Datasheet HMC327MS8G Datasheet (hittite)

查询HMC327MS8G供应商
MICROWAVE CORPORATION
Typical Applications
8
This amplifi er is ideal for use as a power amplifi er for 3.3 - 3.6 GHz applications:
• Wireless Local Loop
Functional Diagram
AMPLIFIERS - SMT
v02.1202
HMC327MS8G
POWER AMPLIFIER, 3.0 - 4.0 GHz
Features
Gain: 21 dB
Saturated Power: +30 dBm
45% PAE
Supply Voltage: +5.0 V
Power Down Capability
Low External Part Count
General Description
The HMC327MS8G is a high effi ciency GaAs InGaP Heterojunction Bipolar Transistor (HBT) MMIC Power amplifi er which operates between
3.0 and 4.0 GHz. The amplifi er is packaged in a low cost, surface mount 8 leaded package with an exposed base for improved RF and thermal performance. With a minimum of external com­ponents, the amplifi er provides 21 dB of gain, +30 dBm of saturated power at 45% PAE from a +5.0V supply voltage. Power down capability is available to conserve current consumption when the amplifi er is not in use.
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Electrical Specifi cations, T
Parameter Min. Typ. Max. Units
Frequency Range 3.0 - 4.0 GHz
Gain 17 21 24 dB
Gain Variation Over Temperature 0.025 0.035 dB / °C
Input Return Loss 15 dB
Output Return Loss 8dB
Output Power for 1dB Compression (P1dB) 24 27 dBm
Saturated Output Power (Psat) 30 dBm
Output Third Order Intercept (IP3) 36 40 dBm
Noise Figure 5.0 dB
Supply Current (Icq) Vpd = 0V/5V 0.002 / 250 mA
Control Current (Ipd) Vpd = 5V 7 mA
Switching Speed tON, tOFF 40 ns
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
= +25° C, Vs = 5V, Vctl = 5V
A
Order Online at www.hittite.com
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
POWER AMPLIFIER, 3.0 - 4.0 GHz
Broadband Gain & Return Loss Gain vs. Temperature
25
20
15
10
5
0
-5
RESPONSE (dB)
-10
-15
-20
-25 2 2.5 3 3.5 4 4.5 5
FREQUENCY (GHz)
S21 S11 S22
Input Return Loss vs. Temperature Output Return Loss vs. Temperature
0
-5
-10
+25 C
+85 C
-40 C
24
22
20
18
16
14
12
10
GAIN (dB)
8
6
4
2
0
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
0
-5
+25 C
+85 C
-40 C
+25 C
+85 C
-40 C
8
AMPLIFIERS - SMT
-15
-20
RETURN LOSS (dB)
-25
-30
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
-10
RETURN LOSS (dB)
-15
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
P1dB vs. Temperature Psat vs. Temperature
34
32
30
28
26
24
22
P1dB (dBm)
20
18
16
14
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
+25 C
+85 C
-40 C
34
32
30
28
26
24
22
Psat (dBm)
20
18
16
14
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
+25 C
+85 C
-40 C
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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MICROWAVE CORPORATION
v02.1202
HMC327MS8G
Power Compression @ 3.5 GHz Output IP3 vs. Temperature
8
48
42
36
30
24
18
12
Pout (dBm), GAIN (dB), PAE (%)
6
0
-5 -3 -1 1 3 5 7 9 11 13 15
Pout (dBm)
Gain (dB)
PAE (%)
INPUT POWER (dBm)
Noise Figure vs. Temperature Gain & Power vs. Supply Voltage
AMPLIFIERS - SMT
10
9
8
7
6
5
4
3
NOISE FIGURE (dB)
2
1
0
3 3.5 4 4.5
FREQUENCY (GHz)
+25 C
+85 C
-40 C
POWER AMPLIFIER, 3.0 - 4.0 GHz
44 42 40 38 36 34 32 30 28 26
OIP3 (dBm)
24 22 20 18 16 14
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
28
27
26
25
24
23
22
GAIN dB)
21
20
19
18
4.75 5 5.25
Gain
Vcc SUPPLY VOLTAGE (Vdc)
+25 C
+85 C
-40 C
P1dB
Psat
32
31
30
P1dB, Psat (dBm)
29
28
27
26
25
24
23
22
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Reverse Isolation vs. Temperature Power Down Isolation
0
-10
-20
-30
-40
ISOLATION (dB)
-50
-60
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
+25 C
+85 C
-40 C
0
-5
-10
-15
-20
-25
ISOLATION (dB)
-30
-35
-40
2.5 3 3.5 4 4.5
FREQUENCY (GHz)
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
Gain, Power & Quiescent Supply Current vs. Vpd @ 3.5 GHz
30
25
20
15
10
GAIN (dB), P1dB (dBm), Psat (dBm)
5
2.5 3 3.5 4 4.5 5
Vpd (Vdc)
Outline Drawing
P1dB
Psat
Gain
Icq
POWER AMPLIFIER, 3.0 - 4.0 GHz
Absolute Maximum Ratings
250
Collector Bias Voltage (Vcc) +5.5 Vdc
200
150
100
50
0
Icq (mA)
Control Voltage (Vpd) +5.5 Vdc
RF Input Power (RFin)(Vs = Vctl = +5.0 Vdc) +20 dBm
Junction Temperature 150 °C
Continuous Pdiss (T = 85 °C) (derate 29 mW/°C above 85 °C)
Thermal Resistance (junction to ground paddle)
Storage Temperature -65 to +150 °C
Operating Temperature -40 to +85 °C
1.88 W
34 °C/W
8
AMPLIFIERS - SMT
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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MICROWAVE CORPORATION
v02.1202
HMC327MS8G
Pin Descriptions
8
Pin Number Function Description Interface Schematic
1 Vpd
2, 4, 7 GND
AMPLIFIERS - SMT
3 RF IN This pin is AC coupled and matched to 50 Ohms from 3.0 to 4.0 GHz.
5, 6 RF OUT
POWER AMPLIFIER, 3.0 - 4.0 GHz
Power Control Pin. For maximum power, this pin hsould be connected to
5.0V. A higher voltage is not recommended. For lower idle current, this voltage can be reduced.
Ground: Backside of package has exposed metal ground slug that must
be connected to ground thru a short path. Vias under the device are
required.
RF output and bias for the output stage. The power supply for the output
device needs to be supplied to these pins.
8 Vcc
Power supply voltage for the fi rst amplifi er stage. An external bypass
capacitor of 330 pF is required. This capacitor should be placed as close
to the device as possible.
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For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
Evaluation PCB
POWER AMPLIFIER, 3.0 - 4.0 GHz
8
AMPLIFIERS - SMT
List of Material
Item Description
J1 - J2 PC Mount SMA RF Connector
J3 2 mm DC Header
C1 - C3 330 pF Capacitor, 0603 Pkg.
C4 1.2 pF Capacitor, 0603 Pkg.
C5 2.0 pF Capacitor, 0402 Pkg.
C6 2.2 µF Capacitor, Tantalum
L1 3.0 nH Inductor, 0805 Pkg.
R1 130 Ohm Resistor, 0603 Pkg.
U1 HMC327MS8G Amplifi er
PCB* 104829 Eval Board
* Circuit Board Material: Rogers 4350
The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A suffi cient number of VIA holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Hittite upon request.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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MICROWAVE CORPORATION
v02.1202
HMC327MS8G
Application Circuit
8
AMPLIFIERS - SMT
POWER AMPLIFIER, 3.0 - 4.0 GHz
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Note 1: C3 should be located < 0.020” from Pin 8 (Vcc) Note 2: C2 should be located < 0.020” from L1.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
TL1 TL2 TL3
Impedance 50 Ohm 50 Ohm 50 Ohm
Length 0.038” 0.231” 0.1”
MICROWAVE CORPORATION
v02.1202
HMC327MS8G
Notes:
POWER AMPLIFIER, 3.0 - 4.0 GHz
8
AMPLIFIERS - SMT
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
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