Sony MDX-66-XLP Service manual
MDX-66XLP
SERVICE MANUAL
Ver 1.1 2002. 04
SPECIFICATIONS
US Model
Canadian Model
AEP Model
UK Model
Model Name Using Similar Mechanism NEW
Mini Disc Mechanism Type MG-798LP-133
Optical Pick-up Name KMS-241C/J1N
FEATURES
System Mini disc digital audio system
Frequency response 10 – 20,000 Hz
Wow and flutter Below measurable limit
Signal-to-noise ratio 95 dB
Outputs Bus control output (8 PIN)
Analog audio output (RCA PIN)
Current drain 300 mA (MD playback)
600 mA (during loading or
ejecting a disc)
Dimensions Approx. 176 × 83.5 × 142 mm
(7 × 3 3/8 × 5 18/32 in.) (w/h/d)
not incl.
projecting parts and controls
Mass Approx. 1.1 kg (2 lb. 7 oz.)
Power requirement 12 V DC car battery (negative
ground)
Supplied accessories Mounting hardware (1 set)
Bus cable 5.5 m (1)
RCA pin cord 5.5 m (1)
• U.S. and foreign patents licensed from Dolby
Laboratories.
• Design and specifications are subject to change without
notice.
• MDLP (MiniDisc Long Play) playback.
• Sony BUS system compatible with mobile MD
changers.
• Direct-in system for inserting and removing
MDs easily.
•The MD changer compartment has a built in light
for easy use even in the dark.
•1 bit Digital/Analog converter for high quality
sound reproduction.
9-873-582-02
2002D0400-1
© 2002. 04
MINIDISC CHANGER
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
1
MDX-66XLP
Ver 1.1
SERVICE NOTE
US, Canadian model
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
AEP, UK model
CLASS
1
PRODUCTLASER
This label is located on the bottom of the chassis.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pickup with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pickup flexible board with a new one.
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. To Place the Set into Playback Mode..................................3
1-2. How to Check the Servo Board Waveforms........................ 3
2. GENERAL
Preparations (US, Canadian Model)........................................ 4
Connections (US, Canadian Model)........................................ 4
Preparations (AEP, UK Model) ............................................... 5
Connections (AEP, UK Model) ............................................... 5
3. DISASSEMBLY
3-1. Panel (Rear) Assy ................................................................ 6
3-2. Case (Upper) ....................................................................... 7
3-3. Panel (Front) Assy...............................................................7
3-4. MD Block............................................................................ 8
3-5. Main Board ......................................................................... 8
3-6. Chassis (OP) Block ............................................................. 9
3-7. Servo Board......................................................................... 9
3-8. Optical Pick-up ................................................................. 10
3-9. Note on Assembly for the Chassis (OP) Block ................. 11
4. DIAGRAMS
4-1. IC Pin Descriptions ........................................................... 12
4-2. Block Diagram .................................................................. 18
4-3. Circuit Boards Location .................................................... 19
4-4. Printed Wiring Boards –Servo Section–............................20
4-5. Schematic Diagram –Servo Section–................................ 22
4-6. Schematic Diagram –Main Section–................................. 23
4-7. Printed Wiring Boards –Main Section– ............................ 24
4-8. Printed Wiring Board –Power Section– ............................ 26
4-9. Schematic Diagram –Power Section– ............................... 27
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 30
5-2. Main Board Section .......................................................... 31
5-3. MD Section (1).................................................................. 32
5-4. MD Section (2).................................................................. 33
5-5. MD Section (3).................................................................. 34
6. ELECTRICAL PARTS LIST ........................................ 35
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-241C/J1N)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The
flexible board is easily damaged and should be handled with care.
laser-tap
OPTICAL PICK-UP FLEXIBLE BOARD
2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT .
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SECTION 1
SERVICE NOTE
1-1. TO PLACE THE SET INTO PLAYBACK MODE
The this set has no key control function and cannot be placed into
the Playback mode alone.
For key control, the this set is controlled through serial
communication with a master unit (car audio player, TV tuner or
source selector compatible with the Sony BUS system.)
T o service the this set, the set should be connected as given below:
MDX-66XLP
MDX-66XLP
BUS CONTROL INBUS CONTROL OUT
Master unit
1-2. HOW TO CHECK THE SERVO BOARD
WAVEFORMS
1. Remove the panel (rear) assy, case (upper) and panel (front) assy .
Then, remove the main board from the mechanism deck. (See
page 8 of “SECTION 3. DISASSEMBLY”.)
2. Remove the chassis (OP) block from the mechanism deck. (See
page 9 of “SECTION 3. DISASSEMBLY”.)
3. Short each bridge points BP1 and BP2 on the main board by
solder bridge.
– main board (conductor side) –
BP1
BP2
4. Connect the power board with the main board by the main
flexible board. Connect the main board with the servo board by
the servo flexible board.
5. Connect to a master unit. With the master unit OFF, press the
preset buttons 4 t 5 t 1 (2 seconds or more each) in this
turn to enter the TEST mode.
6. Open the doors and insert a disc in the chassis (OP) assy. Use the
SOURCE button on the master unit to select to MD to
playback.
7. Check the waveforms at each point on the servo board.
Note: After this check is completed, remove solder between shorted
bridge points BP1 and BP2 and open these points.
3
MDX-66XLP
PREPARATIONS (US, Canadian Model)
SECTION 2
GENERAL
This section is extracted
from instruction manual.
CONNECTIONS (US, Canadian Model)
4
PREPARATIONS (AEP, UK Model)
MDX-66XLP
CONNECTIONS (AEP, UK Model)
5
MDX-66XLP
SECTION 3
DISASSEMBLY
Note : This set can be disassemble according to the following sequence.
SET
3-1. PANEL (REAR) ASSY
3-5. MAIN BOARD
(Page 6)
3-2. CASE (UPPER)
3-6. CHASSIS (OP) BLOCK
(Page 7)
3-3. PANEL (FRONT) ASSY
3-7. SERVO BOARD
(Page 7)
3-4. MD BLOCK
3-8. OPTICAL PICK-UP
(Page 8)
Note : Follow the disassembly procedure in the numerical order given.
(Page 8)
(Page 9)
(Page 9)
(Page 10)
3-1. PANEL (REAR) ASSY
3
BVTT 2.6x6
4
BVTT 2.6x6
6
panel (rear) assy
2
two screws
(PTT 2.6x8)
1
cover
5
CN901
6
3-2. CASE (UPPER)
6
2
BVTT 2.6x6
3
case (upper)
1
BVTT 2.6x
MDX-66XLP
3-3. PANEL (FRONT) ASSY
2
claw
3
panel (front) assy
4
CN620
1
claw
7
MDX-66XLP
0
3-4. MD BLOCK
1
damper (798)
4
tension spring (FL)
6
MD block
5
tension spring (FL)
3-5. MAIN BOARD
3
tension spring (FL)
3
escutcheon
6
chassis (front)
0
CN600
2
damper (798)
7
collar (EHS)
qa
qd
CN603
CN601
qk
MAIN board
qs
CN50
9
CN602
qj
special flat
three screws
(1.7x3)
1
cushion
2
two screws
(M1.7)
5
lead stopper
4
two
screws
(M1.7)
8
sheet (MAIN PC board)
qg
CN700
qf
CN701
qh
cushion (MAIN)
8
3-6. CHASSIS (OP) BLOCK
9
worm wheel (ELV2)
7
bearing (ELV)
6
chassis (OP) block
8
bearing (ELV)
MDX-66XLP
3-7. SERVO BOARD
5
3
chassis (bottom) assy
3
three screws
(M1.7x2.2)
CN300
4
bearing (ELV)
1
precision screw
(P 1.7x1.8)
6
CN100
5
bearing (ELV)
2
precision
three screws
(P 1.7x1.8)
7
SERVO board
4
CN400
2
Unsolder the
motor lead wires.
1
CN200
9
MDX-66XLP
3-8. OPTICAL PICK-UP
2
optical pick-up
1
two screws
(K1.7x3.5)
10
3-9. NOTE ON ASSEMBLY FOR THE CHASSIS (OP) BLOCK
A
B
B
B
A
A
2
Turn the three feed
screw (ELV) assy fully in
the direction of arrows A.
qa
Turn the three gear (ELVB) fully
in the direction of arrows B.
6
bearing (ELV)
7
bearing (ELV)
0
precision
three screws
(P1.7x1.8)
9
precision screw
(P1.7x1.8)
8
chassis (bottom) assy
5
chassis (OP) block
3
bearing (ELV)
4
bearing (ELV)
1
worm wheel (ELV2)
qf
gear (ELVC)
qs
gear (ELVA2)
qg
polyethylene washer
qd
polyethylene washer
MDX-66XLP
11
MDX-66XLP
SECTION 4
DIAGRAMS
4-1. IC PIN DESCRIPTIONS
• IC100 CXA2523AR (RF AMP)
Pin No. Pin Name I/O Pin Description
1 I I I-V converted RF signal input (I) from detector of optical pick-up
2 J I I-V converted RF signal input (J) from detector of optical pick-up
3 VC O Center voltage (+1.65 V) generation output
4 – 9 A – F I Signal input (A to F) from detector of optical pick-up
10 PD I Quantity monitor input of light from laser diode of optical pick-up
11 APC O Laser amplifier output to automatic power control circuit
12 APCREF I Reference voltage input for laser power setting
13 GND — Ground pin
14 TEMPI I Temperature sensor connecting pin (Not used in this set.)
15 TEMPR O Reference voltage output for temperature sensor (Not used in this set.)
16 SWDT I Write data signal input from System controller (IC600)
17 SCLK I Serial clock signal input from System controller (IC600)
18 XLAT I Serial latch signal input from System controller (IC600)
19 XSTBY I Standby signal input (“L” : Standby) (Fixed at “H” in this set.)
20 FOCNT I Center frequency control voltage input of internal circuit filter (BPF22, BPF3T and EQ)
21 VREF O Reference voltage output (Not used in this set.)
22 EQADJ I Center frequency setting input of internal circuit filter (EQ)
23 3TADJ I Center frequency setting input of internal circuit filter (BPF3T)
24 VCC — Power supply pin (+3.3 V)
25 WBLADJ I Center frequency setting input of internal circuit filter (BPF22)
26 TE O Tracking error signal output to CXD2662R (IC200)
27 CSLED I Connecting pin for low pass filter condenser of sled error signal
28 SE O Sled error signal output to CXD2662R (IC200)
29 ADFM O FM signal output of ADIP
30 ADIN I FM signal input of ADIP by AC combination
31 ADAGC I External condenser connecting pin for AGC of ADIP
32 ADFG O ADIP double FM signal output (22.05 kHz ± 1 kHz) to CXD2662R (IC200)
33 AUX O Support signal (I3 signal/temperature signal) output (Not used in this set.)
34 FE O Focus error signal output to CXD2662R (IC200)
35 ABCD O Quantity signal output of light to CXD2662R (IC200)
36 BOTM O Bottom hold signal output of quantity signal (RF/ABCD) of light to CXD2662R (IC200)
37 PEAK O Peak hold signal output of quantity signal (RF/ABCD) of light to CXD2662R (IC200)
38 RF O Playback EFM RF signal output to CXD2662R (IC200)
39 RFAGC I External condenser connecting pin of AGC circuit for RF
40 AGCI I RF signal input by AC combination
41 COMPO O User comparator output pin (Not used in this set.)
42 COMPP I User comparator input pin (Fixed at “L” in this set.)
43 ADDC I External condenser connecting pin for low frequency interception of ADIP amplifier
44 OPO O External condenser connect pin for lower cut of ADIP amplifier
45 OPN I User operational amplifier inversion input pin (Fixed at “L” in this set.)
46 RFO O RF signal output
47 MORFI I RF signal input of MO by AC combination
48 MORFO O RF signal output of MO
12
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