Nokia 3210 Repairhints

NSE-8/9 Repairhints Customer Care Europe & Africa Version 5.0 Approved Technical Services Training Group Date: 05.09.2001

CONFIDENTIAL 1 (48)

Repairhints

3210

NSE-8/9

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CONFIDENTIAL 2 (48)

GENERAL

How to use this document

Put the QUICK REPAIR & COMPONENT FINDER layouts behind this manual. Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components and measuring points.

Component characteristics:

Some components contain important data. Several described steps are only practicable if you are able to reflash/realign the phone and/or rewrite IMEI/SIMlock data in certain cases. Please pay attention to separate notes.

Underfills, broken balls, µBGA

It is not possible to change underfilled components. The trial will damage the PCB surely. All replaceable µBGA-components must be renewed after removing. Check soldering points, remove oxidated solderings (broken balls) very careful. µBGA´s must be soldered only with NMP approved µBGA-rework machines (e.g. Zevac/OK International).

Soldering CSP´s with Hot Air Fan is strictly forbidden!

– refer to General Service Bulletin 106.

Use only recommended fluxtype and always an appropriate amount of it.

PCB handling

Use appropriate cleaning materials only, do not use scratching or rubbing tools. Clean PCB carefully after every rework and take great pains over the keyboard area. Do not make any loose wiring connections anywhere. If it is necessary to change any item located under the metal shields, first remove the shield, do not cut partially or bend it.

Realign after repair

Characteristics of replacement parts are different. To prevent additional faults after repair (e.g. low standby time, loosing network etc.) it is necessary to retune phone values after repair.

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Introduction

IMPORTANT:

This document is intended for use by authorized NOKIA Service Centers only.

The purpose of this document is to provide some further service information for NOKIA 3210 phones. It contains a lot of collected tips and hints to find failures and repair solutions easily. It also will give support to inexperienced technicians. Saving process time and improving the repair quality is the aim of using this document. We have build it up based on fault symptoms (listed in "Contents") followed by detailed description for further analysis. It is to be used additionally to the service manual and other service information like Service Bulletins, for that reason it does not contain any circuit descriptions or schematics.

All measurements are made with following equipment:

Nokia repair SW : WinTesla Version 6.43

DLL version : NSE8 version 311.02.00 / 13.03.2001

Nokia Module Jig : MJS-13

Digital multimeter : Fluke 73

Oscilloscope : Fluke PM 3380 B

Spectrum Analyzer : Advantest R 3131 with an analogue probe

RF-Generator / : Rohde & Schwarz CMU 200

GSM Tester

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA should be notified in writing, using following procedure:

Please state:

Title of the Document + Issue Number/Date of publication. Page(s) and/or Figure(s) in error.

Please send to: Nokia GmbH

Service & Competence Center Europe Meesmannstr.103 D-44807 Bochum / Germany Email: training.sace@nokia.com

Copyright © Nokia Mobile Phones. This material, including documentation and any related computer programs, is protected by copyright, controlled by Nokia Mobile Phones. All rights are reserved. Copying, including reproducing, modifying, storing, adapting or translating, any or all of this material requires the prior written consent of Nokia Mobile Phones. This material also contains confidential information, which may not be disclosed to others without the prior written consent of Nokia Mobile Phones.

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Contents

PREFACE GENERAL 2

Introduction 3

CHAPTER 1 HW CHANGES IN NSE-8/9 7

-Most importand changes-summary 7

-Charging problems 8

-Not charging 8

-Poor or no service 8

-Time and ringtone problems 8

-Phone does not switch on 9

-L102 soldering problems 9

-Keypad problems 9

-PCN PA Buffer change 9

-N500/501 Philips poweramplifier 10

-Different CCONT N100 versions implemented 10

-New COBBA N200 version implemented 10

-COBBA N200 underfilled 10

-New GSM TX filter 10

HW changes summary for GF boards 12

CHAPTER 2 PHONE DOES NOT SWITCH ON 14

CHAPTER 3 NOT CHARGING FAILURES 22

New PCB (GD7) component & vendor changes 10

-Z700 71MHz filter – New ceramic package 10

HW changes summary for GD7 boards 11

-Does not switch on with battery (also with service battery) 14

-X504 related faults 14

-Power switch S416 faulty 14

-L102 broken soldered 14

-VB line faulty 14

-DC/DC converter V105 faulty 15

-Flash D301 / SRAM D302 related faults 15

-G701 faulty 16

-MAD D300 faulty 17

-CCONT N100 faulty 17

-B100 faulty 17

-Phone does not switch on: SectionDC/DC converter (Flowchart) 19

-Phone does not switch on: Section CCONT (Flowchart) 20

-Phone does not switch on: Flash update not possible (Flowchart) 21

-X101/102 and X503 faulty 22

-F100 faulty 22

-R103 faulty or broken 22

-R125 to R127 connection faulty 22

-C100 broken 22

-Charging problems with ACP – 8/9 charger 22

-Not charging (Flowchart) 23

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CHAPTER 4 LOW STANDBY TIME 25

-Low standby time (Flowchart) 25

-C111, C112, C113, C115 faulty 26

CHAPTER 5 PHONE SWITCHES OFF 27

-Phone switches off (Flowchart) 27

CHAPTER 6 CONTACT SERVICE FAILURES 28

-D301 Flash / D302 SRAM - faulty or poor soldered 28

-D303 EEPROM faulty 28

-COBBA serial fail 28

-CCONT interface fail 28

-Flash update not possible 28

-Contact service: COBBA serial/parallel bus failed (Flowchart) 29

-Contact service: Eeprom tune checksum failed (Flowchart) 30

CHAPTER 7

CHAPTER 8

USER INTERFACE FAULTS 31

Buzzer failed 31

-B400 / board connection broken 31

-Clocktime / Ringtone too fast or too slow - B100 faulty 31

Display faults 32

-Black lines on LCD 32

-No display function 32

-No LCD backlight 32

Keypad faults 32

-Keymat faulty 32

-Board / Dome sheet soiled 32

Internal audio faults 33

-L202/203 faulty 33

-Speaker – no, quiet or distored received audio signal 33

-Microphone – no, quiet or distored transmitted audio signal 33

-X503 – Bottom connector 33

-N200 COBBA faulty 33

-Internal audio failed (Flowchart) 34

SIMCARD FAILURES 35

-“Insert SIMcard” 35

-SIMcard not accepted 35

-X100 Simcard reader 37

-N100, CCONT 37

-V112 faulty 37

-CCONT N100 faulty 37

-“Insert Simcard” failure (Flowchart) 37

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CHAPTER 9 RF PART FAILURES 38

-Low receiver signal strength indicator – antenna faulty 38

-No service or long time to get network coverage 38

-Z501 faulty (low RX quality / GSM 1800 38

-G701 VTCCXO faulty 38

-N600 CRFU faulty / Z600 faulty: “Failed to set high reference…” 38

-No RX in PCN mode only 38

-Z700 faulty – RX calibration fault: “failed to set high reference…” 39

-Z701 faulty – RX calibration fault: “failed to set low reference…” 39

-G700 faulty 39

-N700 faulty 39

-N200 COBBA faulty 41

-No service GSM 900 (Flowchart) 42

-No service GSM 1800 (Flowchart) 43

CHAPTER 10

-Z500 faulty – (low TX power / GSM 900) 44

-Z504 faulty (low TX power / GSM 1800) 44

-N500 / N501 faulty (low TX power GSM 900 / 1800) 44

-TX phase faulty 45

-TX phase faulty in high channel range (GSM 1800) 45

-Faulty spectrum COBBA faulty, CCONT and COBBA broken solderings 46

-TX failure (Flowchart) 47

TX POWER FAULTS 44

Change history 48

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HW changes in NSE–8/9, 3210

MOST IMPORTANT CHANGES - SUMMARY:

Check L102 - version and soldering if phone switches off or does not switch on. Page# 9 & 14

Clock/Time & ringtone problems - HW changes (SB 17). Page# 8 & 16

Check R103 version if phone does not charge and check C-Cover version (Time dial removal – SB 24). Page# 8 & 22

Charging problems with ACP-7 charger if battery is totally discharged (SB 42). page# 6 & 22

Check if protective label is added / problems to switch on the phone (SB 11). Page# 9 & 12

Check version of key dome sheet / keypad problems – high keypress force (SB 28 & SB 032). Page# 7 & 32

Check version of G701 („A“ version must be changed to „B“ version) / poor or no service (SB 018). Page# 6 & 16

Poweramplifier change and modul version GD7 (SB 030). Page# 10

New version of 71MHz filter (ceramic package – SB 030). Page# 10

New CCONT versions (Vs. H to I and to M)– these are not vice versa compatible (SB 030 & SB 040). Page# 10

New COBBA versions (Vs. 3.1 to 4.1) – these are not vice versa compatible (SB 035). Page# 10

COBBA underfilled (SB 037). Page# 10

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CHARGING PROBLEMS

Check if R103 is broken – if resistor was broken or missing: Change N101, too. Check C-Cover version, cut the arrow of the time dial in cover or change C-Cover if necessary.

(Service Bulletin 024).

NOT CHARGING (with ACP-7 charger only)

If battery is totally discharged – R132 must be changed to 150k / 1% tolerance and R131 must be changed to 82k / 1% tolerance resistor.

For detailed information see Service Bulletin 042.

POOR OR NO SERVICE

13MHz oscillator (G701) must be changed from version “A“ (NGK3092A) to new version “B“ (NGK3092B). This version “A” VCTCXO is a component used for phones labeled “Made in Finland”, but only within the IMEI range below mentioned.

First NSE-8 IMEI 448896/10/274359/9 Last NSE-8 IMEI 448896/10/422812/8

First NSE-9 IMEI 448898/10/098643/6 Last NSE-9 IMEI 448898/10/149081/8 (Service Bulletin 018)

TIME & RINGTONE PROBLEMS

In some cases the ringtone and/or the clock work too slow or too fast – in these cases C148 must be changed to 47p, J 50V and C153 to 18p, J 50V and check 32.768kHz sine- & squarewave signals of B100. Change oscillator if necessary (Service Bulletin 017).

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PHONE DOES NOT SWITCH ON

Check if track (R132 to L102), located at C110, is printed as upper layer and if this line is 0 Ohm. Also place an isolation label on this track (see pictures) to protect it for short cuts to D-Cover. This is necessary in IMEI number range below 448896/20/485419/5 and 448896/10/205064/9 (Service Bulletin 011).

L102 SOLDERING PROBLEMS

Check soldering of L102 – In some cases the soldering of the coil can be broken on both sides – change if necessary. Note the different (approved) versions of L102.

The first (oldest version with soldering problem)

The new versions for better reliability below.

KEYPAD PROBLEMS

High key press force (eg. Navikey,2,5,8,0) These problems occure due to process change at PCB vendor. IMEI range: First 448903/10/729000/0 Last 449142/10/432508/8 The PCB´s can be identified by a double arrow symbol on the keypad of the PCB. In this case a new modified keydome sheet is available to solve this problem.

(Service Bulletin 028 & 032)

PCN PA BUFFER CHANGE

The PCN PA buffer amplifier (N502) is changed from NEC (µpc2771) to RFMD (RF2367) version – changes apply to HW versions 5.xx. Also the attenuator between the buffer and the PA (R513, R514, R515) is changed from 2dB to 7dB to compensate the higher saturated power from the RFMD buffer (relative to the NEC buffer

)

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NEW PCB (GD_7), COMPONENT & VENDOR CHANGES

Z700 71MHz FILTER – NEW CERAMIC PACKAGE

If it is necessary to change this filter, please note: The old and the latest type are not compatible and cannot be changed one for the other!

Old

New

N500 / N501 PHILIPS POWERAMPLIFIER

These are used with GD_7xx PCB only and are not compatible with Hitachi amplifiers (different prints). In case of replacement of any poweramplifier type, it is necessary to tune the sidebands (CH1 and CH124 for GSM900 and CH512 and CH885 for GSM1800) in addition to the mid channels (CH60 and CH700) – for tuning instructions see Service Bulletin 020.

DIFFERENT CCONT N100 VERSIONS IMPLEMENTED

1st change is CCONT version 2H to version 2I – This new version can replace the old version, but not vice versa!

nd

2

change is CCONT version 2I to version 2M – New version can replace the old version, but not vice versa!

For detailed information see Service Bulletin 030 & 040

NEW COBBA N200 VERSION IMPLEMENTED

New version COBBA 4.1 can replace the old version COBBA 3.1, but not vice versa! For detailed information see Service Bulletin 035

COBBA N200 UNDERFILLED

To prevent that symptoms of dropping calls or loosing service appear - resulting from broken solderings under µBGA – underfilling of COBBA is the solution for those cases. It has been used since IMEI 449143/10/716000/x

NOTE: IT IS NOT POSSIBLE TO REWORK OR REPLACE AN UNDERFILLED µBGA COMPONENT!

For detailed information see Service Bulletin 037

New GSM TX Filter (Z601)

The ceramic version of Z601 is changed to a new version – changes apply to HW versions 5.xx / 55.xx. These versions can be changed against one for the other.

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OLD NEW

left side: old version / right side: new CSSP version

HW CHANGES SUMMARY FOR GD - BOARD

PCBVers.

GD7_18 54.06 =>

HW

changes.

54.10

Delete Add Remarks

71MHz Filter (4511109) R717 220Ω (1430734) R718 220Ω (1430734) R701 470Ω (1430744)

R606 2.7kΩ (1430832)

C749 1.5pF (2320516)

C617 68pF (2320556) C618 68pF (2320556)

L600 180nH (3643037)

L601 180nH (3643037)

L701 330nH (3645031)

71MHz Filter (4511161) R717 330Ω (1430740)

R718 330Ω (1430740) R701 5.6kΩ (1430772) R606 5.6kΩ (1430772) C749 1.8pF (2320518) C617 82pF (2320558) C618 82pF (2320558) L600 220nH (3643079) L601 220nH (3643079) L701 390nH (3640077)

GD7_21 GD7_18 to _21

GD7_21 55.45 =>

55.10 =>

55.45

55.60

R315 0Ω (1430690)

C529 1pF (2320629)

D300 MAD V5 (4370489) C145 100pF (2320560) C320 10nF (2320620)

C149 1.5pF (2320915) N100 CCONT 2H (4370393)

71MHz Filter (4511109)

C529 1pF (2320508) C170 100nF (2320805)

D300 MAD V9 (4370591)

C149 1pF (2320915)

N100 CCONT 2I (4370467)

71MHz Filter (4511161)

New Philips poweramplifier Atmel Flash IC partially in use

New 71MHz Filter New CCONT version 2I New MAD V9 (C07) MAD V5 HW-ID: 55.82 MAD V5 / GD7_18 HW-ID: 55.16 varistor R103 shifted

GD7_21 55.60 =>

55.61

GD7_21 55.61 =>

R319 680kΩ (1430826)

N200 COBBA 3.1 (4370575) N200 COBBA 4.1 (4370643) New COBBA version 4.1

Change of interrupt level for

CARDDETX in BB

55.75

GD7_21 55.75 =>

Z601 Filt 902MHz (4511015) Z601 Filter 902MHz (4511155) New TX-Filter

55.76

GD7_21 55.76 =>

N100 CCONT2M (4370467) N100 CCONT 2M (4370719) New CCONT version 2M

55.85

GD7_21 55.85 =>

55.91

D300 MAD V9 (4370591) D300 MAD V16 (4370687)

C308 27pF (2320546)

New MAD version 16 ROM 6

GD7_25 New board with selective OSP

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HW CHANGES SUMMARY FOR GF - BOARD

PCB-Version HW-

changes

Delete Add Remarks

GF7_17 3.00 =>

3.02

GF7_17 3.02 =>

3.05

GF7_17 3.05 =>

3.06

GF7_18 4.00 =>

4.05

GF7_18 4.05 =>

4.06

GF7_18 4.06 =>

4.10

GF7_18 4.10 =>

4.

15

GF7_18 =>

GF7_20

4.06 =>

5.00

N114 (4219941) C153 27pF (2320546) C232 27pF (2320546) C233 27pF (2320546) C242 27pF (2320546) C243 27pF (2320546)

C148 100pF (2320560) C153 22pF (2320544)

C232 27pF (2320546) C233 27pF (2320546) C242 27pF (2320546) C243 27pF (2320546) C148 100pF (2320560) C153 22pF (2320544)

71MHz Filter (4511109) R717 220Ω (1430734) R718 220Ω (1430734) R701 47Ω (1430744)

R606 2.7kΩ (1430832) C749 1.5pF (2320516)

C617 68pF (2320556) C618 68pF (2320556) L600 180nH (3643037) L601 180nH (3643037) L701 330nH (3645031)

D300 MAD V5 (4370489) C145 100pF (2320560) C320 10nF (2320620) C149 2.2pF (2320915) N100 CCONT 2IH (4370393)

R104 10Ω (1430700) R619 22Ω (1430710) R605 1kΩ (1430754)

R727 1.5kΩ (1430758) R135 330kΩ (1430816) C307 1nF (2312401) C613 27pF (2320546)

C205 33nF (2320783)

C122 10µF (2610003)

D300 MAD V5 (4370489)

V114 (4219941)

C153 22pF (2320544)

To get a better TDMA-noise

C148 47pF (2320552) C153 18pF (2320604)

To get a better TDMA-noise

C148 47pF (2320552) C153 18pF (2320604)

71 MHz Filter (4511161) R717 330Ω (1430740) R718 330Ω (1430740)

R701 5.6kΩ (1430772)

R606 5.6kΩ (1430772)

C749 1.8pF (2320518) C617 82pF (2320558) C618 82pF (2320558) L600 220nH (3643079) L601 220nH (3643079) L701 390nH (3640077)

D300 MAD V9 (4370591)

C149 2.2 pF (2320915) N100 CCONT 2I (4370467)

R619 18Ω (1430708) R727 1.8kΩ (1430760)

C205 10nF (2320805)

D300 MAD V9 (4370591)

R630 22Ω (1430710)

R320 100Ω (1430726)

R620 270Ω (1430738)

R621 270Ω (1430738) R335 330kΩ (1430816)

R314 0Ω (1430690)

R327 1kΩ (1430754)

C122 1µF (2312401) C318 1µF (2312401)

C245 1µF (2320481) C332 27pF (2320546) C650 27pF (2320546)

C320 10nF (2320620)

Improvement of amplitude

of 32kHz oscillator

uplink performance

To improve the start up of

32kHz oscillator

uplink performance

To improve the start up of

32kHz oscillator

New CCONT Version 2I

New MAD V9 (C07)

New MAD Version 9 (C07)

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GF7_20 5.00 =>

5.15

GF7_20 5.15 =>

5.16

C145 100pF (2320560)

C320 10nF (2320620) C149 2.2pF (2320915) N100 CCONT 2IH (4370393)

R508 47Ω (1430718) R319 680KΩ (1430826)

C149 2.2pF (2320915)

N100 CCONT 2I (4370467)

R508 68Ω (1430722)

New CCONT version 2I

Improvements in RF/PCN (R508)

Changed interrupt level for

CARDDETX in BB (R319)

GF7_20 5.16 =>

5.30

GF7_20 5.30 =>

5.31

GF7_20 5.31 =>

5.86

GF7_20 5.89 =>

5.90

GF7_20 5.87 =>

5.94

GF7_22 New board with selective OSP

N200 COBBA 3.1 (4370575) N200 COBBA 4.1 (4370643) New COBBA Version 4.1

Z601 Filter 902MHz (4511015) Z601 Filter 902MHz (4511155) New TX-Filter

N100 CCONT 2M (4370467) N100 CCONT 2M (4370719) New CCONT version 2M

L103 60R/100MHz (3203717) L103 470R/100MHz (3203737) L103 changed, which improves

600 KHz modulation spectrum

R514 10Ω (1430700) R513 470Ω (1430744) R515 470Ω (1430744) N502 RF Ampl. (4340263)

R514 47Ω (1430718) N502 RF Ampl. (4340263)

New PCN PA buffer

RFMD=>

damp adaption: (R513,R514,R515)

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PHONE DOES NOT SWITCH ON

At first always check mechanical appearance of battery connectors X101/X102 if bent or dirty etc. – defect connectors could cause additional faults like “not charging” or the phone switches off intermittently.

Does not switch on with battery (nor with service battery)

Check if phone works properly in service jig. Check if BTEMP AD value is in range of 300. Check battery connectors X101 / X102 for broken solderings or bent spring contacts (see pictures below). Check if phone works also after connecting LCD module in jig (short circuit in VBB line from LCD possible).

X504 related fault

Check if connector X504 has its correct position – especially after rework in its area. If it is misplaced or bent, it could cause possible short circuits to D - Cover with throughholes.

POWER switch S416 faulty

Check mechanical condition of S416. Check if PWRON at R413 drops to 0V during pressing power switch. Change powerswitch S416 or continue with CCONT chapter on page#17.

L102 broken/poor soldered

Check soldering of L102. Check resistance of L102 = 0Ω. Resolder coil or change if necessary.

See the different versions of coil in HW changes chapter on page#9.

VB line faulty

Check battery voltage VB 2.7VDC at L102. Check VB 2.8VDC at R132. Check connection (0Ω) between R132/L102. See HW changes chapter on page#9 for additional PCB protection.

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DC/DC Converter V105 faulty

Check the difference between V101 cathode 3.2VDC / anode 2.6VDC. Check at V105 – pin 4, 5, 12, and 13: switching frequency 600kHz. Check 1.2VDC at V105, pin 15. Check at V105, pin3: 0V. If not, check the respective voltage dividers R131, R132, R134, R143, R144. If all ok – change V105.

FLASH D301 / SRAM D302 related faults

Check if the current consumption is approximately 20mA. Try to flash the phone – if this does not work go to chapter “FLASH update not possible” on page#30. Check also near the service contacts on the PCB - If any component is missing (like on picture below) – flashing will not work!

Torn off components are the result of sliding the phone on the service battery – the contacts can be damaged, too. NOTE: Always handle the phone in combination with the service battery with care to prevent those failures!

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