB cable, USB data cable, power adapter, earphone, antenna and other peripherals to

control or test the module. For details, please refer to document [2].

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3 Application Interface

3.1. General Description

UC15 is equipped with a 68-pin 1.3mm pitch SMT pads plus 40-pin ground pads and reserved pads that

connect to cellular application platform. Sub-interfaces included in these pads are described in details in

the following chapters:

 Power supply

 UART interface

 Audio interface

 PCM interface

 USIM interface

 USB interface

 ADC interface

 Indicator interface

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3.2. Pin Assignment

The following figure shows the pin assignment of the UC15 module.

USB_VBUS

USB_DM

USB_DP

RXD

DTR

TXD

646362616059585756555453525150

DCD

RTS

CTS

VBAT_BB

STATUS

RI

VBAT_BB

VBAT_RF

GND

49

171819202122232425262728293031

SPK1P*

AGND*

SPK1N*

SPK2P*

MIC1P*

MIC2P*

MIC1N*

MIC2N*

RESERVED

RESET_N

PWRKEY

32

RESERVED

NOTES

Figure 2: Pin Assignment (Top View)

1. Keep all RESERVED pins and unused pins unconnected.

2. GND pads 81~108 should be connected to ground in the design, and RESERVED pads 69~80

should be unconnected.

3. “*” means these functions are only supported in Telematics version. Meanwhile, PCM function is still

under development.

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3.3. Pin Description

The pin definition of UC15 is shown in table 4.

Table 3: IO Parameters Definition

Type Description

IO Bidirectional input/output

DI Digital input

DO Digital output

PI Power input

PO Power output

AI Analog input

AO Analog output

Table 4: Pin Description

Power Supply

Pin Name Pin No. I/O Description DC Characteristics Comment

VBAT_BB 52,53 PI

Power supply for

module baseband

part.

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

It must be able to

provide sufficient

current up to 0.8A.

It must be able to

provide sufficient

current in a

transmitting burst

which typically

VBAT_RF 50,51 PI

Power supply for

module RF part.

Vmax=4.3V

Vmin=3.3V

Vnorm=3.8V

rises to 2.0A.

It is recommend to

add a 2.2~4.7uF

VDD_EXT 7 PO

Provide 2.6V for

external circuit.

Vnorm=2.6V

I

max=100mA

O

bypass capacitor

when using this

pin for power

supply.

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42,44~49

GND

65,67~68

Ground.

,81~108

Turn On/Off

Pin Name Pin No. I/O Description DC Characteristics Comment

R

≈200kΩ

PU

PWRKEY 18 DI

Turn on/off the

module.

RESET_N 17 DI Reset the module.

V

max=2.1V

IH

V

min=1.3V

IH

V

max=0.5V

IL

max=2.1V

V

IH

V

min=1.3V

IH

V

max=0.5V

IL

Pull-up to 1.8V

internally.

Pull-up to 1.8V

internally.

Indication

Pin Name Pin No. I/O Description DC Characteristics Comment

V

max=2.6V

STATUS 54 DO

Indicate the module

operating status.

Indicate the module

NETLIGHT 6 DO

network activity

status.

OH

V

min=2.15V

OH

V

max=0.45V

OL

max=2.6V

V

OH

V

min=2.15V

OH

V

max=0.45V

OL

2.6V power

domain.

2.6V power

domain.

USB Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

Vmax=5.25V

USB_VBUS 64 PI USB detection.

Vmin=3.0V

Vnorm=5.0V

USB_DP 62 IO

USB differential data

bus.

Compliant with USB 2.0

standard specification.

Require differential

impedance of 90Ω.

USB_DM 63 IO

USB differential data

bus.

Compliant with USB 2.0

standard specification.

Require differential

impedance of 90Ω.

USIM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

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USIM_GND 8

USIM_VDD 12 PO

USIM_DATA 13 IO

USIM_CLK 14 DO

Specified ground for

USIM card.

Power supply for

USIM card.

Data signal of

USIM card.

Clock signal of

USIM card.

For 1.8V USIM:

Vmax=1.95V

Vmin=1.65V

For 3.0V USIM:

Either 1.8V or 3.0V is

supported by the

module automatically.

Vmax=3.0V

Vmin=2.7V

For 1.8V USIM:

V

max = 0.6V

IL

V

min =1.2V

IH

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V USIM:

V

max=1.0V

IL

V

min=1.95V

IH

V

max=0.45V

OL

V

min=2.55V

OH

Pull-up to USIM_VDD

with 10k resistor

internally.

For 1.8V USIM:

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V USIM:

V

max=0.45V

OL

V

min=2.55V

OH

For 1.8V USIM:

V

max=0.45V

OL

V

min=1.35V

OH

For 3.0V USIM:

V

max=0.45V

OL

V

min=2.55V

OH

V

min=-0.3V

IL

V

max=0.91V

IL

V

min=1.69V

IH

V

max=2.9V

IH

2.6V power domain.

USIM_RST 15 DO

USIM_

PRESENCE

11 DI

Reset signal of

USIM card.

USIM card input

detection.

ADC Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

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General purpose

ADC0 41 AI

analog to digital

converter.

General purpose

ADC1 40 AI

analog to digital

converter.

Voltage range:

0V to 2.1V

Voltage range:

0V to 2.1V

UART Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

V

max=0.45V

RI 55 DO Ring indicator.

DCD 56 DO

Data carrier

detection.

CTS 57 DO Clear to send.

RTS 58 DI Request to send.

DTR 59 DI Data terminal ready.

TXD 60 DO Transmit data.

RXD 61 DI Receive data.

OL

V

OH

V

OL

V

OH

V

OL

V

OH

V

min=-0.3V

IL

V

max=0.91V

IL

V

IH

V

IH

V

min=-0.3V

IL

V

max=0.91V

IL

V

IH

V

IH

V

OL

V

OH

V

min=-0.3V

IL

V

max=0.91V

IL

V

IH

V

IH

min=2.15V

max=0.45V

min=2.15V

max=0.45V

min=2.15V

min=1.69V

max=2.9V

min=1.69V

max=2.9V

max=0.45V

min=2.15V

min=1.69V

max=2.9V

2.6V power domain.

Pull-up by default.

2.6V power domain.

RF Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

RF_ANT 43 IO RF antenna pad. 50Ω impedance.

Analog Audio Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

MIC1P 23 AI Audio positive input.

MIC1N 24 AI

Audio negative

input.

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MIC2P 25 AI

MIC2N 26 AI

SPK1P 22 AO

SPK1N 21 AO

SPK2P 20 AO

Auxiliary audio

positive input.

Auxiliary audio

negative input.

Audio positive

output.

Audio negative

output.

Auxiliary audio

positive output.

Separate ground for

AGND 19 Analog ground. Ground.

external audio

circuits.

PCM Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

V

max=0.45V

PCM_DOUT 34 DO PCM data output.

PCM_DIN 35 DI PCM data input.

PCM_CLK 36 IO PCM data bit clock.

PCM_SYNC 37 IO

PCM data frame

sync signal

OL

V

min=2.15V

OH

V

min=-0.3V

IL

V

max=0.91V

IL

V

min=1.69V

IH

V

max=2.9V

IH

V

min=-0.3V

IL

V

max=0.91V

IL

V

min=1.69V

IH

V

max=2.9V

IH

V

max=0.45V

OL

V

min=2.15V

OH

V

max=0.45V

OL

V

min=2.15V

OH

2.6V power domain.

I2C Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

V

min=-0.3V

IL

V

max=0.91V

I2C_SDA 38 IO I2C serial data.

I2C_SCL 39 DO I2C serial clock.

IL

V

min=1.69V

IH

V

max=2.9V

IH

V

max=0.45V

OL

V

min=2.15V

OH

V

max=0.45V

OL

V

min=2.15V

OH

External pull-up

resistor is required.

2.6V only.

External pull-up

resistor is required.

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2.6V only.

Other Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

V

min=-0.3V

IL

V

max=0.91V

IL

V

min=1.69V

IH

V

max=2.9V

IH

2.6V power domain.

AP_READY 2 DI

Application process

or sleep state

detection.

1,3~5,9~

RESERVED

10,16,27

~33,66,

Reserved.

Keep these pins

unconnected.

69~80

3.4. Operating Modes

The table below briefly summarizes the various operating modes.

Table 5: Overview of Operating Modes

Mode Details

GSM Idle

GSM Talk/Data

GPRS Idle

Normal Operation

GPRS Data

Software is active. The module has registered to the GSM network

and is ready to send and receive data.

GSM connection is ongoing. In this mode, the power consumption

is decided by the configuration of power control level (PCL),

dynamic DTX control and the working RF band.

The module is ready for GPRS data transfer, but no data transfer

is going on. In this case, power consumption depends on network

setting and GPRS configuration.

There is GPRS data in transfer (PPP, TCP or UDP). In this mode,

power consumption is decided by the PCL, working RF band and

GPRS multi-slot configuration.

The module is ready for data transfer in EDGE mode, but no data

EDGE Idle

is currently sent or received. In this case, power consumption

depends on network settings and EDGE configuration.

There is EDGE data in transfer (PPP, TCP or UDP). In this mode,

EDGE Data

power consumption is decided by the PCL, working RF band and

EDGE multi-slot configuration.

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Minimum

Functionality

Mode

Sleep Mode

Power Down

Mode

UMTS Idle

UMTS

Tal k/ Da ta

HSDPA Idle

Software is active. The module has registered to the UMTS

network and the module is ready to send and receive data.

UMTS connection is ongoing. In this mode, the power

consumption is decided by network setting (e.g. TPC pattern) and

data transfer rate.

Software is active. The module has registered to the HSDPA

network and the module is ready to send and receive data.

HSDPA data transfer is ongoing. In this mode, the power

HSDPA Data

consumption is decided by network setting (e.g. TPC pattern) and

data transfer rate.

AT+CFUN=0 command can set the module entering into a minimum functionality

mode without removing the power supply. In this case, both RF function and USIM

card will be invalid.

In this mode, the current consumption of the module will be reduced to the minimal

level. During this mode, the module can still receive paging message, SMS, voice

call and TCP/UDP data from the network normally. Any URC can be output even the

module in Sleep Mode.

In this mode, the power management unit shuts down the power supply for the

baseband part and RF part. Software is not active. The serial interface is not

accessible. Operating voltage (connected to VBAT_RF and VBAT_BB) remains

applied.

3.5. Power Saving

3.5.1. Sleep Mode

UC15 is able to reduce its current consumption to a minimum value during the sleep mode. The following

section describes power saving procedure of UC15.

3.5.1.1. UART Application

If application processor communicates with module via UART interface, the following preconditions can

let the module enter into the sleep mode.

 Execute AT command AT+QSCLK=1 to enable the sleep mode.

 Drive DTR to high level.

The following figure shows the connection between the module and application processor.

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Figure 3: UART Sleep Application

The RI of module is used to wake up the processor, and AP_READY will detect the sleep state of

processor (can be configured to high level or low level detection). You should pay attention to the level

match shown in dotted line between module and processor.

Drive DTR to low level will wake up the module.

3.5.1.2. USB Application with Suspend Function

If application processor communicates with module via USB interface, and processor supports USB

suspend function, following preconditions can let the module enter into the sleep mode.

 Execute AT command AT+QSCLK=1 to enable the sleep mode.

 The processor’s USB bus which is connected with the module USB interface enters into suspended

state.

The following figure shows the connection between the module and processor.

Figure 4: USB Application with Suspend Function

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When the processor’s USB bus returns to resume state, the module will be woken up.

3.5.1.3. USB Application without Suspend Function

If application processor communicates with module via USB interface, and processor does not support

USB suspend function, you should disconnect USB_VBUS with additional control circuit to let the module

enter into sleep mode.

 Execute AT command AT+QSCLK=1 to enable the sleep mode.

 Disconnect USB_VBUS.

The following figure shows the connection between the module and application processor.

Figure 5: USB Sleep Application without Suspend Function

Supply power to USB_VBUS will wake up the module.

In sleep mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the

network normally, but the UART port is not accessible.

3.5.2. Minimum Functionality Mode

Minimum functionality mode reduces the functionality of the module to minimum level, thus minimizes the

current consumption at the same time. This mode can be set as below:

Command AT+CFUN provides the choice of the functionality levels: <fun>=0, 1, 4.

 AT+CFUN=0: Minimum functionality, RF part and USIM card will be closed.  AT+CFUN=1: Full functionality (by default).

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 AT+CFUN=4: Disable RF function (airplane mode). All AT commands related to RF function are not

accessible.

For detailed information about command AT+CFUN, please refer to document [1].

3.6. Power Supply

3.6.1. Power Supply Pins

UC15 provides four VBAT pins to connect with the external power supply. There are two separate voltage

domains for VBAT.

 VBAT_RF with two pads for module RF.

 VBAT_BB with two pads for module baseband.

The following table shows the VBAT pins and ground pins.

Table 6: VBAT and GND Pin

Pin Name Pin No. Description Min. Typ. Max. Unit

VBAT_RF 50,51 Power supply for module RF. 3.3 3.8 4.3 V

VBAT_BB 52,53

GND

42,44~49,65,

67~68,81~108

Power supply for module

baseband.

Ground. - - - -

3.3 3.8 4.3 V

3.6.2. Decrease Voltage Drop

The power supply range of the module is 3.3~4.3V. Because of the voltage drop during the transmitting

time, a bypass capacitor of about 100µF with low ESR should be used. Multi-layer ceramic chip (MLCC)

capacitor can provide the best combination of low ESR. Three ceramic capacitors (100nF, 33pF, 10pF)

are recommended to be applied to the VBAT pins. The capacitors should be placed close to the VBAT

pins of UC15. The following figure shows star structure of the power supply.

The main power supply from an external application should be a single voltage source and has to be

expanded to two sub paths with star structure. In addition, in order to get a stable power source, it is

suggested to use a zener diode of which reverse zener voltage is 5.1V and dissipation power is more than

0.5W.

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Figure 6: Star Structure of the Power Supply

Please pay special attention to the power supply design for applications. Make sure the input voltage will

never drop below 3.3V. If the voltage drops below 3.3V, the module will turn off automatically. The PCB

traces from the VBAT pins to the power source must be wide enough to ensure that there is not too much

voltage drop occurs in the transmitting procedure. The width of VBAT_BB trace should be no less than

1mm, and the width of VBAT_RF trace should be no less than 2mm, and the principle of the VBAT trace is

the longer, the wider.

3.6.3. Reference Design for Power Supply

The power design for the module is very important, since the performance of power supply for the module

largely depends on the power source. The power supply is capable of providing the sufficient current up to

2A at least. If the voltage drop between the input and output is not too high, it is suggested to use a LDO

to supply power for module. If there is a big voltage difference between the input source and the desired

output (VBAT), a buck converter is preferred to be used as a power supply.

The following figure shows a reference design for +5V input power source. The designed output for the

power supply is 3.88V and the maximum load current is 3A.

Figure 7: Reference Circuit of Power Supply

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3.6.4. Monitor the Power Supply

You can use the AT +C B C command to monitor the VBAT_BB voltage value. For more details, please refer to document [1].

3.6.5. VDD_EXT

UC15 has a LDO power output, named VDD_EXT. The VDD_EXT is available and output voltage is 2.6V

by default, rated at 100mA.

The following table shows electrical characteristics of VDD_EXT.

Table 7: Electrical Characteristics of VDD_EXT

Symbol Description Min. Typ. Max. Unit

VDD_EXT Output voltage 2.5 2.6 2.7 V

I

Output current - - 100 mA

OUT

3.7. Turn on and off Scenarios

3.7.1. Turn on Module by PWRKEY Pin

The following table shows the pin definition of PWRKEY.

Table 8: PWRKEY Pin Description

Pin Name Pin No. Description DC Characteristics Comment

max=2.1V

V

PWRKEY 18 Turn on/off the module.

IH

V

min=1.3V

IH

V

max=0.5V

IL

Pull-up to 1.8V internally

with 200kΩ resistor.

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When UC15 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to

low level at least 0.1s. It is recommended to use an open collector driver to control the PWRKEY. You can

monitor the level of the STATUS pin to judge whether the module is turned on or not. After STATUS pin

outputting a high level, module is turned on. A simple reference circuit is illustrated in the following figure.

Figure 8: Turn on the Module by Driving Circuit

The other way to control the PWRKEY is to use a button directly. A TVS component is indispensable to be

placed nearby the button for ESD protection. When pressing the key, electrostatic strike may generate

from finger. A reference circuit is shown in the following figure.

Figure 9: Turn on the Module by Keystroke

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The turn on scenarios is illustrated as the following figure.

Figure 10: Timing of Turning on Module

NOTE

① Make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is

recommended to be more than 0.03s.

3.7.2. Turn off Module

The following procedures can be used to turn off the module:

 Normal power down procedure: Turn off the module by PWRKEY pin.

 Normal power down procedure: Turn off the module by command AT+QPOWD.

 Automatic shutdown: Turn off the module automatically if under-voltage or over-voltage is detected.

3.7.2.1. Turn off Module by PWRKEY Pin

Drive the PWRKEY to low level at least 0.6s, the module will execute power-down procedure after

PWRKEY is released. The power-down scenario is illustrated as the following figure.

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Figure 11: Timing of Turning off Module

During power-down procedure, module will send out URC “NORMAL POWER DOWN” via URC port first,

then log off network and save important data. After logging off, module sends out “POWERED DOWN”

and shuts down the internal power supply. The power on VBAT pins are not allowed to be switched off

before the URC “POWERED DOWN” is output to avoid data loss. If module is not logged off within 60s,

module will force to shut down internal power supply.

After that moment, the module enters into power down mode, no other AT commands can be executed.

The power down mode can also be indicated by the STATUS pin.

3.7.2.2. Turn off Module by AT Command

It is also a safe way to use AT command AT+QPOWD to turn off the module, which is similar to the way of turning off the module via PWRKEY Pin. Please refer to document [1] for details about the AT command of AT+QPOWD.

3.7.2.3. Automatic Shutdown

The module will constantly monitor the voltage applied on the VBAT_BB, if the voltage ≤ 3.5V, the

following URC will be presented:

+QIND: “vbatt”,-1

If the voltage ≥ 4.21V, the following URC will be presented:

+QIND: “vbatt”,1

The uncritical voltage is 3.3V to 4.3V, If the voltage > 4.35V or < 3.2V, the module would automatically

shut down itself.

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If the voltage < 3.2V, the following URC will be presented:

+QIND: “vbatt”,-2

If the voltage > 4.35V, the following URC will be presented:

+QIND: “vbatt”,2

NOTE

The value of voltage threshold can be revised by AT command AT+QCFG=“vbatt”, refer to document [1] for details.

3.8. Reset the Module

The RESET_N can be used to reset the module.

Table 9: RESET_N Pin Description

Pin Name Pin No. Description DC Characteristics Comment

max=2.1V

V

IH

RESET_N 17 Reset the module.

V

min=1.3V

IH

V

max=0.5V

IL

Pull-up to 1.8V internally.

You can reset the module by driving the RESET_N to low level voltage for 0.05~0.2s and then releasing.

A reference circuit is shown in the following figure.

Figure 12: Reference Circuit of RESET_N

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The reset scenario is illustrated as the following figure.

Figure 13: Timing of Resetting Module

NOTE

The low-level pulse through the RESET_N pin cannot last for more than 0.2s, otherwise the module will

be powered off.

3.9. UART Interface

The module provides one 7-wire UART interface, and is designed as the DCE (Data Communication

Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection. UART interface

supports 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800 and

921600bps baud rate. The default is 115200bps, while autobauding is not supported. This interface can

be used for data transmission, AT communication and firmware upgrade.

Table 10: Pin Definition of the UART Interface

Pin Name Pin No. I/O Description Comment

RI 55 DO Ring indicator. 2.6V power domain.

DCD 56 DO Data carrier detection. 2.6V power domain.

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CTS 57 DO Clear to send. 2.6V power domain.

RTS 58 DI Request to send. 2.6V power domain.

DTR 59 DI Data terminal ready. 2.6V power domain.

TXD 60 DO Transmit data. 2.6V power domain.

RXD 61 DI Receive data. 2.6V power domain.

The logic levels are described in the following table.

Table 11: Logic Levels of Digital I/O

Parameter Min. Max. Unit

VIL -0.3 0.91 V

VIH 1.69 2.9 V

VOL 0 0.45 V

VOH 2.15 2.6 V

3.9.1. The Connection of UART

The connection between module and host via UART port is very flexible. Three connection ways are

illustrated as below.

UART port connection is shown as below when it is applied in modulation-demodulation.

Figure 14: Connection of Full Functional UART Port

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Three lines connection is shown as below.

Figure 15: Connection of Three Lines UART Port

UART port with hardware flow control is shown as below. This connection will enhance the reliability of the

mass data communication.

Figure 16: Connection of UART Port with Hardware Flow Control

NOTE

The module disables the hardware flow control by default. AT command AT+IFC=2,2 is used to enable hardware flow control. AT command AT+IFC=0,0 is used to disable the hardware flow control. For more details, please refer to document [1].

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3.9.2. UART Application

The reference design of 3.3V level match is shown as below. When the peripheral MCU/ARM system is

3V, the divider resistor should be changed from 3.6K to 6.8K.

Figure 17: 3.3V Level Match Circuit

The reference design of 5V level match is shown as below. The construction of dotted line can refer to the

construction of solid line. Please pay attention to direction of connection. Input dotted line of module

should refer to input solid line of the module. Output dotted line of module should refer to output solid line

of the module.

Figure 18: 5V Level Match Circuit

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The following figure is an example of connection between module and PC. A RS232 level shifter IC or

circuit must be inserted between module and PC, since UART interface do not support the RS232 level,

while support the CMOS level only.

Figure 19: RS232 Level Shift Circuit

NOTES

1. Rising edge on DTR will let the module exit from the data mode by default. It can be disabled by

command. Refer to document [1] about AT&D and AT&V for details.

2. DCD is used as data mode indication. Please refer to document [1] about command AT&C and

AT&V for details.

3.10. Behavior of the RI

You can use command AT+QCFG=“risignaltype”, “physical” to configure RI behavior:

No matter which port URC is presented on, URC will trigger the behavior on RI pin.

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NOTE

URC can be output from UART port, USB AT port and USB modem port by command AT+QURCCFG.

The default port is USB AT port.

In additional, RI behavior can be configured flexible. The default behavior of the RI is shown as below.

Table 12: Behavior of the RI

State Response

Idle RI keeps in high level.

URC RI outputs 120ms low pulse when new URC is reported.

Figure 20: RI Behavior

The RI behavior can be changed by command AT+QCFG=“urc/ri/ring”, refer to document [1] for

details.

3.11. Analog Audio Interface

The module provides two analog input channels and two analog output channels.

Table 13: Pin Definition of the Audio Interface

Interface Pin Name Pin No. I/O Description Comment

AIN1/ MIC1P 23 AI Audio positive input. If it is unused, keep open.

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AOUT1

MIC1N 24 AI Audio negative input. If it is unused, keep open.

SPK1P 22 AO Audio positive output. If it is unused, keep open.

SPK1N 21 AO Audio negative output. If it is unused, keep open.

AIN2/

AOUT2

MIC2P 25 AI

MIC2N 26 AI

SPK2P 20 AO

Auxiliary audio positive

input.

Auxiliary audio negative

input.

Auxiliary audio positive

output.

AGND 19 Analog ground.

If it is unused, keep open.

Suggested to be used for

audio circuit.

 AIN1 and AIN2 may be used for both microphone and line inputs. An electret microphone is usually

recommended. AIN1 and AIN2 are both differential input channels.

 AOUT1 and AOUT2 may be used for both receiver and speaker outputs. AOUT1 channel is typically

used for a receiver, while AOUT2 channel is typically used for headset or speaker. AOUT1 channel is

a differential channel and AOUT2 is a single-ended channel. SPK2P and AGND can establish a

pseudo differential mode. Both AOUT1 and AOUT2 support voice and ringtone output, and so on.

 These two audio channels can be swapped by A T+QAUDPATH command. For more details, please

refer to document [1].

Use command AT+QAUDPATH to select audio channel:

0: AIN1/AOUT1 (normal audio channel), the default value is 0.

1: AIN2/AOUT2 (auxiliary audio channel).

2: PCM channel.

For each channel, you can use AT +QMIC to adjust the input gain level of microphone. You can also use AT+CLVL to adjust the output gain level of receiver and speaker. AT+QSIDET is to set the side-tone gain level. For more details, please refer to document [1].

3.11.1. Decrease TDD Noise and Other Noise

The 33pF capacitor is applied for filtering out 900MHz RF interference when the module is transmitting at

GSM900/EGSM900MHz. TDD noise could be heard without this capacitor. Moreover, the 10pF capacitor

here is for filtering out 1800/1900MHz RF interference. However, the self-resonant frequency point of a

capacitor largely depends on the material and production technique. Therefore, customer should depend

on its capacitor vendor to choose the most suitable capacitor for filtering out GSM850MHz and

PCS1900MHz separately.

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The severity degree of the RF interference in the voice channel during GSM transmitting period largely

depends on the application design. In some cases, GSM850 TDD noise is more severe; while in other

cases, PCS1900 TDD noise is more obvious. Therefore, customer can have a choice based on test

results. Sometimes, even no RF filtering capacitor is required.

The capacitor which is used for filtering out RF noise should be close to audio interface. Audio alignment

should be as short as possible.

In order to decrease radio or other signal interference, the position of RF antenna should be kept away

from audio interface and audio alignment. Power alignment and audio alignment should not be parallel,

and power alignment should be far away from audio alignment.

The differential audio traces should be placed according to the differential signal layout rules.

3.11.2. Microphone Interfaces Application

AIN1/AIN2 channels come with internal bias supply for external electret microphone. A reference circuit is

shown in the following figure.

Figure 21: Microphone Reference Design for AIN1&AIN2

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3.11.3. Receiver and Speaker Interface Application

Module

SPK1P

SPK1N

Figure 22: Reference Design for AOUT1

10pF

Differential layout

Amplifier circuit

0603

10pF 0603

Close to speaker

GND

33pF 0603

GND

Figure 23: Reference Design with an Amplifier for AOUT1

Texas Instruments TPA6205A1 is recommended for a suitable differential audio amplifier. There are

plenty of excellent audio amplifiers in the market.

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Figure 24: Reference Design for AOUT2

10pF 0603

Module

SPK2P

AGND

Differential layout

C1

C2

Amplifier circuit

Figure 25: Reference Design with an Amplifier for AOUT2

NOTE

The value of C1 and C2 depends on the input impedance of audio amplifier.

Close to speaker

GND

33pF 0603

GND

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3.11.4. Earphone Interface Application

Figure 26: Reference Design for an Earphone

Table 14: Microphone Characteristics

Parameter Min. Typ. Max. Unit

Working Voltage 1.65 1.8 1.95 V

Working Current 20 1000 uA

Table 15: Speaker Characteristics

Parameter Min. Typ. Max. Unit

Normal Output

(AOUT1)

Auxiliary Output

(AOUT2)

Differential

Single ended

Supply voltage 2.0 2.1 2.2 V

Load resistance 25.6 32 ohm

Supply voltage 2.0 2.1 2.2 V

Load resistance 12 16 ohm

Output Power of AOUT1 and AOUT2 50 mW

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3.12. PCM and I2C Interface

UC15 provides one Pulse Code Modulation (PCM) digital interface for audio design with 16-bit linear data

formats, which supports the following modes:

 Primary mode (short sync, works as both master and slave)

 Auxiliary mode (long sync, works as master only)

UC15 supports an 8 kHz short sync mode at 2048 kHz, the data is sampled on the falling edge of the

PCM_CLK and transmitted on the rising edge, and the PCM_SYNC falling edge represents the MSB.

UC15 also supports an 8 kHz long sync mode at 128 kHz, the data is sampled on the falling edge of the

PCM_CLK and transmitted on the rising edge, and the PCM_SYNC rising edge represents the MSB.

The following figures show the different timing relationships of these modes.

Figure 27: Primary Mode Timing

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Figure 28: Auxiliary Mode Timing

The following table shows the pin definition of PCM and I2C interface which can be applied on audio

codec design.

Table 16: Pin Definition of PCM and I2C Interface

Pin Name Pin No. I/O Description Comment

PCM_DOUT 34 DO PCM data output. 2.6V power domain

PCM_DIN 35 DI PCM data input. 2.6V power domain

PCM_CLK 36 IO PCM data bit clock. 2.6V power domain

PCM_SYNC 37 IO

PCM data frame

sync signal

2.6V power domain

I2C_SDA 38 IO I2C serial data.

I2C_SCL 39 DO I2C serial clock.

External pull-up resistor is

required. 2.6V only.

External pull-up resistor is

required. 2.6V only.

UC15’s firmware has integrated the configuration on NAU8814 application with I2C interface. The default

configuration is master mode which uses short sync data format with 2048 kHz clock. Please refer to

document [1] for details about the command AT+QDAI.

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The following figure shows the reference design of PCM interface with external codec IC.

Figure 29: Reference Circuit of PCM Application with Audio Codec

NOTES

1. It is recommended to reserve RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for

PCM_CLK.

2. I2C bus is the standard interface, which is used with NAU8814 application by default.

3. The PCM feature is under development.

3.13. USIM Card Interface

3.13.1. USIM Card Application

The USIM card interface circuitry meets ETSI and IMT-2000 USIM interface requirements. Both 1.8V and

3.0V USIM cards are supported.

Table 17: Pin Definition of the USIM Interfaces

Pin Name Pin No. I/O Description Comment

USIM_VDD 12 PO Power supply for USIM card.

Either 1.8V or 3.0V is supported

by the module automatically.

USIM_DATA 13 IO Data signal of USIM card.

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USIM_CLK 14 DO Clock signal of USIM card.

USIM_RST 15 DO Reset signal of USIM card.

USIM_

PRESENCE

11 DI USIM card detection input. 2.6V power domain

USIM_GND 8 Specified ground for USIM card.

The following figure shows the reference design of the 8-pin USIM card.

Module

VDD_EXT

51K

USIM_GND

USIM_VDD

USIM_RST

USIM_CLK USIM_PRESENCE

USIM_DATA

USIM_VDD

15K

100nF USIM holder

22R

33pF 33pF 33pF

VCC RST

CLK

GND

VPP

IO

GND

ESDA6V8AV6

GND

Figure 30: Reference Circuit of the 8-Pin USIM Card

NOTE

Some AT commands are invalid when USIM card is not applied.

UC15 supports USIM card hot-plugging via the USIM_PRESENCE pin. For details, refer to document [1] about the command AT+QSIMDET. If you do not need the USIM card detection function, keep

USIM_PRESENCE unconnected. The reference circuit for using a 6-pin USIM card holder is illustrated as

the following figure.

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Figure 31: Reference Circuit of the 6-Pin USIM Card

In order to enhance the reliability and availability of the USIM card in customer’s application, please follow

the following criterion in the USIM circuit design:

 Keep layout of USIM card as close as possible to the module. Assure the possibility of the length of

the trace is less than 200mm.

 Keep USIM card signal away from RF and VBAT alignment.

 Assure the ground between module and USIM cassette short and wide. Keep the width of ground

and USIM_VDD no less than 0.5mm to maintain the same electric potential. The decouple capacitor

of USIM_VDD should be less than 1uF and must be near to USIM cassette.

 To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away with each other and

shield them with surrounded ground.

 In order to offer good ESD protection, it is recommended to add TVS such as WILL

(http://www.willsemi.com) ESDA6V8AV6. The capacitance of ESD component is less than 50pF.

The 22Ω resistors should be added in series between the module and the USIM card so as to

suppress the EMI spurious transmission and enhance the ESD protection. The 33pF capacitors are

used for filtering interference of EGSM900. Please note that the USIM peripheral circuit should be

close to the USIM card holder.

 The pull-up resistor on USIM_DATA line can improve anti-jamming capability when long layout trace

and sensitive occasion is applied.

3.13.2. Design Considerations for USIM Card Holder

For 8-pin USIM card holder, it is recommended to use Molex 91228. Please visit http://www.molex.com for

more information.

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Figure 32: Molex 91228 USIM Card Holder

Table 18: Pin Description of Molex USIM Card Holder

Name Pin Function

VDD C1 USIM card power supply

RST C2 USIM card reset

CLK C3 USIM card clock

/ C4 Not defined

GND C5 Ground

VPP C6 Not connected

DATA I/O C7 USIM card data

/ C8

Pull-down GND with external circuit. When the tray is present, C4

is connected to C8.

For 6-pin USIM card holder, it is recommended to use Amphenol C707 10M006 512 2. Please visit

http://www.amphenol.com for more information.

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Figure 33: Amphenol C707 10M006 512 2 USIM Card Holder

Table 19: Pin Description of Amphenol USIM Card Holder

Name Pin Function

VDD C1 USIM card power supply

RST C2 USIM card reset

CLK C3 USIM card clock

GND C5 Ground

VPP C6 Not connected

DATA I/O C7 USIM card data

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3.14. USB Interface

UC15 contains one integrated Universal Serial Bus (USB) transceiver which complies with the USB 2.0

specification and supports high speed (480Mbps), full speed (12Mbps) and low speed (1.5Mbps) mode.

The USB interface is primarily used for AT command, data transmission, software debug and firmware

upgrade. The following table shows the pin definition of USB interface.

Table 20: USB Pin Description

Pin Name Pin No. I/O Description Comment

USB_DP 62 IO USB differential data bus (positive).

USB_DM 63 IO USB differential data bus (negative).

USB_VBUS 64 PI USB detection.

Require differential

impedance of 90Ω.

Require differential

impedance of 90Ω.

3.0~5.25V.

Typical 5.0V.

More details about the USB 2.0 specifications, please visit http://www.usb.org/home.

The following figure shows the reference circuit of USB interface.

Figure 34: Reference Circuit of USB Application

In order to ensure the USB interface design corresponding with the USB 2.0 specification, please comply

with the following principles.

 It is important to route the USB signal traces as differential pairs with total grounding. The impedance

of USB differential trace is 90ohm.

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 Keep the ESD components as closer to the USB connector as possible.

 Pay attention to the influence of junction capacitance of ESD component on USB data lines. Typically,

the capacitance value should be less than 2pF such as ESD9L5.0ST5G.

 Do not route signal traces under crystals, oscillators, magnetic devices and RF signal traces. It is

important to route the USB differential traces in inner-layer with ground shielding not only upper and

lower layer but also right and left side.

NOTE

UC15 module can only be used as a slave device.

The USB interface is recommended to be reserved for firmware upgrade in your design. The following

figure shows the recommended test points.

Figure 35: Test Points of Firmware Upgrade

3.15. ADC Function

The module provides two analog-to-digital converters (ADC) to digitize the analog signal to 12-bit digital

data. Using AT command AT+QADC=0 can read the voltage value on ADC0 pin. Using AT command AT+QADC=1 can read the voltage value on ADC1 pin. For more details of these AT commands, please refer to document [1].

In order to improve the accuracy of ADC, the trace of ADC should be surrounded by ground.

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Table 21: Pin Definition of the ADC

Pin Name Pin NO. Description

ADC0 41 General purpose analog to digital converter.

ADC1 40 General purpose analog to digital converter.

The following table describes the characteristics of the ADC function.

Table 22: Characteristics of the ADC

Parameter Min. Typ. Max. Unit

ADC0 Voltage Range 0

ADC1 Voltage Range 0

2.1 V

Sample Rate 2.4 MHz

ADC Resolution

12

bits

3.16. Network Status Indication

The module provides a pin named NETLIGHT to indicate the module network status which can be used to

drive a LED. The following tables describe pin definition and logic level changes in different network

status.

Table 23: Pin Definition of Network Indicator

Pin Name Pin No. I/O Description Comment

NETLIGHT 6 DO

Indicate the module network activity

status.

2.6V power domain.

Table 24: Working State of the Network Indicator

Pin Name Status Description

200ms High/1800ms Low. Network searching.

NETLIGHT

1800ms High/200ms Low. Idle.

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125ms High/125ms Low. Data transfer is ongoing.

Always High. Voice calling.

Always Low. Sleep.

A reference circuit is shown in the following figure.

Figure 36: Reference Circuit of the Network Indicator

3.17. Operating Status Indication

The STATUS is used to indicate the module operation status. When the module is turned on normally, the

STATUS will output high level.

Table 25: Pin Definition of STATUS

Pin Name Pin No. I/O Description Comment

STATUS 54 DO Indicate the module operation status. 2.6V power domain.

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A reference circuit is shown in the following figure.

Figure 37: Reference Circuit of the STATUS

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4 Antenna Interface

4.1. Antenna Interface

4.1.1. Pin Definition

Pin definition of RF antenna is shown as below.

Table 26: Pin Definition of the RF Antenna

Pin Name Pin No. I/O Description Comment

RF_ANT 43 IO RF antenna pad 50Ω impedance

4.1.2. Operating Frequency

Table 27: Module Operating Frequencies

Band Receive Transmit Unit

GSM850 869 ~ 894 824 ~ 849 MHz

PCS1900 1930 ~ 1990 1850 ~ 1910 MHz

UMTS1900 1930 ~ 1990 1850 ~ 1910 MHz

UMTS850 869 ~ 894 824 ~ 849 MHz

4.1.3. Reference Design

The RF interface has an impedance of 50Ω.The reference design of RF antenna is shown as below. It

should reserve a π-type matching circuit for better RF performance. The capacitors are not mounted by

default.

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Figure 38: Reference Circuit of Antenna Interface

4.2. Antenna Installation

4.2.1. Antenna Requirement

The following table shows the requirements on GSM/UMTS antenna.

Table 28: Antenna Requirements

Type Requirements

GSM850

UMTS850

PCS1900

UMTS1900

4.2.2. Install the Antenna with RF Connector

The following is the antenna installation with RF connector provided by HIROSE. The recommended RF

connector is UF.L-R-SMT.

Cable insertion loss < 0.5dB.

Cable insertion loss < 0.9dB.

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Figure 39: Dimensions of the UF.L-R-SMT Connector (Unit: mm)

You can use U.FL-LP serial connector listed in the following figure to match the UF.L-R-SMT.

Figure 40: Mechanicals of UF.L-LP Connectors (Unit: mm)

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The following figure describes the space factor of mated connector:

Figure 41: Space Factor of Mated Connector (Unit: mm)

For more details, please visit http://www.hirose.com.

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5 Electrical, Reliability and Radio

Characteristics

5.1. Absolute Maximum Ratings

Absolute maximum ratings for power supply and voltage on digital and analog pins of module are listed in

the following table:

Table 29: Absolute Maximum Ratings

Parameter Min. Max. Unit

VBAT_RF/VBAT_BB -0.5 4.7 V

USB_VBUS -0.5 6.0 V

Peak Current of VBAT_BB 0 0.8 A

Peak Current of VBAT_RF 0 1.8 A

Voltage at Digital Pins (1.8V digital I/O) -0.3 2.1 V

Voltage at Digital Pins (2.6V digital I/O) -0.3 2.9 V

Voltage at ADC0 0 2.2 V

Voltage at ADC1 0 2.2 V

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5.2. Power Supply Ratings

Table 30: The Module Power Supply Ratings

Parameter Description Conditions Min. Typ. Max. Unit

Voltage must stay within the

min/max values, including voltage

drop, ripple, and spikes.

Maximum power control level on

GSM850

3.3 3.8 4.3 V

400 mV

VBAT

VBAT_BB and

VBAT_RF

Voltage drop

during

transmitting

burst

Peak supply

I

VBAT

current (during

transmission

Maximum power control level on

GSM850

1.8 2.0 A

slot)

USB_VBUS USB detection 3.0 5.0 5.25 V

5.3. Operating Temperature

The operating temperature is listed in the following table.

Table 31: Operating Temperature

Parameter Min. Typ. Max. Unit

Normal Temperature -35 +25 +75 ºC

Restricted Operation1) -40 ~ -35 +75 ~ +85 ºC

Storage Temperature -45 +90 ºC

NOTE

“1)” When the module works within the temperature range, the deviations from the RF specification may

occur. For example, the frequency error or the phase error would increase.

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5.4. Current Consumption

The values of current consumption are shown below.

Table 32: Module Current Consumption

Parameter Description Conditions Typ. Unit

3.6 @DRX=2

Sleep (USB disconnected)

2.5 @DRX=5

2.2 @DRX=9

mA

I

VBAT

GSM/GPRS

supply current

WCDMA

supply current

Sleep (USB suspended)

Idle (USB disconnected) @DRX=5 30 mA

Idle (USB connected) @DRX=5 60 mA

Sleep (USB disconnected)

Sleep (USB suspended)

Idle (USB disconnected) @DRX=6 30 mA

Idle (USB connected) @DRX=6 60 mA

GSM850 1DL/1UL @PCL=5 222 mA

3.8 @DRX=2

2.7 @DRX=5

2.4 @DRX=9

4.0 @DRX=6

3.0 @DRX=7

2.2 @DRX=8

2.1 @DRX=9

4.0 @DRX=6

3.0 @DRX=7

2.5 @DRX=8

2.2 @DRX=9

mA

GSM850 4DL/1UL @PCL=5 222 mA

GSM850 3DL/2UL @PCL=5 320 mA

GPRS data

transfer

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GSM850 2DL/3UL @PCL=5 403 mA

GSM850 1DL/4UL @PCL=5 459 mA

PCS1900 1DL/1UL @PCL=0 170 mA

PCS1900 4DL/1UL @PCL=0 170 mA

PCS1900 3DL/2UL @PCL=0 238 mA

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PCS1900 2DL/3UL @PCL=0 295 mA

PCS1900 1DL/4UL @PCL=0 331 mA

WCDMA data

transfer

GSM voice call

WCDMA voice

call

UMTS1900 HSDPA @max power 441 mA

UMTS850 HSDPA @max power 372 mA

GSM850 @PCL=5 239 mA

PCS1900 @PCL=0 183 mA

UMTS1900 @max power 520 mA

UMTS850 @max power 450 mA

5.5. RF Output Power

Table 33: Module Conducted RF Output Power

Frequency Max. Min.

GSM850 33dBm±2dB 5dBm±5dB

PCS1900 30dBm±2dB 0dBm±5dB

GSM850 (8-PSK) 27dBm±3dB 5dBm±5dB

PCS1900 (8-PSK) 26dBm+3/-4dB 0dBm±5dB

UMTS850 24dBm+1/-3dB -56dBm±5dB

UMTS1900 24dBm+1/-3dB -56dBm±5dB

NOTE

In GPRS 4 slots TX mode, the max output power is reduced by 2.5dB. This design conforms to the GSM

specification as described in Chapter 13.16 of 3GPP TS 51.010-1.

5.6. RF Receiving Sensitivity

Table 34: Module Conducted Receiving Sensitivity

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Frequency Receive Sensitivity (Typ.) Unit

GSM850 -108.5 dBm

PCS1900 -108.5 dBm

UMTS850 -110 dBm

UMTS1900 -110 dBm

5.7. Electrostatic Discharge

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject

to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and

packaging procedures must be applied throughout the processing, handling and operation of any

application that incorporates the module.

The following table shows the module electrostatics discharge characteristics.

Table 35: Electrostatics Discharge Characteristics

Tested Points Contact Discharge Air Discharge Unit

VBAT, GND ±5 ±10 kV

Antenna Interface ±4 ±8 kV

Other Interfaces ±0.5 ±1 kV

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6 Mechanical Dimensions

This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm.

6.1. Mechanical Dimensions of the Module

29+/-0.15

27.15

(2.5+/-0.2)

27.15

29+/-0.15

(1.0+/-0.1)

Figure 42: UC15 Top and Side Dimensions

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29

4.8

3.2

3.23.43.23.4

3.4

29

Figure 43: UC15 Bottom Dimensions (Bottom View)

Figure 44: Bottom Pads Dimensions (Bottom View)

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6.2. Footprint of Recommendation

14.50

12.60

4.8

0

1.0

0.9

1.3

14.50

9.7

5

0.6

5

0

0.4

0

3.1

0

3.5

6.5

0

9.7

0

14.50

9.7

5

0.6

5

0.8

0

9.6

0

4.8

0

4.8

A

0.1

0

6.7

0

9.6

0

0.9

0

0.7

0

2.3

0

3.9

0

1.6

0

1.6

0

A

1.1

0

1.1

0

0.8

3.0

2.0

0

2.0

0

3.0

0

2.5

0

0.8

0

Figure 45: Recommended Footprint (Top View)

NOTES

1. Refer to figure 2 about the pin distribution (especially for pin 65, 66, 67, 68).

2. The pins on area A are reserved, please keep them unconnected.

3. In order to maintain the module, keep about 3mm between the module and other components in the

host PCB.

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6.3. Top View of the Module

Figure 46: Top View of the Module

6.4. Bottom View of the Module

Figure 47: Bottom View of the Module

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7 Storage and Manufacturing

7.1. Storage

UC15 is stored in the vacuum-sealed bag. The restriction of storage condition is shown as below.

Shelf life in sealed bag is 12 months at < 40ºC/90%RH.

After this bag is opened, devices that will be subjected to reflow solder or other high temperature process

must be:

 Mounted within 72 hours at factory conditions of ≤ 30ºC/60%RH.

 Stored at < 10% RH.

Devices require bake, before mounting, if:

 Humidity indicator card is > 10% when read 23ºC±5ºC.

 Mounted for more than 72 hours at factory conditions of ≤ 30ºC/60% RH.

If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.

NOTE

As plastic container cannot be subjected to high temperature, module needs to be taken out from

container to high temperature (125ºC) bake. If shorter bake times are desired, please refer to

IPC/JEDECJ-STD-033 for bake procedure.

7.2. Manufacturing and Welding

The squeegee should push the paste on the surface of the stencil that makes the paste fill the stencil

openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to produce a

clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil at

the hole of the module pads should be 0.18mm. For details, please refer to document [4].

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It is suggested that peak reflow temperature is 235~245ºC (for SnAg3.0Cu0.5 alloy). Absolute max reflow

temperature is 260ºC. To avoid damage to the module when it was repeatedly heated, it is suggested that

the module should be mounted after the first panel has been reflowed. The following picture is the actual

diagram which we have operated.

Figure 48: Reflow Soldering Profile

7.3. Packaging

UC15 is packaged in the tap and reel carriers. One reel is 12.4m length and contains 250pcs modules.

The following figure shows the package details.

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Figure 49: Carrier Tape

Cover tape

Direction of feed

Unit: m

m

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8 Appendix A Reference

Table 36: Related Documents

SN Document Name Remark

[1] Quectel_UC15_AT_Commands_Manual UC15 AT commands manual

[2] Quectel_M10_EVB_User_Guide M10 EVB user guide

[3] Quectel_UC15_Reference_Design UC15 reference design

[4] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide

Table 37: Terms and Abbreviations

Abbreviation Description

AMR Adaptive Multi-rate

bps Bits Per Second

CHAP Challenge Handshake Authentication Protocol

CS Coding Scheme

CSD Circuit Switched Data

CTS Clear to Send

DRX Discontinuous Reception

DCE Data Communications Equipment (typical module)

DTE Data Terminal Equipment (typical computer, external controller)

DTR Data Terminal Ready

DTX Discontinuous Transmission

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EFR Enhanced Full Rate

EGSM Extended GSM900 Band (including standard GSM900 band)

ESD Electrostatic Discharge

FR Full Rate

GMSK Gaussian Minimum Shift Keying

GSM Global System for Mobile Communications

HR Half Rate

HSDPA High Speed Down Link Packet Access

IMEI International Mobile Equipment Identity

Imax Maximum Load Current

LED Light Emitting Diode

LSB Least Significant Bit

ME Mobile Equipment

MO Mobile Originated

MS Mobile Station (GSM Engine)

MT Mobile Terminated

PAP Password Authentication Protocol

PBCCH Packet Broadcast Control Channel

PCB Printed Circuit Board

PDU Protocol Data Unit

PPP Point-to-Point Protocol

PSK Phase Shift Keying

QAM Quadrature Amplitude Modulation

QPSK Quadrature Phase Shift Keying

RF Radio Frequency

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RMS Root Mean Square (value)

Rx Receive

SIM Subscriber Identification Module

SMS Short Message Service

TX Transmitting Direction

UART Universal Asynchronous Receiver & Transmitter

UMTS Universal Mobile Telecommunications System

URC Unsolicited Result Code

USIM Universal Subscriber Identity Module

USSD Unstructured Supplementary Service Data

Vmax Maximum Voltage Value

Vnorm Normal Voltage Value

Vmin Minimum Voltage Value

VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

VILmax Maximum Input Low Level Voltage Value

VILmin Minimum Input Low Level Voltage Value

VImax Absolute Maximum Input Voltage Value

VImin Absolute Minimum Input Voltage Value

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

WCDMA Wideband Code Division Multiple Access

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9 Appendix B GPRS Coding Scheme

Table 38: Description of Different Coding Schemes

Scheme

Code Rate

USF

Pre-coded USF

Radio Block excl.USF and BCS

BCS

Tail

Coded Bits

Punctured Bits

Data Rate Kb/s

CS-1 CS-2 CS-3 CS-4

1/2 2/3 3/4 1

3 3 3 3

3 6 6 12

181 268 312 428

40 16 16 16

4 4 4 -

456 588 676 456

0 132 220 -

9.05 13.4 15.6 21.4

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10 Appendix C GPRS Multi-slot Class

Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot

classes are product dependant, and determine the maximum achievable data rates in both the uplink and

downlink directions. Written as 3+1 or 2+2, the first number indicates the amount of downlink timeslots,

while the second number indicates the amount of uplink timeslots. The active slots determine the total

number of slots the GPRS device can use simultaneously for both uplink and downlink communications.

The description of different multi-slot classes is shown in the following table.

Table 39: Description of Different Coding Schemes

Multislot Class Dow nlink Slots Uplink Slots Active Slots

1 1 1 2

2 2 1 3

3 2 2 3

4 3 1 4

5 2 2 4

6 3 2 4

7 3 3 4

8 4 1 5

9 3 2 5

10 4 2 5

11 4 3 5

12 4 4 5

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11 Appendix D EDGE Modulation and

Coding Scheme

Table 40: EDGE Modulation and Coding Scheme

Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot

CS-1: GMSK / 9.05kbps 18.1kbps 36.2kbps

CS-2: GMSK / 13.4kbps 26.8kbps 53.6kbps

CS-3: GMSK / 15.6kbps 31.2kbps 62.4kbps

CS-4: GMSK / 21.4kbps 42.8kbps 85.6kbps

MCS-1 GMSK C 8.80kbps 17.60kbps 35.20kbps

MCS-2 GMSK B 11.2kbps 22.4kbps 44.8kbps

MCS-3 GMSK A 14.8kbps 29.6kbps 59.2kbps

MCS-4 GMSK C 17.6kbps 35.2kbps 70.4kbps

MCS-5 8-PSK B 22.4kbps 44.8kbps 89.6kbps

MCS-6 8-PSK A 29.6kbps 59.2kbps 118.4kbps

MCS-7 8-PSK B 44.8kbps 89.6kbps 179.2kbps

MCS-8 8-PSK A 54.4kbps 108.8kbps 217.6kbps

MCS-9 8-PSK A 59.2kbps 118.4kbps 236.8kbps

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Quectel Wireless Solutions 201404UC15 Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual