Dell EMC PowerEdge C6420
Technical Specifications
Reg ula tor y M ode l: E43 S S eries
Reg ula tor y T ype : E 43S 001
Dec emb er 202 0
Rev . A 06
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2017 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Other trademarks may be trademarks of their respective owners.
Contents
Chapter 1: Technical specifications............................................................................................... 4
Dimensions of the Dell EMC PowerEdge C6420 sled.................................................................................................4
Chassis weight......................................................................................................................................................................4
Processor specifications.................................................................................................................................................... 5
Supported operating systems...........................................................................................................................................5
System battery.....................................................................................................................................................................5
Expansion bus specifications............................................................................................................................................ 5
Memory specifications....................................................................................................................................................... 6
Drives and storage specifications.................................................................................................................................... 6
Video specifications............................................................................................................................................................ 6
Environmental specifications............................................................................................................................................ 7
Standard operating temperature specifications..................................................................................................... 7
Expanded operating temperature specifications .................................................................................................15
Particulate and gaseous contamination specifications....................................................................................... 19
Maximum vibration specifications........................................................................................................................... 20
Maximum shock specifications.................................................................................................................................20
Maximum altitude specifications..............................................................................................................................20
Fresh Air Operation.....................................................................................................................................................20
Contents 3
Technical specifications
The technical and environmental specifications of your system are outlined in this section.
Topics:
• Dimensions of the Dell EMC PowerEdge C6420 sled
• Chassis weight
• Processor specifications
• Supported operating systems
• System battery
• Expansion bus specifications
• Memory specifications
• Drives and storage specifications
• Video specifications
• Environmental specifications
Dimensions of the Dell EMC PowerEdge C6420 sled
1
Figure 1. Dimensions of the PowerEdge C6420 sled
Table 1. Dimensions of the PowerEdge C6420 sled
X Y Z
174.4 mm (6.86 inches) 40.5 mm (1.59 inches) 574.5 mm (22.61 inches)
Chassis weight
Table 2. Chassis weight of the enclosure with the sleds
System Maximum weight (with all sleds and drives)
12 x 3.5-inch hard drive systems 43.62 Kg (96.16 lb)
4 Technical specifications
Table 2. Chassis weight of the enclosure with the sleds (continued)
System Maximum weight (with all sleds and drives)
No backplane systems 34.56 Kg (76.19 lb)
Processor specifications
The Dell EMC PowerEdge C6420 sled supports up to two Intel Xeon Scalable processor in each of the four independent sleds.
Each processor supports up to 28 cores.
NOTE: The fabric processor must be installed in the processor 2 socket in a mixed configuration of fabric and non-fabric
processors.
Supported operating systems
The Dell EMC PowerEdge C6420 supports the following operating systems:
● Red Hat Enterprise Linux
● SUSE Linux Enterprise Server
● Microsoft Windows Server with Hyper-V
● Canonical Ubuntu LTS
● VMware ESXi
● Citrix XenServer
NOTE:
For more information about the specific versions and additions, see https://www.dell.com/support/home/drivers/
supportedos/poweredge-c6420
System battery
The PowerEdge C6420 sled uses a CR 2032 3V replaceable lithium coin cell battery.
NOTE: There is a system battery in each of the sleds.
Expansion bus specifications
The Dell EMC PowerEdge C6420 sled supports four Generation 3 capable PCIe slots.
Table 3. Expansion bus specifications
PCIe Slots Description Form factor
x8 Mezz PCIe riser Slot 1: x8 PCIe Gen3 from processor 1 Custom form factor
x8+x8 OCP Mezz riser
Slot 2: x8 PCIe Gen3 from processor 1
Slot 3: x8 PCIe Gen3 from processor 1
x16 PCIe main riser Slot 4: x16 PCIe Gen3 processor 1 Standard Low Profile PCIe form factor
x16 buried PCIe riser Slot 5: x16 PCIe Gen3 from processor 2 Custom form factor
Standard Open Compute Project (OCP)
form factor
NOTE: M.2 SATA riser is supported
on the buried riser.
Technical specifications 5
Memory specifications
Table 4. Memory specifications
Memory
module
sockets
Sixteen 288-pins
DIMM
type
LRDIMM
RDIMM
DIMM rank
Quad rank 64 GB 64 GB 512 GB 128 GB 1024 GB
Octal rank 128 GB 128 GB 1024 GB 256 GB 2048 GB
Single rank 8 GB 8 GB 64 GB 16 GB 128 GB
Dual rank
DIMM
capacity
16 GB 16 GB 128 GB 32 GB 256 GB
32 GB 32 GB 256 GB 64 GB 512 GB
64 GB 64 GB 512 GB 128 GB 1024 GB
Single processor Dual processors
Minimum
RAM
Maximum
RAM
Minimum
RAM
Drives and storage specifications
The Dell EMC PowerEdge C6420 sled supports SAS and SATA Drives and Solid State Drives (SSDs).
Table 5. Supported drive options for the PowerEdge C6420 sled
Maximum number of drives in the enclosure Maximum number of drives assigned per sled
12 x 3.5-inch drive systems Three SAS or SATA Drives and SSDs per sled
24 x 2.5-inch drive systems Six SAS or SATA Drives and SSDs per sled
Maximum
RAM
24 x 2.5-inch drive systems with NVMe The NVMe backplane supports either of these configurations:
● Two NVMe drives and four SAS or SATA Drives and SSDs
per sled
● Six SAS or SATA Drives and SSDs per sled
M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 240 GB
NOTE: The M.2 SATA card can be installed on the x8
(slot 1) mezzanine riser or the x16 riser slot (slot 5).
microSD card (optional) for boot (up to 64 GB) One on each PCIe riser of each sled
Table 6. Supported RAID options with M.2 SATA drives
Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware
Hardware RAID No Yes
RAID Mode N/A RAID 1
Number of drives supported 1 2
Supported processors processor 1 processor 1 and processor 2
RAID
Video specifications
The Dell EMC PowerEdge C6420 sled supports a Matrox G200 integrated graphics card with 16 MB RAM.
6
Technical specifications
Table 7. Supported video resolution options
Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 up to 24
1280 x 800 60 up to 24
1280 x 1024 60 up to 24
1360 x 768 60 up to 24
1440 x 900 60 up to 24
Environmental specifications
The sections below contains information about the environmental specifications of the system.
NOTE: For additional information about environmental certifications, please refer to the Product Environmental Datasheet
located with the Manuals & Documents on www.dell.com/poweredgemanuals.
Standard operating temperature specifications
NOTE:
1. Not available: Indicates that the configuration is not offered by Dell EMC.
2. Not supported: Indicates that the configuration is not thermally supported.
NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with
sufficient thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature
listed in these tables except for the Mellanox DP LP card and Intel Rush Creek card.
Table 8. Standard operating temperature specifications
Standard operating temperature Specifications
Temperature ranges (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F–95°F) with no direct sunlight on the
equipment.
NOTE: Some configurations require a lower ambient temperature. For more information, see the following tables.
Table 9. Maximum continuous operating temperature for nonfabric dual processor configuration
No-BP
Chassis
TDP
Watts
205 W
Process
or
model
8280
8280L
8280M
Heat sink
model
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
Max
memo
ry/
proce
ssor
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
s
Not
Suppo
rted
(2°C)
8x
Drive
s
Not
Suppo
rted
(10°C
)
4x
Drive
s
Not
Supp
orted
(11°C
)
24x
Driv
es
Not
Supp
orted
(19°
C)
20x
Driv
16x
Drive
es
20 21 21 21 21 30
20 21 21 21 21 30
20 21 21 21 21 30
12x
Drive
s
8x
es
4x
Driv
es
Driv
s
N/A
Technical specifications 7
Table 9. Maximum continuous operating temperature for nonfabric dual processor
configuration (continued)
TDP
Watts
200 W 6254
Process
or
model
8270
8268
8276
8276L
Heat sink
model
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
Max
memo
ry/
proce
ssor
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
s
Not
Suppo
rted(6
°C)
8x
Drive
s
Not
Suppo
rted(1
4°C)
4x
Drive
s
Not
Supp
orted
(15°
C)
24x
20x
Driv
Driv
es
20 21 22 22 22 22 30
30
30 30 30 30 30 35 35
16x
Drive
es
20 21 21 21 21 30
20 21 21 21 21 30
30 30 30 30 35 35
12x
Drive
s
No-BP
Chassis
8x
es
4x
Driv
es
N/A
Driv
s
165 W
150 W
8276M
8260
8260L
8260M
8260C
6252
6248
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
Not
Suppo
rted(11
°C)
Not
Suppo
rted(1
4°C)
30 30 30 30 30 35 35
Not
Suppo
rted(1
8°C)
Not
Supp
orted
(19°
C)
21 23 30 30 30 30 30 35 35
21 23 30 30 30 30 30 35 35
30 30 30 30 30 35 35
30 30 30 30 30 35 35
30 30 30 30 30 35 35
30 30 30 30 30 35 35
8 Technical specifications
Table 9. Maximum continuous operating temperature for nonfabric dual processor
configuration (continued)
TDP
Watts
Process
or
model
6240
6242
6244
6240C
6230
Heat sink
model
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
Max
memo
ry/
proce
ssor
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
8 |
CPU2:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
s
25 30 30 30 30 35 35 35 35 35
8x
Drive
21 23 30 30 30 30 30 35 35
21 23 30 30 30 30 30 35 35
21 23 30 30 30 30 30 35 35
21 23 30 30 30 30 30 35 35
4x
24x
Drive
s
s
Driv
es
20x
Driv
es
16x
Drive
s
12x
Drive
s
8x
Driv
es
4x
Driv
es
Chassis
No-BP
N/A
125 W
5220
5218
5218B
8253
6238T
6230N
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
25 30 30 30 30 35 35 35 35 35
25 30 30 30 30 35 35 35 35 35
25 30 30 30 30 35 35 35 35 35
25 30 30 30 30 35 35 35 35 35
25 30 30 30 30 35 35 35 35 35
25 30 30 30 30 35 35 35 35 35
115 W 5217
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
6 |
CPU2:
8
25 30 30 30 30 35 35 35 35 35
Technical specifications 9
Table 9. Maximum continuous operating temperature for nonfabric dual processor
configuration (continued)
TDP
Watts
105 W
100 W 4216
Process
or
model
5218T
5218N
5222
8256
Heat sink
model
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
FMM2M |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
Max
memo
ry/
proce
ssor
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
6 |
CPU2:
8
CPU1:
8 |
CPU2:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
s
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
8x
Drive
s
4x
Drive
s
24x
Driv
es
20x
Driv
es
16x
Drive
s
12x
Drive
s
8x
Driv
es
4x
Driv
es
Chassis
No-BP
N/A
85 W
5215
5215M
5215L
4215
4214
4214C
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
CPU1:
4210
10 Technical specifications
JYKMM |
CPU2:
V2DRD
CPU1:
8 |
CPU2:
8
35 35 35 35 35 35 35 35 35 35
Table 9. Maximum continuous operating temperature for nonfabric dual processor
configuration (continued)
No-BP
Chassis
N/A
TDP
Watts
70 W 4209T
Process
or
model
4208
3204
Heat sink
model
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
CPU1:
JYKMM |
CPU2:
V2DRD
Max
memo
ry/
proce
ssor
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
CPU1:
8 |
CPU2:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
s
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
8x
Drive
s
4x
Drive
s
24x
Driv
es
20x
Driv
es
16x
Drive
s
12x
Drive
s
8x
Driv
es
4x
Driv
es
Table 10. Maximum continuous operating temperature for non-fabric single processor configuration
No-BP
Chassis
N/A
TDP Watts
Processo
r model
Heat
sink
model
Max
memor
y/
proces
sor
3.5-inch chassis 2.5-inch chassis
12x
Drive
8x
4x
24x
Driv
Driv
s
es
Driv
es
20x
Drive
es
16x
Driv
s
es
12x
Drive
s
8x
Drive
s
4x
Drive
s
8280
8280L
205W
200 W 6254
165 W
8280M
8270
8268
6212U
8276
8276L
8276M
8260
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
6
CPU1:
6
CPU1:
6
CPU1:
6
CPU1:
6
CPU1:
6
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
30 30 30 35 35 35 35 35 35 35
30 30 30 35 35 35 35 35 35 35
30 30 30 35 35 35 35 35 35 35
30 30 30 35 35 35 35 35 35 35
30 30 30 35 35 35 35 35 35 35
30 30 30 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
8260L
8260M
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
8
CPU1:
8
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
Technical specifications 11
Table 10. Maximum continuous operating temperature for non-fabric single processor
configuration (continued)
TDP Watts
150 W
Processo
r model
8260C
6210U
6252
6248
6240
6242
6244
6240C
6230
Heat
sink
model
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
JYKMM
Max
memor
y/
proces
sor
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
6
CPU1:
6
CPU1:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
8x
4x
24x
Driv
Driv
s
es
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
Driv
es
20x
Drive
es
16x
Driv
s
es
12x
Drive
s
8x
Drive
s
4x
Drive
Chassis
s
No-BP
N/A
5220
5218
125W
115 W 5217
105 W
5218B
8253
6238T
6230N
5218T
5218N
5222
8256
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
FMM2M
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
6
CPU1:
6
CPU1:
6
CPU1:
6
CPU1:
6
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
100 W 4216
12 Technical specifications
CPU1:
JYKMM
CPU1:
8
30 35 35 35 35 35 35 35 35 35
Table 10. Maximum continuous operating temperature for non-fabric single processor
configuration (continued)
TDP Watts
85 W
Processo
r model
5215
5215M
5215L
4215
4214
4214C
4210
4208
3204
Heat
sink
model
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
CPU1:
JYKMM
Max
memor
y/
proces
sor
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
CPU1:
8
3.5-inch chassis 2.5-inch chassis
12x
Drive
8x
4x
24x
Driv
Driv
s
es
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
Driv
es
20x
Drive
es
16x
Driv
s
es
12x
Drive
s
8x
Drive
s
4x
Drive
Chassis
s
No-BP
N/A
70 W 4209T
CPU1:
JYKMM
CPU1:
8
35 35 35 35 35 35 35 35 35 35
Table 11. Configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical)
connectivity
TDP Watts
205 W
200 W
173 W
165 W
160 W
150 W
140 W
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
supported
supported
supported
supported
supported
supported
supported
3.5-inch chassis 2.5-inch chassis
Not
Not
Not
Not
Not
Not
Not
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
23 25 28 29 29 30 33
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
24 25 25 26 29
24 25 26 26 30
26 27 28 28 31
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
24 24 28
Not
supported
Not
supported
No-BP
Chassis
23
23
135 W
Not
supported
24 25 29 30 30 31 33
Technical specifications 13
Table 11. Configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical)
connectivity (continued)
TDP Watts
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
130 W
125 W 20 25 27 30 31 32 32 35
115 W 21 27 28 32 33 34 34 >35
113 W 21 27 28 32 33 34 34 >35
105 W 22 28 30 34 35 >35 >35 >35
85 W 23 32 33 >35 >35 >35 >35 >35
70 W 25 34 >35 >35 >35 >35 >35 >35
supported
3.5-inch chassis 2.5-inch chassis
Not
24 26 30 31 31 31 34
Table 12. Configuration Restrictions with Intel Rush Creek
TDP Watts
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
205 W Not
supported
200 W Not
supported
3.5-inch chassis 2.5-inch chassis
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20 20 23
21 21 24
No-BP
Chassis
No-BP
Chassis
173 W Not
supported
165 W Not
supported
160 W Not
supported
150 W Not
supported
140 W Not
supported
135 W Not
supported
130 W Not
supported
125 W Not
supported
115W Not
supported
105 W 20 23 24 30 33 33 34 >35
85 W 24 26 27 34 >35 >35 >35 >35
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
21 23 29 31 31 32 34
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20 26 26 28 29 32
20 27 27 29 29 33
21 28 28 30 30 33
20 20 23 24 28
22 22 24 25 29
22 22 24 26 29
24 24 26 27 30
26 26 27 28 31
70 W 25 28 29 >35 >35 >35 >35 >35
14 Technical specifications
Table 13. Configuration Restrictions with Intel NVMe SSD AIC P4800X
TDP Watts
205 W Not
200 W Not
173 W Not
165 W Not
160 W Not
150 W Not
140 W Not
135 W Not
130 W Not
3.5-inch chassis 2.5-inch chassis
12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A
supported
supported
supported
supported
supported
supported
supported
supported
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20 20 20 20 25
20 20 20 20 25
20 20 20 20 25
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20 20 20 25
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
No-BP
Chassis
Not
supported
Not
supported
20
20
25
125 W Not
supported
115 W Not
supported
105 W Not
supported
85 W Not
supported
70 W Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
Not
supported
20 25 25 25 30
25 25 25 25 30
25 25 25 25 30
30 30 30 30 >35
>35 >35 >35 >35 >35
Expanded operating temperature specifications
Table 14. Expanded operating temperature
Expanded operating temperature Specifications
Continuous operation 5°C–40°C at 5% to 85% RH with maximum 29°C dew point.
NOTE: Outside the standard operating temperature
(10°C–35°C), the system can operate continuously in
temperatures as low as 5°C and as high as 40°C.
For temperatures between 35°C-40°C, derate maximum
allowable temperature by 1°C per 175 m above 950 m (1°F
per 319 ft).
≤ 1% of annual operating hours –5°C–45°C at 5% to 90% RH with maximum 29°C dew
point.
NOTE: Outside the standard operating temperature
(10°C–35°C), the system can operate down to –
Technical specifications 15
Table 14. Expanded operating temperature (continued)
Expanded operating temperature Specifications
5°C-45°C for a maximum of 1% of its annual operating
hours.
For temperatures between 40°C-45°C, derate maximum
allowable temperature by 1°C per 125 m above 950 m (1°F
per 228 ft).
NOTE: When operating in the expanded temperature range, system performance may be impacted.
NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System
Event Log.
Operating temperature derating specifications
Table 15. Operating temperature
Operating temperature derating Specifications
< 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft)
above 950 meters (3,117 ft)
35°C–40°C (95°F–104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft)
above 950 meters (3,117 ft)
> 45°C (113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft)
above 950 meters (3,117 ft)
Relative humidity specifications
Table 16. Relative humidity specifications
Relative humidity Specifications
Storage 5% to 95% RH with 33°C (91°F) maximum dew point.
Atmosphere must be non-condensing at all times.
Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum
dew point
Temperature specifications
Table 17. Temperature specifications
Temperature Specifications
Storage –40°C–65°C (–40°F-149°F)
Continuous operation (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F-95°F) with no direct sunlight on the
equipment.
Fresh air For information about fresh air, see Expanded Operating
Temperature section.
Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)
16 Technical specifications
NOTE: Some configurations require a lower ambient temperature for more information, see the Standard operating
temperature specifications.
Thermal restrictions
Table 18. Thermal restrictions matrix for dual processors
Maximum continuous operating inlet temperature (°C)
3.5" Chassis 2.5" Chassis No-BP
Chassi
s
TDP
Watt
165W 6238RCPU1:
150W 6230RCPU1:
s
Proc
6240RCPU1:
6226RCPU1:
6208UCPU1:
No.
DPN
of
CPU
Heat
Sinks
|
CPU2
:
|
CPU2
:
|
CPU2
:
|
CPU2
:
|
CPU2
:
Max
DIM
M
count
s
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
12x
HDDs8xHDDs4xHDDs
Not Supported 30 30 30 30 30 35 35
Not
Suppo
rted
Not
Supported
21 23 30 30 30 30 30 35 35
21 23 30 30 30 30 30 35 35
21 23 30 30 30 30 30 35 35
24x
HDDs
30 30 30 30 30 35 35
20x
HDDs
16x
HDDs
12x
HDDs8xHDDs4xHDDs
N/A
150W 5220RCPU1:
|
CPU2
:
130W 4215R CPU1:
|
CPU2
:
125W 5218R CPU1:
|
CPU2
:
100W 4214R CPU1:
|
CPU2
:
4210R CPU1:
8 |
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
CPU2
: 8
CPU1:
8 |
21 23 30 30 30 30 30 35 35
25 25 30 30 35 35 35 35 35
25 30 30 30 30 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35
Technical specifications 17
Table 18. Thermal restrictions matrix for dual processors (continued)
Maximum continuous operating inlet temperature (°C)
CPU2
95W 4210T CPU1:
CPU2
85W 3206RCPU1:
CPU2
: 8
CPU2
: 8
CPU1:
|
8 |
CPU2
:
: 8
CPU1:
|
8 |
CPU2
:
: 8
30 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
Table 19. Thermal restrictions matrix for single processor
Maximum continuous operating inlet temperature (°C)
3.5" Chassis 2.5" Chassis No-BP
TDP
Watts
165W 6238R CPU1:|
Proc
No.
DPN of
CPU
Heat
Sinks
CPU2:
Max
DIMM
counts
CPU1:8
|
CPU2:
8
12x
HDDs8xHDDs4xHDDs
30 35 35 35 35 35 35 35 35 35
24x
HDDs
20x
HDDs
16x
HDDs
35
12x
HDDs8xHDDs4xHDDs
Chassi
s
N/A
6240R CPU1:|
CPU2:
150W 6230R CPU1:|
CPU2:
6226R CPU1:|
CPU2:
6208U CPU1:|
CPU2:
5220R CPU1:|
CPU2:
130W 4215R CPU1:|
CPU2:
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
30 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
125W 5218R CPU1:|
CPU2:
18 Technical specifications
CPU1:8
|
CPU2:
8
35 35 35 35 35 35 35 35 35 35
Table 19. Thermal restrictions matrix for single processor (continued)
Maximum continuous operating inlet temperature (°C)
100W 4214R CPU1:|
CPU2:
4210R CPU1:|
CPU2:
95W 4210T CPU1:|
CPU2:
85W 3206R CPU1:|
CPU2:
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
CPU1:8
|
CPU2:
8
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
35 35 35 35 35 35 35 35 35 35
Particulate and gaseous contamination specifications
Table 20. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by
ISO Class 8 per ISO 14644-1 with a 95%
upper confidence limit.
NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc
whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 21. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver coupon corrosion rate <200 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Technical specifications 19
Maximum vibration specifications
Table 22. Maximum vibration specifications
Maximum vibration Specifications
Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).
Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).
Maximum shock specifications
Table 23. Maximum shock specifications
Maximum shock Specifications
Operating 24 executed shock pulses 6 G in the positive and negative x,
y, z axis for up to 11 ms (four pulses on each side of the
system).
Storage Six consecutively executed shock pulses of 71 G in the
positive and negative x, y, z axes for up to 2 ms (one pulse on
each side of the system).
Maximum altitude specifications
Table 24. Maximum altitude specifications
Maximum altitude Specifications
Operating 3048 m (10,000 ft)
Storage 12,000 m (39,370 ft)
Fresh Air Operation
Fresh Air operation restrictions
● Processors with a TDP greater than 105 W are not supported
● Support for processors of 85 W and below without PERC restrictions
● 3.5-inch drive configuration is not supported
● 114-mm heat sink is required for the processor in CPU1 socket
● Kerby-flat OCP is not supported
● M.2 card on DCS Mezzanine slot is not supported.
● NVMe SSD is not supported
● AEP DIMM and LRDIMM are not supported
● PCIe cards greater than 25 W are not supported
● H730 PERC and H330 support for 105-W processors
● No PERC restrictions for 85 W and lesser TDP processors
20
Technical specifications
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