Intel 5400 Series, X5472 - Cpu Xeon Quad Core 3.00Ghz Fsb1600Mhz 12M Lga771 Tray, Xeon 5400 Series Design Manuallines

Quad-Core Intel® Xeon® Processor 5400 Series

Thermal/Mechanical Design Guidelines

November 2007

Reference Number: 318611 Revision: 001

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The Quad-Core Intel® Xeon® 5400 Series may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

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2 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Contents

1Introduction..............................................................................................................9

1.1 Objective ...........................................................................................................9

1.2 Scope ................................................................................................................9

1.3 References .........................................................................................................9

1.4 Definition of Terms ............................................................................................ 10

2 Thermal/Mechanical Reference Design.................................................................... 13

2.1 Mechanical Requirements ................................................................................... 13

2.1.1 Processor Mechanical Parameters ............................................................. 13

2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package............................ 14

2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations................... 18

2.2 Processor Thermal Parameters and Features ......................................................... 19

2.2.1 Thermal Control Circuit and TDP............................................................... 19

2.2.2 Digital Thermal Sensor............................................................................ 20

2.2.3 Platform Environmental Control Interface (PECI) ........................................ 21

2.2.4 Multiple Core Special Considerations ......................................................... 21

2.2.5 Thermal Profile ...................................................................................... 24

2.2.6 TCONTROL Definition .............................................................................. 25

2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon®

2.2.8 Performance Targets............................................................................... 28

2.3 Fan Fail Guidelines ............................................................................................ 32

2.4 Characterizing Cooling Solution Performance Requirements..................................... 33

2.4.1 Fan Speed Control.................................................................................. 33

2.4.2 Processor Thermal Characterization Parameter Relationships........................ 34

2.4.3 Chassis Thermal Design Considerations ..................................................... 36

2.5 Thermal/Mechanical Reference Design Considerations ............................................ 37

2.5.1 Heatsink Solutions.................................................................................. 37

2.5.2 Thermal Interface Material....................................................................... 38

2.5.3 Summary .............................................................................................. 38

2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design........... 39

2.5.5 Thermal Solution Performance Characteristics ............................................ 41

2.5.6 Thermal Profile Adherence....................................................................... 42

2.5.7 Components Overview ............................................................................ 45

2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel®

A 1U Alternative Heatsink Thermal/Mechanical Design............................................... 53

A.1 Component Overview......................................................................................... 53

A.2 Thermal Solution Performance Characterics .......................................................... 54

A.3 Thermal Profile Adherence.................................................................................. 54

B Mechanical Drawings............................................................................................... 57

C Heatsink Clip Load Methodology .............................................................................. 83

C.1 Overview ......................................................................................................... 83

C.2 Test Preparation................................................................................................ 83

C.2.1 Heatsink Preparation .............................................................................. 83

C.2.2 Typical Test Equipment ........................................................................... 86

C.2.3 Test Procedure Examples ........................................................................ 86

C.2.4 Time-Zero, Room Temperature Preload Measurement ................................. 86

C.2.5 Preload Degradation under Bake Conditions ............................................... 87

Processor 5400 Series............................................................................. 26

Xeon® Processor 5400 Series Thermal Profile ............................................ 49

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 3

D Safety Requirements................................................................................................89

E Quality and Reliability Requirements .......................................................................91

E.1 Intel Verification Criteria for the Reference Designs ................................................91

E.1.1 Reference Heatsink Thermal Verification ....................................................91

E.1.2 Environmental Reliability Testing ..............................................................91

E.1.3 Material and Recycling Requirements.........................................................93

F Enabled Suppliers Information.................................................................................95

F.1 Supplier Information ..........................................................................................95

F.1.1 Intel Enabled Suppliers............................................................................95

F.1.2 Additional Suppliers ................................................................................96

Figures

2-1 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)............15

2-2 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)............16

2-3 Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3)............17

2-4 Processor Case Temperature Measurement Location ...............................................19

2-5 DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series ............................21

2-6 Processor Core Geometric Center Locations ...........................................................23

2-7 Thermal Profile Diagram .....................................................................................24

2-8 TCONTROL Value and Digital Thermal Sensor Value Interaction................................25

2-9 TCONTROL and Thermal Profile Interaction............................................................26

2-10 Dual Thermal Profile Diagram..............................................................................27

2-11 Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series..................29

2-12 Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series .......................30

2-13 Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series.......................31

2-14 TCONTROL and Fan Speed Control .......................................................................33

2-15 Processor Thermal Characterization Parameter Relationships ...................................35

2-16 Exploded View of CEK Thermal Solution Components..............................................39

2-17 2U+ CEK Heatsink Thermal Performance...............................................................41

2-18 1U CEK Heatsink Thermal Performance.................................................................42

2-19 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile A......................................................................................43

2-20 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile B......................................................................................44

2-21 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400

Series Thermal Profile ........................................................................................45

2-22 Isometric View of the 2U+ CEK Heatsink...............................................................46

2-23 Isometric View of the 1U CEK Heatsink .................................................................46

2-24 CEK Spring Isometric View..................................................................................48

2-25 Isometric View of CEK Spring Attachment to the Base Board ...................................48

2-26 Boxed Active CEK Heatsink Solutions with PWM/DTS Control

(Representation Only) ........................................................................................49

2-27 Fan Cable Connection (Active CEK) ......................................................................50

A-1 Isometric View of the 1U Alternative Heatsink........................................................53

A-2 1U Alternative Heatsink Thermal Performance .......................................................54

A-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®

Processor L5400 Series Thermal Profile.................................................................55

B-1 2U CEK Heatsink (Sheet 1 of 4) ...........................................................................58

B-2 2U CEK Heatsink (Sheet 2 of 4) ...........................................................................59

B-3 2U CEK Heatsink (Sheet 3 of 4) ...........................................................................60

B-4 2U CEK Heatsink (Sheet 4 of 4) ...........................................................................61

4 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

B-5 CEK Spring (Sheet 1 of 3) .................................................................................. 62

B-6 CEK Spring (Sheet 2 of 3) .................................................................................. 63

B-7 CEK Spring (Sheet 3 of 3) .................................................................................. 64

B-8 Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 1 of 6).................................................................... 65

B-9 Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 2 of 6).................................................................... 66

B-10 Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 3 of 6).................................................................... 67

B-11 Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 4 of 6).................................................................... 68

B-12 Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 5 of 6).................................................................... 69

B-13 Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 6 of 6).................................................................... 70

B-14 1U CEK Heatsink (Sheet 1 of 4)........................................................................... 71

B-15 1U CEK Heatsink (Sheet 2 of 4)........................................................................... 72

B-16 1U CEK Heatsink (Sheet 3 of 4)........................................................................... 73

B-17 1U CEK Heatsink (Sheet 4 of 4)........................................................................... 74

B-18 Active CEK Thermal Solution Volumetric (Sheet 1 of 3)........................................... 75

B-19 Active CEK Thermal Solution Volumetric (Sheet 2 of 3)........................................... 76

B-20 Active CEK Thermal Solution Volumetric (Sheet 3 of 3)........................................... 77

B-21 1U Alternative Heatsink (1 of 4) .......................................................................... 78

B-22 1U Alternative Heatsink (2 of 4) .......................................................................... 79

B-23 1U Alternative Heatsink (3 of 4) .......................................................................... 80

B-24 1U Alternative Heatsink (4 of 4) .......................................................................... 81

C-1 Load Cell Installation in Machined Heatsink Base Pocket - Bottom View..................... 84

C-2 Load Cell Installation in Machined Heatsink Base Pocket - Side View......................... 85

C-3 Preload Test Configuration.................................................................................. 85

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 5

Tables

1-1 Reference Documents.......................................................................................... 9

1-2 Terms and Descriptions ......................................................................................10

2-1 Processor Mechanical Parameters Table ................................................................13

2-2 Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5400

Series Thermal Management Features ..................................................................22

2-3 Processor Core Geometric Center Dimensions........................................................23

2-4 Intel Reference Heatsink Performance Targets for the Quad-Core Intel®

Xeon® Processor X5400 Series............................................................................31

2-5 Intel Reference Heatsink Performance Targets for the Quad-Core Intel®

Xeon® Processor E5400 Series............................................................................32

2-6 Fan Speed Control, TCONTROL and DTS Relationship..............................................34

2-7 CEK Heatsink Thermal Mechanical Characteristics...................................................47

2-8 Recommended Thermal Grease Dispense Weight ...................................................47

2-9 Fan Specifications (Boxed 4-wire PWM/DTS Heatsink Solution) ................................50

2-10 Fan Cable Connector Pin Out (Active CEK).............................................................51

A-1 1U Alternative Heatsink Thermal Mechanical Characteristics ....................................54

B-1 Mechanical Drawing List......................................................................................57

C-1 Typical Test Equipment.......................................................................................86

E-1 Use Conditions Environment................................................................................92

F-1 Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel

Reference Solution.............................................................................................95

F-2 Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series

Intel Reference Solution .....................................................................................97

6 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Revision History

Reference

Number

318611 001 Initial release of the document. November 2007

Revision

Number

Description Date

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 7

8 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Introduction

1 Introduction

1.1 Objective

The purpose of this guide is to describe the reference thermal solution and design parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series.

It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements. Furthermore, this document provides an understanding of the processor thermal characteristics, and discusses guidelines for meeting the thermal requirements imposed over the entire life of the processor. The thermal/mechanical solutions described in this document are intended to aid component and system designers in the development and evaluation of processor compatible thermal/mechanical solutions.

1.2 Scope

The thermal/mechanical solutions described in this document pertain to a solution(s) intended for use with the Quad-Core Intel® Xeon® Processor 5400 Series in 1U, 2U, 2U+ and workstation form factors systems. This document contains the mechanical and thermal requirements of the processor cooling solution. In case of conflict, the data in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet supersedes any data in this document. Additional information is provided as a reference in the appendices.

1.3 References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents (Sheet 1 of 2)

Document Comment

European Blue Angel Recycling Standards http://www.blauer-engel.de

Intel

Xeon® Dual- and Multi- Processor Family Thermal Test Vehicle

User's Guide

LGA771 Socket Mechanical Design Guide See Note following table.

LGA771 SMT Socket Design Guidelines See Note following table.

LGA771 Daisy Chain Test Vehicle User Guide See Note following table.

Stoakley Platform Design Guide (PDG) See Note following table.

Dual-Core Intel Guide (PDG)

Clovertown, Harpertown & Wolfdale-DP Processors Compatibility Design Guide for Bensley, Bensley-VS, and Glidewell Platforms

PECI Feature Set Overview See Note following table

Platform Environment Control Interface(PECI) Specification See Note following table

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet See Note following table.

Clovertown_Harpertown_Wolfdale-DP Processor Enabled CEK and Package Mechanical Models (in IGES and ProE* format)

Xeon® Processor-Based Servers Platform Design

Xeon® Processor-Based Workstation Platform Design

See Note at bottom table.

See Note following table.

Available electronically

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 9

Table 1-1. Reference Documents (Sheet 2 of 2)

Document Comment

Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components CEK Thermal Models (in Flotherm* and Icepak*)

Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal Models (in Flotherm and Icepak)

RS - Wolfdale Processor Family BIOS Writers Guide (BWG) See Note following table.

Thin Electronics Bay Specification (A Server System Infrastructure (SSI) Specification for Rack Optimized Servers

Note: Contact your Intel field sales representative for the latest revision and order number of this document.

1.4 Definition of Terms

Table 1-2. Terms and Descriptions (Sheet 1 of 2)

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a

DTS Digital Thermal Sensor replaces the Tdiode in previous products and

MSR The processor provides a variety of model specific registers that are used to control and

FMB Flexible Motherboard Guideline: an estimate of the maximum value of a processor

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the

LGA771 Socket The Quad-Core Intel® Xeon® Processor 5400 Series interfaces to the baseboard

MAX

PECI A proprietary one-wire bus interface that provides a communication channel between

CASE

CASE_MAX

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature

duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature value represents the number of degrees below the TCC activation temperature.

report on processor performance. Virtually all MSRs handle system related functions and are not accessible to an application program.

specification over certain time periods. System designers should meet the FMB values to ensure their systems are compatible with future processor releases.

thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

through this surface mount, 771 Land socket. See the LGA771 Socket Mechanical Design Guide for details regarding this socket.

The maximum power dissipated by a semiconductor component.

Intel processor and chipset components to external thermal monitoring devices, for use in fan speed control. PECI communicates readings from the processors Digital Thermal Sensor. PECI replaces the thermal diode available in previous processors.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T Package Power. Heat source should always be specified for Ψ measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T Package Power.

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T

The case temperature of the processor, measured at the geometric center of the topside of the IHS.

The maximum case temperature as specified in a component specification.

by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

Introduction

Available electronically

www.ssiforum.com

uses the same

– TLA) / Total

CASE

– TS) / Total

CASE

– TLA) / Total Package Power.

10 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Introduction

Table 1-2. Terms and Descriptions (Sheet 2 of 2)

CONTROL

OFFSET

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target

Thermal Monitor A feature on the processor that can keep the processor’s die temperature within factory

Thermal Profile Line that defines case temperature specification of a processor at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink

U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U

A processor unique value for use in fan speed control mechanisms. T temperature specification based on a temperature reading from the processor’s Digital Thermal Sensor. T implementation. T

An offset value from the TCC activation temperature value programmed into each processor during manufacturing and can be obtained by reading the IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the

can be described as a trigger point for fan speed control

CONTROL

= -T

CONTROL

RS - Wolfdale Processor Family BIOS Writers Guide (BWG) for further details.

power level. TDP is not the maximum power that the processor can dissipate.

specifications under normal operating conditions.

and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

equals 3.50 in, etc.

OFFSET

is a

CONTROL

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 11

Introduction

12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

2 Thermal/Mechanical Reference

Design

This chapter describes the thermal/mechanical reference design for Quad-Core Intel® Xeon® Processor 5400 Series. Both Quad-Core Intel® Xeon® Processor X5400 Series and Quad-Core Intel® Xeon® Processor E5400 Series are targeted for the full range of form factors (2U, 2U+ and 1U). The Quad-Core Intel® Xeon® Processor X5482 sku is an ultra performance version of the Quad-Core Intel® Xeon® Processor 5400 Series with 150W TDP and is use only in workstation platforms.

2.1 Mechanical Requirements

The mechanical performance of the processor cooling solution must satisfy the requirements described in this section.

2.1.1 Processor Mechanical Parameters

Table 2-1. Processor Mechanical Parameters Table

Parameter Minimum Maximum Unit Notes

Volumetric Requirements and Keepouts 1

Static Compressive Load 3

Static Board Deflection 3

Dynamic Compressive Load 3

Tra n s ient B e n d 3

Shear Load 70

Tensile Load 25

Torsi on L o a d 35

Notes:

1. Refer to drawings in Appendix B.

2. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Ta bl e 2 -1 above.

3. These socket limits are defined in the LGA771 Socket Mechanical Design Guide.

4. These package handling limits are defined in the Quad-Core Intel® Xeon® Processor 5400 Series

Datasheet.

5. Shear load that can be applied to the package IHS.

6. Tensile load that can be applied to the package IHS.

7. Torque that can be applied to the package IHS.

311

111

3.95

lbf

in*lbf

N*m

2,4,5

2,4,6

2,4,7

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 13

Thermal/Mechanical Reference Design

2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package

The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in

Figure 2-1, Figure 2-2, and Figure 2-3 provide the mechanical information for the

Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the drawing in the processor datasheet should there be any conflicts. Integrated package/ socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide.

14 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-1. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)

Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution are

available in the processor Thermal/Mechanical Design Guidelines.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 15

Thermal/Mechanical Reference Design

Figure 2-2. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)

16 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-3. Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3)

Note: The optional dimple packing marking highlighted by Detail F from the above drawing may only be found on initial

processors.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 17

Thermal/Mechanical Reference Design

The package includes an integrated heat spreader (IHS). The IHS transfers the nonuniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spreads over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink. Details can be found in the

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet.

The processor connects to the baseboard through a 771-land surface mount socket. A description of the socket can be found in the LGA771 Socket Mechanical Design Guide.

The processor package and socket have mechanical load limits that are specified in the

Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and the LGA771 Socket Mechanical Design Guide. These load limits should not be exceeded during heatsink

installation, removal, mechanical stress testing, or standard shipping conditions. For example, when a compressive static load is necessary to ensure thermal performance of the Thermal Interface Material (TIM) between the heatsink base and the IHS, it should not exceed the corresponding specification given in the LGA771 Socket Mechanical Design Guide.

The heatsink mass can also add additional dynamic compressive load to the package during a mechanical shock event. Amplification factors due to the impact force during shock must be taken into account in dynamic load calculations. The total combination of dynamic and static compressive load should not then exceed the processor/socket compressive dynamic load specified in the LGA771 Socket Mechanical Design Guide during a vertical shock. It is not recommended to use any portion of the processor substrate as a mechanical reference or load-bearing surface in either static or dynamic compressive load conditions.

2.1.3 Quad-Core Intel® Xeon® Processor 5400 Series Considerations

An attachment mechanism must be designed to support the heatsink since there are no features on the LGA771 socket to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular:

• Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially ones based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Refer to Section 2.5.2 and Section 2.5.7.2 for information on tradeoffs made with TIM selection. Designs should consider possible decrease in applied pressure over time due to potential structural relaxation in enabled components.

• Ensuring system electrical, thermal, and structural integrity under shock and vibration events. The mechanical requirements of the attach mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attach mechanism. Their design should provide a means for protecting LGA771 socket solder joints as well as preventing package pullout from the socket.

Note: The load applied by the attachment mechanism must comply with the package and

socket specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as identified in Section 2.1.1.

18 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

A potential mechanical solution for heavy heatsinks is the direct attachment of the heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.

The Intel reference design for Quad-Core Intel® Xeon® Processor 5400 Series is using such a heatsink attachment scheme. Refer to Section 2.5 for further information regarding the Intel reference mechanical solution.

2.2 Processor Thermal Parameters and Features

2.2.1 Thermal Control Circuit and TDP

The operating thermal limits of the processor are defined by the Thermal Profile. The intent of the Thermal Profile specification is to support acoustic noise reduction through fan speed control and ensure the long-term reliability of the processor. This specification requires that the temperature at the center of the processor IHS, known as (T

Figure 2-4 shows the measurement location for the Quad-Core Intel® Xeon®

Processor 5400 Series package. Compliance with the T achieve optimal operation and long-term reliability (See the Intel® Xeon® Dual- and Multi- Processor Family Thermal Test Vehicle User's Guide for Case Temperature definition and measurement methods).

Figure 2-4. Processor Case Temperature Measurement Location

) remains within a certain temperature specification. For illustration,

CASE

specification is required to

CASE

To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have been integrated into the silicon of the processor. One feature of the Thermal Monitor is the Thermal Control Circuit (TCC). When active, the TCC lowers the processor temperature by reducing power consumption. This is accomplished through a combination of Thermal Monitor and Advanced Thermal Monitor (TM2). Thermal Monitor modulates the duty cycle of the internal processor clocks, resulting in a lower effective frequency. When active, the TCC turns the processor clocks off and then back on with a predetermined duty cycle. Thermal Monitor 2 activation adjusts both the

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 19

Thermal/Mechanical Reference Design

processor operating frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for further details on TM and TM2.

PROCHOT# is designed to assert at or a few degrees higher than maximum T

CASE

(as specified by the thermal profile) when dissipating TDP power, and can not be interpreted as an indication of processor case temperature. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to ensure the Thermal Control Circuit is not activated below maximum T

CASE

when dissipating TDP power. There is no defined or fixed correlation between the PROCHOT# assertion temperature and the case temperature. However, with the introduction of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5400 Series, the DTS reports a relative offset below the PROCHOT# assertion (see Section 2.2.2 for more details on the Digital Thermal Sensor). Thermal solutions must be designed to the processor specifications (i.e Thermal Profile) and can not be adjusted based on experimental measurements of T

, PROCHOT#, or Digital Thermal Sensor on

CASE

random processor samples.

By taking advantage of the Thermal Monitor features, system designers may reduce thermal solution cost by designing to the Thermal Design Power (TDP) instead of maximum power. TDP should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is based on measurements of processor power consumption while running various high power applications. This data set is used to determine those applications that are interesting from a power perspective. These applications are then evaluated in a controlled thermal environment to determine their sensitivity to activation of the thermal control circuit. This data set is then used to derive the TDP targets published in the processors datasheet. The Thermal Monitor can protect the processors in rare workload excursions above TDP. Therefore, thermal solutions should be designed to dissipate this target power level. The thermal management logic and thermal monitor features are discussed in extensive detail in the Quad-Core Intel® Xeon® Processor 5400 Series

Datasheet.

In addition, on-die thermal management features called THERMTRIP# and FORCEPR# are available on the Quad-Core Intel® Xeon® Processor 5400 Series. They provide a thermal management approach to support the continued increases in processor frequency and performance. Please see the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for guidance on these thermal management features.

2.2.2 Digital Thermal Sensor

The Quad-Core Intel® Xeon® Processor 5400 Series include on-die temperature sensor feature called Digital Thermal Sensor (DTS). The DTS uses the same sensor utilized for TCC activation. Each individual processor is calibrated so that TCC activation occurs at a DTS value of 0. The temperature reported by the DTS is the relative offset in PECI counts below the onset of the TCC activation and hence is negative. Changes in PECI counts are roughly linear in relation to temperature changes in degrees Celsius. For example, a change in PECI count by '1' represents a change in temperature of approximately 1°C. However, this linearity cannot be guaranteed as the offset below TCC activation exceeds 20-30 PECI counts. Also note that the DTS will not report any values above the TCC activation temperature, it will simply return 0 in this case.

The DTS facilitates the use of multiple thermal sensors within the processor without the burden of increasing the number of thermal sensor signal pins on the processor package. Operation of multiple DTS will be discussed in more detail in Section 2.2.4. Also, the DTS utilizes thermal sensors that are optimally located when compared with thermal diodes available with legacy processors. This is achieved as a result of a

20 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

smaller foot print and decreased sensitivity to noise. These DTS benefits will result in more accurate fan speed control and TCC activation.The DTS application in fan speed control will be discussed in more detail in Section 2.4.1.

2.2.3 Platform Environmental Control Interface (PECI)

The PECI interface is designed specifically to convey system management information from the processor (initially, only thermal data from the Digital Thermal Sensor). It is a proprietary single wire bus between the processor and the chipset or other health monitoring device. The PECI specification provides a specific command set to discover, enumerate devices, and read the temperature. For an overview of the PECI interface, please refer to PECI Feature Set Overview. For more detailed information on PECI, please refer to Platform Environment Control Interface (PECI) Specification and Quad-

Core Intel® Xeon® Processor 5400 Series Datasheet.

2.2.4 Multiple Core Special Considerations

2.2.4.1 Multiple Digital Thermal Sensor Operation

Each Quad-Core Intel® Xeon® Processor 5400 Series can have multiple Digital Thermal Sensors located on the die. Each die within the processor currently maps to a PECI domain. The Quad-Core Intel® Xeon® Processor 5400 Series contains two cores per die (domain) and two domains (die) per socket. BIOS will be responsible for detecting the proper processor type and providing the number of domains to the thermal management system. An external PECI device that is part of the thermal management system polls the processor domains for temperature information and currently receives the highest of the DTS output temperatures within each domain.

Figure 2-5 provides an illustration of the DTS domains for the Quad-Core Intel® Xeon®

Processor 5400 Series.

Figure 2-5. DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 21

2.2.4.2 Thermal Monitor for Multiple Core Products

Thermal/Mechanical Reference Design

The thermal management for multiple core products has only one T processor. The T

CONTROL

for processor 0 and T

CONTROL

for processor 1 are independent

CONTROL

value per

from each other. If the DTS temperature from any domain within the processor is greater than or equal to T

CONTROL

, the processor case temperature must remain at or below the temperature as specified by the thermal profile. See Section 2.2.6 for information on T

CONTROL

. The PECI signal is available through CPU pin (G5) on each LGA771 socket for the Quad-Core Intel® Xeon® Processor 5400 Series. Through this pin, the two domains provide the current hottest value received from all the temperature sensors, to an external PECI device such as a thermal management system.

2.2.4.3 PROCHOT#, THERMTRIP#, and FORCEPR#

The PROCHOT# and THERMTRIP# outputs will be shared by all cores on a processor. The first core to reach TCC activation will assert PROCHOT#. A single FORCEPR# input will be shared by every core. Tabl e 2- 2 provides an overview of input and output conditions for the Quad-Core Intel® Xeon® Processor 5400 Series thermal management features.

Table 2-2. Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5400

Series Thermal Management Features

Item Processor Input Processor Output

DTS

TM1/TM2

PROCHOT#

Core X > TCC Activation Temperature

DTS

All Cores TCC Activation

PROCHOT# Asserted

Core X > THERMTRIP # Assertion

THERMTRIP#

FORCEPR#

Note:

1. X=1,2,3,4; represents any one of the core1, core2, core3 and core4 in the Quad-Core Intel® Xeon® Processor 5400 Series.

2. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5400

Series Datasheet.

DTS Tem p era t ur e

FORCEPR# Asserted All Cores TCC Activation

THERMTRIP# Asserted,

all cores shut down

2.2.4.4 Heatpipe Orientation for Multiple Core Processors

Thermal management of multiple core processors can be achieved without the use of heatpipe heatsinks, as demonstrated by the Intel Reference Thermal Solution discussed in Section 2.5.

To assist customers interested in designing heatpipe heatsinks, processor core locations have been provided. In some cases, this may influence the designer’s selection of heatpipe orientation. For this purpose, the core geometric center locations, as illustrated in Figure 2-6, are provided in Tab l e 2 - 3 . Dimensions originate from the vertical edge of the IHS nearest to the pin 1 fiducial as shown in Figure 2-6.

22 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-6. Processor Core Geometric Center Locations

Core4

Core4 Core3

Core3

Core2

Core2 Core1

Table 2-3. Processor Core Geometric Center Dimensions

Feature X Dimension Y Dimension

Core 1 18.15 mm 6.15 mm

Core 2 18.15 mm 10.35 mm

Core 3 18.15 mm 18.85 mm

Core 4 18.15 mm 23.05 mm

Core1

X1, X2, X3, X4

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 23

2.2.5 Thermal Profile

The thermal profile is a line that defines the relationship between a processor’s case temperature and its power consumption as shown in Figure 2-7. The equation of the thermal profile is defined as:

Equation 2-1.y = ax + b

Where:

y = Processor case temperature, T x = Processor power consumption (W) a = Case-to-ambient thermal resistance, ΨCA (°C/W) b = Processor local ambient temperature, TLA (°C)

Figure 2-7. Thermal Profile Diagram

CASE

Thermal/Mechanical Reference Design

(°C)

The high end point of the Thermal Profile represents the processor’s TDP and the associated maximum case temperature (T the local ambient temperature at P = 0W. The slope of the Thermal Profile line represents the case-to-ambient resistance of the thermal solution with the y-intercept being the local processor ambient temperature. The slope of the Thermal Profile is constant, which indicates that all frequencies of a processor defined by the Thermal Profile will require the same heatsink case-to-ambient resistance.

In order to satisfy the Thermal Profile specification, a thermal solution must be at or below the Thermal Profile line for the given processor when its DTS temperature is greater than T

CONTROL

customers to make a trade-off between the thermal solution case-to-ambient resistance and the processor local ambient temperature that best suits their platform implementation (refer to Section 2.4.3). There can be multiple combinations of thermal solution case-to-ambient resistance and processor local ambient temperature that can meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient temperature are known for a specific thermal solution, the Thermal Profile of that solution can easily be plotted against the Thermal Profile specification. As explained

24 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

CASE_MAX

) and the lower end point represents

(refer to Section 2.2.6). The Thermal Profile allows the

Thermal/Mechanical Reference Design

above, the case-to-ambient resistance represents the slope of the line and the processor local ambient temperature represents the y-axis intercept. Hence the T

CASE_MAX

determined, the line can be extended to Power (P) = 0W representing the Thermal Profile of the specific solution. If that line stays at or below the Thermal Profile specification, then that particular solution is deemed as a compliant solution.

value of a specific solution can be calculated at TDP. Once this point is

2.2.6 T

T processor T longer absolute. The T activation set point (i.e. PECI Count = 0), as indicated by PROCHOT#. Figure 2-8 depicts the interaction between the T

Figure 2-8. T

CONTROL

Digital Thermal Sensor Temperature

Tcontrol = -5

Definition

can be described as a trigger point for fan speed control implementation. The

CONTROL

Value and Digital Thermal Sensor Value Interaction

value provided by the Digital Thermal Sensor is relative and no

CONTROL

-10

-20

-30

-40

value is now defined as a relative value to the TCC

CONTROL

value and Digital Thermal Sensor value.

Temperature

The value for T individually. For the Quad-Core Intel® Xeon® Processor 5400 Series, the T value is obtained by reading the processor model specific register (IA32_TEMPERATURE_TARGET MSR).

Note: There is no T

The fan speed control device only needs to read the T the DTS value from the PECI interface. The equation for calculating T

Equation 2-2.T

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 25

CONTROL

Where:

OFFSET

CONTROL_BASE

= -T

= A DTS-based value programmed into each processor during

Time

CONTROL

OFFSET

manufacturing that can be obtained by reading the IA32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the RS - Wolfdale Processor Family BIOS Writer’s Guide (BWG) for further details.

is calibrated in manufacturing and configured for each processor

CONTROL

value to sum as previously required on legacy processors.

OFFSET MSR

and compare this to

CONTROL

is:

Thermal/Mechanical Reference Design

Figure 2-9. T

Figure 2-9 depicts the interaction between the Thermal Profile and T

CONTROL

and Thermal Profile Interaction

CONTROL

If the DTS temperature is less than T

CONTROL

, then the case temperature is permitted to exceed the Thermal Profile, but the DTS temperature must remain at or below T

CONTROL

CASE

CASE_MAX

Refer to Section 2.4.1 for the implementation of the T

. The thermal solution for the processor must be able to keep the processor’s

at or below the Thermal Profile when operating between the T

CONTROL

and

at TDP under heavy workload conditions.

CONTROL

value in support of fan

speed control (FSC) design to achieve better acoustic performance.

2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5400 Series

2.2.7.1 Dual Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor

X5400 Series

The Quad-Core Intel® Xeon® Processor X5400 Series is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. Due to certain limitations of such form factors (i.e. airflow, thermal solution height), it is very challenging to meet the thermal requirements of the processor. To mitigate these form factor constraints, Intel has developed a dual Thermal Profile specification, shown in Figure 2-10.

26 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-10. Dual Thermal Profile Diagram

case_max_B

case_max_A

Thermal Profile B

Thermal Profile A

TDP

Power

The Thermal Profile A is based on Intel’s 2U+ air cooling solution. Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activation is observed in the processor. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition. These brief instances of TCC activation are not expected to impact the performance of the processor. A worst case real world application is defined as a commercially available, useful application which dissipates a power equal to, or above, the TDP for a thermally relevant timeframe. One example of a worst-case thermal condition is when a processor local ambient temperature is at or above 42.8°C for Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A.

Thermal Profile B supports volumetrically constrained platforms (i.e. 1U, blades, etc.), and is based on Intel’s 1U air cooling solution. Because of the reduced capability represented by such thermal solutions, designing to Thermal Profile B results in an increased probability of TCC activation and an associated measurable performance loss. Measurable performance loss is defined to be any degradation in the processor’s performance greater than 1.5%. The 1.5% number is chosen as the baseline since the run-to-run variation in a given performance benchmark is typically between 1 and 2%.

Although designing to Thermal Profile B results in increased T compared to Thermal Profile A at a given power level, both of these Thermal Profiles ensure that Intel’s long-term processor reliability requirements are satisfied. In other words, designing to Thermal Profile B does not impose any additional risk to Intel’s long-term reliability requirements. Thermal solutions that exceed Thermal Profile B specification are considered incompliant and will adversely affect the long-term reliability of the processor.

temperatures

CASE

TDP

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 27

Thermal/Mechanical Reference Design

Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or

Section 2.2.8 for the Thermal Profile A and Thermal Profile B specifications. Section 2.5

of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A and Thermal Profile B respectively.

2.2.7.2 Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor

E5400/X5482 Series

The Quad-Core Intel® Xeon® Processor E5400 Series is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. The Quad-Core Intel® Xeon® Processor X5482 is designed to go into volumetrically unconstrained workstation platforms only. Intel has developed single thermal profile for E5400/X5482 Series.

Designing to the Thermal Profile ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activation is observed in the processor. It is expected that TCC would only be activated for very brief periods of time when running a worstcase real world application in a worst-case thermal condition. These brief instances of TCC activation are not expected to impact the performance of the processor. A worst case real world application is defined as a commercially available, useful application which dissipates a power equal to, or above, the TDP for a thermally relevant timeframe. One example of a worst-case thermal condition is when a processor local ambient temperature is at or above 43.2°C for Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile.

Thermal solutions that exceed the Thermal Profile specification are considered incompliant and will adversely affect the long-term reliability of the processor.

Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or

Section 2.2.8 for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

specifications. Section 2.5 and Appendix A of this document provide details on 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile.

2.2.8 Performance Targets

The Thermal Profile specifications for this processor are published in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet. These Thermal Profile specifications

are shown as a reference in the subsequent discussions.

28 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-11. Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series

Notes:

1. The The thermal specifications shown in this graph are for Quad-Core Intel® Xeon® Processor X5400 Series except the Quad-Core Intel® Xeon® Processor X5482 sku.

2. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the datasheet supersedes any data in this figure.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 29

Thermal/Mechanical Reference Design

Figure 2-12. Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series

Note: The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel®

Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications. In case of conflict, the

data information in the datasheet supersedes any data in this figure.

30 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series

Thermal Profile (2U)

Tcase [C]

Thermal P r ofile Y = 0.187*x + 35

0 102030405060708090100110120130140150

Pow er [W]

Ta b le 2 - 4 and Ta bl e 2- 5 describe the thermal performance target for the Quad-Core

Intel® Xeon® Processor 5400 Series cooling solution enabled by Intel.

Table 2-4. Intel Reference Heatsink Performance Targets for the Quad-Core Intel®

Xeon® Processor X5400 Series

Parameter Maximum Unit Notes

Altitude Sea-level m Heatsink designed at 0 meters

TDP 120 W

CASE_MAX_A

Airflow 27

Pressure Drop 0.182

CASE_MAX_B

Airflow 15

Pressure Drop 0.331

40 °C

2U+ CEK, Thermal Profile A

63 °C

CFM

45.9

45.3

0.187 °C/W Mean + 3σ

1U CEK, Thermal Profile B

70 °C

25.5

82.4

0.246 °C/W Mean + 3σ

/ hr

Inches of H

CFM

/ hr

Inches of H

Airflow through the heatsink fins

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 31

Thermal/Mechanical Reference Design

Table 2-5. Intel Reference Heatsink Performance Targets for the Quad-Core Intel®

Xeon® Processor E5400 Series

Parameter Maximum Unit Notes

Altitude Sea-Level m Heatsink designed at 0 meters

TDP

40 °C

80 W

1U CEK

CASE_MAX

Airflow

Pressure Drop

CASE_MAX

Airflow

Pressure Drop

67 °C

25.5

0.331

82.4

0.246 °C/W Mean + 3σ

1U Alternative Heatsink

67 °C

25.5

0.331

82.4

0.331 °C/W Mean + 3σ

CFM

/ hr

Inches of H

CFM

/ hr

Inches of H

Airflow through the heatsink fins

Note: Intel does not enable reference heatsink for the Quad-Core Intel® Xeon®

Processor X5482 with 150W TDP. The Intel 2U CEK is capable of meeting the thermal specification when local ambient temperature (TLA) is maintained at or below 35°C.

2.3 Fan Fail Guidelines

Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal Profile [Thermal Profile B for Quad-Core Intel® Xeon® Processor X5400 Series] for a duration totaling less than 360 hours per year without affecting long term reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor is expected to control the processor power level as long as conditions do not allow the Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation initially occurred. Under more severe anomalous thermal excursions when the processor temperature cannot be controlled at or below this Tcase level by TCC activation, then data integrity is not assured. At some higher threshold THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to the processor. Thermal Test Vehicles (TTVs) may be used to check anomalous thermal excursion compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max [Tcase_max_B for Quad-Core Intel® Xeon® Processor X5400 Series] at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 80% of the TDP limit for Quad-Core Intel® Xeon® Processor X5400 Series with 120W TDP and 90% of the TDP limit for Quad-Core Intel® Xeon® Processor E5400 Series with 80W TDP.

Note: Fan Failure Guidelines apply only to SKUs which have Thermal Monitor2 enabled.

32 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

2.4 Characterizing Cooling Solution Performance Requirements

2.4.1 Fan Speed Control

Fan speed control (FSC) techniques to reduce system level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determine the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the

of the processor at a given power level. Since the T

CASE

important parameter in the long-term reliability of a processor, the FSC implemented in a system directly correlates to the processor’s ability to meet the Thermal Profile and hence the long-term reliability requirements. For this purpose, the parameter called T

CONTROL

as explained in Section 2.2.6, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system level acoustic noise down. Figure 2-14 depicts the relationship between T methodology.

of a processor is an

CASE

CONTROL

and FSC

Figure 2-14. T

CONTROL

and Fan Speed Control

Once the T

CONTROL

reading from the processor can be compared to this T control scheme can be implemented as described in Tabl e 2 - 6 without compromising the long-term reliability of the processor.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 33

value is determined as explained earlier, the DTS temperature

CONTROL

value. A fan speed

Thermal/Mechanical Reference Design

Table 2-6. Fan Speed Control, T

Condition FSC Scheme

DTS ≤ T

CONTROL

DTS >T

CONTROL

FSC can adjust fan speed to maintain DTS ≤ T

FSC should adjust fan speed to keep T specification (increased acoustic region).

and DTS Relationship

CASE

(low acoustic region).

CONTROL

at or below the Thermal Profile

There are many different ways of implementing fan speed control, including FSC based on processor ambient temperature, FSC based on processor Digital Thermal Sensor (DTS) temperature or a combination of the two. If FSC is based only on the processor ambient temperature, low acoustic targets can be achieved under low ambient temperature conditions. However, the acoustics cannot be optimized based on the behavior of the processor temperature. If FSC is based only on the Digital Thermal Sensor, sustained temperatures above T

CONTROL

drives fans to maximum RPM. If FSC is based both on ambient and Digital Thermal Sensor, ambient temperature can be used to scale the fan RPM controlled by the Digital Thermal Sensor. This would result in an optimal acoustic performance. Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the T

CONTOL

value for a given processor.

2.4.2 Processor Thermal Characterization Parameter Relationships

The idea of a “thermal characterization parameter”, Ψ (psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical conditions (heating source, local ambient conditions). A thermal characterization parameter is convenient in that it is calculated using total package power, whereas actual thermal resistance, θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heatsink is difficult, since some of the power is dissipated via heat transfer into the socket and board. Be aware, however, of the limitations of lumped parameters such as Ψ when it comes to a real design. Heat transfer is a three-dimensional phenomenon that can rarely be accurately and easily modeled by lump values.

The case-to-local ambient thermal characterization parameter value (Ψ measure of the thermal performance of the overall thermal solution that is attached to the processor package. It is defined by the following equation, and measured in units of °C/W:

Equation 2-3.Ψ

= (T

CASE

- TLA) /

Where:

T T

= Case-to-local ambient thermal characterization parameter (°C/W).

= Processor case temperature (°C).

CASE

= Local ambient temperature in chassis at processor (°C).

TDP = TDP dissipation (W) (assumes all power dissipates through the

34 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

TDP

integrated heat spreader (IHS)).

) is used as a

Thermal/Mechanical Reference Design

The case-to-local ambient thermal characterization parameter of the processor, ΨCA, is comprised of ΨCS, the TIM thermal characterization parameter, and of ΨSA, the sink-tolocal ambient thermal characterization parameter:

Equation 2-4.Ψ

= ΨCS + ΨSA

Where:

= Thermal characterization parameter of the TIM (°C/W).

= Thermal characterization parameter from heatsink-to-local ambient

(°C/W).

is strongly dependent on the thermal conductivity and thickness of the TIM

between the heatsink and IHS.

is a measure of the thermal characterization parameter from the bottom of the

heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heatsink.

Figure 2-15 illustrates the combination of the different thermal characterization

parameters.

Figure 2-15. Processor Thermal Characterization Parameter Relationships

2.4.2.1 Example

The cooling performance, Ψ characterization parameter described above:

• Define a target case temperature T processor datasheet.

• Define a target local ambient temperature at the processor, TLA.

The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 35

is then defined using the principle of thermal

CA,

CASE_MAX

and corresponding TDP, given in the

Thermal/Mechanical Reference Design

Assume the datasheet TDP is 85 W and the case temperature specification is 68 °C. Assume as well that the system airflow has been designed such that the local processor ambient temperature is 45°C. Then the following could be calculated using equation (2-3) from above:

Equation 2-5.Ψ

= (T

– TLA) / TDP = (68 – 45) / 85 = 0.27 °C/W

CASE

To determine the required heatsink performance, a heatsink solution provider would need to determine Ψ

performance for the selected TIM and mechanical load

configuration. If the heatsink solution was designed to work with a TIM material performing at ΨCS ≤ 0.05 °C/W, solving for equation (2-4) from above, the performance of the heatsink would be:

Equation 2-6.Ψ

= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 °C/W

If the local processor ambient temperature is assumed to be 40°C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance:

Equation 2-7.ΨCA = (T

– TLA) / TDP = (68 – 40) / 85 = 0.33 °C/W

CASE

It is evident from the above calculations that, a reduction in the local processor ambient temperature has a significant positive effect on the case-to-ambient thermal resistance requirement.

2.4.3 Chassis Thermal Design Considerations

2.4.3.1 Chassis Thermal Design Capabilities and Improvements

One of the critical parameters in thermal design is the local ambient temperature assumption of the processor. Keeping the external chassis temperature fixed, internal chassis temperature rise is the only component that can affect the processor local ambient temperature. Every degree gained at the local ambient temperature directly translates into a degree relief in the processor case temperature.

Given the thermal targets for the processor, it is extremely important to optimize the chassis design to minimize the air temperature rise upstream to the processor (T

rise

hence minimizing the processor local ambient temperature.

The heat generated by components within the chassis must be removed to provide an adequate operating environment for both the processor and other system components. Moving air through the chassis brings in air from the external ambient environment and transports the heat generated by the processor and other system components out of the system. The number, size and relative position of fans, vents and other heat generating components determine the chassis thermal performance, and the resulting ambient temperature around the processor. The size and type (passive or active) of the thermal solution and the amount of system airflow can be traded off against each other to meet specific system design constraints. Additional constraints are board layout, spacing, component placement, and structural considerations that limit the thermal solution size.

In addition to passive heatsinks, fan heatsinks and system fans, other solutions exist for cooling integrated circuit devices. For example, ducted blowers, heat pipes and liquid cooling are all capable of dissipating additional heat. Due to their varying attributes, each of these solutions may be appropriate for a particular system implementation.

36 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

To develop a reliable, cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component. In addition, acoustic noise constraints may limit the size, number, placement, and types of fans that can be used in a particular design.

2.5 Thermal/Mechanical Reference Design Considerations

2.5.1 Heatsink Solutions

2.5.1.1 Heatsink Design Considerations

To remove the heat from the processor, three basic parameters should be considered:

• The area of the surface on which the heat transfer takes place - Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is by attaching a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base.

• The conduction path from the heat source to the heatsink fins - Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it. Refer to Section 2.5.2 for further information on the TIM between the IHS and the heatsink base.

• The heat transfer conditions on the surface on which heat transfer takes place - Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air,

, and the local air velocity over the surface. The higher the air velocity over the

surface, the resulting cooling is more efficient. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base.

An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink.

Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface required to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases: it is more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 37

2.5.2 Thermal Interface Material

TIM application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier and allow direct heatsink attach, without the need for a separate TIM dispense or attach process in the final assembly factory.

All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures the entire processor IHS area is covered. It is important to compensate for heatsink-to-processor attach positional alignment when selecting the proper TIM size.

When pre-applied material is used, it is recommended to have a protective application tape over it. This tape must be removed prior to heatsink installation.

The TIM performance is susceptible to degradation (i.e. grease breakdown) during the useful life of the processor due to the temperature cycling phenomena. For this reason, the measured T the type of TIM material.

Refer to Section 2.5.7.2 for information on the TIM used in the Intel reference heatsink solution.

value of a given processor can decrease over time depending on

CASE

Thermal/Mechanical Reference Design

2.5.3 Summary

In summary, considerations in heatsink design include:

• The local ambient temperature T dissipated by the processor, and the corresponding maximum T These parameters are usually combined in a single lump cooling performance parameter, ΨCA (case to air thermal characterization parameter). More information on the definition and the use of Ψ

• Heatsink interface (to IHS) surface characteristics, including flatness and roughness.

• The performance of the TIM used between the heatsink and the IHS.

• Surface area of the heatsink.

• Heatsink material and technology.

• Development of airflow entering and within the heatsink area.

• Physical volumetric constraints placed by the system.

• Integrated package/socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide.

at the heatsink, airflow (CFM), the power being

is given in Section 2.5 and Section 2.4.2.

temperature.

CASE

38 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design

The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the following components:

• Heatsink (with captive standoff and screws)

• Thermal Interface Material (TIM)

•CEK Spring

2.5.4.1 Geometric Envelope

The baseboard keepout zones on the primary and secondary sides and height restrictions under the enabling component region are shown in detail in Appendix B. The overall volumetric keep in zone encapsulates the processor, socket, and the entire thermal/mechanical enabling solution.

2.5.4.2 Assembly Drawing

Figure 2-16. Exploded View of CEK Thermal Solution Components

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 39

Thermal/Mechanical Reference Design

The CEK reference thermal solution is designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limits by using a load path directly attached to the chassis pan. The CEK spring on the secondary side of the baseboard provides the necessary compressive load for the thermal interface material. The baseboard is intended to be isolated such that the dynamic loads from the heatsink are transferred to the chassis pan via the stiff screws and standoffs. This reduces the risk of package pullout and solder-joint failures.

Using the CEK reference thermal solution, Intel recommends that the maximum outside diameter dimension of the chassis pan standoffs, regardless of shape, that interfaces with the CEK spring on the secondary side of the baseboard and captive screws on the primary side of the baseboard to attach the heatsink to the chassis pan should be no larger than 7.112 mm [0.28 in.]. For example, circular standoffs should be no larger than 7.112 mm [0.28 in.] point-to-point.

The baseboard mounting holes for the CEK solution are at the same location as the hole locations used for previous Intel

Xeon® processor thermal solution. However, CEK assembly requires 10.16 mm [0.400 in.] large diameter holes to compensate for the CEK spring embosses.

The CEK solution is designed and optimized for a baseboard thickness range of 1.57 –

2.31 mm [0.062-0.093 in]. While the same CEK spring can be used for this board thickness range, the heatsink standoff height is different for a 1.57 mm [0.062 in] thick board than it is for a 2.31 mm [0.093 in] thick board. In the heatsink assembly, the standoff protrusion from the base of the heatsink needs to be 0.6 mm [0.024 in] longer for a 2.31 mm [0.093 in] thick board, compared to a 1.57 mm [0.062 in] thick board. If this solution is intended to be used on baseboards that fall outside of this range, then some aspects of the design, including but not limited to the CEK spring design and the standoff heights, may need to change. Therefore, system designers need to evaluate the thermal performance and mechanical behavior of the CEK design on baseboards with different thicknesses.

Refer to Appendix B for drawings of the heatsinks and CEK spring. The screws and standoffs are standard components that are made captive to the heatsink for ease of handling and assembly.

Contact your Intel field sales representative for an electronic version of mechanical and thermal models of the CEK (Pro/Engineer*, IGES and Icepak*, Flotherm* formats). Pro/Engineer, Icepak and Flotherm models are available on Intel Business Link (IBL).

Note: Intel reserves the right to make changes and modifications to the design as necessary.

Note: The thermal mechanical reference design for the Quad-Core Intel® Xeon® Processor

5400 Series was verified according to the Intel validation criteria given in Appendix E.1. Any thermal mechanical design using some of the reference components in combination with any other thermal mechanical solution needs to be fully validated according to the customer criteria. Also, if customer thermal mechanical validation criteria differ from the Intel criteria, the reference solution should be validated against the customer criteria.

2.5.4.3 Structural Considerations of CEK

As Intel explores methods of keeping thermal solutions within the air-cooling space, the mass of the thermal solutions is increasing. Due to the flexible nature (and associated large deformation) of baseboard-only attachments, Intel reference solutions, such as

40 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

CEK, are now commonly using direct chassis attach (DCA) as the mechanical retention design. The mass of the new thermal solutions is large enough to require consideration for structural support and stiffening on the chassis.

2.5.5 Thermal Solution Performance Characteristics

Figure 2-17 and Figure 2-18 show the performance of the 2U+ and 1U passive

heatsinks, respectively. These figures show the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided. The best-fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph.

Figure 2-17. 2U+ CEK Heatsink Thermal Performance

If other custom heatsinks are intended for use with the Quad-Core Intel® Xeon® Processor 5400 Series, they must support the following interface control requirements to be compatible with the reference mechanical components:

• Requirement 1: Heatsink assembly must stay within the volumetric keep-in.

• Requirement 2: Maximum mass and center of gravity.

Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of gravity 3.81 cm [1.5 in.] above the bottom of the heatsink base.

• Requirement 3: Maximum and minimum compressive load.

Any custom thermal solution design must meet the loading specification as documented within this document, and should refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet and LGA771 Socket Mechanical Design Guide for specific details on package/socket loading specifications.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 41

Figure 2-18. 1U CEK Heatsink Thermal Performance

Thermal/Mechanical Reference Design

2.5.6 Thermal Profile Adherence

The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor 5400 Series. From Tabl e 2- 4 , the threesigma (mean+3sigma) performance of the thermal solution is computed to be 0.187 °C/W and the processor local ambient temperature (T °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation 2-8.y = 0.187*X + 40

where,

y = Processor T x = Processor power value (W)

Figure 2-19 below shows the comparison of this reference thermal solution’s Thermal

Profile to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile A specification. The 2U+ CEK solution meets the Thermal Profile A with a 0.6°C margin at the upper end (TDP). By designing to Thermal Profile A, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.

value (°C)

CASE

) for this thermal solution is 40

42 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Temper

atu

re(

Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile A

CASE_MAX_B

@ TDP

) C

05101520 25 30 35 40 45 50 55 60 65 70 75 80

The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5400 Series. From Tabl e 2 - 7 the threesigma (mean+3sigma) performance of the thermal solution is computed to be

0.246°C/W and the processor local ambient temperature (T is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation 2-9.y = 0.246*X + 40

where,

y = Processor T x = Processor power value (W)

Thermal Profile A

Y = 0.168 * X + 42.8

value (°C)

CASE

2U C EK R eference Solution

Y = 0.187 * X + 40

Power (W)

) for this thermal solution

90 100 110

120

TDP

Figure 2-20 below shows the comparison of this reference thermal solution’s Thermal

Profile to the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile B with 0.5°C margin at the upper end (TDP). However, as explained in Section 2.2.7, designing to Thermal Profile B results in increased TCC activation and measurable performance loss for the processor.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 43

Thermal/Mechanical Reference Design

Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

Series Thermal Profile B

CASE_MAX_B

@ TDP

Thermal Profile B

) C

Y = 0.221 * X + 43.5

1U CE K Reference Solution

Y = 0.246 * X + 40

Temp erature (

05101520 25 30 35 40 45 50 55 60 65 70 75 80

Power (W)

90 100 110

120

TDP

The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the Quad-Core Intel® Xeon® Processor E5400 Series. From Ta b le 2- 7 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246 °C/W and the processor local ambient temperature (T

) for this thermal

solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation 2-10.y = 0.246*X + 40

where,

y = Processor T

value (°C)

CASE

x = Processor power value (W)

Figure 2-21 below shows the comparison of this reference thermal solution’s Thermal

Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.

44 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400

Series Thermal Profile

CASE_MAX

@ TDP

Thermal Profile

Y = 0.298 * X + 43.2

)

1U CEK Reference Solution

Tcase (

0510

20 25 30 35 40

Y = 0.246 * X + 40

60 65 70 75 80

Note: Intel has also developed an 1U alternative reference heatsink design. This

alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings. Refer to Appendix B for detail information.

2.5.7 Components Overview

2.5.7.1 Heatsink with Captive Screws and Standoffs

The CEK reference heatsink uses snapped-fin technology for its design. It consists of a copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The mounting screws and standoffs are also made captive to the heatsink base for ease of handling and assembly as shown in Figure 2-22 and Figure 2-23 for the 2U+ and 1U heatsinks, respectively.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 45

Figure 2-22. Isometric View of the 2U+ CEK Heatsink

Thermal/Mechanical Reference Design

Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.

Figure 2-23. Isometric View of the 1U CEK Heatsink

Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.

The function of the standoffs is to provide a bridge between the chassis and the heatsink for attaching and load carrying. When assembled, the heatsink is rigid against the top of the standoff, and the standoff is rigid to a chassis standoff with the CEK spring firmly sandwiched between the two. In dynamic loading situations the standoff carries much of the heatsink load, especially in lateral conditions, when compared to the amount of load transmitted to the processor package. As such, it is comprised of steel. The distance from the bottom of the heatsink to the bottom of the standoff is

8.79 mm [0.346 in.] for a board thickness of 1.57 mm [0.062 in]. The standoff will need to be modified for use in applications with a different board thickness, as defined in Section 2.5.4.2.

The function of the screw is to provide a rigid attach method to sandwich the entire CEK assembly together, activating the CEK spring under the baseboard, and thus providing the TIM preload. A screw is an inexpensive, low profile solution that does not negatively impact the thermal performance of the heatsink due to air blockage. Any fastener (i.e. head configuration) can be used as long as it is of steel construction; the head does not interfere with the heatsink fins, and is of the correct length of 20.64 mm [0.8125 in.].

46 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Although the CEK heatsink fits into the legacy volumetric keep-in, it has a larger footprint due to the elimination of retention mechanism and clips used in the older enabled thermal/mechanical components. This allows the heatsink to grow its base and fin dimensions, further improving the thermal performance. A drawback of this enlarged size and use of copper for both the base and fins is the increased weight of the heatsink. The retention scheme employed by CEK is designed to support heavy heatsinks (approximately up to 1000 grams) in cases of shock, vibration and installation as explained in Appendix E. Some of the thermal and mechanical characteristics of the CEK heatsinks are shown in Ta b le 2-7 .

Table 2-7. CEK Heatsink Thermal Mechanical Characteristics

Size

2U+ 50.80 [2.00] 1.0 [2.2] 45.9 [27] 0.177 0.0033 45.3 [0.182]

1U 27.00 [1.06] 0.53 [1.2] 25.5 [15] 0.240 0.0023 82.4 [0.331]

Height Weight

(mm) [in.] (kg) [lbs]

Target

Airflow

Through Fins

/hr)

[CFM]

Mean Ψ

(°C/W) (°C/W) (Pa) [in H

2.5.7.2 Thermal Interface Material (TIM)

A TIM must be applied between the package and the heatsink to ensure thermal conduction. The CEK reference design uses Shin-Etsu G751 thermal grease.

The recommended grease dispense weight to ensure full coverage of the processor IHS is given below. For an alternate TIM, full coverage of the entire processor IHS is recommended.

Table 2-8. Recommended Thermal Grease Dispense Weight

Processor Minimum Maximum Units Notes

TIM Dispense weight 400 mg Shin-Etsu* G751. Dispense

TIM loading provided

by CEK

It is recommended that you use thermally conductive grease. Thermally conductive grease requires special handling and dispense guidelines. The following guidelines apply to Shin-Etsu G751 thermal grease. For guidance with your specific application, please contact the vendor. Vendor information is provided in Appendix F. The use of a semi-automatic dispensing system is recommended for high volume assembly to ensure an accurate amount of grease is dispensed on top of the IHS prior to assembly of the heatsink. A typical dispense system consists of an air pressure and timing controller, a hand held output dispenser, and an actuation foot switch. Thermal grease in cartridge form is required for dispense system compatibility. A precision scale with an accuracy of ±5 mg is recommended to measure the correct dispense weight and set the corresponding air pressure and duration. The IHS surface should be free of foreign materials prior to grease dispense.

18 80

133

lbf

Deviation Ψ

Standard

weight is an approximate target.

Generated by the CEK.

Pressure Drop

Additional recommendations include recalibrating the dispense controller settings after any two hour pause in grease dispense. The grease should be dispensed just prior to heatsink assembly to prevent any degradation in material performance. Finally, the thermal grease should be verified to be within its recommended shelf life before use.

The CEK reference solution is designed to apply a compressive load of up to 133 N [30 lbf] on the TIM to improve the thermal performance.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 47

2.5.7.3 CEK Spring

The CEK spring, which is attached on the secondary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has four embosses which, when assembled, rest on the top of the chassis standoffs. The CEK spring is located between the chassis standoffs and the heatsink standoffs. The purpose of the CEK spring is to provide compressive preload at the TIM interface when the baseboard is pushed down upon it. This spring does not function as a clip of any kind. The two tabs on the spring are used to provide the necessary compressive preload for the TIM when the whole solution is assembled. The tabs make contact on the secondary side of the baseboard. In order to avoid damage to the contact locations on the baseboard, the tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent).

Figure 2-24 shows an isometric view of the CEK spring design.

Figure 2-24. CEK Spring Isometric View

Thermal/Mechanical Reference Design

Figure 2-25. Isometric View of CEK Spring Attachment to the Base Board

Please refer to Appendix B for more detailed mechanical drawings of the CEK spring. Also, the baseboard keepout requirements shown in Appendix B must be met to use this CEK spring design.

48 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Secondary

Primary

Thermal/Mechanical Reference Design

2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5400 Series. This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue. This active heatsink solution consists of a 4 wire PWM fan and a 1U passive heatsink compatible with 1U form factors both mechanically and thermally. These solutions are intended for system integrators who build systems from components available through distribution channels. The retention solution used for these products is called the CEK. The CEK base is compatible with all the heatsink solutions.

Figure 2-26 provides a representation of the active CEK solution. This design is based

on a 4-pin PWM PECI/DTS controlled active fan heatsink solution. PWM (Pulse Width Modulation also synonymous with Pulse Duration Modulation PDM) is a modulation in which the duration of pulse is varied in accordance with some characteristic of the modulating signal. This solution is being offered to help provide better control over pedestal chassis acoustics. This is achieved though accurate measurement of processor temperature through the processor’s Digital Thermal Sensor (DTS) temperature. Fan RPM is modulated through the use of an ASIC (Application Specific Integrated Circuit) located on the serverboard, that sends out a PWM control signal to the 4 connector labeled as Control.

pin of the

This heatsink solution also requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control. If no PWM signal is detected on

the 4

pin this heatsink solution will revert back to thermistor control mode,

supporting both the 4-wire PWM and standard 3-wire ambient air control methods.

The active heatsink solution will not exceed a mass of approximately 1050 grams. Note that this is per processor, so a dual processor system will have up to approximately 2100 grams total mass in the heatsinks. This large mass will require a minimum chassis stiffness to be met in order to withstand force during shock and vibration.

Figure 2-26. Boxed Active CEK Heatsink Solutions with PWM/DTS Control

(Representation Only)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 49

Clearance is required around the heatsink to ensure unimpeded airflow for proper cooling. The physical baseboard keepout requirements for the active solution are the same as the passive CEK solution shown in Appendix B. Refer to Figure B-18 through

Figure B-20 for additional details on the active CEK thermal solution volumetrics.

2.5.8.1 Fan Power Supply

The active heatsink includes a fan, which requires a +12 V power supply. Platforms must provide a matched fan power header to support the boxed processor. Tab l e 2 - 9 contains specifications for the input and output signals at the heatsink fan connector.

The fan outputs a SENSE signal, an open-collector output, which pulses at a rate of two pulses per fan revolution. A baseboard pull-up resistor provides VCC to match the baseboard-mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND.

Thermal/Mechanical Reference Design

It is recommended that a 4 pin fan header be used on the baseboard, in addition to, a control ASIC that can send a PWM signal to the active fan heatsink solution on the 4 pin, at a nominal 25 KHz frequency. If a 3-pin CPU fan header is used instead, the active fan heatsink solution will revert back to an automatic ambient air temperature control mode.

The fan power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The fan power header identification and location must be documented in the supplier’s platform documentation, or on the baseboard itself. The baseboard fan power header should be positioned within 177.8 mm [7 in.] from the center of the processor socket.

Table 2-9. Fan Specifications (Boxed 4-wire PWM/DTS Heatsink Solution)

Description Min

+12V: 12 Volt Fan Power

Supply

IC: Fan Current Draw N/A 1.25 1.5 1.5 A

SENSE: SENSE Frequency 2 2 2 2 Pulses per fan revolution 1

Note: System board should pull this pin up to VCC with a resistor.

10.8 12 12 13.2 V

Typ

Steady

Max

Steady

Max

Startup

Unit Notes

Figure 2-27. Fan Cable Connection (Active CEK)

50 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Thermal/Mechanical Reference Design

Table 2-10. Fan Cable Connector Pin Out (Active CEK)

Pin Number Signal Color

1 Ground (Constant) Black

2 Power (+12V) Yellow

3 Signal: 2 pulses per revolution Green

4 Control 21KHz - 28KHz Blue

2.5.8.2 Systems Considerations Associated with the Active CEK

This heatsink was designed to help pedestal chassis users to meet the processor thermal requirements without the use of chassis ducting. It may be necessary to implement some form of chassis air guide or air duct to meet the T 40 °C depending on the pedestal chassis layout. Also, while the active heatsink solution is designed to mechanically fit into a 2U chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the heatsink fan. Therefore, additional design criteria may need to be considered if this heatsink is used in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the inlet to the fan heatsink.

Thermal Profile A should be used to help determine the thermal performance of the platform. The primary recommended control method for this solution is using pulse width modulation control. This control method requires the motherboard provide the correct PWM duty cycle to the active fan heatsink solution to properly follow the thermal profile. If no PWM signal is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will automatically adjust fan RPM to meet the thermal profile.

temperature of

It is critical to supply a constant +12 V to the fan header so that the active CEK heatsink solution can operate properly. If a system board has a jumper setting to select either a constant +12 V power to the fan header or a variable voltage, it is strongly recommended that the jumper be set by default to the constant +12 V setting.

It is recommended that the ambient air temperature outside of the chassis be kept at or below 35 °C. The air passing directly over the processor heatsink should not be preheated by other system components. Meeting the processor’s temperature specification is the responsibility of the system integrator.

2.5.8.3 Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and vibration, due to the weight of the heatsink required to cool the processor. The board must not bend beyond specification in order to avoid damage. The boxed processor contains the components necessary to solve both issues. The boxed processor will include the following items:

• Quad-Core Intel® Xeon® Processor 5400 Series

• Unattached heatsink solution

• 4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink)

• Thermal Interface Material (pre-applied on heatsink)

• Installation Manual

•Intel Inside

logo

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 51

Thermal/Mechanical Reference Design

The other items listed in Figure 2-16 that are required to complete this solution will be shipped with either the chassis or boards. They are as follows:

• CEK Spring (supplied by baseboard vendors)

• Heatsink standoffs (supplied by chassis vendors)

52 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

1U Alternative Heatsink Thermal/Mechanical Design

A1U Alternative Heatsink

Thermal/Mechanical Design

Intel has also developed an 1U alternative reference heatsink design for the volumetrically constrained form factor and targeted for the rack-optimized and ultra dense SKUs. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink.

This section describes the alternative heatsink thermal performance and adherence to Quad-Core Intel® Xeon® Processor E5400 Series thermal profile specifications.

A.1 Component Overview

The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive standoff/screws, Thermal Interface Material (TIM) and Spring.

Figure A-1 shows the isometric view of the 1U alternative heatsink.

Figure A-1. Isometric View of the 1U Alternative Heatsink

Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 53

1U Alternative Heatsink Thermal/Mechanical Design

A.2 Thermal Solution Performance Characterics

Figure A-2 shows the performance of the 1U alternative heatsink. This figure shows the

thermal performance and the pressure drop through fins of the heatsink versus the airflow provided. The best-fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph.

Figure A-2. 1U Alternative Heatsink Thermal Performance

Table A-1. 1U Alternative Heatsink Thermal Mechanical Characteristics

Size

1U 27.00

Height Weight Target Airflow

(mm) [in.] (kg) [lbs] (m

[1.06]

Mean Ψ

Through Fins

/hr) [CFM] (°C/W) (°C/W)

0.24 [0.53] 25.5 [15] 0.305 0.0087 85 [0.34]

Standard

Deviation Ψ

Pressure

Drop

(Pa) [in

A.3 Thermal Profile Adherence

The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. From Tab le A- 1 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.331 °C/W and the processor local ambient temperature

) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this

thermal solution is calculated as:

Equation A-1. y = 0.331*x + 40

where,

y = Processor T

54 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

value (°C)

CASE

1U Alternative Heatsink Thermal/Mechanical Design

x = Processor power value (W)

Figure A-3 below shows the comparison of this reference thermal solution’s Thermal

Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.

Figure A-3. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®

Processor L5400 Series Thermal Profile

)

Tcase (

0510

CASE_MAX

@ TDP

Y = 0.298 * X + 43.2

20 25 30 35 40

Thermal Profile

1U Alternative Heatsink

Y = 0.331 * X + 40

60 65 70 75 80

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 55

1U Alternative Heatsink Thermal/Mechanical Design

56 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

B Mechanical Drawings

The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series.

Note: Intel reserves the right to make changes and modifications to the design as necessary.

Table B-1. Mechanical Drawing List

Drawing Description Figure Number

“2U CEK Heatsink (Sheet 1 of 4)” Figure B-1

“2U CEK Heatsink (Sheet 2 of 4)” Figure B-2

“2U CEK Heatsink (Sheet 3 of 4)” Figure B-3

“2U CEK Heatsink (Sheet 4 of 4)” Figure B-4

“CEK Spring (Sheet 1 of 3)” Figure B-5

“CEK Spring (Sheet 2 of 3)” Figure B-6

“CEK Spring (Sheet 3 of 3)” Figure B-7

“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)”

“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6)”

“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6)”

“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6)”

“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6)”

“Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6)”

“1U CEK Heatsink (Sheet 1 of 4)” Figure B-14

“1U CEK Heatsink (Sheet 2 of 4)” Figure B-15

“1U CEK Heatsink (Sheet 3 of 4)” Figure B-16

“1U CEK Heatsink (Sheet 4 of 4)” Figure B-17

“Active CEK Thermal Solution Volumetric (Sheet 1 of 3)” Figure B-18

“Active CEK Thermal Solution Volumetric (Sheet 2 of 3)” Figure B-19

“Active CEK Thermal Solution Volumetric (Sheet 3 of 3)” Figure B-20

“1U Alternative Heatsink (1 of 4)” Figure B-21

“1U Alternative Heatsink (2 of 4)” Figure B-22

“1U Alternative Heatsink (3 of 4)” Figure B-23

“1U Alternative Heatsink (4 of 4)” Figure B-24

Figure B-8

Figure B-9

Figure B-10

Figure B-11

Figure B-12

Figure B-13

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 57

Figure B-1. 2U CEK Heatsink (Sheet 1 of 4)

Mechanical Drawings

58 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-2. 2U CEK Heatsink (Sheet 2 of 4)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 59

Figure B-3. 2U CEK Heatsink (Sheet 3 of 4)

Mechanical Drawings

60 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-4. 2U CEK Heatsink (Sheet 4 of 4)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 61

Figure B-5. CEK Spring (Sheet 1 of 3)

Mechanical Drawings

62 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-6. CEK Spring (Sheet 2 of 3)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 63

Figure B-7. CEK Spring (Sheet 3 of 3)

Mechanical Drawings

64 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-8. Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 1 of 6)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 65

Mechanical Drawings

Figure B-9. Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 2 of 6)

66 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-10. Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 3 of 6)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 67

Mechanical Drawings

Figure B-11. Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 4 of 6)

68 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-12. Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 5 of 6)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 69

Mechanical Drawings

Figure B-13. Baseboard Keepout Footprint Definition and Height Restrictions for

Enabling Components (Sheet 6 of 6)

70 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-14. 1U CEK Heatsink (Sheet 1 of 4)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 71

Figure B-15. 1U CEK Heatsink (Sheet 2 of 4)

Mechanical Drawings

72 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-16. 1U CEK Heatsink (Sheet 3 of 4)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 73

Figure B-17. 1U CEK Heatsink (Sheet 4 of 4)

Mechanical Drawings

74 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 75

Figure B-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3)

Mechanical Drawings

76 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 77

Figure B-21. 1U Alternative Heatsink (1 of 4)

Mechanical Drawings

78 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-22. 1U Alternative Heatsink (2 of 4)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 79

Figure B-23. 1U Alternative Heatsink (3 of 4)

Mechanical Drawings

80 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Mechanical Drawings

Figure B-24. 1U Alternative Heatsink (4 of 4)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 81

Mechanical Drawings

82 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Heatsink Clip Load Methodology

C Heatsink Clip Load

Methodology

C.1 Overview

This section describes a procedure for measuring the load applied by the heatsink/clip/ fastener assembly on a processor package.

This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example:

• Heatsink preload for the LGA771 socket.

• Quantify preload degradation under bake conditions.

Note: This document reflects the current metrology used by Intel. Intel is continuously

exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate.

C.2 Test Preparation

C.2.1 Heatsink Preparation

Three load cells are assembled into the base of the heatsink under test, in the area interfacing with the processor Integrated Heat Spreader (IHS), using load cells equivalent to those listed in Section C.2.2.

To install the load cells, machine a pocket in the heatsink base, as shown in Figure C-1 and Figure C-2. The load cells should be distributed evenly, as close as possible to the pocket walls. Apply wax around the circumference of each load cell and the surface of the pocket around each cell to maintain the load cells in place during the heatsink installation on the processor and motherboard.

The depth of the pocket depends on the height of the load cell used for the test. It is necessary that the load cells protrude out of the heatsink base. However, this protrusion should be kept minimal, as it will create an additional load offset since the heatsink base is artificially raised. The measurement load offset depends on the whole assembly stiffness (i.e. motherboard, clip, fastener, etc.). For example, the Quad-Core Intel® Xeon® Processor 5400 Series CEK Reference Heatsink Design clip and fasteners assembly have a stiffness of around 160 N/mm [915 lb/in]. If the resulting protrusion is 0.038 mm [0.0015”], then a extra load of 6.08 N [1.37 lb] will be created, and will need to be subtracted from the measured load. Figure C-3 shows an example using the Quad-Core Intel® Xeon® Processor 5400 Series CEK Reference Heatsink designed for the Quad-Core Intel® Xeon® Processor 5400 Series in the 771–land LGA package.

Note: When optimizing the heatsink pocket depth, the variation of the load cell height should

also be taken into account to make sure that all load cells protrude equally from the heatsink base. It may be useful to screen the load cells prior to installation to minimize variation.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 83

Heatsink Clip Load Methodology

Alternate Heatsink Sample Preparation

As just mentioned, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design is:

• Machine the pocket in the heatsink base to a depth such that the tips of the load cells are just flush with the heatsink base.

• Then machine back the heatsink base by around 0.25 mm [0.01”], so that the load cell tips protrude beyond the base.

Proceeding this way, the original stack height of the heatsink assembly should be preserved. This should not affect the stiffness of the heatsink significantly.

Figure C-1. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View

Heatsink Base

Heatsink Base Pocket

Pocket

Diam et er ~

Diam et er ~ 29 mm

29 mm [~1.15”]

[~1.15”]

Package IHS

Package IHS Outline (Top

Outline (Top Surface)

Surface)

Load

Load Cells

Cells

84 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Heatsink Clip Load Methodology

Load Cells (3x)

Preload Fixture (copper core with milled out pocket)

Figure C-2. Load Cell Installation in Machined Heatsink Base Pocket - Side View

Wax to maintain load cell in

Wax to maintain load cell in position during heatsink

Height of

Height of pocket ~ height

pocket ~ height of selected

of selected load cell

load cell

position during heatsink installation

installation

Figure C-3. Preload Test Configuration

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 85

C.2.2 Typical Test Equipment

For the heatsink clip load measurement, use equivalent test equipment to the one listed Ta b le C - 1.

Table C-1. Typical Test Equipment

Item Description Part Number (Model)

Load cell Notes: 1, 5

Data Logger (or scanner)

Notes: 2, 3, 4

Notes:

1. Select load range depending on expected load level. It is usually better, whenever possible, to operate in the high end of the load cell capability. Check with your load cell vendor for further information.

2. Since the load cells are calibrated in terms of mV/V, a data logger or scanner is required to supply 5 volts DC excitation and read the mV response. An automated model will take the sensitivity calibration of the load cells and convert the mV output into pounds.

3. With the test equipment listed above, it is possible to automate data recording and control with a 6101-PCI card (GPIB) added to the scanner, allowing it to be connected to a PC running LabVIEW* or Vishay's StrainSmart* software.

4. IMPORTANT: In addition to just a zeroing of the force reading at no applied load, it is important to calibrate the load cells against known loads. Load cells tend to drift. Contact your load cell vendor for calibration tools and procedure information.

5. When measuring loads under thermal stress (bake for example), load cell thermal capability must be checked, and the test setup must integrate any hardware used along with the load cell. For example, the Model 13 load cells are temperature compensated up to 71 °C, as long as the compensation package (spliced into the load cell's wiring) is also placed in the temperature chamber. The load cells can handle up to 121 °C (operating), but their uncertainty increases according to 0.02% rdg/°F.

Honeywell*-Sensotec* Model 13 subminiature load cells, compression only

Select a load range depending on load level being tested.

www.sensotec.com

Vishay* Measurements Group Model 6100 scanner with a 6010A strain card (one card required per channel).

Heatsink Clip Load Methodology

AL322BL

Model 6100

C.2.3 Test Procedure Examples

The following sections give two examples of load measurement. However, this is not meant to be used in mechanical shock and vibration testing.

Any mechanical device used along with the heatsink attach mechanism will need to be included in the test setup (i.e., back plate, attach to chassis, etc.).

Prior to any test, make sure that the load cell has been calibrated against known loads, following load cell vendor’s instructions.

C.2.4 Time-Zero, Room Temperature Preload Measurement

1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis.

For example: If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism.

2. Install the test vehicle in the socket.

3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Quad-Core Intel® Xeon® Processor 5400 Series CEK-reference heatsink example in Figure C-3, and actuate attach mechanism.

4. Collect continuous load cell data at 1 Hz for the duration of the test. A minimum time to allow the load cell to settle is generally specified by the load cell vendors

86 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Heatsink Clip Load Methodology

(often on the order of 3 minutes). The time zero reading should be taken at the end of this settling time.

5. Record the preload measurement (total from all three load cells) at the target time and average the values over 10 seconds around this target time as well, i.e. in the interval for example over [target time – 5 seconds; target time + 5 seconds].

C.2.5 Preload Degradation under Bake Conditions

This section describes an example of testing for potential clip load degradation under bake conditions.

1. Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example).

2. Repeat time-zero, room temperature preload measurement.

3. Place unit into preheated thermal chamber for specified time.

4. Record continuous load cell data as follows: Sample rate = 0.1 Hz for first 3 hrs Sample rate = 0.01 Hz for the remainder of the bake test

5. Remove assembly from thermal chamber and set into room temperature conditions

6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 87

Heatsink Clip Load Methodology

88 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Safety Requirements

D Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards:

1. UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved.

2. CSA Certification. All mechanical and thermal enabling components must have CSA certification.

3. Heatsink fins must meet the test requirements of UL1439 for sharp edges.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 89

Safety Requirements

90 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Quality and Reliability Requirements

E Quality and Reliability

Requirements

E.1 Intel Verification Criteria for the Reference

Designs

E.1.1 Reference Heatsink Thermal Verification

The Intel reference heatsinks will be verified within specific boundary conditions using a TTV and the methodology described in the Intel® Xeon® Dual- and Multi- Processor Family Thermal Test Vehicle User's Guide.

The test results, for a number of samples, are reported in terms of a worst-case mean + 3σ value for thermal characterization parameter using real processors (based on the TTV correction offset).

E.1.2 Environmental Reliability Testing

E.1.2.1 Structural Reliability Testing

The Intel reference heatsinks will be tested in an assembled condition, along with the LGA771 Socket. Details of the Environmental Requirements, and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide.

The use condition environment definitions provided in Appendix E-1are based on speculative use condition assumptions, and are provided as examples only.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 91

Table E-1. Use Conditions Environment

Quality and Reliability Requirements

Use Environment

Shipping and Handling

Speculative Stress

Condition

Mechanical Shock

• System-level

•Unpackaged

•Trapezoidal

• 25 g

• velocity change is based on packaged weight

Product Weight (l bs )

< 20 lbs 20 to > 40 40 to > 80 80 to < 100 100 to <

120 ≥120

†

Change in velocity is based upon a 0.5 coefficient of restitution.

Random Vibration

• System Level

•Unpackaged

• 5 Hz to 500 Hz

• 2.20 g RMS random

• 5 Hz @ .001 g 20 Hz @ 0.01 g (slope up)

• 20 Hz to 500 Hz @ 0.01

/Hz (flat)

• Random control limit tolerance is ± 3 dB

Nonpalletized Product Velo ci ty

†

Change sec)

250 225 205 175 145 125

/Hz to

/Hz

(in/

Example Use

Condition

Total of 12 drops per system:

•2 drops per axis

•± direction

Total per system:

• 10 minutes per axis

•3 axes

Example 7-Yr

Stress Equiv.

n/a n/a

Example 10-

Yr Stress

Equiv.

Note: In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design

Guidelines supersedes that in the Table E-1 above.

E.1.2.2 Recommended Test Sequence

Each test sequence should start with components (i.e. baseboard, heatsink assembly, etc.) that have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.

E.1.2.3 Post-Test Pass Criteria

The post-test pass criteria are:

1. No significant physical damage to the heatsink and retention hardware.

2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

92 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Quality and Reliability Requirements

3. No signs of physical damage on baseboard surface due to impact of heatsink.

4. No visible physical damage to the processor package.

5. Successful BIOS/Processor/memory test of post-test samples.

6. Thermal compliance testing to demonstrate that the case temperature specification can be met.

E.1.2.4 Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or connected:

• Appropriate system baseboard.

• Processor and memory.

• All enabling components, including socket and thermal solution parts.

The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors. Intel PC Diags is an example of software that can be utilized for this test.

E.1.3 Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (e.g. polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams should be recyclable per the European Blue Angel recycling standards.

The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS compliant.

Lead-free and Pb-free: Lead has not been intentionally added, but lead may still exist as an impurity below 1000 ppm.

RoHS compliant: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU or (2) an approved/ pending exemption applies.

Note: RoHS implementation details are not fully defined and may change.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 93

Quality and Reliability Requirements

94 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Enabled Suppliers Information

FEnabled Suppliers

Information

F.1 Supplier Information

F.1.1 Intel Enabled Suppliers

The Intel reference enabling solution for Quad-Core Intel® Xeon® Processor 5400 Series is preliminary. The Intel reference solutions have not been verified to meet the criteria outlined in Appendix E. Customers can purchase the Intel reference thermal solution components from the suppliers listed in Tabl e F - 1.

For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5400 Series thermal mechanical enabling components drawings in Appendix B.

Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel

Reference Solution (Sheet 1 of 2)

Assembly Component Description

CEK771-01-2U (for 2U, 2U+)

CEK Heatsink

Intel Reference Heatsink p/n C61708 rev03

Intel Boxed Heatsink p/n D36871

CEK Heatsink

Intel Boxed Heatsink p/n D36871

Thermal Interface Material

CEK Spring for LGA771 socket

Intel p/n D13646 rev04

CEK Spring for LGA771 socket

Intel p/n D13646 rev04

Copper Fin, Copper Base

includes PCM45F TIM+cover

Copper Fin, Copper Base

includes PCM45F TIM+cover

Grease Shin-Etsu G751

Stainless Steel 301, Kapton* Tape on Reinforced Spring Fingers

Stainless Steel 301, Kapton* Tape on Reinforced Spring

Fingers

Development

Suppliers

Fujikura

CNDA# 1242012

(stacked fin)

Furukawa

CNDA# 65755

(Crimped fin)

CNDA 75610

AVC

CNDA# AP5281

ITW Fastex

CNDA# 78538

Supplier Contact Info

Fujikura America Ash Ooe

a_ooe@fujikura.com 408-748-6991

Fujikura Taiwan Branch Yao-Hsien Huang

yeohsien@fujikuratw.com.tw 886(2)8788-4959

Tim Yu Yu@FurukawaAmerica.com

408-345-1520

Johnson Tseng Johnson@tfe.com.tw (02)2563-8148x15

Randy Isaacson risaacson@microsi.com

(480) 893-8898x113

Steve Huang (APAC) +86-755-3366-8888 x66888 +86-138-252-45215 steve@avc.com.cn

Huabin Chen (China Only) +886-755-3366-8888 x66871 huabin@avc.com.cn

Roger Knell rknell@itwfastex.com 773-307-9035

Henry Lu henry@mail.itwasia.com.tw 886-7-881-9206x10

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 95

Enabled Suppliers Information

Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel

Reference Solution (Sheet 2 of 2)

Assembly Component Description

CEK771-01-1U (for 1U)

CEK771-02-1U (for 1U)

CEK Heatsink

Intel p/n C90546 rev02

Thermal Interface Material

CEK Spring for CEK771

CEK Low Cost Heatsink for Mid and Low Power SKUs

Intel p/n D71537 Rev 02

Thermal Interface Material

CEK Spring for CEK771

Copper Fin, Copper Base

See CEK771-01-2U

Aluminum Extrusion

See CEK771-01-2U

Development

Suppliers

Fujikura

CNDA# 1242012

(stacked fin)

Asia Vital

Components (AVC)

CNDA# AP5281

Supplier Contact Info

Fujikura America Ash Ooe

a_ooe@fujikura.com 408-748-6991

Fujikura Taiwan Branch Yao-Hsien Huang

yeohsien@fujikuratw.com.tw 886(2)8788-4959

Steve Huang (APAC) +86-755-3366-8888 x66888 +86-138-252-45215 steve@avc.com.cn

Huabin Chen (China Only) +886-755-3366-8888 x66871 huabin@avc.com.cn

Note: CEK771-02-1U is the 1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor

E5400 Series in volumetrically constrained form factors.

F.1.2 Additional Suppliers

The Intel enabled solutions for Quad-Core Intel® Xeon® Processor 5400 Series are preliminary. The Intel enabled solutions have not been verified to meet the criteria outlined in Appendix E. Customers can purchase the Intel enabled thermal solution components from the suppliers listed in Tab l e F - 1and Ta bl e F - 2.

For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5400 Series thermal mechanical enabling components drawings in Appendix B.

96 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Enabled Suppliers Information

Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series

Intel Reference Solution (Sheet 1 of 2)

Assembly Component Description

2U Heatsink Alternative CEK

Heatsink

Copper Fin, Copper Base

- and -

Aluminum

Copper Fin, Copper Base

- and -

Aluminum

Copper Fin, Copper Base

- and -

Development

Suppliers

Aavid

Thermalloy

CNDA#2525071

ADDA

Corporation

CNDA#AP1249

Asia Vital Components

(AVC)

CNDA# AP5281

Auras

CNDA#5779699

Supplier Contact Info

David Huang huang@aavid.com 603-223-1724

Frank Hsue frank.hsu@aavid.com.tw 886-2-26989888 x306

Jungpin Chen jungpin@adda.com.tw 886-2-82212252x232

Steve Huang (APAC) +86-755-3366-8888 x66888 +86-138-252-45215 steve@avc.com.cn

Huabin Chen (China Only) +886-755-3366-8888 x66871 huabin@avc.com.cn

Ian Shih liverpool@auras.com.tw +886-937-183-194

Aluminum

Copper Fin, Copper Base

- and -

Aluminum

Aluminum CoolJag (Chia Cherne

Copper Fin, Copper Base

- and -

Aluminum

Copper Fin, Copper Base

CCI (Chaun-Choung

Technology Co. Ltd.)

CNDA#8747572

Industry Co., Ltd.)

CoolerMaster

CNDA#7425225

Taisol Electronics CNDA #3434254

Thermaltake

CNDA#7429482

Monica Chih monica_chih@ccic.com.tw 8862-29952666 EXT 292

Harry Lin 714-739-5797 ackinc@aol.com

Alice Yang +886-4-7323090 alice@cooljag.com

Kenny Kwa ng 510-824-0888 kenny@cooljagusa.com

Helena Wen helena_wen@collermaster.com.tw +886-2-3234-0050x235

Jane Yui jane.yui@taisol.com.tw +886-2-2656-2658 x113

Vera Lee vera@thermaltake.com +886-2-2662-6501-255

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 97

Enabled Suppliers Information

Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series

Intel Reference Solution (Sheet 2 of 2)

Assembly Component Description

1U Heatsink Alternative CEK

Heatsink

Copper Fin, Copper Base

- and -

Aluminum

Copper Fin, Copper Base

- and -

Aluminum

Copper Fin, Copper Base

- and Aluminum

Copper Fin, Copper Base

- and -

Aluminum

Aluminum CoolJag (Chia Cherne

Development

Suppliers

Aavid

Thermalloy

CNDA#2525071

ADDA

CNDA# AP1249

Asia Vital Components

(AVC)

CNDA# AP5281

Auras

CNDA#5779699

CCI (Chaun-Choung

Technology Co. Ltd.)

CNDA# 8747572

Industry Co., Ltd.)

Supplier Contact Info

David Huang huang@aavid.com 603-223-1724

Frank Hsue frank.hsu@aavid.com.tw 886-2-26989888 x306

Jungpin Chen jungpin@adda.com.tw 886-2-82212252-232

Steve Huang (APAC) +86-755-3366-8888 x66888 +86-138-252-45215 steve@avc.com.cn

Huabin Chen (China Only) +886-755-3366-8888 x66871 huabin@avc.com.cn

Ian Shih liverpool@auras.com.tw 886-2-89901653 x314

Monica Chih monica_chih@ccic.com.tw 886-2-29952666x292

Harry Lin ackinc@aol.com 714-739-5797

Alice Yang +886-4-7323090 alice@cooljag.com

98 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Copper Fin, Copper Base

- and -

Aluminum

Copper Fin, Copper Base

- and Aluminum

Copper Fin, Copper Base

- and Aluminum

CoolerMaster

CNDA#7425225

Molex

CNDA#11277

Taisol Electronics CNDA #3434254

Thermaltake

CNDA#7429482

Kenny Kwang 510-824-0888 kenny@cooljagusa.com

Helena Wen helena_wen@collermaster.com.tw +886-2-3234-0050x235

Aljo Amorelli Aljo.Amorelli@molex.com 630-718-5919

Jeremy Shen +886-2-26202300-459 +886-926132586

Jane Yui jane.yui@taisol.com.tw +886-2-2656-2658 x113

Vera Lee vera@thermaltake.com +886-2-2662-6501-255

Enabled Suppliers Information

Quad-Core Intel® Xeon® Processor 5400 Series TMDG 99

Enabled Suppliers Information

100 Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Intel 5400 Series, X5472 - Cpu Xeon Quad Core 3.00Ghz Fsb1600Mhz 12M Lga771 Tray, Xeon 5400 Series Design Manuallines

Specifications and Main Features

Frequently Asked Questions

User Manual