Page 1
S5545
Version 1.0
Copyright
Copyright © 2016 MiTAC International Corporation. All rights reserved. No part of
this manual may be reproduced or translated without prior written consent from
MiTAC International Corporation.
Trademark
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN® is a trademark of MiTAC International Corporation.
®
Intel
is a trademark of Intel® Corporation.
AMI, AMI BIOS are trademarks of AMI Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
Nuvoton
Notice
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications at
any time, without notice. In no event will MiTAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
®
is a trademark of Nuvoton Technology Corporation.
®
products including liability or
http://www.tyan.com
1
Page 2
http://www.tyan.com
2
Page 3
Contents
Before you begin… .................................................................................... 4
Chapter 1: Instruction ................................................................................ 5
1.1 Congratulations ................................................................................. 5
1.2 Hardware Specifications .................................................................... 5
1.3 Software Specifications ..................................................................... 8
Chapter 2: Board Installation ..................................................................... 9
2.1 Board Image .................................................................................... 10
2.2 Block Diagram ................................................................................. 11
2.3 Mainboard Mechanical Drawing ...................................................... 12
2.4 Board Parts, Jumpers and Connectors ........................................... 13
2.4 Installing the Processor and Heat sink ............................................ 19
2.5 Thermal Interface Material .............................................................. 23
2.6 Tips on Installing Motherboard in Chassis ...................................... 24
2.7 Installing the Memory ...................................................................... 26
2.8 Attaching Drive Cables .................................................................... 29
2.9 Installing Add-In Cards .................................................................... 30
2.10 Connecting External Devices ........................................................ 31
2.11 Installing the Power Supply ........................................................... 32
2.12 Finishing Up ................................................................................... 32
Chapter 3: BIOS Setup ............................................................................. 33
3.1 About the BIOS ................................................................................ 33
3.2 Main Menu ....................................................................................... 35
3.3 Advanced Menu ............................................................................... 36
3.4 Chipset Menu .................................................................................. 64
3.5 Security ............................................................................................ 70
3.6 Boot ................................................................................................. 74
3.7 Save & Exit ...................................................................................... 77
Chapter 4: Diagnostics ............................................................................. 79
4.1 Flash Utility ...................................................................................... 79
4.2 AMIBIOS Post Code (Aptio) ............................................................ 80
Appendix: Fan and Temp Sensors.......................................................... 87
Glossary ..................................................................................................... 89
Technical Support .................................................................................... 95
http://www.tyan.com
3
Page 4
Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
1 x S5545 Motherboard
2 x SATA Cable
1 x Rear IO Shield
1 x S5545 Quick reference guide
1 x TYAN
®
Driver’s and Utilities DVD
IMPORTANT NOTE:
Sales sample may not come with the accessory listed above.
Please contact your sales representative to help order accessory for your
evaluation.
4
http://www.tyan.com
Page 5
Chapter 1: Instruction
1.1 Congratulations
You have purchased the powerful TYAN® S5545 motherboard, based on the
®
Q170 and Nuvoton NCT6683D-T chipsets. The S5545 is designed to
Intel
support single Intel
un-buffered non-ECC UDIMM DDR4 2133MHz memory. Leveraging advance d
technology from Intel®, the S5545 is capable of offering scalable 32 and 64-bit
computing, high-bandwidth memory design, and lightning-fast PCI-E bus
implementation.
The S5545 not only empowers you in today’s demanding IT environment but also
offers a smooth path for future application upgradeability. All of these rich feature
sets provides the S5545 with the power and flexibility to meet demanding
requirements for today’s IT environments.
Remember to visit the TYAN® website at http://www.tyan.com. There you can
find all the information on all TYAN® products as well as all the supporting
documentation, FAQs, Drivers and BIOS upgrades.
1.2 Hardware Specifications
TYAN S5545 (S5545AG2NR)
Processor
Chipset PCH Intel Q170
Memory
Expansion Slots PCI-E
LAN
Storage SATA
®
6th Gen. Core i7/i5/i3 series processor, and up to 64GB of
Supported CPU Series Intel 6th Gen. Core i7/i5/i3 series
Socket Type / Q'ty LGA1151 / (1)
Thermal Design Power
(TDP) wattage
Supported DIMM Qty (4) DIMM slots
DIMM Type / Speed Unbuffered non-ECC UDIMM DDR4 2133
Capacity Up to 64GB
Memory channel 2 Channels
Memory voltage 1.2V
Port Q'ty (2) GbE ports (Intel AMT support)
Controller Intel I210 / Intel I219-LM
Connector (6) SATA
Controller Intel Q170
Speed 6.0 Gb/s
RAID RAID 0/1/10/5 (Intel RST)
Max up to 95W
(1) PCI-E Gen3 x16 slot / (1) PCI-E Gen3 x8 slot
( w/ x4 link) / (1) PCI-E Gen.3 x1 slot
5
http://www.tyan.com
Page 6
Graphic
Audio
Connector type (1) DVI-D / (2) Display port 1.2
Chipset Intel Processor Graphics(pGFX)
Chipset Realtek ALC892-GR
Feature 5.1 ch
USB
(4) USB 2.0 ports (2 at rear, 2 via cable) / (7)
USB3.0 ports (4 at rear, 2 via cable, 1 TYPE-A)
COM (1) header
Input /Output
Display port (2) Display Port 1.2
DVI (1) DVI-D connector
Audio (1) 5 holes Audio Jack+SPDIF fiber connector
RJ-45 (2) GbE ports
SATA (6) SATA-III connectors
Chipset NCT6683D-T
Fan Total (3) 4-pin headers
System
Monitoring
Temperature
Others Watchdog timer support
AMT Feature
Monitors temperature for CPU & system
environment
Support Power on/ Power off/ Restart at remote
side
Brand / ROM size 16MB
BIOS
Feature
Hardware Monitor / PXE boot support / ACPI 5.0 /
SMBIOS 3.0/PnP/Wake on LAN / ACPI sleeping
states S3,S4,S5
Physical
Dimension
Operating
System
Regulation
Form Factor Micro ATX
Board Dimension 9.6"x9.6" (243.8x243.8mm)
OS supported list Please refer to our Intel OS supported list.
FCC (DoC) Class B
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Operating
Environment
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Compliant Yes
Motherboard (1) S5545 Motherboard
Package
Contains
Manual
Installation CD (1) TYAN installation CD
(1) Web User's manual / (1) Quick Installation
Guide
TYAN S5545-HE (S5545AG2NR-HE)
Supported CPU Series Intel Xeon E3-1200 v5 series processors
Processor
Socket Type / Q'ty LGA1151 / (1)
Thermal Design Power Max up to 80W
6
http://www.tyan.com
Page 7
(TDP) wattage
Chipset PCH Intel C236
Supported DIMM Qty (4) DIMM slots
DIMM Type / Speed Unbuffered ECC UDIMM DDR4 2133
Memory
Expansion Slots PCI-E
LAN
Storage SATA
Graphic
Audio
Input /Output
System
Monitoring
BIOS
Physical
Dimension
Operating
System
Regulation
Operating Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Capacity Up to 64GB
Memory channel 2 Channels
Memory voltage 1.2V
(1) PCI-E Gen3 x16 slot / (1) PCI-E Gen3 x8 slot
( w/ x4 link) / (1) PCI-E Gen.3 x1 slot
Port Q'ty (2) GbE ports
Controller Intel I210 / Intel I219-LM
Connector (6) SATA
Controller Intel C236
Speed 6.0 Gb/s
RAID RAID 0/1/10/5 (Intel RST)
Connector type (1) DVI-D / (2) Display port 1.2
Chipset Intel Processor Graphics(pGFX)
Chipset Realtek ALC892-GR
Feature 5.1 ch
USB
COM (1) header
Display port (2) Display Port 1.2
DVI (1) DVI-D connector
Audio (1) 5 holes Audio Jack+SPDIF fiber connector
RJ-45 (2) GbE ports
SATA (6) SATA-III connectors
Chipset NCT6683D-T
Fan Total (3) 4-pin headers
Temperature
Others Watchdog timer support
Brand / ROM size 16MB
Feature
Form Factor Micro ATX
Board Dimension 9.6"x9.6" (243.8x243.8mm)
OS supported list Please refer to our Intel OS supported list.
FCC (DoC) Class B
CE (DoC) Yes
(4) USB 2.0 ports (2 at rear, 2 via cable) / (7)
USB3.0 ports (4 at rear, 2 via cable, 1 TYPE-A)
Monitors temperature for CPU & system
environment
Hardware Monitor / PXE boot support / ACPI 5.0 /
SMBIOS 3.0/PnP/Wake on LAN / ACPI sleeping
states S3,S4,S5
7
http://www.tyan.com
Page 8
Environment Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
In/Non-operating
Humidity
RoHS RoHS 6/6 Compliant Yes
Motherboard (1) S5545 Motherboard
Package
Contains
Manual
Installation CD (1) TYAN installation CD
90%, non-condensing at 35° C
(1) Web User's manual / (1) Quick Installation
Guide
1.3 Software Specifications
For OS (operation system) support, please check with TYAN® support for latest
information.
8
http://www.tyan.com
Page 9
Chapter 2: Board Installation
You are now ready to install your motherboard.
How to install our products right… the first time
The first thing you should do is reading this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:
(1) Ground yourself properly before removing your motherboard from the
antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the
board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors,
memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antist ati c
bag that the board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.
NOTE: Do not apply power to the board if it has been damaged.
http://www.tyan.com
9
Page 10
2.1 Board Image
S5545
This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.
http://www.tyan.com
10
Page 11
2.2 Block Diagram
S5545 Block Diagram
http://www.tyan.com
11
Page 12
2.3 Mainboard Mechanical Drawing
http://www.tyan.com
12
Page 13
2.4 Board Parts, Jumpers and Connectors
This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram. But
for the DIMM number please refer to the above placement for memory installation.
For the latest board revision, please visit our web site at http://www.tyan.com.
http://www.tyan.com
13
Page 14
Jumpers & Connectors
Connector/Jumper
1 RJ45 LAN Port #1 (LAN1) + USB
2.0 Ports (J42)
2 DP1 (J10) 16 SATA 3 (J39)
3 DVI-D Connector (DVI-D) 17 SATA 1 (J41)
4 DP2/USB 3.0 High Rise (J8/J13) 18 SATA 0 (J50)
5 RJ45 LAN Port #2 (LAN2) + USB
3.0 Ports (J9)
6 Audio Jack (J102) 20 SATA 2 (J47)
7 Audio Front Header (FP_AUDIO_1) 21 TPM Header (DBG_HD1)
8 Rear FAN (J17) 22 COM Header (J77)
9 USB3.0 Header (J26) 23 24-pin Power Connector (J18)
10 USB2.0 Header (FP_USB_3) 24 Front FAN (J20)
11 USB3.0 Type A (J193) 25 CPU FAN (J16)
12 Intruder (INTRD1)
13 SATA DOM Power Connector
(J83)
14 SATA 5 (J40) 28 LAN2 LED (J82)
Jumpers Slots
a Security Override (J90) A PCIE X16 Slot (PCIE_X16_SLOT1)
b Clear CMOS (J101) B PCIE X1 Slot (PCIE_X1_SLOT1)
c Recovery (J96) C PCIE X8 Slot (PCIE_X8_SLOT1)
d Speaker Header (J85) D DIMM_A0 (J8C1)
Jumper Legend
15 SATA 4 (J48)
19 FP Header (J15)
26 8-pin Power Connector
(PWRCONN1)
27 LAN1 LED (J76)
E DIMM_A1 (J8C2)
F DIMM_B0 (J8C3)
G DIMM_B1 (J8C4)
OPEN - Jumper OFF
CLOSED - Jumper ON
14
Without jumper cover
With jumper cover
http://www.tyan.com
Page 15
J77: COM Port Header
Signal Pin Pin Signal
DCD 1 2 DSR
RXD 3 4 RTS
TXD 5 6 CTS
DTR 7 8 RI
GND 9 10 KEY-Pin
J16 (CPU FAN) / J20 (Front FAN) / J17 (Rear FAN): 4-pin FAN Connector
Pin 1 2 3 4
Signal GND VCC12 TACHOMETER PWM
Use this header to connect the cooling fan to your motherboard to
keep the system stable and reliable.
J15: Front Panel Header
Signal Pin Pin Signal
VCC5 1 2 GRN BLNK HRD
SATA LED 3 4 YLW BLNK HRD
GND 5 6 PWRBTN
FP RST 7 8 GND
VCC 9 10 NA
J85: Speaker Header
Pin 1 2 3 4
Signal VCC5 FLOATING SPKR_BUZZ_IN SPKR_BUZZ
FP_AUDIO_1: Front Audio Header
http://www.tyan.com
Signal Pin Pin Signal
FP_MIC_L 1 2 AGND
FP_MIC_R 3 4 AUDIO_Detect
AUO_HPOUT_R 5 6 AUO_SENSE_MIC
FIO_SENSE 5 6 NC
AUO_HPOUT_L 7 8 AUO_SENSE_HP
15
Page 16
J83: SATA DOM Power Connector
Signal Pin Pin Signal
VCC5 1 2 GND
J76: LAN1 LED
Signal Pin Pin Signal
Power 3.3V 1 2 LED Activity
J82: LAN2 LED
Signal Pin Pin Signal
Power 3.3V 1 2 LED Activity
INTRD1: Intruder Header
Signal Pin Pin Signal
GND 1 2 INTRUDER
FP_USB_3: Front USB2.0 Header (blue)
Signal Pin Pin Signal
VCCUSB_13 1 2 VCCUSB_13
USB_PCH_DN1_R 3 4 USB_PCH_DN3_R
USB_PCH_DP1_R 5 6 USB_PCH_DP3_R
GND 7 8 GND
10 NA
SATA0 (J50) / SATA1 (J41) / SATA2 (J47) / SATA3 (J39) / SATA4 (J48) / SATA5
(J40) : SATA3 6G Connector
PIN Define Pin
1 GND
2 SATA TX DP
3 SATA TX DN
4 GND
5 SATA RX DN
6 SATA RX DP
7 GND
Connects to the Serial
ATA ready drives via
the Serial ATA cable.
NOTE: SATA5 (J40)
supports SATA DOM
Device.
16
http://www.tyan.com
Page 17
J26: USB3.0 Header
Signal Pin Pin Signal
1 VCCUSB3_FRONT
VCCUSB3_FRONT 19 2 USB30RX_4N_R
USB30RX_3N_R 18 3 USB30RX_4P_R
USB30RX_3P_R 17 4 GND
GND 16 5 USB30TX_4N_R
USB30TX_3N_R 15 6 USB30TX_4P_R
USB30TX_3P_R 14 7 GND
GND 13 8 USB_PCH DN2_R
USB_PCH_DN4_R 12 9 USB_PCH DP2_R
USB_PCH_DP4_R 11 10 USB_PCH_OC24_N_ID
DBG_HD1: TYAN Module Header
Signal Pin Pin Signal
VCC3 1 2 LPC_LFRAME_N
LAD0 3 4 KEY
LAD1 5 6 LPC_RST_N
LAD2 7 8 GND
LAD3 9 10 CLK_24M
SERIRQ 11 12 GND
PRESENT_N 13 14 3V3_VSB
GPIO1 15 16 GPIO2
J193: Vertical Type-A USB3.0 Connector
Pin Signal
1 USB_VCC_TYPE_A
2 USB_PCH_DN8_R
3 USB_PCH_DP8_R
4 GND
5 USB3_PCH_RX5N
6 USB3_PCH_RX5P
7 GND
8 USB3_PCH_TX5N
9 USB3_PCH_TX5P
17
http://www.tyan.com
Page 18
J101: Clear CMOS Jumper
3
3
3
3
3
3
1
Normal (Default)
1
Clear TRC
J90: Security Override Jumper
1
You can reset the CMOS settings by using this jumper. This can be
useful if you have forgotten your system/setup password, or need to
clear the system BIOS setting.
1. Power off system and disconnect power connectors from the
motherboard.
2. Remove the jumper from Pin_2 and Pin_3 (Default setting).
3. Move the jumper cap to close Pin_1 and Pin_2 for several seconds
to Clear CMOS.
4. Put jumper cap back to Pin_2 and Pin_3 (Default setting).
5. Reconnect power connectors to the motherboard and power on
system.
Pin 1-2 Closed: Normal (Default)
1
J96: ME Recovery Jumper
1
Pin 2-3 Closed: Security Override
Pin 1-2 Closed: Normal (Default)
1
31
Pin 2-3 Closed: Configure
Remove Cap: Recovery
http://www.tyan.com
18
Page 19
2.4 Installing the Processor and Heat sink
The S5545 supported Intel® processors are listed in section 1.2 Hardware
Specifications on page 5. Check our website at http://www.tyan.com for latest
processor support.
NOTE: MiTAC TYAN is not liable for damage as a result of operating an
unsupported configuration.
Processor Installation (SNB_H4 (LGA1151) for Intel Skylake CPU)
Follow the steps below to install the processors and heat sinks.
Please note that the illustrations are based on a SNB_H4 (LGA1151) which may not
look exactly like the motherboard you purchased. Therefore, the illustration s should
be held for your reference only.
NOTE: Please save and replace the CPU protection cap when returning for service.
1. Locate the CPU socket.
2. Pull the CPU lever slightly away from the socket and then push it to a fully
open position.
3. Open the CPU socket cover.
http://www.tyan.com
19
Page 20
4. Remove the CPU protection cap.
5. Install the processor and make sure the gold arrow is located in the right
direction with two notches properly aligned.
6. Close the CPU socket cover.
7. Press the socket lever down to lock the CPU in place.
http://www.tyan.com
20
Page 21
Heat sink Installation
After installing the processor, you should proceed to install the heat sink. The CPU
heat sink will ensure that the processor do not overheat and continue to o perate at
maximum performance for as long as you own them. The overheated processor is
dangerous to the motherboard.
For the safest method of installation and information on c hoosing the appropriate
heat sink, using heat sinks validated by Intel
®
. Please refer to the Intel® website:
http://www.intel.com
The following diagram illustrates how to install the heat sink for the SNB_H3
(LGA1150) socket.
1. Apply the thermal grease.
2. Place the heat sink on top of the CPU and push the 4 latches in a diagonal
pattern to lock it in place.
21
http://www.tyan.com
Page 22
3. Secure the heat sink screws.
4. Connect the fan cable to complete the installation.
http://www.tyan.com
22
Page 23
2.5 Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat
sink on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
NOTE: Always check with the manufacturer of the heat sink & processor to
ensure that the thermal interface material is compatible with the processor
and meets the manufacturer’s warranty requirements.
23
http://www.tyan.com
Page 24
2.6 Tips on Installing Motherboard in Chassis
Before installing your motherboard, make sure your chassis has the necessary
motherboard support studs installed. These studs are usually metal and are gold in
color. Usually, the chassis manufacturer will pre-install the support studs. If you are
unsure of stud placement, simply lay the motherboard inside the ch assis and align
the screw holes of the motherboard to the studs inside the case. If there are a ny
studs missing, you will know right away since the motherboard will not be able to be
securely installed.
Some chassis include plastic studs instead of metal. Although the plastic studs are
usable, MiTAC recommends using metal studs with screws that will fasten the
motherboard more securely in place.
Below is a chart detailing what the most common motherboard studs look like and
how they should be installed.
http://www.tyan.com
24
Page 25
http://www.tyan.com
25
Page 26
2.7 Installing the Memory
Before installing memory, ensure that the memory you have is compatible with the
motherboard and processor. Check the TYAN Web site at http://www.tyan.com for
details of the type of memory recommended for your motherboard.
Supports up to 64GB of un-buffered non-ECC UDIMM DDR4 2133MHz
memory
Supports single/dual rank memory
All installed memory will automatically be detected and no jumpers or settings
need changing
All memory must be of the same type and density
DIMM Location
http://www.tyan.com
26
Page 27
Recommended Memory Population Table
Quantity of memory
installed
DIMM_A0 √ √ √ √
DIMM_A1 √ √
DIMM_B0 √ √ √
DIMM_B1 √
NOTE:
1. √ indicates a populated DIMM slot.
2. Use paired memory installation for max performance.
3. Populate the same DIMM type in each channel, specifically
- Use the same DIMM size
- Use the same # of ranks per DIMM
4. Dual-rank DIMMs are recommended over single-rank DIMMs.
5. Un-buffered DIMM can offer slightly better performance than registered DIMM if
populating only a single DIMM per channel.
6. Always install with DIMM_A0 Slot first.
Single CPU Installed
1 2 3 4
27
http://www.tyan.com
Page 28
Memory Installation Procedure
Follow these instructions to install memory modules into the S5545.
1. Unlock the clips as shown in the illustration.
2. Insert the memory module firmly into the socket by gently pressing down until
it sits flush with the socket.
3. Lock the clips to secure the memory module into place.
http://www.tyan.com
28
Page 29
2.8 Attaching Drive Cables
Attaching Serial ATA Cables
S5545 is equipped with six (6) Serial ATA (SATA) channel. Connections for the
drives are very simple.
There is no need to set Master/Slave jumpers on SATA drives.
If you are in need of SATA/SAS cables or power adapters please contact your place
of purchase.
The following pictures illustrate how to connect an SATA drive.
1. SATA drive cable
connection
2. SATA drive power connection
3. SATA cable motherboard
connector
4. SATA drive power adapter
http://www.tyan.com
29
Page 30
2.9 Installing Add-In Cards
Before installing add-in cards, it’s helpful to know if they are fully compatible with
your motherboard. For this reason, we’ve provided the diagrams below, showing
the slots that may appear on your motherboard.
PCI-E x 16 slot
PCI-E x 8 slot
PCI-E x 1 slot
Simply find the appropriate slot for your add-in card and insert the card firmly. Do
not force any add-in cards into any slots if they do not seat in place. It is better to try
another slot or return the faulty card rather than damaging both the motherboard
and the add-in card.
TIP: It’s a good practice to install add-in cards in a staggered manner rather than
making them directly adjacent to each other. Doing so allows air to circulate within
the chassis more easily, thus improving cooling for all installed devices.
NOTE: You must always unplug the power connector to the motherboard before
performing system hardware changes to avoid damaging the board or expans ion
device.
http://www.tyan.com
30
Page 31
2.10 Connecting External Devices
Connecting external devices to the motherboard is an easy task. The motherboard
supports a number of different interfaces through connecting peripherals. See the
following diagrams for the details.
LAN1 (I210)
USB2.0 Ports
Onboard LAN LED Color Definition
The two (2) onboard Ethernet ports have green and yellow LEDs to indicat e LAN
status. The chart below illustrates the different LED states.
DP1
NOTE: Peripheral devices can be plugged straight into any of these
ports but software may be required to complete the installation.
DVI-D
USB3.0 Ports
LAN2 (I219)
DP2
USB3.0 Ports
Surround Out
CEN/LFE Out
SPDIF MIC_In
LINE_In
LINE_Out
10 Mbps
100 Mbps
1000 Mbps
No Link Off Off
10/100/1000 Mbps LAN Link/Activity LED Scheme
Left LED Right LED
Link Green Off
Active Blinking Green Off
Link Green Green
Active Blinking Green Green
Link Green Amber
Active Blinking Green Amber
31
http://www.tyan.com
Page 32
2.11 Installing the Power Supply
There are two (2) power connectors on your S5545 motherboard. The S5545
supports EPS 12V power supply.
J18: 24-pin Power Connector
Signal Pin Pin Signal
+3.3V 1 13 +3.3V
+3.3V 2 14 -12V
GND 3 15 GND
+5V 4 16 PS ON#
GND 5 17 GND
+5V 6 18 GND
GND 7 19 GND
Power OK 8 20 Reserve
+5VSB 9 21 +5
+12V 10 22 +5
+12V 11 23 +5
+3.3V 12 24 GND
PWRCONN1: ATX 8-pin Power Connector
Signal Pin Pin Signal
GND 1 5 VCC12_2
GND 2 6 VCC12_2
GND 3 7 VCC12_3
GND 4 8 VCC12_3
NOTE:
1. You must unplug the power supply before plugging the power
cables to motherboard connectors.
2. Apply 5Vsb power supply with current support below 2A.
2.12 Finishing Up
Congratulations on making it this far! You have finished setting up the hardware
aspect of your computer. Before closing up your chassis, make sure that all cables
and wires are connected properly, especially IDE cables and most importantly,
jumpers. You may have difficulty powering on your system if the motherboard
jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find help by
asking your vendor for assistance. If they are not available for assistance, please
find setup information and documentation online at our website or b y calling your
vendor’s support line.
http://www.tyan.com
32
Page 33
Chapter 3: BIOS Setup
3.1 About the BIOS
The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all
the code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.
The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are
current at the time of print and are subject to change, and therefore may not match
exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated, batterybacked memory (called NVRAM) that retains the information even when the power
is turned off.
To start the BIOS setup utility:
1. Turn on or reboot your system.
2. Press <Del> or <F2> during POST (Del on remote console) to start the BIOS
setup utility.
3.1.1 Setup Basics
The table below shows how to navigate in the setup program using the keyboard.
Key Function
Left/Right Arrow Keys Change from one menu to the next
Up/Down Arrow Keys Move between selections
Enter Open highlighted section
PgUp/PgDn Keys Change pages
+/- Change options
ESC Exit
http://www.tyan.com
33
Page 34
3.1.2 Getting Help
Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [Enter] key again.
3.1.3 In Case of Problems
If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understan d. In particular,
do not change settings in the Chipset section unless you are absolutely sure of
what you are doing. The Chipset defaults have been carefully chosen either by
MiTAC or your system manufacturer for best performance and reliability. Even a
seemingly small change to the Chipset setup options may cause the system to
become unstable or unusable.
3.1.4 Setup Variations
Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems,
the appearance of your Setup screen may differ from the charts shown in this
section. Each system design and chipset combination requires a custom
configuration. In addition, the final appearance of the Setup program depends on
the system designer. Your system designer may decide that certain items should
not be available for user configuration, and remove them from the BIOS setup
program.
NOTE: The following pages provide the details of BIOS menu. Please be noticed
that the BIOS menu are continually changing due to the BIOS updating. The BIOS
menu provided are the most updated ones when this manual is written. Please visit
TYAN’s website at http://www.tyan.com for the information of BIOS updating.
34
http://www.tyan.com
Page 35
3.2 Main Menu
In this section, you can alter general features such as the date and time.
Note that the options listed below are for options that can directly be changed within
the Main Setup screen.
BIOS Information
It displays BIOS related information.
Memory Information
This displays the total memory size.
Access Level
Read only.
System Date
Adjust the system date.
MM (Months): DD (Days): YYYY (Years)
System Time
Adjust the system clock.
HH (24 hours format): MM (Minutes): SS (Seconds)
http://www.tyan.com
35
Page 36
3.3 Advanced Menu
This section facilitates configuring advanced BIOS options for your system.
ACPI Settings
System ACPI Parameters.
WatchDog Timer Configuration
WatchDog Configuration.
AMT Configuration
Active Management Technology Configuration Parameters.
PCH-FW Configuration
Management Engine Technology Configuration Parameters.
Super IO Configuration
System Super IO Chip Parameters.
Hardware Health Configuration
Hardware health Configuration Parameters.
http://www.tyan.com
36
Page 37
S5 RTC Wake Settings
Enable system to wake from S5 using RTC alarm.
Serial Port Console Redirection
Serial Port Console Redirection.
CPU Configuration
CPU Configuration Parameters.
Intel Ready Mode Technology (only for S5545AG2NR)
Intel Ready Mode Technology Settings.
SATA Configuration
SATA Devices Configuration.
PCI Subsystem Settings
PCI, PCI-X and PCI Express Settings.
CSM Configuration
CSM configuration: Enable/Disable, Option ROM execution settings, etc.
NVMe Configuration
NVMe Device Options Settings.
USB Configuration
USB Configuration Parameters.
Onboard Device Configuration
Onboard Device Configuration.
http://www.tyan.com
37
Page 38
3.3.1 ACPI Settings
ACPI Sleep State
Select the highest ACPI sleep state the system will enter when the SUSPEND
button is pressed.
Suspend Disabled / S3 only (Suspend to RAM)
http://www.tyan.com
38
Page 39
3.3.2 Watch Dog Timer Configuration
Watch Dog Mode
Watch Dog Mode Help.
Disabled / POST / OS / PowerON
NOTE: Watch Dog Timer will not appear when Watch Dog Mode is set to
[Disabled].
Watch Dog Timer
Watch Dog Timer Help.
2 MINS / 4 MINS / 6 MINS / 8 MINS / 10 MINS
http://www.tyan.com
39
Page 40
3.3.3 AMT Configuration
Intel AMT
Enable/Disable Intel® Active Management Technology BIOS Extension. This option
just controls the BIOS extension execution. If enabled, this requires additional
firmware in the SPI device.
Disabled / Enabled
http://www.tyan.com
40
Page 41
3.3.4 PCH-FW Configuration
ME FW Version
Read only.
ME Firmware Mode
Read only.
ME Firmware Type
Read only.
ME Firmware SKU
Read only.
NFC Support
Read only.
ME Unconfig on RTC Clear State
Disabling this option will cause ME not to unconfigure on RTC clear
Enabled / Disabled
ME State
Set ME to Soft Temporary Disabled
Enabled / Disabled
41
http://www.tyan.com
Page 42
3.3.4.1 Firmware Update Configuration
Me FW Image Re-Flash
Enable or disable ME FW Image Re-Flash function.
Disabled / Enabled
http://www.tyan.com
42
Page 43
3.3.5 Super IO Configuration
Super IO Chip
Read only.
43
http://www.tyan.com
Page 44
3.3.5.1 Serial Port 1 Configuration
Serial Port
Enable or disable Serial Port (COM).
Enabled / Disabled
Device Settings
Read only.
Change Settings
Select an optimal setting for Super IO Device.
Auto / IO=3F8h; IRQ=4;
/ IO=3F8h, IRQ=3, 4, 5, 6, 7, 10, 11, 12;
/ IO=2F8h; IRQ=3, 4, 5, 6, 7, 10, 11, 12;
/ IO=3E8h, IRQ=3, 4, 5, 6, 7, 10, 11, 12;
/ IO=2E8h, IRQ=3, 4, 5, 6, 7, 10, 11, 12;
http://www.tyan.com
44
Page 45
3.3.6 Hardware Health Configuration
Auto Fan Control
Auto Fan Control.
Disabled: Fan speed full on.
Enabled: Automatic fan speed control by temperature.
Disabled / Enabled
http://www.tyan.com
45
Page 46
3.3.6.1 Sensor Data Register Monitoring
Read only.
http://www.tyan.com
46
Page 47
3.3.7 S5 RTC Wake Settings
Wake system from S5
Enable or disable System wake on alarm event. Select Fixed Time, system will
wake on the hr:min:sec specified. Select Dynamic Time, system will wake on the
current time + increase minute(s).
Disabled / Fixed Time / Dynamic Time
Wake system from S5 (when set to [Fixed time])
Wake up hour
Select 0-23. For example enter 3 for 3am and 15 for 3pm.
0
Wake up minute
Select 0-59.
0
Wake up second
Select 0-59.
0
Wake system from S5 (when set to [Dynamic time])
Wake up minute increase
Select 1-5.
1
http://www.tyan.com
47
Page 48
3.3.8 Serial Port Console Redirection
Console Redirection
Console redirection enable or disable.
Disabled / Enabled
Serial Port for Out-Of-Band Management/Windows Emergency Services (EMS)
Console Redirection
Console redirection enable or disable.
Disabled / Enabled
Console Redirection Settings
The settings specify how the host computer (which the user is using) will exchange
data. Both computers should have the same or compatible settings.
http://www.tyan.com
48
Page 49
3.3.8.1 Console Redirection Settings
Terminal Type
Emulation: ANSI: Extended ASCII char set. VT100: ASCII char set.
VT100+: Extends VT100 to support color, function keys, etc.
VT-UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes.
VT100+ / VT100 / VT-UTF8 / ANSI
Bits per Second
Select serial port transmission speed. The speed must be matched on the other
side. Long or noisy lines may require lower speeds.
38400 / 9600 / 19200 / 57600 / 115200
Data Bits
8 / 7
Parity
A parity bit can be sent with the data bits to detect some transmission errors. Even:
parity bit is 0 if the num of 1’s in the data bits is even. Odd: parity bit is 0 if the num
of 1’s in the data bits is odd. Mark: parity bit is always 1. Space: parit y bit is always
0. Mark and Space parity do not allow for error detection.
None / Even / Odd / Mark / Space
http://www.tyan.com
49
Page 50
Stop Bits
Stop bits indicate the end of a serial data packet. (A start bit indicates the
beginning). The standard setting is 1 stop bit. Communication with slow devices
may require more than 1 stop bit.
1 / 2
Flow Control
Flow Control can prevent data loss from buffer overflow. When sending data, if the
receiving buffers are full, a ‘stop’ signal can be sent to stop the data flow. Once the
buffers are empty, a ‘start’ signal can be sent to restart the flow. Hardware flow
control uses two wires to send start/stop signal.
None / Hardware RTS/CTS
VT-UTF8 Combo Key Support
Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.
Enabled / Disabled
Recorder Mode
On this mode enabled only text will be sent. This is to capture Terminal data.
Disabled / Enabled
Resolution 100x31
Enable or disable extended terminal resolution.
Disabled / Enabled
Legacy OS Redirection Resolution
On Legacy OS, the number of rows and columns supported redirection.
80x24 / 80x25
Putty KeyPad
Select FunctionKey and KeyPad on Putty.
VT100 / LINUX / XTERMR6 / SCO / ESCN / VT400
Redirection after BIOS POST
The settings specify if BootLoader is selected than Legacy console redirection is
disabled before booting to Legacy OS. Default value is Always Enable which means
Legacy Console Redirection is enabled for Legacy OS.
Always Enable / BootLoader
http://www.tyan.com
50
Page 51
3.3.8.2 Serial Port for Out-Of-Band Management/Windows Emergency
Services (EMS) Console Redirection Settings
Out-of-Band Mgmt Port
Microsoft Windows Emergency Management Services (EMS) allows for remote
management of a Windows Server OS through a serial port.
COM1 / COM2 (Pci Bus0, Dev0, Func0) (Disabled)
Terminal Type
VT-UTF8 is the preferred terminal type for out-of-band management. The next best
choice is VT100+ and then VT100. See above, in Console Redirection Settings
page, for more Help with Terminal Type/Emulation.
VT-UTF8 / VT100 / VT100+ / ANSI
Bits per Second
Select serial port transmission speed. The speed must be matched on the other
side. Long or noisy lines may require lower speeds.
115200 / 9600 / 19200 / 57600
http://www.tyan.com
51
Page 52
Flow Control
Flow Control can prevent data loss from buffer overflow. When sending data, if the
receiving buffers are full, a ‘stop’ signal can be sent to stop the data flow. Once the
buffers are empty, a ‘start’ signal can be sent to restart the flow. Hardware flow
control uses two wires to send start/stop signal.
None / Hardware RTS/CTS / Software Xon/Xoff
Data Bits / Parity / Stop Bits
Read only.
http://www.tyan.com
52
Page 53
3.3.9 CPU Configuration
CPU Configuration
Read only.
Hyper-threading
Enabled for Windows XP and Linux (OS optimized for Hyper Threading Technology)
and disabled for other OS (OS not optimized for Hyper Threading Technology).
When disabled only one thread per enabled core is enabled.
Enabled / Disabled
Active Processor Cores
Number of cores to enable in each processor package.
All / 1
Intel Virtualization Technology
When enabled, a VMM can utilize the additional hardware capabil ities provided by
Vanderpool Technology.
Enabled / Disabled
Boot Performance Mode
Select the performance state that the BIOS will set before OS handoff.
Turbo Performance / Max Non-Turbo Performance / Max Battery
http://www.tyan.com
53
Page 54
Intel (R) Speed Shift Technology
Enable/Disable Intel (R) Speed shift Technology support. Enabling will expose the
CPPCv2 interface to allow for hardware controlled P-states.
Enabled / Disabled
Intel (R) SpeedStep (tm)
Allows more than two frequency ranges to be supported.
Enabled / Disabled
Turbo Mode
Turbo Mode.
Enabled / Disabled
CPU C states
Enable or disable CPU C states.
Enabled / Disabled
Enhanced C1 State
Enhanced C1 state.
Enabled / Disabled
Package C State Limit
Select Package C State Limit.
C0/C1 / C2 / C3 / C6/ C7 / C7s / C8 / AUTO
SW Guard Extensions (SGX)
Enable/Disable Software Guard Extensions (SGX).
Disabled / Enabled / Software Controlled
http://www.tyan.com
54
Page 55
3.3.10 Intel Ready Mode Technology (only for S5545AG2NR)
Intel Ready Mode Technology
Enable/Disable Ready Mode support based on Windows A way-mode.
Only on DT/AIO
Disabled / Enabled
Intel RMT State
Intel RMT Enabling Status in BIOS.
Enabled / Disabled
HW Notification
Hardware notification enabling status.
Enabled / Disabled
http://www.tyan.com
55
Page 56
3.3.11 SATA Configuration
SATA Mode Selection
Determines how SATA controller(s) operate.
AHCI / RAID
NOTE: Software Feature Mask Configuration submenu will appear when SATA
Mode Selection is set to [RAID].
Hot Plug
Designates this port as Hot Pluggable.
Disabled / Enabled
SATA Device Type
Identify the SATA port is connected to Solid State Drive or Hard Disk Drive.
Hard Disk Drive / Solid State Drive
http://www.tyan.com
56
Page 57
3.3.11.1 Software Feature Mask Configuration
OROM UI and BANNER
If enabled, the OROM UI is shown. Otherwise, no OROM banner or information will
be displayed if all disks and RAID volumes are Normal.
Disabled / Enabled
OROM UI Delay
Select the delay time of the OROM UI Splash Screen in a normal status.
2 / 4 / 6 / 8
http://www.tyan.com
57
Page 58
3.3.12 PCI Subsystem Settings
Above 4G Decoding
Enables or Disables 64bit capable Devices to be Decoded in Above 4G Address
Space (Only if System Supports 64 bit PCI Decoding).
Disabled / Enabled
58
http://www.tyan.com
Page 59
3.3.13 CSM Configuration
CSM Support
Enable/Disable CSM Support.
Enabled / Disabled
Option ROM Messages
Set display mode for Option ROM
Force BIOS / Keep Current
INT19 Trap Response
BIOS reaction on INT19 trapping by Option ROM: IMMEDIATE – execute the trap
right away; POSTPONED – execute the trap during legacy boot.
Immediate / Postponed
Boot option filter
This option controls Legacy/UEFI ROMs priority.
UEFI and Legacy / Legacy only / UEFI only
Network
Controls the execution of UEFI and Legacy PXE OpROM.
Legacy / Do not launch / UEFI
http://www.tyan.com
59
Page 60
Storage
Controls the execution of UEFI and Legacy Storage OpROM.
Legacy / Do not launch / UEFI
Video
Controls the execution of UEFI and Legacy Video OpROM
Legacy / Do not launch / UEFI
Other PCI Devices
Determines OpROM execution policy for devices other than Network, Storage, or
Video.
Legacy / Do not launch / UEFI
http://www.tyan.com
60
Page 61
3.3.14 NVMe Configuration
Read only.
61
http://www.tyan.com
Page 62
3.3.15 USB Configuration
USB Module Version / USB Controllers / USB Devices
Read only.
Legacy USB Support
Enable USB legacy support. AUTO option disables legacy supp ort if no USB
devices are connected. DISABLE option will keep USB devices available only for
EFI applications.
Enabled / Disabled / Auto
USB transfer time-out
The time-out value for Control, Bulk and Interrupt transfers.
20 sec / 1 sec / 5 sec / 10 sec
Device reset time-out
USB mass storage device Start Unit command time-out.
20 sec / 10 sec / 30 sec / 40 sec
Device power-up delay
Maximum time the device will take before it properly reports itself to the Host
Controller. AUTO uses default value: for a Root port it is 100 ms, for a Hub port the
delay is taken from Hub descriptor.
Auto / Manual
http://www.tyan.com
62
Page 63
3.3.16 Onboard Device Configuration
NOTE: The BIOS will automatically read the onboard LAN controller.
LAN1(I210)
Enable or disable onboard LAN1 (I210).
Enabled / Disabled
LAN1 OPROM
Enable or disable onboard LAN1 OPROM.
Disabled / PXE / iSCSI
LAN2(I219)
Enable or disable onboard LAN1 (I219).
Enabled / Disabled
LAN2 OPROM
Enable or disable onboard LAN2 OPROM.
Disabled / PXE
Chassis Intrusion detect
Enabled: When a chassis open event is detected, the BIOS will display the event.
Disabled / Enabled
http://www.tyan.com
63
Page 64
3.4 Chipset Menu
North Bridge
System Agent (SA) Parameters.
South Bridge
South Bridge Parameters.
64
http://www.tyan.com
Page 65
3.4.1 North Bridge Configuration
VT-d
VT-d capability.
Enabled / Disabled
65
http://www.tyan.com
Page 66
3.4.1.1 Graphics Configuration Submenu
IGFX VBIOS Version
Read only.
Primary Display (only for S5545AG2NR)
Select which of IGFX/PEG/PCI Graphics device should be Primary Display Or
select SG for Switchable Gfx.
Auto / Disabled / Enabled
Internal Graphics
Keep IGFX enabled based on the setup options.
Auto / Disabled / Enabled
http://www.tyan.com
66
Page 67
3.4.1.2 Memory Configuration Submenu
Memory RC Version / Memory Frequency / Total Memory / VDD / DIMM_A0 /
DIMM_A1 / DIMM_B0 / DIMM_B1
Read only.
Maximum Memory Frequency
Maximum Memory Frequency selections in Mhz.
Auto / 1866 / 2133
ECC Support (only for S5545AG2NR-HE)
Enable/disable DDR ECC support.
Enabled / Disabled
http://www.tyan.com
67
Page 68
3.4.2 South Bridge Configuration
DeepSx Power Policies
Configure the DeepSx Mode configuration.
Disabled / Enabled in S4-S5
Wake on LAN
Enable or disable integrated LAN to wake the system. (The Wake on LAN cannot
be disabled if ME is on at Sx state.)
Enabled / Disabled
SLP_LAN# Low on DC Power
Enable/Disable SLP_LAN# Low on DC Power.
Enabled / Disabled
High Precision Timer
Enable or Disable the High Precision Event Timer.
Enabled / Disabled
Restore AC Power Loss
Select AC power state when power is re-applied after a power failure.
Power Off / Power On / Last State
http://www.tyan.com
68
Page 69
3.4.2.1 HD Audio Configuration Submenu
HD Audio
Control Detection of the HD-Audio device.
Disabled = HDA will be unconditionally disabled
Enabled = HDA will be unconditionally enabled
Auto = HDA will be enabled if present, disabled otherwise.
Auto / Disabled / Enabled
Audio DSP
Enable/Disable Audio DSP.
Enabled / Disabled
69
http://www.tyan.com
Page 70
3.5 Security
Administrator Password
Set administrator password in the Create New Password window. After you key in
the password, the Confirm New Password window will pop out to ask for
confirmation.
User Password
Set user password in the Create New Password window. After you key in the
password, the Confirm New Password window will pop out to ask for confirmation.
Secure Boot Menu
Customizable Secure Boot settings.
http://www.tyan.com
70
Page 71
3.5.1 Secure Boot menu
Secure Boot
Secure Boot can be enabled if 1. System running in User mode with enrolled
Platform Key (PK) 2. CSM function is disabled.
Disabled / Enabled
Secure Boot Mode
Secure Boot mode selector. “Custom” Mode enables users to change Image
Execution policy and manage Secure Boot Keys.
Custom / Standard
Key Management
Enables experienced user to modify Secure Boot variables.
http://www.tyan.com
71
Page 72
3.5.1.1 Key Management Submenu
Provision Factory Default keys
Install factory default Secure Boot keys when System is in Setup Mode.
Disabled / Enabled
Enroll All Factory Default Keys
Force System to User Mode – install all Factory Default Keys (PK, KEK, db, dbt,
dbx). Change takes effect after reboot.
Save All Secure Boot Variables
Save NVRAM content of all Secure Boot variables to the files
(EFI_SIGNATURE_LIST data format) in root folder on a target file system device.
Platform Key (PK)
Enroll Factory Defaults or load the keys from a file with:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256 (bin)
2. Authenticated UEFI Variable
Key source: Default, Custom, Mixed (*) modified from Setup menu
Set New Key / Delete Key
72
http://www.tyan.com
Page 73
Key Exchange Keys
Enroll Factory Defaults or load the keys from a file with:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256 (bin)
2. Authenticated UEFI Variable
Key source: Default, Custom, Mixed (*) modified from Setup menu
Set New Key / Append Key / Delete Key
Authorized Signatures
Enroll Factory Defaults or load the keys from a file with:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256 (bin)
2. Authenticated UEFI Variable
Key source: Default, Custom, Mixed (*) modified from Setup menu
Set New Key / Append Key / Delete Key
Forbidden Signatures
Enroll Factory Defaults or load the keys from a file with:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256 (bin)
2. Authenticated UEFI Variable
Key source: Default, Custom, Mixed (*) modified from Setup menu
Set New Key / Append Key / Delete Key
Authorized TimeStamps
Enroll Factory Defaults or load the keys from a file with:
1. Public Key Certificate in:
a) EFI_SIGNATURE_LIST
b) EFI_CERT_X509 (DER encoded)
c) EFI_CERT_RSA2048 (bin)
d) EFI_CERT_SHA256 (bin)
2. Authenticated UEFI Variable
Key source: Default, Custom, Mixed (*) modified from Setup menu
Set New Key / Append Key
http://www.tyan.com
73
Page 74
3.6 Boot
Setup Prompt Timeout
Number of seconds to wait for setup activation key. 65535 (0xFFFF) means
indefinite waiting.
1
Bootup NumLock State
Select the keyboard NumLock state.
On / Off
Quiet Boot
Enable or disable Quiet Boot option.
Disabled / Enabled
Boot Option #1 / #2
Sets the system boot order.
Device Name / Disabled
Wait for ‘ESC’ If Error
Wait for ‘ESC’ key to be pressed if error occurs.
Enabled / Disabled
http://www.tyan.com
74
Page 75
Endless Boot
Continuously searches for the Legacy PXE boot image until it is found or the
process is aborted (press Ctrl + Alt + Del).
Disabled / Enabled
http://www.tyan.com
75
Page 76
3.6.1 Delete Boot Option
Delete Boot Option
Remove an EFI boot option from the boot order.
Select one to delete / UEFI: Built-in EFI Shell
http://www.tyan.com
76
Page 77
3.7 Save & Exit
Save Changes and Exit
Exit system setup after saving the changes.
Discard Changes and Exit
Exit system setup without saving any changes.
Save Changes and Reset
Reset the system after saving the changes.
Discard Changes and Reset
Reset system setup without saving any changes.
Save Options
Read only.
Save Changes
Save changes done so far to any of the setup options.
Discard Changes
Discard changes done so far to any of the setup options.
Restore Defaults
http://www.tyan.com
77
Page 78
Restore/Load Default values for all the setup options.
Save as User Defaults
Save the changes done so far as User Defaults.
Restore User Defaults
Restore the User Defaults to all the setup options.
http://www.tyan.com
78
Page 79
Chapter 4: Diagnostics
NOTE: if you experience problems with setting up your system, always check the
following things in the following order:
Memory, Video, CPU
By checking these items, you will most likely find out what the problem might have
been when setting up your system. For more information on troubleshooting, check
the TYAN website at http://www.tyan.com.
4.1 Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash
Utilities, BIOS downloads, and information on how to properly use the Flash Utility
with your motherboard, please check the TYAN web site at http://www.tyan.com
NOTE: Please be aware that by flashing your BIOS, you agree that in the
event of a BIOS flash failure, you must contact your dealer for a replacement
BIOS. There are no exceptions. TYAN does not have a policy for replacing
BIOS chips directly with end users. In no event will TYAN be held responsible
for damages done by the end user.
http://www.tyan.com
79
Page 80
4.2 AMIBIOS Post Code (Aptio)
The POST code checkpoints are the largest set of checkpoints during the BIOS preboot process. The following table describes the type of checkpoints that may occur
during the POST portion of the BIOS:
Checkpoint Ranges
Status Code Range Description
0x01 – 0x0B SEC execution
0x0C – 0x0F SEC errors
0x10 – 0x2F PEI execution up to and including memory detection
0x30 – 0x4F PEI execution after memory detection
0x50 – 0x5F PEI errors
0x60 – 0x8F DXE execution up to BDS
0x90 – 0xCF BDS execution
0xD0 – 0xDF DXE errors
0xE0 – 0xE8 S3 Resume (PEI)
0xE9 – 0xEF S3 Resume errors (PEI)
0xF0 – 0xF8 Recovery (PEI)
0xF9 – 0xFF Recovery errors (PEI)
Standard Checkpoints
SEC Phase
Status Code Description
0x00 Not used
Progress Codes
0x01 Power on. Reset type detection (soft/hard).
0x02 AP initialization before microcode loading
0x03 North Bridge initialization before microcode loading
0x04 South Bridge initialization before microcode loading
0x05 OEM initialization before microcode loading
0x06 Microcode loading
0x07 AP initialization after microcode loading
0x08 North Bridge initialization after microcode loading
0x09 South Bridge initialization after microcode loading
0x0A OEM initialization after microcode loading
0x0B Cache initialization
80
http://www.tyan.com
Page 81
SEC Error Codes
0x0C – 0x0D Reserved for future AMI SEC error codes
0x0E Microcode not found
0x0F Microcode not found
SEC Beep Codes
None
PEI Phase
Status Code Description
Progress Codes
0x10 PEI Core is started
0x11 Pre-memory CPU initialization is started
0x12 Pre-memory CPU initialization (CPU module specific)
0x13 Pre-memory CPU initialization (CPU module specific)
0x14 Pre-memory CPU initialization (CPU module specific)
0x15 Pre-memory North Bridge initialization is started
0x16 Pre-Memory North Bridge initialization (North Bridge module specific)
0x17 Pre-memory North Bridge initialization (North Bridge module specific)
0x18 Pre-Memory North Bridge initialization (North Bridge module specific)
0x19 Pre-memory South Bridge initialization is started
0x1A Pre-Memory South Bridge initialization (South Bridge module specific)
0x1B Pre-memory South Bridge initialization (South Bridge module specific)
0x1C Pre-Memory South Bridge initialization (South Bridge module specific)
0x1D – 0x2A OEM pre-memory initialization codes
0x2B Memory initialization. Serial Presence Detect (SPD) data reading
0x2C Memory initialization. Memory presence detection
0x2D Memory initialization. Programming memory timing information
0x2E Memory initialization. Configuring memory
0x2F Memory initialization (other)
0x30 Reserved for ASL (see ASL Status Codes section below)
0x31 Memory Installed
0x32 CPU post-memory initialization is started
0x33 CPU post-memory initialization. Cache initialization
0x34 CPU post-memory initialization. Application Processor(s) (AP) initialization
0x35 CPU post-memory initialization. Boot Strap Processor (BSP) selection
0x36 CPU post-memory initialization. System Management Mode(SMM) initialization
0x37 Post-Memory North Bridge initialization is started
81
http://www.tyan.com
Page 82
Status Code Description
0x38 Post-Memory North Bridge initialization (North Bridge module specific)
0x39 Post-Memory North Bridge initialization (North Bridge module specific)
0x3A Post-Memory North Bridge initialization (North Bridge module specific)
0x3B Post-Memory South Bridge initialization is started
0x3C Post-Memory South Bridge initialization (South Bridge module specific)
0x3D Post-Memory South Bridge initialization (South Bridge module specific)
0x3E Post-Memory South Bridge initialization (South Bridge module specific)
0x3F – 0x4E OEM post memory initialization codes
0x4F DXE IPL is started
PCI Error Codes
0x50 Memory initialization error. Invalid memory type or incompatible memory speed
0x51 Memory initialization error. SPD reading has failed
0x52 Memory initialization error. Invalid memory size or memory modules do not match
0x53 Memory initialization error. No usable memory detected
0x54 Unspecified memory initialization error
0x55 Memory not installed
0x56 Invalid CPU type or speed
0x57 CPU mismatch
0x58 CPU self test failed or possible CPU cache error
0x59 CPU microcode is not found or microcode update is failed
0x5A Internal CPU error
0x5B Reset PPI is not available
0x5C – 0x5F Reserved for future AMI error codes
S3 Resume Progress Codes
0xE0 S3 Resume is started (S3 Resume PPI is called by the DXE IPL)
0xE1 S3 Boot Script execution
0xE2 Video repost
0xE3 OS S3 wake vector call
0xE4 – 0xE7 Reserved for future AMI progress codes
S3 Resume Error Codes
0xE8 S3 Resume Failed
0xE9 S3 Resume PPI not Found
0xEA S3 Resume Boot Script Error
0xEB S3 OS Wake Error
0xEC – 0xEF Reserved for future AMI error codes
82
http://www.tyan.com
Page 83
Recovery Progress Codes
0xF0 Recovery condition triggered by firmware (Auto recovery)
0xF1 Recovery condition triggered by user (Forced recovery)
0xF2 Recovery process started
0xF3 Recovery firmware image is found
0xF4 Recovery firmware image is loaded
0xF5 – 0xF7 Reserved for future AMI progress codes
Recovery Error Codes
0xF8 Recovery PPI is not available
0xF9 Recovery capsule is not found
0xFA Invalid recovery capsule
0xFB – 0xFF Reserved for future AMI error codes
PEI Beep Codes
# of Beeps Description
1 (repeatedly) Memory not installed
1 Memory was installed twice (InstallPEIMemory routine in PEI Core called twice)
2 Recovery started
3 DXEIPL was not found
3 DXE Core Firmware Volume was not found
4 Recovery failed
4 S3 Resume failed
7 Reset PPI is not available
DXE Phase
Status Code Description
0x60 DXE Core is started
0x61 NVRAM initialization
0x62 Installation of the South Bridge Runtime Services
0x63 CPU DXE initialization is started
0x64 CPU DXE initialization (CPU module specific)
0x65 CPU DXE initialization (CPU module specific)
0x66 CPU DXE initialization (CPU module specific)
0x67 CPU DXE initialization (CPU module specific)
0x68 PCI host bridge initialization
0x69 North Bridge DXE initialization is started
0x6A North Bridge DXE SMM initialization is started
0x6B North Bridge DXE initialization (North Bridge module specific)
83
http://www.tyan.com
Page 84
Status Code Description
0x6C North Bridge DXE initialization (North Bridge module specific)
0x6D North Bridge DXE initialization (North Bridge module specific)
0x6E North Bridge DXE initialization (North Bridge module specific)
0x6F North Bridge DXE initialization (North Bridge module specific)
0x70 South Bridge DXE initialization is started
0x71 South Bridge DXE SMM initialization is started
0x72 South Bridge devices initialization
0x73 South Bridge DXE initialization (South Bridge module specific)
0x74 South Bridge DXE initialization (South Bridge module specific)
0x75 South Bridge DXE initialization (South Bridge module specific)
0x76 South Bridge DXE initialization (South Bridge module specific)
0x77 South Bridge DXE initialization (South Bridge module specific)
0x78 ACPI module initialization
0x79 CSM initialization
0x7A – 0x7F Reserved for future AMI DXE codes
0x80 – 0x8F OEM DXE initialization codes
0x90 Boot Device Selection (BDS) phase is started
0x91 Driver connecting is started
0x92 PCI Bus initialization is started
0x93 PCI Bus Hot Plug Controller initialization
0x94 PCI Bus Enumeration
0x95 PCI BUS Request Resources
0x96 PCI Bus Assign Resources
0x97 Console Output devices connect
0x98 Console Input devices connect
0x99 Super IO initialization
0x9A USB initialization is started
0x9B USB Reset
0x9C USB Detect
0x9D USB Enable
0x9E -0x9F Reserved for future AMI codes
0xA0 IDE initialization is started
0xA1 IDE Reset
0xA2 IDE Detect
0xA3 IDE Enable
0xA4 SCSI initialization is started
84
http://www.tyan.com
Page 85
Status Code Description
0xA5 SCSI Reset
0xA6 SCSI Detect
0xA7 SCSI Enable
0xA8 Setup Verifying Password
0xA9 Start of Setup
0xAA Reserved for ASL (see ASL Status Codes section below)
0xAB Setup Input Wait
0xAC Reserved for ASL (see ASL Status Codes section below)
0xAD Ready To Boot event
0xAE Legacy Boot event
0xAF Exit Boot Services event
0xB0 Runtime Set Virtual Address MAP Begin
0xB1 Runtime Set Virtual Address MAP End
0xB2 Legacy Option ROM initialization
0xB3 System Reset
0xB4 USB hot plug
0xB5 PCI bus hot plug
0xB6 Clean-up of NVRAM
0xB7 Configuration Reset (reset of NVRAM settings)
0xB8 – 0xBF Reserved for future AMI codes
0xC0 – 0xCF OEM BDS initialization codes
DXE Error Codes
0xD0 CPU initialization error
0xD1 North Bridge initialization error
0xD2 South Bridge initialization error
0xD3 Some of the Architectural Protocols are not available
0xD4 PCI resource allocation error. Out of Resources
0xD5 No Space for Legacy Option ROM
0xD6 No Console Output Devices are found
0xD7 No Console Input Devices are found
0xD8 Invalid password
0xD9 Error loading Boot Option (LoadImage returned error)
0xDA Boot Option is failed (StartImage returned error)
0xDB Flash update is failed
0xDC Reset protocol is not available
85
http://www.tyan.com
Page 86
DXE Beep Codes
# of Beeps Description
1 Invalid password
4 Some of the Architectural Protocols are not available
5 No Console Output Devices are found
5 No Console Input Devices are found
6 Flash update is failed
7 Reset protocol is not available
8 Platform PCI resource requirements cannot be met
ACPI/ASL Checkpoints
Status Code Description
0x01 System is entering S1 sleep state
0x02 System is entering S2 sleep state
0x03 System is entering S3 sleep state
0x04 System is entering S4 sleep state
0x05 System is entering S5 sleep state
0x10 System is waking up from the S1 sleep state
0x20 System is waking up from the S2 sleep state
0x30 System is waking up from the S3 sleep state
0x40 System is waking up from the S4 sleep state
0xAC System has transitioned into ACPI mode. Interrupt controller is in PIC mode.
0xAA System has transitioned into ACPI mode. Interrupt controller is in APIC mode.
86
http://www.tyan.com
Page 87
Appendix: Fan and Temp Sensors
This section aims to help readers identify the locations of some specific FAN and
Temp Sensors on the motherboard. A table of BIOS Temp sensor name
explanation is also included for readers’ reference.
NOTE: The red mark indicates the sensor.
Fan and Temp Sensor Location:
1. Fan Sensor: It is located in the third pin of the fan connector, which detects
the fan speed (rpm)
2. Temp Sensor: CPU_MOS_Area, PCH_Temp, and DIMM_Area. They detect
the system temperature around.
NOTE: The system temperature is measured in a scale defined by Intel, not
in Fahrenheit or Celsius.
http://www.tyan.com
87
Page 88
BIOS Temp Sensor Name Explanation:
BIOS Temp Sensor Name Explanation
CPU_ DTS_Temp Temperature of the CPU Digital Temperature Sensor
CPU_PECI_Temp Temperature of the CPU Platform Environment Control Interface
CPU_MOS_Area Temperature of the CPU MOS Area
PCH_Temp Temperature of the PCH Area
DIMM_Area Temperature of the DIMM Area
CPU_DIMM_A0 Temperature of CPU DIMM A0 Slot
CPU_DIMM_A1 Temperature of CPU DIMM A1 Slot
CPU_DIMM_B0 Temperature of CPU DIMM B0 Slot
CPU_DIMM_B1 Temperature of CPU DIMM B1 Slot
CPU_Fan Fan Speed of CPU_Fan
Front_Fan Fan Speed of Front_Fan
Rear_Fan Fan Speed of Rear_Fan
88
http://www.tyan.com
Page 89
Glossary
ACPI (Advanced Configuration and Power Interface): a power management
specification that allows the operating system to control the amount of power
distributed to the computer’s devices. Devices not in use can be turned off, reducing
unnecessary power expenditure.
AGP (Accelerated Graphics Port): a PCI-based interface which was designed
specifically for demands of 3D graphics applications. The 32-bit AGP channel
directly links the graphics controller to the main memory. While the c hanne l runs
only at 66 MHz, it supports data transmission during both the rising and falling ends
of the clock cycle, yielding an effective speed of 133 MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive
implementation that includes the disk controller on the device itself. It allows CDROMs and tape drives to be configured as master or slave devices, just like HDDs.
ATX: the form factor designed to replace the AT form factor. It improves on the AT
design by rotating the board 90 degrees, so that the IDE connectors are closer to
the drive bays, and the CPU is closer to the power supply and cooling fan. The
keyboard, mouse, USB, serial, and parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more data
the bus, phone line, or other electrical path can carry. Greater bandwidth results in
greater speed.
BBS (BIOS Boot Specification): a feature within the BIOS that creates, prioritizes,
and maintains a list of all Initial Program Load (IPL) devices, and then stores that
list in NVRAM. IPL devices have the ability to load and execute an OS, as well as
provide the ability to return to the BIOS if the OS load process fails. At that point,
the next IPL device is called upon to attempt loading of the OS.
BIOS (Basic Input/Output System): the program that resides in the ROM chip,
which provides the basic instructions for controlling yo ur computer’s hardware. Both
the operating system and application software use BIOS routines to ensure
compatibility.
Buffer: a portion of RAM which is used to temporarily store data; usually from an
application though it is also used when printing and in most keyboard drivers. The
CPU can manipulate data in a buffer before copying it to a disk drive. While this
improves system performance (reading to or writing from a disk driv e a single time
is much faster than doing so repeatedly) there is the possibility of losing yo ur data
should the system crash. Information in a buffer is temporarily stored, not
permanently saved.
http://www.tyan.com
89
Page 90
Bus: a data pathway. The term is used especially to refer to the connection
between the processor and system memory, and between the pr ocessor a nd PCI or
ISA local buses.
Bus mastering: allows peripheral devices and IDEs to access the system memor y
without going through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an
application. Using a cache lowers data access times since t he information is stored
in SRAM instead of slower DRAM. Note that the cache is also much smaller tha n
your regular memory: a typical cache size is 512KB, while you may have as much
as 4GB of regular memory.
Closed and open jumpers: jumpers and jumper pins are active when they are “on”
or “closed”, and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the basic
startup information for the BIOS.
COM port: another name for the serial port, which is called as such because it
transmits the eight bits of a byte of data along one wire, and receives data on
another single wire (that is, the data is transmitted in serial form, one bit after
another). Parallel ports transmit the bits of a byte on eight different wires at the
same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): a technology designed to double the clock speed of the
memory. It activates output on both the rising and falling edge of the system clock
rather than on just the rising edge, potentially doubling output.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM
than SIMMs, and do not need to be installed in pairs.
DIMM bank: sometimes called DIMM socket because the physical slot and the
logical unit are the same. That is, one DIMM module fits into one DIMM socket,
which is capable of acting as a memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA channels
allow hardware devices (like soundcards or keyboards) to access the main memory
without involving the CPU. This frees up CPU resources for other tasks. As with
IRQs, it is vital that you do not double up devices on a single line. Plug-n-Play
devices will take care of this for you.
http://www.tyan.com
90
Page 91
DRAM (Dynamic RAM): widely available, very affordable form of RAM which
looses data if it is not recharged regularly (every few milliseconds). This refresh
requirement makes DRAM three to ten times slower than non-recharged RAM such
as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allo ws data to
be checked for errors during run-time. Errors can subsequently be corrected at the
same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash BIOS, it
is a ROM chip which can, unlike normal ROM, be updated. This allows you to keep
up with changes in the BIOS programs without having to buy a new chip. TYAN
®
’s
BIOS updates can be found at http://www.tyan.com
ESCD (Extended System Configuration Data): a format for storing information
about Plug-n-Play devices in the system BIOS. This information helps properly
configure the system each time it boots.
Firmware: low-level software that controls the system hardware.
Form factor: an industry term for the size, shape, power supply type, and external
connector type of the Personal Computer Board (PCB) or motherboard. The
standard form factors are the AT and ATX.
Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
HyperTransport
TM
: a high speed, low latency, scalable point-to-point link for
interconnecting ICs on boards. It can be significantly faster than a PCI bus for an
equivalent number of pins. It provides the bandwidth and flexibility critical f or today' s
networking and computing platforms while retaining the fundamental programming
model of PCI.
IC (Integrated Circuit): the formal name for the computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD interface.
It can handle drives up to 8.4 GB in size. Almost all IDEs sold now are in fact
Enhanced IDEs (EIDEs), with maximum capacity determined by the hardware
controller.
IDE INT (IDE Interrupt): Hardware interrupt signal that goes to the IDE.
91
http://www.tyan.com
Page 92
I/O (Input/Output): the connection between your computer and another piece of
hardware (mouse, keyboard, etc.)
IRQ (Interrupt Request): an electronic request that runs from a hardware device to
the CPU. The interrupt controller assigns priorities to incoming requests and
delivers them to the CPU. It is important that there is only one device hooked up to
each IRQ line; doubling up devices on IRQ lines can lock up your system. Plug-nPlay operating systems can take care of these details for you.
Latency: the amount of time that one part of a system spends waiting for another
part to catch up. This occurs most commonly when the system sends data out to a
peripheral device and has to wait for the peripheral to spread (peripherals tend to
be slower than onboard system components).
NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory that
holds its data without power. DRAM, in contrast, is volatile.
Parallel port: transmits the bits of a byte on eight different wires at the same time.
PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data pathway)
which is faster than the ISA bus. Local buses are those which operate within a
single system (as opposed to a network bus, which connects multiple systems).
PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes used
by IDE drives. These modes use the CPU for data transfer (in contrast, DMA
channels do not). PCI refers to the type of bus used by these modes to
communicate with the CPU.
PCI-to-PCI Bridge: allows you to connect multiple PCI devices onto one PCI slot.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache
because SRAM is slower than SDRAM, but usually larger. Data is cached first to
the faster primary cache, and then, when the primary cache is full, to the slower
secondary cache.
PnP (Plug-n-Play): a design standard that has become ascendant in the industry.
Plug-n-Play devices require little set-up to use. Devices and operating systems that
are not Plug-n-Play require you to reconfigure your system each time you add or
change any part of your hardware.
PXE (Preboot Execution Environment): one of four components that together
make up the Wired for Management 2.0 baseline specification. PXE was
designed to define a standard set of preboot protocol services within a client with
the goal of allowing networked-based booting to boot using industry standard
protocols.
http://www.tyan.com
92
Page 93
RAID (Redundant Array of Independent Disks): a way for the same data to be
stored in different places on many hard drives. By using this method, the data is
stored redundantly and multiple hard drives will appear as a single drive to the
operating system. RAID level 0 is known as striping, where data is striped (or
overlapped) across multiple hard drives, but offers no fault-tolerance. RAID leve l 1
is known as mirroring, which stores the data within at least two hard drives, but
does not stripe. RAID level 1 also allows for faster access time and fault-tolerance,
since either hard drive can be read at the same time. RAID level 0+1 is striping and
mirroring, providing fault-tolerance, striping, and faster access all at the same time.
RAIDIOS: RAID I/O Steering (Intel)
RAM (Random Access Memory): technically refers to a type of memory where
any byte can be accessed without touching the adjacent data and is often referred
to the system’s main memory. This memory is available to any program running o n
the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic
instructions required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep two
sets of memory addresses open simultaneously. By transferring data alternately
from one set of addresses and then the other, SDRAM cuts down on the delays
associated with non-synchronous RAM, which must close one address bank before
opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data
along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another).
SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID controller,
such as AcceleRAID 150, 200 or 250, to implement RAID on a system boardembedded SCSI bus or a set of SCSI busses. SISL: SCSI Interrupt Steering Logic
(LSI) (only on LSI SCSI boards)
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be
refreshed in order to prevent data loss. Thus, it is faster and more expensive.
SLI (Scalable Link Interface): NVIDIA SLI
together to provide scalability and increased performance. NVIDIA SLI takes
advantage of the increased
features
processing units) and NVIDIA MCPs (media and communications processors).
Depending on the application, NVIDIA SLI can deliver as much as two times the
performance of a single GPU configuration.
hardware and software innovations within NVIDIA GPUs (graphics
bandwidth of the PCI Express bus architecture, and
http://www.tyan.com
technology links two graphics cards
93
Page 94
Standby mode: in this mode, the video and hard drives shut down; all other
devices continue to operate normally.
UltraDMA-33/66/100: a fast version of the old DMA channel. UltraDMA is also
called UltraATA. Without a proper UltraDMA controller, your system cannot take
advantage of higher data transfer rates of the new UltraDMA/UltraATA hard drives.
USB (Universal Serial Bus): a versatile port. This one port type can function as a
serial, parallel, mouse, keyboard or joystick port. It is fast enough to support video
transfer, and is capable of supporting up to 127 daisy-chained peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V-SYNC: controls the vertical scanning properties of the monitor.
ZCR (Zero Channel RAID): PCI card that allows a RAID card to use the onboard
SCSI chip, thus lowering cost of RAID solution
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to insert
CPUs without damaging the sensitive CPU pins. The CPU is lightly placed in an
open ZIF socket, and a lever is pulled down. This shifts the processor over and
down, guiding it into the board and locking it into place.
http://www.tyan.com
94
Page 95
Technical Support
If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and
they should have the best idea of what hardware and software your system
contains. Hence, they should be of the most assistance for you. Furthermore, if you
purchased your system from a dealer near you, take the system to them directly to
have it serviced instead of attempting to do so yourself (which can have expensive
consequences).
If these options are not available for you then TYAN can help. Besides designing
innovative and quality products for over a decade, TYAN has continuously offered
customers service beyond their expectations. TYAN’s website (www.tyan.com)
provides easy-to-access FAQ searches and online Trouble Ticket creation as well
as Instant Chat capabilities with our Support Agents. TYAN also provides easy-toaccess resources such as in-depth Linux Online Support sections with
downloadable Linux drivers and comprehensive compatibility reports for chassis,
memory and much more. With all these convenient resources just a few keystrokes
away, users can easily find the latest software and operating system components to
keep their systems running as powerful and productive as possible. TYAN also
ranks high for its commitment to fast and friendly customer support through email.
By offering plenty of options for users, TYAN serves multiple market segments with
the industry's most competitive services to support them.
"TYAN's tech support is some of the most impressive we've seen, with great
response time and exceptional organization in general" - Anandtech.com
Help Resources:
1. See the beep codes section of this manual.
2. See the TYAN website for FAQ’s, bulletins, driver updates,
and other information: http://www.tyan.com
3. Contact your dealer for help BEFORE calling TYAN.
4. Check the TYAN user group:
alt.comp.periphs.mainboard.TYAN
Returning Merchandise for Service
During the warranty period, contact your distributor or system vendor FIRST for any
product problems. This warranty only covers normal customer use and does not
cover damages incurred during shipping or failure due to the alteration, misuse,
abuse, or improper maintenance of products.
http://www.tyan.com
95
Page 96
A
NOTE:
A receipt or copy of your invoice marked with the date of purchase is
required before any warranty service can be rendered. You may obtain
service by calling the manufacturer for a Return Merchandise Authorization
(RMA) number. The RMA number Should be prominently displayed on t he
outside of the shipping carton and the package should be mailed prepaid.
TYAN will pay to have the board shipped back to you.
Notice for the US
Compliance Information Statement (Declaration of
Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC
Rules
Operation is subject to the following conditions:
This device may not cause harmful interference, and this device must accept an y
interference received including interference that may cause undesired operation. If
this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is
encouraged to try one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Plug the equipment into an outlet on a circuit different from that of the receiver.
Consult the dealer on an experienced radio/television technician for help.
Notice for Canada
This apparatus complies with the Class B limits for radio interference as specified in
the Canadian Department of Communications Radio Interference Regul ations. (Cet
appareil est conforme aux norms de Classe B d’interference radio tel que specifie
par le Ministere Canadien des Communications dans les r eglements d’ineteference
radio.)
CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or
dispose of battery in fire. There is danger of an explosion if the battery is incorrectly
replaced. Replace only with the same or equivalent type recommended by
manufacturer. Dispose of used battery according to manufacturer instructions and
in accordance with your local regulations.
Document #: D2243-100
96
http://www.tyan.com
Loading...