Quectel Wireless Solutions 201211M50 User Manual

M50Hardware Design

M50

Quectel Cellul ar Engine

Hardware Design

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M50Hardware Design

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Document Title M50 Hardware Design
Revision 2.0
Date 2012-06-26
Status Released
Document Control ID M50_HD_V2.0

General Notes

Quectel offers this information as a service to its customers, to support application and
engineering efforts that use the products de signed by Quectel. The information provid ed is
based upon requirements specifically provided for customers of Quectel. Quectel has not
undertaken any independent search for additional information, relevant to any information
that may be in the customer’s possession. Furthermore, system validation of this product
designed by Quectel within a larger electronic system remains the responsibility of the
customer or t he custome r’s syste m inte gra tor. All speci ficati ons suppl ie d her ein a re subjec t to
change.

Copyright

This d ocument contains propri etary te chnical inf ormation of Quecte l Co., Ltd. Copying this
document, distribution to others, a nd communica tion of the contents there of, are forbidden
without permission. Offenders are liable to the payment of damages. All rights are reserved in
the event of a patent grant or registration of a utility model or design. All specifications
supplied herei n are subject to change wit hout notice at any time.

Copyright © Shanghai Quectel Wireless Solutions Ltd. 2012.

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Contents

Contents ................................................................................................................................................... 3

Table Index .............................................................................................................................................. 5

Figure Index ............................................................................................................................................ 6

0. Revi s io n hi stor y .................................................................................................................................. 8

1. Introduction ....................................................................................................................................... 9

1.1. Related documents.................................................................................................................... 9

1.2. Terms and ab brevi ations ......................................................................................................... 10

1.3. Safety cautions ........................................................................................................................ 12

2. Product concept ............................................................................................................................. 15

2.1. Key fe at u re s ............................................................................................................................ 15

2.2. Functional diagram ................................................................................................................. 17

2.3. Evaluation board ..................................................................................................................... 18

3. Application interface ...................................................................................................................... 19

3.1. Pin of module .......................................................................................................................... 20

3.1.1. Pin assignment .............................................................................................................. 20

3.1.2. Pin description .............................................................................................................. 22

3.2. O pe r ating mo de s ..................................................................................................................... 29

3.3. Power supply........................................................................................................................... 30

3.3.1. Pow e r features of module ............................................................................................ 30

3.3.2. Decrease supply voltage drop ...................................................................................... 30

3.3.3. Reference design for power supply ............................................................................. 31

3.3.4. Monitor power supply .................................................................................................. 32

3.4. Power on and down scena rios ................................................................................................ 32

3.4.1. Pow e r on ....................................................................................................................... 32

3.4.2. Pow e r dow n .................................................................................................................. 34

3.4.3. Restart ........................................................................................................................... 36

3.5. Charge interface ...................................................................................................................... 38

3.6. Power saving ........................................................................................................................... 38

3.6.1. Minimum functionality mode ...................................................................................... 38

3.6.2. SLEEP mode................................................................................................................. 39

3.6.3. Wake up module f ro m S LEE P mode .......................................................................... 39

.7. Summary of state transition ................................................................................................... 39

3

3.8. RTC backup............................................................................................................................. 40

3.9. Serial in terfaces ...................................................................................................................... 41

3.9.1. UART Port .................................................................................................................... 42

3.9.2. Debug Port .................................................................................................................... 46

3.9.3. Auxiliary UART Port ................................................................................................... 46

3.9.4. UART application ........................................................................................................ 47

3.10. Audio interfaces .................................................................................................................... 50

3.10. 1. De c rease TD D noise and ot her noise ........................................................................ 51

3.10.2. Microphone interfaces design.................................................................................... 51

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3.10. 3. Receiver and s peaker int erface de sign ...................................................................... 52

3.10.4. Earphone interface design.......................................................................................... 54

3.10. 5. L ou d speake r interf ace de sign ................................................................................... 54

3.10. 6. Audio ch a r a cteristics .................................................................................................. 55

3.11. SIM card interface ................................................................................................................ 55

3.11.1. S I M car d a ppl icati o n .................................................................................................. 55

3.11. 2. 6 Pin SIM cassette ...................................................................................................... 57

3.11. 3. 8 Pi n SIM c asse tt e ...................................................................................................... 58

3.12. SD card interface .................................................................................................................. 60

3.13. PCM interface ....................................................................................................................... 62

3.13. 1. C on figuration .............................................................................................................. 62

3.13.2. Timing ......................................................................................................................... 63

3.13. 3. Refere n ce de sign ........................................................................................................ 64

3.13. 4. AT co m ma n d .............................................................................................................. 64

3.14. ADC ....................................................................................................................................... 66

3.15. Behaviors of the RI............................................................................................................... 66

3.16. Network status indication..................................................................................................... 69

3.17. Operating status indication .................................................................................................. 69

4. Antenna interface........................................................................................................................... 71

4.1. RF reference design ................................................................................................................ 71

4.2. RF output power ..................................................................................................................... 72

4.3. RF receiving sensitivity.......................................................................................................... 72

4.4. O pe r ating fre quencie s............................................................................................................. 72

4.5. RF cable soldering .................................................................................................................. 73

5. Electrical, reliability and radio characteristics ......................................................................... 74

5.1. Absolute maximum ratings .................................................................................................... 74

5.2. Operating temperature ............................................................................................................ 74

5.3. Power supply ratings .............................................................................................................. 75

5.4. Current consumption .............................................................................................................. 76

5.5. Electro-static discharge .......................................................................................................... 78

6. Mechanical dimensions ................................................................................................................ 79

.1. Mechanical dimensions of module ........................................................................................ 79

6

6.2. Re c o mmende d f ootprint with o ut bottom centre p a ds .......................................................... 81

6.4. Top view of the module ......................................................................................................... 82

6.5. Bottom view of the module.................................................................................................... 83

7. Storage and manufacturing ......................................................................................................... 84

7.1. Storage ..................................................................................................................................... 84

7.2. Soldering ................................................................................................................................. 85

7.3. Packaging ................................................................................................................................ 86

Appendix A: GPRS coding schemes ............................................................................................. 87

Appendix B: GPRS multi-slot classes............................................................................................ 88

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Table Index

TABLE 1: RELATED DOCUMENTS ..................................................................................................... 9

TABLE 2: TERMS AND ABBREVIATIONS........................................................................................ 10

TABLE 3: MODULE KEY FEATURES ................................................................................................ 15

TABLE 4: CODING SCHEMES AND MAXIMUM NET DATA RATES OVER AIR INTERFACE .. 17

TABLE 5: M50 PIN ASSIGNMENT ..................................................................................................... 21

TABLE 6: PIN DESCRIPTION ............................................................................................................. 22

TABLE 7: OVERVIEW OF OPERATING MODES.............................................................................. 29

TABLE 8: PIN DEFINITION OF THE CHARGING ............................................................................ 38

TABLE 9: SUMMARY OF STATE TRANSITION ............................................................................... 39

TABLE 10: LOGIC LEVELS OF THE UART INTERFACES.............................................................. 42

TABLE 11: PIN DEFINITION OF THE UART IN TERFACES ............................................................ 42

TABLE 12: PIN DEFINITION OF AUDIO INTERFACES .................................................................. 50

TABLE 13: AOUT3 OUTPUT CHARACTERISTICS .......................................................................... 51

TABLE 14: TYPICAL ELECTRET MICROPHONE CHARACTERISTICS ....................................... 55

TABLE 15: TYPICAL SPEAKER CHARACTERISTICS .................................................................... 55

TABLE 16: PIN DEFINITION OF THE SIM INTERFACE ................................................................. 56

TABLE 17: PIN DESCRIPTION OF AMPHENOL SIM CARD HOLDER ......................................... 58

TABLE 18: PIN DESCRIPTION OF MOLEX SIM CARD HOLDER ................................................. 59

TABLE 19: PIN DEFINITION OF THE SD CARD INTERFACE ....................................................... 60

TABLE 20: PIN NAME OF THE SD CARD AND MICRO SD CARD ............................................... 61

TABLE 21: PIN DEFINITION OF PCM INTERFACE......................................................................... 62

TABLE 22: CONFIGURATION ............................................................................................................ 62

TABLE 23: QPCMON COMMAND DESCRIPTION .......................................................................... 65

TABLE 24: QPCMVOL COMMAND DESCRIPTION ........................................................................ 65

TABLE 25: PIN DEFINITION OF THE ADC....................................................................................... 66

TABLE 26: CHARACTERISTICS OF THE ADC ................................................................................ 66

TABLE 27: BEHAVIORS OF THE RI .................................................................................................. 66

TABLE 28: WORKING STATE OF THE NETLIGHT ......................................................................... 69

TABLE 29: PIN DEFINITION OF THE STATUS................................................................................. 69

TABLE 30: PIN DEFINITION OF THE RF_ANT ................................................................................ 71

TABLE 31: THE MODULE CONDUCTED RF OUTPUT POWER .................................................... 72

TABLE 32: THE MODULE CONDUCTED RF RECEIVING SENSITIVITY .................................... 72

TABLE 33: THE MODULE OPERATING FREQUENCIES ................................................................ 72

TABLE 34: ABSOLUTE MAXIMUM RATINGS................................................................................. 74

TABLE 35: OPERATING TEMPERATURE ......................................................................................... 74

TABLE 36: THE MODULE POWER SUPPLY RATINGS ................................................................... 75

TABLE 37: THE MODULE CURRENT CONSUMPTION .................................................................. 76

TABLE 38: THE ESD ENDURANCE (TEMPERATURE:25℃,HUMIDITY:45 %)............................ 78

TABLE 39: DESCRIPTION OF DIFFERENT CODING SCHEMES .................................................. 87

TABLE 40: GPRS MULTI-SLOT CLASSES ........................................................................................ 88

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Figure Index

FIGURE 1: MODULE FUNCTIONAL DIAGRAM ............................................................................. 18

FIGURE 2: PIN ASSIGNMENT ............................................................................................................ 20

FIGURE 3: VOLTAGE RIPPLE DURING TRANSMITTING ............................................................. 30

FIGURE 4: REFERENCE CIRCUIT FOR THE VBAT INPUT ............................................................ 31

FIGURE 5: REFERENCE CIRCUIT FOR POWER SUPPLY .............................................................. 31

FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................. 32

FIGURE 7: TURN ON THE MODULE USIN G KE Y STROKE ........................................................... 33

FIGURE 8: TIMING OF TURNING ON SYSTEM .............................................................................. 33

FIGURE 9: TIMING OF TURNING OFF THE MODULE................................................................... 34

FIGURE 10: REFERENCE CIRCUIT FOR EMERG_OFF BY USING DRIVING CIRCUIT ............ 36

FIGURE 11: REFERENCE CIRCUIT FOR EMERG_OFF BY USING BUTTON .............................. 36

FIGURE 12: TIMING OF RESTARTING SYSTEM ............................................................................ 37

FIGURE 13: TIMING OF RESTAR TING SYSTEM AFTER EMERGENCY SHUTDOWN .............. 37

FIGURE 14: RTC SUPPLY FROM NON-CHARGEABLE BATTERY ............................................... 40

FIGURE 15: RTC SUPPLY FROM RECHARGEABLE BATTERY .................................................... 40

FIGURE 16: RTC SUPPLY FROM CAPACITOR ................................................................................ 40

FIGURE 17: SEIKO XH414H-IV01E CHARGE CHARACTERISTICS ............................................. 41

FIGURE 18: REFERENCE DESIGN FOR FULL-FUNCTION UART ................................................ 44

FIGURE 19: REFERENCE DESIGN FOR UART PORT ..................................................................... 44

FIGURE 20: REFERENCE DESIGN FOR UART PORT WITH HARDWARE FLOW CONTROL... 45

FIGURE 21: REFERENCE DESIGN FOR FIRMWARE UPGRADE .................................................. 45

FIGURE 22: REFERENCE DESIGN FOR DEBUG PORT .................................................................. 46

FIGURE 23: REFERENCE DESIG N FOR AUXILIAR Y UART PORT ............................................... 47

FIGURE 24: LEVEL MATCH DESIGN FOR 3.3V SYSTEM.............................................................. 47

FIGURE 25: LEVEL MATCH DESIGN FOR 5V SYSTEM................................................................. 48

FIGURE 26: LEVEL MATCH DESIGN FOR RS-232 .......................................................................... 49

FIGURE 27: REFERENCE DESIG N FOR AIN1&AIN2...................................................................... 52

FIGURE 28: REFERENCE DESIG N FOR AOUT1 .............................................................................. 52

FIGURE 29: HANDSET INTERFACE DESIGN FOR AOUT2 ........................................................... 53

FIGURE 30: SPEAKER INTERF A CE DESIGN WITH AN AMPLIFIER F OR AOUT2 ..................... 53

FIGURE 31: EARPHONE INTERFACE DESIGN ............................................................................... 54

FIGURE 32: LOUD SPEAKER INTERFACE DESIGN ....................................................................... 54

FIGURE 33: REFERENCE CIRCUIT OF THE 8 PINS SIM CARD .................................................... 56

FIGURE 34: REFERENCE CIRCUIT OF THE 6 PINS SIM CARD .................................................... 57

FIGURE 35: AMPHENOL C707 10M006 512 2 SIM CARD HOLDER .............................................. 58

FIGURE 36: MOLEX 91228 SIM CARD HOLDER ............................................................................ 59

FIGURE 37: REFERENCE CIRCUIT OF SD CARD ........................................................................... 60

FIGURE 38: LONG SYNCHRONIZATION & SIGN EXTENSION DIAGRAM ............................... 63

FIGURE 39: LONG SYNCHRONIZATION & ZERO PADDING DIAGRAM ................................... 63

FIGURE 40: SHORT SYNCHRONIZATION & SIGN EXTENSION DIAGRAM .............................. 63

FIGURE 41: SHORT SYNCHRONIZATION & ZERO PADDING DIAGRAM ................................. 64

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FIGURE 42: REFERENCE DESIGN FOR PCM .................................................................................. 64

FIGURE 43: RI BEHAVIOR OF VOICE CALLING A S A RECEIVER .............................................. 67

FIGURE 44: RI BEHAVIOR OF DATA CALLING AS A RECEIVER ................................................ 67

FIGURE 45: RI BEHAVIOR AS A CALLER ........................................................................................ 67

FIGURE 46: RI BEHAVIOR OF URC OR SMS RECEIVED .............................................................. 68

FIGURE 47: REFERENCE DESIGN FOR NETLIGHT ....................................................................... 69

FIGURE 48: REFERENCE DESIGN FOR STATUS ............................................................................ 70

FIGURE 49: REFERENCE DESIGN FOR RF ...................................................................................... 71

FIGURE 50: RF SOLDERING SAMPLE.............................................................................................. 73

FIGURE 51: M50 TOP A ND SIDE DIMENSIONS .............................................................................. 79

FIGURE 52: M50 BOTTOM DIMENSIONS ........................................................................................ 80

FIGURE 53: RECOMMENDED FOOTPRINT WITHOUT BOTTOM CENTRE PADS .................... 81

FIGURE 55: TOP VIEW OF THE MODULE ....................................................................................... 82

FIGURE 56: BOTTOM VIEW OF THE MODULE .............................................................................. 83

FIGURE 57: PASTE A PPLICATION .................................................................................................... 85

FIGURE 58: RAMP-SOAK-SPIKE REFLOW PROFILE .................................................................... 86

FIGURE 59: MODULE TRAY .............................................................................................................. 86

FIGURE 60: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 ........................................... 87

FIGURE 61: RADIO BLOCK STRUCTURE OF CS-4 ........................................................................ 87

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0. Revision history

Revision Date Author Description of change

1.0 2011-12-20 Ray XU Initial

1.1 2012-02-03 Ray XU 1. Updated PCM interface

2. Updated SD interface

3. Updated charging interface

4. Updated timing of turn ing on the module

1.2 2012-07-20 Bal y BAO 1. Deleted the USB interface

2. Deleted the camera interface

1.3 2012-10-22 Mountain Z H OU 1. Updated functional diagram

2. Update d re fe rence des ign cir c uit

3. Update d a udio char a cteris tics

4. Updated VRTC DC characteristics

5. Updated SLEEP current consumption

6. Update d i nternet se r vice protocol s

7. Updated SIM pins’ name

8. Modified PCM function

9. Deleted F AX function

2.0 2012-06-16 Ray XU 1. Update the m odule si ze

2. Update the pin layout

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Draft new

Digital cellular telecommunications (Phase 2+); AT

Data Circuit

DCE) interface for

Short Message Service (SMS) and Cell Broadcast

hase 2+);
Digital cellular telecommunications (Phase 2+);
Digital cellular telecommunications (Phase 2+);

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1. Introduction

This do cument defines the M50 module and describes the hardware interface of M50 which are
connected with the customer application and the air interface.

This do cument can help customers quickl y unders tan d module interface specifications, electrical
and mechanical details. Associated with application notes and user guide, customers can use
M50module to design and set up mobile applications easily.

1.1. Related document s

Table 1: Related documents

SN Document name Remark

[1] M50_ ATC AT commands set
[2] ITU-T

rec omme nda ti on V.25t er

[3] GSM 07.07

[4] GSM 07.10 Supp ort GSM 07 .1 0 multipl exing proto co l
[5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use

[6] GSM 11.1 4 Digital cellular telecommunications (P

[7] GSM 11.11

[8] GSM 03.38

[9] GSM 11.10 Digital cellular teleco mmuni cations (P h ase 2); Mobile

[10] GSM_UART_AN UART port application note
[11] GSM_FW_Upgrade_AN01 GSM Firm w a re upgrade appl icatio n not e
[12] M10_EVB_UGD

Serial asynchronous automatic dialing and control

command set for GSM Mobile Equipment (ME)

of Data Terminal Equipment –
terminating Equipment (DTE –

Service (CBS)

Specification of the SIM Application Toolkit for the
Subscriber Identity module – Mobile Equipment (SIM
– ME) interfa ce

Specification of the Subscriber Identity module –
Mobile Equipment (SIM – ME) interface

Alphabets and language-specific information

Station (MS) conformance specification; Part 1:
Conformance specificat ion

M10 EVB user gui d

e

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1.2. T erm s and abbreviations

Table 2: Te rms and abb reviati o ns

Abbreviation Description

ADC Analog-to-Digital Converter
AMR Adaptive Multi-Rate
ARP Antenna Reference Point
ASIC Application Specific Integrated Circuit
BER Bit Error Rate
BOM Bill Of Material
BTS Base Transceiver Station
CHAP Challenge Handshake Authentication Protocol
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear To Send
DAC Digital-to-An alo g Co nverter
DRX Discontinuous Reception
DSP Digital Signal Processor
DCE Data Communications Equipment (typically module)
DTE Data Terminal Equipment (typically computer, external co ntroller)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enha nced GSM
EMC Electromagnetic Comp atibilit y
ESD Electrostatic Discharge
ETS European Telecomm unica tion Sta nda rd
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full R ate
GMSK Gaussian Minimum Shift Keying
GPRS G enera l Packet Radio Service
GSM Global System for Mobile Communications
HR Half R at e
I/O Input/Output
IC Integrate d Circuit
IMEI International Mobile Equipment Identity
Imax Maximum Load Current
Inorm Normal Current
kbps Kilo Bits Per Second
LED Light Emitting Diode

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Li-Ion Lithium-Ion
MO Mobile Ori ginated
MS Mobile Station (GSM engine)
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printe d Circuit B oard
PDU Protocol Data Unit
PPP Point-to-Point Protocol
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
RX Receive Direction
SIM Subscriber Identification Module
SMS Short Message Service
TDMA Time Division Multiple Access
TE Terminal Equipment
TX Transmitting Direction
UART Unive rs al Asyn c hr o no us Receiver & Transmitter
URC Unsolicited Result Code
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Vmax Maximum Voltage Value
Vnorm Normal Voltage Value
Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output Hi gh Level Voltage Value
VOHmin Minimum Outp ut High Leve l Volta ge V al ue
VOLmax M ax i m u m Ou tput Low Leve l Volta ge V al ue
VOLmin Minim um Outp ut L ow Level Vol t a ge Value

Phonebook abbreviations

LD SIM Last Dialing phoneb oo k (l ist of num bers m ost recent ly dialed)
MC Mobile Equipment list of unanswered MT Calls (missed calls)
ON SIM (or ME) Own Numbers (MSISDNs) list
RC Mob ile Equipment list of Received Calls
SM SIM phonebook

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station, fuel

safety haza r d.

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1.3. Safety cautions

The following safety precauti ons must be observed during all phases of the operation, such as
usage, service or repair of any cellular terminal or mobile incorporating M50module.
Manufacturers of t he cell ula r termi nal sho uld se nd the follo wing sa fety i nform ation t o use rs and
operating personnel and to incorpo rat e the se gui de li nes int o al l manual s supplied with the pr o du ct.
If not so, Quectel does not take on any liability for customer failure to comply with these
precautions.

When i n a hos pit al or ot her healt h c are f acili ty, obse rve the rest ricti ons about the
use of mo bi l e. Switch the cellular terminal or mobile off. Medical equipment may
be sensitive to not operate n o rm ally for RF energy interference.

Switch off the cell ul ar te rmin al or mobi le bef ore boa rdin g an air craft . Make sure
it switched off. The ope ratio n o f wirel ess appli a n ces i n an ai r c raft is f or bidde n to
preve nt inte rfere nce wit h commu nic atio n syst e ms. Forget to think much of these
inst ruct ions ma y l ead to the flight safety or offend against local legal action, or
both.

Do not ope r ate t he cell ul ar te rmi nal or mobil e i n t he pre se nce o f fl amm able gas
or fume. Switch off the cellul ar t ermin al when you a re near pet rol
depot, chemical plant o r where bl astin g operat ions are i n progre ss. Ope ratio n of
any electrical equipment in potentially explosive atmosphere can constitute a

Your cellular terminal or mobile receives and transmits radio frequency energy
while swi t ched o n. RF i nte rfe re n ce can oc cur i f i t is use d clo se t o TV set, radio,
comput er or other electric equipment.

Road s afe ty co mes first! Do no t us e a hand-held cellular terminal or mobile while
driving a vehicle, unless it is securely mounted in a holder for hands-free
operation. Before making a call with a hand-held terminal or mobile, park the
vehicle.

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GSM cellular terminals or mobiles operate over radio frequency signal and

According to the R&TTE Directive 1999/95/CE, all wireless equipment and

telecommuni cations terminals sold in EU must meet all the stipulated he alth,
safety RF, EMC requirements th at pro vi de fo r CE m ar k. Que cte l M odul e M50
is fully in ac co r da n ce with all the di rective s of EU.

cellular network and cannot be guaranteed to connect in all conditions, for
exam ple no mobil e fee o r an inv ali d SI M card. Whi le you are in t his condition
and need emergent help, Please Remember using emergency call. In order to
make or receive call, the cellul ar termina l or mobile must be swit che d on and in
a servi ce area with a d e quat e cel lular sign al strength.

Some net works d o not allo w for e merge ncy c all if certai n net work se rvice s or
phone feat ures are in use ( e .g. lock fu n cti o ns, fixed diali n g et c . ) . You m a y have
to deactivate t h ose features bef ore you c an ma ke an eme r ge n c y c all .

Also, some networks require that a valid SIM card be properly inserted in
cellular terminal or mobile.

1.4. Directives and standard s

The M50 module is designed to comply with the FCC statements. FCC ID: XMR201211M50.
The Host system using M50, should have label indicated contains FCC ID: XMR201211M50.

1.4.1. FCC Statemen t

1. This devi ce complies with Part 15 o f the FCC rules. Oper ation is subje ct to the following
conditions:

a) Thi s device ma y not c aus e harmful interference.
b) This device must accept any interference received, including interference that may cause
undesired operation.

2. Changes or modi fications not expressl y approved by the party responsible for compliance
coul d void the user ’s authority to operate the equipment.

1.4.2. FCC Radiation exposure statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator and your body as well as kept minimum 20cm from radio antenna depending
on the Mobile status of this module usage.

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The m a nu al of t he host syste m, whi ch uses M50, must include RF exposure warning statement to
advi ce use r shoul d keep mi nim um 20c m fr om the r adi o ante n n a o f M 50 m od ul e depe nding on the
Mobile status.

The following list of antenna is indicating the maximum permissible antenna gain.

Type Maxim u m Gain

(850Hz/900Hz)

External
Antenna

Internal
Antenna

This radio module must not be installed to co-locate and operate simu
ltaneously with other radios in host system;
additional testing and equipment authorization may be required to op
erating simultaneously with other radios.

Monopole 0.5dBi 2dBi 50Ω
Vehicular antenna 0.5dBi 2dBi 50Ω
Monopole 0.5dBi 2dBi 50Ω
PIFA 0.5dBi 2dBi 50Ω
FPC 0.5dBi 2dBi 50Ω
PCB 0.5dBi 2dBi 50Ω

Maxim u m Gain
(1800Hz/1900Hz)

Impedance

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2. Product concept

M50 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz,
GSM900MHz, DCS1800MHz and PCS1900MHz. The M50 features GPRS multi-slot class 12
and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. For more details about
GPRS multi-slot cl as s es a nd co ding sche me s, plea se re fer to the Appendix A an d Appendix B.

With a tin y profile of 24.5mm×25.3mm
for M2M applications, including Vehicles and Personal Tracking, Se c urity S yst em, Wireless POS,
Industrial PDA, Smart Metering, and Remote Maintenance & Control etc.

M50 is an SMD type module with LCC package, which can be embedded in customer’s
applications. It provides abundant hardware inter faces bet ween the module and customer’s hos t
board.

Designed with power s avin g techni que , t he curre nt consumpti on of M50 is as l ow as 1.3 mA i n
SLEEP mode when DRX is 5.

M50 is integra te d with Internet service protocols, su c h as TCP, UD P , F TP and P PP . Exten ded AT
commands h ave been developed for customer to use these Internet service protocols easily.

The module fully complies with the RoHS directive of the European Union.

×2.6mm, the module can meet almost all the requirements

2.1. Key features

Table 3: Module key features

Feature Description

Power supply Single supply voltage 3.3V~ 4.6V

Typical supply voltage 4.0V

Pow er saving Typical p o we r consumpt i on i n SLEEP mode: 1.3 mA@ DRX=5

1.2 mA@ DRX=9

Frequency bands  Quad-band: GSM850, GSM900, DCS1800, PCS1900.

 The module can se arch these frequency bands automatically
 The frequency bands can be set by AT command.
 Compliant with GSM Phase 2/2+

GSM class Small MS
Trans mi tt ing po wer  Class 4 ( 2W) at GSM850 and GSM900

 Cla ss 1 ( 1W) at DCS1800 and PCS1900

GPRS connectivity  GPRS multi-sl o t clas s 12 (default)

 GPRS multi-slot clas s 1~12 (configurable)
 GPRS mobile station class B

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Te mp er at ure rang e  Nor m al o pe r ation: -35°C ~ +80°C

 Restricted operation: -40°C ~ -35° C and +80°C ~ +85°C
 Storage temperature: -45°C ~ +90°C

DATA GPRS:

CSD:

SMS  Text and PDU mode

SIM interface Sup port SIM c ar d: 1.8V, 3V
Audi o features Speech codec modes:

UART interfaces UART Port:

Phonebook ma nagement Support phonebook types: SM, ME, ON, M C, RC, DC, LD, LA
SIM Application Toolkit Support SAT class 3, GSM 11.14 Release 99
Real time clock Supported
Ph ys ical ch aract eri s ti cs Size:

Firmware upgrade Firmware upgrade via UART Port

 GP RS data do wnl ink tra ns fer: m ax. 85. 6 kbps
 GPRS d at a uplink t r an sfer: ma x. 85.6 kbps
 Coding scheme: CS-1, CS-2, CS-3 and CS-4
 Support the protocols PAP (Password Authentication Protocol)

usually used for PPP connections

 Internet service protocols

TCP/UDP/FTP/PPP/HTTP/NTP/PING

 Support Packet Broadcast Control Channel (PBCCH)
 CSD tr an s mi s sion rat e s: 2. 4, 4. 8, 9. 6, 14.4 kbp s non-transparent
 Support Unstructured Supplementary Service Data (USSD)

 SMS storage: SIM card

 Half Rate (ETS 06.20)
 Full Rate (ETS 06.10)
 Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
 Adaptive Multi-Rate (AMR)
 Echo Suppress ion
 E cho C ancel latio n
 Noi se Re d u ction
 Embedded one amplifier o f clas s A B with maximum driving

power up to 800mW

 Seven lines on UART port interface
 Used for AT command, G P R S dat a a n d CSD d ata
 Multiplexing function
 Sup port aut obaudi n g f ro m 4800 bps to 11520 0 bp s

Debug Port:

 Two lines on debug port interface DBG_TXD and DBG_RXD
 De bu g P o rt only use d fo r firmware deb ugging

Auxiliary Port:
 Used for AT command

24.5 (±0.15) × 25.3 (±0.15) × 2.6 (±0.2) mm
Weight: 3.3g

1)

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Antenna interface Connected to antenna pad with 50 Ohm impedance control

1）When the module works in this temperature range, the deviations from the GSM specification
may occur. For example, the frequency error or the phase error will be increased.

Table 4: Coding schemes and maximum net data rates over air interface

Coding scheme 1 Timeslot 2 Time slot 4 Times l ot

CS-1 9.05kbps 18.1kbps 36.2kbps
CS-2 13.4kbps 26.8kbps 53.6kbps
CS-3 15.6kbps 31.2kbps 62.4kbps
CS-4 21.4kbps 42.8kbps 85.6kbps

2.2. Fu n c ti o nal di ag r a m

The following figure shows a block diagram of the M50 module and illustrates the major
functional parts:

 Power management
 Baseband
 Serial Flash
 The radio frequency part
 The peripheral interface

—Charge interface
—PCM interface
—SD interface
—SIM interface
—Audio interface
—Serial interface
—Power supply
—RF interface
—ADC
—Turn on/off interface (PWRKEY & EMERG_OFF)

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M50 Hardware Design

BB&RF

RF PAM

SAW
Filter

Serial

Flash

32KHz

26MHz

RF Transceiver

Audio

RTC

GPIO

Serial

Interface

Memory
Interface

PCM

Interface

SIM

Interface

SD

Interface

ADC

RF_ANT

VBAT

PWRKEY

EMERG_OFF

VRTC

ADC

STATUS&

NETLIGHT

UART

SIM

Interface

Audio

SD

Interface

PCM

Inteface

Reset

ESD

PMU

Charge

Interface

Charge

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Figure 1: Module functional diagram

2.3. Evaluatio n bo ard

In orde r t o he lp cu st o mer to deve lop a pplicat i o ns with M50 , Quectel supplies an evaluation board
(EVB) , RS -232 to USB cable , powe r adapte r, e arphone , ante nna and ot her pe riphe rals to control
or test the module. For details, please refer to the document [ 12].

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3. Application interface

The mo dul e is equi pped w it h 83-pin SMT pads and i t ad opts LCC package. Detailed descriptions
on Sub -interfaces included in these pads are given in the following chapters:

 Power supply
 Power on/down
 Charge interface
 RTC
 Serial interfaces
 Audio interfaces
 SIM interface
 SD interface
 PCM interface
 ADC

M50_HD_V2.0 - 19 -

M50 Hardware Design

1
2
3
4
5

6
7
8

9
10
11

12
13

14
15
16
17
18
19

20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

575859606162636465666768697071727374

Top view

75

76
77

78

79

80

81

82

83

SIM_PRESENCE

RESERVED

VRTC

VDD_EXT

GND

GND

RF_ANT

GND

GND

GND

VBAT

VBAT

VBAT

VBAT

RESERVED

RESERVED

RESERVED

RESERVED

ADC1

ADC0

RESERVED

NETLIGHT

SPK2P
AGND
MIC2P

MIC2N
MIC1P
MIC1N
SPK1N

SPK1P

LOUDSPKN

LOUDSPKP

STATUS

PWRKEY

EMERG_OFF

PCM_IN

PCM_CLK

RESERVED

RESERVED

TXD_AUX

RXD_AUX

DBG_TXD

DBG_RXD

RESERVED

DCD

RI

DTR

CTS

RTS

RXD

TXD

SIM1_GND

SIM1_RST

SIM1_CLK

SIM1_DATA

SIM1_VDD

VBAT GND

PCMRFUART

Power

SIM

Reserved Audio

ADC

Other

SD

PCM_OUT

PCM_SYNC

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

RESERVED

SD_CMD

SD_CLK

SD_DATA0

GND

RESERVED

RESERVED

RESERVED

RESERVED

GND

GND

GND

GND

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3.1. Pin of module

3.1.1. Pin assignment

Figure 2: Pin assignment

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M50 Hardware Design

管脚号

管脚名

输入/输出

管脚号

管脚名

输入/输出

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Table 5: M50 pin assignment

1 ADC1 I 2 ADC0 I
3 RESERVED 4 NETLIGHT O
5 SPK2P O 6 AGND
7 MIC2P I 8 MIC2N I
9 MIC1P I 10 MIC1N I
11 SPK1N O 12 SPK1P O
13 LOUDSPKN O 14 LOUDSPKP O
15 STAT US O 16 PWRKEY I
17 EMERG_OFF I 18 PCM_IN I
19 PCM_CLK O 20 PCM_OUT O
21 PCM_SYNC O 22 RESERVED
23 RESERVED 24 RESERVED
25 RESERVED 26 RESERVED
27 RESERVED 28 RESERVED
29 RESERVED 30 RESERVED
31 RESERVED 32 RESERVED
33 RESERVED 34 SD_CMD O
35 SD_CLK O 36 SD_DATA0 I/O
37 GND 38 RESERVED
39 RESERVED 40 TXD_AUX O
41 RXD_AUX I 42 DBG_TXD O
43 DBG_RXD I 44 RESERVED
45 DCD O 46 RI O
47 DTR I 48 CTS O
49 RTS I 50 RXD I
51 TXD O 52 SIM_GND
53 SIM_RST
55 SI M_ DATA I/O 56 SIM_VDD O
57 SIM_PRESENCE I 58 RESERVED
59 VRTC I/O 60 VDD_EXT O
61 GND 62 GND
63 RF_ANT I/O 64 GND
65 GND 66 GND

O 54 SIM_CLK O

67 VBAT I 68 VBAT I
69 VBAT I 70 VBAT I
71 RESERVED 72 RESERVED

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73 RESERVED 74 RESERVED
75 RESERVED 76 RESERVED
77 RESERVED 78 RESERVED
79 GND 80 GND
81 GND 82 GND
83 GND

Note: Keep all reserved pins open.

3.1.2. Pin description

Table 6: Pin description

Power supply

PIN NAME PIN

NO.

VBAT 67,

68,
69，
70

VRTC 59 I/O Power supply for

VDD_EXT 60 O Suppl y 2.8V volt a ge

GND 37,

61,

I/O DESCRIPTION DC

CHARACTERISTICS

I Main power supply

of module:
VBAT=3.3V~4.6V

RTC when VB AT is
not supplied for the
system.
Chargi n g f or backup
battery or golden
capacitor when the
VBAT is supplied.

for external circuit.

Ground

Vm ax= 4.6V
Vmin=3.3V
Vnorm=4.0V

VImax=3.3V
VImin=1.5V
VInorm=2.8V
VOmax=2.85V
VOmin=2.6V
VOnorm=2.8V
Iout(max)= 1mA
Iin=2.6~5 uA
Vmax=2.9V
Vmin=2.7V
Vnorm=2.8V
Imax=20mA

COMMENT

Make sure that
supply sufficient
current in a
transmitting
burst which
typica lly rises to

1.6A.
If unused, keep
this pin open.

1. If unused,
keep this pin
open.

2. Re co mmended
to add a

2.2~4.7uF
bypass capacitor
when supplying
power for
ext e rnal cir cuit .

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62,
64,
65,
66,

Tu rn on /off

PIN NAME PIN

NO.

PWRKEY 15 I Turn on/off control.

Emergency shutdown

PIN NAME PIN

NO.

EMERG_OFF 17 I Emergency off.

Module indicator
PIN NAME PIN

NO.

STAT US 16 O Indicate module

Audio in t e rface

I/O DESCRIPTION DC

CHARACTERISTICS

VILmax=
PWRKE Y sh ou l d be
pulle d down for a
moment to turn on
or off the system.

I/O DESCRIPTION DC

Pulled dow n fo r at
least 20ms , whi c h
will turn of f the
module in case of
emergency. Use it
only when normal
shutdown t hrough
PWRKEY or A T
command cannot
perform well.

I/O DESCRIPTION DC

operat in g status.
High level indicates
module is power-on
and low level
indicates
power-down.

0.1×VBAT

VIHmin=

0.6×VBAT

VI max=V BAT

CHARACTERISTICS

VILmax=0.4V

VIHmin=2.2V

V

open

CHARACTERISTICS

VOHmin=

0.85×VDD_EXT

VOLmax=

0.15×VDD_EXT

max=2.8V

COMMENT

Pulled up to
VBAT internally.

COMMENT

Open
drain/collector
driver required in
cellular device
application.
If unused, keep
this pin open.

COMMENT

If unused, keep
this pi n open.

PIN NAME PIN

MIC1P
MIC1N

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NO.
9, 10 I Channe l one for

I/O DESCRIPTION DC

CHARACTERISTICS

I f unused, keep
positive and
negative voice-band
input

COMMENT

these pins open.

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MIC2P
MIC2N

SPK1P
SPK1N

SPK2P 5 O Channe l t wo for

AGND 6 Analo g gr o und.

LOUDSPKN
LOUDSPKP

Net status indicator

PIN NAME PIN

7, 8 I Ch a nnel two for

positive and
negative voice-band
input

12, 11 O Channe l o ne for

positive and
negative voice-band
output

voice-band output

Constitute a pse udo
diffe rent ial ch annel
with SPK2P.

13,
14

NO.

O Channel three of

positive and
negative voice-band
output

I/O DESCRIPTION DC

1. If unuse d,
keep these pins
open.

2. Support both

1. If unused,

CHARACTERISTICS

voice a n d
ringtone output.

keep these pins
open.

2. Embedded
amplifier of class
AB internally.

3. Support both
voice a n d
ringtone output.

COMMENT

NETLIGHT 4 O Netw or k status

indication

UART Port

PIN NAME PIN

NO.
DTR 47 I Data terminal ready VILmin=0V
RXD 50 I Receive data
TXD 49 O Transmit data
RTS 51 I Request to send
CTS 48 O Clear to send
RI 46 O Ring indicator
DCD 45 O Data carrier

I/O DESCRIPTION DC

detection

VOHmin=

0.85×VDD_EXT
VOLmax=

0.15×VDD_EXT

CHARACTERISTICS

VILmax=

0.25×VDD_EXT

VIHmin=

0.75×VDD_EXT

VIHmax=

VDD_EXT+0.3

VOHmin=

0.85×VDD_EXT

VOLmax=

If unused, keep
this pin open.

COMMENT

If only use TXD,
RXD and GND
to co mmu n icat e ,
recommend
pulling down
RTS an d ke e ping
othe r pin s open.

M50_HD_V2.0 - 24 -

If unused, keep

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M50 Hardware Design

0.15×VDD_EXT

Debug Port
PIN NAME PIN

NO.
DBG_TXD 42 O UART interface for

DBG_RXD 43 I

Auxiliary UART Port

PIN NAME PIN

NO.
TXD_AUX 40 O T ransmit da ta VILmin=0V

RXD_AUX 41 I Receive data

SIM interface
PIN NAME PIN

NO.

SIM_VDD 56 O Power sup ply for

SI M_ DATA 54 I/O SIM data 3V：

I/O DESCRIPTION DC

CHARACTERISTICS
VILmin=0V

debu gging only.

I/O DESCRIPTION DC

I/O DESCRIPTION DC

SIM card

VILmax=

VIHmin=

VIHmax=

VOHmin=

VOLmax=

CHARACTERISTICS

VILmax=

VIHmin=

VIHmax=

VOHmin=

VOLmax=

CHARACTERISTICS
The voltage can be
selected by firmware
automatically. Either

1.8V or 3V.

VOLmax=0.4
VOHmin=

1.8V:
VOLmax=

0.25×VDD_EXT

0.75×VDD_EXT

VDD_EXT+0.3

0.85×VDD_EXT

0.15×VDD_EXT

0.25×VDD_EXT

0.75×VDD_EXT

VDD_EXT+0.3

0.85×VDD_EXT

0.15×VDD_EXT

SIM_VDD-0.4

COMMENT

If unused, keep
these pins open.

COMMENT

these pin s open.

COMMENT

A ll signals of
SIM interface
should be
protected a gai nst
ESD with a TVS
diode a rra y.
Max i mu m c ab l e
length is 200mm
from the module
pad to SIM card

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0.15×SIM_VDD

VOHmin=

SIM_VDD-0.4

SIM_CLK 55 O SIM clock 3V：

VOLmax=0.4
VOHmin=

0.9×SIM_VDD

1.8V:
VOLmax=

0.12×SIM_VDD

VOHmin=

0.9×SIM_VDD

SIM_RST 53 O SIM reset 3V：

VOLmax=0.36
VOHmin=

0.9×SIM_VDD

1.8V:
VOLmax=

0.2×SIM_VDD

VOHmin=

0.9×SIM_VDD

SIM_GND 52 SIM ground
SIM_PRESEN

CE

ADC

PIN NAME PIN

ADC0 2 I General purpose

ADC1 1 I General purpose

PCM

PIN NAME PIN

PCM_CLK 19 O PCM cloc k VILmin=0V
PCM_IN 18 I PCM data i nput

57 I SIM card detection VILmin=0V

VILmax=

0.25×VDD_EXT

VIHmin=

0.75×VDD_EXT

VIHmax=

VDD_EXT+0.3

I/O DESCRIPTION DC

NO.

analog to digital
converter.

analog to digital
converter.

I/O DESCRIPTION DC

NO.

CHARACTERISTICS
Volt a ge range: 0V to

2.8V

Volt a ge range: 0V to

2.8V

CHARACTERISTICS

VILmax=

holder.

If unused, keep
this pin open.

COMMENT

Please give
priority to the
use of ADC0.
If unused, keep
these pins open.

COMMENT

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M50 Hardware Design

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PCM_OUT 20 O PCM data output 0.25×VDD_EXT
PCM_SYNC 21 O PCM frame

synchronization

SD card

PIN NAME PIN

NO.
SD_CMD 34 O SD command VILmin=0V
SD_CLK 35 O SD cl ock
SD_DATA0 36 I/O SD data

RF inter face

PIN NAME PIN

NO.
RF_ANT 63 I/O RF antenna pad Impedance of 50Ω

Other interface

PIN NAME PIN

NO.
DOWNLOAD 3 I VILmin=0V

RESERVED 22~

33，

38~

39,

44,

58,

I/O DESCRIPTION DC

I/O DESCRIPTION DC

I/O DESCRIPTION DC

Keep these pins

VIHmin=

0.75×VDD_EXT

VIHmax=

VDD_EXT+0.3

VOHmin=

0.85×VDD_EXT

VOLmax=

0.15×VDD_EXT

CHARACTERISTICS

VILmax=

0.25×VDD_EXT

VIHmin=

0.75×VDD_EXT

VIHmax=

VDD_EXT+0.3

VOHmin=

0.85×VDD_EXT

VOLmax=

0.15×VDD_EXT

CHARACTERISTICS

CHARACTERISTICS

VILmax=

0.25×VDD_EXT

VIHmin=

0.75×VDD_EXT

VIHmax=

VDD_EXT+0.3

COMMENT

COMMENT

COMMENT

Keep this pin
open.

open.

M50_HD_V2.0 - 27 -