Datasheet HMC310MS8G Datasheet (Hittite)

MICROWAVE CORPORATION

v01.0401

HMC310MS8G

BLUETOOTH & 2.4 GHz

Typical Applications

1

Transmit & Receive
Switch for 2.4 GHz Applications:

• Bluetooth

• HomeRF

• WLAN Radios

Functional Diagram

AMPLIFIERS - SMT

WLAN TRANSCEIVER

Features

Tx Gain: 15 dB, Rx Gain: 13 dB
Tx 1 dB Compression Point: 5 dBm
Rx Noise Figure: 3 dB @ 2.4 GHz
Single Positive Supply: +3V
No External Matching Required

General Description

The HMC310MS8G is a multifunction RFIC that
incorporates a power amplifi er (P A) and lo w noise
amplifi er (LNA) with a transmit/receive switch. The
RFIC offers 15 dB gain and +5 dBm P1dB in the
transmit mode and 13 dB of gain with an overall
noise fi gure of 3 dB when in receive mode. Trans­mit and receive performance levels have been
selected to meet the BLUETOOTH Class 2 & 3
requirements when used in conjunction with 2.4
GHz ASICs such as National Semiconductor’s
LMX3162. This low current and low cost trans­ceiver requires no external circuitry to operate the
amplifi er power down features, and is availab le in
the industry standard MSOP8G package, which
is 0.118” x 0.190” (3.0mm x 4.9mm).

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Guaranteed Performance, Vdd = +3V, +25° C

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C°52@erugiFesioN0.30.4Bd

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(tnerruCylppuSdI)d2142Am

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

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MICROWAVE CORPORATION

v01.0401

HMC310MS8G

BLUETOOTH & 2.4 GHz

WLAN TRANSCEIVER

GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz

Rx Gain Rx Noise Figure

20
18
16
14
12
10

Gain (dB)

8
6
4
2
0

2 2.2 2.4 2.6 2.8 3

FREQUENCY (GHz)

+25C
+85C

-40C

Rx Return Loss Rx 1dB Compression Point

0

-5

-10

Return Loss (dB)

-15

-20
2 2.2 2.4 2.6 2.8 3

Input Return Loss
Output Return Loss

FREQUENCY (GHz)

5

4.5
4

3.5
3

2.5
2

Noise Figure (dB)

1.5
1

0.5
0

2 2.2 2.4 2.6 2.8 3

FREQUENCY (GHz)

0

-1

-2

-3

-4

-5

-6

P1dB (dBm)

-7

-8

-9

-10

2 2.2 2.4 2.6 2.8 3

FREQUENCY (GHz)

+25C

+85C

-40C

+25C
+85C

-40C

1

AMPLIFIERS - SMT

Rx Output Third Order Intercept Point

10

9
8
7
6
5

IP3 (dBm)

4
3
2
1
0

2 2.2 2.4 2.6 2.8 3

FREQUENCY (GHz)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

1 - 3

MICROWAVE CORPORATION

v01.0401

HMC310MS8G

BLUETOOTH & 2.4 GHz

GaAs MMIC SUB-HARMONICALLY PUMPED MIXER 17 - 25 GHz

Tx Gain

1

AMPLIFIERS - SMT

20
18
16
14
12
10

Gain (dB)

8
6
4
2
0

2 2.2 2.4 2.6 2.8 3

FREQUENCY (GHz)

Tx 1dB Compression Point

10

9
8
7
6
5
4

P1dB (dBm)

3
2
1
0

2 2.2 2.4 2.6 2.8 3

FREQUENCY (GHz)

+25C
+85C

-40C

+25C
+85C

-40C

WLAN TRANSCEIVER

Tx Return Loss

0

-5

-10

Return Loss (dB)

-15

-20

2 2.2 2.4 2.6 2.8 3

Tx Output Third Order Intercept Point

15
14
13
12
11
10

IP3 (dBm)

9
8
7
6
5

2 2.2 2.4 2.6 2.8 3

Input Return Loss
Output Return Loss

FREQUENCY (GHz)

FREQUENCY (GHz)

1 - 4

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

MICROWAVE CORPORATION

v01.0401

HMC310MS8G

BLUETOOTH & 2.4 GHz

Absolute Maximum Ratings

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Pin Locations & Outline Drawing

WLAN TRANSCEIVER

T ruth T able

evitcAnoitceSxTddV=LTCV
evitcAnoitceSxRV0=LTCV

1

AMPLIFIERS - SMT

1. MA TERIAL:
A. PACKAGE BODY - LOW STRESS INJECTION -MOLDED

PLASTIC, SILICA & SILICONE INPREGNATED.
B. LEADFRAME MATERIAL: COPPER ALLOY

2. PLATING: LEAD-TIN SOLDER PLATE

3. DIMENSIONS ARE IN INCHES (MILLIMETERS)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

4. CHARACTERS TO BE HELVETICA MEDIUM, .030 HIGH
USING WHITE INK, LOCATED APPROX AS SHOWN

5. DIMENSION DOES NOT INCLUDE MOLDFLASH
OF 0.15mm PER SIDE.

6. DIMENSION DOES NOT INCLUDE MOLDFLASH
OF 0.25mm PER SIDE.

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MICROWAVE CORPORATION

v01.0401

HMC310MS8G

BLUETOOTH & 2.4 GHz

HMC310MS8G Evaluation PCB

1

AMPLIFIERS - SMT

WLAN TRANSCEIVER

Note:
DC blocking capacitors on the Tx and ANT
ports are required to evaluate this part.
These capacitors may not be required in
the fi nal circuit design if interfacing com­ponents are DC blocked.

The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground leads and backside ground slug should be connected
directly to the ground plane similar to that shown. A suffi cient number of via holes should be used to con-
nect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon
request.

Evaluation Circuit Board Layout Design Details

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0534sregoR:lairetaMdraoBtiucriC*

1 - 6

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

MICROWAVE CORPORATION

v01.0401

HMC310MS8G

BLUETOOTH & 2.4 GHz

Notes:

WLAN TRANSCEIVER

1

AMPLIFIERS - SMT

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Visit us at www.hittite.com, or Email at [e-mail]

1 - 7