Intel 6700PXH User Manual

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Intel® 6700PXH 64-bit PCI Hub

Thermal/Mechanical Design Guidelines

August 2004

Document Number: 302817-003

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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel may make changes to specifications, product descriptions, and plans at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® 6700PXH 64-bit PCI Hub chipset component may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com.

Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.

Copyright © 2004, Intel Corporation. All rights reserved.

* Other brands and names may be claimed as the property of others.

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Contents

1

Introduction

.....................................................................................................................

7

 

1.1

Definition of Terms...............................................................................................

7

 

1.2

Reference .........................................................................................Documents

8

2

Packaging Technology...................................................................................................

9

 

2.1

Package ...................................................................Mechanical Requirements

10

3

Thermal Specifications.................................................................................................

11

 

3.1

Thermal ............................................................................Design Power (TDP)

11

 

3.2

Die Case ................................................................Temperature Specifications

11

4

Thermal Simulation ......................................................................................................

13

5

Thermal Metrology........................................................................................................

15

 

5.1

Die Case ...............................................................Temperature Measurements

15

 

 

5.1.1 ................................................Zero Degree Angle Attach Methodology

15

6

Reference Thermal ........................................................................................Solution

17

 

6.1

Operating ......................................................................................Environment

17

 

6.2

Heatsink ........................................................................................Performance

17

 

6.3

Mechanical .............................................................................Design Envelope

18

 

6.4

Board .................................................-Level Components Keepout Dimensions

18

 

6.5

Torsional ..........................................Clip Heatsink Thermal Solution Assembly

18

 

 

6.5.1 ..............................................................................

Heatsink Orientation

20

 

 

6.5.2 ....................................................................

Extruded Heatsink Profiles

20

 

 

6.5.3 ................................................................

Mechanical Interface Material

20

 

 

6.5.4 .....................................................................

Thermal Interface Material

21

 

 

6.5.5 .........................................................................................

Heatsink Clip

21

 

 

6.5.6 ..........................................................................

Clip Retention Anchors

22

 

6.6

Reliability ..........................................................................................Guidelines

22

A

Thermal Solution .....................................................................Component Suppliers

23

 

A.1

Torsional ...........................................................Clip Heatsink Thermal Solution

23

B

Mechanical Drawings ...................................................................................................

25

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

3

 

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Figures

 

2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View) .............................

9

2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View).............................

9

2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) ......................

10

5-1. Zero Degree Angle Attach Heatsink Modifications ...................................................

16

5-2. Zero Degree Angle Attach Methodology (Top View) ................................................

16

6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity ....

17

6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub

Chipset Component ...........................................................................................

18

6-3. Torsional Clip Heatsink Board Component Keepout ................................................

19

6-4. Retention Mechanism Component Keepout Zones ..................................................

19

6-5. Torsional Clip Heatsink Assembly............................................................................

20

6-6 Heatsink Rails to PXH Package Footprint.................................................................

20

6-7. Torsional Clip Heatsink Extrusion Profile .................................................................

21

B-1. Torsional Clip Heatsink Assembly Drawing .............................................................

26

B-2. Torsional Clip Heatsink Drawing..............................................................................

27

B-3.Torsional Clip Drawing .............................................................................................

28

Tables

 

3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications ...........................................

11

6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure.....................

21

6-2. Reliability Guidelines ...............................................................................................

22

B-1. Mechanical Drawing List..........................................................................................

25

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Revision History

Revision

Description

Date

Number

 

 

 

 

 

-001

Initial release

Jul 2004

 

 

 

-002

Added “reference thermal solution rails to PXH package” footprint drawing in

Aug 2004

 

Section 6.5

 

 

 

 

-003

Removed inaccurate text in three graphics

Sep 2004

 

 

 

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

5

Introduction

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1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

Outline the thermal and Mechanical operating limits and specifications for the Intel® 6700PXH 64-bit PCI Hub component.

Describe a reference thermal solution that meets the specification of Intel® 6700PXH 64-bit PCI Hub component.

Properly designed thermal solution provides adequate cooling to maintain the PXH component die temperatures at or below thermal specifications. This is accomplished by providing a low localambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the PXH component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel® 6700PXH 64-bit PCI Hub components only. For thermal design information on other chipset components, refer to the respective component datasheet.

Unless otherwise specified, the term “PXH” refers to the Intel® 6700PXH 64-bit PCI Hub.

1.1Definition of Terms

BGA

Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is

 

 

mounted, bonded and encapsulated in molding compound. The primary electrical

 

 

interface is an array of solder balls attached to the substrate opposite the die and molding

 

compound.

 

BLT

Bond line thickness. Final settled thickness of the thermal interface material after

 

 

installation of heatsink.

 

MCH

Memory controller hub. The chipset component that contains the processor interface, the

 

memory interface, and the hub interface.

 

PXH

Intel® 6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging

 

 

functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus

 

 

interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or

 

 

PCI-X mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices.

 

 

 

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Introduction

Tcase_max

Tcase_min

TDP

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Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.2Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Datasheet

Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide

Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide

Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet

Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

Intel® 6300ESB I/O Controller Hub Datasheet

Intel® 6300ESB I/O Controller Hub (ICH) Specification Update

BGA/OLGA Assembly Development Guide

Various system thermal design suggestions (http://www.formfactors.org)

Note: Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.

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Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

See Note 1

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2 Packaging Technology

The Intel® 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package (see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure 2-3Figure 2-3).

Figure 2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)

Handling

 

 

Die

 

 

0.491 in.

Keepout

 

Exclusion

 

 

 

Area

 

Area

0.291 in.

 

 

 

 

 

 

 

 

 

0.547 in. 0.247 in.

 

PXH

17.00 mm 21.00 mm

31.00 mm

 

Die

0.200 in.

 

 

 

17.00 mm

21.00 mm

31.00 mm

Figure 2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)

Substrate

0.84 ± 0.05 mm

 

 

 

 

 

 

 

2.445 ± 0.102 mm

Decoup

Die

 

 

2.010 ± 0.099 mm

Cap

0.7 mm Max

0.20 See note 4.

 

 

 

 

 

 

 

 

0.20 –C–

Seating Plane

0.435 ± 0.025 mm See Note 3

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach). 2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Packaging TechnologyPackaging TechnologyPackaging Technology

Figure 2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View)

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AD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Y

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

U

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4X 0.635

P

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

N

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31.000 + 0.100

M

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

K

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4X 15.500

G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

23X 1.270

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B

+

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A

+

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

4

6

7

8

10

12

14

16

17

18

20

22

24

A

 

 

1

3

5

9

11

13

 

15

19

21

 

23

 

 

 

 

23X 1.270

 

 

 

 

 

 

 

 

 

 

 

 

(0.895)

 

 

 

8X

14.605

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

29.2100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31.000 + 0.100

 

 

 

 

 

B

 

 

 

 

 

 

 

0.200

C

A

 

 

 

 

 

 

NOTES:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The PXH package has an exposed bare die, which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Notes

1.The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/IHS top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.

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3 Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the PXH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1 for the PXH component. Flip chip ball grid array (FC-BGA) packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the PXH component.

3.2Die Case Temperature Specifications

To ensure proper operation and reliability of the PXH component, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1Table 3- 1Table 3-1. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications

Parameter

Value

Notes

Tcase_max

105°C

 

 

Tcase_min

5°C

 

 

TDP Segment A @ 66 MHz and Segment B @ 66 MHz

9.0 watts

TDP Segment A @ 100 MHz and Segment B @ 100 MHz

8.9 watts

 

 

TDP Segment A @ 133 MHz and Segment B @ 133 MHz

8.6 watts

 

 

TDP Segment A @ 66 MHz and Segment B @ 100 MHz

8.9 watts

TDP Segment A @ 66 MHz and Segment B @ 133 MHz

8.8 watts

 

 

TDP Segment A @ 100 MHz and Segment B @ 133 MHz

8.7 watts

Note: These specifications are based on silicon characterization, however, they may be updated as further data becomes available.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Thermal SpecificationsThermal Simulation

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4 Thermal Simulation

Intel provides thermal simulation models of the Intel® 6700PXH 64-bit PCI Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool “FLOTHERM”* (version 3.1 or higher) by Flomerics, Inc. These models are also available in IcePak* format. Contact your Intel field sales representative to order the Icepak thermal model and user's guide.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Thermal SimulationThermal Simulation

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5 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the PXH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PXH die temperatures.

5.1Die Case Temperature Measurements

To ensure functionality and reliability, the Tcase of the PXH must be maintained at or between the maximum/minimum operating range of the temperature specification as noted in Table 3-1Table 3- 1Table 3-1. The surface temperature at the geometric center of the die corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate temperature measurement.

Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package, heat loss by radiation and/or convection, conduction through thermocouple leads, or contact between the thermocouple cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the 0° thermocouple attach approach is recommended.

5.1.1Zero Degree Angle Attach Methodology

1.Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of the heatsink base.

2.Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-1Figure 5-1Figure 5-1).

3.Attach thermal interface material (TIM) to the bottom of the heatsink base.

4.Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.

5.Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, ensure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 5-2Figure 5-2Figure 5-2).

6.Attach heatsink assembly to the PXH and route thermocouple wires out through the milled slot.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Thermal MetrologyThermal MetrologyThermal Metrology

Figure 5-1. Zero Degree Angle Attach Heatsink Modifications

NOTE: Not to scale.

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Figure 5-2. Zero Degree Angle Attach Methodology (Top View)

Die

Thermocouple

Wire

Cement +

Thermocouple Bead

Substrate

001321

NOTE: Not to scale.

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6 Reference Thermal Solution

Intel has developed one reference thermal solution to meet the cooling needs of the PXH component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions.

6.1Operating Environment

The PXH reference thermal solution was designed assuming a maximum local-ambient temperature of 55°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 200 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the local-ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C externalambient temperature at sea level. (External-ambient refers to the environment external to the system.)

6.2Heatsink Performance

Figure 6-1Figure 6-1Figure 6-1 depicts the measured thermal performance of the reference thermal solution versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.

Figure 6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity

 

6.0

 

 

 

 

 

 

5.5

 

 

 

 

 

ca (°C/W)

5.0

 

 

 

 

 

4.5

 

 

 

 

 

 

4.0

 

 

 

 

 

 

3.5

 

 

 

 

 

 

50

100

150

200

250

300

Flow Rate (LFM)

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

6.3Mechanical Design Envelope

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While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the PXH thermal solution are shown in Figure 6-2Figure 6-2Figure 6-2.

When using heatsinks that extend beyond the PXH reference heatsink envelope shown in Figure 6-2Figure 6-2Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2.40 mm (0.094 in.) in height.

Figure 6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub Chipset Component

 

Heatsink Fin

3.01mm.

 

1.86mm. 14.71mm

 

Heatsink Base

FCBGA +

Die + TIM

 

Motherboard

 

Solder Balls

 

 

31.00mm.

 

 

Heatsink

31.00mm.

 

Fin

 

 

 

3.00mm.

 

6.4Board-Level Components Keepout Dimensions

The locations of hole pattern and keepout zones for the reference thermal solution are shown in Figure 6-3Figure 6-3Figure 6-3 and Figure 6-4Figure 6-4Figure 6-4.

6.5Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the PXH component is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 6-5Figure 6-5Figure 6-5 shows the reference thermal solution assembly and associated components. Figure 6-6Figure 6-6Figure 6-6 shows the position of the heatsink rails relative to the PXH package top surface.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

Figure 6-3. Torsional Clip Heatsink Board Component Keepout

Component keepout area

1.756

PXH

1.886

 

2x 0.943

Parallel Mean

 

Airflow

 

Direction

 

Max

 

component

 

Height 0.50

2x 0.878

NOTE: All dimensions are in inches.

Figure 6-4. Retention Mechanism Component Keepout Zones

 

 

 

 

Component

 

 

 

0.500

 

Keepout Area

 

 

 

 

 

 

 

 

 

 

2x 0.060

 

 

 

0.120

 

 

 

 

0.345

 

 

0.225

(0.345)

 

 

 

 

0.050"

 

 

 

 

 

Component

0.750

0.170

 

See Detail

 

Keepout

 

 

 

 

 

 

 

 

(0.165)

A

 

 

Detail A

 

 

 

 

 

 

0.100

 

 

0.165

 

 

 

 

 

 

 

 

0.083

2x 0.038

 

 

Plated Through

 

0.173

Hole

 

0.345

0.200

 

0.100

 

 

 

Component

2x 0.056 Trace

 

Keepout

Keepout

 

NOTE: All dimensions are in inches.

 

 

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

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6.5.1Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.

Figure 6-5. Torsional Clip Heatsink Assembly

Figure 6-6 Heatsink Rails to PXH Package Footprint

6.5.2Extruded Heatsink Profiles

The reference torsional clip heatsink uses an extruded heatsink for cooling the PXH component. Figure 6-7Figure 6-7Figure 6-7 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may be available. Full mechanical drawing of this heatsink is provided in Appendix B.

6.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

6.5.4Thermal Interface Material

A thermal interface material provides improved conductivity between the die and heatsink. The reference thermal solution uses Chomerics* T-710, 0.127 mm (0.005 in.) thick, 8 mm x 8 mm square.

Note: Unflowed or “dry” Chomerics* T710 has a material thickness of 0.005 inch. The flowed or “wet” Chromerics T710 has a material thickness of ~0.0025 inch after it reaches its phase change temperature.

6.5.4.1Effect of Pressure on TIM Performance

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on the thermal resistance of the Chomerics T710 TIM is shown in Table 6-1Table 6-1Table 6-1. The heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C inch2/W.

Table 6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure

Pressure (psi)

Thermal Resistance (°C × in2)/W

 

 

5

0.37

 

 

10

0.30

 

 

20

0.21

 

 

30

0.17

 

 

NOTE: All measured at 50°C.

6.5.5Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix B for a mechanical drawing of the clip.

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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

Figure 6-7. Torsional Clip Heatsink Extrusion Profile

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6.5.6Clip Retention Anchors

For Intel® 6700PXH 64-bit PCI Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A for the part number and supplier information.

6.6Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6-2Table 6-2Table 6-2.

Table 6-2. Reliability Guidelines

Test (1)

Requirement

Pass/Fail Criteria (2)

 

 

 

Mechanical Shock

50 g, board level, 11 msec, 3 shocks/axis.

Visual Check and Electrical

 

 

Functional Test

 

 

 

Random Vibration

7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz.

Visual Check and Electrical

 

 

Functional Test

 

 

 

Temperature Life

85°C, 2000 hours total, checkpoints at 168, 500,

Visual Check

 

1000, and 2000 hours.

 

 

 

 

Thermal Cycling

–5°C to +70°C, 500 cycles.

Visual Check

 

 

 

Humidity

85% relative humidity, 55°C, 1000 hours.

Visual Check

 

 

 

NOTES:

 

 

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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AThermal Solution Component Suppliers

A.1 Torsional Clip Heatsink Thermal Solution

 

Part

Intel Part Number

Supplier

Contact Information

 

(Part Number)

 

 

 

 

 

 

 

 

Heatsink Assembly includes:

 

 

Harry Lin (USA)

Unidirectional Fin

 

 

714-739-5797

 

Heatsink

C76435-001

CCI/ACK*

hlinack@aol.com

Thermal Interface

Monica Chih (Taiwan)

 

 

 

Material

 

 

866-2-29952666, x131

Torsional Clip

 

 

monica_chih@ccic.com.tw

 

 

 

 

 

 

 

Harry Lin (USA)

 

 

 

 

714-739-5797

Undirectional Fin Heatsink

C76434-001

CCI/ACK

hlinack@aol.com

(31.0 x 31.0 x 12.2 mm)

Monica Chih (Taiwan)

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

monica_chih@ccic.com.tw

Thermal Interface

A69230-001

Chomerics*

Todd Sousa (USA)

360-606-8171

(Chomerics* T-710)

69-12-22066-T710

 

tsousa@parker.com

 

 

 

 

 

 

 

 

 

 

 

 

 

Harry Lin (USA)

 

 

 

 

714-739-5797

Heatsink Attach Clip

C17725-001

CCI/ACK

hlinack@aol.com

Monica Chih (Taiwan)

 

 

 

 

 

 

 

 

866-2-29952666, x131

 

 

 

 

monica_chih@ccic.com.tw

Solder-Down Anchor

A13494-005

Foxconn*

Julia Jiang (USA)

408-919-6178

(HB96030-DW)

 

 

 

juliaj@foxconn.com

 

 

 

 

 

 

 

 

 

Note: The enabled components may not be currently available from all suppliers. Contact the supplier directly to verify time of component availability.

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Thermal Solution Component Suppliers

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B Mechanical Drawings

Table B-1Table B-1Table B-1 lists the mechanical drawings included in this appendix.

Table B-1. Mechanical Drawing List

Drawing Description

Figure Number

 

 

Torsional Clip Heatsink Assembly Drawing

Figure B-1Figure B-

 

1Figure B-1

 

 

Torsional Clip Heatsink Drawing

Figure B-2Figure B-

 

2Figure B-2

 

 

Torsional Clip Drawing

Figure B-3Figure B-

 

3Figure B-3

 

 

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Mechanical Drawings

Figure B-1. Torsional Clip Heatsink Assembly Drawing

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Mechanical Drawings

Figure B-2. Torsional Clip Heatsink Drawing

 

 

 

 

 

 

 

 

 

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Mechanical Drawings

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Figure B-3.Torsional Clip Drawing

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