that the device is in dedicated port charging
mode
■ Latch-up performance exceeds 500 mA per
JESD 78, Class II
■ ESD performance exceeds JESD22:
– Dn pins: 4000-V human body model
– All other pins: 2000-V human body model
Applications
■ Mobile phones
Table 1.Device summary
= 4.8 Ω (TA = 25 ºC) at VCC = 4.3 V
ON
= 5.9 Ω (TA = 25 ºC) at VCC = 3.0 V
ON
(opr) = 1.65 V to 4.3 V
CC
= 2.3 V to 3.0 V
CC
(A114-A)
(A114-A)
STG3220
QFN10
(1.8 x 1.4 mm)
Description
The STG3220 is a high-speed CMOS low voltage
dual analog SPDT (single pole dual throw) switch
or 2:1 multiplexer/de-multiplexer switch fabricated
in silicon gate C
to operate from 1.65 V to 4.3 V, making this
device ideal for portable applications.
The SEL input is provided to control the switch.
The switch nS1 is ON (connected to common
ports Dn) when the SEL input is held high and
OFF (high impedance state exists between the
two ports) when SEL is held low; the switch nS2 is
ON (it is connected to common port Dn) when the
SEL input is held low and OFF (high impedance
state exists between the two ports) when SEL is
held high. STG3220 has an integrated fail safe
function to withstand over-voltage condition when
the device is powered off.
The STG3220 also has an interrupt pin which
sends a signal to the processor when the device
is in dedicated port charging mode. Additional key
features are fast switching speed, break-beforemake-delay time and ultra low power
consumption. All inputs and outputs are equipped
with protection circuits against static discharge,
giving them ESD immunity and transient excess
voltage.
The STG3220 has a built-in dedicated port charging detection circuit to detect the condition
when the USB D+/D- lines are both in high state. When this occurs, the device sends an
interrupt signal to the processor to indicate that the connected USB device is in dedicated
port charging mode.
Figure 4.Interrupt function logic representation
INT
D1
D2
1S1
1S2
2S1
2S2
SEL
Doc ID 15647 Rev 15/23
Page 6
Maximum ratingSTG3220
4 Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4.Absolute maximum ratings
SymbolParameterValueUnit
V
CC
V
V
V
I
IKC
I
IK
I
OK
I
O
I
OP
or I
I
CC
P
T
stg
T
Supply voltage-0.5 to 5.5V
DC input voltage-0.5 to VCC + 0.5V
I
DC control input voltage-0.5 to 5.5V
IC
DC output voltage-0.5 to VCC + 0.5V
O
DC input diode current on control pin (V
DC input diode current (V
< 0V)±50mA
SEL
< 0V)-50mA
SEL
DC output diode current±20mA
DC output current±128mA
DC output current peak (pulse at 1ms, 10% duty cycle)±300mA
DC VCC or ground current±100mA
GND
Power dissipation at TA = 70 °C
D
(1)
Storage temperature-65 to +150°C
Lead temperature (10 sec)300°C
L
1. Derate above 70 °C by 18.5 mW/°C.
4.1 Recommended operating conditions
Table 5.Recommended operating conditions
1120mW
SymbolParameterValueUnit
V
CC
V
V
V
T
op
dt/dv
Supply voltage1.65 to 4.3V
Input voltage0 to V
I
Control input voltage0 to 4.3V
IC
Output voltage0 to V
O
Operating temperature-40 to 85°C
Input rise and fall time control
input
6/23 Doc ID 15647 Rev 1
= 1.65 V to 2.7 V0 to 20
V
L
= 3.0 to 4.3 V0 to 10
V
L
CC
CC
V
V
ns/V
Page 7
STG3220Electrical characteristics
5 Electrical characteristics
Table 6.DC specifications
Val ue
SymbolParameter
V
(V)
CC
Test
conditions
= 25 °C-40 to 85 °C
A
MinTypMaxMinMax
UnitT
V
V
V
IH-INT
V
IL-INT
V
OL-INT
High level input
IH
voltage
Low level input
IL
voltage
High level input
voltage for INT
Low level input
voltage for INT
Low level output
voltage for INT
1.65 – 1.95
0.65 V
CC
––0.65VCC–
2.3 – 2.51.2––1.2–
2.7 – 3.01.3––1.3–
–
3.3 – 3.61.4––1.4–
4.31.6––1.6–
1.65 – 1.95
––0.25–0.25
2.3 – 2.5––0.25–0.25
2.7 – 3.0––0.25–0.25
–
3.3 – 3.6––0.30–0.30
4.3––0.40–0.40
4.3–2.4––2.4–V
4.3–––0.9–0.9V
4.3I
1.8
= 4 mA––0.40–0.50V
O
–15.117.8––
V
V
R
PEAK
Switch ON peak
resistance
2.7–6.48.0––
3.0–5.97.5––
3.7–5.06.5––
= 0 V to
V
S
V
CC
= 8 mA
I
S
Ω
4.3–4.86.1––
= 3 V
V
3.0
ON
Switch ON
resistance
R
3.0
S
I
= 8 mA
S
= 0.4 V
V
S
IS = 8 mA
–4.25.4––
Ω
–5.77.0––
Doc ID 15647 Rev 17/23
Page 8
Electrical characteristicsSTG3220
Table 6.DC specifications (continued)
Val ue
SymbolParameter
V
(V)
CC
Test
conditions
= 25 °C-40 to 85 °C
A
MinTypMaxMinMax
UnitT
∆R
R
I
FLAT
OFF
I
IN
I
CC
ON resistance
match between
ON
channels
ON resistance
flatness
OFF state
leakage current
(Sn), (D)
Input leakage
current
Quiescent supply
current
(2)
(1)
1.8
–––––
2.7–––––
3.0–0.1–––
3.7–––––
VS at RON max
IS = 8 mA
Ω
4.3–––––
= 0 V to
V
S
1.8
1.8
2.7–2.2–––
3.0–1.8–––
3.7–1.6–––
0.4 V
= 8 mA
I
S
VS = 0 V to
VCC
= 8 mA
I
S
–4.5–––
–9.0–––
Ω
4.3–1.6–––
4.3V
0 to 4.3
1.65 to 4.3
= 0.3 or 4 V-20–20-100100nA
S
= 0 to
V
SEL
4.3 V
V
SEL
GND
= VCC or
-0.2–0.2-1.01.0µ
-0.20.2-1.01.0µ
A
A
V
= 1.65 V–±37±50–±100
Quiescent supply
I
CCLV
current for low
4.3
voltage driving
1. ΔRON = max |mSN-nSN|, where m = 1, 2 and n = 1, 2, N = 1, 2
2. Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the
specified analog signal ranges.
1. Off isolation = 20 Log10 (VD/VS), VD = output, VS = input to off switch.
10/23 Doc ID 15647 Rev 1
Page 11
STG3220Electrical characteristics
Table 9.USB related AC electrical characteristics
Val ue
SymbolParameter
V
CC
(V)
Tes t
conditions
= 25 °C-40 to 85 °C
A
MinTypMaxMinMax
UnitT
t
SK(0)
t
SK(P)
T
J
Channel-tochannel skew
3.0 - 3.6C
Skew of
opposite
transition of the
3.0 - 3.6C
same output
Total jitter3.0 - 3.6
= 10 pF–26–––ps
L
= 10 pF–60–––ps
L
RL = 50 Ω
= 10 pF
C
L
= tF =
t
R
–130– – –ps
750 ps
at 480 Mbps
Doc ID 15647 Rev 111/23
Page 12
Test circuitSTG3220
6 Test circuit
Figure 5.ON resistance
I
DS
V
V
CC
S1
D
VS
S2
GND
IN
GND
CS14071
12/23 Doc ID 15647 Rev 1
Page 13
STG3220Test circuit
Figure 6.OFF leakage
V
CC
I
S(OFF)
A
V
SS
V
CC
Figure 7.OFF isolation
I
D(OFF)
D
A
V
D
S2
IN
GND
CS14081
V
CC
S1
50 Ω
V
OUT
S2
IN
GND
V
S
GND
CS00381
Doc ID 15647 Rev 113/23
Page 14
Test circuitSTG3220
Figure 8.Bandwidth
V
CC
S1
S2
IN
V
CC
Figure 9.Channel-to-channel crosstalk
GND
D
V
OUT
CS00371
14/23 Doc ID 15647 Rev 1
CS14091
Page 15
STG3220Test circuit
Figure 10. Test circuit
1. CL= 5/35 pF or equivalent (includes jig and probe capacitance)
=50Ω or equivalent
2. R
L
3. R
T=ZOUT
of pulse generator (typically 50 Ω)
Doc ID 15647 Rev 115/23
Page 16
Test circuitSTG3220
Figure 11. Break-before-make time delay
Figure 12. Switching time and charge injection
(V
= 0 V, R
GEN
= 0 Ω, RL = 1 MΩ, CL = 100 pF)
GEN
Figure 13. Turn ON, turn OFF delay time
16/23 Doc ID 15647 Rev 1
Page 17
STG3220Package mechanical data
7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Figure 14. Package outline for QFN10 (1.8 x 1.4 x 0.5 mm) - 0.4 mm pitch
7936408 Rev.D
Doc ID 15647 Rev 117/23
Page 18
Package mechanical dataSTG3220
Table 2. Mechanical data for QFN10 (1.8 x 1.4 x 0.5 mm) - 0.4 mm pitch
Symbol
Min Typ Max
A 0.45 0.50 0.55
A1 0 0.02 0.05
A3 0.127
b 0.15 0.20 0.25
D 1.75 1.80 1.85
E 1.35 1.40 1.45
e 0.40
L 0.35 0.40 0.45
Figure 15. Footprint recommendations for QFN10 (1.8 x 1.4 x 0.5 mm) - 0.4 mm pitch
Millimeters
18/23 Doc ID 15647 Rev 1
Page 19
STG3220Package mechanical data
Figure 16. Carrier tape for QFN10 (1.8 x 1.4 x 0.5 mm) - 0.4 mm pitch
Doc ID 15647 Rev 119/23
Page 20
Package mechanical dataSTG3220
Figure 17. Reel information (front side) for QFN10 (1.8 x 1.4 x 0.5 mm) - 0.4 mm pitch
20/23 Doc ID 15647 Rev 1
Page 21
STG3220Package mechanical data
Figure 18. Reel information (back view) for QFN10 (1.8 x 1.4 x 0.5 mm) - 0.4 mm pitch
Doc ID 15647 Rev 121/23
Page 22
Revision historySTG3220
8 Revision history
Table 10.Document revision history
DateRevisionChanges
14-May-20091Initial release.
22/23 Doc ID 15647 Rev 1
Page 23
STG3220
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