Intel 5000 User Manual

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Intel® 5000 Series Chipset Memory

Controller Hub(MCH)

Thermal/Mechanical Design Guide

May 2006

Document Number: 313067-001

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.

Intel may make changes to specifications, product descriptions, and plans at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® 5000 Series chipset Memory Controller Hub may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s website at http://www.intel.com.

Intel and The Dual-Core Intel® Xeon® processor 5000 Sequence, the Intel® 6700PXH 64-bit PCI Hub, the Intel® E7500/E7501/E7505 chipset and the Intel® 631xESB/632xESB I/O Controller Hub and the Intel logo are a trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

Copyright © 2006, Intel Corporation. All rights reserved.

* Other brands and names may be claimed as the property of others.

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Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Contents

1

Introduction

..............................................................................................................

7

 

1.1

Design Flow........................................................................................................

7

 

1.2

Definition of Terms ..............................................................................................

8

 

1.3

Reference ..........................................................................................Documents

9

2

Packaging Technology .............................................................................................

11

 

2.1

Package .......................................................................Mechanical Requirements

12

3

Thermal Specifications ............................................................................................

13

 

3.1

Thermal ..............................................................................Design Power (TDP)

13

 

3.2

Case Temperature .............................................................................................

13

4

Thermal Simulation .................................................................................................

15

5

Thermal Metrology ..................................................................................................

17

 

5.1

MCH Case ..................................................................Temperature Measurement

17

 

 

5.1.1 ......................................................................

Supporting Test Equipment

17

 

 

5.1.2 ..............................................................Thermal Calibration and Controls

18

 

 

5.1.3 ...........................................................................................

IHS Groove

18

 

 

5.1.4 ...............................................Thermocouple Conditioning and Preparation

19

 

 

5.1.5 ........................................................Thermocouple Attachment to the IHS

20

 

 

5.1.6 .......................................................................................

Curing Process

23

 

 

5.1.7 ..............................................................

Thermocouple Wire Management

24

 

 

5.1.8 ......................................................................

Power Simulation Software

25

6

Reference Thermal .....................................................................................Solution

27

 

6.1

Operating ......................................................................................Environment

27

 

6.2

Heatsink ........................................................................................Performance

27

 

6.3

Mechanical ...............................................................................Design Envelope

28

 

6.4

Board-Level ......................................................Components Keepout Dimensions

28

 

6.5

Tall Torsional ..........................................Clip Heatsink Thermal Solution Assembly

29

 

 

6.5.1 ...............................................................................

Heatsink Orientation

30

 

 

6.5.2 .......................................................................

Extruded Heatsink Profiles

31

 

 

6.5.3 ...................................................................

Mechanical Interface Material

31

 

 

6.5.4 .......................................................................

Thermal Interface Material

31

 

 

6.5.5 .........................................................................................

Heatsink Clip

31

 

 

6.5.6 ............................................................................

Clip Retention Anchors

32

 

6.6

Reliability ..........................................................................................Guidelines

32

7

Reference Thermal ..................................................................................Solution 2

35

 

7.1

Operating ......................................................................................Environment

35

 

7.2

Heatsink ........................................................................................Performance

35

 

7.3

Mechanical ...............................................................................Design Envelope

36

 

7.4

Board-Level ......................................................Components Keepout Dimensions

36

 

7.5

Short Torsional ........................................Clip Heatsink Thermal Solution Assembly

37

 

 

7.5.1 ...............................................................................

Heatsink Orientation

38

 

 

7.5.2 .......................................................................

Extruded Heatsink Profiles

39

 

 

7.5.3 ...................................................................

Mechanical Interface Material

39

 

 

7.5.4 .......................................................................

Thermal Interface Material

39

 

 

7.5.5 ............................................................................

Clip Retention Anchors

39

 

7.6

Reliability ..........................................................................................Guidelines

39

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

3

A

 

....................................................................Thermal Solution Component Suppliers

41

 

 

A.1

Tall Torsional Clip Heatsink Thermal Solution.........................................................

41

 

 

A.2

Short Torsional Clip Heatsink Thermal Solution ......................................................

42

B

 

Mechanical Drawings ...............................................................................................

43

Figures

 

 

1-1

Thermal Design Process.......................................................................................

8

 

2-1

MCH Package Dimensions (Top View) ...................................................................

11

 

2-2

MCH Package Dimensions (Side View) ..................................................................

11

 

2-3

MCH Package Dimensions (Bottom View) ..............................................................

12

 

5-1

IHS Groove Dimensions ......................................................................................

19

 

5-2

Orientation of Thermocouple Groove Relative to Package Pin ...................................

19

 

5-3

Bending the Tip of the Thermocouple....................................................................

20

 

5-4

Securing Thermocouple Wires with Kanton* Tape Prior to Attach..............................

21

 

5-5

Thermocouple Bead Placement ............................................................................

21

 

5-6

Position Bead on the Groove Step ........................................................................

22

 

5-7

Using 3D Micromanipulator to Secure Bead Location...............................................

22

 

5-8

Measuring Resistance between Thermocouple and IHS............................................

22

 

5-9

Applying the Adhesive on the Thermocouple Bead ..................................................

23

 

5-10

Thermocouple Wire Management Groove ..............................................................

24

 

5-11

Removing Excess Adhesive from the IHS ..............................................................

24

 

5-12

Filling the Groove with Adhesive ..........................................................................

24

 

6-1

Tall Torsional Clip Heatsink Measured Thermal

 

 

 

 

Performance Versus Approach Velocity .................................................................

27

 

6-2

Tall Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH .......................

28

 

6-3

Tall Torsional Clip Heatsink Board Component Keepout ...........................................

29

 

6-4

Retention Mechanism Component Keepout Zones...................................................

30

 

6-5

Tall Torsional Clip Heatsink Assembly ...................................................................

30

 

6-6

Tall Torsional Clip Heatsink Extrusion Profile..........................................................

32

 

7-1

Short Torsional Clip Heatsink Measured

 

 

 

 

Thermal Performance Versus Approach Velocity .....................................................

35

 

7-2

Short Torsional Clip Heatsink Volumetric Envelope for the Chipset MCH.....................

36

 

7-3

Short Torsional Clip Heatsink Board Component Keepout ........................................

37

 

7-4

Retention Mechanism Component Keepout Zones...................................................

38

 

7-5

Short Torsional Clip Heatsink Assembly.................................................................

38

 

7-6

Torsional Clip Heatsink Extrusion Profile................................................................

39

 

 

B-1

Tall Torsional Clip Heatsink Assembly Drawing.......................................................

44

 

 

B-2

Tall Torsional Clip Heatsink Drawing (Sheet 1 of 2).................................................

45

 

 

B-3

Tall Torsional Clip Heatsink Drawing (Sheet 2 of 2).................................................

46

 

 

B-4

Tall Torsional Clip Heatsink Clip Drawing ...............................................................

47

 

 

B-5

Short Torsional Clip Heatsink Assembly Drawing ....................................................

48

 

 

B-6

Short Torsional Clip Heatsink Drawing(Sheet 1 of 2)...............................................

49

 

 

B-7

Short Torsional Clip Heatsink Drawing(Sheet 2 of 2)...............................................

50

 

 

B-8

Short Torsional Clip Heatsink Clip Drawing ............................................................

51

4

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Tables

3-1 Intel® 5000P Chipset MCH Thermal Specifications .................................................

13

3-2 Intel® 5000V Chipset MCH Thermal Specifications.................................................

13

3-3

Intel® 5000X Chipset MCH Thermal Specifications.................................................

14

5-1

Thermocouple Attach Support Equipment .............................................................

17

6-1

Honeywell PCM45 F TIM Performance as a Function of Attach Pressure .....................

31

6-2

Reliability Guidelines..........................................................................................

32

B-1 Mechanical Drawing List .....................................................................................

43

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

5

Revision Table

Revision

Description

Date

Number

 

 

 

 

 

-001

Initial release of the document.

May 2006

 

 

 

§§

6

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Introduction

1 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

Outline the thermal and mechanical operating limits and specifications for the Intel® 5000 Series chipset memory controller hub (MCH).

Describe reference thermal solutions that meet the specification of the Intel 5000 Series chipset MCH.

Properly designed thermal solutions provide adequate cooling to maintain the

Intel 5000 Series chipset MCH die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel 5000 Series chipset MCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the

Intel 5000 Series chipset MCH components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For the Intel® 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines.

Note: Unless otherwise specified, the term “MCH” refers to the Intel 5000 Series chipset MCH.

1.1Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1-1 illustrates the design process implicit to this document and the tools appropriate for each step.

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

7

Introduction

Figure 1-1. Thermal Design Process

1.2Definition of Terms

BGA

Ball grid array. A package type, defined by a resin-fiber

 

substrate, onto which a die is mounted, bonded and

 

encapsulated in molding compound. The primary electrical

 

interface is an array of solder balls attached to the substrate

 

opposite the die and

 

molding compound.

BLT

Bond line thickness. Final settled thickness of the thermal

 

interface material after installation of heatsink.

Intel® 631xESB/632xESB I/O Controller Hub

 

The chipset component that integrates an Ultra ATA 100

 

controller, six Serial ATA host controller ports, one EHCI host

 

controller, and four UHCI host controllers supporting eight

 

external USB 2.0 ports, LPC interface controller, flash BIOS

 

interface controller, PCI interface controller, Azalia / AC’97

 

digital controller, integrated LAN controller, an ASF controller

 

and a ESI for communication with the MCH. The Intel 631xESB/

 

632xESB I/O Controller Hub component provides the data

 

buffering and interface arbitration required to ensure that

 

system interfaces operate efficiently and provide the bandwidth

 

necessary to enable the system to obtain peak performance.

MCH

Memory controller hub. The chipset component that contains

 

the processor interface, the memory interface, the PCI Express*

 

interface and the ESI interface.

PXH

Intel® 6700PXH 64-bit PCI Hub. The chipset component that

 

performs PCI bridging functions between the PCI Express

 

interface and the PCI Bus. It contains two PCI bus interfaces

 

that can be independently configured to operate in PCI (33 or 66

 

MHz) or PCI-X* mode 1 (66, 100 or 133 MHz), for either 32 or

 

64 bit PCI devices.

PXH-V

Intel® 6702PXH 64-bit PCI Hub. The chipset component that

 

performs PCI bridging functions between the PCI Express

 

interface and the PCI Bus. It contains one PCI bus interface that

 

can be configured to operate in PCI (33 or 66MHz) or PCI-X

 

mode 1 (66, 100 or 133 MHz).

Tcase_max

Maximum IHS temperature allowed. This temperature is

 

measured at the geometric center of the top of IHS.

8

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Introduction

Tcase_min

TDP

Minimum IHS temperature allowed. This temperature is measured at the geometric center of the top of IHS.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.3Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide

Intel® 6700PXH 64-bit PCI Hub Datasheet

Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines

Intel® 5000P/5000V/5000Z Chipset Memory Controller Hub (MCH) Datasheet

Intel® 5000X Chipset Memory Controller Hub (MCH) Datasheet

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines

BGA/OLGA Assembly Development Guide

Various system thermal design suggestions (http://www.formfactors.org)

Note:

Unless otherwise specified, these documents are available through your Intel field sales

 

representative. Some documents may not be available at this time.

§§

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

9

Introduction

10

Intel® 5000 Series Chipset Memory Controller Hub (MCH) Thermal Mechanical Design Guide

Packaging Technology

2 Packaging Technology

Intel 5000 Series chipset consist of three individual components: the Memory Controller Hub (MCH), the Intel® 6700PXH 64-bit PCI Hub (PXH) and the Intel® 631xESB/632xESB I/O Controller Hub. Intel 5000 Series chipset MCH components use a 42.5 mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1, , and Figure 2-2). For information on the PXH package, refer to the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For information on the Intel® 631xESB/632xESB I/O Controller Hub package, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines.

Figure 2-1. MCH Package Dimensions (Top View)

Handling

Exclusion

Area

38.5 mm,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MCH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

38.5 mm.

 

 

 

 

 

 

 

42.5 mm.

 

 

 

IHS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

42.5 mm.

Figure 2-2. MCH Package Dimensions (Side View)

4.23 ± 0.146 mm

 

 

3.79 ± 0.144 mm

IHS

Substrate

 

2.44 ± 0.071 mm

 

 

 

0.20 See note 4.

0.20 –C–

0.435 ± 0.025 mm

Seating Plane

See note 1.

See note 3

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

11

Packaging Technology

Figure 2-3. MCH Package Dimensions (Bottom View)

 

AV

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AU

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AJ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AG

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

42.5 + 0.05

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Y

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

- A

 

W

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

U

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

N

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

M

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20.202

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

K

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

H

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

37X 1.092

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

B

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

4

6

 

8

10

12

14

 

16

18

20

22

24

26

28

30

32

 

34

36

38

 

1

3

5

7

9

 

11

13

15

17

19

21

23

 

25

27

29

31

33

35

37

A

 

 

 

37X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.092

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20.202

42.5

+

B

00..05

 

C

A

2

 

 

Notes:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The Intel 5000 Series chipset MCH package has an integrated heat spreader (IHS) that is capable of sustaining a maximum static normal load of 15 lbf. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note:

1.The heatsink attach solutions must not include continuous stress to the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.

§

12

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

Thermal Specifications

3 Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the MCH component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level to which the thermal solutions should be designed. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1 for the Intel® 5000P chipset MCH, Table 3-2 for the Intel® 5000V chipset MCH, and Table 3-3 for the Intel® 5000X chipset MCH. FCBGA packages have poor heat transfer capability into the board and have minimal thermal capability without thermal solution. Intel recommends that system designers plan for a heatsink when using Intel 5000 Series chipset.

3.2Case Temperature

To ensure proper operation and reliability of the Intel 5000 Series chipset MCH, the case temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3-1 through Table 3-3. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 5, “Thermal Metrology” for guidelines on accurately measuring package case temperatures.

Table 3-1. Intel® 5000P Chipset MCH Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

105°C

 

Tcase_min

5°C

 

TDPwith 1 active memory channel

24.7 W

 

TDPwith 2 active memory channel

26.4 W

 

TDPwith 4 active memory channel

30.0 W

 

Note: These specifications are based on preliminary silicon characterization, however, they may be updated as further data becomes available.

Table 3-2. Intel® 5000V Chipset MCH Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

105°C

 

Tcase_min

5°C

 

TDPwith 1 active memory channel

23.4 W

 

TDPwith 2 active memory channel

25.1 W

 

Note: These specifications are based on preliminary silicon characterization; however, they may be updated as further data becomes available.

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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Thermal Specifications

Table 3-3. Intel® 5000X Chipset MCH Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

105°C

 

Tcase_min

5°C

 

TDPwith 1 active memory channel

27.3 W

 

TDPwith 2 active memory channel

29.0 W

 

TDPwith 4 active memory channel

32.4 W

 

Note: These specifications are based on preliminary silicon characterization, however, they may be updated as further data becomes available.

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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

Thermal Simulation

4 Thermal Simulation

Intel provides thermal simulation models of the Intel 5000 Series chipset MCH and associated user’s guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. Contact your Intel field sales representative to order the thermal models and user’s guides.

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Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

15

Thermal Simulation

16

Intel® 631xESB/632xESB I/O Controller Hub Thermal Mechanical Design Guide

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