Datasheet HMC292LM3C Datasheet (hittite)

查询HMC292LM3C供应商

12

MICROWAVE CORPORATION

Typical Applications

The HMC292LM3C is ideal for:

• Microwave Point to Point Radios

• Multi-Point/LMDS Radios

• SATCOM

Functional Diagram

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HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

Features

Input IP3: +19 dBm

LO / RF Isolation: 25 to 40 dB

Passive: No DC Bias Required

Leadless SMT Package, 25mm

General Description

The HMC292LM3C is a 17 - 31 GHz surface
mount passive GaAs MMIC double-balanced
mixer in a SMT leadless chip carrier package.
The mixer can be used as a downconverter or
upconverter. Excellent isolations are provided by
on-chip baluns, which require no external com­ponents and no DC bias. All data is with the non­hermetic, epoxy sealed LM3C packaged device
mounted in a 50 Ohm test fi xture. Utilizing the
HMC292LM3C eliminates the need for wirebond­ing, thereby providing a consistent connection
interface for the customer.

2

MIXERS - SMT

Electrical Specifi cations, T

Frequency Range, RF & LO 18 - 28 17 - 31 GHz

Frequency Range, IF DC - 6 DC - 6 GHz

Conversion Loss 7.5 9.5 8 11 dB

Noise Figure (SSB) 7.5 9.5 8 11 dB

LO to RF Isolation 26 35 21 32 dB

LO to IF Isolation 20 25 20 25 dB

RF to IF Isolation 22 33 20 30 dB

IP3 (Input) 17 19 15 19 dBm

IP2 (Input) 45 50 42 50 dBm

1 dB Gain Compression (Input) 8 12 8 12 dBm

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= +25° C

A

Parameter

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

LO= +13 dBm, IF= 1 GHz LO= +13 dBm, IF= 1 GHz

Min. Typ. Max. Min. Typ. Max.

Units

MICROWAVE CORPORATION

Conversion Gain vs.
Temperature @ LO = +13 dBm

0

-5

-10

-15

CONVERSION GAIN (dB)

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+25 C

-40 C
+85 C

HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

Isolation @ LO = +13 dBm

0

RF/IF

-10

-20

-30

ISOLATION (dB)

-40

LO/RF
LO/IF

-20
15 20 25 30 35

FREQUENCY (GHz)

Conversion Gain vs. LO Drive

0

LO = + 9 dBm
LO = + 11 dBm

-5

-10

-15

CONVERSION GAIN (dB)

-20
15 20 25 30 35

FREQUENCY (GHz)

LO = + 13 dBm
LO = + 15 dBm

IF Bandwidth @ LO = +13 dBm

0

-50
15 20 25 30 35

FREQUENCY (GHz)

RF & LO
Return Loss @ LO = +13 dBm

0

LO

-5

-10

RETURN LOSS (dB)

-15

-20
15 20 25 30 35

FREQUENCY (GHz)

RF

Upconverter Performance
Conversion Gain @ LO = +13 dBm

0

12

MIXERS - SMT

-5

-10

RESPONSE (dB)

-15

-20
0246810

IF FREQUENCY (GHz)

RETURN LOSS

CONVERSION GAIN

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

-5

-10

-15

CONVERSION GAIN (dB)

-20
15 20 25 30 35

FREQUENCY (GHz)

12 - 115

MICROWAVE CORPORATION

Input IP3 vs. LO Drive

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HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

Input IP3 vs.
Temperature @ LO = +13 dBm

25

20

15

10

5

INPUT IP3 (dBm)

0

-5

12

15 20 25 30 35

Input IP2 vs. LO Drive

80

70

60

50

40

30

INPUT IP2 (dBm)

20

MIXERS - SMT

10

0

15 20 25 30 35

LO= 8 dBm

LO= 10 dBm

LO= 13 dBm

FREQUENCY (GHz)

LO= 8 dBm
LO= 10 dBm
LO= 13 dBm

FREQUENCY (GHz)

25

20

15

10

5

INPUT IP3 (dBm)

0

-5
15 20 25 30 35

FREQUENCY (GHz)

Input IP2 vs.
Temperature @ LO = +13 dBm

80

70

60

50

40

30

INPUT IP2 (dBm)

20

10

0

15 20 25 30 35

FREQUENCY (GHz)

-40 C

+25 C

+85 C

-40 C
+25 C
+85 C

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Input P1dB vs.
Temperature @ LO = +13 dBm

15

13

11

9

INPUT P1dB (dBm)

7

5

15 20 25 30 35

FREQUENCY (GHz)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

MxN Spurious Outputs

mRF01234

0xx11

117039

-40 C

+25 C

+85 C

Order Online at www.hittite.com

2707776

3936986

4 >110 >110 >110

RF= 21 GHz @ -10 dBm
LO= 22 GHz @ +13 dBm
All values in dBc below the IF power level.

nLO

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MICROWAVE CORPORATION

Absolute Maximum Ratings

RF / IF Input +13 dBm

LO Drive +27 dBm

Storage Temperature -65 to +150 deg C

Operating Temperature -40 to +85 deg C

Outline Drawing

HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

12

NOTES:

1. MATERIAL: PLASTIC

2. PLATING: GOLD OVER NICKEL

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. ALL TOLERANCES ARE ± 0.005 [± 0.13].

5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.

6.

INDICATES PIN 1

•

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

MIXERS - SMT

12 - 117

v00.0302

MICROWAVE CORPORATION

HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

Pin Descriptions

Pin Number Function Description Interface Schematic

1, 2, 3 N/C

4 RF

12

5IF

6LO

MIXERS - SMT

This pin may be connected to the housing ground or

left unconnected.

RF Port. This pin is DC coupled and matched to 50 Ohm

from 18 - 31 GHz

IF Port. This pin is DC coupled. For applications not requiring

operation to DC, this port should be DC blocked externally using

a series capacitor whose value has been chosen to pass the

necessary IF frequency range. For operation to DC, this pin must

not source/sink more than 2 mA of current or die non-function and

possible die failure will result.

LO Port. This pin is DC coupled and matched to 50 Ohm

from 18 - 31 GHz.

12 - 118

GND Package base must be soldered to PCB RF ground.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

MICROWAVE CORPORATION

Evaluation PCB

v00.0302

HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

MIXER, 18 - 31 GHz

12

The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal­Ground (GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can
be mounted in a metal housing with 2.4 mm coaxial connectors.

Evaluation Circuit Board Layout Design Details

Layout Technique Micro Strip to CPWG

Material Rogers 4003 with 1/2 oz. Cu

Dielectric Thickness 0.008” (0.20 mm)

Microstrip Line Width 0.018” (0.46 mm)

CPWG Line Width 0.016” (0.41 mm)

CPWG Line to GND Gap 0.005” (0.13 mm)

Ground Via Hole Diameter 0.008” (0.20 mm)

LM3 package mounted to evaluation PCB

MIXERS - SMT

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

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12

v00.0302

MICROWAVE CORPORATION

HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

Suggested LM3-C PCB Land Pattern Tolerance: ± 0.003” (± 0.08 mm)

MIXERS - SMT

12 - 120

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

v00.0302

MICROWAVE CORPORATION

HMC292LM3C

GaAs MMIC DOUBLE-BALANCED

SMT MIXER, 17 - 31 GHz

HMC292LM3C Recommended SMT Attachment Technique

Preparation & Handling of the LM3-C Millimeterwave Package for Surface Mounting

The HMC LM3-C package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM3-C package requires a specifi c mounting pattern to allow
proper mechanical attachment and to optimize electrical perfor­mance at millimeterwave frequencies. This PCB layout pattern
can be found on each LM3-C product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
Sales & Application Engineering.

Follow these precautions to avoid permanent damage:

Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3-C devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.

Static Sensitivity: Follow ESD precautions to protect against ESD strikes.

General Handling: Handle the LM3-C package on the top with a vacuum collet or along the edges with a sharp pair of

bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure
to the top of the lid.

Solder Materials & Temperature Profi le: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.

Solder Paste

Solder paste should be selected based on the user’s experience and be compatible with the metallization systems used.
See the LM3-C data sheet Outline drawing for pin & ground contact metallization schemes.

Solder Paste Application

Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste
will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.

225

200

175

C)

0

150

125

100

TEMPERATURE (

75

50

25

012345678

TIME (min)

12

MIXERS - SMT

Solder Refl ow

The soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. A solder
refl ow profi le is suggested above.

Prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and vary­ing component masses. The fi nal profi le should be determined by mounting the thermocouple to the PCB at the location
of the device.

Follow solder paste and oven vendor’s recommendations when developing a solder refl ow profi le. A standard profi le
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the
fl ux to completely activate. Refl ow must then occur prior to the fl ux being completely driven off. The duration of peak
refl ow temperature should not exceed 15 seconds. Packages have been qualifi ed to withstand a peak temperature of
235°C for 15 seconds. Verify that the profi le will not expose device to temperatures in excess of 235°C.

Cleaning

A water-based fl ux wash may be used.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]

Order Online at www.hittite.com

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