This amplifi er is ideal for use as a power
amplifi er for 3.3 - 3.6 GHz applications:
• Wireless Local Loop
Functional Diagram
AMPLIFIERS - SMT
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 3.0 - 4.0 GHz
Features
Gain: 21 dB
Saturated Power: +30 dBm
45% PAE
Supply Voltage: +5.0 V
Power Down Capability
Low External Part Count
General Description
The HMC327MS8G is a high effi ciency GaAs
InGaP Heterojunction Bipolar Transistor (HBT)
MMIC Power amplifi er which operates between
3.0 and 4.0 GHz. The amplifi er is packaged in a
low cost, surface mount 8 leaded package with
an exposed base for improved RF and thermal
performance. With a minimum of external components, the amplifi er provides 21 dB of gain,
+30 dBm of saturated power at 45% PAE from
a +5.0V supply voltage. Power down capability is
available to conserve current consumption when
the amplifi er is not in use.
8 - 104
Electrical Specifi cations, T
ParameterMin.Typ.Max.Units
Frequency Range3.0 - 4.0GHz
Gain172124dB
Gain Variation Over Temperature0.0250.035dB / °C
Input Return Loss15dB
Output Return Loss8dB
Output Power for 1dB Compression (P1dB)2427dBm
Saturated Output Power (Psat)30dBm
Output Third Order Intercept (IP3)3640dBm
Noise Figure5.0dB
Supply Current (Icq)Vpd = 0V/5V0.002 / 250mA
Control Current (Ipd)Vpd = 5V7mA
Switching SpeedtON, tOFF40ns
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
= +25° C, Vs = 5V, Vctl = 5V
A
Order Online at www.hittite.com
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 3.0 - 4.0 GHz
Broadband Gain & Return LossGain vs. Temperature
25
20
15
10
5
0
-5
RESPONSE (dB)
-10
-15
-20
-25
22.533.544.55
FREQUENCY (GHz)
S21
S11
S22
Input Return Loss vs. TemperatureOutput Return Loss vs. Temperature
0
-5
-10
+25 C
+85 C
-40 C
24
22
20
18
16
14
12
10
GAIN (dB)
8
6
4
2
0
2.533.544.5
FREQUENCY (GHz)
0
-5
+25 C
+85 C
-40 C
+25 C
+85 C
-40 C
8
AMPLIFIERS - SMT
-15
-20
RETURN LOSS (dB)
-25
-30
2.533.544.5
FREQUENCY (GHz)
-10
RETURN LOSS (dB)
-15
2.533.544.5
FREQUENCY (GHz)
P1dB vs. TemperaturePsat vs. Temperature
34
32
30
28
26
24
22
P1dB (dBm)
20
18
16
14
2.533.544.5
FREQUENCY (GHz)
+25 C
+85 C
-40 C
34
32
30
28
26
24
22
Psat (dBm)
20
18
16
14
2.533.544.5
FREQUENCY (GHz)
+25 C
+85 C
-40 C
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
8 - 105
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
Power Compression @ 3.5 GHzOutput IP3 vs. Temperature
8
48
42
36
30
24
18
12
Pout (dBm), GAIN (dB), PAE (%)
6
0
-5-3-113579111315
Pout (dBm)
Gain (dB)
PAE (%)
INPUT POWER (dBm)
Noise Figure vs. TemperatureGain & Power vs. Supply Voltage
AMPLIFIERS - SMT
10
9
8
7
6
5
4
3
NOISE FIGURE (dB)
2
1
0
33.544.5
FREQUENCY (GHz)
+25 C
+85 C
-40 C
POWER AMPLIFIER, 3.0 - 4.0 GHz
44
42
40
38
36
34
32
30
28
26
OIP3 (dBm)
24
22
20
18
16
14
2.533.544.5
FREQUENCY (GHz)
28
27
26
25
24
23
22
GAIN dB)
21
20
19
18
4.7555.25
Gain
Vcc SUPPLY VOLTAGE (Vdc)
+25 C
+85 C
-40 C
P1dB
Psat
32
31
30
P1dB, Psat (dBm)
29
28
27
26
25
24
23
22
8 - 106
Reverse Isolation vs. TemperaturePower Down Isolation
0
-10
-20
-30
-40
ISOLATION (dB)
-50
-60
2.533.544.5
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
+25 C
+85 C
-40 C
0
-5
-10
-15
-20
-25
ISOLATION (dB)
-30
-35
-40
2.533.544.5
FREQUENCY (GHz)
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
Gain, Power & Quiescent Supply
Current vs. Vpd @ 3.5 GHz
30
25
20
15
10
GAIN (dB), P1dB (dBm), Psat (dBm)
5
2.533.544.55
Vpd (Vdc)
Outline Drawing
P1dB
Psat
Gain
Icq
POWER AMPLIFIER, 3.0 - 4.0 GHz
Absolute Maximum Ratings
250
Collector Bias Voltage (Vcc)+5.5 Vdc
200
150
100
50
0
Icq (mA)
Control Voltage (Vpd)+5.5 Vdc
RF Input Power (RFin)(Vs = Vctl = +5.0 Vdc)+20 dBm
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
8 - 107
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
Pin Descriptions
8
Pin NumberFunctionDescriptionInterface Schematic
1Vpd
2, 4, 7GND
AMPLIFIERS - SMT
3RF INThis pin is AC coupled and matched to 50 Ohms from 3.0 to 4.0 GHz.
5, 6RF OUT
POWER AMPLIFIER, 3.0 - 4.0 GHz
Power Control Pin. For maximum power, this pin hsould be connected to
5.0V. A higher voltage is not recommended. For lower idle current, this
voltage can be reduced.
Ground: Backside of package has exposed metal ground slug that must
be connected to ground thru a short path. Vias under the device are
required.
RF output and bias for the output stage. The power supply for the output
device needs to be supplied to these pins.
8Vcc
Power supply voltage for the fi rst amplifi er stage. An external bypass
capacitor of 330 pF is required. This capacitor should be placed as close
to the device as possible.
8 - 108
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
Evaluation PCB
POWER AMPLIFIER, 3.0 - 4.0 GHz
8
AMPLIFIERS - SMT
List of Material
Item Description
J1 - J2PC Mount SMA RF Connector
J32 mm DC Header
C1 - C3330 pF Capacitor, 0603 Pkg.
C41.2 pF Capacitor, 0603 Pkg.
C52.0 pF Capacitor, 0402 Pkg.
C62.2 µF Capacitor, Tantalum
L13.0 nH Inductor, 0805 Pkg.
R1130 Ohm Resistor, 0603 Pkg.
U1HMC327MS8G Amplifi er
PCB*104829 Eval Board
* Circuit Board Material: Rogers 4350
The circuit board used in the fi nal application should use RF
circuit design techniques. Signal lines should have 50 ohm
impedance while the package ground leads and exposed
paddle should be connected directly to the ground plane
similar to that shown. A suffi cient number of VIA holes
should be used to connect the top and bottom ground
planes. The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board shown is
available from Hittite upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
8 - 109
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
Application Circuit
8
AMPLIFIERS - SMT
POWER AMPLIFIER, 3.0 - 4.0 GHz
8 - 110
Note 1: C3 should be located < 0.020” from Pin 8 (Vcc)
Note 2: C2 should be located < 0.020” from L1.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
TL1TL2TL3
Impedance50 Ohm50 Ohm50 Ohm
Length0.038”0.231”0.1”
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
GaAs InGaP HBT MMIC
Notes:
POWER AMPLIFIER, 3.0 - 4.0 GHz
8
AMPLIFIERS - SMT
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
8 - 111
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.