Touch Panel/Touch Pen
TY-TP65P8-S
TY-TPEN6
ORDER NO. PDP0504020CE
D18
© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TY-TP65P8-S / TY-TPEN6
CONTENTS
Page Page
1 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
2 About lead free solder (PbF)
3 Specification
4 External dimensions
5 Setup for Touch Panel
6 Setup for Touch Pen
7 Printed Circuit Board Structure
8 Trouble shooting
8.1. Checking procedures
8.2. Test Program
9 Conductor Views
9.1. Pen-USB and Pen-Receive Board
9.2. CPU / Y-Photo 1 Board
9.3. Y-LED 1 Board
9.4. Y-LED 2 Board
9.5. X-LED 1 Board
9.6. X-LED 2 Board
9.7. X-LED 3 Board
9.8. Y-Photo 2 Board
9.9. X-Photo 1 Board
9.10. X-Photo 2 Board
9.11. X-Photo 3 Board
10 Block Diagram
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10.1. Overall Block Diagram
10.2. Detail Block Diagram (1/3)
10.3. Detail Block Diagram (2/3)
10.4. Detail Block Diagram (3/3)
11 Schematic Diagram
11.1. Pen-USB and Pen-Receive Board
11.2. CPU / Y-Photo 1 Board (1/2)
11.3. CPU / Y-Photo 1 Board (2/2)
11.4. Y-LED 1 Board
11.5. Y-LED 2 Board
11.6. X-LED 1 Board
11.7. X-LED 2 Board
11.8. X-LED 3 Board
11.9. Y-Photo 2 Board
11.10. X-Photo 1 Board
11.11. X-Photo 2 Board
11.12. X-Photo 3 Board
12 Exploded View
13 Replacement Parts List
13.1. Replacement Parts List Notes
13.2. Mechanical Replacement parts List
13.3. Electrical Replacement Parts List
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TY-TP65P8-S / TY-TPEN6
1 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
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TY-TP65P8-S / TY-TPEN6
2 About lead free solder (PbF)
Note:
Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it´s manufacture due to environmental conservation issues. For service and repair work, we´d
suggest the use of Pb free solder as well, although Pb solder may be used.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
0.3mm x 100g 0.6mm x 100g 1.0mm x 100g
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