Datasheet STGB7NB60HDT4 Datasheet (SGS Thomson Microelectronics)

Page 1
STGB7NB60HD
N-CHANNEL 7A - 600V DPAK
PowerMESH IGBT
HIGH INPUT IMPEDANCE (VOLTAGE DRIVEN)
cesat
)
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
VERY HIGH FREQUENCY OPERATION
OFF LOSSES INCLUDE TAIL CURRENT
CO-PACKAGED WITH TURBOSWITCH
ANTIPARALLEL DIODE
SURFACE-MOU NTING D2PAK (TO-263) POWER PACKAGE IN TA PE & REEL (SUFFIX "T4")
DESCRIPTION
Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH IGBTs, with outstanding perfomances. The suffix "H" identifies a family optimized to achieve very low switching times for high frequency applications (<120kHz).
APPLICATIONS
HIGH FREQUENCY MOTOR CONTROLS
SMPS AND PFC IN BOTH HARD SWITCH AND RESONANT TOPOLOGIES
®
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
CES
Collector-Emitter Voltage (VGS = 0) 600 V
V
GE
Gate-Emitter Voltage ± 20 V
I
C
Collector Current (continuous) at Tc = 25 oC14A
I
C
Collector Current (continuous) at Tc = 100 oC7A
I
CM
() Collector Current (pulsed) 56 A
P
tot
Total Dissipation at Tc = 25 oC80W Derating Factor 0.64 W/
o
C
T
stg
Storage Temperature -65 to 150
o
C
T
j
Max. Operating Junction Temperature 150
o
C
(•) Pulse width limited by safe operating area
TYPE V
CES
V
CE(sat)
I
C
STGB7NB60HD 600 V < 2.8 V 7 A
June 1999
1
3
D2PAK
TO-263
(Suffix "T 4")
1/8
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THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ
1.56
62.5
0.5
o
C/W
o
C/W
o
C/W
ELECTRICAL CHARACTERISTICS
(T
j
= 25 oC unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
BR(CES)
Collector-Emitter Breakdown Voltage
IC = 250 µA V
GE
= 0 600 V
I
CES
Collector cut-off (V
GE
= 0)
V
CE
= Max Rating Tj = 25 oC
V
CE
= Max Rating Tj = 125 oC
250
2000
µA µA
I
GES
Gate-Emitter Leakage Current (V
CE
= 0)
V
GE
= ± 20 V VCE = 0 ± 100 nA
ON (∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GE(th)
Gate Threshold Voltage
V
CE
= VGE IC = 250 µA35V
V
CE(SAT)
Collector-Emitter Saturation Voltage
VGE = 15 V IC = 7 A V
GE
= 15 V IC = 7 A Tj = 125 oC
2.3
1.9
2.8 V V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
Forward Transconductance
VCE =25 V IC = 7 A 3.5 5 S
C
ies
C
oes
C
res
Input Capacitance Output Capacitance Reverse Transfer Capacitance
V
CE
= 25 V f = 1 MHz V
GE
= 0 390
45 10
560
68 15
730
90 20
pF pF pF
Q
G
Q
GE
Q
GC
Total Gate Charge Gate-Emitter Charge Gate-Collector Charge
VCE = 480 V IC = 7 A VGE = 15 V 42
7.9
17.6
55 nC
nC nC
I
CL
Latching Current V
clamp
= 480 V RG=10
T
j
= 150 oC
28 A
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. M ax. Unit
t
d(on)
t
r
Delay Time Rise Time
VCC = 480 V IC = 7 A V
GE
= 15 V RG = 10
15 48
ns ns
(di/dt)
on
Eon(❍)
Turn-on Current Slope Turn-on Switching
Losses
V
CC
= 480 V IC = 7 A
R
G
= 10 VGE = 15 V
T
j
= 125 oC
160 185
A/µs
µJ
STGB7NB60HD
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ELECTRICAL CHARACTERISTICS (continued) SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
c
tr(v
off
)
t
d
(off)
t
f
E
off
(**)
E
ts
(❍)
Cross-Over Time Off Voltage Rise Time Delay Time Fall Time Turn-off Switching Loss Total Switching Loss
VCC = 480 V I
C
= 7 A
R
GE
= 10 Ω VGE = 15 V
85 20 75 70 85
235
ns ns ns ns
µ
J
µ
J
t
c
tr(v
off
)
t
d
(off)
t
f
E
off
(**)
E
ts
(❍)
Cross-Over Time Off Voltage Rise Time Delay Time Fall Time Turn-off Switching Loss Total Switching Loss
VCC = 480 V I
C
= 7 A
R
GE
= 10 Ω VGE = 15 V
T
j
= 125 oC
150
50 110 110 220 405
ns ns ns ns
µ
J
µ
J
COLLECTOR-EMITTER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
f
I
fm
Forward Current Forward Current pulsed
7
56
A A
V
f
Forward On-Voltage If = 7 A
I
f
= 7 A Tj = 125 oC
1.6
1.4
2.0 V V
t
rr
Q
rr
I
rrm
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
If = 7 A VR=200 V dI/dt = 100 A/µS T
j
= 125 oC
100 180
3.6
ns
nC
A
(•) Pulse width limited by max. junction temperature (
) Include recovery losses on the STTA506 freewheeling diode (∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (**)Losses Include Also The Tail (Jedec Standardi zat io n)
Thermal Impedance
STGB7NB60HD
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Page 4
Output Characteristics
Transconductance
Collector-Emitter On Voltage vs Collector Current
Transfer Characteristics
Collector-Emitter On Voltage vs Temperature
Gate Threshold vs Temperature
STGB7NB60HD
4/8
Page 5
Normalized Breakdown Voltage vs Temperature
Gate Charge vs Gate-Emitter Voltage
Total Switching Losses vs Temperature
Capacitance Variations
Total Switching Losses vs Gate Resistance
Total Switching Losses vs Collector Current
STGB7NB60HD
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Page 6
Switching Off Safe Operating Area Diode Forward Voltage
Fig. 1: Gate Charge test Circuit
Fig. 3: Switching Waveforms
Fig. 2: Test Circuit For Inductive Load Switching
STGB7NB60HD
6/8
Page 7
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.21 1.36 0.047 0.053
D 8.95 9.35 0.352 0.368 E 10 10.4 0.393 0.409 G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.624 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068
L2
L3
L
B2
B
G
E
A
C2
D
C
A1
DETAIL "A"
DETAIL "A"
A2
P011P6/E
TO-263 (D2PAK) MECHANICAL DATA
STGB7NB60HD
7/8
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STGB7NB60HD
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