Dell EMC PowerEdge C6525
Technical Specifications Guide
Reg ula tor y M ode l: E63 S S eries
Reg ula tor y T ype : E 63S 001
Mar ch 202 1
Rev . A 03
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2019 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
Contents
Chapter 1: Technical specifications............................................................................................... 4
Sled dimensions....................................................................................................................................................................4
Chassis weight..................................................................................................................................................................... 4
Processor specifications.................................................................................................................................................... 5
Supported operating systems...........................................................................................................................................5
System battery specifications.......................................................................................................................................... 5
Expansion card installation guidelines.............................................................................................................................5
Memory specifications....................................................................................................................................................... 8
Drives specifications...........................................................................................................................................................8
Ports and connectors specifications...............................................................................................................................8
USB ports specifications..............................................................................................................................................8
Display port specifications........................................................................................................................................... 9
NIC ports specifications...............................................................................................................................................9
iDRAC9 port specifications......................................................................................................................................... 9
Storage specifications........................................................................................................................................................ 9
Video specifications............................................................................................................................................................ 9
Environmental specifications.......................................................................................................................................... 10
Standard operating temperature specifications................................................................................................... 10
Expanded operating temperature specifications .................................................................................................18
Particulate and gaseous contamination specifications....................................................................................... 19
Relative humidity specifications............................................................................................................................... 19
Maximum vibration specifications............................................................................................................................ 19
Maximum shock specifications.................................................................................................................................20
Maximum altitude specifications............................................................................................................................. 20
Operating temperature de-rating specifications................................................................................................. 20
Fresh Air Operation.....................................................................................................................................................20
Contents 3
Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• Sled dimensions
• Chassis weight
• Processor specifications
• Supported operating systems
• System battery specifications
• Expansion card installation guidelines
• Memory specifications
• Drives specifications
• Ports and connectors specifications
• Storage specifications
• Video specifications
• Environmental specifications
1
Sled dimensions
Figure 1. Sled dimensions
Table 1. Dimensions of the PowerEdge C6525 sled
X Y Z
174.4 mm (6.86 inches) 40.1 mm (1.58 inches) 570.34 mm (22.45 inches)
Chassis weight
Table 2. Chassis weight with sleds
4 Technical specifications
Table 2. Chassis weight with sleds
System Maximum weight (with all sleds and drives)
12 x 3.5-inch configuration 45.53 kg (100.37 lb)
24 x 2.5-inch configuration 41.5 kg (91.49 lb)
System with no backplane 35.15 kg (77.49 lb)
Processor specifications
The PowerEdge C6525 sled supports up to two processors in each of the four independent sleds. Each processor supports up
to 64 cores.
Table 3. Processor specifications
Supported processor Number of processors supported
AMD EPYC™ 7002 and 7003 Series processor 2
Supported operating systems
The PowerEdge C6525 supports the following operating systems:
● Canonical Ubuntu LTS
● Citrix XenServer
● Microsoft Windows Server
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● VMware ESXi
● CentOS
NOTE: For more information, see www.dell.com/ossupport.
System battery specifications
The PowerEdge C6525 sled supports CR 2032 3.0-V lithium coin cell system battery.
NOTE: One battery is supported on each PowerEdge C6525 sled.
Expansion card installation guidelines
The following table describes the supported expansion cards:
PCIe slot priority
Table 4. Expansion card riser configurations
Riser
option
s
Riser
1A
Slot 1 Slot 2 Length Height Primary
Riser 1A
PCIe Gen 4
x 16
NA Half Length Low Profile 1 1
processor
Minimum
processor
requirement
Supported
configurations
● 12 x 3.5-inch
drives
● 24 x 2.5-inch
drives
Technical specifications 5
Table 4. Expansion card riser configurations (continued)
Riser
option
s
Slot 1 Slot 2 Length Height Primary
processor
Minimum
processor
requirement
Supported
configurations
● 8 x 2.5-inch
NVMe drives
● No backplane
Riser 1A
PCIe Gen 4
Riser
1A+2A
Riser2ANA
No
riser
The following table provides guidelines for installing expansion cards to ensure proper cooling and mechanical fit. The expansion
cards with the highest priority should be installed first using the slot priority indicated. All the other expansion cards should be
installed in the card priority and slot priority order.
x 16
NA NA Half Length Low Profile NA 1
Riser 2A
PCIe Gen 4 x
16
Riser 2A
PCIe Gen 4 x
16
Half Length Low Profile 1 and 2 2
Half Length Low Profile 2 2
● 12 x 3.5-inch
drives
● 24 x 2.5-inch
drives
● 8 x 2.5-inch
NVMe drives
● No backplane
● 12 x 3.5-inch
drives
● 24 x 2.5-inch
drives
● 8 x 2.5-inch
NVMe drives
● No backplane
● 12 x 3.5-inch
drives
● 24 x 2.5-inch
drives
● 8 x 2.5-inch
NVMe drives
● No backplane
Table 5. Riser configurations: No riser - Processor 1 and 2
Card Type Slot Priority Maximum number of cards
LOM riser ; 1G (Intel) (BASeT) 3 1
LOM riser ; 10G (Mellanox/Broadcom/
QLogic) (BASeT/SFP/SFP+)
LOM riser ; 25G (QLogic/Mellanox) 3 1
BOSS S1V5 (Inventec) 4 1
3 1
Table 6. Riser configurations: Riser 1A - Processor 1 and 2
Card type Slot priority Maximum number of cards
LOM riser ; 1G (Intel/Broadcom)
(BASeT)
LOM riser ; 10G (Broadcom/QLogic)
(BASeT/SFP/SF+/SFP+)
LOM riser ; 25G (QLogic/Mellanox) 3 1
Card,Network 1G (Broadcom/Intel) 1 1
Card,Network 10G (Broadcom/Intel/
QLogic)
3 1
3 1
1 1
6 Technical specifications
Table 6. Riser configurations: Riser 1A - Processor 1 and 2
Card type Slot priority Maximum number of cards
Card,Network 25G (Broadcom/Intel/
QLogic/Mellanox/SolarFlare)
Card,Network 100G (Mellanox) 1 1
GPU: Nvidia T4 16GB 2 1
PCIe SSD (Samsung/Intel) 1 1
PERC 10: External Adapter (Inventec/
Foxconn)
HBA: External Adapter (Foxconn) 1 1
BOSS S1V5 (Inventec) 4 1
1 1
1 1
Table 7. Riser configurations: Riser 1A + Riser 2A - Processor 2
Card type Slot priority Maximum number of cards
LOM riser ; 1G (Intel/Broadcom)
(BASeT)
LOM riser ; 10G (Broadcom/QLogic)
(BASeT/SFP/SF+/SFP+)
LOM riser ; 25G (/QLogic/Mellanox) 3 1
Card,Network 1G (Broadcom/Intel) 1, 2 2
Card,Network 10G (Broadcom/Intel/
QLogic)
3 1
3 1
1, 2 2
Card,Network 25G (Broadcom/Intel/
QLogic/Mellanox/SolarFlare)
Card,Network 100G (Mellanox) 1, 2 2
GPU: Nvidia T4 16GB 2 1
PCIe SSD (Samsung/Intel) 1, 2 2
PERC 10: External Adapter (Inventec/
Foxconn)
HBA: External Adapter (Foxconn) 1 1
BOSS S1V5 (Inventec) 4 1
1, 2 2
1 1
Table 8. Riser configurations: Riser 2A - Processor 2
Card type Slot priority Maximum number of cards
LOM riser ; 1G (Intel/Broadcom)
(BASeT)
LOM riser ; 10G (Broadcom/QLogic)
(BASeT/SFP/SF+/SFP+)
LOM riser ; 25G (QLogic/Mellanox) 3 1
Card,Network 1G (Broadcom/Intel) 2 1
Card,Network 10G (Broadcom/Intel/
QLogic)
3 1
3 1
2 1
Card,Network 25G (Broadcom/Intel/
QLogic/Mellanox/SolarFlare)
Card,Network 100G (Mellanox) 2 1
2 1
Technical specifications 7
Table 8. Riser configurations: Riser 2A - Processor 2
Card type Slot priority Maximum number of cards
GPU: Nvidia T4 16GB 2 1
PCIe SSD (Samsung/Intel) 2 1
BOSS S1V5 (Inventec) 4 1
Memory specifications
Table 9. Memory specifications
Memory
module
sockets
Sixteen 288-pins
DIMM
type
LRDIMM Octal rank 128 GB 128 GB 1024 GB 256 GB 2048 GB
RDIMM
DIMM rank
Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank
DIMM
capacity
16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1024 GB
Single processor Dual processors
Minimum
RAM
Maximum
RAM
Drives specifications
The PowerEdge C6525 sled supports SAS and SATA hard drives and Solid State Drives (SSDs).
Table 10. Supported drive options for the PowerEdge C6525 sled
Maximum number of drives in the
sled
12 x 3.5-inch drive systems Three SAS or SATA hard drives and SSDs per sled
24 x 2.5-inch Non-NVMe drives
configuration
Maximum number of drives assigned per sled
Six SAS or SATA hard drives and SSDs per sled
Minimum
RAM
Maximum
RAM
8 x 2.5-inch NVMe drives
configuration (2 NVMe drives per
sled / 8 NVMe drives per chassis)
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 480 GB
Micro-SD card (optional) for boot
(up to 64 GB)
The NVMe backplane supports either of these configurations:
● Two NVMe drives and four SAS or SATA hard drives and SSDs per sled
NOTE: NVMe drives are limited to PCIe Gen3 speed.
● Six SAS or SATA hard drives and SSDs per sled
NOTE: The M.2 SATA card can be installed on the M.2 riser or on the BOSS card
One on riser 1A
Ports and connectors specifications
USB ports specifications
Table 11. PowerEdge C6525 sled USB port specifications
8 Technical specifications
Table 11. PowerEdge C6525 sled USB port specifications
Back panel
One USB 3.0-compliant port
Display port specifications
The PowerEdge C6525 sled supports one Mini display port.
NIC ports specifications
The PowerEdge C6525 sled supports one 10/100/1000 Mbps Network Interface Controller (NIC) port located on the rear of the
sled.
iDRAC9 port specifications
The PowerEdge C6525 sled supports one iDRAC9 direct port that is located on the rear of the system.
Storage specifications
The PowerEdge C6525 sled supports RAID options with M.2 SATA drives.
Table 12. Supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware
Hardware RAID No Yes
RAID Mode N/A RAID 1
Number of drives supported 1 2
Supported CPUs CPU 1 CPU 1
NOTE: RAID options are only supported on BOSS cards which support two M.2 SATA drives.
RAID
Video specifications
The PowerEdge C6525 sled supports one Matrox G200 integrated graphics card with 16 MB RAM.
Table 13. Supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 up to 24
1280 x 800 60 up to 24
1280 x 1024 60 up to 24
1360 x 768 60 up to 24
1440 x 900 60 up to 24
1600 x 900 60 up to 24
1600 x 1200 60 up to 24
1680 x 1050 60 up to 24
Technical specifications 9
Table 13. Supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1920 x 1080 60 up to 24
1920 x 1200 60 up to 24
Environmental specifications
The sections below contains information about the environmental specifications of the system.
NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet
located with the Manuals & Documents on www.dell.com/poweredgemanuals.
Standard operating temperature specifications
NOTE:
1. Not available: Indicates that the configuration is not offered by Dell EMC.
2. Not supported: Indicates that the configuration is not thermally supported.
NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with
sufficient thermal margin if the ambient temperature is equal to or below the maximum continuous operating temperature
listed in these tables.
NOTE: Some of the system hardware configurations require a lowered upper temperature limit. For more information about
the operating temperature requirement, contact technical support.
Table 14. Standard operating temperature specifications
Standard operating temperature Allowable Operation
Temperature Ranges (For Altitude <900
meters or 2953 feet)
Humidity Percent Ranges 8%RH with -12°C minimum dew point to 85%RH with 24°C (75.2°F) maximum
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/175 meters (1.8°F/574 feet) above
NOTE: Some configurations require a lower ambient temperature. For more information, see the following tables.
The following tables list key restrictions on ambient temperature based on which CPU is configured in the system. All inlet
temperatures that are provided below are in continuous degrees centigrade.
5 to 40°C (41 to 104°F) with no direct sunlight on the platform
Excursion Limited Operation
5 to 35°C (41 to 95°F) Continuous Operation 35 to 40°C (95 to 104°F) 10%
Annual Runtime
dew point
900 meters (2,953 feet)
Table 15. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 Not
7742 225 64 Not
7642 225 48 Not
10 Technical specifications
supported
supported
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20
20
Table 15. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7542 225 32 Not
supported
7702 200 64 20 20 25 25 30
7552 200 48 20 20 25 25 30
7532 200 32 20 20 25 25 30
7502 180 32 20 20 25 25 30
7402 180 24 20 20 25 25 30
7452 155 32 25 25 25 25 30
7352 155 24 25 25 25 25 30
7302 155 16 25 25 25 25 30
7262 155 8 25 25 25 25 30
7282 120 16 30 30 30 35 35
7272 120 12 30 30 30 35 35
7252 120 8 30 30 30 35 35
7F72 240 24 Not
supported
7F52 240 16 Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20
20
Not
supported
7F32 180 8 20 20 25 25 30
NOTE: H745 is Not supported for CPU TDP ≥ 180 Watts.
NOTE:
● 85C Optics Transceiver is required for OCP cards.
● Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration.
Table 16. Maximum continuous operating temperature for dual processor with 3.5-inch Direct drive
configuration - Air cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7H12 280 64 Not supported Not supported Not supported
7742 225 64 Not supported Not supported Not supported
7642 225 48 Not supported Not supported Not supported
7542 225 32 Not supported Not supported Not supported
7702 200 64 Not supported Not supported Not supported
7552 200 48 Not supported Not supported Not supported
7532 200 32 Not supported Not supported Not supported
7502 180 32 Not supported Not supported Not supported
7402 180 24 Not supported Not supported Not supported
7452 155 32 Not supported Not supported Not supported
7352 155 24 Not supported Not supported Not supported
7302 155 16 Not supported Not supported Not supported
Technical specifications 11
Table 16. Maximum continuous operating temperature for dual processor with 3.5-inch Direct drive
configuration - Air cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7262 155 8 Not supported Not supported Not supported
7282 120 16 20 20 20
7272 120 12 20 20 20
7252 120 8 20 20 20
7F72 240 24 Not supported Not supported Not supported
7F52 240 16 Not supported Not supported Not supported
7F32 180 8 Not supported Not supported Not supported
NOTE:
● 85C Optics Transceiver is required for OCP cards
● Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration
Table 17. Maximum continuous operating temperature for dual processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration - Liquid cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 35 35 35 35 35
7742 225 64 35 35 35 35 35
7642 225 48 35 35 35 35 35
7542 225 32 35 35 35 35 35
7702 200 64 35 35 35 35 35
7552 200 48 35 35 35 35 35
7532 200 32 35 35 35 35 35
7502 180 32 35 35 35 35 35
7402 180 24 35 35 35 35 35
7452 155 32 35 35 35 35 35
7352 155 24 35 35 35 35 35
7302 155 16 35 35 35 35 35
7262 155 8 35 35 35 35 35
7282 120 16 35 35 35 35 35
7272 120 12 35 35 35 35 35
7252 120 8 35 35 35 35 35
7F72 240 24 35 35 35 35 35
7F52 240 16 35 35 35 35 35
7F32 180 8 35 35 35 35 35
Table 18. Maximum continuous operating temperature for dual processor with 3.5-inch Direct drive
configuration - Liquid cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7H12 280 64 35 35 35
7742 225 64 35 35 35
12 Technical specifications
Table 18. Maximum continuous operating temperature for dual processor with 3.5-inch Direct drive
configuration - Liquid cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7642 225 48 35 35 35
7542 225 32 35 35 35
7702 200 64 35 35 35
7552 200 48 35 35 35
7532 200 32 35 35 35
7502 180 32 35 35 35
7402 180 24 35 35 35
7452 155 32 35 35 35
7352 155 24 35 35 35
7302 155 16 35 35 35
7262 155 8 35 35 35
7282 120 16 35 35 35
7272 120 12 35 35 35
7252 120 8 35 35 35
7F72 240 24 35 35 35
7F52 240 16 35 35 35
7F32 180 8 35 35 35
NOTE: Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration
Table 19. Maximum continuous operating temperature for single processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 Not
supported
7742 225 64 30 30 30 35 35
7642 225 48 30 30 30 35 35
7542 225 32 30 30 30 35 35
7702 200 64 35 35 35 35 35
7702P 200 64 35 35 35 35 35
7552 200 48 35 35 35 35 35
7532 200 32 35 35 35 35 35
7502 180 32 35 35 35 35 35
Not
supported
Not
supported
Not
supported
Not
supported
7502P 180 32 35 35 35 35 35
7402 180 24 35 35 35 35 35
7402P 180 24 35 35 35 35 35
7452 155 32 35 35 35 35 35
7352 155 24 35 35 35 35 35
Technical specifications 13
Table 19. Maximum continuous operating temperature for single processor with 2.5-inch direct / 2.5-inch
NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7302 155 16 35 35 35 35 35
7302P 155 16 35 35 35 35 35
7262 155 8 35 35 35 35 35
7282 120 16 35 35 35 35 35
7272 120 12 35 35 35 35 35
7252 120 8 35 35 35 35 35
7232P 120 12 35 35 35 35 35
7F72 240 24 30 30 30 35 35
7F52 240 16 30 30 30 35 35
7F32 180 8 35 35 35 35 35
NOTE: Additional thermal restrictions are required for 128GB LRDIMM and GPU configuration
Table 20. Maximum continuous operating temperature for single processor with 3.5-inch Direct drive
configuration - Air cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7H12 280 64 Not supported Not supported Not supported
7742 225 64 20 25 25
7642 225 48 20 25 25
7542 225 32 20 25 25
7702 200 64 25 35 35
7702P 200 64 25 35 35
7552 200 48 25 35 35
7532 200 32 25 35 35
7502 180 32 25 35 35
7502P 180 32 25 35 35
7402 180 24 25 35 35
7402P 180 24 25 35 35
7452 155 32 30 35 35
7352 155 24 30 35 35
7302 155 16 30 35 35
7302P 155 16 30 35 35
7262 155 8 30 35 35
7282 120 16 35 35 35
7272 120 12 35 35 35
7252 120 8 35 35 35
7232P 120 12 35 35 35
7F72 240 24 20 25 25
14 Technical specifications
Table 20. Maximum continuous operating temperature for single processor with 3.5-inch Direct drive
configuration - Air cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7F52 240 16 20 25 25
7F32 180 8 25 35 35
Other thermal restrictions for 280W CPU
● 128GB LRDIMM is Not supported.
● Limits 280W CPU enabled with GPU.
● Does not support PSU redundant mode(1+1).
● Supports PSU Non-Redundant mode (2+0) configuration mode.
T4 GPU card restrictions
Table 21. Maximum continuous operating temperature for dual processor with 1x T4 GPU card for 2.5inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 Not supported
7F72 240 24 Not supported
7F52 240 16 Not supported
7742 225 64
7642 225 48
7542 225 32
7702 200 64
7552 200 48 25
7532 200 32 25
7502 180 32 25
7402 180 24 25
7F32 180 8 25
7452 155 32 25
7352 155 24
7302 155 16 25
7262 155 8 25
7282 120 16
7272 120 12 25 25 30
7252 120 8 25 25 30
Not supported
Not supported
Not supported
Not supported
25
25
25 25 30
NOTE:
● 3.5" chassis (Air cooled) is not able to support GPU card.
● 128GB LRDIMM is Not supported.
● 1x GPU card + OCP card is supported. Slot #2 is first priority for T4 GPU.
● 1x GPU card + PCIe card is supported. Slot #2 is first priority for T4 GPU.
Technical specifications 15
Table 22. Maximum continuous operating temperature for dual processor with 1x T4 GPU card for 2.5inch direct / 2.5-inch NVMe drive configuration - Liquid cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 35 35 35 35 35
7F72 240 24 35 35 35 35 35
7F52 240 16 35 35 35 35 35
7742 225 64 35 35 35 35 35
7642 225 48 35 35 35 35 35
7542 225 32 35 35 35 35 35
7702 200 64 35 35 35 35 35
7532 200 32 35 35 35 35 35
7502 180 32 35 35 35 35 35
7402 180 24 35 35 35 35 35
7F32 180 8 35 35 35 35 35
7452 155 32 35 35 35 35 35
7352 155 24 35 35 35 35 35
7302 155 16 35 35 35 35 35
7262 155 8 35 35 35 35 35
7282 120 16 35 35 35 35 35
7272 120 12 35 35 35 35 35
7252 120 8 35 35 35 35 35
Table 23. Maximum continuous operating temperature for dual processor with 1x T4 GPU card for 3.5inch direct drive configuration - Liquid cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7H12 280 64 Not supported 25 25
7F72 240 24 20 25 25
7F52 240 16 20 25 25
7742 225 64 20 25 25
7642 225 48 20 25 25
7542 225 32 20 25 25
7702 200 64 20 25 25
7532 200 32 20 25 25
7502 180 32 20 25 25
7402 180 24 20 25 25
7F32 180 8 20 25 25
7452 155 32 20 25 25
7352 155 24 20 25 25
7302 155 16 20 25 25
7262 155 8 20 25 25
7282 120 16 20 25 25
16 Technical specifications
Table 23. Maximum continuous operating temperature for dual processor with 1x T4 GPU card for 3.5inch direct drive configuration - Liquid cooled
CPU TDP Cores 12 x drives 8 x drives 4 x drives
7272 120 12 20 25 25
7252 120 8 20 25 25
Table 24. Maximum continuous operating temperature for single processor with 1x T4 GPU card for
2.5-inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 Not
supported
7F72 240 24 20 20 20 20 25
7F52 240 16 20 20 20 20 25
7742 225 64 20 20 20 20 25
7642 225 48 20 20 20 20 25
7542 225 32 20 20 20 20 25
7702 200 64 20 25 25 25 30
7702P 200 64 20 25 25 25 30
7532 200 32 20 25 25 25 30
7502 180 32 20 25 25 25 30
7502P 180 32 20 25 25 25 30
7402 180 24 20 25 25 25 30
7402P 180 24 20 25 25 25 30
7452 155 32 20 25 25 25 35
7352 155 24 20 25 25 25 35
7302 155 16 20 25 25 25 35
Not
supported
Not
supported
Not
supported
Not
supported
7302P 155 16 20 25 25 25 35
7262 155 8 20 25 25 25 35
7282 120 16 25 25 25 30 35
7272 120 12 25 25 25 30 35
7252 120 8 25 25 25 30 35
7232P 120 12 25 25 25 30 35
NOTE:
● 3.5" chassis (Air cooled) is not able to support GPU card.
● 128GB LRDIMM is Not supported.
● OCP card is supported.
Table 25. Maximum continuous operating temperature for dual processor with 128GB LRDIMM for 2.5inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7H12 280 64 Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Technical specifications 17
Table 25. Maximum continuous operating temperature for dual processor with 128GB LRDIMM for 2.5inch direct / 2.5-inch NVMe drive configuration - Air cooled
CPU TDP Cores 24 x drives 16 x drives 8 x drives 4 x drives No BP
7742 225 64 Not
supported
7642 225 48 Not
supported
7542 225 32 Not
supported
7702 200 64 20 20 25 25 25
7532 200 32 20 20 25 25 25
7502 180 32 20 20 25 25 25
7402 180 24 20 20 25 25 25
7452 155 32 20 20 25 25 30
7352 155 24 20 20 25 25 30
7302 155 16 20 20 25 25 30
7262 155 8 20 20 25 25 30
7F72 240 24 Not
supported
7F52 240 16 Not
supported
7282 120 16 20 20 25 30 30
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20
20
20
20
Not
supported
7272 120 12 20 20 25 30 30
7252 120 8 20 20 25 30 30
NOTE: H745 is Not supported for CPU TDP ≥ 180 Watts.
NOTE:
● 128GB LRDIMM is Not supported on 3.5" chassis.
● 128GB LRDIMM is Not supported on liquid cooled chassis.
● T4 GPU card is Not supported with 128GB LRDIMM.
Expanded operating temperature specifications
Table 26. Expanded operating temperature
Expanded operating temperature Allowable Operation
Temperature Ranges (For Altitude
<900 meters or 2953 feet)
Humidity Percent Ranges 8% RH with -12°C minimum dew point to 90% RH with 24°C (75.2°F) maximum
5 to 45°C (41 to 113°F) with no direct sunlight on the platform
Excursion Limited Operation
5 to 35°C (41 to 95°F) Continuous Operation 35 to 40°C (95 to 104°F) 10%
Annual Runtime 40 to 45°C (104 to 113°F)1% Annual Runtime
dew point
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/125 meters (1.8°F/410 feet) above 900
meters (2,953 feet)
NOTE: When operating in the expanded temperature range, system performance may be impacted.
18 Technical specifications
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System
Event Log.
Particulate and gaseous contamination specifications
Table 27. Particulate contamination specifications
Particulate
contamination
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence
NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Specifications
limit.
Table 28. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion
rate
<300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion
rate
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
<200 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Relative humidity specifications
Table 29. Relative humidity specifications
Relative humidity Allowable Operation
Temperature Ranges (For Altitude <900
meters or 2953 feet)
Humidity Percent Ranges 8% RH with -12°C minimum dew point to 80% RH with 21°C (69.8°F)
Operational Altitude De-Rating Maximum temperature is reduced by 1°C/300 meters (1.8°F/984 feet) above
10 to 35°C (50 to 95°F) with no direct sunlight on the platform
maximum dew point
900 meters (2,953 feet)
Maximum vibration specifications
Table 30. Maximum vibration specifications
Technical specifications 19
Table 30. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock specifications
Table 31. Maximum shock specifications
Maximum shock Specifications
Operating
Storage
Six consecutively executed shock pulses 6 G in the positive and negative x, y, z axis for up to 11 ms
(four pulses on each side of the system).
Six consecutively executed shock pulses in the positive and negative x, y, and z axis (one pulse on
each side of the system) of 71 G for up to 2 ms.
Maximum altitude specifications
Table 32. Maximum altitude specifications
Maximum altitude Allowable Operation
Maximum Temperature Gradient (applies
to both operation and non-operation)
Non-Operational Temperature Limits -40 to 65°C (-40 to 149°F)
Non-Operational Humidity Limits 5% to 95% RH with 27°C (80.6°F) maximum dew point. Atmosphere shall be
Maximum Non-Operational Altitude 12,000 meters (39,370 feet)
Maximum Operational Altitude 3,048 meters (10,000 feet)
20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
minutes), 5°C in an hour* (9°F in an hour) for tape hardware
non-condensing at all times
Operating temperature de-rating specifications
Operating temperature de-rating specifications
Table 33. Operating temperature de-rating specifications
Operating temperature derating
< 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft) above 950 meters (3,117
35°C-40°C (95°F-104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above 950 meters (3,117 ft).
> 45°C (113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above 950 meters (3,117 ft).
Specifications
ft).
Fresh Air Operation
Table 34. Fresh Air operation restrictions
Liquid cooled Air Cooled
● NVMe SSD is not supported. ● NVMe SSD is not supported.
20 Technical specifications
Table 34. Fresh Air operation restrictions
Liquid cooled Air Cooled
● LRDIMM is not supported.
● PCIe cards greater than 25W are not supported.
● GPU card is not supported.
● 3.5-inch drive configuration is not supported.
● LRDIMM is not supported.
● PCIe cards greater than 25W are not supported.
● GPU card is not supported.
● 3.5-inch drive configuration is not supported.
● The 2.5-inch, no backplane configuration supports a maximum
processor TDP of 200 Watts only.
● Supports single processor configuration only. No support for dual
processor configuration.
Technical specifications 21
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