Intel 6 SERIES User Manual

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Intel® 6 Series Chipset

Thermal Mechanical Specifications and Design Guidelines (TMSDG)

January 2011

324647-001

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2 Thermal Mechanical Specifications and Design Guidelines

Contents

1Introduction..............................................................................................................7

1.1 Related Documents .............................................................................................8

1.2 Terminology .......................................................................................................8

2 Packaging Mechanical Specifications .........................................................................9

2.1 PCH Package for Single Processor Desktop..............................................................9

2.2 Solder Balls......................................................................................................11

2.3 Package Mechanical Requirements................................................ .. .....................12

3 Thermal Specifications ............................................................................................13

3.1 Thermal Design Power (TDP) ..............................................................................13

3.2 Thermal Specifications.......................................................................................13

3.3 Storage Specifications........................................................................................16

4 Thermal Simulation .................................................................................................17

5 Thermal Metrology ..................................................................................................19

5.1 Tcase Temperature Measurements.............. .......................... .. .. ......................... ..19

5.1.1 Heatsink Thermocouple Attach Methodology ..............................................19

5.2 Ambient Temperature and Airflow Measurement....................................................21

6 ATX Reference Thermal Solution..............................................................................23

6.1 Reference Solution ........ .. .. ................................................... .. .. .. .......................23

6.2 Environmental Reliability Requirements................................................................24

A Thermal Solution Compon ent Vendors.....................................................................25

B Mechanical Drawings for Package and Reference Thermal Solution .........................27

Thermal Mechanical Specifications and Design Guidelines 3

Figures

2-1 Package Dimensions (Top View) .................................................................................. 9

2-2 Package Dimensions (Side View) ................................................... ........................... ..10

2-3 Package (Land Side View)..........................................................................................11

5-1 Thermal Solution Decision Flow Chart..........................................................................19

5-2 Heatsink Modifications...............................................................................................20

5-3 Top View of Package.................................................................................................20

5-4 Airflow & Temperature Measurement Locations.............................................................21

6-1 Reference Thermal Solution............................ ......................... ... .. ......................... .. ..24

Tables

3-1 PCH Thermal Specifications........................................................................................13

3-2 PCH TDP Workload Running Simultaneously.................................................................14

3-3 PCH TDP Configuration..............................................................................................14

3-4 PCH Idle Power Configuration.....................................................................................15

3-5 Storage Conditions ...................................................................................................16

6-1 Reference Thermal Solution Environmental Reliability Requirements................................24

4 Thermal Mechanical Specifications and Design Guidelines

Revision History

Revision

Number

001 Initial release January 2011

Description

Revision

Date

Thermal Mechanical Specifications and Design Guidelines 5

6 Thermal Mechanical Specifications and Design Guidelines

Introduction

1 Introduction

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the the Intel® 6 Series Chipset for use in single processor systems for the desktop.

• Describe reference thermal solutions that meet the specifications of the Intel Series Chipset.

The Intel

•Intel® P67 Express Chipset

•Intel

•Intel® B65 Express Chipset

•Intel® Q67 Express Chipset

Note: Unless otherwise specified, the term “Platform Controller Hub” or “PCH” will be used to

refer to any version of the chipset for the Desktop platform. Only where required will a specific product code be used.

6 Series Chipset components supported in this document are:

H67 Express Chipset

Properly designed thermal solutions provide adequate cooling to maintain the Platform Controller Hub case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the PCH case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the PCH. Operation outside the functional limits can cause data corruption or permanent damage to the component.

The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

Thermal Mechanical Specifications and Design Guidelines 7

1.1 Related Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents.

Title Location

Intel

6 Series Chipset Datasheet www.intel.com/Assets/PDF/

Intel

6 Series Chipset Specification Update www.intel.com/Assets/PDF/

Generation Intel® Core™ Processor and LGA1155 Socket Thermal

2 Mechanical Specifications and Design Guidelines

Thermally Advantaged Chassis Design Guidelines http://www3.intel.com/cd/

Various system thermal design suggestions http://www.formfactors.org

1.2 Terminology

Item Description

BLT

CTE

FC-BGA

PCH

SMD

TDP

TIM

Bond Line Thickness. Final settled thickness of the thermal interface material after installation of the heatsink.

Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical interface is an array of solder balls attached to the substrate opposite the die. Note that the device arrives at the customer with solder balls attached.

Metal Defined pad is one where a pad is individually etched into the PCB with a minimum width trace exiting it

Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and the Intel

The Solder Mask Defined pad is typically a pad in a flood plane where th e solder mask opening defines the pad size for soldering to the component.

Thermal design power. Thermal solutions shou ld be designed to dissipate this power level. TDP is not the peak power that the PCH can dissipate.

Thermal Interface Material. A conductive material used between the component and heatsink to improve thermal conduction.

Introduction

specupdate/324645.pdf

specupdate/324646.pdf http://download.intel.com/

design/processor/specupdt/

324644.pdf

channel/reseller/asmo-na/eng/ products/53211.htm

Flexible Display Interface (Intel® FDI)

§ §

8 Thermal Mechanical Specifications and Design Guidelines

Packaging Mechanical Specifications

27.000

9.525

10.574

27.000

0.440

Package CenterlineDie Centerline

2 Packaging Mechanical

Specifications

2.1 PCH Package for Single Processor Desktop

The Platform Controller Hub uses a 27 mm square flip chip ball grid array (FC-BGA) package (see Figure 2-1 through Figure 2-3). The complete package drawing can be found in Appendix B.

Figure 2-1. Package Dimensions (Top View)

Note:

1. All dimensions in mm

Thermal Mechanical Specifications and Design Guidelines 9

Figure 2-2. Package Dimensions (Side View)

Packaging Mechanical Specifications

Note: All dimensions in mm

10 Thermal Mechanical Specifications and Design Guidelines

Packaging Mechanical Specifications







Figure 2-3. Package (Land Side View)

Note: All dimensions in mm

2.2 Solder Balls

A total of 942 solder balls corresponding to the lands are on the bottom of the PCH package for surface mounting with the motherboard. The package solder ball has the following characteristics:

• Lead free SAC (SnAgCu) 405 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.

• Solder ball diameter 17 mil [0.4138 mm], before attaching to the package.

Thermal Mechanical Specifications and Design Guidelines 11

Packaging Mechanical Specifications

2.3 Package Mechanical Requirements

The package has a bare die that is capable of sustaining a maximum static normal load of 15 lbf (67 N).

Note: The heatsink attach solutions must not induce continuous stress to the package with

Note: These specifications apply to uniform compressive loading in a direction perpendicular

Note: These specifications are based on limited testing for design characterization. Loading

the exception of a uniform load to maintain the heatsink-to-package thermal interface.

to the die top surface.

limits are for the package only.

§ §

12 Thermal Mechanical Specifications and Design Guidelines

Thermal Specifications

3 Thermal Specifications

To ensure proper operation and reliability of the PCH, the case (or junction) temperature must be at or below the maximum value specified in Table 3-1. System and/or component level thermal solutions are required to maintain these temperature specifications. Chapter 5 provides the thermal metrology guidelines for case tempearture measurements.

3.1 Thermal Design Power (TDP)

Real applications are unlikely to cause the PCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption to reach a Thermal Design Power (TDP). TDP is the target power level to which the thermal solutions should be designed. TDP is not the maximum power that the PCH can dissipat e , see Table 3-1.

TDP condition is a set of applications when run simultaneously, would stress all its features and dissipate power equivalent to TDP in the worst leakage scenario, see

Table 3-2. The configuration of PCH TDP is in Table 3-3.

3.2 Thermal Specifications

The data in Table 3-1 is based on post-silicon power measurements for the PCH. The TDP, Idle, S3 and S5 (deep Sx) values are based on system configuration, see the notes of Table 3-1. Intel recommends designing the PCH thermal solution to the TDP for maximum flexibility and reuse. The PCH package has poor heat transfer capability into the board and has minimal thermal capability without thermal solutions. Intel requires that system designers plan for an attached heatsink when using the PCH. The reference thermal solution is described in Chapter 6.

Table 3-1. PCH Thermal Specifications (Sheet 1 of 2)

Parameter Value Notes

Tcase-max 104 °C Tcase-min 0 °C Tj,max 108 °C Tcontrol 104 °C

1. The value is based on system configuration and applications running

TDP 6.1 W

Idle 2.77 W

Idle (configuration 2)2.65 W

simultaneously, see Table 3-2 and Table 3-3.

2. The value measurement is based on a core voltage of 1.05V and Tj of Tj,max

1. The value is based on system configuration, see Table 3-4

2. The value measurement is based on a core voltage of 1.05 V and Tj of 50 °C

1. The value is based on system configuration, see Table 3-4 but disconnected one Gen 2 SATA HDD

2. The value measurement is based on a core voltage of 1.05 V and Tj of 50 °C

Thermal Mechanical Specifications and Design Guidelines 13

Table 3-1. PCH Thermal Specifications (Sheet 2 of 2)

Parameter Value Notes

Idle (configuration

S3 0.128 W The value measurement is based on Tj of 35°C S5/ deep Sx <0.009 W The value measurement is based on Tj of 35°C

2.41 W

1. The value is based on system configuration, see Table 3-4 one Gen 2 SATA HDD and disabled integrated graphic and then installed an external graphic card.

2. The value measurement is based on a core voltage of 1.05 V and Tj of 50 °C

Table 3-2. PCH TDP Workload Running Simultaneously

TDP Workload Description (Applications running concurrently)

Windows* 7 system back up (Video, Pictire, Music, etc...) to USB HDD Printer emulation (print ASCII test file to USB thumbdrive) NetBlast over LAN to emulate heavy web traffic (Local network, system 1) Media download from digital camera Large file copy from HDD to USB thumbdrive NetBlast over WLAN to emulate heavy web traffic (Local network, system 2) 1080P HD Video Recording over PCIE NetBlast over PCI-LAN card to emulate heavy web traffic (Local network, system 3) Large file copy from USB thumbdrive to USB HDD Web Camera 1600 x 1200 @ 30 fps active (running Skype)

Thermal Specifications

but disconnected

Table 3-3. PCH TDP Configuration (Sheet 1 of 2)

PCH Interfaces Connected and Active Notes

USB Port 0 Flash Drive High-speed USB Port 1 External USB HDD High-speed USB Port 2 Digital Camera High-speed USB Port 3 Media Card Reader High-speed USB Port 4 USB Keyboard Low-speed USB Port 5 USB Mouse Low-speed USB Port 6 MP3 Player High-speed USB Port 7 Gaming Controller Low-speed USB Port 10 WebCam (640x480) High-speed USB Port 13 Printer High-speed SATA Port 0 HDD Non-Raid OS Gen 3 SATA Port 1 HDD Raid Array Gen 3 SATA Port 2 HDD Raid Array Gen 2 SATA Port 3 HDD Raid Array Gen 2 SATA Port 4 DVD/CD RW ODD Gen 1 SATA Port 5 BD ODD Gen 1 PCIE Port 1 Lewisville Gbe PCIE Port 3 HDMI* HDTV Recorder PCIE Port 5 USB3 Dongle PCIE Port 6 WiFi (Mini PCIE) Display Link 1 DP 1920 x 1200, 60 Hz, 24bpp

14 Thermal Mechanical Specifications and Design Guidelines

Thermal Specifications

Table 3-3. PCH TDP Configuration (Sheet 2 of 2)

PCH Interfaces Connected and Active Notes

Display Link 2 VGA 1920 x 1200, 60 Hz, 24bpp Platform Audio Jacks Headphone/Microphone Combination FDI x 2 x2 for each 1920x1200, 60 Hz, 24bpp DMI x 4 Active LPC I/F Active PCI 1394 Controller Active

Table 3-4. PCH Idle Power Configuration

PCH Interfaces Link Utilization Notes

High Definition Audio Idle External Codec USB Port 1 EHCI1 (Idle, ports in suspend) Low-speed Keyboard USB Port 2 Low-speed Mouse SATA Port 2 Windows 7 system Idle, LPM disabled Gen 2 HDD SATA Port 3 Windows 7 system Idle, LPM disabled Gen 2 HDD SATA Port 5 Windows 7 system Idle, LPM disabled Gen 1 ODD PCIE Port 1 100% L1 x 1 device Lewisville Gbe PCIE Port 2 100% L1 x 1 device (IEEE-1394b Controller) Display Link 1 Active VGA 1920 x 1200, 60 Hz, 24bpp FDI x 2 1920x1200, 60 Hz, 24bpp

Thermal Mechanical Specifications and Design Guidelines 15

3.3 Storage Specifications

Table 3-5 includes a list of the specifications for device storage in terms of maximum

and minimum temperatures and relative humidity. These conditions should not be exceeded in storage or transportation.

Table 3-5. Storage Conditions

Parameter Description Min Max Notes

The non-operating device storage temperature.

ABSOLUTE STORAGE

SUSTAINED STORAGE

TIME

SUSTAINED STORAGE

Note:

1. Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by applicable JEDEC standard. Non-adherence may affect component reliability.

3. T

ABSOLUTE STORAGE

moisture barrier bags or desiccant.

4. Intel

5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture

6. Nominal temperature and humidity conditions and durations are given and tested within the constraints

branded board products are certified to me et th e fol lowing temperat ure and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C & Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel

sensitive devices removed from the moisture barrier bag. imposed by Tsustained and customer shelf life in applicable Intel

Damage (latent or otherwise) may occur when subjected to for any length of time.

The ambient storage temperature limit (in shipping media) for a sustained period of time.

The maximum device storage relative humidity for a sustained period of time.

A prolonged or extended period of time; typically associated with customer shelf life.

applies to the unassembled component only and does not apply to the shipping media,

branded boards.

Months6 Months

box and bags.

Thermal Specifications

-55 °C 125 °C 1, 2, 3

-5 °C 40 °C 4, 5

60% @ 24 °C 5, 6

§ §

16 Thermal Mechanical Specifications and Design Guidelines

Thermal Simulation

4 Thermal Simulation

Intel provides thermal simulation models of the PCH and associated users’ guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. and Icepak* by Fluent. Contact your Intel field sales representative to order the thermal models and users’ guides.

§ §

Thermal Mechanical Specifications and Design Guidelines 17

Thermal Simulation

18 Thermal Mechanical Specifications and Design Guidelines

Thermal Metrology

Start

End

Attach

thermocouple.

Setup the system

in the desired

configuration

Revise

Heatsink or

Boundary

Conditions

Run representative

workload for the

configuration and

monitor the device

temperature

Temperature >

Specification?

Attach the

device to the

board using

normal reflow

process

Yes

Start

End

Attach

thermocouple.

Setup the system

in the desired

configuration

Revise

Heatsink or

Boundary

Conditions

Run representative

workload for the

configuration and

monitor the device

temperature

Temperature >

Specification?

Attach the

device to the

board using

normal reflow

process

Yes

5 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PCH case and junction temperatures. The flowchart in

Figure 5-1 offers useful guidelines for thermal performance and evaluation.

Figure 5-1. Thermal Solution Decision Flow Chart

5.1 Tcase Temperature Measurements

To ensure functionality and reliability, the T between the maximum/minimum operating range of the temperature specification as noted in Table 3-1. The surface temperature at the geometric center of the die corresponds to T

. Measuring T

case

requires special care to ensure an accurate

case

temperature measurement. T emperature differences between the surface and the surrounding local ambient air can

introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, and/ or contact between the thermocouple cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the following thermocouple attach approach is recommended.

5.1.1 Heatsink Thermocouple Attach Methodology

1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of the heatsink base.

2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).

3. Attach thermal interface material (TIM) to the bottom of the heatsink base.

of the PCH must be maintained at or

case

Thermal Mechanical Specifications and Design Guidelines 19

4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The

Cement + Thermocouple Bead

Die

Thermocouple

Wire

Substrate

cutouts should match the slot and hole milled into the heatsink base.

5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, ensure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 5-3).

6. Attach heatsink assembly to the package and route thermocouple wires out through the milled slot.

Figure 5-2. Heatsink Modifications

Thermal Metrology

Note: Not to Scale

Figure 5-3. Top View of Package

20 Thermal Mechanical Specifications and Design Guidelines

Thermal Metrology

5.2 Ambient Temperature and Airflow Measurement

Figure 5-4 describes the recommended location for air temperature measurements

measured relative to the component. For a more accur ate measurement of the av erage approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented.

Airflow velocity should be measured using industry standard air velocity sensors.T ypical airflow sensor technology may include hot wire anemometers.

Figure 5-4 provides guidance for airflow velocity measurement locations. These

locations are for a typical JEDEC test setup and may not be compatible with all chassis layouts due to the proximity of the PCI and PCI Express* add-in cards to the component. The user may have to adjust the locations for a specific chassis. Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result. Measurements should be taken with the chassis fully sealed in its operational configuration to achieve a representative airflow profile within the chassis.

Figure 5-4. Airflow & Temperature Measurement Locations

§ §

Thermal Mechanical Specifications and Design Guidelines 21

Thermal Metrology

22 Thermal Mechanical Specifications and Design Guidelines

ATX Reference Thermal Solution

6 ATX Reference Thermal

Solution

Note: The reference thermal mechanical solution information shown in this document

represents the current state of the design. The data is subject to modification and represents design targets, not commitments by Intel.

The design strategy for the PCH thermal solution is to reuse the z-clip heatsink originally designed for the I/O Controller Hub 6 (ICH6) Family and used on subsequent ICH designs through ICH10 and also for Intel® 5 Series Chipset design.

This section describes the overall requirements for the A TX heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions depending on your specific system local-ambient operating conditions.

6.1 Reference Solution

The reference solution is an extruded aluminum heatsink with pre-applied phase change thermal interface material (TIM). The TIM is a Chomerics T710. The reference solution is provided as an assembly with the clip, TIM and extrusion. See Appendix B for the complete set of mechanical drawings including the motherboard keep-out zone.

The reference design z-clip centers the load on the die and by design will keep the heatsink flush and parallel with the top surface of the die. The TIM size in the reference design is larger than the die area. The resistivity of the TIM is 5 x 10^16 Ohm-cm. Any TIM material that comes in contact with die side capacitors (DSC) will not cause a short.

During the heatsink assembly process the heatsink may come in contact with DSC. The maximum spring force allowed for the reference design z-clip has not been shown to cause damage to DSC during assembly.

Thermal Mechanical Specifications and Design Guidelines 23

Figure 6-1. Reference Thermal Solution

ATX Reference Thermal Solution

6.2 Environmental Reliability Requirements

The reference solution heatsink will be evaluated to the reliability requirements in

Table 6-1. The mechanical loading of the component may vary depending on the

heatsink, and attach method used. The customer should define a validation test suite based on the anticipated use conditions and resulting reliability requirements. Thermal cycling, bake and humidity tests were performed on original design and are not being repeated. The designer should select appropriate thermal / humidity tests for the expected use conditions.

Table 6-1. Reference Thermal Solution Environmental Reliability Requirements

Test Requirement Pass / Fail Criteria

3 drops for + and - directions in each of 3 perpendicular

Mechanical Shock

Random Vibration

axes (that is, total 18 drops). Profile: 50 G trapezoidal waveform, 170 inches/sec.

minimum velocity change. Setup: Mount sample board on test fixture

Duration: 10 min/axis, 3 axes Frequency Range: 5 Hz to 500 Hz Power Spectral Density (PSD) Profile: 3.13 g RMS

§ §

Visual\Electrical Check

24 Thermal Mechanical Specifications and Design Guidelines

Thermal Solution Component Vendors

A Thermal Solution Component

Vendors

Note: These vendors and devices are listed by Intel as a convenience to Intel's general

customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.

Table A-1. Reference Heatsink Enabled Components

Item Intel PN AVC CCI Foxconn Wieson

Heatsink Assembly

Anchor A13494-008 HB9703E-DW G2100C888-064H

Table A-2. Supplier Contact Information

C46655-001 S702C00001 00C855802B 2Z802-009

Supplier Contact Phone

AVC (Asia Vital Corporation)

CCI(Chaun Choung Technology

Foxconn

Wieson

Kai Chang

Monica Chih Harry Lin

Jack Chen Wanchi Chen

Chary Lee Henry Liu

+86 755 3366 8888 x63588

+886-2-2995-2666 (714) 739-5797

(408) 919-6121 (408) 919-6135

+886-2-2647-1896 ext. 6684 +886-2-2647-1896 ext.6330

kai_chang@avc.com.tw

monica_chih@ccic.com.tw hlinack@aol.com

jack.chen@foxconn.com wanchi.chen@foxconn.com

chary@wieson.com henry@wieson.com

§ §

Thermal Mechanical Specifications and Design Guidelines 25

Thermal Solution Component Vendors

26 Thermal Mechanical Specifications and Design Guidelines

Mechanical Drawings for Package and Reference Thermal Solution

B Mechanical Drawings for

Package and Reference Thermal Solution

The following mechanical drawings are included in this appendix:

Figure B-1, “Desktop Platform Controller Hub Package Drawing” on page 28 Figure B-2, “Motherboard Keep-Out for ATX Reference Heatsink” on page 29 Figure B-3, “ATX Reference Heatsink Assembly” on page 30 Figure B-4, “ATX Reference Heatsink Extrusion” on page 31 Figure B-5, “ATX Reference Heatsink Clip” on page 32

Thermal Mechanical Specifications and Design Guidelines 27

Mechanical Drawings for Package and Reference Thermal Solution

Figure B-1. Desktop Platform Controller Hub Package Drawing

28 Thermal Mechanical Specifications and Design Guidelines

Mechanical Drawings for Package and Reference Thermal Solution

5678

123

5678

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

SHEET 1 OF 1DO NOT SCALE DRAWINGSCALE: 1

1.0C45961 D

REVDRAWING NUMBERCAGE CODESIZE

ICH 6 KEEPOUT DRAWING

TITLE

2200 MISSION COLLEGE BLVD.

P.O. BOX 58119

SANTA CLARA, CA 95052-8119

CORP.

TMD

DEPARTMENT

FINISH:NAMATERIAL:

06/02/03D.CARTER

DATEAPPROVED BY

06/02/03F.ANDERS

DATECHECKED BY

06/01/03P. JOHNSON

DATECHECKED BY

5/30/03S.LOFLAND

DATEDESIGNED BY

UNLESS OTHERWISE SPECIFIED:

DIMENSIONS ARE IN MILLIMETERS.

INTERPRET DIMENSIONS AND TOLERANCES

PER ANSI Y14.5M-1994

THIRD ANGLE PROJECTION

REVISION HISTORY

ZONE REV DESCRIPTION DATE APPROVED

*** 0.5 PRELIMINARY RELEASE 06/02/03 PJ

1.0 CHANGED REV FROM 0.5 TO 1.0 09/28/04 D.CARTER

C45961 1 1.0

DWG. NO SHT. REV

2X 22.39

.882[]

2X 5.08

.200[]

2X 4.19

.165[]

2X 8.76

.345[]

2X 2.11

.083[]

2X 1.85

.073[]

1.299[]

2X 27.43

1.080[]

2X 18.29

.720[]

4X PLATED THRU HOLE0.97 .038[]

2X 5

.197[]

1.5 [ .059]

MAX COMPONENT HEIGHT

(NON-ICH COMPONENTS)

3.25 [ .125]

MAX COMPONENT HEIGHT

NO COMPONENTS THIS AREA

4X 1.42[.056] TRACE KEEPOUT

DETAIL A

DO NOT SCALE

SEE DETAIL A

COMPONENT CENTER

NOTES:

1 . HOLE PLACEMENT FABERICATION

TOLERANCE PER INTEL 454979, CLASS 1,2,3.

Figure B-2. Motherboard Keep-Out for ATX Reference Heatsink

Thermal Mechanical Specifications and Design Guidelines 29

Mechanical Drawings for Package and Reference Thermal Solution

Figure B-3. ATX Reference Heatsink Assembly

30 Thermal Mechanical Specifications and Design Guidelines

Mechanical Drawings for Package and Reference Thermal Solution

Figure B-4. ATX Reference Heatsink Extrusion

Thermal Mechanical Specifications and Design Guidelines 31

Mechanical Drawings for Package and Reference Thermal Solution

Figure B-5. ATX Reference Heatsink Clip

§ §

32 Thermal Mechanical Specifications and Design Guidelines

Intel 6 SERIES User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Intel® 6 Series Chipset

Revision History

1 Introduction

1.1 Related Documents

1.2 Terminology

Packaging Mechanical Specifications

2.1 PCH Package for Single Processor Desktop

2.2 Solder Balls

2.3 Package Mechanical Requirements

3 Thermal Specifications

3.1 Thermal Design Power (TDP)

3.2 Thermal Specifications

3.3 Storage Specifications

4 Thermal Simulation

5 Thermal Metrology

5.1 Tcase Temperature Measurements

5.1.1 Heatsink Thermocouple Attach Methodology

5.2 Ambient Temperature and Airflow Measurement

ATX Reference Thermal Solution

6.1 Reference Solution

6.2 Environmental Reliability Requirements