Intel 6300ESB, I/O Controller Hub 6300ESB User Manual

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Intel® 6300ESB I/O Controller

Hub

Thermal and Mechanical Design Guide

February 2004

Order Number: 300682-001

Contents

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® 6300ESB I/O Controller Hub may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

AlertVIEW, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Connect, CT Media, Dialogic, DM3, EtherExpress, ETOX, FlashFile, i386, i486, i960, iCOMP, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share, Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel Play, Intel Play logo, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Xeon, Intel XScale, IPLink, Itanium, LANDesk, LanRover, MCS, MMX, MMX logo, Optimizer logo, OverDrive, Paragon, PC Dads, PC Parents, PDCharm, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your Command, RemoteExpress, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside., The Journey Inside, TokenExpress, Trillium, VoiceBrick, Vtune, and Xircom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Copyright © Intel Corporation, 2004

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Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

Contents

Contents

1.0

Introduction....................................................................................................................................

5

 

1.1

Definition of Terms................................................................................................................

5

 

1.2

Reference Documents ..........................................................................................................

6

2.0

Packaging Technology .................................................................................................................

7

3.0

Thermal Specifications .................................................................................................................

9

 

3.1

Case Temperature and Thermal Design Power ...................................................................

9

 

3.2

Case Temperature Metrology ...............................................................................................

9

4.0

Reference Thermal Solution.......................................................................................................

11

 

4.1

Reliability Requirements .....................................................................................................

11

A

Mechanical Drawings ..................................................................................................................

13

Figures

1

Intel® 6300ESB I/O Controller Hub Package Dimensions..........................................................

14

Tables

 

1

Definition of Terms........................................................................................................................

5

2

Reference Documents ..................................................................................................................

6

3

Intel® 6300ESB I/O Controller Hub Thermal Specifications .........................................................

9

4

Reliability Requirements .............................................................................................................

11

Revision History

Date

Revision

Description

 

 

 

February 2004

1.0

Initial release of this document.

 

 

 

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Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

Introduction

1.0Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Heat may be dissipated using improved system cooling and/or attaching passive heatsinks.

The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits may be expected to meet specified performance requirements. Operation outside the functional limit may degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel® 6300ESB I/O Controller Hub (ICH).

The simplest and most cost effective method is to improve the inherent system cooling characteristics through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink may be varied to balance size and space constraints with acoustic noise.

This document presents the conditions and requirements to properly design a cooling solution for systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case temperatures of the Intel 6300ESB ICH at or below those recommended in this document, a system designer may ensure the proper functionality, performance, and reliability of these components.

1.1Definition of Terms

Table 1. Definition of Terms

Term

Definition

 

 

 

Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is

BGA

mounted, bonded and encapsulated in molding compound. The primary electrical interface is

 

an array of solder balls attached to the substrate opposite the die and molding compound.

 

 

Tcase-nhs

The maximum package case temperature without any package thermal solution. This

temperature is measured at the geometric center of the top of the package case.

Tj-max

The maximum component temperature specification measured at the hottest point in the

processor die.

TDP

Thermal Design Power. Thermal solutions should be designed to dissipate this target power

level.

 

 

 

LFM

Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such

as an axial fan or blower.

 

 

 

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