Nokia 2300 Service Manual 08 rm4 engine

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Customer Care Solutions

Technical Documentation

Engine module

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Table of Contents

Page No

Abbreviations ................................................................................................................ 5

Baseband HW Introduction ...........................................................................................8

Technical Summary ....................................................................................................8

Modes of Operation .................................................................................................... 9

No supply ................................................................................................................ 10

Power_off ............................................................................................................... 10

Acting Dead ............................................................................................................ 10

Active ......................................................................................................................10

Sleep mode ............................................................................................................. 11

Charging ................................................................................................................. 11

DC Characteristics ....................................................................................................12

Supply Voltage Ranges .......................................................................................... 12

Regulators Voltage Ranges .................................................................................... 13

Interconnection Diagram ........................................................................................... 14

External Signals and Connections ............................................................................. 14

System connector (X102) ....................................................................................... 14

Battery connector .................................................................................................... 16

Baseband – RF interface ......................................................................................... 16

Internal Signals and Connections ..............................................................................16

Audio ...................................................................................................................... 16

Speaker (IHF & ringer) ........................................................................................... 17

Baseband board clocks ......................................................................................... 17

Environmental Specifications ......................................................................................19

Operating conditions .................................................................................................19

Temperature Conditions ......................................................................................... 19

Humidity ................................................................................................................... 19

Functional Description ................................................................................................ 20

Audio External ..........................................................................................................20

Audio Internal ........................................................................................................... 20

Earpiece .................................................................................................................. 20

Microphone .............................................................................................................21

Power amplifier (boomer) ......................................................................................... 22

Batteries .................................................................................................................... 23

FM radio .................................................................................................................... 25

Keyboard ...................................................................................................................27

Display & Keyboard Backlight .................................................................................28

LCD Backlight ........................................................................................................28

Keyboard light ........................................................................................................ 28

LED driver circuit ................................................................................................... 28

Display ...................................................................................................................... 29

Memory Module ....................................................................................................... 29

SIM Interface ............................................................................................................29

Vibra ..........................................................................................................................30

Test Interfaces ............................................................................................................. 31

Connections to Baseband .......................................................................................... 31

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FLASH Interface .......................................................................................................31

FBUS Interface ......................................................................................................... 31

MBUS Interface ........................................................................................................32

General description of the RF circuits ......................................................................... 33

Receiver signal path ..................................................................................................33

Transmitter signal path .............................................................................................. 33

PLL ............................................................................................................................34

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Abbreviations

Abbr. Description

ACI Accessory Control Interface ADC Analog Digital Connector ARM Advanced RISC Machines ASIC Application Specific Integrated Circuit ATR Answer To Reset BB Baseband BL-5C Battery type. BSI Battery Size Indicator Cbus Control bus (internal phone interface between UPP-UEM) CCS Customer Care Service CTI Cover Type Indicator CTSI Clock Timing Sleep and Interrupt Dbus DSP controlled bus (Internal phone interface between UPP-UEM) DC Direct Current DCT4.0 Digital Core Technology, generation 4.0 DSP Digital Signal Processor DUT Device under test EAD External Accessory Detection EMC Electro Magnetic Compatibility ESD Electro Static Discharge Fbus Fast Bus, asynchronous message bus connected to DSP (commu-

nications bus) FCI Functional cover interface FPC Flexible printed circuit FR Full Rate GENIO General Purpose Input/Output GSM G lobal System Mobile

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HW Hardware IF Interface IHF Integrated Hands Free IMEI International Mobile Equipment Identity LCD Liquid Crystal Display LDO Low Drop Out LED Light Emitting Diode Li-Ion Lithium Ion battery LPRF Low Power Radio Frequency Lynx Battery type MALT Medium And Loud Transducer Mbus Asynchronous message bus connected to MCU (phone control

interface). Slow message bus for control data. MCU Micro Controller Unit NO_SUPPLY UEM state where UEM has no supply what so ever NRT Nokia Ringing Tones NTC Negative temperature Coefficient, temperature sensitive resistor

used as a temperature sensor. PA Power Amplifier (RF) PDM Pulse Density Modulation PDRAM Program/Data RAM Phoenix SW tool of DCT4.x PLL Phase locked loop PnPHF Plug and Play Handsfree PUP General Purpose IO ( PIO), USARTS and Pulse Width Modulators PWB Printed Wired Board PWR_OFF UEM state where phone is off PWRONX Signal from power on key. R&D Research and development RESET UEM state where regulators are enabled RTC UEM internal Real Time Clock

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SARAM Single Access RAM SIM Subscriber Identification Module SLEEP UEM power saving state controlled by UPP SPR Standard Product Requirements SRAM Static RAM STI Serial Trace Interface SW Software TBSF Through the Board Side Firing TI Texas Instruments, American company UEM Universal Energy Management UI User Interface UPP Universal Phone Processor VBAT Main battery voltage VCHAR Charger input voltage VCHARDET Charger detection threshold level VMSTR+,

Master Reset threshold level VMSTR

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Baseband HW Introduction

This document specifies the baseband module for the Nokia 2300 phone. The baseband module includes the baseband engine chipset, the UI components and the acoustical parts for the transceiver.

Nokia 2300 is a hand-portable dual band 900/1800MHz phone, featuring DCT4 generation baseband (UEM/UPP) and RF (MJOELNER) circuitry. Nokia 2300 is closely related to Nokia 3510 and 3510i

Technical Summary

The baseband module contains 2 main ASICs named UEM and UPP. The baseband module furthermore contains a Flash IC of 16Mbit. The baseband is based on the DCT4 engine program.

Figure 1: Nokia 2300 baseband block diagram

PA Supply

RF Supplies

RF RX/TX

SIM

EAR

MIC

LM4890

IHF

Battery

Baseband

UEM

DLIGHT

SLEEPCLK

Supplies

32kHz

CBUS/ DBUS

Mjoelner

26MHz

UPP

RFBUS

MEMADDA

VIBRA

External Audio Charger connection

DCT4 Janette connector

MBus/FBus

AM/FM Radio

FLASH

The UEM supplies both the baseband module as we ll as the RF module with a series of voltage regulators. Both, the RF and baseband modules are supplied with regulated voltages of 2.78V and 1.8V. The UEM includes 6 linear LDO (low drop-out) regulators for baseband and 7 regulators for RF. The UEM is furthermore supplying the baseband SIM interface with a program-

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mable voltage of either 1.8 V or 3.0 V. The core of the UPP is supplied with a programmable voltage of 1.0 V, 1.3 V, 1.5 V or 1.8 V.

The UPP operates from a 26MHz clock, coming from the RF ASIC MJOELNER, the 26 MHz clock is internally divided by two, to the nominal system clock of 13MHz. The DSP and MCU contain phase locked loop (PLL) clock multipliers, which can multiply the system frequency.

The UEM contains a real-time clock, sliced down from the 32768 Hz crystal oscillator. The 32768 Hz clock is fed to the UPP as a sleep clock.

Communication between the UEM and the UPP is carried out via the bi-directional serial buses CBUS and DBUS. The CBUS is controlled by the MCU and it operates at a speed of 1 MHz set by SW. The DBUS is controlled by the DSP and it operates at a speed of 13 MHz. Both processors are located in the UPP.

The UEM ASIC mainly handles the interface between the baseband and the RF section. The UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEM supplies the analog signals to RF section according to the UPP DSP digital control.

The RF ASIC MJOELNER is controlled through the UPP RFBUS serial interface. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside the UPP ASIC. The UEM is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and the analog parts are running from the analog supply 2.78V, VBAT is directly used by some blocks also.

The baseband supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is carried out by the UEM according to control messages from the UPP.

Nokia 2300 has two external serial control interfaces: FBUS and MBUS. These buses can be accessed only through the production test pattern as described in section 4.

The transceiver module is implemented on 6 layer selective OSP/Gold coated PWB.

Modes of Operation

Nokia 2300 baseband engine has six different operating modes (in normal mode):

• No_Supply

• Power_off

• Acting_Dead

• Active

• Sleep

•Charging

Additionally, two modes exist for product verification: 'test mode' and 'local mode'.

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No supply

In No_Supply mode, the phone has no supply voltage. This mode is due to disconnection of the main battery or low battery voltage level.

The phone is exiting from No_Supply mode when sufficient battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > V ing charger and charging the battery above V

mstr+

or by connect-

mstr+

Power_off

In this state the phone is powered off, but supplied. The VRTC regulator is active (enabled) having supply voltage from the main battery. Note that the RTC status in the PWR_OFF mode depends on whether RTC was enabled or not when entering PWR_OFF. From the Power_off mode the UEM enters the RESET mode (after 20ms delay), if any of the following statements is true (logical OR –function):

• Power_on button detected (PWROFFX)

• charger connection detected (VCHARDET)

• RTC_ALARM detected

The phone enters the POWER_OFF mode from all the other modes except NO_SUPPLY if the internal watchdog elapses.

Acting Dead

If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. In this mode no RF parts are powered. To the user, the phone acts as if it was switched off. A battery-charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.

Active

In the active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.

In active mode SW controls the RF regulators.

Table 1: Regulator controls

Regulator NOTE

VFLASH1 Enabled; Low Iq mode during sleep VFLASH2 Enabled; Disabled in sleep mode; Used for FM radio VANA Enabled; Disabled in sleep mode VIO Enabled; Low Iq mode during sleep VCORE Enabled; Low Iq mode during sleep VSIM Controlled by register writing.

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Table 1: Regulator controls

VR1A Enabled; Disabled in sleep mode VR1B Not used in Nokia 2300, disabled VR2 Controlled by register writing; Enabled in sleep mode VR3 Enabled; Disabled in sleep mode VR4 Not used in Nokia 2300, disabled VR5 Enabled; Disabled in sleep mode VR6 Enabled; Disabled in sleep mode VR7 Enabled; Disabled in sleep mode IPA1-2 Not used in Nokia 2300, disabled

Sleep mode

The sleep mode is entered when both MCU and DSP are in stand-by mode. Sleep is controlled by both processors. When SLEEPX low signal is detected, the UEM enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All RF regulators, except VR2, are disabled in SLEEP. When SLEEPX=1 is detected UEM enters ACTIVE mode and all functions are activated.

The sleep mode is exited either by the expiration of a sleep clock counter in the UEM or by some external interrupt, generated by a charger connection, key press, headset connection etc.

In the sleep mode, the main oscillator (26MHz) is shut down and the 32kHz sleep clock oscillator is used as a reference clock for the baseband.

Charging

Charging can be performed in parallel with any other operating mode. A BSI resistor inside the battery pack indicates the battery type/size. The resistor value corresponds to a spe cific battery capacity and technology.

The battery voltage, temperature, size and current are measured by the UEM controlled by the charging software running in the UPP.

The charging control circuitry (CHACON) inside the UEM controls the charging current delivered from the charger to the battery. Charging current is monitored by measuring the voltage drop across a 220 mOhm resistor.

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DC Characteristics

Supply Voltage Ranges

Table 2: Absolu te Maximum Ratings

Signal Rating

Battery Voltage 0 ... 4.39V (VBAT) Charger Input Voltage -0.3 ... 9.2VRMS (16,9 Vpeak)

Following voltages are assumed as normal and extreme voltages for used battery:

Table 3: Battery voltage range

Signal Min Nom Max Note

VBAT 3.21V 3.80V 4.39V

Vcoff+ 3.0V 3.1 3.2 HW off to on Vcoff- 2.7V 2.8V 2.9V HW on to off Vmstr+ 2.0V 2.1V 2.2V UEM off to on Vmstr- 1.8V 1.9V 2.0V UEM on to off Sw shutdown - 3.1V - In Call Sw shutdown - 3.2V - In Idle

According to the GSM specifications, a GSM device with a Li- ion batte ry should work correctly

if it is powered by its nominal voltage +/-15%. The UEM hardware shutdown is from 3.10V and below . The Energy Management of this ph one shut s the phon e down at 3.20V in orde r to perform a correct shutdown of the phone. Above 3.20V + tolerances, at 3.21V, the phone is still fullfilling all the GSM requirements. The nominal voltage is therefore set at 3.80V. This is higher than the normal battery voltage and is only set so that the phone is fullfilling Type Approval. Some of BB testing might be done on battery level. During fast charging of an empty battery voltages between 4.20 and 4.60 might appear for a short while.

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Regulator Voltage Ranges

Table 4: BB regulators

Signal Min Nom Max

VANA 2.70V 2.78V 2.86V VFLASH1 2.70V 2.78V 2.86V VFLASH2 2.70V 2.78V 2.86V VSIM 1.745V

2.91V

1.8V

3.0V

1.855V

3.09V VIO 1.72V 1.8V 1.88V VCORE 1.000V

1.140V

1.235V

1.425V

1.710V

1.053V

1.2V

1.3V

1.5V

1.8V

1.106V

1.260V

1.365V

1.575V

1.890V

Table 5: RF regulators

Signal Min Nom Max

VR1A 4.6V 4.75V 4.9V VR1B 4.6V 4.75V 4.9V VR2 V

out_on out_sleep

2.70V

2.61V

2.78V 2.86V

2.95V

VR3 2.70V 2.78V 2.86V VR4 2.70V 2.78V 2.86V VR5 2.70V 2.78V 2.86V VR6 2.70V 2.78V 2.86V VR7 2.70V 2.78V 2.86V

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Interconnection Diagram

Figure 2: Power distribution diagram

Battery

Baseband

UEM

RF Regulators

VLED+

LED Driver

VBAT

Audio Amplifier

RTC

PA Supply

Baseband Regulators

ccessor

Regulator

Vout

System Connecto

CHACON

VR1A VR1B

VR2-7

VSIM

VCORE

VANA

VIO

VFLASH1

VFLASH2

SIM

UPP

FLASH SRAM

LCD

FM Radio

External Signals and Connections

System connector (X102)

Table 6: DC connector

Pin Signal Min Nom Max Condition Note

2 VCHAR - 11.1V

7.0 V

RMS

8.4 V

peak

RMS

1 CHGND - 0 - Charger ground

16.9 V

7.9 V

RMS

1.0 A

peak

9.2 V

RMS

850 mA

peak

Standard charger (ACP-7)

Fast charger

Charger positive input

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Table 7: External microphone

Signal Min Nom Max Condition Note

MIC2P (Differential input P) - - 100mV

MIC2N (Differential input N) - - 100mV MICB2 (Microphone Bias) 2.0 V 2.1 V 2.25 V DC Unloaded

External loading of MICB2 - - 600 uA D C

G=20dB 1,22kΩ to MIC1B (AC

G=20dB 1kΩ to GND

condition)

Table 8: External speaker, differential output XEARP (HF) & XEARN (HFCM)

Signal Min Nom Max Units Note

Output voltage swing*

* seen from transducer side

Common voltage level for HF output (HF & HFCM) VCMHF

Load Resistance (HF to HFCM)

2.0 - - Vpp Differential output, with 60 dB signal to total distortion ratio

0.75 0.8 0.85 V

154 194 234 W 2×22Ω (±5%) + 150Ω (±25%)

Load Capacitance (HF to HFCM)

- - 10 NF Load to GND

Table 9: Headset detection

Signal Min Nom Max Condition Note

HookInt 0V - 2.86V (Vflash1) Headset button call control, con-

nected to UEM AD-converter

HeadInt 0V - 2.86V (V flash1) Accessory detection, connected to

UEM AD-converter

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Battery connector

Name Description Test usage

VBAT Battery voltage terminal. Battery calibration. GND Battery ground terminal. BSI Battery size identification. Flash and local mode forcing.

Battery temperature is estimated by measurement in transceiver PWB with a separate NTC resistor.

Baseband – RF interface

The interface between the baseband and the RF can be divided into three categories:

• The digital interface from the UPP to the RF ASIC (Mjoelner). The serial digital interface is used to control the operation of the different blocks in the RF ASICs.

• The analogue interface between the UEM and RF. The analogue interface consists of RX and TX converter signals. The power amplifier control signal TXC and the AFC signal come from the UEM as well.

• Reference clock interface between Mjoelner and UPP which supplies the 26Mhz system clock for the UPP.

Internal Signals and Connections

The tables below describe internal signals. The signal names can be found on the schematic for the PWB.

Audio

Table 10: Internal microphone

Signal Min Nom Max Condition Note

MIC1P (Differential input P) - 5mV - G=0dB 1kΩ to MIC1B

(RC filtered by 220R/

4.7uF) MIC1N (Differential input N) - 5mV - G=0dB 1kΩ to GND MICB1 (Microphone Bias) 2.0 V 2.1 V 2.25 V DC External loading of MICB1 - - 600uA DC

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Table 11: Internal speaker (Differential output EARP & EARN)

Signal Min Nom Max Units Note

Output voltage swing 4.0 - - Vpp Differential output Load Resistance (EARP to EARN) 26 32 - W Load Capacitance (EARP to EARN) - - 50 NF

Speaker (IHF & ringer)

Table 12: Connections between UPP and Boomer

Signal From To Parameter Min. Max. Unit Notes

Shutdown GENIO[14] Shutdown

(p. 5)

Table 13: Connections between UEM/Battery and LM4890

Signal

name

XAUDIO[1] Filtered signal

VBAT Battery LM4890

Differential between HF and HFCM. No direct connection between UEM and LM4890

From To Parameter Min. Max. Unit Notes

LM4890 Output

(p. 6)

Baseband board clocks

Table 14: Board Clocks

Vih Vil

Swing

Supply 3.1 4.39 V Lower limit is

1.2

0.4

- 80mV Vpp Long-term

V V

Boomer Shutdown threshold levels

consumption

SW cut-off

Signal name From To Min. Typ. Max. Unit Notes

RFCLK MJOELNER UPP - 26 - MHz Active when

SLEEPX is high

SLEEPCLK UEM UPP - 32.768 - KHz Active when

VBAT is supplied

RFCONVCLK UPP UEM 13 - MHz Active when RF

converters are active

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Table 14: Board Clocks

RFBUSCLK UPP MJOELNER - 13 13 MHz Only active when

bus-enable is active

DBUSCLK UPP (DSP) UEM - 13 13 MHz Only active when

bus-enable is active

CBUSCLK UPP (MCU) UEM - 1 1.2 MHz Only active when

bus-enable is active

LCDCAMCLK UPP

(Write) (Read)

LCD 0.3

3.25

0.650

4 MHz Only active when

bus-enable is active

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Environmental Specifications

Operating conditions

Temperature Conditions

Table 15: Temperature conditions for Nokia 2300

Environmental

condition

Normal operation -25 ° C … +55 °C Specifications fulfilled Reduced performance -40 °C ..-25 °C

and +55 °C … +85 °C

No operation and/or storage

< -40 °C or > +85 °C No storage or operation. An

Ambient

temperature

Remarks

attempt to operate may damage the phone permanently

Humidity

The Nokia 2300 BB module is not protected against water. Condensed or splashed water might cause malfunction. Any submerge of the phone will cause permanent damag e. Long-term high humidity, with condensation, will cause permanent damage because of corrosion.

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Functional Description

Audio External

Nokia 2300 is designed to support a fully differential external audio accessory connection. A headset and PnPHF can be directly connected to the system connector. Detection of the different accessories is made in an analogue way by reading the DC voltage value of EAD converter.

Figure 3: Headset interface

2.7V

Hookint

/MBUS

EAD

Headint Headint

Mic_bias

HFCM

UEM

MICB2

MIC2P MIC2N

3...25k

Not all components are shown

Bottom Connector

33N

1k0

0.3V

1.8V

2.1V

33N

0.8V

MicGnd

Audio Internal

Earpiece

The earpiece selected is a 13 mm dynamic earpiece with a nominal impedance of 32 Ω (previously used for 3210, 3310, 6210, among others).

The earpiece is placed within the mechanical parts, e.g. C-cover and Light guide. The holes of the A-cover and the choice of dust shield are made in a way to have the best transmission of the sound, without having much impact on the sound waves and sound qualities.

The acoustic design involves a sandwich of five parts: Earmat, A-cover, C-cover, lightguideand D-cover.

On top of the lightguide there will be a metal frame (C-cover) that will protect the earpiece. The C-cover will contain 5 acoustical holes and a double-sided gasket for sealing in the area over the earpiece.

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The front cover consists of two parts, an A-cover and an earmat. The earpiece circuit includes only a few components:

• two 10 ohm in order to have a stable output

• an EMC filter

Figure 4: Earpiece interface

Placed in top of

PWB, near

earpiece

EARP

UEM

EARP

Placed near UEM

ohm

EARN

ohm

EARN

Microphone

Acoustical design

An omni directional microphone is used. The microphone is placed in the system connector sealed in its rubber gasket. The sound port is provided in the system connector. This design is well known from Nokia 3310. The only change done to the bottom connector is that the external charger pads were removed.

Figure 5: Bottom connector

Sound port opening

Microphone boot

Electrical interface

Nokia 2300 uses a differential bias circuit, driven directly from the MICB1 bias output with external RC filters.

The RC filter (220 Ω, 4.7µF) is scaled to provide damping at 217 Hz. 217 Hz audible noise (TDMA).

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The RC filter 2.2 kΩ and 1nF are EMC component, while the remaining 10 nF and 1 n F capacitors near the bottom connector are for ESD.

Figure 6: Internal electrical microphone interface

Placed near

bottom

connector

UEM

Placed near

UEM

MICB1

MIC1P

MIC1N

MICBCAP

2k2

22k

Power amplifier (boomer)

Figure 7: Interface between the MIDI circuit and UEM

UEM

external audio

HFCM

Interface to

220

2*33n

4.7uF

1n 1n

Interface to

FM radio

MIC+

2k2

XEARP

XEARN

MIC-

Vbat

Vdd

22k

330p

Vo1

MALT

Vo2

Interface to

UPP

33n

12k

330p

22k

470 n

IN-

IN+

BYPASS

DC-out

GENIO14

SHUTDOWN

GND

Placed near

UEM

Placed outside

BB-can, near the

connections to

MALT

Not used / NA

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The speaker has an external amplifier connected (a so-called boomer) to provide sufficient power for an 8 Ω load. The boomer is implemented with a differential configuration on the input. The inputs are wired to the headset connections HF and HFCM from UEM. These two outputs can each deliver an output swing up to 1.6 Vpp before clipping occurs. HF and HFCM are 180 × out of phase.

Under normal conditions HF and HFCM will be used for downlink audio to the headset/car kit. During headset/car kit usage, where the MIDI speaker is supposed not to be active, the MIDI amplifier can be disabled by means of the shutdown pin, which is controlled by changing the logic level on SHUTDOWN (managed by UPP). During sleep, keeping the shutdown pin "low" also secures a minimum amount of stand-by current to be consumed.

The SHUTDOWN pin shall be timed so that GENIO14 isn't enabled until the DC level shift on HF and HFCM have reached their permanent level (0.8 V sounds in the MALT speaker. Furthermore, when a ringing tone is ending, SHUTDOWN shall be disabled before the DC level on HF and HFCM changes again.

). This in order to remove click

Table 16: Control of SHUTDOWN.

Accessory mode HF-output of UEM SHUTDOWN

In-coming call No accessories connected MIDI-tone routed to HF and

HFCM

Accessories connected MIDI-tone routed to HF and

HFCM

Conversation (non IHF)

Conversation (IHF)

Sleep - - Logic "Low"

No accessories connected No audio routed to HF and

HFCM

Accessories connected Downlink routed to HF and

HFCM

No accessories used, or headset connected

Car kit connected No audio routed to HF and

Downlink routed to HF and HFCM

HFCM

SHUTDOWN is an active high input. The amplification for the given boomer configuration will be equal to 18.5 dB.

Logic "High"

Logic "Low"

Logic "High"

Logic "Low"

Batteries

Type: BL-5C Technology: Li-Ion. 4.23V charging. Capacity: 850 mA/h

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Figure 8: BL-5C battery

The BSI values for the BL-5C batteries:

Table 17: BSI levels BL-5C Battery

Mode BSI (kOhm) Description

Min Type Max

Normal 75 Used for calculating the Capacity (BL5-C =

850mA)

Service 3.2 3.3 3.4 Pull-down resistor in battery. Used for fast

power-up in production (LOCAL mode), R/D purposes or in after sales, 1% tolerance resistors shall be used.

Test 6.7 6.8 6.9 Pull-down resistor in battery, used in produc-

tion for testing purposes. 1% tolerance resistors shall be used.

Banned <3.2

Inside the battery, an over-temperature and an over-voltage protection circuit are present. The BL-5C battery does not contain a temperature sensor. An external temperature sensor

(NTC resistor) is placed on the PWB to measure the temperature.

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FM radio

Headset is used as antenna.

Figure 9: FM radio antenna interface

UEM

INT

HEADINT

100k

HFCM

RFIN1

RFIN2

10n 10n

120 nH

47p

270 nH

39p

XEARP

XEARN

12p

As the chipset and the bottom connector used by Nokia 2300 doesn’t support true stereo, the stereo functionality from a radio point of view cannot be used efficiently for playing stereo over headset.

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Figure 10: FM radio - BB interface

TEA5777

Vafl

Vana

33nF

MIC3P

Gain

MIC3N

UEMC

Attenuation

33nF

Boomer

Gain

max

1.5Vrms

The nominal output of the radio will be in the order of max. 86mVrms @ 22.5kHz swing, max. 190mVrms @ 50kHz swing, max. 280mVrms @ 75kHz swing. This outp ut is routed as a single ended signal to MIC3P and internally in UEM routed to HF/HFCM (by means of an appropriate routing that either amplifies or provides attenuation). From there, the radio signal is sent to the headset and possibly also the IHF speaker, depending on the user’s choice.

The BB interface consist of the following lines: Data and clock

• Bus_en (GENIO8) The data direction is controlled by the edges of the Bus_en signal. Ris-

ing edge means reading from the chip, falling edge means writing data into the chip.

• Data (GENIO 12)

• Data clk (GENIO 11) Serial clock for data transfer, the rising edge clock the data into the chip

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• Reference clock (GENIO 3) The reference clock is 13 MHz. The reference clock is only needed when the radio is active. This means

that data transfer can be made without having the reference clock active. Using a reference clock of 13 MHz also indicates that the radio will not work if the phone is in sleep modes where the RF reference is turned off.

Audio

• Single ended line signal (Input is MIC3P)

Keyboard

The keyboard PWB layout consists of a grounded outer ring and an inner pad. The power key is integrated in keypad. The following table shows the principles of the key-

board.

Table 18: Overview of keyboard configuration

Nokia

UPP Pin

GenIO1 0 In Up GenIOInt5 Falling edge interrupt GenIO2/P05 7 In Up P0 int Falling edge interrupt GenIO20 # In Up GenIOInt2 Falling edge interrupt GenIO21 * In Up GenIOInt3 Falling edge interrupt GenIO25 Up In Up GenIOInt4 Falling edge interrupt GenIO27 1 In Up GenIOInt6 Falling edge interrupt GenIO28 Soft left In Up GenIOInt7 Falling edge interrupt

P00 Menu In Up P0 int Falling edge interrupt P01 3 In Up P0 int Falling edge interrupt

2300) Key

In/

Out

Internal

Pull

Up/down

Interrupt

P02 9 In Up P0 int Falling edge interrupt P03 8 In Up P0 int Falling edge interrupt P04 Down In Up P0 int Falling edge interrupt P10 6 In Up P1 int Falling edge interrupt P11 4 In Up P1 int Falling edge interrupt P12 Soft Right In Up P1 int Falling edge interrupt P13 5 In Up P1 int Falling edge interrupt

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Table 18: Overview of keyboard configuration

P14 C In Up P1 int Falling edge interrupt P15 2 In Up P1 int Falling edge interrupt

All lines are configured as input, when there is no key pressed. When a key is pressed, the specific line where the key is placed is pulled low. This genera tes

an interrupt to the MCU and the MCU now starts its scanning procedure. When the key has been detected all the keypad-register inside the UPP is reset and it's ready

receiving new interrupt.

Display & Keyboard Backlight

LCD Backlight

LCD Backlight consists of 2 sidefirering white LED's which are placed on the display FPC beside the LCD area. They lit into the light guide where the light is distributed to generate sufficient backlight for the LCD & keyboard area.

Keyboard light

There is no dedicated keyboard light implemented. Keyboard light is provided by the LCD backlight.

LED driver circuit

The LED drivers for the LCD & Keyboard backlight are shown in the following figure.The driver circuit is controlled by the UEM output pin [DLIGHT].

R307 defines the current through the LED’s. Dlight is used for switching on and off the driver. The driver itself controls the current and is temperature compensated.

Figure 11: LED driver circuit for LCD and keyboard backlight

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RM-4/RM-5 Engine Module CCS Technical Documentation

Display

The LCD is a black and white 96x65 full dot matrix display. The LCD cell is part of the complete LCD module, which includes C-cover, gasket, light guide, spring connector, transflector, LEDs and earpiece.

Figure 12: LCD module

The LCD is powered from both V V

for the driver chip.

FLASH1

and VIO. V

FLASH1

is used for the boosting circuit and

Memory Module

The Nokia 2300 baseband memory module consists of external burst flash memory 2Mbyte (16Mbit) (optional: 4Mbyte (32Mbit). The UPP contains internal SRAM with 2 Mbit.

SIM Interface

The whole SIM interface is located in the two ASICs, UPP and UEM. The SIM interface in the UEM contains power up/down, port gating, card dete ct, data receiving,

ATR-counter, registers and level shifting buffers logic. The SIM interface is the electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEM device).

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Figure 13: UEM & UPP SIM connections

GND

SIM

C5 C6 C7

C1C2C3

From Battery Type

SIMDATA

SIMCLK

VSIM

BSI

SIMRST

UEM

SIMIF register

Vibra

The vibra is placed in the bottom of the phone.

SIMIO SIMClk

Data

UEM digital logic

GND

SIMIO

SIMClk

Data

UPP

UIF Block

UEMInt

CBusDa

CBusEnX

CBusClk

The vibra is controlled from the UEM by a PWM (Pulse Wide Modulated) square wave signal. In Nokia 2300 Duty cycle is 40.5% if the Vbat is less than 4.0 volts otherwise it will be set to

34.3%. PWM is 520 Hz.

Figure 14: Vibra driver circuit

Vbat

35%

+/-

UEM

VBATDriv

5kohm

VIBRA

10n

Buzz0

Vibraclk

VSADriv2

Only mounted

on Nickel

on RM-4/RM-5

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RM-4/RM-5 Engine Module CCS Technical Documentation

Test Interfaces

Production test pattern is placed on the engine PWB, for service and production purposes. The same test pattern is used for after sales purposes as well.

Through MBUS or FBUS connections, the phone HW can be tested by PC software (Phoenix) and production equipment (FLALI/FINUI/LABEL).

The testpads are listed in the schematic diagrams.

Connections to Baseband

The flash programming box, FPS8, is connected to the baseband using a galvanic connector or test pads for galvanic connection. The UEM watchdog is disabled during flash programming to prevent a hardware reset of the timer. The flash programming interface connects the flash prommer to the UPP via the UEM and the connections correspond to a logic level of 2.7 V. The flash prommer is connected to the UEM via the MBUS (bi-directional line), FBUS_TX, and FBUS_RX. The programming interface connections between the UEM and the UPP constitute the MBUS, FBUS_TX, and FBUS_RX lines. The interface also uses the BSI (Battery Size Indicator).

FLASH Interface

Flash programming in production is done through the production test pattern (J396) on the PWB.

Table 19: Flash interface signals

Signal Min Nom Max Note

TX_D 2.7V

RX_D 2.7V

0V GND 0V SCK 2.7V

0V VPP 0V 12V Flash programming voltage BSI 0V 2.7V Battery size indication. Falling edge

3.0V

required for flash programming.

FBUS Interface

FBUS is an asynchronous data bus having separate TX and RX signals. The default bit rate of the bus is 115.2 kbit/s. FBUS is mainly used for controlling the phone in production. Typical VFLASH1 is 2.78V

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Table 20: FBUS interface signals

Signal Min Nom Max Note

FBUS_TX Voh 0.7*VFLASH1 VFLASH1

Vol 0 0.3*VFLASH1

FBUS_RX Vih 0.7*VFLASH1 VFLASH1

Vil 0 0.3*VFLASH1

Rise time Tr 12.5 ns for TX and RX

signals

GND 0

MBUS Interface

The MBUS interface is used for controlling the phone in R&D and CCS. It is a b i-directional serial bus between the phone and PC. In production, the phone initialisation is made using MBUS. The default transmission speed is 9.6 kbit/s.

Table 21: MBUS interface signals

Signal Min Nom Max Note

GND 0 MBUS Vih 1.95V 2.7V 3.0V bi-directional

Vil 0V 0.2V 0.83V Voh 1.95V 2.78V 2.83V Vol 0V 0.2V 0.83V

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General description of the RF circuits

In the following general description the different parts is described at block level.

Receiver signal path

The signal from the antenna pad is routed to the RX/TX switch (Z700). If no control voltages are present at VANT2 and VANT1, the switch works as a diplexer and the GSM900 signal is passed through the RX/TX switch to the GSM-RX and the GSM1800 signal to PCS-RX.

VRX

RXIP

RXIM

RXQP

RXQM

VPLL

VCP

VVCO

VXO

REFOUT

VBB

TXIP/TXIM

TXQP/TXQM

VREF1

RESET_X

VTX

TXC TXP

2 2 2 2

PWC

TXP

TXC

B B X R D D V

1/2

222

1/4

Mjoelner

BIQUAD

RBEXT

2,7k

LPF1

BBAMP

64/65

LOCNT

REFCNT

CTRL

SENSE

VDDTX

LPF1

NDIV ADIV

RDIV

Hitachi PA: 33k Philips PA: 56k RFMD PA: 82k

DCN1

AGC

DCN1

buffer

BIQUAD

DCN2

LPF2

DCN2

LPF2

charge

pump

Lock

detect

VDDPLL VDDLO

VDDPRE

VDDCP

CPOUT

loop filter

VDDXO

REFOU

Buffer

T XTALM

26MHz

XTALP

VCCVCO1 VCCVCO2

VDDBBB VDDDL VDDDIG

2 2

VBEXT RESETX

RFBUSCLK

RFBUSX RFBUSDA

F X R D D V

INPL

GSM

TX RX

Ant Switch

PCN

SAW

RX900/850

SAW

RX1900

VANT1 / VANT2

INML

INPM

RX1800

INMM

INPH

INMH

Controls

From the RX/TX switch, the GSM900 signal is routed to the SAW filter (Z602). The purpose of the SAW filter is to provide out-of band blocking immunity and to provide the LNA I Mjoelner (N600) with a balanced signal. The front end of Mjoelner is divided into a LNA and a Pre-Gain amplifier before the mixers.

The output from the mixer is fed to the baseband part of Mjoelner, where the signals are amplified in the BBAMP and lowpass filtered in LPF1 before the DC compensations circuits in DCN1. The DCN1 output is followed by a controlled attenuator and a second lowpass filter LPF2. The output from LPF2 is DC centered in DCN2 before being feed to the BB for demodulation.

The GSM1800 signal chain is similar to GSM900, the SAW filter is numbered Z601.

Transmitter signal path

The I/Q signal from the BB is routed to the modulators for both 900 and 1800 MHz. The output of the modulators is either terminated in a SAW filter (Z603) for GSM900 or a balun for GSM1800.

The signal is then amplified in the PA (N700) where the gain control takes place. The TX signal from the couplers is fed to the RX/TX switch, used to select which signal to route to the antenna.

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Dir. Coupler

PLL

VRX

RXIP

RXIM

RXQP

RXQM

VPLL

VCP

VVCO

VXO

REFOUT

VBB

TXIP/TXIM

TXQP/TXQM

VREF1

RESET_X

VTX

TXC TXP

2 2 2 2

PWC

TXP

TXC

B B X R D D V

1/2

222

1/4

Mjoelner

BIQUAD

RBEXT

2,7k

LPF1

BBAMP

64/65

LOCNT

REFCNT

CTRL

SENSE

VDDTX

LPF1

NDIV ADIV

RDIV

Hitachi PA: 33k Philips PA: 56k RFMD PA: 82k

DCN1

AGC

DCN1

AGC

buffer

BIQUAD

DCN2

LPF2

DCN2

LPF2

charge

pump

Lock

detect

VDDPLL

VDDLO

VDDPRE VDDCP CPOUT

loop filter

VDDXO REFOU

Buffer

T XTALM

26MHz

XTALP

VCCVCO1 VCCVCO2

VDDBBB VDDDL VDDDIG

2 2

VBEXT

RESETX

RFBUSCLK

RFBUSX RFBUSDA

F X R D D V

GSM

TX RX

Ant Switch

PCN

Controls

OUTHP OUTHM

OUTLP OUTLM

DET PLFB1 PLFB2

Controls

Open collector

VPCH/VPCL

VTXBL VTXBH VTXLOL

1800

1900

DET

VBATT

Balun

VTX

SAW

PWloop Filter

The PLL supplies Local Oscillator (LO) signals for the RX and TX mixers. In order to be able to generate LO-frequencies for the required EGSM and PCN channels, a regular synthesizer circuit is used. All blocks for the PLL except for the VCO, reference X-tal and lopp filter is located in the Mjoelner IC.

The reference frequency is generated by a 26 MHz Numerically controlled X-tal Oscillator (NCXO), which is located in the Mjoelner IC. Only the X-tal is external. 26 MHz is supplied to BB, where a divide-by-2 (located in the UPP IC) generates the BB-clock at 13 MHz. The reference is supplied to the reference divider (RDIV), where the frequency is divided by 65. The output of RDIV (400kHz) is used as a reference clock for the Phase Detector (

ϕ).

The PLL is a feedback control system controlling the phase and frequency of the LO signal. Building blocks for the PLL include: Phase detector, Charge Pump, Voltage Controlled Oscillator (VCO) and loop filter. As mentioned earlier, only the VCO and loop filter is external to the Mjoelner IC.

The VCO (G600) is the component that actually generates the LO frequency. Based on the control voltage input, the VCO generates a single-enede RF output. The signal is then differentiated through a balun. The signal is fed to the Pre-scaler and N-divider in Mjoelner, these 2 blocks will together divide the frequency by a ratio based on the selected channel.

The divider output is supplied to the phase detector, which compares the freque ncy and phase of the 400 kHz reference clock. Based on this comparison, the phase detector controls the charge pump to either charge or discharge the capacitors in the loop filter. By charging/discharging the loop filter, the control voltage to the VCO changes and the LO frequency will change. Therefore the PLL keeps the LO frequency locked to the 26 MHz NCXO frequency.

The loop filter consists of the following components: C639-C640-C641 and R618-R619.

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The PLL is operating at twice the channel center frequency when transmitting or receiving in the GSM1800 band. For the GSM900 band the PLL is operating at 4 times the channel frequency. Therefore divide-by-2 and divide-by-4 circuits are inserted between the PLL and output and the LO input for the GSM900 and GSM1800 mixers.

Item EGSM900 GSM1800

Receive frequency range 925…960 MHz 1805…1880MHz Transmit frequency range 880…915 MHz 1710…1785MHz Duplex spacing 45 MHz 95 MHz Channel spacing 200 kHz Number of channels 174 374 Power class 4 (2 W peak) 1 (1 W peak) Number of power levels 15 16

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36 COMPANY CONFIDENTIAL ISSUE 1 02/2004

Nokia 2300 Service Manual 08 rm4 engine

Specifications and Main Features

Frequently Asked Questions

User Manual

Engine module

Abbreviations

Baseband HW Introduction

Technical Summary

Modes of Operation

No supply

Power_off

Acting Dead

Active

Sleep mode

Charging

DC Characteristics

Supply Voltage Ranges

Regulator Voltage Ranges

Interconnection Diagram

External Signals and Connections

System connector (X102)

Battery connector

Baseband – RF interface

Internal Signals and Connections

Audio

Speaker (IHF & ringer)

Baseband board clocks

Environmental Specifications

Operating conditions

Temperature Conditions

Humidity

Functional Description

Audio External

Audio Internal

Earpiece

Microphone

Power amplifier (boomer)

Batteries

FM radio

Keyboard

Display & Keyboard Backlight

LCD Backlight

Keyboard light

LED driver circuit

Display

Memory Module

SIM Interface

Vibra

Test Interfaces

Connections to Baseband

FLASH Interface

FBUS Interface

MBUS Interface

General description of the RF circuits

Receiver signal path

Transmitter signal path