Datasheet HMC300LM1 Datasheet (Hittite)

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

FEBRUARY 2001

Features

SMT mmWave package

1

Gain > 15 dB
Broadband Performance
Saturated Output Power: +24 dBm
Positive Supply : +5V to +7V

AMPLIFIERS

SMT

V00.1200

General Description

The HMC300LM1 is a low cost broadband
surface mount medium power amplifier that
operates between 25.5 and 33.5 GHz. A 0.25
um power pHEMT process is used to achieve
efficient gain and output power performance.
High volume surface mount re-flow assembly
techniques may be used to mount the amplifier
to the end user’s PCB. The LM1 package elimi­nates the need for wire bonding or die attach
mounting. The amplifier provides 15 dB of gain
and +24 dBm of saturated output power across
various microwave radio bands. This millimeter
wave amplifier requires no external RF match­ing components and minimal DC bypass com­ponents. The amplifier operates from a +6V Vdd
and a -0.35 Vgg gate bias.

Guaranteed Performance,

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C°52@niaG316122Bd

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ssoLnruteRtupnI 58 Bd

ssoLnruteRtuptuO58Bd

noitalosIesreveR 5305Bd

)Bd1P(noisserpmoCBd1rofrewoPtuptuO0232mBd

)tasP(rewoPtuptuOdetarutaS 1242mBd

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)enothcaemBd5-=rewoPtupnIenot-owT(

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*)cdV0.6=ddV()ddI(tnerruCylppuS 022572Am

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* Adjust Vgg1 between -1.0 to 0V to achieve Idd= 220 mA typical.

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

1 - 94

Vdd = +6V, -40 to +85 deg C

1262mBd

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

V00.1200

Broadband Gain & Return Loss

25
20
15
10

5
0

-5

RESPONSE (dB)

-10

-15

-20

-25
20 25 30 35 40

FREQUENCY (GHz)

S21
S11
S22

Input Return Loss vs.
Temperature @ Vdd= +6V

0

-5

-10

FEBRUARY 2001

Gain vs. Temperature @ Vdd= +6V

25

20

15

GAIN (dB)

10

+25 C

5

0

24 25 26 27 28 29 30 31 32 33 34 35

+85 C

-40 C

FREQUENCY (GHz)

Output Return Loss vs.
Temperature @ Vdd= +6V

0

-5

-10

1

AMPLIFIERS

SMT

RETURN LOSS (dB)

-15

-20
24 25 26 27 28 29 30 31 32 33 34 35

+25 C
+85 C

-40 C

FREQUENCY (GHz)

P1dB Output Power vs.
Temperature @ Vdd= +6V

30

25

20

15

10

Output P1dB (dBm)

5

0

24 25 26 27 28 29 30 31 32 33 34 35

+25 C
+85 C

-40 C

FREQUENCY (GHz)

RETURN LOSS (dB)

-15

-20
24 25 26 27 28 29 30 31 32 33 34 35

FREQUENCY (GHz)

+25 C
+85 C

-40 C

Output IP3 vs.
Temperature @ Vdd= +6V

35

30

25

20

15

10

5

THIRD ORDER INTERCEPT POINT (dBm)

0

24 25 26 27 28 29 30 31 32 33 34 35

+25 C
+85 C

-40 C

FREQUENCY (GHz)

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

1 - 95

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

FEBRUARY 2001

Gain vs. Vdd

1

GAIN (dB)

AMPLIFIERS

SMT

Output Return Loss vs. Vdd

25

20

15

10

Vdd=+5V

5

0

24 25 26 27 28 29 30 31 32 33 34 35

0

-5

-10

Vdd=+6V
Vdd=+7V

FREQUENCY (GHz)

Input Return Loss vs. Vdd

0

-5

-10

RETURN LOSS (dB)

-15

-20
24 25 26 27 28 29 30 31 32 33 34 35

Vdd=+5V
Vdd=+6V
Vdd=+7V

FREQUENCY (GHz)

P1dB Output Power vs. Vdd

30

25

20

15

V00.1200

10

RETURN LOSS (dB)

-15

-20
24 25 26 27 28 29 30 31 32 33 34 35

FREQUENCY (GHz)

Vdd=+5V
Vdd=+6V
Vdd=+7V

Output P1dB (dBm)

5

0

24 25 26 27 28 29 30 31 32 33 34 35

Vdd=+5V
Vdd=+6V
Vdd=+7V

FREQUENCY (GHz)

Psat Output Power vs. Vdd IP3 vs. Vdd

30

25

20

15

Psat (d Bm)

10

5

0

24 25 26 27 28 29 30 31 32 33 34 35

Vdd=+5V
Vdd=+6V
Vdd=+7V

FREQUENCY (GHz)

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

35

30

25

20

15

10

5

THIRD ORDER INTERCEPT POINT (dBm)

0

24 25 26 27 28 29 30 31 32 33 34 35

Vdd=+5V
Vdd=+6V
Vdd=+7V

FREQUENCY (GHz)

1 - 96

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

V00.1200

Functional Diagram

Note:
Dashed lines
represent I/Os
on bottom of
package.

Outline

(

Bottom View)

(Top View)

FEBRUARY 2001

Absolute Maximum Ratings

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Note: Use HMC marking
and dot to establish proper
orientation.

Wm3531

o

C

o

C

1

AMPLIFIERS

SMT

1. MATERIAL:
A) PACKAGE BODY & LID: PLASTIC.
B) PIN CONTACT : COPPER, 0.5 OUNCE.

2. PLATING : ELECTROLYTIC GOLD (50-225 MICROINCHES) OVER

ELECTROLYTIC NICKEL (75 TO 225 MICROINCHES).

3. DIMENSIONS ARE IN INCHES (MILLIMETERS).UNLESS OTHERWISE SPECIFIED

ALL TOLERANCES ARE ± 0.005 (± 0.13).

4. ALL GROUNDS MUST BE SOLDERED TO THE PCB RF GROUND.

5. SEE APPLICATION NOTE FOR RECOMMENDED ATTACHMENT TECHNIQUE TO PCB.

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

1 - 97

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

FEBRUARY 2001

HMC300LM1 Evaluation PCB

1

AMPLIFIERS

SMT

V00.1200

The grounded Co-Planar Wave Guide (G-CPW) PCB input/output transitions allows use of Ground-Signal­Ground (GSG) probes for testing. Suggested probe pitch is 400µm (16 mils). Alternatively, the board can
be mounted in a metal housing with 2.4 mm coaxial connectors.

Evaluation Circuit Board Layout Design Details

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2C.gkP6021,roticapaCFp000,33

LM1 package mounted to evaluation PCB

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

1 - 98

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

V00.1200

HMC300LM1 Application Circuit

C1

Vdd1

C2

Vdd2

HMC300LM1

Vgg1

C2

C2

C1

C1

RF OUT

FEBRUARY 2001

1

AMPLIFIERS

SMT

seulaVtnenopmoCdednemmoceR

1CFp001

2CFp000,33

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

Note: Vgg1 should be applied to Pin 6 to provide appropriate
bias level to Amplifier. Voltage level should be adjusted until
nominal Idd of 200 mA is reached.

1 - 99

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

FEBRUARY 2001

HMC300LM1 Recommended SMT Attachment Technique

Preparation & Handling of the LM1 Millimeterwave Package for Surface Mounting

1

The HMC LM1 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM1 package requires a specific mounting pattern to allow
proper mechanical attachment and to optimize electrical
performance at millimeterwave frequencies. This PCB layout
pattern can be found on each LM1 product data sheet. It can
also be provided as an electronic drawing upon request from
Hittite Sales & Application Engineering.

Follow these precautions to avoid permanent damage:

AMPLIFIERS

Cleanliness:

clean devices and PCBs. LM1 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.

Static Sensitivity:

ESD strikes ( see catalog page 8 - 2 ).

SMT

General Handling:

vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure
to the top of the lid.

Solder Materials & Temperature Profile:

not recommended. Conductive epoxy attachment is not recommended.

Solder Paste

Solder paste should be selected based on the user’s experience and be compatible with the metallization systems
used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes.

Observe proper handling procedures to ensure

Follow ESD precautions to protect against

Handle the LM1 package on the top with a

Follow the information contained in the application note. Hand soldering is

225
200
175

C)

0

150
125
100

TEMPERATURE (

75
50
25

012345678

Recommended solder reflow profile

for HMC LM1 SMT package

TIME (min)

V00.1200

Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical
& electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.

Solder Reflow

The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.

Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.

Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to
thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to
evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off.
The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to with­stand a peak temperature of 235°C for 15 seconds. Verify that the profile will not expose device to temperatures in
excess of 235°C.

Cleaning

A water-based flux wash may be used.

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

1 - 100

MICROWAVE CORPORATION

SMT MEDIUM POWER AMPLIFIER 25.5 - 33.5 GHz

HMC300LM1

V00.1200

NOTES:

FEBRUARY 2001

1

AMPLIFIERS

SMT

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

1 - 101