FEATURES
Four 80 MSPS Wideband Inputs (14 Linear Bits Plus 3 RSSI)
4 Real Input Ports/2 Complex Input Ports
Processes 4 Wideband Channels (UMTS or cdma2000
1x) or 8 GSM/EDGE, IS136 Channels
8 Independent Digital Receivers in a Single Package
Four 16-Bit Parallel Output Ports and Four 8-Bit Link Ports
4 Programmable Digital AGC Loops with 96 dB Range
Digital Resampling for Noninteger Decimation Rates
Programmable Decimating FIR Filters
4 Interpolating Half-Band Filters
Flexible Control for Multicarrier and Phased Array
FUNCTIONAL BLOCK DIAGRAM
INA[13:0]
EXPA[2:0]
IENA
LIA-A
LIA-B
INB[13:0]
EXPB[2:0]
IENB
LIB-A
LIB-B
INC[13:0]
EXPC[2:0]
IENC
LIB-A
LIB-B
IND[13:0]
EXPD[2:0]
IEND
LID-A
LID-B
SYNCA
SYNCB
SYNCC
SYNCD
I
N
P
U
T
M
A
T
R
I
X
I
N
P
U
T
M
A
T
R
I
X
EXTERNAL
SYNC.
CIRCUIT
NCO
NCO
NCO
NCO
NCO
NCO
NCO
NCO
rCIC2
RESAMPLER
rCIC2
RESAMPLER
rCIC2
RESAMPLER
rCIC2
RESAMPLER
rCIC2
RESAMPLER
rCIC2
RESAMPLER
rCIC2
RESAMPLER
rCIC2
RESAMPLER
CLK
CIC5
CIC5
CIC5
CIC5
CIC5
CIC5
CIC5
CIC5
RSP
CLK
Programmable Attenuator Control for Clip Prevention and
External Gain Ranging via Level Indicator
3.3 V I/O, 2.5 V CMOS Core
User Configurable Built-in Self Test (BIST) Capability
APPLICATIONS
Multicarrier, Multimode Digital Receivers
GSM, IS136, EDGE, PHS, IS95, UMTS, cdma2000
Micro and Pico Cell Systems, Software Radios
Wireless Local Loop
Smart Antenna Systems
In-Building Wireless Telephony
RAM
COEFFICIENT
FILTER
CHANNEL 0
RAM
COEFFICIENT
FILTER
CHANNEL 1
RAM
COEFFICIENT
FILTER
CHANNEL 2
RAM
COEFFICIENT
FILTER
CHANNEL 3
RAM
COEFFICIENT
FILTER
CHANNEL 4
RAM
COEFFICIENT
FILTER
CHANNEL 5
RAM
COEFFICIENT
FILTER
CHANNEL 6
RAM
COEFFICIENT
FILTER
CHANNEL 7
BUILT-IN (BIST)
SELF-TEST CIRCUITRY
TO A AND B
OUTPUT
PORTS
TO A AND B
OUTPUT
PORTS
CH A INTERPOLATING
HALF-BAND FILTER,
INTERLEAVING & AGC
TO A AND B
OUTPUT
PORTS
CH B INTERPOLATING
HALF-BAND FILTER,
INTERLEAVING & AGC
TO A AND B
OUTPUT
PORTS
TO C AND D
OUTPUT
PORTS
TO C AND D
OUTPUT
PORTS
CH C INTERPOLATING
HALF-BAND FILTER,
INTERLEAVING & AGC
TO C AND D
OUTPUT
PORTS
CH D INTERPOLATING
HALF-BAND FILTER,
INTERLEAVING & AGC
TO C AND D
OUTPUT
PORTS
MICROPORT OR SERIAL
PORT CONTROL
RCF OUTPUTS
CHANNELS 0,
RCF OUTPUTS
CHANNELS 0,
RCF OUTPUTS
CHANNELS 4, 5, 6, 7
RCF OUTPUTS
CHANNELS 4,
1, 2,
1, 2,
5, 6,
PORT A
LINK PORT
3
OR
PARALLEL
PORT
CH A AND B
OUTPUT MUX
CIRCUITRY
PORT B
LINK PORT
OR
PARALLEL
PORT
3
PORT C
8-BIT DSP
LINK PORT
OR
16-BIT
PARALLEL
OUTPUT
CH C AND D
OUTPUT MUX
CIRCUITRY
PORT D
8-BIT DSP
LINK PORT
OR
16-BIT
7
PARALLEL
OUTPUT
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
The AD6635 is a multimode, 8-channel, digital Receive Signal
Processor (RSP) capable of processing up to four WCDMA
channels. Each channel consists of four cascaded signal-processing elements: a frequency translator, two CIC decimating filters,
and a programmable coefficient-decimating filter. Each input
port has input level threshold detection circuitry for accommodating large dynamic ranges or situations where gain ranging
converters are used. Quad 16-bit parallel output ports accommodate high data rate WBCDMA applications. On-chip
interpolating half-band filters can also be used to further
increase the output rate. In addition, each output port has a
digital AGC for accommodating large dynamic ranges using
smaller bit widths. The AGCs can maintain either signal level or
clipping level, depending on their mode. Link port outputs are
provided to enable glueless interfaces to Analog Devices’
TigerSHARC DSP core.
The AD6635 is part of Analog Devices’ SoftCell Multicarrier
transceiver chipset designed for compatibility with Analog Devices’
family of high sample rate IF sampling ADCs (AD9238/AD6645
12-bit and 14-bit). The SoftCell receiver comprises a digital
receiver capable of digitizing an entire spectrum of carriers and
digitally selecting the carrier of interest for tuning and channel
selection. This architecture eliminates redundant radios in wireless
base station applications.
High dynamic range decimation filters offer a wide range of
decimation rates. The RAM-based architecture allows easy
reconfiguration for multimode applications.
The decimating filters remove unwanted signals and noise from
the channel of interest. When the channel of interest occupies
less bandwidth than the input signal, this rejection of out-of-band
noise is called “processing gain.” By using large decimation
factors, processing gain can improve the SNR of the ADC by
30 dB or more. In addition, the programmable RAM coefficient
filter allows antialiasing, matched filtering, and static equalization functions to be combined in a single, cost-effective filter.
Half-band interpolating filters at the output are used in various
applications, especially in WCDMA or cdma2000 applications,
to increase the output rate from 2¥ to 4¥ the chip rate. The
AD6635 is equipped with four independent automatic gain
control (AGC) loops for direct interface to a RAKE receiver.
The AD6635 is compatible with standard ADC converters, such
as the AD664x, AD943x, AD923x, and the AD922x families of
data converters. The AD6635 is also compatible with the
AD6600 Diversity ADC, and hence can be designed into existing systems that use AD6600 ADCs.
Each channel of the AD6635 has four signal processing stages:
a Frequency Translator, a second-order Resampling Cascaded
Integrator Comb FIR Filter (rCIC2), a fifth-order Cascaded
Integrator Comb FIR Filter (CIC5), and a RAM Coefficient
FIR Filter (RCF). Multiple modes are supported for clocking
data into and out of the chip, and for providing flexibility for interfacing to a wide variety of digitizers. Programming and control is
accomplished via serial and/or microprocessor interfaces.
Frequency translation is accomplished with a 32-bit complex
Numerically Controlled Oscillator (NCO). Real data entering
this stage is separated into inphase (I) and quadrature (Q) components by multiplying with the complex NCO word. This stage
translates the input signal from a digital intermediate frequency
(IF) to digital baseband. Phase and amplitude dither may be
enabled on-chip to improve spurious performance of the NCO.
A phase-offset word is available to create a known phase relationship between multiple AD6635s or between channels.
Following frequency translation is a fixed coefficient, high speed,
second-order, Resampling Cascade Integrator Comb (rCIC2) filter
that reduces the sample rate based on the ratio between the decimation and interpolation registers.
The next stage is a fifth-order Cascaded Integrator Comb (CIC5)
filter whose response is defined by the decimation rate. The purpose of these filters is to reduce the data rate to the final filter stage
(RCF), so that it can calculate more taps for the same RCF bandwidth. The CIC5 filter has better antialiasing (filtering) compared
to rCIC2. In light of this, the user is advised to use this filter only if
resampling is required or if the required decimation cannot be
handled by CIC5 alone.
The final stage is a sum-of-products FIR filter with programmable 20-bit coefficients, and decimation rates programmable
from 1 to 256 (1 to 32 in practice). The RAM Coefficient FIR
Filter (RCF) can handle a maximum of 160 taps.
The data coming out of the RCF can be sent to output ports or
to an interleaver. This section can interleave data from more
than one channel. One carrier can be processed using more than
one channel and the interleaver will interleave the data back into
the output section. This way, processing power from more than
one channel can be used for one carrier.
The interleaved data is sent into a fixed coefficient half-band
interpolation filter where data is interpolated by a factor of two.
Digital AGC following the half-band filter has a gain range of
96.3 dB. This AGC section is completely programmable in
terms of its response. Four each of half-band filters and AGCs
are present in the AD6635, as shown in the Functional Block
Diagram. These half-band filters and AGC sections can be
bypassed independent of each other.
The overall filter response for the AD6635 is the composite of
all decimating and interpolating stages. Each successive filter
stage is capable of narrower transition bandwidths, but requires
a greater number of CLK cycles to calculate the output. More
decimation in the first filter stage will minimize overall power
consumption. Each independent filter stage can be bypassed in
a unique way. Data from the chip is interfaced to the DSP via
either a high speed parallel port or a TigerSHARC compatible
link port. Each output can be independently configured to use
either the parallel port or the link port.
Figure 1 illustrates the tuning function of the AD6635 NCOs to
select and filter a single channel from a wide input spectrum.
The frequency translator “tunes” the desired carrier to baseband. Figure 2 shows the combined filter response of the rCIC2,
CIC5, and RCF filters for a sample filter configuration.
REV. 0
–5–
AD6635
–
f
/2–3
S
–
f
/2–3
S
WIDEBAND INPUT SPECTRUM
SIGNAL OF INTEREST “IMAGE”SIGNAL OF INTEREST
f
/8–5
f
/16–
f
/4–3
f
/16–
f
/8–
f
/8–
/16
S
f
/16
S
S
f
/8–5
S
S
f
S
S
AFTER FREQUENCY TRANSLATIONNCO “TUNES” SIGNAL TO BASEBAND
/16–
f
S
S
WIDEBAND INPUT SPECTRUM (e.g., 30MHz FROM HIGH SPEED ADC)
/4–3
f
S
FREQUENCY TRANSLATION (e.g., SINGLE 1MHz CHANNEL TUNED TO BASEBAND)
/16–
S
f
S
f
/2 TO
f
(
SAMPLE
dc
dc
f
/16
S
f
/16
S
SAMPLE
f
S
f
S
/2)
/8
3f
/16
f
S
/8
3f
/16
S
/4
S
f
/4
S
Figure 1. AD6635 Frequency Translation of Wideband Input Spectrum
20
5f
/16
3f
/8
f
S
5f
/16
S
S
3f
/8
S
/2
S
f
/2
S
0
CIC RESPONSE
dBc
–100
–120
–20
–40
–60
–80
–1.5 10
4
–1.0 10
COMPOSITE
RESPONSE
DESIRED
RESPONSE
4
–500005000
kHz
1.0 10
4
1.5 10
4
Figure 2. Composite Filter Response of rCIC2, CIC5, and RCF for a Sample Filter Configuration
REV. 0–6–
AD6635
SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
Test AD6635BB
ParameterTempLevelMinTypMaxUnit
VDDIV2.252.52.75V
VDDIOIV3.03.33.6V
T
AMBIENT
ELECTRICAL CHARACTERISTICS
Parameter (Conditions)TempLevelMinTypMaxUnit
LOGIC INPUTS (5 V TOLERANT)
Logic CompatibilityFullIV3.3 V CMOS
Logic 1 VoltageFullIV2.05.0V
Logic 0 VoltageFullIV–0.3+0.8V
Logic 1 CurrentFullIV110A
Logic 0 CurrentFullIV110A
Logic 1 Current (inputs with pull-down)FullIV
Logic 0 Current (inputs with pull-up)FullIV
Input Capacitance25∞CV4pF
LOGIC OUTPUTS
Logic CompatibilityFullIV
Logic 1 Voltage (I
Logic 0 Voltage (IOL = 0.25 mA)FullIV0.20.4V
Input to ≠CLKn Setup TimeFullIV2.0ns
Input to ≠CLKn Hold TimeFullIV1.0ns
LEVEL INDICATOR OUTPUT SWITCHING CHARACTERISTICS
t
DLI
≠CLKn to LIx-y Output Delay TimeFullIV3.310.0ns
SYNC TIMING REQUIREMENTS
t
SS
t
HS
SYNC(A, B, C, D) to ≠CLKn Setup TimeFullIV2.0ns
SYNC(A, B, C, D) to ≠CLKn Hold TimeFullIV1.0ns
SERIAL PORT CONTROL TIMING REQUIREMENTS
SWITCHING CHARACTERISTICS
t
SCLK
t
SCLKL
t
SCLKH
SCLKn (n = 0, 4) PeriodFullIV16ns
SCLKn Low TimeFullIV3.0ns
SCLKn High TimeFullIV3.0ns
2
INPUT CHARACTERISTICS
t
SSI
t
HSI
PARALLEL PORT TIMING REQUIREMENTS
(MASTER MODE) SWITCHING CHARACTERISTICS
t
DPOCLKL
t
DPOCLKLL
t
DPREQ
t
DPP
SDIn to ØSCLKn Setup TimeFullIV1.0ns
SDIn to ØSCLKn Hold TimeFullIV1.0ns
3
ØCLKn to ≠PCLKn Delay (Divide by 1)FullIV6.510.5ns
ØCLKn to ≠PCLKn Delay (Divide by 2, 4, or 8) FullIV8.314.6ns
≠CLKn to ≠PxREQ Delay1.0ns
≠CLKn to Px[15:0] Delay0.0ns
INPUT CHARACTERISTICS
t
SPA
t
HPA
PARALLEL PORT TIMING REQUIREMENTS
(SLAVE MODE) SWITCHING CHARACTERISTICS
t
POCLK
t
POCLKL
t
POCLKH
t
DPREQ
t
DPP
PxACK to ØPCLKn Setup Time7.0ns
PxACK to ØPCLKn Hold Time–3.0ns
3
PCLKn PeriodFullI12.5ns
PCLKn Low Period (when PCLK Divisor = 1)FullIV2.00.5 ⫻ t
PCLKn High Period (when PCLK Divisor = 1)FullIV2.00.5 ⫻ t
≠CLKn to ≠PxREQ Delay10.0ns
≠CLKn to Px[15:0] Delay11.0ns
POCLK
POCLK
ns
ns
REV. 0–8–
AD6635
GENERAL TIMING CHARACTERISTICS
1, 2
Test AD6635BB
Parameter (Conditions)TempLevelMinTypMaxUnit
INPUT CHARACTERISTICS
t
SPA
t
HPA
LINK PORT TIMING REQUIREMENTS
SWITCHING CHARACTERISTICS
t
RDLCLK
t
FDLCLK
t
RLCLKDAT
t
FLCLKDAT
NOTES
1
All Timing Specifications valid over VDD range of 2.25 V to 2.75 V, and VDDIO range of 3.0 V to 3.6 V.
2
C
= 40 pF on all outputs unless otherwise specified.
LOAD
3
The timing parameters for Px[15:0], PxREQ, PxACK, LxCLKOUT, and Lx[7:0] apply for output ports A, B, C, and D. (x stands for A, B, C, or D.)
Specifications subject to change without notice.
PxACK to ØPCLKn Setup Time1.0ns
PxACK to ØPCLKn Hold Time1.0ns
3
≠PCLKn to ≠LxCLKOUT DelayFullIV2.5nsØPCLKn to ØLxCLKOUT DelayFullIV0ns≠LxCLKOUT to Lx[7:0] DelayFullIV02.9nsØLxCLKOUT to Lx[7:0] DelayFullIV02.2ns
REV. 0
–9–
AD6635
MICROPROCESSOR PORT TIMING CHARACTERISTICS
1, 2
Test AD6635BB
Parameter (Conditions)TempLevelMinTypMaxUnit
MICROPROCESSOR PORT, MODE MNM (MODE = 0)
MODE INM WRITE TIMING
t
SC
t
HC
t
HWR
t
SAM
t
HAM
t
DRDY
t
ACC
Control3 to ≠CLKn Setup TimeFullIV2.0ns
Control3 to ≠CLKn Hold TimeFullIV2.5ns
WR(RW) to RDY(DTACK) Hold TimeFullIV7.0ns
Address/Data to WR(RW) Setup TimeFullIV3.0ns
Address/Data to RDY(DTACK) Hold TimeFullIV5.0ns
WR(RW) to RDY(DTACK) DelayFullIV8.0ns
WR(RW) to RDY(DTACK) High DelayFullIV4 ⫻ t
CLK
5 ⫻ t
CLK
9 ⫻ t
CLK
ns
MODE INM READ TIMING
t
SC
t
HC
t
SAM
t
HAM
t
DRDY
t
ACC
Control3 to ≠CLKn Setup TimeFullIV5.0ns
Control3 to ≠CLKn Hold TimeFullIV2.0ns
Address to RD(DS) Setup TimeFullIV0.0ns
Address to Data Hold TimeFullIV5.0ns
RD(DS) to RDY(DTACK) DelayFullIV8.0ns
RD(DS) to RDY(DTACK) High DelayFullIV8 ⫻ t
CLK
10 ⫻ t
CLK
13 ⫻ t
CLK
ns
MICROPROCESSOR PORT, MODE MNM (MODE = 1)
MODE MNM WRITE TIMING
t
SC
t
HC
t
HDS
t
HRW
t
SAM
t
HAM
t
DDTACK
t
ACC
Control3 to ≠CLKn Setup TimeFullIV2.0ns
Control3 to ≠CLKn Hold TimeFullIV2.5ns
DS(RD) to DTACK(RDY) Hold TimeFullIV8.0ns
RW(WR) to DTACK(RDY) Hold TimeFullIV7.0ns
Address/Data to RW(WR) Setup TimeFullIV3.0ns
Address/Data to RW(WR) Hold TimeFullIV5.0ns
DS(RD) to DTACK(RDY) DelayFullIV8.0ns
RW(WR) to DTACK(RDY) Low DelayFullIV4 ⫻ t
CLK
5 ⫻ t
CLK
9 ⫻ t
CLK
ns
MODE MNM READ TIMING
t
SC
t
HC
t
HDS
t
SAM
t
HAM
t
DDTACK
t
ACC
NOTES
1
All Timing Specifications valid over VDD range of 2.25 V to 2.75 V, and VDDIO range of 3.0 V to 3.6 V.
2
C
3
Specification pertains to control signals: R/W, (WR), DS, (RD), CS0, CS1.
Specifications subject to change without notice.
Control3 to ≠CLKn Setup TimeFullIV5.0ns
Control3 to ≠CLKn Hold TimeFullIV2.0ns
DS(RD) to DTACK(RDY) Hold TimeFullIV8.0ns
Address to DS(RD) Setup TimeFullIV0.0ns
Address to Data Hold TimeFullIV5.0ns
DS(RD) to DTACK(RDY) DelayFullIV8.0ns
DS(RD) to DTACK(RDY) Low DelayFullIV8 ⫻ t
= 40 pF on all outputs unless otherwise specified.
*Stresses greater than those listed above may cause permanent damage to the device
These are stress ratings only; functional operation of the devices at these or any
other conditions greater than those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
EXPLANATION OF TEST LEVELS
I100% Production Tested.
II100% Production Tested at 25∞C, and Sample Tested at
Specified Temperatures.
IIISample Tested Only.
IVParameter Guaranteed by Design and Analysis.
VParameter is Typical Value Only.
VI100% Production Tested at 25∞C, and Sample Tested at
AD6635BB–40ºC to +85ºC324-Lead PBGA (Ball Grid Array)B-324
AD6635BB/PCBEvaluation Board with AD6635 and Software
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD6635 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
–11–
AD6635
PIN CONFIGURATION
19mm 19mm – 18
2
BALL ZAPHOD PACKAGE
1.00
BSC
BSC
1.00
BOTTOM VIEW
A1 BALL
CORNER
1234567891018 17 16 15 14 13 12 11
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
REV. 0–12–
PIN CONFIGURATION (PIN OUT)
AD6635
123456789
A
B
C
D
CHIP0_ID1
E
F
G
PBCH0_
H
PBCH1_
J
PB2_LB2
K
L
M
N
P
R
T
U
V
CLK0
CLK1
PA AC K
SCLK0
PCLK0
LBCLK
OUT
LBCLK
IN
PB11
PB13
PB12
PBREQ
EXPB0
EXPB1
EXPB2
IENC
VDDIO
(Reserved)
VDDIO
(Reserved)
CHIP0_ID0
CHIP0_ID2
PAIQ
SDI0
PBIQ
PB0_LB0
PB4_LB4
PB1_LB1
PB9
PB14
PB15
INB10
INB9
INB8
INB7
INC1INC8INC11
PAREQ
PB6_LB6
PB7_LB7
PB3_LB3
PB5_LB5GND
PB8
PB10
VDDIO
(Reserved)
PBACK
INB11
INB4
INB5
INB6
INC7
INC2
LID-A
VDD
VDD
GND
GND
GND
VDDIO
VDDIO
PA 1 5
INB12
INB3
INB2
INB1
INC12
IND2
IND1
INC9
LID-BIND0IND5
INC10
INC3
INC4
INC5
VDD
VDD
VDD
VDD
GND
GND
GNDGND
GND
GND
GND
GND
VDDIOVDDIO
VDDIO
VDDIO
PA 1 4
PA 1 3
EXPA0
INB13
EXPA1
INB0
INA13
LIB-B
INA12
IENB
IND3IND7
IND4IND6
INC13
EXPC2EXPC1
INC6
VDDIO
VDDIO
VDDIO
VDDIO
GND
GND
GND
GNDGND
VDD
VDD
PA 1 0
EXPA2
INA9INA8
INA10
INA11
IEND
GND
GND
GND
VDD
VDD
PA 1 2
PA 9
INA7
INA6
INC0
123456789
10
IND8
IND11
IND9IND12
IND10
IND13
EXPC0
VDDIOGND
VDDIOGND
PA 0_LA0 PA2_LA2
VDD
VDD
GND
GND
GND
GND
GND
GND
GND
GND
VDDIOVDDIO
VDD
VDDVDDIO
PA 3_LA3
PA 1 1
LIC-B
PA 8
INA5
INA3
INA4
INA2
10
11
EXPD1
EXPD2
EXPD0
VDD
VDD
GND
GND
GND
GND
GND
GND
VDDIO
LIC-A
PA 5_LA5
PA 1_LA1
INA1
INA0
11
12
PDREQ
PD14
PDACK
PD12
PD15
PD9
VDD
PD13
VDD
VDDIOVDDIO
GND
GND
VDDIOVDDIO
GND
GND
GND
GND
GND
GND
GND
GND
VDDIOVDD
VDDIO
VDD
DNC
DNC
CS0
DNC
DTACK
SYNCD
SYNCA
LIA-A
IENA
LIB-A
12
13
13
14
PD10
PD11
PD1_LD1
PCACK
VDDIO
(Reserved)
GNDGND
GND
GNDGND
GNDGND
VDDVDD
VDD
DNC
D4
RESET
SYNCC
LIA-B
14
15
PD8
PD4_LD4
PD2_LD2
CHIP1_ID1
DNC
VDDIO
VDDIO
GND
VDD
D7
D3
PA 7_LA7
PA 6_LA6
SYNCB
15
16
PD5_LD5
PD3_LD3
PD0_LD0
PCIQ
CHIP1_ID0
PCREQ
PC11
PC10
PC8
PC1_LC1
A1
PC6_LC6
A0
D0
CS1
DNC
PA 4_LA4
PACH0_
LACLK
OUT
16
17
PDCH1_
LDCLK
IN
PD7_LD7
SDI4
PD6_LD6
CHIP1_ID2
PC14
PC13
PC9
PC0_LC0
PC3_LC3
PC5_LC5
PC7_L
C7
A2
D1
R/W
D5
MODE
PACH1_
LACLK
IN
17
18
PDCH0_
LDCLK
OUT
PDIQ
PCLK1
SCLK4
PC15
PC12
DNC
GND
(Reserved)
PC2_LC2
PC4_LC4
PCCH1_
LCCLK
IN
PCCH0_
LCCLK
OUT
DS
VDDIO
(Reserved)
D2
D6
18
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
REV. 0
–13–
AD6635
PIN FUNCTION DESCRIPTION
NameTypeFunction
POWER SUPPLY
VDDP2.5 V Core Supply (also called DVCORE)
VDDIOP3.3 V IO Supply (also called DVRING)
GNDGGround
INPUTS
INA[13:0]
EXPA[2:0]
IENA
INB[13:0]
EXPB[2:0]
IENB
INC[13:0]
EXPC[2:0]
IENC
IND[13:0]
EXPD[2:0]
IEND
RESETIActive Low Reset Pin
CLK0IInput Clock 0 (Master Clock for Channels 0–3 and Ports A, B)
CLK1IInput Clock 1 (Master Clock for Channels 4–7 and Ports C, D)
PCLK0I/OLink/Parallel Port Clock for Output Ports A and B
PCLK1I/OLink/Parallel Port Clock for Output Ports C and D
LACLKINILink Port A Data Ready
LBCLKINILink Port B Data Ready
LCCLKINILink Port C Data Ready
LDCLKINILink Port D Data Ready
SYNCA
SYNCB
SYNCC
SYNCD
CHIP0_ID[2:0]
CHIP1_ID[2:0]
1
1
2
1
1
2
1
1
2
1
1
2
1
1
1
1
1
1
IA Input Data (Mantissa)
IA Input Data (Exponent)
IInput Enable—Input A
IB Input Data (Mantissa)
IB Input Data (Exponent)
IInput Enable—Input B
IC Input Data (Mantissa)
IC Input Data (Exponent)
IInput Enable—Input C
ID Input Data (Mantissa)
ID Input Data (Exponent)
IInput Enable—Input D
IAll Sync Pins Go to All Eight Channels
IAll Sync Pins Go to All Eight Channels
IAll Sync Pins Go to All Eight Channels
IAll Sync Pins Go to All Eight Channels
IChip ID Selector for Channels 0–3 and Ports A, B
IChip ID Selector for Channels 4–7 and Ports C, D
CONTROL
PAACKIParallel Port A Acknowledge
PAREQOParallel Port A Request
PBACKIParallel Port B Acknowledge
PBREQOParallel Port B Request
PCACKIParallel Port C Acknowledge
PCREQOParallel Port C Request
PDACKIParallel Port D Acknowledge
PDREQOParallel Port D Request
REV. 0–14–
PIN FUNCTION DESCRIPTION (continued)
NameTypeFunction
MICROPORT CONTROL
D[7:0]I/O/TBidirectional Microport Data
A[2:0]IMicroport Address Bus
DS (RD)IActive Low Data Strobe (Active Low Read)
DTACK (RDY)
2
O/TActive Low Data Acknowledge (Microport Status Bit)
R/W (WR)IRead Write (Active Low Write)
MODEIIntel or Motorola Mode Select
1
CS0
CS1
1
IChip Select for Channels 0–3 and Ports A, B
IChip Select for Channels 4–7 and Ports C, D
AD6635
SERIAL PORT CONTROL
1
SDI0
SCLK0
1
SDI4
SCLK4
ISerial Port Control Data Input for Channels 0–3 and Ports A, B
1
ISerial Port Control Clock for Channels 0–3 and Ports A, B
ISerial Port Control Data Input for Channels 4–7 and Ports C, D
1
ISerial Port Control Clock for Channels 4–7 and Ports C, D
OUTPUTS
LIA-AOLevel Indicator—Input A, Interleaved-Data A
LIA-BOLevel Indicator—Input A, Interleaved-Data B
LIB-AOLevel Indicator—Input B, Interleaved-Data A
LIB-BOLevel Indicator—Input B, Interleaved-Data B
LIC-AOLevel Indicator—Input C, Interleaved-Data A
LIC-BOLevel Indicator—Input C, Interleaved-Data B
LID-AOLevel Indicator—Input D, Interleaved-Data A
LID-BOLevel Indicator—Input D, Interleaved-Data B
LACLKOUTOLink Port A Clock Output
LBCLKOUTOLink Port B Clock Output
LCCLKOUTOLink Port C Clock Output
LDCLKOUTOLink Port D Clock Output
LA[7:0]OLink Port A Output Data
LB[7:0]OLink Port B Output Data
LC[7:0]OLink Port C Output Data
LD[7:0]OLink Port D Output Data
PA[15:0]OParallel Output Data Port A
PB[15:0]OParallel Output Data Port B
PC[15:0]OParallel Output Data Port C
PD[15:0]OParallel Output Data Port D
PACH[1:0]OParallel Output Port A Channel Indicator
PBCH[1:0]OParallel Output Port B Channel Indicator
PCCH[1:0]OParallel Output Port C Channel Indicator
PDCH[1:0]OParallel Output Port D Channel Indicator
PAIQOParallel Port A I/Q Data Indicator
PBIQOParallel Port B I/Q Data Indicator
PCIQOParallel Port C I/Q Data Indicator
PDIQOParallel Port D I/Q Data Indicator
NOTES
1
Pins with a pull-down resistor of nominal 70 kW.
2
Pins with a pull-up resistor of nominal 70 kW.
REV. 0
–15–
AD6635
TIMING DIAGRAMS
Figure 3. Level Indicator Output Switching Characteristics (x = A, B, C, D; and y = A, B)
(For x = A and B, n = 0; and for x = C or D, n = 1)