T exas Instruments (TI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to obtain the latest
version of relevant information to verify , before placing orders, that the information being relied
on is current.
TI warrants performance of its semiconductor products and related software to the specifications
applicable at the time of sale in accordance with TI’s standard warranty . T esting and other quality
control techniques are utilized to the extent TI deems necessary to support this warranty.
Specific testing of all parameters of each device is not necessarily performed, except those
mandated by government requirements.
Certain applications using semiconductor products may involve potential risks of death,
personal injury , or severe property or environmental damage (“Critical Applications”).
TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.
Inclusion of TI products in such applications is understood to be fully at the risk of the customer.
Use of TI products in such applications requires the written approval of an appropriate TI officer .
Questions concerning potential risk applications should be directed to TI through a local SC
sales office.
IMPORTANT NOTICE
In order to minimize risks associated with the customer’s applications, adequate design and
operating safeguards should be provided by the customer to minimize inherent or procedural
hazards.
TI assumes no liability for applications assistance, customer product design, software
performance, or infringement of patents or services described herein. Nor does TI warrant or
represent that any license, either express or implied, is granted under any patent right, copyright,
mask work right, or other intellectual property right of TI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
Texas Instruments has developed the first in a series of programmable video
cameras that utilize its very-high-resolution TC216 and TC217 CCD image
sensors. Features of the MC-1134P camera include:
-
RS-170 monochrome video format
-
High-quality image
-
1134 (H) x 486 (V) active picture elements
-
Internal or external synchronization
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Factory-programmable timing to address specific customer needs
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Small tubular package
The MULTICAM MC-1134P system is intended for scientific, medical, and
industrial image data-processing applications. The camera employs the T exas
Instruments TC217 frame-transfer CCD image sensor, which features
551,124 active photosites and can generate a very-high-resolution image. The
MUL TICAM MC-1134P system’s three modes of operation are user selectable
through an external connector provided with the system. The system is also
capable of internal or external synchronization through the same auxiliary
connector.
The MC-1134P camera has a standard C-mount that allows use of a variety
of lenses. The MULTICAM MC-1134P system provides signals for auto-iris
control via an external connector; the mating cable for this connector is
included in the MULTICAM package. The camera can be secured with the
1/4 x 20 tripod mount provided or it can be clamped externally.
The MC-1 134P series includes options for connector location, automatic gain
control (AGC), and gamma correction (0.45/1.0). Other options can be made
available upon customer request. The standard model part numbers are
shown in the following table.
The MC-1134P camera unit should be handled in accordance with standard
precautions for electro-optic equipment. The camera should not be
mishandled by dropping or by exposure to excessive moisture. When not in
use, the camera unit should be stored in a dust- and moisture-free
environment and within the specified storage-temperature range.
The MC-1134P camera unit contains electrostatic-discharge-sensitive
components and should be handled accordingly. Specific guidelines for
handling assemblies of this type are contained in the publication
for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and
Assemblies
Guidelines
available from Texas Instruments.
B-12
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