1
Motorola Small–Signal Transistors, FETs and Diodes Device Data
PNP Silicon
MAXIMUM RATINGS
Rating Symbol BDB02C BDB02D Unit
Collector–Emitter Voltage V
CEO
–80 –100 Vdc
Collector–Base Voltage V
CES
–80 –100 Vdc
Emitter–Base Voltage V
EBO
–5.0 Vdc
Collector Current — Continuous I
C
–0.5 Adc
Total Device Dissipation
@ TA = 25°C
Derate above 25°C
P
D
1.0
8.0
Watt
mW/°C
Total Device Dissipation
@ TC = 25°C
Derate above 25°C
P
D
2.5
20
Watt
mW/°C
Operating and Storage Junction
Temperature Range
TJ, T
stg
–55 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient
R
q
JA
125 °C/W
Thermal Resistance, Junction to Case
R
q
JC
50 °C/W
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic
Symbol Min Max Unit
OFF CHARACTERISTICS
Collector–Emitter Voltage BDB02C
(IC = –10 mA, IB = 0) BDB02D
V
(BR)CEO
–80
–100
—
—
Vdc
Collector Cutoff Current
(VCB = –80 V, IE = 0) BDB02C
(VCB = –100 V, IE = 0) BDB02D
I
CBO
—
—
–0.1
–0.1
m
Adc
Emitter Cutoff Current (IC = 0, VEB = –5.0 V) I
EBO
— –100 nAdc
ON CHARACTERISTICS
DC Current Gain
(IC = –100 mA, VCE = –1.0 V)
(IC = –500 mA, VCE = –2.0 V)
h
FE
40
25
400
—
—
Collector–Emitter Saturation Voltage
(1)
(IC = –1000 mA, IB = –100 mA) V
CE(sat)
— –0.7 Vdc
Collector–Emitter On Voltage
(1)
(IC = –1000 mA, VCE = –1.0 V) V
BE(on)
— –1.2 Vdc
DYNAMIC CHARACTERISTICS
Current–Gain — Bandwidth Product (IC = –200 mA, VCE = –5.0 V, f = 20 MHz) f
T
50 — MHz
Output Capacitance (VCB = –10 V, IE = 0, f = 1.0 MHz) C
ob
— 30 pF
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle 2.0%.