Quectel Wireless Solutions 201403GC10 Manual

GC10 Hardware Design

GSM/GPRS Module Series

Rev. GC10_Hardware_Design_V2.0

Date: 2014-01-09

www.quectel.com

GSM/GPRS Module Series

GC10 Hardware Design

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Quectel Wireless Solutions Co., Ltd.

Room 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233

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Mail: [e-mail]

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GENERAL NOTES

QUECTEL OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT PRIOR NOTICE.

COPYRIGHT

THIS INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTABLE, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THIS CONTENTS ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2014. All rights reserved.

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About the Document

History

Revision		Date		Author	Description
1.0		2013-12-09		King HAO	Initial
					1.	Updated Figure 2: Pin assignment.
2.0		2014-01-09		King HAO	2.	Modified the mechanical dimensions and the
						recommended footprint of the module in Chapter 6.
					3.	Updated SIM card detection function.

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Contents

About the Document...................................................................................................................................					2
Contents.......................................................................................................................................................					3
Table Index...................................................................................................................................................					5
Figure Index .................................................................................................................................................					6
1	Introduction		..........................................................................................................................................		8
	1.1.	Safety Information ...................................................................................................................			8
2	Product Concept ................................................................................................................................				10
	2.1.	General Description...............................................................................................................			10
	2.2.	Directives and Standards ......................................................................................................			10
		2.2.1.	FCC Statement...............................................................................................................		10
		2.2.2.	FCC Radiation Exposure Statement..............................................................................		11
	2.3.	Key Features .........................................................................................................................			11
	2.4.	Functional Diagram ...............................................................................................................			13
	2.5.	Evaluation Board ...................................................................................................................			14
3	Application Interface .........................................................................................................................				15
	3.1.	Pin of Module.........................................................................................................................			16
		3.1.1.	Pin Assignment ..............................................................................................................		16
		3.1.2.	Pin Description ...............................................................................................................		17
	3.2.	Operating Modes...................................................................................................................			21
	3.3.	Power Supply ........................................................................................................................			22
		3.3.1. Power Features of Module.............................................................................................			22
		3.3.2. Decrease Supply Voltage Drop......................................................................................			22
		3.3.3. Reference Design for Power Supply..............................................................................			23
		3.3.4.	Monitor Power Supply....................................................................................................		24
	3.4.	Power On and Down Scenarios............................................................................................			24
		3.4.1.	Power On .......................................................................................................................		24
		3.4.2.	Power Down...................................................................................................................		26
		3.4.2.1.		Power Down Module by the PWRKEY Pin .......................................................	27
		3.4.2.2.		Power Down Module by AT Command .............................................................	28
		3.4.2.3.		Over-voltage or Under-voltage Automatic Shutdown........................................	28
		3.4.2.4.		Emergency Shutdown by EMERG_OFF Pin ....................................................	29
		3.4.3.	Restart............................................................................................................................		30
	3.5.	Power Saving Technology.....................................................................................................			31
		3.5.1.	Minimum Functionality Mode .........................................................................................		31
		3.5.2.	Sleep Mode ....................................................................................................................		31
		3.5.3. Wake Up Module from Sleep Mode...............................................................................			32
		3.5.4.	Summary of State Transition..........................................................................................		32
	3.6.	RTC Backup ..........................................................................................................................			32
	3.7.	Serial Interfaces.....................................................................................................................			34
		3.7.1.	UART Port ......................................................................................................................		36
		3.7.1.1.		The Features of UART Port...............................................................................	36

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		3.7.1.2.		The Connection of UART ..................................................................................	37
	3.7.2. Debug and Upgrade Port ...............................................................................................				38
	3.7.3.		UART Application ...........................................................................................................		39
	3.8.	Audio Interfaces.....................................................................................................................			41
	3.8.1. Decrease TDD Noise and Other Noises........................................................................				42
	3.8.2.		Microphone Interfaces Design .......................................................................................		43
	3.8.3.		Receiver Interface Design..............................................................................................		44
	3.8.4.		Earphone Interface Design ............................................................................................		46
	3.8.5.		Audio Characteristics .....................................................................................................		46
	3.9.	SIM Card Interface ................................................................................................................			47
	3.9.1.		SIM Card Application......................................................................................................		47
	3.9.2.		SIM Cassette..................................................................................................................		49
	3.10.	PCM Interface........................................................................................................................			52
	3.11.	Behaviors of the RI................................................................................................................			52
	3.12.	Network Status Indication......................................................................................................			53
4	Antenna Interface...............................................................................................................................				55
	4.1.	RF Reference Design............................................................................................................			55
	4.2.	RF Output Power...................................................................................................................			56
	4.3.	RF Receiving Sensitivity........................................................................................................			56
	4.4.	Operating Frequencies..........................................................................................................			57
	4.5.	RF Cable Soldering ...............................................................................................................			57
5	Electrical, Reliability and Radio Characteristics............................................................................				58
	5.1.	Absolute Maximum Ratings...................................................................................................			58
	5.2.	Operating Temperature .........................................................................................................			59
	5.3.	Power Supply Ratings...........................................................................................................			59
	5.4.	Current Consumption ............................................................................................................			60
	5.5.	Electro-static Discharge ........................................................................................................			61
6	Mechanical Dimensions ....................................................................................................................				63
	6.1.	Mechanical Dimensions of Module .......................................................................................			63
	6.2.	Recommended Footprint.......................................................................................................			65
7	Storage and Manufacturing ..............................................................................................................				66
	7.1.	Storage ..................................................................................................................................			66
	7.2.	Soldering ...............................................................................................................................			67
	7.3.	Packaging..............................................................................................................................			68
	7.3.1. Tape and Reel Packaging ..............................................................................................				68
8	Appendix A Reference.......................................................................................................................				70
9	Appendix B GPRS Coding Scheme .................................................................................................				74
10	Appendix C GPRS Multi-slot Class..................................................................................................				76

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Table Index
TABLE 1: MODULE KEY FEATURES ................................................................................................................	11
TABLE 2: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE........................	13
TABLE 3: PIN DESCRIPTION...........................................................................................................................	17
TABLE 4: OVERVIEW OF OPERATING MODES.............................................................................................	21
TABLE 5: SUMMARY OF STATE TRANSITION ...............................................................................................	32
TABLE 6: LOGIC LEVELS OF THE UART INTERFACES ................................................................................	35
TABLE 7: PIN DEFINITION OF THE UART INTERFACES ..............................................................................	35
TABLE 8: PIN DEFINITION OF AUDIO INTERFACE .......................................................................................	41
TABLE 9: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS...........................................................	46
TABLE 10: TYPICAL AUDIO OUTPUT CHARACTERISTICS ..........................................................................	46
TABLE 11: PIN DEFINITION OF THE SIM INTERFACE ..................................................................................	47
TABLE 12: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER ...........................................................	50
TABLE 13: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ..................................................................	51
TABLE 14: BEHAVIOURS OF THE RI ..............................................................................................................	52
TABLE 15: WORKING STATE OF THE NETLIGHT..........................................................................................	53
TABLE 16: PIN DEFINITION OF THE RF_ANT................................................................................................	55
TABLE 17: THE MODULE CONDUCTED RF OUTPUT POWER ....................................................................	56
TABLE 18: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY.......................................................	56
TABLE 19: THE MODULE OPERATING FREQUENCIES................................................................................	57
TABLE 20: ABSOLUTE MAXIMUM RATINGS ..................................................................................................	58
TABLE 21: OPERATING TEMPERATURE........................................................................................................	59
TABLE 22: THE MODULE POWER SUPPLY RATINGS ..................................................................................	59
TABLE 23: THE MODULE CURRENT CONSUMPTION ..................................................................................	60
TABLE 24: THE ESD ENDURANCE (TEMPERATURE: 25 , HUMIDITY: 45 %) ...........................................	62
TABLE 25: RELATED DOCUMENTS................................................................................................................	70
TABLE 26: TERMS AND ABBREVIATIONS......................................................................................................	71
TABLE 27: DESCRIPTION OF DIFFERENT CODING SCHEMES ..................................................................	74
TABLE 28: GPRS MULTI-SLOT CLASSES ......................................................................................................	76

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Figure Index
FIGURE 1: MODULE FUNCTIONAL DIAGRAM...............................................................................................	14
FIGURE 2: PIN ASSIGNMENT .........................................................................................................................	16
FIGURE 3: VOLTAGE DROP DURING TRANSMITTING.................................................................................	22
FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT ...........................................................................	23
FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY............................................................................	24
FIGURE 6: REFERENCE DIAGRAM FOR SWITCHING POWER CONVERTER ...........................................	24
FIGURE 7: TURN ON THE MODULE WITH AN OC DRIVER..........................................................................	25
FIGURE 8: TURN ON THE MODULE WITH A BUTTON ..................................................................................	25
FIGURE 9: TURN-ON TIMING ..........................................................................................................................	26
FIGURE 10: TURN-OFF TIMING ......................................................................................................................	27
FIGURE 11: AN OC DRIVER FOR EMERG_OFF ............................................................................................	29
FIGURE 12: REFERENCE CIRCUIT FOR EMERG_OFF BY BUTTON ..........................................................	29
FIGURE 13: TIMING OF RESTARTING SYSTEM............................................................................................	30
FIGURE 14: TIMING OF RESTARTING SYSTEM AFTER EMERGENCY SHUTDOWN ................................	30
FIGURE 15: RTC SUPPLIED FROM A NON-CHARGEABLE BATTERY.........................................................	33
FIGURE 16: RTC SUPPLIED FROM A RECHARGEABLE BATTERY .............................................................	33
FIGURE 17: RTC SUPPLIED FROM A CAPACITOR .......................................................................................	33
FIGURE 18: CHARGING CHARACTERISTICS OF SEIKO’S XH414H-IV01E ................................................	34
FIGURE 19: REFERENCE DESIGN FOR FULL-FUNCTION UART................................................................	37
FIGURE 20: REFERENCE DESIGN FOR UART PORT...................................................................................	38
FIGURE 21: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL ....................	38
FIGURE 22: THE CONNECTION OF FIRMWARE DEBUGGING AND UPGRADE.........................................	39
FIGURE 23: LEVEL MATCH DESIGN FOR 3.3V SYSTEM..............................................................................	39
FIGURE 24: LEVEL MATCH DESIGN FOR 5V SYSTEM.................................................................................	40
FIGURE 25: LEVEL MATCH DESIGN FOR RS-232.........................................................................................	41
FIGURE 26: REFERENCE DESIGN FOR AIN1&AIN2 .....................................................................................	43
FIGURE 27: REFERENCE RECEIVER INTERFACE DESIGN OF AOUT1 .....................................................	44
FIGURE 28: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT1................................	44
FIGURE 29: REFERENCE RECEIVER INTERFACE DESIGN OF AOUT2 .....................................................	45
FIGURE 30: SPEAKER INTERFACE WITH AMPLIFIER CONFIGURATION OF AOUT2................................	45
FIGURE 31: EARPHONE INTERFACE DESIGN..............................................................................................	46
FIGURE 32: REFERENCE CIRCUIT FOR 8-PIN SIM CARD HOLDER ..........................................................	48
FIGURE 33: REFERENCE CIRCUIT FOR 6-PIN SIM CARD HOLDER ..........................................................	49
FIGURE 34: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER..............................................................	50
FIGURE 35: MOLEX 91228 SIM CARD HOLDER............................................................................................	51
FIGURE 36: RI BEHAVIOUR OF VOICE CALLING AS A RECEIVER .............................................................	52
FIGURE 37: RI BEHAVIOUR AS A CALLER.....................................................................................................	53
FIGURE 38: RI BEHAVIOUR OF URC OR SMS RECEIVED...........................................................................	53
FIGURE 39: REFERENCE DESIGN FOR NETLIGHT .....................................................................................	54
FIGURE 40: REFERENCE DESIGN FOR RF ..................................................................................................	55
FIGURE 41: RF SOLDERING SAMPLE ...........................................................................................................	57

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FIGURE 42: GC10 MODULE TOP AND SIDE DIMENSIONS (UNIT: MM)	....................................................... 63
FIGURE 43: GC10 MODULE BOTTOM DIMENSIONS (UNIT: MM) ................................................................	64
FIGURE 44: RECOMMENDED FOOTPRINT (UNIT: MM)................................................................................	65
FIGURE 48: RAMP-SOAK-SPIKE REFLOW PROFILE....................................................................................	68
FIGURE 49: DIMENSIONS OF TAPE ...............................................................................................................	69
FIGURE 50: DIMENSIONS OF REEL...............................................................................................................	69
FIGURE 51: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3...........................................................	74
FIGURE 52: RADIO BLOCK STRUCTURE OF CS-4.......................................................................................	75

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1 Introduction

This document defines the GC10 module and describes its hardware interface which are connected with your application and the air interface.

This document can help you quickly understand module interface specifications, electrical and mechanical details. Associated with application notes and user guide, you can use GC10 module to design and set up mobile applications easily.

1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating GC10 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, Quectel does not take on any liability for your failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobie while driving (even with a handsfree kit) cause distraction and can lead to an accident. You must comply with laws and regulations restrcting the use of wireless devices while driving.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft. If your device offers a Flight Mode which must be enabled prior to boarding an aircraft.

Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are desinged to prevent possible interference with sentitive medical equipment.

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GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON , it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment.

In locations with potencially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potencially exposive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders.

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2 Product Concept

2.1. General Description

GC10 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The GC10 features GPRS multi-slot class 10 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about GPRS multi-slot classes and coding schemes, please refer to the Appendix B&C.

With a tiny profile of 19mm×16.9mm×2.35mm, the module can meet almost all the requirements for M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA, Smart Metering, and Remote Maintenance & Control, etc.

GC10 is an SMD type module, which can be easily embedded into applications through its 44-pin pads. It provides abundant hardware interfaces like Audio and UART Interface.

Designed with power saving technique, the current consumption of GC10 is as low as 1.3mA in sleep mode when DRX is 5.

GC10 is integrated with Internet service protocols, such as TCP/UDP, HTTP and PPP. Extended AT commands have been developed for you to use these Internet service protocols easily.

The module fully complies with the RoHS directive of the European Union.

2.2. Directives and Standards

The GC10 module is designed to comply with the FCC statements. FCC ID: XMR201403GC10

The Host system using GC10, should have label indicated FCC ID: XMR201403GC10.

2.2.1.FCC Statement

1. This device complies with Part 15 of the FCC rules. Operation is subject to the following conditions:

a)This device may not cause harmful interference.

b)This device must accept any interference received, including interference that may cause undesired

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operation.

2. Changes or modifications not expressly approved by the party responsible for compliance could

void the user’s authority to operate the equipment.

2.2.2.FCC Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage. This module should NOT be installed and operating simultaneously with other radio.

The manual of the host system, which uses GC10, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of GC10 module depending on the Mobile status.

Note: If a portable device (such as PDA) uses GC10 module, the device needs to do permissive change and SAR testing.

The following list of antenna is indicating the maximum permissible antenna gain.

	Part Number	Frequency	Peak Gain	Average Gain	VSWR	Impedance
		Range (MHz)	(XZ-V)	(XZ-V)
	3R007A	PCS1900:1850~1990	1 dBi typ.	1 dBi typ.	3 max	50Ω
		GSM850:824-894

2.3. Key Features

The following table describes the detailed features of GC10 module.

Table 1: Module Key Features

Feature	Implementation

Single supply voltage: 3.3V~4.6V

Power Supply

Typical supply voltage: 4.0V

Typical power consumption in sleep mode: 1.3 mA@ DRX=5

Power Saving

1.1 mA@ DRX=9

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			Quad-band: GSM850/GSM900/DCS1800/PCS1900
	Frequency Bands	 The module can search these frequency bands automatically
		 Compliant to GSM Phase 2/2+
	Transmitting Power	 Class 4 (2W) at GSM850/GSM900
		 Class 1 (1W) at DCS1800/PCS1900
	GPRS Connectivity	 GPRS multi-slot class 10
		 GPRS mobile station class B
			Normal operation: -35°C~ +80°C
	Temperature Range	 Restricted operation: -40°C ~ -35°C and +80°C ~ +85°C 1)
		 Storage temperature: -45°C ~ +90°C
		 GPRS data downlink transfer: max. 85.6kbps
		 GPRS data uplink transfer: max. 42.8kbps
	DATA GPRS	 Coding scheme: CS-1, CS-2, CS-3 and CS-4
		 Internet service protocols TCP/UDP, PPP, HTTP
		 Support Packet Broadcast Control Channel (PBCCH)
	USSD	Support Unstructured Supplementary Service Data
	SMS	 MT/MO, Text and PDU mode
		 SMS storage: SIM card
	SIM Interface	Support SIM card: 1.8V/3.0V
		Speech codec modes:
		 Half Rate (ETS 06.20)
		 Full Rate (ETS 06.10)
	Audio Features	 Enhanced Full Rate (ETS 06.50/06.60/06.80)
			Echo Suppression
			Echo Cancellation
			Noise Reduction
		UART Port:
		 Seven lines on UART port interface
		 Used for AT command, GPRS data
		 Support fixed baud rate from 2400bps to 460800bps
	UART Interfaces	 Support autobauding from 4800bps to 115200bps
		Debug Port:
		 Two lines on debug port interface DBG_TXD and DBG_RXD
		 Used for firmware debugging and log output
		 Used for firmware upgrade
		 The baud rate is fixed at 921600bps
	Phonebook Management	Support phonebook types: SM/ON/FD/LD
	SIM Application Toolkit	Support SAT class 3, GSM 11.14 Release 99
	Real Time Clock	Supported
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	Physical Characteristics	Size: 19±0.15×16.9±0.15×2.35±0.2mm
		Weight: Approx.1.3g
	Firmware Upgrade	Firmware upgrade via debug port
	Antenna Interface	Connected to antenna pad with 50 Ohm impedance control

NOTE

When the module works within this temperature range, the deviations from the GSM specification may occur. For example, the frequency error or the phase error will be increased.

Table 2: Coding Schemes and Maximum Net Data Rates over Air Interface

Coding Scheme	1 Timeslot	2 Timeslot	4 Timeslot
CS-1	9.05kbps	18.1kbps	36.2kbps
CS-2	13.4kbps	26.8kbps	53.6kbps
CS-3	15.6kbps	31.2kbps	62.4kbps
CS-4	21.4kbps	42.8kbps	85.6kbps

2.4. Functional Diagram

The following figure shows a block diagram of GC10 and illustrates the major functional parts.

Radio frequency part

Power management

Memory

The peripheral interface —Power supply —Turn-on/off interface —UART interfaces —Audio interfaces —SIM interface —PCM interface —RTC interface

—RF interface

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Figure 1: Module Functional Diagram

2.5. Evaluation Board

In order to help you to develop applications with GC10, Quectel supplies an evaluation board (EVB) with RS-232 to USB cable, power adapter, antenna, firmware upgrade cable (UART to USB cable) and other peripherals to control or test the module. For details, please refer to the document [11].

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3 Application Interface

The module adopts 44-pin pads with LCC package. The following chapters provide detailed descriptions about these pins below.

Power supply (Please refer to chapter 3.3)

Power on/down (Please refer to chapter 3.4)

Power saving technology (Please refer to chapter 3.5)

RTC (Please refer to chapter 3.6)

Serial interfaces (Please refer to chapter 3.7)

Audio interfaces (Please refer to chapter 3.8)

SIM interface (Please refer to chapter 3.9)

PCM interface (Please refer to chapter 3.10)

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3.1. Pin of Module

3.1.1.Pin Assignment

Figure 2: Pin Assignment

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3.1.2.Pin Description

Table 3: Pin Description

Power Supply

	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
				Main power supply of	Vmax= 4.6V	Make sure that supply
						sufficient current in a
	VBAT	33,34	I	module:	Vmin=3.3V
						transmitting burst
				VBAT=3.3V~4.6V	Vnorm=4.0V
						typically rises to 1.6A.
				Power supply for RTC	VImax=3.3V
					VImin=2.0V
				when VBAT is not		Recommended to be
					VInorm=2.8V
				supplied for the system.		connected to a backup
					VOmax=2.9V
	VRTC	13	I/O	Charging for backup		battery or a golden
					VOmin=2.7V
				battery or golden		capacitor. If unused,
					VOnorm=2.8V
				capacitor when the VBAT		keep this pin open.
					Iout(max)=1.35mA
				is applied.
					Iin=70uA
						Recommend to add a
					Vmax=3.1V	2.2 or 4.7uF bypass
	VDD_EXT	29	O	Supply 3.0V voltage for	Vmin=2.9V	capacitor, when using
				external circuit.	Vnorm=3.0V	this pin for power
					Imax=20mA	supply. If unused,
						keep this pin open.
		32,35,
	GND	36,37,		Ground
		39
	Turn on/off
	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
				Power on/off key.
				PWRKEY should be	VILmax=2.0V	Recommend to add an
	PWRKEY	5	I	pulled down for a	VIHmin=2.3V	OC driver circuit to
				moment to turn on or	VImax=3.3V	control this pin.
				turn off the system.
	Emergency Shutdown
	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.

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				Emergency off. Pulled
				down for at least 10ms,	Pulled up to VDD_EXT
				which will turn off the
					internally. OC/OD
	EMERG_			VILmax=
				module in case of	driver required in
	OFF	40	I	0.3×VDD_EXT
				emergency. Use it only	cellular device
				VIHmin=
				when shutdown via	application. If unused,
				0.7×VDD_EXT
				PWRKEY or AT	keep this pin open.
				command cannot be

achieved.

Module Indicator

Pin

Pin Name I/O Description DC Characteristics Comment

NO.

VOLmin=0V

VOLmax=

0.3×VDD_EXT

If unused, keep this

NETLIGHT 14 O Network status indication VOHmin=

pin open.

0.7×VDD_EXT VOHmax=

VDD_EXT

Audio Interfaces

Pin

Pin Name I/O Description DC Characteristics Comment

NO.

MIC1P	19,20	Channel 1 positive and
MIC1N		I
		negative voice input
SPK1P	21,22	Channel 1 positive and
SPK1N		O
		negative voice output
MIC2P	17,18	Channel 2 positive and
MIC2N		I
		negative voice input
SPK2P	16	Channel 2 single-ended
		O
		voice output
AGND	15	Audio analog ground.

	Main audio channel.
	Recommended to add
	ESD protection
	components at the
	MIC1P/N lines. If
	unused, keep these
	pins open.
For Audio DC	Auxiliary audio
characteristics refer	channel.
to Chapter 3.9.	Recommended to add
	ESD protection
	components at the
	MIC2P/N lines. If
	unused, keep these
	pins open.
	Separate ground
	connection for external
	audio circuits.

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UART Port

	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
	RI	6	O	Ring indication	VILmin=0V
					VILmax=
	DTR	7	I	Data terminal ready	0.3×VDD_EXT
					VIHmin=	If only use TXD, RXD
	DCD	8	O	Data carrier detection	0.7×VDD_EXT	and GND to
					VIHmax=	communicate,
	TXD	9	O	Transmit data	VDD_EXT	recommended
					VOLmin=0V	connecting RTS to
	RXD	10	I	Receive data	VOLmax=	GND via a 0R resistor
					0.3×VDD_EXT	and keeping other pins
	RTS	11	I	Request to send	VOHmin=	open.
					0.7×VDD_EXT
	CTS	12	O	Clear to send	VOHmax=
					VDD_EXT
	Debug Port
	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
					VILmin=0V
					VILmax=
					0.3×VDD_EXT
	DBG_TXD	31	O		VIHmin=
					0.7×VDD_EXT
				Used for firmware	VIHmax=
				debugging and upgrade.	VDD_EXT	If unused, keep these
				The baud rate is fixed at	VOLmin=0V	pins open.
				921600bps.	VOLmax=
					0.3×VDD_EXT
	DBG_RXD	30	I		VOHmin=
					0.7×VDD_EXT

VOHmax=

VDD_EXT

SIM Interface

	Pin Name	Pin	I/O Description	DC Characteristics	Comment
		NO.
				The voltage can be	All signals of SIM
	SIM_VDD	23	Power supply for SIM	selected by software	interface should be
			O	automatically. Either	protected against ESD
			card
				1.8V or 3V.	with a TVS diode

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					GSM/GPRS Module Series
					GC10 Hardware Design
	SIM_RST	24	O	SIM reset		array. Maximum trace
						length is 100mm from
	SIM_ DATA	25	I/O	SIM data
						the module pad to SIM
						card holder.
	SIM_CLK	26	O	SIM clock
	SIM_GND	27		SIM ground
					VILmin=0V
						SIM_PRESENCE
					VILmax=
						must be pulled up by
	SIM_				0.3×VDD_EXT
		28	I	SIM card detection		an external resistor
	PRESENCE				VIHmin=
						when SIM card
					0.7×VDD_EXT
						detection function is
					VIHmax=

used.

VDD_EXT

PCM Interface

	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
					VILmin=0V
	PCM_ IN	1	I	PCM data input	VILmax=
					0.3×VDD_EXT
					VIHmin=
	PCM_SYNC	2	O	PCM frame	0.7×VDD_EXT
				synchronization	VIHmax=	PCM function is not
					VDD_EXT	supported at present.
					VOLmin=0V	If unused, keep these
	PCM_ OUT	3	O	PCM data output	VOLmax=	pins open.
					0.3×VDD_EXT
					VOHmin=
	PCM_ CLK	4	O	PCM clock	0.7×VDD_EXT
					VOHmax=
					VDD_EXT
	RF Interface
	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
	RF_ANT	38	I/O	RF antenna pad	Impedance of 50Ω	Please refer to
						Chapter 4
	Other Interface
	Pin Name	Pin	I/O	Description	DC Characteristics	Comment
		NO.
	RESERVED	41,42,				Please keep these
		43,44				pins open.

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GPRS Data

GPRS Ready

GPRS Standby

GPRS Idle

GSM Talk

GSM Idle

GSM/GPRS Sleep

The module will automatically go into sleep mode if DTR is set to high level and there is no interrupt (such as GPIO interrupt or data on UART port). In this case, the current consumption of module will reduce to the minimal level. During sleep mode, the module can still receive paging message and SMS from the system normally.

Software is active. The module has registered to the GSM network, and the module is ready to send and receive GSM data.

GSM connection is ongoing. In this mode, the power consumption is decided by the configuration of Power Control Level (PCL), dynamic DTX control and the working RF band.

The module is not registered to GPRS network. The module is not reachable through GPRS channel.

The module is registered to GPRS network, but no GPRS PDP context is active. The SGSN knows the Routing Area where the module is located at.

The PDP context is active, but no data transfer is ongoing. The module is ready to receive or send GPRS data. The SGSN knows the cell where the module is located at.

There is GPRS data in transfer. In this mode, power consumption is decided by the PCL, working RF band and GPRS multi-slot configuration.

Normal shutdown by sending the “AT+QPOWD=1” command, using the PWRKEY or the EMERG_OFF1) pin. The power management ASIC disconnects the power supply from the base band part of the module, and only the power supply for the RTC is remained. Software is not active. The UART interfaces are not accessible. Operating voltage (connected to VBAT) remains applied.

“AT+CFUN” command can set the module to a minimum functionality mode without removing the power supply. In this case, the RF part of the module will not work or the SIM card will not be accessible, or both RF part and SIM card will be disabled, but the UART port is still accessible. The power consumption in this case will be reduced.

Function

GSM/GPRS Module Series

GC10 Hardware Design

3.2. Operating Modes

The table below briefly summarizes the various operating modes in the following chapters.

Table 4: Overview of Operating Modes

Mode

Normal Operation

Mode

Power Down Mode

Minimum Functionality

Mode

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NOTE

Use the EMERG_OFF pin only when failing to turn off the module by the command “AT+QPOWD=1” and the PWRKEY pin. For more details, please refer to Section 3.4.2.4.

3.3. Power Supply

3.3.1.Power Features of Module

The power supply is one of the key issues in designing GSM terminals. Because of the 577us radio burst in GSM every 4.615 ms, power supply must be able to deliver high current peaks in a burst period. During these peaks, drops on the supply voltage must not exceed minimum working voltage of module.

For GC10 module, the max current consumption could reach to 1.6A during a transmit burst. It will cause a large voltage drop on the VBAT. In order to ensure stable operation of the module, it is recommended that the max voltage drop during the transmit burst does not exceed 400mV.

Figure 3: Voltage Drop during Transmitting

3.3.2.Decrease Supply Voltage Drop

The power supply range of the module is 3.3V to 4.6V. Make sure that the input voltage will never drop below 3.3V even in a transmitting burst. If the power voltage drops below 3.3V, the module could turn off automatically. For better power performance, it is recommended to place a 1000uF tantalum capacitor with low ESR and ceramic capacitor 100nF, 47pF and 10pF near the VBAT pin. The reference circuit is illustrated in Figure 4.

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The VBAT route should be wide enough to ensure that there is not too much voltage drop during transmit burst. The width of trace should be no less than 2mm and the principle of the VBAT route is the longer route, the wider trace.

Figure 4: Reference Circuit for the VBAT Input

3.3.3.Reference Design for Power Supply

The power design for the module is very important, since the performance of power supply for the module largely depends on the power source. The power supply is capable of providing the sufficient current to 2A at least. If the voltage drop between the input and output is not too high, it is suggested to use a LDO as module’s power supply. If there is a big voltage difference between the input source and the desired output (VBAT), a switching power converter is recommended to be used as a power supply.

Figure 5 shows a reference design for +5V input power source. The designed output for the power supply is 4.16V and the maximum load current is 3A. In addition, in order to get a stable output voltage, a zener diode is placed close to the pins of VBAT. As to the zener diode, it is suggested to use a zener diode whose reverse zener voltage is 5.1V and dissipation power is more than 1 Watt.

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