The VCU1525 Reconfigurable Acceleration Platform is a peripheral component interconnect
express (PCIe®) Gen3 x16 compliant board featuring the Xilinx® Virtex® UltraScale+™
XCVU9P-L2FSGD2104E FPGA. This Xilinx FPGA-based PCIe accelerator board is designed to
accelerate compute-intensive applications like machine learning, data analytics, and video
processing.
The VCU1525 board is available in both active and passive cooling configurations and
designed to be used in cloud data center servers.
Figure 1-1 shows the VCU1525 active cooling configuration (PC applications).
CAUTION! The VCU1525 board with passive cooling is designed to be installed into a data center
server, where controlled air flow provides direct cooling. The VCU1525 board with active cooling is
designed to be installed into a PC environment where the air flow is uncontrolled, hence this
configuration has the heat sink and fan enclosure cover installed to provide appropriate cooling. In
either cooling configuration, due to the board enclosure, switches are not accessible, nor are LEDs
visible (except the triple-LED module DS3 which protrudes through the left front end PCIe bracket).
Board details revealed in this user guide are provided to aid understanding of board features. If the
cooling enclosure is removed from either configuration of the board and it is powered-up, external fan
cooling airflow MUST be applied to prevent over-temperature shut-down and possible damage to the
board electronics.
See Appendix C, Additional Resources and Legal Notices for references to documents, files,
and resources relevant to the VCU1525 board.
VCU1525 Acceleration Platform User Guide6
UG1268 (v1.3) August 7, 2018www.xilinx.com
X-Ref Target - Figure 1-3
244-pin DIMM interface
64-bit + ECC dual rank support
x4/x8 UDIMM support
PC4-2400 compatible
C0
244-pin DIMM interface
64-bit + ECC dual rank support
x4/x8 UDIMM support
PC4-2400 compatible
C2
244-pin DIMM interface
64-bit + ECC dual rank support
x4/x8 UDIMM support
PC4-2400 compatible
C3
244-pin DIMM interface
64-bit + ECC dual rank support
x4/x8 UDIMM support
PC4-2400 compatible
C1
DIP SWPOWER
QSPI1
QSPI2
PCIe GEN1/2/3 x 1/2/4/8/16
PCIe GEN4 x 8
QSFP #2
QSFP #1
XADC
LEDs
Clocks
VU9P
D2104
X19964-110617
SendFeedback
Chapter 1: Introduction
Block Diagram
A block diagram of the VCU1525 board is shown in Figure 1-3.
VCU1525 Acceleration Platform User Guide7
UG1268 (v1.3) August 7, 2018www.xilinx.com
Figure 1-3:VCU1525 Board Block Diagram
Chapter 1: Introduction
SendFeedback
Board Features
The VCU1525 board features are listed in this section. Detailed information for each feature
is provided in Component Descriptions in Chapter 3.
•Front panel JTAG and universal asynchronous receiver-transmitter (UART) access
through the USB port
•FPGA configurable over USB/JTAG and Quad SPI configuration flash memory
•Thermal management with variable rate fan for minimal fan noise
current PCIe slot power and 6-pin
CCINT
current PCIe slot power and 8-pin
CCINT
Board Specifications
Dimensions
Height: 4.2 inch (10.67 cm)
PCB thickness (±5%): 0.062 inch (0.157 cm)
Board length, passive heat sink: 9.2 inch (23.4 cm)
Board length, active heat sink: 11.4 inch (29 cm)
Board thickness with heat sink enclosure installed:
Active: 1.52 inch (3.86 cm)
Passive: 1.44 inch (3.66 cm)
Dual slot PCIe full-length, full height form-factor compliant
Note:
A 3D model of this board is not available.
Environmental
Temperature
Operating: 0°C to +45°C
Storage: –25°C to +60°C
VCU1525 Acceleration Platform User Guide9
UG1268 (v1.3) August 7, 2018www.xilinx.com
Humidity
SendFeedback
10% to 90% non-condensing
Operating Voltage
Chapter 1: Introduction
PCIe slot +12 VDC, +3.3 VDC, +3.3 V
, External +12 V
AUXDC
DC
VCU1525 Acceleration Platform User Guide10
UG1268 (v1.3) August 7, 2018www.xilinx.com
Board Setup and Configuration
00
Round callout references a component
on the front side of the board
Square callout references a component
on the back side of the board
00
1
2
3
4
5
16
17
8
9
19 20
18
13
14
7
12
12
6
15
X19972-031618
SendFeedback
Board Component Location
Figure 2-1 shows the location of components on the VCU1525 board. Each component
shown is keyed to Tab le 2- 1 . Ta ble 2- 1 identifies the components, references the respective
schematic page numbers, and links to a detailed functional description of the component
and board features in Chapter 3, Board Component Descriptions.
X-Ref Target - Figure 2-1
Chapter 2
VCU1525 Acceleration Platform User Guide11
UG1268 (v1.3) August 7, 2018www.xilinx.com
IMPORTANT: Figure 2-1 is for visual reference only and might not reflect the current revision of the
Figure 2-1:VCU1525 Board Components
board.
CAUTION! The VCU1525 board can be damaged by electrostatic discharge (ESD). Follow standard ESD
17J4Cooling Fan ConnectorJST SALES S4B-PH-K-S(LF)(SN)11
Feature
(Link)
Notes
TI MSP432P401RIPZ24
LIGHT JIE AARRA001-08MTTRH17
Default Switch Settings
Default switch settings are listed in Tab l e 2 -2. Switch locations are shown in Figure 2-1.
Table 2-2:Default Switch Settings
Switch Function Default Comments Figure 2-1 Callout Schematic Page
SW3 4-pole GPIO DIP ON, ON, ON, ON 4-pole user DIP18 11
Tab le 2 -3 shows other visible switch locations.
Table 2-3:Other Visible Switches
Schematic
Page
Component Function Comments Figure 2-1 Callout Schematic Page
SW1Pushbutton switchCPU_RESET_B19 11
SW2Pushbutton switchPROGRAM_B20 11
Installing the VCU1525 Board in a Server Chassis
Because each server or PC vendors hardware is different, for physical card installation
guidance, see the manufacturer’s PCIe card installation instructions.
For programming and start-up details, see Appendix A, Board Installation.
VCU1525 Acceleration Platform User Guide13
UG1268 (v1.3) August 7, 2018www.xilinx.com
Chapter 2: Board Setup and Configuration
SendFeedback
FPGA Configuration
The VCU1525 board supports two UltraScale+ FPGA configuration modes:
•Quad SPI flash memory
•JTAG using USB JTAG configuration port (USB J13/FT4232H U27)
The FPGA bank 0 mode pins are hardwired to M[2:0] = 001 Master SPI mode with
pull-up/down resistors.
At power up, the FPGA is configured by the Quad SPI NOR Flash U17 device (Micron
MT25QU01GBBA8E12-0SIT) with the FPGA_CCLK operating at clock rate of 105 MHz
(EMCCLK) using the Master Serial Configuration mode.
The Quad SPI flash memory NOR device has a capacity of 1 Gb.
While the FPGA default mode selects Quad SPI configuration, JTAG mode overrides it if
invoked. JTAG mode is always available independent of the Mode pin settings.
M0 is pulled up, however it is also connected to the I2C I/O port U2 PCA9536 device (port
P1, pin 2 ). This con nection al lows M0 to b e driven lo w by the MSP432 U19 BMC over I2C (via
the I2C PCS9536 U2 port expander), disabling the Master SPI mode.
For complete details on configuring the FPGA, see UltraScale Architecture Configuration User Guide (UG570) [Ref 1].
This chapter provides a detailed functional description of board components and features.
Tab le 2 -1 identifies the components, references the respective schematic page numbers,
and links to the corresponding detailed functional description in this chapter. Component
locations are shown in Tab le 2 -1.
Component Descriptions
Chapter 3
Virtex UltraScale+ XCVU9P-L2FSGD2104E FPGA
[Figure 2-1, callout 1]
The VCU1525 board is populated with the Virtex® UltraScale+™ XCVU9P-L2FSGD2104E
FPGA.
For more information on Virtex UltraScale+ FPGAs, see Virtex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics (DS923)[Ref 2].
I/O Voltage Rails
There are 13 I/O banks available on the XCVU9P-L2FSGD2104E FPGA and the VCU1525
board.
VCU1525 Acceleration Platform User Guide16
UG1268 (v1.3) August 7, 2018www.xilinx.com
X-Ref Target - Figure 3-1
MGTY233
MGTY232
MGTY231
MGTY230
MGTY229
MGTY228
MGTY227
MGTY226
MGTY225
MGTY224
MGTY133
MGTY131
MGTY130
MGTY129
MGTY128
MGTY123
MGTY122
MGTY121
MGTY120
727374717069
666465616263
67
X19971-103017
SendFeedback
Chapter 3: Board Component Descriptions
Figure 3-1 shows the XCVU9P-L2FSGD2104E bank arrangement.
Figure 3-1:XCVU9P-L2FSGD2104E Bank Arrangement
VCU1525 Acceleration Platform User Guide17
UG1268 (v1.3) August 7, 2018www.xilinx.com
Chapter 3: Board Component Descriptions
SendFeedback
The voltages applied to the XCVU9P-L2FSGD2104E U13 FPGA I/O banks are listed in
Tab le 3 -1.
Table 3-1:I/O Bank Voltage Rails
XCVU9P-L2FSGD2104EPower Net NameVoltageConnected To
Bank 61VCC1V2_BTM1.2VDDR4 C0 DQ[0:15], DQ[40:55]
Bank 62VCC1V2_BTM1.2VDDR4 C0 DQ[16:39], DQ[56:63]
Bank 63VCC1V2_BTM1.2VDDR4 C0 DQ[64:71], ADDR/CTRL
Bank 64VCC1V2_BTM1.2VUSB, QSFP0,QSFP1, I2C, GPIO_MSP, SW_DP
Bank 65VCC1V2_BTM1.2VDDR4 C1 DQ[64:71], ADDR/CTRL
Bank 66VCC1V2_BTM1.2VDDR4 C1 DQ[32:63]
Bank 67VCC1V8_BTM1.2VDDR4 C1 DQ[0:31]
Bank 69VCC1V2_TOP1.2VDDR4_C2 DQ[32:71]
Bank 70VCC1V2_TOP1.2VDDR4 C2 DQ[40:47], ADDR/CTRL
Bank 71VCC1V2_TOP1.2VDDR4_C2 DQ[0:31
Bank 72VCC1V2_TOP1.2VDDR4 C3 DQ[64:71], ADDR/CTRL
Bank 73VCC1V2_TOP1.2VDDR4_C3 DQ[16:31], DQ[40:55]
Bank 74VCC1V2_TOP1.2VDDR4_C3 DQ[0:15], DQ[32:39], DQ[56:63]
DDR4 DIMM Memory
[Figure 2-1, callout 2, 3, 4, 5]
Four independent dual-rank DDR4 interfaces are available on the VCU1525 board. The
VCU1525 board is populated with four socketed single-rank Micron
MTA18ASF2G72PZ-2G3B1IG or Samsung M393A2K40BB1-CRC 16GB DDR4 UDIMMs. Each
DDR4 is 72-bits wide (64-bits plus support for ECC).
Memory interface-to-FPGA bank assignment is shown in Ta ble 3- 1. The DDR4 0.6V V
termination voltages are sourced from four independent TI TPS51200DR regulator circuits.
The VCU1525 DDR4 memory interfaces adhere to the constraints guidelines documented in
the "DDR3/DDR4 Design Guidelines" section of the UltraScale Architecture-Based FPGAs Memory IP LogiCORE IP Product Guide (PG150) [Ref 3]. The VCU1525 board DDR4 memory
interfaces are 40 Ω impedance implementations.
For more details about the Micron DDR4 DIMM, see the Micron MTA18ASF2G72PZ-2G3B1IG
data sheet at the Micron website [Ref 7].
TT
VCU1525 Acceleration Platform User Guide18
UG1268 (v1.3) August 7, 2018www.xilinx.com
For more details about the Samsung DDR4 DIMM, see the Samsung M393A2K40BB1-CRC
data sheet at the Samsung website [Ref 8].
Chapter 3: Board Component Descriptions
X20038-110617
SendFeedback
Quad SPI Flash Memory
[Figure 2-1, callout 6]
Two Quad Serial Peripheral Interface (SPI) flash memory devices of the same type and wired
in parallel are provided on the VCU1525 board (U17 and U58). A field effect transistor (FET)
switch structure (U57 and U61) implements a chip-select enable mechanism, controlled by
the MSP432 board management controller (BMC). Only one Quad SPI device can be
enabled at a time.
The default selected (bank 0 configuration) Quad SPI flash memory is U17. Each Quad SPI
device provides 1 Gb of nonvolatile storage.
•Part number: MT25QU01GBB8E12-0SIT (Micron)
•Supply voltage: 1.8V
•Datapath width: 4 bits
•Data rate: variable
X-Ref Target - Figure 3-2
Figure 3-2 shows the linear Quad SPI flash memory circuitry on the VCU1525 board. For
more flash memory details, see the Micron MT25QU01GBB8E12-0SIT data sheet at the
Micron website [Ref 7].
VCU1525 Acceleration Platform User Guide19
UG1268 (v1.3) August 7, 2018www.xilinx.com
Figure 3-2:Quad SPI 1Gb Flash Memory
X-Ref Target - Figure 3-3
FT4232HQ
USB AB
J13
U27
ADBUS0
ADBUS1
ADBUS2
ADBUS3
ADBUS5
TXBN0304
U35
B1
B3
B2
B4
A1
A3
A2
A4
OE_B
3.3V L/S 1.8V
FT TCK
FT TDO
FT TDI
FT TMS
FT OE
XCVU9PFSGD2104
U13R
TCK
TDI
TDO
TMS
BANK 0
TCK
TDI
TDO
TMS
MSP432
U19
P3_0
P3_1
P3_2
P3_3
P3_4
TXBN0304
U33
B1
B3
B2
B4
A1
A3
A2
A4
OE_B
3.3V L/S 1.8V
MSP TCK
MSP TDI
MSP TDO
MSP TMS
MSP EN
PCIe EDGE
CN1
A5
A6
A7
A8
TXBN0304
U34
B1
B3
B2
B4
A1
A3
A2
A4
OE_B
3.3V L/S 1.8V
PEX TCK
PEX TDI
PEX TDO
PEX TMS
P10_4
BD. MGMT.
CONTROLLER
PEX OE
TCK
TDI
TDO
TMS
GPIO
PORT
TCK
TDI
TDO
TMS
X19965-031418
SendFeedback
Chapter 3: Board Component Descriptions
For details on bank 0 pins, see UltraScale Architecture Configuration User Guide (UG570)
[Ref 1].
USB JTAG Interface
[Figure 2-1, callout 7]
The VCU1525 board XCVU9P-L2FSGD2104E FPGA U13 is the only component in the Joint
Test Action Group (JTAG) chain. JTAG configuration is available through the USB-to-JTAG
FTDI FT4232HQ U27 bridge device connected to Micro-AB USB connector J13. The FTDI
JTAG signals are level-shifted through TXBN0304 device U35. The PCIe 16-lane edge
connector CN1 JTAG port is connected in parallel through level-shifter U34. GPIO port 3 of
the U19 MSP432 BMC is also connected through level-shifter U33. Each level-shifter enable
pin is controlled by the BMC to allow only one JTAG connection at a time.
JTAG configuration is allowed at any time regardless of the FPGA mode pin settings.
The JTAG chain block diagram is shown in Figure 3-3.
VCU1525 Acceleration Platform User Guide20
UG1268 (v1.3) August 7, 2018www.xilinx.com
Figure 3-3:VCU1525 JTAG Chain Block Diagram
Loading...
+ 44 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.