GC10 Hardware Design
GSM/GPRS Module Series
Rev. GC10_Hardware_Design_V2.0
Date: 2014-01-09
www.quectel.com
GSM/GPRS Module Series
GC10 Hardware Design
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Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
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GENERAL NOTES
QUECTEL OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THIS INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTABLE, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THIS CONTENTS ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2014. All rights reserved.
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About the Document
History
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Description |
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1.0 |
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2013-12-09 |
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Initial |
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1. |
Updated Figure 2: Pin assignment. |
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2014-01-09 |
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2. |
Modified the mechanical dimensions and the |
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recommended footprint of the module in Chapter 6. |
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3. |
Updated SIM card detection function. |
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Contents
About the Document................................................................................................................................... |
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Contents....................................................................................................................................................... |
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Table Index................................................................................................................................................... |
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Figure Index ................................................................................................................................................. |
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1 |
Introduction |
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1.1. |
Safety Information ................................................................................................................... |
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2 |
Product Concept ................................................................................................................................ |
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2.1. |
General Description............................................................................................................... |
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2.2. |
Directives and Standards ...................................................................................................... |
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2.2.1. |
FCC Statement............................................................................................................... |
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2.2.2. |
FCC Radiation Exposure Statement.............................................................................. |
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2.3. |
Key Features ......................................................................................................................... |
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2.4. |
Functional Diagram ............................................................................................................... |
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2.5. |
Evaluation Board ................................................................................................................... |
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Application Interface ......................................................................................................................... |
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3.1. |
Pin of Module......................................................................................................................... |
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3.1.1. |
Pin Assignment .............................................................................................................. |
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3.1.2. |
Pin Description ............................................................................................................... |
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3.2. |
Operating Modes................................................................................................................... |
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3.3. |
Power Supply ........................................................................................................................ |
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3.3.1. Power Features of Module............................................................................................. |
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3.3.2. Decrease Supply Voltage Drop...................................................................................... |
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3.3.3. Reference Design for Power Supply.............................................................................. |
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3.3.4. |
Monitor Power Supply.................................................................................................... |
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3.4. |
Power On and Down Scenarios............................................................................................ |
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3.4.1. |
Power On ....................................................................................................................... |
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3.4.2. |
Power Down................................................................................................................... |
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3.4.2.1. |
Power Down Module by the PWRKEY Pin ....................................................... |
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3.4.2.2. |
Power Down Module by AT Command ............................................................. |
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3.4.2.3. |
Over-voltage or Under-voltage Automatic Shutdown........................................ |
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3.4.2.4. |
Emergency Shutdown by EMERG_OFF Pin .................................................... |
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3.4.3. |
Restart............................................................................................................................ |
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3.5. |
Power Saving Technology..................................................................................................... |
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3.5.1. |
Minimum Functionality Mode ......................................................................................... |
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3.5.2. |
Sleep Mode .................................................................................................................... |
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3.5.3. Wake Up Module from Sleep Mode............................................................................... |
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3.5.4. |
Summary of State Transition.......................................................................................... |
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3.6. |
RTC Backup .......................................................................................................................... |
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3.7. |
Serial Interfaces..................................................................................................................... |
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3.7.1. |
UART Port ...................................................................................................................... |
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3.7.1.1. |
The Features of UART Port............................................................................... |
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3.7.1.2. |
The Connection of UART .................................................................................. |
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3.7.2. Debug and Upgrade Port ............................................................................................... |
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3.7.3. |
UART Application ........................................................................................................... |
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3.8. |
Audio Interfaces..................................................................................................................... |
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3.8.1. Decrease TDD Noise and Other Noises........................................................................ |
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3.8.2. |
Microphone Interfaces Design ....................................................................................... |
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3.8.3. |
Receiver Interface Design.............................................................................................. |
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3.8.4. |
Earphone Interface Design ............................................................................................ |
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3.8.5. |
Audio Characteristics ..................................................................................................... |
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3.9. |
SIM Card Interface ................................................................................................................ |
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3.9.1. |
SIM Card Application...................................................................................................... |
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3.9.2. |
SIM Cassette.................................................................................................................. |
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3.10. |
PCM Interface........................................................................................................................ |
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3.11. |
Behaviors of the RI................................................................................................................ |
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3.12. |
Network Status Indication...................................................................................................... |
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Antenna Interface............................................................................................................................... |
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4.1. |
RF Reference Design............................................................................................................ |
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4.2. |
RF Output Power................................................................................................................... |
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4.3. |
RF Receiving Sensitivity........................................................................................................ |
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4.4. |
Operating Frequencies.......................................................................................................... |
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4.5. |
RF Cable Soldering ............................................................................................................... |
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Electrical, Reliability and Radio Characteristics............................................................................ |
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5.1. |
Absolute Maximum Ratings................................................................................................... |
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5.2. |
Operating Temperature ......................................................................................................... |
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5.3. |
Power Supply Ratings........................................................................................................... |
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5.4. |
Current Consumption ............................................................................................................ |
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5.5. |
Electro-static Discharge ........................................................................................................ |
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Mechanical Dimensions .................................................................................................................... |
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6.1. |
Mechanical Dimensions of Module ....................................................................................... |
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6.2. |
Recommended Footprint....................................................................................................... |
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Storage and Manufacturing .............................................................................................................. |
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7.1. |
Storage .................................................................................................................................. |
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7.2. |
Soldering ............................................................................................................................... |
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7.3. |
Packaging.............................................................................................................................. |
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7.3.1. Tape and Reel Packaging .............................................................................................. |
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Appendix A Reference....................................................................................................................... |
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Appendix B GPRS Coding Scheme ................................................................................................. |
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Appendix C GPRS Multi-slot Class.................................................................................................. |
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Table Index |
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TABLE 1: MODULE KEY FEATURES ................................................................................................................ |
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TABLE 2: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE........................ |
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TABLE 3: PIN DESCRIPTION........................................................................................................................... |
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TABLE 4: OVERVIEW OF OPERATING MODES............................................................................................. |
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TABLE 5: SUMMARY OF STATE TRANSITION ............................................................................................... |
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TABLE 6: LOGIC LEVELS OF THE UART INTERFACES ................................................................................ |
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TABLE 7: PIN DEFINITION OF THE UART INTERFACES .............................................................................. |
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TABLE 8: PIN DEFINITION OF AUDIO INTERFACE ....................................................................................... |
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TABLE 9: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS........................................................... |
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TABLE 10: TYPICAL AUDIO OUTPUT CHARACTERISTICS .......................................................................... |
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TABLE 11: PIN DEFINITION OF THE SIM INTERFACE .................................................................................. |
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TABLE 12: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER ........................................................... |
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TABLE 13: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER .................................................................. |
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TABLE 14: BEHAVIOURS OF THE RI .............................................................................................................. |
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TABLE 15: WORKING STATE OF THE NETLIGHT.......................................................................................... |
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TABLE 16: PIN DEFINITION OF THE RF_ANT................................................................................................ |
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TABLE 17: THE MODULE CONDUCTED RF OUTPUT POWER .................................................................... |
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TABLE 18: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY....................................................... |
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TABLE 19: THE MODULE OPERATING FREQUENCIES................................................................................ |
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TABLE 20: ABSOLUTE MAXIMUM RATINGS .................................................................................................. |
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TABLE 21: OPERATING TEMPERATURE........................................................................................................ |
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TABLE 22: THE MODULE POWER SUPPLY RATINGS .................................................................................. |
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TABLE 23: THE MODULE CURRENT CONSUMPTION .................................................................................. |
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TABLE 24: THE ESD ENDURANCE (TEMPERATURE: 25 , HUMIDITY: 45 %) ........................................... |
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TABLE 25: RELATED DOCUMENTS................................................................................................................ |
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TABLE 26: TERMS AND ABBREVIATIONS...................................................................................................... |
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TABLE 27: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................................. |
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TABLE 28: GPRS MULTI-SLOT CLASSES ...................................................................................................... |
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Figure Index |
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FIGURE 1: MODULE FUNCTIONAL DIAGRAM............................................................................................... |
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FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... |
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FIGURE 3: VOLTAGE DROP DURING TRANSMITTING................................................................................. |
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FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT ........................................................................... |
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FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY............................................................................ |
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FIGURE 6: REFERENCE DIAGRAM FOR SWITCHING POWER CONVERTER ........................................... |
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FIGURE 7: TURN ON THE MODULE WITH AN OC DRIVER.......................................................................... |
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FIGURE 8: TURN ON THE MODULE WITH A BUTTON .................................................................................. |
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FIGURE 9: TURN-ON TIMING .......................................................................................................................... |
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FIGURE 10: TURN-OFF TIMING ...................................................................................................................... |
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FIGURE 11: AN OC DRIVER FOR EMERG_OFF ............................................................................................ |
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FIGURE 12: REFERENCE CIRCUIT FOR EMERG_OFF BY BUTTON .......................................................... |
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FIGURE 13: TIMING OF RESTARTING SYSTEM............................................................................................ |
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FIGURE 14: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN ................................ |
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FIGURE 15: RTC SUPPLIED FROM A NON-CHARGEABLE BATTERY......................................................... |
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FIGURE 16: RTC SUPPLIED FROM A RECHARGEABLE BATTERY ............................................................. |
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FIGURE 17: RTC SUPPLIED FROM A CAPACITOR ....................................................................................... |
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FIGURE 18: CHARGING CHARACTERISTICS OF SEIKO’S XH414H-IV01E ................................................ |
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FIGURE 19: REFERENCE DESIGN FOR FULL-FUNCTION UART................................................................ |
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FIGURE 20: REFERENCE DESIGN FOR UART PORT................................................................................... |
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FIGURE 21: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL .................... |
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FIGURE 22: THE CONNECTION OF FIRMWARE DEBUGGING AND UPGRADE......................................... |
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FIGURE 23: LEVEL MATCH DESIGN FOR 3.3V SYSTEM.............................................................................. |
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FIGURE 24: LEVEL MATCH DESIGN FOR 5V SYSTEM................................................................................. |
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FIGURE 25: LEVEL MATCH DESIGN FOR RS-232......................................................................................... |
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FIGURE 26: REFERENCE DESIGN FOR AIN1&AIN2 ..................................................................................... |
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FIGURE 27: REFERENCE RECEIVER INTERFACE DESIGN OF AOUT1 ..................................................... |
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FIGURE 28: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1................................ |
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FIGURE 29: REFERENCE RECEIVER INTERFACE DESIGN OF AOUT2 ..................................................... |
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FIGURE 30: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2................................ |
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FIGURE 31: EARPHONE INTERFACE DESIGN.............................................................................................. |
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FIGURE 32: REFERENCE CIRCUIT FOR 8-PIN SIM CARD HOLDER .......................................................... |
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FIGURE 33: REFERENCE CIRCUIT FOR 6-PIN SIM CARD HOLDER .......................................................... |
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FIGURE 34: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER.............................................................. |
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FIGURE 35: MOLEX 91228 SIM CARD HOLDER............................................................................................ |
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FIGURE 36: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER ............................................................. |
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FIGURE 37: RI BEHAVIOUR AS A CALLER..................................................................................................... |
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FIGURE 38: RI BEHAVIOUR OF URC OR SMS RECEIVED........................................................................... |
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FIGURE 39: REFERENCE DESIGN FOR NETLIGHT ..................................................................................... |
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FIGURE 40: REFERENCE DESIGN FOR RF .................................................................................................. |
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FIGURE 41: RF SOLDERING SAMPLE ........................................................................................................... |
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FIGURE 42: GC10 MODULE TOP AND SIDE DIMENSIONS (UNIT: MM) |
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FIGURE 43: GC10 MODULE BOTTOM DIMENSIONS (UNIT: MM) ................................................................ |
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FIGURE 44: RECOMMENDED FOOTPRINT (UNIT: MM)................................................................................ |
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FIGURE 48: RAMP-SOAK-SPIKE REFLOW PROFILE.................................................................................... |
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FIGURE 49: DIMENSIONS OF TAPE ............................................................................................................... |
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FIGURE 50: DIMENSIONS OF REEL............................................................................................................... |
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FIGURE 51: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3........................................................... |
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FIGURE 52: RADIO BLOCK STRUCTURE OF CS-4....................................................................................... |
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GSM/GPRS Module Series
GC10 Hardware Design
1 Introduction
This document defines the GC10 module and describes its hardware interface which are connected with your application and the air interface.
This document can help you quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, you can use GC10 module to design and set up mobile applications easily.
1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating GC10 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for your failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobie while driving (even with a handsfree kit) cause distraction and can lead to an accident. You must comply with laws and regulations restrcting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft. If your device offers a Flight Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are desinged to prevent possible interference with sentitive medical equipment.
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GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON , it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.
In locations with potencially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potencially exposive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders.
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2 Product Concept
2.1. General Description
GC10 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The GC10 features GPRS multi-slot class 10 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix B&C.
With a tiny profile of 19mm×16.9mm×2.35mm, the module can meet almost all the requirements for M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA, Smart Metering, and Remote Maintenance & Control, etc.
GC10 is an SMD type module, which can be easily embedded into applications through its 44-pin pads. It provides abundant hardware interfaces like Audio and UART Interface.
Designed with power saving technique, the current consumption of GC10 is as low as 1.3mA in sleep mode when DRX is 5.
GC10 is integrated with Internet service protocols, such as TCP/UDP, HTTP and PPP. Extended AT commands have been developed for you to use these Internet service protocols easily.
The module fully complies with the RoHS directive of the European Union.
2.2. Directives and Standards
The GC10 module is designed to comply with the FCC statements. FCC ID: XMR201403GC10
The Host system using GC10, should have label indicated FCC ID: XMR201403GC10.
2.2.1.FCC Statement
1. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions:
a)This device may not cause harmful interference.
b)This device must accept any interference received, including interference that may cause undesired
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operation.
2. Changes or modifications not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment.
2.2.2.FCC Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage. This module should NOT be installed and operating simultaneously with other radio.
The manual of the host system, which uses GC10, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of GC10 module depending on the Mobile status.
Note: If a portable device (such as PDA) uses GC10 module, the device needs to do permissive change and SAR testing.
The following list of antenna is indicating the maximum permissible antenna gain.
Part Number |
Frequency |
Peak Gain |
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VSWR |
Impedance |
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Range (MHz) |
(XZ-V) |
(XZ-V) |
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3R007A |
PCS1900:1850~1990 |
1 dBi typ. |
1 dBi typ. |
3 max |
50Ω |
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GSM850:824-894 |
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2.3. Key Features
The following table describes the detailed features of GC10 module.
Table 1: Module Key Features
Feature |
Implementation |
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Single supply voltage: 3.3V~4.6V
Power Supply
Typical supply voltage: 4.0V
Typical power consumption in sleep mode: 1.3 mA@ DRX=5
Power Saving
1.1 mA@ DRX=9
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Quad-band: GSM850/GSM900/DCS1800/PCS1900 |
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Frequency Bands |
The module can search these frequency bands automatically |
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Compliant to GSM Phase 2/2+ |
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Transmitting Power |
Class 4 (2W) at GSM850/GSM900 |
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Class 1 (1W) at DCS1800/PCS1900 |
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GPRS Connectivity |
GPRS multi-slot class 10 |
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GPRS mobile station class B |
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Normal operation: -35°C~ +80°C |
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Temperature Range |
Restricted operation: -40°C ~ -35°C and +80°C ~ +85°C 1) |
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Storage temperature: -45°C ~ +90°C |
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GPRS data downlink transfer: max. 85.6kbps |
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GPRS data uplink transfer: max. 42.8kbps |
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DATA GPRS |
Coding scheme: CS-1, CS-2, CS-3 and CS-4 |
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Internet service protocols TCP/UDP, PPP, HTTP |
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Support Packet Broadcast Control Channel (PBCCH) |
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USSD |
Support Unstructured Supplementary Service Data |
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SMS |
MT/MO, Text and PDU mode |
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SMS storage: SIM card |
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SIM Interface |
Support SIM card: 1.8V/3.0V |
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Speech codec modes: |
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Half Rate (ETS 06.20) |
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Full Rate (ETS 06.10) |
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Audio Features |
Enhanced Full Rate (ETS 06.50/06.60/06.80) |
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Echo Suppression |
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Echo Cancellation |
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Noise Reduction |
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UART Port: |
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Seven lines on UART port interface |
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Used for AT command, GPRS data |
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Support fixed baud rate from 2400bps to 460800bps |
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UART Interfaces |
Support autobauding from 4800bps to 115200bps |
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Debug Port: |
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Two lines on debug port interface DBG_TXD and DBG_RXD |
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Used for firmware debugging and log output |
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Used for firmware upgrade |
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The baud rate is fixed at 921600bps |
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Phonebook Management |
Support phonebook types: SM/ON/FD/LD |
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SIM Application Toolkit |
Support SAT class 3, GSM 11.14 Release 99 |
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Real Time Clock |
Supported |
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Physical Characteristics |
Size: 19±0.15×16.9±0.15×2.35±0.2mm |
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Weight: Approx.1.3g |
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Firmware Upgrade |
Firmware upgrade via debug port |
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Antenna Interface |
Connected to antenna pad with 50 Ohm impedance control |
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NOTE
When the module works within this temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased.
Table 2: Coding Schemes and Maximum Net Data Rates over Air Interface
Coding Scheme |
1 Timeslot |
2 Timeslot |
4 Timeslot |
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CS-1 |
9.05kbps |
18.1kbps |
36.2kbps |
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CS-2 |
13.4kbps |
26.8kbps |
53.6kbps |
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CS-3 |
15.6kbps |
31.2kbps |
62.4kbps |
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CS-4 |
21.4kbps |
42.8kbps |
85.6kbps |
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2.4. Functional Diagram
The following figure shows a block diagram of GC10 and illustrates the major functional parts.
Radio frequency part
Power management
Memory
The peripheral interface —Power supply —Turn-on/off interface —UART interfaces —Audio interfaces —SIM interface —PCM interface —RTC interface
—RF interface
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Figure 1: Module Functional Diagram
2.5. Evaluation Board
In order to help you to develop applications with GC10, Quectel supplies an evaluation board (EVB) with RS-232 to USB cable, power adapter, antenna, firmware upgrade cable (UART to USB cable) and other peripherals to control or test the module. For details, please refer to the document [11].
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3 Application Interface
The module adopts 44-pin pads with LCC package. The following chapters provide detailed descriptions about these pins below.
Power supply (Please refer to chapter 3.3)
Power on/down (Please refer to chapter 3.4)
Power saving technology (Please refer to chapter 3.5)
RTC (Please refer to chapter 3.6)
Serial interfaces (Please refer to chapter 3.7)
Audio interfaces (Please refer to chapter 3.8)
SIM interface (Please refer to chapter 3.9)
PCM interface (Please refer to chapter 3.10)
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3.1. Pin of Module
3.1.1.Pin Assignment
Figure 2: Pin Assignment
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3.1.2.Pin Description
Table 3: Pin Description
Power Supply
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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Main power supply of |
Vmax= 4.6V |
Make sure that supply |
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sufficient current in a |
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VBAT |
33,34 |
I |
module: |
Vmin=3.3V |
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transmitting burst |
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VBAT=3.3V~4.6V |
Vnorm=4.0V |
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typically rises to 1.6A. |
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Power supply for RTC |
VImax=3.3V |
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VImin=2.0V |
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when VBAT is not |
Recommended to be |
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VInorm=2.8V |
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supplied for the system. |
connected to a backup |
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VOmax=2.9V |
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VRTC |
13 |
I/O |
Charging for backup |
battery or a golden |
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VOmin=2.7V |
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battery or golden |
capacitor. If unused, |
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VOnorm=2.8V |
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capacitor when the VBAT |
keep this pin open. |
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Iout(max)=1.35mA |
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is applied. |
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Iin=70uA |
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Recommend to add a |
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Vmax=3.1V |
2.2 or 4.7uF bypass |
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VDD_EXT |
29 |
O |
Supply 3.0V voltage for |
Vmin=2.9V |
capacitor, when using |
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external circuit. |
Vnorm=3.0V |
this pin for power |
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Imax=20mA |
supply. If unused, |
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keep this pin open. |
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32,35, |
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GND |
36,37, |
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Ground |
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39 |
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Turn on/off |
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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Power on/off key. |
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PWRKEY should be |
VILmax=2.0V |
Recommend to add an |
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PWRKEY |
5 |
I |
pulled down for a |
VIHmin=2.3V |
OC driver circuit to |
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moment to turn on or |
VImax=3.3V |
control this pin. |
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turn off the system. |
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Emergency Shutdown |
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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Emergency off. Pulled |
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down for at least 10ms, |
Pulled up to VDD_EXT |
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which will turn off the |
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internally. OC/OD |
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EMERG_ |
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VILmax= |
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module in case of |
driver required in |
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OFF |
40 |
I |
0.3×VDD_EXT |
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emergency. Use it only |
cellular device |
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VIHmin= |
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when shutdown via |
application. If unused, |
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0.7×VDD_EXT |
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PWRKEY or AT |
keep this pin open. |
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command cannot be |
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achieved.
Module Indicator
Pin
Pin Name I/O Description DC Characteristics Comment
NO.
VOLmin=0V
VOLmax=
0.3×VDD_EXT
If unused, keep this
NETLIGHT 14 O Network status indication VOHmin=
pin open.
0.7×VDD_EXT VOHmax=
VDD_EXT
Audio Interfaces
Pin
Pin Name I/O Description DC Characteristics Comment
NO.
MIC1P |
19,20 |
Channel 1 positive and |
MIC1N |
I |
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negative voice input |
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SPK1P |
21,22 |
Channel 1 positive and |
SPK1N |
O |
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negative voice output |
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MIC2P |
17,18 |
Channel 2 positive and |
MIC2N |
I |
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negative voice input |
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SPK2P |
16 |
Channel 2 single-ended |
O |
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voice output |
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AGND |
15 |
Audio analog ground. |
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Main audio channel. |
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Recommended to add |
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ESD protection |
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components at the |
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MIC1P/N lines. If |
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unused, keep these |
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pins open. |
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For Audio DC |
Auxiliary audio |
characteristics refer |
channel. |
to Chapter 3.9. |
Recommended to add |
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ESD protection |
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components at the |
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MIC2P/N lines. If |
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unused, keep these |
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pins open. |
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Separate ground |
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connection for external |
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audio circuits. |
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UART Port
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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RI |
6 |
O |
Ring indication |
VILmin=0V |
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VILmax= |
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DTR |
7 |
I |
Data terminal ready |
0.3×VDD_EXT |
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VIHmin= |
If only use TXD, RXD |
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DCD |
8 |
O |
Data carrier detection |
0.7×VDD_EXT |
and GND to |
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VIHmax= |
communicate, |
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TXD |
9 |
O |
Transmit data |
VDD_EXT |
recommended |
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VOLmin=0V |
connecting RTS to |
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RXD |
10 |
I |
Receive data |
VOLmax= |
GND via a 0R resistor |
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0.3×VDD_EXT |
and keeping other pins |
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RTS |
11 |
I |
Request to send |
VOHmin= |
open. |
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0.7×VDD_EXT |
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CTS |
12 |
O |
Clear to send |
VOHmax= |
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VDD_EXT |
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Debug Port |
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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VILmin=0V |
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VILmax= |
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0.3×VDD_EXT |
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DBG_TXD |
31 |
O |
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VIHmin= |
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0.7×VDD_EXT |
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Used for firmware |
VIHmax= |
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debugging and upgrade. |
VDD_EXT |
If unused, keep these |
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The baud rate is fixed at |
VOLmin=0V |
pins open. |
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921600bps. |
VOLmax= |
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0.3×VDD_EXT |
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DBG_RXD |
30 |
I |
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VOHmin= |
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0.7×VDD_EXT |
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VOHmax=
VDD_EXT
SIM Interface
Pin Name |
Pin |
I/O Description |
DC Characteristics |
Comment |
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NO. |
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The voltage can be |
All signals of SIM |
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SIM_VDD |
23 |
Power supply for SIM |
selected by software |
interface should be |
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O |
automatically. Either |
protected against ESD |
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card |
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1.8V or 3V. |
with a TVS diode |
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SIM_RST |
24 |
O |
SIM reset |
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array. Maximum trace |
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length is 100mm from |
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SIM_ DATA |
25 |
I/O |
SIM data |
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the module pad to SIM |
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card holder. |
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SIM_CLK |
26 |
O |
SIM clock |
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SIM_GND |
27 |
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SIM ground |
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VILmin=0V |
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SIM_PRESENCE |
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VILmax= |
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must be pulled up by |
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SIM_ |
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0.3×VDD_EXT |
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28 |
I |
SIM card detection |
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an external resistor |
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PRESENCE |
VIHmin= |
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when SIM card |
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0.7×VDD_EXT |
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detection function is |
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VIHmax= |
used.
VDD_EXT
PCM Interface
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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VILmin=0V |
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PCM_ IN |
1 |
I |
PCM data input |
VILmax= |
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0.3×VDD_EXT |
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VIHmin= |
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PCM_SYNC |
2 |
O |
PCM frame |
0.7×VDD_EXT |
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synchronization |
VIHmax= |
PCM function is not |
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VDD_EXT |
supported at present. |
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VOLmin=0V |
If unused, keep these |
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PCM_ OUT |
3 |
O |
PCM data output |
VOLmax= |
pins open. |
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0.3×VDD_EXT |
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VOHmin= |
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PCM_ CLK |
4 |
O |
PCM clock |
0.7×VDD_EXT |
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VOHmax= |
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VDD_EXT |
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RF Interface |
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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RF_ANT |
38 |
I/O |
RF antenna pad |
Impedance of 50Ω |
Please refer to |
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Chapter 4 |
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Other Interface |
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Pin Name |
Pin |
I/O |
Description |
DC Characteristics |
Comment |
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NO. |
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RESERVED |
41,42, |
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Please keep these |
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43,44 |
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pins open. |
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3.2. Operating Modes
The table below briefly summarizes the various operating modes in the following chapters.
Table 4: Overview of Operating Modes
Mode
Normal Operation
Mode
Power Down Mode
Minimum Functionality
Mode
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NOTE
Use the EMERG_OFF pin only when failing to turn off the module by the command “AT+QPOWD=1” and the PWRKEY pin. For more details, please refer to Section 3.4.2.4.
3.3. Power Supply
3.3.1.Power Features of Module
The power supply is one of the key issues in designing GSM terminals. Because of the 577us radio burst in GSM every 4.615 ms, power supply must be able to deliver high current peaks in a burst period. During these peaks, drops on the supply voltage must not exceed minimum working voltage of module.
For GC10 module, the max current consumption could reach to 1.6A during a transmit burst. It will cause a large voltage drop on the VBAT. In order to ensure stable operation of the module, it is recommended that the max voltage drop during the transmit burst does not exceed 400mV.
Figure 3: Voltage Drop during Transmitting
3.3.2.Decrease Supply Voltage Drop
The power supply range of the module is 3.3V to 4.6V. Make sure that the input voltage will never drop below 3.3V even in a transmitting burst. If the power voltage drops below 3.3V, the module could turn off automatically. For better power performance, it is recommended to place a 1000uF tantalum capacitor with low ESR and ceramic capacitor 100nF, 47pF and 10pF near the VBAT pin. The reference circuit is illustrated in Figure 4.
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GC10 Hardware Design
The VBAT route should be wide enough to ensure that there is not too much voltage drop during transmit burst. The width of trace should be no less than 2mm and the principle of the VBAT route is the longer route, the wider trace.
Figure 4: Reference Circuit for the VBAT Input
3.3.3.Reference Design for Power Supply
The power design for the module is very important, since the performance of power supply for the module largely depends on the power source. The power supply is capable of providing the sufficient current to 2A at least. If the voltage drop between the input and output is not too high, it is suggested to use a LDO as module’s power supply. If there is a big voltage difference between the input source and the desired output (VBAT), a switching power converter is recommended to be used as a power supply.
Figure 5 shows a reference design for +5V input power source. The designed output for the power supply is 4.16V and the maximum load current is 3A. In addition, in order to get a stable output voltage, a zener diode is placed close to the pins of VBAT. As to the zener diode, it is suggested to use a zener diode whose reverse zener voltage is 5.1V and dissipation power is more than 1 Watt.
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