MODEL NAME :DDM70
PCB NO : LA-F401P
BOM P/N : 431A8F31LXX
BR MLK14 KBL-U UMA
Kabylake U42
22
@ : Nopop Component
EMC@ : EMI, ESD and RF Component
@EMC@ : EMI, ESD and RF Nopop Component
CXDP@ : XDP Component
CONN@ : Connector Component
33
U42@ : KBL-R U42 Component
2018-08-17
REV :3.0 (A02)
U22@ : KBL-R U22 Component
DS3@ : Support DS3 Component
MB PCB
Part Number
DAA000EE000
44
COPYRIGHT 2015
ALL RIGHT RESERVED
REV:X00
PWB: TXD2X
Description
PCB 25A LA-F401P REV0 MB 1
Layout Dell logo
A
NDS3@ : No Support DS3 Component
650@ : Pop NPCT650VB2YX Component
750@ : Pop NPCT750JAAYX Component
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATIO N OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AU THORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONT AINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
B
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
C
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
D
Date:Sheetof
Compal Electronics, Inc.
Cover Sheet
Cover Sheet
Cover Sheet
LA-F401P
LA-F401P
LA-F401P
169Friday, August 17, 2018
169Friday, August 17, 2018
169Friday, August 17, 2018
E
0.2
0.2
0.2
A
B
C
D
E
BreckenridgeMLK 14 UMA Block Diagram
Memory BUS (DDR4)
USB
USH TPM1.2
BCM58102
SPI
DDR4 2133MHz for KBL-U
DDR4 2400MHz for KBL-H
Up to 2x8GB Modules
USB2.0[9]
USB3.0[6]
SLGC55544BVTR
USB POWER SHARE
USB3 Repeater
PS8713B
HD Audio I/F
SATA REPEATER
PI3EQX6741STZDEX
SATA/PCIE REPEATER
PS8558 x2
USB2.0[10]
USH board
P39
P29
P23
SW2_DP1
To Type C
P24
P32
P33
USB2.0[4]
2-Lane eDP1.3
HDMI
SW2_DP3
To VGA
M.2,3030 Key A
WLAN+BT
DP DeMUX
PS8338B
PCIE[3]
P33
USB2.0[7]
DDI[1]
INTEL
Kaby Lake Refresh U MCP
DDI[2]
P22
PAGE 6~19
SATA[0]
ESPI
SMSC KBC
MEC5105
SPI
P35-36
SATA[2]/PCIE[12][11]
W25Q128JVSIQ
128M 4K sector
P8
W25Q128JVSIQ
128M 4K sector
P8
reserve
TPM1.2/2.0 Nuvoton
NPCT750JAAYX
KB/TP CONN
FAN CONN
P45
P36
P39
11
EDP CONN
HDMI 1.4
CONN
VGA
CONN
P24
22
PCIE[1]
Card reader
RTS5242
P31
SD4.0
P31
33
PCIE[4]
Intel Jacksonville
WGI219LM
Transformer
RJ45
P30
P30
P30
DP TO VGA
RTD2166
SATA[1]/PCIE[8]
SATA/PCIE REPEATER
PS8558 x1
SATA[1]/PCIE[8]
M.2,3042 Key B
WWAN/LTE/HCA
USB3.0[2]
Non-AR Type C
DP1.2 4 lanes
TX/RX
USB 3.0 + AM
Type C CONN.
44
USB2.0
CC
Vbus
HS Redriver Switch
TUSB546@
PS8743@
P25
GPIO
PD Solution
TPS65982DC
P26-27P28
SW2_DP1
USB3.0[1]
SMBUS
USB2.0[1]
Smart Card
TDA8034HN
RFID/NFC
Fingerprint
CONN
SPI
Reverse Type
DDR4-SO-DIMM X2
BANK 0, 1, 2, 3
P20~21
USB2.0[8]
USB2.0[5]
USB2.0[9]_PS
P43
USB3.0[6]
P42
USB2.0[2]
USB3.0[3]
USB2.0[3]
USB3.0[4]
HDA Codec
ALC3246
P39
P34
P41
LCD Touch
Camera
P29
P29
USB3.0 Conn
PS(Ext Port 1)
P43
USB3.0 Conn
(Ext Port 2)
P44
USB3.0 Conn
(Ext Port 3)
INT.Speaker
Universal Jack
Dig. MIC
P44
P34
P34
P29
Trough eDP Cable
SATA HDD
Conn
P41
M.2 2280
SSD Conn
P40
Trough eDP Cable
LID SWITCH
USH CONN
CPU&PCH XDP Port
AUTOMATIC POWER
SWITCH(APS)
Free Fall sensor
DC/DC Interface
POWER ON/OFF
SW & LED
LED board
P46
P38
P14
P11
P41
P47
P46
5V VR
Charger
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
A
B
C
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
D
Title
Size Document NumberRev
Size Document NumberRev
Size Document NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
Block diagram
Block diagram
Block diagram
LA-F401P
LA-F401P
LA-F401P
E
269Friday, August 17, 2018
269Friday, August 17, 2018
269Friday, August 17, 2018
0.2
0.2
0.2
5
POWER STATES
Signal
State
S0 (Full ON) / M0
DD
S3 (Suspend to RAM) / M3LOW HIGH HIGHONONONOFF
S4 (Suspend to DISK) / M3ONONOFF
S5 (SOFT OFF) / M3ONONOFFLOWHIGHLOW
S3 (Suspend to RAM) / M-OFF
S4 (Suspend to DISK) / M-OFFHIGH
S5 (SOFT OFF) / M-OFF
SLP
S3#
HIGH
LOWHIGH HIGH
LOW HIGH HIGH LOWONONOFFOFFOFF
LOW LOWLOWONOFFOFFOFFOFF
LOW LOW LOW LOWONOFFOFFOFFOFF
SLP
SLP
S5#
S4#
HIGH HIGH
LOW
LOW
SLP
A#
HIGH
HIGH
ALWAYS
PLANE
ON
PM TABLE
+5V_ALW
+3.3V_ALW
+3.3V_ALW_DSW
CC
State
S0
S3
S5 S4/AC
S5 S4/AC doesn't exist
power
plane
+3.3V_ALW_PCH+1.2V_MEM
+RTC_CELL
+1.8V_PRIM
+1.0V_PRIM
+1.0V_PRIM_CORE
+5V_ALW2
+3.3V_ALW2
+3.3V_RTC_LDO
+1.0V_MPHYGT
ON
ON
+3.3V_CV2
+2.5V_MEM
+1.0V_VCCST
+5V_RUN
+3.3V_RUN
+0.6V_DDR_VTT
+1.8V_RUN
+VCC_CORE
+VCC_GT
+VCC_SA
+1.0VS_VCCIO
ONON
ON
OFF
OFFOFF
OFFON
OFF
OFF
M
PLANE
ON
4
SUS
RUN
PLANE
PLANE
ONONON
OFF
OFF
CLOCKS
OFF
OFF
OFF
USB3.0
USB3.0-1
USB3.0-2
USB3.0-3
USB3.0-4
USB3.0-5
USB3.0-6
SSIC
SSIC
3
2
1
For Breckenridge12/14/15 UMA
PCIE
PCIE-1
PCIE-2
PCIE-3
PCIE-4
PCIE-5
PCIE-6
PCIE-7
PCIE-8
PCIE-9
PCIE-10
PCIE-11
PCIE-12
SATA
SATA-0
SATA-1
M.2 3042(SATA Cache or HCA)
SATA-1*
SATA-2
M.2 2280 SSD
(PCIex2 or SATA)
12" not support JUSB3
Type-C PortType-C Port
M.2 3042(LTE)
JUSB2-->Left
JUSB3-->Rear Left
Card Reader
JUSB1-->Right
M.2 3030(WLAN)
LOM
NA
NA
SATA HDD
NA
NA
USB PORT#DESTINATION
DESTINATION
1
2
3
4
5
6
7
8
9
10
JUSB2-->Left
JUSB3-->Rear Left
M2 3042(WWAN)
Camera
NA
M.2 3030(BT)
Touch Screen
JUSB1-->Right
USH
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERI NG DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THI S DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE IN FORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
Size Document NumberRev
Size Document NumberRev
Size Document NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
Port assignment
Port assignment
Port assignment
LA-F401P
LA-F401P
LA-F401P
1
369Friday, August 17, 2018
369Friday, August 17, 2018
369Friday, August 17, 2018
0.2
0.2
0.2
5
Barrel
ADAPTER
DD
CHARGER
ISL9538
(PU901)
Type-C
ADAPTER
+PWR_SRC
SY8286RAC
(PU301)
BATTERY
CC
SY8210A
(PU200)
SY8288C
(PU102)
SY8288B
(PU100)
4
SIO_SLP_S4#
0.6V_DDR_VTT_ON
PCH_PRIM_EN
(SIO_SLP_SUS#)
ALWON
ALWON
+1.2V_MEM
+0.6V_DDR_VTT
+1.0V_PRIM
+5V_ALW
+5V_ALW2
+3.3V_RTC_LDO
+3.3V_ALW2
+3.3V_ALW
TPS22961
(UZ26)
3
PCH_PRIM_EN
(SIO_SLP_SUS#)
SIO_SLP_S4#
+VCC_SFR_OC
TPS62134C
(PU401)
TPS62134D
(PU402)
EM5209
(UZ4)
SLGC55544C
(UI3)
SY6288
(UI1)
SY6288
(UI2)
RUN_ON
PCH_PRIM_EN
(SIO_SLP_SUS#)
RUN_ON
USB_POWERSHARE_VBUS_EN
USB_PWR_EN1#
USB_PWR_EN2#
+1.0VS_VCCIO
+1.0V_PRIM_CORE
+USB_EX2_PWR
+USB_EX3_PWR
TPS22961
(UZ19)
TPS22961
(UZ21)
+5V_RUN
+5V_USB_CHG_PW R
2
CPU PWR
PCH PWR
GT3 PWR
RUN_ON
SIO_SLP_S0#
SIO_SLP_S4#
LP2301
(QV8)
EM5209
(@UZ5)
+1.0V_VCCSTG
+1.0V_VCCST
3.3V_TS_EN
@PCH_3.3V_TS_EN
AUD_PWR_EN
Peripheral Device PWR
TYPE-C Power
GPU PWR
+5V_TSP
+5V_RUN_AUDIO
1
RT8097A
FDMF3035
ISL95857
(PU602)
IMVP_VR_ON
BB
+VCC_SA
FDMF3035
(PU612)
IMVP_VR_ON
+VCC_GT
(PU610)
FDMF3035
(PU613)
U42@
IMVP_VR_ON
+VCC_CORE
AO6405
(QV1)
EN_INVPWR
+BL_PWR_SRC
(PU501)
EM5209
(UZ2)
EM5209
(UZ3)
EM5209
(UZ4)
G524B1T11U
(UV24)
PCH_PRIM_EN
(SIO_SLP_SUS#)
SIO_SLP_LAN#
3.3V_WWAN_EN
@PCH_ALW_ON
PCH_PRIM_EN
(SIO_SLP_SUS#)
RUN_ON
@SIO_SLP_WLAN#
AUX_EN_WOWL
LCD_VCC_TEST_EN
ENVDD_PCH
+1.8V_PRIM
+3.3V_LAN
+3.3V_WW AN
+3.3V_ALW_PCH
+3.3V_RUN
+3.3V_WLAN
+LCDVDD
AOZ1336
(UZ8)
LP2301A
(QZ1)
EM5209
(@UZ5)
RUN_ON
3.3V_CAM_EN#
AUD_PWR_EN
+1.8V_RUN
+3.3V_CAM
+3.3V_RUN_AUDIO
TYPE-C
+TBTA_VBUS(5V~20V)
AA
AP2204
(UT8)
5
+5V_ALW
+5V_TBT_VBUS
AP2112K
(UT7)
+3.3V_TBT_SX
4
TPS22967
(UZ18)
AP7361C
(PU503)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERI NG DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THI S DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE IN FORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
CV2_ON
SIO_SLP_S4#
+3.3V_CV2
+2.5V_MEM
for DDR4
USH/B
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
Size Document NumberRev
Size Document NumberRev
Size Document NumberRev
Date:Sheetof
Date:Sheetof
2
Date:Sheetof
Compal Electronics, Inc.
Power rails
Power rails
Power rails
LA-F401P
LA-F401P
LA-F401P
1
469Friday, August 17, 2018
469Friday, August 17, 2018
469Friday, August 17, 2018
0.2
0.2
0.2
5
4
3
2
1
PD &
FW reflash
2.2K
2.2K
+3.3V_RUN
202
200
202
200
53
51
1
4
DIMM1
DIMM2
XDP
LNG2DMTR
1K
2.2K
2.2K
2.2K
2.2K
2.2K
2.2K
2.2K
2.2K
+3.3V_ALW_PCH
+3.3V_ALW_PCH
+3.3V_TP
+3.3V_ALW
+3.3V_ALW
+3.3V_ALW
0ohm short pad
0ohm short pad
DMN66D0LDW-7
DMN66D0LDW-7
28
31
LOM
UPD1_SMBCLK_Q
UPD1_SMBDAT_Q
DDR_XDP_WAN_SMBCLK
DDR_XDP_WAN_SMBDAT
2.2K
2.2K
@2.2K
@2.2K
9
TP
8
+3.3V_CV2
M9
USH
L9
USH/B
+3.3V_TBTA_FLASH
B5
A5
R7
R8
DD
SKL-U
R9
W3
SML1_SMBDATA
SML1_SMBCLK
03
W2
02
02
01
01
00D7
00
04
04
V3
E11D8
03
CC
KBC
MEC 5105
MEM_SMBCLK
MEM_SMBDATA
SML0_SMBCLK
SML0_SMBDATA
1K
1K
DAT_TP_SIO_I2C_CLK
C12
CLK_TP_SIO_I2C_DAT
E10
B3
USH_EXPANDER_SMBCLK
E5
USH_EXPANDER_SMBDAT
UPD2_SMBCLK
E7
UPD2_SMBDAT
C3
UPD1_SMBCLK
UPD1_SMBDAT
B4
+3.3V_ALW_PCH
1K
499
499
F7
05
B6
BB
AA
05
A12
06
N10
06
07
M4
M7
07
C508
C8
08
F6
09
E9
09
10
N2
PBAT_CHARGER_SMBCLK
M3
10
PBAT_CHARGER_SMBDAT
2.2K
2.2K
+3.3V_ALW
100 ohm
100 ohm
4
5
Charger
BATTERY
CONN
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERI NG DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THI S DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE IN FORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
9/24: Reserve for embedded location ,refer Intel PDG 0.9
ISH_UART0_RXD <33>
ISH_UART0_TXD <33>
ISH_UART0_RTS# <33>
ISH_UART0_CTS# <33>
SIO_EXT_WAKE# <35>
@
T18
PAD~D
LCD_CBL_DET# <29>
HDD_EN <41>
@
T258
PAD~D
@
PAD~D
GPP_A GROUP is +1.8V
T268
WWAN
WLAN
1
For BR/SB UMA
ISH_I2C2_SDA
ISH_I2C2_SCL
LCD_CBL_DET#
12
RC3631K_04 02_5%
12
RC3621K_04 02_5%
12
RC287100K_ 0402_5%
+1.8V_RUN
+3.3V_RUN
+3.3V_RUN
12
RC1864.7K_ 0402_5%@
NRB_BIT
+3.3V_RUN
10K_0402_5%
RC267@
TPM_TYPE
TPM_TYPE no function,Reserve GPIO for future use,
NO REBOOT STRAP
HIGH
LOW(DEFAULT)
Internal 20k PD
BB
+3.3V_ALW_PCH
RC1848.2K_ 0402_5%@
No REBOOT
REBOOT ENABLE
12
BBS_BIT6
BOOT BIOS Destination(Bit 6)
HIGH
LOW(DEFAULT)
Internal 20k PD
AA
LPC
SPI
5
12
10K_0402_5%
12
DIMM Detect
HIGH
LOW
ONE_DIMM#
RC268
1 DIMM
2 DIMM
12
12
VendorTBDTBDFOXCONJAE
TYPEC_CON_SEL1 LOW
TYPEC_CON_SEL2
RC555
@
10K_0402_5%
RC556
@
10K_0402_5%
+3.3V_ALW_PCH
+3.3V_ALW_PCH+3.3V_ALW_PCH
RC553
@
10K_0402_5%
12
TYPEC_CON_SEL2TYPEC_CON_SEL1
LOW
4
12
@
10K_0402_5%
LOW
HIGHLOW
RC554
HIGHHIGH
HIGH
MEM_INTERLEAVED
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (5/14)
CPU (5/14)
CPU (5/14)
LA-F401P
LA-F401P
LA-F401P
1069Friday, August 17, 2018
1069Friday, August 17, 2018
1069Friday, August 17, 2018
1
0.2
0.2
0.2
5
4
3
2
1
For BR UMA
CPU@
UC1J
DD
WWAN--->
WLAN--->
M.2 SDD--->
LAN--->
Card Reader --->
+3.3V_LAN
CC
+3.3V_ALW_DSW
+1.0V_VCCST
+3.3V_ALW_PCH
10/6 depop, prevent singal step.
BB
H_CPUPWRGD VCCST_PWRGD
100P_0402_50V8J
12
CC300ESD@
AA
ESD Request:place near C PU side
CLK_PCIE_N0<33>
CLK_PCIE_P0<33>
CLKREQ_PCIE#0<33>
+3.3V_RUN
CLK_PCIE_N1<33>
CLK_PCIE_P1<33>
CLKREQ_PCIE#1<33>
+3.3V_RUN
+3.3V_RUN
CLK_PCIE_N3<40>
CLK_PCIE_P3<40>
CLKREQ_PCIE#3<40>
+3.3V_RUN
CLK_PCIE_N4<30>
CLK_PCIE_P4<30>
CLKREQ_PCIE#4<30>
+3.3V_RUN
CLK_PCIE_N5<31>
CLK_PCIE_P5<31>
CLKREQ_PCIE#5<31>
+3.3V_RUN
12
RL7010K_0402_5%@
RC32310K_0402_5%
RC671K_0402_5%
RC41110K_0402_5%@
LAN_WAKE#
12
12
PCH_PCIE_WAKE#
12
VCCST_PWRGD
RC711K_0402_5%
12
ME_SUS_PWR_ACK
RC7410K_0402_5%@
12
PCH_PWROK
+3.3V_1.8V_PGPPA
@
RC5511K_0402_5%
100P_0402_50V8J
12
CC301ESD@
@RF@
12
RC3730_0402_5%
RC18910K_0402_5%
RC4710K_0402_5%
RC5010K_0402_5%
RC5910K_0402_5%
RC5110K_0402_5%
RC19010K_0402_5%
@
T9
PAD~D
12
SUSACK#_R
RC215
POP
DE-POP
PCH_DPWROKPCH_RSMRST#_AND
RC2150_0402_5%
NDS3@
0.01UF_0402_25V7K
100K_0402_1%
12
1
@
CC266
2
12
12
RC3740_0402_5%
12
12
12
RC3760_0402_5%
12
12
RC3770_0402_5%
12
12
RC3780_0402_5%
12
PCH_PLTRST#
RC220
@
@
TC7SH08FU_SSOP5~D
VCCST_PWRGD<14,35,36>
ME_SUS_PWR_ACK<35>
SUSACK#<35>
NO Support Deep sleep
Support Deep sleep
12
@RF@
@RF@
@RF@
@RF@
12
RC620_0402_5%
12
RC2440_0402_5%
+3.3V_ALW_PCH
1
B
2
A
UC7
RC771K_0402_5%@
RC7860.4_0402_1%
@
RC4440_0402_5%
RC4430_0402_5%@
12
RC75
10K_0402_5%
CLKREQ_PCIE#0_R
CLKREQ_PCIE#1_R
CLKREQ_PCIE#2_R
CLKREQ_PCIE#3_R
CLKREQ_PCIE#4_R
CLKREQ_PCIE#5_R
5
P
4
O
G
3
PCH_RSMRST#_AND<14, 45>
12
12
12
12
PCH_PLTRST#_AND
12
PCH_PCIE_WAKE#<35,36>
PM_LANPHY_ENABLE<30>
XDP_DBRESET#<14>
+3.3V_RUN
D42
CLKOUT_PCIE_N0
C42
CLKOUT_PCIE_P0
AR10
GPP_B5/SRCCLKREQ0#
B42
CLKOUT_PCIE_N1
A42
CLKOUT_PCIE_P1
AT7
GPP_B6/SRCCLKREQ1#
D41
CLKOUT_PCIE_N2
C41
CLKOUT_PCIE_P2
AT8
GPP_B7/SRCCLKREQ2#
D40
CLKOUT_PCIE_N3
C40
CLKOUT_PCIE_P3
AT10
GPP_B8/SRCCLKREQ3#
B40
CLKOUT_PCIE_N4
A40
CLKOUT_PCIE_P4
AU8
GPP_B9/SRCCLKREQ4#
E40
CLKOUT_PCIE_N5
E38
CLKOUT_PCIE_P5
AU7
GPP_B10/SRCCLKREQ5#
KBL-RU42_BGA1356
PLTRST_LAN# <30>PLTRST_TPM# <37>
PCH_PLTRST#_EC <36>
PCH_PLTRST#_AND <31,33,38,40>
RC65
@
100K_0402_5%
PCH_PLTRST#
SYS_RESET#
PCH_RSMRST#_AND
H_CPUPWRGDH_CPUPWRGD_R
VCCST_PWRGD_CPU
SYS_PWROK<14,35>
PCH_PWROK<56>
PCH_DPWROK<35>
ME_SUS_PWR_ACK_R
SUSACK#_R
LAN_WAKE#<30,35>
3.3V_CAM_EN#<29>
12
RC31110K_0402_5%
XDP_DBRESET#
12
RC225@8.2K_0402_5%
12
RC227@8.2K_0402_5%
if pop UC12, RC291 also need pop (74AHC1G09GW is OD output)
KBL-R U4+2
CLOCK SIGNALS
PCH_PLTRST#
RC600_0402_5%@
PCH_PLTRST#_AND
@
RC3250_0402_5%
CPU@
UC1K
SYSTEM POWER MANAGEMENT
AN10
GPP_B13/PLTRST#
B5
SYS_RESET#
AY17
RSMRST#
A68
PROCPWRGD
B65
VCCST_PWRGD
B6
SYS_PWROK
BA20
PCH_PWROK
BB20
DSW_PWROK
AR13
GPP_A13/SUSWARN#/SUSPWRDNACK
AP11
GPP_A15/SUSACK#
BB15
WAKE#
AM15
GPD2/LAN_WAKE#
AW17
GPD11/LANPHYPC
AT15
GPD7/RSVD
KBL-RU42_BGA1356
12
@
RC2900_0402_5%
+3.3V_RUN
1
B
2
ME_RESET#
A
RSVD_E3/XTAL24_IN
RSVD_C7/XTAL24_OUT
12
12
5
P
4
O
G
UC12@
74AHC1G09GW_TSSOP5
3
Rev_0.1
KBL-U / KBL-R U4+2
XTAL24_IN/NC_2
XTAL24_OUT/NC_1
CLKOUT_ITPXDP_N
CLKOUT_ITPXDP_P
GPD8/SUSCLK
XCLK_BIASREF
RTCX1
RTCX2
SRTCRST#
RTCRST#
10 OF 20
KBL-R U4+2
SYS_RESET#_R
Close to CPU
E3
XTAL24_IN_U42_CPUXTAL24_IN_U42
C7
XTAL24_OUT_U42_CPU
E37
XTAL24_IN_U22_CPU
E35
XTAL24_OUT_U22_CPU
F43
CLK_ITPXDP_N
E43
CLK_ITPXDP_P
BA17
SUSCLK
E42
XCLK_BIASREF
AM18
PCH_RTCX1
AM20
PCH_RTCX2
AN18
SRTCRST#
AM16
PCH_RTCRST# <35>
PCH_RTCRST#
12
RC41733_0402_5%U42@
12
RC41833_0402_5%U42@
12
RC41933_0402_5%U22@
12
RC42033_0402_5%U22@
12
RC2970_0402_5%@
12
RC2980_0402_5%@
SUSCLK <33,40>
12
RC522.7K_0402_1%
12
RC32459_0402_1%@
546765_546765_2014WW 48_Skylake_MOW_Rev_1_0
12
RC5620K_0402_5%
1 2
CC781U_0201_6.3V6M
1 2
CC791U_0201_6.3V6M@
12
RC5720K_0402_5%
1 2
CC801U_0201_6.3V6M
1 2
CC811U_0201_6.3V6M@
1
SHORT PADS~D
@
1
CMOS1
2
2
CMOS1 must take care short & touch risk on layout placement
For Skylake, pop RC 52,depop RC324
For Cannonlake, pop RC324, depop RC52
+RTC_CELL_PCH
MLCC downsize 4/18
MLCC downsize 4/18
VCCDSW_EN_GPIO<18>
VCCDSW_EN<35>
ALW_PWRGD_3V_5V<45, 51>
No Support DS3
@
T115
SYS_RESET#
0.1U_0402_25V6
@ESD@
12
CC302
ESD Request:place near C PU side
XTAL24_IN_U22
XTAL24_OUT_U22
For KBL-R U42
XTAL24_IN_U42
XTAL24_OUT_U42
PCH_RTCX1
PCH_RTCX2
12
@
RC4450_0402_5%
RC439
Support DS3
'V' mean POP, 'X' mean DE-POP
VVV
XX
For KBL-R U22
12
@
RC2940_0402_5%
1M_0402_1%
12
@
RC2950_0402_5%
@
1M_0402_1%
12
@
NDS3@
21
RB751S40_SOD523-2
NDS3@
RB751S40_SOD523-2
XTAL24_IN_U22_R
U22@
RC46
12
XTAL24_OUT_U22_R
For Skylake,YC1 24 M Hz (50 Ohm ESR)
For Cannonlake,YC1 38.4 M Hz (30 Ohm ESR)
546765_546765_2014WW 48_Skylake_MOW_Rev_1_0
12
RC5500_0402_5%
U42@
RC421
RC4220_0402_5%
@
DC1
XTAL24_IN_U42_R
12
XTAL24_OUT_U42_R
For Skylake,YC3 24 M Hz (50 Ohm ESR)
RC54
10M_0402_5%
12
12
PCH_RTCX2_R
RC2960_0402_5%
SIO_SLP_SUS#
VCCDSW_EN_Q
DC2
21
RC440RE536 RC215RC441 RC442
X
X
VVV
X
+3.3V_ALW_PCH
+3.3V_ALW
+3.3V_ALW
POWER_SW#_M B<36,46>
X
U22@
CC21
1 2
12P_0402_50V8J
3
4
YC1
U22@
24MHZ_12PF_X3G024000DC1H
1
2
U22@
CC22
1 2
12P_0402_50V8J
U42@
CC334
1 2
12P_0402_50V8J
3
4
U42@
YC3
24MHZ_12PF_X3G024000DC1H
1
2
U42@
CC335
1 2
12P_0402_50V8J
CC23
1 2
12P_0402_50V8J
12
YC2
32.768KHZ_12.5PF_9H03200042
ESR MAX=50k ohm
CC26
1 2
12P_0402_50V8J
@DS3@
RC441
12
0_0402_5%
RC442
NDS3@
12
0_0402_5%
8/21 can change to 10K for merge t o RP
PCH_BATLOW#
AC_PRESENT
INTRUDER#
MPHYP_PWR_EN
VRALERT#
SIO_SLP_LAN#
SUSCLK
SIO_SLP_S3#
SIO_SLP_S5#
SIO_SLP_S4#
SIO_SLP_A#
PCH_RTCRST#
SYS_RESET#
SIO_SLP_S0#
PCH_PRIM_EN <17,47, 53,54,55>
12
RC728.2K_0402_5%
12
RC24310K_0402_5%
12
RC691M_0402_5%
12
RC38710K_0402_5%@
12
RC7310K_0402_5%@
12
RC34410K_0402_5%@
12
RC6810K_0402_5%@
12
RC481K_0402_5%@
JAPS1
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
18
19
GND
20
GND
@CONN@
ACES_50506-01841-P01
+3.3V_ALW_DSW
+RTC_CELL_PCH
+3.3V_ALW_PCH
+3.3V_ALW
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
1
2
HDA_SDOUT
CC333
2.2P_0402_50V8C
@RF@
CC303
ESD request,Place near CPU side.
PCH_JTAG_TMS
12
RC8651_0402_5%@
Service Mode Switch:
Add a switch to ME_FWP signal to unlock the ME region and
allow the entire region of the SPI flash to be updated using FPT.
+3.3V_ALW_PCH
ME_FWP PCH has internal 20K PD.
(suspend power rail)
FLASH DESCRIPTOR SECURITY OVERRIDE
LOW = ENABLE (DEFAULT) -->Pin1 & Pin3 short
HIGH = DISABLE (ME can update) -->Pin2 & Pin3 short
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
ESD request,Place near JXDP1 side.ESD request,Place near UC8 side.
0.1U_0402_25V6
@ESD@
12
CC307
0.1U_0402_25V6
@ESD@
12
CC308
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (9/14)
CPU (9/14)
CPU (9/14)
LA-F401P
LA-F401P
LA-F401P
1469Friday, August 17, 2018
1469Friday, August 17, 2018
1469Friday, August 17, 2018
1
0.2
0.2
0.2
5
+VCC_CORE: 0.3~1.35V
DD
@
T122
PAD~D
@
T123
PAD~D
CC
VCCOPC,VCCOPC_1P8,VCCEOPIO for SKYLAKE-U 2+3e
(w/ on package cache)
CAD Note: Place the PU resistors close to CPU
RC204 close to CPU 300 - 1500mils
12
H_CPU_SVIDALRT#
RC153220_0402_5%
CAD Note: Place the PU resistors close to CPU
RC208close to CPU 300 - 1500mils
VIDSOUT
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
2
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (10/14)
CPU (10/14)
CPU (10/14)
LA-F401P
LA-F401P
LA-F401P
1569Friday, August 17, 2018
1569Friday, August 17, 2018
1569Friday, August 17, 2018
1
0.2
0.2
0.2
5
4
3
2
1
+VCCGT: 0.3~1.35V
KBL-R 4+2 and KBL-U 2+2&2+3e option (place on power page)
KBL-R 4+2 and KBL-U 2+2&2+3e option (place on power page)
+VCC_GT_+VCC_CORE
12
+VCC_GT
+VCC_GTX
VCCGTX for KBL-U 2+3e only
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
CZ1004
CZ1005
RUN_ON<35,36,47,54>
TC7SH08FU_SSOP5~D
12
1U_0201_6.3V6M
12
1U_0201_6.3V6M
UZ35
RZ3200_0402_5%@
+5V_ALW
+3.3V_ALW
5
1
B
2
A
3
12
P
G
O
+1.0V_PRIM
4
VCCSTG_EN
UZ19
1
VIN1
2
VIN2
7
VIN thermal
3
VBIAS
4
ON
TPS22961DNYR_WSON8
4.4mohm/6A
TR=12.5us@Vin=1.05V
2
VOUT
GND
12
PJP2
PAD-OPEN1x1m
6
+1.0V_VCCSTG_C
5
DELL CONFIDENTIAL/PROPRIETARY
pop option with UZ19
12
CZ106 0.1U_0201_10V6K
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRev
SizeDocument NumberRev
SizeDocument NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (12/14)
CPU (12/14)
CPU (12/14)
LA-F401P
LA-F401P
LA-F401P
1769Friday, August 17, 2018
1769Friday, August 17, 2018
1769Friday, August 17, 2018
1
0.2
0.2
0.2
5
+1.0V_PRIM
DD
+1.8V_PRIM
CC
+3.3V_ALW_PCH
+1.8V_PRIM
BB
12
@
RC2990_06 03_5%
12
@
RC3000_04 02_5%
12
@
RC3010_04 02_5%
12
@
RC3020_04 02_5%
12
@
RC3030_04 02_5%
12
@
RC3040_04 02_5%
12
RC2340_0402_5%@
12
@
RC2350_04 02_5%
12
RC2110_0402_5%LPC@
12
@ESPI@
RC2120_04 02_5%
12
@
RC3050_04 02_5%
12
@
RC3060_04 02_5%
12
@
RC3070_04 02_5%
12
@
RC3080_04 02_5%
+3.3V_ALW_PCH
12
LC1BLM15GA750SN1D_2P
1
1
CC105
@
2
2
1U_0201_6.3V6M
+1.0V_MPHYAON
+1.0V_CLK6
+1.0V_DTS
+1.0V_CLK1
+1.0V_CLK3
+1.8V_PGPPF
+3.3V_1.8V_PGPPG
+3.3V_1.8V_PGPPA
+3.3V_PGPPB+3.3V_ALW_PCH
+3.3V_PGPPC
+3.3V_PGPPD
+3.3V_PGPPE
8/28 schematic review
CC104
@
1U_0201_6.3V6M
close UC1.AJ19 and <400mil
close UC1.AF20 and <400mil
+3.3V_1.8V_ESPI
PJP4
12
PAD-OPEN1x1m
Must be +1.8V for eSPI I/F
LC1,LC2 need link SM01000S100(S SUPPRE_ FBMA-1H-100505-601T 0402 )
+3.3V_VCCHDA
1
CC313
2
0.1U_0201_10V6K
+1.0V_MPHYAON
1
1
CC861U_0201_6.3V6M
CC871U_0201_6.3V6M
2
2
+1.0V_MPHYGT
close UC1.N15 and CC210 <400mil, CC211 <120mil
1
2
MLCC downsize 4/18
+1.0V_SRAM
1
CC109
@
2
1
MLCC downsize 4/18
CC341
2
RF@
18P_0402_50V8J
close UC1.K15, UC1.L15 and <100mil
@
12
RC1690_0603_5%
1
2
CC281
@
0.1U_0201_10V6K
+1.0V_PRIM
12
LC2BLM15GA7 50SN1D_2P
1
RF@
2
CC225
12P_0402_50V8J
close UC1.V15 and <100mil
MLCC downsize 4/18
AA
close UC1.N20 and <100mil
12
@
RC1730_04 02_5%
5
+1.0V_CLK4+1.0V_PRIM
22U_0603_6.3V6M
CC226
1
2
12
@
RC1700_04 02_5%
close UC1.K19 and <100mil
4
close UC1.AL1 and <120mil
1
1
CC881U_0201_6.3V6M
CC891U_0201_6.3V6M
2
2
MLCC downsize 4/18
1
1
CC98
2
1
CC108
@
2
CC99
2
1U_0201_6.3V6M
+1.0V_APLLEBB
1U_0201_6.3V6M
1
2
+1.0V_AMPHYPLL+1.0V_MPHYGT
22U_0603_6.3V6M
1
2
+1.0V_CLK2+1.0V_PRIM
22U_0603_6.3V6M
1
2
4
CC210
@
1U_0201_6.3V6M
47U_0805_6.3V6M
+1.0V_PRIM_CORE+1.0VO_DSW
CC901U_0201_6.3V6M
CC911U_0201_6.3V6M
@
@
1
1
2
2
close UC1.AF18 and <400mil
+1.0V_AMPHYPLL
+1.0V_APLL
1U_0201_6.3V6M
+1.0V_PRIM
+3.3V_ALW_DSW
+3.3V_VCCHDA
+3.3V_ALW_PCH
+1.0V_PRIM
close UC1.N18 and <120mil
1
CC110
CC111
2
1U_0201_6.3V6M
1U_0201_6.3V6M
close UC1.K15 and <120mil
CC219
1
1
CC129
CC128
@
@
2
2
1U_0201_6.3V6M
MLCC downsize 4/18
+1.0V_APLL
1
CC314
2
0.1U_0201_10V6K
CC220
close UC1.AB19 and <400milclose UC1.K17 and <120mil
@
1
2
+3.3V_SPI
1U_0201_6.3V6M
+1.0V_PRIM
CC931U_0201_6. 3V6M
1
2
@
3
PCH PWR
CC921U_0201_6. 3V6M
UC1O
CPU@
AB19
VCCPRIM_1P0
AB20
VCCPRIM_1P0
P18
VCCPRIM_1P0
AF18
VCCPRIM_CORE
AF19
VCCPRIM_CORE
V20
VCCPRIM_CORE
V21
VCCPRIM_CORE
AL1
DCPDSW_1P0
K17
VCCMPHYAON_1P0
L1
VCCMPHYAON_1P0
N15
VCCMPHYGT_1P0_N15
N16
VCCMPHYGT_1P0_N16
N17
VCCMPHYGT_1P0_N17
P15
VCCMPHYGT_1P0_P15
P16
VCCMPHYGT_1P0_P16
K15
VCCAMPHYPLL_1P0
L15
VCCAMPHYPLL_1P0
V15
VCCAPLL_1P0
AB17
VCCPRIM_1P0_AB17
Y18
VCCPRIM_1P0_Y18
AD17
VCCDSW_3P3_AD17
AD18
VCCDSW_3P3_AD18
AJ17
VCCDSW_3P3_AJ17
AJ19
VCCHDA
AJ16
VCCSPI
AF20
VCCSRAM_1P0
AF21
VCCSRAM_1P0
T19
VCCSRAM_1P0
T20
VCCSRAM_1P0
AJ21
VCCPRIM_3P3_AJ21
AK20
VCCPRIM_1P0_AK20
N18
VCCAPLLEBB_1P0
KBL-RU42_BGA1356
+3.3V_ALW_DSW+3.3V_ALW_PCH
@DS3@
22U_0603_6.3V6M
@
CC279
1
1
2
2
RC439
RC440RE536RC215RC441RC442
Support DS3
No Support DS3
'V' mean POP, 'X' mean DE-POP
VVV
XX
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
Note1: VCCPRIM_CORE Implementation with PCH CORE_VID Recommendation
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
3
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
2
Title
Size Docum ent NumberRev
Size Docum ent NumberRev
Size Docum ent NumberRev
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Ele ctronics, Inc.
DDR4
DDR4
DDR4
LA-F401P
LA-F401P
LA-F401P
1
2169Friday, August 17, 2018
2169Friday, August 17, 2018
2169Friday, August 17, 2018
0.2
0.2
0.2
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