Texas Instruments EV2400 User Manual

User's Guide
SLUU446A–June 2011–Revised September 2011

EV2400 EVM Interface Board

This user's guide describes the function and operation of the EV2400 evaluation module interface board. A complete description, as well as the bill of materials and schematic are included.
Contents
1 Introduction .................................................................................................................. 2
2 Interfaces ..................................................................................................................... 2
3 EV2400 Bill of Materials, Component Placement, Schematic ........................................................ 5
1 EV2400 Ports................................................................................................................ 3
2 Top Assembly ............................................................................................................... 8
3 Bottom Assembly ........................................................................................................... 9
4 Board Layer 1.............................................................................................................. 10
5 Board Layer 2.............................................................................................................. 11
6 Solder Mask 1.............................................................................................................. 12
7 Solder Mask 2.............................................................................................................. 13
8 Silkscreen................................................................................................................... 14
9 Schematic, Page 1 ........................................................................................................ 15
10 Schematic, Page 2 ........................................................................................................ 16
11 Schematic, Page 3 ........................................................................................................ 17
List of Tables
1 Ordering Information........................................................................................................ 2
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Introduction

1 Introduction

The EV2400 EVM interface board enables an IBM-compatible or other type PC (with the required driver for its particular platform) to communicate with the Texas Instruments SMBus, I2C, HDQ, or DQ interface gas gauges via a Universal Serial Bus (USB) port. In addition to this board, PC software is required to interpret the gas gauge data to complete the evaluation system.

1.1 Features

Fully powered from the USB port
Optional 5-V port for powering high power voltage drivers (future upgrade)
Complete interface between the USB and SMBus, I2C, and HDQ (8/16) interfaces using a simple API
Expansion port for future upgrades

1.2 Kit Contents

EV2400 circuit module
Standard USB cable

1.3 Ordering Information

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Table 1. Ordering Information
EVM Part Number
EV2400

2 Interfaces

The EV2400 interfaces are described in the following table. The reference designators on the circuit board and the functions are also listed.
Reference Designator Function Details
Port 1: SMB SMBus Interface Port
Port 2: I2C I2C Interface Port
Port 3: HDQ HDQ and DQ Interface Ports
Port 4 Single Wire Port Future expansion port Port 5 GPIO Port Future expansion port
Terminal block for connecting to a target device
Terminal block for connecting to a target device
Terminal block for connecting to a target device
2
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2.1 Overview

The EV2400 ports are shown in Figure 1.
NOTE: The additional power input 5-V port on the EV2400 must not be connected in normal
Interfaces
Figure 1. EV2400 Ports
operation. Normal operation uses power from the USB port.

2.2 EV2400 Controller

The EV2400 controller is an MSP430F5529 running at 4 MHz. The controller firmware is stored in flash memory and is executed by the core at power-up.
The controller communicates with target device(s) through either: a 2-wire SMBus communication port, a 1-wire HDQ port, or a 2-wire EEPROM I2C port. The 2-wire SMBus communication port supports both SMBus and I2C protocols. CRC-8 checksum verification for the data packets prevents data corruption over the USB.

2.3 USB Interface (USB)

The interface board connects to a USB port (version 1.1 or later) on a host computer and is powered from the port. All communication over the USB is human Interface device (HID) class. Drivers are built into Windows®and most of the operating systems.

2.4 HDQ Interface (HDQ)

This interface allows a host computer to interact with a slave or target device through the 1-wire HDQ interface. The ports are labeled with the corresponding signal names above each port connector. Connect the signal and a ground reference (VSS) to a target device.
Pin Name Description
3.1 VSS Ground return/reference for HDQ interface.
3.2 VOUT 3 Optional voltage output (future expansion)
3.3 SDA HDQ 1-wire interface. Pulled up to variable pullup voltage with a 20-k
3.4 VOUT 4 Optional voltage output (future expansion)
resistor. Uses bus acceleration in positive direction to allow for larger pullup.
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Interfaces

2.5 I2C Interface (I2C)

This interface allows a host computer to interact with I2C interfaces, such as a battery monitor device and EEPROM through a 2-wire I2C interface. Connect the data, clock, and a ground reference (VSS) to a target device.
Pin Name Description
2.1 VSS Ground return/reference for I2C interface.
2.2 SCL I2C clock. Uses level translation. Pulled up to variable pullup voltage with a
2.3 SDA I2C data. Uses level translation. Pulled up to variable pullup voltage with a
2.4 VOUT 2 Optional voltage output (future expansion)

2.6 SMBus Interface (SMBus)

This interface allows a host computer to interact with an SMBus interface device such as a battery monitor device through a 2-wire SMBus interface. Connect the data, clock, and a ground reference (VSS) to a target device.
Pin Name Description
1.1 VSS Ground return/reference for SMBus
1.2 SCL SMBus clock. Pulled up to variable pullup
1.3 SDA SMBus data. Pulled up to variable pullup
1.4 VOUT 1 Optional voltage output (future expansion)
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20-kresistor. Uses bus acceleration in positive direction to allow for larger pullup.
20-kresistor. Uses bus acceleration in positive direction to allow for larger pullup.
interface.
voltage with a 20-kresistor. Uses bus
acceleration in positive direction to allow
for larger pullup.
voltage with a 20-kresistor. Uses bus
acceleration in positive direction to allow
for larger pullup.
4
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EV2400 Bill of Materials, Component Placement, Schematic

3 EV2400 Bill of Materials, Component Placement, Schematic

This chapter includes the bill of materials, component placement on the circuit board, and schematic for the EV2400 EVM.

3.1 Bill of Materials (BOM)

Count Reference Design Value Description Size Part Number Manufacturer
31 C1, C2, C3, C4, 0.1 µF Capacitor, 0603 STD Any
1 C12 4.7 µF Capacitor, 0805 STD Any
1 C36 2.2 nF Capacitor, 0603 STD Any
2 C37, C41 220 pF Capacitor, 0603 STD Any
1 C40 470 nF Capacitor, 0603 STD Any
2 C42, C43 12 pF Capacitor, 0603 STD Any
2 C8, C10 2.2 µF Capacitor, 0603 STD Any
3 C9, C14, C17 10 µF Capacitor, 3216 293D106X0010A Vishay
6 D1, D2, D3, D4, GL05T Diode, TVS SOT23 GL05T General
3 D7, D8, D9 SSF-LXH305GD- Diode. LED, 2.6 0.250 x0.250 SSF- Lumex
1 J1 67068-1000 Connector, USB 0.47 x 0.67 inch 67068-1000 Molex
4 J2, J3, J4, J5 22-05-3041 Header, Friction 0.400 x 0.500 22-05-3041 Molex
1 J6 PEC12DBAN Header, Right 0.100 inch x 12 PEC12DBAN Sullins
1 J7 RAPC 722 Connector, 0.57 x 0.35 inch RAPC 722 Switchcraft
1 J8 22-23-2041 Header, 4-pin 0.250 x 0.400 22-23-2041 Molex
0 JP1, JP2, JP3, DNP Header, 2-pin, 0.100 inch x 2 PEC02SAAN Sullins
C5, C6, C7, C11, Ceramic, 25 V,
C13, C15, C16, X7R, 20% C18, C19, C20, C21, C22, C23, C24, C25, C26, C27, C28, C29, C30, C31, C32, C33, C34, C35,
C38, C39
Ceramic, 25 V, X7R, 20%
Ceramic, 25 V, X7R, 20%
Ceramic, 50 V, C0G, 5%
Ceramic, 25 V, X7R, 20%
Ceramic, 50 V, C0G, 10%
Ceramic, 25 V, X7R, 20%
Tantalum, 10 µF, 2T 10 V, 20%
D5, D6 diode, Low
Capacitance
TR V, 25 mA inch LXH305GD-TR
Upstream (Type B)
Lock Ass'y, 4-pin inch Right Angle,
Angle, Male x 2 2x12-pin, 100mil spacing (12-pin strip), right-angle
2.1mm, DC Jack w/Switch, TH
Friction Lock, inch 100-mil spacing
JP4, JP5, JP6 100-mil spacing
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EV2400 Bill of Materials, Component Placement, Schematic
Count Reference Design Value Description Size Part Number Manufacturer
1 JP7 PEC02SAAN Header, 2-pin, 0.100 inch x 2 PEC02SAAN Sullins
6 Q1, Q2, Q3, Q4, BSS223PW MOSFET, Pch, SOT323 BSS223PW Infineon
Q5, Q6 –20 V, –0.39 A,
3 Q7, Q8, Q9 2N7002W MOSFET, Nch, SOT323 [SC70] 2N7002W Diodes
1 R1 33 kΩ Resistor, Chip, 0603 STD Any
4 R10, R11, R13, 20 kΩ Resistor, Chip, 0603 STD Any
R14 1/16 W, 5%
2 R2, R3 33 Ω Resistor, Chip, 0603 STD Any
1 R26 470 Ω Resistor, Chip, 0603 STD Any
1 R27 51 kΩ Resistor, Chip, 0603 STD Any
1 R28 100 kΩ Resistor, Chip, 0603 STD Any
3 R39, R40, R41 200 Ω Resistor, Chip, 0603 STD Any
1 R4 1.5 kΩ Resistor, Chip, 0603 STD Any
1 R42 47 kΩ Resistor, Chip, 0603 STD Any
3 R43, R44, R45 10 kΩ Resistor, Chip, 0603 STD Any
3 R46, R47, R48 100 kΩ Resistor, Chip, 0603 STD Any
21 R5, R6, R7, R12, 10 kΩ Resistor, Chip, 0603 STD Any
R15, R16, R19, 1/16 W, 5% R20, R22, R24, R25, R29, R30, R31, R32, R33, R34, R35, R36,
R37, R38
6 R8, R9, R17, R18, 100 Ω Resistor, Chip, 0603 STD Any
R21, R23 1/16 W, 5%
1 SW1 EVQPSD02K Switch, SMD 6.1 mm x 4.0 EVQPSD02K Panasonic
1 TP1 5VUSB Test Point, Red, 0.100 x 0.100 5000 Keystone
1 TP2 5VPLUG Test Point, Red, 0.100 x 0.100 5000 Keystone
1 TP3 3.3V Test Point, Red, 0.100 x 0.100 5000 Keystone
1 TP4 GND Test Point, 0.100 x 0.100 5001 Keystone
1 U1 MSP430F5529IP IC, Mixed Signal TQFP-80 MSP430F5529IP TI
N Microcontroller N
6 U10, U11, U12, TPS73601DBV IC, Cap-Free, SOT23-5 TPS73601DBV TI
U13, U15, U18 NMOS, 400mA
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100-mil spacing
1.2 Ohm
60 V, 115 mA
1/16 W, 5%
1/16 W, 5%
1/16 W, 1%
1/16 W, 1%
1/10 W, 1%
1/16 W, 5%
1/16 W, 5%
1/16 W, 5%
1/10 W, 1%
1/16 W, 5%
Light-Touch, mm Side Operation
Thru Hole Color inch Keyed
Thru Hole Color inch Keyed
Thru Hole Color inch Keyed
Black, Thru Hole inch Color Keyed
LDO Regulator with Reverse Current Protection.
6
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EV2400 Bill of Materials, Component Placement, Schematic
Count Reference Design Value Description Size Part Number Manufacturer
1 U2 TPS2550DBV IC, SOT-23-6 TPS2550DBV TI
Power­Distribution Switch, Current-Limited
1 U3 TPS76333DBV IC, Micro-Power SOT23-5 TPS76333DBV TI
150-mA LDO Regulator
3 U4, U5, U6 ST2329AQTR IC, 2-bit dual 10-QFN ST2329AQTR ST
supply level translator without direction control pin
1 U7 TPS79650DCQ IC, SOT223-6 TPS79650DCQ TI
Ultralow-Noise, High PSRR Fast RF, LDO, 1A, 5V
1 U8 TPS2113APW IC, Auto SO8 TPS2113APW TI
Switching Power Mux, Rds 84 milli Ohm, 1A.
2 U9, U14 ISL90842UIV1427 IC, Quad TSSOP ISL90842UIV142 Intersil
Z Digitally 7Z
Controlled Potentiometers
1 Y1 4 MHz Crystal, SMT 0.484 x 0.190 ATS040SM CTS
Quartz Crystal inch 1 PCB HPA500 Any 1 Plastic, 115574-501-000 PACTEC
Enclosure,
Silkscreened,
Two Custom end
panels, screws
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent manufacturers' components.
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EV2400 Bill of Materials, Component Placement, Schematic

3.2 EV2400 Component Placement

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Figure 2. Top Assembly
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EV2400 Bill of Materials, Component Placement, Schematic
Figure 3. Bottom Assembly
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EV2400 Bill of Materials, Component Placement, Schematic
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Figure 4. Board Layer 1
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EV2400 Bill of Materials, Component Placement, Schematic
Figure 5. Board Layer 2
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EV2400 Bill of Materials, Component Placement, Schematic
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Figure 6. Solder Mask 1
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EV2400 Bill of Materials, Component Placement, Schematic
Figure 7. Solder Mask 2
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EV2400 Bill of Materials, Component Placement, Schematic
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Figure 8. Silkscreen
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3.3 EV2400 Schematic

EV2400 Bill of Materials, Component Placement, Schematic
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Figure 9. Schematic, Page 1
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+
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EV2400 Bill of Materials, Component Placement, Schematic
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Figure 10. Schematic, Page 2
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EV2400 Bill of Materials, Component Placement, Schematic
Figure 11. Schematic, Page 3
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Evaluation Board/Kit Important Notice
Texas Instruments (TI) provides the enclosed product(s) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all
claims arising from the handling or use of the goods. Please read this users guide and, specifically, the EVM Warnings and Restrictions notice below prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TIs environmental and/or safety programs, contact a TI field representative or visit
www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.
Should this evaluation board/kit not meet the specifications indicated in the users guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
Regulatory Information
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause an undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment
This Class A digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. Cet appareil numérique de la classe A est confor á la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider luser; autorité de s pour actionner l’équipement.
EVM Warnings and Restrictions
It is important to operate this EVM within TIs recommended specifications and environmental considerations per the user guidelines. Failure to follow the guidelines may cause potential risk of personal injury, property damage, and/or unexpected operation of the EVM. If there are any questions, please contact a TI field representative before connecting and/or enabling power or other interface connections to the EVM.
During normal operation and within the EVMs recommended ratings, some circuit components including but not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks may have elevated case temperatures or contain voltages exceeding safe touch levels. These types of devices, as applicable, can be identified using the EVM schematic in this user's guide. When placing measurement probes near or on these devices during operation for evaluation purposes, precautions should be taken against inadvertent contact with surfaces of elevated temperatures and/or voltages exceeding safe touch levels.
As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs.
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Revision History

Revision History
Changes from Original (June 2011) to A Revision ......................................................................................................... Page
Deleted installer information ............................................................................................................ 3
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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