• 5 Conversion Modes for
Resolution/Speed Trade-Off;
12-bit Effective Resolution
with 18 µs Signal Delay
(14-bit with 94 µs)
• Fast 3 µs Over-Range
Detection
• Serial I/O (SPI®, QSPI® and
Microwire® Compatible)
• ±200 mV Input Range with
Single 5 V Supply
• 1% Internal Reference
Voltage Matching
H
HCPL-7860
HCPL-0870, -7870
• Offset Calibration
• -40°C to +85°C Operating
Temperature Range
• 15 kV/µs Isolation Transient
Immunity
• Regulatory Approvals; UL,
CSA, VDE
DIGITAL CURRENT SENSOR
++
YYWW
HPx870
DIGITAL
INTERFACE IC
OUTPUT
DATA
MICRO-CONTROLLER
INPUT
CURRENT
ISOLATION
BOUNDARY
YYWW
HP7860
ISOLATED
MODULATOR
Hewlett-Packard’s Isolated A/D Converter delivers the reliability, small size, superior
isolation and over-temperature performance motor drive designers need to accurately
measure current at half the price of traditional solutions.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
SPI and QSPI are trademarks of Motorola Corp.
Microwire is a trademark of National Semiconductor Inc.
1-260
5965-5255E
Digital Current Sensing
Circuit
As shown in Figure 1, using the
Isolated 2-chip A/D converter to
sense current can be as simple as
connecting a current-sensing
resistor, or shunt, to the input
and reading output data through
the 3-wire serial output interface.
By choosing the appropriate
shunt resistance, any range of
current can be monitored, from
less than 1 A to more than 100 A.
Even better performance can be
achieved by fully utilizing the
more advanced features of the
Isolated A/D converter, such as
the pre-trigger circuit which can
reduce conversion time to less
NON-ISOLATED
+ 5 V
than 1 µs, the fast over-range
detector for quickly detecting
short circuits, different conversion
modes giving various resolution/
speed trade-offs, offset calibration mode to eliminate initial
offset from measurements, and
an adjustable threshold detector
for detecting non-short circuit
overload conditions.
ISOLATED
+ 5 V
R
SHUNT
0.02
+
C1
0.1 µF
INPUT
CURRENT
Figure 1: Typical Application Circuit.
Product Overview
Description
The HCPL-7860 Isolated Modulator and the HCPL-x870 Digital
Interface IC together form an
isolated programmable two-chip
analog-to-digital converter. The
isolated modulator allows direct
measurement of motor phase
currents in power inverters while
the digital interface IC can be
programmed to optimize the
conversion speed and resolution
trade-off.
In operation, the HCPL-7860
Isolated Modulator (optocoupler
with 3750 V
stand voltage rating) converts a
dielectric with-
RMS
V
V
DD1
MCLK
IN+
MDAT
IN-
GND2
HCPL-7860
DD2
C2
0.1 µF
V
V
GND1
low-bandwidth analog input into
a high-speed one-bit data stream
by means of a sigma-delta (∑∆)
oversampling modulator. This
modulation provides for high
noise margins and excellent
immunity against isolation-mode
transients. The modulator data
and on-chip sampling clock are
encoded and transmitted across
the isolation boundary where they
are recovered and decoded into
separate high-speed clock and
data channels.
The Digital Interface IC converts
the single-bit data stream from
the Isolated Modulator into
fifteen-bit output words and
provides a serial output interface
that is compatible with SPI®,
QSPI®, and Microwire® protocols, allowing direct connection
to a microcontroller. The Digital
Interface IC is available in two
package styles: the HCPL-7870 is
in a 16-pin DIP package and the
HCPL-0870 is in a 300-mil wide
SO-16 surface-mount package.
Features of the Digital Interface
IC include five different conversion modes, three different pretrigger modes, offset calibration,
fast over-range detection, and
adjustable threshold detection.
Programmable features are configured via the Serial Configuration port. A second multiplexed
input is available to allow
measurements with a second
1-261
isolated modulator without
additional hardware. Because the
two inputs are multiplexed, only
one conversion at a time can be
made and not all features are
available for the second channel.
The available features for both
channels are shown in the table
at right.
Negative inputMDATSerial data output
(normally connected to GND1)
1-262
Pin Description, Digital Interface IC
Symbol Description
CCLKClock input for the Serial Configuration
Interface (SCI). Serial Configuration
data is clocked in on the rising edge
of CCLK.
CLATLatch input for the Serial Configuration
Interface (SCI). The last 8 data bits
clocked in on CDAT by CCLK are
latched into the appropriate
configuration register on the rising
edge of CLAT.
CDATData input for the Serial Configuration
Interface (SCI). Serial configuration
data is clocked in MSB first.
MCLK1Channel 1 Isolated Modulator clock
input. Input Data on MDAT1 is clocked
in on the rising edge of MCLK1.
MDAT1Channel 1 Isolated Modulator data
input.
MCLK2Channel 2 Isolated Modulator clock
input. Input Data on MDAT2 is clocked
in on the rising edge of MCLK2.
MDAT2Channel 2 Isolated Modulator data
input.
GNDDigital ground.
Symbol Description
V
Supply voltage (4.5 V to 5.5 V).
DD
CHANChannel select input. The input level on
CHAN determines which channel of
data is used during the next conversion
cycle. An input low selects channel 1,
a high selects channel 2.
SCLKSerial clock input. Serial data is clocked
out of SDAT on the falling edge of SCLK.
SDATSerial data output. SDAT changes from
high impedance to a logic low output
at the start of a conversion cycle.
SDAT then goes high to indicate that
data is ready to be clocked out. SDAT
returns to a high-impedance state after
all data has been clocked out and CS
has been brought high.
CSConversion start input. Conversion
begins on the falling edge of CS. CS
should remain low during the entire
conversion cycle and then be brought
high to conclude the cycle.
THR1Continuous, programmable-threshold
detection for channel 1 input data. A
high level output on THR1 indicates
that the magnitude of the channel 1
input signal is beyond a user
programmable threshold level between
160 mV and 310 mV. This signal
continuously monitors channel 1
independent of the channel select
(CHAN) signal.
OVR1High speed continuous over-range
detection for channel 1 input data. A
high level output on OVR1 indicates
that the magnitude of the channel 1
input is beyond full-scale. This signal
continuously monitors channel 1
independent of the CHAN signal.
RESETMaster reset input. A logic high input
for at least 100 ns asynchronously
resets all configuration registers to
their default values and zeroes the
Offset Calibration registers.
1-263
Isolated A/D Converter Performance
Electrical Specifications
Unless otherwise noted, all specifications are at V
specifications are at TA = 25°C and V
TA = -40°C to +85°C, V
DYNAMIC CONVERTER CHARACTERISTICS
(Digital Interface IC is set to Conversion Mode 3.)
Signal-to-Noise RatioSNR6273dBV
Total Harmonic DistortionTHD-67
Signal-to-(NoiseSND66
+ Distortion)
Effective Number of BitsENOB1012bits87
Conversion Timet
Signal Delayt
Over-Range Detect Timet
Threshold Detect Timet
Signal BandwidthBW1822kHz1112
Isolation TransientCMR1520kV/µsV
Immunity
C2
t
C1
t
C0
DSIG
OVR1
THR1
2.02.74.2V
= -200 mV to +200 mV and V
IN+
= 0 V; all Typical
IN-
= VDD = 5 V; all Minimum/Maximum specifications are at
0.0250.14%4
= 0 V5
IN+
4µV/°C4
0.7mV/V
326mV
190ppm/°C
0.9%
+V
REF
mV6
= 35 Hz,2,9
IN+
400 mV
(141 mV
pk-pk
rms
) sine
wave.
0.71.0µsPre-Trigger Mode 27,8
1822Pre-Trigger Mode 1
14
3744Pre-Trigger Mode 0
1822109
= 0 to 400 mV 1210
IN+
1011
step waveform
= 1 kV13
ISO
1-264
Notes:
1. Resolution is defined as the total
number of output bits. The useable
accuracy of any A/D converter is a
function of its linearity and signal-tonoise ratio, rather than how many
total bits it has.
2. Integral nonlinearity is defined as
one-half the peak-to-peak deviation
of the best-fit line through the
transfer curve for V
+200 mV, expressed either as the
= -200 mV to
IN+
number of LSBs or as a percent of
measured input range (400 mV).
3. Differential nonlinearity is defined as
the deviation of the actual difference
from the ideal difference between
midpoints of successive output
codes, expressed in LSBs.
4. Data sheet value is the average
magnitude of the difference in offset
voltage from TA=25°C to
TA= -40°C, expressed in microvolts
per °C.
5. All units within each HCPL-7860
standard packaging increment (either
50 per tube or 1000 per reel) have an
Absolute Reference Voltage tolerance
of ±1%. An Absolute Reference
Voltage tolerance of ± 4% is
guaranteed between standard
packaging increments.
6. Beyond the full-scale input range the
output is either all zeroes or all ones.
7. The effective number of bits (or
effective resolution) is defined by the
equation ENOB = (SNR-1.76)/6.02
and represents the resolution of an
ideal, quantization-noise limited A/D
converter with the same SNR.
8. Conversion time is defined as the
time from when the convert start
signal CS is brought low to when
SDAT goes high, indicating that
output data is ready to be clocked
out. This can be as small as a few
cycles of the isolated modulator clock
and is determined by the frequency of
the isolated modulator clock and the
selected Conversion and Pre-Trigger
modes. For determining the true
signal delay characteristics of the A/D
converter for closed-loop phase
margin calculations, the signal delay
specification should be used.
9. Signal delay is defined as the effective delay of the input signal through
the Isolated A/D converter. It can be
measured by applying a -200 mV to
± 200 mV step at the input of modulator and adjusting the relative delay
of the convert start signal CS so that
the output of the converter is at midscale. The signal delay is the elapsed
time from when the step signal is
applied at the input to when output
data is ready at the end of the conversion cycle. The signal delay is the
most important specification for
determining the true signal delay
characteristics of the A/D converter
and should be used for determining
phase margins in closed-loop applications. The signal delay is determined
by the frequency of the modulator
clock and which Conversion Mode is
selected, and is independent of the
selected Pre-Trigger Mode and,
therefore, conversion time.
10. The minimum and maximum overrange detection time is determined by
the frequency of the channel 1 isolated modulator clock.
11. The minimum and maximum threshold detection time is determined by
the user-defined configuration of the
adjustable threshold detection circuit
and the frequency of the channel 1
isolated modulator clock. See the
Applications Information section for
further detail. The specified times
apply for the default configuration.
12. The signal bandwidth is the frequency
at which the magnitude of the output
signal has decreased 3 dB below its
low-frequency value. The signal
bandwidth is determined by the frequency of the modulator clock and
the selected Conversion Mode.
13. The isolation transient immunity (also
known as Common-Mode Rejection)
specifies the minimum rate-of-rise of
an isolation-mode signal applied
across the isolation boundary beyond
which the modulator clock or data
signals are corrupted.
75.0
V
= 4.5 V
DD1
= 5.0 V
74.5
74.0
SNR
73.5
73.0
72.5
-4085040
V
DD1
V
= 5.5 V
DD1
-20
2060
TEMPERATURE – °C
Figure 2. SNR vs. Temperature.
16
14
12
10
8
6
INL – LSB
4
2
0
-4085040
V
= 4.5 V
DD1
= 5.0 V
V
DD1
V
= 5.5 V
DD1
-20
2060
TEMPERATURE – °C
Figure 3. INL (Bits) vs. Temperature.
0.08
0.07
0.06
0.05
0.04
INL – %
0.03
0.02
0.01
0
-4085040
V
= 4.5 V
DD1
= 5.0 V
V
DD1
V
= 5.5 V
DD1
-20
2060
TEMPERATURE – °C
Figure 4. INL (%) vs. Temperature.
1-265
400
300
200
100
0
-100
-200
-300
OFFSET CHANGE – µV
-400
-500
-600
-4085
040
-20
TEMPERATURE – °C
V
DD1
V
DD1
V
DD1
2060
= 4.5 V
= 5.0 V
= 5.5 V
2.5
2.0
1.5
1.0
0.5
CHANGE – %
0
REF
V
-0.5
-1.0
-1.5
-4085040
V
= 4.5 V
DD1
= 5.0 V
V
DD1
V
= 5.5 V
DD1
-20
2060
TEMPERATURE – °C
200
180
160
140
120
100
80
60
40
CONVERSION TIME – µs
20
0
15
2
CONVERSION MODE #
PRE-TRIGGER
MODE 0
PRE-TRIGGER
MODE 1
PRE-TRIGGER
MODE 2
34
Figure 5. Offset Change vs.
Temperature.
14
13
12
11
10
9
EFFECTIVE RESOLUTION (# BITS)
8
15
2
34
CONVERSION MODE #
Figure 8. Effective Resolution vs.
Conversion Mode.
100
90
80
70
60
50
40
30
20
SIGNAL BANDWIDTH – kHz
10
0
2
15
CONVERSION MODE #
34
Figure 6. V
Temperature.
85
80
75
70
SNR
65
60
55
50
15
Figure 9. SNR vs. Conversion Mode.
V
IN+
Change vs.
REF
2
34
CONVERSION MODE #
(200 mV/DIV.)
OVR1 (200 mV/DIV.)
THR1
(2 V/DIV.)
2
s/DIV.
Figure 7. Conversion Time vs.
Conversion Mode.
100
90
80
70
60
50
40
30
SIGNAL DELAY – µs
20
10
0
2
15
CONVERSION MODE #
34
Figure 10. Signal Delay vs.
Conversion Mode.
Figure 11. Signal Bandwidth vs.
Conversion Mode.
1-266
Figure 12. Over-Range and Threshold
Detect Times.
Isolated Modulator
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-7860#XXX
No Option = Standard DIP package, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option, 1000 per reel.
Option data sheets available. Contact Hewlett-Packard sales representative or authorized distributor.
Package Outline Drawings
8-pin DIP Package
9.40 (0.370)
9.90 (0.390)
5678
TYPE NUMBER
PIN ONE
HP 7860X
YYWW
REFERENCE VOLTAGE
MATCHING SUFFIX*
DATE CODE
4321
6.10 (0.240)
6.60 (0.260)
7.36 (0.290)
7.88 (0.310)
0.18 (0.007)
0.33 (0.013)
5° TYP.
1.19 (0.047) MAX.
PIN ONE
0.76 (0.030)
1.24 (0.049)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*ALL UNITS WITHIN EACH HCPL-7860 STANDARD PACKAGING INCREMENT (EITHER 50 PER TUBE OR 1000 PER REEL)
HAVE A COMMON MARKING SUFFIX TO REPRESENT AN ABSOLUTE REFERENCE VOLTAGE TOLERANCE OF ± 1%.
AN ABSOLUTE REFERENCE VOLTAGE TOLERANCE OF ± 4% IS GUARANTEED BETWEEN STANDARD PACKAGING
INCREMENTS.
1.78 (0.070) MAX.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.65 (0.025) MAX.
2.28 (0.090)
2.80 (0.110)
PIN DIAGRAM
1
V
DD1
2
V
IN+
V
3
IN–
4
GND1
V
DD2
MCLK
MDAT
GND2
8
7
6
5
1-267
8-pin DIP Gull Wing Surface Mount Option 300
PIN LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
6
5
6.350 ± 0.25
(0.250 ± 0.010)
3
4
1.780
(0.070)
MAX.
4.19
MAX.
(0.165)
MOLDED
1.19
(0.047)
MAX.
7
8
1
2
1.02 (0.040)
1.19 (0.047)
1.19 (0.047)
1.78 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
4.83
(0.190)
0.255 (0.075)
0.010 (0.003)
TYP.
9.65 ± 0.25
(0.380 ± 0.010)
0.380 (0.015)
0.635 (0.025)
1.080 ± 0.320
(0.043 ± 0.013)
2.540
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
TOLERANCES (UNLESS OTHERWISE SPECIFIED):xx.xx = 0.01
0.51 ± 0.130
(0.020 ± 0.005)
xx.xxx = 0.005
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
Package Characteristics
Unless otherwise noted, all specifications are at TA = +25°C.
Input IC Junction-to-Caseθ
Thermal Resistancecenter underside of
Output IC Junction-to-Caseθ
jco
Thermal Resistance
3750V
I-O
I-O
jci
10
10
10
11
0.7pFf = 1 MHz
96°C/WThermocouple located at
12
114°C/W
13
RH ≤ 50%, t = 1 min.14,15
rms
ΩV
= 500 Vdc15
I-O
TA = 100°C
package
** The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or HP Application Note
1074, Optocoupler Input-Output Endurance Voltage.
1-268
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