POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
(US model only)
With 8 ohm loads, both channels driven, from
20 – 20,000 Hz; rated 90 watts per channel
minimum RMS power, with no more than 0.09%
total harmonic distortion from 250 milliwatts to
rated output.
Amplifi er section
US, Canadian and AEP models
Minimum RMS Output Power (8 ohms, 20 Hz –
20 kHz, THD 0.09%)
90 W + 90 W
Stereo Mode Output Power (8 ohms, 1 kHz,
THD 1%)
100 W + 100 W
1)
Measured under the following conditions:
AreaPower requirements
US, Canadian120 V AC, 60 Hz
AEP230 V AC, 50 Hz
Frequency response
Analog 10 Hz – 70 kHz
+0.5/–2 dB (with BASS =
0 dB, TREBLE = 0 dB)
Input
Analog (PORTABLE IN)
Sensitivity: 1 V/
50 kilohms
S/N
Inputs
Analog (Except PORTABLE IN)
Sensitivity: 500 mV/
50 kilohms
S/N
Outputs
Analog (AUDIO OUT)
Voltage: 500 mV/
10 kilohms
1)
2)
: 96 dB (A, 500 mV3))
2)
: 96 dB (A, 500 mV3))
Tone
Gain levels ±10 dB, 1 dB step
2)
INPUT SHORT (with BASS = 0 dB, TREBLE =
0 dB).
3)
Weighted network, input level.
FM tuner section
Tuning range 87.5 MHz – 108.0 MHz
Antenna (aerial) FM wire antenna (aerial)
Antenna (aerial) terminals
75 ohms, unbalanced
AM tuner section
Tuning range
AreaTuning scale
US, Canadian530 kHz – 531 kHz –
AEP
Antenna (aerial) Loop antenna (aerial)
General
Power requirements
AreaPower requirements
US, Canadian120 V AC, 60 Hz
AEP230 V AC, 50/60 Hz
Power consumption 200 W
Power consumption (during standby mode)
0.3 W
Dimensions (w/h/d) (Approx.)
430 mm × 132.5 mm ×
279 mm (17 in × 5 1/4 in ×
11 in) including projecting
parts and controls
Mass (Approx.) 6.4 kg (14 lb 2 oz)
10 kHz step 9 kHz step
1,710 kHz 1,710 kHz
– 531 kHz –
1,602 kHz
US Model
Canadian Model
AEP Model
Supplied accessories
s Operating Instructions
s Quick Setup Guide
s FM wire antenna (aerial) (1)
s AM loop antenna (aerial) (1)
s Remote control (RM-AAU130) (1)
s R6 (size AA) batteries (2)
Design and specifi cations are subject to
change without notice.
Halogenated fl ame retardants are not used in
the certain printed wiring boards.
After correcting the original service problem, perform the following safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
To Exposed Metal
Parts on Set
MODEL IDENTIFICATION
–BACK PANEL–
Part No.
ModelPart No.
US
AEP
Canadian4-408-213-2
4-408-213-0[]
4-408-213-1[]
[]
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
AC
1.5 kΩ0.15 μF
Earth Ground
voltmeter
(0.75 V)
Fig. A. Using an AC voltmeter to check AC leakage.
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
TABLE OF CONTENTS
1. DISASSEMBLY
1-1. Case ..................................................................................... 4
1-2. Back Panel Section ............................................................. 5
1-3. Front Panel Section ............................................................. 5
1-4. MAIN Board Section .......................................................... 6
2. TEST MODE ...................................................................... 7
3. FM TUNER CHECK ........................................................ 9
4. DIAGRAMS
4-1. Block Diagram – Main Section – ......................................11
4-2. Block Diagram – Display and Power Section – ............... 12
4-3. Printed Wiring Board – Main Board – .............................. 14
4-4. Schematic Diagram – Main Board 1/3 – .......................... 15
4-5. Schematic Diagram – Main Board 2/3 – .......................... 16
4-6. Schematic Diagram – Main Board 3/3 – .......................... 17
4-7. Printed Wiring Board – Display and
Power Key Board – ........................................................... 18
4-8. Schematic Diagram – Display and
Power Key Board – ........................................................... 19
4-9. Printed Wiring Board – Headphone, Thermal and