Nokia 3210 Repairhints

NSE-8/9 Repairhints Customer Care Europe & Africa Version 5.0 Approved Technical Services Training Group Date: 05.09.2001

CONFIDENTIAL 1 (48)

Repairhints

3210

NSE-8/9

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CONFIDENTIAL 2 (48)

GENERAL

How to use this document

Put the QUICK REPAIR & COMPONENT FINDER layouts behind this manual. Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components and measuring points.

Component characteristics:

Some components contain important data. Several described steps are only practicable if you are able to reflash/realign the phone and/or rewrite IMEI/SIMlock data in certain cases. Please pay attention to separate notes.

Underfills, broken balls, µBGA

It is not possible to change underfilled components. The trial will damage the PCB surely. All replaceable µBGA-components must be renewed after removing. Check soldering points, remove oxidated solderings (broken balls) very careful. µBGA´s must be soldered only with NMP approved µBGA-rework machines (e.g. Zevac/OK International).

Soldering CSP´s with Hot Air Fan is strictly forbidden!

– refer to General Service Bulletin 106.

Use only recommended fluxtype and always an appropriate amount of it.

PCB handling

Use appropriate cleaning materials only, do not use scratching or rubbing tools. Clean PCB carefully after every rework and take great pains over the keyboard area. Do not make any loose wiring connections anywhere. If it is necessary to change any item located under the metal shields, first remove the shield, do not cut partially or bend it.

Realign after repair

Characteristics of replacement parts are different. To prevent additional faults after repair (e.g. low standby time, loosing network etc.) it is necessary to retune phone values after repair.

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Introduction

IMPORTANT:

This document is intended for use by authorized NOKIA Service Centers only.

The purpose of this document is to provide some further service information for NOKIA 3210 phones. It contains a lot of collected tips and hints to find failures and repair solutions easily. It also will give support to inexperienced technicians. Saving process time and improving the repair quality is the aim of using this document. We have build it up based on fault symptoms (listed in "Contents") followed by detailed description for further analysis. It is to be used additionally to the service manual and other service information like Service Bulletins, for that reason it does not contain any circuit descriptions or schematics.

All measurements are made with following equipment:

Nokia repair SW : WinTesla Version 6.43

DLL version : NSE8 version 311.02.00 / 13.03.2001

Nokia Module Jig : MJS-13

Digital multimeter : Fluke 73

Oscilloscope : Fluke PM 3380 B

Spectrum Analyzer : Advantest R 3131 with an analogue probe

RF-Generator / : Rohde & Schwarz CMU 200

GSM Tester

While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA should be notified in writing, using following procedure:

Please state:

Title of the Document + Issue Number/Date of publication. Page(s) and/or Figure(s) in error.

Please send to: Nokia GmbH

Service & Competence Center Europe Meesmannstr.103 D-44807 Bochum / Germany Email: training.sace@nokia.com

Copyright © Nokia Mobile Phones. This material, including documentation and any related computer programs, is protected by copyright, controlled by Nokia Mobile Phones. All rights are reserved. Copying, including reproducing, modifying, storing, adapting or translating, any or all of this material requires the prior written consent of Nokia Mobile Phones. This material also contains confidential information, which may not be disclosed to others without the prior written consent of Nokia Mobile Phones.

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Contents

PREFACE GENERAL 2

Introduction 3

CHAPTER 1 HW CHANGES IN NSE-8/9 7

-Most importand changes-summary 7

-Charging problems 8

-Not charging 8

-Poor or no service 8

-Time and ringtone problems 8

-Phone does not switch on 9

-L102 soldering problems 9

-Keypad problems 9

-PCN PA Buffer change 9

-N500/501 Philips poweramplifier 10

-Different CCONT N100 versions implemented 10

-New COBBA N200 version implemented 10

-COBBA N200 underfilled 10

-New GSM TX filter 10

HW changes summary for GF boards 12

CHAPTER 2 PHONE DOES NOT SWITCH ON 14

CHAPTER 3 NOT CHARGING FAILURES 22

New PCB (GD7) component & vendor changes 10

-Z700 71MHz filter – New ceramic package 10

HW changes summary for GD7 boards 11

-Does not switch on with battery (also with service battery) 14

-X504 related faults 14

-Power switch S416 faulty 14

-L102 broken soldered 14

-VB line faulty 14

-DC/DC converter V105 faulty 15

-Flash D301 / SRAM D302 related faults 15

-G701 faulty 16

-MAD D300 faulty 17

-CCONT N100 faulty 17

-B100 faulty 17

-Phone does not switch on: SectionDC/DC converter (Flowchart) 19

-Phone does not switch on: Section CCONT (Flowchart) 20

-Phone does not switch on: Flash update not possible (Flowchart) 21

-X101/102 and X503 faulty 22

-F100 faulty 22

-R103 faulty or broken 22

-R125 to R127 connection faulty 22

-C100 broken 22

-Charging problems with ACP – 8/9 charger 22

-Not charging (Flowchart) 23

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CHAPTER 4 LOW STANDBY TIME 25

-Low standby time (Flowchart) 25

-C111, C112, C113, C115 faulty 26

CHAPTER 5 PHONE SWITCHES OFF 27

-Phone switches off (Flowchart) 27

CHAPTER 6 CONTACT SERVICE FAILURES 28

-D301 Flash / D302 SRAM - faulty or poor soldered 28

-D303 EEPROM faulty 28

-COBBA serial fail 28

-CCONT interface fail 28

-Flash update not possible 28

-Contact service: COBBA serial/parallel bus failed (Flowchart) 29

-Contact service: Eeprom tune checksum failed (Flowchart) 30

CHAPTER 7

CHAPTER 8

USER INTERFACE FAULTS 31

Buzzer failed 31

-B400 / board connection broken 31

-Clocktime / Ringtone too fast or too slow - B100 faulty 31

Display faults 32

-Black lines on LCD 32

-No display function 32

-No LCD backlight 32

Keypad faults 32

-Keymat faulty 32

-Board / Dome sheet soiled 32

Internal audio faults 33

-L202/203 faulty 33

-Speaker – no, quiet or distored received audio signal 33

-Microphone – no, quiet or distored transmitted audio signal 33

-X503 – Bottom connector 33

-N200 COBBA faulty 33

-Internal audio failed (Flowchart) 34

SIMCARD FAILURES 35

-“Insert SIMcard” 35

-SIMcard not accepted 35

-X100 Simcard reader 37

-N100, CCONT 37

-V112 faulty 37

-CCONT N100 faulty 37

-“Insert Simcard” failure (Flowchart) 37

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CHAPTER 9 RF PART FAILURES 38

-Low receiver signal strength indicator – antenna faulty 38

-No service or long time to get network coverage 38

-Z501 faulty (low RX quality / GSM 1800 38

-G701 VTCCXO faulty 38

-N600 CRFU faulty / Z600 faulty: “Failed to set high reference…” 38

-No RX in PCN mode only 38

-Z700 faulty – RX calibration fault: “failed to set high reference…” 39

-Z701 faulty – RX calibration fault: “failed to set low reference…” 39

-G700 faulty 39

-N700 faulty 39

-N200 COBBA faulty 41

-No service GSM 900 (Flowchart) 42

-No service GSM 1800 (Flowchart) 43

CHAPTER 10

-Z500 faulty – (low TX power / GSM 900) 44

-Z504 faulty (low TX power / GSM 1800) 44

-N500 / N501 faulty (low TX power GSM 900 / 1800) 44

-TX phase faulty 45

-TX phase faulty in high channel range (GSM 1800) 45

-Faulty spectrum COBBA faulty, CCONT and COBBA broken solderings 46

-TX failure (Flowchart) 47

TX POWER FAULTS 44

Change history 48

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HW changes in NSE–8/9, 3210

MOST IMPORTANT CHANGES - SUMMARY:

Check L102 - version and soldering if phone switches off or does not switch on. Page# 9 & 14

Clock/Time & ringtone problems - HW changes (SB 17). Page# 8 & 16

Check R103 version if phone does not charge and check C-Cover version (Time dial removal – SB 24). Page# 8 & 22

Charging problems with ACP-7 charger if battery is totally discharged (SB 42). page# 6 & 22

Check if protective label is added / problems to switch on the phone (SB 11). Page# 9 & 12

Check version of key dome sheet / keypad problems – high keypress force (SB 28 & SB 032). Page# 7 & 32

Check version of G701 („A“ version must be changed to „B“ version) / poor or no service (SB 018). Page# 6 & 16

Poweramplifier change and modul version GD7 (SB 030). Page# 10

New version of 71MHz filter (ceramic package – SB 030). Page# 10

New CCONT versions (Vs. H to I and to M)– these are not vice versa compatible (SB 030 & SB 040). Page# 10

New COBBA versions (Vs. 3.1 to 4.1) – these are not vice versa compatible (SB 035). Page# 10

COBBA underfilled (SB 037). Page# 10

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CHARGING PROBLEMS

Check if R103 is broken – if resistor was broken or missing: Change N101, too. Check C-Cover version, cut the arrow of the time dial in cover or change C-Cover if necessary.

(Service Bulletin 024).

NOT CHARGING (with ACP-7 charger only)

If battery is totally discharged – R132 must be changed to 150k / 1% tolerance and R131 must be changed to 82k / 1% tolerance resistor.

For detailed information see Service Bulletin 042.

POOR OR NO SERVICE

13MHz oscillator (G701) must be changed from version “A“ (NGK3092A) to new version “B“ (NGK3092B). This version “A” VCTCXO is a component used for phones labeled “Made in Finland”, but only within the IMEI range below mentioned.

First NSE-8 IMEI 448896/10/274359/9 Last NSE-8 IMEI 448896/10/422812/8

First NSE-9 IMEI 448898/10/098643/6 Last NSE-9 IMEI 448898/10/149081/8 (Service Bulletin 018)

TIME & RINGTONE PROBLEMS

In some cases the ringtone and/or the clock work too slow or too fast – in these cases C148 must be changed to 47p, J 50V and C153 to 18p, J 50V and check 32.768kHz sine- & squarewave signals of B100. Change oscillator if necessary (Service Bulletin 017).

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PHONE DOES NOT SWITCH ON

Check if track (R132 to L102), located at C110, is printed as upper layer and if this line is 0 Ohm. Also place an isolation label on this track (see pictures) to protect it for short cuts to D-Cover. This is necessary in IMEI number range below 448896/20/485419/5 and 448896/10/205064/9 (Service Bulletin 011).

L102 SOLDERING PROBLEMS

Check soldering of L102 – In some cases the soldering of the coil can be broken on both sides – change if necessary. Note the different (approved) versions of L102.

The first (oldest version with soldering problem)

The new versions for better reliability below.

KEYPAD PROBLEMS

High key press force (eg. Navikey,2,5,8,0) These problems occure due to process change at PCB vendor. IMEI range: First 448903/10/729000/0 Last 449142/10/432508/8 The PCB´s can be identified by a double arrow symbol on the keypad of the PCB. In this case a new modified keydome sheet is available to solve this problem.

(Service Bulletin 028 & 032)

PCN PA BUFFER CHANGE

The PCN PA buffer amplifier (N502) is changed from NEC (µpc2771) to RFMD (RF2367) version – changes apply to HW versions 5.xx. Also the attenuator between the buffer and the PA (R513, R514, R515) is changed from 2dB to 7dB to compensate the higher saturated power from the RFMD buffer (relative to the NEC buffer

)

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NEW PCB (GD_7), COMPONENT & VENDOR CHANGES

Z700 71MHz FILTER – NEW CERAMIC PACKAGE

If it is necessary to change this filter, please note: The old and the latest type are not compatible and cannot be changed one for the other!

Old

New

N500 / N501 PHILIPS POWERAMPLIFIER

These are used with GD_7xx PCB only and are not compatible with Hitachi amplifiers (different prints). In case of replacement of any poweramplifier type, it is necessary to tune the sidebands (CH1 and CH124 for GSM900 and CH512 and CH885 for GSM1800) in addition to the mid channels (CH60 and CH700) – for tuning instructions see Service Bulletin 020.

DIFFERENT CCONT N100 VERSIONS IMPLEMENTED

1st change is CCONT version 2H to version 2I – This new version can replace the old version, but not vice versa!

nd

2

change is CCONT version 2I to version 2M – New version can replace the old version, but not vice versa!

For detailed information see Service Bulletin 030 & 040

NEW COBBA N200 VERSION IMPLEMENTED

New version COBBA 4.1 can replace the old version COBBA 3.1, but not vice versa! For detailed information see Service Bulletin 035

COBBA N200 UNDERFILLED

To prevent that symptoms of dropping calls or loosing service appear - resulting from broken solderings under µBGA – underfilling of COBBA is the solution for those cases. It has been used since IMEI 449143/10/716000/x

NOTE: IT IS NOT POSSIBLE TO REWORK OR REPLACE AN UNDERFILLED µBGA COMPONENT!

For detailed information see Service Bulletin 037

New GSM TX Filter (Z601)

The ceramic version of Z601 is changed to a new version – changes apply to HW versions 5.xx / 55.xx. These versions can be changed against one for the other.

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OLD NEW

left side: old version / right side: new CSSP version

HW CHANGES SUMMARY FOR GD - BOARD

PCBVers.

GD7_18 54.06 =>

HW

changes.

54.10

Delete Add Remarks

71MHz Filter (4511109) R717 220Ω (1430734) R718 220Ω (1430734) R701 470Ω (1430744)

R606 2.7kΩ (1430832)

C749 1.5pF (2320516)

C617 68pF (2320556) C618 68pF (2320556)

L600 180nH (3643037)

L601 180nH (3643037)

L701 330nH (3645031)

71MHz Filter (4511161) R717 330Ω (1430740)

R718 330Ω (1430740) R701 5.6kΩ (1430772) R606 5.6kΩ (1430772) C749 1.8pF (2320518) C617 82pF (2320558) C618 82pF (2320558) L600 220nH (3643079) L601 220nH (3643079) L701 390nH (3640077)

GD7_21 GD7_18 to _21

GD7_21 55.45 =>

55.10 =>

55.45

55.60

R315 0Ω (1430690)

C529 1pF (2320629)

D300 MAD V5 (4370489) C145 100pF (2320560) C320 10nF (2320620)

C149 1.5pF (2320915) N100 CCONT 2H (4370393)

71MHz Filter (4511109)

C529 1pF (2320508) C170 100nF (2320805)

D300 MAD V9 (4370591)

C149 1pF (2320915)

N100 CCONT 2I (4370467)

71MHz Filter (4511161)

New Philips poweramplifier Atmel Flash IC partially in use

New 71MHz Filter New CCONT version 2I New MAD V9 (C07) MAD V5 HW-ID: 55.82 MAD V5 / GD7_18 HW-ID: 55.16 varistor R103 shifted

GD7_21 55.60 =>

55.61

GD7_21 55.61 =>

R319 680kΩ (1430826)

N200 COBBA 3.1 (4370575) N200 COBBA 4.1 (4370643) New COBBA version 4.1

Change of interrupt level for

CARDDETX in BB

55.75

GD7_21 55.75 =>

Z601 Filt 902MHz (4511015) Z601 Filter 902MHz (4511155) New TX-Filter

55.76

GD7_21 55.76 =>

N100 CCONT2M (4370467) N100 CCONT 2M (4370719) New CCONT version 2M

55.85

GD7_21 55.85 =>

55.91

D300 MAD V9 (4370591) D300 MAD V16 (4370687)

C308 27pF (2320546)

New MAD version 16 ROM 6

GD7_25 New board with selective OSP

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HW CHANGES SUMMARY FOR GF - BOARD

PCB-Version HW-

changes

Delete Add Remarks

GF7_17 3.00 =>

3.02

GF7_17 3.02 =>

3.05

GF7_17 3.05 =>

3.06

GF7_18 4.00 =>

4.05

GF7_18 4.05 =>

4.06

GF7_18 4.06 =>

4.10

GF7_18 4.10 =>

4.

15

GF7_18 =>

GF7_20

4.06 =>

5.00

N114 (4219941) C153 27pF (2320546) C232 27pF (2320546) C233 27pF (2320546) C242 27pF (2320546) C243 27pF (2320546)

C148 100pF (2320560) C153 22pF (2320544)

C232 27pF (2320546) C233 27pF (2320546) C242 27pF (2320546) C243 27pF (2320546) C148 100pF (2320560) C153 22pF (2320544)

71MHz Filter (4511109) R717 220Ω (1430734) R718 220Ω (1430734) R701 47Ω (1430744)

R606 2.7kΩ (1430832) C749 1.5pF (2320516)

C617 68pF (2320556) C618 68pF (2320556) L600 180nH (3643037) L601 180nH (3643037) L701 330nH (3645031)

D300 MAD V5 (4370489) C145 100pF (2320560) C320 10nF (2320620) C149 2.2pF (2320915) N100 CCONT 2IH (4370393)

R104 10Ω (1430700) R619 22Ω (1430710) R605 1kΩ (1430754)

R727 1.5kΩ (1430758) R135 330kΩ (1430816) C307 1nF (2312401) C613 27pF (2320546)

C205 33nF (2320783)

C122 10µF (2610003)

D300 MAD V5 (4370489)

V114 (4219941)

C153 22pF (2320544)

To get a better TDMA-noise

C148 47pF (2320552) C153 18pF (2320604)

To get a better TDMA-noise

C148 47pF (2320552) C153 18pF (2320604)

71 MHz Filter (4511161) R717 330Ω (1430740) R718 330Ω (1430740)

R701 5.6kΩ (1430772)

R606 5.6kΩ (1430772)

C749 1.8pF (2320518) C617 82pF (2320558) C618 82pF (2320558) L600 220nH (3643079) L601 220nH (3643079) L701 390nH (3640077)

D300 MAD V9 (4370591)

C149 2.2 pF (2320915) N100 CCONT 2I (4370467)

R619 18Ω (1430708) R727 1.8kΩ (1430760)

C205 10nF (2320805)

D300 MAD V9 (4370591)

R630 22Ω (1430710)

R320 100Ω (1430726)

R620 270Ω (1430738)

R621 270Ω (1430738) R335 330kΩ (1430816)

R314 0Ω (1430690)

R327 1kΩ (1430754)

C122 1µF (2312401) C318 1µF (2312401)

C245 1µF (2320481) C332 27pF (2320546) C650 27pF (2320546)

C320 10nF (2320620)

Improvement of amplitude

of 32kHz oscillator

uplink performance

To improve the start up of

32kHz oscillator

uplink performance

To improve the start up of

32kHz oscillator

New CCONT Version 2I

New MAD V9 (C07)

New MAD Version 9 (C07)

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GF7_20 5.00 =>

5.15

GF7_20 5.15 =>

5.16

C145 100pF (2320560)

C320 10nF (2320620) C149 2.2pF (2320915) N100 CCONT 2IH (4370393)

R508 47Ω (1430718) R319 680KΩ (1430826)

C149 2.2pF (2320915)

N100 CCONT 2I (4370467)

R508 68Ω (1430722)

New CCONT version 2I

Improvements in RF/PCN (R508)

Changed interrupt level for

CARDDETX in BB (R319)

GF7_20 5.16 =>

5.30

GF7_20 5.30 =>

5.31

GF7_20 5.31 =>

5.86

GF7_20 5.89 =>

5.90

GF7_20 5.87 =>

5.94

GF7_22 New board with selective OSP

N200 COBBA 3.1 (4370575) N200 COBBA 4.1 (4370643) New COBBA Version 4.1

Z601 Filter 902MHz (4511015) Z601 Filter 902MHz (4511155) New TX-Filter

N100 CCONT 2M (4370467) N100 CCONT 2M (4370719) New CCONT version 2M

L103 60R/100MHz (3203717) L103 470R/100MHz (3203737) L103 changed, which improves

600 KHz modulation spectrum

R514 10Ω (1430700) R513 470Ω (1430744) R515 470Ω (1430744) N502 RF Ampl. (4340263)

R514 47Ω (1430718) N502 RF Ampl. (4340263)

New PCN PA buffer

RFMD=>

damp adaption: (R513,R514,R515)

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PHONE DOES NOT SWITCH ON

At first always check mechanical appearance of battery connectors X101/X102 if bent or dirty etc. – defect connectors could cause additional faults like “not charging” or the phone switches off intermittently.

Does not switch on with battery (nor with service battery)

Check if phone works properly in service jig. Check if BTEMP AD value is in range of 300. Check battery connectors X101 / X102 for broken solderings or bent spring contacts (see pictures below). Check if phone works also after connecting LCD module in jig (short circuit in VBB line from LCD possible).

X504 related fault

Check if connector X504 has its correct position – especially after rework in its area. If it is misplaced or bent, it could cause possible short circuits to D - Cover with throughholes.

POWER switch S416 faulty

Check mechanical condition of S416. Check if PWRON at R413 drops to 0V during pressing power switch. Change powerswitch S416 or continue with CCONT chapter on page#17.

L102 broken/poor soldered

Check soldering of L102. Check resistance of L102 = 0Ω. Resolder coil or change if necessary.

See the different versions of coil in HW changes chapter on page#9.

VB line faulty

Check battery voltage VB 2.7VDC at L102. Check VB 2.8VDC at R132. Check connection (0Ω) between R132/L102. See HW changes chapter on page#9 for additional PCB protection.

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DC/DC Converter V105 faulty

Check the difference between V101 cathode 3.2VDC / anode 2.6VDC. Check at V105 – pin 4, 5, 12, and 13: switching frequency 600kHz. Check 1.2VDC at V105, pin 15. Check at V105, pin3: 0V. If not, check the respective voltage dividers R131, R132, R134, R143, R144. If all ok – change V105.

FLASH D301 / SRAM D302 related faults

Check if the current consumption is approximately 20mA. Try to flash the phone – if this does not work go to chapter “FLASH update not possible” on page#30. Check also near the service contacts on the PCB - If any component is missing (like on picture below) – flashing will not work!

Torn off components are the result of sliding the phone on the service battery – the contacts can be damaged, too. NOTE: Always handle the phone in combination with the service battery with care to prevent those failures!

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G701 faulty

Check VCC 2.8VDC at C750 (Phone must be set in local mode). Check control voltage (AFC) 0.1 – 2.3V at C715. Check 13MHz reference frequency ±50 Hz (900mVpp) at R743.

NOTE: If you have to change the oscillator, pay attention to use the correct one

– also see HW changes chapter on page#8

False

Correct

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MAD D300 faulty

Check 32.768 kHz SLEEPCLK squarewave at C145 3Vpp. Check 13MHz RFC at C301 900 mVpp. Check VBB 2.8 VDC at C117. Check SLEEPX 2.8 VDC at J340. Check PURX 2.8 VDC at R303.

CCONT N100 faulty

Check at R413, if 3.2VDC drops to 0V during pressing powerswitch. Check SLEEPCLK 32.768kHz squarewave at C145: 3Vpp. Check VBB 2.8VDC at C117. Check Vref 1.5VDC at C123. Check PURX 2.8VDC at R303. Check VXO 2.8 VDC at C102.

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B100 faulty

Check 32.768kHz sinewave at C153 – 600mVpp. Check Sleepclock area: C147, C148, C149, C153 and R121-R124. Check 32.768kHz squarewave at C145 – 3Vpp.

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PHONE DOES NOT SWITCH ON: SECTION DC/DC CONVERTER

Phone does not switch

on, section: DC/DC

converter

Check VB (Battery

2.4V-3V) on L102

OK

Check soldering

and resistance of L102

"0 Ohm"

OK

Check connection

between L102 to R132

(0 Ohm)

OK

Check pin 3 from V105

on="low"status 0V

nOK

Check connector X101/ X102 change if bent or

soiled

Resolder or change L102

Swap the phone if the

connection is open

Check V109 and the

respective voltage deviders

R131,132,134,143,144

OK

Check voltage at

V101 anode 2.6V;

cathode 3.2V

OK

DC/DC converter is ok!

continue with

section CCONT

Check 600kHz

nOK

Checked by:

switching frequency at

pin 4,5,12,13 of

V105

Yes

Check 1.2V operation voltage at

Pin 15 of V105

CC Training Group

nOK

Check soldering of V105 or

change if necessary

Check soldering of V105 or

change if necessary. Also

check R102, R105, R112

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PHONE DOES NOT SWITCH ON: SECTION CCONT

( First disable Watchdog )

Phone does not switch on,

section: CCONT

Check if PWRON (3.2VDC)

drops to 0V during pressing

powerswitch at R413.

OK

Check 32.768 kHz sinewave

(600mVpp) on C153

OK

Check 32.768 kHz

squarewave (3Vpp)l at

C145

OK

Check VXO (2.8VDC) at

C102

OK

nOK

nOK nOK

nOK

Change S416 if it is

mechanically

damaged

Change B100 if frequency

or amplitude failed

Change N100

Check C147/148/153,

R121-124

Check Vbb (2.8VDC) at

C117

OK

Check PURX at R303

(2.8VDC) after pressing

powerswitch

OK

Check 13MHz CLK

frequency

at C301

OK

Try to flash the phone

nOK

Checked by:

Change N100

Check 13MHz at G701

Continue with section

Flash update not possible

nOK

CC Training Group

Check soldering of G701 or

change if necessary

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PHONE DOES NOT SWITCH ON / FLASH UPDATE NOT POSSIBLE

Does not switch on,

section: FLASH update

not possible

Change Service jig or

Service battery to local mode

if the phone switches off

OK

"MCU boot failure"

appears during flashing

Check 32.768kHz squarewave

at C145 (3Vpp)

OK

Check 13MHz RFCLK

at C301 900mVpp

OK

Check VBB 2.8V DC at C117

OK

Try to flash the phone, if

curre nt consumption is around

20mA

nOK

"External RAM error"

appears

during flashing

Continue with section

CCONT

Continue with section

CCONT

Continue with section

CCONT

Swap the phone -

MAD or PCB might be

the reason

Yes

nOK

Change FLASH

and try to update again

OK

Phone is OK

Checked by:

nOK

CC Training Group

Yes

Resolder SRAM or change if necessary try to update again

OK

Phone is OK

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NOT CHARGING FAILURES

If you are using WinTesla NSE-8/9 with DLL 2.41.03 or lower, the error message “current calibration fail” will appear in every charge tuning calibration test! See additional information in Service Manual: Chapter “Service Software Instructions”, page# 21 (Energy Management Calibration)

X101/102 and X503 faulty

First of all check the mechanical condition of all connectors and clean connector-pads (X503) on PCB and/or change bent or damaged connectors if necessary –also see pictures on page # 14. If any connector is poor soldered – additional faults will be the result!

F100 faulty

Check resistance of fuse F100 (0Ω). Check resistance of V_CHARGE_IN line to GND – should be around 10KΩ. If the line is in lower-Ohm range, check the PCB for possible liquid or mechanical damages.

R103 faulty or broken

If the phone does not charge when ACP-9 fast charger is connected: Check mechanical condition of R103 (some versions of this resistor can be broken through mechanical stress) If the component is broken or is completely missing – change R103 and additional PSCC N101. (PSCC defect by using charger with broken or missing R103) If a broken resistor is the reason for this fault, check also C-Cover and cut away the arrow in time dial (by using e.g. scalpel) or replace it if necessary – see HW changes page# 8 for additional information.

R125 to R127 connection faulty

Check with WinTesla/local mode/Testing/ADC readings if any AD value is out of limits – especially BTEMP (317 ≅≅≅≅ 25°). Check connection between R125 (near CCONT) and R127 (near X101) = 0Ω and check the resistance of R127 = 47kΩ. If R127 is broken or poor soldered, the battery indication bar on LCD will appear flashing when charger is connected to phone.

C100 broken

Display-message “Not charging” Check mechanical condition of C100 (near PSCC) – change capacitor if broken (sometimes only hairline crack) Check C-Cover (bent or damaged) if C100 is broken – change if necessary

Charging problems with ACP – 8/9 charger

(Sometimes charging stops after LCD light turned off) Check if the problems do appear with these chargers only and if the phone works properly with ACP – 7 charger. Check R117 (10kΩ) and R142 (10kΩ) in CHARG_CTRL line if these are poor soldered or in MΩ range – change if necessary. Check V200 in CHARG_CTRL line for shorts to GND. Check CHARG_CTRL line to GND.

Checked by:

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NOT CHARGING (1)

Not charging (1)

confirmation or error message/

beep is not coming from phone, if

charger is plugged in

Check V_CHARGE_IN at C100

OK

Check voltage divider R100/101

OK

Change CCONT

nOK

Check system connector

X503, clean contacts & PCB

or change if necessary

OK

Check resistance of fuse (F100)

and L100 (0 Ohm), change if

necessary

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NOT CHARGING (2)

Not charging (2) error message/beep is coming from phone if

charger is plugged in

nOK OK

Charge voltage failed

Yes

Try energy

management

calibration

Check BTEMP

A/D in ADC readings

(317=25°C)

Check VCHAR

at voltage divider

R100 / R101

(10:1)=0.8V

nOK

OK

Try to charge

after calibration

Check

connection R125

to R127

OK

Check NTC resistor

R127 (47Kohm)

Change N100

(CCONT)

nOK

Swap the phone

if disconnected

Battery voltage failed

Checked by:

Yes

Check resistance of

fuse (F100) and

L100 (0 Ohm),

change if necessary

OK

Check R103 if

broken or missing

Check voltage

divider R106/R111

(1:2)

nOK

Check battery

connector X101

X102 change if bent

Yes

Change R103 and

N101 (PSCC)

OK

CC Training Group

Change N100

(CCONT)

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LOW STANDBY TIME

Low standby time

YES

Off state curren t

0-1mA

YES

Sleepmode current

2-8mA

OK

Change N100

Check

charging circuit, try

energy management

calibration

OK

NO nOK

NO

Check resistance

of CCONT output lines

to GND

Check components in

nOK

corresponding lines

Lift L103

OK

Lift C111/112/113

nOK

Lift L505

nOK

OK

Lift L102

OK

Check C109/110,

change V105

Check C107/115,

change N101

Change capacitors

OK

Change N500

nOK

Calibrate RX/TX

values

OK

NOTE: Standby time depends also on

network`s side, signal strength , location

update and users phone handling.

Lift L506

nOK

Lift L105 OK

nOK

Change N100

Checked by:

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OK

Change N501

Change N702

nOK

Check consumption of

G700-lift R741 G702-lift R742

nOK

Check capacitors

C718/721/737/739/

754/742, change N700

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C111, C112, C113, C115 faulty

Check the current consumption in different operation modes (refer to the table below). Check if high current consumption resulting from VB, Vout or output voltages of CCONT. Disconnect L105 (N702 supply) L505, L506 (PA´s supply) coil by coil and check consumption after every removing. Check and desolder C111, C112, C113 and C115. Try Energy Management Calibration if charging stops too early or battery is too hot after charging.

see chapter “NOT CHARGING FAULTS” for additional information.

Current consumption values

Function mode Minimum current in mA Maximum current in mA Off state 0 1 Sleep mode 2 8 Call mode GSM 900 < 100* < 370** Call mode GSM 1800 < 100* < 350**

CH60, Power level 19 CH700 Power level 15 Ch60, Power level 5 CH700 Power level 0 Measured with TDS-7

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PHONE SWITCHES OFF

Phone switches off

intermittently

Check if this happens

only with 5V SIM-cards

and if the phone works properly

with 3V SIMcards

nOK

Check 5V

supply voltage at C136

with oscilloscope

nOK

Change C131 if the noise is

higher than 350mVpp

OK

Check X101

and X102,

if poor soldered,

bent or soiled

OK

Check amplitude

of 32.768kHz square

wave at C145, 3Vpp

OK

Check amplitude

of 13MHz RF Clk at

C301 (900mVpp)

OK

Check VBB 2.8V DC

at C117

nOK

not OK

Resolder, change or clean

the connectors

Change or check

soldering of B100, C147,

C148, C153, N100

Change or check

soldering

of G701, V702

Change or check

soldering

of N100, C117

C136 10µF/10V

Check if the phone does not switch off with 3V SIM Cards. Check if VSIM at C136 is approximately 4.8V-5.2V, with maximal 350mVpp noise overlap - see diagram below. Diagram of normal noise at C136.

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CONTACT SERVICE FAILURES

D303 EEPROM faulty

Check using WinTesla if IMEI or product data are somehow corrupted. Check 2.8VDC at pin 8 of EEPROM. Do not use the option "Full factory set" with WinTesla. Otherwise the original IMEI will be changed to "65656565…" Change EEPROM if it is permitted to you and rewrite all phone data (IMEI, product code…). If you are not authorized to change EEPROM and the IMEI is missing, write a note with a short comment, and send it together with the phone to a higher level NOKIA Service Center.

COBBA serial fail

After changing COBBA N200 – take care that all components in the periphery of COBBA are not shifted from their position! Especially check R765, R766, R233 for the correct position.

CCONT interface failed

Remove Display and check selftest again. If failure persists, change CCONT and check for oxidized pads.

Flash update not possible

D301 FLASH / D302 SRAM - faulty or poor soldered

“Contact service “ appears on LCD Check with

WinTesla/Testing/Self tests – which of the MCU self test fails

If “MCU ROM Checksum failed” appears or if the phone does not switch on:

Check current consumption. If continuously around 20mA, try to flash the phone. If the fault remains after flashing: Check soldering of SRAM D302 Change Flash D301 and try to flash the phone again.

If “MCU RAM Interface failed” or if “MCU RAM Component failed” appears:

Check 32.768KHz Sleepclock squarewave at C145 (3Vpp). Check 13MHz RFC at C301 (900mVpp). Check VBB at C117 – 2.8VDC. Resolder SRAM D302 and try to flash the phone. If any error message appears during flashing (“External RAM error”), change SRAM D302 and retry. If error message persists, change Flash D301 and flash again. If the failure persists, probably MAD D300 or PCB faulty.

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CONTACT SERVICE - COBBA PARALLEL / SERIAL BUS FAILED

COBBA parallel/

serial bus failed

Check COBBACLK 13MHz

3.6Vpp at J201

OK

Check VBB 2.8V at C117

OK

Check VCOBBA 2.8V DC at C248

nOK

Check 13MHz RFC

at C301 900mVpp

OK

Swap the phone, as

MAD or PCB might

be the reason

Check soldering or change N100, C117

Change or check

soldering of N100,

C248

nOK

Check soldering or change G701, V702

Check COBBA reset impulse

during initialization routine

Change the COBBA

OK

at J343

OK

not OK

Checked by:

Swap the phone, as MAD or PCB might

be the reason

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CONTACT SERVICE – EEPROM TUNE CHECKSUM FAILED

EEPROM tune

checksum failed

Check with WinTesla

all product information,

if any phone data like IMEI, product

code, PSN, etc. is anyhow

corrupted

Yes

Reset the phone

No

do not use full factory

set if it is not pe rmitted to you

to rewrite the IMEI

Check 2.8V DC at

EEPROM pin 8

EEPROM

internal fault

OK

nOK

OK

Phone is ok if CONTACT SERVICE

dissapears

nOK

Check VBB at C117

Change EEPROM if it is

permitted to you, to rewrite

the IMEI

For detailed

information see

General Service Bulletin 026

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Send these phones to a

higher level

NOKIA Service Center

if it is not permitted to you to

rewrite the IMEI

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USER INTERFACE FAULTS

BUZZER FAILURE

Buzzer failure

Check

buzzer control signal

from MAD 2.8Vpp at

N400 pin 3

OK

Check VDC_OUT

3.9V DC at N 400 pin 1 and "+" at B400

OK

buzzer signal 5Vpp at N400

Check

pin 6 and "-" of B400

OK

Change B400

nOK

Swap the phone because

MAD or PCB might be

the reason

Check connection to

VDC_OUT at V105,

pin 1/16

Check VBB 2.8V DC at

pin 2 of N400

OK

Change N400

nOK

Check VBB 2.8V DC

at C117

B400 / board connections broken

Check buzzer control signal from MAD at N400, pin 3: 2.8Vpp / 1kHz

(use WinTesla/Testing/Audio Level 1, 1000Hz)

Check VDC_OUT 3.9VDC at N400, pin 1 and at Plus-pin of buzzer. Check VBB 2.8VDC at N400, pin 2. Check buzzer signal at Minus-pin of buzzer: 5Vpp, 1kHz. Check board connection N400, pin 6 to Minus-pin of buzzer. Change buzzer if all ok.

Clock time / Ringtone too fast or too slow - B100 faulty

Check Sleepclock 32.768kHz squarewave at C145 – 3Vpp Check B100, C147, C148, C153, N100. See Service Bulletin 017 for additional information (value change: capacitors C148, C153).

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Display Faults

If one or more lines are missing completely as in picture below, change LCD unit

Faulty display sample

Black lines on LCD

Check VBB 2.8VDC at C400 and R421 If voltage ok, change LCD

No display function

If backlight works, but no symbol on LCD appears, in the most cases there are broken solderings under CCONT N100

No LCD backlight

Check VDC_OUT = 3.2VDC at V406, V409, V412, V413

Use WinTesla/Testing/User Interface/1.Test Pattern “on”/”off”.

Check LCD_LED line at N400, pin 9: 1.2VDC in “on” mode / 1.9VDC in “off” mode. Check cathode of V406, V409, V412, V413: 1.2VDC “on”/ 1.9VDC “off”. Check LCD_LIGHT line at N400, pin 7: 2.8VDC “on”. Check also soldering of R415 and/or for shorts to GND.

KEYPAD FAILURE

Keymat faulty

Check the bottom of keymat for broken pins or mechanical damage.

Board / Dome Sheet soiled

If there are only one or two keys without function, check and clean the keyboard area and Dome Sheet if soiled. NOTE: Different versions of Dome Sheets are available If all faulty keys are in the same ROW or COL line, check connections between the corresponding keys and to GND. If any line is disconnected between the keys, swap the unit as PCB is faulty.

see HW changes on page# 9.

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INTERNAL AUDIO FAULTS

L202, L203 faulty

Check resistance from L202, L203 to speaker pads normal 0Ω. Check resistance from L202, L203 to GND and between both lines, Normal: high resistance range >1MΩ.

Speaker - No, quiet or distorted received audio signal.

Check mechanical condition of speaker. Check resistance of speaker - around 30Ω.

Microphone – No, quiet or distorted transmitted audio signal.

Check contact pads of microphone. Check resistance of microphone - around 800Ω. Check microphone voltage 1.7VDC at C242 (use WinTesla/ Testing/ Audio/ internal/ Loop on). Check audio signal at C258 and C259.

X503 – Bottom connector

Check microphone contact springs in connector. Check contact springs to the board. Change connector if bent. Clean the contact pads on PCB.

N200 COBBA faulty

Check VBB 2.8VDC at C117 near CCONT. Check VCOBBA 2.8VDC C248 near COBBA. Check COBBACLK 3.6Vpp at J201 - see diagram at page# 41. Check COBBARESET impulse during initialization routine at J343 (see diagram "COBBA RESET"). Change COBBA (if not underfilled) and rewrite IMEI and SIMlock data. If error persists - MAD or PCB might be the reason. SWAP the unit because MAD is not changeable.

Note: Rewrite SIMlock and IMEI entries with Nokia Security Password and make a SW-update or send these phones to a higher level NOKIA Service Center!

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INTERNAL AUDIO FAILURE

Internal audio failure

Speaker does not work

(received audio)

Microphone

does not work

Check

Yes

connection L202, L203

to speaker pads

(0 Ohm)

OK

nOK

Check the mechanical

appearence and

impedance of speaker

nOK

(around 30 Ohm)

Check contact springs

Yes nOK

and impedanc e of microphone

(800 Ohm)

Ok

Check microphone bias

voltage 1.7V at C242

(audio loop enable)

nOK

Change L202 or L203

Change speaker

Change microphone

Check voltage at R214

nOK

Check resistance

between lines and

GND: >1MOhm

Change COBBA

(N200)

Check if the

connection X503 to

PCB is soiled

Change N200

COBBA

Change

N200 COBBA

Ok

Check audio signal

at C258, C259

Ok

Check 2.8V DC VBB at C117

and 2.8V DC VCOBBA at C248

Ok

Check

COBBACLK 13MHz 3.6Vpp at

OK nOK

J201and COBBARESET at J343

during initialization

Checked by:

nOK

Follow signal back to

the microphone

continue with CCONT

chapter on page #17

Swap the phone because

MAD or PCB might

be the reason

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SIMCARD FAILURES

First of all – always check the mechanical condition of all connectors: X100, X101, X102 and change if contact springs are bent, soiled or possible torn off traces/pads under X100. Also check solderings of connectors and areas for possible liquid damages.

“INSERT SIMCARD”

Check if the phone works properly with a Test SIM. If Test SIM works check R115, R116 (both 100 Check at SIMcard reader if VSIM is pulsed to 3/5Vpp, refer to VSIM picture – if not, change N100 if necessary. Check SIM lines and especially V112 for shorts to GND. Check components in SIM lines (R115, R116 and C137 – C141) for short circuits or capacity loss.

Ω) if these are in a high Ohm range.

“SIMCARD NOT ACCEPTED”

Open with WinTesla/View/Quick-RF-info, to see if a possible SIMlock is activated. Compare the data listed in MCC & MNC with SIMlock list for the respective product code. If SIMlock settings are ok, but the MSIN data field is closed to any special IMSI data range:

ONLY the provider is allowed to open this SIMlock!

If the listed data does not fit to the product code: Correct SIMlock settings with NOKIA Security Password, if this procedure is permitted to you. If SIMlock is not active and/or SIMcard is still not accepted after correct data input – change COBBA N200

NOTE: After rework of COBBA it is necessary to rewrite SIMlock data with NOKIA Security Password if it is permitted to you.

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If other SIMcard problems appear, check the following signals at SIMcard reader pins: SIMclock (pin x), SIMdata (pin 4) – but note:

These signals are only present when SIMcard is active (e.g. when phone registers to the network).

SIMreset (SIMRST_0) is low active, which means that SIMcard will be reseted when SIMreset is 0V. This is the case after switching on the phone (see next diagram). While VSIM is already high, SIMreset keeps low for a few milliseconds – in this time SIMcard will be reset.

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X100, SIMcard reader

Check soldering Check contacts - change connector if bent

N100, CCONT

Check SIMDATA (Pin 4 SIMreader), SIMClock 3.25MHz (Pin 3 SIMreader), SIMReset (Pin 2 SIMreader) and VSIM 3V/5VDC (Pin 1/5 SIMreader) depends on used SIMcard

See diagramss on page# 36.

V112 faulty

Change component if SIMDATA, SIMClock, SIMReset or VSIM is short circuited to GND

Check R115, R116, C137, C138, C139, C140, C141 for short circuits or capacity loss

CCONT N100 faulty

Refer to “Insert SIM Card” procedure – see Flowchart on page# 37.

COBBA N200 faulty

Change COBBA if all SIM LOCK entries and SIMcard signals from CCONT are ok Swap the phone if component is underfilled!

Note: Rewrite SIMlock and IMEI entries with Nokia Security Password and make a SW-update or send these phones to an authorized NOKIA Service Center.

“Insert Simcard” failure

Insert SIMcard

the phone does not register the SIMcard

Check soldering and

contacts of X100,

SIM-reader

OK

Check SIM-data,-clock,-reset and

VSIM for shorts to GND

OK

Change N 100 CCONT

nOK

Resolder X100 or change if any

contact spring is bent

Change V112 if SIM -DATA,

-CLOCK, -RESET or VSIM is short circuited to ground

OK

Check R115,R116, C137,C138,C139,

C140, C141

nOK

Swap the phone whether

any contact pad of

SIM-reader is torn off

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RF PART FAILURES

In case of any fault you suppose in the RF part of your phone: Try to calibrate RX/TX-values first to define the fault. Refer to spectrum samples on page#46

Low receiver signal strength indicator – Antenna faulty

Check the fixed position of the antenna – do not touch the conductive area with bare fingers! Check spring connector X501 – change if spring contacts are bent (the GND spring will always look bend down a bit) Check the indicator level with a new antenna.

No service or long time to get network coverage

Check sleepclock frequency 32.768kHz at B100 – change B100 if frequency does not fit (see also chapter “Phone does not switch on – B100 faulty”)

Z501 faulty (low RX Quality / GSM1800)

If RX calibration fails – see RF part faults in previous chapter If RX calibration works or in some cases the low reference level cannot be set – check if Z501 bent Change Z501 if necessary

No service failures summary

At first set the RF-Generator to a high RF-level output: e.g. –40dBm Use WinTesla to set the phone in the following mode: Local mode/Testing/RF Controls/Active unit “RX”/continuous mode

G701 – VCTCXO faulty

Check 13MHz reference frequency at SUMMA N700, pin 15 – frequency error ±50Hz / 900mVpp (see also chapter “Phone does not switch on – G701 faulty”)

If all voltages ok and no frequency deviation is realized, but intermittent call interrupts occuring over and over again - it is also possible that G701 has a not detectable internal failure – so change G701 if the phone has those intermittent call problems.

N600 CRFU faulty / Z600 faulty: “failed to set high reference …”

Check the incoming RF-frequency (e.g. GSM/CH60: 947MHz) at N600, pin 27 Check LNA_AGC (FRACTRL) at N600, pin 28: 2.8VDC Check VRX_1 at N600, Check LNA_OUT 2.3VDC at N600, pin 23 and output of Z600 (attenuation in/out ~15dBm) at N600, pin 18, 19 (In some cases it could be possible that Z600 shorts LNA_OUT) Check UHF LO frequency (GSM/CH60 = 2036MHz) at N600, pin 4 (app. –20dBm) – Check 71MHz intermediate frequency output at N600, pin 15, 16. Check soldering of N600 and/or change CRFU if necessary.

pin 33, 38, 45, 46: 2.8VDC

No RX in PCN-mode only

Check IF 187MHz at N600 pin 45, 46 (out) and pin 11, 12 (in) Check IF 71MHz at N600 pin 15, 16 (out) Check ¼ VHF 116MHz at N600 pin 9 Check V_VHF = 2.8V at N600 pin 13 – if not ok, change CCONT N100

for additional information see Service Bulletin 018

Frequency deviation 0Hz!

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Z700 faulty – RX calibration fault: “failed to set high reference …”

Check 71MHz intermediate frequency at Z700 in and out (attenuation ~15dBm) Check components in output lines of Z700 (C701, C704, C749, L701, R701) if output amplitude is different between both lines. Check for possibly broken solderings under the component.

Z701 faulty – RX calibration fault: “failed to set low reference …”

Check 13MHz intermediate frequency output at N700, pin 30 Check 13MHz IF input at N700, pin 25, 26 (attenuation in/out ~20dBm) Check 13MHz IF at Z701 (attenuation in/out ~5dbm) Check soldering of Z701 or change if necessary Check IF input lines (N700, pin 25, 26) to GND - 10k

Ω - and periphery of Z701 (R717, R718, R719, C706)

G700 faulty

Check UHF frequency at G700 for high spurios emission and/or frequency deviation Check VDC_OUT at N702, pin 6 and also VDC_OUT connection to L103 Check connection from N702, pin 4 to R741 Check VCP 5VDC supply voltage at N700, pin 13, 22 If VCP lower than 4.8VDC check components in VCP line back to CCONT and/or change N100 if necessary Check UHF VC at N700, pin 21: 1.9V – 3.2VDC depending on the used channel Check VC with oscilloscope for noise – check especially soldering of R733 Check C136 (e.g. for capacity loss) if UHF frequency is not adjustable only in higher channel range Change G700 if necessary

N700 faulty

Check 13MHz reference frequency at N700, pin 15: 900mVpp (frequency deviation ±50Hz) Check VRX_2 at N700, pin 35: 2.8VDC Check incoming 71MHz IF at N700, pin 37, 38 and outgoing 13MHz IF (measurable level approximately -20dBm) at N700, pin 30 If 13MHz IF does not exist or a frequency error appears – check VHF_LO at N700, pin 8 Check VCC of G700 and G702 (check connection between both oscillator VCC´s to N702, pin 4) and R745 Check VP1/VP2 at N700, pin 9, 19: 2.8VDC Check VCP 5VDC at N700, pin 13, 22 Check PLL control signals at N700, pin 5 (SCLK), pin 6 (SDAT), pin 7 (SENA) – see following diagrams Check VC of G700 at N700, pin 21 (PD2) depending on the used channel and VC of G702 at N700, pin 12 (PD1): 2.2VDC Check soldering of N700 or change SUMMA if necessary

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N200 COBBA faulty

Check 13MHz IF at N700, pin 23, 24 – if the generator level (-80dBm….-105dBm) is changing - amplitude of IF must also change Check RXC signal at N700, pin 36 – if the generator level is changed – the amplitude of signal must also change Check R725 if these signals are not measurable or too low in amplitude – Check VBB 2.8VDC at C117 (near CCONT) Check VCOBBA 2.8VDC at C248 (near COBBA) Check COBBACLK at J201: 3.6Vpp –

see diagram below

If all signals and voltages are ok – set the phone in call mode with CMU/CMD Check the RX/TX values while knocking (with a nonmetallic item) around COBBA If any error appears – probably broken solderings under COBBA - change N200 if possible (if not underfilled) If the errors persist after rework of COBBA – MAD or PCB might be the reason

NOTE: If COBBA or MAD is underfilled – swap the phone, because these components are not changeable!

If COBBA was changed - SIMlock and IMEI entries must be rewritten with NOKIA Security Password, if this procedure is permitted to you!

see diagram below

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NO SERVICE GSM900 - First check TX spectrum if it is only a receiver fault, see spectrum samples on page# 46.

Failed to set low

reference

Change Z700

Change Z701

nOK

Failed to set high

reference

Check 71MHz IF

at C617/C618

OK

Check IF 71MHz at

N700 pin 37/38

OK

Check IF 13MHz

in/out at Z701

nOK

Check 13MHz

Ref.frequency at

N700, pin 15

OK

Check

GSM LNA

947MHz at N600,

pin 27

OK

Check 947 MHz

in/out at Z600

nOK

Change G701

Check Z500/503

Change Z600

OK

Check IF

Change N700

nOK

13MHz at N700

pin 23/24

OK

Change COBBA

(N200)

NOTE : If COBBA or D301 has been changed, SIMLOCK & IMEI data have to be rewritten.

Also realign RX/TX values.

OK

Check UHF2036

MHz at N600 pin 4

OK

Check UHF

2036MHz at G700

nOK

Check Vc&Vcc

at G700

nOK

Change N600

Change G700

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NO SERVICE GSM1800 - First check TX spectrum if it is only a receiver fault, see spectrum samples on page# 46.

Failed to set low

reference

Check Z501 if bent

OK

Check PCN_LNA at

N600, pin 34

OK

Check 1842.8MHz

in/out at Z602

OK

Check 13MHz RFCLK

900mVpp

OK

Check UHF 2029.8MHz

at G700 & N600, pin 4

OK

Check 187MHz at

N600, pin 45/46

OK

Check 1/4 VHF 116MHz

at N600, pin 9

nOK

OK

Change Z501

Check PCN_LNA at

Z504, Z503, X501, X500

Change Z602

Change G701

Change G700

Change N600

Check 71MHz IF at

C617/C618

OK

Check 71MHz IF at

N700, pin 37/38

OK

nOK

Change N700

Change Z700

Check values at N700

and G702

NOTE : If COBBA or D301 has been

changed, SIMLOCK & IMEI data

have to be rewritten.

Also realign RX/TX values.

Checked by:

Check 13MHz IF at

Z701, in/out

OK

Check 13MHz IF at

N700, pin 23/24

OK

Change COBBA

CC Training Group

nOK

Change Z701

Change N700

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TX Power faults

FOR DETAILED TROUBLESHOOTING AND FURTHER INFORMATION SEE SERVICE MANUAL CHAPTER 4/GSM & 5/PCN TRANSMITTER

Z500 faulty – (low TX power / GSM900)

Check TX power level difference at Z500 between TX pad & Antenna pad Check soldering of Z500

Z504 faulty (low TX power / GSM1800)

Check switching voltage at Z504 (C507): 1VDC Check TX power difference at Z504 between TX pad & Antenna pad If the difference > 2dBm – change Z504

N500 / N501 faulty (low TX power GSM900 / GSM1800)

All hints are always for both bands (GSM/PCN) – so take only the band depending on your faulty one

Check VDC_OUT 3.2V …. 4.2V (depending on power level) at N500 / N501 Check input / output power difference at N500 / N501 Check CTL_GSM signal at N500 (1.2Vpp …. 1.9Vpp – depending on the used power level) at N700, pin 31 Check CTL_PCN signal at N501(1.0Vpp …. 1.6Vpp – depending on the used power level) at N700, pin 28 (see diagram below) Change corresponding PA if control lines are ok

CTL_PCN signal at N700, pin 28 – in this example measured at power level 0

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TX phase faulty

Check TX spectrum with analyzer – refer to page# 46 If the following spectrum appears – check components in TX I/Q lines for shorts: In some cases (especially after rework in COBBA area) R708, R710, C708, C709 (near COBBA N200) could be misplaced. If the components are ok – change COBBA N200 if not underfilled.

NOTE:

If COBBA was changed - SIMlock and IMEI entries must be rewritten with NOKIA Security Password, if this procedure is permitted to you!

TX phase faulty in high channel range in GSM1800

Check TX spectrum with analyzer – refer to page# 46 Check mechanical appearance of Z504 If measurements are ok – change Z504 – in some cases the bottom side of this component could be teared off because of mechanical stress, which only could be seen if the component is removed.

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Faulty spectrum – COBBA faulty, COBBA and CCONT broken solderings

1)

Normal spectrum 3) Spectrum of faulty COBBA

2)

Spectrum with broken solderings under CCONT 4) Spectrum of faulty oscillator G500

Turns to picture 1 if CCONT is pushed careful with some nonmetallic item

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TX FAILURE

GSM900 faulty GSM1800 faulty

OK

Check 116MHz

at N700, pin 44/45

OK

Check 116MHz

at N600, pin 25/26

OK

Check UHF 2036MHz

at N600, pin 4

OK

nOK nOK

nOK

Check 13MHz RFCLK 900mVpp

at N700, pin15.

Change if faulty.

OK

Check VHF 464MHz

at N700, pin 8

Change N700

Check Z702

Check/change G700

OK

nOK

Change G702

Check 232MHz at

N700, pin 46

Check 232MHz at

N600, pin 35/37

Check UHF 1979.8MHz

at N600, pin 4

OK

Check

PA_GSM 902MHz at

N600, pin 22

OK

Check

PA_GSM 902MHz

at N500, pin1

OK

Check PA_GSM at

N500, pin 4

OK

Check PA_GSM at L500,

Z503/Z500, X500/X501

Change Z504

nOK

Change N600

Check Z601 (in/out)

Check Z603,N502,Z502

Check at N500/501, pin 2:

CTL_GSM=0.7-1.7Vpp

CTL_PCN=0.12-0.2Vpp

( squarew ave, de pends on Pow er-level )

OK

Check VC at Z504

0.9Vpp squarewave

nOK

OK

Check PA_PCN

1747.8MHz at N600, pin 40

OK

Check PA_PCN

at N501, pin 1

OK

Check PA_PCN

at N501, pin 4

OK

Check PA_PCN

at Z504 (Ant. conn.)

nOK

Check/change L503

OKI

Check/change:

a) N600 / b) N100

if not ok, MAD faulty

Check at N503:

nOK

Checked by:

a) pin 2 BAND_SEL (lowlevel)

b) pin 1 VTX 2.8V pulsed

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Check PA_PCN

at Z503, X500/501

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Change history

Originator Status Version Date Comment Jose Marquez Jose Marquez Jose Marquez

Holger Klein

TS-TrainingGroup

Draft 0.2 22.10.1999 First draft version for the repair group

Draft 0.3 02.11.1999 Insert comments from the repair team, add layout

"Test Points"

approved 1.0 05.11.1999 First AMS version

approved

2.0

3.0

04.02.2000

07.09.2000

“not charging” reference to SB024 added Additions to chapter “no service” SIM-Locks updated Flowcharts page 15, 21 VCOBBA at C148 corrected to C248 New appearance, RF- descriptions, Flowcharts and HW changes added. All documents reworked.

approved 4.0 20.10.2000 Headers changed.

approved 4.2 31.10.2000 Last SIMlock-list and Comments added.

TS-TrainingGroup

draft 4.6 27.08.2001 Comments from repair team added, SIMlock list

removed (separated)

approved 5.0 05.09.2001

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