IDEAL FOR 802.11, HomeRF,
& BLUETOOTH APPLICATIONS
ULTRA SMALL 8 LEAD MSOP:
14.8 mm² x 1mm High
AMPLIFIERS
SMT
V01.0900
General Description
The HMC309MS8 is a versatile integrated low
noise amplifier (LNA) and transmit/receive switch
front-end for 2.3 to 2.5 GHz spread spectrum
applications including BLUETOOTH, HomeRF,
802.11 WLAN, and 2.4 GHz ISM radios. The
LNA offers 8 dB gain and 2.5 dB noise figure
while the transmit switch path has 0.5 dB insertion loss and better than +30 dBm linear power
handling. Using a single control line, the LNA is
powered down when the switch Tx port is selected minimizing Idd current consumption to 5
mA in the Rx mode and 120 uA in the Tx mode
at Vdd = +3V bias. The HMC309MS8 may be
directly interfaced with popular 2.4 GHz transceiver chips. At a height of 0.040” (1.0mm), the
MSOP8 package is ideal for low profile portable
wireless devices.
Guaranteed Performance, Vdd = +3V, -40 to +85 deg C
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373Web Site: www.hittite.com
1 - 110
Page 4
MICROWAVE CORPORATION
2.4 GHz FRONT-END LNA / SWITCH IC
HMC309MS8
V01.0900
Schematic
CTL(PIN 5)
POWER
MANAGEMENT
ANT
(PIN 2)
Tx
Note:
(PIN 4)
DC blocking capacitors are required on the
ANT port (Pin 2) and the Tx port (Pin 4).
Vdd (PIN 6)
Ground (PINS 1, 3, 7)
Outline
Rx
(PIN 8)
FEBRUARY 2001
Absolute Maximum Ratings
)ddV(egatloVylppuScdV8+
V
ddVot
mBd01-
mBd43+
o
C
o
W/C
o
C
o
C
TNA@rewoPtupnI
)V3+=ddV,"NO"ANL(
xT@rewoPtupnI
)V3+=ddV,"NO"hctiwS(
)cT(erutarepmeTlennahC571
)cj(ecnatsiseRlamrehT
)ediskcaBlennahC(
erutarepmeTegarotS051+ot56-
erutarepmeTgnitarepO58+ot55-
)LTC(egnaRegatloVlortnoC2.0-
23
T ruth Table
Control Input Tolerances are ± 0.2 Vdc
lortnoC
)cdV(tupnI
LTCxRotTNATNAotxT
0nOffO
3+ffOnO
htaPlangiS
1
AMPLIFIERS
SMT
1. MATERIAL:
A) PACKAGE BODY - LOW STRESS INJECTIONMOLDED PLASTIC.
B) LEADFRAME MATERIAL: COPPER ALLOY
2 . PLATING : LEAD - TIN SOLDER PLATE
3. DIMENSIONS ARE IN INCHES (MILLIMETERS).
UNLESS OTHERWISE SPECIFIED ALL TOL. ARE ±0.005(±0.13).
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 MM PER SIDE
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 MM PER SIDE
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373Web Site: www.hittite.com
1 - 111
Page 5
MICROWAVE CORPORATION
2.4 GHz FRONT-END LNA / SWITCH IC
HMC309MS8
FEBRUARY 2001
Evaluation PCB for HMC309MS8
1
AMPLIFIERS
SMT
V01.0900
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads should be connected directly to the ground plane similar
to that shown above. A sufficient number of VIA holes should be used to connect the top and bottom ground
planes. The evaluation circuit board as shown is available from Hittite upon request.
List of Material
metInoitpircseD
3J,2J,1JrotcennoCFRAMStnuoMCP
6J,5J,4JsniPCD
1UreifilpmA8SM903CMH
*BCP"55.1x"5.1draoBlavE
0534sregoR:lairetaMdraoBtiucriC*
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373Web Site: www.hittite.com
1 - 112
Page 6
MICROWAVE CORPORATION
2.4 GHz FRONT-END LNA / SWITCH IC
HMC309MS8
V01.0900
NOTES:
FEBRUARY 2001
1
AMPLIFIERS
SMT
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373Web Site: www.hittite.com
1 - 113
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