Analog Devices AD5320 b Datasheet

+2.7 V to +5.5 V, 140 ␮A, Rail-to-Rail Output
a
FEATURES Single 12-Bit DAC 6-Lead SOT-23 and 8-Lead SOIC Packages Micropower Operation: 140 A @ 5 V Power-Down to 200 nA @ 5 V, 50 nA @ 3 V +2.7 V to +5.5 V Power Supply Guaranteed Monotonic by Design Reference Derived from Power Supply Power-On-Reset to Zero Volts Three Power-Down Functions Low Power Serial Interface with Schmitt-Triggered
Inputs On-Chip Output Buffer Amplifier, Rail-to-Rail Operation SYNC Interrupt Facility
APPLICATIONS Portable Battery Powered Instruments Digital Gain and Offset Adjustment Programmable Voltage and Current Sources Programmable Attenuators
SYNC
12-Bit DAC in a SOT-23
FUNCTIONAL BLOCK DIAGRAM
V
GND
DD
POWER-ON
RESET
REF (+)
DAC
REGISTER
INPUT
CONTROL
LOGIC
SCLK DIN
REF (–)
12-BIT
DAC
POWER-DOWN
CONTROL LOGIC
OUTPUT BUFFER
AD5320*
AD5320
RESISTOR NETWORK
V
OUT
GENERAL DESCRIPTION
The AD5320 is a single, 12-bit buffered voltage out DAC that operates from a single +2.7 V to +5.5 V supply consuming 115 µA at 3 V. Its on-chip precision output amplifier allows rail-to-rail output swing to be achieved. The AD5320 utilizes a versatile three-wire serial interface that operates at clock rates up to 30 MHz and is compatible with standard SPI™, QSPI™, MICROWIRE™ and DSP interface standards.
The reference for AD5320 is derived from the power supply inputs and thus gives the widest dynamic output range. The part incorporates a power-on-reset circuit that ensures that the DAC output powers up to zero volts and remains there until a valid write takes place to the device. The part contains a power-down feature that reduces the current consumption of the device to 200 nA at 5 V and provides software selectable output loads while in power-down mode. The part is put into power-down mode over the serial interface.
The low power consumption of this part in normal operation makes it ideally suited to portable battery operated equipment. The power consumption is 0.7 mW at 5 V reducing to 1 µW in power-down mode.
The AD5320 is one of a family of pin-compatible DACs. The AD5300 is the 8-bit version and the AD5310 is the 10-bit version. The AD5300/AD5310/AD5320 are available in 6-lead SOT-23 packages and 8-lead µSOIC packages.
SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corporation. *Patent pending; protected by U.S. Patent No. 5684481.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
PRODUCT HIGHLIGHTS
1. Available in 6-lead SOT-23 and 8-lead µSOIC packages.
2. Low power, single supply operation. This part operates from a single +2.7 V to +5.5 V supply and typically consumes
0.35 mW at 3 V and 0.7 mW at 5 V, making it ideal for battery powered applications.
3. The on-chip output buffer amplifier allows the output of the DAC to swing rail-to-rail with a slew rate of 1 V/µs.
4. Reference derived from the power supply.
5. High speed serial interface with clock speeds up to 30 MHz. Designed for very low power consumption. The interface only powers up during a write cycle.
6. Power-down capability. When powered down, the DAC typically consumes 50 nA at 3 V and 200 nA at 5 V.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
AD5320–SPECIFICA TIONS
(VDD = +2.7 V to +5.5 V; RL = 2 k to GND; CL = 200 pF to GND; all specifications T
to T
MIN
unless otherwise noted)
MAX
B Version
1
Parameter Min Typ Max Unit Conditions/Comments
STATIC PERFORMANCE
2
Resolution 12 Bits Relative Accuracy ±16 LSB See Figure 2. Differential Nonlinearity ±1 LSB Guaranteed Monotonic by Design. See Figure 3. Zero Code Error +5 +40 mV All Zeroes Loaded to DAC Register. See Figure 6. Full-Scale Error –0.15 –1.25 % of FSR All Ones Loaded to DAC Register. See Figure 6. Gain Error ±1.25 % of FSR Zero Code Error Drift –20 µV/°C Gain Temperature Coefficient –5 ppm of FSR/°C
OUTPUT CHARACTERISTICS
Output Voltage Range 0 V
3
V
DD
Output Voltage Settling Time 8 10 µs 1/4 Scale to 3/4 Scale Change (400 Hex to C00 Hex).
R
= 2 k; 0 pF < CL < 200 pF. See Figure 16.
L
12 µsR
= 2 k; CL = 500 pF
L
Slew Rate 1 V/µs Capacitive Load Stability 470 pF R
=
L
1000 pF RL = 2 k Digital-to-Analog Glitch Impulse 20 nV-s 1 LSB Change Around Major Carry. See Figure 19. Digital Feedthrough 0.5 nV-s DC Output Impedance 1 Short Circuit Current 50 mA VDD = +5 V
20 mA V Power-Up Time 2.5 µs Coming Out of Power-Down Mode. V
= +3 V
DD
= +5 V
DD
5 µs Coming Out of Power-Down Mode. VDD = +3 V
LOGIC INPUTS
3
Input Current ±1 µA
, Input Low Voltage 0.8 V VDD = +5 V
V
INL
V
, Input Low Voltage 0.6 V VDD = +3 V
INL
, Input High Voltage 2.4 V VDD = +5 V
V
INH
, Input High Voltage 2.1 V VDD = +3 V
V
INH
Pin Capacitance 3 pF
POWER REQUIREMENTS
V
DD
(Normal Mode) DAC Active and Excluding Load Current
I
DD
= +4.5 V to +5.5 V 140 250 µAV
V
DD
V
= +2.7 V to +3.6 V 115 200 µAV
DD
(All Power-Down Modes)
I
DD
= +4.5 V to +5.5 V 0.2 1 µAV
V
DD
VDD = +2.7 V to +3.6 V 0.05 1 µAV
2.7 5.5 V
= VDD and VIL = GND
IH
= VDD and V
IH
= VDD and VIL = GND
IH
= VDD and VIL = GND
IH
= GND
IL
POWER EFFICIENCY
I
OUT/IDD
NOTES
1
Temperature ranges are as follows: B Version: –40°C to +105°C.
2
Linearity calculated using a reduced code range of 48 to 4047. Output unloaded.
3
Guaranteed by design and characterization, not production tested.
Specifications subject to change without notice.
93 % I
= 2 mA. VDD = +5 V
LOAD
–2–
REV. B
TIMING CHARACTERISTICS
WARNING!
ESD SENSITIVE DEVICE
1, 2
(VDD = +2.7 V to +5.5 V; all specifications T
MIN
to T
unless otherwise noted)
MAX
AD5320
Limit at T
MIN
, T
MAX
Parameter VDD = 2.7 V to 3.6 V VDD = 3.6 V to 5.5 V Unit Conditions/Comments
3
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
NOTES
1
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
See Figure 1.
3
Maximum SCLK frequency is 30 MHz at VDD = +3.6 V to +5.5 V and 20 MHz at VDD = +2.7 V to +3.6 V.
Specifications subject to change without notice.
50 33 ns min SCLK Cycle Time 13 13 ns min SCLK High Time
22.5 13 ns min SCLK Low Time 0 0 ns min SYNC to SCLK Rising Edge Setup Time 5 5 ns min Data Setup Time
4.5 4.5 ns min Data Hold Time 0 0 ns min SCLK Falling Edge to SYNC Rising Edge 50 33 ns min Minimum SYNC High Time
t
1
SCLK
t
2
DB0
t
7
SYNC
DIN
t
8
t
4
t
DB15
t
3
t
6
5
Figure 1. Serial Write Operation
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . .–0.3 V to V
V
to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
OUT
+ 0.3 V
DD
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (T
Max) . . . . . . . . . . . . . . . . .+150°C
J
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
Max–T
J
)/θ
A
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 240°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
µSOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
JC
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections
JA
of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature Branding Package
Model Range Information Options*
AD5320BRT –40°C to +105°C D4B RT-6 AD5320BRM –40°C to +105°C D4B RM-8
*RT = SOT-23; RM = µSOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5320 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Max–T
J
)/θ
A
JA
–3–REV. B
AD5320
PIN CONFIGURATIONS
SOT-23 SOIC
V
OUT
GND
V
DD
1
AD5320
2
TOP VIEW
(Not to Scale)
3
6
5
4
SYNC
SCLK DIN
1
V
DD
NC
2
NC
3
(Not to Scale)
4
V
OUT
NC = NO CONNECT
AD5320
TOP VIEW
8
7
6
5
GND
DIN
SCLK
SYNC
PIN FUNCTION DESCRIPTIONS
SOT-23 Pin Numbers
Pin No. Mnemonic Function
1V
OUT
Analog output voltage from DAC. The output amplifier has rail-to-rail operation. 2 GND Ground reference point for all circuitry on the part. 3V
DD
Power Supply Input. These parts can be operated from +2.5 V to +5.5 V and VDD should be de-
coupled to GND. 4 DIN Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input. 5 SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
input. Data can be transferred at rates up to 30 MHz. 6 SYNC Level triggered control input (active low). This is the frame synchronization signal for the input
data. When SYNC goes low, it enables the input shift register and data is transferred in on the
falling edges of the following clocks. The DAC is updated following the 16th clock cycle unless
SYNC is taken high before this edge in which case the rising edge of SYNC acts as an interrupt and
the write sequence is ignored by the DAC.
–4–
REV. B
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