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SERVICE MANUAL FOR
SERVICE MANUAL FOR
9223
9223
BY: Meg.chen
Technical Maintenance Department/GTK MTC
Nov.2009/R00
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Contents
1. Hardware Engineering Specification …………………………………………………………………….
1.1 Introduction ………………………………………………………………………………………………………………
1.2 System Overview ………………………………………………………………………………………...………………
1.3 Functions Description …………………………………………………………………………………………….…….
1.4 Electrical Characteristic ………………………………………………………………………………..………………
1.5 Reference Documents ……………………………………………………………………………………………………
2. System View and Disassembly …………………………………………………………………………....
2.1 System View ………………………………………………………………………………………………………………
2.2 Tools Introduction …………………………………………………………………………………………………….…
2.3 System Disassembly ………………………………………………………………………………………………..….…
3. Definition & Location of Connectors/Switches ……………………………………………………….....
3.1 Mother Board ………………………………………………………………………………………………….................
4. Pin Descriptions of Major Components ………………………………………………………….............
4.1 Cantiga North Bridge…………………………………………………………………………………………………….
4.2 ICH9M South Bridge……………………………………………………………………………………………………
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5. System Block Diagram ……………………………………………………………………………………..
6. Trouble Shooting
…………………………………………………………………………………………………………..
6.1 No Power…………………………………………………………………………………………………………………..
6.2 No Display…………………………………………………………………………………………………………………
6.3 Graphics Controller Failure LCD No Display…………………………………………………………………………
6.4 External Monitor No Display……………………………………………………………………………………………
6.5 Keyboard (K/B) & Touch-Pad (T/P) Failure……………………………………………………………………………
6.6 Hard Disk Driver Failure…………………………………………………………………………………………………
6.7 Bluetooth Failure…………………………………………………………………………………………………………
6.8 USB Port Failure…………………………………………………………………………………………………………...
6.9 Audio Failure………………………………………………………………………………………………………………
6.10 LAN Failure……………………………………………………………………………………………………………….
6.11 Card Reader slot Failure…………………………………………………………………………………………………
6.12 Mini Express (Wireless) Socket Failure…………………………………………………………………………………
6.13 Express Card Socket Failure……………………………………………………………………………………………
Contents
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1. Hardware Engineering Specification
1.1 Introduction
1.1.1 General Description
The 9223 motherboard is Intel Montevina SFF Platform with Mobile Penryn ULV on Intel’s advance 45 nm process
technology with copper interconnect. The processor provides a high-performance low-power mobile processor based
on the Intel Mobile processor architecture.
9223 platform implements Intel Cantiga GS40 SFF / ICH9-M SFF core logic. The Intel Cantiga GS chipset-based
Memory Controller Hub and the Intel I/O Controller Hub 9 Mobile SFF(ICH9-M).
The GMCH component provide the host interface controller, system memory interface (SDRAM) ,Direct Media
interface ,Integrated Graphics engine. The ICH9-M integrate a number of I/O device controller and interface for
legacy and high-speed device.
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1.2 System Overview
4GBMax Size
2 SO-DIMM Slot
DDRII 667/800 1GB/2GBType
Memory
Intel Cantiga GS40 + ICH9M-enhanced SFFChipset
-13.3 1366x768 LED w/z driver
-Max Brightness :TBD
EDID Support
Display
Chipset NB low 7-8W,high 10-12.5W, SB
2.0-2.5W
10W TDP chassis designTDP
Montevina SFF SKU
FSB 800
Mobile Penryn Montevina ULV CPU SU2700
Mobile Penryn Montevina Celeron CPU C723
Type
CPU 10WCPU
RemarkSpecBasic Function
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3 in 1 typeSD/MS/MS Pro/MMCSlot Type
USB interface3 in 1 (Realtek)Card Reader
VHot plugFunction
PCI-E & USB interface supportExpress Card Type I 34 mm x1Slot Type
Express Card
Not SupportBuzzer
TBDQuality
S/W volume control by K/BVolume
1 mic arrayInt. Mic
with Speaker Box1.5W speaker x2Speaker
ALC 272AzaliaInterface
Audio
UMAGraphic
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XAlert on LAN
XWake on LAN in S4
VWake on LAN in S3
VBoot on LANFunction
10/100/1000 LAN (PCI-E)Spec
On board LAN solution Slot Type
RTL8111DLRJ45 JackConn. I/F
LAN
RemarkSpecCommunication
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Remain the same status of last power offPower on status
Radio wave enable by Fn+F1 key or killer SwitchOthers
MIMO1.802.11 b/g/n , AW-NE771
2.3G , EM770
Module Spec
1.3G (EU first) + MIMO + BT for antenna
(US 2
nd
priority)
2.All Antenna on top
MIMOAntenna
Mini PCI-E x2Slot Type
Wireless LAN
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USB/UVC functionInterface
AuzreWave, AM-1B013Module Spec
Slot Type
Webcam
Power on status
Others
AW-BT252Module Spec
Antenna on panel topAntenna
Test criteria: 1Mbps @10m8 pinSlot Type
BTO if possibleBluetooth
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RJ45LAN
BlackMic in
BlackHP Out Audio Jack
Port x3 (USB2.0)USB
VistaD-sub x 1Video output
RemarkSpecI/O Interface
Structure
Digital support onlySuper Multi/DVD-Dual/DVD COMBOType
SATA interface9.5mm height ODDODD
160/250/320 GBSATA I/F,2.5’’ height HDDHDD
RemarkSpecStorage Device
Push button typeECO
Push button typePower button
One touch solutionButton /Switch
RemarkSpecUser Interface
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19mm Pitch/1.7mm Stroke
Pitch/Stroke
Keyboard
RemarkSpecInput Device
BlueECO button
BluePWR button
BlueNum Lock
BlueCaps Lock
BlueHDD/ODD
BlueCharge
Blue/RedAC/BATT
BlueWLAN
Status LED
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TBDWindowsFn+F12Suspend
Backlight OffTBDDos/WindowsFn+F11Panel on/off
Mute system master volumeTBDWindowsFn+F10Mute on/off
TBDX
T/P on/off
TBDDos/WindowsFn+F7 16 levelsBrightness up
Switch to battery model still keep original
brightness level
TBDDos/WindowsFn+F6 16 levelsBrightness down
Behaviour:
LCD→LCD+CRT→CRT→LCD
TBDDos/WindowsFn+F5
Display Change
TBDWindowsFn+F4
Sound up
TBDWindowsFn+F3
Sound down
TBDX
Radio on/off
TBDWindowsFn+F1 (WLAN)
Radio on/off
BeepOS
Function Key
300mm
Dimension
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RemarkSpecPower
12 PinPin
Glide pad with 2 buttonsFunction
Under plasticSynaptics: TM391Pointing Device
5 years battery lifeNot chargeableRTC Battery
Target: TBDS3 Suspend Time
Idle modeTarget: TBDPower on Charge
Target:2 hrs to 90%(6 cells )Power off Charge
ECO modeTarget:
4.5 hours with backlight min. with 6 cell battery
Battery Life
6 cellsCells No.
2250mAhCapacity
Li-ion typeType
Gauge IC 20Z90Battery
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TBDBattery remain 20% after 30 Days w/z 100% battery capacity
(6 cell)
Leakage Current
DeltaVendor
AC 100-240VInput
65W 3 pin DCAC Adapter
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1.3.2 CORE LOGIC
1.3 Function Description
1.3.1 CPU
• The Penryn Processor SU2700 on 45-nanometer process technology (also referred to as
CPU and processor in this document) with the following new features:
• 800-MTs Source-Synchronous Front Side Bus (FSB)
• Intel® Trusted Execution Technology (Intel® TxT)
• SSE4.1 instructions
• New Deep Power Down Technology (also called C6 state) low power state which further reduces power
consumption when the processor is idle
• Enlarged 2-MB L2 cache memory
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ICH9-M
• The Cantiga chipset Graphics Memory Controller Hub (also referred to as the (G)MCH in the document)
and ICH9M I/O controller hub with the following new features.
• Gen 5.0 Integrated Graphics Engine
• 400-MHz core render clock at 1.05-V core voltage
• Support for DDR2 at 800 and 667 MTs
Cantiga
• The ICH9M I/O controller hub (also referred to as ICH9M in the document) is a follow-on product to Intel
ICH8M with the following enhancements.
• 12 USB ports
• 4 SATA ports
• Support for Intel® Active Management Technology (Intel® AMT) 4.0
• Support for Integrated Trusted Port module 1.2
• CPU Deep Power Down Technology (also called C6 state) state support
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Support DDR2 667/800 MHz SO-DIMM expandable to 4GB (2 DDR2-SODIMM slots)
1.3.3 Memory
CRT Port
1.3.4 I/O PORTS
• Standard VGA compatible port
• DDC1 and DDC2B compliant
4GB2GB2GB
2GB1GB1GB
2GB0GB2GB
1GB0GB1GB
TotalSlot2Slot1
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RJ-45
• RTL8111DL Integrated 10/100/1000 transveiver
• Supports PCI ExpressTM 1.1
•Auto-Negotiation with Next Page capability
Clock to DDC monitorCRT_DDCK15
Vertical Sync controlCRT_VSYNC14
Horizontal Sync controlCRT_HSYNC13
Data from DDC monitorCRT_DDDA12
NCMonitor Sense11
GroundGND10
+5VDCVCC9
GroundGND8
GroundGND7
GroundGND6
Monitor SenseGND5
NCMonitor Sense4
Blue analog video outputCRT_BLUE3
Green analog video outputCRT_GREEN2
Red analog video outputCRT_RED1
DESCRIPTIONSIGNALPIN
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• The Fast Ethernet MAC Controller features an IEEE802.3 and IEEE802.3x compliant MAC with external LAN
physical layer chip supporting full duplex control.
• Support Wake-up On-LAN function from S3.
USB Ports
• Four industry standard USB 2.0 ports (Backward compatible to USB 1.1)
Internal termination resistor-MDO3 -/ RJ45_PJ78
Internal termination resistor-MDO3 + / RJ45_PJ77
Internal termination resistor-MDO2-/ RJ45_PJ46
Internal termination resistor-MDO2+ / RJ45_PJ45
Receive Data Tip.INPJRX-4
Receive Data RingINPJRX+3
Transmit Data TipOutPJTX-2
Transmit Data RingOutPJTX+1
DescriptionDirectionSignal NamePin
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• Support maximum transfer rate up to 480Mbits/s
• Support SD, MMC, Memory Stick, Memory Stick Duo (adapter), Memory Stick Pro.
• 3 in1 combo connector
Card Reader Port
GroundGroundGND4
Balanced Data PositiveI/ODATA+3
Balanced Data NegativeI/ODATA-2
USB Device Power (+5VDC)PowerVCC1
DescriptionDirectionSignal NamePin
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1.3.5 DISPLAY
1.3.6 READ ONLY MEMORY (SPI Serial Flash)
Fully compatible with industry standard software including Windows Vista.
Fully supports APM V1.2 and latest ACPI specification
1Mx8 (8Mbit) SPI Serial Flash BIOS
Phoenix BIOS core (EFI)
13.3” WXGA(1366x768 pixels) display size for notebook PC
LED Backlight with LED controller IC
Glare Surface
Bezel less structure
1.3.7 POWER MANAGEMENT FEATURES
Local standby mode (Individual devices such as HDD, graphics controller, LCD etc..)
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CPU Idle mode (Including ACPI modes C0, C1, C2, C3,C4 and C6)
Suspend mode (S3 & S4 ACPI modes)
Fully APM-base legacy power.
Fully ACPI V1.0b, 2.0 and 3.0, compliant.
Hibernate for Vista.
Thermal management.
1.3.8 KEYBOARD CONTROLLER
Winbond W83L951D.
1.3.9 LEDs INDIACTOR
WiFi & AC/BAT & Charger & CDROM +HDD & Cap lock & Num lock.
1.3.10 TOUCH PAD MODULE
Synaptics TM61P-391
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1.4 Electrical Characteristic
1.4.1 Power Consumption Of Suspend Mode
Suspend To RAM < 50mA
Suspend To Disk / Soft-Off /Mechanical Off < 1mA
ECO modeTarget:
4.5 hours with backlight min. w/z 6 cell battery
Battery Life
6 cellsCells No.
2250mAh (P) (S)Capacity
Li-ion typeType
Gauge IC 20Z90Battery
RemarkSpecPower
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5 years battery lifeNot chargeableRTC Battery
Target: TBDS3 Suspend Time
Idle modeTarget: TBDPower on Charge
Target:2 hrs to 90%(6 cells )Power off Charge
TBDBattery remain 20% after 30 Days w/z 100% battery capacity
(6 cell)
Power Consumption
DeltaVendor
AC 100-240VInput
65W 3 pin DCAC Adapter
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1.5 Reference Documents
0.1SILEGO SLG8SP552
2.2PCI Local Bus Specification
0.7PC2001 System Design Guide
0.93Realtek RTS5159 USB 2.0 Card Reader Controller
0.9Realtek ALC272
2.3Intel® I/O Controller Hub 9 (ICH9) Family External Design Specification (EDS) – Volume 1
2.4Cantiga Chipset External Design Specification (EDS)
2.2Penryn Processor for Montevina Platform
2.1Montevina Platform Design Guide for Penryn Processor, Cantiga Chipset and ICH9M I/O Controller Hub
RevisionDocuments
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Appendix B Function Key Definition
w/z bibi soundPower low
w/o bibi soundFn+F12Suspend
w/o bibi sound
Disable backlightFn+F11Panel on/off
Mute system master volumeFn+F10Mute on/off
Fn+F7 8 levelsBrightness up
w/o bibi sound
Could control it in DOS mode
Fn+F6 8 levelsBrightness down
W/o bibi soundFn+F5Display Change
w/o bibi soundFn+F4 Sound up
w/o bibi soundFn+F3 Sound down
TBDFn+F1 (Bluetooth)Radio on/off
w/o bibi soundFn+F1 (WLAN)Radio on/off
Function Key
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2.1.2 Left-side View
2. System View and Disassembly
n Power Connector
Card Reader
r
RJ-45 Connectorq
o
VGA Port
p
USB Port
2.1.2 Right-side View
n Super Multi Drive
o Audio output Connector
p Microphone Connector
q
USB Port
s
Express card slot
2.1 System View
o p
q
r
n
s
n
oqp
r
r
Kensington Lock
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2.2 Tools Introduction
2 mm
2 mm
Bit Size
#0
Screw Size Tooling Tor. Bit Size
1. M2.0 Auto Screwdriver 2.0-2.5 kg/cm2 #0
2. Auto screw driver for notebook assembly & disassembly.
1. Screw driver with bit size for notebook assembly & disassembly.
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2.3 System Disassembly
The section discusses at length each major component for disassembly/reassembly and show corresponding
illustrations.Use the chart below to determine the disassembly sequence for removing components from the
notebook.
NOTE: Before you start to install/replace these modules, disconnect all peripheral devices and make sure the
notebook is not turned on or connected to AC power.
Modular Components
LCD Assembly Components
NOTEBOOK
Base Unit Components
2.3.1 Battery Pack
2.3.2 ODD
2.3.3 KBD
2.3.5 DDR
2.3.6 WLAN
2.3.7 HDD
2.3.14 LCD ASSY
2.3.15 LCD Panel
2.3.4 HOUSING
2.3.8 Heatsink
2.3.9 Audio Board
2.3.10 HDD ODD Board
2.3.11 System Board
2.3.12 Bluetooth
2.3.13 Speaker
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