HP HCPL-7870, HCPL-7860, HCPL-0870 Datasheet

Isolated 15-bit A/D Converter
Technical Data
• 12-bit Linearity
• 700 ns Conversion Time (Pre-Trigger Mode 2)
• 5 Conversion Modes for Resolution/Speed Trade-Off;
12-bit Effective Resolution with 18 µs Signal Delay (14-bit with 94 µs)
• Fast 3 µs Over-Range
Detection
• Serial I/O (SPI®, QSPI® and Microwire® Compatible)
±200 mV Input Range with Single 5 V Supply
• 1% Internal Reference Voltage Matching
H
HCPL-7860 HCPL-0870, -7870
• Offset Calibration
• -40°C to +85°C Operating
Temperature Range
• 15 kV/µs Isolation Transient
Immunity
• Regulatory Approvals; UL, CSA, VDE
DIGITAL CURRENT SENSOR
++
YYWW
HPx870
DIGITAL
INTERFACE IC
OUTPUT
DATA
MICRO-CONTROLLER
INPUT
CURRENT
ISOLATION
BOUNDARY
YYWW
HP7860
ISOLATED
MODULATOR
Hewlett-Packard’s Isolated A/D Converter delivers the reliability, small size, superior isolation and over-temperature performance motor drive designers need to accurately
measure current at half the price of traditional solutions.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
SPI and QSPI are trademarks of Motorola Corp. Microwire is a trademark of National Semiconductor Inc.
1-260
5965-5255E

Digital Current Sensing Circuit

As shown in Figure 1, using the Isolated 2-chip A/D converter to sense current can be as simple as connecting a current-sensing resistor, or shunt, to the input and reading output data through the 3-wire serial output interface. By choosing the appropriate
shunt resistance, any range of current can be monitored, from less than 1 A to more than 100 A.
Even better performance can be achieved by fully utilizing the more advanced features of the Isolated A/D converter, such as the pre-trigger circuit which can reduce conversion time to less
NON-ISOLATED
+ 5 V
than 1 µs, the fast over-range detector for quickly detecting short circuits, different conversion modes giving various resolution/ speed trade-offs, offset calibra­tion mode to eliminate initial offset from measurements, and an adjustable threshold detector for detecting non-short circuit overload conditions.
ISOLATED
+ 5 V
R
SHUNT
0.02
+
C1
0.1 µF
INPUT
CURRENT
Figure 1: Typical Application Circuit.

Product Overview

Description

The HCPL-7860 Isolated Modu­lator and the HCPL-x870 Digital Interface IC together form an isolated programmable two-chip analog-to-digital converter. The isolated modulator allows direct measurement of motor phase currents in power inverters while the digital interface IC can be programmed to optimize the conversion speed and resolution trade-off.
In operation, the HCPL-7860 Isolated Modulator (optocoupler with 3750 V stand voltage rating) converts a
dielectric with-
RMS
V
V
DD1
MCLK
IN+
MDAT
IN-
GND2
HCPL-7860
DD2
C2
0.1 µF
V V
GND1
low-bandwidth analog input into a high-speed one-bit data stream by means of a sigma-delta (∑∆) oversampling modulator. This modulation provides for high noise margins and excellent immunity against isolation-mode transients. The modulator data and on-chip sampling clock are encoded and transmitted across the isolation boundary where they are recovered and decoded into separate high-speed clock and data channels.
The Digital Interface IC converts the single-bit data stream from the Isolated Modulator into fifteen-bit output words and provides a serial output interface
CCLK V CLAT CHAN CDAT SCLK MCLK1 SDAT MDAT1 CS MCLK2 THR1 MDAT2 OVR1 GND RESET
HCPL-x870
DD
3-WIRE SERIAL INTERFACE
+
C3
10 µF
that is compatible with SPI®, QSPI®, and Microwire® proto­cols, allowing direct connection to a microcontroller. The Digital Interface IC is available in two package styles: the HCPL-7870 is in a 16-pin DIP package and the HCPL-0870 is in a 300-mil wide SO-16 surface-mount package. Features of the Digital Interface IC include five different conver­sion modes, three different pre­trigger modes, offset calibration, fast over-range detection, and adjustable threshold detection. Programmable features are con­figured via the Serial Configura­tion port. A second multiplexed input is available to allow measurements with a second
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isolated modulator without additional hardware. Because the two inputs are multiplexed, only one conversion at a time can be made and not all features are available for the second channel. The available features for both channels are shown in the table at right.

Functional Diagrams

ISOLATION
BOUNDARY
V
DD1
V
IN+
V
IN–
GND1
1
2
3
4
SIGMA-
DELTA
MOD./
ENCODE
DECODE
SHIELD
V
8
DD2
7
MCLK
6
MDAT
GND2
5

HCPL-x870 Digital Interface IC

Feature Channel #1 Channel #2
Conversion Mode ✓✓ Offset Calibration ✓✓ Pre-Trigger Mode Over-Range Detection Adjustable Threshold Detection
CCLK
1 2 3 4 5 6 7 8
CONFIG.
INTER-
FACE
CH1
CH2
CON-
VERSION
INTER-
FACE
THRES-
HOLD
DETECT
&
RESET
CLAT
CDAT SCLK MCLK1 SDAT MDAT1 MCLK2 MDAT2 OVR1
GND RESET
V
16
DD
15
CHAN
14 13
CS
12 11
THR1
10
9

HCPL-7860 Isolated Modulator

HCPL-x870 Digital Interface IC

Pin Description, Isolated Modulator

Symbol Description Symbol Description
V
DD1
V
IN+
V
IN–
GND1 Input ground GND2 Output ground
Supply voltage input (4.5 V to 5.5 V) V
DD2
Supply voltage input (4.5 V to 5.5 V)
Positive input (± 200 mV MCLK Clock output (10 MHz typical) recommended)
Negative input MDAT Serial data output (normally connected to GND1)
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Pin Description, Digital Interface IC

Symbol Description
CCLK Clock input for the Serial Configuration
Interface (SCI). Serial Configuration data is clocked in on the rising edge of CCLK.
CLAT Latch input for the Serial Configuration
Interface (SCI). The last 8 data bits clocked in on CDAT by CCLK are latched into the appropriate configuration register on the rising edge of CLAT.
CDAT Data input for the Serial Configuration
Interface (SCI). Serial configuration data is clocked in MSB first.
MCLK1 Channel 1 Isolated Modulator clock
input. Input Data on MDAT1 is clocked in on the rising edge of MCLK1.
MDAT1 Channel 1 Isolated Modulator data
input.
MCLK2 Channel 2 Isolated Modulator clock
input. Input Data on MDAT2 is clocked in on the rising edge of MCLK2.
MDAT2 Channel 2 Isolated Modulator data
input.
GND Digital ground.
Symbol Description
V
Supply voltage (4.5 V to 5.5 V).
DD
CHAN Channel select input. The input level on
CHAN determines which channel of data is used during the next conversion cycle. An input low selects channel 1, a high selects channel 2.
SCLK Serial clock input. Serial data is clocked
out of SDAT on the falling edge of SCLK.
SDAT Serial data output. SDAT changes from
high impedance to a logic low output at the start of a conversion cycle. SDAT then goes high to indicate that data is ready to be clocked out. SDAT returns to a high-impedance state after all data has been clocked out and CS has been brought high.
CS Conversion start input. Conversion
begins on the falling edge of CS. CS should remain low during the entire conversion cycle and then be brought high to conclude the cycle.
THR1 Continuous, programmable-threshold
detection for channel 1 input data. A high level output on THR1 indicates that the magnitude of the channel 1 input signal is beyond a user programmable threshold level between 160 mV and 310 mV. This signal continuously monitors channel 1 independent of the channel select (CHAN) signal.
OVR1 High speed continuous over-range
detection for channel 1 input data. A high level output on OVR1 indicates that the magnitude of the channel 1 input is beyond full-scale. This signal continuously monitors channel 1 independent of the CHAN signal.
RESET Master reset input. A logic high input
for at least 100 ns asynchronously resets all configuration registers to their default values and zeroes the Offset Calibration registers.
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Isolated A/D Converter Performance

Electrical Specifications

Unless otherwise noted, all specifications are at V specifications are at TA = 25°C and V TA = -40°C to +85°C, V
DD1
= V
DD2
= V
DD1
DD2
= VDD = 4.5 to 5.5 V.
Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Note
STATIC CONVERTER CHARACTERISTICS
Resolution 15 bits 1 Integral Nonlinearity INL 6 30 LSB 3 2
Differential Nonlinearity DNL 1 LSB 3 Uncalibrated Input Offset V
OS
Offset Drift vs. Temperature dVOS/dT Offset drift vs. V
DD1
Internal Reference Voltage V
dVOS/dV
REF
DD1
-1 1 2.5 mV V
A
Absolute Reference Voltage -4 4 % 6 5 Tolerance
Reference Voltage -1 1 % TA = 25°C. Matching See Note 5
V
Drift vs. Temperature dV
REF
V
Drift vs. V
REF
DD1
dV
Full Scale Input Range -V
REF
REF
/dT
/dV
A
DD1
REF
Recommended Input -200 +200 Voltage Range
DYNAMIC CONVERTER CHARACTERISTICS (Digital Interface IC is set to Conversion Mode 3.)
Signal-to-Noise Ratio SNR 62 73 dB V Total Harmonic Distortion THD -67 Signal-to-(Noise SND 66
+ Distortion) Effective Number of Bits ENOB 10 12 bits 8 7 Conversion Time t
Signal Delay t Over-Range Detect Time t Threshold Detect Time t Signal Bandwidth BW 18 22 kHz 11 12 Isolation Transient CMR 15 20 kV/µsV
Immunity
C2
t
C1
t
C0
DSIG OVR1 THR1
2.0 2.7 4.2 V
= -200 mV to +200 mV and V
IN+
= 0 V; all Typical
IN-
= VDD = 5 V; all Minimum/Maximum specifications are at
0.025 0.14 % 4
= 0 V 5
IN+
4 µV/°C4
0.7 mV/V
326 mV
190 ppm/°C
0.9 % +V
REF
mV 6
= 35 Hz, 2,9
IN+
400 mV (141 mV
pk-pk
rms
) sine
wave.
0.7 1.0 µs Pre-Trigger Mode 2 7, 8
18 22 Pre-Trigger Mode 1
14
37 44 Pre-Trigger Mode 0 18 22 10 9
= 0 to 400 mV 12 10
IN+
10 11
step waveform
= 1 kV 13
ISO
1-264
Notes:
1. Resolution is defined as the total number of output bits. The useable accuracy of any A/D converter is a function of its linearity and signal-to­noise ratio, rather than how many total bits it has.
2. Integral nonlinearity is defined as one-half the peak-to-peak deviation of the best-fit line through the transfer curve for V +200 mV, expressed either as the
= -200 mV to
IN+
number of LSBs or as a percent of measured input range (400 mV).
3. Differential nonlinearity is defined as the deviation of the actual difference from the ideal difference between midpoints of successive output codes, expressed in LSBs.
4. Data sheet value is the average magnitude of the difference in offset voltage from TA=25°C to TA= -40°C, expressed in microvolts per °C.
5. All units within each HCPL-7860 standard packaging increment (either 50 per tube or 1000 per reel) have an Absolute Reference Voltage tolerance of ±1%. An Absolute Reference Voltage tolerance of ± 4% is guaranteed between standard packaging increments.
6. Beyond the full-scale input range the output is either all zeroes or all ones.
7. The effective number of bits (or effective resolution) is defined by the
equation ENOB = (SNR-1.76)/6.02 and represents the resolution of an ideal, quantization-noise limited A/D converter with the same SNR.
8. Conversion time is defined as the time from when the convert start signal CS is brought low to when SDAT goes high, indicating that output data is ready to be clocked out. This can be as small as a few cycles of the isolated modulator clock and is determined by the frequency of the isolated modulator clock and the selected Conversion and Pre-Trigger modes. For determining the true signal delay characteristics of the A/D converter for closed-loop phase margin calculations, the signal delay specification should be used.
9. Signal delay is defined as the effec­tive delay of the input signal through the Isolated A/D converter. It can be measured by applying a -200 mV to ± 200 mV step at the input of modu­lator and adjusting the relative delay of the convert start signal CS so that the output of the converter is at mid­scale. The signal delay is the elapsed time from when the step signal is applied at the input to when output data is ready at the end of the conver­sion cycle. The signal delay is the most important specification for determining the true signal delay characteristics of the A/D converter
and should be used for determining phase margins in closed-loop applica­tions. The signal delay is determined by the frequency of the modulator clock and which Conversion Mode is selected, and is independent of the selected Pre-Trigger Mode and, therefore, conversion time.
10. The minimum and maximum over­range detection time is determined by the frequency of the channel 1 iso­lated modulator clock.
11. The minimum and maximum thresh­old detection time is determined by the user-defined configuration of the adjustable threshold detection circuit and the frequency of the channel 1 isolated modulator clock. See the Applications Information section for further detail. The specified times apply for the default configuration.
12. The signal bandwidth is the frequency at which the magnitude of the output signal has decreased 3 dB below its low-frequency value. The signal bandwidth is determined by the fre­quency of the modulator clock and the selected Conversion Mode.
13. The isolation transient immunity (also known as Common-Mode Rejection) specifies the minimum rate-of-rise of an isolation-mode signal applied across the isolation boundary beyond which the modulator clock or data signals are corrupted.
75.0
V
= 4.5 V
DD1
= 5.0 V
74.5
74.0
SNR
73.5
73.0
72.5
-40 85040
V
DD1
V
= 5.5 V
DD1
-20
20 60
TEMPERATURE – °C
Figure 2. SNR vs. Temperature.
16 14 12 10
8 6
INL – LSB
4 2 0
-40 85040
V
= 4.5 V
DD1
= 5.0 V
V
DD1
V
= 5.5 V
DD1
-20
20 60
TEMPERATURE – °C
Figure 3. INL (Bits) vs. Temperature.
0.08
0.07
0.06
0.05
0.04
INL – %
0.03
0.02
0.01 0
-40 85040
V
= 4.5 V
DD1
= 5.0 V
V
DD1
V
= 5.5 V
DD1
-20
20 60
TEMPERATURE – °C
Figure 4. INL (%) vs. Temperature.
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400 300 200 100
0
-100
-200
-300
OFFSET CHANGE – µV
-400
-500
-600
-40 85
040
-20 TEMPERATURE – °C
V
DD1
V
DD1
V
DD1
20 60
= 4.5 V = 5.0 V = 5.5 V
2.5
2.0
1.5
1.0
0.5
CHANGE – %
0
REF
V
-0.5
-1.0
-1.5
-40 85040
V
= 4.5 V
DD1
= 5.0 V
V
DD1
V
= 5.5 V
DD1
-20
20 60
TEMPERATURE – °C
200 180 160 140 120 100
80 60 40
CONVERSION TIME – µs
20
0
15
2
CONVERSION MODE #
PRE-TRIGGER MODE 0
PRE-TRIGGER MODE 1
PRE-TRIGGER MODE 2
34
Figure 5. Offset Change vs. Temperature.
14
13
12
11
10
9
EFFECTIVE RESOLUTION (# BITS)
8
15
2
34
CONVERSION MODE #
Figure 8. Effective Resolution vs. Conversion Mode.
100
90 80 70 60 50 40 30 20
SIGNAL BANDWIDTH – kHz
10
0
2
15
CONVERSION MODE #
34
Figure 6. V Temperature.
85
80
75
70
SNR
65
60
55
50
15
Figure 9. SNR vs. Conversion Mode.
V
IN+
Change vs.
REF
2
34
CONVERSION MODE #
(200 mV/DIV.)
OVR1 (200 mV/DIV.)
THR1 (2 V/DIV.)
2
s/DIV.
Figure 7. Conversion Time vs. Conversion Mode.
100
90 80 70 60 50 40 30
SIGNAL DELAY – µs
20 10
0
2
15
CONVERSION MODE #
34
Figure 10. Signal Delay vs. Conversion Mode.
Figure 11. Signal Bandwidth vs. Conversion Mode.
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Figure 12. Over-Range and Threshold Detect Times.

Isolated Modulator

Ordering Information

Specify Part Number followed by Option Number (if desired).
Example:
HCPL-7860#XXX
No Option = Standard DIP package, 50 per tube. 300 = Gull Wing Surface Mount Option, 50 per tube. 500 = Tape and Reel Packaging Option, 1000 per reel.
Option data sheets available. Contact Hewlett-Packard sales representative or authorized distributor.

Package Outline Drawings

8-pin DIP Package

9.40 (0.370)
9.90 (0.390)
5678
TYPE NUMBER
PIN ONE
HP 7860X
YYWW
REFERENCE VOLTAGE MATCHING SUFFIX*
DATE CODE
4321
6.10 (0.240)
6.60 (0.260)
7.36 (0.290)
7.88 (0.310)
0.18 (0.007)
0.33 (0.013)
5° TYP.
1.19 (0.047) MAX.
PIN ONE
0.76 (0.030)
1.24 (0.049)
DIMENSIONS IN MILLIMETERS AND (INCHES). *ALL UNITS WITHIN EACH HCPL-7860 STANDARD PACKAGING INCREMENT (EITHER 50 PER TUBE OR 1000 PER REEL)
HAVE A COMMON MARKING SUFFIX TO REPRESENT AN ABSOLUTE REFERENCE VOLTAGE TOLERANCE OF ± 1%. AN ABSOLUTE REFERENCE VOLTAGE TOLERANCE OF ± 4% IS GUARANTEED BETWEEN STANDARD PACKAGING INCREMENTS.
1.78 (0.070) MAX.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.65 (0.025) MAX.
2.28 (0.090)
2.80 (0.110)
PIN DIAGRAM
1
V
DD1
2
V
IN+
V
3
IN–
4
GND1
V
DD2
MCLK
MDAT
GND2
8
7
6
5
1-267

8-pin DIP Gull Wing Surface Mount Option 300

PIN LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
6
5
6.350 ± 0.25
(0.250 ± 0.010)
3
4
1.780
(0.070)
MAX.
4.19
MAX.
(0.165)
MOLDED
1.19
(0.047)
MAX.
7
8
1
2
1.02 (0.040)
1.19 (0.047)
1.19 (0.047)
1.78 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
4.83
(0.190)
0.255 (0.075)
0.010 (0.003)
TYP.
9.65 ± 0.25
(0.380 ± 0.010)
0.380 (0.015)
0.635 (0.025)
1.080 ± 0.320
(0.043 ± 0.013)
2.540
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES). TOLERANCES (UNLESS OTHERWISE SPECIFIED):xx.xx = 0.01
0.51 ± 0.130
(0.020 ± 0.005)
xx.xxx = 0.005 
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
LEAD COPLANARITY  MAXIMUM: 0.102 (0.004)

Package Characteristics

Unless otherwise noted, all specifications are at TA = +25°C.
Parameter Symbol Min. Typ. Max. Units Test Conditions Note
Input-Output Momentary V
ISO
Withstand Voltage (See note ** below)
Resistance (Input - Output) R
Capacitance C (Input - Output)
Input IC Junction-to-Case θ Thermal Resistance center underside of
Output IC Junction-to-Case θ
jco
Thermal Resistance
3750 V
I-O
I-O
jci
10 10
10
11
0.7 pF f = 1 MHz
96 °C/W Thermocouple located at
12
114 °C/W
13
RH 50%, t = 1 min. 14,15
rms
V
= 500 Vdc 15
I-O
TA = 100°C
package
** The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to your equipment level safety specification or HP Application Note 1074, Optocoupler Input-Output Endurance Voltage.
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