Low Supply Current Reduces Spikes
During Output Transitions
D
Single-Supply Operation From 1 V to 15 V
D
Functionally Interchangeable With the
unctional block diagram
HRES
CONT
V
DD
8
R
6
R
RESET
5
4
R1
R
S
1
NE555; Has Same Pinout
2
D
ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015.2
description
The TLC551 is a monolithic timing circuit
fabricated using the TI LinCMOSprocess. The
TRIG
R
1
GND
RESET can override TRIG, which can override THRES.
timer is fully compatible with CMOS, TTL, and MOS logic and operates at frequencies up to 2 MHz. Compared
to the NE555 timer, this device uses smaller timing capacitors because of its high input impedance. As a result,
more accurate time delays and oscillations are possible. Power consumption is low across the full range of
power supply voltage.
7
3
OUT
DISCH
Like the NE555, the TLC551 has a trigger level equal to approximately one-third of the supply voltage and a
threshold level equal to approximately two-thirds of the supply voltage. These levels can be altered by use of
the control voltage terminal (CONT). When the trigger input (TRIG) falls below the trigger level, the flip-flop is
set and the output goes high. If TRIG is above the trigger level and the threshold input (THRES) is above the
threshold level, the flip-flop is reset and the output is low. The reset input (RESET) can override all other inputs
and can be used to initiate a new timing cycle. If RESET is low, the flip-flop is reset and the output is low.
Whenever the output is low, a low-impedance path is provided between DISCH and GND. All unused inputs
should be tied to an appropriate logic level to prevent false triggering.
While the CMOS output is capable of sinking over 100 mA and sourcing over 10 mA, the TLC551 exhibits greatly
reduced supply-current spikes during output transitions. This minimizes the need for the large decoupling
capacitors required by the NE555.
The TLC551C is characterized for operation from 0°C to 70°C.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level,
preferably either supply voltage or ground. Specific guidelines for handling devices of this type are contained in the publication
Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies
LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
available from Texas Instruments.
Copyright 1997, Texas Instruments Incorporated
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
1
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044A – FEBRUARY 1984 – REVISED MAY 1997
V
T
A
0°C to 70°C1 V to 16 VTLC551CDTLC551CDBLETLC551CPTLC551CPWLETLC551Y
The D package is available taped and reeled. Add the suffix R (e.g., TLC551CDR). The DB and PW packages are only
available left-end taped and reeled (indicated by the LE suffix on the device type; e.g., TLC551CDBLE). Chips are
tested at 25°C.
†
DD
RANGE
RESET
VOLTAGE
For conditions shown as MIN or MAX, use the appropriate value specified under
electrical characteristics.
†
<MINIrrelevantIrrelevantLowOn
>MAX<MINIrrelevantHighOff
>MAX>MAX>MAXLowOn
>MAX>MAX<MINAs previously established
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL
OUTLINE
(D)
FUNCTION TABLE
TRIGGER
VOLTAGE
THRESHOLD
†
SSOP
(DB)
VOLTAGE
PLASTIC DIP
†
(P)
OUTPUT
TSSOP
(PW)
DISCHARGE
SWITCH
CHIP FORM
(Y)
TLC551Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC551. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
50
BONDING PAD ASSIGNMENTS
64
V
DD
(8)
R
THRES
(6)
R
(2)
TRIG
R
(1)
GND
RESET can override TRIG, which can override THRES.
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (1) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(5)
RESETCONT
(4)
R1
1
R
S
(7)
(3)
OUT
DISCH
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•3
equivalent schematic
CONT
THRES
COMPONENT COUNT
V
OUT
39
DD
Transistors
Resistors
5
TRIGRESET
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
DISCH
LinCMOS
TLC551, TLC551Y
TM
TIMERS
GND
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to network GND.
DISSIPATION RATING TABLE
PACKAGE
D
DB
P
PW
TA ≤ 25°C
POWER RATING
725 mW
525 mW
1000 mW
525 mW
DERATING FACTOR
ABOVE TA = 25°C
5.8 mW/°C
4.2 mW/°C
8.0 mW/°C
4.2 mW/°C
TA = 70°C
POWER RATING
464 mW
336 mW
640 mW
336 mW
recommended operating conditions
MINMAXUNIT
Supply voltage, V
Operating free-air temperature range, T
DD
A
115V
070°C
†
DD
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VITThreshold voltage
V
IITThreshold current
pA
V
Trigger voltage
V
I
Trigger current
pA
V
Reset voltage
V
I
Reset current
pA
Discharge switch on-stage voltage
I
100 µA
V
Discharge switch off-stage voltage
nA
VOHHigh-level output voltage
I
A
V
VOLLow-level output voltage
I
100 µA
V
IDDSupply current
See Note 2
A
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
electrical characteristics at specified free-air temperature, VDD = 1 V
PARAMETERTEST CONDITIONST
I(TRIG)
I(TRIG)
I(RESET)
I(RESET)
Control voltage (open circuit) as a percentage of
supply voltage
=
OL
p
p
pp
†
Full range is 0°C to 70°C.
NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or to TRIG.
OH
OL
= –10 µ
=
†
A
25°C0.4750.670.85
Full range0.450.875
25°C10
70°C75
25°C0.150.330.425
Full range0.10.45
25°C10
70°C75
25°C0.40.71
Full range0.31
25°C10
70°C75
70°C66.7%
25°C0.020.15
Full range0.2
25°C0.1
70°C0.5
25°C0.60.98
Full range0.6
25°C0.030.2
Full range0.25
25°C15100
Full range150
MINTYPMAXUNIT
p
p
p
µ
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
5
TLC551, TLC551Y
VITThreshold voltage
V
IITThreshold current
pA
V
Trigger voltage
V
I
Trigger current
pA
V
Reset voltage
V
I
Reset current
pA
Discharge switch on-stage voltage
I
mA
V
Discharge switch off-stage voltage
nA
VOHHigh-level output voltage
I
300 µA
V
VOLLow-level output voltage
I
mA
V
IDDSupply current
See Note 2
A
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
electrical characteristics at specified free-air temperature, VDD = 2 V
PARAMETERTEST CONDITIONST
I(TRIG)
I(TRIG)
I(RESET)
I(RESET)
Control voltage (open circuit) as a percentage of
supply voltage
= 1
OL
p
p
pp
†
Full range is 0°C to 70°C.
NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or to TRIG.
OH
OL
= –
= 1
†
A
25°C0.951.331.65
Full range0.851.75
25°C10
70°C75
25°C0.40.670.95
Full range0.31.05
25°C10
70°C75
25°C0.41.11.5
Full range0.31.8
25°C10
70°C75
70°C66.7%
25°C0.030.2
Full range0.25
25°C0.1
70°C0.5
25°C1.51.9
Full range1.5
25°C0.070.3
Full range0.35
25°C65250
Full range400
MINTYPMAXUNIT
p
p
p
µ
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VITThreshold voltage
V
IITThreshold current
pA
V
Trigger voltage
V
I
Trigger current
pA
V
Reset voltage
V
I
Reset current
pA
Discharge switch on-stage voltage
I
mA
V
Discharge switch off-stage voltage
nA
VOHHigh-level output voltage
I
mA
V
I
mA
VOLLow-level output voltage
I
mA
V
I
mA
IDDSupply current
See Note 2
A
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
electrical characteristics at specified free-air temperature, VDD = 5 V
PARAMETERTEST CONDITIONST
I(TRIG)
I(TRIG)
I(RESET)
I(RESET)
Control voltage (open circuit) as a percentage of
supply voltage
= 10
OL
p
p
pp
†
Full range is 0°C to 70°C.
NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or to TRIG.
OH
OL
OL
OL
= –1
= 8
= 5
= 3.2
†
A
25°C2.83.33.8
Full range2.73.9
25°C10
70°C75
25°C1.361.661.96
Full range1.262.06
25°C10
70°C75
25°C0.41.11.5
Full range0.31.8
25°C10
70°C75
70°C66.7%
25°C0.140.5
Full range0.6
25°C0.1
70°C0.5
25°C4.14.8
Full range4.1
25°C0.210.4
Full range0.5
25°C0.130.3
Full range0.4
25°C0.080.3
Full range0.35
25°C170350
Full range500
MINTYPMAXUNIT
p
p
p
µ
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
7
TLC551, TLC551Y
VITThreshold voltage
V
IITThreshold current
pA
V
Trigger voltage
V
I
Trigger current
pA
V
Reset voltage
V
I
Reset current
pA
Discharge switch on-stage voltage
I
100 mA
V
Discharge switch off-stage voltage
nA
I
mA
VOHHigh-level output voltage
I
mA
V
I
mA
I
100 mA
VOLLow-level output voltage
I
mA
V
I
mA
IDDSupply current
See Note 2
A
DD
,
AB
,
R
C
pF
ns
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
electrical characteristics at specified free-air temperature, VDD = 15 V
PARAMETERTEST CONDITIONST
I(TRIG)
I(TRIG)
I(RESET)
I(RESET)
Control voltage (open circuit) as a percentage of
supply voltage
=
OL
= –10
OH
p
p
pp
†
Full range is 0°C to 70°C.
NOTE 2: These values apply for the expected operating configurations in which THRES is connected directly to DISCH or to TRIG.
Reset current10pA
Control voltage (open circuit) as a percentage of supply voltage66.7%
Discharge switch on-state voltageIOL = 10 mA0.140.5V
Discharge switch off-state current0.1nA
High-level output voltageIOH = – 1 mA4.14.8V
IOL = 8 mA0.210.4
Low-level output voltage
Supply currentSee Note 2170350µA
IOL = 5 mA
IOL = 3.2 mA0.080.3
0.130.3
V
TYPICAL CHARACTERISTICS
DISCHARGE SWITCH ON-STATE RESISTANCE
vs
FREE-AIR TEMPERATURE
100
70
Ω
40
20
10
7
4
2
Discharge Switch On-State Resistance –
1
02575
VDD = 2 V, IO = 1 mA
VDD = 5 V, IO = 10 mA
VDD = 15 V, IO = 100 mA
50100
TA – Free-Air Temperature – °C
PROPAGATION DELAY TIMES (TO DISCHARGE
OUTPUT FROM TRIGGER AND THRESHOLD
SHORTED TOGETHER)
vs
SUPPLY VOLTAGE
600
I
≥ 1 mA
O(on)
500
400
300
200
PLH
t– Propagation Delay Times – ns
100
PHL
t,
0
024681216
VDD – Supply Voltage – V
‡
The effects of the load resistance on these values must be
taken into account separately.
1014
CL ≈ 0
TA = 25°C
t
PHL
t
PLH
‡
2018
Figure 1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Figure 2
9
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
APPLICATION INFORMATION
V
DD
0.1 µF
R
A
R
B
0.1 µF
CONT
4
RESET
7
6
2
C
T
TLC551
DISCH
THRES
TRIG
GND
1
CIRCUITTRIGGER AND THRESHOLD VOLTAGE WAVEFORM
V
DD
OUT
85
R
L
Output
3
C
L
2/3 V
1/3 V
V
DD
DD
DD
GND
t
PHL
t
c(H)
t
PLH
t
c(L)
Figure 3. Astable Operation
Connecting TRIG to THRES, as shown in Figure 3, causes the timer to run as a multivibrator. The capacitor C
charges through RA and RB to the threshold voltage level (approximately 0.67 VDD) and then discharges through R
only to the value of the trigger voltage level (approximately 0.33 VDD). The output is high during the charging cycle
(t
) and low during the discharge cycle (t
c(H)
). The duty cycle is controlled by the values of RA, and RB, and CT, as
c(L)
shown in the equations below.
t
[
c(H)
t
c(L)
Period+t
CT(RA)
[
CTRBIn 2
c(H)
Output driver duty cycle
Output waveform duty cycle
RB)In2 (In2+0.693)
)
t
[
c(L)
CT(RA)
+
t
c(H)
+
t
c(L)
t
c(H)
)
2RB)In2
t
c(L)
t
c(H)
)
t
c(L)
[
1–
[
RA)
R
RA)
R
B
2R
B
B
2R
B
T
B
The 0.1-µF capacitor at CONT in Figure 3 decreases the period by about 10%.
The formulas shown above do not allow for any propagation delay times from TRIG and THRES to DISCH. These
delay times add directly to the period and create differences between calculated and actual values that increase with
frequency . In addition, the internal on-state resistance ron during discharge adds to RB to provide another source of
timing error in the calculation when R
10
is very low or ron is very high.
B
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
APPLICATION INFORMATION
The equations below provide better agreement with measured values.
–t
t
+
c(H)
t
c(L)
These equations and those given earlier are similar in that a time constant is multiplied by the logarithm of a number
or function. The limit values of the logarithmic terms must be between In 2 at low frequencies and In 3 at extremely
high frequencies. For a duty cycle close to 50%, an appropriate constant for the logarithmic terms can be substituted
with good results. Duty cycles less than 50%
conditions can be difficult to obtain.
In monostable applications, the trip point of the trigger input can be set by a voltage applied to CONT . An input voltage
between 10% and 80% of the supply voltage from a resistor divider with at least 500-µA bias provides good results.
CT(RA)
+
CT(RB)
RB)Inƪ3–exp
ron)In
3–exp
ƪ
t
c(H)
ǒ
CT(RB)
ǒ
CT(RA)
t
c(H)
)
PLH
–t
PHL
require that
t
c(L)
ron)
RB)
Ǔ
)
t
ƫ
PHL
Ǔ
)
t
ƫ
PLH
t
c(H)
<1 and possibly RA ≤ ron. These
t
c(L)
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
11
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
MECHANICAL INFORMATION
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
14
1
0.069 (1,75) MAX
0.050 (1,27)
A
0.020 (0,51)
0.014 (0,35)
0.010 (0,25)
0.004 (0,10)
8
7
0.010 (0,25)
0.157 (4,00)
0.150 (3,81)
M
0.244 (6,20)
0.228 (5,80)
Seating Plane
0.004 (0,10)
PINS **
DIM
A MAX
A MIN
0.008 (0,20) NOM
Gage Plane
0°–8°
8
0.197
(5,00)
0.189
(4,80)
14
0.344
(8,75)
0.337
(8,55)
0.010 (0,25)
0.044 (1,12)
0.016 (0,40)
4040047/D 10/96
16
0.394
(10,00)
0.386
(9,80)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
MECHANICAL INFORMATION
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
28 PIN SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
M
5,60
5,00
Seating Plane
8,20
7,40
0,10
0,15 NOM
Gage Plane
0°–8°
0,25
1,03
0,63
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
8
3,30
2,70
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /C 10/95
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
13
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
MECHANICAL INFORMATION
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE
0.400 (10,60)
0.355 (9,02)
58
0.260 (6,60)
0.240 (6,10)
41
0.070 (1,78) MAX
0.020 (0,51) MIN
0.200 (5,08) MAX
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
0.010 (0,25)
M
0.310 (7,87)
0.290 (7,37)
Seating Plane
0°–15°
0.010 (0,25) NOM
4040082/B 03/95
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLC551, TLC551Y
LinCMOS TIMERS
SLFS044B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
MECHANICAL INFORMATION
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,65
14
1
1,20 MAX
A
7
0,05 MIN
0,30
0,19
8
6,60
4,50
4,30
6,20
M
0,10
Seating Plane
0,10
0,15 NOM
Gage Plane
0,25
0°–8°
0,75
0,50
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
8
3,10
2,90
14
5,10
4,90
16
5,10
20
6,60
6,404,90
24
7,90
7,70
28
9,80
9,60
4040064/E 08/96
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
15
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.