FEATURES
SNR = 75 dB, fIN 15 MHz up to 105 MSPS
SNR = 72 dB, f
200 MHz up to 105 MSPS
IN
SFDR = 89 dBc, fIN 70 MHz up to 105 MSPS
100 dB Multitone SFDR
IF Sampling to 200 MHz
Sampling Jitter 0.1 ps
1.5 W Power Dissipation
Differential Analog Inputs
Pin Compatible to AD6644
Twos Complement Digital Output Format
3.3 V CMOS Compatible
DataReady for Output Latching
APPLICATIONS
Multichannel, Multimode Receivers
Base Station Infrastructure
AMPS, IS-136, CDMA, GSM, WCDMA
Single Channel Digital Receivers
Antenna Array Processing
Communications Instrumentation
Radar, Infrared Imaging
Instrumentation
PRODUCT DESCRIPTION
The AD6645 is a high speed, high performance, monolithic 14-bit
analog-to-digital converter. All necessary functions, including
track-and-hold (T/H) and reference, are included on the chip to
provide a complete conversion solution. The AD6645 provides
CMOS compatible digital outputs. It is the fourth generation in a
wideband ADC family, preceded by the AD9042 (12-bit, 41 MSPS),
the AD6640 (12-bit, 65 MSPS, IF sampling), and the AD6644
(14-bit, 40 MSPS/65 MSPS).
Designed for multichannel, multimode receivers, the AD6645
is part of Analog Devices’ SoftCell
®
transceiver chipset. The
AD6645 maintains 100 dB multitone, spurious-free dynamic
range (SFDR) through the second Nyquist band. This breakthrough performance eases the burden placed on multimode
digital receivers (software radios) that are typically limited by the
ADC. Noise performance is exceptional; typical signal-to-noise
ratio is 74.5 dB through the first Nyquist band.
The AD6645 is built on Analog Devices’ high speed complementary bipolar process (XFCB) and uses an innovative, multipass
circuit architecture. Units are available in a thermally enhanced
52-lead PowerQuad 4® (LQFP_PQ4) specified from –40°C to
+85°C at 80 MSPS and –10°C to +85°C at 105 MSPS.
PRODUCT HIGHLIGHTS
1. IF Sampling
The AD6645 maintains outstanding ac performance up to
input frequencies of 200 MHz, suitable for multicarrier 3G
wideband cellular IF sampling receivers.
2. Pin Compatibility
The ADC has the same footprint and pin layout as the
AD6644, 14-Bit 40 MSPS/65 MSPS ADC.
3. SFDR Performance and Oversampling
Multitone SFDR performance of –100 dBc can reduce the
requirements of high end RF components and allows the
use of receive signal processors such as the AD6620 or
AD6624/AD6624A.
FUNCTIONAL BLOCK DIAGRAM
DV
AV
CC
CC
AIN
AIN
VREF
ENCODE
ENCODE
A1TH2A2TH4ADC3TH5TH3TH1
2.4V
INTERNAL
TIMING
GNDDMID OVR DRYD13
ADC1
DAC1ADC2DAC2
5
D12D11D10D9D8D7D6D5D4D3D2D1D0
MSB
REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
No Missing CodesFullIIGuaranteedGuaranteed
Offset ErrorFullII–10+1.2+10–10+1.2+10mV
Gain ErrorFullII–100+10–100+10% FS
Differential Nonlinearity (DNL)FullII–1.0± 0.25+1.5–1.0±0.5+1.5LSB
Integral Nonlinearity (INL)FullV±0.5±1.5LSB
TEMPERATURE DRIFT
Offset ErrorFullV1.51.5ppm/°C
Gain ErrorFullV4848ppm/°C
VREF is provided for setting the common-mode offset of a differential amplifier such as the AD8138 when a dc-coupled analog input is required. VREF should be
buffered if used to drive additional circuit functions.
2
Specified for dc supplies with linear rise time characteristics.
Encode Rising to DataReady Fallingt
Encode Rising to DataReady Risingt
FullV1.02.03.11.02.03.1ns
DR
FullVt
E_DR
ENCH
+ t
DR
t
ENCH
+ t
DR
ns
(50% Duty Cycle)FullV7.38.39.45.76.757.9ns
ENCODE/DATA (D13:0), OVR
ENC to DATA Falling Lowt
ENC to DATA Rising Lowt
ENCODE to DATA Delay (Hold Time) t
ENCODE to DATA Delay (Setup Time) t
FullV2.44.77.02.44.77.0ns
E_FL
FullV1.43.04.71.43.04.7ns
E_RL
FullV1.43.04.71.43.04.7ns
H_E
FullVt
S_E
ENC
– t
E_FL(max)
t
ENC
– t
E_FL(typ)
t
ENC
– t
E_FL(min)
t
ENC
– t
E_FL(max)
t
ENC
– t
E_FL(typ)
t
ENC
– t
E_FL(min)
ns
ns
ns
(50% Duty Cycle)FullV5.37.610.02.34.87.0ns
DataReady (DRY3)/DATA, OVR
DataReady to DATA Delay (Hold Time) t
FullVNote 4Note 4
H_DR
(50% Duty Cycle)6.67.27.95.15.76.4ns
DataReady to DATA Delay (Setup Time) t
FullVNote 4Note 4
S_DR
(50% Duty Cycle)2.13.65.10.62.13.5ns
APERTURE DELAYt
APERTURE UNCERTAINTY (Jitter)t
NOTES
1
Several timing parameters are a function of t
2
ENCODE TO DATA Delay (Hold Time) is the absolute minimum propagation delay through the analog-to-digital converter, t
3
DRY is an inverted and delayed version of the encode clock. Any change in the duty cycle of the clock will correspondingly change the duty cycle of DRY.
4
DataReady to DATA Delay (t
H_DR
and t
ENC
) is calculated relative to rated speed grade and is dependent on t
S_DR
25°CV–500–500ps
A
25°CV0.10.1ps rms
J
and t
ENCH
.
= t
H_E
.
and duty cycle.
ENC
E_RL
Specifications subject to change without notice.
AIN
ENC, ENC
t
D[13:0], OVR
DRY
t
A
N
N+1
N+2
t
t
ENC
NN+1N+2N+3N+4
E_RL
t
t
E_FL
ENCH
ENCL
t
E_DR
t
S_DR
t
DR
t
H_DR
t
N+3
S_E
Figure 1. Timing Diagram
N+4
t
H_E
NN–1N–2N–3
–4–
REV. B
ABSOLUTE MAXIMUM RATINGS*
ParameterMinMaxUnit
ELECTRICAL
AVCC Voltage07V
Voltage07V
DV
CC
Analog Input Voltage0AV
CC
V
Analog Input Current25mA
Digital Input Voltage0AV
CC
V
Digital Output Current4mA
ENVIRONMENTAL
-80 Operating Temperature Range (Ambient)–40+85°C
-105 Operating Temperature Range (Ambient)–10+85°C
Maximum Junction Temperature150°C
Lead Temperature (Soldering, 10 sec)300°C
Storage Temperature Range (Ambient)–65+150°C
* Absolute maximum ratings are limiting values to be applied individually and beyond which the serviceability
of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute
maximum rating conditions for an extended period of time may affect device reliability.
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although the AD6645
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
3VREF2.4 V Reference. Bypass to ground with a 0.1 µF microwave chip capacitor.
5ENCEncode Input. Conversion initiated on rising edge.
6ENCComplement of ENC, Differential Input.
8, 9, 14, 16, 18, AV
CC
5 V Analog Power Supply.
22, 26, 28, 30
11AINAnalog Input.
12AINComplement of AIN, Differential Analog Input.
20C1Internal Voltage Reference. Bypass to ground with a 0.1 µF chip capacitor.
24C2Internal Voltage Reference. Bypass to ground with a 0.1 µF chip capacitor.
31DNCDo not connect this pin.
32OVR*Overrange Bit. A logic level high indicates analog input exceeds ±FS.
35DMIDOutput Data Voltage Midpoint. Approximately equal to (DV
CC
)/2.
36D0 (LSB)Digital Output Bit (Least Significant Bit); Twos Complement.
37–41, 44–50D1–D5, D6–D12Digital Output Bits in Twos Complement.
51D13 (MSB)Digital Output Bit (Most Significant Bit); Twos Complement.
52DRYDataReady Output.
*The functionality of the overrange bit is specified for a temperature range of 25°C to 85°C only.
–6–
REV. B
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