Intel 6 SERIES User Manual

Intel® 6 Series Chipset

Thermal Mechanical Specifications and Design Guidelines (TMSDG)

January 2011

324647-001

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2 Thermal Mechanical Specifications and Design Guidelines

Contents

1Introduction..............................................................................................................7

1.1 Related Documents .............................................................................................8

1.2 Terminology .......................................................................................................8

2 Packaging Mechanical Specifications .........................................................................9

2.1 PCH Package for Single Processor Desktop..............................................................9

2.2 Solder Balls......................................................................................................11

2.3 Package Mechanical Requirements................................................ .. .....................12

3 Thermal Specifications ............................................................................................13

3.1 Thermal Design Power (TDP) ..............................................................................13

3.2 Thermal Specifications.......................................................................................13

3.3 Storage Specifications........................................................................................16

4 Thermal Simulation .................................................................................................17

5 Thermal Metrology ..................................................................................................19

5.1 Tcase Temperature Measurements.............. .......................... .. .. ......................... ..19

5.1.1 Heatsink Thermocouple Attach Methodology ..............................................19

5.2 Ambient Temperature and Airflow Measurement....................................................21

6 ATX Reference Thermal Solution..............................................................................23

6.1 Reference Solution ........ .. .. ................................................... .. .. .. .......................23

6.2 Environmental Reliability Requirements................................................................24

A Thermal Solution Compon ent Vendors.....................................................................25

B Mechanical Drawings for Package and Reference Thermal Solution .........................27

Thermal Mechanical Specifications and Design Guidelines 3

Figures

2-1 Package Dimensions (Top View) .................................................................................. 9

2-2 Package Dimensions (Side View) ................................................... ........................... ..10

2-3 Package (Land Side View)..........................................................................................11

5-1 Thermal Solution Decision Flow Chart..........................................................................19

5-2 Heatsink Modifications...............................................................................................20

5-3 Top View of Package.................................................................................................20

5-4 Airflow & Temperature Measurement Locations.............................................................21

6-1 Reference Thermal Solution............................ ......................... ... .. ......................... .. ..24

Tables

3-1 PCH Thermal Specifications........................................................................................13

3-2 PCH TDP Workload Running Simultaneously.................................................................14

3-3 PCH TDP Configuration..............................................................................................14

3-4 PCH Idle Power Configuration.....................................................................................15

3-5 Storage Conditions ...................................................................................................16

6-1 Reference Thermal Solution Environmental Reliability Requirements................................24

4 Thermal Mechanical Specifications and Design Guidelines

Revision History

Revision

Number

001 Initial release January 2011

Description

Revision

Date

Thermal Mechanical Specifications and Design Guidelines 5

6 Thermal Mechanical Specifications and Design Guidelines

Introduction

1 Introduction

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the the Intel® 6 Series Chipset for use in single processor systems for the desktop.

• Describe reference thermal solutions that meet the specifications of the Intel Series Chipset.

The Intel

•Intel® P67 Express Chipset

•Intel

•Intel® B65 Express Chipset

•Intel® Q67 Express Chipset

Note: Unless otherwise specified, the term “Platform Controller Hub” or “PCH” will be used to

refer to any version of the chipset for the Desktop platform. Only where required will a specific product code be used.

6 Series Chipset components supported in this document are:

H67 Express Chipset

Properly designed thermal solutions provide adequate cooling to maintain the Platform Controller Hub case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the PCH case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the PCH. Operation outside the functional limits can cause data corruption or permanent damage to the component.

The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

Thermal Mechanical Specifications and Design Guidelines 7

1.1 Related Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents.

Title Location

Intel

6 Series Chipset Datasheet www.intel.com/Assets/PDF/

Intel

6 Series Chipset Specification Update www.intel.com/Assets/PDF/

Generation Intel® Core™ Processor and LGA1155 Socket Thermal

2 Mechanical Specifications and Design Guidelines

Thermally Advantaged Chassis Design Guidelines http://www3.intel.com/cd/

Various system thermal design suggestions http://www.formfactors.org

1.2 Terminology

Item Description

BLT

CTE

FC-BGA

PCH

SMD

TDP

TIM

Bond Line Thickness. Final settled thickness of the thermal interface material after installation of the heatsink.

Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached.

Metal Defined pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it

Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and the Intel

The Solder Mask Defined pad is typically a pad in a flood plane where th e solder mask opening defines the pad size for soldering to the component.

Thermal design power. Thermal solutions shou ld be designed to dissipate this power level. TDP is not the peak power that the PCH can dissipate.

Thermal Interface Material. A conductive material used between the component and heatsink to improve thermal conduction.

Introduction

specupdate/324645.pdf

specupdate/324646.pdf http://download.intel.com/

design/processor/specupdt/

324644.pdf

channel/reseller/asmo-na/eng/ products/53211.htm

Flexible Display Interface (Intel® FDI)

§ §

8 Thermal Mechanical Specifications and Design Guidelines

Packaging Mechanical Specifications

27.000

9.525

10.574

27.000

0.440

Package CenterlineDie Centerline

2 Packaging Mechanical

Specifications

2.1 PCH Package for Single Processor Desktop

The Platform Controller Hub uses a 27 mm square flip chip ball grid array (FC-BGA) package (see Figure 2-1 through Figure 2-3). The complete package drawing can be found in Appendix B.

Figure 2-1. Package Dimensions (Top View)

Note:

1. All dimensions in mm

Thermal Mechanical Specifications and Design Guidelines 9

Figure 2-2. Package Dimensions (Side View)

Packaging Mechanical Specifications

Note: All dimensions in mm

10 Thermal Mechanical Specifications and Design Guidelines

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