Intel 6700PXH User Manual

619.47 Kb
Loading...

R

Intel® 6700PXH 64-bit PCI Hub

Thermal/Mechanical Design Guidelines

August 2004

Document Number: 302817-003

R

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel may make changes to specifications, product descriptions, and plans at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® 6700PXH 64-bit PCI Hub chipset component may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com.

Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.

Copyright © 2004, Intel Corporation. All rights reserved.

* Other brands and names may be claimed as the property of others.

2

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

R

Contents

1

Introduction

.....................................................................................................................

7

 

1.1

Definition of Terms...............................................................................................

7

 

1.2

Reference .........................................................................................Documents

8

2

Packaging Technology...................................................................................................

9

 

2.1

Package ...................................................................Mechanical Requirements

10

3

Thermal Specifications.................................................................................................

11

 

3.1

Thermal ............................................................................Design Power (TDP)

11

 

3.2

Die Case ................................................................Temperature Specifications

11

4

Thermal Simulation ......................................................................................................

13

5

Thermal Metrology........................................................................................................

15

 

5.1

Die Case ...............................................................Temperature Measurements

15

 

 

5.1.1 ................................................Zero Degree Angle Attach Methodology

15

6

Reference Thermal ........................................................................................Solution

17

 

6.1

Operating ......................................................................................Environment

17

 

6.2

Heatsink ........................................................................................Performance

17

 

6.3

Mechanical .............................................................................Design Envelope

18

 

6.4

Board .................................................-Level Components Keepout Dimensions

18

 

6.5

Torsional ..........................................Clip Heatsink Thermal Solution Assembly

18

 

 

6.5.1 ..............................................................................

Heatsink Orientation

20

 

 

6.5.2 ....................................................................

Extruded Heatsink Profiles

20

 

 

6.5.3 ................................................................

Mechanical Interface Material

20

 

 

6.5.4 .....................................................................

Thermal Interface Material

21

 

 

6.5.5 .........................................................................................

Heatsink Clip

21

 

 

6.5.6 ..........................................................................

Clip Retention Anchors

22

 

6.6

Reliability ..........................................................................................Guidelines

22

A

Thermal Solution .....................................................................Component Suppliers

23

 

A.1

Torsional ...........................................................Clip Heatsink Thermal Solution

23

B

Mechanical Drawings ...................................................................................................

25

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

3

 

R

Figures

 

2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View) .............................

9

2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View).............................

9

2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) ......................

10

5-1. Zero Degree Angle Attach Heatsink Modifications ...................................................

16

5-2. Zero Degree Angle Attach Methodology (Top View) ................................................

16

6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity ....

17

6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub

Chipset Component ...........................................................................................

18

6-3. Torsional Clip Heatsink Board Component Keepout ................................................

19

6-4. Retention Mechanism Component Keepout Zones ..................................................

19

6-5. Torsional Clip Heatsink Assembly............................................................................

20

6-6 Heatsink Rails to PXH Package Footprint.................................................................

20

6-7. Torsional Clip Heatsink Extrusion Profile .................................................................

21

B-1. Torsional Clip Heatsink Assembly Drawing .............................................................

26

B-2. Torsional Clip Heatsink Drawing..............................................................................

27

B-3.Torsional Clip Drawing .............................................................................................

28

Tables

 

3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications ...........................................

11

6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure.....................

21

6-2. Reliability Guidelines ...............................................................................................

22

B-1. Mechanical Drawing List..........................................................................................

25

4

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

R

Revision History

Revision

Description

Date

Number

 

 

 

 

 

-001

Initial release

Jul 2004

 

 

 

-002

Added “reference thermal solution rails to PXH package” footprint drawing in

Aug 2004

 

Section 6.5

 

 

 

 

-003

Removed inaccurate text in three graphics

Sep 2004

 

 

 

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

5

Introduction

R

6

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

R

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

Outline the thermal and Mechanical operating limits and specifications for the Intel® 6700PXH 64-bit PCI Hub component.

Describe a reference thermal solution that meets the specification of Intel® 6700PXH 64-bit PCI Hub component.

Properly designed thermal solution provides adequate cooling to maintain the PXH component die temperatures at or below thermal specifications. This is accomplished by providing a low localambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the PXH component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel® 6700PXH 64-bit PCI Hub components only. For thermal design information on other chipset components, refer to the respective component datasheet.

Unless otherwise specified, the term “PXH” refers to the Intel® 6700PXH 64-bit PCI Hub.

1.1Definition of Terms

BGA

Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is

 

 

mounted, bonded and encapsulated in molding compound. The primary electrical

 

 

interface is an array of solder balls attached to the substrate opposite the die and molding

 

compound.

 

BLT

Bond line thickness. Final settled thickness of the thermal interface material after

 

 

installation of heatsink.

 

MCH

Memory controller hub. The chipset component that contains the processor interface, the

 

memory interface, and the hub interface.

 

PXH

Intel® 6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging

 

 

functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus

 

 

interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or

 

 

PCI-X mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices.

 

 

 

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

7

Introduction

Tcase_max

Tcase_min

TDP

R

Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.2Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Datasheet

Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide

Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide

Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet

Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

Intel® 6300ESB I/O Controller Hub Datasheet

Intel® 6300ESB I/O Controller Hub (ICH) Specification Update

BGA/OLGA Assembly Development Guide

Various system thermal design suggestions (http://www.formfactors.org)

Note: Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.

8

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

See Note 1

R

2 Packaging Technology

The Intel® 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package (see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure 2-3Figure 2-3).

Figure 2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)

Handling

 

 

Die

 

 

0.491 in.

Keepout

 

Exclusion

 

 

 

Area

 

Area

0.291 in.

 

 

 

 

 

 

 

 

 

0.547 in. 0.247 in.

 

PXH

17.00 mm 21.00 mm

31.00 mm

 

Die

0.200 in.

 

 

 

17.00 mm

21.00 mm

31.00 mm

Figure 2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)

Substrate

0.84 ± 0.05 mm

 

 

 

 

 

 

 

2.445 ± 0.102 mm

Decoup

Die

 

 

2.010 ± 0.099 mm

Cap

0.7 mm Max

0.20 See note 4.

 

 

 

 

 

 

 

 

0.20 –C–

Seating Plane

0.435 ± 0.025 mm See Note 3

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach). 2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

9

+ 19 hidden pages